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MC34064, MC33064, NCV33064 Undervoltage Sensing Circuit: Surface Mount
MC34064, MC33064, NCV33064 Undervoltage Sensing Circuit: Surface Mount
The MC34064 is an undervoltage sensing circuit specifically designed for use as a reset controller in microprocessorbased systems. It offers the designer an economical solution for low voltage detection with a single external resistor. The MC34064 features a trimmedinpackage bandgap reference, and a comparator with precise thresholds and built-in hysteresis to prevent erratic reset operation. The open collector reset output is capable of sinking in excess of 10 mA, and operation is guaranteed down to 1.0 V input with low standby current. The MC devices are packaged in 3pin TO-92, micro size TSOP5, 8pin SOIC8 and Micro8t surface mount packages. The NCV device is packaged in SOIC8 and TO92. Applications include direct monitoring of the 5.0 V MPU/logic power supply used in appliance, automotive, consumer and industrial equipment.
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TO92 P SUFFIX CASE 29 Pin 1. Reset 2. Input 3. Ground 3 SOIC8 D SUFFIX CASE 751 Micro8 DM SUFFIX CASE 846A TSOP5 SN SUFFIX CASE 483 Pin 1. 2. 3. 4. 5. Reset Input Ground NC NC
8 1 8 1 5 1
TrimmedInPackage Temperature Compensated Reference Comparator Threshold of 4.6 V at 25C Precise Comparator Thresholds Guaranteed Over Temperature Comparator Hysteresis Prevents Erratic Reset Reset Output Capable of Sinking in Excess of 10 mA Internal Clamp Diode for Discharging Delay Capacitor Guaranteed Reset Operation with 1.0 V Input Low Standby Current Economical TO92, TSOP5, SOIC8 and Micro8 Surface Mount Packages NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes PbFree Packages are Available
Input 2 (2) Reset 1 (1)
PIN CONNECTIONS
Reset 1 Input 2 N.C. 3 Ground 4 (Top View) 8 N.C. 7 N.C. 6 N.C. 5 N.C.
ORDERING INFORMATION
1.2 Vref
See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.
Pin numbers adjacent to terminals are for the 3pin TO92 package. Pin numbers in parenthesis are for the 8lead packages. This device contains 21 active transistors.
625 200 625 200 520 240 +150 0 to +70 40 to +85 40 to +125
Tstg
65 to +150
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. ESD data available upon request.
ELECTRICAL CHARACTERISTICS (For typical values TA = 25C, for min/max values TA is the operating ambient temperature range that applies [Notes 3 and 4] unless otherwise noted.)
Characteristics COMPARATOR Threshold Voltage High State Output (Vin Increasing) Low State Output (Vin Decreasing) Hysteresis RESET OUTPUT Output Sink Saturation (Vin = 4.0 V, ISink = 8.0 mA) (Vin = 4.0 V, ISink = 2.0 mA) (Vin = 1.0 V, ISink = 0.1 mA) Output Sink Current (Vin, Reset = 4.0 V) Output Off-State Leakage (Vin, Reset = 5.0 V) Clamp Diode Forward Voltage, Pin 1 to 2 (IF = 10 mA) TOTAL DEVICE Operating Input Voltage Range Quiescent Input Current (Vin = 5.0 V) Vin Iin 1.0 to 6.5 390 500 V mA VOL ISink IOH VF 10 0.6 0.46 0.15 27 0.02 0.9 1.0 0.4 0.1 60 0.5 1.2 mA mA V V V VIH VIL VH 4.5 4.5 0.01 4.61 4.59 0.02 4.7 4.7 0.05 Symbol Min Typ Max Unit
2. Maximum package power dissipation limits must be observed. 3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Thigh = +70C for MC34064 4. Tlow = 0C for MC34064 40C for MC33064 +85C for MC33064 40C for NCV33064 +125C for NCV33064 5. NCV prefix is for automotive and other applications requiring site and change control.
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2
2.0
8.0
10
4.560
4.580
4.620
4.640
4.630 V th, THRESHOLD VOLTAGE (V) RL = 10 k to Vin 4.620 4.610 4.600 4.590 4.580 4.570 55 Lower Threshold Low State Output 25 0 25 50 75 100 125 I in , INPUT CURRENT (mA) Upper Threshold High State Output
1.0 0.8 0.6 +85C 0.4 0.2 0 TA = +25C +85C 40C TA = +25C 40C
2.0
4.0
6.0
8.0
10
2.0 Vin = 4.0 V V OL, OUTPUT SATURATION (V) 1.5 TA = 85C TA = 40C 1.0 4.0 V
Vin 10k Reset
Vin 5.0 V
0.5 10% 0
5.0V 4.0V
REF
10
40 200 ns/DIV
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3
40
20
0.4
1.6
+ Power Supply
2 (2) 1 (1)
+ 1.2 Vref
CDLY
A time delayed reset can be accomplished with the addition of CDLY. For systems with extremely fast power supply rise times (<500 ns) it is recommended that the RCDLY time constant be greater than 5.0 ms. Vth(MPU) is the microprocessor reset input threshold. 1 tDLY = RCDLY In 1 Vth(MPU) Vin
3 (4)
Microprocessor Circuit
3 (4)
Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been simplified and does not account for the change of input current Iin as VCC crosses the comparator threshold (Figure 4). An increase of the lower threshold DVth(lower) will be observed due to Iin which is typically 340 mA at 4.59 V. The equations are accurate to 10% with RH less than 150 W and RL between 1.5 kW and 10 kW .
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4
VO = 5.0 V IO = 50 mA
Conditions Vin = 11.5 V to 14.5 V, IO = 50 mA Vin = 12.6 V, IO = 0 mA to 50 mA Vin = 12.6 V, IO = 50 mA Vin = 12.6 V, IO = 50 mA
Line Regulation 1 (1) + 1.2Vref 3 (4) Load Regulation Output Ripple Efficiency
Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L2 MOSFET.
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5
*NCV33064: Tlow = 40C, Thigh = +125C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control.
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6
SDYYW 1 2 3 1
3x064 ALYW5
SDY = Device Code x = 3 or 4 y = I or C A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week *This marking diagram also applies to NCV33064P.
123
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7
A R P L
SEATING PLANE
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 0.250 0.080 0.105 0.100 0.115 0.135 MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 6.35 2.04 2.66 2.54 2.93 3.43
X X G H V
1
D J C SECTION XX N N
DIM A B C D G H J K L N P R V
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8
D
5 1 2 4 3
L G A J C 0.05 (0.002) H K M
SOLDERING FOOTPRINT
1.9 0.074
0.95 0.037
mm inches
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9
B
1 4
0.25 (0.010)
Y G C Z H D 0.25 (0.010)
M SEATING PLANE
X 45 _
0.10 (0.004)
Z Y
DIM A B C D G H J K M N S
SOLDERING FOOTPRINT*
1.52 0.060
7.0 0.275
4.0 0.155
0.6 0.024
1.270 0.050
SCALE 6:1 mm inches
*For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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10
PIN 1 ID
G D 8 PL 0.08 (0.003)
M
T B
SEATING
C J L
SOLDERING FOOTPRINT*
8X
1.04 0.041
0.38 0.015
8X
3.20 0.126
4.24 0.167
5.28 0.208
6X
0.65 0.0256
SCALE 8:1
mm inches
*For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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11
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12
MC34064/D
This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.