ZigBee Module Testing Kit

HK-Z01

Product Manual
V1.1.0

SilverPAC ZigBee Module Testing Kit HK-Z01 Product Manual

Version Control
Date Apr. 1, 2010 Jul. 2, 2010 Version 1.0.0 1.1.0 Notes 1st Issue of Preliminary Manual Changed documents structure

* This document is subject to changes without further notice.

Copyright Notice
The information contained in this document is the proprietary information of Zhejiang SilverPAC HEA Ltd. (hereinafter referred as SilverPAC). The contents are confidential and any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of SilverPAC, is strictly prohibited. Further, no portion of this document may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, without the prior written consent of SilverPAC, the copyright holder.

Disclaimer of Warranties and Limitation of Liability

SilverPAC publishes this document without making any warranty as to the content contained herein. Further SilverPAC reserves the right to make modifications, additions and deletions to this document due to typographical errors, inaccurate information, or improvements to products mentioned in the document at any time and without notice. Such changes will, nevertheless be incorporated into new editions of this document.

Contact Us
Zhejiang SilverPAC HEA Limited Add: 6/F, East Tower, Holley Technology Park, No.181 Wuchang Ave., Hangzhou, 310023, P.R.C Tel: +86-571-88471702 Fax: +86-571-88471702 Web: http://www.silverpachea.com E-mail: marketing@silverpachea.com

Zhejiang SilverPAC HEA Limited

SilverPAC ZigBee Module Testing Kit HK-Z01 Product Manual

Contents
Version Control ................................................................................................................................ 1 Copyright Notice ............................................................................................................................. 1 Disclaimer of Warranties and Limitation of Liability................................................................... 1 Contact Us ....................................................................................................................................... 1 1. Overview...................................................................................................................................... 3 2. Product Features ........................................................................................................................ 3 3. Names and Functions of Parts.................................................................................................. 4

Zhejiang SilverPAC HEA Limited

SilverPAC ZigBee Module Testing Kit HK-Z01 Product Manual

1. Overview
SilverPAC ZigBee module testing kit (hereinafter referred as testing kit) helps the developers and users to test the network and performance of the modules by simulating the real equipment application environment. With the help of any COM port tools, the developers and users can send and receive the messages from the software to monitor the performance of the modules. By linking with certain emulator, the testing kit can be used for burning / upgrading firmware of the module. HK-Z01 testing kit supports all types of modules with different chip designs.

2. Product Features
Universal RS232 (DB9 female) port supports communication with PC; Support all types of modules with different chip designs (currently support chips of Ember,

Zhejiang SilverPAC HEA Limited

SilverPAC ZigBee Module Testing Kit HK-Z01 Product Manual

3. Names and Functions of Parts

2 1 3

4 5 6

Zhejiang SilverPAC HEA Limited

SilverPAC ZigBee Module Testing Kit HK-Z01 Product Manual

1. Power supply, require DC9.0V. 2. UART TTL interface, connected to EM250s SC1 UART interface and CC2430s UART0 TTL interface. 3. SMA antenna connector. 4. RS232 connect, DB9 female mode. This interface is derived from item 2 above, through a MAX3221 chip. 5. EM250s system SIF interface and CC2430s JTAG interface. These interfaces are necessary for burning firmware and debugging (with Embers Insight Adaptor or Chipcon emulator). 6. DC3.3V power output/input port. If the board is powered by item 1, then this port provides a DC3.3V output. Or, the board could be powered by DC3.3V directly via this port. 7. Two 64Kbytes EPROM chips make up a total space of 128Kbytes, for sake of modules remote upgrade. The E2PROM are connected to EM250s SC2 I2C mode. 8. MMCX connector to the module.

Zhejiang SilverPAC HEA Limited