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Driver tc4421
Driver tc4421
General Description
The TC4421/TC4422 are high-current buffer/drivers capable of driving large MOSFETs and IGBTs. These devices are essentially immune to any form of upset, except direct overvoltage or over-dissipation. They cannot be latched under any conditions within their power and voltage ratings. These parts are not subject to damage or improper operation when up to 5V of ground bounce is present on their ground terminals. They can accept, without damage or logic upset, more than 1A inductive current of either polarity being forced back into their outputs. In addition, all terminals are fully protected against up to 4 kV of electrostatic discharge. The TC4421/TC4422 inputs may be driven directly from either TTL or CMOS (3V to 18V). In addition, 300 mV of hysteresis is built into the input, providing noise immunity and allowing the device to be driven from slowly rising or falling waveforms. With both surface-mount and pin-through-hole packages and four operating temperature range offerings, the TC4421/22 family of 9A MOSFET drivers fit into most any application where high gate/line capacitance drive is required.
Applications
Line Drivers for Extra Heavily-Loaded Lines Pulse Generators Driving the Largest MOSFETs and IGBTs Local Power ON/OFF Switch Motor and Solenoid Driver
Package Types(1)
8-Pin PDIP/ TC4421 TC4422 SOIC
VDD INPUT NC GND 1 8 VDD 2 TC4421 7 OUTPUT 3 TC4422 6 OUTPUT 4 5 GND VDD OUTPUT OUTPUT GND VDD 1 INPUT 2 NC 3 GND 4
8-Pin DFN(2)
8
TC4421 TC4422
VDD VDD
5-Pin TO-220
Tab is Common to VDD
TC4421 TC4422
7 6 5
TC4421 TC4422
Note 1: Duplicate pins must both be connected for proper operation. 2: Exposed pad of the DFN package is electrically isolated.
TC4421/TC4422
Functional Block Diagram
VDD
TC4421
Inverting 200 A 300 mV Output
Input 4.7V
TC4422
Non-Inverting
DS21420D-page 2
TC4421/TC4422
1.0 ELECTRICAL CHARACTERISTICS
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = +25C with 4.5V VDD 18V. Parameters Input Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current Output High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Peak Output Current Continuous Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current Operating Input Voltage Note 1: 2: 3: IS VDD 4.5 0.2 55 1.5 150 18 mA A V VIN = 3V VIN = 0V tR tF tD1 tD2 60 60 30 33 75 75 60 60 ns ns ns ns Figure 4-1, CL = 10,000 pF Figure 4-1, CL = 10,000 pF Figure 4-1 Figure 4-1 VOH VOL ROH ROL IPK IDC IREV VDD 0.025 2 1.4 0.9 9.0 >1.5 0.025 1.7 V V A A A DC TEST DC TEST IOUT = 10 mA, VDD = 18V IOUT = 10 mA, VDD = 18V VDD = 18V 10V VDD 18V, TA = +25C (TC4421/TC4422 CAT only) (Note 3) Duty cycle 2%, t 300 sec VIH VIL IIN 2.4 10 1.8 1.3 0.8 +10 V V A 0V VIN VDD Sym Min Typ Max Units Conditions
Switching times ensured by design. Package power dissipation is dependent on the copper pad area on the PCB. Tested during characterization, not production tested.
DS21420D-page 3
TC4421/TC4422
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD 18V. Parameters Input Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current Output High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current Operating Input Voltage Note 1: IS VDD 4.5 3 0.2 18 mA V VIN = 3V VIN = 0V tR tF tD1 tD2 60 60 50 65 120 120 80 80 ns ns ns ns Figure 4-1, CL = 10,000 pF Figure 4-1, CL = 10,000 pF Figure 4-1 Figure 4-1 VOH VOL ROH ROL VDD 0.025 2.4 1.8 0.025 3.6 2.7 V V DC TEST DC TEST IOUT = 10 mA, VDD = 18V IOUT = 10 mA, VDD = 18V VIH VIL IIN 2.4 10 0.8 +10 V V A 0V VIN VDD Sym Min Typ Max Units Conditions
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V. Parameters Temperature Ranges Specified Temperature Range (C) Specified Temperature Range (E) Specified Temperature Range (V) Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 5L-TO-220 Thermal Resistance, 8L-6x5 DFN Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC JA JA JA JA 71 33.2 125 120 C/W C/W C/W C/W Typical 4-layer board with vias to ground plane TA TA TA TJ TA 0 40 40 65 +70 +85 +125 +150 +150 C C C C C Sym Min Typ Max Units Conditions
DS21420D-page 4
TC4421/TC4422
2.0
Note:
tRISE (nsec)
0 4 6 8 10 12 VDD (V) 14 16 18
5V 250 10V 200 150 15V 100 50 0 100 250 10V 200 150
5V
tFALL (nsec)
tRISE (nsec)
1000
100,000
1000
100,000
CLOAD = 1000 pF
45
Time (nsec)
Time (nsec)
40
tRISE
50 40 30
35
tD1
tD2
tFALL
30
-40
40
TA (C)
80
120
25
10
12
14
16
18
VDD (V)
DS21420D-page 5
TC4421/TC4422
Note: Unless otherwise indicated, TA = +25C with 4.5V VDD 18V.
220 200 180 160
ISUPPLY (mA)
180
VDD = 18V
160 140
22,000 pF
2 MHz
10,000 pF
140 120 100 80 60 40 20 0 100 1000 10,000 CLOAD (pF) 100,000 632 kHz 200 kHz 20 kHz 1.125 MHz 63.2 kHz
ISUPPLY (mA)
VDD = 12V
100 80 60 40 20 0
ISUPPLY (mA)
120
20 kHz
20 0
100
1000
100,000
200 kHz
47,000 pF 22,000 pF
ISUPPLY (mA)
ISUPPLY (mA)
10,000 pF
20 470 pF 0 10
100,000
1000
DS21420D-page 6
TC4421/TC4422
Note: Unless otherwise indicated, TA = +25C with 4.5V VDD 18V.
120 110 100 90
Time (nsec)
50
45 40 35
Time (nsec)
80
tD2
30 25 20 60 40 20
tD1
20 40 TA (C)
60
80
100 120
VDD = 18V
10-7
IQUIESCENT (A)
Asec
Input = 1
102
Input = 0
NOTE: The values on this graph represent the loss seen by the driver during a complete cycle. For the loss in a single transition, divide the stated value by 2.
TJ (C)
6 5.5 5
TJ = 150C
4.5
RDS(ON) ()
DS21420D-page 7
TC4421/TC4422
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No. 8-Pin PDIP, SOIC
1 2 3 4 5 6 7 8
1 2 3 4 5 6 7 8 PAD
1 2 4 5 3 TAB
Supply input, 4.5V to 18V Control input, TTL/CMOS compatible input No connection Ground Ground CMOS push-pull output CMOS push-pull output Supply input, 4.5V to 18V Exposed metal pad Metal tab is at the VDD potential
3.1
3.3
The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 18V with respect to the ground pin. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of the capacitor should be chosen based on the capacitive load that is being driven. A minimum value of 1.0 F is suggested.
The MOSFET driver output is a low-impedance, CMOS, push-pull style output capable of driving a capacitive load with 9.0A peak currents. The MOSFET driver output is capable of withstanding 1.5A peak reverse currents of either polarity.
Ground
The ground pins are the return path for the bias current and for the high peak currents that discharge the load capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply source return.
3.5
The exposed metal pad of the 6x5 DFN package is not internally connected to any potential. Therefore, this pad can be connected to a ground plane or other copper plane on a printed circuit board to aid in heat removal from the package.
DS21420D-page 8
TC4421/TC4422
4.0 APPLICATIONS INFORMATION
+5V Input VDD = 18V 4.7 F 1 0.1 F Input 2 6 7 CL = 10,000 pF 4 5 0V +18V Input: 100 kHz, square wave, tRISE = tFALL 10 nsec Output 0V 10% 10% tD1 90% tR tD2 90% tF 10% +5V Input 90% 8 0.1 F Output 0V +18V Output 0V 10% 10% 10% tD1 tF 90% tD2 tR 90% 90%
Note: Pinout shown is for the DFN, PDIP and SOIC packages.
FIGURE 4-1:
DS21420D-page 9
TC4421/TC4422
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
5-Lead TO-220 Example:
8-Lead DFN
Example:
Example:
Legend:
XX...X YY WW NNN
Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week 01) Alphanumeric traceability code
Note:
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information.
Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
DS21420D-page 10
TC4421/TC4422
5-Lead Plastic Transistor Outline (AT) (TO-220)
H1 Q
b e3 e
e1
EJECTOR PIN
P a (5X)
C1 J1 A F D
Lead Pitch Overall Lead Centers Space Between Leads Overall Height Overall Width Overall Length Flag Length Flag Thickness Through Hole Center Through Hole Diameter Lead Length Base to Bottom of Lead Lead Thickness Lead Width Mold Draft Angle
INCHES* MAX MIN .060 .072 .263 .273 .030 .040 .190 .160 .385 .415 .560 .590 .234 .258 .045 .055 .103 .113 .146 .156 .560 .540 .090 .115 .022 .014 .025 .040 3 7
MILLIMETERS MIN MAX 1.52 1.83 6.68 6.93 0.76 1.02 4.06 4.83 9.78 10.54 14.22 14.99 5.94 6.55 1.14 1.40 2.62 2.87 3.71 3.96 13.72 14.22 2.29 2.92 0.36 0.56 0.64 1.02 3 7
*Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC equivalent: TO-220
Drawing No. C04-036
DS21420D-page 11
TC4421/TC4422
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) Saw Singulated
DS21420D-page 12
TC4421/TC4422
8-Lead Plastic Dual In-line (P) 300 mil (PDIP)
E1
D 2 n 1 E
A2
L A1
eB
B1 p B
Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
MIN
INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10
MAX
MIN
.140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5
.170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15
MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10
MAX
4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010 (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018
DS21420D-page 13
TC4421/TC4422
8-Lead Plastic Small Outline (SM) Medium, 208 mil Body (SOIJ)
(JEITA/EIAJ Standard, Formerly called SOIC)
E E1
p D 2 n B 1
c A A2
L A1
Number of Pins Pitch Overall Height A .080 .070 Molded Package Thickness A2 .078 .069 Standoff A1 .002 .010 Overall Width E .300 .325 Molded Package Width E1 .201 .212 Overall Length D .202 .210 Foot Length L .020 .030 Foot Angle 0 8 c Lead Thickness .008 .010 Lead Width B .014 .020 Mold Draft Angle Top 0 15 Mold Draft Angle Bottom 0 15 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
Drawing No. C04-056
MIN
INCHES* NOM 8 .050 .075 .074 .005 .313 .208 .205 .025 4 .009 .017 12 12
MAX
MIN
MILLIMETERS NOM 8 1.27 1.78 1.97 1.75 1.88 0.05 0.13 7.62 7.95 5.11 5.28 5.13 5.21 0.51 0.64 0 4 0.20 0.23 0.36 0.43 0 12 0 12
MAX
DS21420D-page 14
TC4421/TC4422
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range XX Package XXX Tape & Reel X PB Free Examples:
a) TC4421CAT: 9A High-Speed Inverting MOSFET Driver, TO-220 package, 0C to +70C.
Device:
TC4421: TC4422:
b)
TC4421ESMG: 9A High-Speed Inverting MOSFET Driver, PB Free SOIC package, -40C to +85C. TC4421VMF: 9A High-Speed Inverting MOSFET Driver, DFN package, -40C to +125C. 9A High-Speed Non-Inverting MOSFET Driver, PDIP package, -40C to +125C. 9A High-Speed Non-Inverting MOSFET Driver, PDIP package, -40C to +85C. 9A High-Speed Inverting MOSFET Driver, DFN package, -40C to +85C.
Temperature Range:
C E V
c)
Package:
AT = TO-220, 5-lead (C-Temp Only) MF = Dual, Flat, No-Lead (6x5 mm Body), 8-lead MF713 = Dual, Flat, No-Lead (6x5 mm Body), 8-lead (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead SM = Plastic SOIC (208 mil Body), 8-lead SM713 = Plastic SOIC (208 mil Body), 8-lead (Tape and Reel)
a)
TC4422VPA:
b)
TC4422EPA:
PB Free
* Available on selected packages. Contact your local sales representative for availability
c)
TC4422EMF:
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21420D-page 15
TC4421/TC4422
NOTES:
DS21420D-page 16
Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchips products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Companys quality system processes and procedures are for its PICmicro 8-bit MCUs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchips quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
DS21420D-page 17
ASIA/PACIFIC
Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8676-6200 Fax: 86-28-8676-6599 China - Fuzhou Tel: 86-591-750-3506 Fax: 86-591-750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Shanghai Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 China - Shenzhen Tel: 86-755-8290-1380 Fax: 86-755-8295-1393 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Qingdao Tel: 86-532-502-7355 Fax: 86-532-502-7205
ASIA/PACIFIC
India - Bangalore Tel: 91-80-2229-0061 Fax: 91-80-2229-0062 India - New Delhi Tel: 91-11-5160-8632 Fax: 91-11-5160-8632 Japan - Kanagawa Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Kaohsiung Tel: 886-7-536-4816 Fax: 886-7-536-4817 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Taiwan - Hsinchu Tel: 886-3-572-9526 Fax: 886-3-572-6459
EUROPE
Austria - Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Ballerup Tel: 45-4420-9895 Fax: 45-4420-9910 France - Massy Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Ismaning Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 England - Berkshire Tel: 44-118-921-5869 Fax: 44-118-921-5820
08/24/04
DS21420D-page 18