Professional Documents
Culture Documents
May Electronics Produce
May Electronics Produce
PRODUCTS
Energy-Saving Initiative Motors & Controls Consumer Electronics Forum In This Issue...
No-nonsense tools for the busy EE
MAY 2012
electronicproducts.com
A Hearst Business Publication
C
M
Y
CM
MY
CY
CMY
K
MD_InsideCover_April.pdf 1 3/28/2012 4:19:18 PM
Energy-Saving Initiative Motors & Controls Consumer Electronics Forum In This Issue...
electronicproducts.com
A Hearst Business Publication
onsense tools for the busy EE
MAY 2012
2011 Agilent Technologies, Inc.
You should expect more from a
power supply than just power.
Fast Forward with exclusive Agilent functionality
Theres more to a great power supply than just clean, reliable
power. Thats why Agilent power supplies are designed to
simplify difcult tasks and streamline setups. Backed by
decades of power expertise and breakthrough technology,
Agilent power supplies provide fast, accurate sourcing and
measurements to give you condence in your results.
Ag Agilent DC Power Supplies (200+ chhoi o ces)
Gain insights with scope pe-l -lik ikee di disp spla lay, ARB and data logger
Ensure re DDUT UT safet ty y wwith extensive built-in protections
Increase thr hrou ough ghpu put t wi with th iind ndus ustr try- y-le lead adin ing g processing speed
Download our Power Supply Selection Guide
Find the one to match your specic need
www.testequity.com/Agilent_Power
Agilent and our
Distributor Network
Right Instrument.
Right Expertise.
Delivered Right Now.
800-732-3457
www.testequity.com/agilent
Advanced semiconductor solutions to fuel your creativity.
Come to Mouser frst for what's next from these industry leaders.
Its
to be
square.
The Newest Products for Your Newest Designs
mouser.com
mouser.com
Semiconductors and electronic
components for design engineers.
Mouser and Mouser Electronics are registered trademarks of Mouser Electronics, lnc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.
A BERKSHlRE HATHAWAY COMPANY
Authorized Distributor
ElecProd_5-1 ItsHip.indd 1 4/13/12 9:12 AM
MeaWelREV_LEDS_1003 1 3/2/10 1:26 PM
Vol. 54, No. 12 MAY 2012
CONTENTS
PRODUCT
UPDATE
Dc/dc
converters
68
C
o
v
e
r
P
h
o
t
o
g
r
a
p
h
L
i
g
h
t
b
u
l
b
p
h
o
t
o
g
r
a
p
h
c
o
u
r
t
e
s
y
o
f
C
r
e
e
(
D
u
r
h
a
m
,
N
C
)
D
i
g
i
t
a
l
i
m
a
g
e
r
y
b
y
D
o
n
W
i
l
b
e
r
.
DEPARTMENTS
6
Viewpoint: Its not a small world after all
8
Product of the Year Story Behind the Story:
International Rectifiers IR3550 a big feat in a small
footprint
11
OUTLOOK (Technology News)
Hybrid cube promises memory revolution
Standoff sensing system identifies materials using
dual-laser technique
SID lights up Boston
At Sensors Expo, MEMS the word
Whats new at IMS2012
63
Whats Inside: Samsung Galaxy Nexus SCH-i515
Mobile Handset
64
Product Application: Industrial automation electronics
66
Product Roundup: Packaging & EMI/RFI Shielding
68
Product Update: Dc/dc converters
NEW PRODUCTS
77
Power Sources
83
Packaging & Interconnections
88
Intergrated Circuits
90
Components & Subassemblies
93
Optoelectronics
94
Test & Measurement
Electronic Products Magazine (USPS 539490) (ISSN 0013-4953)Published monthly by Hearst Business Communications Inc./UTP Division, 50 Charles Lindbergh Blvd., Suite 100, Uniondale, NY 11553.
Periodicals postage paid Garden City, NY and additional mailing offices. Electronic Products is distributed at no charge to qualified persons actively engaged in the authorization, recommendation or
specification of electronic components, instruments, materials, systems and subsystems. The publisher reserves the right to reject any subscription on the basis of information submitted in order to
comply with audit regulations. Paid subscriptions available: U.S. subscriber rate $65 per year, 2 years $110. Single issue, $6.00. Information contained herein is subject to change without notice. No re-
sponsibility is assumed by the publisher for its accuracy or completeness.
Postmaster: Send address changes to Electronic Products, PO Box 3012, Northbrook, Il 60065-3012. Phone 847-559-7317
2011 by Hearst Business Communications Inc./UTP Division. ALL RIGHTS RESERVED
Publications Mail Agreement Number 40012807. Return Undeliverable Canadian Addresses to: Station A PO Box 12, Windsor, ON N9A 6J5
Want to see what the Editors are thinking? www2.electronicproducts.com/ElectronicProductsBlogs.aspx
Focus: Industrial strength, smartphone sensibilities
New Scale Technologies
Data centers discover the value of LiFePO4 batteries
Palladium Energy
Safety and the lithium battery
Monolithic Power Systems
whats ONLINE...
electronicproducts.com
Matching ESD protection to process geometry
ON Semiconductor
The evolution of quartz timing technology
Pericom
Redefining low power in current-sense amps
Touchstone Semiconductor
OUTLOOK
Hybrid cube
promises memory
revolution
11
COVER STORY
Lighting & Optoelectronics
39
This month, Electronic Products looks at several
technical issues faced by those designing LED-
based lighting and flat-panel displays.
41
When it comes to binning LEDs,
some like it hot
44
Drivers enable next-gen LED street
lighting
51
Balancing power parameters in LED apps
54
New approach prevents thermal runaway
58
Increasing viewability, not backlighting,
for displays
ENERGY-SAVING INITIATIVE SERIES
22
Part 1 The history of energy harvesting
FEATURES
27
Motors & Controls
Brushless motors with integral controls
30
Consumer Electronics Forum
Whats Inside
Samsung Galaxy
Nexus SCH-i515
Mobile Handset
63
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 5
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 6
shrimp at the bottom of the Mariana
Trench, but that doesnt really apply
to people in some of the remote parts of Africa or Latin
America, does it? Personally, this traveler has been in a
few places in the last few years where Internet access or
cell service was nonexistent to limited, at best. But I
think we fool ourselves into believing the hype the
world is such a small place. Maybe I should just blame
Disney and the Its a Small World After All stuff for
my childhood misconception.
Bryan DeLuca
To comment on this Viewpoint, visit www.eebeat.
com/?p=4967
Its not a small world
after all
L
ike nodes of many kinds, peo-
ple have a tendency to cluster
together. Why? Jobs, food,
shelter, safety, and the comfort of
human companionship.
But what about technology? We
think technology makes the world
a small place, and it does on some
level because it allows us to con-
nect to anyone in the world,
right? Yes, you can make calls
to remote places or share ideas
on the Internet with people in
other countries. Yes, yes, yes.
But overall you cannot reach
everyone everywhere by far. I
call BS on the whole thing.
Did you ever look at a light
pollution map? More than
half the land mass of the world
is blacked out. If you fly over
east of the Mississippi, the place
it lit up like a Christmas tree. I
can even see from the air the ma-
jor roadways that lead to my house
while coming in at JFK. Fly over China and its dark in so
many places.
But light pollution is not the only map that looks like
this. So does cell phone coverage. Now stack those maps
on top of a population density and you start getting a re-
ally good picture of how the world is wired to say the
least. And where the technology, including communica-
tion, really spans. We tend to even forget about the power
we need to run everything.
So why do we try to kid ourselves the world is such a
small place? Yes, James Cameron can tweet he saw some
VIEWPOINT
Coming in over Long Island, you can trace
every major roadway. (Photo courtesy of
Laura Leudesdorff-DeLuca)
EDITORIAL STAFF
516-227-1300 FAX: 516-227-1901
Content Operations Director Bryan DeLuca
516-227-1379 bdeluca@hearst.com
Managing Editor John Filippelli
516-227-1381 jfilippelli@hearst.com
Senior Editor Paul OShea
941-359-8684 poshea@hearst.com
Editor Christina Nickolas
516-227-1459 cnickolas@hearst.com
Technical Editor Jim Harrison
415-456-1404 jpharrison@hearst.com
Editor Richard Comerford
516-227-1433 rcomerford@hearst.com
Contributing Editors Carolyn Mathas
Michael Kawa
Steve Evanczuk
Chief Copy Editor Leonard Schiefer
Custom Media Editor Missy Harris
Online Researcher and Editor Jeffrey Bausch
Directory Coordinator Fran Panzica
Art Director Don Wilber
Artist Estelle Zagaria
Group Production Manager Thomas Young
Client Services Accounts Manager Amy Fischer
Client Services Coordinator Marisa Giordano
Audience Development Director Carolyn Giroux
Subscriber Service 1-866-813-3752
Group Publisher Steve Cholas
Electronics Group
Director of Online Sales Robert McIntosh
and Operations
Published by
Hearst Business Communications, Inc.
UTP Division
A Unit of The Hearst Corporation
50 Charles Lindbergh Blvd.,
Suite 100 Uniondale, NY 11553
TEL: (516) 227-1300 FAX: (516) 227-1901
Robert D. Wilbanks
Treasurer
Catherine Bostron
Secretary
William Barron
Vice President, Publishing Director,
Electronics Group
Adriana Marzovilla
Business Manager
THE HEARST CORPORATION
George R. Hearst, Jr.
Chairman
Frank A. Bennack, Jr.
Vice Chairman & Chief Executive Officer
HEARST BUSINESS MEDIA
Richard P. Malloch
President & Group Head
Robert D. Wilbanks
Group Controller
Electronic
PRODUCTS
International Rectifiers IR3550
a big feat in a small footprint
PRODUCT OF THE YEAR
THE STORY BEHIND THE STORY
T
he IR3550 PowIRstage is a pio-
neering device that features a
synchronous buck gate driver,
an integrated synchronous MOSFET,
and a Schottky diode all in a 6 x 6 x
0.9-mm PQFN package. The device
targets high-current multiphase buck
regulators and simplifies dc/dc con-
verter design. It will find application
in next-generation servers, storage,
and communication systems. The
company set the standards for this
device high, requiring that the pack-
aging optimized efficiency by reduc-
ing parasitic and increasing thermal
conduction. The driver design of this
new device had to ensure that the
drive characteristics optimized the
efficiency of the Generation 12.5
MOSFETs used in the device. The
IR3550 design team was required to
hit the efficiency targets that cus-
tomers demanded and to hit the
space/density requirements as well
a big feat in a small footprint.
Three teams from within IR com-
bined to accomplish this design:
multiphase design, packaging, and
application engineering.
The company saw that next-gen-
eration high-performance server,
storage, and communication system
CPUs, GPUs, and DDR memories have
increasingly challenging power man-
agement requirements of up to 300-A
load currents at very low voltages of
around 1 V. The very high efficiency,
low power losses, excellent thermals,
and reduced space were some of the
key demands for these next-genera-
tion systems. In order to meet these
requirements, a multi-
phase synchronous buck
converter is needed. The
maximum current per
phase has traditionally
been limited to 15 to 30
A due to the limitations
of conventional MOS-
FET, driver, and packag-
ing technologies. The
IR3550 PowIRstage de-
livers the highest bench-
marked efficiency in the
marketplace for high-
current multiphase solu-
tions and it does it at 60
A. This allows custom-
ers to increase the main
CPU dc/dc solution efficiency signifi-
cantly, saving energy and cost or meet
a similar efficiency to previous gen-
erations, but without a heat sink, sav-
ing space and cost or meet a similar
efficiency to previous generations,
but with at least one, possibly two
fewer phases For example, you can
convert a six-phase design to a five- or
even four-phase design. For increas-
ing load requirements extra phases
are required to handle the power,
which in most cases is extremely un-
desirable and leads to extra board
space, increased system costs and
higher component count.
Paul OShea
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 8
TECHNICAL SUPPORT: 1.877.736.4835
COMMUNITY: element14.com
WEBSITE: newark.com
LEARN MORE: newark.com/together
HOW MAY WE HELP YOU TODAY?
COMPLETE
ENGINEERING
SOLUTIONS
Start here.
Get direct, one-on-one technical support from real engineers
with no go-between and no waiting. Access industry,
manufacturer and legislative experts on our community.
And nd thousands of technical documents, videos & tools all in
one source. Engineering expertise starts at Newark element14.
9 out of 10 customers recommend
Newark element14 Technical Support
Customer feedback studies
WWW.COILCRAFT.COM
3104 does just that: its buck regulator can deliver 300mA with up to 95% efficiency with a no load quiescent current of
just 1.8A when in Burst Mode
operation. Its 10mA low noise LDO adds just 1.0A of quiescent current and can be powered
from the buck output. The LTC3104s wide 2.5V to 15V input voltage range accommodates a variety of input sources, making
it ideal for remote sensor networks, portable instruments and a wide range of battery-powered devices.
V
IN
Range: 2.5V to 15V
V
OUT
Range: 0.6V to 13.8V
300mA Buck I
Q
= 1.8A
1.2MHz Constant Frequency, Current
Mode Architecture
10mA LDO I
Q
= 1.0A
LDO Dropout = 150mV
3mm x 4mm DFN14, MSE16 Packages
LTC3103 for 300mA Buck Only in
3mm x 3mm DFN, MSE10
1.8V
1.2V
LTC3104
RUNLDO
RUN
V
IN
GND
SW
FB
VLDO
FBLDO
1.2M
600k
600k
600k
I
BATTERY
= 3.8A
9V
, LT, LTC, LTM, Linear Technology, the Linear logo and Burst
Mode are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
www.linear.com/product/LTC3104
1-800-4-LINEAR
LTC3104 Video Product Brief
Output Current (A)
65
E
f
f
i
c
i
e
n
c
y
(
%
)
95
100
60
55
90
75
85
80
70
0.0001 0.01 0.1 1
50
0.001
V
IN
= 4V
V
IN
= 7V
V
OUT
= 2.5V
L = 10H
LTC3104 Efciency Curve
(Automatic Burst Mode Operation)
OUTLOOK
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 14
At Sensors
Expo,
MEMS
the word
T
he organizers of this years Sen-
sors Expo are quick to point out
that microelectromechanical
systems (MEMS) will be a key technol-
ogy featured in the educational ses-
sions and throughout the Expo Hall
during the event. We are proud of
our history and our focus on cutting
edge technology by partnering with
the MEMS Industry Group and oth-
ers, said Wendy Loew, Group Show
Director for Questex Media Group,
LLC, producers of Sensors Expo.
Since 1987, when the industry was
just in its infancy, we have been bring-
ing together the industry leaders like
Epson, ROHM, PCB Piezotronics, and
MicroStrain to share the newest tech-
nologies with engineers who are pro-
viding the solutions for tomorrow.
Beginning Tuesday, June 5, MEMS
education at Sensors Expo will kick
off with a pre-conference workshop
entitled MEMS in the Mainstream:
Commercialization and Product Real-
ization - Leveraging the MEMS Infra-
structure produced in partnership
with MEMS Industry Group (MIG).
the exciting work that will be described at the symposium
are the printing of organic TFTs and a new way to use high-
temperature processes on low-temperature substrates.
This years keynote speakers will offer talks about
breakthroughs in OLEDs and how they can be used for
OLED TVs. For example, mass-production OLED displays
have gone from 5 to 55 in. in just three years. Another
speaker will talk about three waves of display evolution
for the continuous growth of the LCD market including
the notebook, at-screen monitors, and LCD TVs, but
these have slowed and even stagnated. The next wave
will be the multi-purpose use of displays, such as in smart
windows, smart e-boards, and digital art displays. The
nal keynote will be about the development of novel dis-
plays by the Camera Culture Group at the MIT Media
Lab. These architectures exploit both the design of opti-
cal elements (e.g., lenslet arrays and layered light-attenu-
ating masks) and the development of the associated light-
eld encoding/decoding algorithms. Some of the novel
displays include a new type of I/O device that possesses
the ability to both capture images
and display them; and a 6D optical
system, which responds to changes
in viewpoint as well as changes in
back-lit transmitted illumination.
Paul OShea
For more on DisplayWeek at
the Boston Convention Center
from June 3 to 8, go to http://
www.displayweek.org/
>>
Find out how LabVIEW can make you better at ni.com/labview/better 800 453 6202
2010 National Instruments. All rights reserved. LabVIEW, National Instruments, NI, and ni.com are trademarks of National Instruments.
Other product and company names listed are trademarks or trade names of their respective companies. 2807
NI LabVIEW
Name
Dr. Laurel Watts
Job Title
Principal Software
Engineer
Area of Expertise
Chemical Engineering
LabVIEW Helped Me
Control multiple
instruments operating in
harsh conditions
Latest Project
Engineer the ultimate
storm chaser
LabVIEW makes me better because the
with hardware is so seamless
2807.indd 1 3/9/11 4:27:15 PM
OUTLOOK
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 16
Whats new at IMS2012
haul, WiGig (IEEE 802.11ad) multi-Gbit/s solutions in-
cluding wireless cable replacement (HDMI, USB 3.0, Dis-
playPort), wireless docking
stations, video/magazine ki-
osks and wireless sensors. The
HMC6000 transmitter IC can
translate analog baseband in-
phase and quadrature signals
to a selected channel in the 60-
GHz band, requiring only an
external crystal oscillator.
The HMC6000 transmitter
IC includes a low-phase-noise
frequency synthesizer for tuning across the 57 to 64-GHz
band in 500 or 540 MHz steps depending upon the refer-
ence input frequency. The HMC6001 receiver IC operates
with single-ended input signals from a selected channel
in the 60 GHz band and downconverts them to differen-
tial analog I and Q baseband signals.
Analog Devices (Booth #1725) will spotlight complete
system solutions and demos of new offerings, including RF/
IF ampliers, frequency synthesizers and data converters,
including the industry rst ADL5324 half-Watt RF driver
amplier with dynamically adjustable bias and extended
temperature range for wired and wireless applications. In
addition, ADI will demo the ADRF660x series of mixers and
ADRF670x series of modulators, which achieve a break-
through level of integration, enabling LTE and 4G base sta-
T
his years International Microwave Symposium
(IMS2012) is being held in Montral, Quebec, Can-
ada, from June 17 to 22. It coincides with the 60th
anniversary of the Microwave Theory and Techniques So-
ciety (MTT-S), which will be celebrated in various ways at
the symposium. Below are just a few products that will be
shown. For additional related news plus more products
shown at IMS2012, visit my column at www.eebeat.com/
?author=5 during the conference.
Showcased parts
TriQuint Semiconductor (Booth# 1815) will present a pair
of best-in-class ultra-low-noise single-ended ampliers for
3G/4G cellular base
station frequencies,
the TQP3M9036
(0.4-1.5 GHz) and
TQP3M9037 (1.5-
2.7 GHz). Although
highly integrated
and fully matched,
the parts deliver a
noise gure of less
than 0.5 dB while providing 19 dB of gain minimum.
Samples are now available.
Hittite Microwave (Booth #1701) will showcase the
HMC6000/6001 silicon transceiver chipset, which targets
60-GHz applications such as: metrocell/picocell back-
TriQuints TQP3M9036/37 ultra-low noise
amplifiers
Hittites HMC6000/6001
silicon transceiver chipset
Sensors Expo will be held June 6 and 7 at the Donald E.
Stephens Convention Center in Rosemont, IL. For more
information, visit www.sensorsexpo.com.
This symposium will explore the many models of achiev-
ing MEMS commercialization and product realization.
System-level customers in attendance will learn how to
leverage a mature MEMS infrastructure capable of deliver-
ing system-level components without the cost, develop-
ment time or performance risks of
years past.
Speakers will discuss how MEMS
fabrication has evolved, creating a
new era of in-house fabrication as
well as fabless and fab-lite manufac-
turing. Presentations will include
different perspectives on how com-
panies have incorporated MEMS so-
lutions into their current product
line while using their existing in-
frastructure. They will also address
the product development challeng-
es and the market-pull-versus-tech-
nology-push issues that are unique
to MEMS. In other words, MEMS is
in the mainstream.
The conference will showcase over 55 sessions during
the two-day event, including a dedicated MEMS track with
nine sessions. Specic MEMS sessions include:
Sensor Fusion: Applications, Challenges and Solu-
tions, chaired by Stephane Gervais-Ducouret, Director
for Sensors, Freescale
An Integrated 6-axis MotionProcessor, by Stephen
Lloyd, Vice President of Engineering and New Product
Development, InvenSense
MEMS in High Performance Audio, by Rob OReilly,
Senior Staff Engineer, Analog Devices.
In addition to the conference pro-
gramming dedicated to MEMS, Sen-
sors Expo will also provide a show-
case of the newest MEMS products
and services, as well as education on
what is to come, at the MEMS Pavil-
ion. The Pavilion will display best-
in-class exhibitors including Ad-
vanced Microsensors, Fraunhofer
ENAS, Fraunhofer IPMS, Omron, ST-
Microelectronics, Tronic MEMS, X-
Fab, and Yole Development all
providing their latest MEMS tech-
nologies. Inside the pavilion, the
MEMS Innovation Area will be dedi-
cated to companies who are on the
forefront of strategic MEMS products, such as MEMS Indus-
try Group, Acuity, Hua Yank, and Plures Technologies.
Richard Comerford
Analog, Digital & Mixed-Signal
ICs, Modules, Subsystems & Instrumentation
2 Elizabeth Drive Chelmsford, MA 01824
978-250-3343 tel 978-250-3373 fax sales@hittite.com
Order On-Line at: www.hittite.com
Receive the latest product releases - click on My Subscription
Lowest Noise Linear Voltage Regulators for 64-QAM Modulation Applications!
HMC1060LP3E Quad Output Low Noise
High PSRR Linear Voltage Regulator
Ultra Low Noise Density:
3 nV/Hz at 10 kHz, 7 nV/Hz at 1 kHz
High Power Supply Rejection Ratio (PSRR):
80 dB at 1 kHz, 60 dB at 1 MHz
Four Adjustable Voltage Outputs:
VR1: 100 mA at 1.8V to 5.2V
VR2 & VR3: 50 mA at 1.8V to 5.2V
VR4: 300 mA at 1.8V to 5.2V
Ideal for Powering Hittites Broad Line of Low Noise VCOs,
Wideband PLLs and PLL + VCOs!
Less than 1 A Power Down Current
10
-10
10
-9
10
-8
10
-7
10
-6
10
2
10
3
10
4
10
5
10
6
10
7
VR1@100 mA
VR2@50 mA
VR3@50 mA
VR4@300 mA
FREQUENCY (Hz)
N
O
I
S
E
D
E
N
S
I
T
Y
(
V
/
z
)
-90
-80
-70
-60
-50
-40
-30
-20
10
2
10
3
10
4
10
5
10
6
10
7
VR4@300 mA
VR1@100 mA
VR2 & VR3 50@mA
P
S
R
R
(
d
B
)
FREQUENCY (Hz)
Output Noise Density vs. Frequency Power Supply Rejection Ratio vs. Frequency
Input
Voltage (V)
Function
Output
Voltage
(V)
Output
Current
(mA)
Power Supply Rejection
Ratio (PSRR) (dB)
Output Noise Spectral
Density (nV/Hz)
Regulated
Outputs
Part
Number
1 kHz 1 MHz 1 kHz 10 kHz
3.3 - 5.6 Low Noise, High PSRR 1.8 to 5.1 400 60 30 6 3 1 HMC976LP3E
3.35 - 5.6 Quad High PSRR 2.5 - 5.2 240 80 60 7 3 4 HMC860LP3E
3.35 - 5.6 Low Noise, High PSRR 1.8 - 5.2 500 80 60 7 3 4 HMC1060LP3E NEW!
OUTLOOK
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 18
tion manufacturers to realize an unprecedented 60 percent
reduction in board space and a signicant savings on BOM
costs.
At the Agilent booth (#1015) you will see the EXG
N5171B,EXG N5172B, MXG N5181B, and MXG N5182B X-
Series signal generators which the company claims provide
unmatched performance in phase noise, output power,
ACPR, EVM, and bandwidth.
The MXG delivers phase
noise performance of 146
dBc/Hz at 1 GHz and 20-kHz
offset, and a spurious perfor-
mance of 96 dBc at 1 GHz.
Both the MXG and EXG fea-
ture low EVM, output power
up to +27 dBm, and ACPR of
up to 73 dBc (W-CDMA
test model 1, 64 DPCH).
Anritsu (Booth # 807)
will be showcasing its MS2830A Signal Analyzer and Vec-
torStar Broadband ME7838A system. With extended fre-
quency range to 43 GHz, the MS2830A can measure Tx
characteristics of mobile backhaul signals used in the mi-
crowave band, as well as second-order harmonics in digi-
tal terrestrial and satellite broadcasting systems up to 36
GHz. The ME7838A has industry-best broadband fre-
quency coverage starting at 70 kHz and operational
from 40 kHz to 125 GHz as well as best-in-class dy-
namic range (108 dB at 65 GHz and 107 dB at 110 GHz)
and measurement speed (55 ms for 201 points).
The OX-501 mini OCXO from Vectron International
(Booth #1300) combines a small footprint with high sta-
bility, providing 20 ppb over the full industrial tempera-
ture range in a compact industry-
standard 9x14-mm package. The
OX-501 bridges the gap between
AT cut based TCXOs and larger
OCXO designs and provides im-
proved phase noise and short-
term stability.
Teseq (Booth# 82) will show-
case the PMM 9180 digital EMC/
EMI receiver module that provides a frequency range
from 6 to 18 GHz. It is ideal for use in commercial test labs
and by in-house manufacturers labs. It features a high
speed optical interface, an operating temperature of 5
to 45C, a measurement accuracy of +2.0 dB and a maxi-
mum input level of 137 dBV without damage. It is fully
compliant with CISPR 16-1-1 and MIL-STAD.
Christina Nickolas
Vectrons
OX-501
Agilent Technologies MXG and
EXG signal generators
IMS2012 (www.ims2012.org) will be held at Palais des
congrs de Montral in Canada during Jun 17-22.
Design Outside the Box !
ZILOGS REFERENCE DESIGNS
For more information, please visit www.zilog.com
Mini-Z Modules are 28-pin dual-inline single-board computers that are easy to use
and support a wide base of free application resources.
These handy modules feature the 16-bit ZNEO CPU-based Z16F2810 MCU and are
designed to be pin-compatible with various other stamp modules, which allow for
fexibility to utilize diferent vendors base boards that you may already have in your
arsenal.
These Mini-Z stamps also ship with supporting design boards, which provide a
mix-and-match capability for creating fast solutions.
Here are just several of the Mini-Z Reference Designs Zilog ofers:
Mini-Z ZNEO 28-Pin Module
Mini-Z WLAN 28-Pin Module
Mini-Z Solid State Relay (SSR) Design Board
Mini-Z ZNEO SSR Kit
Mini-Z WLAN SSR Kit
Part Number
Z16F2800100MODG
Z16F28WF100MODG
Z16SSR00100DBDG
Z16SSR00100KITG
Z16F28WF100KITG
Mini-Z Reference Design Products
Design With Freedom
mouser.com/bomtool
The Newest Products for Your Newest Designs
Mouser and Mouser Electronics are registered trademarks of Mouser Electronics, Inc.
mouser.com
Semiconductors and electronic
components for design engineers.
Authorized Distributor
Scan here to try
Mousers new
BOM Tool
mouser.com
A BOM Tool as high-tech
as the parts it researches.
ElecProd_5-1 BOM.indd 1 4/13/12 8:55 AM
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 20
Engineering
Distribution
A
D
V
E
R
T
I
S
E
M
E
N
T
In Partnership with
E
very DIYer sometimes find themself
asking: Should I hire a professional?
Developing and cleaning a BOM
yourself is no different, beyond considering the hours
required to complete it (especially if Microsoft Excel or
other software is used that was not created specifically to
manage a BOM).
So it makes little senseparticularly if you are trying to
respond to an RFQ on time, to not use the BOM cleansing
and finalizing support tools provided by an authorized
electronics distributor. Here are a variety of reasons why:
The one cent mistake that can cost thousands
BOM software tools will validate the accuracy and cur-
rency of supplier names and part numbers, finding and
correcting misspelled manufacturer names on the cleansed
spreadsheet. You may have one row on your spreadsheet
that references TI and another row that reads Texas In-
struments. The BOM tool will recognize that and map
both into a consistent, proper format. Scrubbing old and
incorrect data for parts also minimizes sourcing delays
caused by inaccurate or invalid part data.
Environmental compliance
Using a distributors BOM tool can help head off any com-
pliance issues that may arise. It severely lessens the possi-
bility that a new RoHs-imposed regulation or a prohibited
chemical listed in REACH might find its way onto a BOM,
thus eliminating fines or lost sales due the oversight.
Part obsolescence
Using a distributors BOM analysis tool helps designers avoid
specifying discontinued parts or parts on the suppliers Not
Recommended for New Designs list, which means a part
has been superseded by another. When a BOM tool catches
obsolete semiconductors early, you stand a better chance of
finding an alternative quickly and/or developing a second-
ary source. Similarly, the BOM tool provides you with the
time needed to find an approved substitute for parts that
come in and out of stock frequently.
Early access to new technology
BOM tools reference a huge parts database, helping you
find the right solutions to fit your design. A distributors
relationship with suppliers gives them access to supplier
technology roadmaps and ensures that you get the newest
parts that meet your needs.
Mousers new Bill of Materials (BOM) Management Tool
(for more in-depth details of Mousers new BOM see the
article on the opposite page) enables users to import a new
BOM or view BOMs saved in their account. It lets you set
preferences for how you want your BOM to be processed
(such as currency, formatting, RoHS options, and more).
The tool will remember your preferences, naming
conventions and column mapping for future BOMs as well
as the product selections you have made previously.
It can analyze partial part numbers and descriptions
using a relevancy engine so that the best options can be
offered rather than simply showing that no results have
been found.
Upon completion of processing your BOM, you are
presented with an import summary, which quickly lets
you know the number of lines that were imported,
unresolved, quoted and unmatched. If the tool found
more than one match, you then review the possible
matches and select the one you want (a process known as
part resolution). Once in the part resolution phase, you
will see the data you provided at the top of the screen and
all the possible matches below it. Simply examine the
results displayed, select the part you want, and then click
the Add Selected Part to BOM button.
The new Mouser BOM Tool is available to anyone with a
My Mouser Account.
BY MURRAY
SLOVICK
Dont Let Your BOM become a BOMB
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 21
Engineering
Distribution
able to learn more about this timesaving business tool,
easily accessible at www.mouser.com/bomtool/.
Our goal was to build the most intelligent BOM tool
for our industry,
making the materials
management process
less burdensome for
engineers and buyers,
shared Shumate. It
remembers not just
your preferences,
but the layout of
your spreadsheets,
your naming
conventions and
the product selections made previously. No part number,
no problem. Instead of only matching exact
manufacturers part numbers, it can analyze partial part
numbers and descriptions using a relevancy engine so
that the best options can be offered. Currently, other
industry BOM tools come up short by showing no
results found.
Unlike other distributors BOM tools, engineers and
buyers can choose what product data they want in
which columns and export everything into their
original spreadsheet with their own custom formatting
intact. Currency, formatting, RoHS options, and other
individual preferences are remembered allowing each
user to create a truly personalized experience. If a
customer does not have a spreadsheet, they can easily
paste data directly into the tool. Overall, Mousers BOM
tool is designed to work around individual users, rather
than demanding that individual users conform to a set
process determined by the distributor. Ultimately, this
benefits customers by allowing them to spend less time
reformatting data and resetting preferences. The tool is
as unique as each customer that visits mouser.com and
uses it.
Overall, Mousers new and improved BOM
Management Tool gives engineers and buyers what they
demand most time to design the next technological
wonder. For more information, visit www.mouser.com/
bomtool/.
Engineering
Distribution
A
D
V
E
R
T
I
S
E
M
E
N
T
W
orking smarter is all about discovering new
efficiencies the kind of efficiencies that
streamline complex mundane tasks, offer
process improvements, and conserve valuable resources.
Regardless of the end product, every business is in a race
against time hard at work identifying new ways to
create more product while actually using less time.
This served as the business context and challenge
that led to the development of the all-new intelligent
Bill-of-Materials (BOM) Management Tool from Mouser
Electronics.
Mouser a subsidiary of TTI and part of the esteemed
collection of Berkshire Hathaway companies is a
leading worldwide
electronics distributor
focused on design/
prototype creation and
development. The
companys chief mission
is helping design
engineers and buyers
engineer a speed-to-
market advantage by
supplying the newest semiconductors and components for
product design,
combined with
any number of
Mousers value-
added services.
Mousers new
BOM Management
Tool is available
to anyone with a
My Mouser Account,
enabling users to
import a new BOM
or view BOMs
saved in their
account. In visiting
with Hayne Shumate,
Vice President of
Mouser Internet
Business, we were
In Partnership with
Engineering a Better BOM Tool
By Mouser Electronics, www.mouser.com, (800) 346-6873
Engineers and buyers can learn more about
Mousers new intelligent BOM tool on
Mouser.com/bomtool.
Hayne Shumate, Vice President of Mouser
Internet Business, heads the companys
BOM tool development team.
Mousers global headquarters and
distribution center spans over 492,000
square feet.
Making low-voltage energy harvesting practical:
Part 1
The history of energy harvesting
Bringing a sleeping giant to life
BY BOB CHAO, CEO
Advanced Linear Devices
www.aldinc.com
T
odays world-wide mantra is for
everyone and everything to be
wireless and as energy efficient
as possible. Suddenly, being tethered
to a line source or even a recharge-
able battery-pack, is not acceptable.
Engineering has extended battery
life to the point we now have the abil-
ity to cut the ac power cord for ex-
tended hours, in some cases portables
units can 24 hours or
more before requiring a
recharging. Energy har-
vesting creates the next
technology shift giving
us the ability to cut, or
at least reduce signifi-
cantly, both the a/c cord
and batteries with that
will at some point re-
quire recharging.
Ultimately, the goal
is to be able to capture
any number of very
low-state energy sourc-
es such as photovoltaic,
piezoelectric, thermo-
electric, wind, biome-
chanical or even ambi-
ent radio frequency
(RF) and electromag-
netic (EM) radiation harness this
currently unused power to run any
number of devices and products al-
lowing them to be in a near always
charged status.
We have come a long way. In the
last few years. Energy-harvesting tech-
nology has evolved to capture accu-
mulate, store and manage the energy
available from these sources. Figure 1
shows the basic concepts of energy
harvesting. But it has been a long jour-
ney since man first felt the suns rays.
Thanks to fossil fuels
The interest in harvested energy was
given a kick start in the late 1970s
when the first energy crunch came
about. Suddenly, fledgling technolo-
gies such as solar became all the rage,
and large-scale wind farms started
cropping up as well. Coincidentally,
technology had evolved to make this
somewhat practical. And contrary to
most normal technological develop-
ment tracks, the dynamics of large-
scale wind and solar technology were
much easier to implement than mi-
cro- and nano-scale technology. It
seemed like the planets had
aligned to present the ideal
combination of circumstances to
give birth to the energy-harvesting
industry and bring it into the main-
stream.
Of course, just because it can be
done doesnt always mean it will be
done. There was a lot of panic short-
ly after the first energy crisis, and
that jump-started large-scale devel-
opment of the only two practical
sources of scavenged or free energy
available at that time-wind and solar
power. As fossil fuel prices adjusted
to market demands over the next few
years, the bump that wind and solar
got from the initial panic seemed to
fade into the background. Develop-
ment continued, but alluring ROIs
that the hand-wringers promised
with the demise of fossil fuels never
materialized. The cost of fossil fuels
stabilized, and the cost of energy
harvesting still had a fairly high
amortization cost curve.
Solar powers contribution
Modern commercial photovoltaic
technology was developed in the
United States in 1954 when Daryl
Chapin, Calvin Fuller, and Gerald
Pearson developed the first commer-
cially producible silicon photovoltaic
(PV) cell at Bell Labs. This first sili-
con solar cell offered a mere 4% effi-
ciency.
It wasnt until the late 1960s that
solar cell technology advanced
enough to be implemented with
some confidence on a larger scale.
NASA decided solar was a better
choice to power satellites than nucle-
ar, which gave a green light to the
technology for commercialization.
Shortly thereafter, in the early
1970s, Dr. Elliot Berman, backed by
Exxon Corporation, designed a sig-
nificantly less costly solar cell. This
was accomplished by selecting a low-
er grade of silicon and evolving
an electronic products special series
ENERGY-SAVING
INITIATIVE
Fig. 1: Energy-harvesting
overview. (Courtesy of Advanced
Linear Devices.)
Solar-powered satellite. (Courtesy: NASA)
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 22
If you use RFID toll tags, automated water, gas or electric utility
meters, tire pressure monitors, or numerous other electronic
devices, youre probably using Tadiran batteries. You never knew
it because our batteries perform just as they were designed to,
delivering decades of trouble-free performance.
If theyre good enough for you, then theyre
good enough for your next project. Specify
a lithium battery that is so reliable,
its forgettable.
Tadiran Batteries
2001 Marcus Ave.
Suite 125E
Lake Success,
NY 11042
1-800-537-1368
516-621-4980
www.tadiranbat.com
You probably use
a Tadiran battery
but you dont
even know it.
PROVEN
25
YEAR
OPERATING
LIFE
ENERGY-SAVING
INITIATIVE
cheaper packaging. This reduced the
cost of the cell by 80%, bringing it
down from $100/W to $20/W. From
this point on, solar started to find a
home in more segments of industry.
But it wasnt until the 1990s that
better and cheaper cells were devel-
oped by applying methods such as
growing the silicon into shapes that
eliminated most of the slicing or
finding a way to simply apply solar
cell material onto inexpensive, but
rigid support structures, such as ce-
ramic, glass, plastic, or steel.
Coming soon to an array near you
are tomorrows PV cells with an ex-
pected 40%+ efficiency from
nanoparticle- and molecular beam
epitaxy-based technologies currently
on the drawing board. Essentially,
the developments of the 1990s laid
down the platform for todays 21st
century micro- and nano-photovol-
taic energy-harvesting technology.
Feel the wind
Over the years, man has used the
wind to power an almost unimagi-
nable array of devices.
Today, even human breath is ca-
pable of being harvested as a power
source a far cry from the trade
winds that powered early man to the
far corners of the world.
The most ubiquitous wind har-
nessing device is the windmill. Oth-
er than the sail, the windmill con-
cept is the basis for all wind-driven
energy devices. Perhaps the most re-
nowned utilization of windmills is
the fabled Dutch windmill innova-
tion that allowed them to drain lakes
and rivers in Europes Rhine river
delta. As far back as 200 BC, the Chi-
nese used windmills to pump water
a technique that was refined well
into the 19th century and used in
farm irrigation. About the same time,
the Persians used windmills to grind
their grain. This same general wind-
mill technique was later adapted to
generate early forms of electricity.
The first wind turbine to generate
electricity was developed by Profes-
sor James Blyth of Andersons Col-
lege in Glasgow. The configuration
consisted of cloth sails resembling
windmill blades. The generated en-
ergy was stored in accumulators and
used to power the lights of his vaca-
tion cottage in Marykirk.
Todays wind turbines are a far
cry from the windmills of bygone
eras. Modern wind turbine fields can
be seen in any number of geographic
locations around the country and
the world. According to the U.S. De-
partment of Energy, by 2030, wind-
generated energy will account for
20% of all of the generated energy in
the U.S. Europe is expected to be
even more wind powered by then.
Flip it around 180
Solar and wind have always been the
predominant sources of scavenged/
waste or free energy. Their success and
what we have learned from them has
inspired great thinkers to scale down
energy harvesting to the micro level.
As a result, the girth of energy har-
vesting has ex-
panded beyond just
wind and sun to in-
clude movement,
heat, mechanical
vibration, RF, and
others, as men-
tioned previously.
Low-power en-
ergy harvesting is
a technology of
the 21st century.
As such, its history is short but dy-
namic. Technology advancements of
the late 20th century jump started
this emerging field. The ability to re-
duce the power requirements of por-
table devices by orders of magnitude,
in just the last 10 years, has made
formerly unthinkable waste energy
sources realistic for the next genera-
tion of portable and remote devices.
While low-power harvested ener-
gy has been on the drawing board
since the late 1990s, it wasnt until
about 10 years ago that the first gen-
eration of low-power energy-harvest-
ing devices emerged. They were de-
signed to harvest micro power
primarily from photovoltaic or piezo-
electric sources. However, they were
really designed more as backup
sources to charging circuits and still
required battery back-up. In 2007,
the first true micro-powered energy-
harvesting product was developed. It
was capable of capturing energy not
only from photovoltaic or piezoelec-
tric, but also from virtually any mi-
cro-power source and its generating
action, such as:
Mechanical: vibration, stress
Thermal: furnaces, heaters,
friction
Light: photo-sensor, photo-diode
Electromagnetic:inductors,
coils, transformers
Natural Resources: wind, water,
solar, human
Other: chemical, biological
The ability to capture waste ener-
gy is due to technology known as
zero- and nano- powered metal-
oxide semiconductor field-effect
transistors (MOSFETs). These devices
can be triggered by input voltages as
low as 100 mV, and input power of as
low as 200 nA. The ultra-low pow-
ered energy-harvesting modules are
the technology that has unlocked
the next generation of energy-har-
vesting devices (see Fig. 2). This tech-
nology will be discussed, in detail, in
the next installment of this series.
This leap in technology has gener-
ated a fast-forward movement in the
development of true, untethered mi-
cro-powered energy-harvesting de-
vices. The future of this technology
will also be covered in detail, in the
third and final article in this series.
The wheels have been greased a
glimpse of the future has been
handed to us, and Moores Law is
starting to come into play in this
arena. The history of energy har-
vesting is a colorful one- from Ne-
anderthal man lying on a rock in
the sun to warm up, to future min-
iature wind turbines that can cap-
ture waste heat and power from the
breath of a human. Because micro-
power energy harvesting is such a
new platform, much of its history is
still to be written. We are lucky to
be at the forefront of the next evolu-
tion of energy harvesting.
weblink scan
Use QR reader for direct link to web page.
Part
Number
I
O
MAX
(A)
V
RRM
MAX
(V)
V
F @
I
F
= I
O
MAX
(V)
I
R @
V
RRM
MAX
(A)
Package
Type
CMSH1-200HE 1.0 200 0.9 50 SMA
CMSH3-200MHV 3.0 200 0.9 50 SMB
CMSH5-200HV 5.0 200 0.9 50 SMC
CSHD8-200 8.0 200 0.9 50 DPAK
CSHDD16-200C 16 200 0.9* 50 D
2
PAK
200V Schottky Bridge Rectifier
CBRHDSH1-200 1.0 200 0.9 50 HD DIP
*V
F
@ 8A per rectifier
For more information visit:
www.centralsemi.com/hvs6
TECHNOLOGY
ROUNDTABLE
Consumer Electronics
So I could continue that thought say-
ing that basically theres just a much
wider proliferation of devices in every-
bodys household. You have a smart-
phone, a tablet, notebook, PC, and
connected TV that is Internet-enabled,
DVRs, and more. So theres just a much
broader proliferation of electronic de-
vices in everybodys household. And
theyre all going to be connected.
Theyre all going to somehow commu-
nicate with each other. You can share
files. And you use them all in multiple
modes. You have a smartphone that
you use both for business and for en-
tertainment and playing games,
watching movies, whatever.
Youll find that people are using
their equipment a lot. And so that
does speak to battery life that theyre
going to put more demands on the
battery life. The other side of that is
theyre going to be
recharging very
frequently, on a
daily basis or
sometimes even
more, right? And
so you want that
battery use and re-
charge profile to
be as seamless as
possible. So that gives us opportuni-
ties for things like wireless charging,
higher-rate chargers, so that you can
frequently top off your battery with a
minimum impact on downtime for
the user.
Vijendra Kuroodi (Principal Systems
Architect at ROHM Semiconductor): Yes, I
would like to echo on that. I interact
with systems architects in companies,
mostly in the consumer electronics
and the PC industries and we discuss
product requirements and specifica-
tions. I very often hear the need for
new approaches to lower power con-
sumption. Just as Upal was saying, tab-
lets and portable computing and com-
munications devices will continue to
be very important, and customers are
looking for new ways to reduce power
consumption.
So that brings us to this point; La-
pis Semiconductor, which is a member
of the ROHM group of companies, has
announced the ML610Q792 Sensor
Hub, which is targeted at the smart-
phone market. The Sensor Hub helps
reduce power consumption in certain
frequently used smartphone applica-
tions. What has happened in the tab-
let, ultrabook, or smartphone plat-
forms is that there
are so many sen-
sors, that they are
best managed lo-
cally by a dedi-
cated sensor hub.
The Lapis Sen-
sor Hub is based
on a low-power 8-
bit microcon-
troller core and includes a 16-bit co-
processor for additional on-demand
processing power. When the phone
runs a pedometer application, for ex-
ample, the low-power Sensor Hub
handles computation locally, which
reduces power consumption by avoid-
ing the need to frequently wake up a
powerful quad-core system processor
which may not be running optimal
software.
High efficiency Energy Harvesting Modules
Low charge injection analog switches
Low drift CMOS timers
Voltage comparators with high current drivers
Ultra low input signal rail-to-rail CMOS op amps
High accuracy dual-slope integrating analog
and digital processors
5 1/2 digit DVM boards
Other innovative ALD precision products
Tel: 408-747-1155 Fax: 408-747-1286
www.aldinc.com
MOSFET ARRAYS
ALD EPAD
N
A
B
L
E
D
E
N-Channel
Q1 Q2
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 32
Accelerating the Speed of Design.
Avnet is ranked
Best-in-Class* for online seminars, design & engineering services and knowledgeable
application engineers proof that we consistently deliver:
> Proactive engineering support
> Factory certied FAEs
Accelerate Time to Market.
at: www.em.avnet.com/drc
1 800 332 8638
www.avnetexpress.com
*As rated by Hearst Electronics Group: The Engineer & Supplier Interface Study, 2009.
Avnet, Inc. 2011. All rights reserved. AVNET is a registered trademark of Avnet, Inc.
Follow us on Twitter!
www.twitter.com/avnetdesignwire
TECHNOLOGY
ROUNDTABLE
Ted Worroll (Global Product Man-
ager, ITT): And obviously if youre fa-
miliar with ITT and ICS division, we
manufacture the interconnect systems
that go anywhere from military to
consumer electronics.
But getting back to that power
question and wireless charging, here
in the United States, we have a wireless
charging system that provides power
to 5-W handheld devices. It uses mag-
netic resonance to wirelessly charge
low-wattage-type systems for those
military handheld devices and/or
smartphones.
In our Shenzhen factory in China,
we have a 3.3-kW wireless charging
system. If youre thinking about 3.3
kW, its a lot of power. And why would
somebody need that? Well thats actu-
ally the charging number for wireless
charging of electric vehicles today. And
it separates two plates basically 18 inch-
es apart. And its close to 95% efficient
in terms of transferring energy.
We also manufacture interconnects
that are used in consumer devices, and
we talk about lithium-ion technology
and batteries. Were very familiar with
the capabilities of electric vehicles, as
well as what you would find in hand-
held portable devices, whether its
medical or just consumer needs. We
also manufacture interconnects for
microphone speakers, vibrators, an-
tenna pickup, so on and so forth.
And what we see in the industry is a
huge move away from beryllium cop-
per. We spend a lot of time with mate-
rial-science-type technologies in find-
ing that correct product, that correct
alloy that will replace beryllium. Many
people want to move away from beryl-
lium as its hazardous material.
But long story short, weve moved a
lot of our contacts, interconnect sys-
tems to titanium copper today. And
we have 4 billion of these intercon-
nects out in the field with no failures.
So we see small size, material size in
terms of alloys and low-contact resis-
tance and basically spring-loaded-type
features to do the interconnects as
well as components in antennas. And
that includes battery contacts and bat-
tery device as well.
Challenges designers face
Electronic Products: What are the is-
sues that designers face while consum-
er devices not only need to be con-
nected to the Internet, but also need
to be fully featured and connected to
one another?
Rory Pynenburg: If I can just jump
back in again with some of the battery
requirement issues here, as theyre be-
coming more fully functioned and
consumers are using these devices in
diverse environments and demanding
longer runtimes, theres a drive for cell
vendors and battery manufacturers to
improve the energy density of the stor-
age system.
One of the easiest ways that this
can be achieved and Ive seen it on
numerous cell vendor roadmaps is
to increase the voltage and use materi-
als that have higher-charge voltages.
This is a great way forward, however,
the problem with this approach is that
for products with well-established bas-
es in the market, there may be issues
with peripherals such as charges that
will need to be field upgraded. At Mi-
cro Power, were investing a lot of ef-
fort in developing system-level solu-
tions capable of supporting any
foreseeable changes in the battery
technology. In this approach, our cus-
tomers avoid having to bring products
back into a central location for up-
dates.
ShreHarsha Rao: So I can agree
with the comment that was made ear-
lier. All the gentlemen on the call clear-
ly expressed concerns about the power
rate. So what we are seeing obviously is
with every new generation of a mobile
phone and a tablet release, you can ex-
pect brighter displays, 4G LTE, mo-
dems, and all that kind of stuff.
The bottom line is still that con-
sumers expect better battery life. I
mean there was a big issue when the
iPhone 4S was released and its battery
life was slightly down compared to the
previous one and consumers com-
plained about it.
TI and several other companies are
working to reduce the power con-
sumption in a mobile device. If you
look at a power profile of a mobile
phone battery, its dominated by the
applications processors and the dis-
play. It is extremely important that the
apps processor needs to be turned on
only when absolutely needed in order
to save power. All the analog sensor
components around it need to reduce
the interaction with the apps proces-
sor in order to save power.
And I think one of the gentlemen
from ROHM mentioned about the
sensor hub, I think thats actually a
fantastic concept. And obviously its
something that TI is working on and
were taking it to the next level, which
is to actually have it integrated in
chipsets. But most importantly is how
are these various sensors on a mobile
phone, at a tablet, working in tandem,
in synchronization without bothering
the host. Because the less you bother
the host, the less you wake up the host,
the more power youre going to save.
So thats where we are dedicated to-
wards, coming up with this intelligent
analog companion chips around
these power-hungry chipsets that can
seamlessly work and it kind of gathers
data from the sensors on the phone
and make intelligent things happen.
You know, for example, when you
tilt your iPhone or an Android phone,
the gyro or the accelerometer sends a
signal to the chipset saying all right,
youre going to move your screen the
other way. What if you can do that
intelligently without the host interac-
tion? Youre going to save a lot of
power there.
So those are some of the things that
I think more and more people are go-
ing to start investing in and looking
into the next few months because bat-
tery power cannot go down even if
you start adding features to these
phones.
Mike Salas: Lets tie some of these
themes together. What we are all talk-
ing about is the ability to capture in-
formation, the ability to compute that
information, and then the ability to
communicate that information.
Fundamentally, the function of
capturing information is the process
of interacting with the real world. This
We all live in this
very technical world.
We design very
complex things.
The march toward
innovation is very
compelling.
But ultimately,
it does come down
to the consumer.
Consumer Electronics
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 34
Power Management Solutions
Design to Delivery
Visit www.e-t-a.com/solutions to learn more
Power management solutions begin with an understanding of
your requirements. From concept to delivery, E-T-A provides:
Electrical and electromechanical design
Component sourcing and vendor management
Prototype and high volume manufacturing
100% testing in an ISO accredited facility
The result is a power management solution meeting the
specications of your application regardless of the complex-
ity. Dont let power management slow you down - Make it
our responsibility.
ETA_design_to_delivery.indd 1 3/14/12 5:38 PM
includes technologies such as envi-
ronmental sensors, human interfaces,
and the ability to effectively move in-
formation from an analog world into a
digital one.
Computing clearly is the process of
then taking this captured information
and making decisions about what you
want to do with this information. And
this is clearly driven by the end prod-
uct or application itself. This is where
processing or microcontroller horse-
power comes to the table.
The last thing is this ability to com-
municate. If you capture information
and have computed it, you also need
to communicate it. Traditionally, this
has been primarily a wired function,
using things like UARTs, USB interfac-
es, or Ethernet interfaces to send the
processed information somewhere.
Of course, more recently, weve re-
ally seen the emergence of wireless
connectivity, which can be enabled by
devices like wireless MCUs. However,
in either the wired or wireless world,
the real emerging issue is how to en-
able these devices to operate in this
new IP-enabled, iPhone-driven world.
For the foreseeable future, what I
think youll see is a bifurcated model
where youll have proprietary point-
to-point or point-to-multipoint solu-
tions that will be used alongside more
standardized approaches, whether
they be ZigBee or Wi-Fi or 6LoWPAN.
Every wireless approach has its pros
and cons.
However, utilizing many of the
technologies from these companies
on the roundtable today can really
help make these disparate approaches
appear more seamless to the consum-
er. And I think, fundamentally, thats
going to be our job to determine
how we can address these challenges
and then develop a more seamless pre-
sentation to answer the end consum-
ers needs.
Vijendra Kuroodi: I just wanted to
mention that with all the innovations
we are seeing in the consumer elec-
tronics space, ROHM has invested a lot
in sensor technologies and human in-
terface processing. We have invested
in technologies that make it easier for
a human to interact with a device us-
ing various kinds of sensors.
For example, ROHM has acquired
Kionix, which is one of the top suppli-
ers of MEMS sensors for smartphones
and tablets. Another example is the
display or the touch interface. ROHM
has the expertise in multiple products
that go with the display and touch in-
terface touch sensors, timing con-
trollers, LCD drivers, optical sensors,
motion sensors, analog and mixed-
signal technology, the whole thing;
we have invested in the entire chain of
technologies that help a device inter-
act with a human. We also try to bring
those together and provide a solution.
Electronic Products: Are they new
markets? Any opportunities that could
be created? Anything going away?
Upal Sengupta: We hope not. I
think to that point of that weve all
been talking about, therere so many
more kinds of products. So in general,
yes, of course some things will become
less popular. You know, a case in point
is the netbook PC. That was kind of a
hot topic three years ago, but it was es-
sentially been completely overrun by
the tablet today, right?
But as things go away, there will be
Streamline Your High Power Design!
1000V Q3-Class HiPerFET
TM
Power MOSFET in SMPD Package Technology
www.ixyspower.com
Applications:
-0C-0C Ceaerters
-8atter, C|arqers
-!wltc|-Me4e aa4 keseaaat-Me4e
|ewer !app|les
-0C C|eppers
-!emperatare aa4 |lq|tlaq
Ceatre|s
SMPD Package Features:
-Cempact, U|tra-|ew |ac|aqe |reh|e
(.1mm |elq|t t 1.mm |eaqt| t
1.1mm wl4t|)
-U| keceqalte4 \ Ceramlc
|se|atlea (0C8)
-\er, Nlq| |ewer C,c|laq Capa|l|lt,
-|tce||eat !|erma| |erfermaace
-|ew |ac|aqe Uelq|t (q)
-Nlq| |ewer 0easlt,
Q3-Class HiPerFET
TM
Features:
-|ew k
4sea
& Q
q
-|ew |atrlaslc ate keslstaace
-|ast |atrlaslc kectlher
-|tce||eat 4\/4t |erfermaace
-Nlq| ka|aac|e |aerq, Capa|l|ltles
-Nlq| !pee4 !wltc|laq Capa|l|ltles
-Nlq| Nelse lmmaalt,
1000V/30A Part
Number Example:
MMIX1F44N100Q3
D
S
G
EUROPE
IXYS GmbH
marcom@ixys.de
USA
IXYS Power
sales@ixys.com
ASIA
IXYS Taiwan
sales@ixys.com.tw
TECHNOLOGY
ROUNDTABLE
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 36
one or more things that probably re-
place them, right? And I think we see
there are all kinds of connected gad-
gets that weve all been talking about.
Therere just many more things that
people use now, many more products
with a battery, many more connected
devices in everybodys household, as
well as being built into peoples vehi-
cles, right?
So I think that youre just going to
see more and more different applica-
tions. As the basic technology has
been developed over the past few
years, thats now being fanned out
into so many more applications, right?
And obviously, I think one of the
things that you saw at the Consumer
Electronics Show a couple of months
ago, was a lot of emphasis on ultra-
books. And so you saw more ultrabook
PCs or lighter-weight, higher-perfor-
mance products coming out, that will
fill that gap between the tablet and
the higher computing needs that peo-
ple still have.
ShreHarsha Rao: What youre see-
ing is that gesture-based computing to
be a new market in the whole consum-
er electronic devices. I mean, Siri has
been super popular now. Its a way to
communicate with your handheld us-
ing voice. I think now, is there a touch-
less gesturing that you can do, very
Microsoft Kinect-like that you can in-
teract with your handheld devices or
even tablets for that matter.
So we think that is what
in TI we call as Natural
User Interface or NUI. It
kind of blends in very well
with our applications pro-
cessor strategy, which is OMAP, and also
our 3D imaging in a lot of sensors that
are required to make this work. So TI has
a breadth in both the processing world
from an applications processor and also
the sensors from analog world to make
this, what we believe is a natural exten-
sion of the way you interact with hand-
held devices.
You know, a lot of these gestures
are very intuitive for humans, just like
touch is so intuitive. As example my
2-year-old daughter now unlocks an
iPhone and plays YouTube videos. Its
so intuitive. And you can take it to the
next level by adding gestures. And I
think thats only going to grow. And I
think this is probably a new market
which brings in a lot of silicon content
from the embedded sensor side and
also a lot of processing on the applica-
tions processor side.
Vijendra Kuroodi: Yes, I cant agree
more with ShreHarsha. This is obvi-
ously true. We are seeing a lot of inter-
est in gesture recognition. And we
have a very interesting product based
on IR sensing that can recognize ges-
tures where you can swipe your arm,
left to right or up and down, and have
these gestures recognized.
I believe that we will see a lot of in-
novations in the TV market. Obvious-
ly, TVs are becoming smarter and more
connected. The display technologies
are improving and we will see new
uses for a TV. We will see improved
gesture recognition for games. So
Siri has quickly become one
of the most popular tools
on the iPhone 4S. (Via:
gizmodo.com)
Consumer Electronics
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 37
TECHNOLOGY
ROUNDTABLE
Consumer Electronics
whether it is added intelligence in a
remote control or new applications for
a connected TV, therell be a lot of in-
novation there.
Mike Salas: Im going to echo a lot
of the statements already made today.
But theres one thing I think is impor-
tant for all of us to keep in mind. This
is my litmus test. We all live in this
very technical world. We design very
complex things. The march towards
innovation is very compelling. But ul-
timately, it does come down to the
consumer.
And the litmus test for me is when
I call my wife, my kids or my friends, I
interact with them in a non-technical
way. What do they see and find ap-
pealing in consumer technology at
the end of the day? And what I found
and this is just my general observa-
tion is the need for simplicity. Its
taking a thermostat, for example, that
may have all these different buttons
and different screen options and is
very hard to program, and then re-en-
gineering it with a very simple intui-
tive human interface. Thats what is
very appealing to a consumer.
The IP enablement piece is very im-
portant. Clearly, as consumers have
become more and more familiar and
comfortable with iPhone technology
and IP-enabled technology, the ability
to now use smart phone applications
to drive other tasks is clearly becom-
ing important.
If you look under the hood, there
are a lot of things that we can do to try
to make the user experience simpler.
For example, when bridging technolo-
gies, if youre going to IP-enable some-
thing, there are a lot of technologies
that you have to worry about. You have
to figure out, is it going to be a ZigBee
or Wi-Fi solution, or are you going to
transmit over an Ethernet or USB con-
nection. Theres a way that we can
make that simpler. You can offer, for
example, a microcontroller solution
with the ability to bridge between a
proprietary solution into a more stan-
dardized solution, such as a bridge be-
tween the wired and wireless worlds.
My perspective is that this is the
way its going to be for the next 12 to
24 months at a minimum as we try to
find ways to bridge between the com-
plexities and to really hide these com-
plexities from the end consumer. At
the end of the day, we just need to
make technology very simple for
them. And I think thats really what
consumers are looking for.
Rory Pynenburg: I couldnt agree
more. Its our obligation as designers
to increase simplicity. But at the same
time, improve the ruggedness of de-
vices, and in doing so, the reliability.
One of the pieces that Micro Power
is working on to improve this rugged-
ness is contact-less charging. The main
challenge with it, though, as was men-
tioned previously, is its 95% efficiency.
That 5% loss of energy is going some-
where, usually as heat within the host
device. Many ultraportable devices
don't have provision for active cool-
ing, so the ability to remove heat from
the product will have to rely on smart,
holistic system-level design.
To continue with the complete
Consumer Electronics Forum, visit
www2.electronicproducts.com.
Illuminate & Indicate
ELMA spotlights your LED choices with
light guides and illumination systems
ELMA provides LED light guides, illumination systems and more
to illuminate, indicate and warn. ELMA ofers hundreds of options
from LED light tubes in multiple colors to surface-mount device
indicators to through-hole & fexible light pipes. As with every
ELMA product, our engineers specify and control all the details;
the manufacturing creates remarkable products second-to-none;
ELMAs quality control reviews each to assure our products meet
the highest standards; and we stand behind every product we sell.
For more than 60 years, ELMA provided its customers with rotary
switches, knobs and other technology solutions that kept public
safety radios functioning, trains running on time and factories
manufacturing goods. ELMA lights up those processes.
Learn why the smallest LEDs matter by visiting http://goELMA.com/plenty.
Or call toll free (855) GO-ELMA1 or (855) 463-5621.
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 38
MAY 2012
Lighting &
Optoelectronics
Special
When it comes
to binning LEDs,
some like it hot ... 41
Drivers enable
next-gen LED
street lighting ..... 44
Balancing power
parameters in
LED apps ........... 51
New approach
prevents thermal
runaway ............. 54
Increasing
viewability, not
backlighting, for
displays .............. 58
Elect ronic
PRODUCTS PRODUCTS
electronicproducts.com
Elect ronic
SPECI AL
LIGHTING & OPTOELECTRONICS
T
he human eye is an extraordi-
narily sensitive optical instru-
ment, and our brains are physi-
ologically wired to detect exceptions
and inconsistencies in our environ-
ment and analyze them as possible
sources of food, physical threats, etc.
Most people can readily detect the
difference between the points
(0.4200, 0.4400) and (0.4203, 0.4403)
on the CIE 1931 chromaticity dia-
gram (Fig 1) four decimal places of
accuracy! Therefore, even tiny pro-
cess variations in manufacturing can
manifest themselves as a problem
when it comes to any product that
deals with light and color.
We see this phenomenon in lot-to-
lot variation in dyes, fabrics and
paints but also with traditional light
sources like fluorescent, compact flu-
orescent and metal halide lamps (Fig.
2). The LED industry has had to wres-
tle with this issue as it has rapidly
When it comes to binning
LEDs, some like it hot
The human eyes sensitivity demands that LEDs be sorted in
ways that will easily provide uniformity in real-world conditions
evolved over the past decade, and the
way we have chosen to deal with it is
called binning.
Binning
Just as the name implies, binning
is a physical sorting of LED lamps
of similar brightness and color.
The individual bins are then priced
and sold commercially based on
desirability and availability. Bright-
er lamps, closer to the black body
locus (BBL) are generally more de-
sirable and availability is synony-
mous with manufacturing yield.
The lighting industry has sold, or
binned, traditional lamps by
brightness (connoted for incandes-
cent lamp by wattage) and color
(the correlated color temperature,
or CCT, expressed in kelvins) for
decades, so the LED binning is re-
ally only an extension of an exist-
ing paradigm.
One of the most difficult con-
cepts for many LED luminaire de-
signers to master is the analog na-
ture of LEDs. LEDs are not one fixed
wattage/light output, and they are
also not one fixed color/CCT/chro-
maticity. These parameters vary as a
function of many criteria: drive cur-
rent, operating temperature, number
of operating hours, phosphor technol-
ogy, and the design of the LED lamp
itself. Over the years, LED companies
have more or less arbitrarily selected
standard currents and temperatures at
which to bin their products, and they
publish standard graphs to form a
mathematical framework from which
to calculate the performance
of the LED lamp under various
operating conditions (Fig 3).
The most common binning
current for lighting-class LEDs
is 350 mA, but this too varies
by model and manufacturer. LED
lamps designed for general, non-light-
ing applications (so-called high-
brightness LED lamps) are often
binned at 20 mA. Historically, nearly
all LED lamp types have been binned
at 25C, the nominal ambient temper-
ature in the factory at the time of
manufacture.
Turning up the heat
Cree was the first LED manufacturer
to depart from the 25C binning
convention with the release in Feb-
ruary, 2011, of the XLamp MT-G (Fig.
BY MARK McCLEAR
Director of Business Development, SSL
Cree
www.cree.com
Fig. 1: Superimposed on the CIE 1931
chromaticity diagrams black-body locus
(BBL) are typical lighting-class LED bins.
Fig. 2: This bank of 400-W metal-halide lamps
illuminating a building faade in Chicago, IL, shows stark
lamp-to-lamp color variations.
Fig. 3: On a typical LED datasheet, users can find
the mathematical framework in graphical form for
calculating luminous flux under real-world
conditions.(A): XLamp XP-G relative flux vs.
junction temperature (I
F
= 350 mA). (B): XLamp XP-
G relative flux vs.current (T
J
= 25C).
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 41
4), binned at 85C. Subsequently, five
additional XLamp platforms span-
ning thousands of lumens in flux
range, single- and multi-
chip arrays, stan-
dard and high-
voltage options,
and all ANSI
c hr omat i c i t y
ranges have
been binned at
85C. This has
resulted in the
considerable ex-
perience with
so-called hot binning, and a thor-
ough understanding of the strengths
and weakness of this approach, from
the standpoints of both LED manufac-
turing and LED applications.
As the name implies, hot binning is
binning the LED lamps at a higher
temperature than the conventional
25C. The LED manufacturers who
have decided to launch new products
binned at an elevated temperature have
converged on 85C as the new conven-
tional binning temperature. Though
85C, like 25C before it, is somewhat
arbitrary, it has one major advantage
it is a lot closer to the typical operat-
ing temperature of many solid-state
lighting luminaires than 25C.
Binning at 85C makes the initial
part of the design process slightly
easier and more intuitive. For exam-
ple, if a designer were working on an
LED system that needed 1,000 lu-
mens at an 85C temperature, then
he or she could simply select 10 LED
lamps with a luminous flux of 100
lumens per LED, binned at 85C.
Thus, hot binning makes it easy to
estimate the performance of these
LED lamps in this real-world situa-
tion. On the other hand, if the LEDs
were binned at 25C, the same 10
LED lamps would need to be binned
at 114 lumens each and de-rated per
the LEDs mathematical framework
(Fig. 3) to arrive at the same 1,000
lumen goal at the system level.
So, the good news is binning at
85C makes the first-pass math more
intuitive. The bad news is you still
have to do the same math if your sys-
tem runs or ever runs at any
temperature other than 85C. Exam-
ples of this would be outdoor lumi-
naires (60 to 65C is much more
common) or freezer cases (20 to
25C is typical) or downlights in in-
sulated ceilings or almost any retro-
fit bulb (often over 100C). In each
of these cases the value of binning at
85C is lost and the designer is back
to doing the same math from a new
mathematical framework where, ar-
bitrarily, 85C is now set to equal
100%.
Dont get burnt
As we pointed out earlier, LED lamp
performance can vary considerably as
a function of drive current and tem-
perature. Since an LED supplier can
never know exactly what application
an LED will be applied to in the field,
minimizing this variation across all
possible drive currents and operating
temperatures is very important. Mini-
mizing this variation also poses ex-
treme challenges to LED chip design,
phosphor technology, process control,
and package/lamp construction.
There are hundreds of ways to cut
corners on these LED lamp design pa-
rameters this is one of the main dif-
ferences between lighting-class and
high-brightness LEDs and the re-
sults are often not readily apparent
from a typical LED datasheet. Hot bin-
ning can mask some of these issues
even further, so hot binning can be
misused to mask enormous color vari-
ation of low-quality LED lamps over
the full range of operating tempera-
tures and drive currents.
For example, Fig. 5 shows LED
lamps binned at 85C from two differ-
ent manufacturers. In each case, the
LED lamps were driven starting at the
binning drive current (350 mA) and
then stepped up to the datasheet max-
imum (1,500 mA). The lamps were
mounted on a thermal chuck to con-
trol the temperature from 35C and
allowed to run up to 105C at each
current step, and the chromaticity
points (x, y in Fig. 1) were recorded.
In Fig. 5, LED A has a very large
color variation over 400K CCT
as a function of drive current and tem-
perature. We also note that this varia-
tion is more or less horizontal across
the CCT range. Over the allowable op-
erating range of the device, the LED
lamp actually changes color from the
starting point in the 2,700K ANSI
quadrangle and crosses over well into
the 3,000K ANSI quadrangle. This
would not be considered acceptable
color stability performance for most
lighting applications.
Binning this lamp hot is conve-
nient for the manufacturer of LED A,
who is betting that the lamp will be
used in or around 85C in the field, and
also near the nominal binning current
of 350 mA. If this is the case, the cus-
tomer will more or less get the flux and
chromaticity that was ordered. Prob-
lems arise when the actual application
(for example, outdoor, freezer, down-
lights, and bulbs, as noted previously)
calls for almost any temperature or
drive current other than the hot-bin-
ning parameters selected arbitrarily by
the LED manufacturer.
LED B, on the other hand, shows
only 31K variation across this same
range of drive currents and tempera-
tures, and remains in the ANSI 3,000K
quadrangle under all datasheet oper-
ating conditions. This lighting-class
LED lamp system was engineered to
manage the variation more in the ver-
tical direction along constant CCT
lines regardless of end
use application.
In summary, binning is
how LED manufacturers
reconcile manufacturing
process variations and the
exacting sensitivities of
the human vision system.
Binning at 85C is quickly
becoming the convention
in the Lighting-class LED
market segment because
binning at elevated temperatures can
make the initial design efforts a bit
more intuitive. There is no freedom
from LED binning at this point in
LED technology development, or
from the math that must be done in
designing with these analog compo-
nents in most real-world applications.
Hot LED binning is not always a mag-
ic fix-all designed to help LED system
designers it can also be a market-
ing fix-all designed to help mask an
underlying design weakness of an
LED component.
Fig. 4: The
XLamp MT-G shown
here was the first LED
to be binned hot, at
85C.
Fig. 5: This diagram, of LED color shift over maximum current
and temperature, shows how hot binning can be used to
mask massive color shift for some LEDs.
When it comes to binning LEDs, some like it hot SPECI AL
LIGHTING & OPTOELECTRONICS
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 42
Thermally conductive insulated metal substrate
boards specifically configured for LED applications.
NEW
T-CLAD
PA
STICKS
IT TOHEAT.
Peel and place thermal solution withstands the heat of solder reflow.
Easier assembly, cooler LEDs.
Bergquists T-Clad with pre-applied Bond-Ply
PA
Sample Board
SPECI AL
LIGHTING & OPTOELECTRONICS
I
n Canada and the United States,
power is often distributed to out-
door lighting fixtures at 347 or
480 Vac, respectively. With the adop-
tion of LEDs, the light fixture must
then convert the power to much low-
er voltages on the output; in the U.S.
this voltage needs to be below 60 Vdc
if safety extra-low-voltage (SELV)
constraints are observed.
Until now, this conversion was ac-
complished using bulky and ineffi-
cient step-down transformers that
increased design complexity as well
as power losses in the conversion
stage. What is needed is a new type of
integrated power supply that can pro-
vide this conversion without the need
of the external step-down transform-
er thus simplifying the design, reduc-
ing the driver system weight and
eliminating the energy losses associ-
ated with the transformer.
According to industry analyst
firm Strategies Unlimited, the U.S.
market has taken the lead in proving
the viability of LED technology for
outdoor lighting applications. The
Department of Energy (DOE), the
Municipal Solid-State Street Lighting
Consortium, and the Design Lights
Consortium have all undertaken ef-
forts to increase the industry aware-
ness of the quality requirements nec-
essary to successfully progress the
LED adoption. Strategies Unlimited
says the CAGR for unit growth is
forecasted to grow 26% from 2010 to
2015, with the market reaching $544
billion in revenues in 2015.
The driver system is the key to en-
Drivers enable next-gen
LED street lighting
What designers must consider when selecting a driver, focusing
on why eliminating the step-down transformer is a good idea
abling the promise of the LEDs. LEDs
are complex, sophisticated semicon-
ductor devices whose tightly interde-
pendent photometric (luminous flux
and efficacy), electrical (current,
voltage, power) and thermal (junc-
tion temperature) characteristics of-
ten behave in a highly nonlinear
manner. LED drivers play a critical
role in ensuring the light fixtures ef-
ficiency, life expectancy and compli-
ance with current regulations. Be-
yond providing an efficient and
controlled power conversion opti-
mized to drive the LEDs, the system
can also integrate dimming capabili-
ties, protections, and other features
that decrease the operating costs
even further and enhance the value
to the end user.
A new class of integrated drivers is
now able to specifically address and
eliminate the challenge of using an
external step-down lighting trans-
former in many outdoor and high-
bay LED lighting fixtures. This arti-
cle will explore the choices a street
light fixture designer must consider
when selecting a driver and specifi-
cally focus on why eliminating the
external step-down transformer
might be a good idea.
Power conversion function
In the past, an accepted driver solu-
tion for a 480- or 357-Vac street light-
ing system was to use a step-down
lighting transformer to convert the
480- (or 347-) Vac) input voltage to
the lower voltage required by the
power supply driving the LED (often
277 or 120 Vac). One or more power
supplies can be used with one step-
down transformer to then drive the
LED output strings
often at voltages
below 60 Vdc.
Today, a valid al-
ternative is to choose
an integrated power
supply that can han-
dle the 480-Vac-to-
less-than-60-Vdc con-
version in one, single
product.
To understand the
choice, it is important
to comprehend the
key characteristics of
each component in-
volved in the driver
system. A typical 125-VA-rated light-
ing transformer can weigh 2.3
pounds and dissipate up to 7 W. A
reference 40-W power supply able to
handle input voltages of 120 or 277
Vac can weigh less than a half pound
and be 90% efficient. A new, inte-
grated 480 Vac input 40 W power
supply is still 90% efficient and
weighs only slightly more (0.80 lbs)
than the previous one.
When envisioning a modular de-
sign of the driver system, a designer
can choose to scale the driver system
BY IRENE SIGNORINO
Director of Business Development
Industrial and Automotive
Microsemi
www.microsemi.com
Fig. 1: The latest LED driver technology reduces weight while
delivering more power.
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 44
by using multiple power supplies.
Typically, no more than four power
supplies would be used as the com-
plexity added into the wiring system
would decrease the benefits of the
scalable design.
Figure 1 shows the difference in
weight between the driver system of
fixtures built using traditional solu-
tions and those built using next-gen-
eration integrated LED drivers that
eliminate bulky external step-down
transformers. As shown, a significant
(>50%) driver system weight reduc-
tion can be achieved, thus enabling
some transportation costs reductions
as well as more compact designs.
Because the external step-down
transformer is completely eliminated
and the power conversion is achieved
with a power supply at least as effi-
cient as the original power supply,
the new driver solution also provides
increased energy savings to the street
light operator (see Fig. 2). For exam-
ple, a typical installation of 10,000
40-W fixtures used by a municipality
that pays $0.1 kWh can achieve a
five-year period energy savings of
$400,000.
Finally, removing the external
component increases the reliability
of the LED driver by reducing the
points of potential failure.
Additional driver features
Todays LED drivers integrate many
features that are specifically opti-
mized for streetlights. These features
are as critical for a successful lighting
fixture design as the decision of us-
ing (or not using) an external step-
down transformer.
Dimming capabilities and inte-
grated protections (over current, over
voltage and/or thermal protections)
are fairly well understood and prop-
erly used.
Additional benefits can be real-
ized by leveraging the integrated
fault detection capabilities of the
next-generation LED drivers. Fault
detection and management capabili-
ties can be used to detect and com-
municate a faulty condition. The
managing entity is often required to
provide a certain amount of light in
places used by the public. If an acci-
dent happens due to lack of light, the
entity might be exposed to potential
liability claims. A system that pro-
vides a quick alert about a faulty
light is therefore
valuable.
Such a system
can be as simple as a
person noticing and
reporting the non
operating light or as
complex as a wired
or wireless data net-
work actively de-
tecting and report-
ing the faulty light
immediately and
around the clock. If
the light is part of a
network, a device
capable of detecting
and reporting the fault to the net-
work is necessary. The newer drivers
do in fact integrate such capability.
Figure 3 shows a wiring diagram for
incorporating fault management
functionality into an integrated LED
driver solution.
The same integrated capability
can also be used for basic trouble-
shooting, such as the light fixture
not turning on (if the fault alert is
on, but there is no light, then it is
likely the LED module is damaged
but not the driver).
One of the first examples of this
new generation of integrated LED
drivers is Microsemis LXMG221D-
0700040-D2F solution, which inte-
grates a high-voltage step-down
transformer into a single compact,
lightweight and high-performance
solution. The device operates on 347-
or 480-Vac systems for North Ameri-
can and Canadian installations, and
is designed for constant-current, sin-
gle 700-mA string applications using
approximately 12 to 17 LEDs (<57
Vac) without flickering.
The device features high active
power factor correction and low to-
tal harmonic distortion across the
entire input voltage range at full
load, and is dimmable to 10% by dif-
ferent dimming methods (0 to 10 V,
PWM or potentiometer) for addition-
al power savings. Multiple protection
features include overvoltage and
overcurrent protection and automat-
ic over-temperature shutdown. Built-
in fault management also enables
fixtures to sense and manage failed
(short and open) LED situations.
Municipalities face increasing
pressure to deliver improved street
lighting reliability while reducing
costs and simplifying fixture moni-
toring and maintenance. Achieving
these goals has been difficult with
traditional solutions that require
cumbersome transformers with
high power losses or with poorly
designed drivers.
Now, thanks to the availability
of integrated LED drivers that pro-
vide the power conversion without
needing a external bulky trans-
former, fixture designers can create
significantly smaller, lighter, and
more efficient solutions. These driv-
ers also deliver more benefits and
higher value to the end user via
highly reliable designs, dimming,
fault detection and management
capabilities, and built in robust
protections.
Fig. 2: Integrated LED driver solutions deliver increased energy
savings.
Fig. 3: Fault
management
circuitry for
integrated LED
driver solution.
SPECI AL
LIGHTING & OPTOELECTRONICS
Drivers enable next-gen LED street lighting
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 46
877.845.4395
www.americaii.com/ep
Quality, inventory, people.
America IIs distribution model allows us to create a completely unique experience
for our customers. We utilize an inventory-centric model in which we buy direct from
approximately 400 manufacturers and stock nearly 4 billion components. In addition, our
team of global commodity specialists sources components daily, while a team of inventory
solutions experts offers asset recovery through excess purchasing programs.
The evolution of distribution is here.
One distributor meeting all your needs.
America II is the evolution of distribution.
Inniium 90000 Q-Series
InniiVision 2000 & 3000 X-Series
Whether you need the fastest real-time oscilloscope on earth with the highest measurement
accuracy anywhere, or something a little more basic, Agilent oscilloscopes outperform in every
category. Thats why discerning engineers have made Agilent the fastest growing oscilloscope
company in the world since 1997. Like you, were working on whats next.
From extreme value
to extreme performance.
See the 90000 Q-Series
http://goo.gl/jhsiB
See the fastest real-time scope
www.agilent.com/find/Qseriesoscilloscopes
New Inniium 90000 Q-Series
The fastest real-time oscilloscope with 63 GHz bandwidth
u.s. 1-800-829-4444 canada 1-877-894-4414 Agilent Technologies, Inc. 2012
Inniium 90000 Q-Series
InniiVision 2000 & 3000 X-Series
Whether you need the fastest real-time oscilloscope on earth with the highest measurement
accuracy anywhere, or something a little more basic, Agilent oscilloscopes outperform in every
category. Thats why discerning engineers have made Agilent the fastest growing oscilloscope
company in the world since 1997. Like you, were working on whats next.
From extreme value
to extreme performance.
See the 90000 Q-Series
http://goo.gl/jhsiB
See the fastest real-time scope
www.agilent.com/find/Qseriesoscilloscopes
New Inniium 90000 Q-Series
The fastest real-time oscilloscope with 63 GHz bandwidth
u.s. 1-800-829-4444 canada 1-877-894-4414 Agilent Technologies, Inc. 2012
Put our
We deliver custom
power filters & film
capacitors with the
shortest lead times!
expertise to work for you!
Coaxial Filters
& Interconnects
Power Filters
& Film Modules
Specialty Connectors
& Harnessing
Advanced Ceramics
At the NEW Spectrum Control, weve expanded our product
capability to include a wider range of sophisticated components
and assemblies. Our engineering teams continue to provide
custom application-specific solutions exceeding our customers
mechanical, electrical and power requirements. The Spectrum
design process begins with our extensive library of standard
components, which we frequently develop into custom
assemblies offering you a more complete, high performance
solution... saving you time and money.
Download our NEW
Power Filter Catalog &
Full Line Catalog Today!
See how our expertise can work for you,
call 888.267.1195 or visit SpecEMC.com
Filtering power is a challenge in many applications,
but none more than renewable energy power converters.
Our power filter group is ready to meet your demands
for high performance in a ruggedized package for your
application...delivered in the industrys shortest leadtimes.
Were proven leaders in designing and building efficient,
high power EMI filters. And our new power film capacitors
utilize innovative film technology to provide reliable, high
current ripple filtering up to 10,000F. Give me a call or visit
us online for a fast and flexible filter solution to your solar
or wind power challenge.
Steve Parshall
Product Application
Engineer
Spectrum Control
innovative
problem-solving
new products
SPECI AL
LIGHTING & OPTOELECTRONICS
L
ow-power LED solutions typically
consist of a single string of LEDs or
a single input and output control
point for the LED driver. These drivers
must perform the basic functions of
any LED power supply, such as power
conditioning and conversion and load
control. High-power solutions can of-
ten leverage specialist stages for these
functions. Low-power solutions of less
than 35 W, such as a light bulb, must
perform all three functions in as few
stages as possible, because cost and
space are at a premium.
The challenge for a low-power LED
design is to achieve a balance of power
conditioning set by regulatory stan-
dards. Power conversion, also guided
by regulatory standards, must be safe
and efficient. Superior load control
must be incorporated. This includes
constant current regulation and dim-
ming fidelity, which is generally set by
market acceptance. The FL7730 and
FL7732 PFC controllers strike this bal-
ance quite well and perform all three
functions in one stage. With these so-
lutions there is significant interplay
among all three functions. To under-
stand the solutions we will start with
the highest order and focus primarily
on power conditioning and power
conversion. The interplay of load con-
trol does take part in power condition-
ing, but in order to meet power condi-
tioning standards and market
requirements, understanding how to
achieve power condition, such as EMI
requirements and power factor, is vi-
tal. The next step is to understand load
control, such as fault protection, con-
stant current control and dimming.
Flybacks are used for most low-pow-
er isolated LED supplies, but not all fly-
Balancing power
parameters in LED apps
The challenge for a low-power LED design is to keep
power conditioning, conversion, and load control in balance
backs are alike.
The operation
and regulation of
a flyback will af-
fect system per-
formance and
cost. The typical
flyback used for
low-power sup-
plies is not power
factor corrected
and tends to have
a high-voltage
electrolytic ca-
pacitor after the
BY ALEXANDER CRAIG
Principal Engineer
Fairchild Semiconductor
www.fairchildsemi.com
Fig. 1: PWM controller schematic with primary side regulation, allowing
isolated LED drivers to be created with fewer components.
Give us a call at 888.267.1195
or visit SpecEMC.com
EMI Filtered
Micro D-Sub
Connectors
Excellent EMI Filtering in a Smaller
Footprint Connector
Compact size and lightweight
Rugged construction, designed
and built to MIL-DTL-83513
Cap values up to 4700pF with
selective line filtering available
9-37 contact models with variety
of styles/terminations
Environmentally sealed contact
area when mated
MicroDSub_Ad512_SASP_1/3pgAd 4/3/12 4:15 PM Page 1
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 51
bridge rectifier.
These supplies are typically second-
ary side regulated (SSR), meaning they
have an optocoupler, a voltage refer-
ence and a fast loop band width of 1
kHz to react to load charges. This type
of flyback is not ideal for LED lighting
for two reasons: the flyback is not pow-
er factor corrected and is typically set
up as a constant voltage supply where
LEDs are better driven with content
current.
In single-stage flyback PFC, quality
power factor is achieved by using a
boundary, or critical, conduction mode
PFC control IC that uses a fixed on-
time variable switching frequency
scheme. This feature improves and
maintains the power factor but places
restrictions on the turns ratio n and
output voltage of the transformer where
n = V
RO
/V
O
+ V
F
. Equation 1 shows the
input current as a function on phase
angle. The denominator makes the cur-
rent shape non-sinusoidal, unless the
ratio V
IN
Peak
/V
R
is made very small
where V
R
is the reflected voltage.
Equation 1
With higher reflected voltages re-
quired to achieve an expectable power
factor, the stress on the MOSFET volt-
age can be increased where V
DS,max
=
V
IN,PK,max
+ V
R
+ V
spike
. These restrictions
tend to force the use of higher-voltage
MOSFETs: ~800 or 900 V.
This approach typically uses a SSR
constant current control scheme that
measures the load current and volt-
age directly. Power loss is incurred in
measuring the load current but good
constant-current control of a few
percent can be achieved but an opto-
coupler is also required. These sup-
plies operate with a slow feedback
loop of ~20 Hz, which works well for
LED loads because they are not dy-
namic. The energy storage performed
by the high-voltage electrolytic ca-
pacitor in the classic flyback is ac-
complished with lower-voltage (LED
string voltage) capacitors.
To work around cost limitations
with the single-stage flyback PFC,
some have tried a primary side regu-
lated (PSR) flyback with a passive
PFC. This approach reduces the pow-
er loss on the SSR and the voltage
stress on the MOSFET, however this
process uses HV capacitors and other
parts in the primary side which lim-
its power factor, lifetime, and size.
To achieve a cost effective balance
of power conditioning, power conver-
sion and load control for LED applica-
tions a new approach is employed
with the FL7730 and FL7732. These
PWM controllers uses a different type
of single-stage topology with primary
side regulation, allowing isolated LED
drivers to be created with
fewer components and
minimized cost without
requiring a high-voltage
input capacitor or SSR
feedback circuitry. Refer to
Fig. 1 for the simplified
overall schematic.
To achieve good power
factor and low THD, the
flyback is operated in
DCM at a fixed frequency
with constant on-time
over the half sine wave.
Therefore the input current is I
IN
=
I
P_avg
= T
ON
(V
IN
/L
m
)T
ON
/ 2T and is pro-
portional to V
IN
. With this approach
good power factor does not require a
high reflected voltage, thus allowing
the use of less expensive 600-V MOS-
FETs in place of costly 800- or 900-V
MOSFETs.
The center peace of the FL7730 and
FL7732 is the PSR Load control func-
tion block. This unique circuitry is
called the TRUE-
CURRENT control
and has been prov-
en in applications such as chargers.
By adding two key features to the
TRUECURRENT control the FL7732
and FL7730 can accurately regulate
output current versus changes in in-
put voltage, output voltage and mag-
netizing inductance variation. For
FL7730 designs, the device also al-
lows for a simple but effective dim-
ming.
The basic operation of the TRUE-
CURRENT control block is illustrated
in Fig. 2 and Eq 2.
Equation 2
Equation 2 describes how the out-
put current is determined by the diode
peak current and the discharge time
on the energy stored in the transform-
Fig. 2: The TRUECURRENT
PSR Load control function
block can regulate output
current versus changes in
input voltage, output
voltage, and magnetizing
inductance variation.
Fig. 3: Constant-current regulation showing measured results
from an evaluation board.
Table 1: Constant current regulation by line voltage change (11 ~ 28 V)
Input Voltage Min Current Max Current Tolerance
90 Vac /60 Hz 347 mA 357 mA 1.5%
110 Vac /60 Hz 345 mA 360 mA 2.1%
140 Vac /60 Hz 342 mA 352 mA 1.5%
180 Vac /50 Hz 342 mA 356 mA 2.0%
220 Vac /50 Hz 340 mA 351 mA 1.7%
265 Vac /50 Hz 336 mA 347 mA 1.7%
Table 2: Constant current regulation by output voltage change (90 ~ 265 Vac)
Output
Voltage
90 Vac 110 Vac 140 Vac 180Vac 220 Vac 265 Vac Tolerance
20 V 347 mA 357 mA 350 mA 353mA 346 mA 344 mA 1.9%
22 V 350 mA 355 mA 352 mA 350 mA 349mA 343 mA 1.7%
24 V 357 mA 354 mA 349 mA 347 mA 344mA 342 mA 2.1%
SPECI AL
LIGHTING & OPTOELECTRONICS
Balancing power parameters in LED apps
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 52
Balancing power parameters in LED apps
er. The output current (I
OUT
), the aver-
age of the diode current in steady state,
is estimated using the peak inductor
current as measured by the current
sense resistor at the source of the MOS-
FET and inductor current discharge
time (T
dis
) as measured by the V
S
pin
shown in Fig. 1. Since the output cur-
rent (I
OUT
) is the average of the diode
current in steady state. Proper selec-
tion of the current sense resistor (R
CS
)
allows the measurement of the peak
drain current value with a peak detec-
tion circuit. The I
OUT
is calculated us-
ing the inductor discharge time and
can be measured in the V
S
pin. When
the diode current goes to zero, the
voltage on the V
S
pin starts to rapidly
decrease as can be seen in Fig. 1. These
measurements and the knowledge of
the switching period (T
S
) are the pri-
mary factors on the TRUECURRENT
control block.
This output information is com-
pared with a precise internal refer-
ence to generate an error voltage
(VCOMI), which determines the
duty cycle of the MOSFET (Q
1
) for
constant-current-mode operation.
This innovative technique is how
the FL7732 and FL7730 precisely
control a constant-current output.
This can be seen in Fig. 3 and Table
1, which show measured results
from an evaluation board showing
constant-current deviation in the
wide output voltage range from 11
to 28 V of less than 2.1% at each
line-input voltage.
The first key feature added for
lighting is the Line Compensator
that receives information about the
line voltage from the V
S
pin and
uses it to modify the peak current
circuit. This innovative solution al-
lows for extremely tight tolerances
and constant-current regulation
over a wide input voltage range.
This can be seen in Fig. 3 and Table
2, which show measured results
from an evaluation board showing
constant-current deviation in the
wide line regulation at the rated
output voltage (24 V) is <2.1%.
A more detailed explanation of
the operation of high power factor
PSR flyback can be found at www.
fairchildsemi.com/an/AN/AN-9750.pdf.
The second key feature for lighting
is the dimming control function,
which will be explained in more de-
tail in a future article.
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 53
New approach
prevents thermal
runaway
Preventing thermal runaway resulting
from failed power FETs improves a
lighting systems safety and performance
BY PHILIPPE DIFULVIO
Application Engineering Manager
and FARAZ HASAN, Sr.
Global Strategic Business Manager
for Industrial, Appliance, Lighting
TE Circuit Protection
www.circuitprotection.com
M
ost industrial and consumer
electronics incorporate ther-
mal protection devices to
prevent damage caused by overheat-
ing and improve reliability and safety.
The heat generated by resistive and in-
ductive loads, power capacitors, and
current drivers to MOSFETs, switches,
and relays presents significant chal-
lenges to engineers charged with de-
signing in reliable, safe thermal man-
agement.
In recent years, a variety of innova-
tive technologies have emerged to
help designers of electrical and elec-
tronic applications implement ther-
mal protection. The objective is to pro-
tect the application and the end user
from catastrophic thermal events by
interrupting electrical current flow
when a component or board area is
heated to a specific rated temperature.
Conventional solutions
Traditional thermal protection devices
are available in a variety of shapes,
sizes, and technologies to help protect
equipment from damage caused by
thermal events. Two notable devices
are the thermal fuse/thermal cutoff
(TCO) and the thermal switch. Both
provide wide-ranging and specific
temperature activation characteristics
in both AC and DC applications and
can be specified as bolt-in, clip-on,
pig-tail, or lead-type configurations.
However, these devices can complicate
design-in and manufacturing process-
es. Careful handling procedures must
be adhered to in order to guarantee
that they perform as expected.
Thermal fuses typically contain a
component that is temperature sensi-
tive, such as a low-temperature alloy
or a plastic/wax pellet, which holds a
spring contact mechanism. The device
is normally closed and opens when ac-
tivated at a given maximum, or trip,
temperature. These devices are also
non-resettable and must be replaced
after they trip.
Thermal fuses require special han-
dling in the manufacturing process. If
they are to be soldered, or require wire
extensions to be soldered or welded to
the leads, a heat-sink must be attached
to the lead to conduct heat away from
the temperature-sensitive alloy so as
to not activate it or limit the effective-
ness of the device before it is to be used
in its intended application.
Another common thermal protec-
tion device is the thermal switch.
These devices are designed for multi-
ple uses and can be configured to be
normally-open or normally-closed.
When a specific trip temperature is
reached the thermal switch activates
and opens like a thermal fuse to stop
the current flow. Likewise, when de-
signed to close during a thermal event,
PwrBlade+
AC/DC power
distribution connector system
FCIs PwrBlade+
connector serves
applications requiring higher linear
current density and low power loss.
Capable of 192A/linear inch when
8 adjacent contacts are energized,
the high power contact is rated up
to 75A/contact. A low power contact
option is available for applications
with multiple voltages and lower
power requirements. The number
and placement of power and signal
contacts are highly confgurable.
www.fciconnect.com/pwrblade+
High Speed Differential Signaling
up to 20 Gb/s
AirMax VSe
right-angle connectors
feature mating-compatible interfaces
to AirMax VS
vertical backplane
connectors and provide an AirMax
3700
data sheet (.pdf)
SOFT-SHIELD
3700
High Temperature, Conductive
Fabric Over Foam EMI Gaskets
EP 3700.indd 1 4/5/2012 1:54:51 PM
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 66
Tech-Etch berylium-copper components
Heilind
Electronics
Autosplice RFI
shield clips
grounding clips, connector contacts,
ESD clips, and shielding gaskets.
Tech-Etchs in-house tool-and-die
department produces bending tools
capable of forming intricate sharp
bends in tempers from annealed to
full hard. Component parts are then
heat-treated in an inert atmosphere to
enhance spring properties. The treat-
ment results in greater deflection,
without compression set, while achiev-
ing close dimensional control. Finally,
parts can be finished in many ways,
with tin, silver, zinc, sulfamate nickel,
electroless nickel, palladium nickel,
and gold. Visit www.tech-etch.com/pho-
toetch for a Precision Engineered Parts
Capabilities Brochure and additional
information.
Heilind Electronics (www.heilind.
com) is now producing Autosplice RFI
shield clips to allow placement of EMI/
RFI shielding on pc boards without
hand soldering. The miniature sur-
face-mount clips are put on a board
using standard high-speed placement
equipment, eliminating extra holes
and preserving board space.
The clips have four independent
spring contacts that allow shield re-
moval and replacement for rework and
tuning. Originally designed for the
handheld device market, they can be
used in any application where space is
a premium.
To help engineers who are trouble
shooting diverse and many times
elusive EMI issues, Leader Tech has
published a free, six-page quick-refer-
ence guide that provides an overview
of company products and capabili-
ties. The company notes that it is ex-
tremely common today for products
to integrate specialized components
from several different manufacturers.
Unfortunately, this trend has also led
to many unanticipated radiated emis-
sions and compliance problems. In-
dependently these components per-
form as expected, but when they are
installed in close proximity on the
same circuit board, signal integrity
and interference problems become
apparent.
The new product reference guide
from Leader Tech features three one-
page sections that highlight shielding
solutions for virtually any board, en-
closure, or cable interference problem
so engineers can quickly find one or
more cost-effective solutions to their
problem, thus reducing time to mar-
ket, while lowering shielding expense
and dealing with a single source. The
Leader Techs Products and Capabili-
ties Overview brochure is available for
download from the companys Web
site, www.leadertechinc.com.
Richard Comerford
M a x i m u m
s e c u r i t y f o r
y o u r
e l e c t r o n i c s
New R6 enclosure
has highest
EMI/RFI
protection available
In the fields of intelligence and computer
security, TEMPEST requirement NSA 94-106
is among the most stringent. The new R6
electronics enclosure, developed by
Equipto Electronics engineers, far
exceeds this standard for EMI/RFI defense.
Tested by an independent laboratory, the
R6 included front and rear opening doors,
a fiber wave guide in the top and a
proprietary honeycomb filter in the
bottom, and more.
Because of the proprietary design of the
R6 enclosure, please contact Equipto
Electronics for more information.
800-204-7225 Ext. 9/ 630-859-7840
email: sales@equiptoelec.com
www.equiptoelec.com
ISO 9001:2008 RoHs Compliant
Made with pride in the USA
Aurora, IL
Independent laboratory test results available upon request.
Equipto ad EP 4.375X7.25:Layout 1 7/27/10 8:28 AM Page 1
Packaging & EMI/RFI Shielding
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 67
1/16th-brick converters suit
low-profile apps
The PKU-C series of isolated dc/dc power converters are provided in an indus-
try-standard sixteenth-brick form factor and deliver an output current up to
20 A with an output power equivalent to 100 W. The converters suit the need
for mid-range IT and communications power applications including decen-
tralized local data-storage equipment that requires
12- and 5-V to power disk drives.
The dc/dc converters operate from a 36 to 75-V
input range and suit applications powered by a cen-
tralized 48-V bus. The 12V PKU4104C and 5V
PKU4105C feature a floating output and can be
combined to power disk-drive-array application re-
quiring more than 100 W. They provide 92.7% efficiency at 50% load and
12-V output. The converters deliver full performance up to 80C with a 3.0-
m/s airflow, and full output power with natural convection up to 65C. ($24.50
ea/large qty available now.)
Ericsson Power Modules, Plano, TX
Keith Merrill 972-583-6910 pm.info@ericsson.com
www.ericsson.com/powermodules
Mini LED drivers offer
5 to 20-W output
The LDU series of PCB mount dc-input constant current
LED drivers feature four models with power outputs of 5,
7, 14 and 20 W. They have a typical efficiency of 93% for
the 5 to 14-W models and 95% for the 20-W devices. The
LDU20 series provides up to 700mA output current, and
the LDU05, 07 and 14 series have a maximum output of
1,000 mA. They suit indoor, outdoor, underwater, automotive LED lighting
application, and also for battery powered applications.
The LED drivers accommodate input voltages from 7 to 30 Vdc. Dimming
options include two analog methods (voltage or resistance) and a pulse width
modulation input signal. The PWM approach has a maximum operating fre-
quency of 1 kHz, with a minimum 200ns on/off time. The analog dimming
method can adjust the output current from 25% to 100% of nominal current.
(From $7.02 ea/500 available now.)
XP Power, Sunnyvale, CA
Duane Darrow 408-732-7777 ddarrow@xppower.com
www.xppower.com
C
M
Y
CM
MY
CY
CMY
K
EMCO_AD_March_EP_AD_PRINT.pdf 1 2/7/12 9:24 AM
Dc/dc converters suit railway apps
The CCR050 series dc/dc converter target railway ap-
plications and satisfy the majority of rolling-stock dc
power applications with a single unit. The converters
accept a very wide nominal input voltage range from
24 to 110 Vdc (16.8 to 137.5 Vdc full range) and pro-
vide up to 50W output. The nominal output voltage
is 24 Vdc with alternative output voltages available.
Efficiency levels are >85% at 72V input voltage.
The dc/dc converters comply with the EN50155
requirements for railway applications, including EN 50121-3-2, EN55011 and
EN 61373. The converters feature reverse input voltage protection, overvolt-
PRODUCT
UPDATE
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 68
Dc/dc converters
75W dc/dc converters
target avionics
The MGDS-75-S series of high-input-voltage dc/dc con-
verters targets avionics, aerospace, military, and missile
applications. The converters have an input voltage range
of 155 to 480 V, making them suitable for 270-V applica-
tions and meeting MIL-STD-704E/F requirements, or for
use with power-factor-corrected front-end converters.
The converter family consists of five single-output
models offering 3.3-, 5-, 12-, 15-, and 26-
V outputs, each capable of delivering up
to 75 W in the quarter-brick footprint of
57.9 x 36.8 x 12.7-mm. The units have
10% voltage trim capability. Efficiency
age protection, permanent short-circuit protection and
inrush current limitation. Operating temperature range
is 40 to 70C without derating. They are available in
open frame or housed in a metal enclosure. The open-
frame version measures 105 x 100 x 35.5 mm. (Contact
company for price and availability.)
Martek Power, Torrance, CA
Information 310-202-8820 sales.mpa@martekpower.com
www.martekpowerabbott.com
40-W 32nd brick targets
telecom
The CPZ 40-W 32nd brick series of
dc/dc converters is a pick-and-
place-capable surface-mount mod-
ule that uses solder ball pins which
allow it to conform to coplanarity
deviations. The converters target
space-constrained distributed power and intermediate
bus converter applications including networking and
telecommunications, data processing, railway, military,
medical, and aerospace equipment. The modules provide
40 W at 55C and 200-lfm airflow.
The converters are offered in three 2:1 input voltage
ranges of 9 to 18, 18 to 36 or 36 to 75 Vdc. Output volt-
levels are as high as 92%, and the standard operating tem-
perature range is 40 to 105C case temperature. Protec-
tion functions such as undervoltage lockout, overvoltage
protection, current limit, and overtemperature protec-
tion. (Contact company for price and availability.)
Gaia Converter, Saint Laurent Quebec, Canada
Francois Baudin 514-333-3169
www.gaia-converter.com
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 69
PRODUCT
UPDATE
www.micropowerdirect.com
MicroPower Direct
We Power Your Success - For Less!
MicroPower Direct
Call today for a surprisingly low
cost quotation. For datasheets
or samples, go to:
MicroPower Direct is your
source for thousands of high
performance power products. We
now offer products specically
designed to power and control
high speed IGBTs.
Products just
like these:
T: (781) 344-8226
E: sales@micropowerdirect.com
VISO = 3,750V
30kV/S CMR
Internal OptoCoupler
Short Circuit Protected
Compact SIP Package
Compatible With M57962AL
IG100 Series
30kV/S CMR
VISO = 3,750V
Single Supply Drive
Built-In OptoCoupler
Short Circuit Protected
Compatible With EXB841
IGD841
3,000V Isolation
Operates With IGD962
Dual Outputs
-40C to +85C Operation
Short Circuit Protected
Small SIP Package
IGD962
High SPEED
Mi P Di i
GO DIRECT
POWER!
A Controller With A Built-In
DC/DC Will Be Released Shortly!
MPD EP1205.indd 1 4/5/2012 3:25:23 PM
First dc/dc converter 1/32 brick
offers 30 W
The ULT series of isolated 30W dc/dc converters are the industry first in a
1/32-brick Distributed-power Open Standards Alliance (DOSA)compatible
open-frame package. Measuring 19.1 x 23.4 x 8.89 mm, they are available
with either a throughhole or a surfacemount
option.
The dc/dc converters offer a 2:1-input volt-
age range from 36 to 75 Vdc to meet the re-
quirements of 48V and 60V battery backup
systems. The product includes 12, 5, and
3.3Vout models. The 12-Vout model provides
30 W max, the 5- and 3.3-V models produce
25 W. Line regulation is 0.1% of Vout across
all Vin conditions at full load. An external
trim function allows the output voltage to be trimmed by +10% to 20%.
Input to output isolation is certified to 1,500 V according to safety standard
EN/UL60950. They target industrial, telecommunications, routing, optical
networking, wireless equipment, and microwave radio point-to-point com-
munications. (Contact company for price and availability.)
Murata Power Solutions, Mansfield, MA
Information 508-339-3000 usmedia@murata-ps.com
www.murata-ps.com
Supply offers dc input for
co-location centers
The DS460SDC-3 is a compact 460W bulk front-end power supply that
achieve a conversion efficiency of 90% at 50% full load. It is a dc-input power
supply targeting co-location systems that use distributed power architectures,
especially in computing, storage, networking and data-
com applications.
The front-end supply is pin- compatible with
the ac-input DS460S-3 bulk power supply, en-
abling users to switch easily from an ac to a dc
supply infrastructure. Housed in a plug-in, rack-
mount module with a 1U x 2U form factor, the dc-
input is 7.75in. long. It features and input from 40 to
72-Vdc and accommodates all standard 48-V battery back-
up schemes, and has a maximum inrush current of 50 A. It generates a main
payload output of 12.3 Vdc, capable of delivering up to 36 A continuously, and
also produces an auxiliary always on 12Vdc output. The supply has a turn-on
delay of <2 s, and the main output rises monotonically in <50 ms. ($190 ea/
large qty available now.)
Emerson Network Power Embedded Power, Carlsbad, CA
Information 760-930-4600
www.PowerConversion.com
ages of 3.3, 5, and 12 Vdc are standard. The product is 0.92 x 0.90 x 0.374-in.,
using 30% less area than a 16th-brick converter. The typical efficiency exceeds
90% for 5- and 12-V models. The converters provide 2,250-Vdc input-to-out-
put isolation. (Call 888-438-3232 for price and availability.)
Semiconductor Circuits, Atkinson, NH
Sales 888-GET-DCDC FAX 603-893-6280
www.dcdc.com
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 70
Main Output
Voltage
Output Power
Input
Voltage
Typical
Ef ciency
Convection
Cooling
Forced Air
Cooling Model
MVAB120-12 12V
75W 120W
90-264Vac /
120-300Vdc
88%
MVAB120-24 24V 90%
MVAB120-48 48V 91%
Look Ma! No Fans!
Up to 75W without fans? Thats cool!
Our MVAB120 series of high ef ciency, open frame
single output, 120 Watt power supplies deliver
up to 75W using convection cooling only.
Just 250 LFM forced airfow required
Compact design: 2 x 4 x 1.35
Industry standard footprint / 1U height
Look Ma! No Fans!
Cool & Ef cient
Power
For specifcations on this cool, no fans solution,
please visit: murata-ps.com/mvab120
Dc/dc converters offer
84% efficiency
The R1S/E, RB/E, and RO/E dc/dc converters offer 1-W
output with 84% efficiency and up to 70% efficiency at
1/2-brick converters
deliver 75 W
The DCHBW75 series of 75-W dc/dc
power converters are provided in an
industry standard half-brick 2.40 x
2.28 x 0.50-in. footprint. The series consists of 3.3-, 5-, 12-,
15-, 24-, 28-, and 48-Vdc single-output models that operate
over 4:1 input voltage ranges of 9 to 36 and 18 to 75 Vdc.
Standard features of the dc/dc converters include 90%,
efficiency soft start, adjustable output voltage, remote
sense, six-sided shielding, and positive remote on/off con-
trol. All models are RoHS compliant and have UL60950-1,
EN60950-1, and IEC60950-1 safety approvals. They have
no minimum load requirements and operate over an am-
bient temperature range from 40 to 76C (with derat-
ing). ($57.30 ea/large qty available now.)
Wall Industries, Exeter, NH
Russ Berube 603-778-2300 rberube@wallindustries.com
www.wallindustries.com
Step up LED drivers offer
4:1 input
Available in 2 x 1-in. packages, the AMLB-Z step up
dc/dc LED drivers offer a 4:1 input range from 9 to 36 Vdc
that steps down to an output voltage range from 14 to 48
Vdc. They produce constant output currents from 150 to
20% load. The converters operate from 40 to 100C
without derating.
The R1S/E series dc/dc converters feature an unpotted
SMD-design, the RO/E-series is of-
fered in an SIP4 package, and RB/
E-series in an SIP7 package. Appli-
cations include vapor phase sol-
dering processes. The unregulated
converters have 5V/200mA out-
put and input voltages of 3.3, 5, 12
or 24 Vdc. They feature a standard
isolation of 1 kVdc/1s and option-
ally 2 kVdc/1s. They comply with EN60950-1 and
UL60950-1. (Ea/small qty: R1S/E, $6; RB/E, $5; RO/E, $5
available now.)
Recom Power, Brooklyn, NY
information 718-855-9710
www.recom-power.com
Dc/dc converters
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 71
700 mA and have ripple and noise as low 350 mVp-p.
The modular drivers feature remote on/off function,
continuous short-circuit protection,
and adjustable PWM. They offer
analog dimming functions to en-
sure the consistent and constant
brightness of the LEDs they drive.
(From $13.73 each available
now.)
Aimtec, Montreal, Quebec, Canada
Information 888-9AIMTEC (924-6832)
www.aimtec.com
800-542-3355
www.calex.com
Designed, Made and Supported in the USA
5 Year Warranty
Reasonable NRE for Custom Designs
4 - 6 Week Production Lead Time
From Standard
to Custom
DC Converters
e-mail: sales @ calex.com
15-W dc/dc converter
suits military avionics
The 15-W DVAB dc/dc converter series delivers a dual out-
put converter with zero-cross
regulation due to two inde-
pendent control loops. It is
designed for use in rugged
commercial avionics, mili-
tary avionics, and other criti-
cal reliability power systems.
The input range extends
from 15 to 50 V with 80V transient for 1-s per MIL-STD-
Dc/dc converters are
DOSA compliant
The DOSA-2 product line is a family of non-isolated SMT
dc/dc converters that comply with the latest 2nd Genera-
tion DOSA standards for PoL converters. They are com-
prised of the iCF 3-A/16.5-
W, the iCG 6-A/33-W, the
iBF 12-A/66-W, and the iAF
20-A/110-W converters.
The converters suit harsh
telecom, broadcast mast-
mounted applications, in-
dustrial, test and measurement, and medical equipment.
The converters use an input voltage range of 4.5 to 14 V
and feature adjustable output voltages from 0.7 to 5.5 V
with conversion efficiencies up to 97%. Units can operate
704. The converter series offers 5, 12, or 15V output.
It has a nominal fixed-frequency of 325 kHz and uses a
fault-tolerant magnetic feedback design. The operating
temperature extends from 55 to 125C with no power
derating. (Contact company for price and availability.)
VPT, Blacksburg, VA
Information 425-353-3010
www.vpt-inc.com
PRODUCT
UPDATE
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 72
in ambient temperatures from 40C
up to 115C. The modules range in
size from 12.2 x 12.2 x 4.45 mm to
33 x 13.46 x 7.75 mm. (From $6.17
ea/reel qty available now.)
TDK-Lambda Americas
San Diego, CA
Sales 619-575-4400
www.us.tdk-lambda.com
UNIPOWER JUST GOT MORE POWERFUL
Solutions from 40W to over 300kW and 1.8V to 500kV
Broad range of Custom and Standard products
Contact us for design and application support 954-905-1071 or sales@unipowerco.com
unipowerco.com/power Powering Technology
High Voltage Military / C.O.T.S.
Medical
Datacom
Commercial / Industrial
Telecom / Network
Converter
modules feature
4:1 input voltage
The Traco Power TEP 150WI series
dc/dc converters feature a 4:1 input
voltage. They meet EMC demands
including conducted noise in accor-
dance to EN55022 class B, and burst
and surge immunity without exter-
nal components.
The dc/dc converter modules of-
fer 87% efficiency, with constant
current output charac-
teristics for battery
load applica-
tions. The 98
x 52 x 34-
mm metal
case features over temperature pro-
tection and an operating range from
40 to 75C. They provide reverse
input protection, undervoltage lock-
out, and 2,250-Vdc I/O isolation.
($215 ea/large qty available now.)
Power Sources Unlimited
Wrentham, MA
Sales 800-966-7784
sales@psui.com
www.psui.com
Dc/dc converters
suit IP65
applications
The PCMDS150WK-IP65 primary
switched dc/dc converters suit in-ve-
hicle, rail technology, industrial, and
telecommunication applications.
The 150-W converters provide an in-
put range for battery voltages of 24-,
36-, 48-, 60-, 72-, 80-, 96- and 110-V
according to EN 50 155. With the
help of a transformer and a second-
ary linear
choke, a gal-
v a n i c a l l y
isolated out-
put voltage
of 24 V is
p r o d u c e d
that is ad-
justed by pulse-width modulation.
The dc/dc converters measure 192
x 115 x 68 mm, have a thermo-selec-
tive vacuum encapsulation for uni-
form heat dissipation and resistance
to shock, vibration and moisture.
They suit applications requiring
protection per IP65. The converters
need no ground load and are short-
circuit protected by primary and
Dc/dc converters
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 73
Our Newest
Chassis Mount
AC/DC Power Supplies
www.ConTech-us.com
sales@ConTech-us.com
Toll Free 877-302-4411
Avai l abl e from
25- 150 Watts
secondary power limiting. (Contact company for price
and availability.)
MTM Power, Canton, MA
Sales 774-565-3800 info-inc@mtm-power.com
www.mtm-power.com
1-kW, dc/dc converter
uses convection cooling
The BAP 1K-U7712 series of dc/dc converters that gener-
ate up to 1kW output power with convection cooling.
Housed in a 7 x 7 x 12-in. chassis-mount enclosure,
these converters suit industrial applications including
factory automation systems, industrial control equip-
ment, production machinery
and mining equipment. They
comply with EN/UL 60950 and
equivalent industrial safety
standards. A railway grade ver-
sion that meets EN 50155 is also
available.
The 1kW dc/dc converters
contain two internal modules, each capable of generating
500 W (minimum). A dual-output version with two inde-
pendent, fully regulated outputs of 500-W each is also
possible. The units operate from inputs of 48, 72, 110, 125
Quarter brick IBC module
supplies 850 W
The IB050Q096T80N1-00 quarter-brick intermediate bus
converters (IBCs) modules provide up to 850 W of output
power. They suit demanding applications spanning en-
terprise, optical access, and storage networks.
The quarter-brick modules are available as a drop-in
upgrade for the industry stan-
dard 5:1 fixed ratio convert-
ers. They operate from a 36 to
60V input with 2,250Vdc
isolation from input to output, and
achieve 98% peak efficiency. The supplies are rated at up
to 80 A, 850 W from 55 to 60Vin and 550W from 36
or 250 Vdc (15%) and provide regulated outputs of 24,
48, 110, or 125 Vdc. Efficiency is 85% (minimum), protec-
tion features include 2,250Vdc input/output isolation,
overload, overvoltage, and short-circuit protection with
thermal shutdown and self-resetting. ($720 ea/100
available now.)
Absopulse Electronics, Carp, Ontario, Canada
Carole Lombard 613-836-3511
absopulse@absopulse.com
www.absopulse.com
PRODUCT
UPDATE
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 74
20-W dc/dc converters
feature wide input
The B2000RU series of wide-input 20-W dc/dc converters
are offered in 1 x 2-in. cases. The 14 standard models op-
erate from 4:1 inputs of 9 to 36 or 18 to 75 Vdc, providing
regulated single outputs of 3.3, 5, 12, 15, 5, 12, or 15
Vdc. Standard features include 1,600-
Vdc input/output isolation and short-
circuit protection. All models meet
EN 55022 and EN 61000-4. The MTBF
(per MIL HDBK 217F) is >560 khours.
The dc/dc converters are packaged
in 1.0 x 2.0-in. cases and specified for
operation from 40 to 66C (ambient). They suit process
control systems, telecommunications equipment, robotic
Vin. The 2.30 x 1.45 x 0.42in. quarter-brick modules
allow designers to conserve board space and achieve full-
load operation at 50C with 400-lfm airflow. The mod-
ules are pin-compatible with industry standard square
wave bus converters, and operate at 1 MHz. ($0.09/W in
OEM qty available now.)
Vicor, Andover, MA
Sales 800-735-6200 custserv@vicr.com
www.vicorpower.com
systems, and board-level power distribution subsystems.
(From $34.80 ea/100 available now.)
MicroPower Direct, Stoughton, MA
Sales 781-344-8226 sales@micropowerdirect.com
www.micropowerdirect.com
10 to 20-W dc/dc
converters offer 4:1 inputs
The VYB series of dc/dc converters feature a 4:1 input that
provide outputs ranging from 10 to 20 W. They are pack-
aged in an industry standard 2 x 1in. footprint. The con-
verters target battery-driven applications where charging
and discharging conditions require an ultra-wide input
range. The temperature range extends from 40 to +85C
The dc/dc converters are available in +3.3, +5, +12, or
+15 Vdc single output models and 5, 12, or 15 Vdc
dual output models. They accept input voltages from 9
to 36 Vdc or 18 to 75 Vdc. Outputs are fully regulated to
within 0.5% over all line input conditions and 1.0%
for all load conditions. The converters have an input to
output isolation of 1,500 Vdc across the range. ($19.74
ea/100 available now.)
CUI Inc, Tulatin, OR
Maggie Lefor 503-612-2391
mlefor@cui.com
Dc/dc converters
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 75
(718) 956-8900 (800) 221-5510
e-mail: kec@keyelco.com Website: keyelco.com
E L E C T R O N I C S C O R P.
SOLAR MIDGET FUSE HOLDERS
MULTI-PHASE
DC-DC
CONTROLLER
Piezoelectric Alarms
The industrys largest selection of piezoelectric whoops, warbles,
sirens, beeps and more. Available in variety of voltages and
output up to 103dB! Rugged panel mount products are IP68
and NEMA 4X when used with optional gasket. ISO 9001:2000
registered company all products made in the USA.
Floyd Bell Inc.
Tel: (614) 294-4000
Fax: (614) 291-0823
sales@oydbell.com
www.oydbell.com
Absopulse Electronics Ltd. ..................................... 80
Advanced Linear Devices, Inc. ............................... 32
Advanced Power Solutions .................................... 27
Agilent Technologies, Inc. ................ Cover 2, 48, 49
AKM Semiconductor, Inc. ...................................... 89
Allied Electronics Inc. ................................... Cover 3
America II Electronics, Inc. .................................... 47
AMETEK Programmable Power, Inc. ...................... 78
APM Hexseal .......................................................... 60
Arrow Electronics, Inc. ............................................. 7
Astrodyne Corp. ..................................................... 72
Avnet Electronic Marketing ............................. 33, 40
BlockMaster Electronics, Inc. .................................. 96
Buckeye Shapeform ................................................. 96
BUD Industries, Inc. ............................................... 84
Calex Manufacturing Company, Inc. ..................... 72
Central Semiconductor Corp. ................................ 31
Chomerics .............................................................. 66
CIT Relay & Switch ................................................ 90
Clare, Inc. ......................................................... 56, 64
Coilcraft, Inc. ......................................................... 10
ConTech ................................................................. 74
Digi-Key Corporation ............................................... 1
ELMA Electronics, Inc. .......................................... 38
EMCO High Voltage Corporation .......................... 68
Equipto Electronics Corp. ...................................... 67
E-T-A Circuit Breakers ............................................. 35
FCI Electronics ................................................. 54, 55
Floyd Bell Inc. ........................................................ 96
Fujipoly America Corp. .......................................... 58
GAIA Converter Inc. ............................................... 74
Garrett Electronics Corporation ............................ 60
General Cable ......................................................... 37
GlobTek, Inc. ........................................... Cover 1, 77
Hammond Manufacturing Company Inc. ............ 83
Harwin ................................................................... 65
Hittite Microwave Corporation ............................. 17
Integrated Power Designs, Inc. ............................... 25
International Rectier ............................................ 91
IXYS Corporation ................................................... 36
Keystone Electronics Corp. .................................... 76
KOA Speer Electronics, Inc. ................................... 53
Krohn-Hite Corporation .................................. 94, 96
Kyocera Display Corporation ................................. 59
Linear Technology Corporation ............................ 13
Master Bond Inc. .................................................... 86
Maxim Integrated Products, Inc. .................. Cover 4
Maxon Precision Motors, Inc. ................................ 28
Mean Well USA, Inc. ................................................ 4
Mega Electronics, Inc. ............................................ 75
Melexis ................................................................... 12
Memory Protection Devices ................................... 45
MicroMo Electronics, Inc. ...................................... 26
MicroPower Direct, LLC ......................................... 70
Minmax Technology Co., Ltd. . .............................. 80
Mouser Electronics ................................. 3, 19, 20, 21
MS Kennedy Corporation ...................................... 29
MTM Power ............................................................ 69
MuRata Power Solutions, Inc. ................................ 71
National Instruments ............................................. 15
Newark/element14 ................................................... 9
Online Components ..................................... Cover 1
Panasonic Industrial Co.-
OEM Batteries Group ........................................ 82
Panasonic Electric Works Corporation .................. 14
Pduke Technology .................................................. 77
Pelican Products, Inc. ............................................... 2
Pico Electronics, Inc. .............................................. 92
Precision Paper Tube Company ............................. 86
Precision, Inc. ......................................................... 41
Rigol Technologies ................................................. 95
RTG, Inc. ................................................................ 93
Spectrum Control Inc. ..................................... 50, 51
Tadiran ................................................................... 23
Taiyo Yuden (USA), Inc. ......................................... 61
Tensility International Corporation ...................... 85
The Bergquist Company ........................................ 43
Total Power International, Inc. .............................. 75
Traco Power ............................................................ 79
Unipower Corporation .......................................... 73
VARTA Microbattery Inc. ....................................... 57
XP Power ................................................................ 81
Yuan Dean Scientic Co., LTD. .............................. 61
Zilog Inc. ................................................................ 18
ADVERTISER INDEX
This index is provided as an additional service. The publisher does not assume any liability for errors or omissions.
PRODUCT MART
Electronic Products Presented BY THE Manufacturer
on Schneider Electric online purchases through
May 31, 2012 at alliedelec.com/SchneiderElectric AVE 10%
Compact and installs anywhere
Programmable Logic Controller
TWIDO
Tool-free installation
Touch Panel
HMI STU
Wireless installation and
maintenance-free
Wireless Pushbutton Switches
Harmony
XB5R
Quickly reduces system damage
Miniature Circuit Breakers
Multi-9
01
1.800.433.5700
Allied Electronics, Inc 2012. Allied Electronics and the Allied Electronics logo are trademarks of Allied Electronics, Inc. An Electrocomponents Company.
THINK ALLIED
SM
Schneider Electric offers industrial control solutions that leverage
ingenuity and intelligence for ease of use all available from
Allied Electronics.
Reduce wiring errors
Contactor and Overload Relay
TeSys
D IEC
Innovative Automation & Control Solutions
MAY12-Schneider Ad (EP).qxd:ELECTRONIC PRODUCTS 4/6/12 10:47 AM Page 1
Dont let your design be the weak link in your supply chain. Youve invested too much in product development to leave your
FPGA-based design unprotected. With Maxims 1-Wire secure memories, you can safeguard your FPGA IP from counterfeiters for
less than one dollar. They give you the full strength of the SHA-1 protocol and a robust authentication scheme using a single FPGA
pin. Its afordable protection for ideas you cant aford to lose.
Technology Benefits
1-Wire technology secures your FPGA or CPLD IP using a single FPGA pin with minimal overhead
SHA-1 challenge-and-response authentication ensures that the design only works in a licensed environment
Built-in die-level and side-channel countermeasures thwart even the most sophisticated device-level attacks
Plug-in modules and evaluation platforms are available to speed evaluation and development
2012 Maxim Integrated Products, Inc. All rights reserved. Innovation Delivered, Maxim, the Maxim logo, and 1-Wire are trademarks or registered trademarks of Maxim Integrated Products, Inc., in the United States and other jurisdictions throughout the world.
All other company names may be trade names or trademarks of their respective owners.
Learn more about the 1-Wire approach to securing FPGAs.
www.maxim-ic.com/FPGA-Security
Fix the Weak Link in Your Supply Chain
Secure FPGA IP from counterfeiting with crypto-strong authentication
www.em.avnet.com/maxim
DIRECT
www.maxim-ic.com/shop www.digikey.com/maxim www.mouser.com/maximic