Thermal shock resistance

Thermal shock resistance is a measure of how large a change in temperature a material can withstand without damage. Thermal shock resistance is very important to most high temperature designs. Measurements of thermal shock resistance are highly subjective because it is extremely process dependent. Thermal shock resistance is a complicated function of heat transfer, geometry and material properties. The temperature range and the shape of the part play a key role in the material's ability to withstand thermal shock. Tests must be carefully designed to mimic anticipated service conditions to accurately asses the thermal shock resistance of a material. Borosilicate glass (known commercially as Pyrex) is used for cooking and chemical glassware because of its strength at high temperatures, low coefficient of expansion, and good thermal shock resistance. Thermal shock is the name given to cracking as a result of rapid temperature change. Glass and ceramic objects are particularly vulnerable to this form of failure, due to their low toughness, low thermal conductivity, and high thermal expansion coefficients. However, they are used in many high temperature applications due to their high melting point. Thermal shock occurs when a thermal gradient causes different parts of an object to expand by different amounts. This differential expansion can be understood in terms of stress or of strain, equivalently. At some point, this stress overcomes the strength of the material, causing a crack to form. If nothing stops this crack from propagating through the material, it will cause the object's structure to fail. Thermal shock can be prevented by: 1. Reducing the thermal gradient seen by the object, by: changing its temperature more slowly increasing the material's thermal conductivity 2. Reducing the material's coefficient of thermal expansion 3. Increasing its strength 4. Decreasing its Young's modulus 5. Increasing its toughness, by crack tip blunting crack deflection

Creep resistance
Creep resistance can be defined as a material's ability to resist any kind of distortion when under a load over an extended period of time. Creep is slow, temperature aided, time dependent deformation. In materials science, creep is the tendency of a solid material to slowly move or deform permanently under the influence of stresses. It occurs as a result of long term exposure to high levels of stress that are below the yield strength of the material. Creep is more severe in materials that are subjected to heatfor long periods, and near melting point. Creep always increases with temperature. Creep is typically a factor in materials above one third of their absolute melting temperature or two thirds of their glass transition temperature. Creep resistance is an important material property in high temperature design, but it is difficult to quantify with a single value. Creep is plotted as strain vs. time. A typical creep curve shows three basic regimes. During stage I, the primary or transient stage, the curve begins at the initial strain, with a relatively high slope or strain rate which decreased throughout stage I until a steady state is reached. Stage II, the steady state stage, is generally the longest stage and represents most of the response. The strain rate again begins to increase in stage III and rupture at tRgenerally follows quickly. Tertiary creep can be caused by: 1. Reduction of of the cross-sectional area of the component due to cracking or necking. 2. Oxidation and other environmental effects which reduce the cross-sectional area. 3. Microstructural changes that weaken the material such as coarsening of percipitates

Questions

1. It is a measure of how large a change in temperature a material can withstand without damage. 2. What is known commercially as Pyrex? 3. 5 prevention of Thermal shock? 4. It is defined as a material's ability to resist any kind of distortion when under a load over an extended period of time. 5. 3 Causes of Tertiary creep.