2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 2 Course Outline A. Electronics Cooling Heat Transfer with special application to electronics cooling industry. However, application of principles/techniques to other industrial heat transfer problems are within the scope of this module.
1. Introduction 2. Conduction Cooling 3. Free and Forced Convection Cooling 4. Radiation Heat Transfer 5. Combined Modes of Heat Transfer
B. Transient Heat Conduction beyond lumped capacitance method 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 3 Course Outline - Continued C. 2D Steady Heat Conduction numerical method of solution
D. Boiling Heat Transfer (Drs PS Lee & SY Park) 1. Pool boiling. 2. Film boiling and condensation 3. Two phase flow and heat transfer (flow boiling)
E. Mass Transfer 1. Diffusive and convective mass transfer 2. Analogy between heat and mass transfer 3. Evaporative cooling 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 4 Module Learning Outcomes 1. Ability to analyze heat flows through various components in a thermal system involving one or more modes of heat transfer.
2. Ability to analyze transient and 2D steady heat transfer problems.
3. Ability to analyze heat transfer problems involving boiling and condensation.
4. Ability to understand the analogy between heat and mass transfer and solve mass transfer problems. Assessment: 2 quizes (15% each); final examination (70%) 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 5 1. D. S. Steinberg, Cooling Techniques for Electronic Equipment 2e, J. Wiley & Sons, 1991
2. F.P. Incropera, D.P. Dewitt, T.L. Bergman, A.S. Lavine, "Principles of Heat and Mass Transfer 7e, J Wiley & Sons, 2013.
3. Holman, J.P., Heat Transfer, McGraw-Hill, New York, 10e, 2010. References 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 6 With the relentless trend toward ever powerful chips in ever decreasing package sizes, intense heat fluxes and higher operating temperatures are becoming a concern.
Thermal Challenges in Electronics Systems Heat dissipation of Intel CPUs. W 80 W/cm 2 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 7 Newspaper Article on 2004 Intel Chip
2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 8 Humidity 19% Vibration 20% Dust 6% Temperature 55% Dust Vibration Humidity Temperature Major Causes of Electronics Failures Thermally induced failures account for more than 50% of all electric failures. The useful life of an electronic component is halved for every rise of 10C in its operating temperature. 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 9 Perspective on Microelectronic Heat Fluxes Unlike other systems the temperature of chips cannot be increase even while heat fluxes are increased. Heat flux, q =h T 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 10 Values of Heat Transfer Coefficient for Various Cooling Technologies FC = Fluorocarbon fluid s th hA R 1 = 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 11 Structure of IC Packages 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 12 Chip Carrier or Package Early design of IC package. Pin-Through-Hole (PTH) technology used. 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 13 Small Outline Integrated circuit (SOIC) using SMT Ceramic Dual in-line package (CerDIP) using PTH technology IC packages, chip carriers or modules hold semiconductor chips and supply the connections or leads between the chip and printed circuit boards. As number of leads increases, PTH technology is replaced by Surface Mount Technology (SMT) Conventional IC Packages 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 14 Leadless Chip Carrier Pin Grid Array (PGA) J-Leaded Plastic Quad Flat Package (PQFP) Plastic Dual-in-line Packages (PDIP) 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 15 Ceramic Quad Flat Pack Plane of heat dissipation at IC layer on surface of silicon chip 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 16 PCB Copper Pads Underfill Solder Joints Flip Chip Package Chip directly connected to PCB by solder ball joints. Area array packaging to accommodate more chip-to-board interconnections. Plane of heat dissipation at IC layer on surface of silicon chip 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 17 Flip Chip Package 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 18 Wirebonded Ball Grid Array (BGA) Plane of heat dissipation at IC layer on surface of silicon chip 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 19 Flip Chip Ball Grid Array (BGA) 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 20 Fully Populated and Depopulated BGA Fully-populated BGA where solder balls cover the entire substrate Depopulated BGA. Often the central patch of solder balls serve a thermal function rather than an electrical function. 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 21 Stacked Die Packages 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 22 Stacked Flip-Chip CSP CSP = Chip Scale Package 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 23 Package-on-Package (PoP) 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 24 Examples of Electronics Cooling Systems Electronic box cooled with exhaust fan 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 25 Water or Refrigerant Cooling Systems 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 26 Electronic Boxes in Missiles Plan view of electronic box with cover removed 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 27 Coolers for PC CPUs Fan-Cooled Heat Sink heat sink fan CPU 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 28 Heat Pipes 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 29 heat sink Coolers for PC CPUs Heat Pipes fan heat pipes CPU 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 30 heat exchanger Heat Pipe Coolers for Notebook Computers fan heat pipes Copper block for CPU 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 31 Coolers for PC CPUs Thermoelectric Coolers q p q p q sink = q p
P e q sink = q p + P e
Seebeck and Peltier effects.
A bigger heat sink will be necessary with thermoelectric cooling. 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 32 Thermoelectric CPU Cooler for AMD Athlon XP Coolers for PC CPUs Thermoelectric Coolers heat sink TE Cooler CPU 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 33 Liquid Cooling Source: Thermacore 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 34 Liquid Cooling Source: Electronics Cooling 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 35 Immersion Cooling Source: Electronics Cooling CRAY-2 liquid immersion cooling system Boiling may occur. 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 36 Review of Modes of Heat Transfer 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 37 Conduction Heat Transfer Thermal energy exchange from region of high temperature to region of low temperature by the vibration of atoms/ions/molecules and by the drift of electrons (metals)
Fouriers Law of Heat Conduction
Heat flux Temperature gradient
Heat flux, (1.1)
or heat rate, (1.2)
where k is the thermal conductivity of the material. x T k q x c c = ' ' x T kA q x c c = 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 38
W/m K
W/m K
Aluminum (pure)
216
Alloy 42
16
Alumina
25
Mylar
0.2
Bakelite
0.2
Nickel
92
Beryllia
230
Nylon
0.2
Copper
398
Platinum
69
Diamond
2300
Quartz
1.0
Epoxy (no fill)
0.2
Silicon (undoped)
144
Epoxy (high fill)
2.1
Silicone grease
0.2
Glass- epoxy
1.7
Silicone rubber
0.2
Gold
297
Silver
418
Kovar
16.4
Solder (37% Pb, 63% Sn)
53
Lead
34
Teflon
0.2
Magnesium (cast)
70
Thermal grease/paste
~1
Mica
0.5
Tin
63
Thermal Conductivity of Packaging Materials at 25C 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 39
W/m K
Water
0.60
Freon 113
0.073
FC-72
0.055
FC-75
0.057
FC-77
0.057
Mineral Oil
~0.15
Thermal Conductivity of Selected Liquids at 25C 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 40
Measured at (C)
W/m K
Air
0
0.024
100
0.030
Argon
0
0.017
63
0.019
Helium
7
0.144
56
0.159
Hydrogen
4
0.168
50
0.186
Thermal Conductivity of Selected Gases at 1 atm. 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 41 Convection Heat Transfer Convection thermal energy exchange between solid surface and fluid as a result of the motion of the fluid relative to the solid surface. Forced convection Motion of fluid artificially induced e.g. by fan, pump. Free (natural) convection Motion of fluid induced by buoyancy forces.
2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 42 Flow Regimes Flow can be
Laminar or Turbulent Smooth, orderly flow. Disorderly, mixing flow
Internal or External Flow in tubes, ducts. Flow over surfaces. 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 43 Heat flux, q = h (T w T f ) [W/m 2 ] (1.3)
Heat transfer rate, q = h A (T w T f ) [W] (1.4)
where h = convective heat transfer coefficient [W/m 2 K] T w = temperature of wall surface T f = bulk temperature of fluid Newtons Law of Cooling Heat flux Temperature difference 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 44 Radiation Heat Transfer No medium required for radiation heat transfer.
Stefan-Boltzmann Law of black body radiation
Emissive power, e b = oT 4 (1.5)
where T is absolute temperature [K] o is S-B constant = 5.67 x 10 -8 [W/m 2 .T -4 ]
A black surface is one which absorbs all thermal radiation incident on it. 2013 Prof Andrew Tay ME4225 Industrial Heat Transfer 45 Radiation exchange between surfaces Radiation heat transfer between two black surfaces
Q = oA 1 F 12 (T 1 4 - T 2 4 ) (1.6)
where A 1 is area of surface 1, and F 12 is a Shape or View Factor between the surfaces.
Radiation heat transfer is usually negligible when temperature differences are not large. However, they can be of the same order as natural convection heat transfer.