ME4225 2 Conduction 2014

2013 Prof Andrew Tay
ME4225 Industrial Heat Transfer

1
Heat flux Temperature gradient

Heat flux, (2.1)

or heat rate, (2.2)

For significant temperature ranges, k ~ constant.
2. Fouriers Law of Heat Conduction
In some situations e.g. heat conduction across a slab, radial
conduction across a cylindrical or spherical shell/layer, the
conduction can be regarded as one-dimensional and relatively
simple heat transfer calculations can be made.
x
T
kA q
x
c
c
=
x
T
k q
x
c
c
=
' '
2
Conduction in Slab or Insulated Bar

1-D Steady Heat Conduction in plane slab or insulated bar of
length L, cross-sectional area, A :

(2.3)
( )
1 2
T T
T
Q kA
L
L
kA
A
= =
| |
|
\ .
Thermal resistance
Q
R
T
1
T
2
Analogy with electrical resistance.
T
1

T
2

A
q
T
2

T
1

q
L
L
q
q
3
Multilayer Composite Wall
Assumptions:
1. Uniform T across vertical interfaces.
2. No heat transfer between C-D and
D-E interfaces.
q
4
1 2 3
L
1

4
q
1

q
2

q
3

W
5
L
2
L
3
L
4

Thermal Resistance Network
Assume steady-state, only conduction heat transfer, no heat loss
through sides of printed circuit board (PCB).
q
5

T
1

T
5

T
2
T
3
T
4

q
1

q
2

q
3

q
4

R
4
R
3
R
2
R
1

Above thermal resistance
network can be constructed to
model the heat conduction from
chips to edges of PCB.
5
Analysis of Thermal Resistance Network
1 2 3
L
1

4
q
1
q
2

q
3

5
L
2
L
3
L
4

q
5

T
1

T
5

T
2
T
3
T
4

q
1

q
2

q
3

q
4

R
4
R
3
R
2
R
1

Considering energy balance at each
node:
0
0
0
0
0
5
4
5 3
4
1
4 1
3
4
3 5
3
3 2
2
3
2 3
2
2 1
1
2
1 2
1
1 4
=
= +
= +
= +
q
R
T T
q
R
T T
q
R
T T
R
T T
q
R
T T
R
T T
q
R
T T
R
T T
Applying boundary conditions:
e.g. T
4
= 35C, T
5
= 38C
Unknown T
1
, T
2
, T
3
, can be calculated.
6
Typical Multilayer Construction of PCB
Copper
Dielectric Material
(e.g. FR-4, G10,
polyimide)
Material W/m.K
Copper layer 386
Dielectric layer:
G10 0.30
FR-4 0.35
Polyimide 0.52
Thermal conductivity of
basic PCB materials
7
The two equivalent thermal conductivities of a printed circuit board
(PCB) are the planar (lateral) thermal conductivity k
xy
and the normal
thermal conductivity k
z
(in the z direction).

Planar Thermal Conductivity k
xy
The laminated lavers are considered as parallel paths in calculation
of the equivalent thermal conductivity.
For a parallel network, the total resistance is
1 2 3
1 1 1 1
...
xy
R R R R
= + + +
Equivalent thermal conductivity of PCB
(2.5)
where R
i
= thermal resistance for the i
th
layer, i = 1, 2, 3, ...
8
L
i
= length of i
th
layer
A
i
= cross-sectional area of i
th
layer (normal to heat flow)
=
k
i
= thermal conductivity of i
th
, layer
c
i
= fraction of total coverage for i
th
layer
(e.g. if the cutout for a given layer (usually copper) is
80%, c
i
= 0.2 )

i
i
i i i
L
R
k Ac
=
Planar thermal conductivity of PCB
(2.6)
where
L
i
W
i
=W

t
i
W
i
t
i
t
PCB
q
9
where the subscripts in and Cu represent the dielectric insulation
material and the copper, respectively. A is the total cross-sectional
area over the thickness of a PCB; i.e.

xy
i i i i i i
i i
in Cu
k A
c k A c k A
L L L
| | | |
= +
| |
\ . \ .

Planar thermal conductivity of PCB
Eqn (2.5) can be rewritten as:
(2.7)
(2.8)
Since L
i
= L and c
i,in
= 1 :
A=W

t
PCB
Cu
i i i
in
i i
xy
A
A k c
A
A k
k

|
.
|
\
|
+
|
.
|
\
|
=
10
For heat conduction normal to
each layer, it may be assumed that
the resistances of the layers are in
series:
PCB
z
. .
i i
z i i i i i i
in Cu
t t t
i e
k A c k A c k A
| | | |
= +
| |
\ . \ .

Normal thermal conductivity of PCB
L
i
W
i
=W

t
i
t
PCB
q
1 2 3
...
z
R R R R = + + +
(2.10)
(2.12)
(2.11)
( ) ( )
PCB
z
i i i i i i
in Cu
t
k
t c k t c k
=
+

Since A
i
= A
z
,
11
Simple Thermal Model of IC Package
Paths of heat transfer from component
R
jc

R
ca

q
d

T
a

T
j

T
c

Case temperature T
c
assumed
constant.
Heat transfer from junction to
case characterized by one
resistance, R
jc
, and that
from case to ambient by R
ca

.
12
For IC chips, manufacturers usually provide
values for R
ja
and R
jc
, the junction-to-ambient
and junction-to-case thermal resistances,
respectively:

q
d
=(T
c
- T
a
)/ R
ca
(2.20)

q
d
=(T
j
- T
c
)/ R
jc
(2.21)

q
d
=(T
j
- T
a
)/ R
ja
(2.22)

where q
d
= heat dissipation in chip. Usually
T
j
< 125 C.
R
jc

R
ca

q
d

T
a

T
j

T
c

13

R
ja
= R
jc
+ R
ca
(2.23)

Internal Resistance
(depends on
constitution of chip
package)
External Resistance
(depends on method
of cooling)
R
ca
is usually based on natural convection (worst case).

14
Under 135
o
C Under 115
o
C
(
o
C/W)
a
Package
- 1.180 32-38 PLCC 84
- 0.960 41-47 PLCC 68
- 1.070 38-42 PLCC 52
- 0.850 44-53 PLCC 44
0.890 0.620 59-73 PLCC 28
0.810 0.560 70-80 PLCC 20
0.930 0.640 70 SO 28
0.810 0.560 70-80 SO 24
0.720 0.500 80-90 SO 20
- 0.450 90-110 SOL 16
- 0.375 110-120 SO 16
- 0.340 110-130 SO 14
Power (W) for junction
temperature
a
These typical thermal resistance
values are based on copper lead
frames with components mounted on
sockets. Actual thermal resistance will
vary with die size, component
mounting and molding compound.
Maximum power rating for
surface mount packages for
junction temperatures of
115
o
C and 135
o
C and an
ambient temperature of 70
o
C
(M. Kastner, and P. Melville,
Ed. Signetics SMD Thermal
Considerations. Signetics
Publication 98-9800-010,
1986.)
Typical Thermal Resistance of IC Packages
15
Improved Thermal Model of IC Package
Limitations of R
jc
:
- assumes uniform case temperature
- assumes all surfaces uniformly cooled
- dependent on actual boundary conditions
due to existence of multiple heat flow paths

Improved model:

16
For thin, small outline and flip chip packages, R
side
~
and heat conduction can be assumed to occur only through
the top and bottom surfaces.
d
side top bot
side
top bot
bot
side top
top
side bot
j
side
side j
bot
bot j
top
top j
d
q
R
R R R
T
R
R R
T
R
R R
T
R
R R
T
R
T T
R
T T
R
T T
q
+ + + =
=
side top side bot bot top
R R R R R R R + + where
(2.24)
(2.25)
(2.26)
Improved Thermal Model of IC Package
17
Mounting Components
on Printed Circuit Boards
18
Using metal plates to enhance conduction cooling

copper strips over
PCB and under
components
aluminum plate bonded to
a thin PCB
clearance holes in
aluminium plate with
PCB on back side
(Source: D.S. Steinberg, 1991)
19
Conduction Strip
PCB with chip packages
If packages are closely placed on strip, a uniform distributed heat
load may be assumed.

20
Analysis of Conduction Strip
Assuming all heat transferred by conduction and no losses:
1
0, 0 : 0
dT
x c
dx
= = =
From energy balance,
Integrating,
From Fouriers heat conduction eqn,
From symmetry, at
(2.28)
(2.29)
(2.30)
(2.27)
x=L
0
T
o
T
e
x
dx
x
dx
q'dx
q
x+dx
q
x
q
dx
dq
dx
q q
dx q q q
x x dx x
dx
x dx x
'
= =
'
=
+
+
0
lim .
.
1
c x q q
x
+
'
=
.
1
c x q
dx
dT
kA q
x
+
'
= =
q'
21
Let T=T
e
at x=L :
2
2
2
1
c x q kAT + ' =
kA
L q
T T
e o
2
2
'
=
x=L
0
T
o
T
e
(2.31)
Integrating (2.29),
Analysis of Conduction Strip
x
dx
q'dx
q
x+dx
q
x
The maximum temperature is T
o
at x=0:
e
kAT L q c ' =
2
2
2
1
( )
2 2
2
1
x L q
kA
T T
e
' + =
(2.32)
q'
22
A row of 6 IC packages each dissipating 100 mW are mounted onto a
conduction strips on a PCB of thickness 0.071 mm (2 oz Cu per sq ft).
The heat must be conducted to the edges of the PCB, where it flows
into a heat sink. Determine the temperature difference between the
centre and edge of the copper strip to see if the design will be
satisfactory.
Example Problem
q' = 0.6/0.152 = 3.947 W/m
152 mm
5
0.071 mm
q'
Assuming that the heat is spread uniformly over the length of the strip:
23

k = 287 W/mK, (copper alloy)
A = 0.005 x 0.000071 = 3.55 10
-7
m
2

From Eqn (2.32) ,

Example Problem
With 4 ounce copper (thickness 0.14mm), AT = 56C,
giving a cooler package temperature.
Rule of thumb: Design is satisfactory if package surface
temperature 100C.
7
2 2
10 55 . 3 287 2
076 . 0 947 . 3
2

=
'
= = A
kA
L q
T T T
e o
24
q Unless surfaces are very well
bonded together, a thermal
interface resistance will exist.
Interface Resistance,
(2.35)
(2.33)
where h
i
is the unit (area) interface or contact conductance.
Interface Conductance,
(2.34)
Thermal Resistance of Interfaces
q
T
R
i
A
=
i i
i
A h
R T
q
= =
A
1
T A h q
i i
A =
25
Interface thermal resistance depends on :
a. Effective contact area (contact pressure)
b. Interface medium
c. Surface roughness of contact surfaces
d. Flatness of surfaces
e. Hardness of materials in contact
Heat flow across interface
26
Table 3.5 Interface Conductance for Various Materials with
an Interface Pressure of 10 psi (71 kPa)

6780 4520 1200 800 80 70 Bronze AMS 4846
11300 7330 2000 1300 60 60
7620 2260 1350 400 85 70
9040 4520 1600 800 90 15
10175 1800 17 16 5051 Aluminium
12435 2200 3 1 SAE 4141 steel
Oil
a
Dry Oil
a
Dry
Rms
(in)
b

Surface 2
Rms
(in)
b

Surface
1 Material
W /m
2
K Btu /(hr ft
2

o
F)
Interface Conductance
a
k
oil
= 0.073 Btu/hr ft F = 0.126 W/m K.
b
1 in = 0.025m
27
Fig. 4 Interface conductance for various interface
pressures at sea level.
28
Interface Conductance at High Altitudes
At high altitudes air is depleted and h
i
drops drastically (see Fig. below).
To improve heat transfer, thermal greases or epoxy glue should be
employed. The use of some intervening material may also help.
Fig. 5 Interface
conductance with
contact pressure
of 2 psi as a function
of altitude.
29
Effect of altitude on thermal interface resistance
30
PCB Edge Guides
31
PCB
Guide
Turning screw of wedge
clamp causes wedges to
exert firm pressure
against PCB resulting in
secure installation and
low thermal resistance.
PCB Edge Guides
Fig. 7 Board edge guides with typical unit thermal resistance. (a) G guide, 0.3 K.m/W;
(b) B guide, 0.2 K.m/W; (c) U guide, 0.15 K.m/W; (d) wedge clamp, 0.05 K.m/W.
32
Thermal Resistance of PCB Edge Guides
T
g
T
e
A
c
q

( )
where contact conductance
contact area
c c e g
c
c
Q h A T T
h
A total
=
=
=
( )
1 1
(2 )
e g g
g
c c c g g
T T R
R
Q h A h wL L
'
= = = =
L
g
w
where = unit thermal resistance of edge guide.
g
R
'
q
q
(2.36)
33
TEMPERATURE RISE ACROSS A PCB EDGE GUIDE

Determine the temperature rise across a G-guide if it is 125
mm long and the total power dissipation of the PCB is 10 W,
uniformly distributed. What would be this temperature rise
when the equipment is operated at an altitude of 100,000 feet?

Example Problem

34
Since there are two edge guides, half of the total power will be
conducted through each guide. The temperature rise at sea level
conditions can be determined from

Given: = 0.3 K.m/W (unit thermal resistance)
q = 10/2 = 5 watts (on half of the PCB), L = 0.125 m.

At an altitude of 100,000 ft, the resistance across the edge guide will
increase about 30%. The temperature rise at this altitude will then be

AT = 1.30 x 12K = 15.6 K
0.3 5
12 K
0.125
T

A = =
Example Problem

g
R
'
L
R q
qR T
g
'
= = A
35
Example Problem

Cross section through a chasis with chip packages on PCBs.
q
p
= 200 mW
36
Example Problem

Each IC package of 9 mm x 9 mm and dissipating
q
p
= 200 mW is attached onto a 0.20 mm thick PCB lamina (k= 1.5
W/mK) with an air gap of 0.14 mm. The edge guide has a unit
thermal resistance of 0.305 K.m/W. The interface conductance
between the base of the box and the cold plate is 1130 W/m
2
K at
sea level.

Assume conduction heat transfer only. Maximum allowable IC
case temperature is 100 C. Is above design satisfactory for
operation at sea level?
37
Solution to Example Problem

The hottest IC package is located at the centre of the top row of
packages. This maximum temperature can be determined by
calculating the temperature drops along individual segments of
the heat flow path from the hottest component to the liquid cooled
cold plate heat sink, namely
AT
1
= AT from IC case to centre of aluminium plate.
AT
2
= AT from centre of aluminium plate to the edge of the plate.
AT
3
= AT across board edge guide to chassis side wall.
AT
4
= AT down chassis side wall to the base of the chassis.
AT
5
= AT across the bolted interface to the cold plate.
38
AT
1
: 0.2 mm thick PCB lamina plus air gap of 0.14 mm.

2 2
0.0002 0.00014
1.5 0.009 0.03 0.009
1.7 57.6 59.3 /
a al
a al
L L L
R
k A k A k A
K W
= + + = +

= + =
q
p
= 0.2 W
AT
1
= 0.2 x 59.3 = 11.9C
AT
1
from IC case to centre of aluminium plate
-
-
39
AT
2
: Assuming uniform heat distribution over the PCB, eqn (2.32)
can be used with L = 0.075 m,
AT
2
from centre of aluminum plate to edge of plate.
= 10.4C
q' = 40 x 0.2/0.15 =53.33 W/m.
001 . 0 102 . 0 6 . 143 2
075 . 0 33 . 53
2
2 2
2

=
'
= A
kA
L q
T
40
AT
3
: Unit thermal resistance of edge guide at sea level is

= 0.305 K.m/W

thermal resistance, R
3
= 0.305/0.102
= 3 K/W

AT
3
= 4 x 3 = 12C
AT
3
across board edge guide to chassis side wall.
g
R
'
41
AT
4
:
AT
4
down the chassis side wall to the base of chassis
A
Side view
42
Along AB, heat input is uniform at 4/0.102 W/m and edge at A is
insulated as heat loss is negligible here. Hence AB represents half a
standard conduction strip and eqn. (2.32) can be used with q = 4/0.102
= 39.22 W/m, L = 0.102 m

AT
4
= 24.7+12.1+2.3 = 39.1 C
C .
. . .
.
kA
qL
T
C .
. . .
.
kA
qL
T
C .
. . .
. .
kA
qL
T
CD
BC
AB
=

= = A
=

= = A
=

= = A
3 2
006 0 025 0 6 143
0125 0 4
1 12
0023 0 025 0 6 143
025 0 4
7 24
0023 0 025 0 6 143 2
102 0 22 39
2
2 2
AT
4
down the chassis side wall to the base of chassis
43
AT
5
: Since the average interface conductance at sea level is
1130 W/m
2
K,

Hence total AT = 11.9+10.4+12+39.1+5.7
= 79.1 C

C .
. . hA
q
T
o
s
7 5
025 0 025 0 1130
4
=

= = A
AT
5
across the bolted interface to the cold plate.
44
Maximum component surface temp. = 27+79.1
= 106.1 C

Hence design is not satisfactory.

IC case temperature can be reduced by various measures such
as increasing the thickness of the supporting bracket, cementing
IC to PCB, etc.

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2013 Prof Andrew Tay

ME4225 Industrial Heat Transfer

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