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CST Co., Ltd.

248 Namdong-daero, Namdong-gu, Incheon-si, Korea
(53BL-4L, Nonhyeon-dong)
TEL. +82-32-821-4220
FAX. +82-32-821-4225

http://www.cstflex.com

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CIRCUIT SOLUTION TECHNOLOGY

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To the World, For the future

with Technology

CIRCUIT SOLUTION TECHNOLOGY

WE WILL DO OUR BEST

Achieving No.1

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CONTENTS

Value
06

Message from CEO

08

Global network

10

About us

11

Performance of management

12

R&D Research and development

Technology
16

Products

18

Production process

20

Technical specication

22

Equipment

26

Vision of enterprise

28

Activities

30

Certicates

Achieving No.1 CST

06 07
Message from
CEO

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Committed to becoming
Global Leader
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Achieving No.1 CST

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Achieving No.1 CST

08 09
Global
network

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Arctic Ocean

Operations Center

Europe

Asia

North America

Middle East

Atlantic Ocean

Pacific Ocean

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Africa

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South America

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Oceania

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Southem Ocean

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Global business network

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Products

Achieving No.1 CST

10 11
About us

Performance
of
management

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History
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2013

11

2011

09

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2010

09

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2007

10

,112%,=FHUWLILHG

07

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12

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10

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07

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03

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10

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04

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2006

2005

2004

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Sales Results
( Unit : 1, 000$ )

90,000

100,000

73,000
62,000

70,000

2003
2002

05
03

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Sales Goals

300,000

300,000

10,000
7,000

500,000

400,000

22,000

30,000

1,000,000
500,000

34,000

50,000

( Unit : 1, 000$ )

200,000

6,000

150,000

200,000

100,000

5,000

50,000

3,000

30,000

1,000

10,000

2003

2006

2008

2010

2012

2013

2014

2015

2017

2020

Achieving No.1 CST

12 13
R&D
Research and
development

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CIRCUIT SOLUTION TECHNOLOGY

Passion for Technology

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FRQWLQXRXVUHVHDUFKHVDQGHIIRUWV

Technical Road MAP

PROCESS

ITEMS

2012

2013

2014

2015

INNER LAYER

LINE / SPACE

40 / 40

35 / 35

30 / 30

25 / 25

OUTER LAYER

LINE / SPACE

50 / 50

45 / 45

40 / 40

35 / 35

LASER DRILL

BVH DIAMETER
PTH LAND
ANNULAR RING

50
250
100

50
230
90

50
210
80

45
185
70

MECHANICAL
DRILL

BVH DIAMETER
PTH LAND
ANNULAR RING

120
320
100

100
300
100

75
255
90

75
235
80

MULTILAYER

MAX LAYER
REGISTRATION

8 LAYERS
100

10 LAYERS
90

12 LAYERS
80

14 LAYERS
75

FINISH
PLATING

ENIG (Ni/Au)
ELECTRO SOFT/HARD (Ni/Au)
IMMERSION Tin
ELECTRO TIN
ENEPIG (Ni/Pd/Au)

3 ~ 5 / 0.03 ~ 0.07 (Ni : 1 ~ A3 Comfortable)

3 ~ 8 / 0.05 ~ 0.5
0.4 ~ 0.8
5 ~ 15
3 ~ 5 / Min. 0.03 / Min. 0.05

Technical Road MAP (ITEM)

ITEMS

2013
3 Layer Type
Line / Space = 50 / 50
0.1 NC Drill

2014

2015

TSP

Initiating mass production of the product

with more than 10 layers of MLB
6 Layer R-FPCB for satellite

MULTI
LAYER BOARD

Non Plating Type : 35 / 35

Plating : 45 / 45

6 Layer Type
Line / Space = 40 / 40

Control of atness corresponding to

8M pixels (30)
ENIG + electrolytic composite plating
ENEPIG


Camera Module

4 Layer Type
Line / Space = 45 / 45

Control of atness corresponding

to 13M pixels (20)
- 7409 (High-Tg) material applied
ENEPIG + ENIG composite plating
Initiating mass production of the product
with more than 12 layers of MLB
8 Layer R-FPCB for Medical
Non Plating Type : 30 / 30
Plating : 40 / 40

Control of atness corresponding

to high pixels of more than 13M (15)
ENEPIG + ENIG composite plating


Initiating mass production of the product

with more than 14 layers of MLB
10 Layer R-FPCB for Medical


Non Plating Type : 25 / 25

Plating : 35 / 35

Min. Pattern Width

(Line / Space)

IMPEDANCE
Impedance control

ANTENNA/NFC

Etc.

Differential : 100 8%,

Single : 50 15% control
Improvement of transmitting velocity at high
speed broadband (40GHz) through the
examination of the raw material with low Dk


Differential : 100 10%,

Single : 50 20% control

Mass production of 3oz FCCL-based NFC

Making mass production of PET or PEN

material-based ANT
Manufacturing thin plate ANT

Applying INK Type Via Fill

Differential : 100 5%,

Single : 50 10% control
Stabilization of high speed broadband with
the raw material of low Dk


Applying plated Type Via Fill

Manufacturing super thin plate ANT

Applying Selective Plating of copper plating

Achieving No.1 CST

14 15

R&D Research and development

CIRCUIT SOLUTION TECHNOLOGY

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Single

Specications

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ITEMS

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Base Materials

Polyimide or Polyester

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Cover-lay

Polyimide, Solder Mask

Thickness

50 ~ 125

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Coverlay
Surface treatment
Base Copper

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Base PI

Reinforcing plate

SPEC.

Line Width/Space

Normal Min. 0.040 / 0.040mm

Conductor

1/4oz, 1/3oz, 1/2oz

Finish Plating

ENIG, Direct Gold,Soft Gold, Hard Gold,

OSP, Immersion Tin

Stiffener

PI, Epoxy

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Double
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RIFDPHUDPRGXOH

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2012.12 'HYHORSPHQWDQGPDVVSURGXFWLRQ

Specications

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ITEMS

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Min. Line/Space(out)

Normal : 50 / 50 , Special 40 / 40

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V0DLQ%RDUG/&'

Min. Hole Size

Mechanical : 0.15, Special : 0.10

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Stiffener

Polyimide, Epoxy, SUS

Finish Plating

ENEPIG, Complex Surface Treatment,

High ductility ENEPIG, Soft Gold
Hard Gold, Immersion TIN

Stiffener

PI, Epoxy

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Coverlay

Surface treatment
Base Copper

Base PI
Reinforcing plate

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2012.01 ,QWURGXFWLRQRILPSHGDQFHPHDVXULQJ

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2014.01 'HYHORSPHQWRIPXOWLOD\HUDQWHQQD
IRUPRELOHSKRQH

SPEC.

Multi (General)
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763)LQH3DWWHUQ

Specications

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IXQFWLRQKLJKGHQVLW\HWF,WVXVDJHVVXFKDV0DLQ%RDUGIRUPRELOHDSSOLDQFHV

ITEMS

ERDUGIRU7RXFK6FUHHQDQGVRIRUWKDUHEHLQJJUDGXDOO\LQFUHDVHG

Layer

Over 3 Layer

Min. Line/Space (out)

Normal : 60 / 60, Special 50 / 50

Min. Hole Size

Mechanical : 0.15, Special : 0.10

Laser : 0.12, Special 0.08

Stiffener

Polyimide, Epoxy, SUS

Surface Finish

ENEPIG, Complex Surface Treatment, High

ductility ENEPIG, Soft Gold
Hard Gold

Through Hole

2013.12 'HYHORSPHQWRIIODWQHVVDQG

2013.02 'HYHORSPHQWDQGSURJUHVVLQJPDVV

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SURGXFWLRQRIDQWHQQDIRUQRWHERRN

Coverlay
Base PI
Laser Via
Bonding

Bonding

Base PI

Base PI

Surface treatment
Base Copper

Impedance Control

SPEC.

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Multi (RFPCB)
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Impedance circuit (6EA)

Solid Type GND

Solid Type GND

73.52

Impedance circuit (6EA)

Hatched Type GND

Hatched GND
101.78

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ITEMS

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Layer

Normaly 4 Layer

JHQHUDOO\XVHG

Flatness

Under 8M : 30, Over 8M : 20

Min. Hole Size

Mechanical : 0.15, Special : 0.10

Laser : 0.12, Special 0.08

Impedance

Differential : 100 10%

Single : 50 20%

PSR

Color : Blue, Black, Green

Gloss : Matt, Glossy

Stiffener

Polyimide, Epoxy, SUS

Surface Finish

ENEPIG, Complex Surface Treatment,

High ductility ENEPIG, Soft Gold, Hard Gold

Wire Bonding
Prepreg
Laser Via
Base PI

- When the circuit width is 50, the impedance value will be 73.52
- In order to control the impedance value of 100,
circuit width shall be controlled as 35This cannot be controlled

- Impedance value is controlled as 100 by maintaining existing

circuit width as 50 through the hatching design of GND.
- Validity of hatching designIncreased exibility

Specications

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Coverlay
Base PI
Coverlay

Surface treatment
Base Copper

SPEC.

Achieving No.1 CST

16 17

Products
CIRCUIT SOLUTION TECHNOLOGY

S/S Type

MLB Type
Features

Features

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DPRQJWKH)3&%FKDUDFWHULVWLFVRU3,&.XS0RGXOHRI2''SURGXFW

VL]H

Applications

Applications

Mobile Phone

Digital Camera

CD-ROM

Mobile Phone

Print

Print

Hard Disk

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'ULYLQJVHFWLRQRI&'5:3LFNXS
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6LPSOHFRQQHFWLRQFLUFXLWEHWZHHQXQLWVRIYDULRXVHOHFWURQLFSURGXFWV

D/S Type

R/F Type
Features

Features

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RI3,ILOPDQGLQWKHFDVHRIWKLVVWUXFWXUHSDUWGHQVLW\FDQEHUDLVHG

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Applications

Mobile Phone

Applications

LCD

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)RUPLQJWKHFLUFXLWZLWKKLJKHUGHQVLW\WKDQ66
$FWXDOPRXQWLQJRISDUWWR)3&

Mobile Phone

Digital Camera

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&'5:3LFNXS$VV
\
%XLOWLQW\SH&DPHUD&&'$VV
\

CD-ROM

Achieving No.1 CST

18 19

Production process
CIRCUIT SOLUTION TECHNOLOGY

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20 21

Technical specication
CIRCUIT SOLUTION TECHNOLOGY

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22 23

Equipment
CIRCUIT SOLUTION TECHNOLOGY

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DRILL

DES
ITEMS

SPEC.

ITEMS

SPEC.

Name of process

Drill

Name of process

DES

Name of
equipment

Drill

Name of
equipment

DES

Specication

6axes / 250,000rpm / 0.05

Specication

Sheet type

Combined use
for Sheet and
Roll to Roll

Scrubbing
M/C

Soft Etching

Quantity

12
Quantity

Purpose

Through Hole processing and copper plating with the purpose

of conducting between layers of product with both sides and
multi-layer structure

Purpose

Forming the circuit with Development Etching Stripping

CU PLATING

Pre-treatment device

AOI
ITEMS

SPEC.

ITEMS

SPEC.

Name of process

CU Plating

Name of process

AOI

Name of
equipment

Copper

Name of
equipment

AOI

VRS

Specication

Thickness 2

Specication

Line / Space : 30 / 30

Line / Space : 30 / 30

Quantity

Quantity

10

12

Purpose

Plating for the sake of electrical conduction of

Through Hole's inner wall

Purpose

Automatic detection of formed circuit's short/open

D/F (;326('/,*+7

HOT PRESS
ITEMS

SPEC.

ITEMS

SPEC.

Name of process

D/F exposed light

Name of process

Hot press

Name of
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laminator

Name of
equipment

Hot press

Specication

Automatic
lami

Manual Vacuum
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Manual Automatic
parallel parallel

LDI

Specication

Opening of thermal medium

Vacuum of thermal medium

Quantity

Quantity

14

Purpose

Forming the circuit pattern with adhesion of light sensitive

lm and UV investigation

Purpose

Adhesion of Coverlay and lamination of MLB

Exposing machine

Achieving No.1 CST

24 25

Equipment
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BBT

Name of
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Punching machine

Name of
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BBT

Specication

Precision : 0.02 / Hole : 0.27sec

Specication

Quantity

10

Purpose

Machining of guide hole

PATTERN PLATING

50M of insulation resistance /

20M of continuous resistance

Quantity

10

Purpose

Detecting short/open with BBT Fixture Power press

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SPEC.

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Name of process

Pattern Plating

Name of process

Press

Name of
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Gold plating

Name of
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Power press

Specication

ENEPIG correspondence

Specication

60 ton

Quantity

Quantity

22

Purpose

Plating on Land surface

Purpose

PRINT

Processing the external shape of member and product

with metal mold

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Achieving No.1 CST

26 27
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28 29
Activities

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personnel, and customers

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Organization


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Achieving No.1 CST

30
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