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ECEN474: (Analog) VLSI Circuit Design Fall 2012: Lecture 1: Introduction
ECEN474: (Analog) VLSI Circuit Design Fall 2012: Lecture 1: Introduction
Lecture 1: Introduction
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Naturally occurring signals are analog Analog circuits are required to amplify and condition the signal for further processing Performance of analog circuits often determine whether the chip works or not Examples
Sensors and actuators (imagers, MEMS) RF transceivers Microprocessor circuits (PLL, high-speed I/O, thermal sensor)
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Integrated Circuits
[Bohr ISSCC 2009]
Scaling transistor dimensions allows for improved performance, reduced power, and reduced cost/transistor Assuming you can afford to build the fab
32nm CMOS fab ~3-4 BILLION dollars
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Course Topics
CMOS technology
Active and passive devices Layout techniques
Course Goals
Learn analog CMOS design approaches
Specification Circuit Topology Circuit Simulation Layout Fabrication
Administrative
Instructor:
Sam Palermo 315E WERC Bldg., 845-4114, spalermo@ece.tamu.edu Office hours: MW 3:00pm-4:30pm
Class Material
Textbook: Design of Analog CMOS Integrated Circuits, B. Razavi, McGraw-Hill, 2001. (Optional) References
Analog Integrated Circuit Design, D. Johns and K. Martin, John Wiley & Sons, 1997. Analysis and Design of Analog Integrated Circuits, P. Gray, R. Meyer, P. Hurst, and S. Lewis, John Wiley & Sons, 4th Edition, 2003. Technical Papers
Class notes
Posted on the web and will hand out hard copies in class
Grading
Exams (60%)
Three midterm exams (20% each)
Homework (10%)
Collaboration is allowed, but independent simulations and write-ups Need to setup CADENCE simulation environment No late homework will be graded
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Preliminary Schedule
Reading
Razavi Chapter 2 & 16
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Open to all TAMU Grad Students Teams of 2 will compete in a circuit design contest Designs are judged by a distinguished industrial committee
Broadcom, NXP, Qualcomm, Silicon Labs, TSMC, TI, Stone Soup Labs
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CMOS Technology
[Razavi]
NMOS
PMOS
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NMOS Transistor
Source Metal 1 CVD Oxide Drain Poly Gate n+ Gate Oxide p substrate Bulk
Gate
[Silva]
NMOS Symbols
n+
Cross Section
Source Bulk
Drain
Circuit Symbol
n+
Poly
n+
Top View
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PMOS Transistor
Drain Metal 1 CVD Oxide Source Poly Gate p+ Gate Oxide n-well Bulk p substrate Bulk
Gate
[Silva]
PMOS Symbols
p+
Cross Section
Drain Bulk
Source
Circuit Symbol
n-well
n+
Poly
n+
Top View
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Todays transistors have advanced device structures Most advanced transistors are moving from poly-gates back to metal-gates
Allows for High-K gate dielectric and reduced gate leakage current
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Interconnect (Wires)
Diodes
[Silva] Anode Cathode Typical values: P+=1017-1019 acceptors /cm3 P=1015-1017 acceptors /cm3 A SiO2 P+ Diode N N+ Contact C N=1016-1018 donors/cm3 N+=1017-1019 donors/cm3 Metal 5x1022 electrons/cm3
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Resistors
Poly Resistor Nwell Resistor [Razavi]
Different resistor types have varying levels of accuracy and temperature and voltage sensitivities
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Capacitors
Poly - Diffusion Poly - Poly Metal1 - Poly
[Wang]
[Ho]
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Inductors
[Silva/Park]
Inductors are generally too big for widespread use in analog IC design
Can fit thousands of transistors in a typical inductor area (100m x 100m)
Useful to extend amplifier bandwidth at zero power cost (but significant area cost)
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Useful in a precise voltage reference circuit commonly implemented in ICs (Bandgap Reference)
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Potential for parasitic BJTs (Vertical PNP and Lateral NPN) to form a positive feedback loop circuit If circuit is triggered, due to current injected into substrate, then a large current can be drawn through the circuit and cause damage Important to minimize substrate and well resistance with many contacts/guard rings
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Next Time
MOS Transistor Modeling
DC I-V Equations Small-Signal Model
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