Featured Products

Gennum’s 3G-SDI
Solutions

Gennum’s award winning portfolio

of professional and broadcast
solutions includes Equalizers,
Reclockers, Cable Drivers, Serializers/
Deserializers, Timing and Clock
Cleaners, Video Optical modules and
PCI Express solutions.

In This Issue:

Audio/Video
Gennum

Development Tools
Xilinx

Controllers
Linear Technology

Co-Processor
Silicon Motion

Datacom
Micrel

Power & Battery Management

Allegro Microsystems
Exar

November 2009
 Gennum’s 3G-SDI Solutions
The most comprehensive, end-to-end portfolio of
Audio / Video

broadcast video solutions with a commitment towards

unmatched performance and signal integrity.
ENABLING THE NEXT GENERATION OF BROADCAST VIDEO EQUIPMENT
Gennum’s award winning portfolio of professional and broadcast solutions includes Equalizers, Reclockers, Cable Drivers,
Serializers/Deserializers, Timing and Clock Cleaners, Video Optical modules and PCI Express solutions.

WHAT IS DRIVING THE 3G-SDI ADOPTION

 Improved jitter attenuation and improved jitter margins mean that there is more tolerance for cascaded SDI signals.
 Longer cable distances using coaxial cables means less need to install fiber optics to go the longer distances.
 Better performance even at lower data rates, 3G can deliver longer cable lengths and reduced bit error rates.
 Improved system reliability with 3G covering both SD/HD data rates then there is a far simplified plant design with less mix of
components.

2
For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal
 P ow er (DC-DC Converters)
3G-SDI Equalizers - GS2984 and GS2964 Key Features 3G-SDI Equalizer Benefits

 SMPTE 424M, SMPTE 292M, SMPTE 344M and SMPTE 259M compliant  Industry’s lowest output jitter adaptive cable driver and all
 Supports date rates from 143Mbps to 2.97Gbps and DVB-ASI at 270Mbps guaranteed over production testing
 Manual bypass for low data rates with slow rise/fall times  Extended temperature range of -40 to +85 deg.C
 50 ohm differential outputs support DC coupling to 3.3V and 2.5V CML  Lowest power consumption at SD/HD/3G data rates
logic
 Longest cable reach at 3G data rates of 140m @ 0.3UI
 DC coupling to 2.5V on GS2984 only max output jitter
 0 to 6dB gain boost pin on GS2984 only
 0-6dB gain boost pin is unique to the GS2984 and helps
 Single 3.3V supply
to compensate for 6dB flat attenuation
 Temperature range -40 to +85 deg.C
 Both in 16 pin QFN package (4x4mm)  DC coupling to Gennum 3.3V cable drivers & reclockers or
to industry standard 3.3V & 2.5V CML logic
 GS2984 power consumption is typically 195mW
 GS2964 power consumption is typically 215mW  Drop in replacements for the current GS2974A, GS2974B
 GS2984 typical equalized length of Belden 1694A cable: and GS1574A derivatives
 140m at 3G data rates with 0.3UI max output jitter
 200m at HD data rates with 0.3UI max output jitter
 400m at SD data rates
 GS2964 typical equalized length of Belden 1694A cable:
 100m at 3G data rates with 0.35UI max output jitter
 130m at HD data rates with 0.25UI max output jitter
 170m at SD data rates
 Both GS2984 and GS2964 are footprint compatible with GS2974A,
GS2974B and GS1574A

3G-SDI Reclocker’s - GS2985, GS2986 and GS2965 Key Features 3G-SDI Reclocker Benefits
 SMPTE 424M, 292M, 344M and 259M compliant  Far lower output jitter in all SD/HD/3G data rates when compared
 Supports data rates of 270Mbps, 1483.5Mbps, 1485Mbps, 2967Mbps, to other industry offerings.
2970Mbps & DVB-ASI at 270Mbps  Very low power consumption
 Auto and Manual Modes for data rate selection  Support for a 27MHz crystal reference.
 SD/HD indication O/P to control GS2978 cable driver (or the new
 4-wire SPI interface for configuration and monitoring of multiple
GS2988 cable driver soon to be released)
GS29xx’s being daisy chained together.
 4:1 input multiplexer on GS2985 and GS2986
 Extended temperature range of -40 to +85 deg.C.
 2:1 input multiplexer on GS2965
 Dual reclocked data outputs or one data output and one recovered clock output  Output de-emphasis to compensate for pcb trace dielectric
 Loss of Signal (LOS) & Lock Detect outputs losses.
 On-chip Input and Output termination  Up to 40 inches of FR4 trace loss is supported on the inputs and
 Mute, Bypass and Auto bypass functions 20 inches on the outputs.
 Selectable 400mVpp or 800mVpp output swings
 27MHz crystal with cascadable buffer to support multiple reclockers
from single crystal
 4 wire SPI interface for device configuration and monitoring
 Input equalization and output de-emphasis settings to compensate
for board trace dielectric losses
 Supply voltages of 3.3V or 2.5V
 Power consumption typically 180mW at 3G data rates and at 2.5V
for all three variations
 Temperature range -40 to +85 deg.C
 64 pin QFN package (9x9mm) for GS2985
 40 pin QFN package (6x6mm) for GS2986
 32 pin QFN package (5x5mm) for GS2965

3G-SDI Multi-Slew Rate Cable Drivers - GS2988 and GS2989 Key Features 3G-SDI Cable Driver Benefits

 SMPTE 424M, SMPTE 292M, SMPTE 344M and SMPTE 259M compliant  Lowest output jitter and power consumption compared to other
 Capable of driving data rates up to 2.97Gbps industry offerings
 GS2988 offers dual 75 ohm coaxial cable driving outputs with selectable  Input trace equalization supports up to 10 inches of FR4 trace
slew rate to meet SMPTE compliance standards loss
 GS2989 offers four coaxial cable driving outputs  Output signal presence indicates whether an active signal is
 Maximum output swing voltage of 1800mV present at the outputs of the GS298x
 Input trace equalization and output signal presence  A disable pin powers down the output drivers leaving them in a
 No external biasing resistors required at the inputs high impedance output state - saves more power
 Supply voltages of 2.5V or 3.3V  Extended temperature range of -40 to +85 deg.C
 Both in 16 pin QFN package (4x4mm)
 Wide voltage output swing of 1.8Vpp
 Temperature range -40 to +85 deg.C
 Based on recommended board layout, Output Return Loss (ORL) is -20dB
at HD data rates & -12dB at 3G data rates
 GS2988 is a slot in replacement for GS1578A, GS9077 and GS2978
 GS2988 typical power consumption is 125mW at 2.5V supply and at 3G
data rates with all outputs enabled
 GS2989 typical power consumption is 220mW at 2.5V supply and at 3G
data rates with all outputs enabled

3
 LTC2656-12 - Octal 16-/12-Bit Rail-to-
Rail DACs with 10ppm/C Max Reference
C onverters

16-Bit Octal SPI DAC Achieves ±4LSB INL (Max)

The LTC2656 is a family of octal 16-/12-bit rail-to-rail DACs with a precision integrated reference.
The DACs have built-in high performance, rail-to-rail, output buffers and are guaranteed
monotonic.The LTC2656-L has a full-scale output of 2.5V with the integrated 10ppm/°C
reference and operates from a single 2.7V to 5.5V supply. The LTC2656-H has a full-scale
output of 4.096V with the integrated reference and operates from a 4.5V to 5.5V supply. Each
DAC can also operate with an external reference, which sets the DAC full-scale output to two
times the external reference voltage.

These DACs communicate via a SPI/MICROWIRE™ compatible 4-wire serial interface which
operates at clock rates up to 50MHz. The LTC2656 incorporates a power-on reset circuit that
is controlled by the PORSEL pin. If PORSEL is tied to GND the DACs reset to zero-scale. If
PORSEL is tied to VCC, the DACs reset to mid-scale.

Features
 Precision 10ppm/°C Max Reference
 Maximum INL Error: ±4LSB at 16 Bits
 Guaranteed Monotonic over Temperature
 Selectable Internal or External Reference
 2.7V to 5.5V Supply Range (LTC2656-L)
 Integrated Reference Buffers
 Ultralow Crosstalk Between DACs(<1nV•s)
 Power-On-Reset to Zero-Scale/Mid-scale
 Asynchronous LDAC Update Pin
 Tiny 20-Lead 4mm × 5mm QFN and 20-Lead
Thermally Enhanced TSSOP Packages

Applications
 Mobile Communications
 Process Control and Industrial Automation
 Instrumentation
 Automatic Test Equipment
 Automotive

4
For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal
LynxExp & VoyagerGX 2D

C o-P rocessor
Graphics Co-processor
Enable low power, high quality
and sophisticated applications
The LynxExp and VoyagerGX graphics co-processors are designed with low power,Block
SM502 high Diagram
performance and reliability in mind to enable
the rich multimedia features for the vertical and consumer applications. They are ideal graphics co-processor in applications where the
resolution needs to be higher than 640x480.

The 128-bit 2D drawing engine includes a front-end color space conversation with 4:1 and 1:8 scaling support. The video engine
supports two different video outputs at 8-bit, 16-bit or 32-bit per pixel and a 3-color hardware cursor per video
VCR/DVE Player NTSC/PAL Camera
output. The LCD panel
TV Tuner/
MP2/4 decoder
video pipe supports a back-end YUV color space conversion with 4:1 and 1:2 scaling. A Zoom Video port is also included to interface to
external circuitry for MPEG decode or TV input. The complete software debug and SDK tools simplify the driver developmentUSBofHostutilizing 1.1 UART
Dual 8-bit
the 7 graphics display layers and multiple display function for high quality and sophisticate applications.
Single 16-bit uC & I/O
AC97, I2S, PWM
SSP, GPIO
Video Port
Input
The LynxExp supports the standard PCIe Gen.1 bus interface in a 17mmx17mm BGA package while the VoyagerGX supports the 32-
bit local bus and PCI bus interfaces in a 19mmx19mm BGA package. The CPU flexible bus interfaces
Platform
32-bit Host Bus / PCI
32-bit CPU allows
Host Bus
2D supporting a wide range of
Graphics/ Video
embedded CPUs, which includes x86, Xscale, ARM7/9/11, MIPS-license CPUs, Renesas SH, and PowerPC.
or
PCI 33/66 Engine Display
R.G.B

Engine

Internal Memory Panel Interface

Features Benefits Memory Controller

SM502  Lowest cost 2D GPU solution

External Memory Interface
2x16 / 1x32
 32-bit local bus / PCI bus 2D GPU for embedded or x86 CPU  Lowest power GPU, no heat sink or fan required
 Internal 8MB SDRAM or external 32-bit high bandwidth SDRAM memory configuration  Rich display featureSDRAM
for sophisticate applications
 Up to 1280x1024 (4:3) or 1440x960 (16:9) resolution  Complete and easy to use SDK for customize
 I/O peripherals: USB host, AC97/I2S, I2C, SSP, PWM, 2x8-bit/1x16-bit Zoom Video, driver development
and GPIO.
 Committed to product longevity
 7 display layers: primary graphics, video overlay, video alpha, graphics alpha, primary
hardware cursor, secondary graphics and secondary hardware cursor  Available in industrial temperature grade
 Complete software set for Linux, CE, Windows, etc.

SM750 Applications
 PCIe x1 bus 2D GPU for embedded or x86 CPU  High resolution handhelds
 Internal 16MB DDRI or external 64-bit high bandwidth DDRI memory configuration
 Point-of-Sales terminals
 Up to 1920x1440 (4:3) or 1920x1080 (16:9) resolution
 I/O peripherals: 2x8-bit/1x16-bit Zoom Video, I2C PWM, SSP and GPIO.  Medical device
 2 internal 300Mhz DAC  Multi-functional printer
 2 18-bit TFT interfaces  Casino gaming
 7 display layers: primary graphics, video overlay, video alpha, graphics alpha, primary  IPC
hardware cursor, secondary graphics and secondary hardware cursor SM750  Server
Block Diagram
 Complete software set for Linux, CE, Windows, etc.  Thin Client
SM502 Block Diagram

VCR/DVE Player
Serial
ROM
VCR/DVE Player NTSC/PAL Camera TV Tuner/ NTSC/PAL Camera TV Tuner/
MP2/4 decoder Optional
MP2/4 decoder

USB Host 1.1 UART Dual 8-bit R.G.B.-1

Dual 8-bit AC97, I2S, PWM VGA Single 16-bit
Single 16-bit uC & I/O SSP, GPIO Code Video Port
Video Port Input
Input R.G.B.-2

CPU 32-bit CPU PCI-E 2D Display TMDS

32-bit Host Bus / PCI Host Bus
2D CPU Graphics/ Video Transmitter
Platform Graphics/ Video Platform PICe X 1 Controller Engine
or R.G.B Engine
PCI 33/66 Engine Display
Optional
Option

Engine TTL 18bit x2

Internal Memory Panel Interface Internal Memory
Memory Controller Memory Controller
LVDS
Transmitter
Optional
O ti
External Memory Interface 4x16/2x32 Memory I/F
2x16 / 1x32 Optional

SDRAM DDR
SM502 Block Diagram SM750 Block Diagram

5
 KSZ8873: 3-port Ethernet Switch
A new generation of low port count, cost-
D atacom

sensitive and power-efficient 10/100Mbps

switch on a chip ICs
The KSZ8873MLL, KSZ8873RLL, KSZ8873FLL, and KSZ8873MML are highly integrated
3-port switch on a chip ICs in one of the smallest footprints. They are designed to enable
a new generation of low port count, cost-sensitive and power-efficient 10/100Mbps switch
systems. Low power consumption, advanced power management and sophisticated QoS
features (e.g., IPv6 priority classification support) make these devices ideal for IPTV, IP-STB,
VoIP, automotive and industrial applications.

The KSZ8873 family is designed to support the GREEN requirement in today’s switch systems.
Advanced power management schemes include hardware and software power down, as well
as the energy detect mode that shuts downs the transceiver when a port is idle.

KSZ8873MLL, KSZ8873RLL, and KSZ8873FLL also offer the by-pass mode, which enables
system-level power savings. In this mode, the processor connected to the switch through the
MII interface can be shut down without impacting the normal switch operation.

Features Benefits
 Single 2.5V or 3.3V supply with internal 1.8V LDO, and optional  Enables low power design
3.3V, 2.5V or 1.8V VDDIO  Ethernet traffic between Port 1 and Port 2 are sustained
 Port 1 & Port 2 by-pass mode while the MII interface (Port 3) is shut down. This allows
the device connected to the MII interface to enter a
 4-queue (per port) traffic prioritization, based on port, 802.1p, power saving mode
802.1Q VLAN tags, or Differential Services (both Ipv4 and Ipv6
 Enables the implementation of advanced QoS policies
priority classification)
 Enables the implementation of Ethernet ring network for
 Source address filtering industrial control and automotive applications
 Internal generated RMII 50MHz clock (KSZ8873RLL)  Eliminates expensive external 50MHz oscillator for the
RMII mode
 LinkMD® TDR-based cable diagnostics
 Allows identification of common cabling problems,
including those not addressed by IEEE. Simplifies
network deployment and reduces network downtime

Applications
 VoIP Phone
 Set-top/Game Box
 Automotive
 Industrial Control
 IPTV POF
 SOHO Residential Gateway
 Broadband Gateway / Firewall / VPN
 Integrated DSL/Cable Modem
 Wireless LAN access point + gateway
 Standalone 10/100 switch

KSZ8873 Block Diagram

LinkMD is a registered trademark of Micrel, Inc.

6
 Power & Battery Management
ACS710 - 120 kHz Bandwidth,
High Voltage Isolation Current Sensor IC
Ideal Solution for your High Voltage Isolation Needs
The Allegro® ACS710 current sensor IC provides an economical and
precise means for current sensing applications in industrial, commercial,
and communications systems. The device is offered in a small footprint
surface mount package that allows easy implementation in customer
applications.

The ACS710 consists of a precision linear Hall sensor integrated circuit

with a copper conduction path located near the surface of the silicon
die. Applied current flows through the copper conduction path, and the
analog output voltage from the Hall sensor linearly tracks the magnetic
field generated by the applied current. The accuracy of the ACS710 is
maximized with this patented packaging configuration because the Hall
element is situated in extremely close proximity to the current to be
measured.

High level immunity to current conductor dV/dt and stray electric fields,
offered by Allegro proprietary integrated shield technology, guarantees
low output voltage ripple and low offset drift in high voltage applications. The voltage on the Overcurrent Input (VOC pin) allows
customers to define an overcurrent fault threshold for the device. When the current flowing through the copper conduction path
(between the IP+ and IP– pins) exceeds this threshold, the open drain Overcurrent Fault pin will transition to a logic low state. Factory
programming of the linear Hall sensor IC inside of the ACS710 results in exceptional accuracy in both analog and digital output
signals.

The internal resistance of the copper path used for current sensing is typically 1 mΩ, for low power loss. Also, the current conduction
path is electrically isolated from the low voltage sensor inputs and outputs. This allows the ACS710 family of sensor ICs to be used
in applications requiring electrical isolation, without the use of optoisolators or other costly isolation techniques.

Features / Benefits
 125 kHz Bandwidth
 Industry leading noise performance provides improved resolution
 User-adjustable over-current fault level output with 2 µS response time can be used to protect switching devices from failure
during over-current or short circuit conditions
 Zero current reference: enhanced accuracy & use in differential circuits
 The device can be optimized for compatibility with 3.3 V supplies used in common analog to digital converter and
microprocessor devices. Contact factory for more details.
 Ratiometry pin for enhanced accuracy when used with an ADC
 High isolation voltage, suitable for line-powered applications
 Integrated shield protects against high dV/dt voltage transients
 Low resistance conductor results in low power loss

VCC

D
CLK
Q
Applications
R
Hall POR
Consumer / Industrial
POR Fault Latch
Bias
FAULT_EN FAULT Reset

VOC
– Drain
FAULT  Motor control
+
2VREF
Control
 UPS systems
OC Fault Logic
3 mA  Power supply protection
Fault
Comparator  IGBT modules
– VZCR
Sensitivity
 Energy metering and various white goods applications
Trim
+
IP+

Signal VIOUT
Recovery
RF(INT)
Hall
IP– Amplifier

VOUT(Q)
Trim

GND FILTER

7
For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal
Power & Battery Management
Fully (re)Configurable 4-Channel DC-to-DC
Digital PWM Controllers with Integrated
Drivers
Power System Design
Fast ■ Easy ■ Flexible
EXAR’s highly configurable digital power step-down
controllers, the XRP7704 and XRP7740, more intelligently
manage today’s power systems with up to four independent
digital-control loops while integrating an on-board standby
power LDO.

With four 12-bit resolution digital pulse width modulators

(DPWM) with integrated gate drivers, the XRP7704 and
XRP7740 use a digital PID control algorithm to perform full
digital loop control at switching frequencies up to 1.5MHz.
These power system controllers are fully addressable and
configurable via an I²C interface for monitoring, control and
management of DC-to-DC point-of-load power conversions.

Features Benefits
 4-channel step-down controllers w/standby LDO  Integrate the best of both worlds:
 Digital control loop Low cost and flexibility of digital power management and
 No external passive components control, and the robust power capabilities of analog switching
 Five PID coefficients
power supplies
 4A/ XRP7704 and 15A/ XRP7740 per channel
 On-board gate drivers
 Reduce development time to hours enabling a significant time-
 Up to 1.5MHz programmable operating frequency
to-market advantage
 0.9V to 5V programmable output voltage
 6.5V-20V single input voltage
 Independent channel (re) configurability  Permit real-time power system adjustments during design, in
 I²C configurability and control response to changing requirements or even after field-
 Green/halogen free 40-pin QFN package deployment

Applications  Built-in Low-Drop Out (LDO) for standby power, power

sequencing capability, and integrated gate drivers
 Computing: Servers, Storage Systems
 Consumer: Set-top box (STB), Game Systems
 Industrial: ATE, DC-DC converters, Video Processing
 Plasma Display Panel (PDP)
 Networking and Telecommunications Equipment

8
For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal
 Spartan-6 FPGA SP605 Evaluation Kit

Development Tools
The Spartan®-6 FPGA SP605 Evaluation Kit delivers all the basic components of the Xilinx Base Targeted Design Platform in
one package. It provides a flexible environment for system design and provides customers reference design and examples
on how to leverage features such as high-speed serial transceivers, PCI Express®, DVI, and/or DDR3. It includes an industry-
standard FMC (FPGA Mezzanine Card) connector for future scaling and customization to specific applications and markets.

Key Features: What’s Inside the SP605 Evaluation Kit:

 FPGA: XC6SLX45T FGG484-3CES Spartan-6  SP605 Base Board with the XC6LX45T-FGG484 FPGA
 Configuration:  ISE® Design Suite Logic Edition: (device-locked) for
 Onboard JTAG configuration circuitry Spartan-6 LX45T FPGA
 128MB Platform Flash XL  Includes ChipScope™ Pro and the ChipScope
 Quad SPI Flash 64MB Pro Serial I/O Toolkit
 16MB Parallel (BPI) Flash  Includes PlanAhead™ Design Analysis Tool
 System ACE 2G Compact FLASH (CF) Card  Timing Driven Place and Route, SmartGuide™,
and SmartXplorer Technology
 JTAG
 Memory:  Documentation
 Hardware Setup Guide
 DDR3 Component Memory 1Gb
 Getting Started Guide
 16MB Parallel (BPI) Flash (Also available for
configuration)  Hardware User Guide
 IIC 8Kb IIC EEPROM  Reference Designs User Guide
 Communications and Networking  Schematics and PCB files
 10/100/1000 Tri-Speed Ethernet  Universal 12V power supply
 SFP transceiver connector  Cables: 2 USB, 1 Ethernet, 1 DVI-VGA adapter
 GTX port (TX, RX) with four SMA connectors  Reference Designs and Demos
 USB To UART Bridge  Board Diagnostic Demo
 PCI Express x1 Edge Connector  Base System Reference Design featuring DSP48,
 Expansion Connectors: Ethernet, Memory, and Serial Transceiver integration

 FMC-LPC connector (1 GTP Transceiver, 68  Multiboot Reference Design, featuring fail-safe

single-ended or 34 differential user defined signals) configuration
 User GPIO with two SMA connectors  Hardened Memory Controller Reference Design
 4 User I/O (Digilent 2x6 Header)  Reference designs, demos, documentation, and
 Clocking: applications delivered on USB FLASH drive to get
started quickly
 200 MHz Oscillator (Differential)
 Oscillator socket (Single-Ended)
 SMA Connectors for external clock (Differential)
 GTX Reference Clock port with 2 SMA connectors
 Display:
 Video - DVI / VGA
 16x2 LCD character display
 4X LEDs

Ordering information
Part number— EK-S6-SP605-G
 Price -- $495

9
Nu Horizons offers a wide range of development/evaluation boards, tools and kts. For more information, please visit www.nuhorizons.com/development
Nu Horizons Line Card
• Military Discretes (Switching Diodes - JAN, JANTX, JANTXV)
• Audio (DAC’s, ADC’s, Codec’s, SPDIF, Sample Rate
Conv., DSP, USB)
• Memory (EEPROM, DAC + EEPROM)
• Networking (T1/E1/T3/E3 xcvr, PCM)
• Sensors (Hall Effect Sensor, 3d Compass)
• Video (NTSC/PAL Encoder/Decoder, A/V Switches, (Formerly Astec / Artesyn)
Video Gain Amp)
• Discrete (Transistors, FET arrays, Thyristors, Triacs)
• Display (Vacuum – Fluorescent Display Drivers)
• LED Drivers (Constant Current Drivers)
• Motor Control (Brushless DC, Bi-Polar Stepper)
• Power (Linear Regulators, Buck/Boost/Fly back DC- Up & Down Converting Mixers, IF Amplifiers, PA, RF
DC, Charge Pumps)
• Sensors (Hall Effect)
• Device Server Modules
• Embedded MCU / MPU (ARM7TDMI, ARM9926EJ)
• Networking Modules (Wired/Wireless 802.3 / • Solar Devices (Solar Cells, Solar Bits, Solar Die,
802.11bg / 802.15.4
• AC-DC Switchers
- Low Power (LP, NT, DA, DP, SSL) 25W-350W
- Medium Power (MP) Up to 1200W
- High Power (VS) Up to 2500W
- Intelligent High Power (iVS) Up to 4860W
• DC-DC Modules (1/16 Brick, 1/8 Brick, ¼ Brick, ½ • Signal Conditioning (Amplifiers, Comparators,
Brick, RF Power Brick)
• Industry Standard - Non Isolated Point-of-Load
(C-Class, E-Class, F-Class)
• Power Systems Engineering Services
• Power (MOSFET, IGBT, Diodes, Thyristors, DC/DC,
PWM Control, LED/Lamp/Display Drivers)
• RF Power (FETs, Drivers, Amplifiers, Microwave
modules, RF Modules)
Solar Battery Chargers)
• Data Converters (Delta Sigma, SAR, Voltage DAC,
Current DAC)
• Frequency Control (Silicon Timing)
• Interface (RS-232, 422/485, CAN PHY)
• Power Management (Switching Regulators, Linear
Regulators, DC/DC µModules, LED Drivers, Hot
Swap, PoE)
Filters, Voltage References, Thermal Couple
Compensators)
• Wireless / RF (I/Q Modulators – Demodulators,
Log Detectors, RF Power Detector)

• Analog (Data Conversion, Power Management) • Data Converters (ADC, DAC)
• Interface (PLB/PCI/I2C/SPI USB/UART’s, • Data Communications (10/100/1G/10G Ethernet
• Communications (Bluetooth, LIN, CAN, POTS, Switches, 10/100/1000/10G PHYs)
GPS, RF, WiMax, Zigbee) RS232/485/422 Transceivers)
• Memory (Flash, EEPROM, Modules) • Power (Buck/Boost Regulator’s, Charge Pumps, • Embedded MCU / MPU (ARM V5TE, PXA
• Microcontrollers (8051, AVR, ARM7TDMI, LDO’s, Supervisors, PWM, Programmable Power) StrongARM, PPC & MIPS Systems Controller)
ARM926EJ) • Storage (Data Reduction, Data Security) • Power Management (POLA)
• Multimedia & Imaging (CCD/CMOS Arrays, IR, • Telecom (T1/E1/DS1/DS3/E3 LIU’s, Carrier ETH • Storage (FAS/SATA/PATA, SAS/Fiberchannel,
Video) SONET/SDH Framers, Mappers & Aggregators) Storage Processors)
• Network Storage (Data Storage, Switched • Video (Format Converter)
Ethernet) • Wireless / RF (802.11 Modules)
• Programmable Logic (FPGA, SPLD/CPLD) (Fiber Optics Division)
• Sensors (Biometrics, RF, Smart Cards)
• Optical Components (WDM Management, 850nm
VCSELs & Detectors, 1310nm Lasers & Detectors,
CML Transmitters,WSS) • Analog ( Drivers / Voltage & uC Supervisors /
• Optical Transceivers (GBIC, XFP, MSA300, SFP, Filters / Switches / Regulators)
• Fiber Optic Devices (10G FP TOSA & MM PIN SFP+) • Bus Device ICs ( USB / PC / PCMCIA / SMBus)
ROSA, OTDR FP Lasers, 2.5G DWDM DML, DFB • Passive Optics (WDM networks) • Ethernet ( 10/100 PHYs, Controllers, Switches)
TOSA & APD ROSA) • Linear ICs ( Active Filters / Comparators /
• Optocouplers (Transistor Output, High Speed, Solid Op Amps / References / Timers)
State Relays) • Power Management ICs ( Battery, Display, Hot-
• RF Modules (Zigbee) Swap, PCI/PCIX/PCIE, High Side, LDOs, DDR)
• RF Semiconductors (RFIC Switch, GaAs FET, • Precision Edge ICs ( Clock distribution, generation,
GaAs PA, Si LD-MOSFET, CATV Hybrid, Si RFIC) synthesizers / Multiplexers, PLLs, buffers, CDRs)
• Audio (Mux/Demux, Codec) • RF (290 – 980 ISM band / ASK/FSK / 200kbps max
• Image Processor (Scaler, Deinterlacer, Motion Co- data rate)
CPU) • System Management ICs ( Fan Control / Thermal
• Telecom (SERDES, CDR, Laser Drivers, TIA’s, Supervisor I2C)
Limiting Amps)
• Embedded Array ( 0.13µ - 0.5µ / 6K – 10.7M • Video (HDMI, Equalizers, Cable Drivers, Reclockers,
Gates / 50 – 300 MHz) Optical Modules (SFP))
• IP Repository ( ARM926EJ, 8051, USB, PCIE,
DDR2, 10/100 MAC, Mil-STD-1553, UART, DMA, • DRAM (DDR3 SDRAM, DDR2 SDRAM, DDR
Timer, GPIO) SDRAM, SDRAM, RLDRAM, PSRAM)
• Standard Cell ( 0.13µ - 0.25µ / 5M – 12M Gates / • DRAM Modules (FBDIMM, RDIMM, SODIMM,
150 – 333 MHz) UDIMM)
• Structured ASIC ( 0.13µ - 0.35µ / 21K – 1.7M • Mobil DRAM (Mobil SDRAM, Mobil DDR SDRAM)
Gates / 50 – 250 MHz) • Memory (QDR/DDR SRAM, Zero-Wait SRAM • Multichip Packages (MobilDRAM & NAND Flash
(NBT), Sync Burst SRAM, Specialty Sync-SRAM) Combinations)
• NAND Flash Memory (Managed NAND, High
Speed NAND, Solid State Storage, Embedded USB)

• Power and Battery Management (IGBT and ® (Including ICS)

MOSFET gate drivers)
• Sensor and Imaging Arrays (Hall Effect Sensors) • Audio (2,4,8, & 10 Channel Codecs)
• Clock Distribution (Synthesizers, Translators, (Formerly C&D Technologies)
• Signal Conditioning (Solid State Relays,
Optocouplers) Oscillators, PLLs, Spread Spectrum, Video)
• Telecom (Embedded Modem, MF Trunk signaling, • Clock Generation (Fan-Out, Multiplexers, PLLs, • AC/DC Power Supplies (200 – 2000 Watts,
DTMF) Translators, Programmable) 2.5VDC to 48 VDC Out – PCI Modules)
• Datacom (10/100BaseT Phys) • Data Acquisition (Electronic Imaging, A/D
• Interface (PCIE Switches, Rapid I/O) Converters, D/A Converters, Sample/Hold Amplifier,
• Logic (FST, ALVC, LVC, FCT & BusSwitch) Multiplexers)
• Memory (FIFO, SRAM, Multiport RAM) • DC/DC Converters (0.25 to 340 Watts, 0.02 to 80
• Telecom (Network Search Engines, T1/E1/J1 LIUs, Amps, 1.2 to 48 VDC Out; 3 to 75 VDC In)
• Imaging Solutions (Fax Modems, Fax and MFP Framers, ATMs, AFEs, TSIs) • Digital Panel Meters (Voltmeters, Wire Meters,
System Solutions, Digital Photo Frames)
• Audio (Speakers-on-a-Chip, PC HD-Audio, PC HD- • Video (LVDS TX/RX, HDMI Multiplexer/Switches) Process Monitors, AC/DC Ammeters)
Audio Modem Combo)
• Magnetics (Inductors & Transformers, Differential
• Video (MPEG Encoders/Codecs, Video Decoders, common-mode filters, Databus Isolators)

Demodulators, Surveillance / Security)
• Dial-Up Access Modems (PC Dial-Up Modems,
Embedded Dial-Up Modems)
• Memory (DDR DRAM,SDRAM, EDO & FPO DRAM,
E2PROM, PSRAM, SRAM, DDR II Synchronous
SRAM, Asynchronous SRAM) • AC-DC Power Supplies (125W-375W, 3.3vdo to
• Smart Card (Two-Wire Serial EEPROM, Secure, 56vdo, 90-264vao in, 3”, 3.3” x 5” format)
• Wireless (Bluetooth modules, ZigBee modules, MCU Based, ICs) • DC-DC Open Frame Power Supplies (125W,
802.11 modules) 160W, 3.3-48vdo 3” X 5” format)
10 • Power Systems Engineering Services


Nu Horizons Line Card

® continued
• Sensors (Accelerometers, Proximity, Thermal, Touch)
• Wireless/RF (2.4G / 900M / 433M Transceiver, • Frequency Control (Oscillators, Optical Timing • Interface (Smartcard)
MCU based RF, Audio streaming) Clocks, Sine Wave Oscillator) • Wireless (Bluetooth, ZigBee, GPS, RFID)
• RF Components (SAW Resonators, SAW RF & IF • Audio (Decoders, Power Amps, Analog CPU, Digital
Filters, RFIC Transceivers) CPU, Radio)
• RF Modules (ZigBee, 802.15.4, UHF Mesh, FHSS • Image Sensor (Camera Modules, Imaging Signal
ISM, Bluetooth, 802.11b) Processor, CMOS Arrays)
• Standalone RF modules (FHSS, 802.15.4, • Video (Demodulator, Decoders)
• Communications (Voice & Audio CODECs, Pro-X • Motor Control (Controllers, Drivers, MCU’s)
SLICs, USB Audio Codec) 802.11b, and Bluetooth) • Microcontrollers (8-bit, 16-bit, ARM7TDMI,
• Logic ICs (I/O Controllers, ISA Bridge, Power ARM926E, Cortex M3)
Management, Hardware Monitors, Clock Generators,
Power I/C, Card Reader IC’s, IEEE1394)
• MPU (8-bit 80C51 based, 32-bit ARM7TDMI)
• Power (ACPI Controller, PWM, DDR Bus Term,
Power Switch) (Formerly OKI Semiconductor) • Optoelectronics (LED Drivers, EL Lamp Drivers)
• Voice Solutions (Record & Playback ICs) • Power (Switching, Automotive, PFC, Backlight,
• Connectivity (CAN, J1850) LDO, High Voltage Interface / Driver’s, PoE)
• Display Drivers (LCD / VFD Driver / Controllers) • Transducers (Ultrasound)
• Embedded MCU / MPU (4-Bit NX 63K /
ARM7TDMI / ARM946E – Full Development Tool
Suites)
• Analog Image Sensor (NTSC/PAL) • Memory (P2ROM, DRAM )
• Digital Image Sensor (CIF, VGA, 1.3M / 2.0M / • MEMS (3D Accelerometers -3g to +3g) • AC/DC Power Supplies (Industrial and Medical -
3.2M / 5.17M Pixel) • Power Management (Linear (LDO) & Switching 300W - 1500W)
• Image Processors Voltage Regulators, Power Switch (USB) devices) • DC/DC Converters
• Speech (BGM Mixer - ADPCM & ADPCM2, Voice - Industry Standard (1/8-Brick, 1/4-Brick, 1/2-
Synthesizers & Recorders, Audio Codec) Brick, Full Brick)
• Telecom (ADPCM – Linear – PCMA-Law - VoIP - Non-Isolated Point of Load
Codec’s, Echo Cancellers, Transceivers) - Intermediate Bus Converters (1/8-Brick, 1/4-
• Video (NTSC / PAL / SECAM Encoders – Brick, 1/2-Brick)
• Amplifiers & Comparators (Audio, Op Amp, Gain Decoders, NR-FIFO)
Control, Level Detect/Sense, Video)
• Analog Switches (Audio, Data, Video)
• Circuit Protection (EMI / RFI Filters) • Audio / Video (3 Input A/V Switch, Dual SCART
• Clock Management (Synthesizers, ZDB, PLL, A/V Switch)
Skew Control, Fan-Out, Buffers, Timers) • Modems (V22bis, Data Pumps, AFEs, DAAs)
• Discretes (FETs, Transistors, Diodes, Rectifiers, • Power Measurement Metering Control (Single/
Thyristors) Poly Phase Meter ICs)
• Interface (232 / 422 / CAN Tranciever, Modulator / • Smart Card Reader (SoC - Smart Card Reader &
Demodulators., Smart / SIM) • Flat Panel Displays (LCD – 2” to 65”) Power Management, Interface ICs)
• Logic (Gates, Inverters, MUX, Latches) • Memory (Flash – NOR) • WAN / LAN (10/100 PHY, 10Base2/5 - OC-3 /
• Power Management (PFC, Battery Management, • Optoelectronics (LEDs, LED Modules, Laser Diode, STM-1 / STS-3 / E4 & DS3 / E3 / STS-1
Supervisors, References, DC/DC Switchers, Off-Line Photocoupler, IrDA, photo interrupters, Emitters/ Transceivers)
Reg/Ctrl, LDO) Detectors, Sensors)
• Power (LDO / Switching Regulators, LED Drivers,
Solid State Relays)
• Data Interconnect (Signal Conditioners and
Retimers, Crosspoint Switches, Backplane, Switch
• High-Power Laser Diodes (Single, Laser Bar / Fabrics)
Stacks) • Ethernet (10/100/1G/10G PHYs, 10/100/1G/10G
• Infrared (Photo detectors, Emitters, Sensors) MACs, Switches, Transceivers)
• Intelligent Displays (Self-Contained LED Displays) • Storage (FC, SerDes, Transceivers, SAS
• Digital Video Processors Controllers, SATA Controls)
• LED’s (Side / Radial / Top Emitters, Arrays, High • Transport Physical Layer (TIAs, Amplifiers,
Power) • Storage Products (Serial ATA - Parallel ATA,
Parallel ATA Controller, RAID Storage Processors, Photodiodes, CDR, MUX, DEMUX, Transceivers,
SATA Controllers, SATA Port Multipliers) PON)
• Video Transport (HDMI, DVI and iTMDS Products - • Transport Processing (VC, FEC, Network
Processors, TSI, Pointer Processors)
Receivers, Transmitters, Switches, PHYs)
(Including SaRonix)

• Analog Switches (3-17V SPDT-SPST-DPST-MUX,
Custom HDMI/DVI-PCI-USB-LAN) • Memory (SDRAM / DDR1, Pseudo SRAM, Serial
• Bridges (PCI, PCIX, PCI Express – 32/64Bit – Flash, Parallel Flash)
66/133MHz) • Controllers (Flash Memory Card Controller, USB
• Clock ICs ( VCXOs, Buffers, Drivers, Generators, Flash Controller)
Skew Controllers) • Embedded Graphics (128-bit 2D/3D mobile
• Crystals & Oscillators (Quartz Crystal Resonators) graphics engine, Mobile Graphics Coprocessor)
• Digital Switches (2-Port, Bus, Crossbar, DDR, • Mobile Communication (Mobile Satellite TV Tuner
Mux/DeMux, Low Voltage Translator) IC)
• Interface (Re-Drivers, Buffers, Flip-Flops, Gates, • Multimedia SoC (MP3/WMA Digital Audio Player,
Latches, Registers, Transceivers, Voltage Translators) USB 2.0 Megapixal Image Controller) • Filters
• Logic (ALVC, FCT, LCX, LPT) • Inductors
• PCI Express Solutions (Packet/Signal Switches, • Isolators
Bridge, PHY, Signal Conditioning, Clock-Buffers/ • Transformers (Modem, Analog/Voice Switching,
DSL, Cable Modem, RJ45, PoE)
Generators/Crystals)
• Translators (Voltage, I/O Signal)
• Advanced I/O Controllers (USB-ATA, Southbridge)
• Datacom Satellite Receiver (10/100 MAC/PHY
Controller, 10/100PHY, Multimedia Processors,
ArcNET, CircNET)
• Environmental (Temperature Sensors, Fan Control) • Advanced / General Purpose FPGAs
• USB Solutions (Card Reader, Flash Drive, Disk • CPLD (32 – 512 Macrocells, Low Power/High
• Frequency Control (Oscillators, Crystals, VCXO, Drive, Hub, PHY) Performance)
TCXO, OCXO, Sine Wave Oscillator) • Development Platforms
• Development Tools (DSP, Embedded Processing,
Synthesis & Implementation)
• Intellectual Property (including PCIe, PCI,
10/100/1G/10G Ethernet, MPEG4, FEC, PPC,
• Communications (CAN, LIN, ZigBee) • Power Management (AC/DC, Battery µBlaze, PicoBlaze)
• Discrete (Diodes, Power MOSFETS, Thyristors, Management, DC/DC, LDO, MPU - Supervisor, PoE, • Services (Design Services, Training, XPA)
Triacs, Transistors) VDC References, AC Switches)
• Embedded MCU / MPU (16/32 Bit MCUs) • Discretes (Thyristors, Diodes, FETs, Transistors)
• Logic (Standard – High/Low Voltage, Interface, • Signal Conditioning (Comparators, Op-Amps,
Multi-Purpose) Clamp Diode Arrays, Crowbar Diodes, EMI Filtering)
• Memory (Fast Flash, Low Power SRAM, EEPROM) • Logic (3.3V, 5V, Translators, Gates, Switches, Port -
Expansion)
11
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Sign up online to receive your copy, be notified of upcoming issues or to request samples of
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In order to simplify the design process, Nu Horizons has created a series of application notes
Application designed to guide engineers through the process of interfacing different devices together.
Using a detailed step-by-step approach, these design guides identify key elements in the design
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Notes stand-alone section, with a short introduction or overview, followed by the step-by-step design
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