Engineering Guide Printed Circuit Boards

Delivering Quality Since 1952.
TECHNICAL ENGINEERING GUIDE

PRINTED
CIRCUIT BOARDS
PRINTED CIRCUIT BOARDS
1
DELIVERING QUALITY SINCE 1952.
TECHNOLOGY OVERVIEW
ENGINEERING OVERVIEW
Epec Engineered Technologies designs and manufactures customized, built-to-print, performance-critical
products for all sectors of the electronics industry.
At Epec, we have a powerful story to tell a history of great achievements, world class talent, and
innovative breakthroughs, but most importantly, a story of helping our customers deliver their high quality
products to market, faster.
Epec has a sixty year history of reliability, on time delivery, and financial stability. Our continuous investment
in people, technology, and new ideas are making it easier for our customers to do great work.
We have built the industrys leading supply chain platform and technology team, with Epec UL certified
manufacturing operations in Shenzhen, Taipei, and North America, to seamlessly manage the needs of our
customers product life cycles.
With more than 100 dedicated employees throughout North America and Asia, Epec Engineered
Technologies has become one of the fastest growing companies in the Industry.
Epec has built one of the Industrys leading global supply chain and engineering platforms.
As one of North Americas leading PCB and built-to-print engineered product companies, Epecs annual
capital expenditures are consistently among the highest in the industry.
Our investments are focused on world class engineering design systems, such as EpecDFx, and on
continually improving our global technology platform, to accelerate our customers time to market.
Epec's technical engineering and manufacturing solutions have helped thousands of leading companies
reduce their time to market.
With 24/7 North American engineering support we provide our customers the most in-depth feedback, with
exact accuracy, eliminating delays and quality problems.
Epec can provide complete engineering and design services on all our engineered products, from concept
through production in a quick and efficient time frame. With over sixty years of experience and knowledge
across diverse industries, Epec has the ability to think outside the box and create innovative designs and
solid manufacturing solutions.
Our technical staff will work with you to generate material specifications, product renderings, complete
documentation and prototypes.
2
STANDARD LEAD TIME - 20 Working Day
Technology 1 Day 2 Day 3 Day 5 Day 7 Day 10 Day
1 - 4 Layers x x x x x x
6 - 10 Layers x x x x
> 10 Layers x x
* Prototype and Production Quantities Available
Solder Mask..........Green, Blue, Red, Black, Clear
Min Solder Mask Web................................... .004
Max Board Thickness................................... .250
Maximum Board Size............................. 22 x 42
Max Copper Weight....................................... 6 oz
Standard SMD Pitch..................................... .016
PCB LEAD TIMES
PRINTED CIRCUIT BOARD CAPABILITIES
STANDARD PCB FEATURES
Materials
FR-4 ALL Types
CEM-1 & CEM-3
Heavy Copper
RF and High Speed Materials
Mixed Materials / FR-4 Tefon
Metal Backed Boards
Polyimide
Surface Finishes
ENIG
HASL
Pb Free HASL
Immersion Silver & Tin
ENEPIG
Hard Body Gold
Soft Bondable Gold
OSP
Plating
Conductive Via Fill
Edge Plating
Castellations
Plated Slots
Gold Tabs
Plasma Etch Back
Peelable Solder Mask
Drill & Rout
Jump Score
Counter Sinks / Counter Bores
Control Depth & Laser Drilling
12:1 Aspect Ratio
Depth Controlled Milling
Design
1 to 18 Layers
3 Mil Lines & Spaces
IPC Class 2 / Class 3
Impedance Control +/-10%
Down to .006 Holes
Blind & Buried Vias
Silver Thru Hole
Via in Pad
Laser Direct Imaging
MicroVias
PRINTED CIRCUIT BOARD CAPABILITIES
MIL-PRF-55110
Sequential Lamination
Net List Compare
Ionic Cleanliness
Free DFx File Check
Design Services
Flex & Rigid Flex
ITAR Registered
Thermal Management
High Density Interconnects
3
TECHNOLOGY ROAD MAP
Standard Advanced
Mechanical
Maximum Layer Count 18 26
Maximum Board Thickness .250" .287"
Maximum Board Size 20" x 23" 20" x 24"
Smallest Hole Size (Finished) .006" .005"
Aspect Ratio 11:01 12:01
Minimum Component Pitch .020" (soldermask between pins) .016" (gang masked)
Minimum Core Thickness .003" .002"
Jump Scoring Yes Yes
Countersinks/Counterbores Yes Yes
Plated Hole Tolerance +/- .003" +/- .002
Warpage 1% 0.75%
Copper Weight
Inner Layers 4 ounces 4 ounces
Outer Layers 6 ounces 8 ounces
Technology
Impedance Control +/- 10% +/- 5%
Via Technology Blind/Buried Blind/Buried
Laser Drilling (Microvias) Yes Yes
Plasma Etching Yes Yes
Laser Direct Imaging Yes Yes
Via Filling Non-Conductive Conductive
Available Surface Finishes
HASL Immersion Silver
ENIG OSP
Pb Free HASL Immersion Gold
Immersion Tin Electroplated Gold
Materials
FR-4 (140-220 Tg) Tefon
Polyimide Thermagon
CEM-1 Arlon
Rogers Getek
Agency Qualifcations
UL (File #E86319)
ISO-9001:2008
TS-16949
IPC-6012 Class 3
Standard - Everyday Capability
Advanced - Everyday Capability with a small premium.
4
PROCESS CAPABILITIES
Standard Advanced
Annular Ring
Internal Minimum Pad Size
.016" larger than fnished
hole size
hole size with teardrop
External Minimum Pad Size
hole size
hole size with teardrop
Increase pad size accordingly for annular ring requirements greater than .001". Vias may use pad .010" larger than Finished Hole Size
Holes requiring greater than .001" copper (i.e. 1 oz plated to 3 oz Finish) require and additional .004 pad diameter.
Plane Layer Clearance
PTH & NPTH Hole Clearance to Plane .030" larger than fnished hole size .024" larger than fnished hole size
PTH & NPTH Hole to Inner Layer Trace .015" Spacing .012" Spacing
Line Width and Space
Inner Layer Line width on Hoz copper Minimum -.004" Minimum - .004"
Inner Layer Line width on 1oz copper Minimum-.005" Minimum-.005"
Inner Layer Line width on 2 oz copper Minimum -.008" Minimum -.008"
Inner Layer Line width on 3 oz base copper or greater Minimum -.012" Minimum -.012"
Outer Layer Line width on H ounce base copper Minimum-.004" Minimum-.004"
Outer Layer Line width on 1oz base copper Minimum -.005" Minimum - .005"
Outer Layer Line width on 2 oz copper Minimum -.008" Minimum -.008"
Outer Layer Line width on 3 oz base copper or greater Minimum -.012" Minimum -.012"
Inner layer Feature to Feature on 1 oz or less base copper Minimum -.005" Minimum - .004"
Inner layer Feature to Feature on 2 oz Base Copper Minimum -.008" Minimum -.008"
Inner layer Feature to Feature on 3 oz copper or greater Minimum -.012" Minimum -.012"
Outer layer Feature to Feature on 1 oz or less base copper Minimum -.005" Minimum - .004"
Outer layer Feature to Feature on 2 oz Base Copper Minimum -.008" Minimum -.008"
Outer layer Feature to Feature on 3 oz copper or greater Minimum -.012" Minimum -.012"
Trace to Plane Spacing Minimum -.008" Minimum -.008"
Feature to Board Edge *does not include tabs Minimum -.010" Minimum -.008"
Feature to Score Edge Minimum -.020" Minimum -.015"
Solder Mask
LPI Conductor Overlap .005" Larger Than Feature Size .004" Larger Than Feature Size
LPI Mask Clearance .003" Minimum .002" Minimum
LPI Mask Web .005" Minimum .004" Minimum
Less than 4 mil web between component pins may result in loss of mask between SMT pads.
Silkscreen
Silk Screen Ink .008" minimum aperture .006" minimum aperture
Copper Features (ETCHED TEXT) .010" minimum aperture .010" minimum aperture
Font Height .065" minimum height .045" minimum height
Distance from Feature (clipping) .006" minimum from feature .006" minimum from feature
If the specifcations of a board design fall into the advanced category it may be subject to additional charges.
5
LAMINATE INFORMATION
A
r
c

R
e
s
i
s
t
a
n
c
e
M
i
n
i
m
u
m

(
s
e
c
.
)
E
l
e
c
t
r
i
c
a
l

S
t
r
e
n
g
t
h
M
i
n
i
m
u
m

(
v
o
l
t
s
/
m
i
l
.
)
F
l
a
m
m
a
b
i
l
i
t
y

U
L
9
4
G
l
a
s
s

T
r
a
n
s
i
t
i
o
n
T
e
m
p
e
r
a
t
u
r
e

T
g
(
C
e
l
s
i
u
s
)
D
e
g
r
a
d
a
t
i
o
n
T
e
m
p
e
r
a
t
u
r
e

b
y

T
G
A
(
C
e
l
s
i
u
s
)
D
i
e
l
e
c
t
r
i
c

C
o
n
s
t
a
n
t
(
1

M
H
z
)
D
i
e
l
e
c
t
r
i
c

C
o
n
s
t
a
n
t
(
1

G
H
z
)
L
o
s
s

T
a
n
g
e
n
t

a
t
(
1

M
H
z
)
L
o
s
s

T
a
n
g
e
n
t

a
t
(
1

G
H
z
)
Vendor Product Type IPC 4101A
SHENGYI
S1000 Low CTE FR4 /24 100 - V-0 175 335 4.8 - 0.013 -
S1130 FR4 /21 115 - V-0 135 - 4.6 - 0.016 -
S1141 FR4 /21 115 - V-0 140 - 4.5 - 0.016 -
S1155
FR4/Halogen
Free
/21 115 - V-0 135 - 4.7 - 0.01 -
S1165
FR4/Halogen
Free
/94 127 - V-0 170 260 4.8 - 0.007 -
S1170 FR4 /24 123 - V-0 175 340 4.6 - 0.012 -
S1600 High CTI FR4 /21 126 - V-0 135 - 4.7 - 0.016 0.008
S1860 FR4 /29 90 - V-0 210 - 3.6 - 0.008
S1440 FR4/UV Block /97 125 - V-0 140 - 4.7 - 0.0015 -
S2130 CEM-3 - 115 - V-0 132 - 4.6 - 0.0016 -
S3110 CEM-1 - 118 - V-0 110 - 4.4 - 0.022 -
HONG TAI
HTE-420 FR4 - 120 - V-0 145 - 4.2-4.8 - 0.019 -
HTE-740 FR4 - 120 - V-0 175 - 4.2-4.8 - 0.019 -
ISOLA
ED130UV FR4 /21 100 - V-0 135 - 4.7 4.34 0.02 0.016
FR406 FR4 /24, /26, /28 60 1000 - 170 295 - - - -
FR408 FR4 /24 120 1400 - 180 370 - 3.63 - 0.013
P95 Polymide /41 131 1200 V-0 260 4.4 4.2 0.016 0.014
Policlad 370HR FR4 /24, /26, /98 115 54 V-0 180 350 4.7 4.5 0.016 0.017
Getek PPO /25 >60 1200 V-0 175-185 - 3.6-4.2 - .010-.015 -
IS-410 FR4 /24, /26, /28 129 1100 V-0 180 350 - - - -
ITEQ
IT140 FR4 /21 60 - V-0 135 305 5.4 - 0.035 -
IT140G
FR4/Halogen
Free
/21 90 760 V-0 155 365 4.5 - 0.015 -
IT158 Low CTE FR4 /24 125 - V-0 155 345 4.6 - 0.016 -
IT170G
FR4/Halogen
Free
/24 100 - V-0 180 380 4.5 - 0.009 -
IT180 FR4 /24, /99 60 760 V-0 170 340 4.4 - 0.016 -
IT600 High CTI FR4 /21 60 - V-0 140 305 4.8 - 0.018 -
NAN YA
NP-140 FR4 /21 - - V-0 140 311 - 4.2 - 0.015
NP-170TL FR4 /24 - - V-0 175 312 - 4.22 - 0.013
NPG-170
FR4/Halogen
Free
/94 90 - V-0 170 355 - 4.3 - 0.012
NP-180 FR4 /24 120 - V-0 180 359 - 4.36 - 0.019
NPG-180
FR4/Halogen
Free
- - - V-0 180 380 - 4.8 - 0.016
6
LAMINATE INFORMATION
A
r
c

R
e
s
i
s
t
a
n
c
e
M
i
n
i
m
u
m

(
s
e
c
.
)
E
l
e
c
t
r
i
c
a
l

S
t
r
e
n
g
t
h
M
i
n
i
m
u
m

(
v
o
l
t
s
/
m
i
l
.
)
F
l
a
m
m
a
b
i
l
i
t
y

U
L
9
4
G
l
a
s
s

T
r
a
n
s
i
t
i
o
n
T
e
m
p
e
r
a
t
u
r
e

T
g
(
C
e
l
s
i
u
s
)
D
e
g
r
a
d
a
t
i
o
n
T
e
m
p
e
r
a
t
u
r
e

b
y

T
G
A
(
C
e
l
s
i
u
s
)
D
i
e
l
e
c
t
r
i
c

C
o
n
s
t
a
n
t
(
1

M
H
z
)
D
i
e
l
e
c
t
r
i
c

C
o
n
s
t
a
n
t
(
1

G
H
z
)
L
o
s
s

T
a
n
g
e
n
t

a
t
(
1

M
H
z
)
L
o
s
s

T
a
n
g
e
n
t

a
t
(
1

G
H
z
)
Vendor Product Type IPC 4101A
NELCO
N4000-13 PPE /29 123 1200 - 210-240 350 3.8 3.7 - 0.014
N4000-13 SI PPE /29 123 1000 - 210-240 350 - 3.5 - 0.009
N4000-2 FR4 /21 65 1250 V-0 130-140 300 4.4 - 0.027 -
N4000-6 FR4 High Temp /24, /26 65 1300 V-0 170-175 300 4.3 4.1 0.027 -
N4000-7 FR4 /24 124 1100 V-0 155 317 4.5 4 0.017 0.017
N5000 BT /30 118 1200 - 185-220 334 3.8 3.6 - 0.014
N7000-1 Polymide /40, /41 136 1350 V-1 250-260 389 3.9 3.9 - 0.015
ROGERS
3003 PTFE - - - V-0 - 500 - 3 - 0.0013
4003C Ceramic - - 650 - 280 425 - 3.38 - 0.0027
4350B Ceramic - - 800 V-0 280 390 - 3.48 - 0.0037
4450B Ceramic - - 1000 V-0 >280 - - 3.54 - 0.004
TMM3 Ceramic - - 650 - >280 425 - 3.27 - 0.002
TMM4 Ceramic - - 650 - >280 425 - 4.5 - 0.002
Ultralam 2000 PTFE - 185 - V-0 - - - 2.6 - 0.0022
ARLON
25N Ceramic /10 - - - 260 - - 3.38 - 0.0025
25FR Ceramic /11 - - V-0 260 - - 3.58 - 0.0035
85N Polyimide /40 - - - 260 - 4.39 - 0.008 -
TACONIC
TLC PTFE - >180 - V-0 - - - 3.2 - 0.003
TLE PTFE - >180 - V-0 - - - 2.95 - 0.0028
TLT PTFE - >180 - V-0 - - - 2.5 - 0.0006
TLX PTFE - >180 - V-0 - - - 2.5 - 0.0019
DUPONT
PYRALUX AC Polyimide - - - V-0 - - 3.7 - 0.014 -
PYRALUX AP Polyimide - - - V-0 220 - 3.4 - 0.003 -
TAIFLEX
2LPSE 1005 Polyimide - - - V-0 - - 3.65 - 0.009 -
THKD050513 Polyimide - - - V-0 - - 3.65 - 0.009 -
For more information on Laminates, visit the following websites.
SHENG YI - www.syst.com.cn ROGERS - www.rogerscorp.com
ISOLA - www.isola-group.com ARLON - www.arlon-med.com
ITEQ - www.iteq.com.tw TACONIC - www.taconic-add.com
NAN YA - www.npc.com.tw DUPONT - www.dupont.com
NELCO - www.parkelectro.com TAIFLEX - www.taifex.com
7
PCB DESIGN SERVICES
A Manufacturing Mentality
For more than 60 years, Epec has continued its tradition of perfection in engineering and manufacturing
printed circuit boards for the most discerning customers. Our years of manufacturing experience provide
us with a competitive edge when it comes to PCB layout and design. From a simple single sided board
to a complex multi-layer, double sided surface mount design, our goal is to provide you a design that
meets your requirements and is the most cost effective to manufacture.
We pride ourselves on providing high quality design and layout services, but it is equally important that
our customers can manufacturer their parts in the most cost effective manner. Our goal is to reduce the
overall cost of our customers product by designing a circuit board that can be easily manufactured by
Epec or anyone else in our industry.
REVERSE ENGINEERING AND SCANNING
With the consolidation of the printed circuit board industry over the last few years, many of our customers
find themselves needing to order boards but they have no electronic data. Their previous supplier may
have gone out of business and the only copies of the artwork or electronic data have been discarded.
At EPEC, we can create electronic data from virtually anything, including, films, drawings (DXF), 1 to 1
paper plots, and even boards themselves.
We have over 10 years of experience in creating electronic data from all types of media using our state of
the art scanning equipment and software. We have developed a systematic process to make sure that
all of the board features are double checked to ensure that everything has been replicated properly. We
understand how important it is to get even the smallest details right when it comes to our customers
circuit boards.
Please contact your sales representative for more specific details around our design and manufacturing
guidelines.
PCB DESIGN CAPABILITIES
Design Capabilities:
Single and Double Sided
Multi-layer (up to 20-Layers)
Flex and RigidFlex
High Density Surface Mount
(BGA, CGA)
Analog, Digital & Mixed Designs
Impedance Control
Matched Line Lengths
Differential Pairs
Auto routing for dense
multi-layer designs
PCB Software:
PADS
AutoCAD
CADSTAR
ORCAD
Accel
PCAD
Design Service:
Gerber completion in
as few as 5 days
PCB Layout:
Complete assembly
drawings for fabrication
In-Circuit Test Data Generation
Pick and Place
Data Generation
Panelization Drawings
Gerber Editing
Scanning
8
EpecDFx ENGINEERING PLATFORM
EpecDFx is a whole new quality and manufacturability platform, combining the industry's latest, most
advanced technology and engineering expertise.
Prototype through production Reduces overall costs Accelerates time-to-market
EpecDFx IN ACTION
Typical example of a subtle, yet crucial engineering and design problem discovered before fabrication;
EpecDFx and Epecs engineering team detects and develops must-fx through optimal solutions.
Experience EpecDFx, and how our engineering support gives customers the most in-depth feedback,
with exact accuracy, available anywhere in the printed circuit board Industry, eliminating delays and
quality problems.
EpecDFx issue shows:
Isolated connection caused by
oversized plane clearances not caught by
CAD system resulting in netlist violation.
Reduced thermal connection due to
proximity to large split plane line.
Impact:
Electrical integrity of the design is invalid,
resulting in scrapped board.
Compromised thermal connection results
in poor solderability to connector pin.
EpecDFx
Critical/Must Fix
Suggestion: Reduce plane
clearances for holes to
allow connection.
Result: Netlist integrity is
restored.
EpecDFx Better
clearances for holes to allow
connection. Plus rotate
thermal relief 45 degrees.
restored, and thermal
properties are improved.
EpecDFx Best
clearances for holes to allow
connection. Plus rotate
thermal relief 45 degrees and
reduce plane clearance line.
restored, and thermal
properties are maximized.
9
HEAVY COPPER PCBS
Epec has been building heavy cooper circuit boards with traces and copper planes of up to 6 ounces or
over 20 years. Our expertise is in producing at a reasonable cost, heavy copper PCBs that are of proven
designs. Our engineering team can work with you to review your design to make sure that they can be
manufactured with the highest quality at the best overall cost.
Industries Served Using Heavy Copper:
Welding Equipment
Solar Panel Manufacturers
Power Supplies
Automotive
Electrical Power Distribution
Power Converters
Heavy Copper PCB Capabilities:
Maximum Number of Layers = 16
Laminate FR-4 (All Tg Ranges), Teflon, Ceramic
Finished Thickness = .020 - .275
Green, Blue, Red, Black, Clear & White Solder Masks & Legend Inks
Minimum Soldermask Clearance 6 mils
Minimum Solder dam Width 5.5 mils
Hot Air Solder Leveling (HASL)
Immersion Gold (ENIG) & Immersion Silver
Blind & Buried Vias
Minimum Drill Bit Hole Size = .012
Minimum Holes Size - .008 +.005/-.008
Maximum Hole Aspect Ratio = 10:1
Maximum Copper Weight = 6 oz. (UL Approved)
Controlled Impedance +/- 10%
Minimum Silkscreen Line Width 8 mils
Production Minimums
Measured in Inches H oz 1 oz 2 oz 3 oz 4 oz 5 oz 6 oz
Min. Conductor Width 0.004 0.005 0.006 0.007 0.008 0.009 0.10
Min. Conductor Spacing 0.004 0.006 0.008 0.012 0.014 0.017 0.020
Min. Pad to Pad Spacing 0.004 0.006 0.008 0.012 0.014 0.017 0.020
Min. Conductor-to-Pad Spacing 0.004 0.006 0.008 0.012 0.014 0.017 0.020
Min. PTH Annular Ring 0.006 0.006 0.008 0.009 0.011 0.013 0.014
Min. VIA Annular Ring 0.006 0.006 0.008 0.009 0.011 0.013 0.014
Min. Distance - Hole to Board Edge 0.010 0.010 0.010 0.010 0.010 0.010 0.010
10
THERMAL CLAD AND METAL BACKED PCBS
Epec offers Thermal Clad PCBs which is a dielectric metal base with a bonded copper circuit layer. This
creates superior heat transfer to help cool components while eliminating problems associated with managing
fragile ceramics. Thermal clad is a unique layered system comprised of the follow layers:
Circuit Layer: Printed circuit foil with thickness of 1 oz to 5 oz.
Dielectric Layer: Many different options which offer
electrical isolation with minimum thermal resistance.
Also used to bond the circuit layer and base material
together. Each specific dielectric has its own UL recognition.
Base Layer: Most often Aluminum, but can also be copper.
The most commonly used thickness is 0.040 (1.0 mm) although
many thicknesses are available.
THERMAL CLAD PCB APPLICATIONS
Power Conversion: Thermal clad offers a variety of thermal performances is compatible with mechanical
fasteners and is highly reliable.
LEDs: Using Thermal Clad PCBs assures the lowest possible operating temperatures and maximum
brightness, color and life.
Motor Drives: Thermal Clad dielectric choices provide the electrical isolation needed to meet operating
parameters and safety agency test requirements.
Solid State Relays: Thermal clad offers a very thermally efficient and mechanically robust substrate.
Automotive: The automotive industry uses Thermal clad boards as they need long term reliability under
high operating temperatures coupled with their requirement of effective space utilization.
Improve the durability and performance of your product by using Thermal Clad PCBs. Simple designs
and low thermal impedance of the dielectric out performs all other PCB insulators for power and
high-operating temperature components.
Thermal Clad PCB Materials:
Bergquist
Thermagon
Arlon
Denka
Thermal Clad PCB Specifications:
1 & 2 Layer Dielectrics
HASL, ENIG & Pb Free HASL finish
Up to 5 oz finished Cu
Al & CU base material up
to .250 thick
Thermal Clad PCB Benefits:
Lower Operating Temperatures
Improved Product Durability
Increased Power Density
Increased Thermal Efficiency
Reduced Number of Interconnects
Lower Junction Temperatures
Reduced PCB Size
Eliminates Older Hardware
Minimizes Labor Required for Assembly
Wide Variety of Form Factors
Minimize Thermal Impedance
11
HDI HIGH DENSITY INTERCONNECT PCB
HDI boards, one of the fastest growing technologies in PCBs, are now available at Epec. HDI Boards
may have blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a
higher circuitry density than traditional circuit boards using less layer construction.
Since the late 1980's we have seen video cameras using cartridges the size of a novel, shrink to fit in the
palm of your hand. Mobile computing and working from home pushed technology further to make computers
faster and lighter, allowing the consumer to work remotely from anywhere.
HDI Technology is the leading reason for these transformations. Products do more, weigh less and are
physically smaller. Specialty equipment, mini-components and thinner materials have allowed for electronics
to shrink in size while expanding technology, quality and speed.
Key HDI Benefits
As consumer demands change, so must technology. By using HDI technology, designers now have the
option to place more components on both sides of the raw PCB. Multiple via processes, including via in pad
and blind via technology, allow designers more PCB real estate to place components that are smaller even
closer together. Decreased component size and pitch allow for more I/O in smaller geometries. This means
faster transmission of signals and a significant reduction in signal loss and crossing delays.
Via in Pad Process
Inspiration from surface mount technologies from the late 1980's has pushed the limits with BGA's, COB
and CSP into smaller square surface inches. The via in pad process allows for vias to be placed within the
surface of the flat lands while using eight additional steps to complete this unique process. Specialty
equipment and trained technicians follow the process closely to achieve the perfect hidden via.
Quality remains the most important factor for the consumer second to price. Using HDI technology during
design, it is possible to reduce an 8 layer through-hole PCB to a 4 layer HDI microvia technology packed
PCB. The wiring capabilities of a well-designed HDI 4 layer PCB can achieve the same or better functions
as that of a standard 8 layer PCB.
Via-in-Pad technology shown .005 laser drill
within .015 BGA capped and plated pads.
.005 via holes within .014 copper pads are
filled, capped and plated over allowing for
small component placement.
12
HDI HIGH DENSITY INTERCONNECT PCB (continued)
Why Build Non-Conventional HDI Boards
With 60 years of experience in the printed circuit board industry, Epec has always made its top focus to be
our customer needs. With technology increases every day and devices get smaller, we are always
increasing our capabilities to exceed the demands of our customers, ensuring we deliver the highest quality
engineered products available.
With our engineering knowledge we welcome the opportunity to expand our HDI circuit board product
offering to our customers helping them stay on top in their market.
Our teams of engineers are always available 24/7 to help our customers design and manufacture state of
the art products for their respected industry. Whether you need a quick turn or a prototype order,
design help, or require ITAR or special certifications, we will meet your schedule to get your products
to market faster.
Industries That Utilize HDI:
Automotive Industry
Medical Industry
Aerospace & Military
Consumer Electronics
Products That Benefit From HDI:
Portable Devices
Mobile Devices
Hand Held Computing
Scanning Devices & Printers
Our HDI Technology Includes:
Prototype & Production Size Orders
Quick Turns & Standard Lead Times
Blind & Buried Micro-Vias
Sequential Lamination
Exotic Materials
Extreme Thicknesses
Stacked Micro-Vias
Staggered Micro-Vias
Thin Lines & Spacing
ITAR / Military
13
MANUFACTURING PROCESS CAPABILITIES
Category Description Sym. Capability
1. Microvia Diameter 1.1
Microvia Diameter at Target Land
A
100 um
0.004
1.2
Microvia Diameter at Capture Land
B
125 um
0.005
1.3
Microvia Target Land Size
C 0.012
1.4
Microvia Target Land Size
D
450 um
0.0177
2. Stagger & Stack 2.1
Min. Staggered Via Pitch
Staggered Via Pitch
A
560 um
0.022
2.2
RCC Thickness
RCC
B
50 um
0.002
2.3
Blind Via Layers
N 2
3. Material & Construction 3.1
Finished Board Thickness
H 0.012 - 0.250
3.2
Min. Inner Layer Thickness
H1
0.075 mm
0.003
3.3
Min. Dielectric Thickness
H2
0.05 mm
0.002
3.4
Max. Inner Layer Copper
T1 10 oz
3.5
Max. Outer Layer Copper
T2 6 oz
4. Warp
4.1
Warp and Twist (Max.)
A B < 0.75%
5. Pad 5.1
Min. Finish Hole Size
H 0.005
5.2
Min. Land Size
H 0.018
5.3
Min. Annual Ring for Via
R1 IPC Class 2
5.4
Min. Annual Ring for Component
R1
0.05 mm
0.002, provided
designed per IPC
14
6. Drill
6.1
Tolerance for PTH Hole
A
0.08 mm
0.003
6.2
NPTH Hole Tolerance
B
0.05 mm
0.002
7. Registration for S/M
7.1
Registration for S/M to Pattern
S1-S2 0.0024
7.2
Registration for Legend to S/M
NA 0.005
8. Registration for Drill
8.1
Registration for Drill to Inner Layer
S
0.075 mm
0.003
8.2
Registration for Drill to Datum
S
0.05 mm
0.002
8.3
Registration for First Drill to
Second Drill
NA 0.005
9. Registration for Layers
9.1
Layer to Layer for 4 layers
S
0.08 mm
0.003
9.2
S
0.10 mm
0.004
9.3
S
0.13 mm
0.005
10. Line Width
10.1
I/L Min. Width (0.5 oz)
W2 0.003
10.2
O/L Min. Width (0.5 oz)
W1 0.003
15
11. Line Space
11.1
I/L Min. Space
S2 0.003
11.2
O/L Min. Space (0.5 oz)
S 0.003
12. Drill Capability
12.1
Max. Aspect Ratio
(Board Thickness 0.063)
H/T 12.0
12.2
Min. Drill Hole Size
(Board Thickness 0.063,
After Plating)
H 0.0083
13. S/M Thickness
13.1
Max. Thickness on Copper
H1
0.025 mm
0.001
13.2
Max. Thickness at Shoulder
H2
0.0075 mm
0.0003
14. S/M Capability
14.1
Min. SMD Space for Dam
W2 0.0078
14.2
Min. Dam Size
W1 0.0003
15. Carbon Capability
15.1
Max. Contact Resistance
NA 30 / sq
15.2
Max. Primary Resistance
NA 30
15.3
Min. Thickness
NA 0.0004
15.4
Min. Space
A 0.015
15.5
Max. Space for Registration
B 0.007
16
16. HAL Capability
16.1
Board Thickness for HAL
H2
0.6 mm
0.0236
16.2
Min. Pad Width/Space for HAL
W
0.25 mm
0.0098
16.3
HAL Thickness for any point
H1
0.001 mm ~ 0.025 mm
40 micro-inch ~ 0.001
16.4
Thickness on QFP Pad
(0.05 Wide Quad)
A
0.015 mm ~ 0.030 mm
0.0006 ~ 0.0012
17. HAL Capability
17.1
Outline Tolerance-Punching
AB NA
17.2
Outline Tolerance-Routing
AB 0.005
18. Beveling Capability
18.1
Beveling Angle
B 200-600
18.2
Tolerance for Outline of Bevel
A + - 0.005
19. V-Cut Capability
19.1
V-Cut Angle V-Cut
C 30
19.2
Range of Board Thickness
H 0.030 ~ 0.125
19.3
Tolerance of V-Cut Residual
B
0.05 mm
0.003
19.4
V-Cut Off Line V-Cut
D
0.125 mm
0.005
17
20. Test Capability
20.1
Voltage
NA 5-500 VDC
20.2
Isolation
NA 500 M
20.3
Continuity
NA 20 ~ 100 K
20.4
Min. SMD PAD Pitch SMD
P
0.3 mm
0.0118
21. Impedance Control Capability
21.1
Impedance Control > 50
NA +/- 10%
21.2
Impedance Control < 50
NA +/- 10%
22. Differential Impedance Capability
22.1
Differential Impedance
Control > 50
NA +/- 10%
22.2
Differential Impedance
Control < 50
NA +/- 10%
22. Coplanar Impedance Capability
22.1
Coplanar Impedance
Control > 50
NA +/- 10%
22.2
Coplanar Impedance
Control < 50
NA +/- 10%
18
PCB PLUG VIA PROCESS
Epec offers a variety of printed circuit board manufacturing solutions for Plug Via Process requirements.
Whether you require vias flooded with mask, selective plugging in BGA areas, conductive and
non-conductive epoxy fill, or fully plugged and via in pad, we have you covered.
Our experienced engineering team will help you to get your product to market faster, while eliminating
delays and quality issues.
Feature Symbol
1.27mm/
50mils
1.00mm/
0.3937mils
0.8mm/
0.031496
Discrete
BGA Pad bp 24 19 14
BGA Mask Must Be Avoided Should Be Avoided Should Be Avoided Must Be Avoided Must Be Avoided
(Cu defned) bm bp+5 (4 min) bp+5 (4 min) bp+5 (4 min) pad+5 (4 min)
BGA Pad Dia. Dist. pd 70.71 55.67 44.54
Via Pad VP 22-25 22 20
Via Hole VH 10-12 10 8-10
Via Mask (Zit via) VM VH+5 (4 min) VH+5 (4 min) VH+5 (4 min)
BGA Mask Dam d 14.35-12.35 min 9.33-8.33 7.27-5.27
Via Button Print VB VH+15 (10 min) VH+15 (10 min) VH+15 (10 min)
d1 4 min
d2 10 min
* Based on 0.062 thick board, non solder mask defined BGA pads and plastic BGA packages.
* Cu defined pad infers no mask will be present on the capture pad.
d2
d1
VH VM VB VP
bp
bm
d
pd
19
ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)
The perfect electronic product device should be as small and light as possible, while containing the
maximum amount of electronic functionality and operating at the highest possible speed. To meet these
needs, the electronic packaging industry has been driven to develop more and more advanced packaging
methods, both by increasing the density of integrated circuits on a single PCB and also by combining
multiple functionalities into single, dense packages.
Increased package and interconnection density have driven the evolution of assembly methods from
through-hole technology (THT) to surface mount technology (SMT) and have led an increased use of wire
bonding to attach devices to PCB substrates. Decreased interconnect pitch and the use of chip scale
packaging (CSP) have enabled the increases in device density, while multichip modules (MCM) / system in
package (SiP) approaches have allowed integration of functionalities that would be difficult to produce on a
single wafer substrate.
When the semiconductor industry has concentrated for many years on increasing the performance of
devices by reduction in critical dimensions, until recently, there has been less consideration of the fact that
devices in an electronic system must communicate with each other through the packages that contain them.
Large I/O requirements and signal transmission quality have emerged as key considerations for the
semiconductor packaging industry, as have the assembly process requirements and the final finish of PCB
substrates used to achieve reliable interconnections both within IC packages and for the second level
packaging of devices onto PCB substrates.
The below describes the key factors affecting interconnection reliability, especially focusing on the
performance of finishes for gold wirebonding applications.
ADVANTAGES OF ENEPIG
The key advantages of ENEPIG, combining both excellent solder joint and gold wire bonding reliability can
be summarized in the following points:
"Black Nickel" free no possibility of grain boundary corrosion of nickel surface by immersion gold
Palladium acts as an additional barrier layer to further reduce copper diffusion to surface, thus
ensuring good solderability
Palladium completely dissolves into solder, without leaving an excessively high P% rich interface,
exposing an oxide-free nickel surface allowing reliable formation of Ni/Sn intermetallic
Withstands multiple lead-free reflow soldering cycles
Demonstrates excellent gold wire bondability
Process costs substantially lower than electrolytic nickel gold or electroless nickel electroless gold
Rohm and Haas Electronic Materials LLC is a global supplier of a comprehensive range of final finishes
including pretreatment chemistries, electroless nickel, electroless palladium and immersion gold and tin
products.
20
ENEPIG - SURFACE FINISH OPTIONS FOR WIREBONDING
While electrolytic nickel gold provides excellent gold wirebonding performance, it suffers from three major
deficiencies, each of which is a major barrier to its use in leading edge applications:
1. The process cost is high, driven by to the relatively high gold thickness required
2. At the higher gold thicknesses normally used, solder joint reliability may be reduced due to the
formation of tin-gold intermetallics. Should the finish be combined with a second final finish, more
suitable for soldering applications, additional costs from secondary imaging operations are
also incurred
3. The electrical bussing required to make connections to the features during the plating process limit the
feature densities that can be achieved
These limitations have provided an opening for electroless process options. These include electroless nickel
immersion gold (ENIG), electroless nickel electroless gold (ENEG) and electroless nickel electroless
palladium immersion gold (ENEPIG).
Of these three options, ENIG is not generally considered to have an acceptable process window for high
reliability gold wire bonding (although it has been used for some lower end consumer applications) and
ENEG suffers from many of the same process cost issues as electrolytic nickel gold, with additional
challenges from operating more complex electroless gold processes.
While electroless nickel electroless palladium immersion gold (ENEPIG) first emerged in the late 1990's,
its market acceptance was delayed by the very volatile price of palladium metal around 2000. However, in
more recent years, the market demand has shown strong growth as users have begun to appreciate the
potential of ENEPIG to address many of the new packaging reliability needs, while also meeting
lead free / ROHS requirements.
Apart from the advantage of packaging reliability, the cost of ENEPIG has now become a positive
consideration. With recent increases in the price of gold price to levels above US$800 per troy oz, the
production cost of electronic device that required thick gold electroplating becomes extremely difficult to
control. Since the cost of palladium metal (US$300 per troy oz) has remained relatively low in comparison
to gold, an opportunity for cost saving by replacement of gold with palladium is now available.
ENEPIG - COMPARISON OF FINAL FINISHES
In the existing market, there are 4 primary lead-free final finishes for PCBs which are suitable for assembly
of fine pitch QFP / BGA devices:
Immersion Tin
Immersion Silver
Organic Solder Preservatives (OSP)
Electroless Nickel Immersion Gold (ENIG)
21
ENEPIG - COMPARISON OF FINAL FINISHES (continued)
The table below shows a comparison between these four final finishes and ENEPIG. None of the four
primary final finish options is perfect for lead-free assembly, due to a variety of different concerns
including multiple reflow cycle capability, shelf life before assembly and wire bond capability. In contrast,
ENEPIG shows substantial advantages combining excellent shelf life, solder joint reliability, gold wire
bondability and usage as a contact surface.
The protection of the electroless nickel interface with the formation of a thin electroless palladium layer,
prior to immersion gold, eliminates the potential for excessive gold attack on the electroless nickel surface.
Characteristics OSP ENIG ENEPIG
Immersion
Silver
Immersion
Tin
Shelf Life
(Controlled Conditions)
< 12 Months > 12 Months > 12 Months < 12 Months 3 6 Months
Handling / Contact
With Soldering
Surfaces
Must Be Avoided Should Be Avoided Should Be Avoided Must Be Avoided Must Be Avoided
SMT Land
Surface Planarity
Flat Flat Flat Flat Flat
Multiple
Soldering Cycles
Fair To Good Good Good Fair To Good Fair To Good
No Clean Flux Usage
Pth/Via Fill
Concerns
No Concerns No Concerns No Concerns No Concerns
Solder Joint Reliability Good
Good Process
Control Required To Avoid
"Black Pad"
Good
Interfacial Microvoid
Concerns
Good
Gold Wire Bonding No No Yes No No
Electrical Test Probing
Poor,
Unless Solder Applied
During Assembly
Good Good Good Good
Corrosion Risk
After Assembly
Yes No No No Yes
Contact Surface
Applications
No Yes Yes No No
Total Coating
Thickness (Micron)
> 0.15
u 0.08 0.13
Ni 3.0 6.0
Soldering:
Au 0.03 0.05
Pd 0.05 0.1
Ni 3.0 5.0
Wirebonding:
Au 0.07 0.15
Pd 0.1 0.15
Ni 3.0 5.0
0.05 0.5 typical 1.0 1.1
When we consider the final finish performance in a variety of different assembly methods, it can be seen that
ENEPIG is suitable for a wide range of assembly requirements.
22
PCB DESIGN AND LAYOUT
At Epec, we specializes in high-performance Printed Circuit Board physical design (layout) utilizing high-end
software programs complemented by leading edge hardware.
Our Capabilities Encompass The Full Design Flow From Start To Finish Including:
Micro BGA / Micro Via / Blind & Buried Vias
Rules Driven Designs
Schematic Capture
Library Development
Database Construction and Verification
Signal Integrity/Design Verification
EMI Checking
Full Document Package Creation
We are fully licensed and utilize industry leading
tools, including Cadence Allegro, Mentor Expedition,
Mentors PADS, Altium, Valor for DFM Analysis.

We customize and develop software in-house to
improve quality and compliment our design tools.
ELECTRICAL ENGINEERING
We have the experience required to consistently meet the highest standards in the industry. Our experience
spans multiple market segments, including Telecom, Datacom, Computer & Storage, Medical,
Mil/Aero, Industrial, and consumer products.
Our expertise lies in High-Speed Circuitry Design up to 40GHz and Mesh Networking
(Optical: OC-48, OC-192, T1, E1, and Infiniband).
Other capabilities include Thermal Engineering, Signal Integrity Analysis, Software and Firmware Design,
including software integration and API design.
Digital/High-Speed and Analog Design Capabilities Include:
Circuit Design and Analysis
FPGA to ASIC Conversion
Component Analysis & Evaluation
Compliance and Value Engineering
Pulsed Circuits
Analog Circuit Simulation and much more!
Embedded Microprocessors & Chipsets for
Power PC, Intel x86, TI DSP, Mellanox, Broadcom
and various other chipsets used in Server, Telecom,
Industrial, and Commercial market segments
23
MECHANICAL ENGINEERING
Our Engineers have 30 years experience in Mechanical Engineering. We are capable of supporting any part
of the product lifecycle across multiple market segments. We utilize leading CAD platforms such as
AutoCAD Inventor, SolidWorks, and Pro/ENGINEER Wildfire.
Our Capabilities Include:
Packaging, Enclosure, and Industrial Design
Product/System Architecture
Detailed Mechanical Design
Stress Analysis (FEA) Shock/Vibration Simulation
Thermal Simulation
Material and Component Selection
Solid Modeling
PCB Linkage DFM / DFA & Cost reduction
PCB FABRICATION
For over 60 years Epec has been your reliable PCB manufacture. From prototype to production runs our
engineers can support you in all your PCB needs 24/7. Why look elsewhere, from the simplest single sided
PCB to HDI, sequential laminated multilayers with multiple blind and buried vias weve got you covered.
Via in pad, silver filled, copper filled, epoxy, conductive, non-conductive via fill, Aluminum, RF, ENEPIG, our
specialty is customer service. As we continue to expand our PCB supply chain we have one goal in mind,
to provide our valued customers what they need when they need it. Supporting domestic 1, 2, 3 day quick
turns, 5 day turns from Asia and our guarantee to satisfy.
PCB FABRICATION
Our SI experts have years of experience in pre-design and post-design verification and analysis. This
experience and expertise, combined with powerful state-of-the-art software, helps ensure your design will
work the way you expect it to the first time and all the time. Although we can customize services to meet
your unique needs, we have included a list below of the services we provide.
Capabilities Include:
Up Front SI Risk Analysis
Pre and Post Route Simulations
Frequency Domain & Time Domain Modeling
3D Via Field Modeling and Optimization
Optimization of AC Coupling Cap Launches
Optimization of Connector Launches
Infiniband, PCIe (Gen 1 & 2), XAUI link Analysis
IEEE 802.3ap KR Compliance to 10 Gbps
StatEye Time Domain Analysis
DDR2 and DDR3 Optimization
Crosstalk and Timing Analysis
Detailed SI CAD Guidelines Generation
Real Time SI Support Throughout the CAD Layout Process
Epec Can Provide:
Concept Sketches/Rendering
Product Specifications
Mock Ups
3D Rendering
Full Documentation
24
ITAR COMPLIANT
What is ITAR?
The International Traffic in Arms Regulations (ITAR) is a set of regulations that govern
the export and re-export of certain controlled commodities, services, and, most
importantly, technologies. In order to be controlled under ITAR as a defense article,
a given component, subcomponent, part, assembly, subassembly, or integrated
system must have been specifically designed, developed, configured, adapted,
or modified for a military application controlled under the United States Munitions List.
It also restricts sensitive information and technologies to only to be shared with US Citizens unless
special approval is granted. In summary, this regulation makes sure that anything to do with US proprietary
defense secrets are not shared with anyone that our government has deemed not authorized to see or be in
possession of. Including non-US citizens in the US.
ITAR Compliance vs. ITAR Registered
ITAR requires that any person (company) who engages in the business of manufacturing defense articles or
furnishing defense services is required to register and keep their registration current with the United States
Department of State. Epec Engineered Technologies is registered with the Department of State.
Many companies claim that they are ITAR compliant, but havent taken the proper steps to register with the
Department of State. If you manage ITAR materials, it is your responsibility to assure that all of your
suppliers have the proper registrations and follow the ITAR procedures. The Department of State interprets
and enforces ITAR. Its goal is to safeguard US national security and further US foreign policy objectives.
Epecs ITAR Commitment
Being a global manufacturer of build to print products, ITAR compliance requires a significant commitment
from management and a substantial investment in systems. Epecs management has committed by
investing in separate and secure IT resources that ensure that all of our ITAR data is stored in a manner that
far exceeds the ITAR requirement.
Epecs ITAR PCB Manufacturing
Because our roots are in PCB manufacturing, we have traditionally focused most of our ITAR work in printed
circuit boards as printed circuit boards fall under Item 14-Category II of the United States Munitions List. Our
factory located in Detroit, MI focuses solely on quick turn, ITAR and military work. This focus has allowed us
to be profitable and to invest in the right equipment and people to allow us to exceed our customers
expectations.
Understanding ITAR & Your Supply Chain
Epec has long been an industry leader in supply chain management and we have used our many years of
experience to develop processes and procedures that assure ITAR compliance today and well into the
future. As a company that deals in ITAR articles it is our responsibility to make sure that all of our
subcontractors, employees, directors and sales representatives understand the compliance is not optional.
Our auditing process allows us to systematically check all of the effected parties to assure compliance. This
is another way that we add value to our customers.
25
ITAR COMPLIANT (continued)
What happens if you are not in compliance with ITAR?
The Arms Export Control Act (AECA) provides for criminal penalties of up to 10 years in prison and
$1 million in fines for each violation. In addition, the AECA provides for civil penalties of up to $500,000 per
violation and debarment from future exports. In FY 2006, law enforcement agencies initiated criminal actions
pursuant to the AECA and International Traffic in Arms Regulations (ITAR) that resulted in 119 arrests, 92
indictments and 60 convictions.
Epec is serious about ITAR
We spent over 7 months reviewing and developing our ITAR management plan to assure that we did not
miss any of these details.
INVENTORY STOCKING SOLUTIONS
Epec offers its customers a variety of customized stocking and consigned inventory management programs
that support their individual logistic objectives. There are 4 Main Inventory Programs that Epec utilizes, and
each is customized to your particular objectives.
Owned Inventory: Customer places an order with Epec, we will bring the product into our inventory
until you require it. We will ship based upon your delivery requirements, and invoice with the shipment.
Consigned Inventory: Placing finished goods in the hands of the customer, but Epec retains
ownership until the goods are used. Can be invoiced weekly or monthly.
Kanban Inventory: Customer provides Epec with a forecast for us to build to. Customer then pulls
from Inventory and will be billed upon the pull. Epec will then replenish inventory based on the
next forecast.
Blanket Orders: Customer places an order with Epec that contains multiple delivery dates, scheduled
over a period of time, at predetermined pricing. Having a blanket order saves the customer from
holding large inventories and avoids the administrative expense of processing frequent purchase
orders, while favoring discount pricing through volume commitments.
Each of the inventory programs has a different level
of cost associated with increased operating
expenses and working capital requirements.
Epec is one of the few companies in the industry
with the financial capability to offer the flexibility
of inventory management programs.
It is our goal to help our customers create a
competitive advantage for themselves by
improving product lead times while at the same
time reducing inventory requirements.
26
ADDITIONAL ENGINEERED PRODUCTS
USER INTERFACES
Membrane Switches
Rubber Keypads
Touch Panels
Tactile & Non-Tactile
Keyboard Assemblies
LEDs, Cutouts & Display Windows
GRAPHIC PRODUCTS
Overlays & Faceplates
Roll Labels
Rigid Metal Nameplates
Serial Number Tags
Barcode & QR Codes
Printed Cut Plastic
Urethane Doming
Digital & Screen Printing
FANS & MOTORS
AC/DC Axial Fans
Motorized Impellers
Industry Leader in Electronically
Commutated Motors
CUSTOM BATTERY PACKS
Industry Leading Design Team
NiMH, NiCH & Sealed Lead Batteries
Li-Ion, Li-Pol & LFP
Smart Battery Technology
Custom Enclosures
IATA, DOT & UL Testing
Battery Chargers
FLEXIBLE & RIGID FLEX PCBS
Prototype, Low-High Volume & Roll to Roll
Polyimide & Polyester Materials
IPC 2223C Constructions
Coverlay & Flexible Soldermask
Stiffeners, PSAs & Strain Reliefs
Controlled Impedance & Shielding
Design & Gerber Layout Support
RIGID PRINTED CIRCUIT BOARDS
Leader in Quick-Turn PCB's
Up to 18 Layers
Fine Lines & Spaces
Heavy Copper
Thermal Clad
Many RoHS and
RF Materials
Blind & Buried Via's
Controlled Impedance
Visit Our Website @ www.epectec.com
AMERICA'S OLDEST. A HISTORY OF INNOVATION.
CONTACT US
The 60-year story of Epec is connected to the development of the PCB and the electronics industry.
Epec, through the merger of Electralab and Printed Electronics Corp
(EPEC), are proudly two of the five founding members of the IPC,
the 2,900 member trade association supporting the $1.5 trillion
global electronics industry.
From pioneering innovation in the PCB Industry with R & D,
training and setting professional core values, the legacy of
Epec has now passed to a new generation of very bright
young people, but still continues the great
tradition of imagination.
In incubating new technologies, the Epec team continue
breaking new frontiers in engineering, and enjoying
exponential growth in related sectors of electronics, with
custom battery packs, membrane switches,
rubber keypads, and EC fans and drives.
Our knowledgeable staff has many years of experience in the industry.
We welcome the opportunity to put our skills to work for you!
Please contact us with any questions or requests.
North American Headquarters
174 Duchaine Blvd.
New Bedford, MA 02745
Toll Free: (888) 995-5171
Tel: (508) 995-5171
Fax: (508) 998-8694
Contact Us By Email:
Sales sales@epectec.com
Quotes quoting@epectec.com
Engineering engineering@epectec.com
Quality quality@epectec.com
Stay Connected with Epec Engineered Technologies
Join our Social Community and keep in touch with all our latest
technology investments, current news, upcoming events, and promotions.
Visit our Social Media Websites for more information.

Engineering Guide Printed Circuit Boards

Uploaded by

Document Information

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Engineering Guide Printed Circuit Boards

Uploaded by

Copyright:

Available Formats

Delivering Quality Since 1952.

TECHNICAL ENGINEERING GUIDE

You might also like