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1 s2.0 S0378779614001758 Main
1 s2.0 S0378779614001758 Main
1 s2.0 S0378779614001758 Main
3V
aco
sin
_
t + +
6
_
v
BC
(t) = v
BOref
(t) V
COref
(t) =
3V
aco
sin
_
t +
2
_
v
CA
(t) = v
COref
(t) V
AOref
(t) =
3V
aco
sin
_
t + +
5
6
_
(2)
Based on Fig. 2, expressions (3)(5) describe the DC gain, mod-
ulation index, and instantaneous gain respectively.
G
dc
=
V
dco
V
dc
(3)
M =
V
aco
V
aco
=
V
aco
V
dco
V
dc
=
V
aco
V
dc
_
1
G
dc
1
_
(4)
g
ac
(t) =
v
AO
(t)
V
dc
=
V
dco
+V
aco
sin(t +)
V
dc
(5)
where,
V
aco
is the highest possible magnitude of the converter out-
put voltage. Substituting from(3) and (4) into (5), an expression for
the instantaneous AC gain is given in (6). The maximum value of
Fig. 2. Output voltage parameters.
14 A. Elserougi et al. / Electric Power Systems Research 116 (2014) 1223
(a) (b) (c) (d)
0.98 0.985 0.99 0.995 1
100
150
200
250
300
350
400
time, s
V
A
O
r
e
f
,
k
V
0.98 0.985 0.99 0.995 1
0.4
0.5
0.6
0.7
0.8
time, s
D
1
D
max
0.98 0.985 0.99 0.995 1
-1500
-1000
-500
0
500
1000
1500
2000
2500
time, s
i
L
1
,
A
I at D
max
I
Lmax
0.98 0.985 0.99 0.995 1
100
150
200
250
300
350
400
time, s
V
A
O
,
k
V
Capacitor
voltage peak
Fig. 3. Variationof duty cycle, inductor current, capacitor voltage withthe variationof reference voltage (a) reference voltage, (b) duty cycle of the converter, (c) corresponding
inductor current, (d) corresponding capacitor voltage.
instantaneous AC gain is given by (7). This expression is an impor-
tant design factor when considering switch rating selection.
g
ac
(t) = G
dc
+(MG
dc
M) sin(t +) (6)
g
ac
= G
dc
(M+1) M (7)
2.2. Selection of BI-HVDC parameters
Selection of BI parameters (inductors, capacitors, and switch-
ing frequency) is an important design consideration. Inductors are
designed to ensure continuous conduction while maintaining a
desired current ripple content. Capacitors are selected to limit the
output voltage ripples. Finally, the switching frequency is selected
based on the required converter rating and semiconductor device
type [15]. As in other high power applications, low switching fre-
quency is a design constraint in HVDC systems.
For an HVDC system with a DC-link voltage (V
dc
) of 100kV, an
output AC voltage reference (V
aco
) of 100kV, an output DC com-
ponent (V
dco
) of 250kV, a 1.5kHz switching frequency, 100mH
inductors, 10F capacitors, and an AC load of 200 per-phase.
The per-phase variation of the boost converter duty cycle, inductor
current, and capacitor voltage with the variation of the converter
output voltage reference is shown in Fig. 3. Based on Fig. 3, the duty
cycle is continuously changing to generate the desired variation in
the output voltage. With the variation of duty cycle, the inductor
current andits ripple magnitude are changing. The inductor current
reaches its peak (I
Lmax
) at the instant of the maximum duty cycle
(D
max
). It is clear that the highest current ripple magnitude (I)
occurs at the instant of D
max
which is expected from the DCDC
boost converter principles.
The inductor can be selected to meet the required design speci-
cations. At the instant of the inductor current peak (i.e. maximum
duty cycle), its value is given by (8) assuming negligible losses;
I
L max
=
v
c
I
gph
V
dc
(8)
where, v
c
is the peak of the capacitor voltage, and
I
gph
is the peak
of the grid current.
From DCDC boost converter principles, the expression for
peak-to-peak inductor current ripple at the instant of maximum
dutycycle is givenby(9); where L is the boost converter inductance,
f
sw
is the switching frequency, and D
max
is given by (10).
I|
Dmax
=
(V
dc
)D
max
Lf
sw
(9)
D
max
= 1
V
dc
v
c
(10)
Thus, a suitable inductor can be selected for a desired switching
frequency (f
sw
) and desired level of inductor current ripples. Practi-
cally, inductor current ripple is chosen lower than (I
Lmax
) to ensure
operating in continuous current mode.
Based on Fig. 3, the capacitor voltage and its ripple magnitude
are changing with the variation of duty cycle. Since the capaci-
tor voltage reaches its peak ( v
c
) at the instant of maximum duty
cycle (D
max
), the highest capacitor voltage ripple (v
C
) occurs at
this instant as well; i.e. the output voltage ripple is given by (11),
where C is the boost converter output capacitance.
v
C
=
D
max
I
gph
Cf
sw
(11)
For a desired switching frequency and desired level of output
voltage ripples, a suitable capacitance (C) can be selected.
2.3. Control system
Each boost DCDC converter is controlled to ensure robust per-
formance at different operating points. Sliding mode control of the
single-phase BI is proposed in [15]. Another control strategy for
the single-phase BI has been proposed in [16], in which each DC-
to-DC boost converter is controlled by a double-loop regulation
scheme using proportional-integral controllers (PI). The control
scheme consists of an inductor current control inner loop and an
output voltage control outer loop in order to cope with the vari-
able operating point conditions and to achieve a high robustness
to both input voltage and output current disturbances. In [17],
a proportional-resonant (PR) controller is employed instead of a
proportional-integral (PI) controller in the double loop-regulation
scheme. The PR controller has the ability to minimize the draw-
backs of the PI alternative, and enables tracking a sinusoidal
reference with zero steady-state error and high disturbance rejec-
tion capability [17].
The double-loop regulation scheme for the proposed three-
phase grid-connected BI is shown in Fig. 4. The outer loops
controllers are the conventional PQ closed loop controllers which
determine the AC voltage reference of the inverter. The boost
inverter controllers are based on double loop control (controlling
inductor current, and capacitor voltage) which is familiar in DCDC
converters controllers.
Based on Fig. 4, the grid voltages and currents are measured to
estimate grid active power, grid reactive power, grid voltage peak,
and grid voltage orientation (t). The inverter can operate under
A. Elserougi et al. / Electric Power Systems Research 116 (2014) 1223 15
Fig. 4. Grid-connected three-phase BI (a) topology and (b) control system.
DC voltage control or active power control via a selector. If DC volt-
age control mode is selected, the DC-link voltage is measured and
compared with the reference DC voltage (V
*
dc
), then the voltage
error is fed to a proportional integral (PI1) controller to generate
the suitable phase difference () between the inverter and grid vol-
tages. Similarly, if active power control mode is selected, the active
power reference is compared withgrid active power, and the active
power error is fed to a PI controller (PI2) to generate the suitable
(). On the other hand, the reactive power reference is compared
with grid reactive power, and the reactive power error is fed to
PI controller (PI3) to generate the suitable voltage difference (V)
betweeninverter andgridvoltages. This voltage difference is added
to grid peak voltage to obtain the suitable AC voltage magnitude
at the inverter output (V
aco
). Then, based on Eq. (1), the reference
output voltage of each DCDC boost converter can be simply gen-
erated (V
AO ref
, V
BO ref
, and V
CO ref
). The capacitor voltages (V
AO
, V
BO
,
and V
CO
) are controlled to track these voltage references using PI
controllers (PI4, PI6, and PI8) which generate the reference capac-
itor currents (i*
1
, i*
2
, and i*
3
). Based on these current references
and the measured grid current (i
g1
, i
g2
, and i
g3
), the inductor cur-
rent references (i
L1
, i
L2
, and i
L3
) can be estimated using Kirchhoffs
current law. Finally, the inductor currents are also controlled by PI
controllers (PI5, PI7, and PI9) which generate the inductor voltage
references (V*
L1
, V*
L2
, and V*
L3
), then based on Kirchhoffs voltage
law, these reference voltages can be used to estimate the suitable
instantaneous duty cycles for each DC-to-DC converter (D
1
, D
2
, and
D
3
). The duty cycle signals are compared with carrier waveforms to
generate gate pulses for the semiconductor devices (S
a
, S
a
, S
b
, S
b
,
S
c
, and S
c
). The frequency of these carrier waves is adjusted based
on the desired switching frequency. The use of shifted carriers is
preferred in order to reduce the inverter DC current ripples.
3. Mathematical analysis during DC side faults
3.1. DC fault blocking capability of BI-HVDC system
The BI-HVDC conguration inherently provides blocking capa-
bility of AC side contribution during DC side faults by inhibiting
its IGBTs gate pulses when DC side faults are detected. With all
IGBTs open, all freewheeling diodes are blocking the AC grid cur-
rent contributionto the DC side fault (all diodes are reverse biased),
as depicted fromFig. 5. The inverter output capacitors are seen as a
three-phasestar-connectedbalancedloadconnectedtotheACgrid.
Generally, the inverter output capacitors have small capacitance;
hence, grid current is limited after fault isolation to the capacitor
currents; i.e. the BI circuit topology provides a complete blocking
capability between the AC network and DC side fault which pre-
vents active power transfer betweenbothsides. The control system
should be modied to inhibit the IGBTs gate pulses after detecting
the DC side faults. This can be simply achieved by measuring the DC
link voltage of the BI. When the measured DC link voltage is lower
than a threshold level, the gate pulses are disabled.
3.2. Grid current under DC fault condition
The equivalent circuit on the AC side after inhibiting the gate
pulses of semiconductor devices is shown in Fig. 5. The capacitors
are seen by the grid as a star connected three-phase balanced load.
The grid current magnitude is given by (12), where r
T
and X
T
are
the resistance and leakage reactance of the interfacing impedance.
|I
g
ph
| =
|V
g
ph
|
_
r
2
T
+(X
T
X
c
)
2
(12)
Fig. 5. DC fault blocking capability of BI.
16 A. Elserougi et al. / Electric Power Systems Research 116 (2014) 1223
Hence, the active and reactive powers supplied by the AC grid
during the fault are given by (13) and (14) respectively.
P = 3|I
g
ph
|
2
r
T
(13)
Q = 3|I
g
ph
|
2
(X
T
X
c
) (14)
It is worthy to note that these power components account for
power inthe interfacingimpedances andthe inverter output capac-
itors. Although they have nonzero values, the generic assumed
blocking capability between the AC and DC sides is not violated.
3.3. DC fault current (capacitor discharge current)
The equivalent circuit of the DCside inthe BI-HVDCsystemafter
inhibiting the gate pulses is shown on the left side of Fig. 5. The DC
link capacitor is discharged into the DC fault (natural response)
without any contribution from the AC side. Applying Kirchhoffs
voltage lawon the DC side shown in Fig. 5 yields (15);
d
2
i(t)
dt
2
+
r
L
c
di(t)
dt
+
1
L
c
C
dc
i(t) = 0 (15)
where, r and L
c
are the resistance and inductance of the DC cable
from the inverter terminals to the fault, respectively. Taking the
Laplace transformof both sides of Eq. (15), the DC fault current in
the s-domain is as in (16);
I(s) =
sI
o
+(V
o
/L
c
)
(s
2
+(r/L
c
)s +(1/L
c
C
dc
))
(16)
where, I
o
and V
o
are the pre-fault DC link current and voltage
respectively. Accordingtothe systemparameters (r, L
c
, andC
dc
), the
natural response of the systemduring a fault may be over-damped
for (r >2
_
L
c
/C
dc
), critically-dampedfor (r = 2
_
L
c
/C
dc
) or under-
damped for (r <2
_
L
c
/C
dc
). Fig. 6 shows the dynamics of the DC
capacitor discharge current for different cases assuming I
o
=500A,
V
o
=400kV, cable length of 75km, C
dc
=1mF, r =133.33m/km,
and different values of L
c
(0, 0.1, 1, and 2mH/km). The total
resistance, r, will be 10 in all cases, while for the inductance
values (0, 0.1, 1, and 2mH/km), the 2
_
L
c
/C
dc
) term will be 0,
5.48, 17.3, and 24.5 respectively, i.e. over-damped condition is
conrmed in rst and second cases, while under-damped per-
formance is realized in third and fourth cases. In this paper,
the resistance of HVDC cables used in the simulation study is
more signicant than inductance, hence, over-damped response is
expected.
0 0.02 0.04 0.06 0.08 0.1
-10
0
10
20
30
40
time, s
D
i
s
c
h
a
r
g
e
c
u
r
r
e
n
t
,
k
A
L
c
=0
L
c
=0.1mH/km
L
c
=1mH/km
L
c
=2mH/km
C=1F, r=133.33m /km
Initial current
Fig. 6. Dynamics of DC capacitor discharge current.
4. Characteristics of the proposed BI-HVDC system
In this section, the selection of voltage and current ratings of
the employed semiconductor devices in the proposed BI-HVDC are
introduced.
4.1. Voltage rating of semiconductor devices
In the proposed BI-HVDC, six semiconductor devices are needed
with the voltage rating calculated as follows: for a peak grid phase
voltage of V
max
and a 1:1 transformer ratio, the peak of the AC com-
ponent of each DCDC buck-boost converter will be around V
max
.
The DC component of each converter is selected greater than or
equal to the summation of its AC component peak value and DC-
link voltage, i.e. the highest instantaneous voltage of the converter
output capacitor ( v
c
) will be around 2V
max
+V
dc
. Consequently, the
voltage rating of each device will be (2V
max
+V
dc
). Using the boost
converter input-output voltage relation, the DC-link voltage can be
given by (17).
V
dc
= (1 D
max
) v
c
=
2V
max(1Dmax)
D
max
(17)
Based on (17), the voltage rating of each semiconductor switch
will be given by (18),
voltage rating = (2V
max
+V
dc
) =
2V
max
D
max
(18)
It is obvious that the voltage rating of semiconductor devices
required in this topology is high compared to other existing topolo-
gies. Nevertheless, increasing the switchvoltage rating inreturnfor
the BI blocking capability of AC side contribution during DC side
faults may warrant interest.
In order to meet the required voltage rating, a large number of
series-connected IGBTs will be used. The main disadvantage of this
solution is the need for voltage balancing for the series connected
IGBTs due to mismatch in their characteristics. Instead of stack-
ing the IGBTs, the multi-module BI-HVDC conguration shown in
Fig. 7 can be used as an alternative. In the multi-module version
of the proposed boost inverter, the AC side is connected to the
multi-module three-phase boost inverter (n modules) through a
three-phase multi-open winding isolating transformer. Each mod-
ule consists of three single-phase boost inverters and its DC side
is connected to one of the DC-link capacitors (C
dc
). The DC-link
capacitors are connected together, as in Fig. 7, and the volt-
age of each capacitor is kept constant at (V
dc
/n) by employing
suitable voltage balancing technique. According to the available
voltage rating of semiconductor devices, the suitable number of
modules can be estimated. The voltage rating of semiconductor
device in this case is (2V
max
+V
dc
)/n. The multi-module concept
with its controllers has been presented in [18] but for buck-boost
conguration.
As another solution is decreasing the DC link voltage, which
helps inreducingthevoltageratingof thesemiconductor devices by
thedifferencebetweenoldandnewDCvoltagelevels. Themaindis-
advantage of lowering the DC link voltage for the same transferred
power is the increase in DC current consequently the transmis-
sion losses. This is limited by the current rating of the HVDC
system components. It is worthy to note that the transmission
loss problem is not relevant in the HVDC back-to-back congu-
ration since there is no need for the DC transmission cable in this
conguration.
A. Elserougi et al. / Electric Power Systems Research 116 (2014) 1223 17
Fig. 7. Multi-module three-phase BI-HVDC.
4.2. Current rating of semiconductor devices
In the proposed systemthe current rating of the semiconductor
devices is selected based on the inductor peak current which is
given by (19).
I
L max
=
_
I
gph
1 D
max
_
(19)
Based on (19), the current rating of semiconductor devices is
selected from(20);
current rating = i
L max
+0.5I|D
max
(20)
where, I|
Dmax
is the peak-to-peak inductor current ripple at max-
imum duty cycle, which is dependent on the boost converter
inductance and the switching frequency as in (9).
4.3. Optimummaximumduty cycle
Multiplying (18) and (19), the total VA rating of each semicon-
ductor switch is given by (21), assuming that the inductor is large
enough in order to obtain negligible current ripple.
VArating =
2
D
max(1Dmax)
V
max
I
gph
(21)
By differentiating the VA rating given by (21) with respect
to D
max
, the optimum maximum duty cycle, D
max-optimum
,
can be obtained as in (22); yielding an optimum duty cycle
D
max-optimum
=0.5
(VArating)
(D
max
)
=
2(1 2D
max
)
(D
max(1Dmax)
)
2
V
max
I
gph
= 0 (22)
Substituting (22) into (17), the optimumDC link voltage can be
obtained as in (23).
V
dcoptimum
= 2V
max
(23)
4.4. Efciency of the proposed systemcompared to other existing
topologies
4.4.1. Conduction losses
In this section the efciency of the proposed BI-HVDC is com-
pared with the most common HVDC converters such as the 2-level
VSC, half-bridge MMC (HBMMC), and full-bridge MMC (FBMMC).
Generally, the conduction losses of any semiconductor device are
given by (24);
P
c
= I
ave
V
on
+I
2
rms
R
on
(24)
where, I
ave
and I
rms
are the average and root mean square cur-
rent of the semiconductor device, V
on
is the on-state voltage
of semiconductor device, and R
on
is the on-state resistance of
semiconductor device. To study the efciency of the proposed
converter and compare it with other existing HVDC convert-
ers, an IGBT with data shown in Table 1 is used as a building
block for all required switches in the different types of HVDC
converters.
For an HVDC system with DC-link voltage of 400kV, peak grid
voltage, V
max
, of 200kV, peak AC output current, I
max
, of 2kA, load
power factor of 0.95 lag, and a 1:1 transformer ratio; each type
of HVDC converter will need a certain number of IGBTs connected
in series/parallel combinations to build one switch. The required
IGBTs for each switch in each topology are given in Table 2 in
addition to the corresponding equivalent on-state resistance and
voltage per equivalent switch.
Models of the four topologies have been tested assuming the
above mentioned data. The current of each equivalent switch and
diodearemeasuredandtheir correspondingaverageandroot mean
square values are obtained to calculate the conduction losses. The
estimated conduction losses as a percentage of total transferred
active power for the 2-level VSC, 3-level HBMMC, 3-level FBMMC,
and proposed converter are summarized in Table 3. It is clear that
the proposed converter has slightly higher conduction losses com-
pared to other congurations.
Table 1
Parameters of available IGBT.
Voltage rating 4kV
Current rating 1kA
RonT (for IGBT) 1m
RonD (for freewheeling diode) 2m
VonT (for IGBT) 1.2V
VonD (for freewheeling diode) 1V
18 A. Elserougi et al. / Electric Power Systems Research 116 (2014) 1223
Table 2
Parameters of equivalent HV switch for different types of HVDC converters based on the available IGBT.
Type Available IGBT 4kV, 1kA Vmax =200kV, Imax =2kA, 0.95 power factor lag
2-level VSC 3-level HBMMC 3-level FBMMC Proposed Converter at
(Dmax =0.5)
V
dc
400kV 400kV 400kV 400kV
No of needed switches 6 24 48 6
Voltage rating of each switch 400kV 200kV 200kV 800kV
Current rating of each switch 2kA 2kA 2kA 4kA
No of series connected IGBTs to withstand the voltage level 400kV/4kV=100 200kV/4kV=50 200kV/4kV=50 800kV/4kV=200
No of parallel IGBTs strings to withstand the current level 2kA/1kA=2 2kA/1kA=2 2kA/1kA=2 4kA/1kA=4
Total No. of IGBTs per switch 200=1002 100=502 100=502 800=2004
RonT per SW 50m 25m 25m 50m
RonD per SW 100m 50m 50m 100m
VonT per SW 120V 60V 60V 240V
VonD per SW 100V 50V 50V 200V
Table 3
Estimated converters losses when delivering 600MVA, at 0.95 lagging power factor.
Converter type 2-level VSC 3-level HBMMC 3-level FBMMC Proposed converter
Conduction losses (Based on
the data shown in Table 2)
0.143% 0.14% 0.302% 0.391%
Switching losses 0.4% at fs =1kHz 0.16% at fs =400Hz 0.7% at fs =1kHz
The main advantage of this type of converters that it can
operate with reduced switching frequency
4.4.2. Switching losses
Switching losses are mainly dependent onthe appliedswitching
frequency, the voltage level, and the current level. The switching
losses per switch, P
sw
, can be approximately given by (25),
P
sw
=
_
m
k=1
0.5(I
x
k
V
x
k
t
on
+I
y
k
V
y
k
t
off
)
_
f
o
(25)
where,
t
on
is the switch turn-on time.
t
off
is the switch turn-off time.
V
x
k
, andI
x
k
aretheoff-stateswitchvoltageandtheon-statesteady
stateswitchcurrent respectivelyat thebeginningof current pulse
number (k) where k =1, 2, . . ., m.
I
y
k
, and V
y
k
are the on-state switch current and the off-state
steady state switch voltage respectively at the end of current
pulse number (k) where k =1, 2, . . ., m.
f
o
is the fundamental frequency of the AC output voltage.
The simulation model of the proposed system can be used to
record the voltages and currents of each switch. For given turn-on
and turn-off times, Eq. (25) can be used to get the switching losses
per switch, and hence total switching losses can be estimated.
In the HVDC systemwith the same data used in calculating con-
duction losses, turn-on time of 1s, and turn-off time of 1s; the
estimated switching losses for the proposed topology and the other
HVDC converters are given in Table 3. It is clear that, the proposed
converter will have the lowest efciency.
4.4.3. Inductors losses
Copper losses in the inductors are another type of losses in the
proposed converter as well as modular multilevel converters. It can
be simply calculated by multiplying the square of rms value of the
inductor current and the inductor internal resistance.
Since the inductors are carrying high currents, their internal
resistances will be low (i.e. negligible internal resistances). As a
result, the inductor losses will be insignicant compared to other
types of losses.
5. Comparison between BI-HVDC and other existing
topologies
Table 4 shows a comparison between ratings and character-
istics of the most common HVDC converters such as the 2-level
VSC, m-level half-bridge MMC (HBMMC), m-level full-bridge MMC
(FBMMC), and the proposed converter (assuming a unity load
power factor, a unity modulation index, and a unity transformer
turns ratio).
Referring to Table 4, although the total VA rating of the semi-
conductor devices of the proposed converter is relatively high, and
its efciency is the lowest efciency among the other HVDC con-
verters, it offers, in addition to blocking the contribution of the AC
grids to the DC side faults, other desirable benets such as provid-
ing a pure sinusoidal output which eliminates the common mode
voltages, and reduces the dv/dt of the output voltage which avoids
local overstressingof thetransformer insulation. Theproposedcon-
verter andfull-bridgeMMC haveverysimilar semiconductor device
total VArating and both are able to block DC fault current. The main
advantages of the proposed converter over the FBMMC are: lower
dv/dt, and no need for voltage balancing.
6. Simulation and discussion
The block diagram for the simulated HVDC system is shown in
Fig. 8. In this system, inverter 1 operates in active-reactive power
control mode while DC voltage control mode is applied to inverter
2. For simplicity, AC system 2 and its inverter are modeled as a
constant DC source of 400kV. Two different simulation models
have been built. The rst uses the conventional 2-level VSC con-
guration (for Inverter 1) and the second uses the proposed BI
conguration. The main target is to investigate the performance
of the proposed conguration during normal operating conditions
and compare between the dynamic performances of each type dur-
ingDCfault conditions toillustrate the effectiveness of the BI-HVDC
during DC side faults.
The parameters of an HVDC system are given in Table 5. Based
on the desired switching frequency, inductor current ripple, and
capacitor voltage ripple, the boost converter inductance and capac-
itance are selectedas follows: for 200MVA ratedpower, and180kV
A. Elserougi et al. / Electric Power Systems Research 116 (2014) 1223 19
Table 4
Comparison between various types of HVDC converters.
Point of view Type
2-level VSC m-level HBMMC m-level FBMMC Proposed converter
(at Dmax =0.5)
Ratings of converters components
Switches
Number of switches 6 12(m1) 24(m1) 6
Voltage rating per switch 2Vmax 2Vmax/(m1) 2Vmax/(m1) 4Vmax
Current rating per switch Imax 0.75Imax
=(Imax) 0.75Imax
=(Imax) 2Imax
DC-link capacitors
Number of DC-link capacitors 1 6(m1) (one/sub-module) 6(m1) (one/sub-module) 1
Voltage rating 2Vmax 2Vmax/(m1) 2Vmax/(m1) 2Vmax
Filter capacitors
Number of capacitors 3 3 3 3
Voltage rating Vmax Vmax Vmax 4Vmax
Filter inductors
Number of inductors 3 3 3 3
Current rating Imax Imax Imax 2Imax
Characteristics
Arminductors No need Sixarminductors areneededtolimit circulatingandfault currents No need
DC blocking capabilities No No Yes Yes
Common mode voltages Yes Yes Yes No
dv/dt for output voltage Highest Low Low Lowest
Requirements for voltages balancing technique No Yes Yes No
Efciency Highest Lowest
Fig. 8. Description of simulated practice case study.
peak grid voltage, the corresponding peak grid current will be
approximately 750A. From (8), the inductor peak current at rated
conditions will be approximately 1500A assuming that the capac-
itor peak voltage is 800kV (i.e. D
max
A).
Fig. 12c shows that the grid voltage appears across the BI ter-
minals after applying the fault due to the blocking capability when
the IGBT gate pulses are inhibited. Fig. 12d shows that the DC link
voltage of inverter 1 decreased to zero after fault initiation. Fig. 12e
shows the DC fault current contribution. The peak capacitor dis-
charge current reaches 40kA, andthendecays to a zero steady state
value due to the blocking capability of this converter. As a result,
the DC circuit breaker associated with the BI topology will be sim-
ple and can disconnect at zero current crossings to clear the fault.
Finally, Fig. 12f shows the variation of boost converter capacitor
voltage, it is clear the capacitor voltage is positive for a long dura-
tion which reverse biases all diodes and blocks the AC grid current
contribution in DC-side fault.
6.2. VSC-HVDC simulation results (DC side fault)
To compare between the performance of the conventional 2-
level VSC and the proposed conguration during a DC side fault, the
same test fault is applied and the results are as shown in Fig. 13.
Fig. 13a shows the variationof gridactive andreactive power before
and after applying the DC side fault. It is clear that the active and
reactive powers increased after applying the DC fault due to the
rectication action of the freewheeling diodes in the VSC congu-
ration. In the proposed conguration the diodes are reverse biased
and the grid active power is limited to zero. Fig. 13b shows grid cur-
rent increasing to approximately 5kA due to the DC fault. Fig. 13c
shows the variation of per-phase inverter output voltage. It is clear
that the inverter voltage magnitude decreased signicantly due to
thelargeuncontrolledcurrent drawnfromthegridintotheDCfault.
Fig. 13d shows that the DC link voltage decreased to approximately
60kV (not to zero as in the proposed BI conguration). Finally,
Fig. 13e shows the DCfault current contribution. The peak capacitor
discharge current reaches 40kAas in the proposed BI conguration
because the initial discharge current is not affectedbythe converter
conguration but mainly depends on the DC-link capacitance and
DC cable parameters which are the same in both cases. After the
initial discharge, current decays with time and reaches to 5.8kA at
2 2.2 2.4 2.6 2.8 3
0
500
1000
1500
time, s
G
r
i
d
P
o
w
e
r
s
P(MW)
Q(MVAR)
2.45 2.5 2.55 2.6 2.65
-10
-5
0
5
10
time, s
G
r
i
d
c
u
r
r
e
n
t
,
k
A
2.45 2.5 2.55 2.6 2.65
-400
-200
0
200
400
time, s
I
n
v
e
r
t
e
r
v
o
l
t
a
g
e
,
k
V
(c) (b) (a)
(e) (d)
2.45 2.5 2.55 2.6 2.65
0
200
400
600
time, s
D
C
V
o
l
t
a
g
e
,
k
V
2.4 2.5 2.6 2.7 2.8 2.9
-40
-30
-20
-10
0
10
time, s
D
C
C
u
r
r
e
n
t
(
I
d
c
)
,
k
A
-450A
-40kA
-5.8kA
Fig. 13. Simulation results for DC-side fault in 2-level VSC-HVDC conguration.
22 A. Elserougi et al. / Electric Power Systems Research 116 (2014) 1223
(c) (b) (a)
1 2 3 4 5
200
250
300
350
400
450
time, s
D
C
V
o
l
t
a
g
e
,
k
V
2 3 4 5
0
50
100
150
200
250
time, s
A
c
t
i
v
e
p
o
w
e
r
,
M
W
2 3 4 5
-50
0
50
time, s
R
e
a
c
t
i
v
e
p
o
w
e
r
.
M
V
A
R
Fig. 14. Test of DC voltage controller, (a) DC-link voltage in kV, (b) injected grid active power in MW, and (c) injected grid reactive power in MVAR.
(b) (a)
1.36 1.37 1.38 1.39 1.4
-200
0
200
time, s
I
n
v
e
r
t
e
r
v
o
l
t
a
g
e
s
,
k
V
1.36 1.37 1.38 1.39 1.4
-1000
0
1000
time, s
G
r
i
d
c
u
r
r
e
n
t
s
,
A
Fig. 15. Effect of the output capacitors mismatch on the quality of the output AC voltages.
steady state (not to zero as in the proposed conguration); i.e. the
DC circuit breaker associated with the VSC topology will be more
complicated compared to the BI breaker.
6.3. Test of DC voltage controller in BI-HVDC
In this section, the DC voltage controller for the proposed topol-
ogy is tested. In this case, the converter was transferring 80MW
from the grid to the DC side (loading from the other converter),
then at t =2s the power is increased to 160MW. The correspond-
ing DC-link voltage, injected grid active power, and grid reactive
power at the converter at which the DC voltage control is applied
is shown in Fig. 14. It is clear that, the DC voltage is well regulated
and the grid is injecting the required amount of active power to
replenish the DC-link and maintain constant DC-link voltage.
6.4. Effect of the output capacitance variation on the inverter
output voltages
In this section, the effect of capacitors mismatch on the quality
of the three-phase inverter output voltages is tested. In this case,
the output capacitances are dened by 4.5F, 5F, and 5.5F to
emulate the mismatch between the capacitors. The per-phase out-
put voltages, and grid currents for this case are shown in Fig. 15
assuming same abovementioned converter parameters with con-
stant DC-link voltage of 400kV. The converter was transferring
200MWfromDC-side to its AC-side at unity power factor. It is clear
that, the voltage ripple ineachphase is different due tomismatchin
the capacitance, theses ripples are oscillating around same instan-
taneous average for all phases. These ripples will be damped and
will not appear on the grid current thanks to the ltration action of
the interfacing impedance as shown in Fig. 15, i.e. capacitors mis-
match has a negligible effect on the quality of the converter output
AC voltages.
7. Conclusion
This paper proposes a BI-HVDC system with blocking capabil-
ity of AC side contribution during DC side faults. The BI-HVDC
congurationprovides independent active andreactive power con-
trol in both directions. The main disadvantages of the proposed
topology are: (i) slightly lower efciency compared to existing
HVDC topologies due to higher conduction losses, and relatively
higher switching frequency. (ii) The requirement for semiconduc-
tor devices withrelativelyhigher voltage/current rating, andhigher
isolation requirements. The high voltage rating constraint can be
handled using the multi-module version of the proposed BI-HVDC
conguration where the series connection of IGBTs and their asso-
ciated problems can be avoided.
The main advantages of the proposed conguration can be sum-
marized as follows: