HFSS SolverOnDemand

HFSS for ECAD: HFSS for ECAD:
Package Package Modeling Modeling, ,

MMIC and on MMIC and on- -die die
extraction extraction
HFSS for ECAD: HFSS for ECAD:
Package Package Modeling Modeling, ,
MMIC and on MMIC and on- -die die
extraction extraction
Alain Michel Alain Michel Alain Michel Alain Michel
2010 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary 2010 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary
Alain Michel Alain Michel
Business Development Manager, Business Development Manager,
Electronics, Europe Electronics, Europe
Alain Michel Alain Michel
Business Development Manager, Business Development Manager,
Electronics, Europe Electronics, Europe
Introduction
HFSS Solver on Demand in Detail
Create a project from A to Z
Application
Agenda
2010 ANSYS, Inc. All rights reserved. 2 ANSYS, Inc. Proprietary
Application
Package and Board
MMIC application with UMS PH15 design kit
Integration in ECAD Flow: ECAD Translator
New Features in Designer 7.0
Conclusion
Introduction Introduction Introduction Introduction
MCAD (Mechanical Computer-Aided Design) vs.
ECAD (Electronic Computer-Aided Design)
HFSS application can be mostly split into two families:
Application originally designed with MCAD: Antennas,
Connector, Wave Guide, filters
Application originally designed with ECAD: PCB, RFIC,
Why HFSS in Ansoft Designer?
Application originally designed with ECAD: PCB, RFIC,
MMIC, Planar Antenna, Package
HFSS original GUI perfectly address MCAD
application needs
HFSS Solver on Demand provides a new interface
for ECAD application
Available with Ansoft Designer 6.0
2D layout design entry
Import from APD, ODB++
Full custom layout
Layers stackup definition
Easy of Use with setup automation
HFSS Solver on Demand Overview
Easily toggle between FEM and MOM solvers
Support scripted footprint
HFSS technology for reliable and accurate models
Adaptative meshing
3D Objects: wirebonds, arbitrary shaped vias
Finite dielectric
Support for multimoded wave ports and gap sources
HFSS Solver on Demand HFSS Solver on Demand
in Detail in Detail
HFSS Solver on Demand HFSS Solver on Demand
in Detail in Detail
Standard HFSS design entry uses 3D Object
HFSS in Designer combine 2D drawing with stackup
definition
Stackup Definition
+
=
Define port by selecting edge
Solver specific properties
HFSS gap or wave port available
Easy and Automated Port Setup
Size setup
Deembeding available
PEC launch allows wave port inside air box
Wave Port Setup
Radiation Boundary for air box
Dielectric size setup
Air box size setup
Boundaries Setup
Solution Frequency
Adaptive solution
Mixed order elements and
iterative solver available
HFSS Solution Setup
Rectangular, smith chart plots
Current, far and near field display
Meshing
Post-Processing
-25.00
-12.50
0.00
Y
1
Ansoft LLC spir2_20 S11_12_dB ANSOFT
Curve Inf o
S12_3D_HFSS
Setup HFSS_gap : Sweep 1
S11_3D_HFSS
2.00 4.50 7.00 9.50 12.00 14.50 17.00 19.50
F [GHz]
-37.50
5.00 2.00 1.00 0.50 0.20 0.00
5.00
-5.00
2.00
-2.00
1.00
-1.00
0.50
-0.50
0.20
-0.20
0.00
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
-170
-160
-150
-140
-130
-120
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
spir2_20 Smith Chart 1 ANSOFT
Curve Inf o
S(Port1,Port1)
-30.00
-25.00
-20.00
-15.00
-10.00
-5.00
0.00
Y
1
Ansoft LLC spir2_20 S11_12_dB ANSOFT
Curve Inf o
S11_3D_MoM
Setup 3DMoMedge : Sweep 1
S12_3D_MoM
Setup 3DMoMedge : Sweep 1
S12_3D_HFSS
S11_3D_HFSS
Spirale example
1 project 2 setup
2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 20.00
F [GHz]
-45.00
-40.00
-35.00
Package and Board Package and Board Package and Board Package and Board
From 2D to 3D
Finite dielectric definition in stackup
Use Bondwire type primitive
Padstack definition for BGAPad
Quick and easy port
setup
Display current
MMIC Package example
Display current
Current distribution
Package example
Stackup Parameterization
Bondwire
Via
Imported Package Example
Import from APD/Allegro
.mcm, .sip, .brd, .anx
Import stackup and bondwire profile
Setup solderball profile
Automatically port setup for pin
Cutout sub-design
Cutout sub-design
Package Cutout
Cutout region can either be auto generated or determined by user
Select signal, power and ground nets to create cutout
Cutout package portion
Original package layout
Package/PCB Merge
Copy package
Paste into PCB layout
Independent package and board stackup
Board
HFSS Solver on Demand
Final Model in Designer
Dielectrics not rendered
Lumped ports on
package bumps
Wave Port
on traces end
MMIC application MMIC application
with UMS PH15 with UMS PH15
design kit design kit
MMIC application MMIC application
with UMS PH15 with UMS PH15
design kit design kit
Provide UMS PH15 Design Kit with passive
component simulable with HFSS
Includes parameterized footprint for
MIM capacitor
Spirale inductor
UMS Partnership
Tan and TiWSi Resistors
Vias
Footprint are both valid for GDS export and
HFSS simulation
Technology file loads design kit components, layer
definition and stackup
Stackup is defined with regards to process technology
definition given by foundry
What is a Design Kit?
Create parameterized footprint
With respect to design rules defined
for manufacturing
With respect to physical design
used for HFSS simulation
Layer deposition
Air bridges
Challenge
Air bridges
.
Source UMS PH15 design guide
Shape of the same layer is drawn twice
User type for manufacturing (GDSII export)
Signal, dielectric or ground for HFSS simulation
Stackup definition validated with UMS
Automatically loaded with the technology file
Layer Definition
1.00
Cap_0_26pF_merge_nitride
Cap_value ANSOFT
Curve Inf o
cap_pf
Name X Y
m4 7.5000 0.2929
Good agreement with UMS model
Simulation results:
MIM capacitor 0.26pf
wint_um=28
lint_um=28.5
CapOnGrid_pF=0.263pF
Port1 Port2
0.00 5.00 10.00 15.00 20.00 25.00 30.00 35.00 40.00
F [GHz]
0.00
0.20
0.40
0.60
0.80
Y
1
m4
m5
m7
m6
cap_pf _UMS_Model
m4 7.5000 0.2929
m5 7.5000 0.2699
m6 30.0000 0.5092
m7 30.0000 0.4319
Name Delta(Y)
d( m4,m5) -0.0230
d( m6,m7) -0.0773
Spiral Inductor 1.91nh
Ldrawn=1.902nH
Port1
Port2
Ldrawn=1.902nH
Ndrawn=4
Longdrawn=1760um
1.00 6.00 11.00 16.00 20.00
F [GHz]
1.00
1.50
2.00
2.50
3.00
Y
1
Ansoft LLC Self_1_91nh
Ind_Value_zoom ANSOFT
Curve Inf o
ind_nh_HFSS
ind_nh_UMS_Model
-20.00
-15.00
-10.00
-5.00
0.00
Y
1
LPF
S Parameters ANSOFT
Curve Inf o
Simple LPF
0.00 10.00 20.00 30.00 40.00 50.00 60.00
F [GHz]
-45.00
-40.00
-35.00
-30.00
-25.00
Y
1
Curve Inf o
dB(S(Port1,Port1))
dB(S(Port2,Port1))
Coupling between components
No need of internal port
ECAD Translator ECAD Translator ECAD Translator ECAD Translator
What is ECAD Translator?
It offers direct import of Cadence
APD, SiP, Allegro, layout files without creation of an .anx file
Virtuoso with .anx file creation
Integrated in Designer
Must have Cadence installed
Support for ODB++
Common PCB Manufacturing format
Supported by Mentor, Zuken, Cadence, Altium
Cadence SPB Integration
Available through ECAD Translators
Create models in Cadence SPB that are ready for simulation using HFSS
Solver on Demand.
Cadence SPB Integration
View of the package in the Designer layout
editor after export from Allegro Package
Designer
Virtuoso Integration
User Interface for Solver on Demand model
creation in Virtuoso
Lumped ports (vertical and horizontal)
Simulation setup and sweeps
Improve storage of database for use with
other designs in the same CDN lib.
Simplify layer stackup
Cluster via arrays
Solver on Demand
Cluster via arrays
Virtuoso Layout
Setup for
Model Export
Layout Cell View Export Process
Open layout cell view in Cadence and
customized Ansys menu to load
cadence interface to export to HFSS
Load or define material to be used in
the stackup
Define and save stackup (only first
Define and save stackup (only first
time)
Define port
Create Flatten cell
Define Air Box size
Define HFSS setup
Export .anx file
Import .anx file using Ansoft Links from
Designer
Run simulation
Define Stackup
Add layer in stackup
Select from LSW Layers for
via and metal
Add dielectric
Specify thickness and
elevation
Merge operation (horizontal)
Metal
Dielectric
Combine operation (Vertical)
Metal
Dielectric
Stackup definition saved at
selected levels
Cell view
Design library
Reference library
Merge layer: Ground Pattern
example
Original cell with ground pattern Flattened cell with 0.5 um setting
Flattened cell with 1.1 um setting
Via Cluster
Original cell no via cluster Flattened cell with via cluster
Original cell no via cluster exported Flattened cell with via cluster
Original cell no via cluster exported
in HFSS Solver on Demand
Flattened cell with via cluster
exported in HFSS Solver on Demand
HFSS Setup
Define HFSS setup for
simulation
Mesh frequency
Frequency sweep
Order of basis functions
Iterative solver
Create project
Create project
Create an .anx file for
importing in Designer
HFSS Solver On Demand Project
Import from anx file automatically create project ready to solve:
Stackup definition created
Port setup
HFSS setup
Air Box defined
NET_A_LEFT NET_A_RIGHT
ODB++ Import
ODB++ Import via Designer Links
HFSS Solver On Demand HFSS Solver On Demand
Designer 7.0 Designer 7.0
HFSS Solver On Demand HFSS Solver On Demand
Designer 7.0 Designer 7.0
Layout Editor
One layout editor for 2D and 3D views
HFSS Setup Advanced Setting
Frequency dependent mesh
Convergence versus output variable
Parameterized Padstack
Target ECAD application
2D layout design entry
2D Layout + Stackup
Easy and quick setup of an HFSS project
HFSS technology for reliable and accurate models
Adaptative meshing
Conclusion
Adaptative meshing
3D Objects: wirebonds, arbitrary shaped vias
Finite dielectric
Support for multimoded wave ports and gap sources
ECAD Translator offers powerful link with EDA tool
Preparing model for electromagnetic simulation
Automates settings: ports, setup, boundaries ...
Thank you Thank you Thank you Thank you

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HFSS for ECAD: HFSS for ECAD:

Package Package Modeling Modeling, ,

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