Combined 123456

FACULTY OF SCIENCE BACHELOR OF SCIENCE (INDUSTRIAL CHEMISTRY)
UNIVERSITI TEKNOLOGI MALAYSIA SSU 2915

Chapter 1
INTRODUCTION TO THE COMPANY
UNISEM (M) BERHAD
1.1 COMPANY BACKGROUND
Figure 1.1: Photo of Unisem Company Figure 1.2: Logo of Unisem (M) Berhad
Unisem (M) Berhad, incorporated in the year of 1989 and commenced operations in 1992
as an independent subcontract integrated circuit (IC) pacaging and test house in Ma!aysia"
Unisem and its #ho!!y$o#ned subsidiary Unisem (%urope) &imited pro'ide fu!! turney so!utions
to the customers" (hose turney so!utions inc!uded #afer grinding, pacaging and testing of ICs,
1
tape and ree!, and drop ship ser'ices and no#, Unisem is a !eading semiconductor pacaging and
test ser'ices pro'ider in Ma!aysia"
)'er the years Unisem has in'ested more than *M1"2 bi!!ion in !and, bui!ding, and p!ant
and machinery" )perating from its factories (+hase I, II and III) in +u!ai ,aya, Ipoh, Unisem has a
current staff strength of about -... peop!e" (he factories, #ith a tota! bui!t$up area of about
/0.,... s1uare feet, are erected on a 1/$acre site" 2o#, Unisem has more than one mi!!ion s1uare
feet of IC pacaging and testing manufacturing space in Ipoh, Ma!aysia, 3a!es, United 4ingdom
and Chengdu, +eop!e5s *epub!ic of China and a!so consists 2.,... s1uare feet of #afer bumping
faci!ity in Ipoh, Ma!aysia"
Unisem (%urope), #hich first commenced production in mid$1990, current!y offers high$
end radio fre1uency and high$end mi6ed signa! test ser'ices and offers a se!ect range of ad'anced
pacages" Unisem (%urope) has staff strength of about 27. and operates from a pacaging and test
faci!ity #ith a tota! bui!t$up area of about 18.,... s1uare feet in 3a!es, United 4ingdom" Unisem
announced it #ou!d be pro'iding semiconductor pacaging and testing ser'ices in Chingdu, at year
2..-, this represents an opportunity for Unisem to position itse!f in China"
(ogether #ith Unisem (%urope), Unisem has the capabi!ity of pacaging and testing a #ide
range of !ead frame and substrates pacages, #hich are e6pected to remain as the most cost$
effecti'e so!ution for app!ications under 1.. !eads" 3ith the fina! test, engineering and e1uipment
capabi!ity Unisem #i!! continue to #or c!ose!y #ith the customers to de'e!op the ne6t generation
of pacages focusing the efforts on pacages #hich meet customers9 immediate demand" :ri'en by
2
customer5s demand, Unisem is !ooing into de'e!oping ad'anced !ead frame pacages, such Chip
;ca!e +acage (C;+) and <!ip Chip"
Unisem and Unisem (%urope) ha'e a customer base comprising primari!y fab!es companies
and to a !esser e6tent design houses and a sma!! proportion of integrated de'ice manufacturers"
=bout 82"0> of the ?roup5s sa!es are to customers in 2orth =merica, 11"7> to %urope and /"0>
to =sia" 3ith a sound ba!ance sheet, U2I;%M #i!! stri'e and adapt to support its customers as they
e6pand and gro#"
8
1.1.1 VISION
(o be the !eading company pro'iding tota! semiconductor pacaging and test ser'ice g!oba!!y
and be recogni@ed as a mode! corporation"
1.1.2 MISSION
In order to achie'e the 'ision, Unisem is committed to
+ro'ide tota! customer satisfaction
Be a caring company and emp!oyer of choice
?enerate profits and acce!erate gro#th"
:e'e!op !ong term #in$#in partnership #ith Unisem business associates
=dhere to good corporate go'ernance and support en'ironmenta!, socia! and economica!
de'e!opment of the community
Up ho!d and !i'e Unisem core 'a!ues"
1.1.3 CORE VALUES
Unisem core 'a!ues inc!udedA
(eam#or
Commitment
(rust
-
+ro$=cti'e
Caring
1.1.4 UNISEM PLANT OVERVIEW
Figure 1.3: Location Map of Unisem (M) Berhad
Unisem offers a comprehensi'e range of assemb!y and test capabi!ities" Unisem5s e1uipment
standardi@ation for maBor operations is often praised by many of the customersC %;%C for die
attach and #ire bond operations, Danmi auto mo!ding system, Danmi and =;M trimEform, and
C%M auto strip$to$strip p!ating !ine" +urchasing the e1uipment from the same supp!iers a!so
ensures fe#er 'ariab!es" Unisem continua!!y increase the manufacturing capabi!ities by adding
/
state$of$the$art e1uipment, inc!uding 8 inch #afer processing and fine pitch #ire bonding of 8.
micron and be!o#"
=!! the abo'e are housed in one of the c!eanest #oring en'ironments in the #or!d" Unisem
faci!iti@ed / front$of$!ine c!ean room e6ceeds the standard re1uired in the industry" In eeping
#ith #or!d en'ironmenta! standards, Unisem manufacturing processes use on!y non$o@one
dep!eting chemica!s" (he faci!ity emp!oys an air scrubbing system and a!so has its o#n #aste
#ater treatment p!ant" Unisem has an %n'ironmenta! +o!icy, #hich is committed to !ega!
comp!iance, po!!ution pre'entionEreduction and continua! impro'ement"
1.2 History of Unise
!"ne 1#$#
Incorporated as a pri'ate !imited company under the Ma!aysian Companies =ct, 197/"
Se%t 1##1
Commenced construction of the +hase I factory bui!ding"
M&r 1##2
Comp!eted construction of the +hase I factory bui!ding #ith a bui!t$up area of about 18.,...
s1uare feet"
!"'y 1##2
Commenced mass production of semiconductor pacages #ith about 8.. emp!oyees"
M&r 1##3
=#arded M; I;) 9..2 1ua!ity systems certification for 1ua!ity assurance in production,
insta!!ation and ser'icing"
!"ne 1##3
&aunched the fine$pitch pacaging operations and commenced production of the F;)+ pacages"
!"'y 1##3
;et up the fina! test operations #ith an initia! 8,... s1uare feet"
7
!&n 1##4
;et up the tape and ree! pacing operations"
Se%t 1##(
%6panded the fina! test area to 2.,... s1uare feet"
M&r 1##)
Commenced drop$ship ser'ices"
M&y 1##)
Upgraded and e6panded the mo!ding capabi!ity #ith an automated mo!ding system"
M&y 1##)
&aunched the fine$pitch E miniaturised ;;)+"
A"* 1##)
Comp!eted construction of the +hase II factory bui!ding #ith an additiona! bui!t$up area of 11.,...
s1uare feet"
+e, 1##-
Computerised the fina! 'isua! inspection operations #ith an automated inspection system"
!"ne 1##-
Con'erted into a pub!ic !imited company"
!"'y 1##$
&isted on the 4ua!a &umpur ;toc %6change (no# no#n as Bursa Ma!aysia ;ecurities Berhad)
Main Board"
O.t 1###
Commenced construction of the +hase III factory bui!ding"
M&y 2///
=ttained the M; I;) 1-..1 certification on en'ironmenta! management systems"
Se%t 2///
Comp!eted construction of the +hase III factory bui!ding #ith an additiona! bui!t$up area of about
88.,... s1uare feet"
M&r 2//1
=#arded F; 9... and I;) 9..2 1ua!ity system certification for 1ua!ity assurance in production,
!"ne 2//1
Commenced #afer probe ser'ices"
0
!&n 2//2
&aunched the sma!! !ead!ess pacages (;&+)"
!"ne 2//2
=ttained the Internationa! +rocurement Centre &icence for performing dropshipments"
!&n 2//3
*e$certification of M; I;) 1-..1 on en'ironmenta! management systems"
!"ne 2//3
Certificate of ?reen +artner from ;ony, an en'ironmenta! management system that has met the
re1uirements of the ;ony ?reen +artner +rogram"
!&n 2//4
%stab!ished high end mi6ed signa! test capabi!ity by insta!!ing (eradyne Integra$<&%G, #ith )cta!$
site testing"
M&r 2//4
=#arded I;) 9..1A2... 1ua!ity systems certification for 1ua!ity assurance in production,
M&y 2//4
%6panded mi6ed signa! capabi!ity by adding (eradyne Cata!yst"
!"ne 2//4
*e$certification of F; 9... on 1ua!ity systems certification for 1ua!ity assurance in production,
!"ne 2//4
=c1uired =t!antic (echno!ogy Do!dings (U4) &imited (no# no#n as Unisem (%urope) Do!dings
&imited)"
Se%t 2//4
Incorporation of a Boint$'enture company, Unisem (echno!ogies ;dn Bhd (no# no#ns as
Unisem$=d'anpac (echno!ogies ;dn Bhd) for pacaging and bumping of semiconductor de'ices"
No0 2//4
Commenced construction of the #afer bumping factory bui!ding"
1e. 2//4
Incorporated Unisem Chengdu Co", &td", a semiconductor pacaging and test faci!ity in Chengdu,
;ichuan, +*C"
8
M&y 2//(
*ecei'ed Certificate of ?reen +artner from ;ony, an en'ironmenta! management system that has
met the re1uirements of the ;ony ?reen +artner +rogram"
M&y 2//(
%6panded radio fre1uency test capabi!ity from sing!e function bui!ding b!oc to high!y integrated
radio fre1uency de'ice" Using =;&84*< as ne6t generation test p!atform"
!"'y 2//(
Comp!eted construction of the #afer bumping factory bui!ding and insta!!ation of c!eanroom"
No0 2//(
Change of Corporate &ogo"
M&r 2//)
Commenced #afer bump ser'ices"
A%r 2//)
*e$certification of M; I;) 1-..1 on en'ironmenta! management systems"
!"ne 2//)
%stab!ished #afer$!e'e! C;+ test capabi!ity"
O.t 2//)
Unisem Chengdu opens its phase one factory in Chengdu, ;ichuan, +*C"
!&n 2//-
Unisem (M) Berhad certified #ith I;)E(; 179-9A2..2"
!"'y 2//-
=c1uired =d'anced Interconnect (echno!ogies &imited (no# no#n as Unisem (Mauritius)
Do!dings &imited)"
2//$
Unisem =d'anced (echno!ogies ;dn Bhd (HU=(H) (former!y no#n as Unisem$=d'anpac
(ehcno!ogies ;dn Bhd) entered into a !icense agreement #ith <!ipChip Internationa!, &&C (H<CIH)"
<CI became a shareho!der of U=("
9
1.3 Or*&ni2&tion&' Str".t"re
1.
Chairman
Managing Director
Presiden
Chief Operating Officer
!i"e Presiden
Central
Engineering
Seni#r Mana$er
Final Test
Seni#r Mana$er
Corporate Affairs
!i"e Presiden
Mfg. Operation-
Assembly
Seni#r Mana$er
Reliability & QA
Seni#r Mana$er
Facility
!i"e Presiden
ales!Mar"eting!
#$ss. De%elopment
Seni#r Mana$er
&ro'$ction Control
Seni#r Mana$er
($man Reso$rces
!i"e Presiden
Finance!A'min
Figure 1.4: Organization chart of Unisem (M) Berhad
1.3.1 1es.ri%tion of Or*&ni2&tion&' Str".t"re &n3 Its 1e%&rtent
To% M&n&*eent
(he (op Management o'ersees the #ho!e operation of the company business" (hey are a!so in
charge of monitoring and contro!!ing the share maret"
M&r4etin* 3e%&rtent
(his department is responsib!e for identifying and de'e!oping ne# business as #e!! sustaining
e6isting business" (his inc!udes price negotiation, contact generation, re'ie# and fina!i@ation"
Re'i&,i'ity 5 6"&'ity Ass"r&n.e 1e%&rtent
(his department is responsib!e for the 1ua!ity management of the products" (his department is a!so
responsib!e to coordinate periodic interna! 1ua!ity system audit and presents the audit findings for
impro'ement"
En*ineerin* 3e%&rtent
(his department is responsib!e for a!! production and process engineering de'e!opment and
imp!ementation" (his inc!udes e1uipment engineering and machine maintenance"
Pro3".tion 1e%&rtent
11
(his :epartment o'ersees the manufacturing of products to meet customer re1uirements" (he
+roduction manager p!ans and organi@es resources to meet yie!d, 1ua!ity, producti'ity, cost, and
cyc!e time"
+in&n.e 1e%&rtent
(his department is responsib!e for eeping accounting record, fund management, costing,
budgetary contro!, payro!!, ta6ation, insurance, and credit contro! and supp!ier payment"
H"&n Reso"r.e 1e%&rtent
(his department maintains genera! persona! and administrati'e management conforming to
estab!ished company and !oca! go'ernments po!icies"
M&teri&' 1e%&rtent
(his department is responsib!e for procurement of a!! goods and ser'ices re!ating to direct and
indirect materia!, in'entory contro! and a!! shipping functions"
+&.i'ity 1e%&rtent
(his department is responsib!e for the company5s infrastructure and faci!ities"
Pro3".tion Contro' 1e%&rtent
(his department is to p!an and schedu!ing on I*un$rate5 based on a'ai!ab!e production capacity,
piece$parts in'entory !e'e! and finished good output" (his is to fu!fi!! shipment dead!ine"
+in&' Test 3e%&rtent
12
(he department contro!s the e!ectrica! screening and a!! other subse1uent production process to
fina! test to meet the customer re1uirements" (he <ina! (est Manager o'ersees the production,
maintenance and engineering functions of the fina! test operations"
In.oin* M&teri&' 1e%&rtent
Incoming materia! are tested before use" Materia! such as mo!d compound, a!uminum or copper
!ead frames and #afer are considered as incoming materia!s"
R 5 6A L&,
(he particu!ar !ab is di'ided into t#o section they are *e!iabi!ity, <ai!ure =na!ysis and (herma!
=na!ysis and Ca!ibration, %;: and %n'ironment Contro!" (he *e!iabi!ity, <ai!ure =na!ysis and
(herma! =na!ysis ;ection are responsib!e for the 1ua!ity contro! of the products manufactured in
U2I;%M" (he ca!ibration, %;: and %n'ironment Contro! section is responsib!e for ca!ibration of
e1uipment that is a'ai!ab!e in U2I;%M"
18
CHAPTER 2
PRODUCT & SERVICES OF COMPANY
2.1 PAC7A8E O++ERIN8S
Unisem designs and creates both =rray and &ead frame pacages for the g!oba! IC maret"
(he turney ser'ices inc!ude %!ectrica! and (herma! Characteri@ation, :esign, =ssemb!y, (esting,
<ai!ure =na!ysis and more" =nd #ith rea!$time 3I+ systems and drop shipping to )%M9s, Unisem
offers its customers e'erything needed for time$to$maret #ins"
Unisem offers a broad range of standard and custom !ead frame and array pacages #ith
pin counts ranging from 8 to 0..J" Unisem a!so offered 3&C;+s or 3afer$&e'e! Chip$;ca!e
+acages, #hich is a !o# cost so!ution that enab!es direct connecti'ity at the substrate or board
!e'e!"
2.2 ASSEM9L:
Unisem taes pride in its efficiency and inno'ation, both of #hich contribute to a dramatic
reduction in cyc!e time $ from days to hours in many cases" (he factories pro'ide 3afer
Bacgrind, In!ess 3afer ;ort and Mapping, and =cce!erated (urn (imes, #ith three different
1-
cre#s managing proBects around the c!oc, 0 days a #ee, assemb!y runs from start to finish #ith
minima! do#n time"
2.3 TEST
In addition to pacage assemb!y ser'ices, Unisem pro'ides a fu!! range of pacage testing
ser'ices" Capabi!ities inc!ude ana!og, digita! and mi6ed signa! testing, #ith o'er 1.. test systems"
<rom 3afer +robe through <ina! (est, Unisem (est ;er'ices operate 2- hours a day, 0 days a #ee,
#ith more than 1/.,... tota! s1uare feet dedicated to testing" (o further reduce time$to$maret,
Unisem a!so offers the fo!!o#ing post$test ser'icesA &ead ;can, &ead Conditioning, (ape and *ee!,
Kacuum +acing, Burn$in, :ry$bae, <ina! +acE;toc and :rop ;hipping"
Unisem9s assemb!y and test ser'ices faci!ity in Ipoh, Ma!aysia pro'ides a fu!! range of
probe, test, and engineering and other test re!ated ser'ices" 3ith 78,... s1uare foot of factory f!oor
space dedicated to test ser'ices, Unisem9s Ipoh factory can meet your company9s test ser'ices
needs to pro'ide a fu!! turney so!ution" Unisem pro'ides so!utions for our customers9 test strategy
enab!ing them to concentrate on their products rather than troub!eshooting test hard#are, soft#are
and other test issues" (he (est %ngineering ;upport, +roduct <ai!ure =na!ysis, and the (est
:e'e!opment ?roup are committed to pro'iding test so!utions beyond the customer9s e6pectations"
2.4 WA+ER 9UMPIN8
Unisem offers #afer$bumping ser'ices through its subsidiary Unisem =d'anced
(echno!ogies (U=()" U=( is a 8$party Boint 'enture bet#een Unisem, =d'anpac ;o!utions and
<!ip Chip Internationa!" &ocated at the same premise as Unisem Ipoh, customers recei'e seam!ess
integration of a #ide 'ariety of ser'ices under one roof co'ering #afer bumping, #afer
1/
bacgrinding, #afer probe, dicing, fina! test and f!ip$chip assemb!y" U=( offers go!d bumps,
copper pi!!ar bumps and so!der bumps (through ba!! drop, p!ating and so!der paste printing)"
=dditiona!!y, U=( pro'ides repassi'ation and bond pad redistribution ser'ices" U=( is tru!y a one$
stop center for a!! bumping needs"
2.( 1ESI8N AN1 CHARACTERI;ATION
:esign and Characteri@ation ser'ices are a ey component to maing sure Unisem5s
customers ha'e the best pacaging so!ution for their de'ice" (he company has the techno!ogy,
capabi!ity, and staff to both design and characteri@e uni1ue IC pacaging re1uirements"
2.(.1 1ESI8N
Unisem pro'ides inno'ati'e pacage design so!utions that consistent!y e6ceed customer
e6pectations through a team dedicated to technica! no#!edge, integrity, and e6ceptiona! customer
ser'ice" In Unisem, there is a team of fu!!$time designers in both ;ingapore and ;i!icon Ka!!ey,
#hich a!!o#s the company to #or around the c!oc, around the #or!d, carrying out customers9
1uic time to maret needs"
2.(.2 CHARACTERI;ATION
Unisem pro'ides customers #ith the most accurate and re!iab!e pacage therma!, e!ectrica!
and mechanica! data using #e!! defined methodo!ogies for pacage characteri@ation" (he company
characteri@ation team studies the effects of 'arious parameters on therma!, e!ectrica! and
mechanica! performance of pacages in the stage of de'e!opment and design"
17
2.) COMPAN: PRO1UCTS
=t Unisem, there are 'arious semi$conductor assemb!y pacaging inc!uding of +:I+,
;)IC, +&CC, F;)+, ;;)+, M;)+, (;;)+, ;)(, ;C, (), MIC*) LG, MIC*) L+ and ;&+ #ith
(F<+ and B?="
10
FAMILY & DESCRIPTION LEADS
SI%E
TSOT
Thin ma!! "ut!ine Transistor
#$%
LBGA
Lo& Profi!e Ba!! 'rid (rray
Custom To )* + )*mm
LBGA
Lo& Profi!e Fine Pit,h Ba!!
'rid (rray
Custom To )* + )*mm
TFBGA
Thin Fine Pit,h Ba!! 'rid (rray
Custom To )* + )*mm
VFBGA
-ery Fine Pit,h Ba!! 'rid (rray
Custom To )* + )*mm
LGA
Land 'rid (rray
Custom To )* + )*mm
QFP
2.*.2./.0.)1mm Thi,2 3uad
F!at Pa,2
))$#2 4 %)
))$%)$5* 4 1**
%)$5*$1** 4 125
12*$125$1))$1%*
4 2*5
1* + 1*mm
1) + 1)mm
1) + 2*mm
25 + 25mm
LQFP
1.)mm Thi,2 Lo& Profi!e
3uad F!at Pa,2
02$)5 4 %)
))$#2 4 %)
5*
))$ %)$5*$1** 4
125
/ + /mm
1* + 1*mm
12 + 12mm
1) + 1)mm
18
%)$5*$1** 4 125 1) + 2*mm
MICRO-X
Mi,ro67 Pa,2age
)
MSOP
Mini ma!! "ut!ine Pa,2age
5$1*
MSOP
(8+posed Pad)
5$1*68P
MSOP
(Chip on !ead)
5$1*6C"L
PDIP-300
P!asti, 9ua! :n Line Pa,2age
5$1)$1%$15$2*$25 0**mi!s
PDIP-400
22 )**mi!s
PDIP-600
2)$25$)*
%**mi!s
PLCC
P!asti, Leaded Chip Carrier
25$02$))$#2$%$5#
QSOP
3uarter ma!! "ut!ine
Pa,2age
1%68P$ 2*$2)$25 1#*mi!s
QVSOP
3uarter -ery ma!! "ut!ine
Pa,2age
5*$)* 1#*mi!s
19
QFN
3uad F!at ;o Lead
%$5$1*$12$1%$2*$2)
$25$02$)*$))$)5$#%
$%)
1.% + 1.2mm
To 1* + 1*mm
Ta<!e 2.*: emi,ondu,tor Pa,2aging
Chapter 3
ASSEMBLY PROCESS FLOW IN UNISEM (M) BERHAD
3./ Intro3".tion to t<e Pro.ess +'o=
In Unisem (m) Berhad, a comp!ete #orf!o# in assemb!y a chip can be di'ided into 2 partsA
1" <ront of &ine (<)&)
2" %nd of &ine (%)&)
3.1 +ront of Line >+OL?
2.

Figure 3.1.1: Front of Line (FOL) process fo!
Incoming QA
Materia! recei'ed from supp!iers or customer #i!! be inspected for any defects and for the
correct 1uantity" &ead frames #i!! be inspected for the correct dimension #ithin the specification
of Unisem" ;ome of !ead frames #i!! be pu!!ed random!y to undergo impurities contamination
chec using )mega Meter" =fter inspection, the #afers are ept in cabinets fi!!ed #ith nitrogen
gas"
+ass
Pro3".tion 1//@
if f&i' 6A *&te
Pro3".tion 1//@
if f&i' 6A *&te
+&i'
W&fer Mo"nt
2
n3
O%ti.&'
6A 8&te
W&fer S&=
1ie Att&.<
Wire 9on3
3
r3
O%ti.&'
6A 8&te
+ass
+&i'
To En3 of 'ine
1ro% S<i% fro C"stoer
21
Wafer Mount
3afer mounting is a process of pro'iding support to the #afer to faci!itate the processing of
the #afer from #afer sa# through die attach" :uring #afer mounting, the #afer and a #afer frame
are simu!taneous!y attached on a #afer or dicing tape" (he #afer frame may be made of p!astic or
meta!, but it shou!d be resistant to #arping, bending, corrosion, and heat" (he dicing tape is Bust a
+KC sheet #ith synthetic adhesi'e on one side to ho!d both the #afer frame and the #afer"
Figure 3.1.": Mounted !afer
Wafer Saw
3afer sa# is the step that actua!!y cuts the #afer into indi'idua! die for assemb!y in IC
pacages" (he #afer sa# process consists of the fo!!o#ing steps" <irst!y, the frame$mounted
#afer is automatica!!y a!igned into position for cutting" (hen, the #afer is cut thru its thicness
according to the programmed die dimensions using a resin$bonded diamond #hee! rotating at a
'ery high rpm" <ina!!y, the #afer goes through a c!eaning process using high pressure :I #ater
sprayed on the rotating #or piece and then dried by air b!o#ing"
22
Figure 3.1.3: #fter sa!ing process
2
nd
Optical QA Gate Inspection
2nd )ptica! F= ?ate Inspection is a stage to ensure sa#ing process is according!y" It is a!so
a stage to detect any defect such as #afer #ithout sa#ing, g!assi'ation, scratches on die,
meta!!i@ation 'oids, meta!!i@ation corrosion, meta!!i@ation adherence and others" =ny damaged die
#i!! be reBected and disposed"
Die Attach
:ie =ttach, a!so no#n, as :ie Mount or :ie Bond, is the process of attaching the si!icon
chip to the die pad or die ca'ity of the support structure of the semiconductor pacage" =fter
second optica! inspection, indi'idua! chips #i!! be bonded to !ead frames" (he comp!ete bonding
process is repeated continuous!y and automatica!!y" )n!y good chips are remo'ed from the #afer
and accurate!y !anded onto !ead frames pads" (he !ead frames are then transported using 'acuum
from the top stac !oader to the programmab!e inde6er" (he inde6er #ou!d then transports the
!eadframe to the dispense position #here it is accurate!y positioned using a !aser sensor"
28
%po6y is p!aced onto the bond pad using syringe dispensers" (he !eadframe is then
remo'ed to the bond position #here it is positioned by a further !aser sensor before a chip is p!aced
onto the bond pad" =fter bonding, the !ead frames are p!aced in a maga@ine and are taen to o'en
to cure the epo6y" =s the epo6y hardened and the die are g!ued tight!y to the die pad" :ie attach
materia! has to be monitored as to ensure enough epo6y to ho!d the die onto the die pad" <i!!et of
epo6y bet#een die and die pad is a!so monitored" ?ood co'erage of epo6y on the die pad #i!!
!essen any comp!icity"

Figure 3.1.4: $ross %ection of a pac&age
Wire Bond
3ire bonding pro'ides e!ectrica! connections bet#een the contact pads of an integrated
circuit and the e6terna! connection" (he process is high!y monitored, as it is important that no error
occurs to a'oid defects" In Unisem, the #ire used in #ire bonding is go!d (=u) #ire"
Bonding method (3ire Bonder 8..7) L Ba!! and #edge is a precise!y contro!!ed process
#ith the combination of heat, force and u!trasonic energy" It in'o!'ed u!tra fine go!d #ire #ith a
typica! diameter of appro6imate!y 2/ (1mi!) and high purity of go!d (99"9>)"
2-
In the region #here force is app!ied, diffusion and p!astic deformation occurs bet#een the
go!d #ire and the meta!!i@ation surface to produce a meta!!urgica! bond ca!! intermeta!!ic" (he
de'ice to be bonded is p!aced in contact #ith a heat source on the #or ho!der to heat the
!eadframe to the re1uired temperature at 1/.C to 2..C"
3ire bonding has to be monitored and to be test regu!ar!y #ith tests such as #ire pu!!, ba!!
shear and #ire pee!" Intermeta!!ic thicness and #ire !ooping are monitored as it can easi!y be
affected #hen setting of machine is not correct" Digh #ire !ooping #i!! caused e6posed #ire on the
top pacage" Comp!eted #ire bond process is sho#n in <igure 8"1"/"
Figure 3.1.': $ompeted !ire (ond process
3
rd
Optical QA Gate Inspection
8rd )ptica! F= gate inspection is a stage to chec for partia! attached die, foreign matters, die
mas different from bui!dsheet, cracs or chipped die, ti!ted die, !ifted die, epo6y co'erage, #rong
bonding, meta! scratches or smears #rong orientation, broen or e6traneous #ires, bonding on
epo6y, cratering and other 'isua! defects on die after #ire bonding" %'er * M F= department
performed F= gate" F= ?ate contro!s the 1ua!ity of the manufactured products"
2/
3.2 En3 of Line >EOL?
27
Figure 3.".1: )nd of Line ()OL) process fo!
Pro3".tion
1//@
if f&i' 6A *&te
+&i'
+ass
Pro3".tion
1//@
if f&i' 6A *&te
+&i' +ass
Mo'3
M&r4in*
S'"rry
1eA"n4
Post Mo'3 C"re
P'&tin*
En3 of Line
F= ?ate (+!ating
<ina! Kisua!)
Tri B +or
+in&' Vis"&'
IF= <ina!
?ate
S<i%%in* to
C"stoer
4
t<
O%ti.&' 6A 8&te
P&.4in*
20
Molding
Mo!d compound acts on e!e'ated temperature and pressure to insu!ate the die on the die
attach pad" (he mo!d compound is con'erted from !i1uid resin state into so!id mass to encapsu!ate
the #ho!e pacage e6cept for !eads" (he purpose of encapsu!ation is to protect the chip from the
outside en'ironment such as moisture, impurity and for e!ectrica! insu!ation from outside
en'ironment" = !ayer of #a6 that co'ers the surface of the unit forms #hen encapsu!ation #i!! act
as #ater resistance" Mo!ding mae it is easy hand!e and resistance to therma! and mechanica!
shoc"
(here are three types of mo!ds, #hich are ca'ity mo!d, 1uic$change chase and uni'ersa!
mo!d base" (ransfer mo!ding in'o!'es se'era! stages" <irst, mo!d compound is preheated before it
is inserted into mo!d" It is then !oaded into the mo!d and is forced through the cu!!, runners and
gates into the ca'ities by the action of pressure" =fter mo!ding, the e6cessi'e compound is
remo'ed from the bottom mo!d and the mo!d ca'ities are then air sprayed to c!ean it from mo!d
compound"
Deun!
:eBun is a process to remo'e mo!d compound from the strip of pacage" It is a!so to
ensure the strip is c!eaned from any compound residue" (#o method that #or simu!taneous!y are
mechanica! def!ash and dedambar (sho#n in <igure 8"2"2)"
28
Figure 3.".": Mechanica Fash and dedam(ar
Mechanica! def!ash is to remo'ing e6cess mo!d f!ash from the edge of pacage body, #here
so!id def!ash b!ades or puncher are used to noc do#n the affected area" (his process he!ps to
minimi@e debris carried o'er to trim and form operation"
:edambar is to remo'e tie$bar meta! bar piece, #hich ho!ds integrity of adBacent !eads"
)ther terms used are dambar cutting or tie$bar cutting" In this operation meta! is sheared bet#een
cutting edges of punchers unti! the point of fracture"
Slurr" Deflash
;!urry def!ash is a process to remo'es thin or !oose mo!d f!ash (b!eed) from !eads after
mo!ding" Mechanica! def!ash is to enhance so!der co'erage at p!ating and it a!so remo'es #a6
adhesion or scum and #ash the surface of the mo!ded p!astic pacage to impro'e mar adhesion"
)ther than that, this process remo'es meta! o6ide formation on !eads and heat sin to enhance
so!der adhesion or so!der abi!ity" (he method used is through uniform dispersion of abrasi'e g!ass
beads" (he g!ass beads are first pumped into a no@@!e gun and then b!asted onto the target surface"
3ater is sprayed continuous!y to pre'ent scratching"
29
Mar!ing
(here are t#o common maring processes, name!y, in maring and !aser maring" (he
most common in maring process for semiconductor products is pad printing" +ad printing
consists of transferring an in pattern from the p!ate, #hich is a f!at b!oc #ith pattern depressions
that are fi!!ed #ith in, to the pacage, using a si!icone rubber stamp pad" ;i!icone rubber repe!s
in, maing the transfer of the in pattern c!ean and efficient" It is a!so resi!ient and e!astic,
maing it possib!e to print e'en on une'en surfaces
&aser maring (<igure 8"2"8) refers to the process of engra'ing mars on the maring
surface using a !aser beam" (he detai!s about !aser maring #i!! be discussed in Chapter 8, !aser
maring"
Figure 3.".3: Mar&ing process
#ost Mold $ure
;trips of pacage is s!o#!y heated in o'ens for se'era! hours to dry up the moisture from
the inside surface of the mo!d co'erage" (he o'en is heated to 10/ J / C and the duration is
appro6imate!y 7 hours and may differ from customer to customer" +MC is intended to harden and
stabi!i@e the mo!d compound to pre'ent cracing in the fo!!o#ing process" (he process gi'es a fu!!
protection against short$circuit and corrosion of die that may e6ist if moisture is present"
8.
#lating
+!ating is a process #here so!der is coating on e6terna! !eads to enhance so!der abi!ity and
pre'ent corrosion" (he =$-2 (=!!oy -2) and Cu !ead frames re1uire e!ectro!ytic so!der coating tin,
remaining !ead on e6terna! !eads" (here are t#o #ays of p!ating #hich are crac p!ating and strip$
to$strip p!ating"
(he !ots first go to the +!ating ;tation Incoming (+;I) to ensure the correct 1uantity and
1ua!ity of the frames" (he frames are then !oaded onto the machines for pretreatment and are
fo!!o#ed by pre$ rinsing" (hen a series of e!ectro!ytic p!ating of the !ead frames is done fo!!o#ed
by post$rinsing and drying before un!oaded for 'isua! inspection" <ina!!y the !ots are sent for
+!ating ;tation )utgoing (+;))" Dere, they ensure the correct p!ating thicness"
= ;+C monitoring is performed to chec for correct component of !ead and tin" = re!iabi!ity
test is done through the steam aging process, #here the units are steamed for a specified period and
then undergo a test for the so!der abi!ity"
#lating QA Gate
+!ating F= gate is a 1..> Kisua! Inspection for defects" =mong the inspection criteria are
disco!oration, pee!ing or crac, bridging of !eads, e6posed base meta!, contamination, scratches
and so on"
%rim and &orm
(rim is a process that shearing of !eads prior to forming and simu!ations of units from a
mo!ded strip" <orming is a process to produce a desire shape from a sheet meta! #ithout changing in
mass" <orming is straining it beyond the yie!d point of the materia! so that it #i!! tae a permanent
81
shape and retain the shape" (he forming operation must be contro!!ed bet#een yie!d point and
u!timate strength !imit of the materia!" (he comparison of before and after trimmed is sho#n be!o#
(<igure 8"2"-)"
Figure 3.".4: $omparison (efore and after trimmed
&inal 'isual
<ina! Kisua! Inspection is di'ided into t#o types, #hich are by operator and by 'ision
machine" <ina! Kisua! Inspection by operator uses 8. G magnification !o# po#er scopes to inspect
e6posed #ire, crac or the 'erification of defects" 3hi!e the magnifying g!asses (8G) are used to
inspect mo!ding defects, trim and form defects, p!ating defects, maring defects and genera!
#ormanship"
Besides that, 'ision machines are used in <ina! Kisua! Inspection" (hese machines can screen
out pacage defect units, !ead defect units and maring defect units" =s a conc!usion, 'ision
machines can screen out more defect units than operator"
82
&inal %esting
= 1..> e!ectrica! testing units for its functiona!ity is done either automatica!!y or manua!!y"
;amp!e units are sent for re!iabi!ity test in the re!iabi!ity !aboratory"
<u!!y automatic e!ectrica! testing using testers ha'e a digita! test system, an ana!og test
system, a micro processing unit and a radio fre1uency tester unit" Units are tested for direct current
(:C) parameters and =C parameters" Customers #i!! pro'ide the testing parameter" (he e!ectrica!
test criteria test specification for respecti'e de'ices may differ from one de'ice to another de'ice"
= test yie!d is ca!cu!ated for the tested !ot" If the yie!d is !ess than the minimum yie!d, an
engineering ho!d notice is issue to ho!d the !ot and production engineer is informed" 3hen the test
yie!d is abo'e the re1uired percentage, units are sent for pacing"
#ac!ing
Units are p!aced into tubes or tape and ree! after trim and form" (here are further paced in
#ays as specified by customer" ?enera!!y, there are tape and ree! pacing, bu! pacing, ;(*
pacing and !oose pacing" <igure 8"2"/ sho#ed the pacing prosess"
Figure 3.".': *ac&ing *rocess
88
QA &inal 'isual Gate
(his gate is the most crucia! and thorough checing" (he same inspection criteria for fina! 'isua!
inspection are app!ied here #ith the addition of checing the correct 1uantity of units that are
paced before shipping
8-
CHAPTER 4
PROJECT AND ACTIVITIES
4./ Intro3".tion
:uration for my industria! training is 1.#ees #hich started from 27 =pri! 2.1. unti! 2
,u!y 2.1." I #an enro!!ed to Incoming F= (Fua!ity =ssurance) department" In IF=, there is a
;ection Manager and a tota! of 2 staff engineers and 2 superintendents" ;ince Unisem (M) Berhad
is a 2- hours operating company, there are 8 supporti'e cre#s rotating a 12 hours shift" %ach cre#
!ead by a super'isor and support by 2$8 operator"
4.1 Intro3".tion to In.oin* 6A 1e%&rtent
Incoming F= is a sub$department from Fua!ity and *e!iabi!ity =ssurance (F*=)
:epartment !ead by Mr" ;C Cho#" (he main dai!y #or of IF= personne! are carry out inspection
on a!! incoming materia!" (hose materia!s inc!udeA
Mo!d Compound
&ead frame
?o!d 3ire
;hipping (ube
%po6y
:ie Coat
;o!der
Co'er (ape, Carrier (ape M *ee!

Dub
;o!der +aste
Copper 3ire
8/
3afer
Figure 4.1.1: +,# Organization $hart
87
Site 6RA
M&n&*eent
;C Cho#
In.oin* 6A
Se.tion
M&n&*e
r
6RA
S"%erinten3ent
?race Chin
St&ff 6RA
En*ineer
;4 Chan
Senior 6RA
S"%erinten3ent
+N 2g
St&ff 6RA
En*ineer
N4 &eong
9 S<ift
S"%er0isor
(Bien
A S<ift
S"%er0isor
*o@ie
C S<ift
S"%er0isor
,ustina
C S<ift
Ins%e.tor
A S<ift
Ins%e.tor
9 S<ift
Ins%e.tor
ACCEPT RE!ECT
80
Vis"&' B 1iension&'
ins%e.tion or +LT reAe.ts
P"'' s&%'es for
ins%e.tion
I6C refer to CD
T&'4 syste
Tr&nsfer for
tr&nsition roo
W&re<o"se %ersonne'
&ssi*ne3 'ot n",er
In.oin*
Pie.eDP&rts
P'&.e ACCEPT
sti.4er on ,oEes
P'&.e RE!ECT
sti.4er on ,oEes
Figure 4.1.": -or& Fo! for +,# .epartment
4.2 Intro3".tion to St"3entFs ProAe.ts &n3 A.ti0ities
:uring my industria! training period, I #as enro!!ed in the Incoming Fua!ity =ssurance
(IF=) :epartment" My super'isor is Ms" ;"4 Chan #ho is staff engineer in the department" My
Bob scope is to assist IF= engineers, IF= personne! and IFC operator in dai!y #ors inc!udingA
Conduct <irst =rtic!e Inspection (<=I)
;mart ;cope +rogramming
+repare Unisem Inspection +!an (U"I"+) from dra#ing
Kisua! inspection on !ead frame (;&+ M 2on ;&+ pacage)
:imensiona! inspection on !ead frame (;&+ M 2on ;&+ pacage)
:imensiona! inspection on shipping tube
3eight test on mo!d compound
+repare &** report
+repare +iece$part Inspection (racing
(ab!e be!o# are some e1uipment that I hand!e #ith"
E6UIPMENT +UNCTION
88
Sen3 ,&.4 to
s"%%'ier
Re&3y for
%ro3".tion
S&rt S.o%e
Use for dimensiona! inspection #here a!! the basic
dimensiona! measurement criteria #i!! be conducted"
TM s.o%e (o measure specimen that in'o!'e O$a6is
measurement"
#ower Scope
Use for magnifier the image of the units !here 1//0
1isua inspection !i (e conducted.
Hot P'&te
Use to conduct bae test for !ead frame #here the
!ead frame #i!! be heat up to high temperature"
E'e.troni. Wei*<in*
M&.<ine
(o #eight mo!d compound #hich is part of the
inspection before incoming materia! can be accepted
2a(e 4.".1: )3uipment used and their function
89
4.3 Pro.e3"re to .o%'ete & +irst Arti.'e Ins%e.tion >+AI?
(he purpose of <=I is to run the ne# de'iceEdesign in sma!! sca!e to monitor if there is any
prob!em" If the design fai!s during the <=I process, in charge department #i!! inform the supp!ier
that this !ot is not suitab!e to be commercia!ised"
=fter the ne# design is re'ie# by interna! engineer and supp!ier, designer #i!! sign out a
purchase order (+)) to !ead frame supp!ier based on the on the !ead frame dra#ing" 3hen the !ead
frame arri'es, a <=I seria!s number #i!! be generated in system" 2e6t, fe# strips of !ead frame #i!!
sent to IF= (Incoming Fua!ity =ssurance) and process engineer to monitoring it" +rocess engineer
#i!! 1ua!ify and state a remar at the <=I process report" Beside that, IF= #i!! ensure the !ead
frame fi6 #ith the design order and 1ua!ify it"
=t our side, #e a!so #i!! re'ie# the !ead frame and maring the dra#ing dimension to
chec the actua! dimension of the !ead frame" <=I needs to comp!ete in 0 #oring day, norma!!y
it5s can achie'e or tae fe# more days to comp!ete if #ithout any issue" %ngineer #i!! try to so!'e
the prob!em they facing during <=I, maBority ne# design are pass if fai! <=I engineer #i!! modify
or reBect the design"
In IF= department, <=I #i!! be done once engineer generate the Unisem Inspection +!an
(U"I"+) from dra#ing gi'en by the supp!ier" (hen, inspection #i!! be carrying out" ;teps of
inspection are as be!o#A
1" +repare Unisem Inspection +!an (U"I"+) from dra#ing
-.
2" Kisua! Inspection
8" :imension Inspection
-" Bae (est
4.3.1 Pre%&re Unise Ins%e.tion P'&n >U.I.P? fro 3r&=in*
Pro.e3"reG
a) <ind out the dra#ing #ith the same dra#ing number as the <=I samp!e"
b) ;tudy and understand the dra#ing pro'ided by supp!ier"
c) ;tate the specification that needed to inspect according types of pacages"
d) Co!!ect a!! usefu! data and create a ne# U"I"+"
e) 4ey the ne# U"I"+ in the system for future usage"
By using e6amp!e of !ead frame #ith dra#ing number %&$%(.98); *%K"." Be!o# are some
e6amp!es of data that can be found in dra#ingA
Figure 4.3.1.1: *art of dra!ing (+)
-1
Inde6 ho!e to
inde6 ho!e
:escription of
the !eadframe
Figure 4.3.1.": *art of dra!ing (++)
-2
+itch N
(ie bar #idth
%6posed pad
si@e
(G,N)
(op pad si@e
(G,N)
+itch G
(ie bar #idth
%6posed !ead
!ength
Connecting bar
#idth
Figure 4.3.1.3: *art of dra!ing (+++)
4.3.2 VISUAL INSPECTION
Kisua! inspections are done inside the c!ean room in +iece$+art Inspection *oom" Before
entering the c!ean room, a!! are re1uired to #ear smoc, face mas and %;: shoes to pre'ent any
dust #hich #i!! po!!uted the c!ean room"
-8
Meta! bar ha!f etched
opening
&ead #idth
(top J bottom)
Figure 4.3.".1: *roper attire (efore entering cean room
%'ery <irst =rtic!e Inspection (<=I) !ead frame pacage contained t#o strips of !ead frameC
1.. > 'isua! inspection must do on both !ead frames to chec for 'isua! defects" (he 'isua! defects
criteria and actions taen are sho#n as be!o#A
Vis"&' 1efe.ts A.tions
;tains *eBect if any stains is found inside pacage out!ine"
Contamination *eBect if any contamination is found inside pacage
out!ine"
)6idation E *ust *eBect if any o6idationErust is obser'ed e6cept for Ditachi
taping"
Bent !eads *eBect for any !ead bent more than ha!f !ead #idth from
the norma! centre!ine"
;cratches E Cut *eBect if scratchEcut e6pose base meta! on functiona! area"
;hifted tie$bar E <!ags *eBect if any tie$barEf!ags shifted more than ha!f the tie$bar
#idth from the centre!ine"
<oreign matter *eBect if any foreign matter is found inside pacage
out!ine"
:amaged *eBect if a !ead is damaged by more than 2/> of the !ead
#idth or !ead thicness"
+!ating defect *eBect if there is any missing p!ating, pee!ing, f!aing or
b!istering on the p!ated surface"
Kee ?roo'e$reBect if any 'ee$groo'e is obser'ed"
+!ating co'erage at O$
a6is
+erform dimensiona! inspection if any si!'er b!eeds
detected at the O$a6is"
=nchor ho!e *eBect if the anchor ho!e e6ceed the pacage out!ine"
+!ating b!eed *eBect if found any p!ating b!eed on the !ead frame"
Burn mar *eBect if found any burn mar on the !ead frame"
--
B!ister *eBect if any b!ister is found inside pacage out!ine"
<inger print *eBect if any fingerprint obser'ed on the !ead frame"
Inner !ead M outer !ead
misa!ignment
*eBect if any inner M outer !ead misa!ignment obser'ed"
(*eading fai!ed if more than 2 mi!s)
(i!ted !ead *eBect if any !ead found ti!ted"
Bubb!e defect *eBect if found any of the bubb!e on the acti'e area"
Crossbo# *eBect if found any crossbo# on the !ead frame (;&+)"
2a(e 4.3.".1: 4isua .efects $riteria
Pro.e3"re of Vis"&' Ins%e.tionG
1) 3ear finger coats on each fingers before hand!e the !ead frame (Figure 4.3.".3), this
step #i!! pre'ent any finger contamination on the !ead frame5s surfaces"
2) +ut the !ead frame on the Big and p!ace the Big under the po#er scope" (Figure4.3.".4)
8) )n the po#er button of the po#er scope" (Figure 4.3.".')
-) =dBust the magnification unti! 1/6 (minimum) M adBust the focus unti! c!ear image is
obtained" (Figure 4.3.".5)
/) Mo'e the Big in @ig$@ag direction to do 1..> 'isua! inspection on the !ead frame"
(Figure 4.3.".6)
7) *ecord do#n in incoming inspection !og sheet$!ead frame if found any 'isua! defects
that stated in 2a(e 4.3.".1 M inform engineer to 'erify"
Figure 4.3.".": *o!er scope
Figure 4.3.".3: -earing finger coats
-/
Figure 4.3.".4: *ace a ead frame under the
po!er scope
Figure 4.3.".': *o!ering the po!er scope
ighting
Figure 4.3.".5: #d7usting the focus unti
o(tained cear image
Figure 4.3.".6: Mo1e the 7ig in zig8zag
direction
4.3.3 1IMENSION INSPECTION
=!most a!! the dimension inspection is done by smart scope e6cept for the p!ating thicness that
#i!! do by G$*ay machine" (he UI+ sha!! inc!ude eighteen basic dimensiona! measurement criteria
as be!o# for :imension InspectionA
+ad ;i@e L 6$a6is ((op)
+ad ;i@e L y$a6is ((op)
+ad ;i@e L 6$a6is (%6posed) +ad ;i@e L y$a6is (%6posed)
-7
+itch L 6$a6is
+itch L y$a6is
&ead 3idth ((op)
&ead 3idth (%6posed)
%6posed &ead &ength
&ead frame 3idth
(ie$bar 3idth
Connecting Bar 3idth
Meta! Bar Da!f %tched )pening
Inde6 Do!e to Inde6 Do!e
Inde6 Do!e :iameter
+!ating (hicness
+!ating Co'erage Measure <rom the Centre of +ad L 6$a6is (<u!! spot E &ead *ing E +ad
*ing)
+!ating Co'erage Measure <rom the Centre of +ad L y$a6is (<u!! spot E &ead *ing E +ad
*ing)
Pro.e3"res of 1iension Ins%e.tion Usin* S&rt S.o%e
1) 3ear smoc before entering the +iece$+art Inspection *oom"
2) 3ear finger coats before hand!e any !ead frame to pre'ent contamination on the !ead
frame5s surfaces"
8) +ut the !ead frame on the tab!e of smart scope M a!ign it a!ong #ith the Big" (Figure 4.3.3.")
-) (urn on the bac!ight to measure the top surface of the !ead frame" (Figure 4.3.3.3)
-0
/) Mo'e the Boystic in order to mo'e the camera to the !ead frame position"
7) (urn the Boystic in c!oc#ise E counter c!oc#ise direction in order to focus the image that
captured by the camera" (Figure 4.3.3.4)
0) Use the Measure Mind +!us program to contro! the smart scope" (Figure 4.3.3.')
8) ;tart the basic dimensiona! inspection criteria !ie Figure 4.3.3.5 and Figure 4.3.3.6"
9) %'ery strips of !ead frame #i!! be measure fi'e different position units"
1.) *ecord do#n a!! the readings in the incoming inspection !og sheet$!ead frame"
11) If found any measurements that are not #ithin the specifications to!erance, inform
engineer to 'erify"
Figure 4.3.3.1: %mart scope
Figure 4.3.3.": *ut the ead frame on the
smart scope stage
-8
Figure 4.3.3.3: 2urn on the (ac&ight
Figure 4.3.3.4: #d7ust the ead frame
position 9 focus point
Figure 4.3.3.': Measure Mind *us program
Figure4.3.3.5: Basic dimensiona measurement criteria (: using smart scope(+)
-9
Figure 4.3.3.6: Basic dimensiona measurement criteria (: using smart scope (++)
/.
Point Le*en3
1 +ad ;i@e G$a6is ((op)
2 +ad ;i@e G$a6is ((op)
3 Connecting Bar 3idth ((op)
4 +itch G$a6is ((op)
( +itch N$a6is ((op)
)
+!ating Co'erage Measure from Centre of +ad (G$
a6is)
-
+!ating Co'erage Measure from Centre of +ad (N$
a6is)
$ &ead 3idth ((op)
# (ie$Bar 3idth ((op)
1/ &ead &ength (%6posed)
11 &ead 3idth (%6posed)
12 Meta! Bar Da!f %tched )pening (%6posed)
13 +ad ;i@e L G M N a6is (%6posed)
14 Inde6 Do!e to Inde6 Do!e
1( Inde6 Do!e :iameter
2a(e '.": Legend for Figure 4.3.3.6
Pro.e3"res of 1iension Ins%e.tion Usin* S&rt S.o%e
1) 3ear smoc M face mas before entering the G$*ay room"
2) =!#ays c!ose the G$*ay room door #hen in use" (Figure 4.3.3.;)
8) 3ear finger coats before hand!e any !ead frame to pre'ent contamination on the !ead
frame5s surfaces"
-) +ush the po#er button to )n the G$*ay Machine" (Figure 4.3.3.1/)
/) )pen the door for the G$*ay Machine" (Figure 4.3.3.11)
7) +!ace the !ead frame on the tab!e M a!ign it #ith the Big" (Figure 4.3.3.1")
/1
0) C!ose the door M open the <(M program that !ocated on computer destop" (Figure
4.3.3.13)
8) Mo'e the Boystic in order to mo'e the !ead frame into camera area" (Figure 4.3.3.14)
9) +ress the O$a6is upEdo#n button in order to focus on the !ead frame" (Figure 4.3.3.1')
1.) (urn the ey on to acti'ate DK" (Figure 4.3.3.15)
11) C!ic the PstartQ icon on the program to start the p!ating thicness measurement" (Figure
4.3.3.16)
12) Mo'e the tab!e to fi'e$difference position units on each !ead frame for measure"
18) *ecord do#n a!! the readings in the incoming inspection !og sheet$!ead frame"
1-) Inform engineer if found any readings that are not in specifications to!erance"
1/) (urn off the ey #hen finish a!! the measurements M open the door to get the !ead frame
out"
17) C!ic the Pe6itQ icon on the program M turn off the G$*ay machine"
Figure 4.3.3.<: =8>a: machine
Figure 4.3.3.;: ?eep the door of =8>a: room
cose !hen using
/2
Figure 4.3.3.1/: *o!ering up the =8>a:
machine
Figure 4.3.3.11: Opening the door for =8>a:
machine
Figure 4.3.3.1": *ace the ead frame on the
=8>a: machine@s ta(e
Figure 4.3.3.13: Open the F2M program on
computer des&top
Figure 4.3.3.14: Use the 7o:stic& to
positioning the ead frame
Figure 4.3.3.1': Manua focusing on the ead
frame
/8
O%en t<e
+TM
%ro*r&
Figure 4.3.3.15: 2urning on the A4 (: using
securit: &e:
Figure 4.3.3.16: %tart measuring pating
thic&ness (: cic&ing the start icon
/-
C'i.4 t<e St&rt i.on
4.3.4 9A7E TEST
Bae test is a simp!e test to test on the strength of p!ating on a !ead frame"
Figure 4.3.4.1: Aot pate
+rocedure of Bae (estA
1) ;#itch on the green button for digita! contro!!er of hot p!ate de'ice" &et the hot p!ate
heat to 8..$8/. degree Ce!sius"
2) Use the t#ee@ers to de$tape the Ditachi tape from !ead frame (;&+ +acage on!y)"
8) +!ace the !ead frame5s p!ating surface on the hot p!ate #hen it is hot" (Figure 4.3.4.")
-) 3ait t#o minutes M use the t#ee@ers transfer the hot !ead frame to meta! surface to
coo! do#n the temperature"
/) +!ace scotch tape hori@onta!!y on the top of p!ating surface M #ait unti! the !ead frame
coo! do#n" (Figure 4.3.4.3)
7) :e$tape the scotch tape from the !ead frame M obser'ed got any p!ating stic on the
scotch tape" If does, inform engineer to 'erify"
//
0) If the tape !oos c!ear, attach the scotch tape samp!e on the antistatic p!astic bag M
accept the !ot" (Figure 4.3.4.4)
Figure 4.3.4.": *acing the ead frame on the hot pate surface
Figure 4.3.4.3: #ttach the scotch tape horizonta: on the ead frame
Figure 4.3.4.4: #ttach the scotch tape sampe on the antistatic pastic (ag
/7
4.4 S&rt S.o%e Pro*r&in* Instr".tion
Figure#.11:MeasureMindP!us Too!<o+
Settin* "% Ori*in Point for Le&3 +r&e
/0
<ocus
2e# <i!e
Crosshair
+oint Measure
Construct
)rigin
<eature <inder
=6is =!ignment
;a'e
*un
:istance
3idth
Midpoint
Intersect
Figure '.1"
a) ;e!ect PNe= +i'eQ icon, turn on the 9&.4'i*<t, mo'e the camera to the position E3*e 1,
se!ect the P+o."s T&r*etQ icon #here the focus target #i!! consist R of !ead frame edge and
R is the transparent bacground" &eft C!ic on the screen to auto focus"
b) ;e!ect the PCross<&irQ icon and a!ign the G M N$a6is !ines e6act!y match #ith the E3*e 1 of
the !ead frame" )n the front pane!, set the G, N M O to be @ero 'a!ues"
c) Mo'e the Crosshair to the E3*e 2 and a!ign the G$a6is M N$a6is !ines e6act!y match #ith the
E3*e 2 of the !ead frame" )n the front pane!, se!ect the PAn*Q icon"
d) Mo'e the crosshair to the 1
st
in3eE <o'e position, se!ect P+o."sQ, PMe&s"reQ M PPointQ
icon" &eft c!ic on the screen to auto focus, press PEnterQ button (,oystic) and se!ect
P1oneQ icon"
e) ;e!ect the PConstr".tQ M POri*inQ icon and high!ight the point 1, if the point didn5t sho#,
se!ect P+"'' S.&'eQ icon" (ic P;ero ;DAEisQ icon M se!ect P1oneQ icon"
f) ;e!ect PMe&s"reQ, P+e&t"re +in3erQ M PCir.'eQ icon" +!ace any three points #ithin the 1
st

in3eE <o'e circ!e, if successfu!C it #i!! sho# a red fu!! circ!e #ith cross surrounding the 1
st

in3eE <o'e" (If sho# an incomp!ete circ!e, se!ect P6"itQ icon M repeat ste% ) again")
g) ;e!ect PConstr".tQ M POri*inQ iconC high!ight the circ!e that created in ste% ), tic P;ero
CDAEisQ M P;ero :DAEisQ icon and se!ect P1oneQ icon
/8
1
st
In3eE
Ho'e
2
n3
In3eE
Ho'e
E3*e 1 E3*e 2
h) Mo'e the camera to 2
n3
In3eE Ho'e !ocation M se!ect PMe&s"reQ, P+e&t"re +in3erQ M
PCir.'eQ icon, p!ace any three points #ithin the 2
n3
in3eE <o'e circ!e" ;e!ect PConstr".tQ M
PAEis A'i*nentQ icon" Digh!ight the 2
n3
In3eE Ho'e circ!e, tic PA'i*n CDAEisQ icon c!ic
P1oneQ icon"
i) ;e!ect the PS&0eQ icon M rename the fi!e name according to the dra#ing number that
indicated in C of C (Certificate of Conformance)"
I%ort&n.e of Settin* "% Ori*in Point for Le&3 +r&e
(o ca!cu!ate the ang!e of the !ead frame
(o mae sure the !ead frame is on the setting point before programming is done
3hen re$run programming, then ang!e of the !ead frame #i!! be in consider if the !ead
frame is not put straight"
IM+)*(=2(A setting up origin point MU;( be done before programming #as done and before
re$run the !ead frame"
CHAPTER 5
/9
RECOMMENDATIONS
(./ Intro3".tion
:uring the period of my industria! training, I ha'e !earnt a !ot in semiconductor fie!d" :uring
theses 1. #ees, I gained a !ot of no#!edge on the process of manufacturing and assemb!y a
integrated chip" =part from that, I a!so !earnt to manage my tas more effecti'e during the training"
It ga'e me !ot of benefits such as impro'ed my si!! #hen I in'o!'ed in any test procedures and
in'estigation report that gi'en by my super'isor" (he en'ironment a!so increased my maturity and
increased se!f$confidence in #oring in teams at #orp!ace" Based on my e6perience in this
company, I #ou!d !ie to gi'e some recommendation to the company as #e!! as the <acu!ty for a
better future"
(.1 Re.oen3&tion for t<e Co%&ny
(he company pro'ides a !ot of faci!ities and #e!fare for the emp!oyees" (he faci!ities inc!uded
canteen, a mini mart, c!inic, atm machines and a!so basetba!! court" %'en though a good #oring
en'ironment has been practice in the company by a!! emp!oyees, there are sti!! some aspects that
then company shou!d impro'e" Dere are some recommendations for the companyA
= short training shou!d be pro'ided to a!! ne# trainees about the #or f!o# and the
o'er'ie# of the company"
(he company shou!d gi'e a !ocation map of the factory to a!! trainees and a!so ne# staff so
that they can easi!y found the department that they #anted to go"
7.
(he company shou!d arrange the ca!ibration for the e1uipments that used fre1uent!y to
a'oid getting incorrect data from the e1uipment"
(he company shou!d mae sure that the e1uipments used is up$to$date or e!se the outdated
e1uipment #i!! not gi'e an accurate data"
(.3 Re.oen3&tion for t<e +&."'ty
Unisem (M) Berhad is a big company that taes a !ot of trainees" I #ou!d !ie to recommend to the
<acu!ty that the <acu!ty can send more students to this company for their industria! training in the
ne6t session" Dere, I #ou!d !ie to gi'e some recommendation so that the <acu!ty #i!! be ab!e to
modify and to impro'e in the coming session"
:uration for industria! training shou!d be e6tending so that students can !earn more from
the company"
Unisem (M) Berhad taing trainees from a!! inds of courses that they tae
o ;cience
o Management, mareting and finance
o %ngineering (Mechanica!, %!ectric and Chemica!)
o I(, Computer ;cience
(he <acu!ty shou!d inform the company about their 'isit to a'oid incon'enience"
CHAPTER 6
71
CONCLUSION
)./ Con.'"sion
:uring these 1. #ees, I !earnt a !ot from Unisem and in IF= department" I #as e6posed to
the rea! #oring en'ironment and !eant a !ot of ne# no#!edge that I cannot !earn from the
!ecture" 2o#, I gained some no#!edge in semiconductor fie!d #hich I ne'er meet before"
(hrough this industria! training, I gained some e6periences on #oring !ife that I #i!! meet in the
future" =s a trainee here, I ha'e recei'ed a !ot of support and he!p from my co!!eagues in IF=
:epartment" (hey are so he!pfu! #hen I needed some he!p and #hen I faced some prob!ems in
comp!eting my Bob" (hough, my practica! training is 'ery short but I !earnt a !ot from my superiors
and they taught me a !ot on some e6tra no#!edge" &ast!y I #as so appreciated that I #as gi'en a
chance to ha'e training in Unisem, because there is many ne# no#!edge for me to !earn here that
I had ne'er e6perience before" 3ith this opportunity, I #ou!d !ie to than my manager Mr" C"2"
Do, engineer Ms" ;"4" Chan, Ms" N"4" &eong, ;uperintendent Ms" +"N" 2g M Ms" ?race Chin for
their guidance and support during my training period"
CHAPTER 8
72
REFERENCES
We,site
Unisem 3ebsite A httpAEE###"unisem"com"myE
;emiconfarest 3ebsite A httpAEE###"semiconfareast"comE
;+( 3ebsite A httpAEE ###"sma!!presiciontoo!s"comE
)?+ ;mart ;cope A httpAEE###"ogpsmartscope"comE
Person
F*= ;taff %ngineer A Miss ;"4" Chan
F*= ;taff %ngineer A Miss N"4" &eong
F*= ;uperintendent A Miss +N" 2g
F*= ;uperintendent A Miss ?race Chin
%6$F*= ;taff %ngineer A Miss 3endy
78

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UNIVERSITI TEKNOLOGI MALAYSIA SSU 2915

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