2014 Solder Joint Reliability

15.
0 Release
Hari Subramaniam
Technical Services Engineer
ANSYS, Irvine, CA
hari.subramaniam@ansys.com
Solder Joint Reliability (SJR) under
Thermal Cycling
1-2
ANSYS, Inc. Proprietary
2009 ANSYS, Inc. All rights reserved.
February 23, 2009
Inventory #002593
2011 ANSYS, Inc. October 8, 2014 2
Solder Joint Failure
CTE mismatch
At Elevated Temperature
Low CTE
High CTE
Undeformed state
Stiffness mismatch
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For most consumer electronics, thermal cycling is the main cause for fatigue
Plasticity and Creep causes solder joints in electronics to undergo incremental
damage with every thermal cycle
Each load cycle causes stress damage to solder
Damage accumulates over time
Damage Accumulation
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Fracture is typically not modeled explicitly for SJR since this would be
computationally expensive
Instead, crack size or life are related to other parameters such as plastic work or
strain
By having ANSYS calculate plastic strain or work, we can relate this to the life of
the part
Life Prediction
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Utilize constitutive material model
Possible inclusion of inelastic, rate-dependent and
temperature-dependent effects
ANAND, Creep Models
Volume-averaged approach
Pick a region and determine a volume-averaged
quantity for Life calculation
Predict Life
Darveaux, Syed
Solder Joint Reliability - Workflow
Possible failure regions. Volume
Averaging done within this to
Predict TTF
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Plasticity models describe inelastic behavior that develops when the stress level
goes beyond the yield strength of the material
Usually, a type of kinematic hardening is suitable for cyclic loading behavior
Can be rate-independent or rate-dependent or coupled with creep
Review of Plasticity

Yield Strength
y
Elastic Plastic
Unloading
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Creep strain is driven by stress and temperature without a distinct yield surface.
Usually separated into three regions Primary, Secondary, Tertiary. Solder
joint reliability is typically interested in secondary creep effects to get stabilized
cycles
Review of Creep
Generalized Garofalo (Hyperbolic Sine)
Combined Time Hardening (Double Power Law)
( ) [ ]
3
4
2 1
sinh
C
T
C
cr
C e C
=
&
( )
/T C C
/T C C C
cr
te C
C
e t C
7 6
4 3 2
5
3
1
1
1
+
+
+
=
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Popularized by Darveaux and others for
solder joint simulations
ANAND Model can be thought of as a
special form of hyperbolic sine law with an
evolution term s
Review of ANAND Model
R. Darveaux, Effect of Simulation Methodology on Solder Joint Crack
Growth Correlation, ECTC 2000
m
RT
Q
in
s
Ae
1
sinh
(
\
|
=

&
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Inelastic Strain (or sometimes referred to as creep strain or plastic strain) is the
irrecoverable strain that develops
Accumulated inelastic strain is an always increasing quantity
Plastic Work (or creep strain energy) is the energy associated with this inelastic
strain
Volume Averaging technique will be used to reduce the sensitivity to meshing
Plastic Work
Plastic Work and Strain
Possible failure regions. Volume
Averaging done within this to
Predict TTF

=
V
V W
W
avg
volume unit per work Plastic W . . . . =
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Model proposed by Syed et al
Model proposed by Darveaux et al
Crack Initiation
Crack Growth
Characteristic Life
Life Prediction Methods
( )
1
=
acc f
W N
( )
1
=
acc f
C N
2
1 0
K
avg
W K N =
4
3
K
avg
W K
dN
da
=
dN
da
a
N
W
+ =
0
N
f
Cycles to Failure
C and W Material Parameters
eacc Accumulated creep strain per cycle
wacc Accumulated creep energy density per cycle
Here, K
1
through K
4
are material
parameters
a is the joint diameter at the interface
(final crack length)
W is the plastic work per cycle
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Geometry
Split the solder region for Volumetric Averaging
Use DesignModeler, Spaceclaim
Workflow - Geometry
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Input Material properties in the Engineering Data
Workflow Material Data
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Check Connections Contact
Create Named Selection
Named Selection will be used during post-processing
for calculating the volume averaged plastic work
Apply Thermal condition up to 3 to 4 cycles
Workflow - Loading
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Workflow - Postprocessing
APDL Commands are used for volumetric
averaging and Life calculations
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NL-PLWK can be plotted using User-Defined Results
Workflow - Postprocessing
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ANSYS also provides other approaches for failure prediction
Cohesive Zone Model (CZM)
Fracture Parameter
J-Integral Calculations [J]
Stress Intensity Factor [K]
Energy Release Rate [G]
Crack Growth
VCCT based crack growth
APPENDIX Other Methodologies
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ANSYS nCode DesignLife
PSD Cycle Counters
NarrowBand Only suitable for signals with single frequency content
Steinberg Electronics
Dirlik First general purpose (wideband) technique
LaLanne Military Standard
APPENDIX Other Methodolgies
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Q & A
Thank you
Hari Subramaniam
Hari.subramaniam@ansys.com
714-918-1866

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