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Low Temp Vacuum Processing Entropy LTD
Low Temp Vacuum Processing Entropy LTD
net
Technical Alert:
pcyoung@entropyltd.net
entropyltd@att.net
ENTROPY LTD has developed a novel approach to achieve high vacuum (50
ppm total gas residuals) in polymeric sealed devices within a 24 hour TOTAL
PROCESS TIME and the device bake out temperature never exceeds 100 C!!!
Compare this to the 4-6 percent total residuals for standard vacuum
processing.
If your company has a vacuum device requiring < 100 ppm total residuals
ENTROPY LTD can provide a solution with our new viscous flow processing system.
900
Cn 100
19
10
10 20 30 40
12 tn 50
Time In Hours
Residual Conc in pp m
There are some elements of this process that are proprietary however a
discussion of the general principles involved will assist in a better understanding of
how this system can achieve these results.
Metallic seals can form excellent hermetic seals good to 10 e-10 torr cc per
second leak rate of Helium. However, soldering, brazing and welding generate
issues relative to the high temperatures necessary to affect a good seal.
Cold metal seals such as Indium still require a substantial force to squeeze
the sealant mandating a fairly large seal area and application of forces; putting
further constraints on the design and many times limiting the size of the device due
to the overtly large seal itself.
Polymeric seals on the other hand are not constrained by the above and can
be scaled to the design as long as there is adequate surface area and sufficient
thickness of the polymer to prevent diffusion and or permeation of gases into the
device.polymeric’s has enabled the construction of smaller more complex devices
as metallic seals limit the size and the mechanical design.