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OptiX OSN 3500 Intelligent Optical Transmission

System
V200R011C03

Hardware Description
Issue

03

Date

2013-02-20

HUAWEI TECHNOLOGIES CO., LTD.

Copyright Huawei Technologies Co., Ltd. 2013. All rights reserved.


No part of this document may be reproduced or transmitted in any form or by any means without prior written
consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions


and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective holders.

Notice
The purchased products, services and features are stipulated by the contract made between Huawei and the
customer. All or part of the products, services and features described in this document may not be within the
purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information,
and recommendations in this document are provided "AS IS" without warranties, guarantees or representations
of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.


Address:

Huawei Industrial Base


Bantian, Longgang
Shenzhen 518129
People's Republic of China

Website:

http://www.huawei.com

Email:

support@huawei.com

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

About This Document

About This Document


Related Versions
The following table lists the product versions related to this document.
Product Name

Version

OptiX OSN 3500

V200R011C03

Intended Audience
This document describes the structure, composition, boards, and cables of the OptiX OSN
equipment.
The readers can have a comprehensive understanding of the hardware of the OptiX OSN
equipment through this document.
This document is intended for:
l

Network design and planning engineers

Hardware installation engineers

Symbol Conventions
The symbols that may be found in this document are defined as follows.
Symbol

Description

DANGER

WARNING

Issue 03 (2013-02-20)

DANGER indicates a hazard with a high level or medium


level of risk which, if not avoided, could result in death or
serious injury.
WARNING indicates a hazard with a low level of risk which,
if not avoided, could result in minor or moderate injury.

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

Symbol

About This Document

Description

CAUTION

CAUTION indicates a potentially hazardous situation that,


if not avoided, could result in equipment damage, data loss,
performance deterioration, or unanticipated results.

TIP

Provides a tip that may help you solve a problem or save time.

NOTE

Provides additional information to emphasize or supplement


important points in the main text.

GUI Conventions
The GUI conventions that may be found in this document are defined as follows.
Convention

Description

Boldface

Buttons, menus, parameters, tabs, window, and dialog titles


are in boldface. For example, click OK.

>

Multi-level menus are in boldface and separated by the ">"


signs. For example, choose File > Create > Folder.

Change History
Updates between document issues are cumulative. Therefore, the latest document issue contains
all updates made in previous issues.

Updates in Issue 03 (2013-02-20) Based on Product Version


V200R011C03
This document of the V200R011C03 version is of the third release. Compared with Issue 02,
Issue 03 includes the following updates in V200R011C03SPC200:
l

Information about pluggable optical modules supported by boards is added in topic "SDH
Boards".

In chapter "SDH Boards", the description of PRBS support is optimized for each line board.

In chapter "Cabinet", added the description of DPD100-2-8 PDU and DPD63-8-8 PDU.

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

About This Document

Updates in Issue 02 (2012-03-15) Based on Product Version


V200R011C03
This document of the V200R011C03 version is of the second release. Compared with issue 01,
this issue has the following new or optimized contents:
l

In topic "EoS Boards", the description of frame length range is optimized.

Updates in Issue 01 (2012-01-30) Based on Product Version


V200R011C03
This document of the V200R011C03 version is of the first release. Compared with
V200R011C02, This issue has the following new or optimized contents:
l

In topics "SDH Boards" and "PDH Boards", the version description of each board is
optimized.

In topic "UPM", the description that type-III subracks (2300 W) support EPS75-4815AF
UPMs is added.

In topic "UPM", the front panel diagram and power consumption of the EPS75-4815AF
UPM are modified.

Updates in Issue 02 (2011-10-26) Based on Product Version


V200R011C02
This document of the V200R011C02 version is of the second release. Compared with issue 01,
this issue has the following new or optimized contents:
l

In topic "Packet Interface Boards", the MTU is modified for ports on N1PETF8 and
N1PEFF8 boards.

Updates in Issue 01 (2011-07-20) Based on Product Version


V200R011C02
This document of the V200R011C02 version is of the first release. Compared with
V200R011C01, this issue has the following new or optimized contents:
l

The description of the N1SXCSA and N3PSXCSA boards is added to topic "Cross-Connect
Boards and System Control Boards".

The description of the N4SL64 boards is added to topic "SDH Boards".

The description that the N3EGS2 boards support HUB/SPOKE is added to topic "EoS
Boards".

The description of the N1PFL1 boards is added to topic "PDH Boards".

The description of the N1VST4 boards is added to topic "SAN/Video Boards".

The description of the N2EFT8 and N2EFT8A boards is deleted from topic "EoS Boards".

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Hardware Description

About This Document

Updates in Issue 02 (2011-04-15) Based on Product Version


V200R011C01
This document of the V200R011C01 version is of the second release. Compared with issue 01,
this issue has the following new or optimized contents:
l

The description of the N2EFT8 and N2EFT8A boards is added to topic "EoS Boards".

The description of MTU and inband DCN is added to topics "Packet Processing Boards"
and "Packet Interface Boards".

The sections "Functions and Features" of packet boards and EoS boards are optimized.

Updates in Issue 01 (2011-01-25) Based on Product Version


V200R011C01
This document of the V200R011C01 version is of the first release. Compared with
V200R011C00, this issue has the following new or optimized contents:
l

The description that the PEG8 supports GE electrical ports is added to the topic "Packet
Processing Boards".

The description of the TN12OBU1 board is added to the topic "Optical Amplifier Boards
and Dispersion Compensation Boards".

Updates in Issue 02 (2010-11-01) Based on Product Version


V200R011C00
This document of the V200R011C00 version is of the second release. Compared with issue 01,
this issue has the following new or optimized contents:
l

The description that the N2PEX1 and N1PEX2 boards support the 0.3 km transmission
distance is deleted from the topic "Functions and Features".

The description that the colored optical transmission distance supported by the PEX1,
PEX2, PEG8, and PEG16 boards is added in the topic "Functions and Features".

Updates in Issue 01 (2010-07-20) Based on Product Version


V200R011C00
This document of the V200R011C00 version is of the first release. Compared with
V100R009C03, this issue has the following new or optimized contents:
l

The description of the PEX2/PEG8/PEFF8 is added in the topic "Packet Boards".

The description of the EDQ41 is added.

The description of the CQ1/MD12/MD75 is added.

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Hardware Description

Contents

Contents
About This Document.....................................................................................................................ii
1 Equipment Structure.....................................................................................................................1
2 Cabinet.............................................................................................................................................5
2.1 Types of Cabinets...............................................................................................................................................6
2.2 Configuration of the Cabinet............................................................................................................................13
2.2.1 Indicators.................................................................................................................................................14
2.2.2 DC Power Distribution Unit....................................................................................................................15
2.2.3 Other Configurations...............................................................................................................................21

3 Subrack..........................................................................................................................................22
3.1 Subrack Structure.............................................................................................................................................24
3.2 Slot Allocation..................................................................................................................................................25
3.3 Slot Access Capacity in Packet Mode..............................................................................................................28
3.4 Slot Access Capacity in TDM Mode................................................................................................................29
3.5 Ventilation Mode..............................................................................................................................................30
3.6 Cable Management...........................................................................................................................................31
3.7 Mapping Policies of Power Consumption........................................................................................................32
3.8 Technical Specifications...................................................................................................................................33

4 Overview of Boards.....................................................................................................................36
4.1 Appearances and Dimensions of the Boards....................................................................................................37
4.2 Bar Codes of the Boards...................................................................................................................................39

5 Classification of Boards..............................................................................................................41
6 Cross-Connect Boards and System Control Boards..............................................................53
6.1 SXCSA.............................................................................................................................................................54
6.1.1 Version Description.................................................................................................................................54
6.1.2 Application..............................................................................................................................................54
6.1.3 Functions and Features............................................................................................................................54
6.1.4 Working Principle and Signal Flow........................................................................................................56
6.1.5 Front Panel...............................................................................................................................................58
6.1.6 Jumpers and DIP Switches......................................................................................................................59
6.1.7 Valid Slots...............................................................................................................................................59
6.1.8 Feature Code............................................................................................................................................59
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6.1.9 Configuring and Commissioning the Board............................................................................................59


6.1.10 Parameter Settings.................................................................................................................................60
6.1.11 Maintaining the Board...........................................................................................................................61
6.1.12 List of Alarms........................................................................................................................................62
6.1.12.1 Alarms of N1SXCSA...................................................................................................................62
6.1.13 List of Performance Events...................................................................................................................62
6.1.14 Technical Specifications........................................................................................................................62
6.2 PSXCS(A)........................................................................................................................................................63
6.2.1 Version Description.................................................................................................................................63
6.2.2 Application..............................................................................................................................................64
6.2.3 Functions and Features............................................................................................................................64
6.2.4 Working Principle and Signal Flow........................................................................................................66
6.2.5 Front Panel...............................................................................................................................................67
6.2.6 Jumpers and DIP Switches......................................................................................................................69
6.2.7 Valid Slots...............................................................................................................................................69
6.2.8 Feature Code............................................................................................................................................69
6.2.9 Configuring and Commissioning the Board............................................................................................69
6.2.10 Parameter Settings.................................................................................................................................70
6.2.11 Maintaining the Board...........................................................................................................................71
6.2.12 List of Alarms........................................................................................................................................71
6.2.12.1 Alarms of N1PSCXS(A)..............................................................................................................72
6.2.12.2 Alarms of N2PSCXS(A)..............................................................................................................72
6.2.12.3 Alarms of N3PSCXS(A)..............................................................................................................73
6.2.13 List of Performance Events...................................................................................................................74
6.2.14 Technical Specifications........................................................................................................................74
6.3 GSCC................................................................................................................................................................75
6.3.1 Version Description.................................................................................................................................75
6.3.2 Application..............................................................................................................................................75
6.3.3 Functions and Features............................................................................................................................76
6.3.4 Working Principle and Signal Flow........................................................................................................77
6.3.5 Front Panel...............................................................................................................................................79
6.3.6 Jumpers and DIP Switches......................................................................................................................81
6.3.7 Valid Slots...............................................................................................................................................85
6.3.8 Feature Code............................................................................................................................................86
6.3.9 Configuring and Commissioning the Board............................................................................................86
6.3.10 Parameter Settings.................................................................................................................................87
6.3.11 Maintaining the Board...........................................................................................................................87
6.3.12 List of Alarms........................................................................................................................................88
6.3.12.1 Alarms of N4GSCC......................................................................................................................88
6.3.12.2 Alarms of N6GSCC......................................................................................................................89
6.3.13 List of Performance Events...................................................................................................................90
6.3.13.1 Performance Events of N4GSCC.................................................................................................91
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6.3.13.2 Performance Events of N6GSCC.................................................................................................91


6.3.14 Technical Specifications........................................................................................................................91

7 Packet Processing Boards...........................................................................................................92


7.1 PEX1.................................................................................................................................................................93
7.1.1 Version Description.................................................................................................................................93
7.1.2 Application..............................................................................................................................................93
7.1.3 Functions and Features............................................................................................................................94
7.1.4 Working Principle and Signal Flow......................................................................................................100
7.1.5 Front Panel.............................................................................................................................................102
7.1.6 Jumpers and DIP Switches....................................................................................................................104
7.1.7 Valid Slots.............................................................................................................................................104
7.1.8 Feature Code..........................................................................................................................................105
7.1.9 Configuring and Commissioning the Board..........................................................................................105
7.1.10 Configuring the Board Functions........................................................................................................107
7.1.11 Parameter Settings...............................................................................................................................107
7.1.12 Maintaining the Board.........................................................................................................................108
7.1.13 List of Alarms......................................................................................................................................108
7.1.13.1 Alarms of N1PEX1.....................................................................................................................109
7.1.13.2 Alarms of N2PEX1.....................................................................................................................109
7.1.14 List of Performance Events.................................................................................................................111
7.1.14.1 Performance Events of N1PEX1................................................................................................111
7.1.14.2 Performance Events of N2PEX1................................................................................................113
7.1.15 Technical Specifications......................................................................................................................115
7.2 PEX2...............................................................................................................................................................119
7.2.1 Version Description...............................................................................................................................119
7.2.2 Application............................................................................................................................................120
7.2.3 Functions and Features..........................................................................................................................120
7.2.4 Working Principle and Signal Flow......................................................................................................125
7.2.5 Front Panel.............................................................................................................................................127
7.2.6 Jumpers and DIP Switches....................................................................................................................129
7.2.7 Valid Slots.............................................................................................................................................129
7.2.8 Feature Code..........................................................................................................................................129
7.2.9 Configuring and Commissioning the Board..........................................................................................129
7.2.10 Configuring the Board Functions........................................................................................................131
7.2.11 Parameter Settings...............................................................................................................................131
7.2.12 Maintaining the Board.........................................................................................................................131
7.2.13 List of Alarms......................................................................................................................................132
7.2.13.1 Alarms of N1PEX2.....................................................................................................................132
7.2.14 List of Performance Events.................................................................................................................133
7.2.14.1 Performance Events of N1PEX2................................................................................................134
7.2.15 Technical Specifications......................................................................................................................136
7.3 PEG8...............................................................................................................................................................139
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7.3.1 Version Description...............................................................................................................................139


7.3.2 Application............................................................................................................................................139
7.3.3 Functions and Features..........................................................................................................................140
7.3.4 Working Principle and Signal Flow......................................................................................................145
7.3.5 Front Panel.............................................................................................................................................147
7.3.6 Jumpers and DIP Switches....................................................................................................................148
7.3.7 Valid Slots.............................................................................................................................................148
7.3.8 Feature Code..........................................................................................................................................149
7.3.9 Configuring and Commissioning the Board..........................................................................................149
7.3.10 Configuring the Board Functions........................................................................................................151
7.3.11 Parameter Settings...............................................................................................................................151
7.3.12 Maintaining the Board.........................................................................................................................151
7.3.13 List of Alarms......................................................................................................................................152
7.3.13.1 Alarms of N1PEG8.....................................................................................................................152
7.3.14 List of Performance Events.................................................................................................................153
7.3.14.1 Performance Events of N1PEG8................................................................................................154
7.3.15 Technical Specifications......................................................................................................................156
7.4 PEG16.............................................................................................................................................................159
7.4.1 Version Description...............................................................................................................................159
7.4.2 Application............................................................................................................................................159
7.4.3 Functions and Features..........................................................................................................................160
7.4.4 Working Principle and Signal Flow......................................................................................................164
7.4.5 Front Panel.............................................................................................................................................166
7.4.6 Jumpers and DIP Switches....................................................................................................................168
7.4.7 Valid Slots.............................................................................................................................................168
7.4.8 Feature Code..........................................................................................................................................168
7.4.9 Configuring and Commissioning the Board..........................................................................................169
7.4.10 Configuring the Board Functions........................................................................................................170
7.4.11 Parameter Settings...............................................................................................................................171
7.4.12 Maintaining the Board.........................................................................................................................171
7.4.13 List of Alarms......................................................................................................................................172
7.4.13.1 Alarms of N1PEG16...................................................................................................................172
7.4.14 List of Performance Events.................................................................................................................173
7.4.14.1 Performance Events of N1PEG16..............................................................................................173
7.4.15 Technical Specifications......................................................................................................................175

8 Packet Interface Boards............................................................................................................178


8.1 PETF8.............................................................................................................................................................179
8.1.1 Version Description...............................................................................................................................179
8.1.2 Application............................................................................................................................................179
8.1.3 Functions and Features..........................................................................................................................180
8.1.4 Working Principle and Signal Flow......................................................................................................183
8.1.5 Front Panel.............................................................................................................................................184
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8.1.6 Jumpers and DIP Switches....................................................................................................................186


8.1.7 Valid Slots.............................................................................................................................................186
8.1.8 Feature Code..........................................................................................................................................186
8.1.9 Configuring and Commissioning the Board..........................................................................................186
8.1.10 Parameter Settings...............................................................................................................................188
8.1.11 Maintaining the Board.........................................................................................................................188
8.1.12 List of Alarms......................................................................................................................................189
8.1.12.1 Alarms of N1PETF8...................................................................................................................189
8.1.13 List of Performance Events.................................................................................................................190
8.1.13.1 Performance Events of N1PETF8..............................................................................................190
8.1.14 Technical Specifications......................................................................................................................193
8.2 PEFF8.............................................................................................................................................................193
8.2.1 Version Description...............................................................................................................................193
8.2.2 Application............................................................................................................................................194
8.2.3 Functions and Features..........................................................................................................................194
8.2.4 Working Principle and Signal Flow......................................................................................................197
8.2.5 Front Panel.............................................................................................................................................199
8.2.6 Valid Slots.............................................................................................................................................201
8.2.7 Feature Code..........................................................................................................................................201
8.2.8 Configuring and Commissioning the Board..........................................................................................201
8.2.9 Configuring the Board Functions..........................................................................................................203
8.2.10 Parameter Settings...............................................................................................................................203
8.2.11 Maintaining the Board.........................................................................................................................203
8.2.12 List of Alarms......................................................................................................................................204
8.2.12.1 Alarms of N1PEFF8...................................................................................................................204
8.2.13 List of Performance Events.................................................................................................................205
8.2.13.1 Performance Events of N1PEFF8...............................................................................................206
8.2.14 Technical Specifications......................................................................................................................207
8.3 CQ1.................................................................................................................................................................209
8.3.1 Version Description...............................................................................................................................209
8.3.2 Application............................................................................................................................................209
8.3.3 Functions and Features..........................................................................................................................210
8.3.4 Working Principle and Signal Flow......................................................................................................211
8.3.5 Front Panel.............................................................................................................................................213
8.3.6 Jumpers and DIP Switches....................................................................................................................215
8.3.7 Valid Slots.............................................................................................................................................215
8.3.8 Feature Code..........................................................................................................................................215
8.3.9 Configuring and Commissioning the Board..........................................................................................215
8.3.10 Parameter Settings...............................................................................................................................216
8.3.11 Maintaining the Board.........................................................................................................................217
8.3.12 List of Alarms......................................................................................................................................217
8.3.12.1 Alarms of N1CQ1.......................................................................................................................217
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Contents

8.3.13 List of Performance Events.................................................................................................................218


8.3.13.1 Performance Events of N1CQ1..................................................................................................218
8.3.14 Technical Specifications......................................................................................................................219
8.4 MD12..............................................................................................................................................................220
8.4.1 Version Description...............................................................................................................................220
8.4.2 Application............................................................................................................................................221
8.4.3 Functions and Features..........................................................................................................................221
8.4.4 Working Principle and Signal Flow......................................................................................................224
8.4.5 Front Panel.............................................................................................................................................226
8.4.6 Jumpers and DIP Switches....................................................................................................................228
8.4.7 Valid Slots.............................................................................................................................................229
8.4.8 Feature Code..........................................................................................................................................229
8.4.9 Configuring and Commissioning the Board..........................................................................................229
8.4.10 Parameter Settings...............................................................................................................................230
8.4.11 Maintaining the Board.........................................................................................................................230
8.4.12 List of Alarms......................................................................................................................................231
8.4.12.1 Alarms of N1MD12....................................................................................................................231
8.4.13 List of Performance Events.................................................................................................................232
8.4.13.1 Performance Events of N1MD12...............................................................................................232
8.4.14 Technical Specifications......................................................................................................................233
8.5 MD75..............................................................................................................................................................234
8.5.1 Version Description...............................................................................................................................234
8.5.2 Application............................................................................................................................................234
8.5.3 Functions and Features..........................................................................................................................235
8.5.4 Working Principle and Signal Flow......................................................................................................238
8.5.5 Front Panel.............................................................................................................................................240
8.5.6 Jumpers and DIP Switches....................................................................................................................242
8.5.7 Valid Slots.............................................................................................................................................243
8.5.8 Feature Code..........................................................................................................................................243
8.5.9 Configuring and Commissioning the Board..........................................................................................243
8.5.10 Parameter Settings...............................................................................................................................244
8.5.11 Maintaining the Board.........................................................................................................................244
8.5.12 List of Alarms......................................................................................................................................245
8.5.12.1 Alarms of N1MD75....................................................................................................................245
8.5.13 List of Performance Events.................................................................................................................246
8.5.13.1 Performance Events of N1MD75...............................................................................................246
8.5.14 Technical Specifications......................................................................................................................247

9 EoD Boards................................................................................................................................. 249


9.1 EDQ41............................................................................................................................................................250
9.1.1 Version Description...............................................................................................................................250
9.1.2 Application............................................................................................................................................250
9.1.3 Functions and Features..........................................................................................................................251
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9.1.4 Working Principle and Signal Flow......................................................................................................255


9.1.5 Front Panel.............................................................................................................................................259
9.1.6 Jumpers and DIP Switches....................................................................................................................260
9.1.7 Valid Slots.............................................................................................................................................260
9.1.8 Feature Code..........................................................................................................................................260
9.1.9 Configuring and Commissioning the Board..........................................................................................261
9.1.10 Configuring the Board Functions........................................................................................................262
9.1.11 Parameter Settings...............................................................................................................................263
9.1.12 Maintaining the Board.........................................................................................................................263
9.1.13 List of Alarms......................................................................................................................................265
9.1.13.1 Alarms of N1EDQ41..................................................................................................................265
9.1.14 List of Performance Events.................................................................................................................267
9.1.14.1 Performance Events of N1EDQ41.............................................................................................267
9.1.15 Technical Specifications......................................................................................................................269

10 SDH Boards..............................................................................................................................271
10.1 SL1................................................................................................................................................................274
10.1.1 Version Description.............................................................................................................................274
10.1.2 Application..........................................................................................................................................274
10.1.3 Functions and Features........................................................................................................................275
10.1.4 Working Principle and Signal Flow....................................................................................................276
10.1.5 Front Panel...........................................................................................................................................278
10.1.6 Jumpers and DIP Switches..................................................................................................................280
10.1.7 Valid Slots...........................................................................................................................................280
10.1.8 Feature Code........................................................................................................................................280
10.1.9 Configuring and Commissioning the Board........................................................................................281
10.1.10 Parameter Settings.............................................................................................................................282
10.1.11 Maintaining the Board.......................................................................................................................282
10.1.12 List of Alarms....................................................................................................................................284
10.1.12.1 Alarms of N1SL1......................................................................................................................284
10.1.12.2 Alarms of N2SL1......................................................................................................................285
10.1.13 List of Performance Events...............................................................................................................286
10.1.13.1 Performance Events of N1SL1.................................................................................................286
10.1.13.2 Performance Events of N2SL2.................................................................................................286
10.1.14 Technical Specifications....................................................................................................................287
10.2 SL1A.............................................................................................................................................................288
10.2.1 Version Description.............................................................................................................................289
10.2.2 Application..........................................................................................................................................289
10.2.3 Functions and Features........................................................................................................................289
10.2.4 Working Principle and Signal Flow....................................................................................................290
10.2.5 Front Panel...........................................................................................................................................292
10.2.6 Valid Slots...........................................................................................................................................294
10.2.7 Feature Code........................................................................................................................................294
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10.2.8 Parameter Settings...............................................................................................................................295


10.2.9 Technical Specifications......................................................................................................................295
10.3 SLQ1.............................................................................................................................................................296
10.3.1 Version Description.............................................................................................................................296
10.3.2 Application..........................................................................................................................................297
10.3.3 Functions and Features........................................................................................................................298
10.3.4 Working Principle and Signal Flow....................................................................................................299
10.3.5 Front Panel...........................................................................................................................................301
10.3.6 Valid Slots...........................................................................................................................................303
10.3.7 Feature Code........................................................................................................................................303
10.3.8 Parameter Settings...............................................................................................................................304
10.3.9 Technical Specifications......................................................................................................................304
10.4 SLQ1A..........................................................................................................................................................305
10.4.1 Version Description.............................................................................................................................305
10.4.2 Application..........................................................................................................................................305
10.4.3 Functions and Features........................................................................................................................306
10.4.4 Working Principle and Signal Flow....................................................................................................307
10.4.5 Front Panel...........................................................................................................................................310
10.4.6 Valid Slots...........................................................................................................................................311
10.4.7 Feature Code........................................................................................................................................311
10.4.8 Parameter Settings...............................................................................................................................312
10.4.9 Technical Specifications......................................................................................................................312
10.5 SLO1.............................................................................................................................................................313
10.5.1 Version Description.............................................................................................................................314
10.5.2 Application..........................................................................................................................................314
10.5.3 Functions and Features........................................................................................................................315
10.5.4 Working Principle and Signal Flow....................................................................................................316
10.5.5 Front Panel...........................................................................................................................................318
10.5.6 Valid Slots...........................................................................................................................................321
10.5.7 Feature Code........................................................................................................................................321
10.5.8 Parameter Settings...............................................................................................................................322
10.5.9 Technical Specifications......................................................................................................................322
10.6 SLT1.............................................................................................................................................................323
10.6.1 Version Description.............................................................................................................................323
10.6.2 Application..........................................................................................................................................324
10.6.3 Functions and Features........................................................................................................................324
10.6.4 Working Principle and Signal Flow....................................................................................................325
10.6.5 Front Panel...........................................................................................................................................327
10.6.6 Valid Slots...........................................................................................................................................329
10.6.7 Feature Code........................................................................................................................................329
10.6.8 Parameter Settings...............................................................................................................................330
10.6.9 Technical Specifications......................................................................................................................330
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Contents

10.7 SLH1.............................................................................................................................................................331
10.7.1 Version Description.............................................................................................................................331
10.7.2 Application..........................................................................................................................................331
10.7.3 Functions and Features........................................................................................................................332
10.7.4 Working Principle and Signal Flow....................................................................................................333
10.7.5 Front Panel...........................................................................................................................................336
10.7.6 Jumpers and DIP Switches..................................................................................................................337
10.7.7 Valid Slots...........................................................................................................................................338
10.7.8 Board Protection..................................................................................................................................338
10.7.9 Configuring and Commissioning the Board........................................................................................340
10.7.10 Parameter Settings.............................................................................................................................341
10.7.11 Maintaining the Board.......................................................................................................................342
10.7.12 List of Alarms....................................................................................................................................343
10.7.12.1 Alarms of N1SLH1(B).............................................................................................................343
10.7.13 List of Performance Events...............................................................................................................344
10.7.13.1 Performance Events of N1SLH1(B).........................................................................................344
10.7.14 Technical Specifications....................................................................................................................345
10.8 SEP1.............................................................................................................................................................345
10.8.1 Version Description.............................................................................................................................345
10.8.2 Application..........................................................................................................................................346
10.8.3 Functions and Features........................................................................................................................346
10.8.4 Working Principle and Signal Flow....................................................................................................348
10.8.5 Front Panel...........................................................................................................................................352
10.8.6 Jumpers and DIP Switches..................................................................................................................353
10.8.7 Valid Slots...........................................................................................................................................353
10.8.8 Board Protection..................................................................................................................................353
10.8.9 Feature Code........................................................................................................................................356
10.8.10 Configuring and Commissioning the Board......................................................................................356
10.8.11 Parameter Settings.............................................................................................................................357
10.8.12 Maintaining the Board.......................................................................................................................357
10.8.13 List of Alarms....................................................................................................................................359
10.8.13.1 Alarms of N1SEP1...................................................................................................................359
10.8.14 List of Performance Events...............................................................................................................360
10.8.14.1 Performance Events of N1SEP1...............................................................................................360
10.8.15 Technical Specifications....................................................................................................................360
10.9 SL4................................................................................................................................................................361
10.9.1 Version Description.............................................................................................................................361
10.9.2 Application..........................................................................................................................................362
10.9.3 Functions and Features........................................................................................................................362
10.9.4 Working Principle and Signal Flow....................................................................................................363
10.9.5 Front Panel...........................................................................................................................................366
10.9.6 Valid Slots...........................................................................................................................................367
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Contents

10.9.7 Feature Code........................................................................................................................................367


10.9.8 Parameter Settings...............................................................................................................................368
10.9.9 Technical Specifications......................................................................................................................368
10.10 SL4A...........................................................................................................................................................369
10.10.1 Version Description...........................................................................................................................369
10.10.2 Application........................................................................................................................................370
10.10.3 Functions and Features......................................................................................................................370
10.10.4 Working Principle and Signal Flow..................................................................................................372
10.10.5 Front Panel.........................................................................................................................................374
10.10.6 Valid Slots.........................................................................................................................................375
10.10.7 Feature Code......................................................................................................................................375
10.10.8 Parameter Settings.............................................................................................................................376
10.10.9 Technical Specifications....................................................................................................................376
10.11 SLD4...........................................................................................................................................................378
10.11.1 Version Description...........................................................................................................................379
10.11.2 Application........................................................................................................................................379
10.11.3 Functions and Features......................................................................................................................380
10.11.4 Working Principle and Signal Flow..................................................................................................381
10.11.5 Front Panel.........................................................................................................................................383
10.11.6 Valid Slots.........................................................................................................................................385
10.11.7 Feature Code......................................................................................................................................385
10.11.8 Parameter Settings.............................................................................................................................386
10.11.9 Technical Specifications....................................................................................................................386
10.12 SLD4A........................................................................................................................................................387
10.12.1 Version Description...........................................................................................................................387
10.12.2 Application........................................................................................................................................387
10.12.3 Functions and Features......................................................................................................................388
10.12.4 Working Principle and Signal Flow..................................................................................................389
10.12.5 Front Panel.........................................................................................................................................392
10.12.6 Valid Slots.........................................................................................................................................393
10.12.7 Feature Code......................................................................................................................................393
10.12.8 Parameter Settings.............................................................................................................................394
10.12.9 Technical Specifications....................................................................................................................394
10.13 SLQ4...........................................................................................................................................................395
10.13.1 Version Description...........................................................................................................................395
10.13.2 Application........................................................................................................................................396
10.13.3 Functions and Features......................................................................................................................397
10.13.4 Working Principle and Signal Flow..................................................................................................398
10.13.5 Front Panel.........................................................................................................................................400
10.13.6 Valid Slots.........................................................................................................................................402
10.13.7 Feature Code......................................................................................................................................402
10.13.8 Parameter Settings.............................................................................................................................403
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Contents

10.13.9 Technical Specifications....................................................................................................................403


10.14 SLQ4A........................................................................................................................................................404
10.14.1 Version Description...........................................................................................................................404
10.14.2 Application........................................................................................................................................404
10.14.3 Functions and Features......................................................................................................................405
10.14.4 Working Principle and Signal Flow..................................................................................................406
10.14.5 Front Panel.........................................................................................................................................409
10.14.6 Valid Slots.........................................................................................................................................410
10.14.7 Feature Code......................................................................................................................................410
10.14.8 Parameter Settings.............................................................................................................................411
10.14.9 Technical Specifications....................................................................................................................411
10.15 SL16............................................................................................................................................................412
10.15.1 Version Description...........................................................................................................................412
10.15.2 Application........................................................................................................................................413
10.15.3 Functions and Features......................................................................................................................414
10.15.4 Working Principle and Signal Flow..................................................................................................415
10.15.5 Front Panel.........................................................................................................................................417
10.15.6 Valid Slots.........................................................................................................................................419
10.15.7 Feature Code......................................................................................................................................419
10.15.8 Parameter Settings.............................................................................................................................420
10.15.9 Technical Specifications....................................................................................................................420
10.16 SL16A.........................................................................................................................................................422
10.16.1 Version Description...........................................................................................................................422
10.16.2 Application........................................................................................................................................423
10.16.3 Functions and Features......................................................................................................................424
10.16.4 Working Principle and Signal Flow..................................................................................................426
10.16.5 Front Panel.........................................................................................................................................428
10.16.6 Jumpers and DIP Switches................................................................................................................429
10.16.7 Valid Slots.........................................................................................................................................429
10.16.8 Feature Code......................................................................................................................................429
10.16.9 Configuring and Commissioning the Board......................................................................................430
10.16.10 Parameter Settings...........................................................................................................................431
10.16.11 Maintaining the Board.....................................................................................................................432
10.16.12 List of Alarms..................................................................................................................................433
10.16.12.1 Alarms of N1SL16A...............................................................................................................433
10.16.12.2 Alarms of N2SL16A...............................................................................................................434
10.16.12.3 Alarms of N3SL16A...............................................................................................................435
10.16.13 List of Performance Events.............................................................................................................437
10.16.13.1 Performance Events of N1SL16A..........................................................................................437
10.16.13.2 Performance Events of N2SL16A..........................................................................................437
10.16.13.3 Performance Events of N3SL16A..........................................................................................438
10.16.14 Technical Specifications..................................................................................................................439
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Contents

10.17 SLD16.........................................................................................................................................................442
10.17.1 Version Description...........................................................................................................................442
10.17.2 Application........................................................................................................................................442
10.17.3 Functions and Features......................................................................................................................442
10.17.4 Working Principle and Signal Flow..................................................................................................444
10.17.5 Front Panel.........................................................................................................................................446
10.17.6 Jumpers and DIP Switches................................................................................................................448
10.17.7 Valid Slots.........................................................................................................................................448
10.17.8 Feature Code......................................................................................................................................448
10.17.9 Configuring and Commissioning the Board......................................................................................449
10.17.10 Parameter Settings...........................................................................................................................450
10.17.11 Maintaining the Board.....................................................................................................................450
10.17.12 List of Alarms..................................................................................................................................452
10.17.12.1 Alarms of N1SLD16...............................................................................................................452
10.17.13 List of Performance Events.............................................................................................................453
10.17.13.1 Performance Events of N1SLD16..........................................................................................453
10.17.14 Technical Specifications..................................................................................................................454
10.18 SLQ16.........................................................................................................................................................455
10.18.1 Version Description...........................................................................................................................455
10.18.2 Application........................................................................................................................................456
10.18.3 Functions and Features......................................................................................................................456
10.18.4 Working Principle and Signal Flow..................................................................................................458
10.18.5 Front Panel.........................................................................................................................................460
10.18.6 Jumpers and DIP Switches................................................................................................................463
10.18.7 Valid Slots.........................................................................................................................................463
10.18.8 Feature Code......................................................................................................................................463
10.18.9 Configuring and Commissioning the Board......................................................................................464
10.18.10 Parameter Settings...........................................................................................................................465
10.18.11 Maintaining the Board.....................................................................................................................465
10.18.12 List of Alarms..................................................................................................................................467
10.18.12.1 Alarms of N1SLQ16...............................................................................................................467
10.18.13 List of Performance Events.............................................................................................................468
10.18.13.1 Performance Events of N1SLQ16..........................................................................................468
10.18.14 Technical Specifications..................................................................................................................469
10.19 SLO16.........................................................................................................................................................470
10.19.1 Version Description...........................................................................................................................470
10.19.2 Application........................................................................................................................................470
10.19.3 Functions and Features......................................................................................................................471
10.19.4 Working Principle and Signal Flow..................................................................................................472
10.19.5 Front Panel.........................................................................................................................................475
10.19.6 Jumpers and DIP Switches................................................................................................................476
10.19.7 Valid Slots.........................................................................................................................................476
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Contents

10.19.8 Feature Code......................................................................................................................................476


10.19.9 Configuring and Commissioning the Board......................................................................................477
10.19.10 Parameter Settings...........................................................................................................................478
10.19.11 Maintaining the Board.....................................................................................................................478
10.19.12 List of Alarms..................................................................................................................................480
10.19.12.1 Alarms of N1SLO16...............................................................................................................480
10.19.13 List of Performance Events.............................................................................................................481
10.19.13.1 Performance Events of N1SLO16..........................................................................................481
10.19.14 Technical Specifications..................................................................................................................482
10.20 SF16............................................................................................................................................................483
10.20.1 Version Description...........................................................................................................................483
10.20.2 Application........................................................................................................................................483
10.20.3 Functions and Features......................................................................................................................484
10.20.4 Working Principle and Signal Flow..................................................................................................485
10.20.5 Front Panel.........................................................................................................................................488
10.20.6 Valid Slots.........................................................................................................................................489
10.20.7 Feature Code......................................................................................................................................489
10.20.8 Parameter Settings.............................................................................................................................490
10.20.9 Technical Specifications....................................................................................................................490
10.21 SL64............................................................................................................................................................492
10.21.1 Version Description...........................................................................................................................492
10.21.2 Application........................................................................................................................................493
10.21.3 Functions and Features......................................................................................................................494
10.21.4 Working Principle and Signal Flow..................................................................................................496
10.21.5 Front Panel.........................................................................................................................................498
10.21.6 Jumpers and DIP Switches................................................................................................................501
10.21.7 Valid Slots.........................................................................................................................................501
10.21.8 Feature Code......................................................................................................................................501
10.21.9 Configuring and Commissioning the Board......................................................................................502
10.21.10 Parameter Settings...........................................................................................................................503
10.21.11 Maintaining the Board.....................................................................................................................504
10.21.12 List of Alarms..................................................................................................................................505
10.21.12.1 Alarms of N1SL64..................................................................................................................505
10.21.12.2 Alarms of N2SL64..................................................................................................................506
10.21.12.3 Alarms of N4SL64..................................................................................................................508
10.21.13 List of Performance Events.............................................................................................................509
10.21.13.1 Performance Events of N1SL64.............................................................................................509
10.21.13.2 Performance Events of N2SL64.............................................................................................509
10.21.13.3 Performance Events of N4SL64.............................................................................................510
10.21.14 Technical Specifications..................................................................................................................510
10.22 SLD64.........................................................................................................................................................516
10.22.1 Version Description...........................................................................................................................516
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Contents

10.22.2 Application........................................................................................................................................516
10.22.3 Functions and Features......................................................................................................................516
10.22.4 Working Principle and Signal Flow..................................................................................................518
10.22.5 Front Panel.........................................................................................................................................520
10.22.6 Jumpers and DIP Switches................................................................................................................522
10.22.7 Valid Slots.........................................................................................................................................522
10.22.8 Feature Code......................................................................................................................................522
10.22.9 Configuring and Commissioning the Board......................................................................................522
10.22.10 Parameter Settings...........................................................................................................................524
10.22.11 Maintaining the Board.....................................................................................................................524
10.22.12 List of Alarms..................................................................................................................................526
10.22.12.1 Alarms of N1SLD64...............................................................................................................526
10.22.13 List of Performance Events.............................................................................................................527
10.22.13.1 Performance Events of N1SLD64..........................................................................................527
10.22.14 Technical Specifications..................................................................................................................528
10.23 SF64............................................................................................................................................................529
10.23.1 Version Description...........................................................................................................................529
10.23.2 Application........................................................................................................................................529
10.23.3 Functions and Features......................................................................................................................530
10.23.4 Working Principle and Signal Flow..................................................................................................531
10.23.5 Front Panel.........................................................................................................................................534
10.23.6 Jumpers and DIP Switches................................................................................................................535
10.23.7 Valid Slots.........................................................................................................................................535
10.23.8 Feature Code......................................................................................................................................535
10.23.9 Configuring and Commissioning the Board......................................................................................536
10.23.10 Parameter Settings...........................................................................................................................537
10.23.11 Maintaining the Board.....................................................................................................................537
10.23.12 List of Alarms..................................................................................................................................539
10.23.12.1 Alarms of N1SF64..................................................................................................................539
10.23.13 List of Performance Events.............................................................................................................541
10.23.13.1 Performance Events of N1SF64.............................................................................................541
10.23.14 Technical Specifications..................................................................................................................541
10.24 SF64A.........................................................................................................................................................543
10.24.1 Version Description...........................................................................................................................544
10.24.2 Application........................................................................................................................................544
10.24.3 Functions and Features......................................................................................................................544
10.24.4 Working Principle and Signal Flow..................................................................................................546
10.24.5 Front Panel.........................................................................................................................................548
10.24.6 Valid Slots.........................................................................................................................................550
10.24.7 Parameter Settings.............................................................................................................................550
10.24.8 Technical Specifications....................................................................................................................550
10.25 SLQ41.........................................................................................................................................................552
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Contents

10.25.1 Version Description...........................................................................................................................553


10.25.2 Application........................................................................................................................................553
10.25.3 Functions and Features......................................................................................................................553
10.25.4 Working Principle and Signal Flow..................................................................................................555
10.25.5 Front Panel.........................................................................................................................................557
10.25.6 Jumpers and DIP Switches................................................................................................................559
10.25.7 Valid Slots.........................................................................................................................................559
10.25.8 Feature Code......................................................................................................................................559
10.25.9 Configuring and Commissioning the Board......................................................................................560
10.25.10 Parameter Settings...........................................................................................................................561
10.25.11 Maintaining the Board.....................................................................................................................562
10.25.12 List of Alarms..................................................................................................................................563
10.25.12.1 Alarms of N3SLQ41...............................................................................................................563
10.25.13 List of Performance Events.............................................................................................................564
10.25.13.1 Performance Events of N3SLQ41..........................................................................................564
10.25.14 Technical Specifications..................................................................................................................565
10.26 SLH41.........................................................................................................................................................569
10.26.1 Version Description...........................................................................................................................569
10.26.2 Application........................................................................................................................................569
10.26.3 Functions and Features......................................................................................................................569
10.26.4 Working Principle and Signal Flow..................................................................................................571
10.26.5 Front Panel.........................................................................................................................................573
10.26.6 Jumpers and DIP Switches................................................................................................................576
10.26.7 Valid Slots.........................................................................................................................................576
10.26.8 Feature Code......................................................................................................................................577
10.26.9 Configuring and Commissioning the Board......................................................................................577
10.26.10 Parameter Settings...........................................................................................................................578
10.26.11 Maintaining the Board.....................................................................................................................579
10.26.12 List of Alarms..................................................................................................................................580
10.26.12.1 Alarms of N3SLH41...............................................................................................................580
10.26.13 List of Performance Events.............................................................................................................581
10.26.13.1 Performance Events of N3SLH41..........................................................................................581
10.26.14 Technical Specifications..................................................................................................................582
10.27 EU04...........................................................................................................................................................585
10.27.1 Version Description...........................................................................................................................585
10.27.2 Application........................................................................................................................................585
10.27.3 Functions and Features......................................................................................................................585
10.27.4 Working Principle and Signal Flow..................................................................................................586
10.27.5 Front Panel.........................................................................................................................................586
10.27.6 Valid Slots.........................................................................................................................................588
10.27.7 Technical Specifications....................................................................................................................588
10.28 EU08...........................................................................................................................................................589
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Contents

10.28.1 Version Description...........................................................................................................................589


10.28.2 Application........................................................................................................................................589
10.28.3 Functions and Features......................................................................................................................589
10.28.4 Working Principle and Signal Flow..................................................................................................589
10.28.5 Front Panel.........................................................................................................................................590
10.28.6 Valid Slots.........................................................................................................................................592
10.28.7 Technical Specifications....................................................................................................................593
10.29 OU08..........................................................................................................................................................593
10.29.1 Version Description...........................................................................................................................594
10.29.2 Application........................................................................................................................................594
10.29.3 Functions and Features......................................................................................................................594
10.29.4 Working Principle and Signal Flow..................................................................................................594
10.29.5 Front Panel.........................................................................................................................................595
10.29.6 Valid Slots.........................................................................................................................................598
10.29.7 Technical Specifications....................................................................................................................599

11 PDH Boards..............................................................................................................................601
11.1 PQ1...............................................................................................................................................................603
11.1.1 Version Description.............................................................................................................................603
11.1.2 Application..........................................................................................................................................603
11.1.3 Functions and Features........................................................................................................................604
11.1.4 Working Principle and Signal Flow....................................................................................................605
11.1.5 Front Panel...........................................................................................................................................608
11.1.6 Jumpers and DIP Switches..................................................................................................................609
11.1.7 Valid Slots...........................................................................................................................................609
11.1.8 Feature Code........................................................................................................................................610
11.1.9 Board Protection..................................................................................................................................610
11.1.10 Configuring and Commissioning the Board......................................................................................612
11.1.11 Parameter Settings.............................................................................................................................614
11.1.12 Maintaining the Board.......................................................................................................................614
11.1.13 List of Alarms....................................................................................................................................615
11.1.13.1 Alarms of N1PQ1.....................................................................................................................615
11.1.13.2 Alarms of N2PQ1.....................................................................................................................615
11.1.14 List of Performance Events...............................................................................................................616
11.1.14.1 Performance Events of N1PQ1.................................................................................................616
11.1.14.2 Performance Events of N2PQ1.................................................................................................616
11.1.15 Technical Specifications....................................................................................................................617
11.2 PQM..............................................................................................................................................................617
11.2.1 Version Description.............................................................................................................................617
11.2.2 Application..........................................................................................................................................617
11.2.3 Functions and Features........................................................................................................................618
11.2.4 Working Principle and Signal Flow....................................................................................................619
11.2.5 Front Panel...........................................................................................................................................622
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Contents

11.2.6 Jumpers and DIP Switches..................................................................................................................623


11.2.7 Valid Slots...........................................................................................................................................623
11.2.8 Feature Code........................................................................................................................................624
11.2.9 Board Protection..................................................................................................................................624
11.2.10 Configuring and Commissioning the Board......................................................................................626
11.2.11 Parameter Settings.............................................................................................................................627
11.2.12 Maintaining the Board.......................................................................................................................627
11.2.13 List of Alarms....................................................................................................................................628
11.2.13.1 Alarms of N1PQM....................................................................................................................628
11.2.14 List of Performance Events...............................................................................................................629
11.2.14.1 Performance Events of N1PQM...............................................................................................629
11.2.15 Technical Specifications....................................................................................................................629
11.3 PFL1.............................................................................................................................................................630
11.3.1 Version Description.............................................................................................................................630
11.3.2 Application..........................................................................................................................................630
11.3.3 Functions and Features........................................................................................................................631
11.3.4 Working Principle and Signal Flow....................................................................................................631
11.3.5 Front Panel...........................................................................................................................................633
11.3.6 Jumpers and DIP Switches..................................................................................................................634
11.3.7 Valid Slots...........................................................................................................................................634
11.3.8 Feature Code........................................................................................................................................634
11.3.9 Configuring and Commissioning the Board........................................................................................634
11.3.10 Parameter Settings.............................................................................................................................636
11.3.11 Maintaining the Board.......................................................................................................................636
11.3.12 List of Alarms....................................................................................................................................637
11.3.12.1 Alarms of N1PFL1...................................................................................................................637
11.3.13 List of Performance Events...............................................................................................................638
11.3.13.1 Performance Events of N1PFL1...............................................................................................638
11.3.14 Technical Specifications....................................................................................................................638
11.4 PL3................................................................................................................................................................639
11.4.1 Version Description.............................................................................................................................639
11.4.2 Application..........................................................................................................................................640
11.4.3 Functions and Features........................................................................................................................640
11.4.4 Working Principle and Signal Flow....................................................................................................641
11.4.5 Front Panel...........................................................................................................................................644
11.4.6 Jumpers and DIP Switches..................................................................................................................645
11.4.7 Valid Slots...........................................................................................................................................645
11.4.8 Feature Code........................................................................................................................................645
11.4.9 Board Protection..................................................................................................................................646
11.4.10 Configuring and Commissioning the Board......................................................................................648
11.4.11 Parameter Settings.............................................................................................................................649
11.4.12 Maintaining the Board.......................................................................................................................650
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Contents

11.4.13 List of Alarms....................................................................................................................................650


11.4.13.1 Alarms of N1PL3......................................................................................................................651
11.4.13.2 Alarms of N2PL3......................................................................................................................651
11.4.14 List of Performance Events...............................................................................................................652
11.4.14.1 Performance Events of N1PL3.................................................................................................652
11.4.14.2 Performance Events of N2PL3.................................................................................................652
11.4.15 Technical Specifications....................................................................................................................653
11.5 PL3A.............................................................................................................................................................653
11.5.1 Version Description.............................................................................................................................653
11.5.2 Application..........................................................................................................................................654
11.5.3 Functions and Features........................................................................................................................654
11.5.4 Working Principle and Signal Flow....................................................................................................655
11.5.5 Front Panel...........................................................................................................................................658
11.5.6 Jumpers and DIP Switches..................................................................................................................659
11.5.7 Valid Slots...........................................................................................................................................659
11.5.8 Feature Code........................................................................................................................................659
11.5.9 Configuring and Commissioning the Board........................................................................................659
11.5.10 Parameter Settings.............................................................................................................................661
11.5.11 Maintaining the Board.......................................................................................................................661
11.5.12 List of Alarms....................................................................................................................................662
11.5.12.1 Alarms of N1PL3A...................................................................................................................662
11.5.12.2 Alarms of N2PL3A...................................................................................................................663
11.5.13 List of Performance Events...............................................................................................................663
11.5.13.1 Performance Events of N1PL3A..............................................................................................663
11.5.13.2 Performance Events of N2PL3A..............................................................................................664
11.5.14 Technical Specifications....................................................................................................................664
11.6 PD3...............................................................................................................................................................665
11.6.1 Version Description.............................................................................................................................665
11.6.2 Application..........................................................................................................................................666
11.6.3 Functions and Features........................................................................................................................666
11.6.4 Working Principle and Signal Flow....................................................................................................667
11.6.5 Front Panel...........................................................................................................................................670
11.6.6 Valid Slots...........................................................................................................................................671
11.6.7 Board Protection..................................................................................................................................671
11.6.8 Parameter Settings...............................................................................................................................674
11.6.9 Technical Specifications......................................................................................................................674
11.7 PQ3...............................................................................................................................................................674
11.7.1 Version Description.............................................................................................................................674
11.7.2 Application..........................................................................................................................................674
11.7.3 Functions and Features........................................................................................................................675
11.7.4 Working Principle and Signal Flow....................................................................................................676
11.7.5 Front Panel...........................................................................................................................................679
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Contents

11.7.6 Valid Slots...........................................................................................................................................680


11.7.7 Board Protection..................................................................................................................................680
11.7.8 Parameter Settings...............................................................................................................................682
11.7.9 Technical Specifications......................................................................................................................683
11.8 DX1..............................................................................................................................................................683
11.8.1 Version Description.............................................................................................................................683
11.8.2 Application..........................................................................................................................................683
11.8.3 Functions and Features........................................................................................................................684
11.8.4 Working Principle and Signal Flow....................................................................................................685
11.8.5 Front Panel...........................................................................................................................................686
11.8.6 Jumpers and DIP Switches..................................................................................................................688
11.8.7 Valid Slots...........................................................................................................................................688
11.8.8 Feature Code........................................................................................................................................688
11.8.9 Board Protection..................................................................................................................................689
11.8.10 Configuring and Commissioning the Board......................................................................................691
11.8.11 Parameter Settings.............................................................................................................................692
11.8.12 Maintaining the Board.......................................................................................................................692
11.8.13 List of Alarms....................................................................................................................................693
11.8.13.1 Alarms of N1DX1....................................................................................................................693
11.8.14 List of Performance Events...............................................................................................................694
11.8.14.1 Performance Events of N1DX1................................................................................................694
11.8.15 Technical Specifications....................................................................................................................694
11.9 DXA..............................................................................................................................................................695
11.9.1 Version Description.............................................................................................................................695
11.9.2 Application..........................................................................................................................................695
11.9.3 Functions and Features........................................................................................................................696
11.9.4 Working Principle and Signal Flow....................................................................................................696
11.9.5 Front Panel...........................................................................................................................................697
11.9.6 Valid Slots...........................................................................................................................................699
11.9.7 Parameter Settings...............................................................................................................................699
11.9.8 Technical Specifications......................................................................................................................699
11.10 SPQ4...........................................................................................................................................................699
11.10.1 Version Description...........................................................................................................................699
11.10.2 Application........................................................................................................................................700
11.10.3 Functions and Features......................................................................................................................700
11.10.4 Working Principle and Signal Flow..................................................................................................701
11.10.5 Front Panel.........................................................................................................................................705
11.10.6 Jumpers and DIP Switches................................................................................................................707
11.10.7 Valid Slots.........................................................................................................................................707
11.10.8 Feature Code......................................................................................................................................707
11.10.9 Board Protection................................................................................................................................707
11.10.10 Configuring and Commissioning the Board....................................................................................710
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Contents

11.10.11 Parameter Settings...........................................................................................................................711


11.10.12 Maintaining the Board.....................................................................................................................711
11.10.13 List of Alarms..................................................................................................................................712
11.10.13.1 Alarms of N1SPQ4.................................................................................................................712
11.10.13.2 Alarms of N2SPQ4.................................................................................................................713
11.10.14 List of Performance Events.............................................................................................................714
11.10.14.1 Performance Events of N1SPQ4............................................................................................714
11.10.14.2 Performance Events of N2SPQ4............................................................................................715
11.10.15 Technical Specifications..................................................................................................................715
11.11 D12B...........................................................................................................................................................715
11.11.1 Version Description...........................................................................................................................715
11.11.2 Application........................................................................................................................................716
11.11.3 Functions and Features......................................................................................................................716
11.11.4 Working Principle and Signal Flow..................................................................................................716
11.11.5 Front Panel.........................................................................................................................................716
11.11.6 Valid Slots.........................................................................................................................................718
11.11.7 Technical Specifications....................................................................................................................719
11.12 D12S...........................................................................................................................................................720
11.12.1 Version Description...........................................................................................................................720
11.12.2 Application........................................................................................................................................720
11.12.3 Functions and Features......................................................................................................................720
11.12.4 Working Principle and Signal Flow..................................................................................................721
11.12.5 Front Panel.........................................................................................................................................721
11.12.6 Valid Slots.........................................................................................................................................723
11.12.7 Technical Specifications....................................................................................................................724
11.13 D75S...........................................................................................................................................................725
11.13.1 Version Description...........................................................................................................................725
11.13.2 Application........................................................................................................................................725
11.13.3 Functions and Features......................................................................................................................725
11.13.4 Working Principle and Signal Flow..................................................................................................726
11.13.5 Front Panel.........................................................................................................................................727
11.13.6 Valid Slots.........................................................................................................................................729
11.13.7 Technical Specifications....................................................................................................................729
11.14 D34S...........................................................................................................................................................730
11.14.1 Version Description...........................................................................................................................730
11.14.2 Application........................................................................................................................................730
11.14.3 Functions and Features......................................................................................................................731
11.14.4 Working Principle and Signal Flow..................................................................................................731
11.14.5 Front Panel.........................................................................................................................................731
11.14.6 Valid Slots.........................................................................................................................................733
11.14.7 Technical Specifications....................................................................................................................733
11.15 C34S...........................................................................................................................................................734
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Contents

11.15.1 Version Description...........................................................................................................................734


11.15.2 Application........................................................................................................................................734
11.15.3 Functions and Features......................................................................................................................734
11.15.4 Working Principle and Signal Flow..................................................................................................734
11.15.5 Front Panel.........................................................................................................................................735
11.15.6 Valid Slots.........................................................................................................................................737
11.15.7 Technical Specifications....................................................................................................................737
11.16 MU04..........................................................................................................................................................738
11.16.1 Version Description...........................................................................................................................738
11.16.2 Application........................................................................................................................................738
11.16.3 Functions and Features......................................................................................................................738
11.16.4 Working Principle and Signal Flow..................................................................................................738
11.16.5 Front Panel.........................................................................................................................................739
11.16.6 Valid Slots.........................................................................................................................................741
11.16.7 Technical Specifications....................................................................................................................741
11.17 DM12..........................................................................................................................................................742
11.17.1 Version Description...........................................................................................................................742
11.17.2 Application........................................................................................................................................742
11.17.3 Functions and Features......................................................................................................................742
11.17.4 Working Principle and Signal Flow..................................................................................................743
11.17.5 Front Panel.........................................................................................................................................743
11.17.6 Valid Slots.........................................................................................................................................746
11.17.7 Technical Specifications....................................................................................................................747
11.18 TSB4...........................................................................................................................................................748
11.18.1 Version Description...........................................................................................................................748
11.18.2 Application........................................................................................................................................748
11.18.3 Functions and Features......................................................................................................................748
11.18.4 Working Principle and Signal Flow..................................................................................................748
11.18.5 Front Panel.........................................................................................................................................749
11.18.6 Valid Slots.........................................................................................................................................750
11.18.7 Technical Specifications....................................................................................................................751
11.19 TSB8...........................................................................................................................................................751
11.19.1 Version Description...........................................................................................................................751
11.19.2 Application........................................................................................................................................751
11.19.3 Functions and Features......................................................................................................................752
11.19.4 Working Principle and Signal Flow..................................................................................................752
11.19.5 Front Panel.........................................................................................................................................753
11.19.6 Valid Slots.........................................................................................................................................753
11.19.7 Technical Specifications....................................................................................................................757

12 EoS Boards................................................................................................................................758
12.1 EFT8.............................................................................................................................................................760
12.1.1 Version Description.............................................................................................................................760
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Contents

12.1.2 Application..........................................................................................................................................760
12.1.3 Functions and Features........................................................................................................................761
12.1.4 Working Principle and Signal Flow....................................................................................................764
12.1.5 Front Panel...........................................................................................................................................766
12.1.6 Jumpers and DIP Switches..................................................................................................................769
12.1.7 Valid Slots...........................................................................................................................................769
12.1.8 Feature Code........................................................................................................................................769
12.1.9 Configuring and Commissioning the Board........................................................................................769
12.1.10 Configuring the Board Functions......................................................................................................771
12.1.11 Parameter Settings.............................................................................................................................771
12.1.12 Maintaining the Board.......................................................................................................................771
12.1.13 List of Alarms....................................................................................................................................772
12.1.13.1 Alarms of N1EFT8...................................................................................................................772
12.1.14 List of Performance Events...............................................................................................................773
12.1.14.1 Performance Events of N1EFT8...............................................................................................773
12.1.15 Technical Specifications....................................................................................................................775
12.2 EFT8A..........................................................................................................................................................779
12.2.1 Version Description.............................................................................................................................779
12.2.2 Application..........................................................................................................................................779
12.2.3 Functions and Features........................................................................................................................780
12.2.4 Working Principle and Signal Flow....................................................................................................784
12.2.5 Front Panel...........................................................................................................................................786
12.2.6 Jumpers and DIP Switches..................................................................................................................789
12.2.7 Valid Slots...........................................................................................................................................789
12.2.8 Feature Code........................................................................................................................................789
12.2.9 Configuring and Commissioning the Board........................................................................................789
12.2.10 Configuring the Board Functions......................................................................................................790
12.2.11 Parameter Settings.............................................................................................................................791
12.2.12 Maintaining the Board.......................................................................................................................791
12.2.13 List of Alarms....................................................................................................................................792
12.2.13.1 Alarms of N1EFT8A................................................................................................................792
12.2.14 List of Performance Events...............................................................................................................793
12.2.14.1 Performance Events of N1EFT8A............................................................................................793
12.2.15 Technical Specifications....................................................................................................................795
12.3 EGT2............................................................................................................................................................799
12.3.1 Version Description.............................................................................................................................799
12.3.2 Application..........................................................................................................................................800
12.3.3 Functions and Features........................................................................................................................800
12.3.4 Working Principle and Signal Flow....................................................................................................804
12.3.5 Front Panel...........................................................................................................................................806
12.3.6 Jumpers and DIP Switches..................................................................................................................809
12.3.7 Valid Slots...........................................................................................................................................810
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Contents

12.3.8 Feature Code........................................................................................................................................810


12.3.9 Configuring and Commissioning the Board........................................................................................810
12.3.10 Configuring the Board Functions......................................................................................................812
12.3.11 Parameter Settings.............................................................................................................................812
12.3.12 Maintaining the Board.......................................................................................................................812
12.3.13 List of Alarms....................................................................................................................................813
12.3.13.1 Alarms of N1EGT2..................................................................................................................813
12.3.13.2 Alarms of N2EGT2..................................................................................................................814
12.3.14 List of Performance Events...............................................................................................................815
12.3.14.1 Performance Events of N1EGT2..............................................................................................815
12.3.14.2 Performance Events of N2EGT2..............................................................................................816
12.3.15 Technical Specifications....................................................................................................................818
12.4 EFS0.............................................................................................................................................................827
12.4.1 Version Description.............................................................................................................................827
12.4.2 Application..........................................................................................................................................828
12.4.3 Functions and Features........................................................................................................................829
12.4.4 Working Principle and Signal Flow....................................................................................................835
12.4.5 Front Panel...........................................................................................................................................838
12.4.6 Jumpers and DIP Switches..................................................................................................................839
12.4.7 Valid Slots...........................................................................................................................................839
12.4.8 Feature Code........................................................................................................................................840
12.4.9 Board Protection..................................................................................................................................840
12.4.10 Configuring and Commissioning the Board......................................................................................842
12.4.11 Configuring the Board Functions......................................................................................................843
12.4.12 Parameter Settings.............................................................................................................................843
12.4.13 Maintaining the Board.......................................................................................................................844
12.4.14 List of Alarms....................................................................................................................................845
12.4.14.1 Alarms of N1EFS0...................................................................................................................845
12.4.14.2 Alarms of N2EFS0...................................................................................................................845
12.4.14.3 Alarms of N4EFS0...................................................................................................................846
12.4.14.4 Alarms of N5EFS0...................................................................................................................847
12.4.15 List of Performance Events...............................................................................................................848
12.4.15.1 Performance Events of N1EFS0...............................................................................................848
12.4.15.2 Performance Events of N2EFS0...............................................................................................849
12.4.15.3 Performance Events of N4EFS0...............................................................................................851
12.4.15.4 Performance Events of N5EFS0...............................................................................................852
12.4.16 Technical Specifications....................................................................................................................853
12.5 EFS0A..........................................................................................................................................................862
12.5.1 Version Description.............................................................................................................................862
12.5.2 Application..........................................................................................................................................863
12.5.3 Functions and Features........................................................................................................................863
12.5.4 Working Principle and Signal Flow....................................................................................................868
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Hardware Description

Contents

12.5.5 Front Panel...........................................................................................................................................871


12.5.6 Jumpers and DIP Switches..................................................................................................................872
12.5.7 Valid Slots...........................................................................................................................................872
12.5.8 Feature Code........................................................................................................................................873
12.5.9 Board Protection..................................................................................................................................873
12.5.10 Configuring and Commissioning the Board......................................................................................875
12.5.11 Configuring the Board Functions......................................................................................................876
12.5.12 Parameter Settings.............................................................................................................................876
12.5.13 Maintaining the Board.......................................................................................................................877
12.5.14 List of Alarms....................................................................................................................................878
12.5.14.1 Alarms of N1EFS0A................................................................................................................878
12.5.15 List of Performance Events...............................................................................................................879
12.5.15.1 Performance Events of N1EFS0A............................................................................................879
12.5.16 Technical Specifications....................................................................................................................880
12.6 EFS4.............................................................................................................................................................884
12.6.1 Version Description.............................................................................................................................885
12.6.2 Application..........................................................................................................................................885
12.6.3 Functions and Features........................................................................................................................886
12.6.4 Working Principle and Signal Flow....................................................................................................892
12.6.5 Front Panel...........................................................................................................................................894
12.6.6 Jumpers and DIP Switches..................................................................................................................896
12.6.7 Valid Slots...........................................................................................................................................897
12.6.8 Feature Code........................................................................................................................................897
12.6.9 Configuring and Commissioning the Board........................................................................................897
12.6.10 Configuring the Board Functions......................................................................................................899
12.6.11 Parameter Settings.............................................................................................................................899
12.6.12 Maintaining the Board.......................................................................................................................899
12.6.13 List of Alarms....................................................................................................................................900
12.6.13.1 Alarms of N1EFS4...................................................................................................................900
12.6.13.2 Alarms of N2EFS4...................................................................................................................901
12.6.13.3 Alarms of N3EFS4...................................................................................................................902
12.6.14 List of Performance Events...............................................................................................................903
12.6.14.1 Performance Events of N1EFS4...............................................................................................903
12.6.14.2 Performance Events of N2EFS4...............................................................................................904
12.6.14.3 Performance Events of N3EFS4...............................................................................................906
12.6.15 Technical Specifications....................................................................................................................907
12.7 EGS2.............................................................................................................................................................915
12.7.1 Version Description.............................................................................................................................915
12.7.2 Application..........................................................................................................................................916
12.7.3 Functions and Features........................................................................................................................917
12.7.4 Working Principle and Signal Flow....................................................................................................922
12.7.5 Front Panel...........................................................................................................................................925
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Hardware Description

Contents

12.7.6 Jumpers and DIP Switches..................................................................................................................928


12.7.7 Valid Slots...........................................................................................................................................928
12.7.8 Feature Code........................................................................................................................................928
12.7.9 Configuring and Commissioning the Board........................................................................................929
12.7.10 Configuring the Board Functions......................................................................................................930
12.7.11 Parameter Settings.............................................................................................................................930
12.7.12 Maintaining the Board.......................................................................................................................931
12.7.13 List of Alarms....................................................................................................................................932
12.7.13.1 Alarms of N2EGS2...................................................................................................................932
12.7.13.2 Alarms of N3EGS2...................................................................................................................933
12.7.14 List of Performance Events...............................................................................................................933
12.7.14.1 Performance Events of N2EGS2..............................................................................................934
12.7.14.2 Performance Events of N3EGS2..............................................................................................935
12.7.15 Technical Specifications....................................................................................................................936
12.8 EMS2............................................................................................................................................................946
12.8.1 Version Description.............................................................................................................................946
12.8.2 Application..........................................................................................................................................946
12.8.3 Functions and Features........................................................................................................................947
12.8.4 Working Principle and Signal Flow....................................................................................................953
12.8.5 Front Panel...........................................................................................................................................955
12.8.6 Jumpers and DIP Switches..................................................................................................................958
12.8.7 Valid Slots...........................................................................................................................................958
12.8.8 Feature Code........................................................................................................................................958
12.8.9 Configuring and Commissioning the Board........................................................................................959
12.8.10 Configuring the Board Functions......................................................................................................960
12.8.11 Parameter Settings.............................................................................................................................961
12.8.12 Maintaining the Board.......................................................................................................................961
12.8.13 List of Alarms....................................................................................................................................962
12.8.13.1 Alarms of N1EMS2..................................................................................................................962
12.8.14 List of Performance Events...............................................................................................................963
12.8.14.1 Performance Events of N1EMS2.............................................................................................963
12.8.15 Technical Specifications....................................................................................................................965
12.9 EMS4............................................................................................................................................................974
12.9.1 Version Description.............................................................................................................................974
12.9.2 Application..........................................................................................................................................974
12.9.3 Functions and Features........................................................................................................................975
12.9.4 Working Principle and Signal Flow....................................................................................................980
12.9.5 Front Panel...........................................................................................................................................983
12.9.6 Jumpers and DIP Switches..................................................................................................................986
12.9.7 Valid Slots...........................................................................................................................................986
12.9.8 Feature Code........................................................................................................................................987
12.9.9 Board Protection..................................................................................................................................987
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Contents

12.9.10 Configuring and Commissioning the Board......................................................................................991


12.9.11 Configuring the Board Functions......................................................................................................993
12.9.12 Parameter Settings.............................................................................................................................993
12.9.13 Maintaining the Board.......................................................................................................................993
12.9.14 List of Alarms....................................................................................................................................994
12.9.14.1 Alarms of N1EMS4..................................................................................................................995
12.9.15 List of Performance Events...............................................................................................................996
12.9.15.1 Performance Events of N1EMS4.............................................................................................996
12.9.16 Technical Specifications....................................................................................................................997
12.10 EGS4.........................................................................................................................................................1006
12.10.1 Version Description.........................................................................................................................1006
12.10.2 Application......................................................................................................................................1007
12.10.3 Functions and Features....................................................................................................................1007
12.10.4 Working Principle and Signal Flow................................................................................................1013
12.10.5 Front Panel.......................................................................................................................................1016
12.10.6 Jumpers and DIP Switches..............................................................................................................1019
12.10.7 Valid Slots.......................................................................................................................................1019
12.10.8 Feature Code....................................................................................................................................1019
12.10.9 Board Protection..............................................................................................................................1020
12.10.10 Configuring and Commissioning the Board..................................................................................1023
12.10.11 Configuring the Board Functions..................................................................................................1025
12.10.12 Parameter Settings.........................................................................................................................1025
12.10.13 Maintaining the Board...................................................................................................................1025
12.10.14 List of Alarms................................................................................................................................1026
12.10.14.1 Alarms of N1EGS4...............................................................................................................1027
12.10.14.2 Alarms of N3EGS4...............................................................................................................1028
12.10.14.3 Alarms of N4EGS4...............................................................................................................1029
12.10.15 List of Performance Events...........................................................................................................1030
12.10.15.1 Performance Events of N1EGS4..........................................................................................1030
12.10.15.2 Performance Events of N3EGS4..........................................................................................1032
12.10.15.3 Performance Events of N4EGS4..........................................................................................1033
12.10.16 Technical Specifications................................................................................................................1034
12.11 EAS2.........................................................................................................................................................1044
12.11.1 Version Description.........................................................................................................................1044
12.11.2 Application......................................................................................................................................1044
12.11.3 Functions and Features....................................................................................................................1045
12.11.4 Working Principle and Signal Flow................................................................................................1050
12.11.5 Front Panel.......................................................................................................................................1052
12.11.6 Jumpers and DIP Switches..............................................................................................................1053
12.11.7 Valid Slots.......................................................................................................................................1053
12.11.8 Feature Code....................................................................................................................................1053
12.11.9 Configuring and Commissioning the Board....................................................................................1053
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Contents

12.11.10 Configuring the Board Functions..................................................................................................1055


12.11.11 Parameter Settings.........................................................................................................................1055
12.11.12 Maintaining the Board...................................................................................................................1056
12.11.13 List of Alarms................................................................................................................................1057
12.11.13.1 Alarms of N1EAS2...............................................................................................................1057
12.11.14 List of Performance Events...........................................................................................................1057
12.11.14.1 Performance Events of N1EAS2..........................................................................................1058
12.11.15 Technical Specifications................................................................................................................1059
12.12 EFF8.........................................................................................................................................................1063
12.12.1 Version Description.........................................................................................................................1063
12.12.2 Application......................................................................................................................................1063
12.12.3 Functions and Features....................................................................................................................1063
12.12.4 Working Principle and Signal Flow................................................................................................1063
12.12.5 Front Panel.......................................................................................................................................1064
12.12.6 Valid Slots.......................................................................................................................................1065
12.12.7 Technical Specifications..................................................................................................................1066
12.13 EFF8A......................................................................................................................................................1067
12.13.1 Version Description.........................................................................................................................1067
12.13.2 Application......................................................................................................................................1067
12.13.3 Functions and Features....................................................................................................................1067
12.13.4 Working Principle and Signal Flow................................................................................................1068
12.13.5 Front Panel.......................................................................................................................................1068
12.13.6 Valid Slots.......................................................................................................................................1070
12.13.7 Technical Specifications..................................................................................................................1070
12.14 ETF8.........................................................................................................................................................1071
12.14.1 Version Description.........................................................................................................................1071
12.14.2 Application......................................................................................................................................1071
12.14.3 Functions and Features....................................................................................................................1072
12.14.4 Working Principle and Signal Flow................................................................................................1072
12.14.5 Front Panel.......................................................................................................................................1072
12.14.6 Valid Slots.......................................................................................................................................1074
12.14.7 Technical Specifications..................................................................................................................1075
12.15 ETF8A......................................................................................................................................................1076
12.15.1 Version Description.........................................................................................................................1076
12.15.2 Application......................................................................................................................................1076
12.15.3 Functions and Features....................................................................................................................1076
12.15.4 Working Principle and Signal Flow................................................................................................1076
12.15.5 Front Panel.......................................................................................................................................1077
12.15.6 Valid Slots.......................................................................................................................................1078
12.15.7 Technical Specifications..................................................................................................................1079
12.16 ETS8.........................................................................................................................................................1079
12.16.1 Version Description.........................................................................................................................1080
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Contents

12.16.2 Application......................................................................................................................................1080
12.16.3 Functions and Features....................................................................................................................1080
12.16.4 Working Principle and Signal Flow................................................................................................1080
12.16.5 Front Panel.......................................................................................................................................1081
12.16.6 Valid Slots.......................................................................................................................................1082
12.16.7 Technical Specifications..................................................................................................................1083

13 ATM Boards............................................................................................................................1085
13.1 ADL4..........................................................................................................................................................1086
13.1.1 Version Description...........................................................................................................................1086
13.1.2 Application........................................................................................................................................1086
13.1.3 Functions and Features......................................................................................................................1088
13.1.4 Working Principle and Signal Flow..................................................................................................1089
13.1.5 Front Panel.........................................................................................................................................1091
13.1.6 Jumpers and DIP Switches................................................................................................................1093
13.1.7 Valid Slots.........................................................................................................................................1093
13.1.8 Feature Code......................................................................................................................................1093
13.1.9 Configuring and Commissioning the Board......................................................................................1094
13.1.10 Parameter Settings...........................................................................................................................1095
13.1.11 Maintaining the Board.....................................................................................................................1095
13.1.12 List of Alarms..................................................................................................................................1096
13.1.12.1 Alarms of N1ADL4................................................................................................................1096
13.1.13 List of Performance Events.............................................................................................................1097
13.1.13.1 Performance Events of N1ADL4...........................................................................................1097
13.1.14 Technical Specifications..................................................................................................................1098
13.2 ADQ1..........................................................................................................................................................1099
13.2.1 Version Description...........................................................................................................................1099
13.2.2 Application........................................................................................................................................1099
13.2.3 Functions and Features......................................................................................................................1101
13.2.4 Working Principle and Signal Flow..................................................................................................1102
13.2.5 Front Panel.........................................................................................................................................1104
13.2.6 Jumpers and DIP Switches................................................................................................................1106
13.2.7 Valid Slots.........................................................................................................................................1106
13.2.8 Feature Code......................................................................................................................................1106
13.2.9 Configuring and Commissioning the Board......................................................................................1107
13.2.10 Parameter Settings...........................................................................................................................1108
13.2.11 Maintaining the Board.....................................................................................................................1108
13.2.12 List of Alarms..................................................................................................................................1109
13.2.12.1 Alarms of N1ADQ1................................................................................................................1109
13.2.13 List of Performance Events.............................................................................................................1110
13.2.13.1 Performance Events of N1ADQ1...........................................................................................1110
13.2.14 Technical Specifications..................................................................................................................1111
13.3 IDL4............................................................................................................................................................1112
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Hardware Description

Contents

13.3.1 Version Description...........................................................................................................................1112


13.3.2 Application........................................................................................................................................1112
13.3.3 Functions and Features......................................................................................................................1113
13.3.4 Working Principle and Signal Flow..................................................................................................1115
13.3.5 Front Panel.........................................................................................................................................1117
13.3.6 Jumpers and DIP Switches................................................................................................................1118
13.3.7 Valid Slots.........................................................................................................................................1118
13.3.8 Feature Code......................................................................................................................................1118
13.3.9 Board Protection................................................................................................................................1119
13.3.10 Configuring and Commissioning the Board....................................................................................1119
13.3.11 Parameter Settings...........................................................................................................................1120
13.3.12 Maintaining the Board.....................................................................................................................1121
13.3.13 List of Alarms..................................................................................................................................1122
13.3.13.1 Alarms of N1IDL4..................................................................................................................1122
13.3.14 List of Performance Events.............................................................................................................1123
13.3.14.1 Performance Events of N1IDL4.............................................................................................1123
13.3.15 Technical Specifications..................................................................................................................1124
13.4 IDQ1...........................................................................................................................................................1125
13.4.1 Version Description...........................................................................................................................1125
13.4.2 Application........................................................................................................................................1125
13.4.3 Functions and Features......................................................................................................................1126
13.4.4 Working Principle and Signal Flow..................................................................................................1128
13.4.5 Front Panel.........................................................................................................................................1130
13.4.6 Jumpers and DIP Switches................................................................................................................1131
13.4.7 Valid Slots.........................................................................................................................................1131
13.4.8 Feature Code......................................................................................................................................1131
13.4.9 Board Protection................................................................................................................................1132
13.4.10 Configuring and Commissioning the Board....................................................................................1132
13.4.11 Parameter Settings...........................................................................................................................1134
13.4.12 Maintaining the Board.....................................................................................................................1134
13.4.13 List of Alarms..................................................................................................................................1135
13.4.13.1 Alarms of N1IDQ1.................................................................................................................1135
13.4.14 List of Performance Events.............................................................................................................1136
13.4.14.1 Performance Events of N1IDQ1.............................................................................................1136
13.4.15 Technical Specifications..................................................................................................................1137

14 RPR Boards.............................................................................................................................1139
14.1 EGR2..........................................................................................................................................................1140
14.1.1 Version Description...........................................................................................................................1140
14.1.2 Application........................................................................................................................................1140
14.1.3 Functions and Features......................................................................................................................1141
14.1.4 Working Principle and Signal Flow..................................................................................................1145
14.1.5 Front Panel.........................................................................................................................................1147
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Contents

14.1.6 Jumpers and DIP Switches................................................................................................................1149


14.1.7 Valid Slots.........................................................................................................................................1149
14.1.8 Feature Code......................................................................................................................................1149
14.1.9 Configuring and Commissioning the Board......................................................................................1150
14.1.10 Configuring the Board Functions....................................................................................................1151
14.1.11 Parameter Settings...........................................................................................................................1151
14.1.12 Maintaining the Board.....................................................................................................................1152
14.1.13 List of Alarms..................................................................................................................................1153
14.1.13.1 Alarms of N2EGR2................................................................................................................1153
14.1.14 List of Performance Events.............................................................................................................1154
14.1.14.1 Performance Events of N2EGR2............................................................................................1154
14.1.15 Technical Specifications..................................................................................................................1157
14.2 EMR0..........................................................................................................................................................1162
14.2.1 Version Description...........................................................................................................................1162
14.2.2 Application........................................................................................................................................1163
14.2.3 Functions and Features......................................................................................................................1163
14.2.4 Working Principle and Signal Flow..................................................................................................1167
14.2.5 Front Panel.........................................................................................................................................1169
14.2.6 Jumpers and DIP Switches................................................................................................................1171
14.2.7 Valid Slots.........................................................................................................................................1171
14.2.8 Feature Code......................................................................................................................................1172
14.2.9 Configuring and Commissioning the Board......................................................................................1172
14.2.10 Configuring the Board Functions....................................................................................................1174
14.2.11 Parameter Settings...........................................................................................................................1174
14.2.12 Maintaining the Board.....................................................................................................................1174
14.2.13 List of Alarms..................................................................................................................................1175
14.2.13.1 Alarms of N2EMR0................................................................................................................1175
14.2.14 List of Performance Events.............................................................................................................1176
14.2.14.1 Performance Events of N2EMR0...........................................................................................1176
14.2.15 Technical Specifications..................................................................................................................1180

15 SAN/Video Boards................................................................................................................1189
15.1 MST4..........................................................................................................................................................1190
15.1.1 Version Description...........................................................................................................................1190
15.1.2 Application........................................................................................................................................1190
15.1.3 Functions and Features......................................................................................................................1190
15.1.4 Working Principle and Signal Flow..................................................................................................1192
15.1.5 Front Panel.........................................................................................................................................1194
15.1.6 Jumpers and DIP Switches................................................................................................................1196
15.1.7 Valid Slots.........................................................................................................................................1196
15.1.8 Feature Code......................................................................................................................................1196
15.1.9 Configuring and Commissioning the Board......................................................................................1197
15.1.10 Parameter Settings...........................................................................................................................1198
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Contents

15.1.11 Maintaining the Board.....................................................................................................................1198


15.1.12 List of Alarms..................................................................................................................................1199
15.1.12.1 Alarms of N1MST4................................................................................................................1199
15.1.13 List of Performance Events.............................................................................................................1200
15.1.13.1 Performance Events of N1MST4...........................................................................................1200
15.1.14 Technical Specifications..................................................................................................................1200
15.2 VST4...........................................................................................................................................................1202
15.2.1 Version Description...........................................................................................................................1202
15.2.2 Application........................................................................................................................................1202
15.2.3 Functions and Features......................................................................................................................1202
15.2.4 Working Principle and Signal Flow..................................................................................................1203
15.2.5 Front Panel.........................................................................................................................................1205
15.2.6 Jumpers and DIP Switches................................................................................................................1207
15.2.7 Valid Slots.........................................................................................................................................1207
15.2.8 Feature Code......................................................................................................................................1207
15.2.9 Configuring and Commissioning a Board.........................................................................................1207
15.2.10 Parameter Settings...........................................................................................................................1208
15.2.11 Maintaining the Board.....................................................................................................................1208
15.2.12 List of Alarms..................................................................................................................................1209
15.2.12.1 Alarms of N1VST4.................................................................................................................1209
15.2.13 List of Performance Events.............................................................................................................1210
15.2.13.1 Performance Events of N1VST4............................................................................................1210
15.2.14 Technical Specifications..................................................................................................................1210

16 Microwave Boards.................................................................................................................1212
16.1 IFSD1..........................................................................................................................................................1213
16.1.1 Version Description...........................................................................................................................1213
16.1.2 Application........................................................................................................................................1213
16.1.3 Functions and Features......................................................................................................................1213
16.1.4 Working Principle and Signal Flow..................................................................................................1215
16.1.5 Front Panel.........................................................................................................................................1216
16.1.6 Jumpers and DIP Switches................................................................................................................1219
16.1.7 Valid Slots.........................................................................................................................................1219
16.1.8 Feature Code......................................................................................................................................1219
16.1.9 Board Protection................................................................................................................................1219
16.1.10 Configuring and Commissioning the Board....................................................................................1219
16.1.11 Parameter Settings...........................................................................................................................1221
16.1.12 Maintaining the Board.....................................................................................................................1223
16.1.13 List of Alarms..................................................................................................................................1223
16.1.13.1 Alarms of N1IFSD1................................................................................................................1223
16.1.14 List of Performance Events.............................................................................................................1224
16.1.14.1 Performance Events of N1IFSD1...........................................................................................1224
16.1.15 Technical Specifications..................................................................................................................1224
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Contents

16.2 RPWR.........................................................................................................................................................1226
16.2.1 Version Description...........................................................................................................................1226
16.2.2 Application........................................................................................................................................1226
16.2.3 Functions and Features......................................................................................................................1226
16.2.4 Working Principle and Signal Flow..................................................................................................1227
16.2.5 Front Panel.........................................................................................................................................1228
16.2.6 Valid Slots.........................................................................................................................................1230
16.2.7 Feature Code......................................................................................................................................1230
16.2.8 Configuring and Commissioning the Board......................................................................................1230
16.2.9 Maintaining the Board.......................................................................................................................1231
16.2.10 List of Alarms..................................................................................................................................1232
16.2.11 List of Performance Events.............................................................................................................1232
16.2.12 Technical Specifications..................................................................................................................1232
16.3 ODU............................................................................................................................................................1232

17 WDM Boards..........................................................................................................................1234
17.1 CMR2.........................................................................................................................................................1236
17.1.1 Version Description...........................................................................................................................1236
17.1.2 Application........................................................................................................................................1236
17.1.3 Functions and Features......................................................................................................................1236
17.1.4 Working Principle and Signal Flow..................................................................................................1237
17.1.5 Front Panel.........................................................................................................................................1238
17.1.6 Valid Slots.........................................................................................................................................1240
17.1.7 Feature Code......................................................................................................................................1240
17.1.8 Technical Specifications....................................................................................................................1240
17.2 CMR4.........................................................................................................................................................1242
17.2.1 Version Description...........................................................................................................................1242
17.2.2 Application........................................................................................................................................1242
17.2.3 Functions and Features......................................................................................................................1242
17.2.4 Working Principle and Signal Flow..................................................................................................1243
17.2.5 Front Panel.........................................................................................................................................1244
17.2.6 Valid Slots.........................................................................................................................................1245
17.2.7 Feature Code......................................................................................................................................1245
17.2.8 Technical Specifications....................................................................................................................1246
17.3 CMD2.........................................................................................................................................................1248
17.3.1 Version Description...........................................................................................................................1248
17.3.2 Application........................................................................................................................................1248
17.3.3 Functions and Features......................................................................................................................1248
17.3.4 Working Principle and Signal Flow..................................................................................................1249
17.3.5 Front Panel.........................................................................................................................................1249
17.3.6 Valid Slots.........................................................................................................................................1251
17.3.7 Feature Code......................................................................................................................................1251
17.3.8 Configuring and Commissioning the Board......................................................................................1251
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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

Contents

17.3.9 Parameter Settings.............................................................................................................................1252


17.3.10 Maintaining the Board.....................................................................................................................1252
17.3.11 List of Alarms..................................................................................................................................1253
17.3.12 List of Performance Events.............................................................................................................1253
17.3.13 Technical Specifications..................................................................................................................1253
17.4 MR2............................................................................................................................................................1254
17.4.1 Version Description...........................................................................................................................1255
17.4.2 Application........................................................................................................................................1255
17.4.3 Functions and Features......................................................................................................................1255
17.4.4 Working Principle and Signal Flow..................................................................................................1256
17.4.5 Front Panel.........................................................................................................................................1257
17.4.6 Valid Slots.........................................................................................................................................1258
17.4.7 Feature Code......................................................................................................................................1258
17.4.8 Technical Specifications....................................................................................................................1259
17.5 MR2A.........................................................................................................................................................1260
17.5.1 Version Description...........................................................................................................................1260
17.5.2 Application........................................................................................................................................1260
17.5.3 Functions and Features......................................................................................................................1261
17.5.4 Working Principle and Signal Flow..................................................................................................1262
17.5.5 Front Panel.........................................................................................................................................1263
17.5.6 Valid Slots.........................................................................................................................................1265
17.5.7 Technical Specifications....................................................................................................................1265
17.6 MR2C.........................................................................................................................................................1266
17.6.1 Version Description...........................................................................................................................1266
17.6.2 Application........................................................................................................................................1266
17.6.3 Functions and Features......................................................................................................................1267
17.6.4 Working Principle and Signal Flow..................................................................................................1268
17.6.5 Front Panel.........................................................................................................................................1269
17.6.6 Valid Slots.........................................................................................................................................1271
17.6.7 Technical Specifications....................................................................................................................1271
17.7 MR4............................................................................................................................................................1272
17.7.1 Version Description...........................................................................................................................1272
17.7.2 Application........................................................................................................................................1272
17.7.3 Functions and Features......................................................................................................................1273
17.7.4 Working Principle and Signal Flow..................................................................................................1273
17.7.5 Front Panel.........................................................................................................................................1274
17.7.6 Valid Slots.........................................................................................................................................1276
17.7.7 Feature Code......................................................................................................................................1276
17.7.8 Technical Specifications....................................................................................................................1277
17.8 LWX...........................................................................................................................................................1278
17.8.1 Version Description...........................................................................................................................1278
17.8.2 Application........................................................................................................................................1278
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Contents

17.8.3 Functions and Features......................................................................................................................1278


17.8.4 Working Principle and Signal Flow..................................................................................................1279
17.8.5 Front Panel.........................................................................................................................................1281
17.8.6 Valid Slots.........................................................................................................................................1283
17.8.7 Feature Code......................................................................................................................................1283
17.8.8 Parameter Settings.............................................................................................................................1283
17.8.9 Technical Specifications....................................................................................................................1284
17.9 FIB..............................................................................................................................................................1287
17.9.1 Version Description...........................................................................................................................1287
17.9.2 Application........................................................................................................................................1287
17.9.3 Functions and Features......................................................................................................................1287
17.9.4 Working Principle and Signal Flow..................................................................................................1288
17.9.5 Front Panel.........................................................................................................................................1288
17.9.6 Valid Slots.........................................................................................................................................1290
17.9.7 Technical Specifications....................................................................................................................1290

18 Auxiliary Boards....................................................................................................................1292
18.1 AUX............................................................................................................................................................1293
18.1.1 Version Description...........................................................................................................................1293
18.1.2 Application........................................................................................................................................1293
18.1.3 Functions and Features......................................................................................................................1293
18.1.4 Working Principle and Signal Flow..................................................................................................1295
18.1.5 Jumpers..............................................................................................................................................1296
18.1.6 Front Panel.........................................................................................................................................1297
18.1.7 Valid Slots.........................................................................................................................................1306
18.1.8 Technical Specifications....................................................................................................................1306
18.2 FAN............................................................................................................................................................1306
18.2.1 Version Description...........................................................................................................................1306
18.2.2 Application........................................................................................................................................1307
18.2.3 Functions and Features......................................................................................................................1307
18.2.4 Working Principle and Signal Flow..................................................................................................1308
18.2.5 Front Panel.........................................................................................................................................1308
18.2.6 Valid Slots.........................................................................................................................................1309
18.2.7 Technical Specifications....................................................................................................................1309

19 Optical Amplifier Boards and Dispersion Compensation Boards..............................1311


19.1 BA2.............................................................................................................................................................1312
19.1.1 Version Description...........................................................................................................................1312
19.1.2 Application........................................................................................................................................1312
19.1.3 Functions and Features......................................................................................................................1312
19.1.4 Working Principle and Signal Flow..................................................................................................1313
19.1.5 Front Panel.........................................................................................................................................1315
19.1.6 Valid Slots.........................................................................................................................................1318
19.1.7 Feature Code......................................................................................................................................1319
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Contents

19.1.8 Technical Specifications....................................................................................................................1319


19.2 BPA............................................................................................................................................................1320
19.2.1 Version Description...........................................................................................................................1320
19.2.2 Application........................................................................................................................................1321
19.2.3 Functions and Features......................................................................................................................1321
19.2.4 Working Principle and Signal Flow..................................................................................................1322
19.2.5 Front Panel.........................................................................................................................................1323
19.2.6 Valid Slots.........................................................................................................................................1325
19.2.7 Feature Code......................................................................................................................................1325
19.2.8 Technical Specifications....................................................................................................................1326
19.3 COA............................................................................................................................................................1327
19.3.1 Version Description...........................................................................................................................1327
19.3.2 Application........................................................................................................................................1328
19.3.3 Functions and Features......................................................................................................................1328
19.3.4 Working Principle and Signal Flow..................................................................................................1330
19.3.5 Front Panel.........................................................................................................................................1332
19.3.6 Valid Slots.........................................................................................................................................1336
19.3.7 Feature Code......................................................................................................................................1337
19.3.8 Technical Specifications....................................................................................................................1337
19.4 RPC01.........................................................................................................................................................1339
19.4.1 Version Description...........................................................................................................................1339
19.4.2 Application........................................................................................................................................1339
19.4.3 Functions and Features......................................................................................................................1340
19.4.4 Working Principle and Signal Flow..................................................................................................1340
19.4.5 Front Panel.........................................................................................................................................1342
19.4.6 Valid Slots.........................................................................................................................................1343
19.4.7 Jumpers and DIP Switches................................................................................................................1343
19.4.8 Feature Code......................................................................................................................................1344
19.4.9 Parameter Settings.............................................................................................................................1344
19.4.10 Technical Specifications..................................................................................................................1345
19.5 RPC02.........................................................................................................................................................1346
19.5.1 Version Description...........................................................................................................................1346
19.5.2 Application........................................................................................................................................1346
19.5.3 Functions and Features......................................................................................................................1346
19.5.4 Working Principle and Signal Flow..................................................................................................1347
19.5.5 Front Panel.........................................................................................................................................1349
19.5.6 Valid Slots.........................................................................................................................................1350
19.5.7 Jumpers and DIP Switches................................................................................................................1350
19.5.8 Feature Code......................................................................................................................................1351
19.5.9 Parameter Settings.............................................................................................................................1351
19.5.10 Technical Specifications..................................................................................................................1352
19.6 OBU1..........................................................................................................................................................1353
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Contents

19.6.1 Version Description...........................................................................................................................1353


19.6.2 Application........................................................................................................................................1353
19.6.3 Functions and Features......................................................................................................................1353
19.6.4 Working Principle and Signal Flow..................................................................................................1354
19.6.5 Front Panel.........................................................................................................................................1356
19.6.6 Valid Slots.........................................................................................................................................1358
19.6.7 Feature Code......................................................................................................................................1358
19.6.8 Parameter Settings.............................................................................................................................1358
19.6.9 Technical Specifications....................................................................................................................1359
19.7 DCU............................................................................................................................................................1361
19.7.1 Version Description...........................................................................................................................1361
19.7.2 Application........................................................................................................................................1361
19.7.3 Functions and Features......................................................................................................................1362
19.7.4 Working Principle and Signal Flow..................................................................................................1362
19.7.5 Front Panel.........................................................................................................................................1363
19.7.6 Valid Slots.........................................................................................................................................1365
19.7.7 Feature Code......................................................................................................................................1365
19.7.8 Technical Specifications....................................................................................................................1366

20 Power Boards..........................................................................................................................1368
20.1 UPM............................................................................................................................................................1369
20.1.1 Version Description...........................................................................................................................1369
20.1.2 Application........................................................................................................................................1369
20.1.3 Functions and Features......................................................................................................................1370
20.1.4 Working Principle and Signal Flow..................................................................................................1371
20.1.5 Front Panel.........................................................................................................................................1372
20.1.6 Valid Slots.........................................................................................................................................1375
20.1.7 Technical Specifications....................................................................................................................1376
20.2 PIU..............................................................................................................................................................1377
20.2.1 Version Description...........................................................................................................................1377
20.2.2 Application........................................................................................................................................1377
20.2.3 Functions and Features......................................................................................................................1378
20.2.4 Working Principle and Signal Flow..................................................................................................1378
20.2.5 Front Panel.........................................................................................................................................1379
20.2.6 Valid Slots.........................................................................................................................................1381
20.2.7 Technical Specifications....................................................................................................................1381
20.3 PIUA...........................................................................................................................................................1381
20.3.1 Version Description...........................................................................................................................1381
20.3.2 Application........................................................................................................................................1381
20.3.3 Functions and Features......................................................................................................................1382
20.3.4 Working Principle and Signal Flow..................................................................................................1382
20.3.5 Front Panel.........................................................................................................................................1383
20.3.6 Valid Slots.........................................................................................................................................1385
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Hardware Description

Contents

20.3.7 Technical Specifications....................................................................................................................1385


20.4 PIUB...........................................................................................................................................................1385
20.4.1 Version Description........................................................................................................................... 1386
20.4.2 Application........................................................................................................................................1386
20.4.3 Functions and Features......................................................................................................................1386
20.4.4 Working Principle and Signal Flow..................................................................................................1387
20.4.5 Front Panel.........................................................................................................................................1388
20.4.6 Valid Slots.........................................................................................................................................1389
20.4.7 Technical Specifications....................................................................................................................1389

21 Pluggable Optical Module...................................................................................................1391


21.1 Overview....................................................................................................................................................1392
21.2 SFP/eSFP....................................................................................................................................................1393
21.3 XFP............................................................................................................................................................. 1399
21.4 CWDM/DWDM.........................................................................................................................................1400

22 Pluggable Electrical Module...............................................................................................1416


23 Cables.......................................................................................................................................1418
23.1 Fiber Jumper...............................................................................................................................................1419
23.1.1 Categories of the Fiber Jumpers........................................................................................................1419
23.1.2 Connector...........................................................................................................................................1419
23.2 Power Cable and Ground Cable.................................................................................................................1422
23.2.1 Power Cable of the Cabinet...............................................................................................................1422
23.2.2 Ground Cable of the Cabinet Door....................................................................................................1426
23.2.3 Subrack Power Cable.........................................................................................................................1427
23.2.4 COA Power Cable.............................................................................................................................1429
23.2.5 RPC Power Cable..............................................................................................................................1431
23.3 Alarm Cable................................................................................................................................................1432
23.3.1 Cabinet Indicator Cable.....................................................................................................................1432
23.3.2 Indicator Cascading Cable Between Subracks or Alarm Cascading Cable Between the OptiX OSN
Equipment.....................................................................................................................................................1434
23.3.3 Alarm Cascading Cable Between the OptiX OSN Equipment and the Other Huawei Transmission
Equipment.....................................................................................................................................................1435
23.3.4 Alarm Input/Output Cable.................................................................................................................1437
23.4 Management Cable.....................................................................................................................................1438
23.4.1 OAM Serial Cable.............................................................................................................................1439
23.4.2 Serial 1 to 4/F1/F&f Serial Cable......................................................................................................1440
23.4.3 RS-232/RS-422 Serial Cable.............................................................................................................1441
23.4.4 Ordinary Telephone Line...................................................................................................................1443
23.4.5 COA Cascading Cable.......................................................................................................................1444
23.4.6 Straight-Through Cable.....................................................................................................................1445
23.4.7 Crossover Cable.................................................................................................................................1447
23.5 Signal Cable................................................................................................................................................1448
23.5.1 75-ohm 8xE1 Cable...........................................................................................................................1448
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Contents

23.5.2 120-ohm 8xE1 Cable.........................................................................................................................1451


23.5.3 E3/T3/STM-1 Cable..........................................................................................................................1453
23.5.4 Framed E1 Cable...............................................................................................................................1455
23.5.5 Nx64 kbit/s Cable..............................................................................................................................1455
23.6 Clock Cable................................................................................................................................................1473
23.6.1 75-ohm/120-ohm Clock Cable..........................................................................................................1473
23.6.2 One-Channel Clock Transit Cable and Two-Channel Clock Transit Cable......................................1475

24 Indicators.................................................................................................................................1478
24.1 Indicators on the Cabinet............................................................................................................................1479
24.2 Alarm Indicators on the Boards..................................................................................................................1479

25 Labels.......................................................................................................................................1486
25.1 Safety Labels..............................................................................................................................................1487
25.1.1 Label Description..............................................................................................................................1487
25.1.2 Label Position....................................................................................................................................1488
25.2 Engineering Labels.....................................................................................................................................1490

26 Board Information Quick Reference.................................................................................1494


26.1 Board Version Replacement.......................................................................................................................1495
26.2 Quick Reference Table for Optical Interfaces............................................................................................1500
26.2.1 Common Parameters Specified for Optical Interfaces of SDH Boards.............................................1500
26.2.2 Parameters Specified for the Optical Ports of PDH Boards..............................................................1507
26.2.3 Common Parameters Specified for Optical Interfaces of Packet Boards..........................................1507
26.2.4 Common Parameters Specified for Optical Interfaces of Packet Boards..........................................1510
26.2.5 Common Parameters Specified for Optical Interfaces of Data Boards.............................................1511
26.3 Quick Reference of Board Functions.........................................................................................................1514
26.3.1 Information Quick Reference of SDH Boards...................................................................................1514
26.3.2 Information Quick Reference of PDH Boards...................................................................................1517
26.3.3 Information Quick Reference of Data Boards...................................................................................1518
26.3.4 Information Quick Reference of Packet Boards................................................................................1521
26.4 Loopback Capability of the Boards............................................................................................................1525
26.5 Protection Schemes Supported by Each Board..........................................................................................1535
26.6 Quick Reference of Power Consumption and Weight of Each Board........................................................1542

27 Parameter Settings.................................................................................................................1548
27.1 Packet Processing Boards...........................................................................................................................1550
27.1.1 General Attributes..............................................................................................................................1550
27.1.2 Flow Control......................................................................................................................................1551
27.1.3 Layer 2 Attributes..............................................................................................................................1552
27.1.4 Layer 3 Attributes..............................................................................................................................1554
27.1.5 Advanced Attributes..........................................................................................................................1555
27.2 EoD Boards.................................................................................................................................................1557
27.3 Packet Interface Boards..............................................................................................................................1557
27.3.1 SDH Parameters................................................................................................................................1558
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Contents

27.3.2 Channelized STM-1 Port...................................................................................................................1559


27.3.3 E1 Port...............................................................................................................................................1563
27.4 Data Boards................................................................................................................................................1566
27.4.1 SDH Parameters................................................................................................................................1566
27.4.2 Ethernet Parameters...........................................................................................................................1568
27.4.2.1 Basic Attributes........................................................................................................................1568
27.4.2.2 Flow Control.............................................................................................................................1569
27.4.2.3 Network Attributes...................................................................................................................1570
27.4.2.4 Advanced Attributes.................................................................................................................1571
27.4.2.5 TAG Attributes.........................................................................................................................1575
27.4.2.6 Encapsulation/Mapping............................................................................................................1576
27.4.2.7 Bound Paths..............................................................................................................................1577
27.4.3 ATM Parameters................................................................................................................................1578
27.5 SDH Processing Boards..............................................................................................................................1579
27.6 PDH Boards................................................................................................................................................1580
27.7 WDM Boards..............................................................................................................................................1582
27.8 Cross-Connect and Timing Units...............................................................................................................1590
27.9 Optical Amplifier Boards...........................................................................................................................1594

28 Task Collection......................................................................................................................1602
28.1 Querying the Protection Subnet..................................................................................................................1604
28.2 Troubleshooting Service Unavailability.....................................................................................................1604
28.3 Troubleshooting the Clock Tracing Failure................................................................................................1605
28.4 Configuring the F&f Debugging Serial Port and OAM NM Port..............................................................1606
28.5 Testing the Frequency Accuracy of the Free-Run Clock...........................................................................1607
28.6 Testing the Clock Holdover Accuracy.......................................................................................................1608
28.7 Checking Board Parameters.......................................................................................................................1609
28.8 Testing the SAN Service Channel..............................................................................................................1613
28.9 Testing the SDI Service Channel................................................................................................................1615

A Glossary....................................................................................................................................1617

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Hardware Description

1 Equipment Structure

Equipment Structure

The OptiX OSN 3500 equipment consists of the cabinet, cabinet doors, DC power distribution
unit (PDU), subracks, orderwire phone fixing frame, boards, and cables. The OptiX OSN 3500
subrack can be installed in a 300 mm or 600 mm ETSI cabinet.
Figure 1-1 shows the appearance of the OptiX OSN 3500 that is installed in the 300 mm ETSI
cabinet.

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Figure 1-1 Appearance of the OptiX OSN 3500 that is installed in the 300 mm ETSI cabinet
1

7
7

7
H
D

1. DC PDU

2. Side panel

3. Cable distribution plate

4. Orderwire phone fixing frame

5. Subrack

6. Cabinet

7. Fiber management tray

8. Front door

Figure 1-2 shows the appearance of the general OptiX OSN 3500 subrack and enhanced OptiX
OSN 3500 subrack (1100 W).

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Figure 1-2 Appearance of the general OptiX OSN 3500 subrack and enhanced OptiX OSN 3500
subrack (1100 w)

4
1. Interface board area

2. Fan area

3. Processing board area

4. Cable routing area

Figure 1-3 shows the appearance of the OptiX OSN 3500 type III subrack (2300 W).

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Figure 1-3 Appearance of the OptiX OSN 3500 type III subrack (2300 W)

4
1. Interface board area

2. Fan area

3. Processing board area

4. Cable routing area

NOTE

The difference between a general subrack and a type III subrack (2300 W) is with regard to applicable power
boards. With different power boards, the two types of subracks support different maximum power consumption
values.

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2 Cabinet

Cabinet

About This Chapter


Subracks are installed in a cabinet. OptiX OSN subracks need to be installed in appropriate
cabinets.
2.1 Types of Cabinets
The OptiX OSN 3500 subrack can be installed in the 300 mm or 600 mm ETSI cabinet.2600
mm high T63 cabinets are discontinued. For details, see the released product change notice.
2.2 Configuration of the Cabinet
An ETSI cabinet has indicators and a DC PDU at the top.

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2.1 Types of Cabinets


The OptiX OSN 3500 subrack can be installed in the 300 mm or 600 mm ETSI cabinet.2600
mm high T63 cabinets are discontinued. For details, see the released product change notice.
NOTE

The cabinets described in this topic are provided by Huawei.

The 300 mm ETSI cabinet is available in two types, namely, T63 cabinet and N63E cabinet.
Figure 2-1 shows the appearances of the T63 cabinet and N63E cabinet.

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Figure 2-1 Appearances of the T63 cabinet and N63E cabinet

T63 Cabinet

N63E Cabinet

Comparison Between the Specifications of the T63 Cabinet and the Specifications
of the N63E Cabinet
Table 2-1 describes the comparison between the specifications of the T63 cabinet and the
specifications of the N63E cabinet.
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Table 2-1 Comparison between the specifications of the T63 cabinet and the specifications of
the N63E cabinet
Cabinet

Dimensions (mm)

Weight (kg)

300 mm ETSI cabinet (T63)

600 (W) x 300 (D) x 2000 (H)

58

600 (W) x 300 (D) x 2200 (H)

63

600 (W) x 300 (D) x 2600 (H)

73

600 (W) x 300 (D) x 2000 (H)

41

600 (W) x 300 (D) x 2200 (H)

45

300 mm ETSI cabinet (N63E)

T63 Cabinet
The specifications of the T63 cabinet comply with the ETSI standard. The T63 cabinet is 600
mm wide and 300 mm deep.
There are two ground bolts on the frame at the top of the T63 cabinet. Figure 2-2 shows the
locations of the cable holes at the top of the T63 cabinet. Figure 2-3 shows the locations of the
cable holes at the bottom of the T63 cabinet.
Figure 2-2 Locations of the cable holes at the top of the T63 cabinet
600mm
200mm

106mm

Cabling hole
15mm

160mm

200mm

295mm

106mm

110mm

110mm

Power cable hole Cabniet grounding terminal

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Figure 2-3 Locations of the cable holes at the bottom of the T63 cabinet
600mm
106mm

Cabling hole
15mm

200mm

200mm

160mm

295mm

106mm

Cabniet installtion hole

110mm

Power cable hole

N63E Cabinet
The specifications of the N63E cabinet comply with the ETSI standard. The N63E cabinet is
600 mm wide and 300 mm deep.
There are two ground bolts on the frame at the top of the N63E cabinet. Figure 2-4 shows the
locations of the cable holes at the top of the N63E cabinet. Figure 2-5 shows the locations of
the cable holes at the bottom of the N63E cabinet.
Figure 2-4 Locations of the cable holes at the top of the N63E cabinet
Cable hole Cable hole

Cable hole Cable hole

600mm
143mm

155mm

62mm

81mm

188mm

300mm

66mm

251mm
Fiber hole

Grounding bolt

Fiber hole

Power cable hole

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Figure 2-5 Locations of the cable holes at the bottom of the N63E cabinet
Cable hole

Cable hole

184mm

360mm
Fiber hole

Fiber hole

CAUTION
The difference between the cable routing in the case of the T63 cabinet and the cable routing in
the case of the N63E cabinet is with regard to the cable routing at the top and bottom cable holes.
The cable routing in the T63 cabinet is the same as the cable routing in the N63E cabinet.
The T63 cabinet is approximately 16 mm deeper than the N63E cabinet. When you install the
mounting ears of the components, select proper mounting holes according to the type of cabinet
on site.

Enclosure Frame
Only the 2000 mm and 2200 mm high N63E cabinets are available. If the 2600 mm high N63E
cabinet is required, you need to place a 400 mm high enclosure frame on the top of the 2200
mm high N63E cabinet.
Figure 2-6 shows the picture and dimensions of the enclosure frame.
Figure 2-6 Picture and dimensions of the enclosure frame

60

0m
m

400mm

m
0m
0
3

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N66T Cabinet
The 600 mm ETSI cabinet is called the N66T cabinet. The N66T cabinet uses both the front and
rear columns, and it has a single front door and a single rear door. Figure 2-7 shows the
appearance of the N66T cabinet.
NOTE

The N66T cabinet supports back-to-back installation of one ordinary OptiX OSN 3500 subrack and one
enhanced OptiX OSN 3500 subrack (1,100 W).

Figure 2-7 Appearance of the N66T cabinet

Table 2-2 lists the specifications of the N66T cabinet.

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2 Cabinet

Table 2-2 Specifications of the N66T cabinet


Cabinet

Dimensions (mm)

Weight (kg)

N66T cabinet

600 (W) x 600 (D) x 2000 (H)

71

600 (W) x 600 (D) x 2200 (H)

76

There are two ground bolts on the frame at the top of the N66T cabinet. Figure 2-8 shows the
locations of the cable holes at the top of the N66T cabinet. Figure 2-9 shows the locations of
the cable holes at the bottom of the N66T cabinet.
Figure 2-8 Locations of the cable holes at the top of the N66T cabinet
600 mm

95 mm

95 mm

95 mm

215 mm

Cabling hole

17.8 mm

600 mm

95 mm

17.8 mm

224 mm

Power cable hole

Cabniet grounding terminal

224 mm

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2 Cabinet

Figure 2-9 Locations of the cable holes at the bottom of the N66T cabinet

Cabling hole

2.2 Configuration of the Cabinet


An ETSI cabinet has indicators and a DC PDU at the top.
Figure 2-10 shows the positions of the indicators and the DC PDU.

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2 Cabinet

Figure 2-10 ETSI cabinet


1
2
PowerCritical MajorMinor

Power distribution unit

H
W

1. Indicators

2. DC PDU

2.2.1 Indicators
The ETSI cabinet has one power indicator and three alarm severity indicators.
Table 2-3 describes the meanings of the status of the indicators.
Table 2-3 Meanings of the status of the indicators
Indicator

Status

Meaning

Power indicator - Power (green)

On

Power is supplied to the


equipment.

Off

Power is not supplied to


the equipment.

On

A critical alarm occurs


on the equipment.

Off

No critical alarm
occurs on the
equipment.

On

A major alarm occurs


on the equipment.

Off

No major alarm occurs


on the equipment.

Critical alarm indicator - Critical (red)

Major alarm indicator - Major (orange)

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Indicator

Status

Meaning

Minor alarm indicator - Minor (yellow)

On

A minor alarm occurs


on the equipment.

Off

No minor alarm occurs


on the equipment.

CAUTION
The status of the indicators is controlled by the AUX on the subrack. The indicators work only
after the cables of the indicators are correctly connected and the subrack is powered on.

2.2.2 DC Power Distribution Unit


The DC power distribution unit (PDU) is located on the top of a cabinet and is used to supply
power to the equipment.

DC Power Distribution Unit N1PDU


Figure 2-11 shows the front panel of the general cabinet DC PDU, N1PDU.
Figure 2-11 Front panel of the N1PDU

3
2
OUTPUT

2 3 4 5

ON

3
2
OUTPUT

ON
RTN1(+) RTN2(+) NEG1(-) NEG2(-)

OFF
32A

32A

20A

INPUT

OFF

20A

32A

32A

1. Terminal block (A)

2. Power ground cable RTN1(+)

3. Power ground cable RTN2(+)

4. Power cable NEG1(-)

5. Power cable NEG2(-)

6. Terminal block (B)

7. PGND

8. Power switch

20A

20A

In the case of the OptiX OSN 3500, the output terminal block on side A supplies power to the
power interface board on side A of the subrack, and the output terminal block on side B supplies
power to the power interface board on side B of the subrack. Table 2-4 shows the connections
of the output terminal blocks on side A and side B.
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Table 2-4 Connections of the output terminal blocks on side A and side B
Terminal
Block on
Side A

Corresponding Subrack
and Power Interface
Board

Terminal
Block on
Side B

Corresponding Subrack
and Power Interface
Board

Power interface board on


side A of the first subrack

Power interface board on


side B of the first subrack

Power interface board on


side A of the second subrack

Power interface board on


side B of the second subrack

Power interface board on


side A of the third subrack

Power interface board on


side B of the third subrack

Power interface board on


side A of the fourth subrack

Power interface board on


side B of the fourth subrack

NOTE

In the case of an enhanced subrack, the two power inputs work in load-sharing mode (each input carries
16 A). In the telecommunications room, however, the PDU needs to provide power supply of 34 A to an
entire subrack. In the case of a general subrack, the two power inputs work in load-sharing mode (each
input carries 10 A). In the telecommunications room, however, the PDU needs to provide power supply of
20 A to an entire subrack. In this case, power failure will not occur if either of the power inputs fails.

CAUTION
In the case of the OptiX OSN 3500, the first and second terminal blocks are used. The third and
fourth terminal blocks supplies power to other equipment such as case-shaped optical amplifiers.
The number of the subracks increases from the bottom up.
NOTE

The DPD100-2-8 PDU can substitute for the N1PDU.

DC Power Distribution Unit DPD100-2-8 PDU


The DPD100-2-8 is installed at the top of the cabinet, and is divided into two parts, namely, part
A and part B that back up each other. Part A and part B each receive one -48 V power input and
provide four power outputs to subracks inside the cabinet.
Figure 2-12 and Figure 2-13 show the front panel of the DPD100-2-8 PDU.
Figure 2-12 Front panel of the DPD100-2-8 PDU (covered)

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Figure 2-13 Front panel of the DPD100-2-8 PDU (uncovered)

Power output area: On both sides of the DC PDU, there are respectively four output terminal
blocks that are used to connect to the power cables of subracks.

Power input area: INPUT A and INPUT B are each connected to one -48 V DC power cable
and one power ground cable, that is, two -48 V DC power cables and two power ground
cables in total.

Power switch area: On both sides of the DC PDU, there are respectively four power output
switches that correspond to the output terminal blocks. The power output switches control
power supply to the corresponding subracks.

DC Power Distribution Unit TN51PDU


The TN51PDU is installed at the top of the cabinet, and is divided into two parts, namely, part
A and part B that back up each other. Part A and part B respectively access four -48 V power
supplies. Among them:
l

Connections of main power supply: Part A is connected to RTN(+) and NEG(-).

Connections of standby power supply: Part B is connected to RTN(+) and NEG(-).


NOTE

RTN(+)s and NEG(-)s are located at the upper layer and lower layer of the power input area respectively.

The TN51PDU provides eight power output interfaces, supplying power to the subracks inside
the cabinet. Figure 2-14 shows the front panel of the TN51PDU.
Figure 2-14 Front panel of the TN51PDU

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Power output area: On both sides of the DC PDU, there are respectively four output terminal
blocks that are used to connect to the power cables of subracks.

Power input area: The TN51PDU supports corresponding power input capability based on
the power supply capacity of the telecommunications room.
When the telecommunications room provides four power inputs not less than 63 A, part
A and part B can respectively be connected to four -48 V DC power cables and four
power ground cables, that is, eight -48 V DC power cables and eight power ground
cables in total.
When the telecommunications room provides two power inputs not less than 125 A,
part A and part B can respectively be connected to two -48 V DC power cables and two
power ground cables, that is, four-48 V DC power cables and four power ground cables
in total.

Power switch area: On both sides of the DC PDU, there are respectively four power output
switches that correspond to the output terminal blocks. The power output switches control
power supply to the corresponding subracks.

DC Power Distribution Unit DPD63-8-8 PDU


The DPD63-8-8 PDU is installed at the top of the cabinet, and is divided into two parts, namely,
part A and part B that back up each other. Part A and part B each receive four -48 V power inputs
and provide four power outputs subracks inside the cabinet.
Figure 2-15 and Figure 2-16 show the front panel of the DPD63-8-8 PDU.
Figure 2-15 Front panel of the DPD63-8-8 PDU (covered)

Figure 2-16 Front panel of the DPD63-8-8 PDU (uncovered)

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Power output area: On both sides of the DC PDU, there are respectively four output terminal
blocks that are used to connect to the power cables of subracks.

Power input area: INPUT A and INPUT B are each connected to four -48 V DC power
cables and four power ground cables, that is, eight -48 V DC power cables and eight power
ground cables in total.

Power switch area: On both sides of the DC PDU, there are respectively four power output
switches that correspond to the output terminal blocks. The power output switches control
power supply to the corresponding subracks.
NOTE

Each of part A and part B needs to be connected to only two -48 V DC power cables and two power ground
cables.
The DPD63-8-8 PDU can substitute for the TN51PDU.
By default, one DPD63-8-8 PDU provides eight inputs and eight outputs. It can provide four inputs and
eight outputs with a short-circuiting copper bar installed.

Power Distribution Scheme


The DC PDU provides two groups (left and right) of power output at the same time. Table
2-5 lists the power distribution scheme of the N1PDU. Table 2-6 lists the power distribution
scheme of the TN51PDU. Table 2-7 lists the power distribution scheme of the DPD100-2-8
PDU.Table 2-8 lists the power distribution scheme of the DPD63-8-8 PDU.
Table 2-5 Power distribution scheme of the N1PDU
Input/
Output

Group
No.

Power

Ground
Cable

Remarks

Power input

INPUT

NEG1(-)

RTN1(+)

External power supply 1

NEG2(-)

RTN2(+)

External power supply 2

32 A
power
supply
group

1(-)

1(+)

Two outputs, providing 1+1 hot backup


of 32 A power to the subrack

2(-)

2(+)

Two outputs, providing 1+1 hot backup


of 32 A power to the subrack

20 A
power
supply
group

3(-)

3(+)

Two outputs, providing 1+1 hot backup


of 20 A power to the subrack

4(-)

4(+)

Two outputs, providing 1+1 hot backup


of 20 A power to the subrack

Connected to the protection ground of


the cabinet

Power
output

Protection
ground

Table 2-6 Power distribution scheme of the TN51PDU

Issue 03 (2013-02-20)

Input/Output

Group No.

Remarks

Power input
(short-circuiting

INPUT A

Two 63 A power inputs and two 32 A power inputs

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Input/Output

Group No.

Remarks

copper bar not


installed)

INPUT B

Two 63 A power inputs and two 32 A power inputs

Power input
(short-circuiting
copper bar
installed)

INPUT A

One 125 A power input and two 32 A power inputs

INPUT B

One 125 A power input and two 32 A power inputs

Power output

63 A power
supply group

Four outputs, providing 1+1 hot backup of 63 A power


to the subrack

32 A power
supply group

Four outputs, providing 1+1 hot backup of 32 A power


to the subrack

Connected to the protection ground of the cabinet

Protection
ground

Table 2-7 Power distribution scheme of the DPD100-2-8 PDU


Input/Output

Group No.

Remarks

Power input

INPUT A

One 100 A power input

INPUT B

One 100 A power input

OUTPUT A

Four outputs, providing two 32 A power inputs and two


20 A power inputs to subracks

OUTPUT B

Four outputs, providing 1+1 hot backup for the two 32


A power inputs and two 20 A power inputs to subracks

Connected to the protection ground of the cabinet

Power output

Protection
ground

Table 2-8 Power distribution scheme of the DPD63-8-8 PDU

Issue 03 (2013-02-20)

Input/Output

Group No.

Remarks

Power input
(short-circuiting
copper bar not
installed)

INPUT A

Two 63 A power inputs and two 32 A power inputs

INPUT B

Two 63 A power inputs and two 32 A power inputs

Power input
(short-circuiting
copper bar
installed)

INPUT A

One 125 A power input and one 63 A power input

INPUT B

One 125 A power input and one 63 A power input

Power output

OUTPUT A

Four outputs, providing two 63 A power inputs and two


32 A power inputs to subracks

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Input/Output

Protection
ground

2 Cabinet

Group No.

Remarks

OUTPUT B

Four outputs, providing 1+1 hot backup for the two 63


A power inputs and two 32 A power inputs to subracks

Connected to the protection ground of the cabinet

Technical Specifications
Table 2-9 Technical specifications of the PDU
Board

Dimensions
(mm)

Single-Cabinet
Input Voltage
(V)

Single-Cabinet
Output Voltage
(V)

Output
Current (A)

DPD100-2
-8 PDU

442 (W) x 79.6


(D) x 110 (H)

-48 (DC)

-38.4 to -57.6

-60 (DC)

-48 to -72

l 4x32 A
l 4x20 A

N1PDU

530 (W) x 97 (D)


x 133 (H)

-48 (DC)

-38.4 to -57.6

-60 (DC)

-48 to -72

-48 (DC)

-38.4 to -57.6

-60 (DC)

-48 to -72

-48 (DC)

-38.4 to -57.6

-60 (DC)

-48 to -72

DPD63-88 PDU

442 (W) x 79.6


(D) x 110 (H)

TN51PDU

535 (W) x 147


(D) x 133 (H)

l 4x32 A
l 4x20 A
l 4x63 A
l 4x32 A
l 4x63 A
l 4x32 A

NOTE
l Two power inputs that back up each other need to be provided, and they work in load-sharing mode.
l In the telecommunications room, it is required that the PDU needs to provide power supply for an
entire subrack. In this case, normal power supply can be guaranteed when either of the power inputs
fails.

2.2.3 Other Configurations


In addition to subracks, external case-shaped devices can be installed in a cabinet as required.
l

Uninterruptible power module (UPM)

Roman pump amplifiers RPC01 and RPC02

Orderwire phone

Dispersion compensation module (DCM)

Case-shaped optical amplifier (COA)

Fiber management tray

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3 Subrack

Subrack

About This Chapter


This topic describes the structure, capacity, slot layout, and technical specifications of the
subrack.
3.1 Subrack Structure
An OptiX OSN 3500 subrack has a two-layer structure. The subrack consists of a processing
board area, an interface board area, a fan area, and a cable routing area.
3.2 Slot Allocation
An OptiX OSN 3500 subrack consists of an upper layer and a lower layer. The upper layer,
where 19 slots are available, is the slot area for interface boards. The lower layer, where 18 slots
are available, is the slot area for processing boards.
3.3 Slot Access Capacity in Packet Mode
When different cross-connect boards are used, the access capacity of each slot on the equipment
varies.
3.4 Slot Access Capacity in TDM Mode
When different cross-connect boards are used, the access capacity of each slot on the equipment
varies.
3.5 Ventilation Mode
The subrack of the equipment has many minute air vents and houses fans. The air enters from
the front and exits from the back, and the air flows from the bottom to the top. In this manner,
the equipment has good performance in heat dissipation.
3.6 Cable Management
This topic describes the function of the cable distribution plate and fiber spool box and the overall
scheme for cable routing.
3.7 Mapping Policies of Power Consumption
The increasing features supported by the equipment cause higher power consumption. To ensure
the normal operation of the equipment, the internal power supply system provides different
mapping policies of power consumption according to different power consumption
requirements.
3.8 Technical Specifications
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The technical specifications of the subrack include the dimensions, weight, and maximum power
consumption.

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3 Subrack

3.1 Subrack Structure


An OptiX OSN 3500 subrack has a two-layer structure. The subrack consists of a processing
board area, an interface board area, a fan area, and a cable routing area.
Figure 3-1 shows the structure of an OptiX OSN 3500 subrack.
Figure 3-1 Structure of an OptiX OSN 3500 subrack

2
3

5
4
H
W

1. Interface board area

2. Fan area

3. Processing board area

4. Cable routing area

5. Mounting ear

The functions of the areas are as follows:


l

Interface board area: This area houses the interface boards of the OptiX OSN 3500.

Fan area: This area houses three fan modules, which dissipate heat generated by the
equipment.

Processing board area: This area houses the processing boards of the OptiX OSN 3500.

Cable routing area: This area houses fiber jumpers in a subrack.

Mounting ear: This mounting ear secures the subrack in a cabinet.


NOTE

An interface board is also called an access board or a transit board. An interface board provides physical
interfaces for optical signals and electrical signals, and transmits the optical signals or electrical signals to
the corresponding processing board.

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

3 Subrack

3.2 Slot Allocation


An OptiX OSN 3500 subrack consists of an upper layer and a lower layer. The upper layer,
where 19 slots are available, is the slot area for interface boards. The lower layer, where 18 slots
are available, is the slot area for processing boards.
Figure 3-2 shows the slot layout of an OptiX OSN 3500 subrack.
Figure 3-2 Slot layout of an OptiX OSN 3500 subrack

S
L
O
T
1
9

S
L
O
T
2
0

S
L
O
T
2
1

S
L
O
T
2
2

S
L
O
T
2
3

S
L
O
T
2
4

S
L
O
T
2
5

S
L
O
T
2
6

S
L
O
T
2
7

S
L
O
T
2
8

P
I
U

P
I
U

S S S S
L L L L
O O O O
T T T T
2 3 4 5

S
L
O
T
3
0

S
L
O
T
6

S S
L L
O O
T T
7 8

S
L
O
T
3
1

S
L
O
T
3
2

S
L
O
T
3
3

S
L
O
T
3
4

S
L
O
T
3
5

S
L
O
T
3
7

S
L
O
T
3
6

A
U
X

FAN
SLOT 39

FAN
SLOT 38

S
L
O
T
1

S
L
O
T
2
9

S
L
O
T
9

S
L
O
T
1
0

X
C
S

X
C
S

S
L
O
T
1
1

FAN
SLOT 40

S S S S
L L L L
O O O O
T T T T
1 1 1 1
2 3 4 5

S
L
O
T
1
6

S
L
O
T
1
7

S
L
O
T
1
8

G
S
C
C

G
S
C
C

Fiber routing trough

Figure 3-3 shows the dual-slot layout of an OptiX OSN 3500 subrack.

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

3 Subrack

Figure 3-3 Dual-slot layout of an OptiX OSN 3500 subrack

S
L
O
T
1
9

S
L
O
T
2
0

S
L
O
T
2
1

S
L
O
T
2
2

S
L
O
T
2
4

S
L
O
T
2
3

S
L
O
T
2
5

S
L
O
T
2
6

S
L
O
T
2
7

S
L
O
T
2
8

P
I
U

P
I
U

S
L
O
T
3

S
L
O
T
5

S
L
O
T
3
0

S
L
O
T
3
1

S
L
O
T
3
2

S
L
O
T
3
3

S
L
O
T
7

S
L
O
T
3
5

S
L
O
T
3
4

S
L
O
T
3
7

S
L
O
T
3
6

A
U
X

FAN
SLOT 39

FAN
SLOT 38

S
L
O
T
1

S
L
O
T
2
9

S
L
O
T
9

S
L
O
T
1
0

X
C
S

X
C
S

S
L
O
T
1
1

FAN
SLOT 40

S
L
O
T
1
3

S
L
O
T
1
5

S
L
O
T
1
7

S
L
O
T
1
8

G
S
C
C

G
S
C
C

Fiber routing trough

Slot Area for Interface Boards


Slots for service interface boards: slots 19-26 and 29-36

Slot Area for Processing Boards


Slots for service processing boards: slots 1-8 and 11-17

Other Slots
l

Slots for cross-connect and timing boards: slots 9-10

Slots for system control and communication boards: slots 17-18 (slot 17 can also house a
processing board)

Slots for power interface boards: slots 27-28

Slot for an auxiliary interface board: slot 37

Slots for fan boards: slots 38-40

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

3 Subrack

NOTE

In an OptiX OSN 3500 subrack, dual-slot boards and single-slot boards cannot be installed at the same
time.

Mapping Between Slots for Interface Boards and Slots for Processing Boards
Table 3-1 lists the mapping between slots for interface boards and slots for processing boards.
Table 3-1 Mapping between slots for interface boards and slots for processing boards
Slot for
Processing
Board

Dual-Slot for
Processing Board

Slot for Corresponding Interface Board

Slot 2

Slots 19 and 20

Slot 3

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slot 5

Slots 25 and 26

Slot 13

Slot 13

Slot 29 and 30

Slot 14

Slot 31 and 32

Slot 15

Slot 15

Slot 33 and 34

Slot 16

Slot 35 and 36

Paired Slots
If overhead bytes pass through the backplane bus between two slots, the two slots are called
paired slots. Paired slots achieves automatic transparent transmission of overhead bytes such as
K bytes, D bytes, and E1 overhead bytes. This improves multiplex section protection (MSP)
switching performance and protects orderwire and DCC communication with other NEs even
after the system control board on the local NE cannot be detected. Table 3-2 lists paired slots.
Table 3-2 Paired slots
Cross-Connect Capacity

Paired Slot

200 Gbit/s

(Slot 2, Slot 17)


(Slot 3, Slot 16)
(Slot 4, Slot 15)
(Slot 5, Slot 14)
(Slot 6, Slot 13)
(Slot 7, Slot 12)
(Slot 8, Slot 11)

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

3 Subrack

3.3 Slot Access Capacity in Packet Mode


When different cross-connect boards are used, the access capacity of each slot on the equipment
varies.
When the N1PSXCS board is used, one service processing board occupies two slots. In this case,
adjacent slots can be merged, as shown in Figure 3-4.
Figure 3-4 Slot access capacity of the OptiX OSN 3500 when the N1PSXCS board is used (dualslot)

S
L
O
T
1
3

S
L
O
T
1
5

S S
L L
O O
T T
1 1
7 8

GSCC

S
L
O
T
1
1

GSCC

10Gbit/s

S
L
O
T
1
0

7.5Gbit/s

10Gbit/s

S
L
O
T
9

10Gbit/s

S
L
O
T
7

10Gbit/s

S
L
O
T
5

XCS

S
L
O
T
3

FAN

XCS

S
L
O
T
1

7.5Gbit/s

FAN

5Gbit/s

FAN

Cable routing area

Figure 3-5 shows the slot access capacity of the OptiX OSN 3500 when the N2PSXCSA or
N3PSXCSA board is used.

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

3 Subrack

Figure 3-5 Slot access capacity of the OptiX OSN 3500 when the N2PSXCSA/N3PSXCSA
board is used (single slots)

GSCC

GSCC

5Gbit/s

XCS

S S S S
L L L L
O O O O
T T T T
1 1 1 1
5 6 7 8

2.5Gbit/s

20Gbit/s

S
L
O
T
1
4

5Gbit/s

10Gbit/s

S S
L L
O O
T T
1 1
2 3

5Gbit/s

2.5Gbit/s

S
L
O
T
1
1

10Gbit/s

2.5Gbit/s

S
L
O
T
1
0

20Gbit/s

S
L
O
T
9

5Gbit/s

S
L
O
T
8

5Gbit/s

S
L
O
T
7

5Gbit/s

S S S S S
L L L L L
O O O O O
T T T T T
2 3 4 5 6

2.5Gbit/s

S
L
O
T
1

FAN

XCS

FAN

FAN

Cable routing

3.4 Slot Access Capacity in TDM Mode


When different cross-connect boards are used, the access capacity of each slot on the equipment
varies.
Figure 3-6 shows the slot access capacity of the OptiX OSN 3500.
Figure 3-6 Slot access capacity of the OptiX OSN equipment

S
L
O
T
1
0

S
L
O
T
1
1

S S
L L
O O
T T
1 1
2 3

S
L
O
T
1
4

XCS

XCS

20Gbit/s

20Gbit/s

10Gbit/s
5Gbit/s

S S S S
L L L L
O O O O
T T T T
1 1 1 1
5 6 7 8

GSCC

S
L
O
T
9

5Gbit/s or GSCC

S
L
O
T
8

10Gbit/s

S
L
O
T
7

20Gbit/s

FAN

20Gbit/s

10Gbit/s

10Gbit/s

5Gbit/s

5Gbit/s

S S S S S
L L L L L
O O O O O
T T T T T
2 3 4 5 6

5Gbit/s

S
L
O
T
1

5Gbit/s

FAN

5Gbit/s

FAN

Cable routing

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

3 Subrack

3.5 Ventilation Mode


The subrack of the equipment has many minute air vents and houses fans. The air enters from
the front and exits from the back, and the air flows from the bottom to the top. In this manner,
the equipment has good performance in heat dissipation.
NOTE

Make smooth ventilation of the air pipe of the cabinet. Do not block the air intake vents and air exhaust
vents of the subrack. Do not place any sundries in the upper part of the subrack to ensure that air can flow
through the subrack.

Figure 3-7 Ventilation mode of the OptiX OSN 3500

AIR OUT

AIR OUT

AIR OUT

AIR IN

NOTE

When the arrow color changes from a cool color to a warm color, air temperature increases.

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

3 Subrack

3.6 Cable Management


This topic describes the function of the cable distribution plate and fiber spool box and the overall
scheme for cable routing.

Cable Distribution Plate


One subrack needs to have one cable distribution plate installed on its top. Figure 3-8 shows
the appearance of the cable distribution plate. The function of the cable distribution plate is to
fix the equipment cable to avoid the difficulty that the board may not be easily reseated or that
the air vents of the equipment are blocked and therefore the heat dissipation of the equipment
is poor.
Figure 3-8 Appearance of the cable distribution plate

Fiber Spool Box


The fiber spool box is used to coil the redundant optical fibers inside the cabinet, and is installed
under a subrack by default. Figure 3-9 shows the appearance of a fiber spool box.
Figure 3-9 Appearance of a fiber spool box

Cable-through
hole

Fiber spool
box

For the installation position of the fiber spool box and cable distribution plate in the cabinet, see
1 Equipment Structure.
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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

3 Subrack

Overall Scheme for Fiber Jumper Routing


l

The fiber jumpers of the equipment are routed through the front vertical columns at the two
sides of the cabinet.

The fiber jumpers of the equipment are led out through the fiber hole of the cabinet.

The fiber jumpers between the cabinet and the ODF are protected with a protection pipe.
The two ends of the protective pipe should be extended 10 cm into the cabinet and the ODF.

The fiber jumpers are secured smoothly and interconnected reliably in the ODF. The
redundant fiber jumpers are coiled tidily.

When the internal fiber jumpers are routed, the redundant fibers are coiled tidily in the fiber
spool box.

The routing and connection of the fiber jumpers should be consistent with the design. The
optical attenuators are added according to the requirements of the engineering design.

The bend radius of the fiber jumper must be greater than its minimum curvature radius.
Specifically, the minimum curvature radius for the 2 mm fiber jumper is 40 mm, and that
for the 3 mm fiber jumper is 60 mm.

Overall Scheme for Cable Routing


l

The external power cables and ground cables are arranged separately from the signal cables,
with a space more than 3 cm.

The power cables of the subrack are bundled under the cable distribution plate. The power
cables of the subrack are routed separately towards the back of the two sides of the cabinet,
and are routed along the back of the side panels to reach the power box.

The power cables of the IF board connect the IF power board to the IF board and are routed
through the cable-routing channel. If the IF power cable is redundant in the cable-routing
channel, bundle the redundant part of the power cable on the vertical column or at the cablerouting area on the side of the cabinet.

The method of routing the IF cables is the same as the method of routing the signal cables.

In the case of overhead cabling, the signal cables of the upper subrack are led out from the
cable-through holes in the top middle of the cabinet, and the signal cables of the lower
subrack are led out from the cable-through holes on the two sides of the top of the cabinet.

In the case of underfloor cabling, the signal cables of the upper and lower subracks are led
out from the cable-through holes on the two sides of the bottom of the cabinet.

3.7 Mapping Policies of Power Consumption


The increasing features supported by the equipment cause higher power consumption. To ensure
the normal operation of the equipment, the internal power supply system provides different
mapping policies of power consumption according to different power consumption
requirements.
The internal power supply system consists of PDU and PIU. Table 3-3 shows different mapping
policies of power consumption.

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

3 Subrack

Table 3-3 Mapping policies of power consumption on the OptiX OSN 3500
Type of
Subrac
k

Label of Subrack

Mappin
g PDU

Mappi
ng PIU

Mappin
g UPM

Maxim
um
Power
Consu
mption

Fuse
Capacit
y of
Circuit
Breaker
s in a
DC
PDU

Standard
OptiX
OSN
3500
subrack

N1PDU,
DPD100
-2-8
PDU

N1PIU,
N1PIU
A

EPS75-4
815AF

720 W

20 A

Enhance
d OptiX
OSN
3500
subrack
(1100
W)

N1PDU,
DPD100
-2-8
PDU

N1PIU
A

EPS75-4
815AF

1100 W

32 A

OptiX
OSN
3500
type III
subrack
(2300
W)

TN51PD
U,
DPD638-8 PDU

N1PIUB

EPS75-4
815AF

2300 W

63 A

CAUTION
When the type III subrack (2300 W) is configured with N1PDU/DPD100-2-8 PDU, the
maximum power consumption of the equipment is 1100 W. Therefore, it is recommended that
the type III subrack (2300 W) be configured with 51PDU/DPD63-8-8 PDU.
The service boards supported by various subracks are the same. However, for a specific type of
service board, the maximum number of boards that can be configured per subrack is related to
the power consumption of the subrack.

3.8 Technical Specifications


The technical specifications of the subrack include the dimensions, weight, and maximum power
consumption.
Table 3-4 lists the technical specifications of the OptiX OSN 3500 subrack.

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

3 Subrack

Table 3-4 Technical specifications of the OptiX OSN 3500 subrack


Dimensions (mm)

Weight (kg)

497 (W) x 295 (D) x 722 (H)

23 (net weight of the subrack that is not


installed with boards or fans)

Table 3-5 lists the maximum power consumption of the OptiX OSN 3500 subrack.
Table 3-5 Maximum power consumption of the OptiX OSN 3500 subrack
Subrack
Type

Maximum
Power
Consumpt
iona

General
720 W
OptiX
OSN 3500
subrack

Fuse
Capaci
ty

Typical Configuration
Typical Power
Consumption

Typical Configuration

20 A

496 W

l Two N1SLD64 (S-64.2b, LC)


boards
l Two N2SLQ4 (S-4.1, LC)
boards
l Two N1SLQ16 (L-16.2, LC)
boards
l Two N1SLH1 (S-1.1, LC)
boards
l Four N1OU08 boards
l Two N2EGT2 boards
l Two N1PSXCS boards
l One N4GSCC board
l One N1AUX board
l Two N1PIU boards

Enhanced 1100 W
OptiX
OSN 3500
subrack

32 A

534 W

l Two N1SL64 (S-64.2b, LC)


boards
l Two N2SLQ4 (S-4.1, LC)
boards
l One N1SLT1 (S-1.1, LC)
board
l Two N1PEG8 boards
l Two N1PEX2 boards
l Two N1PETF8 boards
l Two N2PSXCSA boards
l One N1AUX board
l Two N1PIUA boards

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

Subrack
Type

Maximum
Power
Consumpt
iona

OptiX
2300 W
OSN 3500
type-III
subrack

3 Subrack

Fuse
Capaci
ty

Typical Configuration
Typical Power
Consumption

Typical Configuration

63 A

718 W

l Five N1PEG8 boards


l Two N1PEX2 boards
l Two N2PEX1 boards
l Three N1PETF8 boards
l Two N2PSXCSA boards
l One N1AUX board
l Two N1PIUB boards

a: The maximum power consumption refers to the maximum power consumption


configuration that the subrack can support and the maximum heat dissipation capability of
the subrack. In the actual application, the value is much higher than the power consumption
of the subrack in typical configuration.

NOTE

The default maximum power consumption of the equipment is 1100 W. If the maximum power
consumption of the equipment needs to reach 2300 W, set the maximum power consumption parameter
on the NMS.
When the cabinet is fully loaded, the maximum power consumption is the sum of the maximum power
consumption of all subracks and the maximum power consumption of other configuration.
In the case of transmission equipment, power consumption is generally transformed into heat consumption.
Hence, heat consumption (BTU/h) and power consumption (W) can be converted to each other in the
formula: Heat consumption (BTU/h) = Power consumption (W) / 0.2931 (Wh).

Table 3-6 lists the predicted reliability specifications of the OptiX OSN equipment.
Table 3-6 Equipment predicted reliability

Issue 03 (2013-02-20)

System
Availability

Mean Time to Repair (MTTR)

Mean Time Between Failures


(MTBF)

0.9999964

1 hour

31.83 years

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

4 Overview of Boards

Overview of Boards

About This Chapter


This topic describes the appearances, dimensions, bar codes, and classification of the boards
used on the OptiX OSN systems.
4.1 Appearances and Dimensions of the Boards
Different boards have different appearances and dimensions.
4.2 Bar Codes of the Boards
The bar code on the front panel of a board indicates the version, name, and feature code of the
board.

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

4 Overview of Boards

4.1 Appearances and Dimensions of the Boards


Different boards have different appearances and dimensions.
Table 4-1 provides information about the appearances and dimensions of the boards used on
the OptiX OSN 3500.
Table 4-1 Appearances and dimensions of the boards used on the OptiX OSN 3500
Parameter

Appearance and Dimensions

Board
appearance

Board
classificatio
n

Optical interface board


(for example, SL16)

Service processing
board (for example,
PQ1)

Service interface board


(for example, D75S)

Height
(mm)

262.05

262.05

262.05

Depth (mm)

220

220

110

Width (mm)

25.4

25.4

22

Cross-connect and
timing board

System auxiliary
interface board (AUX)

Power interface board


(PIU)

Board
appearance

Board
classificatio
n

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

4 Overview of Boards

Parameter

Appearance and Dimensions

Height
(mm)

262.05

262.05

262.05

Depth (mm)

220

110

110

Width (mm)

40

44

44

Board
appearance

Board
classificatio
n

Board that occupies two


slots (such as the
N1PEG16)

Height
(mm)

262.05

Depth (mm)

220

Width (mm)

50.8

Note: The figure in the right cell shows the three dimensions.
"H" and "W" indicate the height and width of the front panel
respectively and "D" indicates the depth of the printed circuit
board (PCB).

H
D

CAUTION
Wear an ESD wrist strap when holding a board. To prevent the static discharge from damaging
the board, ensure that the ESD wrist strap is grounded properly.

DANGER
Do not look directly at the optical interface board or optical interface. The laser beams inside
the fiber can damage your eyes.

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

4 Overview of Boards

CAUTION
l A level optical module cannot be directly connected to an optical attenuator. If an optical
attenuator is required, use the attenuator on the optical distribution frame (ODF) side.
l If an optical attenuator is required, insert the attenuator in the IN interface instead of the OUT
interface.
l Add an attenuator when performing a loopback at an optical interface to prevent the optical
module from being damaged.

4.2 Bar Codes of the Boards


The bar code on the front panel of a board indicates the version, name, and feature code of the
board.
Two types of bar codes are used for the boards of the OptiX OSN 3500, which are as follows:
l

16-digit manufacturing code + board version + board name + board feature code

20-digit manufacturing code + board version + board name + board feature code

The bar code is attached to the front panel of a board. Figure 4-1 shows the bar code with a 16digit manufacturing code.
Figure 4-1 Bar code of a board

Bar code

0364401055000015 -SSN3SL16A01

Last six digits of the BOM code


Internal code
Board version
Board name
5 Board feature code

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

4 Overview of Boards

NOTE

The positions of bar codes vary according to boards. For details on the feature code of a board, see the
topic that describes the feature code of the board.

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

5 Classification of Boards

Classification of Boards

Boards are functionally classified into cross-connect boards and system control boards, packet
processing boards, packet interface boards, SDH boards, PDH boards, WDM boards, optical
amplifier boards and dispersion compensation boards, auxiliary boards, and power boards.
NOTE

For details on the board version replacement relationship between boards, see 26.1 Board Version
Replacement in the Hardware Description.

Cross-Connect Boards and System Control Boards


Table 5-1 lists all cross-connect boards and system control boards and their applicable products.
Table 5-1 List of cross-connect boards and system control boards

Issue 03 (2013-02-20)

Board

Description

Applicable Product

TNN1SCA

System control and auxiliary


processing board

OptiX OSN 7500 II

TNN1PSXCS

Super Cross-connect and


Synchronous Timing Board

OptiX OSN 7500 II

T1PSXCSA

Super dual-plane crossconnect and synchronous


timing board

OptiX OSN 7500

N4GSCC,
N6GSCC

System Control and


Communication Board

OptiX OSN 7500, OptiX OSN 3500

N1PSXCS,
N2PSXCSA,
N3PSXCSA

Super Cross-connect and


Synchronous Timing Board
(supporting packet features)

OptiX OSN 3500

N1SXCSA

Super cross-connect and


synchronous timing board
(only applicable in TDM
mode)

OptiX OSN 3500

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Hardware Description

5 Classification of Boards

Board

Description

Applicable Product

R1PCXLN

SCC unit, cross-connect unit,


and optical interface unit
integrated board (supporting
the packet feature)

OptiX OSN 1500

Packet Processing Boards


Table 5-2 lists all packet processing boards and their applicable products.
Table 5-2 List of packet processing boards
Board

Description

Applicable Product

TNN1EX2

2x10GE processing board

OptiX OSN 7500 II

N1PEX2

2-port 10 Gigabit Ethernet


switching processing board

OptiX OSN 7500, OptiX OSN 3500

N1PEX1

1x10GE Ethernet processing


board

OptiX OSN 3500

N2PEX1

1x10GE Ethernet processing


board

OptiX OSN 7500, OptiX OSN 3500

N1PEG16

16xGE Ethernet processing


board

OptiX OSN 3500

TNN1EG8

8xGE processing board

OptiX OSN 7500 II

N1PEG8

8-Port Gigabit Ethernet


switching processing board

OptiX OSN 7500, OptiX OSN 3500

Q1PEGS2

2xGE processing board

OptiX OSN 1500A, OptiX OSN 1500B

R1PEGS1

1xGE processing board

OptiX OSN 1500A, OptiX OSN 1500B

R1PEFS8

8xFE processing board

OptiX OSN 1500A, OptiX OSN 1500B

R1PEF4F

4xFE optical processing


board

OptiX OSN 1500A, OptiX OSN 1500B

R1ML1

Multi-protocol 16xE1
electrical processing board

OptiX OSN 1500A, OptiX OSN 1500B

Packet Interface Boards


Table 5-3 lists all packet interface boards and their applicable products.

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

5 Classification of Boards

Table 5-3 List of packet interface boards


Board

Description

Applicable Product

TNN1CO1

8-port channelized STM-1


CES optical interface board

OptiX OSN 7500 II

TNN1D75E

32-port 75-ohm E1 interface


board

OptiX OSN 7500 II

TNN1D12E

32-port 120-ohm E1
interface board

OptiX OSN 7500 II

TNN1ETMC

8xFE+4xFE/GE electrical
interface board

OptiX OSN 7500 II

TNN1AFO1

8-port ATM STM-1 service


interface board

OptiX OSN 7500 II

N1PEFF8

8xFE optical interface board

OptiX OSN 7500, OptiX OSN 3500

TNN1EFF8

8-port FE optical interface


board

OptiX OSN 7500 II

N1PETF8

8xFE electrical interface


board

OptiX OSN 7500, OptiX OSN 3500

N1MD12

Multi-protocol 32xE1
interface board (120 ohms)

OptiX OSN 7500, OptiX OSN 3500

N1MD75

Multi-protocol 32xE1
interface board (75 ohms)

OptiX OSN 7500, OptiX OSN 3500

EoD Boards
Table 5-4 lists all EoD boards and their applicable products.
Table 5-4 List of EoD boards
Board

Description

Applicable Product

N1EDQ41

4-port 622/155 Mbit/s SDH


optical interface Ethernet
dual-mode multi-function
processing board

OptiX OSN 7500, OptiX OSN 3500

SDH Boards
Table 5-5 lists all SDH boards and their applicable products.

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

5 Classification of Boards

Table 5-5 List of SDH boards

Issue 03 (2013-02-20)

Board

Description

Applicable Product

N4SLD64

2xSTM-64 optical interface


board

OptiX OSN 7500 II

N1SLD64

2xSTM-64 optical interface


board

OptiX OSN 7500, OptiX OSN 3500

T2SL64,
T2SL64A

1xSTM-64 optical interface


board

OptiX OSN 7500

N1SF64,
N1SF64A

1xSTM-64 optical interface


board (with the forward error
correction (FEC) function)

OptiX OSN 7500, OptiX OSN 3500

N1SL64

1xSTM-64 optical interface


board

OptiX OSN 7500, OptiX OSN 3500

N2SL64

1xSTM-64 optical interface


board

OptiX OSN 3500

N4SL64

1xSTM-64 optical interface


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500

N4SLO16

8xSTM-16 optical interface


board

OptiX OSN 7500 II

N1SLO16

8xSTM-16 optical interface


board

OptiX OSN 7500, OptiX OSN 3500

N4SLQ16

4xSTM-16 optical interface


board

OptiX OSN 7500 II

N1SLQ16,
N2SLQ16

4xSTM-16 optical interface


board

OptiX OSN 7500, OptiX OSN 3500

N1SLD16

2xSTM-16 optical interface


board

OptiX OSN 3500

N3SL16,
N3SL16A

1xSTM-16 optical interface


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500A,
OptiX OSN 1500B

N1SL16,
N1SL16A,
N2SL16,
N2SL16A

1xSTM-16 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1SF16

1xSTM-16 optical interface


board (with the outband FEC
function)

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N3SLH41

16xSTM-4/STM-1 optical
interface board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500

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Issue 03 (2013-02-20)

5 Classification of Boards

Board

Description

Applicable Product

N3SLQ41

4xSTM-4/STM-1 optical
interface board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500A,
OptiX OSN 1500B

N1SLQ4,
N2SLQ4,
N1SLQ4A

4xSTM-4 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1SLD4,
N2SLD4,
N1SLD4A

2xSTM-4 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

R1SLD4

2xSTM-4 optical interface


board (divided slot)

OptiX OSN 1500A, OptiX OSN 1500B

R1SL4

1xSTM-4 optical interface


board (divided slot)

OptiX OSN 1500A, OptiX OSN 1500B

N1SL4, N2SL4,
N1SL4A

1xSTM-4 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1SLH1

16xSTM-1 signal processing


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500

N1SLT1

12xSTM-1 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1EU08

8xSTM-1 electrical interface


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1OU08

8xSTM-1 optical interface


board (LC)

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N2OU08

8xSTM-1 optical interface


board (SC)

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N2SLO1,
N3SLO1

8xSTM-1 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1SLQ1,
N2SLQ1,
N1SLQ1A

4xSTM-1 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

R1SLQ1

4xSTM-1 optical interface


board (divided slot)

OptiX OSN 1500A, OptiX OSN 1500B

N1EU04

4xSTM-1 electrical interface


board

OptiX OSN 3500, OptiX OSN 1500B

N1MU04

4xE4/STM-1 electrical
interface board

OptiX OSN 1500B

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Hardware Description

5 Classification of Boards

Board

Description

Applicable Product

N1SEP1

2xSTM-1 line processing


board when interfaces are
available on the front panel

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

8xSTM-1 line processing


board when interfaces are
available on the
corresponding interface
board
N1SL1, N2SL1,
N1SL1A

1xSTM-1 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

R1SL1

1xSTM-1 optical interface


board (divided slot)

OptiX OSN 1500A, OptiX OSN 1500B

PDH Boards
Table 5-6 lists all PDH boards and their applicable products.
Table 5-6 List of PDH boards

Issue 03 (2013-02-20)

Board

Description

Applicable Product

N1SPQ4

4xE4/STM-1 electrical
processing board

OptiX OSN 3500, OptiX OSN 1500B

N2SPQ4

4xE4/STM-1 electrical
processing board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1MU04

4xE4/STM-1 electrical
interface board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500

N2PQ3

12xE3/T3 service processing


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1D34S

6xE3/T3 electrical switching


interface board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1C34S

3xE3/T3 electrical switching


interface board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N1PD3, N2PD3

6xE3/T3 service processing


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N1PL3, N2PL3

3xE3/T3 service processing


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N1PL3A,
N2PL3A

3xE3/T3 service processing


board (Interfaces are
available on the front panel.)

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

5 Classification of Boards

Board

Description

Applicable Product

N1PQ1

63xE1 service processing


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N2PQ1

63xE1 service processing


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1PQM

63xE1/T1 service processing


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1D12B

32xE1/T1 electrical
switching interface board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1D12S

32xE1/T1 electrical
switching interface board
(120 ohms)

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1D75S

32xE1 electrical switching


interface board (75 ohms)

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

R1PD1, R2PD1

32xE1 service processing


board

OptiX OSN 1500A, OptiX OSN 1500B

R1PL1

16xE1 service processing


board

OptiX OSN 1500A, OptiX OSN 1500B

R1L12S

16xE1/T1 electrical
switching interface board
(120 ohms)

OptiX OSN 1500A

R1L75S

16xE1 electrical switching


interface board (75 ohms)

OptiX OSN 1500A

N1PFL1

8xE1 optical processing


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1TSB8

8-port electrical switching


interface board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1TSB4

4-port electrical switching


interface board

OptiX OSN 3500, OptiX OSN 1500B

N1DX1

DDN service accessing and


converging board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N1DXA

DDN service converging and


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1DM12

DDN service interface board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

EoS Boards
Table 5-7 lists all EoS boards and their applicable products.

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

5 Classification of Boards

Table 5-7 List of EoS boards

Issue 03 (2013-02-20)

Board

Description

Applicable Product

N1EFT8

8xFE/16xFE transparent
transmission board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1EFT8A

8xFE transparent
transmission board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1EFS0A

16xFE switching and


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N1EFS0

8xFE switching and


processing board

OptiX OSN 3500, OptiX OSN 1500B

N2EFS0,
N4EFS0,
N5EFS0

8xFE switching and


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N1EFS4,
N2EFS4,
N3EFS4

4xFE switching and


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

R1EFT4

4xFE transparent
transmission board (divided
slot)

OptiX OSN 1500A, OptiX OSN 1500B

N1EAS2

2x10GE Layer 2 switching


and processing board

OptiX OSN 7500, OptiX OSN 3500

N1EMS4

4xGE and 16xFE switching


and processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1EMS2

2xGE and 16xFE switching


and processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1EGS4,
N3EGS4,
N4EGS4

4xGE switching and


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1EGT2,
N2EGT2

2xGE transparent
transmission board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N2EGS2,
N3EGS2

2xGE switching and


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1EFF8,
N1EFF8A

8x100M Ethernet optical


interface board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N1ETF8,
N1ETF8A

8x100M Ethernet twistedpair interface board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N1ETS8

8x10/100M Ethernet twisted


pair interface switching
board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

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Hardware Description

5 Classification of Boards

ATM Boards
Table 5-8 lists all ATM boards and their applicable products.
Table 5-8 List of ATM boards
Board

Description

Applicable Product

N1ADL4,
N1IDL4

1xSTM-4 ATM service


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1ADQ1,
N1IDQ1

4xSTM-1 ATM service


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

RPR Boards
Table 5-9 lists all PRP boards and their applicable products.
Table 5-9 List of RPR boards
Board

Description

Applicable Product

N2EGR2

2xGE ring processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N2EMR0

12xFE and 1xGE ring


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

SAN/Video Boards
Table 5-10 lists all SAN/video boards and their applicable products.
Table 5-10 List of SAN/video boards
Board

Description

Applicable Product

N1VST4

4-port video service


transparent transmission
board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1MST4

4-port multi-service
transparent transmission
board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

Microwave Boards
Table 5-11 lists all microwave boards and their applicable products.
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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

5 Classification of Boards

Table 5-11 List of microwave boards


Board

Description

Applicable Product

N1IFSD1

Dual-port IF board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1RPWR

6-channel ODU power board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

WDM Boards
Table 5-12 lists all WDM boards and their applicable products.
Table 5-12 List of WDM boards
Board

Description

Applicable Product

TN11CMR4

4-channel optical add/drop


multiplexing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

TN11CMR2,
TN11MR2,
N1MR2A,
N1MR2C

2-channel optical add/drop


multiplexing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1MR2B

2-channel optical add/drop


multiplexing board

OptiX OSN 1500A, OptiX OSN 1500B

TN11MR4

4-port optical add/drop


multiplexing board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500A,
OptiX OSN 1500B

N1CMD2

2-channel bidirectional
optical multiplexer and
demultiplexer board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1LWX

Arbitrary bit rate wavelength


conversion board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1FIB

Filter isolating board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

Auxiliary Boards
Table 5-13 lists all auxiliary boards and their applicable products.
Table 5-13 List of auxiliary boards

Issue 03 (2013-02-20)

Board

Description

Applicable Product

T1EOW

Orderwire processing board

OptiX OSN 7500

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

5 Classification of Boards

Board

Description

Applicable Product

R1EOW

Orderwire processing board

OptiX OSN 1500A, OptiX OSN 1500B

T1AUX

System auxiliary interface


board

OptiX OSN 7500

N1AUX

System auxiliary interface


board

OptiX OSN 3500

R1AUX,
R2AUX

System auxiliary interface


board

OptiX OSN 1500A, OptiX OSN 1500B

R1AMU

Orderwire processing or
alarm cascading board

OptiX OSN 1500A, OptiX OSN 1500B

TN81FAN

Fan board

OptiX OSN 7500 II

N1FANA

Fan board (high power)

OptiX OSN 7500

N1FAN

Fan board

OptiX OSN 3500

R1FAN

Fan board

OptiX OSN 1500A, OptiX OSN 1500B

Optical Amplifier Boards and Dispersion Compensation Boards


Table 5-14 lists all optical amplifier boards and dispersion compensation boards and their
applicable products.
Table 5-14 List of optical amplifier boards and dispersion compensation boards

Issue 03 (2013-02-20)

Board

Description

Applicable Product

N1BPA

Optical booster and preamplifier board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N2BPA

Optical booster and preamplifier board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500A,
OptiX OSN 1500B

N1COA,
61COA, 62COA

Case-shaped optical
amplifier

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1DCU

Dispersion compensation
board

OptiX OSN 7500, OptiX OSN 3500

N2DCU

Dispersion compensation
board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500

TN11OBU1

Optical booster amplifier


board

OptiX OSN 7500, OptiX OSN 3500

TN12OBU1

Optical booster amplifier


board

OptiX OSN 7500 II

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5 Classification of Boards

Board

Description

Applicable Product

N1BA2

Optical booster amplifier


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1RPC01

Forward Raman driving


board (external)

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1RPC02

Backward Raman driving


board (external)

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

Power Boards
Table 5-15 lists all power boards and their applicable products.
Table 5-15 List of power boards

Issue 03 (2013-02-20)

Board

Description

Applicable Product

TN81PIU

Uninterruptible power
module

OptiX OSN 7500 II

UPM

Uninterruptible power
module

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

T1PIU

Power interface board


(supporting standard
subracks)

OptiX OSN 7500

T1PIUB

Power interface board


(supporting type III subracks)

OptiX OSN 7500

N1PIUA

Power interface board


(supporting 1100 W
enhanced subrack.)

OptiX OSN 3500

N1PIUB

Power interface board


(supporting type III subracks)

OptiX OSN 3500

R1PIU

Power interface board


(supporting OptiX OSN
1500B subrack)

OptiX OSN 1500B

R1PIUA

Power interface board


(supporting OptiX OSN
1500A subrack)

OptiX OSN 1500A

R1PIUB

Power interface board


(supporting enhanced OptiX
OSN 1500B subrack)

OptiX OSN 1500B

R1PIUC

Power interface board


(supporting enhanced OptiX
OSN 1500A subrack)

OptiX OSN 1500A

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Cross-Connect Boards and System Control


Boards

About This Chapter


This topic describes the system control boards and the cross-connect boards that have different
capacities.
6.1 SXCSA
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SXCSA (super cross-connect and synchronous timing board).
This topic also describes how to configure and commission the SXCSA.
6.2 PSXCS(A)
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PSXCS(A) (super dual-plane cross-connect and timing board).
This topic also describes how to configure and commission the PSXCS(A).
6.3 GSCC
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the GSCC (system control and communication board). This topic also
describes how to configure and commission the GSCC.

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6.1 SXCSA
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SXCSA (super cross-connect and synchronous timing board).
This topic also describes how to configure and commission the SXCSA.

6.1.1 Version Description


The SXCSA is available in one functional version, namely, N1.

6.1.2 Application
The SXCSA is a super cross-connect and synchronous timing board. The SXCSA provides
service grooming and clock input/output functions in the OptiX OSN 3500 system.
The cross-connect and synchronous timing board provides the other boards in the system with
the timing information and grooms the services between line boards or tributary boards.
Figure 6-1 shows the position of the cross-connect and synchronous timing board in the OptiX
OSN system.
Figure 6-1 Position of the cross-connect and synchronous timing board in the system
Line

Line
SDH

Cross-connect and timing board

PDH

FE/GE

RPR

ATM

SAN

6.1.3 Functions and Features


The SXCSA grooms services and inputs/outputs clock signals.
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Cross-Connect Unit
Table 6-1 provides the functions and features of the cross-connect unit of the SXCSA.
Table 6-1 Functions and features of the cross-connect unit of the SXCSA
Function and
Feature

SXCSA

Basic functions

Realizes 200 Gbit/s higher order cross-connection at the VC-4 level


and 20 Gbit/s lower order cross-connection at the VC-3 or VC-12
level.

Service processing

l Supports the flexible service grooming and supports the fully nonblocking cross-connect, multicast, and broadcast services.
l Enables the communication between the SXCSA and the other
boards.
l Supports the tact switch and performs the protection switching
without interrupting services.
l Supports the SNCP protection at the VC-4-4c, VC-4-8c,
VC-4-16c, VC-4-64c, VC-4, VC-12, VC-3, and AU-3 levels.
l Supports VC-4-4c, VC-4-8c, VC-4-16c, and VC-4-64c
concatenation services.
l Supports a maximum of 40 linear MSP groups.
l Supports a maximum of 12 ring MSP groups.
l Supports a maximum of 2016 SNCP groups.
l Supports a maximum of 592 SNCMP groups.
l Supports a maximum of 512 SNCTP groups.

Protection schemes

Supports the 1+1 Hot Backup for the Cross-Connect and Timing
Units (non-revertive, by default).

Maintenance
features

Supports the PRBS function in the line direction.

Clock Unit
Table 6-2 provides the functions and features of the clock unit of the SXCSA.
Table 6-2 Functions and features of the clock unit of the SXCSA

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Function and
Feature

SXCSA

Basic functions

Provides the standard system synchronization clock.

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Function and
Feature

SXCSA

Other functions

l Supports the processing of the S1 byte to realize the clock


protection switching.
l Supports the extraction, insertion, and management of the SSM
and clock ID.
l Provides the real-time clock (RTC).
l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and
selects the external timing source.

Input and output

l Outputs two-channel 2048 kHz or 2048 kbit/s timing signals.

6.1.4 Working Principle and Signal Flow


The SXCSA consists of the synchronous timing module, cross-connect module, communication
and control module, and power module.
Figure 6-2 shows the functional block diagram of the SXCSA.
Figure 6-2 Functional block diagram of the SXCSA
Matrix
HPC

622 Mbit/s or 2.5 Gbit/s

SNCP

Service unit

LPC
Cross-connect module

T0

Communication
and conrol
module

38 MHz
OSC

Synchronous
timing module
(SETS)

T1
T2
T3
SETG
Clock external
output
T4
T0
Frame header
T0 (reference clock)

+3.3 V
Power
module

Communication

Power
module

Fuse

SCCunit

SDH unit
PDH unit
AUX
AUX
Service unit
Service unit
-48 V/-60 V
-48 V/-60 V

SETG: synchronous equipment timing generation function

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The functional modules of the cross-connect and synchronous timing boards are described
below.

Synchronous Timing Module


The synchronous timing module uses the centralized timing allocation mode as the clock mode.
The synchronous timing module also selects one clock source from reference clock sources as
the reference clock for the timing module. The reference clock sources are from the line board,
the tributary board, or the external synchronous clock source. The synchronous clock source and
2 Mbit/s or 2 MHz external synchronous clock source are then generated.
The precise 38 MHz oscillator ensures that the reference clock complies with ITU-T standards
in free-run mode.
The SDH clock (SETS) can work in the following modes:
l

Lock mode

Hold-over mode

Free-run mode

When working in lock mode, the SETS extracts the clock from three types of timing signals:
l

Timing signal (T1) from the STM-N line

Timing signal (T2) from the PDH line

Reference signal (T3) from the external synchronous clock source (2 MHz or 2 Mbit/s)

The timing module outputs the following timing signals:


l

T0, system clock

T4, external timing output signal (2 Mbit/s or 2 MHz)

Cross-Connect Module
The cross-connect module consists of two parts:
l

SNCP module, which tests relative alarms and reports the alarms to the software to trigger
the protection switching such as the SNCP switching and MSP switching.

Higher order and lower order cross-connect module, which performs the functions of higher
order and lower order cross-connect units.

Communication and Control Module


The communication and control module is a sub-system provided by the pinch board. It consists
of the CPU, register, Ethernet port, HDLC controller, FPGA loading controller, and bus driver.
This module is connected to external circuits through buses to manage and configure other units
of the boards.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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6.1.5 Front Panel


The front panel of the SXCSA has indicators and a bar code.

Diagram of the Front Panel


Figure 6-3 shows the appearance of the front panel of the SXCSA.
Figure 6-3 Front panel of the SXCSA

SXCSA
STAT
ACT
PROG
SRV
SYNC

SXCSA

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

Synchronization clock status indicator (SYNC) two colors (red and green)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SXCSA has no interface. The AUX provides the SXCSA with the external
clock interface that can be set in 2048 kHz mode or 2048 kbit/s mode. The AUX provides two
BITS clock interfaces with 120-ohm or 75-ohm impedance. For details, see AUX.

6.1.6 Jumpers and DIP Switches


The SXCSA does not have any jumpers or DIP switches that are used for board settings.

6.1.7 Valid Slots


The SXCSA must be installed in a valid slot in the subrack. Otherwise, the SXCSA cannot work
normally.
The SXCSA can be installed in slots 9 and 10 in the subrack. By default, slot 9 houses the active
board and slot 10 houses the standby board.

6.1.8 Feature Code


The SXCSA does not have the feature code.

6.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the active board and standby board are installed in the correct slots.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check the status of the indicators of the board when and after the board is powered
on. For the meanings of the status of the indicators, see 24 Indicators.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
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Step 6 Required: Check the micro switch of the board. When the front panels of the active and standby
cross-connect boards are locked, the active/standby switching can be realized if you unlock the
front panel of the active board.
----End

Configuring the Board


Step 1 Add the logical board. For details, see Adding Boards.
Step 2 Set parameters for the XCS on the U2000. The following main parameters need to be set:
l Clock synchronization status
l Clock source priority
l Phase-locked source output by external clock
l Clock source switching
l Clock subnet configuration
For information about more parameters and the method for setting the parameters, see
Configuring Clocks.
----End

Commissioning the Board


Step 1 Optional: Test the frequency accuracy of the free-run clock. For details, see 28.5 Testing the
Frequency Accuracy of the Free-Run Clock.
Step 2 Optional: Test the clock holdover accuracy. For details, see 28.6 Testing the Clock Holdover
Accuracy.
Step 3 Required: Test the protection switching of the cross-connection. For details, see Testing the 1
+1 Protection of the Cross-Connect and Timing Board.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

6.1.10 Parameter Settings


You can set parameters for the SXCSA by using the U2000.
You can set the following parameters for the SXCSA by using the U2000:
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Clock synchronization status

Clock source priority

Clock source switching

Clock subnet configuration

Phase-locked source output by external clock

For the description of each parameter, see 27.8 Cross-Connect and Timing Units.

6.1.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 6-3 lists the faults that occur on the SXCSA frequently and the troubleshooting methods.
Table 6-3 Methods used to troubleshoot the faults that occur on the SXCSA frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service unavailable

l The type of logical


board is not
consistent with the
type of the board
that is installed on
the NE.

See 28.2 Troubleshooting Service


Unavailability.

l The service
configuration is
incorrect.
l The running status
of the other boards
on the NE is
incorrect.
Clock tracing failure

l The clock source


priority table is
incorrectly
configured.

See 28.3 Troubleshooting the


Clock Tracing Failure.

Replacing the Board


For information on how to replace the SXCSA, see Replace a Cross-Connect and Timing Board.
NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

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6.1.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

6.1.12.1 Alarms of N1SXCSA


APS_FAIL

APS_INDI

BD_STATUS

CHIP_FAIL

BUS_ERR

CHIP_ABN

EXT_SYNC_LOS

CLK_NO_TRACE_MODE

COMMUN_FAIL

HSC_UNAVAIL

FPGA_ABN

HARD_BAD

LPS_UNI_BI_M

K1_K2_M

K2_M

NO_BD_SOFT

LTI

MS_APS_INDI_EX

PRBS_TEST

OOL

POWER_ABNORMAL

S1_SYN_CHANGE

SWITCH_DISABLE

SYN_BAD

SYNC_C_LOS

SYNC_F_M_SWITCH

SYNC_LOCKOFF

TEMP_OVER

TEST_STATUS

W_OFFLINE

NP1_SW_FAIL

W_R_FAIL

NP1_SW_INDI

TIME_FORCE_SWITCH

RPS_INDI

TIME_NO_TRACE_MOD
E

OTH_HARD_FAIL

TIME_LOS

EXT_TIME_LOC

PATCHFILE_NOTEXIST

OTH_BD_STATUS

PATCH_ERR

TIME_NOT_SUPPORT

PATCH_NOT_CONFIRM

SWDL_PKG_NOBDSOFT

6.1.13 List of Performance Events


None.

6.1.14 Technical Specifications


The technical specifications of the SXCSA include the cross-connect capacity, clock access
capability, mechanical specifications, and power consumption.

Cross-Connect Capacity
The cross-connect capacity of the SXCSA is as follows:
l
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Lower order cross-connect capacity: 20 Gbit/s

Access capacity: 155 Gbit/s

Clock Access Capability


The clock access capability of the SXCSA is as follows:
l

External input clock: two channels of 2048 kbit/s or 2 MHz external clock signals

External output clock: two channels of 2048 kbit/s or 2 MHz external clock signals

Mechanical Specifications
The mechanical specifications of the SXCSA are as follows:
l

Dimensions (mm): 40 (W) x 220 (D) x 254.1 (H)

Weight (kg): 2.2

Power Consumption
The maximum power consumption of the SXCSA at room temperature (25C) is 63 W.

6.2 PSXCS(A)
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PSXCS(A) (super dual-plane cross-connect and timing board).
This topic also describes how to configure and commission the PSXCS(A).

6.2.1 Version Description


PSXCS(A) is available in the following functional versions: N3PSXCSA, N1PSXCS and
N2PSXCSA.
Table 6-4 provides version description of PSXCS(A).
Table 6-4 Versions of the PSXCS(A) board

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Item

Description

Functional versions

PSXCS(A) is available in the following functional versions:


N1PSXCS, N2PSXCSA, and N3PSXCSA.

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Item

Description

Differences

l Basic functions: packet data cross-connect capacity and


packet access capacity.
l Others:
N1PSXCS boards cannot work with single-slot packet
data boards.
N2PSXCSA/N3PSXCSA boards configured as
N1PSXCS cannot work with single-slot packet data
boards.
N2PSXCSA boards configured as N2PSXCSA cannot
work with two-slot packet data boards.
N3PSXCSA boards configured as N3PSXCSA or
N2PSXCSA cannot work with two-slot packet data
boards.
N2PSXCSA can substitute for N1PSXCS and N1SXCSA.
N3PSXCSA can substitute for N2PSXCSA, N1PSXCS, and
N1SXCSA.

Substitution

6.2.2 Application
The PSXCS(A) is a super cross-connect and synchronous timing board. The PSXCS(A) provides
service grooming and clock input/output functions in the OptiX OSN 3500 system.
The cross-connect and synchronous timing board provides the timing information to the other
boards in the system and grooms the services between SDH line boards, packet boards, or
tributary boards.
Figure 6-4 shows the position of The cross-connect and synchronous timing board in the system.
Figure 6-4 Position of the cross-connect and synchronous timing board in the system
Packet data

SDH/PDH
service

Higher order/
Lower order
cross-connect
unit

Packet data

Clock
unit

Packet data
processing
unit

Auxillary
unit

PIU

Auxillary
interface

-48 V/-60 V

XCS

6.2.3 Functions and Features


The PSXCS(A) board grooms services and inputs/outputs clock signals.
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Cross-Connect Unit
Table 6-5 provides the functions and features of the cross-connect unit of the PSXCS(A) board.
Table 6-5 Functions and features of the cross-connect unit of the PSXCS(A)
Functions and
Features

Description

Basic functions

l The N1PSXCS board implements 200 Gbit/s higher order crossconnection at the VC-4 level, 20 Gbit/s lower order crossconnection at the VC-12 or VC-3 level, 80 Gbit/s packet data
cross-connect capacity and 60 Gbit/s packet access capacity.
l The N2PSXCSA/N3PSXCSA board implements 200 Gbit/s
higher order cross-connection at the VC-4 level, 20 Gbit/s lower
order cross-connection at the VC-12 or VC-3 level, 160 Gbit/s
packet data cross-connect capacity and 100 Gbit/s packet access
capacity.

Service processing

l Supports the flexible service grooming and supports the fully nonblocking cross-connect, multicast, and broadcast services.
l Communicates with other boards.
l Supports the tact switch and performs the protection switching
without service interruption.
l Supports the SNCP protection at the levels of VC-4-4c, VC-4-8c,
VC-4-16c, VC-4-64c, VC-4, VC-12, VC-3, and AU-3.
l Supports VC-4, VC-12, VC-3, and AU-3 services.
l Supports VC-4-4c, VC-4-8c, VC-4-16c, and VC-4-64c
concatenation services.
l Supports a maximum of 40 linear MSP groups.
l Supports a maximum of 12 ring MSP groups.
l Supports a maximum of 8064 SNCP pairs.
l Supports a maximum of 592 SNCMP pairs.
l Supports a maximum of 512 SNCTP pairs.

Protection Scheme

Supports 1+1 hot standby. The default protection mode is the nonrevertive switching mode.

Maintenance
features

Supports the PRBS function in the line direction.

Others

Supports querying and reporting the working temperature of the


cross-connect and timing board and the entire equipment.

Clock Unit
Table 6-6 provides the functions and features of the clock unit of the PSXCS(A) board.

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Table 6-6 Functions and features of the clock unit of the PSXCS(A) board
Functions and
Features

Description

Basic functions

Provides the standard system synchronization clock.

Other functions

l Supports the processing of the S1 byte to perform clock protection


switching.
l Supports the extraction, insertion, and processing of the SSM and
clock ID.
l Supports the IEEE 1588v2 protocol.
l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and
selects the external timing source.

Input and output

l Outputs two-channel 2048 kHz or 2048 kbit/s timing signals.

6.2.4 Working Principle and Signal Flow


The PSXCS(A) consists of the higher order cross-connect matrix, lower order cross-connect
matrix, packet cross-connect matrix, communication and control module, clock unit, and power
module.
Figure 6-5 shows the functional block diagram of the PSXCS(A).
Figure 6-5 Functional block diagram of the PSXCS(A)
Backplane
Lower order crossconnect matrix

Higher order crossconnect matrix

Packet crossconnect matrix


+3.3 V

Clock unit

The board and system


Service unit/SCC unit/
AUX

Communication
and control unit
Power
module

Fuse

SCC unit
-48 V/-60 V
-48 V/-60 V

Higher Order Cross-Connect Matrix


Realizes higher order cross-connection at the VC-4 level.

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Lower Order Cross-Connect Matrix


Realizes lower order cross-connection at the VC-3 or VC-12 level.

Packet Cross-Connect Matrix


Cross-connects the packet data.

Communication and Control Module


Communicates with the SCC unit and other boards, ensures communication with the other boards
when the GSCC cannot be detected, and generates the other control signals for the PSXCS and
system.

Clock Unit
The clock unit performs the following functions:
l

Traces external clock sources, line clock sources, or tributary clock sources, and provides
the PSXCS and the system with a synchronization clock source.

Through system timing, provides the nodes in the data stream of the system with the clock
signals that have proper frequency and phase. In this way, the components at each node
can meet the requirements regarding data setup and data holding during data receiving.

Provides the system with the frame indication signal that is used to indicate the position of
the frame header in the data.

Supports the IEEE 1588 V2 clock.

Power Module
The power module converts the accessed DC voltage into the DC voltages that the modules of
the PSXCS require.

6.2.5 Front Panel


The front panel of the PSXCS(A) has indicators and a bar code.

Diagram of the Front Panel


Figure 6-6 shows the appearance of the front panel of the PSXCS(A).

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Figure 6-6 Front panel of the PSXCS(A)

PSXCS

PSXCSA

STAT
ACT
PROG
SRV
SYNC

STAT
ACT
PROG
SRV
SYNC

PSXCS

PSXCSA

N1PSXCS

N2PSXCSA/N3PSXCSA

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) three colors (red, green, and yellow)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Synchronization clock status indicator (SYNC) two colors (red and green)

For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the Boards.

Interfaces
The front panel of the PSXCS(A) has no interface. The AUX provides the PSXCS(A) with the
external clock interface that can be set in 2048 kHz mode or 2048 kbit/s mode. The AUX provides
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two BITS clock interfaces with 120-ohm or 75-ohm impedance. For details, see the topic that
describes the interfaces of the AUX.

6.2.6 Jumpers and DIP Switches


The PSXCS(A) does not have any jumpers or DIP switches that are used for board settings.

6.2.7 Valid Slots


The PSXCS(A) can be installed in slots 9 and 10 in the subrack.
By default, slot 9 is the slot for the working board, and slot 10 is the slot for the protection board.

6.2.8 Feature Code


The PSXCS(A) does not have the feature code.

6.2.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the active board and standby board are installed in the correct slots.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check the status of the indicators of the board when and after the board is powered
on. For the meanings of the status of the indicators, see 24 Indicators.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
Step 6 Required: Check the micro switch of the board. When the front panels of the active and standby
cross-connect boards are locked, the active/standby switching can be realized if you unlock the
front panel of the active board.
----End

Configuring the Board


Step 1 Add the logical board. For details, see Adding Boards.
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Step 2 Set parameters for the XCS on the U2000. The following main parameters need to be set:
l Clock synchronization status
l Clock source priority
l Phase-locked source output by external clock
l Clock source switching
l Clock subnet configuration
For information about more parameters and the method for setting the parameters, see
Configuring Clocks.
----End

Commissioning the Board


Step 1 Optional: Test the frequency accuracy of the free-run clock. For details, see 28.5 Testing the
Frequency Accuracy of the Free-Run Clock.
Step 2 Optional: Test the clock holdover accuracy. For details, see 28.6 Testing the Clock Holdover
Accuracy.
Step 3 Required: Test the protection switching of the cross-connection. For details, see Testing the 1
+1 Protection of the Cross-Connect and Timing Board.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

6.2.10 Parameter Settings


You can set parameters for the PSXCS(A) by using the U2000.
You can set the following principal parameters for the PSXCS(A) by using the U2000:
l

Clock synchronization status

Clock source priority

Phase-locked source output by external clock

Clock source switching

Clock subnet configuration

For more parameters and the description of the parameters, see 27.8 Cross-Connect and Timing
Units.
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6.2.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also provides
the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 6-7 lists the faults that occur on the PSXCS(A) frequently and the troubleshooting
methods.
Table 6-7 Methods used to troubleshoot the faults that occur on the PSXCS(A) frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service unavailable

l The type of logical


board is not
consistent with the
type of the board
that is installed on
the NE.

See 28.2 Troubleshooting Service


Unavailability.

l The service
configuration is
incorrect.
l The running status
of the other boards
on the NE is
incorrect.
Clock tracing failure

l The clock source


priority table is
incorrectly
configured.

See 28.3 Troubleshooting the


Clock Tracing Failure.

Replacing the Board


For information on how to replace the PSXCS(A), see Replace a Cross-Connect and Timing
Board.
NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

6.2.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

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6.2.12.1 Alarms of N1PSCXS(A)


APS_FAIL

APS_INDI

BD_STATUS

BDID_ERROR

BUS_ERR

CHIP_ABN

CHIP_FAIL

CLK_NO_TRACE_MODE

COMMUN_FAIL

EXT_SYNC_LOS

FPGA_ABN

HARD_BAD

HSC_UNAVAIL

K1_K2_M

K2_M

LPS_UNI_BI_M

LTI

MS_APS_INDI_EX

NO_BD_SOFT

RPS_INDI

NP1_SW_FAIL

NP1_SW_INDI

OOL

OTH_BD_STATUS

OTH_HARD_FAIL

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

POWER_ABNORMAL

PRBS_TEST

S1_SYN_CHANGE

SWITCH_DISABLE

SYN_BAD

SYNC_C_LOS

SYNC_F_M_SWITCH

SYNC_LOCKOFF

TEMP_OVER

TEST_STATUS

TIME_FORCE_SWITCH

TIME_LOS

TIME_NO_TRACE_MOD
E

W_OFFLINE

W_R_FAIL

EXT_TIME_LOC

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

TIME_NOT_SUPPORT

APS_MANUAL_STOP

APS_FAIL

APS_INDI

BD_STATUS

BDID_ERROR

BUS_ERR

CHIP_ABN

CHIP_FAIL

CLK_NO_TRACE_MODE

COMMUN_FAIL

EXT_SYNC_LOS

FPGA_ABN

HARD_BAD

HSC_UNAVAIL

K1_K2_M

K2_M

LPS_UNI_BI_M

LTI

MS_APS_INDI_EX

NO_BD_SOFT

RPS_INDI

NP1_SW_FAIL

NP1_SW_INDI

OOL

OTH_BD_STATUS

OTH_HARD_FAIL

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

POWER_ABNORMAL

PRBS_TEST

S1_SYN_CHANGE

SWITCH_DISABLE

SYN_BAD

6.2.12.2 Alarms of N2PSCXS(A)

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SYNC_C_LOS

SYNC_F_M_SWITCH

SYNC_LOCKOFF

TEMP_OVER

TEST_STATUS

TIME_FORCE_SWITCH

TIME_LOS

TIME_NO_TRACE_MOD
E

W_OFFLINE

W_R_FAIL

EXT_TIME_LOC

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

TIME_NOT_SUPPORT

CES_K1_K2_M

CES_K2_M

CES_APS_INDI

CES_APS_FAIL

CES_MS_APS_INDI_EX

CES_LPS_UNI_BI_M

APS_MANUAL_STOP

APS_FAIL

APS_INDI

BD_STATUS

BDID_ERROR

BUS_ERR

CHIP_ABN

CHIP_FAIL

CLK_NO_TRACE_MODE

COMMUN_FAIL

EXT_SYNC_LOS

FPGA_ABN

HARD_BAD

HSC_UNAVAIL

K1_K2_M

K2_M

LPS_UNI_BI_M

LTI

MS_APS_INDI_EX

NO_BD_SOFT

RPS_INDI

NP1_SW_FAIL

NP1_SW_INDI

OOL

OTH_BD_STATUS

OTH_HARD_FAIL

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

POWER_ABNORMAL

PRBS_TEST

S1_SYN_CHANGE

SWITCH_DISABLE

SYN_BAD

SYNC_C_LOS

SYNC_F_M_SWITCH

SYNC_LOCKOFF

TEMP_OVER

TEST_STATUS

TIME_FORCE_SWITCH

TIME_LOS

TIME_NO_TRACE_MOD
E

W_OFFLINE

W_R_FAIL

EXT_TIME_LOC

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

TIME_NOT_SUPPORT

CES_K1_K2_M

CES_K2_M

CES_APS_INDI

CES_APS_FAIL

CES_MS_APS_INDI_EX

CES_LPS_UNI_BI_M

APS_MANUAL_STOP

MPLS_PW_CSF

MPLS_PW_LCK

MPLS_PW_LOCK

6.2.12.3 Alarms of N3PSCXS(A)

MPLS_PW_OAMFAIL

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6.2.13 List of Performance Events


None.

6.2.14 Technical Specifications


The technical specifications of the PSXCS(A) include the cross-connect capacity, clock access
capability, mechanical specifications, and power consumption.

Cross-Connect Capacity
The cross-connect capacity of the N1PSXCS is as follows:
l

Higher order cross-connect capacity: 200 Gbit/s

Lower order cross-connect capacity: 20 Gbit/s

Packet switching capability: 80 Gbit/s

Access capacity:
TDM mode: 155 Gbit/s
Packet mode: 60 Gbit/s

The cross-connect capacity of the N2PSXCSA/N3PSXCSA is as follows:


l

Higher order cross-connect capacity: 200 Gbit/s

Lower order cross-connect capacity: 20 Gbit/s

Packet switching capability: 160 Gbit/s

Access capacity:
TDM mode: 155 Gbit/s
Packet mode: 100 Gbit/s

Clock Access Capability


The clock access capability of the PSXCS(A) is as follows:
l

External input clock: two channels of 2048 kbit/s or 2 MHz external clock signals

External output clock: two channels of 2048 kbit/s or 2 MHz external clock signals

Mechanical Specifications
The mechanical specifications of the N1PSXCS are as follows:
l

Dimensions (mm): 40 (W) x 220 (D) x 254.1 (H)

Weight (kg): 2.1

The mechanical specifications of the N2PSXCSA are as follows:


l

Dimensions (mm): 40 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.2

The mechanical specifications of the N3PSXCSA are as follows:


l
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Dimensions (mm): 40 (W) x 220 (D) x 254.1 (H)


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Weight (kg): 1.5

Power Consumption
The maximum power consumption of the N1PSXCS at room temperature (25C) is 90 W.
The maximum power consumption of the N2PSXCSA at room temperature (25C) is 80 W.
The maximum power consumption of the N3PSXCSA at room temperature (25C) is 74 W.

6.3 GSCC
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the GSCC (system control and communication board). This topic also
describes how to configure and commission the GSCC.

6.3.1 Version Description


The GSCC is available in several functional versions. The functions provided by the functional
versions are different.
Table 6-8 describes the versions of the GSCC.
Table 6-8 Versions of the GSCC
Item

Description

Function
al
versions

The GSCC is available in the following functional versions: N4 and N6.

Differen
ces

Packet performance specifications differ between the N4GSCC and the N6GSCC.
For details, see Packet System Performance.

Substitut
ion

The GSCC boards of different versions cannot directly substitute for each other.
If the GSCC of a later version needs to substitute for the GSCC of an earlier
version, the NE software needs to be upgraded accordingly.

6.3.2 Application
The GSCC is the intelligent system control board. The GSCC works with the U2000 to manage
the boards on the equipment and realize the communication between different pieces of
equipment.
Figure 6-7 shows the position of the GSCC in the system.

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Figure 6-7 Position of the GSCC in the system


Auxiliary interface
Auxiliary unit
SCC unit
Other boards

PIU
-48 V/-60 V

6.3.3 Functions and Features


The GSCC supports the system control, orderwire, communication, and system power supply
monitoring.
Table 6-9 provides the functions and features of the GSCC.
Table 6-9 Functions and features of the GSCC
Function and
Feature

GSCC

Basic functions

Performs the service configuration function and service grooming


function, monitors the service performance, and collects information
about the performance events and alarms.

Interfaces

l Provides the 10M/100M Ethernet port, which is used for


communicating with the NMS. The Ethernet port is accessed through
the AUX.
l Provides the F&f interface, which is accessed through the AUX and
is used to manage the COA.
l Provides one 64 kbit/s synchronous data port F1, which is accessed
through the AUX.
l Provides the RS232 OAM interface, which is used for connecting a
PC or workstation, and supports the remote maintenance by using a
modem that uses the RS232 DCE interface. The OAM interface is
accessed through the AUX.

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DCC
communication

Processes 160 DCCs (D1D3). In this manner, the link is provided for
transmitting the NM information.

Overhead
processing

Processes the E1, E2, F1, and serial14 bytes.

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Function and
Feature

GSCC

Clock function

l Provides the RTC.

6 Cross-Connect Boards and System Control Boards

l Supports the high-precision clock synchronization feature, and


complies with the IEEE 1588 V2 protocol. The N4GSCC receives the
time information through interfaces S1S4 of the AUX. The S1, S3
and ALMI4 interfaces receive the first channel of time information,
and the S2, S4 and ALMI4 interfaces receive the second channel of
time information.
l Supports service performance monitoring and collects information
about the performance events and alarms.

Alarms and
maintenance
features

l Provides 16 alarm inputs and four alarm outputs through the AUX.
l Controls the four cabinet indicators through the AUX.
l Supports intelligent fan speed control and manages the fan alarms.
l Supports simulation package loading and diffused loading.
l Supports the function of detecting whether a packet data board is in
position.

Power supply
management

l Supports the monitoring of the 48 V or 60 V power supply.

Protection
schemes

Supports the 1+1 Hot Backup for the SCC Unit. When the active board
is faulty, services are switched to the standby board automatically.

l Supports the in-service check function for the PIU board and supports
the failure check function for the lightning protection module of the
PIU.

NOTE
In packet mode, two N4GSCC/N6GSCC boards are configured as 1+1 backup by
default.

Packet function

The N4GSCC and N6GSCC support the packet function.


For information about the performance of the packet system, see Packet
System Performance.

6.3.4 Working Principle and Signal Flow


The GSCC consists of the communication and control module, OHP module, and power module.
Figure 6-8 shows the functional block diagram of the GSCC.

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Figure 6-8 Functional block diagram of the GSCC


Other
units
V1
V2
Phone
S1-S4
F1

OH
manager

OHP

OHP module

Reset
ALM CUT
Boot
ROM
RAM

Communication
and control
module

AUX interface
16-input/4-output
alarm control
ETH port
OAM interface
F&f interface
COM interface

NVRAM
Flash

PIU
interface
Power
module

AUX power monitor


and reset control

AUX unit

Input/Output alarm
ETH
OAM
F&f
COM
Control of subrack
indicators
Inter-board
communication
Power monitor
PIU test

Other
units

PIU unit
-48 V/-60 V

Communication and Control Module


The communication and control module controls and manages the boards, realizes the
communication between NEs, manages the network, and performs other functions.
l

The system control module communicates with the boards in the subrack, manages the
boards, monitors the performance events and alarms of the boards, collects the status
information about the other functional modules, and performs the corresponding
management operations.

The communication and control module provides the function that NEs communicate with
each other through DCCs. The communication module transfers the OAM information to
other NEs through DCCs, reports the alarms and performance data of the equipment to the
network management terminal, and responds to the commands issued by the network
management terminal.

The communication and control module configures and operates the NE.
NOTE

The service protection is realized by the cross-connect and timing board. When services are switched, the
switching event is reported to the GSCC, which then reports the switching event to the NMS.

When the communication and control module fails, the following situations occur:
l
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The communication and control module cannot manage the boards in the subrack, monitor
the performance events and alarms of the boards, collect the status information about the
other functional modules, or perform the corresponding management operations.
l

DCC failure
The communication and control module cannot transfer the OAM information to other NEs
through the local NE, report the alarms and performance data of the equipment to the
network management terminal, or respond to the commands issued by the network
management terminal.

OHP Module
l

Receives overhead signals from the line slot.

Processes such bytes as E1, E2, F1 and serial14serial

Sends overhead signals to the line board.

Provides the following external interfaces:


One orderwire interface
Two SDH NNI audio interfaces
Interface F1
Broadcast data ports serial14serial

Figure 6-9 shows the orderwire bytes in the SDH frame.


Figure 6-9 Position of these orderwire bytes in the SDH frame
A1

A1

A1

A2

A2

A2

J0

B1

E1

F1

D1

D2

D3

Serial 1 Serial2

AU_PTR
B2

B2

D4

Serial 4

K1

K2

D5

D6

D7

D8

D9

D10

D11

D12

S1

B2

M1

Serial3

E2

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

6.3.5 Front Panel


The front panel of the GSCC has indicators and a bar code.
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Diagram of the Front Panel


Figure 6-10 shows the appearance of the N4GSCC/N6GSCC.
Figure 6-10 Front panel of the N4GSCC/N6GSCC

GSCC
STAT
ACT
PROG
SRV
PWRA
PWRB
PWRC
ALMC

RESET

ALM CUT

GSCC

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

48 V power supply indicator of channel A (PWRA) two colors (red and green)

48 V power supply indicator of channel B (PWRB) two colors (red and green)

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+3.3 V backup power supply indicator of the system (PWRC) two colors (red and green)

Alarm mute indicator (ALMC) one color (yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the GSCC has no interface. The AUX provides interfaces for the GSCC. For
details, see AUX.
The front panel of the N4GSCC/N6GSCC has one warm reset switch and one alarm cut switch.
Table 6-10 describes the types and usage of the switches
Table 6-10 Types and usage of the switches of the GSCC
Switch

Type of
Switch

Usage

RESET

Warm reset
switch

Press the switch to perform a warm reset for the SCC unit.

ALM CUT

Alarm cut
switch

Press the switch to mute the alarm. Press the switch for five
seconds to mute the alarm permanently. Press the switch
again for five seconds to resume the alarm sound.

6.3.6 Jumpers and DIP Switches


The GSCC has jumpers, which are used to set the input voltage and running state of the
equipment.

CAUTION
The jumpers are used for test and maintenance. Do not change the setting of jumpers at random.
Otherwise, the board may become faulty.

N4GSCC
Figure 6-11 shows the layout of the J2101, J7100, J3201, and J3202 jumpers on the N4GSCC.

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Figure 6-11 Position of the jumpers of the N4GSCC


Power
module

J3202
J3201

CPU

J7100

J2101

1
2
3

Table 6-11 lists the jumpers of the N4GSCC.


Table 6-11 Jumpers of the N4GSCC
Jumper

Function

Description

J2101

To enable the
battery

12: If jumper bits (positions) 1 and 2 are capped, the


database and clock are cleared.
23: If jumper bits (positions) 2 and 3 are capped, the
battery is enabled. It is the default state.

J7100

To set the running


state of the board

Jumper J7100 is a group of two-pin jumpers located in


five rows. The jumper in the lowest row is reserved and
does not need to be set. In the case of the jumpers in the
top four rows, the value of a jumper bit is defined as
follows:
If a jumper bit is not capped, the value is 0.
If a jumper bit is capped, the value is 1.
The jumper bit values are queued from bottom to top
and from the higher bit to the lower bit, and form a fourbit binary number. For details, refer to Table 6-12.

J3202 and
J3201

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To set the input


voltage of the
equipment

When the jumpers are not capped, the equipment is


supplied with the 60 V power.
When the jumpers are capped, the equipment is
supplied with the 48 V power. It is the default state.

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CAUTION
Set J3202 and J3201 correctly based on the power voltage provided in the telecommunications
room. If J3202 and J3201 are set incorrectly, the POWER_ABNORMAL alarm is generated.

Table 6-12 Jumper J7100


Value

Description

0b0000

Indicates the running state when the watchdog is started. It is the default
state.

0b0001

Changes to the self-test state of the SDRAM Burst.

0b0011

Indicates the commissioning state.

0b0100

Indicates the running state when the watchdog is stopped.

0b0101

The software is in the BIOS state. The SCC does not work even though
the NE software exists. The IP address of the parameter area, however,
is not changed, which is for querying.

0b0110

The software enters the exhibition mode.

0b1001

Indicates the running state when the watchdog is started.

0b1011

Erases the database.

0b1100

Erases the NE software, including the patches.

0b1101

Erases the database and NE software, including the patches.

0b1110

Erases the database, NE software, and NE.ini file.

0b1111

Erases the extended BIOS and system parameter area in the file system
and flash memory.

N6GSCC
Figure 6-12 shows the layout of the J18, J11, J30, and J31 jumpers on the N6GSCC.

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Figure 6-12 Position of the jumpers of the N6GSCC

Power
module

J30

321
J31

32 1

CPU

J18

1 23

J11

Table 6-13 lists the jumpers of the N6GSCC.


Table 6-13 Jumpers of the N6GSCC
Jumper

Function

Description

J18

To enable the
battery

12: If jumper bits (positions) 1 and 2 are capped, the


database and clock are cleared.
23: If jumper bits (positions) 2 and 3 are capped, the
battery is enabled. It is the default state.

J11

To set the running


state of the board

Jumper J11 is a group of two-pin jumpers located in


five rows. The jumper in the left-most row is reserved
and does not need to be set. In the case of the jumpers
in the right four rows, the value of a jumper bit is
defined as follows:
If a jumper bit is not capped, the value is 0.
If a jumper bit is capped, the value is 1.
The jumper bit values are queued from left to right and
from the higher bit to the lower bit, and form a four-bit
binary number. For details, refer to Table 6-14.

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Jumper

Function

Description

J30 and J31

To set the input


voltage of the
equipment

23 or jumpers are not capped: If jumper bits


(positions) 2 and 3 are capped or jumpers are not
capped, the equipment is supplied with the 60 V
power.
12: If jumper bits (positions) 2 and 3 are capped, the
equipment is supplied with the 48 V power. It is the
default state.

CAUTION
Set J30 and J31 correctly based on the power voltage provided in the telecommunications room.
If J30 and J31 are set incorrectly, the POWER_ABNORMAL alarm is generated.
Table 6-14 Jumper J11
Value

Description

0b0000

Indicates the running state when the watchdog is started. It is the default
state.

0b0001

Changes to the self-test state of the SDRAM Burst.

0b0011

Indicates the commissioning state.

0b0100

Indicates the running state when the watchdog is stopped.

0b0101

The software is in the BIOS state. The SCC does not work even though
the NE software exists. The IP address of the parameter area, however,
is not changed, which is for querying.

0b0110

The software enters the exhibition mode.

0b1001

Indicates the running state when the watchdog is started.

0b1011

Erases the database.

0b1100

Erases the NE software, including the patches.

0b1101

Erases the database and NE software, including the patches.

0b1110

Erases the database, NE software, and NE.ini file.

0b1111

Erases the extended BIOS and system parameter area in the file system
and flash memory.

6.3.7 Valid Slots


The GSCC must be installed in a valid slot in the subrack. Otherwise, the GSCC cannot work
normally.
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The GSCC can be installed in slots 17 and 18 in the subrack. By default, slot 18 houses the active
board and slot 17 houses the standby board.

6.3.8 Feature Code


The GSCC does not have the feature code.

6.3.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the active board and standby board are installed in the correct slots.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check the status of the indicators of the board when and after the board is powered
on. For the meanings of the status of the indicators, see 24 Indicators.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
Step 6 Required: Check the status of the ALM switch.
1.

Press the switch to mute the current alarm sound.

2.

Press the switch for five seconds to mute the alarm sound permanently. In this case, the
alarm mute indicator (ALMC) turns on (in yellow).

3.

Press the switch again for five seconds to resume the alarm sound. In this case, the ALMC
indicator turns off.

----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: If the parameter settings of the GSCC are available on the U2000, download the
parameter settings to the GSCC. Otherwise, perform the following operations:
l Set the NE ID. For details, see Setting the NE ID.
l Set the NE name, date, and time. For details, see Setting the NE Name, Date, and Time.
----End
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Commissioning the Board


Step 1 Check the setting of the jumper that controls the debugging status of the board. For the
description of the jumper, see 6.3.6 Jumpers and DIP Switches.
Step 2 Check and commission the circuit status on the data ports, including the F&f debugging serial
port and OAM NM port. For details, see 28.4 Configuring the F&f Debugging Serial Port
and OAM NM Port.
Step 3 Check the configurations of the data ports.
l For the configuration of the broadcast data port, see Configuring the Broadcast Data
Service.
l For the configuration of the F1 codirectional data port, see Configuring the F1 Data
Service.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

6.3.10 Parameter Settings


You can set parameters for the GSCC by using the U2000.
You can set the following parameters for the GSCC by using the U2000:
l

NE ID

NE name, date, and time

F&f debugging serial port

OAM NM port

Broadcast data port

F1 data port

6.3.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 6-15 lists the faults that occur on the GSCC frequently and the troubleshooting methods.
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Table 6-15 Methods used to troubleshoot the faults that occur on the GSCC frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

ECC failure

l The running status of


the board becomes
abnormal.

l Check whether the running status of


the board is correct. See 24.2
Alarm Indicators on the Boards
to obtain the meanings of the status
of the indicators.

l The optical fibers are


incorrectly
connected.

l Check whether the optical fibers are


correctly connected.

Power supply alarm

The jumper that controls


the input voltage is
incorrectly set.

For information on how to set the


jumper, see 6.3.6 Jumpers and DIP
Switches.

Connection failure
between the NMS
computer and the
equipment

l An incorrect
network cable is
used to connect the
NMS computer to
the equipment.

l For information on the connection


of the network cable, see Checking
Connection Between the U2000
Computer and the Equipment.

l The IP address of the


NMS computer and
the IP address of the
equipment are not in
the same network
segment.
Repetitive GSCC resets

The GSCC is faulty.

l Ensure that the IP address of the


NMS computer and the IP address
of the equipment are correctly set.
For details, see Setting the IP
Address of the PC.

Replace the GSCC. For information on


how to replace the GSCC, see
Replacing a GSCC Board.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the GSCC, see Replacing a GSCC Board.

6.3.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

6.3.12.1 Alarms of N4GSCC

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APS_MANUAL_STOP

BD_AT_LOWPOWER

BD_NOT_INSTALLED

BD_STATUS

BOOTROM_BAD

CFCARD_FAILED

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CFCARD_OFFLINE

CFCARD_W_R_DISABLED

CHIP_ABN

COMMUN_FAIL

DBMS_ERROR

DBMS_PROTECT_MODE

LAN_LOC

FPGA_ABN

HARD_BAD

SYSLOG_COMM_FAIL

MSSW_DIFFERENT

NE_POWER_OVER

NESF_LOST

NESTATE_INSTALL

PATCH_ACT_TIMEOUT

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

POWER_ABNORMAL

POWER_FAIL

REG_MM

RINGMAPM_MM

RTC_FAIL

SECU_ALM

SQUTABM_MM

SWDL_ACTIVATED_TI
MEOUT

SWDL_AUTOMATCH_INH

SWDL_INPROCESS

SWDL_CHGMNG_NOMATCH

SWDL_COMMIT_FAIL

SWDL_NEPKGCHECK

SWDL_ROLLBACK_FAI
L

SYNC_FAIL

TEMP_OVER

WRG_FANTYPE

WRG_BD_TYPE

CFCARD_FULL

BIOS_STATUS

DCC_CHAN_LACK

PATCH_PKGERR

NP1_MANUAL_STOP

STORM_CUR_QUENUM_O
VER

PATCH_DEACT_TIMEOUT

Ext_COMM_FAIL

LCS_DAYS_OF_GRACE

LCS_EXPIRED

LCS_FILE_NOT_EXIST

FEATURE_WITHOUT_LICENSE

SYNC_DISABLE

DCNSIZE_OVER

MEM_OVER

CPC_NODE_ID_ERR

SWDL_PKG_NOBDSOFT

CES_APS_MANUAL_STOP

PASSWORD_NEED_CH
ANGE

DB_RESTORE_FAIL

DBMS_DELETE

NTP_SYNC_FAIL

SSL_CERT_NOENC

SEC_RADIUS_FAIL

APS_MANUAL_STOP

BD_AT_LOWPOWER

BD_NOT_INSTALLED

BD_STATUS

BOOTROM_BAD

CFCARD_FAILED

6.3.12.2 Alarms of N6GSCC

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CFCARD_OFFLINE

CFCARD_W_R_DISABLED

CHIP_ABN

COMMUN_FAIL

DBMS_ERROR

DBMS_PROTECT_MODE

LAN_LOC

FPGA_ABN

HARD_BAD

SYSLOG_COMM_FAIL

MSSW_DIFFERENT

NE_POWER_OVER

NESF_LOST

NESTATE_INSTALL

PATCH_ACT_TIMEOUT

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

POWER_ABNORMAL

POWER_FAIL

REG_MM

RINGMAPM_MM

RTC_FAIL

SECU_ALM

SQUTABM_MM

SWDL_ACTIVATED_TI
MEOUT

SWDL_AUTOMATCH_INH

SWDL_INPROCESS

SWDL_CHGMNG_NOMATCH

SWDL_COMMIT_FAIL

SWDL_NEPKGCHECK

SWDL_ROLLBACK_FAI
L

SYNC_FAIL

TEMP_OVER

WRG_FANTYPE

WRG_BD_TYPE

CFCARD_FULL

BIOS_STATUS

DCC_CHAN_LACK

PATCH_PKGERR

NP1_MANUAL_STOP

STORM_CUR_QUENUM_O
VER

PATCH_DEACT_TIMEOUT

Ext_COMM_FAIL

LCS_DAYS_OF_GRACE

LCS_EXPIRED

LCS_FILE_NOT_EXIST

FEATURE_WITHOUT_LICENSE

SYNC_DISABLE

DCNSIZE_OVER

MEM_OVER

CPC_NODE_ID_ERR

SWDL_PKG_NOBDSOFT

CES_APS_MANUAL_STOP

PASSWORD_NEED_CH
ANGE

DB_RESTORE_FAIL

DBMS_DELETE

NTP_SYNC_FAIL

SSL_CERT_NOENC

SEC_RADIUS_FAIL

6.3.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

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6.3.13.1 Performance Events of N4GSCC


XCSTMPMAX

XCSTMPMIN

XCSTMPCUR

CPUUSAGEMAX

CPUUSAGEMIN

CPUUSAGECUR

MEMUSAGEMAX

MEMUSAGEMIN

MEMUSAGECUR

6.3.13.2 Performance Events of N6GSCC


XCSTMPMAX

XCSTMPMIN

XCSTMPCUR

CPUUSAGEMAX

CPUUSAGEMIN

CPUUSAGECUR

MEMUSAGEMAX

MEMUSAGEMIN

MEMUSAGECUR

6.3.14 Technical Specifications


The technical specifications of the GSCC include the mechanical specifications and power
consumption.

Mechanical Specifications
The mechanical specifications of the GSCC are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight of the N4GSCC (kg): 1.0

Weight of the N6GSCC (kg): 0.9

Power Consumption
The maximum power consumption of the N4GSCC at room temperature (25C) is 19 W.
The maximum power consumption of the N6GSCC at room temperature (25C) is 35 W.

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7 Packet Processing Boards

Packet Processing Boards

About This Chapter


The packet processing boards include the PEX1, PEX2, PEG16, and PEG8. They achieve the
packet switching function in the packet domain.
7.1 PEX1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEX1 (1x10GE Ethernet processing board). This topic also
describes how to configure and commission the PEX1.
7.2 PEX2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEX2 (2-port 10 Gigabit Ethernet switching processing board).
This topic also describes how to configure and commission the PEX2.
7.3 PEG8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEG8 (8-Port Gigabit Ethernet switching processing board). This
topic also describes how to configure and commission the PEG8
7.4 PEG16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEG16 (16xGE Ethernet processing board). This topic also
describes how to configure and commission the PEG16.

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7.1 PEX1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEX1 (1x10GE Ethernet processing board). This topic also
describes how to configure and commission the PEX1.

7.1.1 Version Description


The PEX1 is available in N1 and N2.
Table 7-1 describes the versions of the PEX1.
Table 7-1 Versions of the PEX1
Item

Description

Functional versions

The PEX1 is available in two functional versions, namely, N1


and N2.

Differences

l Regarding interface specifications: interface types,


working modes
l Regarding service specifications: tunnel specifications,
Ethernet service capability
l Regarding protection schemes: MPLS PW APS, MCLAG
l Regarding clock synchronization: IEEE 1588v2
l Regarding maintenance features: MPLS OAM, loopback
capability
l Regarding other points: The N1PEX1 occupies two slots,
but the N2PEX1 occupies only one slot. Therefore, the
N1PEX1 and N2PEX1 boards cannot be used
interchangeably.

Substitution

None

7.1.2 Application
The PEX1 is mainly used in the packet data transmission field to transmit/receive data packets,
manage bandwidths, and realize switching of data packets.
Figure 7-1 shows the typical networking and application of the PEX1. The PEX1 works with
the cross-connect board that provides the packet switching function to meet the requirement of
packet features. With this board, the TDM domain can be overlapped with the packet domain
on the OptiX OSN equipment to transmit data in the two domains. In this way, the equipment
realizes the smooth evolution from the MSTP network to the packet switching network.

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Figure 7-1 Networking and application of the PEX1


OptiX OSN 3500/
7500
NMS

OptiX OSN 3500/


7500

OptiX OSN 3500/


7500
PSN
10GE ring

OptiX OSN 1500

OptiX OSN 1500


PSN
GE ring

OptiX OSN 1500

PSN
GE ring
OptiX OSN
3500/7500
OptiX OSN 1500

Traffic direction
FE interface board/FE processing board

GE convergence board

GE processing board

10GE processing board

Dual-domain (TDM domain and packet


domain) cross-connect board
PSN: packet switched network

7.1.3 Functions and Features


The PEX1 processes and forwards 1x10 Gbit/s Ethernet services and supports QoS functions
such as traffic management, congestion control, and queue scheduling for data packets.
Table 7-2 provides the functions and features of the PEX1.
Table 7-2 Functions and features of the PEX1

Issue 03 (2013-02-20)

Funct
ion
and
Featu
re

Description

Basic
functi
ons

Provides one 10GE optical interface and receives/transmits and processes 1x10 GE
services independently.

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Funct
ion
and
Featu
re

Description

Interfa
ce
types

l N1PEX1 supports 10GBASE-SR (LAN), 10GBASE-SW (WAN), 10GBASELR (LAN), 10GBASE-LW (WAN), 10GBASE-ER (LAN), 10GBASE-EW
(WAN), 10GBASE-ZR (LAN), and 10GBASE-ZW (WAN) Ethernet optical
interfaces. The optical interface uses the LC connector and supports the
transmission distances of 0.3 km, 10 km, 40 km, and 80 km.
l (N2PEX1) Supports the 10GBASE-LR (LAN), 10GBASE-ER (LAN), and
10GBASE-ZR (LAN) Ethernet optical interfaces. The optical interface uses the
LC connector and supports the transmission distances of 10 km, 40 km, and 80
km.
l (N2PEX1) Supports the CWDM and DWDM colored optical interfaces. The
optical interface uses the LC connector. The CWDM optical interface supports
the transmission distance of 70 km. The DWDM optical interface supports the
transmission distance of 40/80 km.

Functi
ons
when
being
used
with
an
interfa
ce
board

Does not support an interface board, and has one 10GE interface on its front panel.

Interfa
ce
charac
teristic
s

Hot
optical
module
swappin
g

Supports hot swapping of XFP optical modules.

Workin
g modes

10GE full-duplex
Supports the configuration of the LAN mode or WAN mode for the port
on the N1PEX1. The default mode of the port is the LAN mode. The
N2PEX1 supports only the LAN mode.

Flow
control
at ports

Autonegotiation
mode

Not supported

Nonautonegotia
tion mode

Not supported by the N1PEX1 but supported by the


N2PEX1

Query/
Setting
of port
status
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Supported

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Funct
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Featu
re

Servic
e
specifi
cation
s

7 Packet Processing Boards

Description

Query
of
interfac
e types

Supported

Setting
of
optical
power
threshol
ds

Supported

Processi
ng
capabili
ty

Processes 10 Gbit/s services in full-duplex mode.

Service
bearing
modes

MPLS

Supported

QinQ

Supported

Port

Supported

Maximum
number of
PWs

16k

MS-PW

Supports static switching of MS-PWs.

Unidirectio
nal

Number of unidirectional MPLS tunnels (with tunnels


shared):

PW
specific
ations

Tunnel
specific
ations

N1PEX1: 4k
N2PEX1:
l When working with the N4GSCC: 4k
l When working with the N6GSCC: 16k
Bidirection
al

Number of bidirectional MPLS tunnels (with tunnels


shared):
N1PEX1: 2k
N2PEX1:
l When working with the N4GSCC: 2k
l When working with the N6GSCC: 8k

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Description

MTU

MTU for
ports

l The N1PEX1 supports the setting of the packet length,


which ranges from 960 bytes to 9600 bytes. After the
setting becomes valid, the length of the packets that
enter or exit the ports is restricted by the pre-set MTU.
l The N2PEX1 supports the setting of the packet length,
which ranges from 960 bytes to 9000 bytes. After the
setting becomes valid, the length of the packets that
enter or exit the ports is restricted by the pre-set MTU.

Ethernet
service
capabili
ty

Protec
tion
schem
es

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MPLS
Tunnel
APS

MTU for
services

For packet services carried by PWs, the PEX1 supports


the setting of the packet length, which ranges from 64
bytes to 9000 bytes; for packet services carried in other
modes, the N1PEX1 supports the setting of the packet
length, which ranges from 64 bytes to 9000 bytes, but the
N2PEX1 does not support the setting of the packet length.

E-Line
service

Number of supported E-Line services:


l When working with the N4GSCC: 4k
l When working with the N6GSCC: 8k

E-LAN
service

Number of supported E-LAN services: 1020.


Number of static MAC addresses in E-LAN services: 2k

E-AGGR
service

The N1PEX1 supports four E-AGGR services, each of


which supports 127 leaf ports; the N2PEX1 does not
support E-AGGR services.

Formats of
Ethernet
data frames

Supports the encapsulation in IEEE 802.3 format, Ethernet


II format, or IEEE 802.1q/p format.

Maximum
number of
QinQ links

1k

Maximum
number of
VLANs

4k

Jumbo
frame

Supports the Jumbo frame with a length not more than


9600 bytes.

Supports the 1+1 (single-ended/dual-ended) and 1:1 (dual-ended) MPLS


Tunnel APS.
Number of supported MPLS Tunnel APS protection groups: 1k.

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Description

MPLS
PW
APS

Supports the 1+1 (single-ended/dual-ended) and 1:1 (dual-ended) MPLS


PW APS (only on the N2PEX1).
Supports PW FPS (single-ended) MPLS PW APS (only on the
N2PEX1).
Supports a maximum of 1k MPLS PW APS protection groups, and a PW
protection group can bind a maximum of 512 members (only on the
N2PEX1).
NOTE
MPLS PW APS and MPLS Tunnel APS share the protection resources.

LAG

l Supports manual link aggregation and static link aggregation.


l Supports the load sharing mode and load non-sharing mode.
l Complies with IEEE 802.3ad and IEEE 802.1AX.

Issue 03 (2013-02-20)

MCLAG

Supported only on N2PEX1 boards, which complies with IEEE 802.3ad


and IEEE 802.1AX.

Multipl
e
spannin
g tree
protocol
(MSTP)

Not supported

LPT for
packet
services

Point-topoint LPT

Supported

Point-tomultipoint
LPT

Supported

Clock
synchr
onizati
on

Synchro
nous
Ethernet

Supports one channel of synchronous Ethernet clock signals.

IEEE
1588v2

Supports one channel of the IEEE 1588v2 clock (only on the


N2PEX1).

Maint
enanc
e
featur
es

ETH
OAM

IEEE
802.1ag

Supports CC, LB, LT, LM and 2DM.

IEEE
802.3ah

Supports OAM auto-discovery, remote loopback, fault


diagnosis, and link performance monitoring.

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Description

MPLS
OAM

MPLS
tunnel
OAM

Supports CV, FFD, BDI, FDI, MPLS Tunnel ping, and


MPLS Tunnel traceroute in compliance with ITU-T Y.
1711.
Number of MPLS tunnels that support OAM: 2k
NOTE
The N1PEX1 supports only the MPLS Tunnel OAM function.

MPLS PW
OAM

Supports CV, FFD, BDI, FDI, PW ping and PW


traceroute in compliance with ITU-T Y.1711. The number
of supported MPLS PW OAM is 2k.
NOTE
MPLS tunnel OAM and MPLS PW OAM share resources. Only
the N2PEX1 support the MPLS PW OAM function.

Loopba
ck
capabili
ty

RMON
perform
ance

Issue 03 (2013-02-20)

PHY layer
at Ethernet
ports

N1PEX1:

MAC layer
at Ethernet
ports

N1PEX1:

Inloops and outloops at the PHY layer of Ethernet ports


N2PEX1: does not support loopbacks at the PHY layer of
Ethernet ports.

Inloops at the MAC layer at Ethernet ports


N2PEX1: Supports inloops and outloops at the MAC layer
at Ethernet ports.

Supported

Inban
d
DCN

Supported

HQoS

Provides the HQoS function, including the scheduling function at multiple levels
for the flow queue and port queue and the bandwidth restricting function, and
provides the corresponding statistical information.

IGMP
snoopi
ng

Supported

Query
of
electro
nic
labels

Supported

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7.1.4 Working Principle and Signal Flow


The PEX1 consists of the network processing module, transmission management module,
switching network buffering module, CPU management module, logic control module,
temperature and voltage detecting module, clock module, and power module.
Figure 7-2 shows the functional block diagram of the PEX1.
Figure 7-2 Functional block diagram of the PEX1
Backplane
Two system clock signals

Working clock

Modules of the board

IEEE 1588 V2 packet


Synchronous Ethernet clock

1x10GE signals

Data processing
module
Packet forwarding
module
Network processing
module

Service
signal

Upstream transmission
module

Synchronous Ethernet clock


Service Upstream scheduling
module
signal

Downstream
transmission module

Downstream
scheduling module

Transmission
management module

Switching network
buffering module

Parallel management bus

Parallel management bus

CPU
management
module

PSXCSA

IEEE 1588 V2 packet

Clock
module

PSXCSA
PSXCSA

Service
signal
PSXCSA

Parallel management bus

Data backup bus


Inter-board communication bus

GSCC
GSCC

Parallel management bus


Logic control
module

Modules of the
board

Temperature and voltage


detecting signals

Temperature and
voltage detecting
signals
- 48V / - 60 V

Power
module
- 48V / - 60 V

Receive Direction
The network processing module receives the 10xGE optical signals, decodes the signals, and
converts the serial signals into parallel signals. Then, the network processing module performs
route searching or address matching for the data packets, and transmits the corresponding packets
to the transmission management module. The transmission management module buffers and
grooms the packets, slices the packets into cells that the switching network requires, and sends
the cells to the switching network buffering module. The switching network buffering module
buffers the cells and sends the cells to the cross-connect unit.

Transmit Direction
The switching network buffering module processes the cells sent by the cross-connect unit and
sends the cells to the transmission management module. The transmission management module
rearranges the cells to form packets, performs buffering and QoS management for the packets,
and sends the packets to the network processing module. The network processing module
converts the parallel signals into serial signals and sends the signals to the 10xGE optical
interface.

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Network Processing Module


The network processing module performs route searching, address matching, and other functions
for data packets. The network processing module of the PEX1 can process the 10 Gbit/s data
packets in full-duplex mode.

Transmission Management Module


The transmission management module slices packets into cells, and performs QoS management
and large volume buffering for the cells.
l

QoS management: The transmission management module provides the scheduling function
at five levels including the flow queue and port queue, the bandwidth restricting function,
and the corresponding statistical information.

Large volume buffering: The transmission management module supports traffic of 10 Gbit/
s and can buffer data for 17 ms in both the upstream direction and downstream direction.

Switching Network Buffering Module


The switching network buffering module performs cell buffering, queue management,
scheduling, and other functions. This module and the cross-connect unit form a three-level
switching network to switch cells.

CPU Management Module


The CPU management module provides the parallel management bus, Ethernet bus, and other
buses to manage the modules of the PEX1. The CPU management module also monitors alarms
and performance events and reports the alarms and performance events to the SCC unit.

Logic Control Module


The logic control module controls the logic of the PEX1. The PEX1 occupies two slots. Each
board part that occupies one slot has the control part. The control logic of the PEX1 is realized
on the board part that occupies the slot with a smaller slot number between the two slots that
house the PEX1.

Temperature and Voltage Detecting Module


The temperature and voltage detecting module monitors the temperature and voltage.

Clock Module
The clock module performs the following functions:
l

Provides the clock signal for each module of the PEX1.

Supports the IEEE 1588 V2 clock.

Supports the synchronous Ethernet clock.

Power Module
The power module converts the accessed DC voltage into the DC voltages that the modules of
the PEX1 require.
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7.1.5 Front Panel


The front panel of the PEX1 has indicators, an interface, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 7-3 shows the appearance of the front panel of the N1PEX1.
Figure 7-3 Front panel of the N1PEX1

PEX1
STAT
ACT
PROG
SRV
LINK
ACT

CLASS 1
LASER
PRODUCT

OUT1
IN1

PEX1

Figure 7-4 shows the appearance of the N2PEX1.

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Figure 7-4 Front panel of the N2PEX1

PEX1
STAT
ACT
PROG
SRV
LINK
ACT
CLASS 1
LASER
PRODUCT

OUT1

IN1

PEX1

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the Boards.

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Interfaces
The front panel of the PEX1 has one optical interface. Table 7-3 describes the type and usage
of the optical interface of the PEX1.
Table 7-3 Optical interface of the PEX1
Interface

Type of Interface

Usage

IN1

LC (pluggable)

Receives 10GE signals.

OUT1

LC (pluggable)

Transmits 10GE signals.

7.1.6 Jumpers and DIP Switches


The PEX1 does not have any jumpers or DIP switches that are used for board settings.

7.1.7 Valid Slots


The PEX1 must be installed in a valid slot in the subrack. Otherwise, the PEX1 fails to work
normally.
The N1PEX1 occupies two slots, and it can be installed in slots 18, and 1116. The PEX1 slot
displayed on the U2000 is the slot that has a smaller slot number between the two slots that house
the PEX1. For example, if the PEX1 is installed in slots 1 and 2, the PEX1 slot displayed on the
U2000 is slot 1. The mapping relationships between the valid slots for the PEX1 and the allocated
bandwidths are as follows:
l

Slot 1: 5 Gbit/s

Slot 3: 7.5 Gbit/s

Slot 5, 7, 11, or 13: 10 Gbit/s

Slot 15: 7.5 Gbit/s

Table 7-4 lists the slots valid for the PEX1 and the corresponding logical slots of the N1PEX1
on the U2000.
Table 7-4 Slots valid for the N1PEX1 and the corresponding logical slots of the N1PEX1 on
the U2000

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Slot Valid for the PEX1

Corresponding Logical Slot

Slots 1 and 2

Slot 1

Slots 3 and 4

Slot 3

Slots 5 and 6

Slot 5

Slots 7 and 8

Slot 7

Slots 11 and 12

Slot 11

Slots 13 and 14

Slot 13

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Slot Valid for the PEX1

Corresponding Logical Slot

Slots 15 and 16

Slot 15

7 Packet Processing Boards

The N2PEX1 occupies one slot, and it can be installed in slots 18, and 1116. The mapping
relationships between the valid slots for the N2PEX1 and the allocated bandwidths are as
follows:
l

Slots 13, and 16: 2.5 Gbit/s

Slots 46, and 1315: 5 Gbit/s

Slots 7 and 12: 10 Gbit/s

Slots 8 and 11: 20 Gbit/s


NOTE

l Two-slot boards can work only with cross-connect boards whose logical boards are N1PSXCS.
l One-slot boards cannot work with cross-connect boards whose logical boards are N1PSXCS.
l Two-slot boards and one-slot boards cannot be configured at the same time.
l When working with an EDQ41 board, a two-slot board cannot be installed in slot 1 or slot 15.

7.1.8 Feature Code


The PEX1 does not have the feature code.

7.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End
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Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Optional: Configure the inband DCN. For details, see Configuring the Inband DCN.
Step 3 Required: Set the Ethernet interface as follows:
l Port enabled/disabled: When you configure services on a port of the Ethernet board, the port
must be set to Enabled.
l Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same fixed working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of traffic,
services may be completely interrupted.
For details, see Parameter Description.
NOTE

For more information about the parameters of the board, see 27.1 Packet Processing Boards.

Step 4 Required: Configure services. The following Ethernet services can be configured according to
actual requirements:
l Configure the E-line service. For details, see Configuring E-Line Services.
l Configure the E-LAN service. For details, see Configuring E-LAN Services.
l Configure the E-AGGR service (only on the N1PEX1). For details, see Configuring E-AGGR
Services.
Step 5 Optional: Configure the MPLS OAM. For details, see Configuring the MPLS OAM.
Step 6 Optional: Configure the MPLS tunnel protection group. For details, see Configuring MPLS
Tunnel APS on a Per-NE Basis.
Step 7 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Configuring an Ethernet LAG.
Step 8 Optional: Configure the QoS. For details, see Configuring the HQoS.
Step 9 Optional: Configure the IEEE 1588 V2 time and clock (only on the N2PEX1). For details, see
Configuring the IEEE 1588v2 Time Synchronization and Clock Synchronization.
Step 10 Optional: Configure the IGMP Snooping. For details, see Configuring the IGMP Snooping.
----End

Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check Ethernet services.
l Check the E-line service. For details, see Verifying the Correctness of E-Line Service
Configuration.
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l Check the E-LAN service. For details, see Verifying the Correctness of E-LAN Service
Configuration.
l Check the E-AGGR service (only on the N1PEX1). For details, see Verifying the Correctness
of E-AGGR Service Configuration.
Step 2 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 3 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

7.1.10 Configuring the Board Functions


The PEX1 supports the packet switching function and provides multiple packet switchingspecific functions and features, such as HQoS, LAG, and ETH OAM. Configure the functions
according to actual requirements.
You can configure the following packet switching functions for the N1PEX1 and N2PEX1 by
using the U2000:
l

HQoS

LAG

ETH OAM

MPLS Tunnel APS

MPLS OAM

IGMP Snooping

Inband DCN

LPT

The N2PEX1 also provides the following packet switching functions:


l

MPLS PW APS

MC-LAG

MS-PW

7.1.11 Parameter Settings


You can set parameters for the PEX1 by using the U2000.

Displayed Slots
The N1PEX1 occupies two slots in the subrack. The logical slot of the N1PEX1 displayed on
the U2000 is the slot that has a smaller slot number between the two slots that house the PEX1.
For the logical slots of the N1PEX1 displayed on the U2000, refer to Table 7-4.
The N2PEX1 occupies one slot in the subrack. The logical slot of the N2PEX1 displayed on the
NMS corresponds to the installation slot.
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Board Parameters
You can set the following principal parameter for the PEX1 by using the U2000:
l

Ethernet interface

For more parameters and the description of the parameters, see 27.1 Packet Processing
Boards.

7.1.12 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also provides
the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 7-5 lists the faults that occur on the PEX1 frequently and the troubleshooting methods.
Table 7-5 Methods used to troubleshoot the faults that occur on the PEX1 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service
troubleshooting

l The service is
interrupted.

See Troubleshooting Packet Service


Interruptions.

l The service loses


packets or has
errored packets.
Protection switching
fault

l The tunnel APS


switching fails.

See Failure of Packet Service Protection


Switching.

l The PW APS
switching fails.
l The MC-LAG
switching fails.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PEX1, see Replacing a Packet Processing Board.

7.1.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

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7.1.13.1 Alarms of N1PEX1


ALM_ALS

BD_STATUS

ETH_APS_LOST

BUS_ERR

COMMUN_FAIL

ETH_APS_TYPE_MISMATCH

ETH_APS_PATH_MISMATCH

ETH_APS_SWITCH_FAIL

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_LOC

ETH_EFM_DF

ETH_EFM_EVENT

ETH_CFM_UNEXPERI

ETH_EFM_REMFAULT

ETH_LINK_DOWN

ETH_EFM_LOOPBACK

FDBSIZEALM_ELAN

FLOW_OVER

ETH_LOS

HARD_BAD

HARD_ERR

IN_PWR_ABN

LAG_DOWN

LAG_MEMBER_DOWN

LASER_MOD_ERR

LASER_SHUT

LOOP_ALM

LSR_BCM_ALM

LSR_NO_FITED

LSR_WILL_DIE

MAC_FCS_EXC

MPLS_TUNNEL_BDI

MPLS_TUNNEL_Excess

MPLS_TUNNEL_FDI

MPLS_TUNNEL_LOCV

MPLS_TUNNEL_MISMATCH

MPLS_TUNNEL_MISMERGE

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

MPLS_TUNNEL_UNKNOWN

NO_BD_SOFT

POWER_ABNORMAL

TEMP_OVER

PW_EXC_TRAFFIC

OUT_PWR_ABN

TEST_STATUS

TEM_HA

TEM_LA

PW_NO_TRAFFIC

W_OFFLINE

TR_LOC

IN_PWR_LOW

LPT_CFG_CLOSEPORT

WRG_BD_TYPE

IN_PWR_HIGH

ETHOAM_SELF_LOOP

TUNNEL_APS_DEGRADED

7.1.13.2 Alarms of N2PEX1

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TEMP_OVER

COMMUN_FAIL

TR_LOC

BUS_ERR

NO_BD_SOFT

TEST_STATUS

HARD_BAD

HARD_ERR

POWER_ABNORMAL

BD_STATUS

PW_NO_TRAFFIC

WRG_BD_TYPE

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LSR_NO_FITED

LASER_MOD_ERR

LASER_SHUT

ALM_ALS

LSR_WILL_DIE

IN_PWR_ABN

OUT_PWR_ABN

TEM_HA

TEM_LA

LSR_BCM_ALM

FLOW_OVER

LOOP_ALM

ETH_LOS

ETH_LINK_DOWN

MPLS_TUNNEL_LOCV

MAC_FCS_EXC

FDBSIZEALM_ELAN

MPLS_TUNNEL_MISMERGE

MPLS_TUNNEL_Excess

MPLS_TUNNEL_MISMATCH

MPLS_TUNNEL_FDI

MPLS_TUNNEL_UNKNOWN

MPLS_TUNNEL_BDI

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

ETH_CFM_UNEXPERI

PW_EXC_TRAFFIC

ETH_CFM_MISMERGE

ETH_EFM_DF

ETH_CFM_LOC

ETH_CFM_RDI

ETH_EFM_LOOPBACK

ETH_EFM_REMFAULT

ETH_EFM_EVENT

ETH_APS_SWITCH_FAIL

ETH_APS_TYPE_MISMATCH

ETH_APS_PATH_MISMATCH

LAG_DOWN

ETH_APS_LOST

LAG_MEMBER_DOWN

MPLS_PW_MISMATCH

MPLS_PW_LOCV

MPLS_PW_Excess

MPLS_PW_BDI

MPLS_PW_MISMERGE

MPLS_PW_UNKNOWN

MPLS_PW_SD

MCLAG_CFG_MISMATCH

MPLS_PW_SF

MCSP_PATH_LOCV

LPT_CFG_CLOSEPORT

IN_PWR_HIGH

IN_PWR_LOW

PWAPS_TYPE_MISMATCH

PWAPS_PATH_MISMATCH

PWAPS_SWITCH_FAIL

PWAPS_LOST

ETHOAM_SELF_LOOP

TUNNEL_APS_DEGRADED

BWUTILIZATION_OVER

MPLS_PW_OAMFAIL

DROPRATIO_OVER

ETH_NO_FLOW

MPLS_TUNNEL_OAMFAIL

PORT_EXC_TRAFFIC

SRV_SHUTDOWN_LD

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7.1.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

7.1.14.1 Performance Events of N1PEX1


Table 7-6 SDH
BDTEMPCUR

BDTEMPMAX

BDTEMPMIN

CPUUSAGECUR

CPUUSAGEMAX

CPUUSAGEMIN

MEMUSAGECUR

MEMUSAGEMAX

MEMUSAGEMIN

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

ETH_CFM_FLR

ETH_CFM_FL

ETH_CFM_FD

ETH_CFM_FDV

ETH_CFM_LS

ETH_CFM_SLS

ETH_CFM_UAS

ETH_CFM_CSLS

Table 7-7 ETH-OAM 802.1ag

Table 7-8 MPLS Tunnel OAM


MPLS_TUNNEL_LS

MPLS_TUNNEL_SLS

MPLS_TUNNEL_UAS

MPLS_TUNNEL_CSLS

MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

Table 7-9 Tunnel

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TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_RX_BPS

TUNNEL_TX_BPS

TUNNEL_RX_PPS

TUNNEL_TX_PPS

TUNNEL_REVERSE_RX_B
PS

TUNNEL_REVERSE_TX_
BPS

TUNNEL_REVERSE_RX
_PPS

TUNNEL_REVERSE_TX_P
PS

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Table 7-10 PW
PW_SNDPKTS

PW_SNDBYTES

PW_DROPPKTS

PW_DROPBYTES

PW_RCVPKTS

PW_RCVBYTES

PW_BANDWIDTH_UTILISATION

PW_AVAILABILITY

PW_RX_BPS

PW_TX_BPS

PW_RX_PPS

PW_TX_PPS

Table 7-11 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES

Table 7-12 QoS


QOS_PRI_DROPPKTS

QOS_PRI_DROPBYTES

Table 7-13 Statistics of RMON basic performance


ETHDROP

RXOCTETS

RXPKTS

RXBRDCAST

RXMULCAST

ETHCRCALI

ETHUNDER

ETHOVER

ETHFRG

ETHJAB

ETHCOL

RXPKT64

RXPKT65

RXPKT128

RXPKT256

RXPKT512

RXPKT1024

Table 7-14 Statistics of RMON extended performance

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RXCTLPKTS

TXOCTETS

TXPKTS

TXCTLPKTS

TXBRDCAST

TXMULCAST

TXPKT64

TXPKT65

TXPKT128

TXPKT256

TXPKT512

TXPKT1024

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Table 7-15 Statistics of specific performance events of RMON


TXPAUSE

ETHALI

ETHFCS

PKT64

PKT65

PKT128

PKT256

PKT512

PKT1024

TXETHDROP

7.1.14.2 Performance Events of N2PEX1


Table 7-16 SDH
CPUUSAGEMAX

CPUUSAGEMIN

CPUUSAGECUR

MEMUSAGEMAX

MEMUSAGEMIN

MEMUSAGECUR

BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

Table 7-17 ETH-OAM 802.1ag


ETH_CFM_LS

ETH_CFM_SLS

ETH_CFM_CSLS

ETH_CFM_UAS

ETH_CFM_FLR

ETH_CFM_FL

ETH_CFM_FD

ETH_CFM_FDV

Table 7-18 MPLS Tunnel OAM


MPLS_TUNNEL_LS

MPLS_TUNNEL_SLS

MPLS_TUNNEL_CSLS

MPLS_TUNNEL_UAS

MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

Table 7-19 Tunnel


TUNNEL_RCVPKTS

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TUNNEL_RCVBYTES

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TUNNEL_SNDBYTES

TNL_BW_UTILISATION

TUNNEL_REVERSE_SND
PKTS

TUNNEL_REVERSE_SND
BYTES

TUNNEL_REVERSE_R
CVPKTS

TUNNEL_REVERSE_RCV
BYTES

TNL_REVERSE_BW_UTILISATION

TUNNEL_REVERSE_R
X_BPS

TUNNEL_REVERSE_RX_
PPS

TUNNEL_REVERSE_TX_B
PS

TUNNEL_REVERSE_T
X_PPS

TUNNEL_RX_BPS

TUNNEL_RX_PPS

TUNNEL_TX_BPS

TUNNEL_TX_PPS

Table 7-20 MPLS PW OAM


MPLS_PW_LS

MPLS_PW_SLS

MPLS_PW_CSLS

MPLS_PW_UAS

MPLS_PW_FLR

MPLS_PW_FL

MPLS_PW_FD

MPLS_PW_FDV

Table 7-21 PW
PW_RCVPKTS

PW_RCVBYTES

PW_SNDBYTES

PW_BANDWIDTH_U
TILISATION

PW_RX_BPS

PW_RX_PPS

PW_SNDPKTS

PW_TX_BPS

PW_TX_PPS

Table 7-22 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES

VUNI_TX_UTILIZATION

VUNI_SND_DROPPKTS

VUNI_SND_DROPBYTES

VUNI_SND_DROPRATIO

Table 7-23 Statistics of RMON basic performance

Issue 03 (2013-02-20)

RXOCTETS

RXPKTS

RXBRDCAST

RXMULCAST

ETHUNDER

ETHOVER

ETHFRG

RXPKT64

RXPKT65

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RXPKT128

7 Packet Processing Boards

RXPKT256

RXPKT512

RXPKT1024

Table 7-24 Statistics of RMON extended performance


RXPKT1519

TXPKT64

TXPKT65

TXPKT128

TXPKT256

TXPKT512

TXPKT1024

TXPKT1519

PKT64

PKT65

PKT128

PKT256

PKT512

PKT1024

PKT1519

RXUNICAST

TXUNICAST

TXMULCAST

TXBRDCAST

RXPAUSE

ETHFCS

ETHUTILIZ

RXCTLPKTS

TXETHOVER

TXPKTS

TXOCTETS

PORT_RX_BYTES_AVAILABILITY

RXBPS

TXBPS

RXPPS

TXPPS

Table 7-25 QoS


FLOW_RX_UTILIZATION

QOS_CARGRNBYTES

QOS_CARGRNPKTS

QOS_CARREDBYTES

QOS_CARREDPKTS

QOS_CARREDRATIO

QOS_CARYLWBYTES

QOS_CARYLWPKTS

QOS_STRM_MATCHBYTES

QOS_STRM_MATCHPKT
S

TNL_REVERSE_SNDDRO
PBYTES

TNL_REVERSE_SNDDRO
PPKTS

TNL_REVERSE_SNDDRO
PRATIO

TNL_SNDDROPBYTES

TNL_SNDDROPPKTS

TNL_SNDDROPRATIO

7.1.15 Technical Specifications


The technical specifications of the PEX1 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

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Parameters Specified for Optical Interfaces


Table 7-26 lists the parameters specified for the optical interfaces of the N1PEX1.
Table 7-26 Parameters specified for the optical interfaces of the N1PEX1
Parameter

Value

Type of
interface

10GBASE-SR
(LAN)

10GBASE-LR
(LAN)

10GBASE-ER
(LAN)

10GBASE-ZR
(LAN)

10GBASE-SW
(WAN)

10GBASE-LW
(WAN)

10GBASE-EW
(WAN)

10GBASE-ZW
(WAN)

Transmission
distance (km)

0.3

10

40

80

Type of fiber

Multi-mode LC

Single-mode LC

Single-mode
LC

Single-mode
LC

Launched
optical power
range (dBm)

-1.3 to -7.3

-6 to -1

-1 to 2

0 to 4

Operating
wavelength
range (nm)

840 to 860

1260 to 1330

1530 to 1565

1530 to 1565

Minimum
overload (dBm)

-1

0.5

-1

-7

Receiver
sensitivity
(dBm)

-7.5

-11

-15

-24

Minimum
extinction ratio
(dB)

8.2

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

30

30

Table 7-27 lists the parameters specified for the optical interfaces of the N2PEX1.

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Table 7-27 Parameters specified for the optical interfaces of the N2PEX1
Parameter

Value

Type of interface

10GBASE-LR (LAN)

10GBASE-ER
(LAN)

10GBASE-ZR
(LAN)

Transmission
distance (km)

10

40

80

Type of fiber

Single-mode LC

Single-mode LC

Single-mode LC

Launched optical
power range (dBm)

-6 to -1

-1 to 2

0 to 4

Operating
wavelength range
(nm)

1260 to 1330

1530 to 1565

1530 to 1565

Minimum overload
(dBm)

0.5

-1

-7

Receiver sensitivity
(dBm)

-11

-15

-24

Minimum extinction
ratio (dB)

8.2

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio
(dB)

30

30

30

Table 7-28 and Table 7-29 lists the parameters specified for the colored optical interfaces of
the N2PEX1.
Table 7-28 CWDM parameters specified for the colored optical interfaces of the N2PEX1
Parameter

Value
CWDM

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Nominal bit rate

9953280 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

70

Launched optical power range


(dBm)

0 to 4

Operating wavelength range


(nm)

1471 to 1611, in steps of 20

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Parameter

7 Packet Processing Boards

Value
CWDM

Receiver sensitivity (dBm)

l 1451nm to 1551nm: -23


l 1571nm: -22
l 1591nm to 1611nm: -21

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

1400

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral width


(nm)

Minimum side mode


suppression ratio (dB)

30

Table 7-29 DWDM parameters specified for the colored optical interfaces of the N2PEX1
Parameter

Value
DWDM

Issue 03 (2013-02-20)

Nominal bit rate

9953280 kbit/s

Type of fiber

Single-mode LC

Transmission
distance (km)

40

80

Launched optical
power range
(dBm)

-1 to 2

-1 to 3

Central frequency
(THz)

192.10 to 196.00

192.10 to 196.00

Central frequency
deviation (GHz)

10

10

Receiver
sensitivity (dBm)

-17

-24

Minimum
overload (dBm)

-1

-9

Maximum allowed
dispersion (ps/nm)

800

1600

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Parameter

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Value
DWDM

Minimum
extinction ratio
(dB)

9.5

8.2

Maximum -20 dB
spectral width
(nm)

0.3

0.3

Minimum side
mode suppression
ratio (dB)

35

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1PEX1 are as follows:
l

Dimensions (mm): 50.8 (W) x 220 (D) x 254.1 (H)

Weight (kg): 2.4

The mechanical specifications of the N2PEX1 are as follows:


l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.4

Power Consumption
The maximum power consumption of the N1PEX1 at room temperature (25C) is 107 W.
The maximum power consumption of the N2PEX1 at room temperature (25C) is 48 W.

7.2 PEX2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEX2 (2-port 10 Gigabit Ethernet switching processing board).
This topic also describes how to configure and commission the PEX2.

7.2.1 Version Description


The PEX2 is available in one functional version, namely, N1.

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7.2.2 Application
The PEX2 is mainly used in the packet data transmission field to transmit/receive data packets,
manage bandwidths, and implement switching of data packets.
Figure 7-5 shows the typical networking and application of the PEX2. The PEX2 works with
the cross-connect board that provides the packet switching function to meet the requirement of
packet features. With this board, the TDM domain can be overlapped with the packet domain
on the OptiX OSN equipment so that the data can be transmitted in the two domains. In this
manner, an MSTP network can smoothly evolve to a packet switching network.
Figure 7-5 Networking and application of the PEX2
OptiX OSN 3500/
7500
NMS

OptiX OSN 3500/


7500

OptiX OSN 3500/


7500
PSN
10GE ring

OptiX OSN 1500

OptiX OSN 1500


PSN
GE ring

OptiX OSN 1500

PSN
GE ring
OptiX OSN
3500/7500
OptiX OSN 1500

Traffic direction
FE interface board/FE processing board

GE convergence board

GE processing board

10GE processing board

Dual-domain (TDM domain and packet


domain) cross-connect board
PSN: packet switched network

7.2.3 Functions and Features


The PEX2 processes and forwards 2x10 Gbit/s Ethernet services and supports QoS functions
such as traffic management, congestion control, and queue scheduling for data packets.
Table 7-30 provides the functions and features of the PEX2.

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Table 7-30 Functions and features of the PEX2


Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits and processes 2x10 GE services.

Interfa
ce
types

l Supports the 10GBASE-LR (LAN), 10GBASE-ER (LAN), and 10GBASE-ZR


(LAN) Ethernet optical interfaces. The optical interface uses the LC connector
and supports the transmission distances of 10 km, 40 km, and 80 km.
l Supports the CWDM and DWDM colored optical interfaces. The optical
interface uses the LC connector. The CWDM optical interface supports the
transmission distance of 70 km. The DWDM optical interface supports the
transmission distance of 40/80 km.

Functi
ons
when
being
used
with
an
interfa
ce
board

Does not support an interface board, and has two 10GE interfaces on its front panel.

Interfa
ce
charac
teristic
s

Hot
optical
module
swappin
g

Supports hot swapping of XFP optical modules.

Workin
g modes

10GE Full-duplex (only in LAN mode)

Flow
control
at ports

Autonegotiation
mode

Not supported

Nonautonegotia
tion mode

Supported

Query/
Setting
of port
status

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Supported

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Funct
ion
and
Featu
re

Servic
e
specifi
cation
s

7 Packet Processing Boards

Description

Query
of
interfac
e types

Supported

Setting
of
optical
power
threshol
ds

Supported

Processi
ng
capabili
ty

Processes 20 Gbit/s services in full-duplex mode.

Service
bearing
modes

MPLS

Supported

QinQ

Supported

Port

Supported

Maximum
number of
PWs

16k

MS-PW

Supports static switching of MS-PWs.

Unidirectio
nal

Number of unidirectional MPLS tunnels (with tunnels


shared):

PW
specific
ations

Tunnel
specific
ations

l When working with the N4GSCC: 4k


l When working with the N6GSCC: 16k
Bidirection
al

Number of bidirectional MPLS tunnels (with tunnels


shared):
l When working with the N4GSCC: 2k
l When working with the N6GSCC: 8k

MTU

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MTU for
ports

Supports the setting of the packet length, which ranges


from 960 bytes to 9000 bytes. After the setting becomes
valid, the length of the packets that enter or exit the ports
is restricted by the pre-set MTU.

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Funct
ion
and
Featu
re

Description

Ethernet
service
capabili
ty

Protec
tion
schem
es

7 Packet Processing Boards

MTU for
services

For packet services carried by PWs, the PEX2 supports


the setting of the packet length, which ranges from 64
bytes to 9000 bytes; for packet services carried in other
modes, the PEX2 does not support the setting of the packet
length.

E-Line
service

Number of supported E-Line services:


l When working with the N4GSCC: 4k
l When working with the N6GSCC: 8k

E-LAN
service

Number of supported E-LAN services: 1020


Number of static MAC addresses in E-LAN services: 2k

E-AGGR
service

Not supported

Formats of
Ethernet
data frames

Supports the encapsulation in IEEE 802.3 format, Ethernet


II format, or IEEE 802.1q/p format.

Maximum
number of
QinQ links

1k

Maximum
number of
VLANs

4k

Jumbo
frame

Supports the Jumbo frame with a length not more than


9000 bytes.

MPLS
Tunnel
APS

Supports the 1+1 (single-ended/dual-ended) and 1:1 (dual-ended) MPLS


Tunnel APS.
Number of supported MPLS Tunnel APS protection groups: 1k

MPLS
PW
APS

Supports the PW FPS (single-ended), 1+1 (single-ended/dual-ended) and


1:1 (dual-ended) MPLS Tunnel APS.
Supports a maximum of 1k MPLS PW APS protection groups, and a PW
protection group can bind a maximum of 512 members.
NOTE
MPLS PW APS and MPLS Tunnel APS share the protection resources.

LAG

l Supports manual link aggregation and static link aggregation.


l Supports the load sharing mode and load non-sharing mode.
l Complies with IEEE 802.3ad and IEEE 802.1AX.

MCLAG

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Supported, which complies with IEEE 802.3ad and IEEE 802.1AX.

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Funct
ion
and
Featu
re

7 Packet Processing Boards

Description

Multipl
e
spannin
g tree
protocol
(MSTP)

Not supported

LPT for
packet
services

Point-topoint LPT

Supported

Point-tomultipoint
LPT

Supported

Clock
synchr
onizati
on

Synchro
nous
Ethernet

Supports two channels of synchronous Ethernet clock signals.

IEEE
1588v2

Supports two channels of IEEE 1588v2 clock signals.

Maint
enanc
e
featur
es

ETH
OAM

IEEE
802.1ag

Supports CC, LB, LT, LM and 2DM.

IEEE
802.3ah

Supports OAM auto-discovery, remote loopback, and link


performance monitoring.

MPLS
tunnel
OAM

Supports CV, FFD, BDI, FDI, MPLS Tunnel ping, and


MPLS Tunnel traceroute in compliance with ITU-T Y.
1711.
Number of MPLS tunnels that support OAM: 2k

MPLS PW
OAM

Supports CV, FFD, BDI, FDI, PW ping and PW traceroute


in compliance with ITU-T Y.1711.
Number of MPLS PWs that support OAM: 2k

MPLS
OAM

NOTE
MPLS tunnel OAM and MPLS PW OAM share resources.

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Loopba
ck
capabili
ty

PHY layer
at Ethernet
ports

Not supported

MAC layer
at Ethernet
ports

Inloops and outloops

RMON
perform
ance

Supported

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Funct
ion
and
Featu
re

Description

Inban
d
DCN

Supported

HQoS

Provides the HQoS function, including the scheduling function at multiple levels
for the flow queue and port queue and the bandwidth restricting function, and
provides the corresponding statistical information.

IGMP
snoopi
ng

Supported

Query
of
electro
nic
labels

Supported

7.2.4 Working Principle and Signal Flow


The PEX2 consists of the network processing module, transmission management module,
switching network buffering module, CPU management module, logic control module,
temperature and voltage detecting module, clock module, and power module.
Figure 7-6 shows the functional block diagram of the PEX2.
Figure 7-6 Functional block diagram of the PEX2
Working clock

Modules of the board

Clock
module

IEEE 1588 V2 packet


Synchronous Ethernet clock

2x10GE signals

Backplane
Two system clock signals
PSXCSA
IEEE 1588 V2 packet
PSXCSA
Synchronous Ethernet clock
PSXCSA

Upstream transmission
Service Upstream scheduling Service
module
module
signal
signal
Downstream
Downstream
transmission module
scheduling module
Transmission
Switching network
management module
buffering module
Parallel management bus
Parallel management bus Parallel management
bus
Data backup bus
CPU

Data processing
module
Packet forwarding
module
Network processing
module

Service
signal

management
module

Inter-board communication bus

PSXCSA

GSCC
GSCC

Parallel management bus


Logic control
module

Modules of the board

Issue 03 (2013-02-20)

Temperature and
voltage detecting
signals

Temperature and
voltage detecting
signals
- 48V / - 60V

Power
module

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Receive Direction
The network processing module receives 2x10GE optical signals, decodes the signals, and
converts the serial signals into parallel signals. Then, the network processing module performs
route searching or address matching for the data packets, and transmits the corresponding packets
to the transmission management module. The transmission management module buffers and
schedules the packets, slices the packets into cells that the switching network requires, and sends
the cells to the switching network buffering module. The switching network buffering module
buffers the cells and sends the cells to the cross-connect unit.

Transmit Direction
The switching network buffering module processes the cells sent by the cross-connect unit and
sends the cells to the transmission management module. The transmission management module
rearranges the cells to form packets, performs buffering and QoS management for the packets,
and sends the packets to the network processing module. The network processing module
converts the parallel signals into serial signals and sends the signals to the 10xGE optical
interface.

Network Processing Module


The network processing module performs route searching, address matching, and other functions
for data packets. The network processing module of the PEX2 can process the 20 Gbit/s data
packets in full-duplex mode.

Transmission Management Module


The transmission management module slices packets into cells, and performs QoS management
and large volume buffering for the cells.
l

QoS management: The transmission management module provides the scheduling function
at five levels for the flow queue and port queue, and the bandwidth restricting function,
and provides the corresponding statistics information.

Large volume buffering: The transmission management module supports traffic of 20 Gbit/
s and can buffer data for 17 ms in both the upstream direction and downstream direction.

Switching Network Buffering Module


The switching network buffering module performs cell buffering, queue management,
scheduling, and other functions. This module and the cross-connect unit form a three-level
switching network to switch cells.

CPU Management Module


The CPU management module provides the parallel management bus, Ethernet bus, and other
buses to manage the modules of the board. The CPU management module also monitors alarms
and performance events and reports the alarms and performance events to the SCC unit.

Logic Control Module


The logic control module controls the logic of the PEX2. It performs the following functions:
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Decodes the address signals of the peripheral modules, allocates the registers, and controls
the logic.

Reports and controls the board status, for example, the shutdown or startup of the laser.

Controls the logic of the CPU module and decodes the address signals of the CPU module.

Configures services, queries the performance, and controls alarms.

Implements some clock functions.

Temperature and Voltage Detecting Module


The temperature and voltage detecting module monitors the temperature and voltage.

Clock Module
The clock module performs the following functions:
l

Provides clock signals for each module of the PEX2.

Supports the IEEE 1588 V2 clock.

Supports the synchronous Ethernet clock.

Power Module
The power module converts the accessed DC voltage into the DC voltages that the modules of
the PEX2 require.

7.2.5 Front Panel


The front panel of the PEX2 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 7-7 shows the appearance of the front panel of the PEX2.

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Figure 7-7 Front panel of the PEX2

PEX2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2
CLASS 1
LASER
PRODUCT

OUT1

IN1

OUT2

IN2

PEX2

Indicators
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the Boards.

Interfaces
The front panel of the PEX2 has two optical interfaces. Table 7-31 describes the type and usage
of the optical interfaces of the PEX2.
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Table 7-31 Optical interfaces of the PEX2


Interface

Type of Interface

Usage

IN1-IN2

LC (pluggable)

Receives 10GE signals.

OUT1OUT2

LC (pluggable)

Transmits 10GE signals.

7.2.6 Jumpers and DIP Switches


The PEX2 does not have any jumpers or DIP switches that are used for board settings.

7.2.7 Valid Slots


The PEX2 must be installed in a valid slot in the subrack. Otherwise, the PEX2 fails to work
normally.
The following part lists the valid slots of the PEX2 and the corresponding bandwidths:
l

Slots 1-3, and 16 (2.5 Gbit/s)

Slots 4-6 and 13-15 (5 Gbit/s)

Slots 7 and 12 (10 Gbit/s)

Slots 8 and 11 (20 Gbit/s)

7.2.8 Feature Code


The PEX2 does not have the feature code.

7.2.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
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Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Optional: Configure the inband DCN. For details, see Configuring the Inband DCN.
Step 3 Required: Set the Ethernet interface as follows:
l Port enabled/disabled: When you configure services on a port of the Ethernet board, the port
must be set to Enabled.
l Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same fixed working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of traffic,
services may be completely interrupted.
For details, see Parameter Description.
NOTE

For more information about the parameters of the board, see 27.1 Packet Processing Boards.

Step 4 Required: Configure services. The following Ethernet services can be configured according to
actual requirements:
l Configure the E-line service. For details, see Configuring E-Line Services.
l Configure the E-LAN service. For details, see Configuring E-LAN Services.
Step 5 Optional: Configure the MPLS OAM. For details, see Configuring the MPLS OAM.
Step 6 Optional: Configure the MPLS tunnel protection group. For details, see Configuring MPLS
Tunnel APS on a Per-NE Basis.
Step 7 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Configuring an Ethernet LAG.
Step 8 Optional: Configure the QoS. For details, see Configuring the HQoS.
Step 9 Optional: Configure the IEEE 1588 V2 time and clock. For details, see Configuring the IEEE
1588v2 Time Synchronization and Clock Synchronization.
Step 10 Optional: Configure the IGMP Snooping. For details, see Configuring the IGMP Snooping.
----End

Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check Ethernet services.
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l Check the E-line service. For details, see Verifying the Correctness of E-Line Service
Configuration.
l Check the E-LAN service. For details, see Verifying the Correctness of E-LAN Service
Configuration.
Step 2 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 3 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

7.2.10 Configuring the Board Functions


The PEX2 supports the packet switching function and provides multiple packet-specific
functions and features, such as HQoS, LAG, and ETH OAM. Configure the functions according
to actual requirements.
You can configure the following packet functions for the PEX2 by using the U2000:
l

HQoS

LAG

ETH OAM

MPLS Tunnel APS

MPLS OAM

IGMP Snooping

Inband DCN

LPT

MPLS PW APS

MC-LAG

MS-PW

7.2.11 Parameter Settings


You can set the parameters for the PEX2 by using the U2000.
You can set the following parameters for the PEX2 by using the U2000:
l

Ethernet interface

For information about more parameters and the description of each parameter, see 27.1 Packet
Processing Boards.

7.2.12 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also provides
the methods and precautions to be taken for rectifying the faults.
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Troubleshooting
Table 7-32 lists the faults that occur on the PEX2 frequently and the troubleshooting methods.
Table 7-32 Methods used to troubleshoot the faults that occur on the PEX2 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service
troubleshooting

l The service is
interrupted.

See Troubleshooting Packet Service


Interruptions.

l The service loses


packets or has
errored packets.
Protection switching
fault

l The tunnel APS


switching fails.

See Failure of Packet Service Protection


Switching.

l The PW APS
switching fails.
l The MC-LAG
switching fails.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PEX2, see Replacing a Packet Processing Board.

7.2.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the NMS.

7.2.13.1 Alarms of N1PEX2

Issue 03 (2013-02-20)

TEMP_OVER

COMMUN_FAIL

TR_LOC

BUS_ERR

NO_BD_SOFT

TEST_STATUS

HARD_BAD

HARD_ERR

POWER_ABNORMAL

BD_STATUS

PW_NO_TRAFFIC

WRG_BD_TYPE

LSR_NO_FITED

LASER_MOD_ERR

LASER_SHUT

ALM_ALS

LSR_WILL_DIE

IN_PWR_ABN

OUT_PWR_ABN

TEM_HA

TEM_LA

LSR_BCM_ALM

FLOW_OVER

LOOP_ALM

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ETH_LOS

ETH_LINK_DOWN

MPLS_TUNNEL_LOCV

MAC_FCS_EXC

FDBSIZEALM_ELAN

MPLS_TUNNEL_MISMERGE

MPLS_TUNNEL_Excess

MPLS_TUNNEL_MISMATCH

MPLS_TUNNEL_FDI

MPLS_TUNNEL_UNKNOWN

MPLS_TUNNEL_BDI

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

ETH_CFM_UNEXPERI

PW_EXC_TRAFFIC

ETH_CFM_MISMERGE

ETH_EFM_DF

ETH_CFM_LOC

ETH_CFM_RDI

ETH_EFM_LOOPBACK

ETH_EFM_REMFAULT

ETH_EFM_EVENT

ETH_APS_SWITCH_FAIL

ETH_APS_TYPE_MISMATCH

ETH_APS_PATH_MISMATCH

LAG_DOWN

ETH_APS_LOST

LAG_MEMBER_DOWN

MPLS_PW_MISMATCH

MPLS_PW_LOCV

MPLS_PW_Excess

MPLS_PW_BDI

MPLS_PW_MISMERGE

MPLS_PW_UNKNOWN

MPLS_PW_SD

MCLAG_CFG_MISMATCH

MPLS_PW_SF

MCSP_PATH_LOCV

LPT_CFG_CLOSEPORT

IN_PWR_HIGH

IN_PWR_LOW

PWAPS_TYPE_MISMATCH

PWAPS_PATH_MISMATCH

PWAPS_SWITCH_FAIL

PWAPS_LOST

ETHOAM_SELF_LOOP

TUNNEL_APS_DEGRADED

BWUTILIZATION_OVER

MPLS_PW_OAMFAIL

DROPRATIO_OVER

ETH_NO_FLOW

MPLS_TUNNEL_OAMFAIL

PORT_EXC_TRAFFIC

SRV_SHUTDOWN_LD

7.2.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the NMS.

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7.2.14.1 Performance Events of N1PEX2


Table 7-33 SDH
CPUUSAGEMAX

CPUUSAGEMIN

CPUUSAGECUR

MEMUSAGEMAX

MEMUSAGEMIN

MEMUSAGECUR

BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

Table 7-34 ETH-OAM 802.1ag


ETH_CFM_LS

ETH_CFM_SLS

ETH_CFM_CSLS

ETH_CFM_UAS

ETH_CFM_FLR

ETH_CFM_FL

ETH_CFM_FD

ETH_CFM_FDV

Table 7-35 MPLS Tunnel OAM


MPLS_TUNNEL_LS

MPLS_TUNNEL_SLS

MPLS_TUNNEL_CSLS

MPLS_TUNNEL_UAS

MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

Table 7-36 Tunnel

Issue 03 (2013-02-20)

TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TNL_BW_UTILISATION

TUNNEL_REVERSE_SND
PKTS

TUNNEL_REVERSE_SND
BYTES

TUNNEL_REVERSE_R
CVPKTS

TUNNEL_REVERSE_RCV
BYTES

TNL_REVERSE_BW_UTILISATION

TUNNEL_REVERSE_R
X_BPS

TUNNEL_REVERSE_RX_
PPS

TUNNEL_REVERSE_TX_B
PS

TUNNEL_REVERSE_T
X_PPS

TUNNEL_RX_BPS

TUNNEL_RX_PPS

TUNNEL_TX_BPS

TUNNEL_TX_PPS

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Table 7-37 MPLS PW OAM


MPLS_PW_LS

MPLS_PW_SLS

MPLS_PW_CSLS

MPLS_PW_UAS

MPLS_PW_FLR

MPLS_PW_FL

MPLS_PW_FD

MPLS_PW_FDV

Table 7-38 PW
PW_RCVPKTS

PW_RCVBYTES

PW_SNDBYTES

PW_BANDWIDTH_U
TILISATION

PW_RX_BPS

PW_RX_PPS

PW_SNDPKTS

PW_TX_BPS

PW_TX_PPS

Table 7-39 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES

VUNI_TX_UTILIZATION

VUNI_SND_DROPPKTS

VUNI_SND_DROPBYTES

VUNI_SND_DROPRATIO

Table 7-40 Statistics of RMON basic performance


RXOCTETS

RXPKTS

RXBRDCAST

RXMULCAST

ETHUNDER

ETHOVER

ETHFRG

RXPKT64

RXPKT65

RXPKT128

RXPKT256

RXPKT512

RXPKT1024

Table 7-41 Statistics of RMON extended performance

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RXPKT1519

TXPKT64

TXPKT65

TXPKT128

TXPKT256

TXPKT512

TXPKT1024

TXPKT1519

PKT64

PKT65

PKT128

PKT256

PKT512

PKT1024

PKT1519

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RXUNICAST

TXUNICAST

TXMULCAST

TXBRDCAST

RXPAUSE

ETHFCS

ETHUTILIZ

RXCTLPKTS

TXETHOVER

TXPKTS

TXOCTETS

PORT_RX_BYTES_AVAILABILITY

RXBPS

TXBPS

RXPPS

TXPPS

Table 7-42 QoS


FLOW_RX_UTILIZATION

QOS_CARGRNBYTES

QOS_CARGRNPKTS

QOS_CARREDBYTES

QOS_CARREDPKTS

QOS_CARREDRATIO

QOS_CARYLWBYTES

QOS_CARYLWPKTS

QOS_STRM_MATCHBYTES

QOS_STRM_MATCHPKT
S

TNL_REVERSE_SNDDRO
PBYTES

TNL_REVERSE_SNDDRO
PPKTS

TNL_REVERSE_SNDDRO
PRATIO

TNL_SNDDROPBYTES

TNL_SNDDROPPKTS

TNL_SNDDROPRATIO

7.2.15 Technical Specifications


The technical specifications of the PEX2 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 7-43 lists the parameters specified for the optical interfaces of the PEX2.
Table 7-43 Parameters specified for the optical interfaces of the PEX2

Issue 03 (2013-02-20)

Parameter

Value

Type of interface

10GBASE-LR
(LAN)

10GBASE-ER
(LAN)

10GBASE-ZR
(LAN)

Transmission
distance (km)

10

40

80

Type of fiber

Single-mode LC

Single-mode LC

Single-mode LC

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Parameter

Value

Launched optical
power range (dBm)

-6 to -1

-1 to 2

0 to 4

Operating
wavelength range
(nm)

1260 to 1330

1530 to 1565

1530 to 1565

Minimum overload
(dBm)

0.5

-1

-7

Receiver sensitivity
(dBm)

-11

-15

-24

Minimum extinction
ratio (dB)

8.2

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio (dB)

30

30

30

Table 7-44 and Table 7-45 lists the parameters specified for the 10GE colored optical interfaces
of the PEX2.
Table 7-44 CWDM parameters specified for the colored optical interfaces of the PEX2
Parameter

Value
CWDM

Nominal bit rate

9953280 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

70

Launched optical power range


(dBm)

0 to 4

Operating wavelength range


(nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

l 1451nm to 1551nm: -23


l 1571nm: -22
l 1591nm to 1611nm: -21

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Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

1400

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Parameter

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Value
CWDM

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral width


(nm)

Minimum side mode


suppression ratio (dB)

30

Table 7-45 DWDM parameters specified for the colored optical interfaces of the PEX2
Parameter

Value
DWDM

Issue 03 (2013-02-20)

Nominal bit rate

9953280 kbit/s

Type of fiber

Single-mode LC

Transmission
distance (km)

40

80

Launched optical
power range
(dBm)

-1 to 2

-1 to 3

Central frequency
(THz)

192.10 to 196.00

192.10 to 196.00

Central frequency
deviation (GHz)

10

10

Receiver
sensitivity (dBm)

-17

-24

Minimum
overload (dBm)

-1

-9

Maximum allowed
dispersion (ps/nm)

800

1600

Minimum
extinction ratio
(dB)

9.5

8.2

Maximum -20 dB
spectral width
(nm)

0.3

0.3

Minimum side
mode suppression
ratio (dB)

35

30

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Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the PEX2 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.4

Power Consumption
The maximum power consumption of the PEX2 at room temperature (25C) is 49 W.

7.3 PEG8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEG8 (8-Port Gigabit Ethernet switching processing board). This
topic also describes how to configure and commission the PEG8

7.3.1 Version Description


The PEG8 is available in one functional version, namely, N1.

7.3.2 Application
The PEG8 is mainly used in the packet data transmission field to transmit/receive data packets,
manage bandwidths, and realize switching of data packets.
Figure 7-8 shows the typical networking and application of the PEG8. The PEG8 works with
the cross-connect board that provides the packet switching function to meet the requirement of
packet features. With this board, the TDM domain can be overlapped with the packet domain
on the OptiX OSN equipment so that the data can be transmitted in the two domains. In this
manner, an MSTP network can smoothly evolve to a packet switching network.
8.1.2 Application describes the typical networking and application when the PEG8 works with
the PETF8.
8.2.2 Application describes the typical networking and application when the PEG8 works with
the PEFF8.
8.3.2 Application describes the typical networking and application when the PEG8 works with
the CQ1.
8.4.2 Application describes the typical networking and application when the PEG8 works with
the MD12.
8.5.2 Application describes the typical networking and application when the PEG8 works with
the MD75.
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Figure 7-8 Networking and application of the PEG8


OptiX OSN 3500/
7500
NMS

OptiX OSN 3500/


7500

OptiX OSN 3500/


7500
PSN
10GE ring

OptiX OSN 1500

OptiX OSN 1500


PSN
GE ring

OptiX OSN 1500

PSN
GE ring
OptiX OSN
3500/7500
OptiX OSN 1500

Traffic direction
FE interface board/FE processing board

GE convergence board

GE processing board

10GE processing board

Dual-domain (TDM domain and packet


domain) cross-connect board
PSN: packet switched network

7.3.3 Functions and Features


The PEG8 processes and forwards 8xGE services and supports QoS functions such as traffic
management, congestion control, and queue scheduling for data packets.
Table 7-46 provides the functions and features of the PEG8.
Table 7-46 Functions and features of the PEG8
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Provides eight GE optical/electrical interfaces on the front panel of the board, and
receives/transmits and processes 8xGE signals.
When being used with an interface board:
l Works with the interface board PETF8/PEFF8/CQ1/MD12/MD75. One PEG8
board can receive/transmit the FE/channelized E1 STM-1/CES services from a
maximum of two interface boards.
l Works with the interface board MD12/MD75. One PEG8 board can receive/
transmit the ATM/IMA services from a maximum of two interface boards.

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Funct
ion
and
Featu
re

Description

Interfa
ce
types

l Supports the 1000BASE-SX, 1000BASE-LX, 1000BASE-VX, and 1000BASEZX optical interfaces. The optical interface uses the LC connector and supports
the transmission distances of 0.5 km, 10 km, 40 km, and 80 km.
l Supports the CWDM colored optical interfaces. The optical interface uses the
LC connector and supports the transmission distances of 40 km and 80 km.
l Supports the DWDM colored optical interfaces. The optical interface uses the
LC connector and supports the transmission distance of 120 km.
l Supports the GE electrical interfaces. The electrical interface uses the RJ45
connector and meets the specifications of the 1000BASE-T physical layer
provided in IEEE 802.3.

Interfa
ce
charac
teristic
s

Issue 03 (2013-02-20)

Hot
optical
module
swappin
g

Supports hot swapping of SFP optical modules.

Workin
g modes

Full-duplex and auto-negotiation for GE optical interfaces


Auto-negotiation for GE electrical ports (the negotiation result can only
be 1000M full duplex)

Flow
control
at ports

Autonegotiation
mode

Supported

Nonautonegotia
tion mode

Supported

Query/
Setting
of port
status

Supported

Query
of
interfac
e types

Supported

Setting
of
optical
power
threshol
ds

Supported

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Funct
ion
and
Featu
re

Description

Servic
e
specifi
cation
s

Processi
ng
capabili
ty

The processing capability varies according to slots.

Service
bearing
modes

MPLS

Supported

QinQ

Supported

Port

Supported

Maximum
number of
PWs

16k

MS-PW

Supports static switching of MS-PWs.

Unidirectio
nal

Number of unidirectional MPLS tunnels (with tunnels


shared):

PW
specific
ations

Tunnel
specific
ations

l When a PEG8 is installed in any slot of slots 1-3 and 16, it processes
2.5 Gbit/s services in full-duplex mode.
l When a PEG8 is installed in any slot of slots 4-6 and 13-15, it
processes 5 Gbit/s services in full-duplex mode.

l When working with the N4GSCC: 4k


l When working with the N6GSCC: 16k
Bidirection
al

Number of bidirectional MPLS tunnels (with tunnels


shared):
l When working with the N4GSCC: 2k
l When working with the N6GSCC: 8k

MTU

Ethernet
service
capabili
ty

Issue 03 (2013-02-20)

MTU for
ports

Supports the setting of the packet length, which ranges


from 960 bytes to 9000 bytes. After the setting becomes
valid, the length of the packets that enter or exit the ports
is restricted by the pre-set MTU.

MTU for
services

For packet services carried by PWs, the PEG8 supports


the setting of the packet length, which ranges from 64
bytes to 9000 bytes; for packet services carried in other
modes, the PEG8 does not support the setting of the packet
length.

E-Line
service

Number of supported E-Line services:


l When working with the N4GSCC: 4k
l When working with the N6GSCC: 8k

E-LAN
service

Number of supported E-LAN services: 1020


Number of static MAC addresses in E-LAN services: 2k

E-AGGR
service

Not supported

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Funct
ion
and
Featu
re

Protec
tion
schem
es

7 Packet Processing Boards

Description

Formats of
Ethernet
data frames

Supports the encapsulation in IEEE 802.3 format, Ethernet


II format, or IEEE 802.1q/p format.

Maximum
number of
QinQ links

1k

Maximum
number of
VLANs

4k

Jumbo
frame

Supports the Jumbo frame with a length not more than


9000 bytes.

MPLS
Tunnel
APS

Supports the 1+1 (single-ended/dual-ended) and 1:1 (dual-ended) MPLS


Tunnel APS.

MPLS
PW
APS

Supports the PW FPS (single-ended), 1+1 (single-ended/dual-ended) and


1:1 (dual-ended) MPLS PW APS.

Number of supported MPLS Tunnel APS protection groups: 1k

Supports a maximum of 1k MPLS PW APS protection groups, and a PW


protection group can bind a maximum of 512 members.
NOTE
MPLS PW APS and MPLS Tunnel APS share the protection resources.

LAG

l Supports manual link aggregation and static link aggregation.


l Supports the load sharing mode and load non-sharing mode.
l Complies with IEEE 802.3ad and IEEE 802.1AX.

Issue 03 (2013-02-20)

MCLAG

Supported, which complies with IEEE 802.3ad and IEEE 802.1AX.

Multipl
e
spannin
g tree
protocol
(MSTP)

Not supported

LPT for
packet
services

Point-topoint LPT

Supported

Point-tomultipoint
LPT

Supported

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Funct
ion
and
Featu
re

Description

Clock
synchr
onizati
on

Synchro
nous
Ethernet

Supports eight channels of synchronous Ethernet clock signals (only by


GE optical interfaces).

IEEE
1588v2

Supports eight channels of IEEE 1588v2 clock signals (only by GE


optical interfaces).

Maint
enanc
e
featur
es

ETH
OAM

IEEE
802.1ag

Supports CC, LB, LT, LM and 2DM.

IEEE
802.3ah

Supports OAM auto-discovery, remote loopback, fault


diagnosis, and link performance monitoring.

MPLS
tunnel
OAM

Supports CV, FFD, BDI, FDI, MPLS Tunnel ping, and


MPLS Tunnel traceroute in compliance with ITU-T Y.
1711.
Number of MPLS tunnels that support OAM: 2k

MPLS PW
OAM

Supports CV, FFD, BDI, FDI, PW ping and PW traceroute


in compliance with ITU-T Y.1711.
Number of MPLS PWs that support OAM: 2k

MPLS
OAM

NOTE
MPLS tunnel OAM and MPLS PW OAM share resources.

Issue 03 (2013-02-20)

Loopba
ck
capabili
ty

PHY layer
at Ethernet
ports

Not supported

MAC layer
at Ethernet
ports

Inloops and outloops

RMON
perform
ance

Supported

Inban
d
DCN

Supported

HQoS

Provides the HQoS function. The PEG8 provides the scheduling function at multiple
levels for the flow queue and port queue and the bandwidth restricting function, and
provides the corresponding statistics information.

IGMP
snoopi
ng

Supported

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Funct
ion
and
Featu
re

Description

Query
of
electro
nic
labels

Supported

7 Packet Processing Boards

7.3.4 Working Principle and Signal Flow


The PEG8 consists of the network processing module, transmission management module,
switching network buffering module, CPU management module, clock module, and power
module.
Figure 7-9 shows the functional block diagram of the PEG8.
Figure 7-9 Functional block diagram of the PEG8
Backplane

GE signals

Interface board

IEEE 1588 V2 packet


Interface board
Data processing
module
8xGE signals

Service
signal

Packet forwarding
module
Network processing
module

Upstream
transmission module

Downstream
scheduling module

Transmission
management module

Switching network
buffering module

Parallel management bus

CPU
management
module

Service
signal
PSXCSA

Parallel
management bus

Ethernet communication bus


Inter-board communication bus

GSCC
Other boards

System clock

Working clock
Interface board
Synchronous Ethernet clock
Interface board/Eight GE signals
IEEE 1588 V2 packet
Interface board/Eight GE signals
Modules of the board

Upstream
scheduling module

Downstream
transmission module

Parallel management bus

Modules of the board

Service
signal

Two system clock signals


Clock module

Synchronous Ethernet
clock
IEEE 1588 V2 packet

Power
module

PSXCSA
PSXCSA
PSXCSA
- 48 V / - 60 V
- 48 V / - 60 V

Interface board

Receive Direction
The network processing module receives the signals sent from the GE interface on the front
panel or the interface board, decodes the signals, and converts the serial signals into parallel
signals. Then, the network processing module performs route searching or address matching for
the data packets, and sends the corresponding packets to the transmission management module.
The transmission management module buffers and schedules the packets, slices the packets into
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cells that the switching network requires, and sends the cells to the switching network buffering
module. The switching network buffering module buffers the cells and sends the cells to the
cross-connect unit.

Transmit Direction
The switching network buffering module processes the cells sent by the cross-connect unit and
sends the cells to the transmission management module. The transmission management module
rearranges the cells to form packets, performs buffering and QoS management for the packets,
and sends the packets to the network processing module. The network processing module
converts the parallel signals into serial signals, and sends the signals to the GE interface on the
front panel of the board or the corresponding interface board through the backplane.

Network Processing Module


The network processing module performs route searching, address matching, and other functions
for data packets. The network processing module of the PEG8 can process 5 Gbit/s data packets
in full-duplex mode.

Transmission Management Module


The transmission management module slices packets into cells, and performs QoS management
and large volume buffering for the cells.
l

QoS management: The transmission management module provides the scheduling function
at five levels for the flow queue and port queue, and the bandwidth restricting function,
and provides the corresponding statistics information.

Large volume buffering: The transmission management module supports traffic of 5 Gbit/
s and can buffer data for 17 ms in both the upstream direction and downstream direction.

Switching Network Buffering Module


The switching network buffering module performs cell buffering, queue management,
scheduling, and other functions. This module and the cross-connect unit form a three-level
switching network to switch cells.

CPU Management Module


The CPU management module provides the parallel management bus, Ethernet bus, and other
buses to manage the modules of the PEG8 and the interface board to which the PEG8
corresponds. The CPU management module also monitors alarms and performance events and
reports the alarms and performance events to the SCC unit.

Clock Module
The clock module performs the following functions:
l

Provides the clock signal for each module of the board.

Supports the transparent transmission of the IEEE 1588 V2 packets from the interface board
or the 8xGE signals to the PSXCSA.

Selects a clock source from the two system clocks sent from the PSXCSA and sends the
selected clock to the interface board and the modules of the PEG8.

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Selects a clock source from the synchronous Ethernet clock signals accessed by the interface
board or the 8xGE signals and sends the selected clock to the PSXCSA.

Power Module
The power module converts the accessed DC voltage into the DC voltages that the modules of
the board require.

7.3.5 Front Panel


The front panel of the PEG8 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 7-10 shows the appearance of the front panel of the PEG8.
Figure 7-10 Front panel of the PEG8 with optical interfaces

PEG8
STAT
ACT
PROG
SRV
CLASS 1
LASER
PRODUCT

TX1
RX1
TX2
RX2
TX3
RX3
TX4
RX4
TX5
RX5
TX6
RX6
TX7
RX7
TX8
RX8

PEG8

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Indicators
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the Boards.

Interfaces
The front panel of the PEG8 has eight optical/electrical interfaces. Table 7-47 describes the type
and usage of the interface of the PEG8.
Table 7-47 Interfaces of the PEG8
Interface

Type of Interface

Usage

RX1-RX8

LC/RJ-45 (pluggable)

Receives GE signals.

TX1-TX8

LC/RJ-45 (pluggable)

Transmits GE signals.

7.3.6 Jumpers and DIP Switches


The PEG8 does not have any jumpers or DIP switches that are used for board settings.

7.3.7 Valid Slots


The PEG8 must be installed in a valid slot in the subrack. Otherwise, the PEG8 fails to work
normally.
The PEG8 can be installed in slots 16, and 1316 in the subrack.
l

When the PEG8 is installed in slots 1-3, and 16, the bandwidth is 2.5 Gbit/s.

When the PEG8 is installed in slots 4-6 and 13-15, the bandwidth is 5 Gbit/s.

When the PEG8 works with the interface board PETF8/PEFF8/CQ1/MD12/MD75, one PEG8
can work with a maximum of two PETF8/PEFF8/CQ1/MD12/MD75 boards. In this case, all the
optical interfaces on the PEG8 can be used. Table 7-48 lists the slots valid for the PEG8 and the
corresponding slots for the interface boards.
Table 7-48 Slots valid for the PEG8 and the corresponding slots for the PETF8/PEFF8/CQ1/
MD12/MD75

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Slot Valid for the PEG8

Corresponding Slot for the PETF8/PEFF8/CQ1/


MD12/MD75

Slot 1

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22
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Slot Valid for the PEG8

Corresponding Slot for the PETF8/PEFF8/CQ1/


MD12/MD75

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 6

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

7.3.8 Feature Code


The PEG8 does not have the feature code.

7.3.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
interface board and the cable match the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Optional: Configure the inband DCN. For details, see Configuring the Inband DCN.
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Step 3 Required: Set the Ethernet interface as follows:


l Port enabled/disabled: When you configure services on a port of the Ethernet board, the port
must be set to Enabled.
l Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same fixed working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of traffic,
services may be completely interrupted.
For details, see Parameter Description.
NOTE

For more information about the parameters of the board, see 27.1 Packet Processing Boards.

Step 4 Required: Configure services. The following services can be configured according to actual
requirements:
l Configure the E-line service. For details, see Configuring E-Line Services.
l Configure the E-LAN service. For details, see Configuring E-LAN Services.
l Configure ATM/IMA service. For details, see Configuring ATM Services
Step 5 Optional: Configure the MPLS OAM. For details, see Configuring the MPLS OAM.
Step 6 Optional: Configure the MPLS tunnel protection group. For details, see Configuring MPLS
Tunnel APS on a Per-NE Basis.
Step 7 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Configuring an Ethernet LAG.
Step 8 Optional: Configure the QoS. For details, see Configuring the HQoS.
Step 9 Optional: Configure the IEEE 1588 V2 time and clock. For details, see Configuring the IEEE
1588v2 Time Synchronization and Clock Synchronization.
Step 10 Optional: Configure the IGMP Snooping. For details, see Configuring the IGMP Snooping.
----End

Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
Step 2 Required: Test the ATM/IMA service. For details, see Testing ATM Services.
----End

Checking the Operation of the Board


Step 1 Required: Check Ethernet services.
l Check the E-line service. For details, see Verifying the Correctness of E-Line Service
Configuration.
l Check the E-LAN service. For details, see Verifying the Correctness of E-LAN Service
Configuration.
Step 2 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
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normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 3 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

7.3.10 Configuring the Board Functions


The PEG8 supports the packet switching function and provides multiple packet-specific
functions and features, such as HQoS, LAG, and ETH OAM. Configure the functions according
to actual requirements.
You can configure the following packet functions for the PEG8 by using the U2000:
l

HQoS

LAG

ETH OAM

MPLS Tunnel APS

MPLS OAM

IGMP Snooping

Inband DCN

LPT

MPLS PW APS

MC-LAG

MS-PW

7.3.11 Parameter Settings


You can set the parameters for the PEG8 by using the U2000.
You can set the following parameters for the PEG8 by using the U2000:
l

Ethernet interface

For information about more parameters and the description of each parameter, see 27.1 Packet
Processing Boards.

7.3.12 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also provides
the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 7-49 lists the faults that occur on the PEG8 frequently and the troubleshooting methods.
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Table 7-49 Methods used to troubleshoot the faults that occur on the PEG8 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service
troubleshooting

l The service is
interrupted.

See Troubleshooting Packet Service


Interruptions.

l The service loses


packets or has
errored packets.
Protection switching
fault

l The tunnel APS


switching fails.

See Failure of Packet Service Protection


Switching.

l The PW APS
switching fails.
l The MC-LAG
switching fails.

Replacing the Optical/Electrical Module


The OptiX OSN equipment supports pluggable optical/electrical modules. If an optical/electrical
module is faulty, replace only the faulty optical/electrical module instead of the associated board.
For information on how to replace an optical/electrical module, see Replacing a Pluggable
Optical/Electrical Module.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PEG8, see Replacing a Packet Processing Board.

7.3.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the NMS.

7.3.13.1 Alarms of N1PEG8

Issue 03 (2013-02-20)

TEMP_OVER

COMMUN_FAIL

TR_LOC

BUS_ERR

NO_BD_SOFT

TEST_STATUS

HARD_BAD

HARD_ERR

POWER_ABNORMAL

BD_STATUS

PW_NO_TRAFFIC

WRG_BD_TYPE

LSR_NO_FITED

LASER_MOD_ERR

LASER_SHUT

ALM_ALS

LSR_WILL_DIE

IN_PWR_ABN

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OUT_PWR_ABN

TEM_HA

TEM_LA

LSR_BCM_ALM

FLOW_OVER

LOOP_ALM

ETH_LOS

ETH_LINK_DOWN

MPLS_TUNNEL_LOCV

MAC_FCS_EXC

FDBSIZEALM_ELAN

MPLS_TUNNEL_MISMERGE

MPLS_TUNNEL_Excess

MPLS_TUNNEL_MISMATCH

MPLS_TUNNEL_FDI

MPLS_TUNNEL_UNKNOWN

MPLS_TUNNEL_BDI

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

ETH_CFM_UNEXPERI

PW_EXC_TRAFFIC

ETH_CFM_MISMERGE

ETH_EFM_DF

ETH_CFM_LOC

ETH_CFM_RDI

ETH_EFM_LOOPBACK

ETH_EFM_REMFAULT

ETH_EFM_EVENT

ETH_APS_SWITCH_FAIL

ETH_APS_TYPE_MISMATCH

ETH_APS_PATH_MISMATCH

LAG_DOWN

ETH_APS_LOST

LAG_MEMBER_DOWN

MPLS_PW_MISMATCH

MPLS_PW_LOCV

MPLS_PW_Excess

MPLS_PW_BDI

MPLS_PW_MISMERGE

MPLS_PW_UNKNOWN

MPLS_PW_SD

MCLAG_CFG_MISMATCH

MPLS_PW_SF

MCSP_PATH_LOCV

LPT_CFG_CLOSEPORT

IN_PWR_HIGH

IN_PWR_LOW

PWAPS_TYPE_MISMATCH

PWAPS_PATH_MISMATCH

PWAPS_SWITCH_FAIL

PWAPS_LOST

ETHOAM_SELF_LOOP

TUNNEL_APS_DEGRADED

BWUTILIZATION_OVER

MPLS_PW_OAMFAIL

DROPRATIO_OVER

ETH_NO_FLOW

MPLS_TUNNEL_OAMFAIL

PORT_EXC_TRAFFIC

SRV_SHUTDOWN_LD

7.3.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the NMS.

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7.3.14.1 Performance Events of N1PEG8


Table 7-50 SDH
CPUUSAGEMAX

CPUUSAGEMIN

CPUUSAGECUR

MEMUSAGEMAX

MEMUSAGEMIN

MEMUSAGECUR

BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

Table 7-51 ETH-OAM 802.1ag


ETH_CFM_LS

ETH_CFM_SLS

ETH_CFM_CSLS

ETH_CFM_UAS

ETH_CFM_FLR

ETH_CFM_FL

ETH_CFM_FD

ETH_CFM_FDV

Table 7-52 MPLS Tunnel OAM


MPLS_TUNNEL_LS

MPLS_TUNNEL_SLS

MPLS_TUNNEL_CSLS

MPLS_TUNNEL_UAS

MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

Table 7-53 Tunnel

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TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TNL_BW_UTILISATION

TUNNEL_REVERSE_SND
PKTS

TUNNEL_REVERSE_SND
BYTES

TUNNEL_REVERSE_RC
VPKTS

TUNNEL_REVERSE_RCV
BYTES

TNL_REVERSE_BW_UTILISATION

TUNNEL_REVERSE_RX_
BPS

TUNNEL_REVERSE_RX_
PPS

TUNNEL_REVERSE_TX_
BPS

TUNNEL_REVERSE_TX_
PPS

TUNNEL_RX_BPS

TUNNEL_RX_PPS

TUNNEL_TX_BPS

TUNNEL_TX_PPS

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Table 7-54 MPLS PW OAM


MPLS_PW_LS

MPLS_PW_SLS

MPLS_PW_CSLS

MPLS_PW_UAS

MPLS_PW_FLR

MPLS_PW_FL

MPLS_PW_FD

MPLS_PW_FDV

Table 7-55 PW
PW_RCVPKTS

PW_RCVBYTES

PW_SNDPKTS

PW_SNDBYTES

PW_BANDWIDTH_UTILISATION

PW_AVAILABILITY

PW_RX_BPS

PW_RX_PPS

PW_TX_BPS

PW_TX_PPS

Table 7-56 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES

VUNI_TX_UTILIZATION

VUNI_SND_DROPPKTS

VUNI_SND_DROPBYTES

VUNI_SND_DROPRATIO

Table 7-57 Statistics of RMON basic performance


RXOCTETS

RXPKTS

RXBRDCAST

RXMULCAST

ETHUNDER

ETHOVER

ETHFRG

ETHJAB

RXPKT64

RXPKT65

RXPKT128

RXPKT256

RXPKT512

RXPKT1024

Table 7-58 Statistics of RMON extended performance

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RXPKT1519

TXPKT64

TXPKT65

TXPKT128

TXPKT256

TXPKT512

TXPKT1024

TXPKT1519

PKT64

PKT65

PKT128

PKT256

PKT512

PKT1024

PKT1519

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TXMULCAST

TXBRDCAST

RXPAUSE

ETHALI

ETHFCS

ETHUTILIZ

RXCTLPKTS

TXPKTS

TXOCTETS

PORT_RX_BYTES_AVAILABILITY

RXBPS

TXBPS

RXPPS

TXPPS

Table 7-59 QoS


FLOW_RX_UTILIZATION

QOS_CARGRNBYTES

QOS_CARGRNPKTS

QOS_CARREDBYTES

QOS_CARREDPKTS

QOS_CARREDRATIO

QOS_CARYLWBYTES

QOS_CARYLWPKTS

QOS_STRM_MATCHBYTES

QOS_STRM_MATCHPKT
S

TNL_REVERSE_SNDDRO
PBYTES

TNL_REVERSE_SNDDRO
PPKTS

TNL_REVERSE_SNDDRO
PRATIO

TNL_SNDDROPBYTES

TNL_SNDDROPPKTS

TNL_SNDDROPRATIO

7.3.15 Technical Specifications


The technical specifications of the PEG8 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 7-60 lists the parameters specified for the optical interfaces of the PEG8.
Table 7-60 Parameters specified for the optical interfaces of the PEG8

Issue 03 (2013-02-20)

Parameter

Value

Type of
interface

1000BASE-SX

1000BASE-LX

1000BASEVX

1000BASE-ZX

Transmission
distance (km)

0.5

10

40

80

Type of fiber

Multi-mode LC

Single-mode LC

Single-mode
LC

Single-mode LC

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Parameter

Value

Launched
optical power
range (dBm)

-9.5 to -2.5

-9 to -3

-5 to 0

-2 to 5

Operating
wavelength
range (nm)

770 to 860

1270 to 1355

1270 to 1355

1500 to 1580

Minimum
overload
(dBm)

-3

-3

-3

Receiver
sensitivity
(dBm)

-17

-20

-23

-23

Minimum
extinction ratio
(dB)

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

Table 7-61 and Table 7-62 lists the parameters specified for the GE colored optical interfaces
of the PEG8.
Table 7-61 CWDM parameters specified for the colored optical interfaces of the PEG8
Parameter

Value
CWDM

Issue 03 (2013-02-20)

Nominal bit rate

1250000 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

40

80

Launched optical power range


(dBm)

0 to 5

0 to 5

Operating wavelength range


(nm)

1471 to 1611, in steps of


20

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

-19

-28

Minimum overload (dBm)

-3

-9

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Parameter

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Value
CWDM

Maximum allowed dispersion


(ps/nm)

800

1600

Minimum extinction ratio (dB)

8.2

8.2

Maximum -20 dB spectral


width (nm)

Minimum side mode


suppression ratio (dB)

30

30

Table 7-62 DWDM parameters specified for the colored optical interfaces of the PEG8
Parameter

Value
DWDM

Nominal bit rate

1250000 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

120

Launched optical power range


(dBm)

-1 to 3

Central frequency (THz)

192.1 to 196.0

Central frequency deviation


(GHz)

10

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

2400

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral width


(nm)

0.3

Minimum side mode


suppression ratio (dB)

30

Parameters Specified for Electrical Interfaces


Table 7-63 lists the parameters specified for the electrical interfaces of the PEG8.

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Table 7-63 Parameters specified for the electrical interfaces of the PEG8
Parameter

Value

Nominal bit rate

1000 Mbit/s

Code pattern

4D-PAM5

Type of interface

RJ-45

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the PEG8 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.2

Power Consumption
The maximum power consumption of the PEG8 at room temperature (25C) is 47 W.

7.4 PEG16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEG16 (16xGE Ethernet processing board). This topic also
describes how to configure and commission the PEG16.

7.4.1 Version Description


The PEG16 is available in one functional version, namely, N1.

7.4.2 Application
The PEG16 is mainly used in the packet data transmission field to transmit/receive data packets,
manage bandwidths, and realize switching and aggregation of data packets.
Figure 7-11 shows the typical networking and application when the PEG16 works with the other
boards on the network. The PEG16 works with the cross-connect board that provides the packet
switching function to meet the requirement of packet features. With this board, the TDM domain
can be overlapped with the packet domain on the OptiX OSN equipment to transmit data in the
two domains. In this way, the equipment realizes the smooth evolution from the MSTP network
to the packet switching network.
For the typical networking and application when the PEG16 works with the PETF8, see 8.1.2
Application.
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Figure 7-11 Networking and application of the PEG16


OptiX OSN 3500/
7500
NMS

OptiX OSN 3500/


7500

OptiX OSN 3500/


7500
PSN
10GE ring

OptiX OSN 1500

OptiX OSN 1500


PSN
GE ring

OptiX OSN 1500

PSN
GE ring
OptiX OSN
3500/7500
OptiX OSN 1500

Traffic direction
FE interface board/FE processing board

GE convergence board

GE processing board

10GE processing board

Dual-domain (TDM domain and packet


domain) cross-connect board
PSN: packet switched network

7.4.3 Functions and Features


The PEG16 receives/transmits and forwards 16xGE services, and supports the QoS functions
such as traffic measurement, congestion control, and queue scheduling for data packets.
Table 7-64
Table 7-64 Functions and features of the PEG16
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits and processes 16xGE services.

Interfa
ce
types

l Supports the 1000BASE-SX, 1000BASE-LX, 1000BASE-VX, and 1000BASEZX optical interfaces. The optical interface uses the LC connector and supports
the transmission distances of 0.5 km, 10 km, 40 km, and 80 km.
l Supports the CWDM colored optical interfaces. The optical interface uses the
LC connector and supports the transmission distance of 40 km.

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Funct
ion
and
Featu
re

Description

Functi
ons
when
being
used
with
an
interfa
ce
board

Provides interfaces on its front panel or works with the interface board PETF8. One
PEG16 board can receive/transmit the FE services of a maximum of two interface
boards.

Interfa
ce
charac
teristic
s

Hot
optical
module
swappin
g

Supports hot swapping of SFP optical modules.

Workin
g modes

Full-duplex and auto-negotiation for GE interfaces

Flow
control
at ports

Autonegotiation
mode

Not supported

Nonautonegotia
tion mode

Not supported

Servic
e
specifi

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7 Packet Processing Boards

Query/
Setting
of port
status

Supported

Query
of
interfac
e types

Supported

Setting
of
optical
power
threshol
ds

Supported

Processi
ng
capabili
ty

Processes 10 Gbit/s services in full-duplex mode.

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Funct
ion
and
Featu
re

Description

cation
s

Service
bearing
modes

MPLS

Supported

QinQ

Supported

Port

Supported

Maximum
number of
PWs

16k

MS-PW

Supports static switching of MS-PWs.

Tunnel
specific
ations

Unidirectio
nal

Number of unidirectional MPLS tunnels (with the tunnels


shared): 4k

Bidirection
al

Number of bidirectional MPLS tunnels (with the tunnels


shared): 2k

MTU

MTU for
ports

Supports the setting of the packet length, which ranges


from 960 bytes to 9600 bytes. After the setting becomes
valid, the length of the packets that enter or exit the ports
is restricted by the pre-set MTU.

MTU for
services

Supports the setting of the packet length, which ranges


from 64 bytes to 9000 bytes.

E-Line
service

Number of supported E-Line services:

PW
specific
ations

Ethernet
service
capabili
ty

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7 Packet Processing Boards

l When working with the N4GSCC: 4k


l When working with the N6GSCC: 8k

E-LAN
service

Number of supported E-LAN services: 1020.

E-AGGR
service

4, each of which supports 127 leaf ports

Formats of
Ethernet
data frames

Supports the encapsulation in IEEE 802.3 format, Ethernet


II format, or IEEE 802.1q/p format.

Maximum
number of
QinQ links

1k

Maximum
number of
VLANs

4k

Jumbo
frame

Supports the Jumbo frame with a length not more than


9000 bytes.

Number of static MAC addresses in E-LAN services: 2k.

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Funct
ion
and
Featu
re

Description

Protec
tion
schem
es

MPLS
Tunnel
APS

Supports the 1+1 (single-ended/dual-ended) and 1:1 (dual-ended) MPLS


Tunnel APS.

MPLS
PW
APS

Not supported

LAG

l Supports manual link aggregation and static link aggregation.

Number of supported MPLS Tunnel APS protection groups:1k

l Supports the load sharing mode and load non-sharing mode.


l Complies with IEEE 802.3ad and IEEE 802.1AX.
MCLAG

Not supported

Multipl
e
spannin
g tree
protocol
(MSTP)

Not supported

LPT for
packet
services

Point-topoint LPT

Supported

Point-tomultipoint
LPT

Supported

Clock
synchr
onizati
on

Synchro
nous
Ethernet

Provides two GE optical interfaces (that is, the first two optical
interfaces) that support the synchronous Ethernet clock feature.

IEEE
1588v2

Not supported

Maint
enanc
e
featur
es

ETH
OAM

IEEE
802.1ag

Supports CC, LB, LT, LM and 2DM.

IEEE
802.3ah

Supports OAM auto-discovery, remote loopback, fault


diagnosis, and link performance monitoring.

MPLS
tunnel
OAM

Supports CV, FFD, BDI, FDI, MPLS Tunnel ping, and


MPLS Tunnel traceroute in compliance with ITU-T Y.
1711.

MPLS
OAM

Number of MPLS tunnels that support OAM: 2k


MPLS PW
OAM

Issue 03 (2013-02-20)

Not supported

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Funct
ion
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Featu
re

7 Packet Processing Boards

Description

Loopba
ck
capabili
ty

PHY layer
at Ethernet
ports

Inloops and outloops

MAC layer
at Ethernet
ports

Inloops

RMON
perform
ance

Supported

Inban
d
DCN

Supported

HQoS

Provides the hierarchical QoS function. The board provides the scheduling function
at multiple levels including the flow queue and port queue, the bandwidth restricting
function, and the corresponding statistical information.

IGMP
snoopi
ng

Supported

Query
of
electro
nic
labels

Supported

7.4.4 Working Principle and Signal Flow


The PEG16 consists of the network processing module, transmission management module,
switching network buffering module, CPU management module, clock module, and power
module.
Figure 7-12 shows the functional block diagram of the PEG16.

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Figure 7-12 Functional block diagram of the PEG16


Backplane

GE signals

Interface board

IEEE 1588 V2 packet


Interface board
Data processing
module
16xGE signals

Upstream
Service
signal transmission module

Service
signal

Upstream
scheduling module

Packet forwarding
module

Downstream
transmission module

Downstream
scheduling module

Network processing
module

Transmission
management module

Switching network
buffering module

Parallel management bus

Parallel management bus

Service
signal

Parallel
management bus

Ethernet communication bus


CPU management

module
Modules of the board

Modules of the board

Inter-board communication bus

GSCC
Other boards

System clock

Working clock
Interface board
Synchronous Ethernet clock
Interface board/First two GE signals
IEEE 1588 V2 packet
Interface board/First two GE signals

PSXCSA

Two system clock signals


Clock module

Synchronous Ethernet
clock
IEEE 1588 V2 packet

Power
module

PSXCSA
PSXCSA
PSXCSA
- 48 V / - 60 V
- 48 V / - 60 V

Interface board

Receive Direction
The network processing module receives the signals sent from the GE interface on the front
panel or the interface board, decodes the signals, and converts the serial signals into parallel
signals. Then, the network processing module performs route searching or address matching for
the data packets, and sends the corresponding packets to the transmission management module.
The transmission management module buffers and grooms the packets, slices the packets into
cells that the switching network requires, and sends the cells to the switching network buffering
module. The switching network buffering module buffers the cells and sends the cells to the
cross-connect unit.

Transmit Direction
The switching network buffering module processes the cells sent by the cross-connect unit and
sends the cells to the transmission management module. The transmission management module
rearranges the cells to form packets, performs buffering and QoS management for the packets,
and sends the packets to the network processing module. The network processing module
converts the parallel signals into serial signals, and sends the signals to the GE interface on the
front panel of the PEG16 or the corresponding interface board through the backplane.

Network Processing Module


The network processing module performs route searching, address matching, and other functions
for data packets. The network processing module of the PEG16 can process the 10 Gbit/s data
packets in full-duplex mode.

Transmission Management Module


The transmission management module slices packets into cells, and performs QoS management
and large volume buffering for the cells.
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QoS management: The transmission management module provides the scheduling function
at five levels including the flow queue and port queue, the bandwidth restricting function,
and the corresponding statistical information.

Large volume buffering: The transmission management module supports traffic of 10 Gbit/
s and can buffer data for 17 ms in both the upstream direction and downstream direction.

Switching Network Buffering Module


The switching network buffering module performs cell buffering, queue management,
scheduling, and other functions. This module and the cross-connect unit form a three-level
switching network to switch cells.

CPU Management Module


The CPU management module provides the parallel management bus, Ethernet bus, and other
buses to manage the modules of the PEG16 and the interface board to which the PEG16
corresponds. The CPU management module also monitors alarms and performance events and
reports the alarms and performance events to the SCC unit.

Clock Module
The clock module performs the following functions:
l

Provides the clock signal for each module of the PEG16.

Supports the transparent transmission of the IEEE 1588 V2 packets from the interface board
or the first two channels of GE signals to the PSXCS.

Selects a clock source from the two system clocks sent from the PSXCS and sends the
selected clock to the interface board and the modules of the PEG16.

Selects a clock source from the synchronous Ethernet clock signals accessed by the interface
board or the first two channels of GE signals and sends the selected clock to the PSXCS.

Power Module
The power module converts the accessed DC voltage into the DC voltages that the modules of
the PEG16 require.

7.4.5 Front Panel


The front panel of the PEG16 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 7-13 shows the appearance of the front panel of the PEG16.

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Figure 7-13 Front panel of the PEG16

PEG16
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT9
OUT1
IN9 OUT10 IN10 OUT11 IN11 OUT12 IN12
IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4
OUT1
OUT13 IN13 OUT14 IN14
IN15 OUT16 IN16
5
OUT5 IN5
OUT6 IN6 OUT7 IN7 OUT8 IN8

PEG16

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the Boards.

Interfaces
The front panel of the PEG16 has sixteen GE optical interfaces. Table 7-65 describes the types
and usage of the optical interfaces of the PEG16.
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Table 7-65 Optical interfaces of the PEG16


Interface

Type of Interface

Usage

IN1IN16

LC (pluggable)

Receives GE signals.

OUT1
OUT16

LC (pluggable)

Transmits GE signals.

7.4.6 Jumpers and DIP Switches


The PEG16 does not have any jumpers or DIP switches that are used for board settings.

7.4.7 Valid Slots


The PEG16 occupies two slots and can be installed in any two adjacent slots among slots 16
and 1316. The PEG16 slot displayed on the U2000 is the slot that has a smaller slot number
between the two slots that house the PEG16. For example, if the PEG16 is installed in slots 1
and 2, the PEG16 slot displayed on the U2000 is slot 1.
When the PEG16 works with the interface board PETF8, one PEG16 board can work with a
maximum of two PETF8 boards. In this case, all the optical interfaces on the PEG16 can be
used. Table 7-66 lists the slots valid for the PEG16 and the corresponding slots for the PETF8.
Table 7-66 Slots valid for the PEG16 and the corresponding slots for the PETF8
Slot Valid for the
PEG16

Corresponding Logical Slot

Corresponding Slot for the


PETF8

Slots 1 and 2

Slot 1

Slots 3 and 4

Slot 3

Slots 21 and 22

Slots 5 and 6

Slot 5

Slots 25 and 26

Slots 13 and 14

Slot 13

Slots 29 and 30

Slots 15 and 16

Slot 15

Slots 33 and 34

NOTE

l The dual-slot board PEG16 cannot be configured together with the single-slot board N2PEX1/
N1PEX2/N1PEG8.
l When working with the cross-connect board SSN1PSXCS and the EDQ41 board, the dual-slot board
PEG16 cannot be housed in slot 1 or slot 15.

7.4.8 Feature Code


The PEG16 does not have the feature code.

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7.4.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
interface board and the cable match the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Optional: Configure the inband DCN. For details, see Configuring the Inband DCN.
Step 3 Required: Set the Ethernet interface as follows:
l Port enabled/disabled: When you configure services on a port of the Ethernet board, the port
must be set to Enabled.
l Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same fixed working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of traffic,
services may be completely interrupted.
For details, see Parameter Description.
NOTE

For more information about the parameters of the board, see 27.1 Packet Processing Boards.

Step 4 Required: Configure services. The following Ethernet services can be configured according to
actual requirements:
l Configure the E-line service. For details, see Configuring E-Line Services.
l Configure the E-LAN service. For details, see Configuring E-LAN Services.
l Configure the E-AGGR service. For details, see Configuring E-AGGR Services.
Step 5 Optional: Configure the MPLS OAM. For details, see Configuring the MPLS OAM.
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Step 6 Optional: Configure the MPLS tunnel protection group. For details, see Configuring MPLS
Tunnel APS on a Per-NE Basis.
Step 7 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Configuring an Ethernet LAG.
Step 8 Optional: Configure the QoS. For details, see Configuring the HQoS.
Step 9 Optional: Configure the IEEE 1588 V2 time and clock. For details, see Configuring the IEEE
1588v2 Time Synchronization and Clock Synchronization.
Step 10 Optional: Configure the IGMP Snooping. For details, see Configuring the IGMP Snooping.
----End

Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check Ethernet services.
l Check the E-line service. For details, see Verifying the Correctness of E-Line Service
Configuration.
l Check the E-LAN service. For details, see Verifying the Correctness of E-LAN Service
Configuration.
l Check the E-AGGR service. For details, see Verifying the Correctness of E-AGGR Service
Configuration.
Step 2 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 3 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

7.4.10 Configuring the Board Functions


The PEG16 supports the packet switching function and provides multiple packet switchingspecific functions and features, such as HQoS, LAG, and ETH OAM. Configure the functions
according to actual requirements.
You can configure the following packet switching functions for the PEG16 by using the
U2000:
l

HQoS

LAG

ETH OAM

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MPLS Tunnel APS

MPLS OAM

IGMP Snooping

Inband DCN

LPT

MS-PW

7 Packet Processing Boards

7.4.11 Parameter Settings


You can set parameters for the PEG16 by using the U2000.

Displayed Slots
The PEG16 occupies two slots in the subrack. The logical slot of the PEG16 displayed on the
U2000 is the slot that has a smaller slot number between the two slots that house the PEG16.
For the logical slots of the PEG16 displayed on the U2000, refer to Table 7-66.

Board Parameters
You can set the following principal parameter for the PEG16 by using the U2000:
l

Ethernet interface

For more parameters and the description of the parameters, see 27.1 Packet Processing
Boards.

7.4.12 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also provides
the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 7-67 lists the faults that occur on the PEG16 frequently and the troubleshooting methods.
Table 7-67 Methods used to troubleshoot the faults that occur on the PEG16 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service
troubleshooting

l The service is
interrupted.

See Troubleshooting Packet Service


Interruptions.

l The service loses


packets or has
errored packets.
Protection switching
fault

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The MPLS APS


switching fails.

See Troubleshooting.

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Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PEG16, see Replacing a Packet Processing Board.

7.4.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

7.4.13.1 Alarms of N1PEG16

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ALM_ALS

BD_STATUS

ETH_APS_LOST

BUS_ERR

COMMUN_FAIL

ETH_APS_TYPE_MISMATCH

ETH_APS_PATH_MISMATCH

ETH_APS_SWITCH_FAIL

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_LOC

ETH_EFM_DF

ETH_EFM_EVENT

ETH_CFM_UNEXPERI

ETH_EFM_REMFAULT

ETH_LINK_DOWN

ETH_EFM_LOOPBACK

FDBSIZEALM_ELAN

FLOW_OVER

ETH_LOS

HARD_BAD

HARD_ERR

IN_PWR_ABN

LAG_DOWN

LAG_MEMBER_DOWN

LASER_MOD_ERR

LASER_SHUT

LOOP_ALM

LSR_BCM_ALM

LSR_NO_FITED

LSR_WILL_DIE

MAC_FCS_EXC

MPLS_TUNNEL_BDI

MPLS_TUNNEL_Excess

MPLS_TUNNEL_FDI

MPLS_TUNNEL_LOCV

MPLS_TUNNEL_MISMATCH

MPLS_TUNNEL_MISMERGE

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

MPLS_TUNNEL_UNKNOWN

NO_BD_SOFT

POWER_ABNORMAL

TEMP_OVER

PW_EXC_TRAFFIC

OUT_PWR_ABN

TEST_STATUS

TEM_HA

TEM_LA

PW_NO_TRAFFIC

W_OFFLINE

TR_LOC

IN_PWR_LOW

LPT_CFG_CLOSEPORT

WRG_BD_TYPE

IN_PWR_HIGH

ETHOAM_SELF_LOOP

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TUNNEL_APS_DEGRADED

7.4.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

7.4.14.1 Performance Events of N1PEG16


Table 7-68 SDH
BDTEMPCUR

BDTEMPMAX

BDTEMPMIN

CPUUSAGECUR

CPUUSAGEMAX

CPUUSAGEMIN

MEMUSAGECUR

MEMUSAGEMAX

MEMUSAGEMIN

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

Table 7-69 ETH-OAM 802.1ag


ETH_CFM_FLR

ETH_CFM_FL

ETH_CFM_FD

ETH_CFM_FDV

ETH_CFM_LS

ETH_CFM_SLS

ETH_CFM_UAS

ETH_CFM_CSLS

Table 7-70 MPLS Tunnel OAM


MPLS_TUNNEL_LS

MPLS_TUNNEL_SLS

MPLS_TUNNEL_UAS

MPLS_TUNNEL_CSLS

MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

Table 7-71 Tunnel


TUNNEL_SNDPKTS
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TUNNEL_SNDBYTES

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TUNNEL_RCVBYTES

TUNNEL_RX_BPS

TUNNEL_TX_BPS

TUNNEL_RX_PPS

TUNNEL_TX_PPS

TUNNEL_REVERSE_RX_B
PS

TUNNEL_REVERSE_TX_
BPS

TUNNEL_REVERSE_RX
_PPS

TUNNEL_REVERSE_TX_P
PS

Table 7-72 PW
PW_SNDPKTS

PW_SNDBYTES

PW_DROPPKTS

PW_DROPBYTES

PW_RCVPKTS

PW_RCVBYTES

PW_BANDWIDTH_UTILISATION

PW_AVAILABILITY

PW_RX_BPS

PW_TX_BPS

PW_RX_PPS

PW_TX_PPS

Table 7-73 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES

Table 7-74 QoS


QOS_PRI_DROPPKTS

QOS_PRI_DROPBYTES

Table 7-75 Statistics of RMON basic performance


ETHDROP

RXOCTETS

RXPKTS

RXBRDCAST

RXMULCAST

ETHCRCALI

ETHUNDER

ETHOVER

ETHFRG

ETHJAB

ETHCOL

RXPKT64

RXPKT65

RXPKT128

RXPKT256

RXPKT512

RXPKT1024

Table 7-76 Statistics of RMON extended performance


RXCTLPKTS
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TXCTLPKTS

TXBRDCAST

TXMULCAST

TXPKT64

TXPKT65

TXPKT128

TXPKT256

TXPKT512

TXPKT1024

Table 7-77 Statistics of specific performance events of RMON


TXPAUSE

ETHALI

ETHFCS

PKT64

PKT65

PKT128

PKT256

PKT512

PKT1024

TXETHDROP

7.4.15 Technical Specifications


The technical specifications of the PEG16 include the Ethernet performance specifications, laser
safety class, parameters specified for optical interfaces, mechanical specifications, and power
consumption.

Parameters Specified for Optical Interfaces


Table 7-78 lists the parameters specified for the optical interfaces of the PEG16.
Table 7-78 Parameters specified for the optical interfaces of the PEG16

Issue 03 (2013-02-20)

Parameter

Value

Type of
interface

1000BASE-SX

1000BASE-LX

1000BASEVX

1000BASE-ZX

Transmission
distance (km)

0.5

10

40

80

Type of fiber

Multi-mode LC

Single-mode LC

Single-mode
LC

Single-mode LC

Launched
optical power
range (dBm)

-9.5 to -2.5

-9 to -3

-5 to 0

-2 to 5

Operating
wavelength
range (nm)

770 to 860

1270 to 1355

1270 to 1355

1500 to 1580

Minimum
overload
(dBm)

-3

-3

-3

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Parameter

Value

Receiver
sensitivity
(dBm)

-17

-20

-23

-23

Minimum
extinction ratio
(dB)

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

Table 7-79 lists the parameters specified for the colored optical interfaces of the PEG16.
Table 7-79 Parameters specified for the colored optical interfaces of the PEG16
Parameter

Value
CWDM

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Nominal bit rate

1250000 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

40

Launched optical power range


(dBm)

0 to 5

Operating wavelength range


(nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

-19

Minimum overload (dBm)

-3

Maximum allowed dispersion


(ps/nm)

800

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral width


(nm)

Minimum side mode


suppression ratio (dB)

30

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Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the PEG16 are as follows:
l

Dimensions (mm): 50.8 (W) x 220 (D) x 254.1 (H)

Weight (kg): 2.3

Power Consumption
The maximum power consumption of the PEG16 at room temperature (25C) is 137 W.

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Packet Interface Boards

About This Chapter


The packet interface boards include the PETF8, PEFF8, CQ1, MD12, and MD75. They provide
packet switching boards with cable input/output interfaces for myriad signals.
8.1 PETF8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PETF8 (8xFE electrical interface board). This topic also describes
how to configure and commission the PETF8.
8.2 PEFF8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEFF8 (8-port fast Ethernet optical interface processing board).
This topic also describes how to configure and commission the PEFF8.
8.3 CQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the CQ1 (4-channel channelized STM-1 CES optical interface board).
8.4 MD12
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the MD12 (multi-protocol 32-channels E1 interface processing
board). This topic also describes how to configure and commission the MD12.
8.5 MD75
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the MD75 (multi-protocol 32-channels E1 interface processing
board). This topic also describes how to configure and commission the MD75.

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8.1 PETF8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PETF8 (8xFE electrical interface board). This topic also describes
how to configure and commission the PETF8.

8.1.1 Version Description


The PETF8 is available in one functional version, namely, N1.

8.1.2 Application
The PETF8 is mainly used in the packet data transmission field to transmit/receive data packets,
manage bandwidths, and realize switching of data packets.
Figure 8-1 shows the typical networking and application of the PETF8. The PETF8 works with
the cross-connect board that provides the packet switching function to meet the requirement of
packet features. With this board, the TDM domain can be overlapped with the packet domain
on the OptiX OSN equipment to transmit data in the two domains. In this way, the equipment
realizes the smooth evolution from the MSTP network to the packet switching network.
Figure 8-1 Networking and application of the PETF8

NMS

NE1

User A2
NE2

PSN

NE4

NE3

User B2
Traffic direction

User B1

PEG8/PEG16
PETF8
Dual-domain (TDM domain
and packet domain) cross- User A1
connect board
PSN: packet switched network

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8.1.3 Functions and Features


The PETF8 receives/transmits 8xFE electrical signals and works with the PEG8/PEG16 to
process services.
Table 8-1 provides the functions and features of the PETF8. When the PETF8 works with the
PEG8, 7.3.3 Functions and Features describes the functions and features of the PETF8; when
the PETF8 works with the PEG16, 8.1.3 Functions and Features describes the functions and
features of the PETF8.
Table 8-1 Functions and features of the PETF8

Issue 03 (2013-02-20)

Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits and processes 8xFE electrical signals.

Interfa
ce
types

Uses the RJ45 connector and meets the specifications of the 100BASE-TX physical
layer provided in IEEE 802.3.

Interfa
ce
charac
teristic
s

Hot
optical
module
swappin
g

Not supported

Workin
g modes

Supports the configuration of the full-duplex mode or auto-negotiation


mode for the FE electrical port (in auto-negotiation mode, only the 100
Mbit/s full-duplex working mode is supported).

Flow
control
at ports

Autonegotiation
mode

Not supported

Nonautonegotia
tion mode

Not supported

Query/
Setting
of port
status

Supported

Query
of
interfac
e types

Not supported

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Funct
ion
and
Featu
re

Servic
e
specifi
cation
s

8 Packet Interface Boards

Description

Setting
of
optical
power
threshol
ds

Not supported

Service
bearing
modes

MPLS

Supported

QinQ

Supported

Port

Supported

MTU for
ports

When working with the PEG16, the PETF8 does not


support the setting of the packet length, which takes the
default value of 9600 bytes. When working with the
PEG8, the PETF8 supports the setting of the packet length,
which ranges from 960 bytes to 1976 bytes. After the
setting becomes valid, the length of a packet that enters or
exits a port is restricted by the MTU pre-set for the port.

MTU for
services

For packet services carried by PWs, the PETF8 supports


the setting of the packet length, which ranges from 64
bytes to 9000 bytes; for packet services carried in other
modes, the PETF8 does not support the setting of the
packet length.

E-Line
service

Supported

E-LAN
service

Supported

E-AGGR
service

Not supported

Formats of
Ethernet
data frames

Supports the encapsulation in IEEE 802.3 format, Ethernet


II format, or IEEE 802.1q/p format.

Jumbo
frame

When working with PEG8 boards, PETF8 boards support


a jumbo frame with a maximum length of 1976 bytes.

MTU

Ethernet
service
capabili
ty

When working with PEG16 boards, PETF8 boards


support a jumbo frame with a maximum length of 9000
bytes.
MS-PW

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Supports static MS-PWs.

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Funct
ion
and
Featu
re

Description

Protec
tion
schem
es

MPLS
Tunnel
APS

Supports the 1+1 (single-ended/dual-ended) and 1:1 (dual-ended) MPLS


Tunnel APS.

MPLS
PW
APS

Supports the PW FPS (single-ended), 1+1 (single-ended/dual-ended) and


1:1 (dual-ended) MPLS PW APS when working with the PEG8.

LAG

l Supports manual link aggregation and static link aggregation.

Does not support MPLS PW APS when working with the PEG16.

l Supports the load sharing mode and load non-sharing mode.


l Complies with IEEE 802.3ad and IEEE 802.1AX.
MCLAG

Supports MC-LAG when working with the PEG8 in compliance with


802.3ad and IEEE 802.1AX.
Does not support MC-LAG when working with the PEG16.

Issue 03 (2013-02-20)

LPT for
packet
services

Point-topoint LPT

Supported

Point-tomultipoint
LPT

Supported

Clock
synchr
onizati
on

Synchro
nous
Ethernet

Supports eight channels of synchronous Ethernet clocks.

IEEE
1588v2

Supports eight channels of IEEE 1588v2 clocks.

Loopb
ack
capabi
lity

PHY
layer at
Ethernet
ports

Inloops

MAC
layer at
Ethernet
ports

Inloops and outloops

Inban
d
DCN

Supported

HQoS

Provides the hierarchical QoS function. The board provides the scheduling function
at multiple levels including the flow queue and port queue, the bandwidth restricting
function, and the corresponding statistical information.

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Funct
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Featu
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Description

IGMP
snoopi
ng

Supported

Query
of
electro
nic
labels

Supported

8 Packet Interface Boards

8.1.4 Working Principle and Signal Flow


The PETF8 consists of the access and converging module, control and driving module, voltage
detecting module, clock module, and power module.
Figure 8-2 shows the functional block diagram of the PETF8.
Figure 8-2 Functional block diagram of the PETF8
Voltage detecting
module

8xFE electrical
signals

Voltage detecting
signal
Management bus
IEEE
Control and
GE service
1588 V2 driving module
signal

Backplane

GE

Access and
converging
module

Synchronous
clock

IEEE
Working
1588 V2
clock signal
signal
One system clock
Working clock
signal
Synchronous Ethernet clock
Clock
module
IEEE 1588 V2 packet

PEG16/PEG8
PEG16/PEG8

PEG16/PEG8
PEG16/PEG8
PEG16/PEG8

Modules of
the board
Modules of
the board

Pow er
module

Fuse
Fuse

PEG16/PEG8
+3.3 V backup pow er

Upstream Direction
The services in the upstream direction are accessed by the FE ports. The service packets are
added with different VLAN tags according to the ingress ports. Then, the services are transmitted
to the GE port on the backplane side. As a result, the FE services are converged into the GE
services. After the PEG16 receives the packets, the PEG8/PEG16 identifies the ports to which
the services correspond according to the VLAN tags and strips the VLAN tags.
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Downstream Direction
The services in the downstream direction are added with VLAN tags on the PEG8/PEG16
according to the destination ports. Then, the services are accessed by the GE port on the
backplane side. The VLAN tags indicate the destination ports of the service packets. The service
packets are sent to the destination ports after the VLAN tags are stripped.

Access and Converging Module


The access and converging module performs the following functions:
l

Transmits/Receives 8xFE electrical signals.

Converges 8xFE services into 1xGE services on the backplane side.

Extracts the IEEE 1588 V2 clock information.

Control and Driving Module


The control and driving module performs the following functions:
l

Detects the system status through the management control bus.


Checks whether the board is properly inserted.
Detects the voltage of the PETF8.

Realizes the hot-swappable function of the PETF8.

Voltage Detecting Module


The voltage detecting module monitors the voltage.

Clock Module
The clock module performs the following functions:
l

Provides the working clock signal for each module of the PETF8.

Supports the synchronous Ethernet clock.

Supports the IEEE 1588 V2 clock.

Power Module
The power module converts the accessed DC voltage into the DC voltages that the modules of
the PETF8 require.

8.1.5 Front Panel


The front panel of the PETF8 has indicators, interfaces, and a bar code.

Diagram of the Front Panel


Figure 8-3 shows the appearance of the front panel of the PETF8.
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Figure 8-3 Front panel of the PETF8

PETF8
STAT
ACT
SRV

FE1
FE2
FE3
FE4
FE5
FE6
FE7
FE8

PETF8

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Service alarm indicator (SRV) two colors (red and green)

Connection status indicator (LINK) one color (green and located on the RJ45 connector)

Data receiving and transmission indicator (ACT) one color (orange and located on the
RJ45 connector)

For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the Boards.

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Interfaces
The front panel of the PETF8 has eight FE electrical interfaces. Table 8-2 describes the types
and usage of the electrical interfaces of the PETF8.
Table 8-2 Electrical interfaces of the PETF8
Interface

Type of Interface

Usage

FE1FE8

RJ-45

Transmits and receives FE signals.

8.1.6 Jumpers and DIP Switches


The PETF8 does not have any jumpers or DIP switches that are used for board settings.

8.1.7 Valid Slots


The PETF8 must be installed in a valid slot on the subrack. Otherwise, the PETF8 fails to work
normally.
The PETF8 can be installed in slots 1926, and 2936 in the subrack.
The PETF8 works as the interface board for the PEG8 and PEG16. For the slots valid for the
PEG8 and PEG16 and the corresponding slots for the PETF8, refer to Table 7-48 and Table
7-66.

8.1.8 Feature Code


The PETF8 does not have the feature code.

8.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
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Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Optional: Configure the inband DCN. For details, see Configuring the Inband DCN.
Step 3 Required: Set the Ethernet interface as follows:
l Port enabled/disabled: When you configure services on a port of the Ethernet board, the port
must be set to Enabled.
l Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same fixed working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of traffic,
services may be completely interrupted.
For details, see Parameter Description.
NOTE

For more information about the parameters of the board, see 27.1 Packet Processing Boards.

Step 4 Required: Configure services. The following Ethernet services can be configured according to
actual requirements:
l Configure the E-line service. For details, see Configuring E-Line Services.
l Configure the E-LAN service. For details, see Configuring E-LAN Services.
Step 5 Optional: Configure the MPLS OAM. For details, see Configuring the MPLS OAM.
Step 6 Optional: Configure the MPLS tunnel protection group. For details, see Configuring MPLS
Tunnel APS on a Per-NE Basis.
Step 7 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Configuring an Ethernet LAG.
Step 8 Optional: Configure the QoS. For details, see Configuring the HQoS.
Step 9 Optional: Configure the IEEE 1588 V2 time and clock. For details, see Configuring the IEEE
1588v2 Time Synchronization and Clock Synchronization.
Step 10 Optional: Configure the IGMP Snooping. For details, see Configuring the IGMP Snooping.
----End

Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check Ethernet services.
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l Check the E-line service. For details, see Verifying the Correctness of E-Line Service
Configuration.
l Check the E-LAN service. For details, see Verifying the Correctness of E-LAN Service
Configuration.
Step 2 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 3 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

8.1.10 Parameter Settings


You can set the parameters for the PETF8 by using the U2000.
You can set the following parameters for the PETF8 by using the U2000:
l

Ethernet interface

For more parameters the description of the parameters, see 27.1 Packet Processing Boards.

8.1.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also provides
the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 8-3 lists the faults that occur on the PETF8 frequently and the troubleshooting methods.
Table 8-3 Methods used to troubleshoot the faults that occur on the PETF8 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service
troubleshooting

l The service is
interrupted.

See Troubleshooting Packet Service


Interruptions.

l The service loses


packets or has
errored packets.
Protection switching
fault

l The tunnel APS


switching fails.

See Failure of Packet Service Protection


Switching.

l The PW APS
switching fails.
l The MC-LAG
switching fails.

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Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PETF8, see Replacing a Packet Interface Board.

8.1.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

8.1.12.1 Alarms of N1PETF8

Issue 03 (2013-02-20)

TEMP_OVER

HARD_BAD

HARD_ERR

POWER_ABNORMAL

BD_STATUS

WRG_BD_TYPE

FLOW_OVER

LOOP_ALM

ETH_LOS

ETH_LINK_DOWN

MAC_FCS_EXC

FDBSIZEALM_ELAN

MPLS_TUNNEL_LOCV

MPLS_TUNNEL_Excess

MPLS_TUNNEL_MISMATCH

MPLS_TUNNEL_MISMERGE

MPLS_TUNNEL_UNKNOWN

MPLS_TUNNEL_BDI

MPLS_TUNNEL_FDI

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

ETH_CFM_UNEXPERI

PW_EXC_TRAFFIC

ETH_CFM_MISMERGE

ETH_EFM_DF

ETH_CFM_LOC

ETH_CFM_RDI

ETH_EFM_LOOPBACK

ETH_EFM_REMFAULT

ETH_EFM_EVENT

ETH_APS_LOST

ETH_APS_TYPE_MISMATCH

ETH_APS_SWITCH_FAIL

LAG_MEMBER_DOWN

PW_NO_TRAFFIC

LPT_CFG_CLOSEPORT

MPLS_PW_Excess

LAG_DOWN

MPLS_PW_LOCV

MPLS_PW_UNKNOWN

MPLS_PW_MISMATCH

MPLS_PW_MISMERGE

MPLS_PW_SF

MPLS_PW_BDI

MPLS_PW_SD

PWAPS_SWITCH_FAIL

PWAPS_TYPE_MISMATCH

PWAPS_PATH_MISMATCH

MCLAG_CFG_MISMATCH

PWAPS_LOST

MCSP_PATH_LOCV

ETHOAM_SELF_LOOP

PORTMODE_MISMATCH

TUNNEL_APS_DEGRADED

BWUTILIZATION_OVER

MPLS_PW_OAMFAIL

DROPRATIO_OVER

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ETH_NO_FLOW

8 Packet Interface Boards

MPLS_TUNNEL_OAMFAIL

PORT_EXC_TRAFFIC

SRV_SHUTDOWN_LD

8.1.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

8.1.13.1 Performance Events of N1PETF8


Table 8-4 SDH
BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

Table 8-5 ETH-OAM 802.1ag


ETH_CFM_LS

ETH_CFM_SLS

ETH_CFM_CSLS

ETH_CFM_UAS

ETH_CFM_FLR

ETH_CFM_FL

ETH_CFM_FD

ETH_CFM_FDV

Table 8-6 MPLS Tunnel OAM


MPLS_TUNNEL_LS

MPLS_TUNNEL_SLS

MPLS_TUNNEL_CSLS

MPLS_TUNNEL_UAS

MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

NOTE

Table 8-7 provides the statistical items of tunnel supported by the N1PETF8 when the N1PETF8 works
together with the PEG8.

Table 8-7 Tunnel

Issue 03 (2013-02-20)

TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TNL_BW_UTILISATION

TUNNEL_REVERSE_SNDP
KTS

TUNNEL_REVERSE_SN
DBYTES

TUNNEL_REVERSE_RC
VPKTS

TUNNEL_REVERSE_RCV
BYTES

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NOTE

Table 8-8 provides the statistical items of tunnel supported by the N1PETF8 when the N1PETF8 works
together with the PEG8.

Table 8-8 Tunnel


TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TUNNEL_REVERSE_SN
DPKTS

TUNNEL_REVERSE_SND
BYTES

TUNNEL_REVERSE_RC
VPKTS

TUNNEL_REVERSE_RC
VBYTES

NOTE

Table 8-9 provides the statistical items of MPLS PW OAM supported by the N1PETF8 when the N1PETF8
works together with the PEG8. When working together with the PEG16, the N1PETF8 does not support
MPLS PW OAM performance measurement.

Table 8-9 MPLS PW OAM


MPLS_PW_LS

MPLS_PW_SLS

MPLS_PW_CSLS

MPLS_PW_UAS

MPLS_PW_FLR

MPLS_PW_FL

MPLS_PW_FD

MPLS_PW_FDV

Table 8-10 PW
PW_RCVPKTS

PW_RCVBYTES

PW_SNDBYTES

PW_BANDWIDTH_UT
ILISATION

PW_SNDPKTS

Table 8-11 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES

NOTE

Table 8-12 and Table 8-13 provide the statistical items supported by the N1PETF8 when the N1PETF8
works together with the PEG8.

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Table 8-12 Statistics of RMON basic performance


RXOCTETS

RXPKTS

RXBRDCAST

RXMULCAST

ETHUNDER

RXPKT65

RXPKT128

RXPKT256

RXPKT512

RXPKT1024

Table 8-13 Statistics of RMON extended performance


RXPKT1519

TXPKT65

TXPKT128

TXPKT256

TXPKT512

TXPKT1024

TXPKT1519

PKT65

PKT128

PKT256

PKT512

PKT1024

PKT1519

RXUNICAST

TXUNICAST

TXMULCAST

TXBRDCAST

ETHFCS

TXPKTS

TXOCTETS

NOTE

Table 8-14 and Table 8-15 provide the statistical items supported by the N1PETF8 when the N1PETF8
works together with the PEG16.

Table 8-14 Statistics of RMON basic performance


RXPKTS

RXOCTETS

RXPKT65

RXPKT128

RXPKT256

RXPKT512

RXPKT1024

RXBRDCAST

RXMULCAST

ETHUNDER

Table 8-15 Statistics of RMON extended performance

Issue 03 (2013-02-20)

TXPKTS

TXOCTETS

TXUNICAST

TXBRDCAST

TXMULCAST

TXPKT65

TXPKT128

TXPKT256

TXPKT512

TXPKT1024

TXPKT1519

RXUNICAST

RXPKT1519

PKT1519

ETHFCS

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PKT65

PKT128

PKT256

PKT512

PKT1024

PORT_RX_BYTES_AVA
ILABILITY

8.1.14 Technical Specifications


The technical specifications of the PETF8 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


Table 8-16 lists the parameters specified for the electrical interfaces of the PETF8.
Table 8-16 Parameters specified for the electrical interfaces of the PETF8
Parameter

Value

Nominal bit rate

100 Mbit/s

Type of electrical interface

RJ-45

Line code pattern

MLT-3 encoding signal (100M)

Specifications of the
interface

Complies with IEEE 802.3u.

Mechanical Specifications
The mechanical specifications of the PETF8 are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.4

Power Consumption
The maximum power consumption of the PETF8 at room temperature (25C) is 6 W.

8.2 PEFF8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEFF8 (8-port fast Ethernet optical interface processing board).
This topic also describes how to configure and commission the PEFF8.

8.2.1 Version Description


The PEFF8 is available in one functional version, namely, N1.

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8.2.2 Application
The PEFF8 is mainly used in the packet data transmission field to transmit/receive data packets,
manage bandwidths, and implement switching of data packets.
Figure 8-4 shows the typical networking and application of the PEFF8. The PEFF8 works with
the cross-connect board that provides the packet switching function to meet the requirement of
packet features. With this board, the TDM domain can be overlapped with the packet domain
on the OptiX OSN equipment so that the data can be transmitted in the two domains. In this
manner, an MSTP network can smoothly evolve to a packet switching network.
Figure 8-4 Networking and application of the PEFF8

NMS

NE1

User A2
NE2

PSN

NE4

NE3

User B2
Traffic direction

User B1

PEG8
PEFF8
Dual-domain (TDM domain
and packet domain) cross- User A1
connect board
PSN: packet switched network

8.2.3 Functions and Features


The PEFF8 receives/transmits 8xFE optical signals and works with the PEG8 to process services.
Table 8-17 lists the functions and features of the PEFF8. When working with the PEG8, the
PEFF8 supports the functions and features as described in 7.3.3 Functions and Features.

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Table 8-17 Functions and features of the PEFF8


Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits and processes 8xFE optical signals.

Interfa
ce
types

Supports 100Base-FX/LX/VX/ZX Ethernet optical interfaces. The optical interface


uses the LC connector and supports the transmission distances of 2 km, 15 km, 40
km, and 80 km.

Interfa
ce
charac
teristic
s

Hot
optical
module
swappin
g

Supports hot swapping of SFP optical modules.

Workin
g modes

100M full duplex

Flow
control
at ports

Autonegotiation
mode

Not supported

Nonautonegotia
tion mode

Not supported

Servic
e
specifi
cation
s

Issue 03 (2013-02-20)

Query/
Setting
of port
status

Supported

Query
of
interfac
e types

Supported

Setting
of
optical
power
threshol
ds

Supported

Service
bearing
modes

MPLS

Supported

QinQ

Supported

Port

Supported

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Funct
ion
and
Featu
re

Description

MTU

Ethernet
service
capabili
ty

Protec
tion
schem
es

8 Packet Interface Boards

MTU for
ports

Supports the setting of the packet length, which ranges


from 960 bytes to 1976 bytes. After the setting becomes
valid, the length of the packets that enter or exit the ports
is restricted by the pre-set MTU.

MTU for
services

For packet services carried by PWs, the PEFF8 supports


the setting of the packet length, which ranges from 64
bytes to 9000 bytes; for packet services carried in other
modes, the PEFF8 does not support the setting of the
packet length.

E-Line
service

Supported

E-LAN
service

Supported

E-AGGR
service

Not supported

Formats of
Ethernet
data frames

Supports the encapsulation in IEEE 802.3 format, Ethernet


II format, or IEEE 802.1q/p format.

Jumbo
frame

Supports the Jumbo frame with a length not more than


1976 bytes.

MS-PW

Supports static MS-PWs.

MPLS
Tunnel
APS

Supports the 1+1 (single-ended/dual-ended) and 1:1 (dual-ended) MPLS


Tunnel APS.

MPLS
PW
APS

Supports the PW FPS (single-ended), 1+1 (single-ended/dual-ended) and


1:1 (dual-ended) MPLS PW APS.

LAG

l Supports manual link aggregation and static link aggregation.


l Supports the load sharing mode and load non-sharing mode.
l Complies with IEEE 802.3ad and IEEE 802.1AX.

Issue 03 (2013-02-20)

MCLAG

Supported when working with a PEG8 board in compliance with 802.3ad


and IEEE 802.1AX.

LPT for
packet
services

Point-topoint LPT

Supported

Point-tomultipoint
LPT

Supported

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Funct
ion
and
Featu
re

Description

Clock
synchr
onizati
on

Synchro
nous
Ethernet

Supports eight channels of synchronous Ethernet clock signals.

IEEE
1588v2

Supports eight channels of IEEE 1588v2 clocks.

Loopb
ack
capabi
lity

PHY
layer at
Ethernet
ports

Inloops

MAC
layer at
Ethernet
ports

Inloops and outloops

Inban
d
DCN

Supported

HQoS

Provides the hierarchical QoS function. The board provides the scheduling function
at multiple levels including the flow queue and port queue, the bandwidth restricting
function, and the corresponding statistical information.

RMO
N
perfor
mance

Supported

IGMP
snoopi
ng

Supported

Query
of
electro
nic
labels

Supported

8.2.4 Working Principle and Signal Flow


The PEFF8 consists of the access and converging module, control and driving module,
temperature and voltage detecting module, clock module, and power module.
Figure 8-5 shows the functional block diagram of the PEFF8.

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Figure 8-5 Functional block diagram of the PEFF8


Voltage
detecting module
Voltage detecting signal
8xFE optical
signals

GE
Access and
converging
module

Synchronous
clock

IEEE
1588v2
signal

Management bus
Control and
driving module

IEEE1588v2 signal
Working clock
signal

Backplane

GE service

PEG8
PEG8

Working clock signal


One channel of system clock

Clock
module

Synchronous Ethernet clock


IEEE 1588 V2 packet

PEG8
PEG8
PEG8

Each module of board


Each module
of board

Pow er
module

Fuse
Fuse

PEG8
+3.3 V backup pow er

Upstream direction
The services in the upstream direction are accessed by the FE ports. The service packets are
added with different VLAN tags based on the ingress ports. Then, the services are transmitted
to the GE port on the backplane side. As a result, the FE services are converged into the GE
services. After receiving the packets, the PEG8 identifies the ports to which the services
correspond based on the VLAN tags and strips the VLAN tags.

Downstream direction
The services in the downstream direction are added with VLAN tags on the PEG8 based on the
destination ports. Then, the services are accessed by the GE port on the backplane side. The
destination ports of the service packets are determined based on the VLAN tags. After the
destination ports of the service packets are determined, the VLAN tags are striped and the
services are sent to the destination ports.

Access and Converging Module


The access and converging module performs the following functions:
l

Transmits/Receives 8xFE optical signals.

Converges 8xFE services into 1xGE services on the backplane side.

Extracts IEEE 1588 V2 clock information.

Control and Driving Module


The control and driving module performs the following functions:
l

Detects the system status through the management control bus.


Checks whether the board is properly inserted.
Tests the voltage status.

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Implements the hot-pluggable function of the PEFF8.

Voltage Test Module


The voltage test module mainly provides the voltage monitoring function.

Clock Module
The clock module performs the following functions:
l

Provides the working clock signal for each module of the PEFF8.

Supports the synchronous Ethernet clock.

Supports the IEEE 1588 V2 clock.

Power Module
The power module converts the accessed DC voltage into the DC voltages that the modules of
the board require.

8.2.5 Front Panel


The front panel of the PEFF8 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 8-6 shows the appearance of the front panel of the PEFF8.

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Figure 8-6 Front panel of the PEFF8

PEFF8
STAT
ACT
SRV
CLASS 1
LASER
PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4


OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8
L/A 1
L/A 2
L/A 3
L/A 4
L/A 5
L/A 6
L/A 7
L/A 8

PEFF8

Indicators
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Service alarm indicator (SRV) two colors (red and green)

Connection status indicator (L/A1-L/A8) two colors (yellow and green)

For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the Boards.

Interfaces
The front panel of the PEFF8 has eight FE optical interfaces. Table 8-18 describes the interfaces
of the PEFF8.

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Table 8-18 Interfaces of the PEFF8


Interface

Type of Interface

Usage

IN1-IN8

LC (pluggable)

Receives FE signals.

OUT1OUT8

LC (pluggable)

Transmits FE signals.

8.2.6 Valid Slots


The PEFF8 must be installed in a valid slot on the subrack. Otherwise, the PEFF8 fails to work
normally.
The PEFF8 can be installed in slots 1926, and 2936 in the subrack.
The PEFF8 works as the interface board of the PEG8. For the slots valid for the PEG8, see Table
7-48.

8.2.7 Feature Code


The PEFF8 does not have the feature code.

8.2.8 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
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Step 2 Optional: Configure the inband DCN. For details, see Configuring the Inband DCN.
Step 3 Required: Set the Ethernet interface as follows:
l Port enabled/disabled: When you configure services on a port of the Ethernet board, the port
must be set to Enabled.
l Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same fixed working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of traffic,
services may be completely interrupted.
For details, see Parameter Description.
NOTE

For more information about the parameters of the board, see 27.1 Packet Processing Boards.

Step 4 Required: Configure services. The following Ethernet services can be configured according to
actual requirements:
l Configure the E-line service. For details, see Configuring E-Line Services.
l Configure the E-LAN service. For details, see Configuring E-LAN Services.
Step 5 Optional: Configure the MPLS OAM. For details, see Configuring the MPLS OAM.
Step 6 Optional: Configure the MPLS tunnel protection group. For details, see Configuring MPLS
Tunnel APS on a Per-NE Basis.
Step 7 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Configuring an Ethernet LAG.
Step 8 Optional: Configure the QoS. For details, see Configuring the HQoS.
Step 9 Optional: Configure the IEEE 1588 V2 time and clock. For details, see Configuring the IEEE
1588v2 Time Synchronization and Clock Synchronization.
Step 10 Optional: Configure the IGMP Snooping. For details, see Configuring the IGMP Snooping.
----End

Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check Ethernet services.
l Check the E-line service. For details, see Verifying the Correctness of E-Line Service
Configuration.
l Check the E-LAN service. For details, see Verifying the Correctness of E-LAN Service
Configuration.
Step 2 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
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Step 3 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

8.2.9 Configuring the Board Functions


The PEFF8 supports the packet switching function and multiple packet functions and features,
such as HQoS, LAG, and ETH OAM. Configure the functions according to actual requirements.
You can configure the following packet functions for the PEFF8 by using the U2000:
l

HQoS

LAG

ETH OAM

MPLS Tunnel APS

MPLS OAM

IGMP Snooping

Inband DCN

LPT

MPLS PW APS

MC-LAG

MS-PW

8.2.10 Parameter Settings


You can set the parameters for the PEFF8 by using the U2000.
You can set the following parameters for the PEFF8 by using the U2000.
l

Ethernet interface

For information about more parameters and the description of each parameter, see 27.1 Packet
Processing Boards.

8.2.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also provides
the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 8-19 lists the faults that occur on the PEFF8 frequently and the troubleshooting methods.

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Table 8-19 Methods used to troubleshoot the faults that occur on the PEFF8 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service
troubleshooting

l The service is
interrupted.

See Troubleshooting Packet Service


Interruptions.

l The service loses


packets or has
errored packets.
Protection switching
fault

l The tunnel APS


switching fails.

See Failure of Packet Service Protection


Switching.

l The PW APS
switching fails.
l The MC-LAG
switching fails.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PEFF8, see Replacing a Packet Interface Board.

8.2.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the NMS.

8.2.12.1 Alarms of N1PEFF8

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TEMP_OVER

HARD_BAD

HARD_ERR

POWER_ABNO
RMAL

BD_STATUS

WRG_BD_TYPE

LSR_NO_FITED

LASER_MOD_ERR

LASER_SHUT

ALM_ALS

LSR_WILL_DIE

IN_PWR_ABN

OUT_PWR_AB
N

TEM_HA

TEM_LA

LSR_BCM_AL
M

FLOW_OVER

LOOP_ALM

ETH_LOS

ETH_LINK_DOWN

MCLAG_CFG_MISMATCH

FDBSIZEALM_
ELAN

MPLS_TUNNEL_L
OCV

MPLS_TUNNEL_Excess

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MPLS_TUNNEL
_MISMATCH

MPLS_TUNNEL_
MISMERGE

MPLS_TUNNEL_UNKNOWN

MPLS_TUNNEL
_BDI

MPLS_TUNNEL_F
DI

MPLS_TUNNEL_SD

MPLS_TUNNEL
_SF

ETH_CFM_UNEXP
ERI

PW_EXC_TRAFFIC

ETH_CFM_MIS
MERGE

ETH_EFM_DF

ETH_CFM_LOC

ETH_CFM_RDI

ETH_EFM_LOOPB
ACK

ETH_EFM_REMFAULT

ETH_EFM_EVE
NT

ETH_APS_SWITC
H_FAIL

ETH_APS_TYPE_MISMATCH

ETH_APS_PAT
H_MISMATCH

LAG_DOWN

ETH_APS_LOST

LAG_MEMBER
_DOWN

IN_PWR_LOW

PW_NO_TRAFFIC

IN_PWR_HIGH

MPLS_PW_Excess

MPLS_PW_MISMATCH

MPLS_PW_LOC
V

MPLS_PW_UNKN
OWN

MPLS_PW_BDI

MPLS_PW_MIS
MERGE

PWAPS_TYPE_MI
SMATCH

MPLS_PW_SD

MPLS_PW_SF

PWAPS_LOST

PWAPS_PATH_MISMATCH

PWAPS_SWITC
H_FAIL

LPT_CFG_CLOSEPORT

MCSP_PATH_LOCV

ETHOAM_SELF
_LOOPSSN1PEF
F8

MAC_FCS_EXC

TUNNEL_APS_DEGRADED

BWUTILIZATI
ON_OVER

MPLS_PW_OAMF
AIL

DROPRATIO_OVER

ETH_NO_FLO
W

MPLS_TUNNEL_O
AMFAIL

PORT_EXC_TRAFFIC

SRV_SHUTDO
WN_LD

8.2.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the NMS.

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8.2.13.1 Performance Events of N1PEFF8


Table 8-20 SDH
BDTEMPMIN

BDTEMPCUR

BDTEMPMAX

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

ETH_CFM_LS

ETH_CFM_SLS

ETH_CFM_CSLS

ETH_CFM_UAS

ETH_CFM_FLR

ETH_CFM_FL

ETH_CFM_FD

ETH_CFM_FDV

Table 8-21 ETH-OAM 802.1ag

Table 8-22 MPLS Tunnel OAM


MPLS_TUNNEL_LS

MPLS_TUNNEL_SLS

MPLS_TUNNEL_CSLS

MPLS_TUNNEL_UAS

MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

Table 8-23 Tunnel


TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TNL_BW_UTILISATION

TUNNEL_REVERSE_SNDP
KTS

TUNNEL_REVERSE_SN
DBYTES

TUNNEL_REVERSE_RC
VPKTS

TUNNEL_REVERSE_RCV
BYTES

Table 8-24 MPLS PW OAM

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MPLS_PW_LS

MPLS_PW_SLS

MPLS_PW_CSLS

MPLS_PW_UAS

MPLS_PW_FLR

MPLS_PW_FL

MPLS_PW_FD

MPLS_PW_FDV

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Table 8-25 PW
PW_RCVPKTS

PW_RCVBYTES

PW_SNDBYTES

PW_BANDWIDTH_UT
ILISATION

PW_SNDPKTS

Table 8-26 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES

Table 8-27 Statistics of RMON basic performance


RXOCTETS

RXPKTS

RXBRDCAST

RXMULCAST

ETHUNDER

RXPKT65

RXPKT128

RXPKT256

RXPKT512

RXPKT1024

Table 8-28 Statistics of RMON extended performance


RXPKT1519

TXPKT65

TXPKT128

TXPKT256

TXPKT512

TXPKT1024

TXPKT1519

PKT65

PKT128

PKT256

PKT512

PKT1024

PKT1519

RXUNICAST

TXUNICAST

TXMULCAST

TXBRDCAST

ETHFCS

TXPKTS

TXOCTETS

8.2.14 Technical Specifications


The technical specifications of the PEFF8 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Specifications Specified for Optical Interfaces


Table 8-29 provides the specifications of the optical interfaces on the PEFF8.
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Table 8-29 Specifications of the electrical interfaces


Item

Value

Type of
interface

100BASEZX

100BASEVX

100BASE-LX

100BASE-FX

Transmission
distance (km)

80

40

15

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode LC

Multi-mode LC

Launched
optical power
range (dBm)

-5 to 0

-5 to 0

-15 to -8

-19 to -14

Operating
wavelength
range (nm)

1480 to 1580

1263 to 1360

1261 to 1360

1270 to 1380

Minimum
overload
(dBm)

-10

-10

-8

-14

Receiver
sensitivity
(dBm)

-34

-34

-28

-30

Minimum
extinction ratio
(dB)

10

10

8.2

10

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the PEFF8 are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight: 0.5 kg

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Power Consumption
The maximum power consumption of the PEFF8 at room temperature (25C) is 13 W.

8.3 CQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the CQ1 (4-channel channelized STM-1 CES optical interface board).

8.3.1 Version Description


The CQ1 is available in one functional version, namely, N1.

8.3.2 Application
The CQ1 directly receives channelized STM-1 services from the TDM domain, transmits the
channelized STM-1 services on the packet ring, and directly separates the channelized STM-1
services from other services on the Base Station Controller (BSC) side. In this manner, the
smooth evolution from the TDM domain to the packet domain is implemented.
Figure 8-7 shows the application of the CQ1. The CQ1 works with the PEG8 to transmit
channelized STM-1 services on the packet ring.

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Figure 8-7 Networking and application of the CQ1


BSC

RNC

NMS
GE

STM-1

CQ1
PEX2

PEX2

PEG8

PEG8

PEX2

PEX2

10GE Ring

CQ1

STM-1
Ring

Packet ring

FE

TDM ring

GE Ring

STM-1
Ring

STM1/STM-4
Ring

E1

E1

FE

Traffic direction
Dual-domain (TDM
domain and packet
domain) crossconnect board

NodeB

BTS
BTS

NodeB

8.3.3 Functions and Features


The CQ1 receives four-port channelized STM-1 services, and works with the PEG8 to process
CES service signals.
Table 8-30 provides the functions and features of the CQ1.
Table 8-30 Functions and features of the CQ1

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Function and
Feature

CQ1

Basic functions

Transmits and receives four-port channelized STM-1 optical signals, and


works with the PEG8 to process four-port channelized STM-1 CES
services.

Interface types

Supports different types of standard optical interfaces, namely, S-1.1,


L-1.1, and L-1.2 to meet requirements for transmission distances. The
characteristics of the optical interfaces comply with ITU-T G.957.

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Function and
Feature

CQ1

Interface
characteristics

ALS

Not supported

Loopback types of the port

Inloop
Outloop
Non-loopback

CES

Auto disabling of port loopback

Supported

Detection and query of optical


module information

Supported

Hot insertion and removal of SFP


optical modules

Supported

Supported CES services

252

Supported emulation mode

CESoPSN
SAToP

Supports the timeslot compression function. In the case of the CES


service in CESoPSN mode, the CQ1 compresses idle timeslots to
improve the bandwidth utilization on the NNI side.
The jitter compensation buffering time of CES services can be set to a
value in the range of 0.375 ms to 16 ms with a step of 0.125 ms.
The packet loading time of CES services can be set to a value in the range
of 0.25 ms to 5 ms with a step of 0.125 ms.
NOTE
l The packet loading time needs to be set to the same value for the NEs at both
ends.
l The jitter compensation buffering time needs to be more than at least two times
of the packet loading time.

Protection
scheme

Supports the 1+1 and 1:1 Packet-based linear MSP.

SSM protocol

Supported

PRBS

Not supported

Query of laser
transmission
distance

Supported

8.3.4 Working Principle and Signal Flow


The CQ1 consists of the line processing module, CES service processing module, management
module, clock module, and power module.
Figure 8-8 shows the functional block diagram of the CQ1.
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Figure 8-8 Functional block diagram of the CQ1


Backplane
4-port channelized
STM-1 signals

Line
processing
module

Service signal

Management bus

3.3.V
.
.

1.2 V

.
.
.

Clock
module

Service
signal

PEG8

Management bus

Management
module

Line clock

CES service
processing
module

Management bus

Line clock
Systemclock

Power
module

PEG8

PEG8

PEG8
+3.3 V backup
power supply

Receive Direction
In the receive direction, the line processing module receives four-channel channelized STM-1
services through the interfaces on the front panel of the CQ1 board. The line processing module
demultiplexes STM-1 signals into VC-12 signals, and demaps the VC-12 signals into E1 signals.
Then, the line processing module processes the overhead bytes, pointers, and alarm signals, and
sends the E1 signals to the CES service processing module. Then, the CES service processing
module rearranges the E1 frames, processes the rearranged signals based on the service type,
and performs PWE3 encapsulation and PW scheduling. Finally, the CES service processing
module sends the processed signals to the PEG8 through the interface on the backplane.

Transmit Direction
In the transmit direction, the CES service processing module receives service signals from the
PEG8, identifies the service type, and performs PWE3 decapsulation and queue scheduling.
Then, the CES service processing module sends the processed signals to the line processing
module. The line processing module maps the E1 service signals into VC-12 signals, and
multiplexes the VC-12 signals into STM-1 signals. Then, the line processing module processes
the overhead bytes, pointers, and alarm signals, and sends out the STM-1 signals through the
interface on the front panel of the CQ1.

Line Processing Module


The line processing module performs the following functions.
l

In the receive direction, the line processing module receives four-port channelized STM-1
services, demultiplexes STM-1 signals into VC-12 signals, and demaps the VC-12 signals
into E1 signals. Then, the line processing module processes the overhead bytes, pointers,
and alarm signals.

In the transmit direction, the line processing module receives E1 signals from the PEG8,
maps the E1 service signals into VC-12 signals, and multiplexes the VC-12 signals into
STM-1 signals. Then, the line processing module processes the overhead bytes, pointers,

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and alarm signals, and sends out the STM-1 signals through the interface on the front panel
of the CQ1.
l

In the case of a service fault, the line processing module implements the LMSP, and
performs service switching.

The line processing module extracts and restores line clock signals.

CES Service processing module


The CES service processing module performs the following functions.
l

In the receive direction, the CES service processing module receives signals from the line
processing module, rearranges the E1 frames, and processes the signals (for example,
compresses timeslots for the CES service). Then, the CES service processing module
performs PWE3 encapsulation and PW scheduling, and sends the processed signals to the
PEG8 through the interface on the backplane.

In the transmit direction, the CES service processing module receives signals from the
PEG8, performs interface conversion, and performs PWE3 decapsulation and service
scheduling. Then, the CES service processing module processes the signals, and sends the
processed signals to the line processing module.

Management Module
The management module manages and controls the modules on the CQ1.

Clock Module
The clock module provides clock information for the modules on the CQ1.

Power Module
The power module converts the accessed DC voltage into the DC voltages that the modules of
the board require.

8.3.5 Front Panel


The front panel of the CQ1 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 8-9 shows the appearance of the front panel of the CQ1.

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Figure 8-9 Front panel of the CQ1

CQ1
STAT
ACT
SRV

OUT1 IN1OUT2 IN2 OUT3 IN3OUT4 IN4

CQ1

Indicators
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the Boards.

Interfaces
The front panel of the CQ1 has four optical interfaces. Table 8-31 describes the type and usage
of the optical interfaces of the CQ1.

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Table 8-31 Interfaces of the CQ1


Optical
Interface

Type of Interface

Usage

IN1-IN4

LC (pluggable)

Channelized STM-1 signal input interface

OUT1OUT4

LC (pluggable)

Channelized STM-1 signal output interface

8.3.6 Jumpers and DIP Switches


The CQ1 does not have any jumpers or DIP switches that are used for board settings.

8.3.7 Valid Slots


The CQ1 must be installed in a valid slot on the subrack. Otherwise, the CQ1 fails to work
normally.
The CQ1 can be installed in any slot of slots 19-26 and slots 29-36.
The CQ1 needs to be used with the PEG8. Table 7-48 lists the slots valid for the PEG8 and the
corresponding slots for the CQ1.

8.3.8 Feature Code


The CQ1 does not have any feature code.

8.3.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the board.
Step 4 Required: Install the board. For information on how to install the board, see Replacing Boards
Onsite. Ensure that the board is in proper contact with the bottom of the subrack and that the
front panel of the board is properly locked.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End
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Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure the CES service interface. For details, see Configuring CES Ports.
NOTE

For more information about the parameters of the board, see 27.3 Packet Interface Boards.

Step 3 Required: Configure services. For details, see Operation Tasks for Configuring CES
Services.
Based on the actual requirements, you can configure the following CES services:
l UNI-UNI CES services (For the configuration example, see Configuration Example (UNIUNI CES Services).)
l UNI-NNI CES services (For the configuration example, see Configuration Example (UNINNI CES Services).)
Step 4 Optional: Configure linear MSP. For details, see Creating Packet-Based Linear MSP.
----End

Commissioning the Board


Step 1 Required: Test the CES service channel. For details, see Testing CES Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

8.3.10 Parameter Settings


You can set the parameters for the CQ1 by using the U2000.
You can set the following parameters for the CQ1 by using the U2000.
l

J0

J1

J2

C2

V5

SDH interface

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For more parameters and the description of the parameters, see 27.3 Packet Interface
Boards.

8.3.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also provides
the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 8-32 lists the faults that occur on the CQ1 frequently and the troubleshooting methods.
Table 8-32 Methods used to troubleshoot the faults that occur on the CQ1 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service fault

l The service is
interrupted.

See CES Service Troubleshooting.

l Bit errors are


generated in the
service.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the CQ1, see Replacing a Packet Interface Board.

8.3.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

8.3.12.1 Alarms of N1CQ1

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CES_LOSPKT_EXC

CES_MISORDERPKT_EX
C

CES_STRAYPKT_EXC

CES_MALPKT_EXC

CES_JTRUDR_EXC

CES_JTROVR_EXC

CES_RDI

CESPW_OPPOSITE_RAI

CESPW_OPPOSITE_ACFAULT

R_OOF

R_LOS

R_LOF

B2_SD

R_LOC

B2_EXC

BIP_SD

B3_EXC

B3_SD

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BIP_EXC

ALM_E1RAI

AU_AIS

BD_STATUS

HP_SLM

J0_MM

AU_LOP

HP_REI

HP_UNEQ

HP_TIM

HP_LOM

HARD_BAD

HP_RDI

IN_PWR_LOW

IN_PWR_ABN

HARD_ERR

LFA

LASER_MOD_ERR

IN_PWR_HIGH

LP_RDI_VC12

LMFA

LASER_SHUT

LP_SLM_VC12

LP_REI_VC12

LOOP_ALM

LSR_BCM_ALM

LP_TIM_VC12

LP_RFI

MS_AIS

LSR_NO_FITED

LP_UNEQ_VC12

OUT_PWR_ABN

MS_RDI

LSR_WILL_DIE

TEM_LA

POWER_ABNORMAL

MS_REI

TU_AIS_VC12

TEMP_OVER

TEM_HA

V5_VCAIS

TU_LOP_VC12

TF

WRG_BD_TYPE

UP_E1_AIS

8.3.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

8.3.13.1 Performance Events of N1CQ1


Table 8-33 SDH

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RSBBE

RSES

RSSES

RSUAS

RSCSES

MSES

MSUAS

MSBBE

MSSES

MSFEBBE

MSCSES

MSFESES

MSFEUAS

MSFEES

AUPJCHIGH

AUPJCLOW

MSFECSES

HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

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HPFESES

HPFEUAS

HPFECSES

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

LPBBE

LPES

LPSES

LPUAS

LPCSES

LPFEBBE

LPFEES

LPFESES

LPFEUAS

CES_LOSPKTS

CES_MISORDERPKTS

CES_STRAYPKTS

CES_MALPKTS

CES_JTRUDR

CES_JTROVR

LPFECSES

Table 8-34 CES

8.3.14 Technical Specifications


The technical specifications of the CQ1 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Specifications of Optical Interfaces


Table 8-35 provides the specifications of the optical interfaces on the CQ1.
Table 8-35 Specifications of the optical interfaces on the CQ1

Issue 03 (2013-02-20)

Item

Value

Nominal bit rate

155520 kbit/s

Line code

NRZ

Type of optical
interface

S-1.1

L-1.1

L-1.2

Type of Fiber

Single-mode LC

Single-mode LC

Single-mode LC

Transmission
distance (km)

2 to 15

15 to 40

40 to 80

Operating
wavelength range
(nm)

1261 to 1360

1263 to 1360

1480 to 1580

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Item

Value

Launched optical
power range
(dBm)

-15 to -8

-5 to 0

-5 to 0

Receiver
sensitivity (dBm)

-28

-34

-34

Minimum
overload (dBm)

-8

-10

-10

Minimum
extinction ratio
(dB)

8.2

10

10

Maximum -20 dB
spectral width
(nm)

Minimum side
mode suppression
ratio (dB)

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1CQ1 are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight: 0.5 kg

Power Consumption
The maximum power consumption of the N1CQ1 at the room temperature (25C) is 10 W.

8.4 MD12
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the MD12 (multi-protocol 32-channels E1 interface processing
board). This topic also describes how to configure and commission the MD12.
NOTE

The interface on the MD12 is a 120-ohm E1 interface.

8.4.1 Version Description


The MD12 is available in one functional version, namely, N1.
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8.4.2 Application
The MD12 directly receives E1 services from the TDM domain, transmits the E1 services on
the packet ring, and directly separates the E1 services from other services on the BSC side. In
this manner, the smooth evolution from the TDM domain to the packet domain is implemented.
Figure 8-10 shows the application of the MD12. The MD12 works with the PEG8 to transmit
E1 services on the packet ring.
Figure 8-10 Networking and application of the MD12
RNC

BSC

GE

STM-1

NMS
CQ1
PEX2

PEX2

PEG8

10GE Ring

Packet ring

PEG8

PEG8
MD12

FE

STM1/STM-4
Ring

E1

FE

E1

TDM ring
Traffic direction
Dual-domain (TDM
domain and packet
domain) crossconnect board

GE Ring

GE Ring

PEG8

STM1/STM-4
Ring

NodeB
BTS

NodeB

BTS

8.4.3 Functions and Features


The MD12 receives and transmits 32xE1 signals and works with the PEG8 to process E1 CES
and ATM/IMA services.
Table 8-36 provides the functions and features of the MD12.

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Table 8-36 Functions and features of the MD12


Function
and
Feature

MD12

Basic
functions

Transmits and receives 32xE1 signals, and works with the PEG8 to process E1
CES and ATM/IMA services.

Interface
types

Supports 120-ohm E1 electrical interface. The electrical interface uses the DB44
connector.

Interface
characteri
stics

Loopba
ck types
of the
port

Inloop

Auto
disablin
g of
port
loopbac
k

Supported

Numbe
r of
CES
service
s

32

Emulati
on
mode

CESoPSN, SAToP

Timesl
ot
compre
ssion
functio
n

In the case of the CES services in CESoPSN mode, the MD12


compresses idle timeslots to improve the bandwidth utilization on the
NNI side.

Jitter
compen
sation
bufferi
ng time
of CES
service
s

The jitter compensation buffering time of CES services can be set to


a value in the range of 0.375 ms to 16 ms with a step of 0.125 ms.

CES

Issue 03 (2013-02-20)

Outloop
Non-loopback

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Function
and
Feature

8 Packet Interface Boards

MD12

Packet
loading
time of
CES
packets

The packet loading time of CES services can be set to a value in the
range of 0.125 ms to 5 ms with a step of 0.125 ms.
NOTE
l The packet loading time needs to be set to the same value for the NEs at
both ends.
l The jitter compensation buffering time needs to be more than at least two
times of the packet loading time.

ATM/
IMA

Issue 03 (2013-02-20)

Numbe
r of
IMA
groups

32

Maxim
um
number
of E1
links in
each
IMA
group

16

Numbe
r of VUNI
ports

512

Numbe
r of VNNI
ports

128

Cell
concate
nation

Type

Concatenation, non-concatenation

Quantit
y

31

ATM
OAM

Type

CC, LB, RDI, AIS

Quantit
y

512

Service
categor
ies

CBR, UBR, UBR+, rt-VBR, nrt-VBR

ATM
QoS

Supported

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Function
and
Feature

MD12

Clock
function

Restores four CES adaptive clock recover (ACR) clocks.


Clocks that are recovered from services over ports 1 and 9 can be added to the
clock priority list.
NOTE
Clock recovery over ports 1 to 16 is independent of clock recovery over ports 17 to 32. That
is, clocks that are recovered from services over ports 1 to 16 can be transmitted out of ports
1 to 16 and clocks that are recovered from services over ports 17 to 32 can be transmitted
out of ports 17 to 32.

Clock
mode

Line Clock Mode and Null.

Line code
of E1 link

HDB3 code

Frame
format of
E1 link

Unframed format, double-framed format, or E1 CRC-4 multiframe format


(default value)

Maintena
nce
features

l Supports the warm reset and cold reset. The warm reset does not affect
services.
l Supports the query of the board manufacturer information.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l Supports the tributary PRBS function.

8.4.4 Working Principle and Signal Flow


The MD12 consists of the tributary processing module, service processing module, management
module, clock module, and power supply module.
Figure 8-11 shows the functional block diagram of the MD12.

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Figure 8-11 Functional block diagram of the MD12


Backplane
32xE1
signals

Tributary
processing
module

Service
processing
module

Service signal

Management bus

3.3. V

.
.
.

.
.

1.2 V

Clock
module

PEG8

Management bus

Management
module

Line clock

Service
signal

Management bus

PEG8

Line clock
System clock

Power
module

PEG8

PEG8
+3.3 V backup
power supply

Receive Direction
The tributary processing module receives E1 signals, and performs the functions of impedance
matching, signal equalization, level conversion, clock recovery, de-jitter, and decoding. After
the tributary processing module processes the E1 signals, the signals are sent to the service
processing module for framing, PWE3 encapsulation and mapping, and PW scheduling. Then,
the signals are sent to the PEG8 through the backplane interface module.

Transmit Direction
The cross-connect unit receives packets from the backplane interface module, and sends the
packets to the service processing module. The service processing module decapsulates the
packets, buffers the data in queues, schedules the queues based on service types, and then
processes and converts the data. The converted data is sent to the tributary processing module.
The tributary processing module performs the functions of coding, dejitter, pulse shaping, and
line drive, and then sends the services to E1 interfaces.

Tributary Processing Module


The tributary processing module consists of 32 independent receive channels and transmit
channels.
l

The receive channels implement the functions of impedance matching, signal equalization,
level conversion, clock recovery, de-jitter, and decoding.

The transmit channels implement the functions of coding, dejitter, pulse shaping, and line
drive.

Service Processing Module


The service processing module performs the following functions:
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In the receive direction, the service processing module obtains the PW information of each
E1 service, performs PWE3 encapsulation and PW scheduling, and then sends the signals
to the PEG8 through the backplane interface.

In the transmit direction, the service processing module receives the services from the
PEG8, identifies different service types, and performs PWE3 decapsulation and service
scheduling.

Management Module
The management module manages and controls the modules on the MD12.

Clock Module
Provides the clock signal for each module of the MD12.

Power Module
The power module converts the accessed DC voltage into the DC voltages that the modules of
the board require.

8.4.5 Front Panel


The front panel of the MD12 has interfaces and a bar code.

Diagram of the Front Panel


Figure 8-12 shows the appearance of the front panel of the MD12.

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Figure 8-12 Front panel of the MD12

MD12

MD12

Interfaces
The front panel of the MD12 has four DB44 interfaces. Table 8-37 describes the types and usage
of the interfaces of the MD12.
Table 8-37 Interfaces of the MD12

Issue 03 (2013-02-20)

Interface

Type of Interface

Usage

1-8

DB44

Receives E1 signals from the 1st channel to the 8th


channel.

9-16

DB44

Receives E1 signals from the 9th channel to the 16th


channel.

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Interface

Type of Interface

Usage

17-24

DB44

Receives E1 signals from the 17th channel to the 24th


channel.

25-32

DB44

Receives E1 signals from the 25th channel to the


32nd channel.

Table 8-38 lists the pins of the DB44 interface.


Table 8-38 Pin description of the DB44 interfaces on the MD12
Front View
30

15

44

Pin

Usage

Pin

Usage

38

R1 to receive the
first channel of
signals

34

R5 to receive the
fifth channel of
signals

R2 to receive the
second channel
of signals

33

R3 to receive the
third channel of
signals

32

R4 to receive the
fourth channel of
signals

31

T1 to transmit
the first channel
of signals

11

T2 to transmit
the second
channel of
signals

10

T3 to transmit
the third channel
of signals

T4 to transmit
the fourth
channel of
signals

23
37
22
36
21
35

31
16

20
15
30
14
29
13
28
12
27

19

18

17

16

26

25

24

R6 to receive the
sixth channel of
signals
R7 to receive the
seventh channel of
signals
R8 to receive the
eighth channel of
signals
T5 to transmit the
fifth channel of
signals
T6 to transmit the
sixth channel of
signals
T7 to transmit the
seventh channel of
signals
T8 to transmit the
eighth channel of
signals

8.4.6 Jumpers and DIP Switches


The MD12 does not have any jumpers or DIP switches that are used for board settings.

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8.4.7 Valid Slots


The MD12 must be installed in a valid slot in the subrack. Otherwise, the MD12 fails to work
normally.
The MD12 can be installed in any slot of slots 19-26 and slots 29-36.
The MD12 needs to be used with the PEG8. Table 7-48 lists the slots valid for the PEG8 and
the corresponding slots for the MD12.

8.4.8 Feature Code


The MD12 does not have the feature code.

8.4.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the board.
Step 4 Required: Install the board. For information on how to install the board, see Replacing Boards
Onsite. Ensure that the board is in proper contact with the bottom of the subrack and that the
front panel of the board is properly locked.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure the CES service. For details, see Configuring CES Ports. Configure the
ATM port. For details, see Configuring ATM Interfaces
NOTE

For more information about the parameters of the board, see 27.3 Packet Interface Boards.

Step 3 Required: Configure services. Based on the actual requirements, you can configure the
following CES services:
l UNI-UNI CES services (For the configuration example, see Configuration Example (UNIUNI CES Services).)
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l UNI-NNI CES services (For the configuration example, see Configuration Example (UNINNI CES Services).)
l UNI-UNI ATM services (For the configuration example, see Configuration Example (UNIUNI ATM Services).)
l UNI-NNI ATM services (For the configuration example, see Configuration Example (UNIsNNI ATM Services).)
----End

Commissioning the Board


Step 1 Required: Test the CES service channel. For details, see Testing CES Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

8.4.10 Parameter Settings


You can set the parameters for the MD12 by using the U2000.
You can set the PDH interfaces parameters for the MD12 by using the U2000.
For the description of the PDH interfaces parameter, see 27.3 Packet Interface Boards.

8.4.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also provides
the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 8-39 lists the faults that occur on the MD12 frequently and the troubleshooting methods.
Table 8-39 Methods used to troubleshoot the faults that occur on the MD12 frequently
Fault Symptom

Common Fault Cause

CES service fault

l The service is interrupted.


l Bit errors are generated in the service.

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Fault Symptom

Common Fault Cause

ATM/IMA service fault

l The service is interrupted.


l Bit errors are generated in the service.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the MD12, see Replacing a Packet Interface Board.

8.4.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

8.4.12.1 Alarms of N1MD12

Issue 03 (2013-02-20)

TEMP_OVER

HARD_BAD

POWER_ABNORMAL

BD_STATUS

ALM_E1RAI

WRG_BD_TYPE

CES_LOSPKT_EXC

CES_MISORDERPKT_EX
C

CES_STRAYPKT_EXC

CES_MALPKT_EXC

CES_JTRUDR_EXC

CES_JTROVR_EXC

CES_RDI

CESPW_OPPOSITE_RAI

CESPW_OPPOSITE_ACFAULT

T_ALOS

UP_E1_AIS

E1_LOC

LFA

LMFA

HARD_ERR

IMA_GROUP_RE_DOWN

IMA_TXCLK_MISMATCH

ALM_IMA_LIF

ALM_IMA_LODS

ALM_IMA_RFI

ALM_IMA_RE_TX_UNUSABLE

ALM_IMA_RE_RX_UNUSABLE

ATMPW_LOSPKT_EXC

ATMPW_MISORDERPKT
_EXC

ATMPW_UNKNOWNCE
LL_EXC

CES_ACR_LOCK_ABN

VP_AIS

VP_RDI

VC_AIS

VC_RDI

VP_LOC

VC_LOC

OCD

LCD

UHCS

CHCS

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LOOP_ALM

8 Packet Interface Boards

IMA_GROUP_LE_DOWN

8.4.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

8.4.13.1 Performance Events of N1MD12


Table 8-40 SDH
BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

E1_LCV_SDH

E1_LES_SDH

E1_LSES_SDH

CES_LOSPKTS

CES_MISORDERPKTS

CES_STRAYPKTS

CES_MALPKTS

CES_JTRUDR

CES_JTROVR

MPLS_PW_FL

MPLS_PW_FD

PW_RCVPKTS

PW_RCVBYTES

PW_SNDPKTS

PW_SNDBYTES

PW_BANDWIDTH_UTILISATION

E1_LLOSS_SDH

Table 8-41 CES

CES_RX_PKTS

Table 8-42 MPLS PW OAM


MPLS_PW_FLR
MPLS_PW_FDV

Table 8-43 PW

Table 8-44 ATM


ATM_UNI1_INCELLS

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ATM_UNI2_OUTCELLS

ATM_CORRECTED_HCSER
R

ATM_UNCORRECTED_H
CSERR

ATM_RCVCELLS

ATM_RCVIDLECELLS

ATM_SNDCELLS

ATM_IF_INRATE_MAX

ATM_IF_INRATE_MIN

ATM_IF_INRATE_AVG

ATM_IF_OUTRATE_M
AX

ATM_IF_OUTRATE_MIN

ATM_IF_OUTRATE_AVG

ATM_CELL_AVAILABILITY

ATM_UNI1_INRATE_MAX

ATM_UNI1_INRATE_MI
N

ATM_UNI1_INRATE_A
VG

ATM_UNI1_OUTRATE_MA
X

ATM_UNI1_OUTRATE_
MIN

ATM_UNI1_OUTRATE_
AVG

ATM_UNI2_INRATE_MAX

ATM_UNI2_INRATE_MI
N

ATM_UNI2_INRATE_A
VG

ATM_UNI2_OUTRATE_MA
X

ATM_UNI2_OUTRATE_
MIN

ATM_UNI2_OUTRATE_
AVG

PORT_RX_BW_UTILIZATION

PORT_TX_BW_UTILIZATION

Table 8-45 ATM PWE3


ATMPW_SNDCELLS

ATMPW_RCVCELLS

ATMPW_UNKNOWNCELLS

8.4.14 Technical Specifications


The technical specifications of the MD12 include the parameters specified for interfaces,
mechanical specifications, and power consumption.

Specifications of Electrical Interfaces


Table 8-46 Specifications of the electrical interfaces of the MD12
Item

Value

Nominal bit rate

2048 kbit/s

Type of electrical interface

DB44

Code pattern

HDB3 code

Signal bit rate at the output port

Compliant with ITU-T G.703

Permitted frequency deviation at the


input port
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Item

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Value

Allowed attenuation at the input port


Input jitter tolerance

Mechanical Specifications
The mechanical specifications of the MD12 are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight: 0.5 kg

Power Consumption
The maximum power consumption of the MD12 at the room temperature (25C) is 12 W.

8.5 MD75
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the MD75 (multi-protocol 32-channels E1 interface processing
board). This topic also describes how to configure and commission the MD75.
NOTE

The interface on the MD12 is a 120-ohm E1 interface.

8.5.1 Version Description


The MD75 is available in one functional version, namely, N1.

8.5.2 Application
The MD75 directly receives E1 services from the TDM domain, transmits the E1 services on
the packet ring, and directly separates the E1 services from other services on the BSC side. In
this manner, the smooth evolution from the TDM domain to the packet domain is implemented.
Figure 8-13 shows the application of the MD75. The MD75 works with the PEG8 to transmit
E1 services on the packet ring.

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Figure 8-13 Networking and application of the MD75


RNC

BSC

GE

STM-1

NMS
CQ1
PEX2

PEX2

PEG8

10GE Ring

Packet ring

PEG8

PEG8
MD75

STM1/STM-4
Ring

FE

E1

E1

TDM ring
Traffic direction
Dual-domain (TDM
domain and packet
domain) crossconnect board

GE Ring

GE Ring

PEG8

STM1/STM-4
Ring

FE

NodeB

BTS
BTS

NodeB

8.5.3 Functions and Features


The MD75 receives and transmits 32xE1 signals and works with the PEG8 to process E1 CES
and ATM/IMA services.
Table 8-47 provides the functions and features of the MD75.
Table 8-47 Functions and features of the MD75

Issue 03 (2013-02-20)

Functio
n and
Feature

MD75

Basic
functions

Transmits and receives 32xE1 signals, and works with the PEG8 to process E1
CES and ATM/IMA services.

Interface
types

Supports 75-ohm E1 electrical interface. The electrical interface uses the DB44
connector.

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Functio
n and
Feature

MD75

Interface
character
istics

Loo
pbac
k
type
s of
the
port

Inloop

Auto
disa
blin
g of
port
loop
back

Supported

Num
ber
of
CES
servi
ces

32

Emu
latio
n
mod
e

CESoPSN, SAToP

Tim
eslot
com
pres
sion
func
tion

In the case of the CES services in CESoPSN mode, the MD75 compresses
idle timeslots to improve the bandwidth utilization on the NNI side.

Jitter
com
pens
ation
buff
erin
g
time
of
CES
servi
ces

The jitter compensation buffering time of CES services can be set to a


value in the range of 0.375 ms to 16 ms with a step of 0.125 ms.

CES

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Outloop
Non-loopback

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Functio
n and
Feature

ATM/
IMA

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8 Packet Interface Boards

MD75

Pack
et
loadi
ng
time
of
CES
pack
ets

The packet loading time of CES services can be set to a value in the range
of 0.125 ms to 5 ms with a step of 0.125 ms.

Num
ber
of
IMA
grou
ps

32

Max
imu
m
num
ber
of
E1
links
in
each
IMA
grou
p

16

Num
ber
of
VUNI
ports

512

Num
ber
of
VNNI
ports

128

Cell
conc
aten
ation

Type

Concatenation, non-concatenation

Quanti
ty

31

NOTE
l The packet loading time needs to be set to the same value for the NEs at both
ends.
l The jitter compensation buffering time needs to be more than at least two times
of the packet loading time.

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Functio
n and
Feature

Clock
function

8 Packet Interface Boards

MD75

AT
M
OA
M

Type

CC, LB, RDI, AIS

Quanti
ty

512

Serv
ice
cate
gori
es

CBR, UBR, UBR+, rt-VBR, nrt-VBR

AT
M
QoS

Supported

Recovers four CES ACR clocks.


Clocks that are recovered from services over ports 1 and 9 can be added to the
clock priority list.
NOTE
Clock recovery over ports 1 to 16 is independent of clock recovery over ports 17 to 32. That
is, clocks that are recovered from services over ports 1 to 16 can be transmitted out of ports
1 to 16 and clocks that are recovered from services over ports 17 to 32 can be transmitted
out of ports 17 to 32.

Clock
mode

Line Clock Mode and Null.

Line code
of E1 link

HDB3 code

Frame
format of
E1 link

Unframed format, double-framed format, or E1 CRC-4 multiframe format


(default value)

Loopbac
k mode

Inloop, outloop, or non-loopback (default value)

Maintena
nce
features

l Supports the warm reset and cold reset. The warm reset does not affect
services.
l Supports the query of the board manufacturer information.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l Supports the tributary PRBS function.

8.5.4 Working Principle and Signal Flow


The MD75 consists of the tributary processing module, service processing module, management
module, clock module, and power supply module.
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Figure 8-14 shows the functional block diagram of the MD75.


Figure 8-14 Functional block diagram of the MD75
Backplane
32xE1
signals

Tributary
processing
module

Service
processing
module

Service signal

Management bus

3.3. V

.
.
.

.
.

1.2 V

Clock
module

PEG8

Management bus

Management
module

Line clock

Service
signal

Management bus

PEG8

Line clock
System clock

Power
module

PEG8

PEG8
+3.3 V backup
power supply

Receive Direction
The tributary processing module receives E1 signals, and performs the functions of impedance
matching, signal equalization, level conversion, clock recovery, de-jitter, and decoding. After
the tributary processing module processes the E1 signals, the signals are sent to the service
processing module for framing, PWE3 encapsulation and mapping, and PW scheduling. Then,
the signals are sent to the PEG8 through the backplane interface module.

Transmit Direction
The cross-connect unit receives packets from the backplane interface module, and sends the
packets to the service processing module. The service processing module decapsulates the
packets, buffers the data in queues, schedules the queues based on service types, and then
processes and converts the data. The converted data is sent to the tributary processing module.
The tributary processing module performs the functions of coding, dejitter, pulse shaping, and
line drive, and then sends the services to E1 interfaces.

Tributary Processing Module


The tributary processing module consists of 32 independent receive channels and transmit
channels.
l

The receive channels implement the functions of impedance matching, signal equalization,
level conversion, clock recovery, de-jitter, and decoding.

The transmit channels implement the functions of coding, dejitter, pulse shaping, and line
drive.

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Service Processing Module


The service processing module performs the following functions:
l

In the receive direction, the service processing module obtains the PW information of each
E1 service, performs PWE3 encapsulation and PW scheduling, and then sends the signals
to the PEG8 through the backplane interface.

In the transmit direction, the service processing module receives the services from the
PEG8, identifies different service types, and performs PWE3 decapsulation and service
scheduling.

Management Module
The management module manages and controls the modules on the MD75.

Clock Module
Provides the clock signal for each module of the MD75.

Power Module
The power module converts the accessed DC voltage into the DC voltages that the modules of
the board require.

8.5.5 Front Panel


The front panel of the MD75 has interfaces and a bar code.

Diagram of the Front Panel


Figure 8-15 shows the appearance of the front panel of the MD75.

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Figure 8-15 Front panel of the MD75

MD75

MD75

Interfaces
The front panel of the MD75 has four DB44 interfaces. Table 8-48 describes the types and usage
of the interfaces of the MD75.
Table 8-48 Interfaces of the MD75

Issue 03 (2013-02-20)

Interface

Type of Interface

Usage

1-8

DB44

Receives E1 signals from the 1st channel to the 8th


channel.

9-16

DB44

Receives E1 signals from the 9th channel to the 16th


channel.

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Interface

Type of Interface

Usage

17-24

DB44

Receives E1 signals from the 17th channel to the 24th


channel.

25-32

DB44

Receives E1 signals from the 25th channel to the


32nd channel.

Table 8-49 lists the pins of the DB44 interface.


Table 8-49 Pin description of the DB44 interfaces on the MD75
Front View
30

15

44

Pin

Usage

Pin

Usage

38

R1 to receive the
first channel of
signals

34

R5 to receive the
fifth channel of
signals

R2 to receive the
second channel
of signals

33

R3 to receive the
third channel of
signals

32

R4 to receive the
fourth channel of
signals

31

T1 to transmit
the first channel
of signals

11

T2 to transmit
the second
channel of
signals

10

T3 to transmit
the third channel
of signals

T4 to transmit
the fourth
channel of
signals

23
37
22
36
21
35

31
16

20
15
30
14
29
13
28
12
27

19

18

17

16

26

25

24

R6 to receive the
sixth channel of
signals
R7 to receive the
seventh channel of
signals
R8 to receive the
eighth channel of
signals
T5 to transmit the
fifth channel of
signals
T6 to transmit the
sixth channel of
signals
T7 to transmit the
seventh channel of
signals
T8 to transmit the
eighth channel of
signals

8.5.6 Jumpers and DIP Switches


The MD75 does not have any jumpers or DIP switches that are used for board settings.

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8.5.7 Valid Slots


The MD75 must be installed in a valid slot in the subrack. Otherwise, the MD75 fails to work
normally.
The MD75 can be installed in any slot of slots 19-26 and slots 29-36.
The MD75 needs to be used with the PEG8. Table 7-48 lists the slots valid for the PEG8 and
the corresponding slots for the MD75.

8.5.8 Feature Code


The MD75 does not have any feature code.

8.5.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the board.
Step 4 Required: Install the board. For information on how to install the board, see Replacing Boards
Onsite. Ensure that the board is in proper contact with the bottom of the subrack and that the
front panel of the board is properly locked.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure the CES service. For details, see Configuring CES Ports. Configure the
ATM port. For details, see Configuring ATM Interfaces
NOTE

For more information about the parameters of the board, see 27.3 Packet Interface Boards.

Step 3 Required: Configure services. Based on the actual requirements, you can configure the
following CES services:
l UNI-UNI CES services (For the configuration example, see Configuration Example (UNIUNI CES Services).)
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l UNI-NNI CES services (For the configuration example, see Configuration Example (UNINNI CES Services).)
l UNI-UNI ATM services (For the configuration example, see Configuration Example (UNIUNI ATM Services).)
l UNI-NNI ATM services (For the configuration example, see Configuration Example (UNIsNNI ATM Services).)
----End

Commissioning the Board


Step 1 Required: Test the CES service channel. For details, see Testing CES Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

8.5.10 Parameter Settings


You can set the parameters for the MD75 by using the U2000.
You can set the PDH interfaces parameters for the MD75 by using the U2000.
For the description of the PDH interfaces parameter, see 27.3 Packet Interface Boards.

8.5.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also provides
the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 8-50 lists the faults that occur on the MD75 frequently and the troubleshooting methods.
Table 8-50 Methods used to troubleshoot the faults that occur on the MD75 frequently
Fault Symptom

Common Fault Cause

Service fault

l The service is interrupted.


l Bit errors are generated in the service.

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Fault Symptom

Common Fault Cause

ATM/IMA service fault

l The service is interrupted.


l Bit errors are generated in the service.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the MD75, see Replacing a Packet Interface Board.

8.5.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

8.5.12.1 Alarms of N1MD75

Issue 03 (2013-02-20)

TEMP_OVER

HARD_BAD

POWER_ABNORMAL

BD_STATUS

ALM_E1RAI

WRG_BD_TYPE

CES_LOSPKT_EXC

CES_MISORDERPKT_EX
C

CES_STRAYPKT_EXC

CES_MALPKT_EXC

CES_JTRUDR_EXC

CES_JTROVR_EXC

CES_RDI

CESPW_OPPOSITE_RAI

CESPW_OPPOSITE_ACFAULT

T_ALOS

UP_E1_AIS

E1_LOC

LFA

LMFA

HARD_ERR

IMA_GROUP_RE_DOWN

IMA_TXCLK_MISMATCH

ALM_IMA_LIF

ALM_IMA_LODS

ALM_IMA_RFI

ALM_IMA_RE_TX_UNUSABLE

ALM_IMA_RE_RX_UNUSABLE

ATMPW_LOSPKT_EXC

ATMPW_MISORDERPKT
_EXC

ATMPW_UNKNOWNCE
LL_EXC

CES_ACR_LOCK_ABN

VP_AIS

VP_RDI

VC_AIS

VC_RDI

VP_LOC

VC_LOC

OCD

LCD

UHCS

CHCS

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IMA_GROUP_LE_DOWN

8.5.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

8.5.13.1 Performance Events of N1MD75


Table 8-51 SDH
BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

E1_LCV_SDH

E1_LES_SDH

E1_LSES_SDH

CES_LOSPKTS

CES_MISORDERPKTS

CES_STRAYPKTS

CES_MALPKTS

CES_JTRUDR

CES_JTROVR

MPLS_PW_FL

MPLS_PW_FD

PW_RCVPKTS

PW_RCVBYTES

PW_SNDPKTS

PW_SNDBYTES

PW_BANDWIDTH_UTILISATION

E1_LLOSS_SDH

Table 8-52 CES

CES_RX_PKTS

Table 8-53 MPLS PW OAM


MPLS_PW_FLR
MPLS_PW_FDV

Table 8-54 PW

Table 8-55 ATM


ATM_UNI1_INCELLS

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ATM_UNI2_OUTCELLS

ATM_CORRECTED_HCSER
R

ATM_UNCORRECTED_H
CSERR

ATM_RCVCELLS

ATM_RCVIDLECELLS

ATM_SNDCELLS

ATM_IF_INRATE_MAX

ATM_IF_INRATE_MIN

ATM_IF_INRATE_AVG

ATM_IF_OUTRATE_M
AX

ATM_IF_OUTRATE_MIN

ATM_IF_OUTRATE_AVG

ATM_CELL_AVAILABILITY

ATM_UNI1_INRATE_MAX

ATM_UNI1_INRATE_MI
N

ATM_UNI1_INRATE_A
VG

ATM_UNI1_OUTRATE_MA
X

ATM_UNI1_OUTRATE_
MIN

ATM_UNI1_OUTRATE_
AVG

ATM_UNI2_INRATE_MAX

ATM_UNI2_INRATE_MI
N

ATM_UNI2_INRATE_A
VG

ATM_UNI2_OUTRATE_MA
X

ATM_UNI2_OUTRATE_
MIN

ATM_UNI2_OUTRATE_
AVG

PORT_RX_BW_UTILIZATION

PORT_TX_BW_UTILIZATION

Table 8-56 ATM PWE3


ATMPW_SNDCELLS

ATMPW_RCVCELLS

ATMPW_UNKNOWNCELLS

8.5.14 Technical Specifications


The technical specifications of the MD12 include the parameters specified for interfaces,
mechanical specifications, and power consumption.

Specifications of Electrical Interfaces


Table 8-57 Specifications of the electrical interfaces of the MD75
Item

Value

Nominal bit rate

2048 kbit/s

Type of electrical interface

DB44

Code pattern

HDB3 code

Signal bit rate at the output port

Compliant with ITU-T G.703

Permitted frequency deviation


at the input port
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Item

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Value

Allowed attenuation at the input


port
Input jitter tolerance

Mechanical Specifications
The mechanical specifications of the MD75 are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight: 0.5 kg

Power Consumption
The maximum power consumption of the MD75 at room temperature (25C) is 12 W.

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EoD Boards

About This Chapter


The OptiX OSN equipment supports the EoD (Ethernet over Dual Domains) board EDQ41,
which bridges Ethernet services between the TDM domain and packet domain.
9.1 EDQ41
This topic describes the version, application, functions, working principle, front panel, valid
slots, and technical specifications of the EDQ41 (4-port 622/155 Mbit/s SDH optical interface
Ethernet double domain multiple function processing board).

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9.1 EDQ41
This topic describes the version, application, functions, working principle, front panel, valid
slots, and technical specifications of the EDQ41 (4-port 622/155 Mbit/s SDH optical interface
Ethernet double domain multiple function processing board).

9.1.1 Version Description


The EDQ41 is available in one functional version, namely, N1.

9.1.2 Application
The EDQ41 is mainly used for interoperation between the SDH network and the packet network.
The board converges the TDM signals and Ethernet packets from the SDH access network and
deconverges the TDM signals to the SDH ring and the Ethernet packets to the packet ring. In
this manner, the board achieves the interoperation between the TDM domain and the packet
domain, facilitating the smooth evolution of the network.
Figure 9-1 shows the typical networking and application of the EDQ41.
Figure 9-1 Networking and application of the EDQ41

RNC

BSC

STM-16/STM-64 ring

10GE ring

E1

GE ring

FE
FE
STM-1/STM-4 ring

Issue 03 (2013-02-20)

Networking in the
TDM domain

Networking in the
packet domain

TDM traffic direction

Packet traffic direction

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The EDQ41 is applicable in four typical networking scenarios. Figure 9-2 shows the service
signal flow in each application scenario.
l

Application 1: The EDQ41 receives EoS services from other NEs and then converts the
EoS services to packet services, therefore implementing transition from the STM-1/STM-4
SDH network to the GE/10GE packet network.

Application 2: The EDQ41 receives EoS services from line boards on the same NE and
then converts the EoS services to packet services, therefore implementing transition from
the SDH network to the GE/10GE packet network.

Application 3: The EDQ41 board receives SDH services (including SDH services and EoS
services) from SDH line board, processes and then distributes the services to GE/10GE
packet networks and STM-1/STM-4 SDH networks.

Application 4: The EDQ41 board receives SDH services (including pure SDH services and
EoS services) from SDH line boards, processes and then sends the services directly to the
SDH network. In this case, the EDQ41 board functions like an SDH line board.
NOTE

The EDQ41 supports the maximum processing capacity of 2.5 Gbit/s. Therefore, only 2.5 Gbit/s services
of the services received from STM-N (1N64) line boards can be processed and sent to the packet network.

Figure 9-2 Service signal flow on the EDQ41


Application 2:

Application 1:
STM-1/STM-4
ring

EDQ41
borad

Packet
core

GE/10GE
ring

Packet
board

EDQ41
borad

TDM
core

Application 3:
STM-1/STM-4
ring

Packet
core

Packet
board

TDM
core

SDH
board

GE/10GE
ring

STM-N

Application 4:

EDQ41
borad

Packet
core

Packet
board

TDM
core

SDH
board

GE/10GE
ring

STM-1/STM-4
ring

STM-N

EDQ41
borad

Packet
core

Packet
board

TDM
core

SDH
board

STM-N

9.1.3 Functions and Features


The EDQ41 processes 4x155 Mbit/s or 4x622 Mbit/s SDH services and 2.5 Gbit/s EoS services
at the same time.
As a dual-domain board, the EDQ41 is applicable in the case of SDH services, packet services,
and EoS services. Table 9-1, Table 9-2, and Table 9-3 provide the functions and features of the
EDQ41 in each service application scenario.
Table 9-1 Functions and features of the EDQ41

Issue 03 (2013-02-20)

Function and
Feature

Description

Basic functions

Transmits and receives 4xSTM-1/STM-4 optical signals.

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Function and
Feature

Description

Specifications of the
interface

l The STM-1 or STM-4 optical module can be used.

9 EoD Boards

l When the STM-1 optical module is used, the standard S-1.1, L-1.1,
and L-1.2 optical interfaces are supported. The optical interfaces
comply with ITU-T G.957.
l When the STM-4 optical module is used, the standard S-4.1, L-4.1,
L-4.2, and Ve-4.2 optical interfaces are supported. The optical
interfaces of the S-4.1, L-4.1, and L-4.2 types comply with ITUT G.957. The optical interface of the Ve-4.2 type complies with
the standards defined by Huawei.

Specifications of
optical modules

l Supports the detection and query of the information about optical


modules.
l Supports the usage and detection of SFP pluggable optical
modules, facilitating the maintenance of optical modules.
l Provides the ALS function. The optical interface supports the
function of setting the on/off state of a laser.

Service processing

l Supports VC-12/VC-3/VC-4 services when the STM-1 optical


module is used.
l Supports VC-12/VC-3/VC-4/VC-4-4c services when the STM-4
optical module is used.

Overhead processing

l Processes the section overheads of STM-4/STM-1 signals.


l Processes path overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports the ECC communication.

Loopback function

l Supports inloops and outloops at optical interfaces.


l Supports inloops and outloops at the VC-4 level.

Alarms and
performance events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection scheme

l Supports Two-fiber ring MSP.


l Supports Four-fiber ring MSP.
l Supports Linear MSP.
l Supports SNCP.
l Supports SNCMP.
l Supports SNCTP.
l Supports fiber-shared virtual trail protection.

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Function and
Feature

Description

Maintenance
features

l Supports the warm reset and cold reset. A warm reset does not
affect services.
l Supports the PRBS function in the line direction and cross-connect
direction.
l Supports the alarm detection function and reports various alarms
and performance events, which facilitates the management and
maintenance of the equipment.

Table 9-2 Packet features of the EDQ41

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Function
and
Feature

Description

Basic
functions

Bridges a maximum of 2.5 Gbit/s EoS services to the packet domain.

Format of
service
frames

l Supports the encapsulation in IEEE 802.3 format, Ethernet II format, or IEEE


802.1q/p format.

Maximum
uplink
bandwidth

2.5 Gbit/s

MTU

MTU for ports

Supports the query of the MTUs


specified for ports but does not support
MTU setting. The default MTU
specified for ports is 9000 bytes.

MTU for services

Supports the setting of the packet


length, which ranges from 64 bytes to
9000 bytes.

l Supports the Jumbo frame with a length not more than 9000 bytes.

Type of
Ethernet
services

l Supports point-to-point E-Line services.

HQoS

Supports the UNI port policy.

LAG

Supports VCG-side manual load non-sharing LAG protection.

Protection
scheme

l Supports LAG.

Maintenan
ce features

l Supports the performance statistics and report of VCTRUNKs.

l Supports multipoint-to-multipoint E-LAN services.

l Supports MC-LAG.

l Supports the query and report of alarms.

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Function
and
Feature

Description

ETH
OAM

Not supported.

MSTP

Not supported.

IGMP
Snooping

Not supported.

Number of
supported
E-Line
services

l When working with the N4GSCC: 4k

Number of
supported
E-LAN
services

1k

9 EoD Boards

NOTE
The board does not support creation of maintenance points but supports transparent
transmission of ETH OAM packets.

l When working with the N6GSCC: 8k

Table 9-3 EoS data features of the EDQ41

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Function and
Feature

EDQ41

Basic function

Supports transparent transmission of Ethernet services.

Encapsulation
format

Supports the GFP-F protocol.

EPL

Supports transparent transmission of PORT-based EPL services.

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Function and
Feature

EDQ41

Number of
VCTRUNKs

Binds a maximum of 63 VCTRUNKs, equivalent to 504 VC-12s, 48


VC-3s, or 16 VC-4s.
Configuration features:
l The first eight VC-4s (including VC-3s and VC-12s in the VC-4s)
and the last eight VC-4s (including VC-3s and VC-12s in the
VC-4s) cannot be bound to the same VCTRUNK.
l Only 5th to 8th and the 13th to 16th VC-4s can bind VC-12 paths.
In addition, VC-12s in the 5th to 8th VC-4s cannot be bound to the
same VCTRUNK as the VC-12s in the 13th to 16th VC-4s.
l VC-3 and VC-4 signals can be bound to any of the 1st to 16th
VC-4s.
l VCTRUNK1 to VCTRUNK63 can be bound to any of the 1st to
16th VC-4s.
l VCTRUNK1 to VCTRUNK8 each can be bound to a maximum
of eight VC-4s. VCTRUNK9 to VCTRUNK63 each can be bound
to a maximum of one VC-4, three VC-3s, or 63 VC-12s.
l A VC-4 cannot bind VC-3 and VC-12 paths at the same time.

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

Test frames

Supports the transmitting and receiving of GFP test frames or Ethernet


test frames.

9.1.4 Working Principle and Signal Flow


The EDQ41 consists of network processing module, encapsulation/mapping and SDH overhead
processing module, clock module, logic control module, O/E converting module, SDH overhead
processing module, and power module.
Figure 9-3 shows the functional block diagram of the EDQ41.

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Figure 9-3 Functional block diagram of the EDQ41


Backplane
Packet
switching unit
Encapsulation/
mapping and
SDH overhead
processing
module

Network
processing
module

Communication unit
Clock
module

Logic control
module
Reference clock and
frame header unit

O/E
converting
module

4xSTM1/STM-4

+3.3 V

SCC
SCC

SDH crossconnect unit


(pure SDH
services)

SDH
overhead
processing
module

Power
module

SDH crossconnect unit


(EoS services)

Power
module

Fuse

-48 V/-60 V
-48 V/-60 V

Services in the SDH Domain


l

In the transmit direction: The O/E converting module converts the received STM-1/STM-4
optical signals into electrical signals and sends the electrical signals to the SDH overhead
processing module. Then, the SDH overhead processing module extracts and processes the
overheads, converts the signals into a format that applies to the backplane bus, and then
sends the signals to the SDH cross-connect unit.

In the receive direction: The SDH overhead processing module inserts overhead bytes into
the electrical signals from the SDH cross-connect unit, and sends the electrical signals to
the E/O converting module. The E/O converting module converts the STM-1/STM-4
electrical signals into optical signals, and then sends the optical signal to fibers for
transmission.

Services Transmitted from the SDH Domain to the Packet Domain


The mapping module demaps the signals from the SDH cross-connect module and compensates
the delay of virtual concatenation. The mapping module decapsulates the packets through
alignment and sends the data to the network processing module. The network processing module
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processes the data according to service types and configuration requirements, and then sends
Ethernet services to the packet switching unit.

Services Transmitted from the Packet Domain to the SDH Domain


The network processing module processes the Ethernet services from the packet switching unit,
and then sends the services to the mapping module. The mapping module encapsulates the
Ethernet services in LAPS or GFP format and concatenates the services. Then, the mapping unit
converts the Ethernet services into STM-16 signals and sends the signals to the SDH crossconnect unit.

Network Processing Module


The network processing module performs the functions at the MAC layer, including code
conversion, Ethernet packet framing, CRC check, and Ethernet performance statistics. In
addition, the network processing module classifies the services according to service types and
configuration requirements. Then, the module encapsulates or decapsulates frames. The module
supports the Ethernet/VLAN encapsulation formats.
The module supports the following functions:
l

Traffic detection and traffic classification

Unicast, multicast, and broadcast of flows

Priorities of data

Weighted fair queuing (WFQ) scheduling

Three service classes

Encapsulation/Mapping and SDH Overhead Processing Module


The encapsulation/mapping and SDH overhead processing module performs encapsulation/
mapping functions and processes SDH overheads.
l

In the upstream direction, the mapping module encapsulates Ethernet signals in LAPS,
GFP-F, or HDLC format and then performs concatenation. The module supports LCAS.
Then, the mapping module converts Ethernet signals into SDH signals.

In the downstream direction, the mapping module demaps SDH signals and compensates
the delay of virtual concatenation. The mapping module decapsulates packets accordingly
through the alignment operation. The decapsulated data is finally transmitted to the network
processing module.

Logic Control Module


The logic control module is connected to external circuits through the bus. The logic control
module performs the following functions:
l

Manages and configures the other modules on the local board.

Implements inter-board communication through the internal Ethernet interface.

O/E Converting Module


l

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In the receive direction, the O/E converting unit converts the received optical signals into
electrical signals.
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In the transmit direction, the O/E converting unit converts the received electrical signals
into SDH optical signals and transmits the optical signals to optical fibers.

This module also detects the R_LOS alarm and provides the ALS function.

SDH Overhead Processing Module


The SDH overhead processing module includes the RST, MST, MSA, and HPT sub-modules.
This module provides the inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the RSOH. That is, the RST
sub-module detects the frame alignment bytes (A1 and A2), descrambles all the bytes
except the first row of the RSOH, restores and checks the J0 byte, and checks the B1
byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first row of the RSOH.

MST sub-module
In the receive direction, the MST sub-module terminates the MSOH. That is, the MST
sub-module generates the MS_AIS or MS_RDI alarm after detecting the K2 byte. In
addition, the sub-module generates the B2_SD or B2_EXC alarm after checking the B2
byte and sends the MS_REI alarm to the opposite end.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves AUGs, divides an AUG
into N AU-4s, detects the AU_LOP and AU_AIS alarms, and performs pointer
justifications.
In the transmit direction, the MSA sub-module adds the AU-PTR to a VC-4 to generate
an AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the POH. That is, the HPT submodule sends the HP_REI alarm to the opposite end after detecting byte B3. In addition,
the sub-module generates the HP_TIM and HP_SLM alarms, and sends the HP_RDI
alarm to the opposite end after detecting bytes J1 and C2 (the sub-module also generates
the HP_UNEQ alarm if it detects the VC-4 path unequipped).
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Clock Module
The clock module traces the system reference clock and generates the required working clock
for each chip.

Power Module
The power module converts the accessed DC voltage into the DC voltages that the modules of
the board require.
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9.1.5 Front Panel


The front panel of the EDQ41 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 9-4 shows the front panel of the EDQ41.
Figure 9-4 Front panel of the EDQ41

EDQ41
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

EDQ41

Indicators
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the indicators, see 24.2 Alarm Indicators on the Boards.
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Interfaces
The front panel of the EDQ41 has four optical interfaces. Table 9-4 lists the types and usage of
the optical interfaces of the EDQ41.
Table 9-4 Interfaces of the EDQ41
Interface

Type of Interface

Usage

IN1-IN4

LC (pluggable)

Receives the STM-1/STM-4 optical signals.

OUT1OUT4

LC (pluggable)

Transmits the STM-1/STM-4 optical signals.

9.1.6 Jumpers and DIP Switches


The EDQ41 does not have any jumpers or DIP switches for board settings.

9.1.7 Valid Slots


The EDQ41 must be installed in a valid slot in the subrack. Otherwise, the EDQ41 fails to work
normally.
EDQ41 can be housed in any of slots 4-8 and slots 11-14. The bandwidth of SDH services in all
slots is 2.5 Gbit/s, and the bandwidth of packet services in all slots is 2.5 Gbit/s.
NOTE

The EDQ41 cannot work with a cross-connect board whose logical board is configured as N1PSXCS.

9.1.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the EDQ41.
The feature code of the EDQ41 indicates the type of optical interface.
Table 9-5 provides the relationship between the feature code of the EDQ41 and types of optical
interfaces.
Table 9-5 Relationship between the feature code of the EDQ41 and types of optical interfaces

Issue 03 (2013-02-20)

Board

Feature Code

Type of Optical Interface

SSN1EDQ4103

03

S-1.1

SSN1EDQ4104

04

L-1.1

SSN1EDQ4105

05

L-1.2

SSN1EDQ4108

08

S-4.1

SSN1EDQ4109

09

L-4.1

SSN1EDQ4110

10

L-4.2

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Board

Feature Code

Type of Optical Interface

SSN1EDQ4111

11

Ve-4.2

SSN1EDQ4112

12

S-1.1x2/S-4.1x2a

a: Port 1 and port 2 operate at 622 Mbit/s, port 3 and port 4 operate at 155 Mbit/s.

9.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Add the ports. For details, see Querying and Configuring Ports on Boards.
Step 3 Required: Set the SDH interface.
l J0 byte: Generally, use the default value. The default value of the J0 byte to be sent is HuaWei
SBS and the default value of the J0 byte to be received is Disabled.
l J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 byte to be sent is HuaWei
SBS and the default value of the J1 byte to be received is Disabled.
l C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent. Set
the C2 byte according to the actual service type. Generally, use the default value, which is
TUG structure.
l Laser status: Set this parameter to Open when you configure and commission the board.
For details, see 28.7 Checking Board Parameters.
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NOTE

For more information about the parameters of the board, see 27.5 SDH Processing Boards.

Step 4 Optional: Create the protection subnet. For details, see Configuring the Protection Subnet.
Step 5 Required: Configure services. For details, see Configuring Cross-Domain Services.
Step 6 Optional: Configure the manual LAG. For details, see Configuring an Ethernet LAG.
Step 7 Optional: Configure test frames. For details, see Configuring Test Frames.
----End

Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing Specifications
of Optical Interfaces.
Step 2 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
Step 4 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the dual-domain services. For details, see Testing Cross-domain Services.
Step 2 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 3 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

9.1.10 Configuring the Board Functions


The EDQ41 supports the packet switching function and multiple Ethernet features, such as
HQoS, LAG, and LCAS. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EDQ41 by using the U2000:
l

HQoS

LAG

MC-LAG

LCAS

Test Frame

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9.1.11 Parameter Settings


You can set the parameters for the EDQ41 by using the U2000.
You can set the following parameters for the EDQ41 by using the U2000:

SDH Parameters
l

J0

J1

J2

C2

For the description of parameters, see 27.5 SDH Processing Boards.

Packet Data Parameters


l

VCTRUNK interfaces

For information about more parameters and the description of each parameter, see 27.1 Packet
Processing Boards.

EoS Parameters
l

Working mode

Enabling LCAS

Maximum frame length

Mapping protocol

For more parameters and the description of the parameters, see 27.4.2 Ethernet Parameters.

9.1.12 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also provides
the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 9-6 lists the faults that occur on the EDQ41 frequently and the troubleshooting methods.

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Table 9-6 Methods used to troubleshoot the faults that occur on the EDQ41 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

SDH service
interruption

l The optical fiber


or connector
becomes
abnormal.

See Service Interruption on a Board or a Port.

l An incorrect
operation is
performed.
l The types or
settings of the
boards are
inconsistent.
l The services on a
single Ethernet
port are
interrupted.

EoS service
interruption

See Interruption of an Ethernet Service.

l The services on
all the Ethernet
ports are
interrupted.
Transient EoS
service interruption

l The services on a
single Ethernet
port are
transiently
interrupted.

See Troubleshooting Transient Service


Interruptions.

l The protocol
becomes
abnormal.
Packet service fault

The packet Ethernet


services are faulty.

See Troubleshooting Packet Service


Interruptions.

Bit error

l The optical power


becomes
abnormal.

See Troubleshooting Bit Errors.

l The equipment
becomes faulty.
Pointer justification

l The clock
configuration is
incorrect.

See Troubleshooting Pointer Justification.

l The precision of
the external clock
source is very
low.

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Fault Symptom

Common Fault
Cause

Troubleshooting Method

Protection switching
failure

l The MSP
switching fails.

See Troubleshooting Protection Switching


Faults.

l The SNCP
switching fails.
l The clock
protection
switching fails.
l The MC-LAG
switching fails.
NEs being
unreachable to the
U2000

l A single NE
becomes
unreachable to
the U2000.

See Troubleshooting the NEs Being


Unreachable.

l All the NEs in a


subnet become
unreachable to
the U2000.
l An NE becomes
unreachable to
the U2000
frequently.
Equipment
interconnection fault

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EDQ41, see Replacing an EoD board.

9.1.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the NMS.

9.1.13.1 Alarms of N1EDQ41

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ALM_ALS

ALM_GFP_dCSF

ALM_GFP_dLFD

AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

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B3_EXC

B3_EXC_VC3

B3_EXC_VC4

B3_SD

B3_SD_VC3

B3_SD_VC4

BD_STATUS

BIP_EXC

BIP_SD

BUS_ERR

C2_PDI

C2_VCAIS

COMMUN_FAIL

DCN_FAIL

FCS_ERR

FSELECT_STG

HARD_BAD

HARD_ERR

HP_LOM

HP_REI

HP_SLM

HP_RDI

HP_UNEQ

IN_PWR_ABN

HP_TIM

IN_PWR_LOW

J0_MM

IN_PWR_HIGH

LAG_MEMBER_DOWN

LASER_MOD_ERR

LAG_DOWN

LCAS_FOPR

LCAS_FOPT

LASER_SHUT

LCAS_PLCT

LCAS_TLCR

LCAS_PLCR

LOOP_ALM

LP_RDI_VC12

LCAS_TLCT

LP_REI_VC12

LP_REI_VC3

LP_RDI_VC3

LP_SLM_VC3

LP_TIM_VC12

LP_SLM_VC12

LP_UNEQ_VC12

LP_UNEQ_VC3

LP_TIM_VC3

LSR_COOL_ALM

LSR_NO_FITED

LSR_BCM_ALM

MCLAG_CFG_MISMATCH

MCSP_PATH_LOCV

LSR_WILL_DIE

MS_AIS

MS_RDI

MOD_TYPE_MISMATCH

NO_BD_SOFT

NO_LSR_PARA_FILE

MS_REI

OUT_PWR_ABN

POWER_ABNORMAL

OH_LOOP

PS

R_LOC

R_LOF

R_LOS

SLAVE_WORKING

T_LOSEX

TEM_HA

TEM_LA

TEMP_OVER

TEST_STATUS

TF

TIME_NOT_SUPPORT

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_SQM_VC12

VCAT_SQM_VC3

WRG_BD_TYPE

MPLS_PW_OAMFAIL

MPLS_TUNNEL_OAMFAIL

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9.1.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the NMS.

9.1.14.1 Performance Events of N1EDQ41


Table 9-7 SDH

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LPBBE

LPES

LPSES

LPUAS

LPCSES

LPFEBBE

LPFEES

LPFESES

LPFEUAS

LPFECSES

CPUUSAGEMAX

CPUUSAGEMIN

CPUUSAGECUR

BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

VC3BBE

VC3ES

VC3SES

VC3UAS

VC3CSES

VC3FEBBE

VC3FEES

VC3FESES

VC3FECSES

VC3FEUAS

MEMUSAGEMAX

MEMUSAGEMIN

MEMUSAGECUR

RSBBE

RSES

RSSES

RSUAS

RSCSES

RSOOF

RSOFS

MSBBE

MSES

MSUAS

MSCSES

MSSES

MSFEBBE

MSFEES

MSFESES

MSFEUAS

MSFECSES

AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

HPFESES

HPFEUAS

HPFECSES

TLBMAX

TLBMIN

TLBCUR

OSPICCVMAX

OSPICCVMIN

OSPICCVCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

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OSPITMPCUR

Table 9-8 MPLS Tunnel OAM


MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

Table 9-9 Tunnel


TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TNL_BW_UTILISATION

TUNNEL_REVERSE_SND
PKTS

TUNNEL_REVERSE_SND
BYTES

TUNNEL_REVERSE_R
CVPKTS

TUNNEL_REVERSE_RCV
BYTES

TUNNEL_RX_BPS

TUNNEL_TX_BPS

TUNNEL_RX_PPS

TUNNEL_TX_PPS

TUNNEL_REVERSE_R
X_BPS

TUNNEL_REVERSE_TX_
BPS

TUNNEL_REVERSE_RX_P
PS

TUNNEL_REVERSE_T
X_PPS

Table 9-10 MPLS PW OAM


MPLS_PW_FLR

MPLS_PW_FL

MPLS_PW_FD

MPLS_PW_FDV

Table 9-11 PW
PW_RCVPKTS

PW_RCVBYTES

PW_SNDPKTS

PW_SNDBYTES

PW_BANDWIDTH_UTI
LISATION

PW_RX_BPS

PW_TX_BPS

PW_RX_PPS

PW_TX_PPS

Table 9-12 Statistics of RMON basic performance


ETHUNDER

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Table 9-13 Statistics of RMON extended performance


RXBGOOD

TXBGOOD

RXBBAD

TXBBAD

RXPKTS

TXPKTS

RXPPS

TXPPS

9.1.15 Technical Specifications


The technical specifications of the EDQ41 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Specifications of Optical Interfaces


The EDQ41 supports the STM-1/STM-4 optical modules.
Table 9-14 provides the specifications of STM-1 optical interfaces on the EDQ41.
Table 9-14 Specifications of STM-1 optical interfaces on the EDQ41
Item

Value

Nominal bit rate

155520 kbit/s

Line code

NRZ

Type of optical
interface

S-1.1

L-1.1

L-1.2

Type of Fiber

Single-mode LC

Single-mode LC

Single-mode LC

Transmission
distance (km)

2 to 15

15 to 40

40 to 80

Operating
wavelength range
(nm)

1261 to 1360

1263 to 1360

1480 to 1580

Launched optical
power range
(dBm)

-15 to -8

-5 to 0

-5 to 0

Receiver
sensitivity (dBm)

-28

-34

-34

Minimum
overload (dBm)

-8

-10

-10

Minimum
extinction ratio
(dB)

8.2

10

10

Table 9-15 provides the specifications specified for STM-4 optical interfaces on the EDQ41.
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Table 9-15 Specifications of STM-4 optical interfaces on the EDQ41


Item

Value

Nominal bit rate

622080 kbit/s

Line code

NRZ

Type of optical
interface

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

2 to 15

15 to 40

40 to 80

80 to 100

Operating wavelength
range (nm)

1274 to 1356

1280 to 1335

1480 to 1580

1480 to 1580

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Single-mode
LC

Launched optical
power range (dBm)

-15 to -8

-3 to -2

-3 to -2

-3 to -2

Receiver sensitivity
(dBm)

-28

-28

-28

-34

Minimum Overload
(dBm)

-8

-8

-8

-13

Minimum extinction
ratio (dB)

8.2

10

10

10.5

Mechanical Specifications
The mechanical specifications of the EDQ41 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight: 1.0 kg

Power Consumption
The maximum power consumption of the EDQ41 at room temperature (25C) is 70 W.

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10

SDH Boards

About This Chapter


This topic describes the SDH boards that operate at the STM-64, STM-16, STM-4, and STM-1
rates.
10.1 SL1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SL1 (1xSTM-1 optical interface board). This topic also describes
how to configure and commission the SL1.
10.2 SL1A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL1A (1xSTM-1 optical interface board).
10.3 SLQ1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ1 (4xSTM-1 optical interface board).
10.4 SLQ1A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ1A (4xSTM-1 optical interface board).
10.5 SLO1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLO1 (8xSTM-1 optical interface board).
10.6 SLT1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLT1 (12xSTM-1 optical interface board).
10.7 SLH1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLH1 (16xSTM-1 signal processing board). This topic also
describes how to configure and commission the SLH1.
10.8 SEP1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SEP1 (8xSTM-1 line processing board). This topic also describes
how to configure and commission the SEP1.
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10.9 SL4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL4 (1xSTM-4 optical interface board).
10.10 SL4A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL4A (1xSTM-4 optical interface board).
10.11 SLD4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLD4 (2xSTM-4 optical interface board).
10.12 SLD4A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLD4A (2xSTM-4 optical interface board).
10.13 SLQ4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ4 (4xSTM-4 optical interface board).
10.14 SLQ4A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ4A (4xSTM-4 optical interface board).
10.15 SL16
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL16 (1xSTM-16 optical interface board).
10.16 SL16A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SL16A (1xSTM-16 optical interface board). This topic also
describes how to configure and commission the SL16A.
10.17 SLD16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLD16 (2xSTM-16 optical interface board). This topic also
describes how to configure and commission the SLD16.
10.18 SLQ16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLQ16 (4xSTM-16 optical interface board). This topic also
describes how to configure and commission the SLQ16.
10.19 SLO16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLO16 (8xSTM-16 optical interface board). This topic also
describes how to configure and commission the SLO16.
10.20 SF16
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SF16 (1xSTM-16 optical interface board with the out-band FEC
function).
10.21 SL64
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SL64 (1xSTM-64 optical interface board). This topic also
describes how to configure and commission the SL64.
10.22 SLD64
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This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLD64 (2xSTM-64 optical interface board). This topic also
describes how to configure and commission the SLD64.
10.23 SF64
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SF64 (1xSTM-64 optical interface board with the FEC function).
This topic also describes how to configure and commission the SF64.
10.24 SF64A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SF64A (1xSTM-64 optical interface board with the FEC function).
10.25 SLQ41
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLQ41 (4xSTM-4/STM-1 optical interface board). This topic also
describes how to configure and commission the SLQ41.
10.26 SLH41
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLH41 (16xSTM-1/STM-4 optical interface board with the
variable rate). This topic also describes how to configure and commission the SLH41.
10.27 EU04
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the EU04 (4xSTM-1 electrical interface board).
10.28 EU08
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the EU08 (8xSTM-1 electrical interface board).
10.29 OU08
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the OU08 (8xSTM-1 optical interface board).

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10.1 SL1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SL1 (1xSTM-1 optical interface board). This topic also describes
how to configure and commission the SL1.

10.1.1 Version Description


The SL1 is available in several functional versions. The functions provided by the functional
versions are different.
The SL1 is available in the following functional versions: N1 and N2. The difference between
the functional versions is with regard to whether they support the tandem connection monitoring
(TCM) function and AU-3 services.
The N1SL1 is no longer manufactured.
Table 10-1 describes the versions of the SL1.
Table 10-1 Versions of the SL1
Item

Description

Functional versions

The SL1 is available in the following functional versions: N1 and N2.

Differences

l Service processing: AU-3 service processing.


l Maintenance features: loopbacks on VC-4 paths and TCM
function.

Substitution

Through the board version replacement function, the N1SL1A and


the N1SL1 can substitute each other.

NOTE

When you configure the multiplex section protection (MSP) or sub-network connection protection (SNCP),
you cannot configure the N1SL1 as the protection board if the working board is the N2SL1 on which the
TCM function is enabled or AU-3 services are configured. Otherwise, the services are interrupted when a
switching operation is performed.

10.1.2 Application
The SL1 is a line board. The SL1 can be used on the OptiX OSN equipment series to transmit
and receive STM-1 optical signals. The SL1 converts the received optical signals into electrical
signals and sends the electrical signals to the cross-connect side. In addition, the SL1 converts
the electrical signals sent from the cross-connect side into optical signals and transmits the optical
signals.
Figure 10-1 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.

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Figure 10-1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

NOTE

The SL1 does not support the two-fiber bidirectional ring MSP.

10.1.3 Functions and Features


The SL1 transmits and receives STM-1 optical signals, performs O/E conversion for the STM-1
optical signals, extracts and inserts overhead bytes, and generates alarm signals on the line.
Table 10-2 provides the functions and features of the SL1.
Table 10-2 Functions and features of the SL1
Function and
Feature

SL1

Basic functions

Transmits and receives 1xSTM-1 optical signals.

Specifications of
the optical
interface

l Supports different types of standard optical interfaces, namely, the I-1,


S-1.1, L-1.1, L-1.2, and Ve-1.2.
l The characteristics of the optical interfaces of the I-1, S-1.1, L-1.1, and
L-1.2 types comply with ITU-T G.957.
l The characteristics of the optical interface of the Ve-1.2 type comply
with the standards defined by Huawei.

Specifications of
the optical
module

l Supports the detection and query of the information about the optical
module.
l Supports the usage and detection of the small form-factor pluggable
(SFP) optical module, which facilitates the maintenance of the optical
module.
l Provides the automatic laser shutdown (ALS) function. The optical
interface supports the setting of the on/off state of a laser.

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Function and
Feature

SL1

Service
processing

l Supports the VC-12 services, VC-3 services, and VC-4 services.

Overhead
processing

l Processes the section overheads of the STM-1 signals.

l The N2SL1 supports the AU-3 services.

l Supports the transparent transmission and termination of the path


overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one channel of ECC communication.

Alarms and
performance
events

Provides various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

l Supports the Two-fiber ring MSP.


l Supports the Four-fiber ring MSP.
l Supports the Linear MSP.
l Supports the SNCP.
l Supports the SNCMP.
l Supports the SNCTP.

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l The N1SL1 supports inloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l The N2SL1 supports the TCM function.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

10.1.4 Working Principle and Signal Flow


The SL1 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-2 shows the functional block diagram of the SL1.

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Figure 10-2 Functional block diagram of the SL1


155 MHz

O/E
155 Mbit/s

E/O

SPI

155
Mbit/s CDR

E/O

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

....

O/E

Backplane
Reference clock
Cross-connect
unit

155 Mbit/s

....

155 Mbit/s

155
Mbit/s

155 MHz
PLL

RST MST MSA HPT

High-speed
bus

CDR
SPI

DCC

155 Mbit/s
SDH overhead
processing module

O/E converting
module

Frame header
Logic and
Communication
control module

IIC
LOS
Laser shutdown

+3.3 V
Power
module

Power
module

Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination CDR: clock data restoration

SDH: synchronous digital hierarchy

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

CDR Module
This module restores the clock signal.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

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MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.1.5 Front Panel


The front panel of the SL1 has indicators, interfaces, and a bar code.
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Diagram of the Front Panel


Figure 10-3 shows the appearance of the front panel of the SL1.
Figure 10-3 Front panel of the SL1

SL1
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1

SL1

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.


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Interfaces
The front panel of the SL1 has one optical interface. Table 10-3 describes the types and usage
of the optical interfaces of the SL1.
Table 10-3 Optical interfaces of the SL1
Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.1.6 Jumpers and DIP Switches


The SL1 does not have any jumpers or DIP switches that are used for board settings.

10.1.7 Valid Slots


The SL1 must be installed in a valid slot in the subrack. Otherwise, the SL1 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SL1 vary with the cross-connect capacity of the subrack. The slots valid
for the board are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the SL1 can be installed in slots 18 and
1117.

10.1.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL1 indicates the type of optical interface.
Table 10-4 provides the relationship between the feature code of the SL1 and the type of optical
interface.
Table 10-4 Relationship between the feature code of the SL1 and the type of optical interface

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Board

Feature Code

Type of Optical Interface

SSN1SL110 and
SSN2SL110

10

S-1.1

SSN1SL111 and
SSN2SL111

11

L-1.1

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Board

Feature Code

Type of Optical Interface

SSN1SL112 and
SSN2SL112

12

L-1.2

SSN1SL113 and
SSN2SL113

13

Ve-1.2

SSN1SL114 and
SSN2SL114

14

I-1

10.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the SDH interface.
l J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.
l J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.
l C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent. Set
the C2 byte according to the actual service type. Generally, use the default value, which is
TUG structure.
l Laser status: Set this parameter to Open when you configure and commission the board.
For details, see 28.7 Checking Board Parameters.
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NOTE

For the other parameters to be set, see 27.5 SDH Processing Boards.

Step 3 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
----End

Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing Specifications
of Optical Interfaces.
Step 2 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

10.1.10 Parameter Settings


You can set parameters for the SL1 by using the U2000.
You can set the following parameters for the SL1 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.1.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 10-5 lists the faults that occur on the SL1 frequently and the troubleshooting methods.
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NOTE

The SL1 uses the SFP optical module. When the SL1 operates and an abnormal alarm occurs on the optical
interface, check whether the optical module is properly installed. To check whether the optical module is
properly installed, you can re-seat the optical module.

Table 10-5 Methods used to troubleshoot the faults that occur on the SL1 frequently
Fault
Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The optical fiber or connector


becomes abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect operation is
performed.
l The types or settings of the
boards are inconsistent.
l The optical power becomes
abnormal.

Bit error

See Troubleshooting Bit Errors.

l The equipment becomes faulty.


l The clock configuration is
incorrect.

Pointer
justification

See Troubleshooting Pointer


Justification.

l The precision of the external


clock source is very low.
Protection
switching
failure

l The MSP switching fails.

NEs being
unreachable to
the U2000

l A single NE becomes
unreachable to the U2000.

l The SNCP switching fails.

See Troubleshooting Protection


Switching Faults.

l The clock protection switching


fails.
See Troubleshooting the NEs Being
Unreachable.

l All the NEs in a subnet become


unreachable to the U2000.
l An NE becomes unreachable to
the U2000 frequently.

Equipment
interconnection
fault

An SDH overhead interconnection


fault occurs.

See Troubleshooting Device


Interconnection Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SL1, see Replacing an SDH Board.

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10.1.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

10.1.12.1 Alarms of N1SL1

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ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_FAIL

C2_PDI

C2_VCAIS

FSELECT_STG

COMMUN_FAIL

FPGA_ABN

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LASER_MOD_ERR

IN_PWR_ABN

J0_MM

LP_RDI_VC12

LASER_SHUT

LOOP_ALM

LP_REI_VC3

LP_RDI_VC3

LP_REI_VC12

LP_TIM_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

LP_UNEQ_VC12

LSR_WILL_DIE

LSR_COOL_ALM

LSR_NO_FITED

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

R_LOF

POWER_ABNORMAL

OUT_PWR_ABN

SLAVE_WORKING

R_LOS

R_LOC

TEM_HA

SPARE_PATH_ALM

R_OOF

TF

TEM_LA

T_LOSEX

TU_AIS_VC3

TR_LOC

TEST_STATUS

W_R_FAIL

TU_LOP_VC12

TU_AIS_VC12

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

TU_LOP_VC3

TIME_NOT_SUPPORT

PS

PATCH_ERR

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

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10.1.12.2 Alarms of N2SL1

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ALM_ALS

ALM_AU3AIS

ALM_AU3B3OVER

ALM_AU3B3SD

ALM_AU3LOP

ALM_AU3RDI

ALM_AU3REI

ALM_AU3SLM

ALM_AU3TIM

ALM_AU3UNEQ

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_FAIL

C2_PDI

C2_VCAIS

FSELECT_STG

COMMUN_FAIL

FPGA_ABN

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LASER_MOD_ERR

IN_PWR_ABN

J0_MM

LP_RDI_VC12

LASER_SHUT

LOOP_ALM

LP_REI_VC3

LP_RDI_VC3

LP_REI_VC12

LP_TIM_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

LP_UNEQ_VC12

LSR_WILL_DIE

LSR_COOL_ALM

LSR_NO_FITED

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

R_LOF

POWER_ABNORMAL

OUT_PWR_ABN

SLAVE_WORKING

R_LOS

R_LOC

TC_DEG

SPARE_PATH_ALM

R_OOF

TC_LTC

TC_EXC

T_LOSEX

TC_RDI

TC_ODI

TC_INCAIS

TC_UNEQ

TC_REI

TC_OEI

TEST_STATUS

TEM_HA

TC_TIM

TU_AIS_VC12

TF

TEM_LA

TU_LOP_VC3

TU_AIS_VC3

TR_LOC

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PATCH_ERR

W_R_FAIL

TU_LOP_VC12

SWDL_PKG_NOBDSOFT

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

PS

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.1.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

10.1.13.1 Performance Events of N1SL1


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

RSOOF

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

10.1.13.2 Performance Events of N2SL2

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AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

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HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

RSOOF

RSSES

RSUAS

TCBBE

TCFEBBE

TCOBBE

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

10.1.14 Technical Specifications


The technical specifications of the SL1 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-6 lists the parameters specified for the optical interfaces of the SL1.
Table 10-6 Parameters specified for the optical interfaces of the SL1
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code
pattern

Non-return to zero (NRZ)

Application
code

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Single-mode LC Single-mode LC

Single-mode
LC

Single-mode LC

Single-mode LC

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Parameter

Value

Operating
wavelength
range (nm)

1260 to 1360

1261 to 1360

1263 to 1360

1480 to 1580

1480 to 1580

Launched
optical power
range (dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

-3 to 0

Receiver
sensitivity
(dBm)

-23

-28

-34

-34

-34

Minimum
overload (dBm)

-8

-8

-10

-10

-10

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1SL1 and N2SL1 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight of the N1SL1 (kg): 0.6

Weight of the N2SL1 (kg): 1.0

Power Consumption
The maximum power consumption of the N1SL1 at room temperature (25C) is 17 W.
The maximum power consumption of the N2SL1 at room temperature (25C) is 14 W.

10.2 SL1A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL1A (1xSTM-1 optical interface board).
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10.2.1 Version Description


The SL1A is available in one functional version, namely, N1.
Through the board version replacement function, the N1SL1 and the N1SL1A can substitute
each other.

10.2.2 Application
The SL1A is a line board. The SL1A can be used on the OptiX OSN equipment series to transmit
and receive STM-1 optical signals. The SL1A converts the received optical signals into electrical
signals and sends the electrical signals to the cross-connect side. In addition, the SL1A converts
the electrical signals sent from the cross-connect side into optical signals and transmits the optical
signals.
Figure 10-4 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-4 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.2.3 Functions and Features


The SL1A transmits and receives STM-1 optical signals, performs O/E conversion for the
STM-1 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-7 provides the functions and features of the SL1A.
Table 10-7 Functions and features of the SL1A

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Function and
Feature

SL1A

Basic functions

Transmits and receives 1xSTM-1 optical signals.

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Function and
Feature

SL1A

Specifications of
the optical
interface

l Supports different types of standard optical interfaces, namely, the I-1,


S-1.1, L-1.1, L-1.2, and Ve-1.2.
l The characteristics of the optical interfaces of the I-1, S-1.1, L-1.1, and
L-1.2 types comply with ITU-T G.957.
l The characteristics of the optical interface of the Ve-1.2 type comply
with the standards defined by Huawei.

Specifications of
the optical
module

l Supports the detection and query of the information about the optical
module.
l Supports the usage and detection of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.
l Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.

Service
processing

Supports the VC-12 services, VC-3 services, and VC-4 services.

Overhead
processing

l Processes the section overheads of the STM-1 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one channel of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP, SNCP,
SNCTP, and SNCMP.

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l Supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

10.2.4 Working Principle and Signal Flow


The SL1A consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-5 shows the functional block diagram of the SL1A.
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Figure 10-5 Functional block diagram of the SL1A


155 MHz

O/E
155 Mbit/s

E/O

SPI

155
Mbit/s CDR

E/O

K1 and K2
insertion/extraction

RST MST MSA HPT

CDR
SPI

K1 and K2
High-speed
bus

....

O/E

Backplane
Reference clock
Cross-connect
unit

155 Mbit/s

....

155 Mbit/s

155
Mbit/s

155 MHz
PLL

High-speed
bus
DCC

155 Mbit/s
SDH overhead
processing module

O/E converting
module

Frame header
Logic and
Communication
control module

IIC
LOS
Laser shutdown

+3.3 V
Power
module

Power
module

Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

CDR Module
This module restores the clock signal.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

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MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.2.5 Front Panel


The front panel of the SL1A has indicators, interfaces, a bar code, and a laser safety class label.
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Diagram of the Front Panel


Figure 10-6 shows the appearance of the front panel of the SL1A.
Figure 10-6 Front panel of the SL1A

SL1A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1

SL1A

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.


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Interfaces
The front panel of the SL1A has one optical interface. Table 10-8 describes the types and usage
of the optical interfaces of the SL1A.
Table 10-8 Optical interfaces of the SL1A
Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.2.6 Valid Slots


The slots valid for the SL1A vary with the cross-connect capacity of the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SL1A are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the SL1A can be installed in slots 18 and
1117.

10.2.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL1A indicates the type of optical interface.
Table 10-9 provides the relationship between the feature code of the SL1A and the type of optical
interface.
Table 10-9 Relationship between the feature code of the SL1A and the type of optical interface

Issue 03 (2013-02-20)

Board

Feature Code

Type of Optical Interface

SSN1SL1A10

10

S-1.1

SSN1SL1A11

11

L-1.1

SSN1SL1A12

12

L-1.2

SSN1SL1A13

13

Ve-1.2

SSN1SL1A14

14

I-1

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10.2.8 Parameter Settings


You can set the parameters for the SL1A by using the U2000.
You can set the following parameters for the SL1A by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.2.9 Technical Specifications


The technical specifications of the SL1A include the parameters specified for optical interfaces,
laster safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-10 lists the parameters specified for the optical interfaces of the SL1A.
Table 10-10 Parameters specified for the optical interfaces of the SL1A

Issue 03 (2013-02-20)

Parameter

Value

Nominal bit
rate

155520 kbit/s

Line code
pattern

NRZ

Application
code

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Transmissio
n distance
(km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Single-mode
LC

Single-mode
LC

Operating
wavelength
range (nm)

1260 to 1360

1261 to 1360

1263 to 1360 1480 to 1580

1480 to 1580

Launched
optical
power range
(dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

-3 to 0

Receiver
sensitivity
(dBm)

-23

-28

-34

-34

-34

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Parameter

Value

Minimum
overload
(dBm)

-8

-8

-10

-10

-10

Minimum
extinction
ratio (dB)

8.2

8.2

10

10

10

Maximum
-20 dB
spectral
width (nm)

Minimum
side mode
suppression
ratio (dB)

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL1A are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.6

Power Consumption
The maximum power consumption of the SL1A at room temperature (25C) is 17 W.

10.3 SLQ1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ1 (4xSTM-1 optical interface board).

10.3.1 Version Description


The SLQ1 is available in two functional versions, namely, N1 and N2. The difference between
the two versions is with regard to whether they support the TCM function and AU-3 services.
The N1SLQ1 is no longer manufactured.
Table 10-11 describes the versions of the SLQ1.

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Table 10-11 Versions of the SLQ1


Item

Description

Functional
versions

The SLQ1 is available in two functional versions, namely, N1 and N2.

Differences

l Service processing: AU-3 service processing.


l Maintenance features: loopbacks on VC-4 paths.

Substitution

Through the board version replacement function, the N3SLQ41 can


substitute for the N1SLQ1 and N2SLQ1 at the same line rate. The
N1SLQ1 and the N1SLQ1A can substitute each other.

NOTE

When you configure the MSP or SNCP, you cannot configure the N1SLQ1 as the protection board if the
working board is the N2SLQ1 on which the TCM function is enabled or AU-3 services are configured.
Otherwise, the services are interrupted when a switching operation is performed.

10.3.2 Application
The SLQ1 is a line board. The SLQ1 can be used on the OptiX OSN equipment series to transmit
and receive STM-1 optical signals. The SLQ1 converts the received optical signals into electrical
signals and sends the electrical signals to the cross-connect side. In addition, the SLQ1 converts
the electrical signals sent from the cross-connect side into optical signals and transmits the optical
signals.
Figure 10-7 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-7 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

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10.3.3 Functions and Features


The SLQ1 transmits and receives 4xSTM-1 optical signals, performs O/E conversion for the
STM-1 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-12 provides the functions and features of the SLQ1.
Table 10-12 Functions and features of the SLQ1
Function and
Feature

SLQ1

Basic functions

Transmits and receives 4xSTM-1 optical signals.

Specifications of l Supports different types of standard optical interfaces, namely, the I-1,
the optical
S-1.1, L-1.1, L-1.2, Ie-1, and Ve-1.2.
interface
l The characteristics of the optical interfaces of the I-1, S-1.1, L-1.1, and
L-1.2 types comply with ITU-T G.957.
l The characteristics of the optical interfaces of the Ie-1 and Ve-1.2 types
comply with the standards defined by Huawei.
Specifications of l Supports the detection and query of the information about the optical
the optical
module.
module
l Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.
l Supports the usage and detection of the SFP optical module, which
facilitates the maintenance of the optical module.
Service
processing

l Supports the VC-12 services, VC-3 services, and VC-4 services.

Overhead
processing

l Processes the section overheads of the STM-1 signals.

l The N2SLQ1 supports the AU-3 services.

l Supports the transparent transmission and termination of the path


overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one to four channels of ECC communication.

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Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP, SNCP,
SNCTP, and SNCMP.

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Function and
Feature

SLQ1

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l The N1SLQ1 supports inloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l The N2SLQ1 supports the TCM function.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

10.3.4 Working Principle and Signal Flow


The SLQ1 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-8 shows the functional block diagram of the SLQ1.
Figure 10-8 Functional block diagram of the SLQ1
155 MHz

O/E
155 Mbit/s

E/O

SPI

O/E
E/O

155
Mbit/s

Backplane
Reference clock
Cross-connect
unit

K1 and K2
insertion/extraction

High-speed
bus
RST MST MSA HPT

CDR
SPI

K1 and K2

155 Mbit/s

....

....

155 Mbit/s

155
Mbit/s CDR

155 MHz
PLL

High-speed
bus
DCC

155 Mbit/s
SDH overhead
processing module

O/E converting
module

Frame header
Logic and
Communication
control module

IIC
LOS
Laser shutdown

+3.3 V
Power
module

Power
module

Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The functional modules of the STM-1 units are described as follows:


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O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

CDR Module
This module restores the clock signal.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.

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In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.3.5 Front Panel


The front panel of the SLQ1 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-9 shows the appearance of the front panel of the SLQ1.

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Figure 10-9 Front panel of the SLQ1

SLQ1
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ1

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SLQ1 has four optical interfaces. Table 10-13 describes the types and
usage of the optical interfaces of the SLQ1.
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Table 10-13 Optical interfaces of the SLQ1


Interface

Type of Interface

Usage

IN1-IN4

LC

Receives optical signals.

OUT1-OUT4

LC

Transmits optical signals.

10.3.6 Valid Slots


The slots valid for the SLQ1 vary with the cross-connect capacity of the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SLQ1 are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the SLQ1 can be installed in slots 18 and
1117 in the subrack.

10.3.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLQ1 indicates the type of optical interface.
Table 10-14 provides the relationship between the feature code of the SLQ1 and the type of
optical interface.
Table 10-14 Relationship between the feature code of the SLQ1 and the type of optical interface

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Board

Feature Code

Type of Optical Interface

SSN1SLQ110 and
SSN2SLQ110

10

S-1.1

SSN1SLQ111 and
SSN2SLQ111

11

L-1.1

SSN1SLQ112 and
SSN2SLQ112

12

L-1.2

SSN1SLQ113 and
SSN2SLQ113

13

Ve-1.2

SSN1SLQ114 and
SSN2SLQ114

14

I-1

SSN1SLQ115

15

Ie-1

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10.3.8 Parameter Settings


You can set the parameters for the SLQ1 by using the U2000.
You can set the following parameters for the SLQ1 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.3.9 Technical Specifications


The technical specifications of the SLQ1 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-15 lists the parameters specified for the optical interfaces of the SLQ1.
Table 10-15 Parameters specified for the optical interfaces of the SLQ1
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code
pattern

NRZ

Application
code

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Ie-1

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

0 to 2

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Single-mode
LC

Multi-mode LC

Operating
wavelength
range (nm)

1260 to
1360

1261 to 1360

1263 to
1360

1480 to
1580

1480 to 1580

1270 to 1380

Launched
optical power
range (dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

-3 to 0

-19 to -14

Receiver
sensitivity
(dBm)

-23

-28

-34

-34

-34

-30

Minimum
overload (dBm)

-8

-8

-10

-10

-10

-14

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Parameter

Value

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10

10

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1SLQ1 and N2SLQ1 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the N1SLQ1 at room temperature (25C) is 15 W.
The maximum power consumption of the N2SLQ1 at room temperature (25C) is 15 W.

10.4 SLQ1A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ1A (4xSTM-1 optical interface board).

10.4.1 Version Description


The SLQ1A is available in one functional version, namely, N1.
Through the board version replacement function, the N1SLQ1 and the N1SLQ1A can substitute
each other.

10.4.2 Application
The SLQ1A is a line board. The SLQ1A can be used on the OptiX OSN equipment series to
transmit and receive STM-1 optical signals. The SLQ1A converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
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SLQ1A converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-10 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-10 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.4.3 Functions and Features


The SLQ1A transmits and receives STM-1 optical signals, performs O/E conversion for the
STM-1 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-16 provides the functions and features of the SLQ1A.
Table 10-16 Functions and features of the SLQ1A
Function and
Feature

SLQ1A

Basic functions

Transmits and receives 4xSTM-1 optical signals.

Specifications of l Supports different types of standard optical interfaces, namely, the I-1,
the optical
S-1.1, L-1.1, L-1.2, Ie-1, and Ve-1.2.
interface
l The characteristics of the optical interfaces of the I-1, S-1.1, L-1.1, and
L-1.2 types comply with ITU-T G.957.
l The characteristics of the optical interfaces of the Ie-1 and Ve-1.2 types
comply with the standards defined by Huawei.

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Function and
Feature

10 SDH Boards

SLQ1A

Specifications of l Supports the detection and query of the information about the optical
the optical
module.
module
l Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.
l Supports the usage and detection of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.
Service
processing

Supports the VC-12 services, VC-3 services, and VC-4 services.

Overhead
processing

l Processes the section overheads of the STM-1 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one to four channels of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP, SNCP,
SNCTP, and SNCMP.

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l Supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

10.4.4 Working Principle and Signal Flow


The SLQ1A consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-11 shows the functional block diagram of the SLQ1A.

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Figure 10-11 Functional block diagram of the SLQ1A


155 MHz

155 Mbit/s
155 Mbit/s

O/E
E/O

S
P
I

155
Mbit/s

E/O

S
P
I

155
Mbit/s

CDR

Cross-connect unit

K1 and K2
Cross-connect unit

K1 and K2 insertion/extraction
High-speed
bus

....

155 Mbit/s

O/E

155
Mbit/s
155
Mbit/s

....

155 Mbit/s

CDR

Reference clock

155 MHz
PLL

RST

155
Mbit/s

MS
T

MS
A

HPT

High-speed
bus

155
Mbit/s

DCC
SDH overhead processing module

IIC
LOS
Laser shutdown

Logic and
control
module
+3.3 V

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit A

Cross-connect unit B
SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

DC/DC
converter

Fuse

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital hierarchy

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

+3.3 V

+3.3 V backup power

CDR: clock and data recovery

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

CDR Module
This module restores the clock signal.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.

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In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.
l

MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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10.4.5 Front Panel


The front panel of the SLQ1A has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-12 shows the appearance of the front panel of the SLQ1A.
Figure 10-12 Front panel of the SLQ1A

SLQ1A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ1A

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SLQ1A has four optical interfaces. Table 10-17 describes the types and
usage of the optical interfaces of the SLQ1A.
Table 10-17 Optical interfaces of the SLQ1A
Interface

Type of Interface

Usage

IN1IN4

LC

Receives optical signals.

OUT1OUT4

LC

Transmits optical signals.

10.4.6 Valid Slots


The slots valid for the SLQ1A vary with the cross-connect capacity of the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SLQ1A are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the SLQ1A can be installed in slots 18
and 1117 in the subrack.

10.4.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLQ1A indicates the type of optical interface.
Table 10-18 provides the relationship between the feature code of the SLQ1A and the type of
optical interface.
Table 10-18 Relationship between the feature code of the SLQ1A and the type of optical
interface

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Board

Feature Code

Type of Optical Interface

SSN1SLQ1A10

10

S-1.1

SSN1SLQ1A11

11

L-1.1

SSN1SLQ1A12

12

L-1.2

SSN1SLQ1A13

13

Ve-1.2

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Board

Feature Code

Type of Optical Interface

SSN1SLQ1A14

14

I-1

SSN1SLQ1A15

15

Ie-1

10.4.8 Parameter Settings


You can set the parameters for the SLQ1A by using the U2000.
You can set the following parameters for the SLQ1A by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.4.9 Technical Specifications


The technical specifications of the SLQ1A include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-19 lists the parameters specified for the optical interfaces of the SLQ1A.
Table 10-19 Parameters specified for the optical interfaces of the SLQ1A

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Parameter

Value

Nominal bit
rate

155520 kbit/s

Line code
pattern

NRZ

Application
code

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Ie-1

Transmissio
n distance
(km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

0 to 2

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Multi-mode
LC

Operating
wavelength
range (nm)

1260 to
1360

1261 to
1360

1263 to
1360

1480 to
1580

1480 to
1580

1270 to
1380

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Parameter

Value

Launched
optical
power range
(dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

-3 to 0

-19 to -14

Receiver
sensitivity
(dBm)

-23

-28

-34

-34

-34

-30

Minimum
overload
(dBm)

-8

-8

-10

-10

-10

-14

Minimum
extinction
ratio (dB)

8.2

8.2

10

10

10

10

Maximum
-20 dB
spectral
width (nm)

Minimum
side mode
suppression
ratio (dB)

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLQ1A are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the SLQ1A at room temperature (25C) is 15 W.

10.5 SLO1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLO1 (8xSTM-1 optical interface board).

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10.5.1 Version Description


The SLO1 is available in two functional versions, namely, N2 and N3. The difference between
the two versions is with regard to whether they support the TCM function and AU-3 services.
The N3SLO1 is discontinued.
Table 10-20 describes the versions of the SLO1.
Table 10-20 Versions of the SLO1
Item

Description

Functional
versions

The SLO1 is available in two functional versions, namely, N2 and N3.

Differences

l Service processing: AU-3 service processing.


l Maintenance features: loopbacks on VC-4 paths, TCM function, and
PRBS function.

Substitution

When the N2SLO1 is not configured with the TCM function and AU-3
services, the N3SLO1 can substitute for the N2SLO1.

NOTE

When you configure the MSP or SNCP, you cannot configure the N3SLO1 as the protection board if the
working board is the N2SLO1 on which the TCM function is enabled or AU-3 services are configured.
Otherwise, the services are interrupted when a switching operation is performed.

10.5.2 Application
The SLO1 is a line board. The SLO1 can be used on the OptiX OSN equipment series to transmit
and receive STM-1 optical signals. The SLO1 converts the received optical signals into electrical
signals and sends the electrical signals to the cross-connect side. In addition, the SLO1 converts
the electrical signals sent from the cross-connect side into optical signals and transmits the optical
signals.
Figure 10-13 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-13 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

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10.5.3 Functions and Features


The SLO1 transmits and receives 8xSTM-1 optical signals, performs O/E conversion for the
STM-1 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-21 provides the functions and features of the SLO1.
Table 10-21 Functions and features of the SLO1 board
Function and
Feature

SLO1

Basic functions

Receives and transmits 8xSTM-1 optical signals.

Specifications of
the optical interface

l Supports different types of standard optical interfaces, namely, the


I-1, S-1.1, L-1.1, L-1.2, and Ve-1.2.
l The characteristics of the optical interfaces of the I-1, S-1.1, L-1.1,
and L-1.2 types comply with ITU-T G.957.
l The characteristics of the optical interface of the Ve-1.2 type
comply with the standards defined by Huawei.

Specifications of
the optical module

l Supports the detection and query of the information about the


optical module.
l Provides the ALS function. The optical interface supports the
setting of the on/off state of a laser.
l Supports the usage and detection of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

Service processing

l Supports the VC-12 services, VC-3 services, and VC-4 services.


l The N2SLO1 supports the AU-3 services.
l Processes the section overheads of the STM-1 signals.

Overhead
processing

l Processes the path overheads.


l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one to eight channels of ECC communication.

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Alarms and
performance events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

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Function and
Feature

SLO1

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l The N3SLO1 supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not
affect services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l The N2SLO1 supports the TCM function.
l Supports the Cause by Cross function.
l The N3SLO1 also supports the PRBS function in the line direction
and cross-connect direction.
l Supports the press-to-collect function in fault data collection.

10.5.4 Working Principle and Signal Flow


The SLO1 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-14 shows the functional block diagram of the SLO1.
Figure 10-14 Functional block diagram of the SLO1
155 MHz

O/E
155 Mbit/s

E/O

SPI

O/E
E/O

155
Mbit/s

Backplane
Reference clock
Cross-connect
unit

K1 and K2
insertion/extraction

High-speed
bus
RST MST MSA HPT

CDR
SPI

K1 and K2

155 Mbit/s

....

....

155 Mbit/s

155
Mbit/s CDR

155 MHz
PLL

High-speed
bus
DCC

155 Mbit/s
SDH overhead
processing module

O/E converting
module

Frame header
Logic and
Communication
control module

IIC
LOS
Laser shutdown

+3.3 V
Power
module

Power
module

Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

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SDH: synchronous digital hierarchy

CDR: clock and data recovery

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O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

CDR Module
This module restores the clock signal.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after

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detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.5.5 Front Panel


The front panel of the SLO1 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-15 and Figure 10-16 show the appearance of the front panel of the SLO1.

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Figure 10-15 Front panel of the SLO1 (with level optical interfaces)

SLO1
STAT
ACT
PROG
SRV

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8
CLASS 1
LASER
PRODUCT

SLO1

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Figure 10-16 Front panel of the SLO1 (with slanting optical interfaces)
SLO1
STAT
ACT
PROG
SRV
CLASS 1
LASER
PRODUCT

TX1
RX1
TX2
RX2
TX3
RX3
TX4
RX4
TX5
RX5
TX6
RX6
TX7
RX7
TX8
RX8

SLO1

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SLO1 has eight optical interfaces. Table 10-22 describes the types and
usage of the optical interfaces of the SLO1.

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Table 10-22 Optical interfaces of the SLO1


Interface

Type of
Interface

Usage

IN1-IN8/RX1-RX8

LC

Receives optical signals.

OUT1-OUT8/TX1TX8

LC

Transmits optical signals.

CAUTION
For SLO1 boards with level optical interfaces, use optical attenuators only on the ODF side.

10.5.6 Valid Slots


The slots valid for the SLO1 vary with the cross-connect capacity of the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SLO1 are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the SLO1 can be installed in slots 18 and
1117. In this case, eight optical interfaces can be configured.

10.5.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLO1 indicates the type of optical interface.
Table 10-23 provides the relationship between the feature code of the SLO1 and the type of
optical interface.
Table 10-23 Relationship between the feature code of the SLO1 and the type of optical interface

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Board

Feature Code

Type of Optical interface

SSN2SLO110 and
SSN3SLO110

10

S-1.1

SSN2SLO111 and
SSN3SLO111

11

L-1.1

SSN2SLO112 and
SSN3SLO112

12

L-1.2

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Board

Feature Code

Type of Optical interface

SSN2SLO113 and
SSN3SLO113

13

Ve-1.2

SSN2SLO114 and
SSN3SLO114

14

I-1

10.5.8 Parameter Settings


You can set the parameters for the SLO1 by using the U2000.
You can set the following parameters for the SLO1 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.5.9 Technical Specifications


The technical specifications of the SLO1 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-24 lists the parameters specified for the optical interfaces of the SLO1.
Table 10-24 Parameters specified for the optical interfaces of the SLO1

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Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

NRZ

Application code

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Operating
wavelength range
(nm)

1261 to
1360

1261 to
1360

1263 to
1360

1480 to
1580

1480 to
1580

Launched optical
power range (dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

-3 to 0

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Parameter

Value

Receiver sensitivity
(dBm)

-23

-28

-34

-34

-34

Minimum overload
(dBm)

-8

-8

-10

-10

-10

Minimum extinction
ratio (dB)

8.2

8.2

10

10

10

Maximum -20 dB
spectral width (nm)

Minimum side mode suppression ratio


(dB)

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N2SLO1 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.1

The mechanical specifications of the N3SLO1 are as follows:


l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.2

Power Consumption
The maximum power consumption of the N2SLO1 at room temperature (25C) is 26 W.
The maximum power consumption of the N3SLO1 at room temperature (25C) is 20 W.

10.6 SLT1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLT1 (12xSTM-1 optical interface board).

10.6.1 Version Description


The SLT1 is available in one functional version, namely, N1.

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10.6.2 Application
The SLT1 is a line board. The SLT1 can be used on the OptiX OSN equipment series to transmit
and receive STM-1 optical signals. The SLT1 converts the received optical signals into electrical
signals and sends the electrical signals to the cross-connect side. In addition, the SLT1 converts
the electrical signals sent from the cross-connect side into optical signals and transmits the optical
signals.
Figure 10-17 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-17 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.6.3 Functions and Features


The SLT1 transmits and receives STM-1 optical signals, performs O/E conversion for the STM-1
optical signals, extracts and inserts overhead bytes, and generates alarm signals on the line.
Table 10-25 provides the functions and features of the SLT1.
Table 10-25 Functions and features of the SLT1
Function and
Feature

SLT1

Basic functions

Transmits and receives 12xSTM-1 optical signals.

Specifications of Supports S-1.1, L-1.1 and L-1.2 standard optical interfaces whose
the optical
characteristics comply with ITU-T G.957.
interface

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Function and
Feature

10 SDH Boards

SLT1

Specifications of l Supports the detection and query of the information about the optical
the optical
module.
module
l Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.
l Supports the usage and detection of the SFP optical module, which
facilitates the maintenance of the optical module.
Service
processing

Supports the VC-12 services, VC-3 services, and VC-4 services.

Overhead
processing

l Processes the section overheads of the STM-1 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one to twelve channels of ECC communication. Port 1 to port
8 support the ECC communication by using bytes D1D12. Port 9 to
port 12 support the ECC communication by using bytes D1D3.
l Supports the time synchronization feature and transmission of the time
information by using the section overhead bytes.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP, SNCP,
SNCTP, and SNCMP.

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l Supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

10.6.4 Working Principle and Signal Flow


The SLT1 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module. The external services are accessed by the
external interface boards EU08 and OU08. The EU08 is an electrical interface board and the
OU08 is an optical interface board.
Figure 10-18 shows the functional block diagram of the SLT1.
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Figure 10-18 Functional block diagram of the SLT1


155 MHz

O/E
155 Mbit/s

E/O

SPI

155
Mbit/s CDR

E/O

K1 and K2
insertion/extraction

RST MST MSA HPT

CDR
SPI

K1 and K2
High-speed
bus

....

O/E

Backplane
Reference clock
Cross-connect
unit

155 Mbit/s

....

155 Mbit/s

155
Mbit/s

155 MHz
PLL

High-speed
bus
DCC

155 Mbit/s
SDH overhead
processing module

O/E converting
module

Frame header
Logic and
Communication
control module

IIC
LOS
Laser shutdown

+3.3 V
Power
module

Power
module

Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

CDR Module
This module restores the clock signal.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

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MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.6.5 Front Panel


The front panel of the SLT1 has indicators, interfaces, a bar code, and a laser safety class label.
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Diagram of the Front Panel


Figure 10-19 shows the appearance of the front panel of the SLT1.
Figure 10-19 Front panel of the SLT1

SLT1
STAT
ACT
PROG
SRV

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8 OUT9 IN9 OUT10IN10OUT11IN11OUT12IN12
CLASS 1
LASER
PRODUCT

SLT1

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.


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Interfaces
The front panel of the SLT1 has 12 optical interfaces. Table 10-26 describes the types and usage
of the optical interfaces of the SLT1.
Table 10-26 Optical interfaces of the SLT1
Interface

Type of
Interface

Usage

IN1IN12

LC

Receives optical signals.

OUT1OUT12

LC

Transmits optical signals.

CAUTION
The optical interfaces of the SLT1 are level optical interfaces. Hence, use an optical attenuator
only on the ODF side.

10.6.6 Valid Slots


The slots valid for the SLT1 vary with the cross-connect capacity of the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

When the cross-connect capacity is 200 Gbit/s, the SLT1 can be installed in slots 18 and
1116. When the SLT1 is installed in slots 14, 15, and 16, one to eight optical interfaces
can be configured. When the SLT1 is installed in slots 58 and 1114, one to twelve optical
interfaces can be configured.

10.6.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLT1 indicates the type of optical interface.
Table 10-27 provides the relationship between the feature code of the SLT1 and the type of
optical interface.
Table 10-27 Relationship between the feature code of the SLT1 and the type of optical interface

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Board

Feature Code

Type of Optical interface

SSN1SLT123

23

S-1.1

SSN1SLT124

24

L-1.1

SSN1SLT125

25

L-1.2

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10.6.8 Parameter Settings


You can set the parameters for the SLT1 by using the U2000.
You can set the following parameters for the SLT1 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.6.9 Technical Specifications


The technical specifications of the SLT1 include the parameters specified for optical interfaces,
dimensions, weight, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-28 lists the parameters specified for the optical interfaces of the SLT1.
Table 10-28 Parameters specified for the optical interfaces of the SLT1

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Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

NRZ

Application code

S-1.1

L-1.1

L-1.2

Transmission distance (km)

2 to 15

15 to 40

40 to 80

Type of fiber

Single-mode LC

Single-mode LC

Single-mode LC

Operating wavelength range


(nm)

1261 to 1360

1263 to 1360

1480 to 1580

Launched optical power


range (dBm)

-15 to -8

-5 to 0

-5 to 0

Receiver sensitivity (dBm)

-28

-34

-34

Minimum overload (dBm)

-8

-10

-10

Minimum extinction ratio


(dB)

8.2

10

10

Maximum -20 dB spectral


width (nm)

Minimum side mode


suppression ratio (dB)

30

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Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLT1 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.3

Power Consumption
The maximum power consumption of the SLT1 at room temperature (25C) is 22 W.

10.7 SLH1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLH1 (16xSTM-1 signal processing board). This topic also
describes how to configure and commission the SLH1.

10.7.1 Version Description


The SLH1 is available in one functional version, namely, N1.

10.7.2 Application
The SLH1 is a line board. The SLH1 can be used on the OptiX OSN equipment series to transmit
and receive STM-1 optical/electrical signals. The SLH1 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side, or directly sends
the received electrical signals to the cross-connect side. In addition, the SLH1 converts the
electrical signals sent from the cross-connect side into optical signals and transmits the optical
signals.
Figure 10-20 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.

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Figure 10-20 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.7.3 Functions and Features


The SLH1 processes STM-1 optical and electrical signals.
Table 10-29 provides the functions and features of the SLH1.
Table 10-29 Functions and features of the SLH1
Function and
Feature

SLH1

Basic functions

Processes 16xSTM-1 signals.

Specifications of
the optical
module

l Supports the detection and query of the information about optical


modules.
l Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.
l Supports the usage and detection of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

Service
processing

Supports the VC-12 services, VC-3 services, and VC-4 services.

Overhead
processing

l Processes the section overheads of the STM-1 signals.


l Supports the transparent transmission and termination of the path
overheads. Supports the setting and query of the J0, J1, and C2 bytes.
l Supports one to sixteen channels of ECC communication. Port 1 to
port 8 support the ECC communication by using bytes D1-D12. Port
9 to port 16 support the ECC communication by using bytes D1-D3.

Alarms and
performance
events
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Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

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Function and
Feature

SLH1

Protection
schemes

l Supports the Two-fiber ring MSP.

10 SDH Boards

l Supports the Four-fiber ring MSP.


l Supports the Linear MSP.
l Supports the SNCP.
l Supports the SNCMP.
l Supports the SNCTP.
l Supports the TPS protection when used with the interface board and
the switching and bridging board.
l Supports inloops and outloops at optical interfaces.

Maintenance
features

l Supports inloops on VC-4 paths.


l Supports warm resets and cold resets. A warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

When the SLH1 works with different interface boards and electrical interface switching boards,
the access capabilities for the STM-1 signals are different. For details, refer to Table 10-30.
Table 10-30 Access capabilities of the SLH1 when the SLH1 works with different interface
boards and electrical interface switching boards
Interface Board

SLH1

None

The SLH1 cannot transmit/receive signals.

EU08

Transmits/Receives and processes 8-channel or 16-channel electrical


signals.

OU08

Transmits/Receives and processes 8-channel or 16-channel optical


signals.

EU08 + OU08

Transmits/Receives and processes 8-channel electrical signals and 8channel optical signals.

EU08 + TSB8

Transmits/Receives and processes 8-channel or 16-channel STM-1


electrical signals, and realizes the 1:N (N3) TPS protection.

10.7.4 Working Principle and Signal Flow


The SLH1 consists of the CDR module, SDH overhead processing module, logic and control
module, and power module. The external services are accessed by the external interface boards
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EU08 and OU08. The EU08 is an electrical interface board and the OU08 is an optical interface
board.
Figure 10-21 shows the functional block diagram of the SLH1 when the SLH1 works with the
EU08 by describing how to process 1xSTM-1 signals.
Figure 10-21 Functional block diagram of the SLH1 when the SLH1 works with the EU08
155 MHz
SPI

EU08
155 Mbit/s

Encode/
Decode

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

....

155 Mbit/s

Backplane
Reference clock
Cross-connect
unit

155 Mbit/s

CMI
Transformer

155
155
Mbit/s CDR Mbit/s

155 MHz
PLL

RST MST MSA HPT

CDR

High-speed
bus
DCC

155 Mbit/s

SDH overhead
processing module

Logic and
control module

LOS

+3.3 V
Power
module

Frame header
Communication
Fuse

Power
module

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination CDR: clock data restoration

SDH: synchronous digital hierarchy

Figure 10-22 shows the functional block diagram of the SLH1 when the SLH1 works with the
OU08 by describing how to process 1xSTM-1 signals.

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Figure 10-22 Functional block diagram of the SLH1 when the SLH1 works with the OU08
155 MHz
PLL

155 MHz
155
155
Mbit/s CDR Mbit/s

OU08
155 Mbit/s

K1 and K2
insertion/extraction

K1 and K2

155 Mbit/s

High-speed
bus

....

O/E
155 Mbit/s

Backplane
Reference clock
Cross-connect
unit

SPI

RST

MST MSA HPT

CDR

E/O

155 Mbit/s

High-speed
bus
DCC

SDH overhead
processing module

LOS
Laser shutdown

Frame header
Logic and
Communication
control module
+3.3 V

Power
module

Fuse

Power
module

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination CDR: clock data restoration

SDH: synchronous digital hierarchy

CDR Module
This module restores the clock signal.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.

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In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.
l

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.7.5 Front Panel


The front panel of the SLH1 has indicators and a bar code.

Diagram of the Front Panel


The front panel of the SLH1 does not have an interface. Hence, the SLH1 must be used with the
EU08 or OU08. Figure 10-23 shows the appearance of the front panel of the SLH1.

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Figure 10-23 Front panel of the SLH1

SLH1
STAT
ACT
PROG
SRV

SLH1

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

10.7.6 Jumpers and DIP Switches


The SLH1 does not have any jumpers or DIP switches that are used for board settings.

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10.7.7 Valid Slots


The SLH1 must be installed in a valid slot in the subrack. Otherwise, the SLH1 fails to work
normally.
The slots valid for the SLH1 vary with the cross-connect capacity of the subrack. The SLH1
needs to work with the OU08/EU08 and TSB8. The slots valid for the SLH1 are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the SLH1 can be installed in slots 25 and
1316.

10.7.8 Board Protection


The SLH1 supports the 1:N (N3) tributary protection switching (TPS) protection.

Protection Principle
The TPS protection is equipment-level protection. When the working board fails, the accessed
signals are switched to the protection board. Hence, complex network-level protection
operations such as the MSP and SNCP are not triggered. In addition, the reliability of the
equipment is enhanced.
The SLH1 can work with the EU08 and TSB8 to realize one 1:N (N3) TPS protection group
for 8xSTM-1 or 16xSTM-1 electrical signals. Figure 10-24 shows the TPS protection provided
by the SLH1.
Figure 10-24 TPS protection provided by the SLH1
Service signal

Service signal
Switching
control bus

Crossconnect and
timing board

Interface board N

Interface board

Working board N

Working board

Working board 1

Protection board

Interface board 1

Protection
switching board

Failed

Normal state
When each working board functions normally, the traffic signal is directly transmitted to
the corresponding working board through position 1 of the control switch on the interface
board.

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Switching state
When a working board detects a failure and requires the switching operation, the control
switch of the corresponding interface board switches from position 1 to position 2. At the
same time, the control switch of the protection switching board switches to the
corresponding position so that the protection board can protect the failed working board.
NOTE

TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing board.
Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

Hardware Configuration
Figure 10-25 shows the slot configuration for two 1:3 TPS protection groups for 16xSTM-1
signals of the SLH1.

EU08

PIU

PIU

S
L
O
T
3
2

S
L
O
T
3
3

S
L
O
T
3
4

S
L
O
T
3
5

S
L
O
T
3
6

S
L
O
T
3
7

AUX

EU08

S
L
O
T
3
1

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8
Working 2

S
L
O
T
1
1

Working 2

Working 1

S
L
O
T
1
0

FAN

Working 2

Working 1

S
L
O
T
9

XCS

S S S S
L L L L
O O O O
T T T T
5 6 7 8

XCS

S
L
O
T
4

Protection 1

FAN

S S S
L L L
O O O
T T T
1 2 3

Working 1

S
L
O
T
3
0

GSCC

TSB8
EU08
EU08
EU08
EU08

FAN

S
L
O
T
2
9

TSB8

S
L
O
T
2
8

TSB8

S
L
O
T
2
7

Protection 2

S
L
O
T
2
6

S
L
O
T
2
3

EU08
EU08

S
L
O
T
2
5

S
L
O
T
2
2

EU08
EU08

S
L
O
T
2
4

S
L
O
T
2
1

EU08

S
L
O
T
2
0

EU08

S
L
O
T
1
9

TSB8

Figure 10-25 Slot configuration for two 1:3 TPS protection groups of the SLH1

Fiber routing area

In Figure 10-25, the board in slot 2 protects the boards in slots 3-5. The board in slot 16 protects
the boards in slots 13-15.
Table 10-31 lists the slots for the SLH1, EU08, and TSB8.
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Table 10-31 Slots for the SLH1, EU08, and TSB8


Board

Protection Group 1

Protection Group 2

SLH1 (protection
board)

Slot 2

Slot 16

TSB8

Slots 19-20

Slots 35-36

SLH1 (working
board)

Slots 3-5

Slots 13-15

EU08

Slots 21-26

Slots 29-34

NOTE

When the equipment is configured for two 1:3 TPS protection groups for 8xSTM-1 signals of the SLH1,
the TSB8 and EU08 can be inserted only in the odd slots.

10.7.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the SDH interface.
l J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.
l J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.
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l C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent. Set
the C2 byte according to the actual service type. Generally, use the default value, which is
TUG structure.
l Laser status: Set this parameter to Open when you configure and commission the board.
For details, see 28.7 Checking Board Parameters.
NOTE

For the other parameters to be set, see 27.5 SDH Processing Boards.

Step 3 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
----End

Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing Specifications
of Optical Interfaces.
Step 2 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

10.7.10 Parameter Settings


You can set the parameters for the SLH1 by using the U2000.
You can set the following parameters for the SLH1 by using the U2000:
l

J0

J1

C2

For the description of each parameter, see 27 Parameter Settings.


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10.7.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 10-32 lists the faults that occur on the SLH1 frequently and the troubleshooting methods.
Table 10-32 Methods used to troubleshoot the faults that occur on the SLH1 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service interruption

l The optical fiber,


cable, or
connector
becomes
abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect
operation is
performed.
l The types or
settings of the
boards are
inconsistent.
l The optical power
becomes
abnormal.

Bit error

See Troubleshooting Bit Errors.

l The equipment
becomes faulty.
Pointer justification

l The clock
configuration is
incorrect.

See Troubleshooting Pointer Justification.

l The precision of
the external clock
source is very
low.
Protection switching
failure

l The MSP
switching fails.

See Troubleshooting Protection Switching


Faults.

l The SNCP
switching fails.
l The clock
protection
switching fails.

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Fault Symptom

Common Fault
Cause

Troubleshooting Method

NEs being
unreachable to the
U2000

l A single NE
becomes
unreachable to
the U2000.

See Troubleshooting the NEs Being


Unreachable.

l All the NEs in a


subnet become
unreachable to
the U2000.
l An NE becomes
unreachable to
the U2000
frequently.
Equipment
interconnection fault

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SLH1, see Replacing an SDH Board.

10.7.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

10.7.12.1 Alarms of N1SLH1(B)

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ALM_ALS

AU_LOP

AU_AIS

AU_CMM

B2_EXC

B1_EXC

B1_SD

B3_EXC_VC3

B2_SD

B3_EXC

BD_STATUS

B3_SD

B3_SD_VC3

BIP_SD

BIP8_ECC

BIP_EXC

C2_VCAIS

CHIP_FAIL

C2_PDI

FSELECT_STG

HP_LOM

COMMUN_FAIL

HP_REI

HP_SLM

HP_RDI

HP_UNEQ

IN_PWR_ABN

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HP_TIM

LASER_MOD_ERR

LASER_SHUT

J0_MM

LP_RDI_VC12

LP_RDI_VC3

LOOP_ALM

LP_REI_VC3

LP_SLM_VC12

LP_REI_VC12

LP_TIM_VC12

LP_TIM_VC3

LP_SLM_VC3

LP_UNEQ_VC3

LSR_COOL_ALM

LP_UNEQ_VC12

LSR_WILL_DIE

MS_AIS

LSR_NO_FITED

MS_REI

R_LOF

MS_RDI

NO_BD_SOFT

RELAY_FAIL

OH_LOOP

OUT_PWR_ABN

SUBCARD_ABN

POWER_ABNORMAL

R_LOC

TEM_LA

R_LOS

R_OOF

TPS_ALM

SLAVE_WORKING

SPARE_PATH_ALM

TU_AIS_VC3

T_LOSEX

TEM_HA

W_R_FAIL

TEST_STATUS

TF

PATCH_NOT_CONFIRM

TR_LOC

TU_AIS_VC12

MOD_TYPE_MISMATCH

TU_LOP_VC12

TU_LOP_VC3

SWDL_PKG_NOBDSOFT

PS

PATCH_ERR

PATCHFILE_NOTEXIST

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.7.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

10.7.13.1 Performance Events of N1SLH1(B)

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AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

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MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

RSOOF

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

10.7.14 Technical Specifications


The technical specifications of the SLH1 include the parameters specified for optical interfaces,
mechanical specifications, and power consumption.

Parameters Specified for Interfaces


The OU8 or EU08 provides interfaces for the SLH1. For the parameters specified for the
interfaces, see Technical Specifications of the EU08 and Technical Specifications of the OU08.

Mechanical Specifications
The mechanical specifications of the SLH1 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the SLH1 at room temperature (25C) is 27 W.

10.8 SEP1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SEP1 (8xSTM-1 line processing board). This topic also describes
how to configure and commission the SEP1.

10.8.1 Version Description


The SEP1 is available in one functional version, namely, N1.

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10.8.2 Application
The SEP1 is a line board. The SEP1 can be used on the OptiX OSN equipment series to transmit
and receive STM-1 optical/electrical signals. The SEP1 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side, or directly sends
the received electrical signals to the cross-connect side. In addition, the SEP1 converts the
electrical signals sent from the cross-connect side into optical signals and transmits the optical
signals.
Figure 10-26 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-26 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.8.3 Functions and Features


The SEP1 processes STM-1 signals. When the interfaces are available on the front panel of the
SEP1 (the logical board of the SEP1 is displayed as SEP1 on the U2000), the SEP1 processes
2xSTM-1 electrical signals. When the SEP1 is used with the interface board (the logical board
of the SEP1 is displayed as SEP on the U2000), the SEP1 processes 8xSTM-1 optical/electrical
signals or 4xSTM-1 electrical signals. The physical boards of the two types of logical boards
(SEP1 and SEP) are the SEP1. When the logical boards do not need to be differentiated, both
the SEP1 and SEP are defined as SEP1.
Table 10-33 provides the functions and features of the SEP1.
Table 10-33 Functions and features of the SEP1
Function and
Feature

SEP1

Basic functions

l Processes 2xSTM-1 signals when the interfaces are available on the


front panel.
l Processes 8xSTM-1 or 4xSTM-1 signals when the SEP1 works with
an interface board.

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Function and
Feature

SEP1

Service
processing

Supports the VC-12 services, VC-3 services, and VC-4 services.

Overhead
processing

l Processes the section overheads of the STM-1 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one or two channels of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

l Supports the Two-fiber ring MSP.


l Supports the Four-fiber ring MSP.
l Supports the Linear MSP.
l Supports the SNCP.
l Supports the SNCMP.
l Supports the SNCTP.
l Supports the TPS protection when used with the interface board and
the switching and bridging board.
l Supports inloops and outloops at optical interfaces.

Maintenance
features

l Supports inloops on VC-4 paths.


l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

When the SEP1 works with different interface boards and electrical interface switching boards,
the access capabilities for the STM-1 signals are different. For details, refer to Table 10-34.
Table 10-34 Access capabilities of the SEP1 when the SEP1 works with different interface
boards and electrical interface switching boards

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Interface Board

SEP1

None

Transmits/Receives and processes 2xSTM-1 electrical signals, but does


not support the TPS protection.

EU04

Transmits/Receives and processes 4xSTM-1 electrical signals.


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Interface Board

SEP1

EU08

Transmits/Receives and processes 8xSTM-1 electrical signals.

OU08

Transmits/Receives and processes 8xSTM-1 optical signals.

EU04 + TSB4

Transmits/Receives and processes 4xSTM-1 electrical signals, and


supports the TPS protection.

EU08 + TSB8

Transmits/Receives and processes 8xSTM-1 electrical signals, and


supports the TPS protection.

EU04 + TSB8

Transmits/Receives and processes 4xSTM-1 electrical signals, and


supports the TPS protection.

NOTE

One SEP1 can transmit/receive services from only one interface board. When the SEP1 works with an
interface board, the two interfaces on the front panel of the SEP1 are invalid.

10.8.4 Working Principle and Signal Flow


The SEP1 consists of the line interface module, CDR module, SDH overhead processing module,
logic and control module, and power module. The external services are accessed by the external
interface boards EU04//EU08/OU08. The EU04/EU08 is an electrical interface board and the
OU08 is an optical interface board.
Figure 10-27 shows the functional block diagram of the SEP1.
Figure 10-27 Functional block diagram of the SEP1
155 MHz
SPI
Port 1

155 Mbit/s

Port 2

CMI Encode/
Decode
Transformer

CMI

155 Mbit/s
155 Mbit/s

CDR

Transformer

Encode/
Decode

155
Mbit/s

K1 and K2
insertion/extraction

K1 and K2

155 Mbit/s

....

155 Mbit/s

NRZ

Backplane
Reference clock
Cross-connect
unit

155 MHz
PLL

NRZ CDR

High-speed
bus

155
Mbit/s

RST MST

MSA HPT

High-speed
bus
DCC

155 Mbit/s

SDH overhead
processing module

LOS

Frame header

Logic and
control module
+3.3 V
Power
module

Communication
Fuse

Power
module

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination CDR: clock data restoration

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Figure 10-28 shows the functional block diagram of the SEP when the SEP works with the
EU08. When the SEP works with the EU04, the function block diagram is the same except that
the number of signals accessed and processed by the SEP is different.
Figure 10-28 Functional block diagram of the SEP when the SEP works with the EU08
Backplane
155 MHz
PLL

Reference clock

K1 and K2
insertion/extraction

EU08

SPI

155 Mbit/s
CMI
Encode/
Port 1
Transformer
155 Mbit/s
Decode

155 Mbit/s
CDR
155 Mbit/s

155 Mbit/s
CMI
Port 8
Encode/
155 Mbit/s Transformer
Decode

CDR

155 Mbit/s

K1 and K2
High-speed
bus

RST MST MSA HPT

155 Mbit/s

High-speed
bus
DCC

SDH overhead
processing module

LOS

Logic and
control module
+3.3 V
Power
module

Frame header
Communication
Fuse

Power
module

Fuse

Cross-connect
unit

Cross-connect
unit

Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination CDR: clock data restoration

SDH: synchronous digital hierarchy

Figure 10-29 shows the functional block diagram of the SEP when the SEP works with the
OU08.

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Figure 10-29 Functional block diagram of the SEP when the SEP works with the OU08
Backplane
155 MHz
PLL

155 OU08
Mbit/s
O/E
155
Port 1 Mbit/s
E/O
155
Mbit/s O/E
Port 8 155
Mbit/s E/O

Reference clock

K1 and K2
insertion/extraction
NRZ
SP
I
NRZ

155
Mbit/s
CDR
155 Mbit/s
155
Mbit/s
CDR
155 Mbit/s

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

LOS
Laser shutdown

Logic and
control module
+3.3 V

Power
module

Power
module

Frame header
Communication
Fuse

Cross-connect
unit

Cross-connect
unit

Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination CDR: clock data restoration

SDH: synchronous digital hierarchy

NOTE

If the SEP works with the OU08 that uses electrical modules, it works in the same way as it does when it
works with the EU08.

Line Interface Module and CDR Module


l

In the receive direction, the received electrical signals (CMI codes) are isolated through
the converter and then transmitted to the decoding unit. The CDR module restores the clock
signals after decoding.

In the transmit direction, the SDH signals, which are processed by the SDH overhead
processing module, are transmitted to the encoding unit. The converter isolates the 155
Mbit/s electrical signals (CMI codes) and sends the signals. The encoding and decoding
units monitor R_LOS alarms.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1

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and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.
l

MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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10.8.5 Front Panel


The front panel of the SEP1 has indicators, interfaces, and a bar code.

Diagram of the Front Panel


Figure 10-30 shows the appearance of the front panel of the SEP1.
Figure 10-30 Front panel of the SEP1

SEP1
STAT
ACT
PROG
SRV

AOUT
AIN
BOUT
BIN

SEP1

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SEP1 has two pairs of electrical interfaces. Table 10-35 describes the
types and usage of the electrical interfaces of the SEP1.
Table 10-35 Electrical interfaces of the SEP1
Interface

Type of Interface

Usage

AINBIN

75-ohm SMB

Receives the STM-1 signals.

AOUTBOUT

75-ohm SMB

Transmits the STM-1 signals.

Note: The SEP1 can be used with the interface board EU04, EU08, or OU08. In this case, the
SEP1 is defined as SEP. When the SEP1 is used with the interface board, the two interfaces
on the front panel are invalid.

10.8.6 Jumpers and DIP Switches


The SEP1 does not have any jumpers or DIP switches that are used for board settings.

10.8.7 Valid Slots


The SEP1 must be installed in a valid slot in the subrack. Otherwise, the SEP1 cannot work
normally.
NOTE

When the SEP1 is used with the interface board, the logical board of the SEP1 is displayed as SEP on the
U2000.

The slots valid for the SEP1 are as follows:


l

When the SEP1 is connected to cables by using the interfaces on its front panel, the SEP1
can be installed in slots 16 and 1316 in the subrack.

When the SEP1 is used with the interface board, the SEP1 can be installed in slots 25 and
1316 in the subrack.

10.8.8 Board Protection


The TPS protection is equipment-level protection. When the working board fails, the accessed
services are switched to the protection board. Hence, complex network-level protection
operations such as the MSP and SNCP are not triggered. In addition, the reliability of the
equipment is enhanced.
NOTE

When the SEP1 is used with the interface board, the logical board of the SEP1 is displayed as SEP on the
U2000.

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Protection Principle
The SEP can work with the EU08 and TSB8 to provide two 1:N (N3) TPS protection groups
for 8xSTM-1 electrical signals.
The SEP can also work with the EU04 and TSB4 to provide two 1:N (N3) TPS protection
groups for 4xSTM-1 electrical signals.
When the SEP works with the EU08 and TSB8 to realize the TPS protection, the protection
principle and valid slots of the involved boards are the same as the protection principle and valid
slots of the involved boards when the SEP works with the EU04 and TSB4 to realize the TPS
protection. Figure 10-31 shows the TPS protection provided by the SEP.
Figure 10-31 TPS protection provided by the SEP
Service signal

Service signal
Switching
control bus

Crossconnect and
timing board

Interface board N

Interface board

Working board N

Working board

Working board 1

Protection board

Interface board 1

Protection
switching board

Failed

Normal state
When each working board functions normally, the traffic signal is directly transmitted to
the corresponding working board through position 1 of the control switch on the interface
board.

Switching state
When a working board detects a failure and requires the switching operation, the control
switch of the corresponding interface board switches from position 1 to position 2. At the
same time, the control switch of the protection switching board switches to the
corresponding position so that the protection board can protect the failed working board.
NOTE

TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing board.
Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

Hardware Configuration
Figure 10-32 shows the slot configuration for the two 1:3 TPS protection groups of the SEP.
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FAN

S
L
O
T
3
1

S
L
O
T
3
2

S
L
O
T
3
3

S
L
O
T
3
4

S
L
O
T
3
5

S
L
O
T
1
0

Working 1

Working 1

XCS

XCS

S
L
O
T
1
1

S
L
O
T
1
2

S
L
O
T
3
7

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8
Working 2

S
L
O
T
9

Working 2

S S S S
L L L L
O O O O
T T T T
5 6 7 8

S
L
O
T
3
6

FAN

Working 2

S
L
O
T
4

Protection 1

FAN

S S S
L L L
O O O
T T T
1 2 3

Working 1

S
L
O
T
3
0

AUX

S
L
O
T
2
9

GSCC

S
L
O
T
2
8

TSB8

S
L
O
T
2
7

Protection 2

S
L
O
T
2
6

EU08

S
L
O
T
2
5

EU08

EU08

S
L
O
T
2
4

EU08

S
L
O
T
2
3

PIU

S
L
O
T
2
2

EU08

S
L
O
T
2
1

EU08

S
L
O
T
2
0

TSB8

S
L
O
T
1
9

PIU

Figure 10-32 Slot configuration for the two 1:3 TPS protection groups of the SEP

Fiber routing area

In Figure 10-32, the board in slot 2 protects the boards in slots 3-5. The board in slot 16 protects
the boards in slots 13-15.
Table 10-36 lists the slots for the SEP, EU08, and TSB8.
Table 10-36 Slots for the SEP, EU08, and TSB8

Issue 03 (2013-02-20)

Board

Protection Group 1

Protection Group 2

SEP (working board)

Slot 2

Slot 16

TSB8

Slot 19

Slot 35

SEP (working board)

Slots 3-5

Slots 13-15

EU08

Slots 21, 23, and 25

Slots 29, 31, and 33

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10.8.9 Feature Code


The IFSD1 does not have a feature code.

10.8.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

CAUTION
When the SEP1 works with the EU08, ensure that the EU08 is installed before the SEP1.
Otherwise, the opposite end may receive the R_LOF alarm.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the SDH interface.
l J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.
l J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.
l C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent. Set
the C2 byte according to the actual service type. Generally, use the default value, which is
TUG structure.
l Laser status: Set this parameter to Open when you configure and commission the board.
For details, see 28.7 Checking Board Parameters.
NOTE

For the other parameters to be set, see 27.5 SDH Processing Boards.

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Step 3 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
----End

Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing Specifications
of Optical Interfaces.
Step 2 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

10.8.11 Parameter Settings


You can set the parameters for the SEP1 by using the U2000.
You can set the following parameters for the SEP1 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.8.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 10-37 lists the faults that occur on the SEP1 frequently and the troubleshooting methods.
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Table 10-37 Methods used to troubleshoot the faults that occur on the SEP1 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service interruption

l The optical fiber,


cable, or
connector
becomes
abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect
operation is
performed.
l The types or
settings of the
boards are
inconsistent.
l The optical power
becomes
abnormal.

Bit error

See Troubleshooting Bit Errors.

l The equipment
becomes faulty.
Pointer justification

l The clock
configuration is
incorrect.

See Troubleshooting Pointer Justification.

l The precision of
the external clock
source is very
low.
Protection switching
failure

l The MSP
switching fails.

See Troubleshooting Protection Switching


Faults.

l The SNCP
switching fails.
l The clock
protection
switching fails.
NEs being
unreachable to the
U2000

l A single NE
becomes
unreachable to
the U2000.

See Troubleshooting the NEs Being


Unreachable.

l All the NEs in a


subnet become
unreachable to
the U2000.
l An NE becomes
unreachable to
the U2000
frequently.
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Fault Symptom

Common Fault
Cause

Troubleshooting Method

Equipment
interconnection fault

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SEP1, see Replacing an SDH Board.

10.8.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

10.8.13.1 Alarms of N1SEP1

Issue 03 (2013-02-20)

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_FAIL

C2_PDI

C2_VCAIS

FSELECT_STG

COMMUN_FAIL

FPGA_ABN

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LP_RDI_VC12

J0_MM

LOOP_ALM

LP_REI_VC3

LP_RDI_VC3

LP_REI_VC12

LP_TIM_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

LP_UNEQ_VC12

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

POWER_ABNORMAL

R_LOC

R_LOF

R_LOS

R_OOF

SLAVE_WORKING

SPARE_PATH_ALM

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T_LOSEX

TEST_STATUS

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

PS

SWDL_PKG_NOBDSOFT

MOD_TYPE_MISMATCH

WRG_BD_TYPE

10.8.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

10.8.14.1 Performance Events of N1SEP1


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

RSBBE

RSCSES

RSES

RSOFS

RSOOF

RSSES

RSUAS

10.8.15 Technical Specifications


The technical specifications of the SEP1 include the parameters specified for interfaces,
mechanical specifications, and power consumption.

Parameters Specified for Interfaces


Table 10-38 lists the parameters specified for the interfaces of the SEP1.

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Table 10-38 Parameters specified for the interfaces of the SEP1


Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

CMI and NRZ

Connector

SMB

Mechanical Specifications
The mechanical specifications of the SEP1 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the SEP1 at room temperature (25C) is 17 W.

10.9 SL4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL4 (1xSTM-4 optical interface board).

10.9.1 Version Description


The SL4 is available in two functional versions, namely, N1 and N2. The difference between
the two versions is with regard to whether they support the TCM function and AU-3 services.
The N1SL4 is no longer manufactured.
Table 10-39 describes the versions of the SL4.
Table 10-39 Versions of the SL4
Item

Description

Functional versions

The SL4 is available in two functional versions, namely, N1 and N2.

Differences

l Service processing: AU-3 service processing.


l Maintenance features: loopbacks on VC-4 paths.

Substitution

Through the board version replacement function, the N1SL4 and the
N1SL4A can substitute each other.

NOTE

When you configure the MSP or SNCP, you cannot configure the N1SL4 as the protection board if the
working board is the N2SL4 on which the TCM function is enabled or AU-3 services are configured.
Otherwise, the services are interrupted when a switching operation is performed.

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10.9.2 Application
The SL4 is a line board. The SL4 can be used on the OptiX OSN equipment series to transmit
and receive STM-4 optical signals. The SL4 converts the received optical signals into electrical
signals and sends the electrical signals to the cross-connect side. In addition, the SL4 converts
the electrical signals sent from the cross-connect side into optical signals and transmits the optical
signals.
Figure 10-33 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-33 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.9.3 Functions and Features


The SL4 transmits and receives 1xSTM-4 optical signals, performs O/E conversion for the
STM-4 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-40 provides the functions and features of the SL4.
Table 10-40 Functions and features of the SL4
Function and
Feature

SL4

Basic functions

Receives and transmits 1xSTM-4 optical signals, and processes


1xSTM-4 standard or concatenation services.

Specifications of
the optical
interface

l Supports different types of standard optical interfaces, namely, the


I-4, S-4.1, L-4.1, L-4.2, and Ve-4.2.
l The characteristics of the optical interfaces of the I-4, S-4.1, L-4.1,
and L-4.2 types comply with ITU-T G.957.
l The characteristics of the optical interface of the Ve-4.2 type comply
with the standards defined by Huawei.

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Function and
Feature

SL4

Specifications of
the optical module

l Supports the detection and query of the information about the optical
module.
l Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.
l Supports the usage and monitoring of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

Service
processing

l Supports the VC-12 services, VC-3 services, VC-4 services, and


VC-4-4c concatenation services.
l The N2SL4 supports the AU-3 services.

Overhead
processing

l Processes the section overheads of the STM-4 signals.


l Supports the transparent transmission and termination of the path
overheads. Supports the setting and query of the J0, J1, J2, and C2
bytes.
l Supports one channel of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

l Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.
l Supports the fiber-shared MSP and SNCP and processes two sets of
K bytes. One SL4 supports a maximum of two MSP protection rings.

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l The N1SL4 supports inloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l The N2SL4 supports the TCM function.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

10.9.4 Working Principle and Signal Flow


The SL4 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-34 shows the functional block diagram of the .SL4

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Figure 10-34 Functional block diagram of the SL4


155 MHz

622 Mbit/s
622 Mbit/s

O/E

S
P
I

E/O

622
Mbit/s

Reference clock

155 MHz
PLL

622
Mbit/s

CDR

K1 and K2

K1 and K2 insertion/extraction

Cross-connect unit

Cross-connect unit

622 Mbit/s
High-speed bus

622 Mbit/s

O/E
E/O

....

....

622 Mbit/s

Cross-connect unit A

S
P
I

622
Mbit/s

CDR

622
Mbit/s

RST

MST

MSA

HPT

High-speed
bus

622 Mbit/s

DCC
SDH overhead processing module

IIC
LOS
Laser shutdown

Logic and
control
module

+3.3 V

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B
SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

DC/DC
converter

Fuse

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital hierarchy

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

+3.3 V

+3.3 V backup power

CDR: clock and data recovery

The functional modules of the STM-4 units are described as follows:

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

CDR Module
This module restores the clock signal.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.

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In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.
l

MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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10.9.5 Front Panel


The front panel of the SL4 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-35 shows the appearance of the front panel of the SL4.
Figure 10-35 Front panel of the SL4

SL4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1

SL4

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SL4 has one optical interface. Table 10-41 describes the types and usage
of the optical interfaces of the SL4.
Table 10-41 Optical interfaces of the SL4
Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

The SL4 can use the swappable optical modules to facilitate maintenance.

10.9.6 Valid Slots


The slots valid for the SL4 vary with the cross-connect capacity of the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SL4 are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the SL4 can be installed in slots 18 and
1117.

10.9.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL4 indicates the type of optical interface.
Table 10-42 provides the relationship between the feature code of the SL4 and the type of optical
interface.
Table 10-42 Relationship between the feature code of the SL4 and the type of optical interface

Issue 03 (2013-02-20)

Board

Feature Code

Type of Optical Interface

SSN1SL410 and
SSN2SL410

10

S-4.1

SSN1SL411 and
SSN2SL411

11

L-4.1

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Board

Feature Code

Type of Optical Interface

SSN1SL412 and
SSN2SL412

12

L-4.2

SSN1SL413 and
SSN2SL413

13

Ve-4.2

SSN1SL414 and
SSN2SL414

14

I-4

10.9.8 Parameter Settings


You can set the parameters for the SL4 by using the U2000.
You can set the following parameters for the SL4 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.9.9 Technical Specifications


The technical specifications of the SL4 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-43 lists the parameters specified for the optical interfaces of the SL4.
Table 10-43 Parameters specified for the optical interfaces of the SL4

Issue 03 (2013-02-20)

Parameter

Value

Nominal bit rate

622080 kbit/s

Line code pattern

NRZ

Application code

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Single-mode
LC

Single-mode
LC

Singlemode LC

Singlemode LC

Singlemode LC

Operating
wavelength range
(nm)

1261 to 1360

1274 to 1356

1280 to
1335

1480 to
1580

1480 to
1580

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Parameter

Value

Launched optical
power range
(dBm)

-15 to -8

-15 to -8

-3 to +2

-3 to +2

-3 to +2

Receiver
sensitivity (dBm)

-23

-28

-28

-28

-34

Minimum
overload (dBm)

-8

-8

-8

-8

-13

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10.5

Maximum -20 dB
spectral width
(nm)

Minimum side
mode suppression
ratio (dB)

30

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1SL4 and N2SL4 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight of the N1SL4 (kg): 0.6

Weight of the N2SL4 (kg): 1.0

Power Consumption
The maximum power consumption of the N1SL4 at room temperature (25C) is 17 W.
The maximum power consumption of the N2SL4 at room temperature (25C) is 15 W.

10.10 SL4A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL4A (1xSTM-4 optical interface board).

10.10.1 Version Description


The SL4A is available in one functional version, namely, N1.
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Through the board version replacement function, the N1SL4 and the N1SL4A can substitute
each other.

10.10.2 Application
The SL4A is a line board. The SL4A can be used on the OptiX OSN equipment series to transmit
and receive STM-4 optical signals. The SL4A converts the received optical signals into electrical
signals and sends the electrical signals to the cross-connect side. In addition, the SL4A converts
the electrical signals sent from the cross-connect side into optical signals and transmits the optical
signals.
Figure 10-36 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-36 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.10.3 Functions and Features


The SL4A transmits and receives 1xSTM-4 optical signals, performs O/E conversion for the
STM-4 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-44 provides the functions and features of the SL4A.
Table 10-44 Functions and features of the SL4A

Issue 03 (2013-02-20)

Function and
Feature

SL4A

Basic functions

Receives and transmits 1xSTM-4 optical signals, and processes


1xSTM-4 standard or concatenation services.

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Function and
Feature

SL4A

Specifications of
the optical
interface

Supports different types of standard optical interfaces, namely, the I-4,


S-4.1, L-4.1, L-4.2, and Ve-4.2. The characteristics of the optical
interfaces of the I-4, S-4.1, L-4.1, and L-4.2 types comply with ITU-T
G.957. The characteristics of the optical interface of the Ve-4.2 type
comply with the standards defined by Huawei.
Supports the CWDM and DWDM colored optical interfaces. The optical
interface uses the LC connector. The CWDM optical interface supports
the transmission distance of 80 km, and the DWDM optical interface
supports the transmission distance of 120 km.

Specifications of
the optical module

l Supports the detection and query of the information about the optical
module.
l Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.
l Supports the usage and monitoring of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

Service
processing

Supports the VC-12 services, VC-3 services, VC-4 services, and


VC-4-4c concatenation services.

Overhead
processing

l Processes the section overheads of the STM-4 signals.


l Supports the transparent transmission and termination of the path
overheads. Supports the setting and query of the J0, J1, J2, and C2
bytes.
l Supports one channel of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

l Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.
l Supports the fiber-shared MSP and SNCP and processes two sets of
K bytes. One SL4A supports a maximum of two MSP protection
rings.

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l Supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

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10.10.4 Working Principle and Signal Flow


The SL4A consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, power module.
Figure 10-37 shows the functional block diagram of the SL4A.
Figure 10-37 Functional block diagram of the SL4A
155 MHz

622 Mbit/s
622 Mbit/s

O/E

S
P
I

E/O

622
Mbit/s

Reference clock

155 MHz
PLL

622
Mbit/s

CDR

K1 and K2

K1 and K2 insertion/extraction

Cross-connect unit

Cross-connect unit

622 Mbit/s
High-speed bus

622 Mbit/s

O/E
E/O

....

....

622 Mbit/s

Cross-connect unit A

S
P
I

622
Mbit/s

CDR

622
Mbit/s

RST

MST

MSA

HPT

High-speed
bus

622 Mbit/s

DCC
SDH overhead processing module

IIC
LOS
Laser shutdown

Logic and
control
module

+3.3 V

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B
SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

DC/DC
converter

Fuse

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital hierarchy

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

+3.3 V

+3.3 V backup power

CDR: clock and data recovery

The functional modules of the STM-4 units are described as follows:

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

CDR Module
This module restores the clock signal.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
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RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

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Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.10.5 Front Panel


The front panel of the SL4A has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-38 shows the appearance of the front panel of the SL4A.
Figure 10-38 Front panel of the SL4A

SL4A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1

SL4A

Indicators
The front panel of the board has the following indicators:
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Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SL4A has one optical interface. Table 10-45 describes the types and usage
of the optical interfaces of the SL4A.
Table 10-45 Optical interfaces of the SL4A
Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

The SL4A can use the swappable optical modules to facilitate maintenance.

10.10.6 Valid Slots


The slots valid for the SL4A vary with the cross-connect capacity of the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SL4A are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the SL4A can be installed in slots 18 and
1117.

10.10.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL4A indicates the type of optical interface.
Table 10-46 provides the relationship between the feature code of the SL4A and the type of
optical interface.
Table 10-46 Relationship between the feature code of the SL4A and the type of optical interface

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Board

Feature Code

Type of Optical Interface

SSN1SL4A10

10

S-4.1

SSN1SL4A11

11

L-4.1

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Board

Feature Code

Type of Optical Interface

SSN1SL4A12

12

L-4.2

SSN1SL4A13

13

Ve-4.2

SSN1SL4A14

14

I-4

10.10.8 Parameter Settings


You can set the parameters for the SL4A by using the U2000.
You can set the following parameters for the SL4A by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.10.9 Technical Specifications


The technical specifications of the SL4A include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-47 lists the parameters specified for the optical interfaces of the SL4A.
Table 10-47 Parameters specified for the optical interfaces of the SL4A

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Parameter

Value

Nominal bit rate

622080 kbit/s

Line code pattern

NRZ

Application code

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Single-mode
LC

Single-mode
LC

Singlemode LC

Singlemode LC

Singlemode LC

Operating
wavelength range
(nm)

1261 to 1360

1274 to 1356

1280 to
1335

1480 to
1580

1480 to
1580

Launched optical
power range
(dBm)

-15 to -8

-15 to -8

-3 to +2

-3 to +2

-3 to +2

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Parameter

Value

Receiver
sensitivity (dBm)

-23

-28

-28

-28

-34

Minimum
overload (dBm)

-8

-8

-8

-8

-13

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10.5

Maximum -20 dB
spectral width
(nm)

Minimum side
mode suppression
ratio (dB)

30

30

30

Table 10-48 and Table 10-49 list the parameters specified for the colored optical interfaces of
the SL4A.
Table 10-48 CWDM parameters specified for the colored optical interfaces of the SL4A
Parameter

Value
CWDM

Issue 03 (2013-02-20)

Nominal bit rate

622080 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

80

Launched optical power range


(dBm)

0 to 5

Operating wavelength range (nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion (ps/


nm)

1600

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral width


(nm)

Minimum side mode suppression


ratio (dB)

30

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Table 10-49 DWDM parameters specified for the colored optical interfaces of the SL4A
Parameter

Value
DWDM

Nominal bit rate

622080 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

120

Launched optical power range


(dBm)

-1 to 3

Central frequency (THz)

192.10 to 196.00

Central frequency deviation


(GHz)

10

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

2400

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral


width (nm)

0.3

Minimum side mode


suppression ratio (dB)

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL4A are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.6

Power Consumption
The maximum power consumption of the SL4A at room temperature (25C) is 17 W.

10.11 SLD4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLD4 (2xSTM-4 optical interface board).
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10.11.1 Version Description


The SLD4 is available in two functional versions, namely, N1 and N2. The difference between
the two versions is with regard to whether they support the TCM function and AU-3 services.
The N1SLD4 is no longer manufactured.
Table 10-50 describes the versions of the SLD4.
Table 10-50 Versions of the SLD4
Item

Description

Functional
versions

The SLD4 is available in two functional versions, namely, N1 and N2.

Differences

l Service processing: AU-3 service processing.


l Maintenance features: loopbacks on VC-4 paths and TCM function.

Substitution

Through the board version replacement function, the N1SLD4 and the
N1SLD4A can substitute each other.

NOTE

When you configure the MSP or SNCP, you cannot configure the N1SLD4 as the protection board if the
working board is the N2SLD4 on which the TCM function is enabled or AU-3 services are configured.
Otherwise, the services are interrupted when a switching operation is performed.

10.11.2 Application
The SLD4 is a line board. The SLD4 can be used on the OptiX OSN equipment series to transmit
and receive STM-4 optical signals. The SLD4 converts the received optical signals into electrical
signals and sends the electrical signals to the cross-connect side. In addition, the SLD4 converts
the electrical signals sent from the cross-connect side into optical signals and transmits the optical
signals.
Figure 10-39 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-39 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

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10.11.3 Functions and Features


The SLD4 transmits and receives 2xSTM-4 optical signals, performs O/E conversion for the
STM-4 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-51 provides the functions and features of the SLD4.
Table 10-51 Functions and features of the SLD4
Function and
Feature

SLD4

Basic functions

Receives and transmits 2xSTM-4 optical signals, and processes


2xSTM-4 standard or concatenation services.

Specifications of
the optical
interface

l Supports different types of standard optical interfaces, namely, the


I-4, S-4.1, L-4.1, L-4.2, and Ve-4.2.
l The characteristics of the optical interfaces of the I-4, S-4.1, L-4.1,
and L-4.2 types comply with ITU-T G.957.
l The characteristics of the optical interface of the Ve-4.2 type comply
with the standards defined by Huawei.

Specifications of
the optical module

l Supports the detection and query of the information about the optical
module.
l Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.
l Supports the usage and monitoring of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

Service
processing

l Supports the VC-12 services, VC-3 services, VC-4 services, and


VC-4-4c concatenation services.
l The N2SLD4 supports the AU-3 services.

Overhead
processing

l Processes the section overheads of the STM-4 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one or two channels of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

l Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.
l Supports the fiber-shared MSP and SNCP and processes four sets of
K bytes. A single optical interface supports two MSP protection
rings, and one SLD4 supports a maximum of four MSP protection
rings.

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Function and
Feature

SLD4

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l The N1SLD4 supports inloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l The N2SLD4 supports the TCM function.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

10.11.4 Working Principle and Signal Flow


The SLD4 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-40 shows the functional block diagram of the SLD4.
Figure 10-40 Functional block diagram of the SLD4
155 MHz

622 Mbit/s
622 Mbit/s

O/E
E/O

S
P
I

622
Mbit/s

CDR

Reference clock

155 MHz
PLL

622
Mbit/s

K1 and K2

K1 and K2 insertion/extraction

Cross-connect unit

Cross-connect unit

622 Mbit/s
High-speed bus

622 Mbit/s

O/E
E/O

....

....

622 Mbit/s

Cross-connect unit A

S
P
I

622
Mbit/s

CDR

622
Mbit/s

RST

MST

MSA

HPT

High-speed
bus

622 Mbit/s

DCC
SDH overhead processing module

IIC
LOS
Laser shutdown

Logic and
control
module

+3.3 V

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B
SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

DC/DC
converter

Fuse

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital hierarchy

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

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+3.3 V

+3.3 V backup power

CDR: clock and data recovery

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The functional modules of the STM-4 units are described as follows:

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

CDR Module
This module restores the clock signal.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)

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alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.11.5 Front Panel


The front panel of the SLD4 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-41 shows the appearance of the front panel of the SLD4.

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Figure 10-41 Front panel of the SLD4

SLD4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2

SLD4

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SLD4 has two optical interfaces. Table 10-52 describes the types and
usage of the optical interfaces of the SLD4.
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Table 10-52 Optical interfaces of the SLD4


Interface

Type of Interface

Usage

IN1-IN2

LC

Receives optical signals.

OUT1-OUT2

LC

Transmits optical signals.

The SLD4 can use the swappable optical modules to facilitate maintenance.

10.11.6 Valid Slots


The slots valid for the SLD4 vary with the cross-connect capacity of the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SLD4 are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the SLD4 can be installed in slots 18 and
1117.

10.11.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLD4 indicates the type of optical interface.
Table 10-53 provides the relationship between the feature code of the SLD4 and the type of
optical interface.
Table 10-53 Relationship between the feature code of the SLD4 and the type of optical interface

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Board

Feature Code

Type of Optical Interface

SSN1SLD410 and
SSN2SLD410

10

S-4.1

SSN1SLD411 and
SSN2SLD411

11

L-4.1

SSN1SLD412 and
SSN2SLD412

12

L-4.2

SSN1SLD413 and
SSN2SLD413

13

Ve-4.2

SSN1SLD414 and
SSN2SLD414

14

I-4

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10.11.8 Parameter Settings


You can set the parameters for the SLD4 by using the U2000.
You can set the following parameters for the SLD4 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.11.9 Technical Specifications


The technical specifications of the SLD4 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-54 lists the parameters specified for the optical interfaces of the SLD4.
Table 10-54 Parameters specified for the optical interfaces of the SLD4

Issue 03 (2013-02-20)

Parameter

Value

Nominal bit rate

622080 kbit/s

Line code
pattern

NRZ

Application
code

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Single-mode
LC

Operating
wavelength
range (nm)

1261 to
1360

1274 to
1356

1280 to
1335

1480 to
1580

1480 to 1580

Launched
optical power
range (dBm)

-15 to -8

-15 to -8

-3 to +2

-3 to +2

-3 to +2

Receiver
sensitivity
(dBm)

-23

-28

-28

-28

-34

Minimum
overload (dBm)

-8

-8

-8

-8

-13

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Parameter

Value

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10.5

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1SLD4 and N2SLD4 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight of the N1SLD4 (kg): 0.6

Weight of the N2SLD4 (kg): 1.0

Power Consumption
The maximum power consumption of the N1SLD4 at room temperature (25C) is 17 W.
The maximum power consumption of the N2SLD4 at room temperature (25C) is 15 W.

10.12 SLD4A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLD4A (2xSTM-4 optical interface board).

10.12.1 Version Description


The SLD4A is available in one functional version, namely, N1.
Through the board version replacement function, the N1SLD4 and the N1SLD4A can substitute
each other.

10.12.2 Application
The SLD4A is a line board. The SLD4A can be used on the OptiX OSN equipment series to
transmit and receive STM-4 optical signals. The SLD4A converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
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SLD4A converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-42 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-42 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.12.3 Functions and Features


The SLD4A transmits and receives STM-4 optical signals, performs O/E conversion for the
STM-4 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-55 provides the functions and features of the SLD4A.
Table 10-55 Functions and features of the SLD4A
Function and
Feature

SLD4A

Basic functions

Receives and transmits 2xSTM-4 optical signals, and processes


2xSTM-4 standard or concatenation services.

Specifications of
the optical
interface

l Supports different types of standard optical interfaces, namely, the


I-4, S-4.1, L-4.1, L-4.2, and Ve-4.2.
l The characteristics of the optical interfaces of the I-4, S-4.1, L-4.1,
and L-4.2 types comply with ITU-T G.957.
l The characteristics of the optical interface of the Ve-4.2 type comply
with the standards defined by Huawei.

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Function and
Feature

SLD4A

Specifications of
the optical module

l Supports the detection and query of the information about the optical
module.
l Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.
l Supports the usage and monitoring of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

Service
processing

Supports the VC-12 services, VC-3 services, VC-4 services, and


VC-4-4c concatenation services.

Overhead
processing

l Processes the section overheads of the STM-4 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one or two channels of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

l Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.
l Supports the fiber-shared MSP and SNCP and processes four sets of
K bytes. A single optical interface supports two MSP protection
rings, and one SLD4A supports a maximum of four MSP protection
rings.

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l Supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

10.12.4 Working Principle and Signal Flow


The SLD4A consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-43 shows the functional block diagram of the SLD4A.

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Figure 10-43 Functional block diagram of the SLD4A


155 MHz

622 Mbit/s
622 Mbit/s

O/E

S
P
I

E/O

622
Mbit/s

Reference clock

155 MHz
PLL

622
Mbit/s

CDR

K1 and K2

K1 and K2 insertion/extraction

Cross-connect unit

Cross-connect unit

622 Mbit/s
High-speed bus

622 Mbit/s

O/E
E/O

....

....

622 Mbit/s

Cross-connect unit A

S
P
I

622
Mbit/s

CDR

622
Mbit/s

RST

MST

MSA

HPT

High-speed
bus

622 Mbit/s

DCC
SDH overhead processing module

IIC
LOS
Laser shutdown

Logic and
control
module

+3.3 V

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B
SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

DC/DC
converter

Fuse

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital hierarchy

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

+3.3 V

+3.3 V backup power

CDR: clock and data recovery

The functional modules of the STM-4 units are described as follows:

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

CDR Module
This module restores the clock signal.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.

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In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.
l

MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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10.12.5 Front Panel


The front panel of the SLD4A has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-44 shows the appearance of the front panel of the SLD4A.
Figure 10-44 Front panel of the SLD4A

SLD4A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2

SLD4A

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SLD4A has two optical interfaces. Table 10-56 describes the types and
usage of the optical interfaces of the SLD4A.
Table 10-56 Optical interfaces of the SLD4A
Interface

Type of Interface

Usage

IN1IN2

LC

Receives optical signals.

OUT1OUT2

LC

Transmits optical signals.

The SLD4A can use the swappable optical modules to facilitate maintenance.

10.12.6 Valid Slots


The slots valid for the SLD4A vary with the cross-connect capacity of the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SLD4A are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the SLD4A can be installed in slots 18
and 1117.

10.12.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLD4A indicates the type of optical interface.
Table 10-57 provides the relationship between the feature code of the SLD4A and the type of
optical interface.
Table 10-57 Relationship between the feature code of the SLD4A and the type of optical
interface

Issue 03 (2013-02-20)

Board

Feature Code

Type of Optical Interface

SSN1SLD4A10

10

S-4.1

SSN1SLD4A11

11

L-4.1

SSN1SLD4A12

12

L-4.2

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Board

Feature Code

Type of Optical Interface

SSN1SLD4A13

13

Ve-4.2

SSN1SLD4A14

14

I-4

10.12.8 Parameter Settings


You can set the parameters for the SLD4A by using the U2000.
You can set the following parameters for the SLD4A by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.12.9 Technical Specifications


The technical specifications of the SLD4A include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-58 lists the parameters specified for the optical interfaces of the SLD4A.
Table 10-58 Parameters specified for the optical interfaces of the SLD4A

Issue 03 (2013-02-20)

Parameter

Value

Nominal bit rate

622080 kbit/s

Line code
pattern

NRZ

Application
code

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Single-mode
LC

Operating
wavelength
range (nm)

1261 to
1360

1274 to
1356

1280 to
1335

1480 to
1580

1480 to 1580

Launched
optical power
range (dBm)

-15 to -8

-15 to -8

-3 to +2

-3 to +2

-3 to +2

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Parameter

Value

Receiver
sensitivity
(dBm)

-23

-28

-28

-28

-34

Minimum
overload (dBm)

-8

-8

-8

-8

-13

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10.5

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLD4A are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.6

Power Consumption
The maximum power consumption of the SLD4A at room temperature (25C) is 17 W.

10.13 SLQ4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ4 (4xSTM-4 optical interface board).

10.13.1 Version Description


The SLQ4 is available in two functional versions, namely, N1 and N2. The difference between
the two versions is with regard to whether they support the TCM function and AU-3 services.
The N1SLQ4 is no longer manufactured.
Table 10-59 describes the versions of the SLQ4.
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Table 10-59 Versions of the SLQ4


Item

Description

Functional
versions

The SLQ4 is available in two functional versions, namely, N1 and N2.

Differences

l Service processing: AU-3 service processing.


l Maintenance features: loopbacks on VC-4 paths and TCM function.

Substitution

Through the board version replacement function, the N3SLQ41 can substitute
for the N1SLQ4 and N2SLQ4 at the same line rate. The N1SLQ4 and the
N1SLQ4A can substitute each other.

NOTE

When you configure the MSP or SNCP, you cannot configure the N1SLQ4 as the protection board if the
working board is the N2SLQ4 on which the TCM function is enabled or AU-3 services are configured.
Otherwise, the services are interrupted when a switching operation is performed.

10.13.2 Application
The SLQ4 is a line board. The SLQ4 can be used on the OptiX OSN equipment series to transmit
and receive STM-4 optical signals. The SLQ4 converts the received optical signals into electrical
signals and sends the electrical signals to the cross-connect side. In addition, the SLQ4 converts
the electrical signals sent from the cross-connect side into optical signals and transmits the optical
signals.
Figure 10-45 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-45 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

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10.13.3 Functions and Features


The SLQ4 transmits and receives STM-4 optical signals, performs O/E conversion for the
STM-4 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-60 provides the functions and features of the SLQ4.
Table 10-60 Functions and features of the SLQ4
Function and
Feature

SLQ4

Basic functions

Transmits and receives 4xSTM-4 optical signals.

Specifications of
the optical
interface

l Supports different types of standard optical interfaces, namely, the I-4,


S-4.1, L-4.1, L-4.2, and Ve-4.2.
l The characteristics of the optical interfaces of the I-4, S-4.1, L-4.1, and
L-4.2 types comply with ITU-T G.957.
l The characteristics of the optical interface of the Ve-4.2 type comply
with the standards defined by Huawei.

Specifications of
the optical
module

l Supports the detection and query of the information about the optical
module.
l Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.
l Supports the usage and monitoring of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

Service
processing

l Supports the VC-12 services, VC-3 services, VC-4 services, and


VC-4-4c concatenation services.
l The N2SLQ4 supports the AU-3 services.

Overhead
processing

l Processes the section overheads of the STM-4 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one to four channels of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

l Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.
l Supports the fiber-shared MSP and SNCP and processes eight sets of
K bytes. A single optical interface supports two MSP protection rings,
and one SLQ4 supports a maximum of eight MSP protection rings.

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Function and
Feature

SLQ4

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l The N1SLQ4 supports inloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l The N2SLQ4 supports the TCM function.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

10.13.4 Working Principle and Signal Flow


The SLQ4 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-46 shows the functional block diagram of the SLQ4.
Figure 10-46 Functional block diagram of the SLQ4
155 MHz

622 Mbit/s
622 Mbit/s

O/E
E/O

S
P
I

622
Mbit/s

CDR

Reference clock

155 MHz
PLL

622
Mbit/s

K1 and K2

K1 and K2 insertion/extraction

Cross-connect unit

Cross-connect unit

622 Mbit/s
High-speed bus

622 Mbit/s

O/E
E/O

....

....

622 Mbit/s

Cross-connect unit A

S
P
I

622
Mbit/s

CDR

622
Mbit/s

RST

MST

MSA

HPT

High-speed
bus

622 Mbit/s

DCC
SDH overhead processing module

IIC
LOS
Laser shutdown

Logic and
control
module

+3.3 V

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B
SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

DC/DC
converter

Fuse

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital hierarchy

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

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+3.3 V

+3.3 V backup power

CDR: clock and data recovery

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The functional modules of the STM-4 units are described as follows:

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

CDR Module
This module restores the clock signal.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after

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detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.13.5 Front Panel


The front panel of the SLQ4 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-47 shows the appearance of the front panel of the SLQ4.

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Figure 10-47 Front panel of the SLQ4

SLQ4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ4

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SLQ4 has four optical interfaces. Table 10-61 describes the types and
usage of the optical interfaces of the SLQ4.
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Table 10-61 Optical interfaces of the SLQ4


Interface

Type of Interface

Usage

IN1-IN4

LC

Receives optical signals.

OUT1-OUT4

LC

Transmits optical signals.

The SLQ4 can use the swappable optical modules to facilitate maintenance.

10.13.6 Valid Slots


The SLQ4 can be installed in slots 18 and 1116 in the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

When the cross-connect capacity is 200 Gbit/s, the SLQ4 can be installed in slots 18 and
1116. When the SLQ4 is installed in slots 14, 15, and 16, two optical interfaces can be
configured. When the SLQ4 is installed in slots 58 and 1114, four optical interfaces can
be configured.

10.13.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLQ4 indicates the type of optical interface.
Table 10-62 provides the relationship between the feature code of the SLQ4 and the type of
optical interface.
Table 10-62 Relationship between the feature code of the SLQ4 and the type of optical interface

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Board

Feature Code

Type of Optical Interface

SSN1SLQ410 and
SSN2SLQ410

10

S-4.1

SSN1SLQ411 and
SSN2SLQ411

11

L-4.1

SSN1SLQ412 and
SSN2SLQ412

12

L-4.2

SSN1SLQ413 and
SSN2SLQ413

13

Ve-4.2

SSN1SLQ414 and
SSN2SLQ414

14

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10.13.8 Parameter Settings


You can set the parameters for the SLQ4 by using the U2000.
You can set the following parameters for the SLQ4 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.13.9 Technical Specifications


The technical specifications of the SLQ4 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-63 lists the parameters specified for the optical interfaces of the SLQ4.
Table 10-63 Parameters specified for the optical interfaces of the SLQ4

Issue 03 (2013-02-20)

Parameter

Value

Nominal bit rate

622080 kbit/s

Line code
pattern

NRZ

Application
code

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Single-mode
LC

Operating
wavelength
range (nm)

1261 to
1360

1274 to
1356

1280 to
1335

1480 to
1580

1480 to 1580

Launched
optical power
range (dBm)

-15 to -8

-15 to -8

-3 to +2

-3 to +2

-3 to +2

Receiver
sensitivity
(dBm)

-23

-28

-28

-28

-34

Minimum
overload (dBm)

-8

-8

-8

-8

-13

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Parameter

Value

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10.5

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLQ4 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the N1SLQ4 at room temperature (25C) is 17 W.
The maximum power consumption of the N2SLQ4 at room temperature (25C) is 16 W.

10.14 SLQ4A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ4A (4xSTM-4 optical interface board).

10.14.1 Version Description


The SLQ4A is available in one functional version, namely, N1.
Through the board version replacement function, the N1SLQ4 and the N1SLQ4A can substitute
each other.

10.14.2 Application
The SLQ4A is a line board. The SLQ4A can be used on the OptiX OSN equipment series to
transmit and receive STM-4 optical signals. The SLQ4A converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
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SLQ4A converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-48 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-48 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.14.3 Functions and Features


The SLQ4A transmits and receives STM-4 optical signals, performs O/E conversion for the
STM-4 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-64 provides the functions and features of the SLQ4A.
Table 10-64 Functions and features of the SLQ4A
Function and
Feature

SLQ4A

Basic functions

Transmits and receives 4xSTM-4 optical signals.

Specifications of
the optical
interface

l Supports different types of standard optical interfaces, namely, the I-4,


S-4.1, L-4.1, L-4.2, and Ve-4.2.
l The characteristics of the optical interfaces of the I-4, S-4.1, L-4.1, and
L-4.2 types comply with ITU-T G.957.
l The characteristics of the optical interface of the Ve-4.2 type comply
with the standards defined by Huawei.

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Function and
Feature

SLQ4A

Specifications of
the optical
module

l Supports the detection and query of the information about the optical
module.
l Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.
l Supports the usage and monitoring of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

Service
processing

Supports the VC-12 services, VC-3 services, VC-4 services, and VC-4-4c
concatenation services.

Overhead
processing

l Processes the section overheads of the STM-4 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one to four channels of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

l Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.
l Supports the fiber-shared MSP and SNCP and processes eight sets of
K bytes. A single optical interface supports two MSP protection rings,
and one SLQ4A supports a maximum of eight MSP protection rings.

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l Supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

10.14.4 Working Principle and Signal Flow


The SLQ4A consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-49 shows the functional block diagram of the SLQ4A.

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Figure 10-49 Functional block diagram of the SLQ4A


155 MHz

622 Mbit/s
622 Mbit/s

O/E
E/O

S
P
I

622
Mbit/s

E/O

S
P
I

K1 and K2

K1 and K2 insertion/extraction

High-speed
bus

....

622 Mbit/s

O/E

622
Mbit/s

622 Mbit/s

....

622 Mbit/s

CDR

Reference clock

155 MHz
PLL

622
Mbit/s

RST

622
CDR Mbit/s

MST

MSA

High-speed
bus

HPT

622 Mbit/s

Cross-connect
unit

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B

DCC

SCC unit

SDH overhead processing module

IIC
LOS
Laser shutdown

Logic and
control
module
+3.3
V

DC/DC
converter

DC/DC
converter

Frame header
Communication

Fuse
Fuse

Cross-connect
unit
SCC unit
-48 V/ -60 V
-48 V/ -60 V

+3.3 V

+3.3 V backup
power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The functional modules of the STM-4 units are described as follows:

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

CDR Module
This module restores the clock signal.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.

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In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.
l

MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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10.14.5 Front Panel


The front panel of the SLQ4A has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-50 shows the appearance of the front panel of the SLQ4A.
Figure 10-50 Front panel of the SLQ4A

SLQ4A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ4A

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SLQ4A has four optical interfaces. Table 10-65 describes the types and
usage of the optical interfaces of the SLQ4A.
Table 10-65 Optical interfaces of the SLQ4A
Interface

Type of Interface

Usage

IN1IN4

LC

Receives optical signals.

OUT1OUT4

LC

Transmits optical signals.

The SLQ4A can use the swappable optical modules to facilitate maintenance.

10.14.6 Valid Slots


The SLQ4A can be installed in slots 18 and 1116 in the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

When the cross-connect capacity is 200 Gbit/s, the SLQ4A can be installed in slots 18
and 1116. When the SLQ4A is installed in slots 14, 15, and 16, two optical interfaces
can be configured. When the SLQ4A is installed in slots 58 and 1114, four optical
interfaces can be configured.

10.14.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLQ4A indicates the type of optical interface.
Table 10-66 provides the relationship between the feature code of the SLQ4A and the type of
optical interface.
Table 10-66 Relationship between the feature code of the SLQ4A and the type of optical
interface

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Board

Feature Code

Type of Optical Interface

SSN1SLQ4A10

10

S-4.1

SSN1SLQ4A11

11

L-4.1

SSN1SLQ4A12

12

L-4.2

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Board

Feature Code

Type of Optical Interface

SSN1SLQ4A13

13

Ve-4.2

SSN1SLQ4A14

14

I-4

10.14.8 Parameter Settings


You can set the parameters for the SLQ4A by using the U2000.
You can set the following parameters for the SLQ4A by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.14.9 Technical Specifications


The technical specifications of the SLQ4A include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-67 lists the parameters specified for the optical interfaces of the SLQ4A.
Table 10-67 Parameters specified for the optical interfaces of the SLQ4A

Issue 03 (2013-02-20)

Parameter

Value

Nominal bit rate

622080 kbit/s

Line code
pattern

NRZ

Application
code

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Single-mode
LC

Operating
wavelength
range (nm)

1261 to
1360

1274 to
1356

1280 to
1335

1480 to
1580

1480 to 1580

Launched
optical power
range (dBm)

-15 to -8

-15 to -8

-3 to +2

-3 to +2

-3 to +2

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Parameter

Value

Receiver
sensitivity
(dBm)

-23

-28

-28

-28

-34

Minimum
overload (dBm)

-8

-8

-8

-8

-13

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10.5

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLQ4A are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the SLQ4A at room temperature (25C) is 17 W.

10.15 SL16
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL16 (1xSTM-16 optical interface board).

10.15.1 Version Description


The SL16 is available in three functional versions, namely, N1, N2, and N3. The difference
between the three versions is with regard to whether they support the TCM function and AU-3
services. The N1SL16 and N2SL16 are discontinued.
Table 10-68 describes the versions of the SL16.
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Table 10-68 Versions of the SL16


Item

Description

Functional
versions

The SL16 is available in three functional versions, namely, N1, N2, and N3.

Differences

l Specifications of optical interfaces: DWDM colored optical interfaces.


l Service processing: AU-3 service processing.
l REG specifications: REG function.
l Maintenance features: loopbacks on VC-4 paths and TCM function.

Substitutio
n

The N1SL16 and N2SL16 cannot be substituted with each other.


The N3SL16 supports the board version replacement function.
l The N3SL16 can substitute for the N1SL16.
l When the AU-3 services are not required, the N3SL16 can substitute for
the N2SL16.
After the N3SL16 substitutes for the N1SL16 or N2SL16, the configuration
and service status of the N3SL16 are the same as the configuration and service
status of the N1SL16 or N2SL16.

NOTE

In the case of the board of different versions, adhere to the following principles when configuring the MSP
or SNCP:
l You cannot configure the N1SL16 as the protection board if the working board is the N2SL16 or
N3SL16 on which the TCM function is enabled. Otherwise, the services are interrupted when a
switching operation is performed.
l You cannot configure the N1SL16 or N3SL16 as the protection board if the working board is the
N2SL16 on which the AU-3 services are configured. Otherwise, the services are interrupted when a
switching operation is performed.

10.15.2 Application
The SL16 is a line board. The SL16 can be used on the OptiX OSN equipment series to transmit
and receive STM-16 optical signals. The SL16 converts the received optical signals into
electrical signals and sends the electrical signals to the cross-connect side. In addition, the SL16
converts the electrical signals sent from the cross-connect side into optical signals and transmits
the optical signals.
Figure 10-51 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.

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Figure 10-51 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.15.3 Functions and Features


The SL16 receives and transmits 1xSTM-16 optical signals and processes overhead bytes.
Table 10-69 provides the functions and features of the SL16.
Table 10-69 Functions and features of the SL16
Function and
Feature

SL16

Basic functions

Transmits and receives 1xSTM-16 optical signals.

Specifications
of the optical
interface

l Supports different types of standard optical interfaces, namely, the


L-16.2, L-16.2Je, V-16.2Je (with the booster amplifier (BA)), and
U-16.2Je (with the BA and pre-amplifier (PA)). The characteristics of
the optical interface of the L-16.2 type comply with ITU-T G.957 and
ITU-T G.692. The characteristics of the optical interfaces of the
L-16.2Je, V-16.2Je (with the BA), and U-16.2Je (with the BA and PA)
types comply with the standards defined by Huawei.
l Supports the output of the standard wavelengths that comply with ITUT G.692. The U-16.2Je optical interface can be directly connected to
the dense wavelength division multiplexing (DWDM) equipment.
l The N3SL16 supports DWDM colored optical interfaces, which use
LC connectors and support the transmission distances of 170 km and
640 km.

Specifications
of the optical
module

l Supports the detection and query of the information about the optical
module.
l Supports fixed optical modules.
l Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.

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Function and
Feature

SL16

Service
processing

l Supports the VC-12 services, VC-3 services, VC-4 services, VC-4-4c


concatenation services, VC-4-8c concatenation services, and
VC-4-16c concatenation services.
l The N2SL16 supports the AU-3 services.

Overhead
processing

l Processes the section overheads of the STM-16 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one channel of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Specifications
of the REG

The N2SL16/N3SL16 board supports the setting and query of the REG
working mode.

Protection
schemes

l Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCMP, and SNCTP.
l Supports the fiber-shared MSP and SNCP and processes two sets of K
bytes. One SL16 supports a maximum of two MSP protection rings.

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l The N1SL16 supports inloops on VC-4 paths. The N3SL16 board
supports inloops and outloops on paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l The N2SL16 and N3SL16 support the TCM function.
l Supports the upgrade of the board software without affecting services.
l The N2SL16/N3SL16 board supports the TCM function.
l Supports the Cause by Cross function.
l The N3SL16 board also supports the PRBS function in the line
direction.
l Supports the press-to-collect function in fault data collection.

10.15.4 Working Principle and Signal Flow


The SL16 consists of the O/E converting module, MUX/DEMUX module, SDH overhead
processing module, logic and control module, power module.
Figure 10-52 shows the functional block diagram of the SL16.

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Figure 10-52 Functional block diagram of the SL16


155 MHz

2.488
Gbit/s

O/E

SPI 2.488 DEMUX 16x155


E/O
Gbit/s
Mbit/s

. .
. .

2.488
Gbit/s

O/E
E/O

SPI

2.488
Gbit/s

MUX

16x155
Mbit/s

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

MUX/
DEMUX

O/E
converting
module

155 MHz
PLL

Backplane
Reference clock
Cross-connect
unit

IIC
LOS
Laser shutdown

Logic and
control module
+3.3 V
Power
module

Power
module

Frame header
Communication
Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module


This module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the RSOH. That is, the RST
sub-module detects the frame alignment bytes (A1 and A2), descrambles all the bytes
except the first line of the RSOH, restores and checks the J0 byte, and checks the B1
byte.

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In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.
l

MST sub-module
In the receive direction, the MST sub-module terminates the MSOH. That is, the MST
sub-module generates the MS_AIS alarm and detects the MS_RDI alarm after detecting
the K2 byte, and detects the MS_REI alarm and generates the B2_EXC alarm after
checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the AUG, divides an AUG
into N AU-4s, detects the AU_LOP alarm and the AU_AIS alarm, and performs pointer
justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the POH. That is, the HPT submodule detects the HP_REI alarm after checking the B3 byte, generates the HP_TIM
alarm and the HP_SLM alarm and detects the HP_RDI alarm after detecting the J1 and
C2 bytes, and generates the HP_UNEQ alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.15.5 Front Panel


The front panel of the SL16 has indicators, interfaces, a bar code, a laser safety class label, and
an APD alarm label.
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Diagram of the Front Panel


Figure 10-53 shows the appearance of the front panel of the SL16.
Figure 10-53 Front panel of the SL16

SL16
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

APD

Receiver
MAX:-9dBm

OUT

IN

SL16

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.


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Interfaces
The front panel of the SL16 has one optical interface. Table 10-70 describes the types and usage
of the optical interfaces of the SL16.
Table 10-70 Optical interfaces of the SL16
Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.15.6 Valid Slots


The slots valid for the SL16 vary with the cross-connect capacity of the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SL16 are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the SL16 can be installed in slots 58 and
1114.

10.15.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL16 indicates the type of optical interface.
Table 10-71 describes the relationship between the feature code of the SL16 and the type of
optical interface
Table 10-71 Relationship between the feature code of the SL16 and the type of optical interface

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Board

Feature Code

Type of Optical
Interface

SSN1SL1600, SSN3SL1600

00

Fixed-wavelength
optical interface

SSN1SL1601, SSN2SL1601, and SSN3SL1601

01

L-16.2

SSN1SL1602, SSN2SL1602, and SSN3SL1602

02

L-16.2Je

SSN1SL1603, SSN2SL1603, and SSN3SL1603

03

V-16.2Je

SSN1SL1604, SSN2SL1604, and SSN3SL1604

04

U-16.2

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10.15.8 Parameter Settings


You can set the parameters for the SL16 by using the U2000.
You can set the following parameters for the SL16 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.15.9 Technical Specifications


The technical specifications of the SL16 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-72 lists the parameters specified for the optical interfaces of the SL16.
Table 10-72 Parameters specified for the optical interfaces of the SL16

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Parameter

Value

Nominal bit
rate

2488320 kbit/s

Line code
pattern

NRZ

Application
code

L-16.2

L-16.2Je

V-16.2Je (BA)

U-16.2Je (BA+PA)

Transmissio
n distance
(km)

50 to 80

80 to 100

100 to 140

140 to 170

Type of fiber

Singlemode LC

Singlemode LC

Single-mode LC

Single-mode LC

Operating
wavelength
range (nm)

1500 to
1580

1530 to
1560

1530 to 1565

1550.12

Launched
optical
power range
(dBm)

-2 to +3

5 to 7

-2 to +3
(without
the BA)

-2 to +3
(without
the BA
or PA)

15 to 18
(with the
BA)

Receiver
sensitivity
(dBm)

-28

-28

-28

-28
(without
the PA
or BA)

-32 (with
the PA)

13 to 15
(with the
BA)

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Parameter

Value

Minimum
overload
(dBm)

-9

-9

-9

-9
(without
the PA
or BA)

Dispersion
tolerance (ps/
nm)

1600

2000

2800

3400

Minimum
extinction
ratio (dB)

8.2

8.2

8.2

8.2

Maximum
-20 dB
spectral
width (nm)

Minimum
side mode
suppression
ratio (dB)

30

30

30

30

-10 (with
the PA)

Note: The optical interface of the Le-16.2 type is the same as the optical interface of the
L-16.2Je type.
The launched optical power of the optical interface of the V-16.2Je type is measured when
the BA is added. The launched optical power of the optical interface of the U-16.2Je type is
measured when the BA and PA are added. When no amplifier is added, the launched optical
power of the optical interfaces of the V-16.2Je and U-16.2Je types ranges from -2 dBm to 3
dBm.

Table 10-73 lists the parameters specified for the colored optical interfaces of the N3SL16.
Table 10-73 Parameters specified for the colored optical interfaces of the N3SL16
Parameter

Value
DWDM

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Nominal bit rate

2488320 kbit/s

Type of fiber

Single-mode LC

Dispersion-limited distance (km)

170

640

Launched optical power range (dBm)

-2 to +3

-5 to -1

Receiver sensitivity (dBm)

-28

-28

Minimum overload (dBm)

-9

-9

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Parameter

10 SDH Boards

Value
DWDM

Maximum allowed dispersion (ps/


nm)

3400

10880

Minimum extinction ratio (dB)

8.2

10

Central frequency deviation (GHz)

20

20

Minimum side mode suppression


ratio (dB)

30

35

Maximum -20 dB spectral width (nm)

0.4

0.2

Maximum optical path penalty (dB)

Optical signal-to-noise ratio (dB)

20

20

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL16 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.1

Power Consumption
The maximum power consumption of the N1SL16 and N2SL16 at room temperature (25C) is
19 W.
The maximum power consumption of the N3SL16 at room temperature (25C) is 22 W.

10.16 SL16A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SL16A (1xSTM-16 optical interface board). This topic also
describes how to configure and commission the SL16A.

10.16.1 Version Description


The SL16A is available in the following functional versions: N3, N2, and N1. The N1SL16A
and N2SL16A are discontinued.
Table 10-74 describes the versions of the SL16A.
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Table 10-74 Versions of the SL16


Item

Description

Functional versions

The SL16A is available in the following functional versions: N3, N2,


and N1. The N1SL16A and N2SL16A are discontinued.

Differences

l Specifications of optical interfaces: DWDM colored optical


interfaces.
l Service processing: AU-3 service processing.
l REG specifications: REG function.
l Maintenance features: loopbacks on VC-4 paths and TCM
function.

Substitution

l The N1SL16A and N2SL16A cannot be substituted with each


other.
l The N3SL16A supports the board version replacement function.
The N3SL16A can substitute for the N1SL16A.
When the AU-3 services are not configured, the N3SL16A can
substitute for the N2SL16A.
l After the N3SL16A substitutes for the N1SL16A or N2SL16A,
the configuration and service status of the N3SL16A are the same
as the configuration and service status of the N1SL16A or
N2SL16A.

NOTE

In the case of the board of different versions, adhere to the following principles when configuring the MSP
or SNCP:
l You cannot configure the N1SL16A as the protection board if the working board is the N2SL16A or
N3SL16A on which only the TCM function is enabled. Otherwise, the services are interrupted when
a switching operation is performed.
l You cannot configure the N3SL16A or N1SL16A as the protection board if the working board is the
N2SL16A on which only the AU-3 services are configured. Otherwise, the services are interrupted
when a switching operation is performed.

10.16.2 Application
The SL16A is a line board. The SL16A can be used on the OptiX OSN equipment series to
transmit and receive STM-16 optical signals. The SL16A converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SL16A converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-54 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.

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Figure 10-54 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.16.3 Functions and Features


The SL16A receives and transmits 1xSTM-16 optical signals, processes overhead bytes, and
performs the MSP.
Table 10-75 describes the functions and features of the SL16A.
Table 10-75 Functions and features of the SL16A
Function and
Feature

SL16A

Basic functions

Transmits and receives 1xSTM-16 optical signals.

Specifications of the
optical interface

Supports different types of standard optical interfaces, namely, the


I-16, S-16.1, L-16.1, and L-16.2. The characteristics of the optical
interfaces comply with ITU-T G.957 and ITU-T G.692.
The N3SL16A supports the CWDM and DWDM colored optical
interfaces. The optical interface uses the LC connector. The CWDM
optical interface supports the transmission distance of 80 km, and
the DWDM optical interface supports the transmission distance of
120 km.

Specifications of the
optical module

l Supports the detection and query of the information about the


optical module.
l Provides the ALS function. The optical interface supports the
setting of the on/off state of a laser.
l Supports the usage and monitoring of the SFP optical module,
which facilitates the maintenance and upgrading of the optical
module.

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Function and
Feature

SL16A

Service processing

l Supports the VC-12 services, VC-3 services, VC-4 services,


VC-4-4c concatenation services, VC-4-8c concatenation
services, and VC-4-16c concatenation services.
l The N2SL16A supports the AU-3 services.

Overhead processing

l Processes the section overheads of the STM-16 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one channel of ECC communication.

Alarms and
performance events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Specifications of the
REG

The N2SL16A/N3SL16A board supports the setting and query of


the REG working mode.

Protection schemes

l Supports the Two-fiber ring MSP.


l Supports the Four-fiber ring MSP.
l Supports the Linear MSP.
l Supports the SNCP.
l Supports the SNCMP.
l Supports the SNCTP.
l Supports the fiber-shared virtual trail protection.
l Supports the fiber-shared MSP and processes two sets of K bytes.
One SL16A supports a maximum of two MSP rings.

Maintenance features

l Supports inloops and outloops at optical interfaces.


l The N1SL16A supports inloops on VC-4 paths. The N3SL16A
board supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not
affect services.
l Supports the query of the manufacturing information of the
board.
l Supports the in-service loading of the FPGA.
l The N2SL16A/N3SL16A board supports the TCM function.
l Supports the upgrade of the board software without affecting
services.
l Supports the Cause by Cross function.
l The N3SL16A board also supports the PRBS function in the line
direction.
l Supports the press-to-collect function in fault data collection.

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10.16.4 Working Principle and Signal Flow


The N1SL16A/N2SL16A/N3SL16A consists of the O/E converting module, MUX/DEMUX
module, SDH overhead processing module, logic and control module, and power module.
Figure 10-55 shows the functional block diagram of the N1SL16A/N2SL16A/N3SL16A.
Figure 10-55 Functional block diagram of the N1SL16A/N2SL16A/N3SL16A
155 MHz

2.488
Gbit/s

2.488
Gbit/s

O/E

DEMUX 16x155
Mbit/s

SPI
2.488
Gbit/s

2.488
Gbit/s

E/O
O/E
converting
module

MUX

16x155
Mbit/s

155 MHz
PLL

Backplane
Reference clock
Cross-connect
unit

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

MUX/
DEMUX

Frame header
Logic and
Communication
control module

IIC
LOS
Laser shutdown

+3.3 V
Power
module

Power
module

Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination -

SDH: synchronous digital hierarchy

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module


This module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
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RST sub-module
In the receive direction, the RST sub-module terminates the RSOH. That is, the RST
sub-module detects the frame alignment bytes (A1 and A2), descrambles all the bytes
except the first line of the RSOH, restores and checks the J0 byte, and checks the B1
byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

MST sub-module
In the receive direction, the MST sub-module terminates the MSOH. That is, the MST
sub-module generates the MS_AIS alarm and detects the MS_RDI alarm after detecting
the K2 byte, and detects the MS_REI alarm and generates the B2_EXC alarm after
checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the AUG, divides an AUG
into N AU-4s, detects the AU_LOP alarm and the AU_AIS alarm, and performs pointer
justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the POH. That is, the HPT submodule detects the HP_REI alarm after checking the B3 byte, generates the HP_TIM
alarm and the HP_SLM alarm and detects the HP_RDI alarm after detecting the J1 and
C2 bytes, and generates the HP_UNEQ alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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10.16.5 Front Panel


The front panel of the SL16A has indicators, interfaces, a bar code, a laser safety class label,
and an APD alarm label.

Diagram of the Front Panel


Figure 10-56 shows the appearance of the front panel of the SL16A.
Figure 10-56 Front panel of the SL16A

SL16A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

APD

Receiver
MAX:-9dBm

OUT
IN

SL16A

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

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Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SL16A has one optical interface. Table 10-76 describes the types and
usage of the optical interfaces of the SL16A.
Table 10-76 Optical interfaces of the SL16A
Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.16.6 Jumpers and DIP Switches


The SL16A does not have any jumpers or DIP switches that are used for board settings.

10.16.7 Valid Slots


The SL16A must be installed in a valid slot in the subrack. Otherwise, the SL16A fails to work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SL16A vary with the cross-connect capacity of the subrack. The slots
valid for the SL16A are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the SL16A can be installed in slots 58 and
1114.

10.16.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL16A indicates the type of optical interface.
Table 10-77 describes the relationship between the feature code of the SL16A and the type of
optical interface.

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Table 10-77 Relationship between the feature code of the SL16A and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SL16A01,
SSN2SL16A01,
SSN3SL16A01

01

I-16

SSN1SL16A02,
SSN2SL16A02,
SSN3SL16A02

02

S-16.1

SSN1SL16A03,
SSN2SL16A03,
SSN3SL16A03

03

L-16.1

SSN1SL16A04,
SSN2SL16A04,
SSN3SL16A04

04

L-16.2

SSN3SL16A06

06

I-16

SSN3SL16A07

07

S-16.1

SSN3SL16A08

08

L-16.1

SSN3SL16A09

09

L-16.2

10.16.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

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Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the SDH interface.
l J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.
l J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.
l C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent. Set
the C2 byte according to the actual service type. Generally, use the default value, which is
TUG structure.
l Laser status: Set this parameter to Open when you configure and commission the board.
For details, see 28.7 Checking Board Parameters.
NOTE

For the other parameters to be set, see 27.5 SDH Processing Boards.

Step 3 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
----End

Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing Specifications
of Optical Interfaces.
Step 2 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

10.16.10 Parameter Settings


You can set the parameters for the SL16A by using the U2000.
You can set the following parameters for the SL16A by using the U2000:
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J0

J1

J2

C2

10 SDH Boards

For the description of each parameter, see 27 Parameter Settings.

10.16.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 10-78 lists the faults that occur on the SL16A frequently and the troubleshooting methods.
NOTE

The SL16A uses the SFP optical module. When the SL16A operates and an abnormal alarm occurs on the
optical interface, check whether the optical module is properly installed. To check whether the optical
module is properly installed, you can re-seat the optical module.

Table 10-78 Methods used to troubleshoot the faults that occur on the SL16A frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service interruption

l The optical fiber


or connector
becomes
abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect
operation is
performed.
l The types or
settings of the
boards are
inconsistent.
l The optical power
becomes
abnormal.

Bit error

See Troubleshooting Bit Errors.

l The equipment
becomes faulty.
Pointer justification

l The clock
configuration is
incorrect.

See Troubleshooting Pointer Justification.

l The precision of
the external clock
source is very
low.
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Fault Symptom

Common Fault
Cause

Troubleshooting Method

Protection switching
failure

l The MSP
switching fails.

See Troubleshooting Protection Switching


Faults.

l The SNCP
switching fails.
l The clock
protection
switching fails.
NEs being
unreachable to the
U2000

l A single NE
becomes
unreachable to
the U2000.

See Troubleshooting the NEs Being


Unreachable.

l All the NEs in a


subnet become
unreachable to
the U2000.
l An NE becomes
unreachable to
the U2000
frequently.
Equipment
interconnection fault

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SL16A, see Replacing an SDH Board.

10.16.12 List of Alarms


This topic lists the alarms that may occur when the board operates.

10.16.12.1 Alarms of N1SL16A

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ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

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BIP_SD

CHIP_FAIL

C2_PDI

C2_VCAIS

FSELECT_STG

COMMUN_FAIL

FPGA_ABN

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LASER_MOD_ERR

IN_PWR_ABN

J0_MM

LP_RDI_VC12

LASER_SHUT

LOOP_ALM

LP_REI_VC3

LP_RDI_VC3

LP_REI_VC12

LP_TIM_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

LP_UNEQ_VC12

LSR_WILL_DIE

LSR_COOL_ALM

LSR_NO_FITED

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

R_LOF

POWER_ABNORMAL

OUT_PWR_ABN

SLAVE_WORKING

R_LOS

R_LOC

TEM_HA

SPARE_PATH_ALM

R_OOF

TF

TEM_LA

T_LOSEX

TU_AIS_VC3

TR_LOC

TEST_STATUS

W_R_FAIL

TU_LOP_VC12

TU_AIS_VC12

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

TU_LOP_VC3

MOD_TYPE_MISMATCH

PS

PATCH_ERR

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.16.12.2 Alarms of N2SL16A

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ALM_ALS

ALM_AU3AIS

ALM_AU3B3OVER

ALM_AU3B3SD

ALM_AU3LOP

ALM_AU3RDI

ALM_AU3REI

ALM_AU3SLM

ALM_AU3TIM

ALM_AU3UNEQ

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

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B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_FAIL

C2_PDI

C2_VCAIS

FSELECT_STG

COMMUN_FAIL

FPGA_ABN

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LASER_MOD_ERR

IN_PWR_ABN

J0_MM

LP_RDI_VC12

LASER_SHUT

LOOP_ALM

LP_REI_VC3

LP_RDI_VC3

LP_REI_VC12

LP_TIM_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

LP_UNEQ_VC12

LSR_WILL_DIE

LSR_COOL_ALM

LSR_NO_FITED

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

R_LOF

POWER_ABNORMAL

OUT_PWR_ABN

SLAVE_WORKING

R_LOS

R_LOC

TC_DEG

SPARE_PATH_ALM

R_OOF

TC_LTC

TC_EXC

T_LOSEX

TC_RDI

TC_ODI

TC_INCAIS

TC_UNEQ

TC_REI

TC_OEI

TEST_STATUS

TEM_HA

TC_TIM

TU_AIS_VC12

TF

TEM_LA

TU_LOP_VC3

TU_AIS_VC3

TR_LOC

PATCH_ERR

W_R_FAIL

TU_LOP_VC12

SWDL_PKG_NOBDSOFT

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

MOD_TYPE_MISMATCH

PS

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.16.12.3 Alarms of N3SL16A


ALM_ALS

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ALM_AU3AIS

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ALM_AU3B3SD

ALM_AU3LOP

ALM_AU3RDI

ALM_AU3REI

ALM_AU3SLM

ALM_AU3TIM

ALM_AU3UNEQ

AU_LOP

AU_AIS

AU_CMM

B2_EXC

B1_EXC

B1_SD

B3_EXC_VC3

B2_SD

B3_EXC

BD_STATUS

B3_SD

B3_SD_VC3

BIP_SD

BIP8_ECC

BIP_EXC

C2_VCAIS

CHIP_ABN

C2_PDI

COMMUN_FAIL

FPGA_ABN

CHIP_FAIL

HP_LOM

HP_RDI

FSELECT_STG

HP_SLM

HP_TIM

HP_REI

IN_PWR_ABN

J0_MM

HP_UNEQ

LASER_SHUT

LOOP_ALM

LASER_MOD_ERR

LP_RDI_VC3

LP_REI_VC12

LP_RDI_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_REI_VC3

LP_TIM_VC3

LP_UNEQ_VC12

LP_TIM_VC12

LSR_COOL_ALM

LSR_NO_FITED

LP_UNEQ_VC3

MS_AIS

MS_RDI

LSR_WILL_DIE

NO_BD_SOFT

OH_LOOP

MS_REI

R_LOS

POWER_ABNORMAL

OUT_PWR_ABN

SPARE_PATH_ALM

R_LOC

R_LOF

TC_EXC

T_LOSEX

SLAVE_WORKING

TC_ODI

TC_INCAIS

TC_DEG

TC_REI

TC_OEI

TC_LTC

TEM_HA

TC_TIM

TC_RDI

TEST_STATUS

TEM_LA

TC_UNEQ

TU_AIS_VC12

TF

TEMP_OVER

TU_LOP_VC3

TU_AIS_VC3

TR_LOC

PATCH_NOT_CONFIRM

W_R_FAIL

TU_LOP_VC12

SWDL_PKG_NOBDSOFT

PATCHFILE_NOTEXIST

PATCH_ERR

TIME_NOT_SUPPORT

PS

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WRG_BD_TYPE

IN_PWR_HIGH

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IN_PWR_LOW

DCN_FAIL

10.16.13 List of Performance Events


This topic lists the performance events that may occur when the board operates.

10.16.13.1 Performance Events of N1SL16A


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

RSOOF

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

10.16.13.2 Performance Events of N2SL16A

Issue 03 (2013-02-20)

AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

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MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

RSOOF

RSSES

RSUAS

TCBBE

TCFEBBE

TCOBBE

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

10.16.13.3 Performance Events of N3SL16A

Issue 03 (2013-02-20)

AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

RSOOF

RSSES

RSUAS

TCBBE

TCFEBBE

TCOBBE

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

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10.16.14 Technical Specifications


The technical specifications of the SL16A include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-79 lists the parameters specified for the optical interfaces of the SL16A.
Table 10-79 Parameters specified for the optical interfaces of the SL16A

Issue 03 (2013-02-20)

Parameter

Value

Nominal bit
rate

2488320 kbit/s

Line code
type

NRZ

Application
code

I-16

S-16.1

L-16.1

L-16.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode LC

Single-mode LC

Operating
wavelength
range (nm)

1266 to 1360

1260 to 1360

1280 to 1335

1500 to 1580

Launched
optical power
range (dBm)

-10 to -3

-5 to 0

-2 to +3

-2 to +3

Receiver
sensitivity
(dBm)

-18

-18

-27

-28

Minimum
overload
(dBm)

-3

-9

-9

Dispersion
tolerance (ps/
nm)

12

1600

Minimum
extinction
ratio (dB)

8.2

8.2

8.2

8.2

Maximum -20
dB spectral
width (nm)

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Parameter

Value

Minimum
side mode
suppression
ratio (dB)

10 SDH Boards

30

30

30

Table 10-80 and Table 10-81 list the parameters specified for the colored optical interfaces of
the N3SL16A.
Table 10-80 CWDM parameters specified for the colored optical interfaces of the N3SL16A
Parameter

Value
CWDM

Nominal bit rate

2488320 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

80

Launched optical power range


(dBm)

0 to 5

Operating wavelength range (nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion (ps/


nm)

1600

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral width


(nm)

Minimum side mode suppression


ratio (dB)

30

Table 10-81 DWDM parameters specified for the colored optical interfaces of the N3SL16A
Parameter

Value
DWDM

Issue 03 (2013-02-20)

Nominal bit rate

2488320 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

120

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Parameter

10 SDH Boards

Value
DWDM

Launched optical power range


(dBm)

-1 to 3

Central frequency (THz)

192.10 to 196.00

Central frequency deviation


(GHz)

10

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

2400

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral


width (nm)

0.3

Minimum side mode


suppression ratio (dB)

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL16A are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight of the N1SL16A (kg): 0.6

Weight of the N2SL16A (kg): 1.1

Weight of the N3SL16A (kg): 0.9

Power Consumption
The maximum power consumption of the N1SL16A at room temperature (25C) is 20 W.
The maximum power consumption of the N2SL16A at room temperature (25C) is 20 W.
The maximum power consumption of the N3SL16A at room temperature (25C) is 22 W.

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10.17 SLD16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLD16 (2xSTM-16 optical interface board). This topic also
describes how to configure and commission the SLD16.

10.17.1 Version Description


The SLD16 is available in one functional version, namely, N1. The N1SLD16 is discontinued.

10.17.2 Application
The SLD16 is a line board. The SLD16 can be used on the OptiX OSN equipment series to
transmit and receive STM-16 optical signals. The SLD16 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLD16 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-57 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-57 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.17.3 Functions and Features


The SLD16 receives and transmits 2xSTM-16 optical signals, processes overhead bytes, and
performs the MSP.
Table 10-82 provides the functions and features of the SLD16.

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Table 10-82 Functions and features of the SLD16


Function and
Feature

SLD16

Basic functions

Transmits and receives 2xSTM-16 optical signals.

Specifications
of the optical
interface

l Supports different types of standard optical interfaces, namely, the


I-16, S-16.1, L-16.1, and L-16.2. The characteristics of the optical
interfaces comply with ITU-T G.957 and ITU-T G.692.
l Supports the output of the standard wavelengths that comply with ITUT G.692.

Specifications
of the optical
module

l Supports the detection and query of the information about the optical
module.
l Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.
l Supports the usage and detection of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

Service
processing

Supports the VC-12 services, VC-3 services, VC-4 services, VC-4-4c


concatenation services, VC-4-8c concatenation services, and VC-4-16c
concatenation services.

Overhead
processing

l Processes the section overheads of the STM-16 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one or two channels of ECC communication.
l Supports the time synchronization feature and transmission of the time
information by using the section overhead bytes.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Specifications
of the REG

Does not support the REG.

Protection
schemes

l Supports the Two-fiber ring MSP.


l Supports the Four-fiber ring MSP.
l Supports the Linear MSP.
l Supports the SNCP.
l Supports the SNCMP.
l Supports the SNCTP.
l Supports the fiber-shared virtual trail protection.
l Supports the fiber-shared MSP and processes four sets of K bytes. A
single optical interface can process two sets of K bytes. One SLD16
supports a maximum of four MSP rings.

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Function and
Feature

SLD16

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l Supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

10.17.4 Working Principle and Signal Flow


The SLD16 consists of the O/E converting module, MUX/DEMUX module, SDH overhead
processing module, logic and control module, and power module.
Figure 10-58 shows the functional block diagram of the SLD16 by describing how to process
1xSTM-16 signals.
Figure 10-58 Functional block diagram of the SLD16
155 MHz

O/E

SPI 2.488 DEMUX 16x155


E/O
Gbit/s
Mbit/s

2.488
Gbit/s

O/E

. .
. .

2.488
Gbit/s

E/O

SPI

2.488
Gbit/s

MUX

16x155
Mbit/s

Backplane
Reference clock
Cross-connect
unit

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

MUX/
DEMUX

O/E
converting
module

155 MHz
PLL

IIC
LOS
Laser shutdown

Logic and
control module
+3.3 V
Power
module

Power
module

Frame header
Communication
Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination -

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O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after

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detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.17.5 Front Panel


The front panel of the SLD16 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-59 shows the appearance of the front panel of the SLD16.

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Figure 10-59 Front panel of the SLD16

SLD16
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2

SLD16

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SLD16 has two optical interfaces. Table 10-83 describes the types and
usage of the optical interfaces of the SLD16.
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Table 10-83 Optical interfaces of the SLD16


Interface

Type of Interface

Usage

IN1IN2

LC

Receives optical signals.

OUT1OUT2

LC

Transmits optical signals.

10.17.6 Jumpers and DIP Switches


The SLD16 does not have any jumpers or DIP switches that are used for board settings.

10.17.7 Valid Slots


The SLD16 must be installed in a valid slot in the subrack. Otherwise, the SLD16 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SLD16 vary with the cross-connect capacity of the subrack. The slots
valid for the SLD16 are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the SLD16 can be installed in slots 7, 8, 11,
and 12.

10.17.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLD16 indicates the type of optical interface.
Table 10-84 provides the relationship between the feature code of the SLD16 and the type of
optical interface.
Table 10-84 Relationship between the feature code of the SLD16 and the type of optical interface

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Board

Feature Code

Type of Optical Interface

SSN1SLD1600

00

SSN1SLD1601

01

I-16

SSN1SLD1602

02

S-16.1

SSN1SLD1603

03

L-16.1

SSN1SLD1604

04

L-16.2

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10.17.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the SDH interface.
l J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.
l J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.
l C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent. Set
the C2 byte according to the actual service type. Generally, use the default value, which is
TUG structure.
l Laser status: Set this parameter to Open when you configure and commission the board.
For details, see 28.7 Checking Board Parameters.
NOTE

For the other parameters to be set, see 27.5 SDH Processing Boards.

Step 3 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
----End

Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing Specifications
of Optical Interfaces.
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Step 2 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

10.17.10 Parameter Settings


You can set the parameters for the SLD16 by using the U2000.
You can set the following parameters for the SLD16 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.17.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 10-85 lists the faults that occur on the SLD16 frequently and the troubleshooting methods.
NOTE

The SLD16 uses the SFP optical module. When the SLD16 operates and an abnormal alarm occurs on the
optical interface, check whether the optical module is properly installed. To check whether the optical
module is properly installed, you can re-seat the optical module.

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Table 10-85 Methods used to troubleshoot the faults that occur on the SLD16 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service interruption

l The optical fiber


or connector
becomes
abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect
operation is
performed.
l The types or
settings of the
boards are
inconsistent.
l The optical power
becomes
abnormal.

Bit error

See Troubleshooting Bit Errors.

l The equipment
becomes faulty.
Pointer justification

l The clock
configuration is
incorrect.

See Troubleshooting Pointer Justification.

l The precision of
the external clock
source is very
low.
Protection switching
failure

l The MSP
switching fails.

See Troubleshooting Protection Switching


Faults.

l The SNCP
switching fails.
l The clock
protection
switching fails.
NEs being
unreachable to the
U2000

l A single NE
becomes
unreachable to
the U2000.

See Troubleshooting the NEs Being


Unreachable.

l All the NEs in a


subnet become
unreachable to
the U2000.
l An NE becomes
unreachable to
the U2000
frequently.

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Fault Symptom

Common Fault
Cause

Troubleshooting Method

Equipment
interconnection fault

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SLD16, see Replacing an SDH Board.

10.17.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

10.17.12.1 Alarms of N1SLD16

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ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_ABN

C2_PDI

C2_VCAIS

FSELECT_STG

CHIP_FAIL

COMMUN_FAIL

HP_RDI

FPGA_ABN

HP_LOM

HP_TIM

HP_REI

HP_SLM

J0_MM

HP_UNEQ

IN_PWR_ABN

LOOP_ALM

LASER_MOD_ERR

LASER_SHUT

LP_REI_VC12

LP_RDI_VC12

LP_RDI_VC3

LP_SLM_VC3

LP_REI_VC3

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_NO_FITED

LP_UNEQ_VC3

LSR_COOL_ALM

MS_RDI

LSR_WILL_DIE

MS_AIS

R_LOF

MS_REI

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NO_BD_SOFT

SPARE_PATH_ALM

OH_LOOP

OUT_PWR_ABN

TEM_LA

POWER_ABNORMAL

R_LOC

TF

R_LOS

SLAVE_WORKING

TU_AIS_VC3

T_LOSEX

TEM_HA

W_R_FAIL

TEMP_OVER

TEST_STATUS

PATCH_NOT_CONFIRM

TR_LOC

TU_AIS_VC12

TIME_NOT_SUPPORT

TU_LOP_VC12

TU_LOP_VC3

PATCHFILE_NOTEXIST

SWDL_PKG_NOBDSOFT

PATCH_ERR

PS

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.17.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

10.17.13.1 Performance Events of N1SLD16

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AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

RSOOF

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

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10.17.14 Technical Specifications


The technical specifications of the SLD16 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-86 lists the parameters specified for the optical interfaces of the SLD16.
Table 10-86 Parameters specified for the optical interfaces of the SLD16

Issue 03 (2013-02-20)

Parameter

Value

Nominal bit
rate

2488320 kbit/s

Line code
type

NRZ

Application
code

I-16

S-16.1

L-16.1

L-16.2

Transmissio
n distance
(km)

0 to 2

2 to 15

15 to 40

40 to 80

Type of fiber

Single-mode LC

Single-mode LC

Single-mode LC

Single-mode LC

Operating
wavelength
range (nm)

1266 to 1360

1260 to 1360

1280 to 1335

1500 to 1580

Launched
optical
power range
(dBm)

-10 to -3

-5 to 0

-2 to +3

-2 to +3

Receiver
sensitivity
(dBm)

-18

-18

-27

-28

Minimum
overload
(dBm)

-3

-9

-9

Dispersion
tolerance
(ps/nm)

12

1600

Minimum
extinction
ratio (dB)

8.2

8.2

8.2

8.2

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Parameter

Value

Maximum
-20 dB
spectral
width (nm)

Minimum
side mode
suppression
ratio (dB)

30

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLD16 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.9

Power Consumption
The maximum power consumption of the SLD16 at room temperature (25C) is 23 W.

10.18 SLQ16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLQ16 (4xSTM-16 optical interface board). This topic also
describes how to configure and commission the SLQ16.

10.18.1 Version Description


The SLQ16 is available in two functional versions, namely, N1 and N2. The difference between
the two versions is with regard to whether they support the TCM function and AU-3 services.
The N2SLQ16 is discontinued.
Table 10-87 describes the versions of the SLQ16.
Table 10-87 Versions of the SLQ16

Issue 03 (2013-02-20)

Item

Description

Functional Versions

The SLQ16 is available in two functional versions, namely, N1 and


N2.

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Item

Description

Differences

l Service processing: AU-3 service processing.


l Maintenance features: loopbacks on VC-4 paths and TCM
function.

Substitution

When the AU-3 services and TCM function are not required, the
N1SLQ16 and N2SLQ16 can be substituted with each other.

NOTE

When you configure the MSP or SNCP, you cannot configure the N1SLQ16 as the protection board if the
working board is the N2SLQ16 on which the TCM function is enabled or AU-3 services are configured.
Otherwise, the services are interrupted when a switching operation is performed.

10.18.2 Application
The SLQ16 is a line board. The SLQ16 can be used on the OptiX OSN equipment series to
transmit and receive STM-16 optical signals. The SLQ16 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLQ16 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-60 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-60 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.18.3 Functions and Features


The SLQ16 receives and transmits 4xSTM-16 optical signals, processes overhead bytes, and
performs the MSP.
Table 10-88 describes the functions and features of the SLQ16.
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Table 10-88 Functions and features of the SLQ16


Function and
Feature

SLQ16

Basic functions

Transmits and receives 4xSTM-16 optical signals.

Specifications of
the optical interface

Supports different types of standard optical interfaces, namely, the I-16,


S-16.1, L-16.1, and L-16.2. The characteristics of the optical interfaces
comply with ITU-T G.957 and ITU-T G.692.

Specifications of
the optical module

l Supports the detection and query of the information about the


optical module.
l Provides the ALS function. The optical interface supports the
setting of the on/off state of a laser.
l Supports the usage and detection of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

Service processing

l Supports the VC-12 services, VC-3 services, VC-4 services,


VC-4-4c concatenation services, VC-4-8c concatenation services,
and VC-4-16c concatenation services.
l The N2SLQ16 supports the AU-3 services.
l Processes the section overheads of the STM-16 signals.

Overhead
processing

l Supports the configuration of the D1-D12, E1, and E2 bytes as


transparent transmission bytes or into other unused overheads bytes.
l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one to four channels of ECC communication.

Alarms and
performance events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Specifications of
the REG

Does not support the REG.

Protection schemes

l Supports the Two-fiber ring MSP.


l Supports the Four-fiber ring MSP.
l Supports the Linear MSP.
l Supports the SNCP.
l Supports the SNCMP.
l Supports the SNCTP.
l Supports the fiber-shared virtual trail protection.
l Supports the fiber-shared MSP and processes eight sets of K bytes.
A single optical interface can process two sets of K bytes. One
SLQ16 supports a maximum of eight MSP rings.

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Function and
Feature

SLQ16

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l The N1SLQ16 supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l Supports the press-to-collect function in fault data collection.
l The N2SLQ16 supports the TCM function.
l Supports the Cause by Cross function.

10.18.4 Working Principle and Signal Flow


The SLQ16 consists of the O/E converting module, MUX/DEMUX module, SDH overhead
processing module, logic and control module, and power module.
Figure 10-61 shows the functional block diagram of the SLQ16 by describing how to process
1xSTM-16 signals.
Figure 10-61 Functional block diagram of the SLQ16
155 MHz

2.488
Gbit/s

O/E

SPI 2.488 DEMUX 16x155


E/O
Gbit/s
Mbit/s

. .
. .

2.488
Gbit/s

O/E
E/O

SPI

2.488
Gbit/s

MUX

16x155
Mbit/s

Backplane
Reference clock
Cross-connect
unit

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

MUX/
DEMUX

O/E
converting
module

155 MHz
PLL

IIC
LOS
Laser shutdown

Logic and
control module
+3.3 V
Power
module

Power
module

Frame header
Communication
Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination -

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O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier

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mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.18.5 Front Panel


The front panel of the SLQ16 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-62 shows the appearance of the front panel of the N1SLQ16.

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Figure 10-62 Front panel of the N1SLQ16

SLQ16
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

SLQ16

Figure 10-63 shows the appearance of the front panel of the N2SLQ16.

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Figure 10-63 Front panel of the N2SLQ16

SLQ16
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

SLQ16

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SLQ16 has four optical interfaces. Table 10-89 describes the types and
usage of the optical interfaces of the SLQ16.
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Table 10-89 Optical interfaces of the SLQ16


Interface

Type of Interface

Usage

IN1-IN4

LC

Receives optical signals.

OUT1-OUT4

LC

Transmits optical signals.

10.18.6 Jumpers and DIP Switches


The SLQ16 does not have any jumpers or DIP switches that are used for board settings.

10.18.7 Valid Slots


The SLQ16 must be installed in a valid slot in the subrack. Otherwise, the SLQ16 fails to work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SLQ16 are as follows:


l

When the cross-connect capacity is 200 Gbit/s,


The SLQ16 can be installed in slots 14, 15, and 16. In this case, two optical interfaces
can be configured.
The SLQ16 can be installed in slots 58 and 1114. In this case, four optical interfaces
can be configured.

10.18.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLQ16 indicates the type of optical interface.
Table 10-90 describes the relationship between the feature code of the SLQ16 and the type of
optical interface.
Table 10-90 Relationship between the feature code of the SLQ16 and the type of optical interface

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Board

Feature
Code

Type of Optical
Interface

SSN1SLQ1601, SSN2SLQ1601

01

I-16

SSN1SLQ1602, SSN2SLQ1602

02

S-16.1

SSN1SLQ1603, SSN2SLQ1603

03

L-16.1

SSN1SLQ1604, SSN2SLQ1604

04

L-16.2

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Board

Feature
Code

Type of Optical
Interface

SSN1SLQ16A10

10

I-16

SSN1SLQ16A11

11

S-16.1

SSN1SLQ16A12

12

L-16.1

SSN1SLQ16A13

13

L-16.2

10.18.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the SDH interface.
l J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.
l J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.
l C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent. Set
the C2 byte according to the actual service type. Generally, use the default value, which is
TUG structure.
l Laser status: Set this parameter to Open when you configure and commission the board.
For details, see 28.7 Checking Board Parameters.
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NOTE

For the other parameters to be set, see 27.5 SDH Processing Boards.

Step 3 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
----End

Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing Specifications
of Optical Interfaces.
Step 2 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

10.18.10 Parameter Settings


You can set the parameters for the SLQ16 by using the U2000.
You can set the following parameters for the SLQ16 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.18.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 10-91 lists the faults that occur on the SLQ16 frequently and the troubleshooting methods.
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NOTE

The SLQ16 uses the SFP optical module. When the SLQ16 operates and an abnormal alarm occurs on the
optical interface, check whether the optical module is properly installed. To check whether the optical
module is properly installed, you can re-seat the optical module.

Table 10-91 Methods used to troubleshoot the faults that occur on the SLQ16 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service interruption

l The optical fiber


or connector
becomes
abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect
operation is
performed.
l The types or
settings of the
boards are
inconsistent.
l The optical power
becomes
abnormal.

Bit error

See Troubleshooting Bit Errors.

l The equipment
becomes faulty.
Pointer justification

l The clock
configuration is
incorrect.

See Troubleshooting Pointer Justification.

l The precision of
the external clock
source is very
low.
Protection switching
failure

l The MSP
switching fails.

See Troubleshooting Protection Switching


Faults.

l The SNCP
switching fails.
l The clock
protection
switching fails.

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Fault Symptom

Common Fault
Cause

Troubleshooting Method

NEs being
unreachable to the
U2000

l A single NE
becomes
unreachable to
the U2000.

See Troubleshooting the NEs Being


Unreachable.

l All the NEs in a


subnet become
unreachable to
the U2000.
l An NE becomes
unreachable to
the U2000
frequently.
Equipment
interconnection fault

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SLQ16, see Replacing an SDH Board.

10.18.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

10.18.12.1 Alarms of N1SLQ16

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ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_ABN

C2_PDI

C2_VCAIS

FSELECT_STG

CHIP_FAIL

COMMUN_FAIL

HP_RDI

HP_REI

HP_LOM

HP_TIM

HP_UNEQ

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HP_SLM

J0_MM

LASER_MOD_ERR

IN_PWR_ABN

LOOP_ALM

LP_RDI_VC12

LASER_SHUT

LP_REI_VC12

LP_REI_VC3

LP_RDI_VC3

LP_SLM_VC3

LP_TIM_VC12

LP_SLM_VC12

LP_UNEQ_VC12

LP_UNEQ_VC3

LP_TIM_VC3

LSR_NO_FITED

LSR_WILL_DIE

LSR_COOL_ALM

MS_RDI

MS_REI

MS_AIS

PATCH_NOT_CONFIRM

OH_LOOP

NO_BD_SOFT

R_LOF

POWER_ABNORMAL

PATCH_ERR

SLAVE_WORKING

PATCHFILE_NOTEXIST

OUT_PWR_ABN

TEM_HA

R_LOS

R_LOC

TEST_STATUS

R_OOF

T_LOSEX

TU_AIS_VC12

SPARE_PATH_ALM

TEM_LA

TU_LOP_VC3

TF

TEMP_OVER

TIME_NOT_SUPPORT

TU_AIS_VC3

TR_LOC

W_R_FAIL

TU_LOP_VC12

PS

SWDL_PKG_NOBDSOFT

MOD_TYPE_MISMATCH

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.18.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

10.18.13.1 Performance Events of N1SLQ16

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AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

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MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

10.18.14 Technical Specifications


The technical specifications of the SLQ16 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-92 lists the parameters specified for the optical interfaces of the SLQ16.
Table 10-92 Parameters specified for the optical interfaces of the SLQ16

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Parameter

Value

Nominal bit rate

2488320 kbit/s

Line code type

NRZ

Application code

I-16

S-16.1

L-16.1

L-16.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode LC

Single-mode
LC

Operating
wavelength range
(nm)

1266 to 1360

1260 to 1360 1280 to 1335

1500 to 1580

Launched optical
power range (dBm)

-10 to -3

-5 to 0

-2 to +3

-2 to +3

Receiver sensitivity
(dBm)

-18

-18

-27

-28

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Parameter

Value

Minimum overload
(dBm)

-3

-9

-9

Dispersion tolerance
(ps/nm)

12

1600

Minimum extinction
ratio (dB)

8.2

8.2

8.2

8.2

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio (dB)

30

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLQ16 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight of the N1SLQ16 (kg): 0.9

Weight of the N2SLQ16 (kg): 1.3

Power Consumption
The maximum power consumption of the N1SLQ16 at room temperature (25C) is 20 W.
The maximum power consumption of the N2SLQ16 at room temperature (25C) is 35 W.

10.19 SLO16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLO16 (8xSTM-16 optical interface board). This topic also
describes how to configure and commission the SLO16.

10.19.1 Version Description


The SLO16 is available in the following functional versions: N1.

10.19.2 Application
The SLO16 is a line board. The SLO16 can be used on the OptiX OSN equipment series to
transmit and receive STM-16 optical signals. The SLO16 converts the received optical signals
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into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLO16 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-64 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-64 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.19.3 Functions and Features


The SLO16 receives and transmits 8xSTM-16 optical signals, processes overhead bytes, and
performs the MSP protection.
Table 10-93 provides the functions and features of the SLO16.
Table 10-93 Functions and features of the SLO16
Function and
Feature

SLO16

Basic functions

Transmits and receives 8xSTM-16 optical signals.

Specifications of
the optical interface

Supports different types of standard optical interfaces, namely, the I-16,


S-16.1, L-16.1, and L-16.2. The characteristics of the optical interfaces
comply with ITU-T G.957 and ITU-T G.692.

Specifications of
the optical module

l Supports the detection and query of the information about the


optical module.
l Provides the ALS function. The optical interface supports the
setting of the on/off state of a laser.
l Supports the usage and detection of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

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Function and
Feature

SLO16

Service processing

Supports the VC-12 services, VC-3 services, VC-4 services, VC-4-4c


concatenation services, VC-4-8c concatenation services, and VC-4-16c
concatenation services.

Overhead
processing

l Processes the section overheads of the STM-16 signals.


l Supports the configuration of the D1D12, E1, and E2 bytes as
transparent transmission bytes or into other unused overheads bytes.
l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one to eight channels of ECC communication.

Alarms and
performance events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Specifications of
the REG

Does not support the REG.

Protection schemes

l Supports Two-fiber ring MSP.


l Supports Four-fiber ring MSP.
l Supports Linear MSP.
l Supports SNCP.
l Supports SNCMP.
l Supports SNCTP.
l Supports the fiber-shared virtual trail protection.
l Supports the fiber-shared MSP and processes 16 sets of K bytes. A
single optical interface can process two sets of K bytes. One SLO16
supports a maximum of 16 MSP rings.

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l Supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l Supports the press-to-collect function in fault data collection.
l Supports the Cause by Cross function.

10.19.4 Working Principle and Signal Flow


The SLO16 consists of the O/E converting module, MUX/DEMUX module, SDH overhead
processing module, logic and control module, and power module.
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Figure 10-65 shows the functional block diagram of the SLO16 by describing how to process
1xSTM-16 signals.
Figure 10-65 Functional block diagram of the SLO16
155 MHz

2.488
Gbit/s

O/E

SPI 2.488 DEMUX 16x155


E/O
Gbit/s
Mbit/s

. .
. .

2.488
Gbit/s

O/E
E/O

SPI

2.488
Gbit/s

MUX

16x155
Mbit/s

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

MUX/
DEMUX

O/E
converting
module

155 MHz
PLL

Backplane
Reference clock
Cross-connect
unit

IIC
LOS
Laser shutdown

Logic and
control module
+3.3 V
Power
module

Power
module

Frame header
Communication
Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination -

SDH: synchronous digital hierarchy

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1

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and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.
l

MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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10.19.5 Front Panel


The front panel of the SLO16 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-66 shows the appearance of the front panel of the SLO16.
Figure 10-66 Front panel of the SLO16

SLO16
STAT
ACT
PROG
SRV
CLASS 1
LASER
PRODUCT

TX1
RX1
TX2
RX2
TX3
RX3
TX4
RX4
TX5
RX5
TX6
RX6
TX7
RX7
TX8
RX8

SLO16

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SLO16 has eight optical interfaces. Table 10-94 describes the types and
usage of the optical interfaces of the SLO16.
Table 10-94 Optical interfaces of the SLO16
Interface

Type of Interface

Usage

RX1RX8

LC

Receives optical signals.

TX1TX8

LC

Transmits optical signals.

10.19.6 Jumpers and DIP Switches


The SLO16 does not have any jumpers or DIP switches that are used for board settings.

10.19.7 Valid Slots


The SLO16 must be installed in a valid slot in the subrack. Otherwise, the SLO16 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SLO16 vary with the cross-connect capacity of the subrack. The slots
valid for the SLO16 are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the SLO16 can be installed in slots 7, 8, 11,
and 12 in the subrack.

10.19.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLO16 indicates the type of optical interface.
Table 10-95 provides the relationship between the feature code of the SLO16 and the type of
optical interface.
Table 10-95 Relationship between the feature code of the SLO16 and the type of optical interface

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Board

Feature Code

Type of Optical Interface

SSN1SLO1610

10

I-16

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Board

Feature Code

Type of Optical Interface

SSN1SLO1611

11

S-16.1

SSN1SLO1612

12

L-16.1

SSN1SLO1613

13

L-16.2

10.19.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the SDH interface.
l J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.
l J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.
l C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent. Set
the C2 byte according to the actual service type. Generally, use the default value, which is
TUG structure.
l Laser status: Set this parameter to Open when you configure and commission the board.
For details, see 28.7 Checking Board Parameters.
NOTE

For the other parameters to be set, see 27.5 SDH Processing Boards.

Step 3 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
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Step 4 Required: Configure services. For details, see Configuring the SDH Services.
----End

Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing Specifications
of Optical Interfaces.
Step 2 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

10.19.10 Parameter Settings


You can set the parameters for the SLO16 by using the U2000.
You can set the following parameters for the SLO16 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.19.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 10-96 lists the faults that occur on the SLO16 frequently and the troubleshooting methods.
NOTE

The SLO16 uses the SFP optical module. When the SLO16 operates and an abnormal alarm occurs on the
optical interface, check whether the optical module is properly installed. To check whether the optical
module is properly installed, you can re-seat the optical module.

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Table 10-96 Methods used to troubleshoot the faults that occur on the SLO16 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service interruption

l The optical fiber


or connector
becomes
abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect
operation is
performed.
l The types or
settings of the
boards are
inconsistent.
l The optical power
becomes
abnormal.

Bit error

See Troubleshooting Bit Errors.

l The equipment
becomes faulty.
Pointer justification

l The clock
configuration is
incorrect.

See Troubleshooting Pointer Justification.

l The precision of
the external clock
source is very
low.
Protection switching
failure

l The MSP
switching fails.

See Troubleshooting Protection Switching


Faults.

l The SNCP
switching fails.
l The clock
protection
switching fails.
NEs being
unreachable to the
U2000

l A single NE
becomes
unreachable to
the U2000.

See Troubleshooting the NEs Being


Unreachable.

l All the NEs in a


subnet become
unreachable to
the U2000.
l An NE becomes
unreachable to
the U2000
frequently.

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Fault Symptom

Common Fault
Cause

Troubleshooting Method

Equipment
interconnection fault

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SLO16, see Replacing an SDH Board.

10.19.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

10.19.12.1 Alarms of N1SLO16

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ALM_ALS

AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

C2_PDI

BIP_EXC

BIP_SD

COMMUN_FAIL

C2_VCAIS

CHIP_ABN

HP_RDI

FSELECT_STG

HP_LOM

HP_TIM

HP_REI

HP_SLM

J0_MM

HP_UNEQ

IN_PWR_ABN

LOOP_ALM

LASER_MOD_ERR

LASER_SHUT

LP_REI_VC12

LP_RDI_VC12

LP_RDI_VC3

LP_SLM_VC3

LP_REI_VC3

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_NO_FITED

LP_UNEQ_VC3

LSR_COOL_ALM

MS_RDI

LSR_WILL_DIE

MS_AIS

PATCH_ERR

MS_REI

NO_BD_SOFT

R_LOC

OH_LOOP

OUT_PWR_ABN

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SLAVE_WORKING

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

PS

POWER_ABNORMAL

R_LOF

R_LOS

T_LOSEX

TEM_HA

TEST_STATUS

TEM_LA

TEMP_OVER

TU_AIS_VC12

TF

TR_LOC

TU_LOP_VC3

R_OOF

DCN_FAIL

BIP8_ECC

TU_AIS_VC3

TU_LOP_VC12

LSR_INVALID

SWDL_PKG_NOBDSOFT

MOD_TYPE_MISMATCH

AU_CMM

CHIP_FAIL

SPARE_PATH_ALM

W_R_FAIL

IN_PWR_HIGH

IN_PWR_LOW

WRG_BD_TYPE

10.19.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

10.19.13.1 Performance Events of N1SLO16

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AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

RSOOF

RSSES

RSUAS

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TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

XCSTMPCUR

XCSTMPMAX

XCSTMPMIN

10.19.14 Technical Specifications


The technical specifications of the SLO16 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-97 lists the parameters specified for the optical interfaces of the SLO16.
Table 10-97 Parameters specified for the optical interfaces of the SLO16

Issue 03 (2013-02-20)

Parameter

Value

Nominal bit rate

2488320 kbit/s

Line code pattern

NRZ

Application code

I-16

S-16.1

L-16.1

L-16.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode LC

Single-mode
LC

Operating
wavelength range
(nm)

1266 to 1360

1260 to 1360 1280 to 1335

1500 to 1580

Launched optical
power range (dBm)

-10 to -3

-5 to 0

-2 to +3

-2 to +3

Receiver sensitivity
(dBm)

-18

-18

-27

-28

Minimum overload
(dBm)

-3

-9

-9

Dispersion tolerance
(ps/nm)

12

1600

Minimum extinction
ratio (dB)

8.2

8.2

8.2

8.2

Maximum -20 dB
spectral width (nm)

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Parameter

Value

Minimum side mode


suppression ratio (dB)

10 SDH Boards

30

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLO16 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the N1SLO16 at room temperature (25C) is 38 W.

10.20 SF16
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SF16 (1xSTM-16 optical interface board with the out-band FEC
function).

10.20.1 Version Description


The SF16 is available in one functional version, namely, N1.

10.20.2 Application
The SF16 is a line board. The SF16 can be used on the OptiX OSN equipment series to transmit
and receive STM-16 optical signals. The SF16 converts the received optical signals into
electrical signals and sends the electrical signals to the cross-connect side. In addition, the SF16
converts the electrical signals sent from the cross-connect side into optical signals and transmits
the optical signals.
Figure 10-67 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.

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Figure 10-67 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.20.3 Functions and Features


The SF16 receives and transmits 1xOTU1 optical signals (2.666 Gbit/s with the FEC function)
and processes overhead bytes.
Table 10-98 provides the functions and features of the SF16.
Table 10-98 Functions and features of the SF16
Function and
Feature

SF16

Basic functions

l Receives and transmits 1xOTU1 optical signals (2.666 Gbit/s with the
FEC function).
l Supports the enabling or disabling of the FEC function.

Specifications
of the optical
interface

l Supports different types of standard optical interfaces, namely, the


Ue-16.2c, Ue-16.2d, and Ue-16.2f. The characteristics of the optical
interfaces comply with the standards defined by Huawei.
l Supports the output of the standard wavelengths that comply with ITUT G.692 and can be directly connected to the DWDM equipment.
l Supports the DWDM colored optical interfaces. The optical interface
uses the LC connector. The DWDM optical interface supports the
transmission distance of 640 km.

Specifications
of the optical
module

l Supports the detection and query of the information about the optical
module.
l Supports fixed optical modules.
l Provides the ALS function. The optical interface supports the setting of
the on/off state of a laser.

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Function and
Feature

SF16

Service
processing

l Supports the VC-12 services, VC-3 services, VC-4 services, VC-4-4c


concatenation services, VC-4-8c concatenation services, and VC-4-16c
concatenation services.
l Encapsulates and encodes the signals with the FEC function, and
processes overhead bytes, which comply with ITU-T G.709.

Overhead
processing

l Supports the processing of the OTU, ODU, and OPU overhead bytes,
performance monitoring, and alarm detection, which comply with ITUT G.709.
l Processes the section overheads of the STM-16 signals.
l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one channel of ECC communication.

Alarms and
performance
events

l Reports various alarms and performance events.

Specifications
of the REG

Does not support the REG.

Protection
schemes

l Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

l Supports the alarms and performance events that are related to the OTU
layer, ODU layer, OPU layer, and FEC function.

l Supports the fiber-shared MSP and SNCP and processes two sets of K
bytes. One SF16 supports a maximum of two MSP protection rings.
Maintenance
features

l Supports inloops and outloops at optical interfaces.


l Supports inloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

10.20.4 Working Principle and Signal Flow


The SF16 consists of the O/E converting module, MUX/DEMUX module, FEC module, SDH
overhead processing module, logic and control module, and power module.
Figure 10-68 shows the functional block diagram of the SF16.

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Figure 10-68 Functional block diagram of the SF16


155 MHz PLL

2.666
Gbit/s

2.666
Gbit/s

2.666
Gbit/s

O/E
S
P
I

DEMUX

16x166
Mbit/s

Reference clock

155 MHz PLL

K1 and K2 insertion/
extraction

16x155
Mbit/s

K1 and K2

High-speed
bus

FEC

2.666
Gbit/s

E/O

16x166
Mbit/s

155 MHz

16x155
Mbit/s

RST

MST

MSA

HPT

High-speed
bus

MUX
DCC
SDH overhead processing
module

166 MHz PLL

Frame header

IIC
LOS
Laser shutdown

Logic and
control module
+3.3 V
DC/DC
converter

Communication

Fuse

DC/DC
converter

Cross-connect
unit

Cross-connect
unit
Cross-connect
unit
Cross-connect
unit
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse

+3.3 V backup
power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

The functional modules are described as follows:

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the SDH overhead processing module into high rate electrical signals.

In the upstream direction, the reverse process is performed. The FEC encoding and
decoding module receives the 2.666 Gbit/s signals from the DEMUX module. After frame
searching, FEC encoding, data packets encapsulation, and scrambling in the FEC module,
the 2.488 Gbit/s signals are recovered and then transmitted to the SDH overhead processing
module. The frame format of the 2.666 Gbit/s signals complies with ITU G.709.

In the downstream direction, the FEC encoding and decoding module receives 2.488 Gbit/
s SDH signals, which are sent by the SDH overhead processing module. After frame

FEC Module

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searching, FEC encoding, data packet encapsulation, and scrambling, the 2.488 Gbit/s SDH
signals are converted into 2.666 Gbit/s signals and then transmitted to the MUX module.
l

The FEC processing module is connected to the logic and control module through a CPU
bus. The CPU controls the working modes of the FEC module by configuring the internal
register. The working mode can be the regenerator mode, namely, REG mode. The CPU
can monitor the performance through the internal register.

SDH Overhead Processing Module


This module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the RSOH. That is, the RST
sub-module detects the frame alignment bytes (A1 and A2), descrambles all the bytes
except the first line of the RSOH, restores and checks the J0 byte, and checks the B1
byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

MST sub-module
In the receive direction, the MST sub-module terminates the MSOH. That is, the MST
sub-module generates the MS_AIS alarm and detects the MS_RDI alarm after detecting
the K2 byte, and detects the MS_REI alarm and generates the B2_EXC alarm after
checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the AUG, divides an AUG
into N AU-4s, detects the AU_LOP alarm and the AU_AIS alarm, and performs pointer
justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the POH. That is, the HPT submodule detects the HP_REI alarm after checking the B3 byte, generates the HP_TIM
alarm and the HP_SLM alarm and detects the HP_RDI alarm after detecting the J1 and
C2 bytes, and generates the HP_UNEQ alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

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10 SDH Boards

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.20.5 Front Panel


The front panel of the SF16 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-69 shows the appearance of the front panel of the SF16.
Figure 10-69 Front panel of the SF16

SF16
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT

IN

SF16

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Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SF16 has one optical interface. Table 10-99 describes the types and usage
of the optical interfaces of the SF16.
NOTE

The SF16 uses the unswappable optical module.

Table 10-99 Optical interfaces of the SF16


Interface

Type of
Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.20.6 Valid Slots


The slots valid for the SF16 vary with the cross-connect capacity of the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SF16 are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the SF16 can be installed in slots 58 and
1114.

10.20.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SF16 indicates the type of optical interface.
Table 10-100 provides the relationship between the feature code of the SF16 and the type of
optical interface.
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Table 10-100 Relationship between the feature code of the SF16 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SF1600

00

Colored optical interface

SSN1SF1601

01

Ue-16.2c/Ue-16.2d/Ue-16.2f

10.20.8 Parameter Settings


You can set the parameters for the SF16 by using the U2000.
You can set the following parameters for the SF16 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.20.9 Technical Specifications


The technical specifications of the SF16 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-101 lists the parameters specified for the optical interfaces of the SF16.
Table 10-101 Parameters specified for the optical interfaces of the SF16

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Parameter

Value

Nominal bit rate

2666057.143 kbit/s

Processing capability

1xSTM-16 standard services or concatenation services

Line code pattern

NRZ

Application codea

Ue-16.2c

Ue-16.2d

Ue-16.2f

FEC + BA (14) +
PA

FEC + BA (17) +
PA

FEC + BA (17) + RA + PA

Type of fiber

Single-mode LC

Single-mode LC

Single-mode LC

Operating
wavelength range
(nm)

1550.12

Launched optical
power range (dBm)b

-5 to -1

-5 to -1

-5 to -1

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Parameter

Value

Launched optical
power range (dBm)c

13 to 15

13 to 15

15 to 18

Receiver sensitivity
(dBm)b

-27.5

-27.5

-27.5

Receiver sensitivity
(dBm)d

-37

-37

-42

Minimum overload
(dBm)d

-10

-10

-10

Minimum extinction
ratio (dB)b

10

10

10

Dispersion tolerance
(ps/nm)

12800

12800

12800

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio
(dB)

30

30

30

a: The numbers in the brackets indicate the corresponding parameter values. For example,
"BA (14)" indicates that the optical power amplified by the BA is 14 dBm. "FEC + BA + PA
+ RA" indicates that the specifications of the optical interface are measured when the FEC,
BA, PA, and Raman amplifier are used.
b: The parameter values are applicable only to the optical modules. The parameter values of
the amplifier are not provided.
c: The parameter values are applicable to the BA.
d: The parameter values are applicable to the PA.

Table 10-102 lists the parameters specified for the colored optical interfaces of the SF16.
Table 10-102 Parameters specified for the colored optical interfaces of the SF16
Parameter

Value
DWDM

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Nominal bit rate

2666057.143 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

640

Launched optical power range (dBm)

-2 to 2.5

Central frequency (THz)

192.1 to 196.0

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Parameter

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Value
DWDM

Central frequency deviation (GHz)

20

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion (ps/nm)

10880

Minimum extinction ratio (dB)

10

Maximum -20 dB spectral width (nm)

0.1

Minimum side mode suppression ratio


(dB)

35

Optical signal-to-noise ratio (dB)

With the FEC: 16


Without the FEC: 21

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SF16 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.1

Power Consumption
The maximum power consumption of the SF16 at room temperature (25C) is 26 W.

10.21 SL64
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SL64 (1xSTM-64 optical interface board). This topic also
describes how to configure and commission the SL64.

10.21.1 Version Description


The SL64 is available in several functional versions. The N2SL64 is discontinued. The functions
provided by the functional versions are different.
Table 10-103 describes the versions of the SL64.
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Table 10-103 Versions of the SL64


Item

Description

Functional versions

The SL64 is available in the following functional versions: N4, N2


and N1.

Differences

l The N1SL64/N4SL64 supports the board version replacement


function, but does not support the TCM function or AU-3 services.
l The N2SL64 does not support the board version replacement
function, but supports the TCM function and AU-3 services, the
TCM function and AU-3 services cannot be available at the same
time.
l The N4SL64 supports pluggable XFP optical modules.
l The N4SL64 detects and reports voltage performance.
l SL64 boards of different versions support different loopback
functions. For details, see 10.21.3 Functions and Features.

Substitution

When the TCM function and AU-3 services are not required, the
N1SL64 can substitute for the N2SL64.
The N4SL64 supports the board version replacement function to
substitute for the N1SL64/N2SL64.

NOTE

l When you configure the MSP or SNCP, you cannot configure the N1SL64 as the protection board if
the working board is the N2SL64 on which the TCM function is enabled or AU-3 services are
configured. Otherwise, the services are interrupted when a switching operation is performed.

10.21.2 Application
The SL64 is a line board. The SL64 can be used on the OptiX OSN equipment series to transmit
and receive STM-64 optical signals. The SL64 converts the received optical signals into
electrical signals and sends the electrical signals to the cross-connect side. In addition, the SL64
converts the electrical signals sent from the cross-connect side into optical signals and transmits
the optical signals.
Figure 10-70 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.

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Figure 10-70 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.21.3 Functions and Features


The SL64 receives and transmits 1xSTM-64 optical signals and processes overhead bytes.
Table 10-104 describes the functions and features of the SL64.
Table 10-104 Functions and features of the SL64

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Function
and Feature

SL64

Basic
functions

Transmits and receives 1xSTM-64 optical signals.

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Function
and Feature

SL64

Specifications
of the optical
interface

l The N1SL64/N2SL64 supports different types of standard optical


interfaces, namely, the I-64.1, I-64.2, S-64.2b, L-64.2b (BA), Le-64.2,
Ls-64.2, and V-64.2b (BA + PA + dispersion compensation unit (DCU)).
The characteristics of the optical interfaces of the S-64.2b, L-64.2b,
Ls-64.2, and V-64.2b types comply with ITU-T G.691 and ITU-T G.692.
The characteristics of the optical interface of the Le-64.2 type comply
with the standards defined by Huawei.
l The N4SL64 supports different types of standard optical interfaces,
namely, the I-64.1, S-64.2b, Le-64.2, P1L1-2D2, and V-64.2b (BA + PA
+ DCU). The characteristics of the optical interfaces of the I-64.1,
S-64.2b, Le-64.2, and V-64.2b types comply with ITU-T G.691. The
characteristics of the optical interface of the P1L1-2D2 type comply with
ITU-T G.959.
l The N1SL64/N2SL64 supports the DWDM colored optical interfaces,
which use LC connectors. The DWDM optical interface supports the
transmission distance of 40 km.
l The N4SL64 supports the CWDM and DWDM colored optical
interfaces. The optical interface uses the LC connector. The CWDM
optical interface supports the transmission distance of 70 km, and the
DWDM optical interface supports the transmission distance of 40 km and
80 km.
l Supports the output of the standard wavelengths that comply with ITUT G.692 and can be directly connected to the WDM equipment.

Specifications
of the optical
module

l Supports the detection and query of the information about the optical
module.
l N1SL64/N2SL64 supports fixed optical modules.
l Provides the ALS function. The optical interface supports the setting of
the on/off state of a laser.
l The N4SL64 supports the usage and detection of the pluggable XFP
optical module, which facilitates the maintenance and upgrading of the
optical module.

Service
processing

l Supports the VC-12 services, VC-3 services, and VC-4 services.


l The N1SL64 and N2SL64 support the VC-4-4c concatenation services,
VC-4-8c concatenation services, Vc-4-16c concatenation services, and
VC-4-64c concatenation services.
l The N2SL64 supports the AU-3 services.

Overhead
processing

l Processes the section overheads of the STM-64 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one channel of ECC communication.

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Function
and Feature

SL64

Alarms and
performance
events

l Reports various alarms and performance events.

Specifications
of the REG

Supports the setting and query of the REG working mode.

Protection
schemes

l Supports Two-fiber ring MSP.

10 SDH Boards

l Supports Four-fiber ring MSP.


l Supports Linear MSP.
l Supports SNCP.
l Supports SNCMP.
l Supports SNCTP.
l Supports the fiber-shared virtual trail protection.
l Supports the fiber-shared MSP and processes two sets of K bytes. One
SL64 supports a maximum of two MSP rings.

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l The N1SL64/N4SL64 supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l The N2SL64 supports the TCM function.
l Supports the upgrade of the board software without affecting services.
l Supports the press-to-collect function in fault data collection.
l The N4SL64 detects and reports voltage performance.
l Supports the Cause by Cross function.
l The N4SL64 also supports the PRBS function in the line direction.

10.21.4 Working Principle and Signal Flow


The SL64 consists of the O/E converting module, MUX/DEMUX Module, SDH overhead
processing module, logic and control module, and power module.
Figure 10-71 shows the functional block diagram of the N1SL64/N2SL64/N4SL64.

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Figure 10-71 Functional block diagram of the N1SL64/N2SL64/N4SL64


622 MHz

9.953
Gbit/s

9.953
Gbit/s

O/E

DEMUX 16x622
Mbit/s

SPI
9.953
Gbit/s

9.953
Gbit/s

E/O
O/E
converting
module

MUX

16x622
Mbit/s

MUX/
DEMUX

622 MHz
PLL

Backplane
Reference clock
Cross-connect
unit

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module
Frame header
Logic and
Communication
control module

IIC
LOS
Laser shutdown

+3.3 V
Power
module

Power
module

Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination -

SDH: synchronous digital hierarchy

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module


This module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the RSOH. That is, the RST
sub-module detects the frame alignment bytes (A1 and A2), descrambles all the bytes
except the first line of the RSOH, restores and checks the J0 byte, and checks the B1
byte.

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In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.
l

MST sub-module
In the receive direction, the MST sub-module terminates the MSOH. That is, the MST
sub-module generates the MS_AIS alarm and detects the MS_RDI alarm after detecting
the K2 byte, and detects the MS_REI alarm and generates the B2_EXC alarm after
checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the AUG, divides an AUG
into N AU-4s, detects the AU_LOP alarm and the AU_AIS alarm, and performs pointer
justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the POH. That is, the HPT submodule detects the HP_REI alarm after checking the B3 byte, generates the HP_TIM
alarm and the HP_SLM alarm and detects the HP_RDI alarm after detecting the J1 and
C2 bytes, and generates the HP_UNEQ alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.21.5 Front Panel


The front panel of the SL64 has indicators, interfaces, a bar code, a laser safety class label, and
an APD alarm label.
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Diagram of the Front Panel


Figure 10-72 shows the appearance of the front panel of the .
Figure 10-72 Appearance of the front panel of the SL64

SL64
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

APD

Receiver
MAX:-9dBm

OUT

IN

SL64

Figure 10-73 shows the appearance of the N4SL64.

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Figure 10-73 Appearance of the front panel of the N4SL64

SL64
STAT
ACT
PROG
SRV
CLASS 1
LASER
PRODUCT

OUT

IN

SL64

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SL64 has one optical interface. Table 10-105 describes the types and
usage of the optical interfaces of the SL64.
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Table 10-105 Optical interfaces of the SL64


Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.21.6 Jumpers and DIP Switches


The SL64 does not have any jumpers or DIP switches that are used for board settings.

10.21.7 Valid Slots


The SL64 must be installed in a valid slot in the subrack. Otherwise, the SL64 fails to work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SL64 vary with the cross-connect capacity of the subrack. The slots valid
for the SL64 are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the N1SL64 can be installed in slots 7, 8,
11, and 12; the N4SL64 can be installed in slots 5-8 and 11-14.

10.21.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL64 indicates the type of optical interface.
Table 10-106 describes the relationship between the feature code of the SL64 and the type of
optical interface.
Table 10-106 Relationship between the feature code of the SL64 and the type of optical interface

Issue 03 (2013-02-20)

Board

Feature Code

Type of Optical Interface

SSN1SL6400

00

Fixed-wavelength optical
interface

SSN4SL6401M01

01M01

Fixed-wavelength optical
interface

SSN1SL6401

01

I-64.2

SSN1SL6402, SSN4SL6402

02

S-64.2b

SSN1SL6403

03

Le-64.2

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Board

Feature Code

Type of Optical Interface

SSN1SL6404

04

Ls-64.2

SSN1SL6405

05

L-64.2b

SSN1SL6406

06

V-64.2b

SSN2SL6400

00

Fixed-wavelength optical
interface

SSN2SL6411

11

I-64.2

SSN2SL6412

12

S-64.2b

SSN2SL6413

13

Le-64.2

SSN2SL6404

04

Ls-64.2

SSN2SL6415

15

L-64.2b

SSN2SL6416

16

V-64.2b

SSN4SL6401

01

I-64.1

SSN4SL6403

03

P1L1-2D2

SSN4SL6404

04

V-64.2b

SSN4SL6405

05

Le-64.2

10.21.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End
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Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the SDH interface.
l J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.
l J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.
l C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent. Set
the C2 byte according to the actual service type. Generally, use the default value, which is
TUG structure.
l Laser status: Set this parameter to Open when you configure and commission the board.
For details, see 28.7 Checking Board Parameters.
NOTE

For the other parameters to be set, see 27.5 SDH Processing Boards.

Step 3 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
----End

Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing Specifications
of Optical Interfaces.
Step 2 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

10.21.10 Parameter Settings


You can set the parameters for the SL64 by using the U2000.
You can set the following parameters for the SL64 by using the U2000:
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J0

J1

J2

C2

10 SDH Boards

For the description of each parameter, see 27 Parameter Settings.

10.21.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 10-107 lists the faults that occur on the SL64 frequently and the troubleshooting methods.
Table 10-107 Methods used to troubleshoot the faults that occur on the SL64 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service interruption

l The optical fiber


or connector
becomes
abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect
operation is
performed.
l The types or
settings of the
boards are
inconsistent.
l The optical power
becomes
abnormal.

Bit error

See Troubleshooting Bit Errors.

l The equipment
becomes faulty.
Pointer justification

l The clock
configuration is
incorrect.

See Troubleshooting Pointer Justification.

l The precision of
the external clock
source is very
low.

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Fault Symptom

Common Fault
Cause

Troubleshooting Method

Protection switching
failure

l The MSP
switching fails.

See Troubleshooting Protection Switching


Faults.

l The SNCP
switching fails.
l The clock
protection
switching fails.
NEs being
unreachable to the
U2000

l A single NE
becomes
unreachable to
the U2000.

See Troubleshooting the NEs Being


Unreachable.

l All the NEs in a


subnet become
unreachable to
the U2000.
l An NE becomes
unreachable to
the U2000
frequently.
Equipment
interconnection fault

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SL64, see Replacing an SDH Board.

10.21.12 List of Alarms


This topic lists the alarms that may occur when the board operates.

10.21.12.1 Alarms of N1SL64

Issue 03 (2013-02-20)

ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

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BIP_SD

CHIP_ABN

C2_PDI

C2_VCAIS

FPGA_ABN

CHIP_FAIL

COMMUN_FAIL

HP_RDI

FSELECT_STG

HP_LOM

HP_TIM

HP_REI

HP_SLM

J0_MM

HP_UNEQ

IN_PWR_ABN

LOOP_ALM

LASER_MOD_ERR

LASER_SHUT

LP_REI_VC12

LP_RDI_VC12

LP_RDI_VC3

LP_SLM_VC3

LP_REI_VC3

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_NO_FITED

LP_UNEQ_VC3

LSR_COOL_ALM

MS_RDI

LSR_WILL_DIE

MS_AIS

R_LOF

MS_REI

NO_BD_SOFT

SLAVE_WORKING

OH_LOOP

OUT_PWR_ABN

TC_DEG

POWER_ABNORMAL

R_LOC

TC_LTC

R_LOS

R_OOF

TC_RDI

SPARE_PATH_ALM

T_LOSEX

TC_UNEQ

TC_EXC

TC_INCAIS

TEMP_OVER

TC_ODI

TC_OEI

TR_LOC

TC_REI

TC_TIM

TU_LOP_VC12

TEM_HA

TEM_LA

PATCHFILE_NOTEXIST

TEST_STATUS

TF

PS

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC3

PATCH_NOT_CONFIRM

W_R_FAIL

PATCH_ERR

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

MOD_TYPE_MISMATCH

10.21.12.2 Alarms of N2SL64

Issue 03 (2013-02-20)

ALM_ALS

ALM_AU3AIS

ALM_AU3B3OVER

ALM_AU3B3SD

ALM_AU3LOP

ALM_AU3RDI

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ALM_AU3REI

ALM_AU3SLM

ALM_AU3TIM

ALM_AU3UNEQ

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

DID_ERROR

BIP_EXC

BIP_SD

BIP8_ECC

C2_PDI

C2_VCAIS

CHIP_FAIL

COMMUN_FAIL

FPGA_ABN

FSELECT_STG

HP_LOM

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

IN_PWR_ABN

J0_MM

LASER_MOD_ERR

LASER_SHUT

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

LSR_COOL_ALM

LSR_NO_FITED

LSR_WILL_DIE

MS_AIS

MS_RDI

MS_REI

NO_BD_SOFT

R_LOF

OH_LOOP

OUT_PWR_ABN

SLAVE_WORKING

POWER_ABNORMAL

R_LOC

TC_DEG

R_LOS

R_OOF

TC_LTC

SPARE_PATH_ALM

T_LOSEX

TC_RDI

TC_EXC

TC_INCAIS

TC_UNEQ

TC_ODI

TC_OEI

TEST_STATUS

TC_REI

TC_TIM

TU_AIS_VC12

TEM_HA

TEM_LA

TU_LOP_VC3

TF

TR_LOC

PATCH_ERR

TU_AIS_VC3

TU_LOP_VC12

SWDL_PKG_NOBDSOFT

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_NOT_CONFIRM

PS

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

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10.21.12.3 Alarms of N4SL64

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ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_ABN

C2_PDI

C2_VCAIS

FPGA_ABN

CHIP_FAIL

COMMUN_FAIL

HP_RDI

FSELECT_STG

HP_LOM

HP_TIM

HP_REI

HP_SLM

J0_MM

HP_UNEQ

IN_PWR_ABN

LOOP_ALM

LASER_MOD_ERR

LASER_SHUT

LP_REI_VC12

LP_RDI_VC12

LP_RDI_VC3

LP_SLM_VC3

LP_REI_VC3

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_INVALID

LP_UNEQ_VC3

LSR_COOL_ALM

MOD_TYPE_MISMATCH

LSR_NO_FITED

LSR_WILL_DIE

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

PATCH_ERR

PATCH_NOT_CONFIRM

OUT_PWR_ABN

R_LOC

POWER_ABNORMAL

PATCHFILE_NOTEXIST

R_OOF

R_LOF

PS

T_LOSEX

SLAVE_WORKING

R_LOS

TEMP_OVER

TEM_HA

SPARE_PATH_ALM

TIME_NOT_SUPPORT

TEST_STATUS

TEM_LA

TU_AIS_VC3

TR_LOC

TF

W_R_FAIL

TU_LOP_VC12

TU_AIS_VC12

TU_LOP_VC3

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

WRG_BD_TYPE

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10.21.13 List of Performance Events


This topic lists the performance events that may occur when the board operates.

10.21.13.1 Performance Events of N1SL64


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

RSOOF

RSSES

RSUAS

TCBBE

TCFEBBE

TCOBBE

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

10.21.13.2 Performance Events of N2SL64

Issue 03 (2013-02-20)

AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

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OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

RSOOF

RSSES

RSUAS

TCBBE

TCFEBBE

TCOBBE

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

10.21.13.3 Performance Events of N4SL64


RSBBE

RSES

RSSES

RSUAS

RSCSES

RSOOF

RSOFS

MSBBE

MSES

MSUAS

MSCSES

MSSES

MSFEBBE

MSFEES

MSFESES

MSFEUAS

MSFECSES

AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

HPFESES

HPFEUAS

HPFECSES

TLBMAX

TLBMIN

TLBCUR

OSPICCVMAX

OSPICCVMIN

OSPICCVCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

INVOLTMAX

INVOLTMIN

INVOLTCUR

10.21.14 Technical Specifications


The technical specifications of the SL64 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

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Parameters Specified for Optical Interfaces


Table 10-108 and Table 10-109 list the parameters specified for the optical interfaces of the
SL64.
Table 10-108 Parameters specified for the optical interfaces of the N1SL64/N2SL64

Issue 03 (2013-02-20)

Paramet
er

Value

Nominal
bit rate

9953280 kbit/s

Line code
type

NRZ

Applicati
on code

I-64.1

I-64.2

S-64.
2b

L-64.2b (BA)

Le-64
.2

Ls-64
.2

V-64.2b (BA +
PA + DCU)

Transmiss
ion
distance
(km)

0 to 2

0 to
25

2 to 40

35 to 80

35 to
60

55 to
80

80 to 120

Type of
fiber

Singl
emode
LC

Singl
emode
LC

Single
-mode
LC

Single-mode
LC

Singl
emode
LC

Singl
emode
LC

Single-mode LC

Operating
wavelengt
h range
(nm)

1290
to
1330

1530
to
1565

1530
to
1565

1530 to 1565

1530
to
1565

1530
to
1565

1550.12

Mean
launched
optical
power
(dBm)

-6 to
-1

-5 to
-1

-1 to
+2

-4 to +2
(without the
BA)

0 to 4

4 to 7

-4 to -1 (without
the BA, PA, or
DCU)

Receiver
sensitivity
(dBm)

-11

Minimum
overload
(dBm)

-1

-1

-1

-1

-8

-8

-1

Minimum
extinction
ratio (dB)

8.2

8.2

8.2

8.2

8.2

8.2

13 to 15 (with
the BA)
-14

-14

-14

13 to 15 (with the
BA)
-21

-21

-14 (without the


PA, BA, or DCU)
-26 (with the PA)

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Paramet
er

Value

Dispersio
n
tolerance
(ps/nm)

6.6

500

800

1600

1200

1600

2040 (with the


DCU)

Maximum
-20 dB
spectral
width
(nm)

Minimum
side mode
suppressi
on ratio
(dB)

30

30

30

30

30

30

30

"BA + PA + DCU" indicates that the specifications of the V-64.2b optical interface are
measured when the BA, PA, and DCU are used.
The dispersion coefficient of the G.652 fiber is 17 ps/nm when the transmission wavelength
is 1550.12 nm. Therefore, the dispersion tolerance of the SL64 is 2040 ps/nm when it works
with the BA, PA, and DCU. (The dispersion compensation distance is 80 km.)

Table 10-109 Parameters specified for the optical interfaces of the N4SL64

Issue 03 (2013-02-20)

Parameter

Value

Nominal bit
rate

9953280 kbit/s

Line code type

NRZ

Application
code

I-64.1

S-64.2b

Le-64.2

P1L1-2D
2

V-64.2b (BA + PA +
DCU)

Transmission
distance (km)

0 to 2

2 to 40

35 to 60

40 to 80

80 to 120

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Single-mode LC

Operating
wavelength
range (nm)

1290 to
1330

1530 to
1565

1530 to
1565

1530 to
1565

1550.12

Mean launched
optical power
(dBm)

-6 to -1

-1 to +2

0 to 4

0 to 4

-4 to -1 (without the BA,


PA, or DCU)

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Parameter

Value

Receiver
sensitivity
(dBm)

-11

Minimum
overload
(dBm)

-1

-1

-8

-7

-1

Minimum
extinction ratio
(dB)

8.2

8.2

8.2

Dispersion
tolerance (ps/
nm)

200

800

1600

1600

2040 (with the DCU)

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

30

30

30

-14

-21

-24

-14 (without the PA, BA,


or DCU)
-26 (with the PA)

"BA + PA + DCU" indicates that the specifications of the V-64.2b optical interface are
measured when the BA, PA, and DCU are used.
The dispersion coefficient of the G.652 fiber is 17 ps/nm when the transmission wavelength
is 1550.12 nm. Therefore, the dispersion tolerance of the SL64 is 2040 ps/nm when it works
with the BA, PA, and DCU. (The dispersion compensation distance is 80 km.)

Table 10-110 lists the parameters specified for the colored optical interfaces of the N1SL64 and
N2SL64.
Table 10-111 and Table 10-112 list the parameters specified for the colored optical interfaces
of the N4SL64.
Table 10-110 Parameters specified for the colored optical interfaces of the N1SL64 and N2SL64
Parameter

Value
DWDM

Issue 03 (2013-02-20)

Nominal bit rate

9953280 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

40

Launched optical power range (dBm)

-4 to -1

Central frequency (THz)

192.1 to 196.0

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Value
DWDM

Central frequency deviation (GHz)

12.5

Receiver sensitivity (dBm)

-14

Minimum overload (dBm)

-1

Maximum allowed dispersion (ps/nm)

800

Minimum extinction ratio (dB)

10

Maximum -20 dB spectral width (nm)

0.3

Minimum side mode suppression ratio (dB)

35

Optical signal-to-noise ratio (dB)

22

Table 10-111 CWDM parameters specified for the colored optical interfaces of the N4SL64
Parameter

Value
CWDM

Nominal bit rate

9953280 kbit/s

Type of fiber

Single-mode LC

Transmission distance
(km)

70

Launched optical power


range (dBm)

0 to 4

Operating wavelength
range (nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

l 1451 to 1551 nm: -23


l 1571 nm: -22
l 1591 to 1611 nm: -21

Issue 03 (2013-02-20)

Minimum overload (dBm)

-9

Maximum allowed
dispersion (ps/nm)

1400

Minimum extinction ratio


(dB)

8.2

Maximum -20 dB spectral


width (nm)

Minimum side mode


suppression ratio (dB)

30

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Table 10-112 DWDM parameters specified for the colored optical interfaces of the N4SL64
Parameter

Value
DWDM

Nominal bit rate

9953280kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

40

80

Launched optical power


range (dBm)

-1 to 2

-1 to 3

Central frequency (THz)

192.1 to 196.0

192.1 to 196.0

Central frequency deviation


(GHz)

10

10

Receiver sensitivity (dBm)

-17

-24

Minimum overload (dBm)

-1

-9

Maximum allowed dispersion


(ps/nm)

800

1600

Minimum extinction ratio


(dB)

9.5

8.2

Maximum -20 dB spectral


width (nm)

0.3

0.3

Minimum side mode


suppression ratio (dB)

35

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL64 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.1

Power Consumption
The maximum power consumption of the N1SL64 at room temperature (25C) is 30 W.
The maximum power consumption of the N2SL64 at room temperature (25C) is 32 W.
The maximum power consumption of the N4SL64 at room temperature (25C) is 15 W.
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10.22 SLD64
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLD64 (2xSTM-64 optical interface board). This topic also
describes how to configure and commission the SLD64.

10.22.1 Version Description


The SLD64 is available in the following functional versions: N1

10.22.2 Application
The SLD64 is a line board. The SLD64 can be used on the OptiX OSN equipment series to
transmit and receive STM-64 optical signals. The SLD64 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLD64 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-74 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-74 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.22.3 Functions and Features


The SLD64 receives and transmits 2xSTM-64 optical signals, processes overhead bytes, and
performs the MSP protection.
Table 10-113 describes the functions and features of the SLD64.

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Table 10-113 Functions and features of the SLD64


Function and
Feature

SLD64

Basic functions

Provides two optical interfaces to transmit and receive 2xSTM-64


optical signals. Processes 2xSTM-64 standard services or concatenated
services, which are encapsulated in XFP format.

Specifications of
the optical interface

Supports different types of standard optical interfaces, namely, the


I-64.1 and S-64.2b. The characteristics of the optical interfaces comply
with ITU-T G.691.

Specifications of
the optical module

l Supports the query of the manufacturing information of the optical


module. The SLD64 also reports the performance events that
indicate the performance of the optical module.
l Supports the default off state of the laser, and the setting and query
of the on/off state of the laser.

Service processing

Supports the VC-12 services, VC-3 services, VC-4 services, VC-4-4c


concatenation services, VC-4-8c concatenation services, VC-4-16c
concatenation services, and VC-4-64c concatenation services.

Overhead
processing

l Processes the section overheads of the STM-64 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports two channels of ECC communication.

Alarms and
performance events

Reports various alarms and performance events.

Specifications of
the REG

Does not support the REG.

Protection schemes

l Supports the Two-fiber ring MSP.


l Supports the Four-fiber ring MSP.
l Supports the Linear MSP.
l Supports the SNCP.
l Supports the SNCMP.
l Supports the SNCTP.
l Supports the fiber-shared virtual trail protection.
l Supports the fiber-shared MSP and processes four sets of K bytes.
A single optical interface can process two sets of K bytes. One
SLD64 supports a maximum of four MSP rings.

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Function and
Feature

SLD64

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l Supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not
affect services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l Supports the press-to-collect function in fault data collection.
l Supports the Cause by Cross function.

10.22.4 Working Principle and Signal Flow


The SLD64 consists of the O/E converting module, MUX/DEMUX module, SDH overhead
processing module, logic and control module, and power module.
Figure 10-75 shows the functional block diagram of the SLD64.
Figure 10-75 Functional block diagram of the SLD64
622 MHz

9.953
Gbit/s

SPI 9.953
E/O
Gbit/s

DEMUX 16x622
Mbit/s

. .
. .

9.953
Gbit/s

O/E

O/E

9.953
SPI Gbit/s

MUX

16x622
Mbit/s

E/O

Backplane
Reference clock
Cross-connect
unit

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

MUX/
DEMUX

O/E
converting
module

622 MHz
PLL

IIC
LOS
Laser shutdown

Logic and
control module
+3.3 V
Power
module

Power
module

Frame header
Communication
Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination -

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SDH: synchronous digital hierarchy

518

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O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after

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detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.22.5 Front Panel


The front panel of the SLD64 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-76 shows the appearance of the front panel of the SLD64.

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Figure 10-76 Front panel of the SLD64

SLD64
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1

IN1
OUT2

IN2

SLD64

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SLD64 has two optical interfaces. Table 10-114 describes the types and
usage of the optical interfaces of the SLD64.
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Table 10-114 Optical interfaces of the SLD64


Interface

Type of Interface

Usage

IN1IN2

LC

Receives optical signals.

OUT1OUT2

LC

Transmits optical signals.

10.22.6 Jumpers and DIP Switches


The SLD64 does not have any jumpers or DIP switches that are used for board settings.

10.22.7 Valid Slots


The SLD64 must be installed in a valid slot in the subrack. Otherwise, the SLD64 fails to work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SLD64 vary with the cross-connect capacity of the subrack. The slots
valid for the SLD64 are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the SLD64 can be installed in slots 7, 8, 11,
and 12.

10.22.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLD64 indicates the type of optical interface.
Table 10-115 describes the relationship between the feature code of the SLD64 and the type of
optical interface.
Table 10-115 Relationship between the feature code of the SLD64 and the type of optical
interface
Board

Feature Code

Type of Optical Interface

SSN1SLD6401

01

I-64.1

SSN1SLD6402

02

S-64.2b

10.22.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.
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Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the SDH interface.
l J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.
l J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.
l C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent. Set
the C2 byte according to the actual service type. Generally, use the default value, which is
TUG structure.
l Laser status: Set this parameter to Open when you configure and commission the board.
For details, see 28.7 Checking Board Parameters.
NOTE

For the other parameters to be set, see 27.5 SDH Processing Boards.

Step 3 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
----End

Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing Specifications
of Optical Interfaces.
Step 2 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End
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Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

10.22.10 Parameter Settings


You can set the parameters for the SLD64 by using the U2000.
You can set the following parameters for the SLD64 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.22.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 10-116 lists the faults that occur on the SLD64 frequently and the troubleshooting
methods.
NOTE

The SLD64 uses the XFP optical module. When the SLD64 operates and an abnormal alarm occurs on the
optical interface, check whether the optical module is properly installed. To check whether the optical
module is properly installed, you can re-seat the optical module.

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Table 10-116 Methods used to troubleshoot the faults that occur on the SLD64 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service interruption

l The optical fiber


or connector
becomes
abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect
operation is
performed.
l The types or
settings of the
boards are
inconsistent.
l The optical power
becomes
abnormal.

Bit error

See Troubleshooting Bit Errors.

l The equipment
becomes faulty.
Pointer justification

l The clock
configuration is
incorrect.

See Troubleshooting Pointer Justification.

l The precision of
the external clock
source is very
low.
Protection switching
failure

l The MSP
switching fails.

See Troubleshooting Protection Switching


Faults.

l The SNCP
switching fails.
l The clock
protection
switching fails.
NEs being
unreachable to the
U2000

l A single NE
becomes
unreachable to
the U2000.

See Troubleshooting the NEs Being


Unreachable.

l All the NEs in a


subnet become
unreachable to
the U2000.
l An NE becomes
unreachable to
the U2000
frequently.

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Fault Symptom

Common Fault
Cause

Troubleshooting Method

Equipment
interconnection fault

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SLD64, see Replacing an SDH Board.

10.22.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

10.22.12.1 Alarms of N1SLD64

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ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_ABN

C2_PDI

C2_VCAIS

FSELECT_STG

CHIP_FAIL

COMMUN_FAIL

HP_RDI

FPGA_ABN

HP_LOM

HP_TIM

HP_REI

HP_SLM

J0_MM

HP_UNEQ

IN_PWR_ABN

LOOP_ALM

LASER_MOD_ERR

LASER_SHUT

LP_REI_VC12

LP_RDI_VC12

LP_RDI_VC3

LP_SLM_VC3

LP_REI_VC3

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_NO_FITED

LP_UNEQ_VC3

LSR_COOL_ALM

MS_RDI

LSR_WILL_DIE

MS_AIS

R_LOF

MS_REI

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NO_BD_SOFT

SPARE_PATH_ALM

OH_LOOP

OUT_PWR_ABN

TEM_LA

POWER_ABNORMAL

R_LOC

TF

R_LOS

SLAVE_WORKING

TU_AIS_VC3

T_LOSEX

TEM_HA

W_R_FAIL

TEMP_OVER

TEST_STATUS

PATCH_NOT_CONFIRM

TR_LOC

TU_AIS_VC12

TIME_NOT_SUPPORT

TU_LOP_VC12

TU_LOP_VC3

PATCHFILE_NOTEXIST

SWDL_PKG_NOBDSOFT

PATCH_ERR

PS

MOD_TYPE_MISMATCH

IN_PWR_LOW

IN_PWR_HIGH

WRG_BD_TYPE

DCN_FAIL

10.22.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

10.22.13.1 Performance Events of N1SLD64

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AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

RSOOF

RSSES

RSUAS

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TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

10.22.14 Technical Specifications


The technical specifications of the SLD64 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-117 lists the parameters specified for the optical interfaces of the SLD64.
Table 10-117 Parameters specified for the optical interfaces of the SLD64

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Parameter

Value

Nominal bit rate

9953280 kbit/s

Line code type

NRZ

Application code

I-64.1

S-64.2b

Transmission distance
(km)

0 to 2

2 to 40

Type of fiber

Single-mode LC

Single-mode LC

Operating wavelength
range (nm)

1290 to 1330

1530 to 1565

Mean launched optical


power (dBm)

-6 to -1

-1 to +2

Receiver sensitivity
(dBm)

-11

-14

Minimum overload (dBm)

-1

-1

Minimum extinction ratio


(dB)

8.2

Dispersion tolerance (ps/


nm)

6.6

800

Minimum side mode


suppression ratio (dB)

30

30

Maximum -20 dB spectral


width (nm)

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Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLD64 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.2

Power Consumption
The maximum power consumption of the N1SLD64 at room temperature (25C) is 41 W.

10.23 SF64
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SF64 (1xSTM-64 optical interface board with the FEC function).
This topic also describes how to configure and commission the SF64.

10.23.1 Version Description


The SF64 is available in the following functional version: N1.

10.23.2 Application
The SF64 is a line board. The SF64 can be used on the OptiX OSN equipment series to transmit
and receive STM-64 optical signals. The SF64 converts the received optical signals into
electrical signals and sends the electrical signals to the cross-connect side. In addition, the SF64
converts the electrical signals sent from the cross-connect side into optical signals and transmits
the optical signals.
Figure 10-77 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-77 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

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The SF64 can be interconnected with the WDM equipment.

10.23.3 Functions and Features


The SF64 receives and transmits 1xSTM-64 optical signals and processes overhead bytes.
Table 10-118 describes the functions and features of the SF64.
Table 10-118 Functions and features of the SF64
Function and
Feature

SF64

Basic functions

l Transmits and receives 1xSTM-64 optical signals.


l Supports the enabling or disabling of the FEC function.

Specifications of
the optical interface

l Supports different types of standard optical interfaces, namely, the


Ue-64.2c, Ue-64.2d, and Ue-64.2e. The characteristics of the
optical interfaces comply with the standards defined by Huawei.
l Supports the output of the standard wavelengths that comply with
ITU-T G.692 and can be directly connected to the DWDM
equipment.
l The N1SF64 supports the DWDM colored optical interfaces. The
optical interface uses the LC connector. The DWDM optical
interface supports the transmission distance of 40 km.

Specifications of
the optical module

l Supports the detection and query of the information about the


optical module.
l supports fixed optical modules.
l Provides the ALS function. The optical interface supports the
setting of the on/off state of a laser.

Service processing

Supports the VC-12 services, VC-3 services, VC-4 services, VC-4-4c


concatenation services, VC-4-8c concatenation services, VC-4-16c
concatenation services, and VC-4-64c concatenation services.

Overhead
processing

l Processes the section overheads of the STM-64 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one channel of ECC communication.

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Alarms and
performance events

Reports various alarms and performance events.

Specifications of
the REG

Supports the setting and query of the REG working mode.

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Function and
Feature

SF64

Protection schemes

l Supports the Two-fiber ring MSP.

10 SDH Boards

l Supports the Four-fiber ring MSP.


l Supports the Linear MSP.
l Supports the SNCP.
l Supports the SNCMP.
l Supports the SNCTP.
l Supports the fiber-shared virtual trail protection.
l Supports the fiber-shared MSP and processes two sets of K bytes.
One SF64 supports a maximum of two MSP rings.
Maintenance
features

l Supports inloops and outloops at optical interfaces.


l Supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not
affect services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l Supports the press-to-collect function in fault data collection.
l Supports the Cause by Cross function.

10.23.4 Working Principle and Signal Flow


The SF64 consists of the O/E converting module, MUX/DEMUX module, FEC module, SDH
overhead processing module, logic and control module, and power module.
Figure 10-78 shows the functional block diagram of the SF64.

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Figure 10-78 Functional block diagram of the SF64


Backplane
622 MHz
622 MHz
PLL
10.71
Gbit/s

10.71
Gbit/s

O/E

DEMU
X

16x669
Mbit/s

MUX

FEC 16x622
16x669
Mbit/s
Mbit/s

SPI
10.71
Gbit/s

E/O
O/E
converting
module

10.71
Gbit/s

16x622
Mbit/s

622 MHz
PLL

Reference clock

Cross-connect
unit

K1 and K2

Cross-connect
unit

K1 and K2
insertion/extraction

High-speed
bus
RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

MUX/DE
MUX
669 MHz
PLL

IIC
LOS
Laser shutdown

Logic and
control module
+3.3 V
Power
module

Frame header
Communication
Fuse

Power
module

Fuse +3.3 V

Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60
V
-48 V/-60 V
+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination -

SDH: synchronous digital hierarchy

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the SDH overhead processing module into high rate electrical signals.

In the upstream direction, the reverse process is performed. The FEC encoding and
decoding module receives the 2.666 Gbit/s signals from the DEMUX module. After frame
searching, FEC encoding, data packets encapsulation, and scrambling in the FEC module,
the 2.488 Gbit/s signals are recovered and then transmitted to the SDH overhead processing
module. The frame format of the 2.666 Gbit/s signals complies with ITU G.709.

In the downstream direction, the FEC encoding and decoding module receives 2.488 Gbit/
s SDH signals, which are sent by the SDH overhead processing module. After frame
searching, FEC encoding, data packet encapsulation, and scrambling, the 2.488 Gbit/s SDH
signals are converted into 2.666 Gbit/s signals and then transmitted to the MUX module.

The FEC processing module is connected to the logic and control module through a CPU
bus. The CPU controls the working modes of the FEC module by configuring the internal

FEC Module

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register. The working mode can be the regenerator mode, namely, REG mode. The CPU
can monitor the performance through the internal register.

SDH Overhead Processing Module


This module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the RSOH. That is, the RST
sub-module detects the frame alignment bytes (A1 and A2), descrambles all the bytes
except the first line of the RSOH, restores and checks the J0 byte, and checks the B1
byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

MST sub-module
In the receive direction, the MST sub-module terminates the MSOH. That is, the MST
sub-module generates the MS_AIS alarm and detects the MS_RDI alarm after detecting
the K2 byte, and detects the MS_REI alarm and generates the B2_EXC alarm after
checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the AUG, divides an AUG
into N AU-4s, detects the AU_LOP alarm and the AU_AIS alarm, and performs pointer
justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the POH. That is, the HPT submodule detects the HP_REI alarm after checking the B3 byte, generates the HP_TIM
alarm and the HP_SLM alarm and detects the HP_RDI alarm after detecting the J1 and
C2 bytes, and generates the HP_UNEQ alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

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Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.23.5 Front Panel


The front panel of the SF64 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-79 shows the appearance of the front panel of the SF64.
Figure 10-79 Front panel of the SF64

SF64
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT

IN

SF64

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Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SF64 has one optical interface. Table 10-119 describes the types and
usage of the optical interfaces of the SF64.
Table 10-119 Optical interfaces of the SF64
Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.23.6 Jumpers and DIP Switches


The SF64 does not have any jumpers or DIP switches that are used for board settings.

10.23.7 Valid Slots


The SF64 must be installed in a valid slot in the subrack. Otherwise, the SF64 fails to work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SF64 vary with the cross-connect capacity of the subrack. The slots valid
for the SF64 are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the SF64 can be installed in slots 7, 8, 11,
and 12.

10.23.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SF64 indicates the type of optical interface.
Table 10-120 provides the relationship between the feature code of the SF64 and the type of
optical interface.
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Table 10-120 Relationship between the feature code of the SF64 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SF6400

00

Fixed-wavelength optical
interface

SSN1SF6401

01

Ue-64.2c, Ue-64.2d, and


Ue-64.2e

10.23.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the SDH interface.
l J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.
l J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.
l C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent. Set
the C2 byte according to the actual service type. Generally, use the default value, which is
TUG structure.
l Laser status: Set this parameter to Open when you configure and commission the board.
For details, see 28.7 Checking Board Parameters.
NOTE

For the other parameters to be set, see 27.5 SDH Processing Boards.

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Step 3 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
----End

Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing Specifications
of Optical Interfaces.
Step 2 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

10.23.10 Parameter Settings


You can set the parameters for the SF64 by using the U2000.
You can set the following parameters for the SF64 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.23.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 10-121 lists the faults that occur on the SF64 frequently and the troubleshooting methods.
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NOTE

The N4SF64 uses the XFP optical module. When the N4SF64 operates and an abnormal alarm occurs on
the optical interface, check whether the optical module is properly installed. To check whether the optical
module is properly installed, you can re-seat the optical module.

Table 10-121 Methods used to troubleshoot the faults that occur on the SF64 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service interruption

l The optical fiber


or connector
becomes
abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect
operation is
performed.
l The types or
settings of the
boards are
inconsistent.
l The optical power
becomes
abnormal.

Bit error

See Troubleshooting Bit Errors.

l The equipment
becomes faulty.
Pointer justification

l The clock
configuration is
incorrect.

See Troubleshooting Pointer Justification.

l The precision of
the external clock
source is very
low.
Protection switching
failure

l The MSP
switching fails.

See Troubleshooting Protection Switching


Faults.

l The SNCP
switching fails.
l The clock
protection
switching fails.

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Fault Symptom

Common Fault
Cause

Troubleshooting Method

NEs being
unreachable to the
U2000

l A single NE
becomes
unreachable to
the U2000.

See Troubleshooting the NEs Being


Unreachable.

l All the NEs in a


subnet become
unreachable to
the U2000.
l An NE becomes
unreachable to
the U2000
frequently.
Equipment
interconnection fault

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SF64, see Replacing an SDH Board.

10.23.12 List of Alarms


This topic lists the alarms that may occur when the board operates.

10.23.12.1 Alarms of N1SF64

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ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP_SD

BEFFEC_EXC

BIP_EXC

C2_VCAIS

BIP8_ECC

C2_PDI

FEC_LOF

CHIP_FAIL

COMMUN_FAIL

FSELECT_STG

FEC_OOF

FPGA_ABN

HP_REI

HP_LOM

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HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LASER_MOD_ERR

IN_PWR_ABN

J0_MM

LP_RDI_VC12

LASER_SHUT

LOOP_ALM

LP_REI_VC3

LP_RDI_VC3

LP_REI_VC12

LP_TIM_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

LP_UNEQ_VC12

LSR_WILL_DIE

LSR_COOL_ALM

LSR_NO_FITED

MS_REI

MS_AIS

MS_RDI

ODU_AIS

NO_BD_SOFT

ODU_OCI

OH_LOOP

ODU_LCK

OTU_LOF

OTU_LOM

OTU_AIS

PM_BIP8_OVER

PM_BDI

OUT_PWR_ABN

POWER_ABNORMAL

PM_BIP8_SD

PM_BEI

R_LOS

R_LOC

PM_TIM

SM_BDI

R_OOF

R_LOF

SM_BIP8_SD

SM_BEI

SLAVE_WORKING

SPARE_PATH_ALM

SM_IAE

SM_BIP8_OVER

TC_EXC

T_LOSEX

SM_TIM

TC_ODI

TC_INCAIS

TC_DEG

TC_REI

TC_OEI

TC_LTC

TEM_HA

TC_TIM

TC_RDI

TF

TEM_LA

TC_UNEQ

TU_AIS_VC3

TR_LOC

TEST_STATUS

W_R_FAIL

TU_LOP_VC12

TU_AIS_VC12

PATCHFILE_NOTEXIST

PATCH_ERR

TU_LOP_VC3

CHIP_ABN

TEMP_OVER

PATCH_NOT_CONFIRM

SWDL_PKG_NOBDSOFT

PS

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

MOD_TYPE_MISMATCH

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10.23.13 List of Performance Events


This topic lists the performance events that may occur when the board operates.

10.23.13.1 Performance Events of N1SF64


AUPJCHIGH

AUPJCLOW

AUPJCNEW

FEC_AFT_COR_ER

FEC_BEF_COR_ER

FEC_COR_0BIT_CNT

FEC_COR_1BIT_CNT

FEC_COR_BYTE_CNT

FEC_UNCOR_BLOCK_CNT

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

ODU2PMBIP8

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

OTU2SMBIP8

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

RSOOF

RSSES

RSUAS

TCBBE

TCFEBBE

TCOBBE

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

10.23.14 Technical Specifications


The technical specifications of the SF64 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-122 lists the parameters specified for the optical interfaces of the SF64.

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Table 10-122 Specifications of optical interfaces of the SF64


Parameter

Value

Nominal bit rate 10709225kbit/s


Line code type

NRZ

Application
code

Ue-64.2c

Ue-64.2d

Ue-64.2e

FEC + BA (14 dB) +


PA + DCU (60 + 80)

FEC + BA (17 dB) + PA +


DCU (80 x 2)

FEC + BA (17 dB) +


RA + PA + DCU (60
x 3)

Operating
wavelength
range (nm)

1550.12

Type of fiber

Single-mode LC

Launched
optical power
range (dBm)

-3 to 2

Receiver
sensitivity
(dBm)

-14

Minimum
overload (dBm)

-1

Minimum
extinction ratio
(dB)

10

Maximum
allowed
dispersion (ps/
nm)

800

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

NOTE
The numbers in the brackets indicate the corresponding parameter values. For example, "BA (14 dB)"
indicates that the optical power amplified by the BA is 14 dBm. "FEC + BA + PA + RA" indicates that
the specifications of the optical interface are measured when the FEC, BA, PA, and Raman amplifier are
used.
The parameters are only for the optical modules. The parameters of the amplifier are not provided.

Table 10-123 lists the parameters specified for the colored optical interfaces of the N1SF64.
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Table 10-123 Parameters specified for the colored optical interfaces of the N1SF64
Parameter

Value
DWDM

Nominal bit rate

10709225 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

40

Launched optical power range (dBm)

-4 to -1

Central frequency (THz)

192.1 to 196.0

Central frequency deviation (GHz)

12.5

Receiver sensitivity (dBm)

-14

Minimum overload (dBm)

-1

Maximum allowed dispersion (ps/nm)

800

Minimum extinction ratio (dB)

10

Maximum -20 dB spectral width (nm)

0.3

Minimum side mode suppression ratio


(dB)

35

Optical signal-to-noise ratio (dB)

With the FEC: 20


Without the FEC: 22

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SF64 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight of the N1SF64 (kg): 1.1

Power Consumption
At room temperature (25C), the maximum power consumption of the N1SF64 is 33 W.

10.24 SF64A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SF64A (1xSTM-64 optical interface board with the FEC function).

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10.24.1 Version Description


The SF64A is available in one functional version, namely, N1.

10.24.2 Application
The SF64A is a line board. The SF64A can be used on the OptiX OSN equipment series to
transmit and receive STM-64 optical signals. The SF64A converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SF64A converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
The SF64A can also be used for interconnecting with the WDM equipment.
Figure 10-80 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-80 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

The SF64A can also be used for interconnecting with the WDM equipment.

10.24.3 Functions and Features


The SF64A receives and transmits 1xSTM-64 optical signals and processes overhead bytes.
Table 10-124 provides the functions and features of the SF64A.
Table 10-124 Functions and features of the SF64A
Function and
Feature

SF64A

Basic functions

l Transmits and receives 1xSTM-64 optical signals.


l Supports the enabling or disabling of the FEC function.

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Function and
Feature

SF64A

Specifications of
the optical interface

l Supports different types of standard optical interfaces, namely, the


Ue-64.2c, Ue-64.2d, and Ue-64.2e. The characteristics of the
optical interfaces comply with the standards defined by Huawei.
l Supports the output of the standard wavelengths that comply with
ITU-T G.692 and can be directly connected to the DWDM
equipment. Supports the variable-wavelength DWDM.
l Supports the DWDM colored optical interfaces. The optical
interface uses the LC connector. The DWDM optical interface
supports the transmission distance of 40 km.

Specifications of
the optical module

l Supports the detection and query of the information about the


optical module.
l Supports fixed optical modules.
l Provides the ALS function. The optical interface supports the
setting of the on/off state of a laser.

Service processing

Supports the VC-12 services, VC-3 services, VC-4 services, VC-4-4c


concatenation services, VC-4-8c concatenation services, VC-4-16c
concatenation services, and VC-4-64c concatenation services.

Overhead
processing

l Processes the section overheads of the STM-64 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one channel of ECC communication.

Alarms and
performance events

Reports various alarms and performance events.

Specifications of
the REG

Supports the setting and query of the REG working mode.

Protection schemes

l Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.
l Supports the fiber-shared MSP and SNCP and processes two sets
of K bytes. One SF64A supports a maximum of two MSP protection
rings.

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Function and
Feature

SF64A

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l Supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not
affect services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l Supports the Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

10.24.4 Working Principle and Signal Flow


The SF64A consists of the O/E converting module, MUX/DEMUX module, FEC module, SDH
overhead processing module, logic and control module, power module.
Figure 10-81 shows the functional block diagram of the SF64A.
Figure 10-81 Functional block diagram of the SF64A
Backplane
622 MHz
622 MHz
PLL
10.71
Gbit/s

10.71
Gbit/s

O/E

16x669
Mbit/s

MUX

FEC 16x622
16x669
Mbit/s
Mbit/s

SPI
10.71
Gbit/s

E/O
O/E
converting
module

10.71
Gbit/s

16x622
Mbit/s

DEMU
X

622 MHz
PLL

Reference clock

Cross-connect
unit

K1 and K2

Cross-connect
unit

K1 and K2
insertion/extraction

High-speed
bus
RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

MUX/DE
MUX
669 MHz
PLL

IIC
LOS
Laser shutdown

Logic and
control module
+3.3 V
Power
module

Frame header
Communication
Fuse

Power
module

Fuse +3.3 V

Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60
V
-48 V/-60 V
+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

The functional modules are described as follows:


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O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

CDR Module
This module restores the clock signal.

FEC Module
l

In the upstream direction, the reverse process is performed. The FEC encoding and
decoding module receives the 2.666 Gbit/s signals from the DEMUX module. After frame
searching, FEC encoding, data packets encapsulation, and scrambling in the FEC module,
the 2.488 Gbit/s signals are recovered and then transmitted to the SDH overhead processing
module. The frame format of the 2.666 Gbit/s signals complies with ITU G.709.

In the downstream direction, the FEC encoding and decoding module receives 2.488 Gbit/
s SDH signals, which are sent by the SDH overhead processing module. After frame
searching, FEC encoding, data packet encapsulation, and scrambling, the 2.488 Gbit/s SDH
signals are converted into 2.666 Gbit/s signals and then transmitted to the MUX module.

The FEC processing module is connected to the logic and control module through a CPU
bus. The CPU controls the working modes of the FEC module by configuring the internal
register. The working mode can be the regenerator mode, namely, REG mode. The CPU
can monitor the performance through the internal register.

SDH Overhead Processing Module


This module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the RSOH. That is, the RST
sub-module detects the frame alignment bytes (A1 and A2), descrambles all the bytes
except the first line of the RSOH, restores and checks the J0 byte, and checks the B1
byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

MST sub-module
In the receive direction, the MST sub-module terminates the MSOH. That is, the MST
sub-module generates the MS_AIS alarm and detects the MS_RDI alarm after detecting
the K2 byte, and detects the MS_REI alarm and generates the B2_EXC alarm after
checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

l
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In the receive direction, the MSA sub-module de-interleaves the AUG, divides an AUG
into N AU-4s, detects the AU_LOP alarm and the AU_AIS alarm, and performs pointer
justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.
l

HPT sub-module
In the receive direction, the HPT sub-module terminates the POH. That is, the HPT submodule detects the HP_REI alarm after checking the B3 byte, generates the HP_TIM
alarm and the HP_SLM alarm and detects the HP_RDI alarm after detecting the J1 and
C2 bytes, and generates the HP_UNEQ alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.24.5 Front Panel


The front panel of the SF64A has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 10-82 shows the appearance of the front panel of the SF64A.

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Figure 10-82 Front panel of the SF64A

SF64A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT

IN

SF64A

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SF64A has one optical interface. Table 10-125 describes the types and
usage of the optical interfaces of the SF64A.
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Table 10-125 Optical interfaces of the SF64A


Interface

Type of
Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.24.6 Valid Slots


The slots valid for the SF64A vary with the cross-connect capacity of the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SF64A are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the SF64A can be installed in slots 7, 8, 11,
and 12.

10.24.7 Parameter Settings


You can set the parameters for the SF64A by using the U2000.
You can set the following parameters for the SF64A by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.

10.24.8 Technical Specifications


The technical specifications of the SF64A include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-126 lists the parameters specified for the optical interfaces of the SF64A.
Table 10-126 Specifications of optical interfaces of the SF64A

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Parameter

Value

Nominal bit rate

10709225 kbit/s

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Parameter

Value

Line code type

DRZ

Application code

Ue-64.2c

Ue-64.2d

Ue-64.2e

Meaning of the
code

FEC + BA (14 dB) +


PA + DCU (60 + 80)

FEC + BA (17 dB) +


PA + DCU (80 x 2)

FEC + BA (17 dB) +


RA + PA + DCU (60
x 3)

Operating
wavelength range
(nm)

1550.12

1550.12

1550.12

Type of fiber

Single-mode LC

Launched optical
power range (dBm)

-4 to -1

-4 to -1

-4 to -1

Receiver
sensitivity (dBm)

-14

-14

-14

Minimum overload
(dBm)

-1

-1

-1

Minimum
extinction ratio
(dB)

10

10

10

Dispersion
tolerance (ps/nm)

800

800

800

Maximum -20 dB
spectral width (nm)

Minimum side
mode suppression
ratio (dB)

30

30

30

NOTE
The numbers in the brackets indicate the corresponding parameter values. For example, "BA (14 dB)"
indicates that the optical power amplified by the BA is 14 dBm. "FEC + BA + PA + RA" indicates that
the specifications of the optical interface are measured when the FEC, BA, PA, and Raman amplifier (RA)
are used.
The parameter values are applicable only to the optical modules. The parameter values of the amplifier
and dispersion compensation unit (DCU) are not provided.

Table 10-127 list the parameters specified for the colored optical interfaces of the SF64A.

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Table 10-127 Parameters specified for the colored optical interfaces of the SF64A
Parameter

Value
DWDM

Nominal bit rate

10709225 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

40

Launched optical power range (dBm)

-4 to -1

Central frequency (THz)

192.1 to 196.0

Central frequency deviation (GHz)

12.5

Receiver sensitivity (dBm)

-14

Minimum overload (dBm)

-1

Maximum allowed dispersion (ps/nm)

800

Minimum extinction ratio (dB)

10

Maximum -20 dB spectral width (nm)

0.3

Minimum side mode suppression ratio


(dB)

35

Optical signal-to-noise ratio (dB)

With the FEC: 20


Without the FEC: 22

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SF64A are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.1

Power Consumption
At room temperature (25C), the maximum power consumption of the SF64A is 33 W.

10.25 SLQ41
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLQ41 (4xSTM-4/STM-1 optical interface board). This topic also
describes how to configure and commission the SLQ41.
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10.25.1 Version Description


The SLQ41 is available in one functional version, namely, N3. The SLQ41 supports the autosensing of optical interfaces.

10.25.2 Application
The SLQ41 is a line board. The SLQ41 can be used on the OptiX OSN equipment series to
transmit and receive STM-1/STM-4 optical signals. The SLQ41 converts the received optical
signals into electrical signals and sends the electrical signals to the cross-connect side. In
addition, the SLQ41 converts the electrical signals sent from the cross-connect side into optical
signals and transmits the optical signals.
Figure 10-83 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-83 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.25.3 Functions and Features


The SLQ41 transmits and receives STM-1 or STM-4 optical signals, performs O/E conversion
for the STM-1 or STM-4 optical signals, extracts and inserts overhead bytes, and generates alarm
signals on the line.
Table 10-128 provides the functions and features of the SLQ41.
Table 10-128 Functions and features of the SLQ41

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Function and
Feature

SLQ41

Basic functions

Transmits and receives 4xSTM-1 or 4xSTM-4 optical signals.

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Function and
Feature

SLQ41

Specifications of the
optical interface

The STM-1 optical module or STM-4 optical module can be used.


l When the STM-1 optical module is used, the SLQ41 supports
different types of standard optical interfaces, namely, the I-1,
S-1.1, L-1.1, L-1.2, and Ve-1.2. The characteristics of the optical
interfaces of the I-1, S-1.1, L-1.1, and L-1.2 types comply with
ITU-T G.957. The characteristics of the optical interface of the
Ve-1.2 type comply with the standards defined by Huawei.
l When the STM-4 optical module is used, the SLQ41 supports
different types of standard optical interfaces, namely, the I-4,
S-4.1, L-4.1, L-4.2, and Ve-4.2. The characteristics of the optical
interfaces of the I-4, S-4.1, L-4.1, and L-4.2 types comply with
ITU-T G.957. The characteristics of the optical interface of the
Ve-4.2 type comply with the standards defined by Huawei.
Supports the CWDM and DWDM colored optical interfaces. The
optical interface uses the LC connector. The CWDM optical interface
supports the transmission distance of 80 km, and the DWDM optical
interface supports the transmission distance of 120 km.

Specifications of the
optical module

l Supports the detection and query of the information about the


optical module.
l Supports the usage and detection of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.
l Provides the ALS function. The optical interface supports the
setting of the on/off state of a laser.

Service processing

l When the STM-1 optical module is used, the SLQ41 supports the
VC-12 services, VC-3 services, and VC-4 services.
l When the STM-4 optical module is used, the SLQ41 supports the
VC-12 services, VC-3 services, VC-4 services, and VC-4-4c
concatenation services.

Overhead processing

l Processes the section overheads of the STM-1 signals or STM-4


signals.
l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one to four channels of ECC communication.

Alarms and
performance events

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Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

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Function and
Feature

SLQ41

Protection schemes

l Supports the Two-fiber ring MSP.

10 SDH Boards

l Supports the Four-fiber ring MSP.


l Supports the Linear MSP.
l Supports the SNCP.
l Supports the SNCMP.
l Supports the SNCTP.
Maintenance
features

l Supports inloops and outloops at optical interfaces.


l Supports inloops and outloops on VC-4 paths.
l Supports warm resets and cold resets. The warm reset does not
affect services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l Supports the PRBS function in the line direction, cross-connect
direction and Cause by Cross function.
l Supports the press-to-collect function in fault data collection.

10.25.4 Working Principle and Signal Flow


The SLQ41 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
This topic describes the working principle and signal flow of the SLQ41 by describing how to
process STM-1/STM-4 signals.
Figure 10-84 shows the functional block diagram of the SLQ41.

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Figure 10-84 Functional block diagram of the SLQ41


155 MHz
PLL

STM-1/
STIM-4

O/E
E/O

O/E
E/O

K1 and K2
High-speed
bus

....

....

STM-1/
STIM-4

K1 and K2
insertion/extraction

CDR

SPI

Backplane
Reference clock
Cross-connect
unit

RST MST MSA HPT

High-speed
bus

CDR

SPI

DCC
SDH overhead
processing module

O/E converting
module

Frame header
Logic and
control module Communication

IIC
LOS
Laser shutdown

+3.3 V
Power
module

Power
module

Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination CDR: clock data restoration

SDH: synchronous digital hierarchy

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

CDR Module
This module restores the clock signal.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

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MST sub-module
In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.25.5 Front Panel


The front panel of the SLQ41 has indicators, interfaces, a bar code, and a laser safety class label.
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Diagram of the Front Panel


Figure 10-85 shows the appearance of the front panel of the SLQ41.
Figure 10-85 Front panel of the SLQ41

SLQ41
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ41

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.


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Interfaces
The front panel of the SLQ41 has four optical interfaces. Table 10-129 describes the types and
usage of the optical interfaces of the SLQ41.
Table 10-129 Optical interfaces of the SLQ41
Interface

Type of Interface

Usage

IN1IN4

LC

Receives optical signals.

OUT1OUT4

LC

Transmits optical signals.

10.25.6 Jumpers and DIP Switches


The SLQ41 does not have any jumpers or DIP switches that are used for board settings.

10.25.7 Valid Slots


The SLQ41 must be installed in a valid slot in the subrack. Otherwise, the SLQ41 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

When the cross-connect capacity is 200 Gbit/s, the slots valid for the SLQ41 are as follows:
The SLQ41 can be installed in slots 14, 15, and 16. In this case, one or two optical
interfaces can be configured.
The SLQ41 can be installed in slots 58 and 1114. In this case, one to four optical
interfaces can be configured.

10.25.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLQ41 indicates the type of optical interface.
Table 10-130 provides the relationship between the feature code of the SLQ41 and the type of
optical interface.
Table 10-130 Relationship between the feature code of the SLQ41 and the type of optical
interface

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Board

Feature Code

Type of Optical Interface

SSN3SLQ414

14

I-4

SSN3SLQ410

10

S-4.1

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Board

Feature Code

Type of Optical Interface

SSN3SLQ411

11

L-4.1

SSN3SLQ412

12

L-4.2

SSN3SLQ413

13

Ve-4.2

SSN3SLQ114

14

I-1

SSN3SLQ110

10

S-1.1

SSN3SLQ111

11

L-1.1

SSN3SLQ112

12

L-1.2

SSN3SLQ113

13

Ve-1.2

10.25.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the SDH interface.
l J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.
l J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.
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l C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent. Set
the C2 byte according to the actual service type. Generally, use the default value, which is
TUG structure.
l Laser status: Set this parameter to Open when you configure and commission the board.
For details, see 28.7 Checking Board Parameters.
NOTE

For the other parameters to be set, see 27.5 SDH Processing Boards.

Step 3 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
----End

Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing Specifications
of Optical Interfaces.
Step 2 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

10.25.10 Parameter Settings


You can set the parameters for the SLQ41 by using the U2000.
You can set the following parameters for the SLQ41 by using the U2000:
l

J0

J1

J2

C2

For the description of each parameter, see 27 Parameter Settings.


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10.25.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 10-131 lists the faults that occur on the SLQ41 frequently and the troubleshooting
methods.
NOTE

The SLQ41 uses the SFP optical module. When the SLQ41 operates and an abnormal alarm occurs on the
optical interface, check whether the optical module is properly installed. To check whether the optical
module is properly installed, you can re-seat the optical module.

Table 10-131 Methods used to troubleshoot the faults that occur on the SLQ41 frequently
Fault Symptom

Common Fault
Cause

Troubleshooting Method

Service interruption

l The optical fiber


or connector
becomes
abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect
operation is
performed.
l The types or
settings of the
boards are
inconsistent.
l The optical power
becomes
abnormal.

Bit error

See Troubleshooting Bit Errors.

l The equipment
becomes faulty.
Pointer justification

l The clock
configuration is
incorrect.

See Troubleshooting Pointer Justification.

l The precision of
the external clock
source is very
low.

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Fault Symptom

Common Fault
Cause

Troubleshooting Method

Protection switching
failure

l The MSP
switching fails.

See Troubleshooting Protection Switching


Faults.

l The SNCP
switching fails.
l The clock
protection
switching fails.
NEs being
unreachable to the
U2000

l A single NE
becomes
unreachable to
the U2000.

See Troubleshooting the NEs Being


Unreachable.

l All the NEs in a


subnet become
unreachable to
the U2000.
l An NE becomes
unreachable to
the U2000
frequently.
Equipment
interconnection fault

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SLQ41, see Replacing an SDH Board.

10.25.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

10.25.12.1 Alarms of N3SLQ41

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ALM_ALS

AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

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C2_PDI

BIP_EXC

BIP_SD

COMMUN_FAIL

C2_VCAIS

CHIP_ABN

HP_LOM

FPGA_ABN

FSELECT_STG

HP_SLM

HP_RDI

HP_REI

IN_PWR_ABN

HP_TIM

HP_UNEQ

LASER_SHUT

J0_MM

LASER_MOD_ERR

LP_SLM_VC3

LOOP_ALM

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_NO_FITED

LP_UNEQ_VC3

LSR_COOL_ALM

MS_RDI

LSR_WILL_DIE

MS_AIS

PATCH_ERR

MS_REI

NO_BD_SOFT

R_LOF

OH_LOOP

OUT_PWR_ABN

T_LOSEX

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

POWER_ABNORMAL

PS

R_LOS

SLAVE_WORKING

TEM_LA

TF

TU_AIS_VC12

TEM_HA

DCN_FAIL

TU_LOP_VC3

TEMP_OVER

TEST_STATUS

TR_LOC

TU_AIS_VC3

TU_LOP_VC12

SWDL_PKG_NOBDSOFT

R_LOC

MOD_TYPE_MISMATCH

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

10.25.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

10.25.13.1 Performance Events of N3SLQ41

Issue 03 (2013-02-20)

AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

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HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

RSOOF

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

10.25.14 Technical Specifications


The technical specifications of the SLQ41 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


The SLQ41 supports the STM-1 and STM-4 optical modules.
Table 10-132 lists the parameters specified for the optical interfaces of the SLQ41 when the
STM-1 optical module is used.
Table 10-132 Parameters specified for the optical interfaces of the SLQ41 when the STM-1 optical module is used
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code
pattern

NRZ

Application
code

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Single-mode LC

Single-mode LC

Single-mode LC

Single-mode LC

Single-mode LC

Operating
wavelength
range (nm)

1260 to 1360

1261 to 1360

1263 to 1360

1480 to 1580

1480 to 1580

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Parameter

Value

Launched
optical power
range (dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

-3 to 0

Receiver
sensitivity
(dBm)

-23

-28

-34

-34

-34

Minimum
overload (dBm)

-8

-8

-10

-10

-10

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

Table 10-133 lists the parameters specified for the optical interfaces of the SLQ41 when the
STM-4 optical module is used.
Table 10-133 Parameters specified for the optical interfaces of the SLQ41 when the STM-4
optical module is used

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Parameter

Value

Nominal bit rate

622080 kbit/s

Line code pattern

NRZ

Application code

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Operating
wavelength range
(nm)

1261 to
1360

1274 to
1356

1280 to
1335

1480 to
1580

1480 to
1580

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Mean launched
optical power
(dBm)

-15 to -8

-15 to -8

-3 to -2

-3 to -2

-3 to -2

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Parameter

Value

Receiver
sensitivity (dBm)

-23

-28

-28

-28

-34

Minimum
overload (dBm)

-8

-8

-8

-8

-13

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10.5

Maximum -20 dB
spectral width
(nm)

Minimum side
mode suppression
ratio (dB)

30

30

30

Table 10-134 and Table 10-135 lists the parameters specified for the colored optical interfaces
of the SLQ41.
Table 10-134 CWDM parameters specified for the colored optical interfaces of the SLQ41
Parameter

Value
CWDM

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Nominal bit rate

155520 kbit/s or 622080 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

80

Launched optical power range


(dBm)

0 to 5

Operating wavelength range (nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion (ps/


nm)

1600

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral width


(nm)

Minimum side mode suppression


ratio (dB)

30

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Table 10-135 DWDM parameters specified for the colored optical interfaces of the SLQ41
Parameter

Value
DWDM

Nominal bit rate

155520 kbit/s or 622080 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

120

Launched optical power range


(dBm)

-1 to 3

Central frequency (THz)

192.10 to 196.00

Central frequency deviation


(GHz)

10

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

2400

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral


width (nm)

0.3

Minimum side mode


suppression ratio (dB)

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLQ41 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.6

Power Consumption
The maximum power consumption of the SLQ41 at room temperature (25C) is 12 W.

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10.26 SLH41
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLH41 (16xSTM-1/STM-4 optical interface board with the
variable rate). This topic also describes how to configure and commission the SLH41.

10.26.1 Version Description


The functional version of the SLH41 is N3.

10.26.2 Application
The SLH41 is a line board. The SLH41 can be used on the OptiX OSN equipment series to
transmit and receive STM-1/STM-4 optical signals. The SLH41 converts the received optical
signals into electrical signals and sends the electrical signals to the cross-connect side. In
addition, the SLH41 converts the electrical signals sent from the cross-connect side into optical
signals and transmits the optical signals.
Figure 10-86 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 10-86 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.26.3 Functions and Features


The SLH41 is used to transmit and receive 16xSTM-1/STM-14 optical signals, to perform O/E
conversion for the STM-1/STM-4 optical signals, to extract or insert overhead bytes, and to
report alarms generated on the line.
Table 10-136 provides the functions and features of the SLH41.
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Table 10-136 Functions and features of the SLH41


Functions and
Features

Value

Basic functions

Transmits and receives 16xSTM-1/STM-4 optical signals.

Specifications of
the optical
interface

The STM-1/STM-4 optical module can be used, which supports the


adaptive modulation (AM) technology.
l When the STM-1 optical module is used, the standard S-1.1 and L-1.1
optical interfaces are supported. The optical interfaces of the S-1.1 and
L-1.1 types comply with ITU-T G.957.
l When the STM-4 optical module is used, the standard S-4.1 optical
interface is supported. The optical interface of the S-4.1 type complies
with ITU-T G.957.
Supports the CWDM and DWDM colored optical interfaces. The optical
interface uses the LC connector. The CWDM optical interface supports
the transmission distance of 80 km, and the DWDM optical interface
supports the transmission distance of 120 km.

Specifications of
the optical
module

l Supports the detection and query of the information about the optical
module.
l Supports the usage and detection of the SFP optical module, facilitating
the maintenance of the optical module.
l Provides the ALS function. The optical interface supports the function
of setting the on/off state of a laser.

Service
processing

l When the STM-1 optical module is used, the SLH41 supports VC-12
services, VC-3 services, and VC-4 services.
l When the STM-4 optical module is used, the SLH41 supports VC-12
services, VC-3 services, VC-4 services, and VC-4-4c concatenation
services.

Overhead
processing

l Processes the section overheads of the STM-1/STM-4 signals.


l Supports the transparent transmission and termination of the path
overheads.
l Supports the setting and query of the J0, J1, J2, and C2 bytes.
l Supports one to sixteen channels of ECC communication. The first
eight optical interfaces support the ECC communication in D1-D12
mode. The last eight optical interfaces support the ECC
communication in D4-D12 mode.

Alarms and
performance
events

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Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

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Functions and
Features

Value

Protection
schemes

l Supports the Two-fiber ring MSP.

10 SDH Boards

l Supports the Four-fiber ring MSP.


l Supports the Linear MSP.
l Supports the SNCP.
l Supports the SNCMP.
l Supports the SNCTP.

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l Supports inloops and outloops on VC-4 paths.
l Supports the warm reset and cold reset. The warm reset does not affect
services.
l Supports the query of the manufacturing information about a board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l Supports the PRBS function in the line direction and Cause by
Cross function.
l Supports the press-to-collect function in fault data collection.

10.26.4 Working Principle and Signal Flow


The SLH41 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
This topic describes the working principle and signal flow of the SLH41 by describing how to
process STM-1/STM-4 signals.
Figure 10-87 shows the functional block diagram of the SLH41.

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Figure 10-87 Functional block diagram of the SLH41


Backplane
Reference clock
Clock unit
155 MHz PLL

STM-1/
STM-4

O/E
E/O

S
P
I

O/E
E/O

S
P
I

K1 and K2
High-speed
bus

....

....

STM-1/
STM-4

Insertion and extraction of


K1 and K2

CDR

RST MST MSA HPT

High-speed
bus

CDR

DCC
SDH OH processing module

O/E
conversion module
IIC
LOS

Logic and
control module

SCC unit

Cross-connect unit A
Cross-connect unit B
SCC unit

Frame header

Clock unit

Communication

SCC unit

ALS
+3.3V
Power
module

Power
module

Fuse

-48V/-60V
-48V/-60V

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section


termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination -

SDH: synchronous digital hierarchy

O/E Converting Module


l

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

CDR Module
This module restores the clock signal.

SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
l

RST sub-module
In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes (A1
and A2), descrambles all the bytes except the first line of the RSOH, restores and checks
the regenerator section trace byte (J0), and checks the B1 byte.
In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte, and
scrambles all the bytes except the first line of the RSOH.

l
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MST sub-module
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In the receive direction, the MST sub-module terminates the multiplex section overhead
(MSOH). That is, the MST sub-module generates the multiplex section-alarm indication
signal (MS_AIS) alarm and detects the multiplex section-remote defect indication
(MS_RDI) alarm after detecting the K2 byte, and detects the multiplex section-remote
error indication (MS_REI) alarm and generates the B2-excessive errors (B2_EXC)
alarm after checking the B2 byte.
In the transmit direction, the MST sub-module generates the MSOH. That is, the MST
sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and calculates and
writes the B2 byte.
l

MSA sub-module
In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal (AU_AIS)
alarm, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
In the receive direction, the HPT sub-module terminates the path overhead (POH). That
is, the HPT sub-module detects the higher order path-remote error indication (HP_REI)
alarm after checking the B3 byte, generates the higher order path-trace identifier
mismatch (HP_TIM) alarm and the higher order path-signal label mismatch (HP_SLM)
alarm and detects the higher order path-remote defect indication (HP_RDI) alarm after
detecting the J1 and C2 bytes, and generates the higher order path-unequipped
(HP_UNEQ) alarm after detecting the C2 byte.
In the transmit direction, the HPT sub-module generates the POH. That is, the HPT submodule writes bytes such as J1 and C2, and calculates and writes the B3 byte.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.26.5 Front Panel


The front panel of the SLH41 has indicators, interfaces, a bar code, and a laser safety class label.
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Diagram of the Front Panel


Figure 10-88 shows the appearance of the front panel of the SLH41.
Figure 10-88 Front panel of the SLH41
SM SFP WORK WITH
G.657B FIBER ONLY

G.657B

SLH41
STAT
ACT
PROG
SRV
RX 1

2 TX

TX 15

16 RX

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.


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Interfaces
The front panel of the SLH41 has 16 optical interfaces. A silkscreen "16SFP" is marked below
the indicators.

Table 10-137 describes the types and usage of the optical interfaces of the SLH41.
Table 10-137 Description of the optical interfaces of the SLH41
Interface

Type of interface

Usage

RX1-RX16

LC

Receives optical signals.

TX1-TX16

LC

Transmits optical signals.

NOTE

The G.657B fiber jumper rather than the G.652D fiber jumper is used if an optical attenuator is inserted
into the transmit port. Otherwise, the cabinet door cannot be closed. Figure 10-89 shows the G.657B fiber
jumper and G.652D fiber jumper.

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Figure 10-89 G.657B fiber jumper and G.652D fiber jumper

G.652D fiber jumper

58.25
50.75

G.657B fiber jumper

42.5

10.26.6 Jumpers and DIP Switches


The SLH41 does not have any jumpers or DIP switches that are used for board settings.

10.26.7 Valid Slots


The SLH41 must be installed in a valid slot on the subrack. Otherwise, the SLH41 fails to work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the SLH41 vary with the cross-connect capacity of the equipment. The slots
valid for the SLH41 are as follows:
l

When the cross-connect capacity is 40 Gbit/s or 80 Gbit/s, the SLH41 cannot be installed
on the subrack.

When the cross-connect capacity is 200 Gbit/s, the SLH41 can be installed in any of slots
5-8 and slots 11-14.

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10.26.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLH41 indicates the type of optical interface.
Table 10-138 provides the relationship between the feature code of the SLH41 and the type of
optical interface.
Table 10-138 Relationship between the feature code of the SLH41 and the type of optical
interface
Board

Feature Code

Type of Optical Interface

SSN3SLH4101

01

12xS-1.1, 4xS-4.1

SSN3SLH4102

02

8xS-1.1, 8xS-4.1

SSN3SLH4103

03

16xS-1.1

SSN3SLH4104

04

4xL-1.1, 12xS-4.1

SSN3SLH4105

05

16xS-4.1

The G.657B fiber jumper is required because the single-mode optical module is used over the
interface.

10.26.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
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Step 2 Required: Set the SDH interface.


l J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.
l J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.
l C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent. Set
the C2 byte according to the actual service type. Generally, use the default value, which is
TUG structure.
l Laser status: Set this parameter to Open when you configure and commission the board.
For details, see 28.7 Checking Board Parameters.
NOTE

For the other parameters to be set, see 27.5 SDH Processing Boards.

Step 3 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
----End

Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing Specifications
of Optical Interfaces.
Step 2 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

10.26.10 Parameter Settings


You can set the parameters for the SLH41 by using the U2000.
You can set the following parameters for the SLH41 by using the U2000:
l

J0

J1

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J2

C2

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For the description of each parameter, see 27 Parameter Settings.

10.26.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also provides
the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 10-139 lists the faults that occur on the SLH41 frequently and the troubleshooting
methods.
NOTE

The SLH41 uses the SFP optical module. When the SLH41 operates and an abnormal alarm occurs on the
optical interface, check whether the optical module is properly installed. To check whether the optical
module is properly installed, you can re-seat the optical module.

Table 10-139 Methods used to troubleshoot the faults that occur on the SLH41 frequently
Symptom

Common Cause

Troubleshooting Method

Service interruption

l The optical fiber


or connector
becomes
abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect
operation is
performed.
l The types or
settings of the
boards are
inconsistent.
l The optical power
becomes
abnormal.

Bit error

See Troubleshooting Bit Errors.

l The equipment
becomes faulty.
Pointer justification

l The clock
configuration is
incorrect.

See Troubleshooting Pointer Justification.

l The precision of
the external clock
source is very
low.

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Symptom

Common Cause

Troubleshooting Method

Protection switching
failure

l The MSP
switching fails.

See Troubleshooting Protection Switching


Faults.

l The SNCP
switching fails.
l The clock
protection
switching fails.
NEs being
unreachable to the
NMS

l A single NE
becomes
unreachable to
the NMS.

See Troubleshooting the NEs Being


Unreachable.

l All the NEs in a


subnet become
unreachable to
the NMS.
l An NE becomes
unreachable to
the NMS
frequently.
Equipment
interconnection fault

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SLH41, see Replacing an SDH Board.

10.26.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the NMS.

10.26.12.1 Alarms of N3SLH41

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R_LOS

WRG_BD_TYPE

R_LOF

R_OOF

R_LOC

B1_EXC

B1_SD

J0_MM

B2_EXC

B2_SD

MS_AIS

MS_RDI

MS_REI

TF

IN_PWR_ABN

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OUT_PWR_ABN

LSR_WILL_DIE

LSR_COOL_ALM

TEM_HA

TEM_LA

LASER_SHUT

LSR_NO_FITED

LASER_MOD_ERR

ALM_ALS

SPARE_PATH_ALM

TEST_STATUS

OH_LOOP

FSELECT_STG

NO_BD_SOFT

TR_LOC

T_LOSEX

COMMUN_FAIL

W_R_FAIL

CHIP_FAIL

POWER_ABNORMAL

BIP8_ECC

BD_STATUS

AU_AIS

AU_LOP

HP_TIM

HP_SLM

HP_UNEQ

HP_RDI

HP_REI

B3_EXC

B3_SD

AU_CMM

C2_VCAIS

C2_PDI

FPGA_ABN

SLAVE_WORKING

HP_LOM

PATCHFILE_NOTEXIST

PATCH_ERR

LSR_INVALID

PATCH_NOT_CONFIRM

CHIP_ABN

LOOP_ALM

LP_RDI_VC12

LP_REI_VC12

LP_SLM_VC12

LP_TIM_VC12

LP_UNEQ_VC12

TU_AIS_VC12

TU_LOP_VC12

BIP_SD

BIP_EXC

TEMP_OVER

LP_RDI_VC3

LP_REI_VC3

LP_SLM_VC3

LP_TIM_VC3

LP_UNEQ_VC3

TU_AIS_VC3

TU_LOP_VC3

B3_EXC_VC3

B3_SD_VC3

TIME_NOT_SUPPORT

PS

MOD_TYPE_MISMATCH

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.26.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the NMS.

10.26.13.1 Performance Events of N3SLH41

Issue 03 (2013-02-20)

RSBBE

RSES

RSSES

RSUAS

RSCSES

RSOOF

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RSOFS

MSBBE

MSES

MSUAS

MSCSES

MSSES

MSFEBBE

MSFEES

MSFESES

MSFEUAS

MSFECSES

AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

HPFESES

HPFEUAS

HPFECSES

TLBMAX

TLBMIN

TLBCUR

OSPICCVMAX

OSPICCVMIN

OSPICCVCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

INVOLTMAX

INVOLTMIN

INVOLTCUR

10.26.14 Technical Specifications


The technical specifications of the SLH41 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-140 lists the parameters specified for the optical interfaces of the SLH41 when the
STM-1 optical module is used.
Table 10-140 Parameters specified for the optical interfaces of the SLH41 when the STM-1
optical module is used

Issue 03 (2013-02-20)

Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

NRZ

Application code

S-1.1

L-1.1

Transmission distance (km)

0 to 15

15 to 40

Type of fiber

Single-mode LC

Single-mode LC

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Parameter

Value

Operating wavelength range


(nm)

1261 to 1360

1263 to 1360

Launched optical power


range (dBm)

-15 to -8

-5 to 0

Receiver sensitivity (dBm)

-28

-34

Overload optical power


(dBm)

-8

-10

Minimum extinction ratio


(dB)

8.2

10

Table 10-141 lists the parameters specified for the optical interfaces of the SLH41 when the
STM-4 optical module is used.
Table 10-141 Parameters specified for the optical interfaces of the SLH41 when the STM-4
optical module is used
Parameter

Value

Nominal bit rate

622080 kbit/s

Line code pattern

NRZ

Application code

S-4.1

Transmission distance (km)

0 to 15

Operating wavelength range


(nm)

1274 to 1356

Type of fiber

Single-mode LC

Launched optical power


range (dBm)

-15 to -8

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-8

Minimum extinction ratio


(dB)

8.2

Table 10-142 and Table 10-143 list the parameters specified for the colored optical interfaces
of the SLH41.

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Table 10-142 CWDM parameters specified for the colored optical interfaces of the SLH41
Parameter

Value
CWDM

Nominal bit rate

155520 kbit/s or 622080 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

80

Launched optical power range


(dBm)

0 to 5

Operating wavelength range (nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion (ps/


nm)

1600

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral width


(nm)

Minimum side mode suppression


ratio (dB)

30

Table 10-143 DWDM parameters specified for the colored optical interfaces of the SLH41
Parameter

Value
DWDM

Issue 03 (2013-02-20)

Nominal bit rate

155520 kbit/s or 622080 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

120

Launched optical power range


(dBm)

-1 to 3

Central frequency (THz)

192.10 to 196.00

Central frequency deviation


(GHz)

10

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

2400

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Parameter

10 SDH Boards

Value
DWDM

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral


width (nm)

0.3

Minimum side mode


suppression ratio (dB)

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLH41 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight: 1.5 kg

Power Consumption
The maximum power consumption of the SLH41 at room temperature (25C) is 49 W.

10.27 EU04
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the EU04 (4xSTM-1 electrical interface board).

10.27.1 Version Description


The EU04 is available in one functional version, namely, N1.

10.27.2 Application
The EU04 is an STM-1 electrical interface board. The EU04 can be used on the OptiX OSN
equipment series to transmit and receive signals for the STM-1 electrical processing board.

10.27.3 Functions and Features


The EU04 receives and transmits 4xSTM-1 electrical signals. The EU04 must work with the
SEP.

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10.27.4 Working Principle and Signal Flow


The EU04 consists of the interface module, switch matrix module, and power module.
Figure 10-90 shows the functional block diagram of the EU04 by describing how to process
1xSTM-1 signals.
Figure 10-90 Functional block diagram of the EU04
Backplane
Cross-connect board
STM-1 electrical
signal

Interface
module

Switch
matrix
module

STM-1 electrical
signal

+3.3 V

Power
module

Fuse

SEP
TSB4/TSB8
TSB4/TSB8
SEP

+3.3 V power

Interface Module
The interface module receives and transmits the STM-1 electrical signals.

Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the SEP. When the TPS is performed, the switch matrix module
transmits the signal to the TSB4 or TSB8 for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

Power Module
The power module provides all the modules of the EU04 with the required DC voltages.

10.27.5 Front Panel


The front panel of the EU04 has interfaces and a bar code.

Diagram of the Front Panel


Figure 10-91 shows the appearance of the front panel of the EU04.
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Figure 10-91 Front panel of the EU04

EUO4

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

EUO4

Interfaces
The front panel of the EU04 has four pairs of electrical interfaces.
Table 10-144 describes the types and usage of the interfaces of the EU04.
Table 10-144 Interfaces of the EU04

Issue 03 (2013-02-20)

Interface

Type of Interface

Usage

IN1IN4

SMB

Receives the 1st to the 4th channels of STM-1


electrical signals.

OUT1OUT4

SMB

Transmits the 1st to the 4th channels of STM-1


electrical signals.

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10.27.6 Valid Slots


The EU04 can be installed in slots 19, 21, 23, 25, 29, 31, 33, and 35 in the subrack and works
as the interface board of the SEP.
Table 10-145 lists the slots valid for the SEP and the corresponding slots for the EU04.
Table 10-145 Slots valid for the SEP and the corresponding slots for the EU04
Slot Valid for the SEP

Corresponding Slot for the EU04

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

10.27.7 Technical Specifications


The technical specifications of the EU04 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


Table 10-146 lists the parameters specified for the electrical interfaces of the EU04.
Table 10-146 Parameters specified for the electrical interfaces of the EU04
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

CMI

Signal bit rate at the output interface

Complies with ITU-T G.703.

Allowed frequency deviation at the input


interface
Allowed attenuation at the input interface

Mechanical Specifications
The mechanical specifications of the EU04 are as follows:
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Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.4

Power Consumption
The maximum power consumption of the EU04 at room temperature (25C) is 6 W.

10.28 EU08
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the EU08 (8xSTM-1 electrical interface board).

10.28.1 Version Description


The EU08 is available in one functional version, namely, N1.

10.28.2 Application
The EU08 is an STM-1 electrical interface board. The EU08 can be used on the OptiX OSN
equipment series to transmit and receive signals for the STM-1 electrical processing board.

10.28.3 Functions and Features


The EU08 receives and transmits 8xSTM-1 electrical signals. The EU08 must work with the
SLH1 or SEP1.

10.28.4 Working Principle and Signal Flow


The EU08 consists of the interface module, switch matrix module, and power module.
Figure 10-92 shows the functional block diagram of the EU08.
Figure 10-92 Functional block diagram of the EU08
Backplane
Cross-connect board
STM-1 electrical
signal

Interface
module

Switch
matrix
module

STM-1 electrical
signal
+3.3 V

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Power
module

Fuse

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TSB8
TSB8
SEP/SLH1

+3.3 V power

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Interface Module
The interface module receives and transmits the STM-1 electrical signals.

Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the SLH1 or SEP. When the TPS is performed, the switch matrix
module transmits the signal to the TSB8 for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

Power Module
The power module provides all the modules of the EU08 with the required DC voltages.

10.28.5 Front Panel


The front panel of the EU08 has interfaces and a bar code.

Diagram of the Front Panel


Figure 10-93 shows the appearance of the front panel of the EU08.

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Figure 10-93 Front panel of the EU08

EUO8
OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
OUT5
IN5
OUT6
IN6
OUT7
IN7
OUT8
IN8

EUO8

Interfaces
The front panel of the EU08 has eight pairs of electrical interfaces.
Table 10-147 describes the types and usage of the interfaces of the EU08.
Table 10-147 Interfaces of the EU08

Issue 03 (2013-02-20)

Interface

Type of
Interface

Usage

IN1IN8

SMB

Receives the 1st to the 8th channels of STM-1


electrical signals.

OUT1OUT8

SMB

Transmits the 1st to the 8th channels of STM-1


electrical signals.

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10.28.6 Valid Slots


The slots valid for the EU08 vary with the cross-connect capacity of the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the EU08 are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the EU08 can be installed in slots 19-26
and 29-36.

Table 10-148 lists the slots valid for the SLH1 and the corresponding slots for the EU08. The
EU08 installed in the slot with a smaller number transmits/receives the 1st to the 8th channels
of STM-1 electrical signals. The EU08 installed in the slot with a larger number transmits/
receives the 9th to the 16th channels of STM-1 electrical signals.
Table 10-148 Slots valid for the SLH1 and the corresponding slots for the EU08
Slot Valid for the SLH1

Corresponding Slot for the EU08

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

Table 10-149 lists the slots valid for the SEP and the corresponding slots for the EU08.
Table 10-149 Slots valid for the SEP and the corresponding slots for the EU08

Issue 03 (2013-02-20)

Slot Valid for the SEP

Corresponding Slot for the EU08

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29
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Slot Valid for the SEP

Corresponding Slot for the EU08

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

10.28.7 Technical Specifications


The technical specifications of the EU08 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


Table 10-150 lists the parameters specified for the electrical interfaces of the EU08.
Table 10-150 Parameters specified for the electrical interfaces of the EU08
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

CMI

Signal bit rate at the output interface

Complies with ITU-T G.703.

Allowed frequency deviation at the


input interface
Allowed attenuation at the input
interface
Input jitter tolerance

Mechanical Specifications
The mechanical specifications of the EU08 are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.4

Power Consumption
The maximum power consumption of the EU08 at room temperature (25C) is 11 W.

10.29 OU08
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the OU08 (8xSTM-1 optical interface board).

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10.29.1 Version Description


The OU08 is available in the following functional versions: N1 and N2. The difference between
the two versions is with regard to the connector type for the optical interfaces and whether the
optical module is swappable.
Table 10-151 describes the versions of the OU08.
Table 10-151 Versions of the OU08
Item

Description

Functional versions

The OU08 is available in two functional versions, namely, N1 and N2.

Common points

The working principle of the N1OU08 is the same as the working


principle of the N2OU08.

Differences

The optical interface of the N1OU08 uses the LC connector, whereas


the optical interface of the N2OU08 uses the SC connector.
The N1OU08 uses the swappable optical module, whereas the
N2OU08 does not use the swappable optical module.
The N1OU08 supports optical power query when using pluggable
optical modules, whereas the N2OU08 does not.

Substitution

None

10.29.2 Application
The OU08 is an STM-1 optical interface board. The OU08 can be used on the OptiX OSN
equipment series to transmit and receive signals for the STM-1 optical processing board.

10.29.3 Functions and Features


The OU08 receives and transmits 8xSTM-1 optical signals. The OU08 must work with the SLH1
or SEP1.

10.29.4 Working Principle and Signal Flow


The OU08 consists of the interface module and power module.
Figure 10-94 shows the functional block diagram of the OU08.

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Figure 10-94 Functional block diagram of the OU08


Backplane
STM-1 optical
signal

SEP/SLH1

Interface
module

STM-1 optical
signal

SEP/SLH1

+3.3 V

Power
module

Fuse

+3.3 V power

Interface Module
In the receive direction, the interface module performs O/E conversion for the STM-1 signals
and transmits the signals to the SLH1 or SEP.
In the transmit direction, the interface module performs E/O conversion for the STM-1 signals
and transmits the signals to the optical interface.

Power Module
The power module provides all the modules of the OU08 with the required DC voltages.

10.29.5 Front Panel


The front panel of the OU08 has interfaces and a bar code.

Diagram of the Front Panel


Figure 10-95 shows the appearance of the front panel of the N1OU08. Figure 10-96 shows the
appearance of the front panel of the N2OU08.

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Figure 10-95 Front panel of the N1OU08

OU08

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4
OUT5 IN5
OUT6 IN6
OUT7 IN7
OUT8 IN8
CLASS 1
LASER
PRODUCT

OU08

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Figure 10-96 Front panel of the N2OU08

OU08
OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
OUT5
IN5
OUT6
IN6
OUT7
IN7
OUT8
IN8

OU08

Interfaces
The front panel of the N1OU08/N2OU08 has eight optical interfaces.
Table 10-152 describes the types and usage of the interfaces of the N1OU08. Table 10-153
describes the types and usage of the interfaces of the N2OU08.
Table 10-152 Interfaces of the N1OU08

Issue 03 (2013-02-20)

Interface

Type of
Interface

Usage

IN1IN8

LC

Receives the first to the eighth channels of STM-1


optical signals.

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Interface

Type of
Interface

Usage

OUT1OUT8

LC

Transmits the first to the eight channels of STM-1


optical signals.

Table 10-153 Interfaces of the N2OU08


Interface

Type of
Interface

Usage

IN1IN8

SC

Receives the first to the eighth channels of STM-1


optical signals.

OUT1OUT8

SC

Transmits the first to the eighth channels of STM-1


optical signals.

10.29.6 Valid Slots


The slots valid for the OU08 vary with the cross-connect capacity of the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

When the cross-connect capacity is 200 Gbit/s, the OU08 can be installed in slots 1926
and 2936.

Table 10-154 lists the slots valid for the SLH1 and the corresponding slots for the OU08. The
OU08 installed in the slot with a smaller number transmits/receives the 1st to the 8th channels
of STM-1 optical signals. The OU08 installed in the slot with a larger number transmits/receives
the 9th to the 16th channels of STM-1 optical signals.
Table 10-154 Slots valid for the SLH1 and the corresponding slots for the OU08

Issue 03 (2013-02-20)

Slot Valid for the SLH1

Corresponding Slot for the OU08

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32
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Slot Valid for the SLH1

Corresponding Slot for the OU08

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

Table 10-155 lists the slots valid for the SEP1 and the corresponding slots for the OU08.
Table 10-155 Slots valid for the SEP1 and the corresponding slots for the OU08
Slot Valid for the SEP1

Corresponding Slot for the OU08

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

10.29.7 Technical Specifications


The technical specifications of the OU08 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 10-156 lists the parameters specified for the optical interfaces of the OU08.
Table 10-156 Parameters specified for the optical interfaces of the OU08

Issue 03 (2013-02-20)

Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

NRZ

Application code

S-1.1

Operating wavelength
range (nm)

N1OU08: 1260-1360

Type of fiber

Single-mode LC

N2OU08: 1261-1360

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Parameter

Value

Mean launched optical


power (dBm)

-15 to -8

Receiver sensitivity
(dBm)

-28

10 SDH Boards

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the OU08 are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.4

Power Consumption
The maximum power consumption of the OU08 at room temperature (25C) is 6 W.

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11

PDH Boards

About This Chapter


The PDH boards include the PDH service interface boards and PDH service processing boards,
to transmit/receive and process E1/T1 signals, E3/T3 signals, E4/STM-1 electrical signals, and
DDN signals.
11.1 PQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PQ1 (63xE1 service processing board). This topic also describes
how to configure and commission the PQ1.
11.2 PQM
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PQM (63xE1/T1 service processing board). This topic also
describes how to configure and commission the PQM.
11.3 PFL1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PFL1 (8xE1 optical processing board). This topic also describes
how to configure and commission the PFL1.
11.4 PL3
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PL3 (3xE3/T3 service processing board). This topic also describes
how to configure and commission the PL3.
11.5 PL3A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PL3A (3xE3/T3 service processing board with the interfaces on
the front panel). This topic also describes how to configure and commission the PL3A.
11.6 PD3
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PD3 (6xE3/T3 service processing board).
11.7 PQ3
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PQ3 (12xE3/T3 service processing board).
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11.8 DX1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the DX1 (DDN service accessing and converging board). This topic
also describes how to configure and commission the DX1.
11.9 DXA
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the DXA (DDN service converging and processing board).
11.10 SPQ4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SPQ4 (4xE4/STM-1 electrical processing board). This topic also
describes how to configure and commission the SPQ4.
11.11 D12B
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D12B (32xE1/T1 access board).
11.12 D12S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D12S (32xE1/T1 switching access board).
11.13 D75S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D75S (32xE1 switching access board).
11.14 D34S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D34S (6xE3/T3 switching access board).
11.15 C34S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the C34S (3xE3/T3 switching access board).
11.16 MU04
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the MU04 (4xE4/STM-1 electrical interface board).
11.17 DM12
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the DM12 (DDN service interface board).
11.18 TSB4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TSB4 (4-channel electrical interface protection switching board).
11.19 TSB8
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TSB8 (8-channel electrical interface protection switching board).

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11.1 PQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PQ1 (63xE1 service processing board). This topic also describes
how to configure and commission the PQ1.

11.1.1 Version Description


The PQ1 is available in the following functional versions: N1 and N2. The functions provided
by the functional versions are different. The N1PQ1 is discontinued.
NOTE

Depending on the port impedance, the PQ1 is available in PQ1A (75 ohms) and PQ1B (120 ohms). Except
this, the two boards are the same in function and feature. When the port impedance does not need to be
present, the PQ1A and PQ1B are referred to as the PQ1.

Table 11-1 describes the versions of the PQ1.


Table 11-1 Versions of the PQ1
Item

Description

Functional versions

The PQ1 is available in the following functional versions: N1 and N2.

Differences

l Service processing: E13 function.


l Maintenance features: CRC function, PRBS test.

Substitution

When the tributary re-timing function is not required, the N1PQ1A


can be replaced with the N2PQ1A.
When the tributary re-timing function is not required, the N1PQ1B
can be replaced with the N2PQ1B.

Note: The PQ1 boards are classified into the PQ1A boards (75 ohms) and PQ1B boards (120
ohms) according to the interface impedance. When the interface impedance is not considered,
the PQ1A and PQ1B are called PQ1 hereafter.

11.1.2 Application
The PQ1 is a PDH processing board. The PQ1 can be used on the OptiX OSN equipment series
to add and drop PDH signals. To transmit/receive and process 63xE1 signals, the PQ1 must be
used with the interface board.
Figure 11-1 shows the application of the PDH processing boards. The PDH processing boards
add tributary signals to line signals and drops tributary signals to line signals.

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Figure 11-1 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.1.3 Functions and Features


The PQ1 processes E1 signals, processes overhead bytes, reports alarms and performance events,
provides maintenance features, and supports the TPS protection.
Table 11-2 provides the functions and features of the PQ1.
Table 11-2 Functions and features of the PQ1

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Function
and
Feature

PQ1
N1PQ1

N2PQ1

Basic
functions

Processes 63xE1
signals.

Processes 63xE1 signals.

Service
processing

Processes 63xE1
electrical signals
when working with
the interface board.

l Processes 63xE1 electrical signals when working


with the interface board.
l Supports the E13 function, which is used to
converge E1 services into E3 services.

Overhead
processing

Supports the processing of the path overheads at the VC-12 level, such as the
J2 byte.

Alarms and
performanc
e events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

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Function
and
Feature

PQ1

Maintenan
ce features

l Supports inloops and outloops at electrical interfaces.

N1PQ1

N2PQ1

l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l The N1PQ1 supports the PRBS test in the tributary direction and in the
cross-connect direction.
l The N2PQ1:
Supports the PRBS test in the tributary direction and in the cross-connect
direction in the normal mode.
Does not support the PRBS test in the MUX mode or Server mode.
l The N1PQ1 does not support the CRC function, but the N2PQ1 supports
the CRC function.

Protection
schemes

Supports the TPS protection when working with the interface board.
l The N1PQ1 supports hybrid protection. When the working board is the
N1PQ1, the protection board can be the N1PQ1, N2PQ1, or N1PQM.
l The N2PQ1 does not support hybrid protection. When the working board
is the N2PQ1, the protection board can only be the N2PQ1.

11.1.4 Working Principle and Signal Flow


The PQ1 consists of the interface module, mapping/demapping module, interface converting
module, logic and control module, and power module.
Figure 11-2 shows the functional block diagram of the PQ1.

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Figure 11-2 Functional block diagram of the PQ1


Backplane
155 MHz
PLL

2 MHz
OSC

E1

63x2 Mbit/s

LIU
PPI

E1

LIU

Mapping/
Demapping
module
63x2 Mbit/s

155 Mbit/s

155 Mbit/s

Reference
clock

Cross-connect
unit

High-speed
bus

Cross-connect
unit A

Interface
converting
module High-speed
bus

Cross-connect
unit B

Interface
module

LOS
Outloop/Inloop
control

Cross-connect
unit

Frame header
Communication

Logic and
control module
+3.3 V
Power
module

Power
module

SCC unit

Fuse

-48 V/-60 V
-48V/-60V

Fuse

+3.3 V backup power

LIU: logic interface unit

PPI: PDH physical interface

OSC: oscillator

Figure 11-3 shows the functional block diagram of the mapping/demapping module.
Figure 11-3 Functional block diagram of the mapping/demapping module
Mapping/demapping module
E1

LPA

LPT

PDH AIS
detector

E1
LPA

LPOH(V5/J2/N2/
K4) insertion
LPOH(V5/J2/N2/
K4) extraction

LPT

HPA

HPT

STM-1

TU-AIS/TULOP detector

HPA

HPT

STM-1

Interface Module
The interface module consists of LIUs and provides the inloop and outloop functions. The
interface module performs the following functions:
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Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the PDH LOS signals.

11 PDH Boards

Mapping/Demapping Module
l

LPA sub-module
The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to be
adapted so that the stream can be transported to the synchronous network for check of the
PDH AIS.

LPT sub-module
The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C-12 container and POH. The POH contains nine octets equally distributed within the frame
bytes for VC-12, namely, V5, J2, N2, and K4.

HPA sub-module
The HPA sub-module generates and processes the channel-level TU-PTR. In the receive
direction, the signals are split into VC-12s, which are located and isolated in TU-12s. The
TU-PTR is processed. TU-AIS and TU-LOP alarms are monitored. In the transmit
direction, VC-12s are located precisely and added with the TU-PTR. Sixty-three TU-12s
are multiplexed into a VC-4 by bytes interleaving. The sequence is as follows: TUG2>TUG3->VC-4

HPT sub-module
The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST sub-module and RST sub-module


These sub-modules are required to create a proprietary STM1 signal so that the E1
mapping/demapping module can interface with the multiplex unit.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Control the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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11.1.5 Front Panel


The front panel of the PQ1 has indicators.

Diagram of the Front Panel


Figure 11-4 shows the appearance of the front panel of the PQ1.
Figure 11-4 Front panel of the PQ1

PQ1
STAT
ACT
PROG
SRV

PQ1

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the PQ1 does not have an interface.
The D75S, D12S, and D12B provide 75-ohm or 120-ohm E1 interfaces for the PQ1. For details,
see the topics that describe the D75S, D12S, and D12B.

11.1.6 Jumpers and DIP Switches


The PQ1 does not have any jumpers or DIP switches that are used for board settings.

11.1.7 Valid Slots


The PQ1 must be installed in a valid slot in the subrack. Otherwise, the PQ1 fails to work
normally.
The PQ1 can be installed in slots 15 and 1316 in the main subrack.
Table 11-3 lists the slots valid for the PQ1 and the corresponding slots for the D75S, D12S, and
D12B in the main subrack.
Table 11-3 Slots valid for the PQ1 and the corresponding slots for the D75S, D12S, and D12B
in the main subrack
Slot Valid for the PQ1

Corresponding Slots for the D75S, D12S,


and D12B

Slot 1

Without an interface board

Slot 2

Slot 19 (132 channels of services)


Slot 20 (3363 channels of services)

Slot 3

Slot 21 (132 channels of services)


Slot 22 (3363 channels of services)

Slot 4

Slot 23 (132 channels of services)


Slot 24 (3363 channels of services)

Slot 5

Slot 25 (132 channels of services)


Slot 26 (3363 channels of services)

Slot 13

Slot 29 (132 channels of services)


Slot 30 (3363 channels of services)

Slot 14

Slot 31 (132 channels of services)


Slot 32 (3363 channels of services)

Slot 15

Slot 33 (132 channels of services)


Slot 34 (3363 channels of services)

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Slot Valid for the PQ1

Corresponding Slots for the D75S, D12S,


and D12B

Slot 16

Slot 35 (132 channels of services)


Slot 36 (3363 channels of services)

NOTE

l Slot 1 can house a protection board for the TPS protection. The board in slot 1 protects the boards in
slots 25 and 1316.
l If the interface board for the boards in slots 25 and 1316 is the D12B, the boards in slots 25 and
1316 cannot be protected by the TPS protection scheme.

11.1.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the PQ1 indicates the type of interface impedance.
Table 11-4 provides the relationship between the feature code of the PQ1 and the type of
interface impedance.
Table 11-4 Relationship between the feature code of the PQ1 and the type of interface impedance
Board

Feature Code

Type of Interface Impedance

SSN1PQ1A01 and SSN2PQ1A01

A01

75-ohm

SSN1PQ1B01 and SSN2PQ1B01

B01

120-ohm

11.1.9 Board Protection


The PQ1 supports the 1:N TPS protection.

Protection Principle
The PQ1 boards work with the D75S or D12S boards to realize one 1:N (N8) TPS protection
group.
Figure 11-5 shows the TPS protection provided by the PQ1. When the cross-connect and timing
board detects that a working PQ1 is faulty, the cross-connect and timing board issues a service
switching command to control the interface board to switch the services from the faulty PQ1 to
the protection PQ1, which realizes the protection of the services.

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Figure 11-5 TPS protection provided by the PQ1


Service signal

Service signal
Switching
control bus

Interface board

Protection bus
Protection bus

Crossconnect and
timing board

Interface board

Interface board

Interface board

Interface board

Interface board

Working board N

Working board

Working board 1

Protection board

Failed

NOTE

TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing board.
Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

Hardware Configuration
Table 11-5 shows the slot configuration for the 1:8 TPS protection of the PQ1.
Table 11-5 Slot configuration for the 1:8 TPS protection of the PQ1

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Working Board

Protection Board

Slot Configuration

PQ1A (75-ohm)

PQ1A (75-ohm)

PQ1B (120-ohm)

PQ1B (120-ohm) or PQM

Slot 1 can house a protection board.


The board in slot 1 protects the boards
in slots 2-5 and 13-16. Figure 11-6
shows the slot configuration for the 1:8
TPS protection of the PQ1.

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D12S
D12S
D12S
D12S
D12S

D12S

PIU

PIU

S
L
O
T
3
1

S
L
O
T
3
2

S
L
O
T
3
3

S
L
O
T
3
4

S
L
O
T
1
0

XCS

XCS

S
L
O
T
1
1

S
L
O
T
1
2

S
L
O
T
3
6

S
L
O
T
3
7

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8

Working

S
L
O
T
9

Working

S S S S
L L L L
O O O O
T T T T
5 6 7 8

S
L
O
T
3
5

FAN

Working

S
L
O
T
4

Working

FAN

Working

Working

Working

Protection

S S S
L L L
O O O
T T T
1 2 3

S
L
O
T
3
0

AUX

D12S

FAN

S
L
O
T
2
9

GSCC

S
L
O
T
2
8

D12S

S
L
O
T
2
7

S
L
O
T
2
4

Working

S
L
O
T
2
6

S
L
O
T
2
3

D12S
D12S

S
L
O
T
2
5

S
L
O
T
2
2

D12S
D12S
D12S

S
L
O
T
2
1

D12S

S
L
O
T
2
0

D12S

S
L
O
T
1
9

D12S

Figure 11-6 Slot configuration for the 1:8 TPS protection of the PQ1

Fiber routing area

11.1.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the interface board and cable match the board. Ensure that the
impedance of the cable matches the impedance of the board.

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Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the PDH interface.
l J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS and
the default value of the J2 to be received is Disabled.
l V5 byte: The setting of the V5 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the V5 byte is Asynchronous.
l Service load indication: When a service channel does not process its carried services, select
Non-Loaded. When the service channel processes its carried services, select Load.
For details, see 28.7 Checking Board Parameters.
Step 3 Optional: Create the protection. For details, see Creating a TPS Protection Group for Boards.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
NOTE

Before you configure services, learn the type of protection subnet configured for the ring network. For the
method for querying the protection subnet, see 28.1 Querying the Protection Subnet.

Step 5 Set parameters on the U2000. For the parameters to be set, see 27.6 PDH Boards.
----End

Commissioning the Board


Step 1 Required: Test the connection between the cable and the service interface. For details, see
Testing Connection Between the Cables and the PDH Service Interfaces.
Step 2 Optional: Test the TPS of the electrical interface. For details, see Testing the TPS of the
Electrical Interfaces.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
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normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

11.1.11 Parameter Settings


You can set parameters for the PQ1 by using the U2000.
You can set the following parameters for the PQ1 by using the U2000:
l

J2 byte

V5 byte

Tributary loopback

Service loading indication

For the description of each parameter, see 27 Parameter Settings.

11.1.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 11-6 lists the faults that occur on the PQ1 frequently and the troubleshooting methods.
Table 11-6 Methods used to troubleshoot the faults that occur on the PQ1 frequently
Fault
Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The cable or connector


becomes abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect operation is
performed.
l The types or settings of
the boards are
inconsistent.
Bit error

The equipment becomes


faulty.

See Troubleshooting Bit Errors.

Pointer
justification

l The clock configuration


is incorrect.

See Troubleshooting Pointer Justification.

l The precision of the


external clock source is
very low.
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Fault
Symptom

Common Fault Cause

Troubleshooting Method

Protection
switching
failure

The TPS fails.

See Troubleshooting Protection Switching


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PQ1, see Replacing a PDH Board.

11.1.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

11.1.13.1 Alarms of N1PQ1


BD_STATUS

BIP_EXC

BIP_SD

CHIP_FAIL

COMMUN_FAIL

DOWN_E1_AIS

E1_LOC

LOOP_ALM

LP_RDI

LP_REI

LP_RFI

LP_SIZE_ERR

LP_SLM

LP_TIM

LP_UNEQ

NO_BD_SOFT

SWDL_PKG_NOBDSOFT

POWER_ABNORMAL

SLAVE_WORKING

SPARE_PATH_ALM

SUBCARD_ABN

T_ALOS

T_LOSEX

TEST_STATUS

TPS_ALM

TR_LOC

TU_AIS

TU_LOP

UP_E1_AIS

V5_VCAIS

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

WRG_BD_TYPE

11.1.13.2 Alarms of N2PQ1

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B3_EXC

B3_SD

BD_STATUS

BIP_EXC

BIP_SD

C2_VCAIS

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CHIP_ABN

CHIP_FAIL

COMMUN_FAIL

CRC4_ERR_OVER

DOWN_E1_AIS

LFA

LMFA

LOOP_ALM

LP_RDI

LP_REI

LP_RFI

LP_SLM

LP_UNEQ

NO_BD_SOFT

P_AIS

P_LOF

P_RAI

LP_TIM

POWER_ABNORMAL

SLAVE_WORKING

SUBCARD_ABN

T_ALOS

T_LOSEX

TEMP_OVER

TEST_STATUS

TPS_ALM

TR_LOC

TU_AIS

TU_LOP

UP_E1_AIS

V5_VCAIS

PATCH_ERR

SWDL_PKG_NOBDSOFT

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

WRG_BD_TYPE

11.1.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

11.1.14.1 Performance Events of N1PQ1


LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

TUPJCHIGH

TUPJCLOW

11.1.14.2 Performance Events of N2PQ1

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CRC4_ERR

E1_LCV_SDH

E1_LES_SDH

E1_LLOSS_SDH

E1_LSES_SDH

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

TUPJCHIGH

TUPJCLOW

VC3BBE

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VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

11.1.15 Technical Specifications


The technical specifications of the PQ1 include the parameters specified for electrical interfaces,
mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


The D75S, D12S, or D12B provides electrical interfaces for the PQ1. For the parameters
specified for the electrical interfaces, see Technical Specifications of the D75S, Technical
Specifications of the D12S and Technical Specifications of the D12B.

Mechanical Specifications
The mechanical specifications of the PQ1 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the N1PQ1 at room temperature (25C) is 19 W.
The maximum power consumption of the N2PQ1 at room temperature (25C) is 13 W.

11.2 PQM
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PQM (63xE1/T1 service processing board). This topic also
describes how to configure and commission the PQM.

11.2.1 Version Description


The PQM is available in one functional version, namely, N1.

11.2.2 Application
The PQM is a PDH processing board. The PQM can be used on the OptiX OSN equipment series
to add and drop PDH signals. To transmit/receive and process 63xE1/T1 signals, the PQM must
be used with the interface board.
Figure 11-7 shows the application of the PDH processing boards. The PDH processing boards
add tributary signals to line signals and drops tributary signals to line signals.
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Figure 11-7 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.2.3 Functions and Features


The PQM processes E1/T1 signals, processes overhead bytes, reports alarms and performance
events, provides maintenance features, and supports the TPS protection.
Table 11-7 provides the functions and features of the PQM.
Table 11-7 Functions and features of the PQM

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Function
and Feature

PQM

Basic
functions

Processes 63xE1/T1 signals.

Service
processing

Transmits/Receives and processes 63xE1/T1 electrical signals when


working with the interface board. Each channel can be configured as E1 or
T1.

Overhead
processing

Supports the processing of the path overheads at the VC-12 level, such as
the J2 byte.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

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Function
and Feature

PQM

Maintenance
features

l Supports inloops and outloops at electrical interfaces.

11 PDH Boards

l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l Supports the PRBS test in the tributary direction and in the cross-connect
direction.
l Supports the CRC function.

Protection
schemes

Supports the TPS Protection when working with the interface board.
l When the working board is the N1PQ1, the protection board can be the
N1PQ1, N2PQ1 or N1PQM. In this case, the hybrid protection is
provided.
l When the working board is the N1PQM, the protection board can only
be the N1PQM.

11.2.4 Working Principle and Signal Flow


The PQM consists of the interface module, mapping/demapping module, interface converting
module, logic and control module, and power module.
Figure 11-8 shows the functional block diagram of the PQM.

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Figure 11-8 Functional block diagram of the PQM


Backplane
155 MHz
PLL

1.5 MHz/2 MHz


OSC

E1/T1

63x1.5 Mbit/s
63x2 Mbit/s

LIU
PPI

E1/T1

LIU

Mapping/
Demapping
63x1.5 Mbit/s
module
63x2 Mbit/s

155 Mbit/s

155 Mbit/s

Reference
clock

Cross-connect
unit

High-speed
bus

Cross-connect
unit A

Interface
converting
module High-speed
bus

Cross-connect
unit B

Interface
module

LOS
Outloop/Inloop
control

Cross-connect
unit

Frame header
Communication

Logic and
control module
+3.3 V
Power
module

Power
module

SCC unit

Fuse

-48 V/-60 V
-48V/-60V

Fuse

+3.3 V backup power

LIU: logic interface unit

PPI: PDH physical interface

OSC: oscillator

Figure 11-9 shows the functional block diagram of the mapping/demapping module.
Figure 11-9 Functional block diagram of the mapping/demapping module
Mapping/demapping module
E1/T1

LPA

LPT

PDH AIS
detector

LPOH(V5/J2/N2/
K4) insertion
LPOH(V5/J2/N2/
K4) extraction

E1/T1
LPA

LPT

HPA

HPT

STM-1

TU-AIS/TULOP detector

HPA

HPT

STM-1

Interface Module
The interface module consists of LIUs and provides the inloop and outloop functions. The
interface module performs the following functions:
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Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the PDH LOS signals.

11 PDH Boards

Mapping/Demapping Module
l

LPA sub-module
The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to be
adapted so that the stream can be transported to the synchronous network for check of the
PDH AIS.

LPT sub-module
The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C-12 container and POH. The POH contains nine octets equally distributed within the frame
bytes for VC-12, namely, V5, J2, N2, and K4.

HPA sub-module
The HPA sub-module generates and processes the channel-level TU-PTR. In the receive
direction, the signals are split into VC-12s, which are located and isolated in TU-12s. The
TU-PTR is processed. TU-AIS and TU-LOP alarms are monitored. In the transmit
direction, VC-12s are located precisely and added with the TU-PTR. Sixty-three TU-12s
are multiplexed into a VC-4 by bytes interleaving. The sequence is as follows: TUG2>TUG3->VC-4

HPT sub-module
The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST sub-module and RST sub-module


These sub-modules are required to create a proprietary STM1 signal so that the E1
mapping/demapping module can interface with the multiplex unit.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Control the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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11.2.5 Front Panel


The front panel of the PQM has indicators.

Diagram of the Front Panel


Figure 11-10 shows the appearance of the front panel of the PQM.
Figure 11-10 Front panel of the PQM

PQM
STAT
ACT
PROG
SRV

PQM

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the PQM does not have an interface. The D12S and D12B provide 120-ohm
E1 interfaces or 100-ohm T1 interfaces for the PQM. For details, see the topics that describe the
D12S and D12B.

11.2.6 Jumpers and DIP Switches


The PQM does not have any jumpers or DIP switches that are used for board settings.

11.2.7 Valid Slots


The PQM must be used with the D12S or D12B. In addition, the PQM must be installed in a
valid slot in the subrack. Otherwise, the PQM fails to work normally.
The PQM board can be installed in slots 15 and 1316 in the main subrack.
Table 11-8 lists the slots valid for the PQM and the corresponding slots for the D12S and D12B
in the main subrack.
Table 11-8 Slots valid for the PQM and the corresponding slots for the D12S and D12B in the
main subrack
Slot Valid for the PQM

Corresponding Slots for the D12S and


D12B

Slot 1

Without an interface board

Slot 2

Slot 19 (132 channels of services)


Slot 20 (3363 channels of services)

Slot 3

Slot 21 (132 channels of services)


Slot 22 (3363 channels of services)

Slot 4

Slot 23 (132 channels of services)


Slot 24 (3363 channels of services)

Slot 5

Slot 25 (132 channels of services)


Slot 26 (3363 channels of services)

Slot 13

Slot 29 (132 channels of services)


Slot 30 (3363 channels of services)

Slot 14

Slot 31 (132 channels of services)


Slot 32 (3363 channels of services)

Slot 15

Slot 33 (132 channels of services)


Slot 34 (3363 channels of services)

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Slot Valid for the PQM

Corresponding Slots for the D12S and


D12B

Slot 16

Slot 35 (132 channels of services)


Slot 36 (3363 channels of services)

NOTE

l Slot 1 can house a protection board for the TPS protection. The board in slot 1 protects the boards in
slots 25 and 1316.
l If the interface board for the boards in slots 25 and 1316 is the D12B, the boards in slots 25 and
1316 cannot be protected by the TPS protection scheme.

11.2.8 Feature Code


The PQM does not have a feature code.

11.2.9 Board Protection


The PQM supports the 1:N TPS protection.

Protection Principle
The PQM boards can work with the D12S boards to realize one 1:N (N8) TPS protection group.
Figure 11-11 shows the TPS protection provided by the PQM.
Figure 11-11 TPS protection provided by the PQM (E1 services are provided as an example)
Service signal

Service signal
Switching
control bus

Interface board

Protection bus
Protection bus

Crossconnect and
timing board

Interface board

Interface board

Interface board

Interface board

Interface board

Working board N

Working board

Working board 1

Protection board

Failed

When the cross-connect and timing board detects that a working PQM is faulty, the cross-connect
and timing board issues a service switching command. Then, the interface board switches the
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services from the faulty PQM to the protection PQM, which realizes the protection of the
services.
NOTE

TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing board.
Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

Hardware Configuration
Table 11-9 shows the slot configuration for the 1:8 TPS protection of the PQM.
Table 11-9 Slot configuration for the 1:8 TPS protection of the PQM
Working
Board

Protection Board

Slot Configuration

PQM (E1)

PQM (E1)

PQM (T1)

PQM (T1)

Slot 1 can house a protection board. The board


in slot 1 protects the boards in slots 2-5 and
13-16. Figure 11-12 shows the slot
configuration for the 1:8 TPS protection of the
PQM.

S
L
O
T
3
1

S
L
O
T
3
4

S
L
O
T
3
5

S
L
O
T
3
6

S
L
O
T
3
7

S
L
O
T
1
0

Protection

Working

Working

XCS

XCS

S
L
O
T
1
1

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8

Working
Working

S
L
O
T
9

Working

S S S S
L L L L
O O O O
T T T T
5 6 7 8

FAN

Working

S
L
O
T
4

Working

S
L
O
T
3
3

FAN

S S S
L L L
O O O
T T T
1 2 3

Working

S
L
O
T
3
2

AUX

S
L
O
T
3
0

GSCC

FAN

S
L
O
T
2
9

D12S

S
L
O
T
2
8

D12S
D12S

S
L
O
T
2
7

D12S
D12S
D12S

S
L
O
T
2
6

D12S

S
L
O
T
2
5

S
L
O
T
2
4

D12S

D12S
D12S
D12S

S
L
O
T
2
3

PIU

D12S

S
L
O
T
2
2

PIU

S
L
O
T
2
1

D12S

S
L
O
T
2
0

D12S
D12S

S
L
O
T
1
9

D12S

Figure 11-12 Slot configuration for the 1:8 TPS protection of the PQM

Fiber routing area

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11.2.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the interface board and cable match the board. Ensure that the
impedance of the cable matches the impedance of the board.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the PDH interface.
l J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS and
the default value of the J2 to be received is Disabled.
l V5 byte: The setting of the V5 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the V5 byte is Asynchronous.
l Service load indication: When a service channel does not process its carried services, select
Non-Loaded. When the service channel processes its carried services, select Load.
For details, see 28.7 Checking Board Parameters.
Step 3 Optional: Create the protection. For details, see Creating a TPS Protection Group for Boards.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
NOTE

Before you configure services, learn the type of protection subnet configured for the ring network. For the
method for querying the protection subnet, see 28.1 Querying the Protection Subnet.

Step 5 Set parameters on the U2000. For the parameters to be set, see 27.6 PDH Boards.
----End
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Commissioning the Board


Step 1 Required: Test the connection between the cable and the service interface. For details, see
Testing Connection Between the Cables and the PDH Service Interfaces.
Step 2 Optional: Test the TPS of the electrical interface. For details, see Testing the TPS of the
Electrical Interfaces.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

11.2.11 Parameter Settings


You can set the parameters for the PQM by using the U2000.
You can set the following parameters for the PQM by using the U2000:
l

J2 byte

V5 byte

Tributary loopback

For the description of each parameter, see 27 Parameter Settings.

11.2.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 11-10 lists the faults that occur on the PQM frequently and the troubleshooting methods.

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Table 11-10 Methods used to troubleshoot the faults that occur on the PQM frequently
Fault
Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The cable or connector


becomes abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect operation is
performed.
l The types or settings of
the boards are
inconsistent.
Bit error

The equipment becomes


faulty.

See Troubleshooting Bit Errors.

Pointer
justification

l The clock configuration


is incorrect.

See Troubleshooting Pointer Justification.

l The precision of the


external clock source is
very low.
Protection
switching
failure

The TPS fails.

See Troubleshooting Protection Switching


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PQM, see Replacing a PDH Board.

11.2.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

11.2.13.1 Alarms of N1PQM

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BIP_EXC

BD_STATUS

BIP_SD

CHIP_FAIL

COMMUN_FAIL

CRC4_ERR_OVER

CRC6_ERR_OVER

DOWN_E1_AIS

DOWN_T1_AIS

E1_LOC

LFA

LMFA

LOOP_ALM

LP_RDI

LP_REI

LP_SIZE_ERR

LP_SLM

LP_RFI

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LP_TIM

LP_UNEQ

NO_BD_SOFT

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

RMFA

SLAVE_WORKING

SPARE_PATH_ALM

SUBCARD_ABN

T_ALOS

T_LOSEX

TEST_STATUS

TPS_ALM

TR_LOC

TS16_AIS

TU_AIS

TU_LOP

UP_E1_AIS

UP_T1AIS

V5_VCAIS

RFA

SWDL_PKG_NOBDSOFT

POWER_ABNORMAL

WRG_BD_TYPE

11.2.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

11.2.14.1 Performance Events of N1PQM


CRC4_ERR

CRC6_ERR

E1_LCV_SDH

E1_LES_SDH

E1_LSES_SDH

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

T1_LCV_SDH

T1_LES_SDH

T1_LSES_SDH

TUPJCHIGH

TUPJCLOW

11.2.15 Technical Specifications


The technical specifications of the PQM include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


The D12S or D12B provides electrical interfaces for the PQM. For the parameters specified for
the electrical interfaces, see Technical Specifications of the D12S and Technical Specifications
of the D12B.

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Mechanical Specifications
The mechanical specifications of the PQM are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the PQM at room temperature (25C) is 22 W.

11.3 PFL1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PFL1 (8xE1 optical processing board). This topic also describes
how to configure and commission the PFL1.

11.3.1 Version Description


The PFL1 is available in one functional version, N1.

11.3.2 Application
The PFL1 is a PDH processing board. The PFL1 can be used on the OptiX OSN equipment
series to receive/transmit and process 8xE1 optical signals.
Figure 11-13 shows the application of the PDH processing boards. The PDH processing boards
add tributary signals to line signals and drops tributary signals to line signals.
Figure 11-13 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

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11.3.3 Functions and Features


The PFL1 processes E1 optical signals and overheads, and supports alarms, performance events,
and maintenance features.
Table 11-11 provides the functions and features of the PFL1.
Table 11-11 Functions and features of the PFL1
Function and
Feature

PFL1

Basic functions

Processes 8xE1 optical signals.

Service
processing

Receives/Transmits and processes 8xE1 optical signals.

Optical port
specifications

Supports I-2M optical ports, which comply with standards defined by


Huawei.

Optical module
specifications

l Supports the detection and query of information about an optical


module.
l Allows setting the on/off state of a laser and supports the automatic laser
shutdown (ALS) function.
l Supports the usage and monitoring of eSFP optical modules, facilitating
optical module maintenance.

Overhead
processing

Processes path overheads at the VC-12 level, such as J2 bytes.

Alarms and
performance
events

Provides various alarms and performance events, facilitating equipment


management and maintenance.

Maintenance
features

l Supports inloops and outloops at optical ports.


l Supports warm resets and cold resets. Warm resets do not affect ongoing
services.
l Supports the query of board manufacturer information.
l Supports in-service FPGA loading.
l Supports board software upgrades without affecting ongoing services.
l Supports the PRBS test in the tributary direction and in the crossconnect direction.

Protection
scheme

TPS protection is not supported.

11.3.4 Working Principle and Signal Flow


The PFL1 consists of the client-side receive/transmit module, mapping/demapping module,
interface converting module, logic and control module, clock module, and power module.
Figure 11-14 shows the functional block diagram of the PFL1.
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Figure 11-14 Functional block diagram of the PFL1


Backplane

E1

Clientside
interface
module

Interface
converting
module

Mapping/Demappi
ng module

Cross-connect
unit A/B

Communication
Logic and control module
32 MHz
38 MHz
58 MHz
66 MHz

Cross-connect
unit A/B

Clock
module

Reference clock and frame header

+3.3 V
Power
module

Power
module

Fuse
Fuse

SCC unit
Cross-connect
unit A/B

-48 V/-60 V
-48 V/-60 V
+3.3 V backup
power

Client-Side Receive/Transmit Module


The client-side receive/transmit module performs the following functions:
l

In the receive direction, converts received optical signals into electrical signals.

In the transmit direction, converts received electrical signals into E1 optical signals.

Detects the T_ALOS alarm and provides the ALS function.

Mapping/Demapping Module
The mapping/demapping module maps 8xE1 signals into VC-4 signals or demaps VC-4 signals
into 8xE1 signals by using asynchronous mapping.

Interface Converting Module


The interface converting module converts the signal bus into a parallel bus. The interface
converting module connects the high-rate backplane interface to the low-rate interface chip of
the transmit system.

Logic and Control Module


The logic control module collects and reports information about board status. This module
contains basic logic units and performs the following functions:
l

Recovers clock signals from an optical module.

Realizes inter-board communication using internal Ethernet interfaces.

Selects and traces clock signals from the active and standby cross-connect units.

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Selects clock signals and frame header signals from the active and standby cross-connect
units.

Controls board indicators.

Clock Module
The clock module provides the desired reference clock to boards.

Power Module
The power module converts the -48 V/-60 V power supply into required DC voltages.

11.3.5 Front Panel


The front panel of the PFL1 has indicators.

Diagram of the Front Panel


Figure 11-15 shows the front panel of the PFL1.
Figure 11-15 Front panel of the PFL1
PFL1
STAT
ACT
PROG
SRV
CLASS 1
LASER
PRODUCT

TX1 RX1
TX2 RX2
TX3 RX3
TX4 RX4
TX5 RX5
TX6 RX6
TX7 RX7
TX8 RX8
PFL1

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Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the PFL1 has eight optical interfaces. Table 11-12 describes the types and
usage of the optical interfaces on the PFL1.
Table 11-12 Electrical ports on the PFL1
Port

Port Type

Usage

RX1-RX8

LC

Receives optical signals.

TX1-TX8

LC

Transmits optical signals.

11.3.6 Jumpers and DIP Switches


The PFL1 does not have any jumpers or DIP switches for board settings.

11.3.7 Valid Slots


The PFL1 must be installed in a valid slot in the subrack. Otherwise, the PFL1 fails to work
properly.
The PFL1 can be installed in slots 1-8 and slots 11-16.

11.3.8 Feature Code


The PFL1 does not have a feature code.

11.3.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the board hardware, configuring the board, commissioning
the board, and checking the operation of the board.

Checking the Board Hardware


Step 1 Required: Check the board hardware.
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l The labels on the front panel of the board are correct and clear.
l The daughter board of the board is properly installed.
l All the components on both surfaces of the board are available and intact.
Step 2 Required: Verify that cables match the board.
Step 3 Required: Insert the board. For details, see Replacing Boards Onsite. Ensure that the board is
in proper contact with the bottom of the subrack and the front panel of the board is properly
locked.
Step 4 Required: Verify that the version of the board software matches the version of the NE software
and the version of the U2000 software.
----End

Configuring the Board


Step 1 Required: Add a logical board. For details, see Adding Boards.
Step 2 Required: Set the PDH port.
l J2 byte: The settings of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS and
the default value of the J2 to be received is Disabled.
l V5 byte: The settings of the V5 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the V5 byte is Asynchronous.
l Service load indication: If a service channel does not process its carried services, select NonLoaded. If a service channel processes its carried services, select Load.
For details, see 28.7 Checking Board Parameters.
Step 3 Required: Configure services. For details, see Configuring the SDH Services.
Step 4 Optional: Set parameters on the U2000. For details, see 27.6 PDH Boards.
----End

Commissioning the Board


Step 1 Required: Test the optical port specifications. For details, see Testing Specifications of Optical
Interfaces.
Step 2 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
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cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

11.3.10 Parameter Settings


You can set parameters for the PFL1 by using the U2000.
You can set the following parameters for the PFL1 by using the U2000:
l

J2 byte

V5 byte

Tributary loopback

For the description of each parameter, see 27 Parameter Settings.

11.3.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also provides
the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 11-13 lists the faults that occur on the PFL1 frequently and the troubleshooting methods.
NOTE

The PFL1 uses an SFP optical module. If the PFL1 operates and an abnormal alarm occurs on the optical
interface, check whether the optical module is properly installed. To check whether the optical module is
properly installed, you can reseat the optical module.

Table 11-13 Methods used to rectify the faults that occur on the PFL1 frequently
Fault
Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The optical fiber or


connector is faulty.

See Troubleshooting TDM Service


Interruptions.

l An incorrect operation is
performed.
l The types or settings of
the boards are
inconsistent.
Bit error

l The equipment becomes


faulty.

See Troubleshooting Bit Errors.

l The optical power


becomes abnormal.

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Fault
Symptom

Common Fault Cause

Troubleshooting Method

Pointer
justification

l The clock configuration


is incorrect.

See Troubleshooting Pointer Justification.

l The precision of the


external clock source is
very low.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information about how to replace the PFL1, see Replacing a PDH Board.

11.3.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

11.3.12.1 Alarms of N1PFL1


T_ALOS

LP_SIZE_ERR

UP_E1_AIS

BIP_EXC

BIP_SD

LP_RFI

TU_AIS

TU_LOP

LP_UNEQ

LP_TIM

LP_SLM

LP_RDI

LP_REI

LOOP_ALM

CHIP_FAIL

NO_BD_SOFT

POWER_ABNORMAL

TEST_STATUS

T_LOSEX

TR_LOC

V5_VCAIS

SLAVE_WORKING

DOWN_E1_AIS

COMMUN_FAIL

BD_STATUS

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

TF

IN_PWR_ABN

OUT_PWR_ABN

LSR_WILL_DIE

LSR_COOL_ALM

TEM_HA

TEM_LA

LASER_SHUT

LSR_NO_FITED

LASER_MOD_ERR

ALM_ALS

WRG_BD_TYPE

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11.3.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

11.3.13.1 Performance Events of N1PFL1


LPBBE

LPES

LPUAS

LPCSES

LPSES

LPFEBBE

LPFEES

LPFESES

LPFEUAS

LPFECSES

TUPJCHIGH

TUPJCLOW

TLBMAX

TLBMIN

TLBCUR

OSPICCVMAX

OSPICCVMIN

OSPICCVCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

11.3.14 Technical Specifications


The technical specifications of the PFL1 include the parameters specified for optical interfaces,
mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 11-14 lists the parameters specified for the optical interfaces of the PFL1.
Table 11-14 Parameters specified for the optical interfaces of the PFL1

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Parameter

Value

Nominal bit rate

2048 kbit/s

Line code type

NRZ

Type of optical interface

I-2M

Transmission distance (km)

0 to 2

Operating wavelength range


(nm)

1260 to 1360

Type of fiber

Single-mode LC

Launched optical power (dBm)

-15 to -8

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Parameter

Value

Optical receiver sensitivity


(dBm)

-23

Minimum overload (dBm)

-8

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral


width (nm)

Side mode suppression ratio


(dB)

11 PDH Boards

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the PFL1 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power consumption
The maximum power consumption of the PFL1 at room temperature (25C) is 17 W.

11.4 PL3
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PL3 (3xE3/T3 service processing board). This topic also describes
how to configure and commission the PL3.

11.4.1 Version Description


The PL3 is available in two functional versions, namely, N1 and N2. The difference between
the two versions is with regard to their functions. The N1PL3 is discontinued.
Table 11-15 describes the versions of the PL3.
Table 11-15 Versions of the PL3

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Item

Description

Functional versions

The PL3 is available in two functional versions, namely, N1 and N2.

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Item

Description

Differences

l Service processing: E13 function and M13 function.


l Maintenance features: PRBS test and CRC function.

Substitution

The N2PL3 can replace the N1PL3.

11.4.2 Application
The PL3 is a PDH processing board. The PL3 can be used on the OptiX OSN equipment series
to add and drop PDH signals. To transmit/receive and process 3xE3/T3 signals, the PL3 must
be used with the interface board.
Figure 11-16 shows the application of the PDH processing boards. The PDH processing boards
add tributary signals to line signals and drops tributary signals to line signals.
Figure 11-16 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.4.3 Functions and Features


The PL3 processes E3/T3 signals, processes overhead bytes, reports alarms and performance
events, provides maintenance features, and supports the TPS protection.
Table 11-16 provides the functions and features of the PL3.

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Table 11-16 Functions and features of the PL3


Function and
Feature

PL3

Basic functions

Processes 3xE3/T3 signals.

Service processing

Transmits/Receives and processes 3xE3/T3 electrical signals.


The N2PL3 supports the E13 function, which is used to converge E1
services into E3 services.
The N2PL3 supports the M13 function, which is used to converge T1
services into T3 services.

Overhead
processing

Supports the setting and query of all the path overhead bytes at the VC-3
level.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Maintenance
features

l Supports inloops and outloops at electrical interfaces.


l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l The N1PL3 supports the PRBS test in only the tributary direction.
l The N2PL3:
Supports the PRBS test in the tributary direction and in the crossconnect direction in the normal mode.
Does not support the PRBS test in the Server mode.
Support the PRBS test in the electrical interface direction in the
MUX mode.
l The N1PL3 does not support the CRC function, but the N2PL3
supports the CRC function.

Protection
schemes

Supports the TPS protection when working with the interface board
and the switching and bridging board.

11.4.4 Working Principle and Signal Flow


The PL3 consists of the interface module, mapping/demapping module, interface converting
module, logic and control module, and power module.
Figure 11-17 shows the functional block diagram of the PL3.

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Figure 11-17 Functional block diagram of the PL3


Backplane
155 MHz
PLL

34 MHz/45 MHz
OSC

E3/T3

3x34 Mbit/s
3x45 Mbit/s

LIU
PPI

E3/T3

LIU

2x155 Mbit/s

Mapping/
Demapping
3x34 Mbit/s
2x155 Mbit/s
module
3x45 Mbit/s

Reference
clock

High-speed
bus

Interface
converting
module High-speed
bus

Cross-connect
unit

Cross-connect
unit A
Cross-connect
unit B

Interface
module

LOS
Outloop/Inloop
control

Cross-connect
unit

Frame header
Communication

Logic and
control module
+3.3 V
Power
module

Power
module

SCC unit

Fuse

-48 V/-60 V
-48V/-60V

Fuse

+3.3 V backup power

LIU: logic interface unit

PPI: PDH physical interface

OSC: oscillator

Figure 11-18 shows the functional block diagram of the mapping/demapping module.
Figure 11-18 Functional block diagram of the mapping/demapping module
Mapping/demapping module
E3/T3

LPA

LPT

PDH AIS
detector

E3/T3
LPA

LPOH (J1/C2/
B3) insertion
LPOH (J1/C2/
B3) extraction

LPT

HPA

HPT

STM-1

TU-AIS/TULOP detector

HPA

HPT

STM-1

LPA: low order path adaptation

LPT: low order path termination

HPA: high order path adaptation

HPT: high order path termination

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Interface Module
The interface module consists of LIUs and provides the inloop and outloop functions. The
interface module performs the following functions:
l

Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the P_LOS alarm.

Mapping/Demapping Module
l

LPA sub-module
The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted
so that the stream can be transported to the synchronous network.

LPT sub-module
The virtual container (VC-3) is formatted. The VC-3 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C-3 container and POH. The POH contains nine octets equally distributed within the frame
bytes for VC-3, namely, J1, B3, C2, G1, F2, H4, F3, K3, and N1.

HPA sub-module
The HPA sub-module generates and processes the channel-level TU-PTR. In the receive
direction, the signals are split into VC-3s, which are located and isolated in TU-3s. The
TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added with
the TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The
sequence is as follows: TU-3->TUG3->VC-4

HPT sub-module
The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST sub-module and RST sub-module


These sub-modules are required to create a proprietary STM1 signal so that the interface
converting module can be connected.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

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Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

11.4.5 Front Panel


The front panel of the PL3 has indicators.

Diagram of the Front Panel


Figure 11-19 shows the appearance of the front panel of the PL3.
Figure 11-19 Front panel of the PL3

PL3
STAT
ACT
PROG
SRV

PL3

Indicators
The front panel of the board has the following indicators:
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Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the PL3 does not have an interface.
The C34S provides E3/T3 interfaces for the PL3. For details, see the topic that describes the
C34S.

11.4.6 Jumpers and DIP Switches


The PL3 does not have any jumpers or DIP switches that are used for board settings.

11.4.7 Valid Slots


The PL3 must be used with the C34S. In addition, the PL3 must be installed in a valid slot in
the subrack. Otherwise, the PL3 cannot work normally.
The PL3 can be installed in slots 25 and 1316 in the main subrack.
The PL3 must be used with the C34S.
Table 11-17 lists the slots valid for the PL3 and the corresponding slots for the C34S in the main
subrack.
Table 11-17 Slots valid for the PL3 and the corresponding slots for the C34S in the main subrack
Slot Valid for the PL3

Corresponding Slot for the C34S

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

11.4.8 Feature Code


The IFSD1 does not have a feature code.

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11.4.9 Board Protection


The PL3 supports the 1:N TPS protection.

Protection Principle
The PL3 can be configured into two 1:N (N3) TPS protection groups when the PL3 works with
the C34S and TSB8/TSB4.
Figure 11-20 shows the TPS protection provided by the PL3.
Figure 11-20 TPS protection provided by the PL3 in the OptiX OSN 1500B subrack
Service signal

Service signal
Switching
control bus

Crossconnect and
timing board

Interface board N

Interface board

Working board N

Working board

Working board 1

Protection board

Interface board 1

Protection
switching board

Failed

Normal state
When each working board functions normally, the traffic signal is directly transmitted to
the corresponding working board through position 1 of the control switch on the interface
board.

Switching state
When a working board detects a failure and requires the switching operation, the control
switch of the corresponding interface board switches from position 1 to position 2. At the
same time, the control switch of the protection switching board switches to the
corresponding position so that the protection board can protect the failed working board.
NOTE

TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing board.
Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

Hardware Configuration
Table 11-18 shows the slot configuration for the 1:3 TPS protection of the PL3.
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Table 11-18 Slot configuration for the 1:3 TPS protection of the PL3
Working
Board

Protection Board

Slot Configuration

PL3 (E3)

PL3 (E3)/PD3 (E3)

PL3 (T3)

PL3 (T3)/PD3 (T3)

If the working board is the PL3, the PD3


can be the protection board. Figure 11-21
shows the slot configuration for the 1:3 TPS
protection of the PL3.

FAN

S
L
O
T
3
1

S
L
O
T
3
2

S
L
O
T
3
3

S
L
O
T
3
4

S
L
O
T
1
0

Working 1

Working 1

XCS

XCS

S
L
O
T
1
1

S
L
O
T
1
2

S
L
O
T
3
6

S
L
O
T
3
7

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8
Working 2

S
L
O
T
9

Working 2

S S S S
L L L L
O O O O
T T T T
5 6 7 8

S
L
O
T
3
5

FAN

Working 2

S
L
O
T
4

Protection 1

FAN

S S S
L L L
O O O
T T T
1 2 3

Working 1

S
L
O
T
3
0

AUX

S
L
O
T
2
9

GSCC

S
L
O
T
2
8

TSB8/TSB4

S
L
O
T
2
7

Protection 2

S
L
O
T
2
6

C34S

S
L
O
T
2
5

C34S

S
L
O
T
2
4

C34S

S
L
O
T
2
3

PIU

C34S

S
L
O
T
2
2

C34S

S
L
O
T
2
1

C34S

S
L
O
T
2
0

TSB8/TSB4

S
L
O
T
1
9

PIU

Figure 11-21 Slot configuration for the two 1:3 TPS protection groups of the PL3

Fiber routing area

In Figure 11-21, the board in slot 2 protects the boards in slots 3-5. The board in slot 16 protects
the boards in slots 13-15.
Table 11-19 lists the slots for the PL3, C34S, and TSB8/TSB4.

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Table 11-19 Slots for the PL3, C34S, and TSB8/TSB4


Board

Protection Group 1

Protection Group 2

PL3 (working board)

Slots 3, 4, and 5

Slots 13, 14, and 15

PL3 (protection board)

Slot 2

Slot 16

TSB8/TSB4

Slot 19

Slot 35

C34S

Slots 21, 23, and 25

Slots 29, 31, and 33

11.4.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the interface board and cable match the board. Ensure that the
impedance of the cable matches the impedance of the board.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the PDH interface.
l J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS and
the default value of the J2 to be received is Disabled.
l V5 byte: The setting of the V5 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the V5 byte is Asynchronous.
l Service load indication: When a service channel does not process its carried services, select
Non-Loaded. When the service channel processes its carried services, select Load.
For details, see 28.7 Checking Board Parameters.
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Step 3 Optional: Create the protection. For details, see Creating a TPS Protection Group for Boards.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
NOTE

Before you configure services, learn the type of protection subnet configured for the ring network. For the
method for querying the protection subnet, see 28.1 Querying the Protection Subnet.

Step 5 Set parameters on the U2000. For the parameters to be set, see 27.6 PDH Boards.
----End

Commissioning the Board


Step 1 Required: Test the connection between the cable and the service interface. For details, see
Testing Connection Between the Cables and the PDH Service Interfaces.
Step 2 Optional: Test the TPS of the electrical interface. For details, see Testing the TPS of the
Electrical Interfaces.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

11.4.11 Parameter Settings


You can set the parameters for the PL3 by using the U2000.
You can set the following parameters for the PL3 by using the U2000:
l

J1 byte

C2 byte

Tributary loopback

Service loading indication

Path service type

For the description of each parameter, see 27 Parameter Settings.


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11.4.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 11-20 lists the faults that occur on the PL3 frequently and the troubleshooting methods.
Table 11-20 Methods used to troubleshoot the faults that occur on the PL3 frequently
Fault
Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The cable or connector


becomes abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect operation is
performed.
l The types or settings of
the boards are
inconsistent.
Bit error

The equipment becomes


faulty.

See Troubleshooting Bit Errors.

Pointer
justification

l The clock configuration


is incorrect.

See Troubleshooting Pointer Justification.

l The precision of the


external clock source is
very low.
Protection
switching
failure

The TPS fails.

See Troubleshooting Protection Switching


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PL3, see Replacing a PDH Board.

11.4.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

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11.4.13.1 Alarms of N1PL3


A_LOC

B3_EXC

B3_SD

BD_STATUS

BDID_ERROR

C2_VCAIS

CHIP_FAIL

COMMUN_FAIL

FPGA_ABN

LOOP_ALM

LP_R_FIFO

LP_RDI

LP_REI

LP_SLM

LP_T_FIFO

LP_TIM

LP_UNEQ

NO_BD_SOFT

P_AIS

P_LOS

PLL_FAIL

POWER_ABNORMAL

SLAVE_WORKING

SPARE_PATH_ALM

SUBCARD_ABN

T_LOSEX

TEST_STATUS

TPS_ALM

TR_LOC

TU_AIS

TU_LOP

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

11.4.13.2 Alarms of N2PL3

Issue 03 (2013-02-20)

B3_EXC

B3_SD

BD_STATUS

BIP_EXC

BIP_SD

C2_VCAIS

CHIP_ABN

CHIP_FAIL

COMMUN_FAIL

CRC6_ERR_OVER

DOWN_E1_AIS

DOWN_T1_AIS

DS3_IDLE

CRC4_ERR_OVER

LFA

LMFA

LOOP_ALM

LP_RFI

LP_RDI

LP_REI

LP_TIM

LP_SLM

NO_BD_SOFT

P_AIS

LP_UNEQ

P_LOF

P_LOS

P_RAI

SUBCARD_ABN

POWER_ABNORMAL

SLAVE_WORKING

TEST_STATUS

T_LOSEX

TEMP_OVER

TU_AIS

TPS_ALM

TR_LOC

UP_T1AIS

TU_LOP

UP_E1_AIS

PATCH_NOT_CONFIRM

V5_VCAIS

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PATCH_ERR

SWDL_PKG_NOBDSOFT

P_FFM

WRG_BD_TYPE

11 PDH Boards

PATCHFILE_NOTEXIST

11.4.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

11.4.14.1 Performance Events of N1PL3


E3_LCV_SDH

E3_LES_SDH

E3_LSES_SDH

T3_LCV_SDH

T3_LES_SDH

T3_LSES_SDH

TUPJCHIGH

TUPJCLOW

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

11.4.14.2 Performance Events of N2PL3


CRC4_ERR

CRC6_ERR

E3_LCV_SDH

E3_LES_SDH

E3_LSES_SDH

LPBBE

LPES

LPFEBBE

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

T3_LCV_SDH

T3_LES_SDH

T3_LSES_SDH

TUPJCHIGH

TUPJCLOW

TUPJCNEW

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

VC3FECSES

LPCSES

LPFECSES

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11.4.15 Technical Specifications


The technical specifications of the PL3 include the parameters specified for electrical interfaces,
mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


The C34S provides electrical interfaces for the PL3. For the parameters specified for the
electrical interfaces, see Technical Specifications of the C34S.

Mechanical Specifications
The mechanical specifications of the PL3 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight of the N1PL3 (kg): 1.0

Weight of the N2PL3 (kg): 0.9

Power Consumption
The maximum power consumption of the N1PL3 at room temperature (25C) is 15 W.
The maximum power consumption of the N2PL3 at room temperature (25C) is 12 W.

11.5 PL3A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PL3A (3xE3/T3 service processing board with the interfaces on
the front panel). This topic also describes how to configure and commission the PL3A.

11.5.1 Version Description


The PL3A is available in two functional versions, namely, N1 and N2. The difference between
the two versions is with regard to whether they support the E13/M13 function. The N1PL3A is
discontinued.
Table 11-21 describes the versions of the PL3A.
Table 11-21 Versions of the PL3A
Item

Description

Functional versions

The PL3A is available in two functional versions, namely, N1 and


N2.

Differences

l Service processing: E13 function and M13 function.


l Maintenance features: PRBS test and CRC function.

Substitution

Issue 03 (2013-02-20)

The N2PL3A can replace the N1PL3A.

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11.5.2 Application
The PL3A is a PDH processing board. The PL3A can be used on the OptiX OSN equipment
series to add and drop PDH signals. To transmit/receive and process 3xE3/T3 signals, the PL3A
uses the interfaces on its front panel.
Figure 11-22 shows the application of the PDH processing boards. The PDH processing boards
add tributary signals to line signals and drops tributary signals to line signals.
Figure 11-22 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.5.3 Functions and Features


The PL3A processes E3/T3 signals, processes overhead bytes, reports alarms and performance
events, provides maintenance features, and supports the TPS protection.
Table 11-22 provides the functions and features of the PL3A.
Table 11-22 Functions and features of the PL3A
Function and
Feature

PL3A

Basic functions

Processes 3xE3/T3 signals.

Service processing

Transmits/Receives and processes 3xE3/T3 electrical signals.


The N2PL3A supports the E13 function, which is used to converge E1
services into E3 services.
The N2PL3A supports the M13 function, which is used to converge
T1 services into T3 services.

Overhead
processing
Issue 03 (2013-02-20)

Supports the setting and query of all the path overhead bytes at the
VC-3 level.
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Function and
Feature

PL3A

Alarms and
performance events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Maintenance
features

l Supports inloops and outloops at electrical interfaces.


l Supports warm resets and cold resets. The warm reset does not
affect services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l The N1PL3A supports the PRBS test in only the tributary direction.
l The N2PL3A:
Supports the PRBS test in the tributary direction and in the
cross-connect direction in the normal mode.
Does not support the PRBS test in the Server mode.
Support the PRBS test in the electrical interface direction in the
MUX mode.
l The N1PLS3A does not support the CRC function, but the N2PL3A
supports the CRC function.

11.5.4 Working Principle and Signal Flow


The PL3A consists of the interface module, mapping/demapping module, interface converting
module, logic and control module, and power module.
Figure 11-23 shows the functional block diagram of the PL3A.

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Figure 11-23 Functional block diagram of the PL3A


Backplane
155 MHz
PLL

34 MHz/45 MHz
OSC

E3/T3

3x34 Mbit/s
3x45 Mbit/s

LIU
PPI

E3/T3

LIU

2x155 Mbit/s

Mapping/
Demapping
3x34 Mbit/s
2x155 Mbit/s
module
3x45 Mbit/s

Reference
clock

High-speed
bus

Interface
converting
module High-speed
bus

Cross-connect
unit

Cross-connect
unit A
Cross-connect
unit B

Interface
module

LOS
Outloop/Inloop
control

Cross-connect
unit

Frame header
Communication

Logic and
control module
+3.3 V
Power
module

Power
module

SCC unit

Fuse

-48 V/-60 V
-48V/-60V

Fuse

+3.3 V backup power

LIU: logic interface unit

PPI: PDH physical interface

OSC: oscillator

Figure 11-24 shows the functional block diagram of the mapping/demapping module.
Figure 11-24 Functional block diagram of the mapping/demapping module
Mapping/demapping module
E3/T3

LPA

LPT

PDH AIS
detector

E3/T3
LPA

LPOH (J1/C2/
B3) insertion
LPOH (J1/C2/
B3) extraction

LPT

HPA

HPT

STM-1

TU-AIS/TULOP detector

HPA

HPT

STM-1

LPA: low order path adaptation

LPT: low order path termination

HPA: high order path adaptation

HPT: high order path termination

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Interface Module
The interface module consists of LIUs and provides the inloop and outloop functions. The
interface module performs the following functions:
l

Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the P_LOS alarm.

Mapping/Demapping Module
l

LPA sub-module
The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted
so that the stream can be transported to the synchronous network.

LPT sub-module
The virtual container (VC-3) is formatted. The VC-3 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C-3 container and POH. The POH contains nine octets equally distributed within the frame
bytes for VC-3, namely, J1, B3, C2, G1, F2, H4, F3, K3, and N1.

HPA sub-module
The HPA sub-module generates and processes the channel-level TU-PTR. In the receive
direction, the signals are split into VC-3s, which are located and isolated in TU-3s. The
TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added with
the TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The
sequence is as follows: TU-3->TUG3->VC-4

HPT sub-module
The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST sub-module and RST sub-module


These sub-modules are required to create a proprietary STM1 signal so that the interface
converting module can be connected.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

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Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

11.5.5 Front Panel


The front panel of the PL3A has indicators and interfaces.

Diagram of the Front Panel


Figure 11-25 shows the appearance of the front panel of the PL3A.
Figure 11-25 Front panel of the PL3A

PL3A
STAT
ACT
PROG
SRV

OUT1
IN1
OUT2
IN2
OUT3
IN3

PL3A

Indicators
The front panel of the board has the following indicators:
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Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

11 PDH Boards

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the PL3A has three pairs of 75-ohm unbalanced interfaces, which are of the
SMB type.

11.5.6 Jumpers and DIP Switches


The PL3A does not have any jumpers or DIP switches that are used for board settings.

11.5.7 Valid Slots


The PL3A must be installed in a valid slot in the subrack. Otherwise, the PL3A cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the PL3A vary with the cross-connect capacity of the subrack. The slots valid
for the PL3A are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the PL3A can be installed in slots 18 and
1117 in the main subrack.

11.5.8 Feature Code


The IFSD1 does not have a feature code.

11.5.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
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Step 2 Required: Check whether the interface board and cable match the board. Ensure that the
impedance of the cable matches the impedance of the board.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the PDH interface.
l J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS and
the default value of the J2 to be received is Disabled.
l V5 byte: The setting of the V5 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the V5 byte is Asynchronous.
l Service load indication: When a service channel does not process its carried services, select
Non-Loaded. When the service channel processes its carried services, select Load.
For details, see 28.7 Checking Board Parameters.
Step 3 Optional: Create the protection. For details, see Creating a TPS Protection Group for Boards.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
NOTE

Before you configure services, learn the type of protection subnet configured for the ring network. For the
method for querying the protection subnet, see 28.1 Querying the Protection Subnet.

Step 5 Set parameters on the U2000. For the parameters to be set, see 27.6 PDH Boards.
----End

Commissioning the Board


Step 1 Required: Test the connection between the cable and the service interface. For details, see
Testing Connection Between the Cables and the PDH Service Interfaces.
Step 2 Optional: Test the TPS of the electrical interface. For details, see Testing the TPS of the
Electrical Interfaces.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
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normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

11.5.10 Parameter Settings


You can set the parameters for the PL3A by using the U2000.
You can set the following parameters for the PL3A by using the U2000:
l

J1 byte

C2 byte

Tributary loopback

Service loading indication

Path service type

For the description of each parameter, see 27 Parameter Settings.

11.5.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 11-23 lists the faults that occur on the PL3A frequently and the troubleshooting methods.
Table 11-23 Methods used to troubleshoot the faults that occur on the PL3A frequently
Fault
Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The cable or connector


becomes abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect operation is
performed.
l The types or settings of
the boards are
inconsistent.
Bit error

Issue 03 (2013-02-20)

The equipment becomes


faulty.

See Troubleshooting Bit Errors.

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Fault
Symptom

Common Fault Cause

Troubleshooting Method

Pointer
justification

l The clock configuration


is incorrect.

See Troubleshooting Pointer Justification.

l The precision of the


external clock source is
very low.
Protection
switching
failure

The TPS fails.

See Troubleshooting Protection Switching


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PL3A, see Replacing a PDH Board.

11.5.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

11.5.12.1 Alarms of N1PL3A


A_LOC

B3_EXC

B3_SD

BD_STATUS

BDID_ERROR

C2_VCAIS

CHIP_FAIL

COMMUN_FAIL

FPGA_ABN

LOOP_ALM

LP_R_FIFO

LP_RDI

LP_REI

LP_SLM

LP_T_FIFO

LP_TIM

LP_UNEQ

NO_BD_SOFT

P_AIS

P_LOS

PLL_FAIL

POWER_ABNORMAL

SLAVE_WORKING

T_LOSEX

TEST_STATUS

TR_LOC

TU_AIS

TU_LOP

W_R_FAIL

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

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11.5.12.2 Alarms of N2PL3A


BD_STATUS

B3_EXC

B3_SD

BIP_SD

C2_VCAIS

BIP_EXC

CHIP_FAIL

COMMUN_FAIL

CHIP_ABN

CRC6_ERR_OVER

DOWN_E1_AIS

CRC4_ERR_OVER

DS3_IDLE

LOOP_ALM

DOWN_T1_AIS

LMFA

LP_REI

LFA

LP_RDI

NO_BD_SOFT

LP_RFI

LP_SLM

P_LOF

LP_TIM

LP_UNEQ

P_AIS

P_FFM

P_RAI

TPS_ALM

UP_E1_AIS

SLAVE_WORKING

SUBCARD_ABN

P_LOS

TEMP_OVER

TEST_STATUS

POWER_ABNORMAL

TU_AIS

TU_LOP

T_LOSEX

V5_VCAIS

PATCH_ERR

TR_LOC

PATCHFILE_NOTEXIST

SWDL_PKG_NOBDSOFT

UP_T1AIS

PATCH_NOT_CONFIRM

WRG_BD_TYPE

11.5.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

11.5.13.1 Performance Events of N1PL3A


E3_LCV_SDH

E3_LES_SDH

E3_LSES_SDH

T3_LCV_SDH

T3_LES_SDH

T3_LSES_SDH

TUPJCHIGH

TUPJCLOW

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

TUPJCNEW

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11.5.13.2 Performance Events of N2PL3A


CRC4_ERR

CRC6_ERR

E3_LCV_SDH

E3_LES_SDH

E3_LSES_SDH

LPBBE

LPES

LPFEBBE

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

T3_LCV_SDH

T3_LES_SDH

T3_LSES_SDH

TUPJCHIGH

TUPJCLOW

TUPJCNEW

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

VC3FECSES

LPCSES

LPFECSES

11.5.14 Technical Specifications


The technical specifications of the PL3A include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


Table 11-24 lists the parameters specified for the electrical interfaces of the PL3A.
Table 11-24 Parameters specified for the electrical interfaces of the PL3A
Nominal bit rate

34368 kbit/s

44736 kbit/s

Line code pattern

HDB3

B3ZS

Waveform at the output


interface

Complies with ITU-T G.703.

Signal bit rate at the output


interface
Allowed attenuation at the input
interface

Issue 03 (2013-02-20)

Allowed frequency deviation at


the input interface

Complies with ITU-T G.823.

Input jitter tolerance

Complies with ITU-T G.


823.

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Nominal bit rate

34368 kbit/s

44736 kbit/s

Anti-interference capability at
the input interface

Complies with ITU-T G.


703.

Reflection attenuation at the


input/output interface
Output jitter

Complies with ITU-T G.823 and G.824.

Mapping jitter

Complies with ITU-T G.783.

Combined jitter
Jitter transfer function

Complies with ITU-T G.


751.

Mechanical Specifications
The mechanical specifications of the PL3A are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight of the N1PL3A (kg): 1.0

Weight of the N2PL3A (kg): 0.9

Power Consumption
The maximum power consumption of the N1PL3A at room temperature (25C) is 15 W.
The maximum power consumption of the N2PL3A at room temperature (25C) is 12 W.

11.6 PD3
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PD3 (6xE3/T3 service processing board).

11.6.1 Version Description


The PD3 is available in two functional versions, namely, N1 and N2. The difference between
the two versions is with regard to whether they support the E13/M13 function. The N1PD3 is
no longer manufactured.
Table 11-25 describes the versions of the PD3.
Table 11-25 Versions of the PD3

Issue 03 (2013-02-20)

Item

Description

Functional
versions

The PD3 is available in two functional versions, namely, N1 and N2.

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Item

Description

Differences

l Service processing: E13 function and M13 function.


l Maintenance features: CRC function, PRBS test.

Substitution

The N2PD3 can replace the N1PD3.

11.6.2 Application
The PD3 is a PDH processing board. The PD3 can be used on the OptiX OSN equipment series
to add and drop PDH signals. To transmit/receive and process 6xE3/T3 signals, the PD3 must
be used with the interface board.
Figure 11-26 shows the application of the PDH processing boards. The PDH processing boards
add tributary signals to line signals and drops tributary signals to line signals.
Figure 11-26 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.6.3 Functions and Features


The PD3 processes E3/T3 signals, processes overhead bytes, reports alarms and performance
events, provides maintenance features, and supports the TPS protection.
Table 11-26 provides the functions and features of the PD3.

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Table 11-26 Functions and features of the PD3


Function
and Feature

PD3

Basic
functions

Processes 6xE3/T3 signals.

Service
processing

l Transmits/Receives and processes 6xE3/T3 electrical signals.


l The N2PD3 supports the E13 function, which is used to converge E1
services into E3 services.
l The N2PD3 supports the M13 function, which is used to converge T1
services into T3 services.

Overhead
processing

Supports the setting and query of all the path overhead bytes at the VC-3
level.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Maintenance
features

l Supports inloops and outloops at electrical interfaces.


l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l The N1PD3 supports the PRBS test in only the tributary direction.
l The N2PD3:
Supports the PRBS test in the tributary direction and in the crossconnect direction in the normal mode.
Does not support the PRBS test in the MUX mode or Server mode.
l The N1PD3 does not support the CRC function, but the N2PD3 supports
the CRC function.

Protection
schemes

Supports the TPS protection when working with the interface board and the
switching and bridging board.

11.6.4 Working Principle and Signal Flow


The PD3 consists of the PPI module, E3/T3 mapping/demapping module, interface converting
module, logic and control module, DC/DC converter, and other modules.
Figure 11-27 shows the functional block diagram of the PD3.

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Figure 11-27 Functional block diagram of the PD3


34 MHz/
45 MHz
OSC

E3/T3
E3/T3

LIU

LIU

P
I

155 MHz
PLL

6x34 Mbit/s/
6x45 Mbit/s

2x155 Mbit/s
E3/T3
Interface
mapping/
converting
6x34 Mbit/s/
demapping
module
2x155 Mbit/s
6x45 Mbit/s
module

LOS
Outloop/Inloop
control

Cross-connect unit

Highspeed bus

Cross-connect unit A

Highspeed bus

Cross-connect unit B

Frame header
Communication

Logic and
control module
+3.3 V
DC/DC
converter

OSC: Oscillator

Reference
clock

DC/DC
converter

Cross-connect unit
SCC Unit

Fuse

-48 V/-60 V
-48 V/-60 V

Fuse

+3.3 V backup power

PPI: PDH physical interface

Figure 11-28 shows the functional block diagram of the E3/T3 mapping/demapping module.
Figure 11-28 Functional block diagram of the E3/T3 mapping/demapping module
Mapping/demapping module
E3/T3

LPA

HPA

LPT

PDH AIS
detector

E3/T3
LPA

LPOH (J1/C2/
B3) insertion
LPOH (J1/C2/
B3) extraction

HPT

STM-1

TU-AIS/TULOP detector

HPA

LPT

HPT

STM-1

LPA: Low order path adaptation

LPT: Low order path termination

HPA: High order path adaptation

HPT: High order path termination

The functional modules are described as follows:


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PPI Module
The PPI module consists of LIUs and provides the inloop and outloop functions. The PPI module
performs the following functions:
l

Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the P_LOS alarm.

E3/T3 Mapping/Demapping Module


l

LPA sub-module

The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted


so that the stream can be transported to the synchronous network.

LPT sub-module

The virtual container (VC-3) is formatted. The VC-3 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
VC-3 container and POH. The POH contains nine octets equally distributed within the
frame bytes for VC-3, namely, J1, B3, C2, G1, F2, H4, F3, K3, and N1.

HPA sub-module

The HPA sub-module generates and processes the channel-level TU-PTR. In the receive
direction, the signals are split into VC-3s, which are located and isolated in TU-3s. The
TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added with
the TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The
sequence is as follows: TU-3->TUG3->VC-4

HPT sub-module

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST sub-module and RST sub-module

These sub-modules are required to create a proprietary STM1 signal so that the interface
converting module can be connected.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

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DC/DC Converter
It converts the 48/60 V power supply into the DC voltages that the modules of the board
require.

11.6.5 Front Panel


The front panel of the PD3 has indicators.

Diagram of the Front Panel


Figure 11-29 shows the appearance of the front panel of the PD3.
Figure 11-29 Front panel of the PD3

PD3
STAT
ACT
PROG
SRV

PD3

Indicators
The front panel of the board has the following indicators:
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Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the PD3 does not have an interface.
The D34S provides E3/T3 interfaces for the PD3. For details, see the topic that describes the
D34S.

11.6.6 Valid Slots


The PD3 must be used with the D34S.
The PD3 can be installed in slots 25 and 1316 in the main subrack.
Table 11-27 lists the slots valid for the PD3 and the corresponding slots for the D34S in the
main subrack.
Table 11-27 Slots valid for the PD3 and the corresponding slots for the D34S in the main subrack
Slot Valid for the PD3

Corresponding Slot for the D34S

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

11.6.7 Board Protection


The PD3 supports the 1:N TPS protection.

Protection Principle
The PD3 can be configured into two 1:N (N3) TPS protection groups when the PD3 works
with the D34S and TSB8. Figure 11-30 shows the TPS protection provided by the PD3.
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Figure 11-30 TPS protection provided by the PD3


6xE3/T3

TSB8

6xE3/T3

D34S

6xE3/T3

Sw itching
control
D34S
signal

D34S

Crossconnect
and timing
board
Slot 9/10
Protection
PD3

Working
PD3

Working
PD3

Working
PD3

Failed
Slot 2

Slot 3

Slot 4

Slot 5

Normal state
When each working board functions normally, the traffic signal is directly transmitted to
the PD3 through position 1 of the control switch on the D34S.

Switching state
When a working board detects a failure and requires the switching operation, the control
switch of the corresponding D34S switches from position 1 to position 2. At the same time,
the control switch of the TSB8 switches to the corresponding position so that the protection
board can protect the failed working board.
NOTE

TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing board.
Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

Hardware Configuration
Table 11-28 shows the slot configuration for the 1:3 TPS protection of the PD3.
Table 11-28 Slot configuration for the 1:3 TPS protection of the PD3

Issue 03 (2013-02-20)

Working
Board

Protection Board

Slot Configuration

PD3 (E3)

PD3 (E3)

PD3 (T3)

PD3 (T3)

Figure 11-31 shows the slot configuration for


the 1:3 TPS protection of the PD3.

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FAN

S
L
O
T
3
1

S
L
O
T
3
2

S
L
O
T
3
3

S
L
O
T
3
4

S
L
O
T
3
5

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8
Working 2

Working 1

S
L
O
T
1
1

Working 2

Working 1

S
L
O
T
1
0

S
L
O
T
3
7

FAN

Working 2

Protection 1

S
L
O
T
9

XCS

S S S S
L L L L
O O O O
T T T T
5 6 7 8

XCS

S
L
O
T
4

S
L
O
T
3
6

AUX

S
L
O
T
3
0

FAN

S S S
L L L
O O O
T T T
1 2 3

Working 1

S
L
O
T
2
9

GSCC

S
L
O
T
2
8

TSB8

S
L
O
T
2
7

Protection 2

S
L
O
T
2
6

D34S

S
L
O
T
2
5

D34S

S
L
O
T
2
4

D34S

S
L
O
T
2
3

PIU

D34S

S
L
O
T
2
2

D34S

S
L
O
T
2
1

D34S

S
L
O
T
2
0

TSB8

S
L
O
T
1
9

PIU

Figure 11-31 Slot configuration for the 1:3 TPS protection of the PD3

Fiber routing area

In Figure 11-31, the board in slot 2 protects the boards in slots 3-5. The board in slot 16 protects
the boards in slots 13-15.
Table 11-29 lists the slots for the PD3, D34S, and TSB8.
Table 11-29 Slots for the PD3, D34S, and TSB8

Issue 03 (2013-02-20)

Board

Protection Group 1

Protection Group 2

PD3 (working board)

Slots 3-5

Slots 13-15

PD3 (protection board)

Slot 2

Slot 16

TSB8

Slot 19

Slot 35

D34S

Slots 21, 23, and 25

Slots 29, 31, and 33

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11.6.8 Parameter Settings


You can set the parameters for the PD3 by using the U2000.
You can set the following parameters for the PD3 by using the U2000:
l

J1 byte

C2 byte

Tributary loopback

Service loading indication

Path service type

For the description of each parameter, see 27 Parameter Settings.

11.6.9 Technical Specifications


The technical specifications of the PD3 include the parameters specified for electrical interfaces,
mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


The C34S provides electrical interfaces for the PD3. For the parameters specified for the
electrical interfaces, see Technical Specifications of the D34S.

Mechanical Specifications
The mechanical specifications of the PD3 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.1

Power Consumption
The maximum power consumption of the N1PD3 at room temperature (25C) is 19 W.
The maximum power consumption of the N2PD3 at room temperature (25C) is 12 W.

11.7 PQ3
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PQ3 (12xE3/T3 service processing board).

11.7.1 Version Description


The PQ3 is available in one functional version, namely, N2.

11.7.2 Application
The PQ3 is a PDH processing board. The PQ3 can be used on the OptiX OSN equipment series
to add and drop PDH signals. To transmit/receive and process 12xE3/T3 signals, the PQ3 must
be used with the interface board.
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Figure 11-32 shows the application of the PDH processing boards. The PDH processing boards
add tributary signals to line signals and drops tributary signals to line signals.
Figure 11-32 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.7.3 Functions and Features


The PQ3 processes E3/T3 signals, processes overhead bytes, reports alarms and performance
events, provides maintenance features, and supports the TPS protection.
Table 11-30 provides the functions and features of the PQ3.
Table 11-30 Functions and features of the PQ3
Function and
Feature

PQ3

Basic functions

Processes 12xE3/T3 signals.

Service
processing

l Transmits/Receives and processes 12xE3/T3 electrical signals.


l Supports the E13 function, which is used to converge E1 services into
E3 services.
l Supports the M13 function, which is used to converge T1 services into
T3 services.

Issue 03 (2013-02-20)

Overhead
processing

Supports the setting and query of all the path overhead bytes at the VC-3
level.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

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Function and
Feature

PQ3

Maintenance
features

l Supports inloops and outloops at electrical interfaces.

11 PDH Boards

l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l PRBS function:
Supports the PRBS test in the tributary direction and in the crossconnect direction in the normal mode.
Does not support the PRBS test in the Server mode.
Support the PRBS test in the electrical interface direction in the
MUX mode.
l Supports the CRC function.

Protection
schemes

Supports the TPS protection when working with the interface board and the
switching and bridging board.

11.7.4 Working Principle and Signal Flow


The PQ3 consists of the PPI module, E3/T3 mapping/demapping module, interface converting
module, logic and control module, DC/DC converter, and other modules.
Figure 11-33 shows the functional block diagram of the PQ3.

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Figure 11-33 Functional block diagram of the PQ3


34 MHz/
45 MHz
OSC

E3/T3
E3/T3

LIU

LIU

P
I

155 MHz
PLL

12x34 Mbit/s/
12x45 Mbit/s

2x155 Mbit/s
E3/T3
Interface
mapping/
converting
12x34 Mbit/s/
demapping
module
2x155 Mbit/s
12x45 Mbit/s
module

LOS
Outloop/Inloop
control

Cross-connect unit

Highspeed bus

Cross-connect unit A

Highspeed bus

Cross-connect unit B

Frame header
Communication

Logic and
control module
+3.3 V
DC/DC
converter

OSC: Oscillator

Reference
clock

DC/DC
converter

Cross-connect unit
SCC Unit

Fuse

-48 V/-60 V
-48 V/-60 V

Fuse

+3.3 V backup power

PPI: PDH physical interface

Figure 11-34 shows the functional block diagram of the E3/T3 mapping/demapping module.
Figure 11-34 Functional block diagram of the E3/T3 mapping/demapping module
Mapping/demapping module
E3/T3

LPA

HPA

LPT

PDH AIS
detector

E3/T3
LPA

LPOH (J1/C2/
B3) insertion
LPOH (J1/C2/
B3) extraction

HPT

STM-1

TU-AIS/TULOP detector

HPA

LPT

HPT

STM-1

LPA: Low order path adaptation

LPT: Low order path termination

HPA: High order path adaptation

HPT: High order path termination

The functional modules are described as follows:

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PPI Module
The PPI module consists of LIUs and provides the inloop and outloop functions. The PPI module
performs the following functions:
l

Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the P_LOS alarm.

E3/T3 Mapping/Demapping Module


l

LPA sub-module

The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted


so that the stream can be transported to the synchronous network.

LPT sub-module

The virtual container (VC-3) is formatted. The VC-3 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
VC-3 container and POH. The POH contains nine octets equally distributed within the
frame bytes for VC-3, namely, J1, B3, C2, G1, F2, H4, F3, K3, and N1.

HPA sub-module

The HPA sub-module generates and processes the channel-level TU-PTR. In the receive
direction, the signals are split into VC-3s, which are located and isolated in TU-3s. The
TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added with
the TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The
sequence is as follows: TU-3->TUG3->VC-4

HPT sub-module

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST sub-module and RST sub-module

These sub-modules are required to create a proprietary STM1 signal so that the interface
converting module can be connected.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


l

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

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DC/DC Converter
It converts the 48/60 V power supply into the DC voltages that the modules of the board
require.

11.7.5 Front Panel


The front panel of the PQ3 has indicators.

Diagram of the Front Panel


Figure 11-35 shows the appearance of the front panel of the PQ3.
Figure 11-35 Front panel of the PQ3

PQ3
STAT
ACT
PROG
SRV

PQ3

Indicators
The front panel of the board has the following indicators:
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Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the PQ3 does not have an interface.
The D34S provides E3/T3 interfaces for the PQ3. For details, see the topic that describes the
D34S.

11.7.6 Valid Slots


The PQ3 can be installed in slots 25 and 1316, and must be used with the D34S.
Table 11-31 lists the slots valid for the PQ3 and the corresponding slots for the D34S.
Table 11-31 Slots valid for the PQ3 and the corresponding slots for the D34S
Slot Valid for the PQ3

Corresponding Slot for the D34S

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

11.7.7 Board Protection


The PQ3 supports the 1:N TPS protection.

Protection Principle
The PQ3 boards can be configured into two 1:N (N3) TPS protection groups when the PQ3
boards work with two D34S boards and two TSB8 boards. Figure 11-36 shows the TPS
protection provided by the PQ3.

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Figure 11-36 TPS protection provided by the PQ3


12xE3/T3 12xE3/T3 12xE3/T3 12xE3/T3 12xE3/T3 12xE3/T3

TSB8

TSB8

3 2

D34S

D34S

D34S

D34S

Sw itching
control
D34S signal

D34S

Crossconnect
and timing
board
Slot 9/10

Protection

Working

PQ3

PQ3

Slot 2

Slot 3

Working
PQ3
Failed
Slot 4

Working
PQ3

Slot 5

Normal state
When each working board functions normally, the traffic signal is directly transmitted to
the PQ3 through position 1 of the control switch on the D34S.

Switching state
When a working board detects a failure and requires the switching operation, the control
switch of the corresponding D34S switches from position 1 to position 2. At the same time,
the control switch of the TSB8 switches to the corresponding position so that the protection
board can protect the failed working board.
NOTE

TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing board.
Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

Hardware Configuration
NOTE

When you configure the N2PQ3 as the TPS protection board, two TSB8 boards are required.

Table 11-32 shows the slot configuration for the 1:3 TPS protection of the PQ3.
Table 11-32 Slot configuration for the 1:3 TPS protection of the PQ3

Issue 03 (2013-02-20)

Working
Board

Protection Board

Slot Configuration

PQ3 (E3)

PQ3 (E3)

PQ3 (T3)

PQ3 (T3)

Figure 11-37 shows the slot configuration for


the 1:3 TPS protection of the PQ3.

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D34S
D34S
D34S
D34S
D34S

D34S

PIU

PIU

S
L
O
T
3
5

S
L
O
T
3
6

S
L
O
T
3
7

S
L
O
T
3
2

S
L
O
T
3
3

S
L
O
T
3
4

S
L
O
T
1
0

XCS

XCS

S
L
O
T
1
1

S
L
O
T
1
2

S
L
O
T
1
3

S S S S S
L L L L L
O O O O O
T T T T T
1 1 1 1 1
4 5 6 7 8
Working 2

S
L
O
T
9

FAN

Working 2

S S S S
L L L L
O O O O
T T T T
5 6 7 8

Working 1

Working 1

Working 1

S
L
O
T
3
1

AUX

TSB8
Protection 1

S
L
O
T
3
0

FAN

FAN

S S S S
L L L L
O O O O
T T T T
1 2 3 4

S
L
O
T
2
9

GSCC

S
L
O
T
2
8

TSB8

S
L
O
T
2
7

S
L
O
T
2
4

Protection 2

S
L
O
T
2
6

S
L
O
T
2
3

Working 2

S
L
O
T
2
5

S
L
O
T
2
2

D34S
D34S
D34S
D34S
TSB8

S
L
O
T
2
1

D34S

S
L
O
T
2
0

D34S

S
L
O
T
1
9

TSB8

Figure 11-37 Slot configuration for the two 1:3 TPS protection groups of the PQ3

Fiber routing area

In Figure 11-37, the board in slot 2 protects the boards in slots 3-5. The board in slot 16 protects
the boards in slots 13-15.
Table 11-33 lists the slots for the PQ3, D34S, and TSB8.
Table 11-33 Slots for the PQ3, D34S, and TSB8
Board

Protection Group 1

Protection Group 2

PQ3 (working board)

Slots 3-5

Slots 13-15

PQ3 (protection board)

Slot 2

Slot 16

TSB8

Slots 19 and 20

Slots 35 and 36

D34S

Slots 21-26

Slots 29-34

11.7.8 Parameter Settings


You can set the parameters for the PQ3 by using the U2000.
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You can set the following parameters for the PQ3 by using the U2000:
l

J1 byte

C2 byte

Tributary loopback

Service loading indication

Path service type

For the description of each parameter, see 27 Parameter Settings.

11.7.9 Technical Specifications


The technical specifications of the PQ3 include the parameters specified for electrical interfaces,
mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


The D34S provides electrical interfaces for the PQ3. For the parameters specified for the
electrical interfaces, see Technical Specifications of the D34S.

Mechanical Specifications
The mechanical specifications of the PQ3 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.9

Power Consumption
The maximum power consumption of the PQ3 at room temperature (25C) is 13 W.

11.8 DX1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the DX1 (DDN service accessing and converging board). This topic
also describes how to configure and commission the DX1.

11.8.1 Version Description


The DX1 is available in one functional version, namely, N1.

11.8.2 Application
The DX1 is a DDN service processing board. The DX1 can be used on the OptiX OSN equipment
series to add and converge the DDN services. To receive eight channels of Nx64 kbit/s signals
and eight channels of framed E1 services and to cross-connect the 48 channels of Nx64 kbit/s
signals on the system side, the DX1 must be used with the interface board.
Figure 11-38 shows the application of the DDN service processing boards. The DDN service
processing boards add DDN service signals to line signals and drops line signals to DDN service
signals.
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Figure 11-38 Networking and application of the DDN service processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.8.3 Functions and Features


The DX1 cross-connects 48xE1 signals at the 64 kbit/s level on the system side.
Table 11-34 provides the functions and features of the DX1.
Table 11-34 Functions and features of the DX1
Function
and
Feature

DX1

Basic
functions

l Processes eight channels of Nx64 kbit/s services and eight channels of


framed E1 services.
l Cross-connects 48 channels of Nx64 kbit/s signals on the system side.

Service
processing

l Transmits/Receives eight channels of Nx64 kbit/s and eight channels of


framed E1 services and realizes the 1:N TPS protection when working with
the DM12.
l One DX1 board needs to work with two DM12 boards.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Maintenance
features

l Supports inloops and outloops at electrical interfaces.


l Supports the PRBS test in the cross-connect direction and in the electrical
interface direction.
l Supports the CRC function.

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Function
and
Feature

DX1

Connectors

The DB28 connectors and DB44 connectors are present on the front panel of
the DM12. The DB28 connector is used for the Nx64 kbit/s signals, and the
DB44 connector is used for the framed E1 signals.

Protection
schemes

Supports the TPS protection when working with the interface board.

11.8.4 Working Principle and Signal Flow


The DX1 consists of the interface and frame processing module, encoding/decoding module,
timeslot cross-connect module, framing/deframing module, mapping/demapping module, logic
and control module, and power module.
Figure 11-39 shows the functional block diagram of the DX1.
Figure 11-39 Functional block diagram of the DX1
Backplane
DM12
8xFrame E1

Framed E1
interface
module

4xNx64 kbit/s

Nx64 kbit/s
interface
module
Power
DM12

4xNx64 kbit/s

Nx64 kbit/s
interface
module

Backplane

DX1 Framed E1
encoding/
decoding and
frame processing
module
Nx64 kbit/s
interface
and frame
processing
module

64 kbit/s
timeslot
cross-connect
module

Framing/
Deframing
module

Logic and
control module

Power
Framed E1
interface
module

+3.3 V
Power
module

Power
module

Mapping/
Demapping
module for
48 channels
of signals

Cross-connect
unit

SCC unit

Fuse

-48 V/-60 V
-48 V/-60 V

Fuse

+3.3 V backup power

In the Transmit Direction


The mapping/demapping module demaps the VC-4 signals sent from the SDH cross-connect
unit and sends the demapped signals to the framing/deframing module. Then, the framing/
deframing module converts the signals into the framed E1 signals and sends the framed E1
signals to the timeslot cross-connect module. Finally, the timeslot cross-connect module crossconnects and grooms the signals at the 64 kbit/s granularity, and transmits the signals that need
to be dropped on the local NE to the interface module.

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In the Receive Direction


The DX1 transmits/receives eight channels of framed E1 signals from the framed E1 interface
module of the DM12 and eight channels of Nx64 kbit/s signals from the Nx64 kbit/s interface
module of the DM12. In addition, the DX1 restores the data signal and clock signal.
In the case of the framed E1 signals, the DX1 decodes the signals and processes the frames. In
the case of the Nx64 kbit/s signals, the DX1 converts the signals and processes the frames. Then,
the DX1 transmits the signals to the 64 kbit/s timeslot cross-connect module. The timeslot crossconnect module cross-connects and grooms the signals at the 64 kbit/s granularity, and transmits
the signals to the framing/deframing module. Finally, the framing/deframing module maps the
signals into VC-4s and transmits the signals to the SDH cross-connect unit.

Logic and Control Module


The logic and control module performs the board communication, board control, and service
configuration functions. In addition, the logic and control module traces and selects the clock
signals and frame header signals sent from the active and standby cross-connect boards.

Power Module
The power module provides all the modules of the DX1 with the required DC voltages.

11.8.5 Front Panel


The front panel of the DX1 has indicators.

Diagram of the Front Panel


Figure 11-40 shows the appearance of the front panel of the DX1.

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Figure 11-40 Front panel of the DX1

DX1
STAT
ACT
PROG
SRV

DX1

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the DX1 does not have an interface.
One DX1 board needs to work with two DM12 boards to receive and transmit the framed E1
signals and Nx64 kbit/s signals. For details, see the topic that describes the DM12.

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11.8.6 Jumpers and DIP Switches


The DX1 does not have any jumpers or DIP switches that are used for board settings.

11.8.7 Valid Slots


The DX1 must be used with the DM12. In addition, the DX1 must be installed in a valid slot in
the subrack. Otherwise, the DX1 cannot work normally.
The DX1 can be installed in slots 15 and 1316.
Table 11-35 lists the slots valid for the DX1 and the corresponding slots for the DM12.
Table 11-35 Slots valid for the DX1 and the corresponding slots for the DM12
Slot Valid for the DX1

Corresponding Slot for the DM12

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

NOTE

l Slot 1 can house a protection board for the TPS protection. The board in slot 1 protects the boards in
slots 25 and 1316.
l One DX1 needs to work with two DM12 boards to transmit/receive eight channels of Nx64 kbit/s
signals. The DM12 in the slot with a smaller slot number is used to transmit/receive eight channels of
framed E1 signals and four channels of Nx64 kbit/s signals. The DM12 in the slot with a larger slot
number is used to transmit/receive four channels of Nx64 kbit/s signals.

11.8.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the DX1 indicates the type of interface impedance.
Table 11-36 provides the relationship between the feature code of the DX1 and the type of
interface impedance.

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Table 11-36 Relationship between the feature code of the DX1 and the type of interface
impedance
Board

Feature Code

Type of Interface Impedance

SSN1DX1A01

A01

75-ohm

SSN1DX1B01

B01

120-ohm

11.8.9 Board Protection


The DX1 supports the 1:N TPS protection.

Protection Principle
The DX1 can be configured into one 1:N (N8) TPS protection group when the DX1 works with
the DM12.
Figure 11-41 shows the TPS protection provided by the DX1.
Figure 11-41 TPS protection provided by the DX1
Service signal

Service signal
Switching
control bus

Interface board

Protection bus
Protection bus

Crossconnect and
timing board

Interface board

Interface board

Interface board

Interface board

Interface board

Working board N

Working board

Working board 1

Protection board

Failed

When the cross-connect and timing board detects that a working DX1 is faulty, the cross-connect
and timing board issues a service switching command to control the interface board to switch
the services from the faulty board to the protection board, which realizes the protection of the
services.

Hardware Configuration
Figure 11-42 shows the slot configuration for the 1:8 TPS protection of the DX1.
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DM12

DM12

PIU

PIU

S
L
O
T
3
4

S
L
O
T
3
5

S
L
O
T
3
6

S
L
O
T
3
3

Working

S
L
O
T
1
1

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8
Working

Working

S
L
O
T
1
0

Working

Protection

S
L
O
T
9

S
L
O
T
3
7

FAN

Working

S S S S
L L L L
O O O O
T T T T
5 6 7 8

XCS

S
L
O
T
4

XCS

S S S
L L L
O O O
T T T
1 2 3

Working

S
L
O
T
3
2

AUX

DM12
DM12
DM12
DM12
DM12

S
L
O
T
3
1

S
L
O
T
2
9

FAN

FAN

Working

S
L
O
T
3
0

DM12

S
L
O
T
2
8

GSCC

S
L
O
T
2
7

DM12

S
L
O
T
2
6

S
L
O
T
2
3

Working

S
L
O
T
2
5

S
L
O
T
2
2

DM12
DM12
DM12

S
L
O
T
2
4

S
L
O
T
2
1

DM12

S
L
O
T
2
0

DM12
DM12

S
L
O
T
1
9

DM12

Figure 11-42 Slot configuration for the 1:8 TPS protection of the DX1

Fiber routing area

In Figure 11-42, the board in slot 1 protects the boards in slots 25 and 1316.
Table 11-37 lists the slots for the DX1 and DM12.
Table 11-37 Slots for the DX1 and DM12

Issue 03 (2013-02-20)

Board

Protection Group

DX1 (working board)

Slots 25 and 1316

DX1 (protection board)

Slot 1

DM12

Slots 1926 and 2936

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11.8.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the interface board and cable match the board. Ensure that the
impedance of the cable matches the impedance of the board.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the PDH interface.
l J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS and
the default value of the J2 to be received is Disabled.
l V5 byte: The setting of the V5 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the V5 byte is Asynchronous.
l Service load indication: When a service channel does not process its carried services, select
Non-Loaded. When the service channel processes its carried services, select Load.
For details, see 28.7 Checking Board Parameters.
Step 3 Optional: Create the protection. For details, see Creating a TPS Protection Group for Boards.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
NOTE

Before you configure services, learn the type of protection subnet configured for the ring network. For the
method for querying the protection subnet, see 28.1 Querying the Protection Subnet.

Step 5 Set parameters on the U2000. For the parameters to be set, see 27.6 PDH Boards.
----End
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Commissioning the Board


Step 1 Required: Test the connection between the cable and the service interface. For details, see
Testing Connection Between the Cables and the PDH Service Interfaces.
Step 2 Optional: Test the TPS of the electrical interface. For details, see Testing the TPS of the
Electrical Interfaces.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

11.8.11 Parameter Settings


You can set the parameters for the DX1 by using the U2000.
You can set the following parameters for the DX1 by using the U2000:
l

J2 byte

Tributary loopback

Service loading indication

Protocol mode of serial ports

DDN clock source management

For the description of each parameter, see 27 Parameter Settings.

11.8.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 11-38 lists the faults that occur on the DX1 frequently and the troubleshooting methods.

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Table 11-38 Methods used to troubleshoot the faults that occur on the DX1 frequently
Fault
Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The cable or connector


becomes abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect operation is
performed.
l The types or settings of
the boards are
inconsistent.
Bit error

The equipment becomes


faulty.

See Troubleshooting Bit Errors.

Pointer
justification

l The clock configuration


is incorrect.

See Troubleshooting Pointer Justification.

l The precision of the


external clock source is
very low.
Protection
switching
failure

The TPS fails.

See Troubleshooting Protection Switching


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the DX1, see Replacing a PDH Board.

11.8.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

11.8.13.1 Alarms of N1DX1

Issue 03 (2013-02-20)

BD_STATUS

BDID_ERROR

BIP_EXC

BIP_SD

CHIP_ABN

CHIP_FAIL

COMMUN_FAIL

CRC4_ERR_OVER

CTS

DCD

DDN_AIS

DDN_ALOS

DDN_CRC4_ERR_OVER

DDN_LFA

DDN_LMFA

DDN_LOOP_ALM

DDN_RFA

DDN_RMFA

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DOWN_E1_AIS

DSR

DTR

E1_LOC

FPGA_ABN

LFA

LMFA

LOOP_ALM

LP_R_FIFO

LP_RDI

LP_REI

LP_RFI

LP_SLM

LP_T_FIFO

LP_TIM

LP_UNEQ

NO_BD_SOFT

PLL_FAIL

POWER_ABNORMAL

R_FIFO_E

RFA

RMFA

RTS

SLAVE_WORKING

SPARE_PATH_ALM

SUBCARD_ABN

TEMP_OVER

T_FIFO_E

T_LOSEX

TR_LOC

TEST_STATUS

TPS_ALM

UP_E1_AIS

TU_AIS

TU_LOP

PATCH_NOT_CONFIRM

V5_VCAIS

PATCH_ERR

PATCHFILE_NOTEXIST

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

11.8.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

11.8.14.1 Performance Events of N1DX1


LPBBE

LPCSES

LPFECSES

LPFEUAS

LPES

LPSES

LPUAS

LPFEBBE

LPFEES

LPFESES

TUPJCHIGH

TUPJCLOW

CRC4_ERR

DDN_CRC4_ERR

11.8.15 Technical Specifications


The technical specifications of the DX1 include the parameters specified for electrical interfaces,
mechanical specifications, and power consumption.

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Parameters Specified for Electrical Interfaces


The DM12 provides electrical interfaces for the DX1. For the parameters specified for the
electrical interfaces, see Technical Specifications of the DM12.

Mechanical Specifications
The mechanical specifications of the DX1 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the DX1 at room temperature (25C) is 15 W.

11.9 DXA
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the DXA (DDN service converging and processing board).

11.9.1 Version Description


The DXA is available in one functional version, namely, N1.

11.9.2 Application
The DXA is a DDN service processing board. The DXA can be used on the OptiX OSN
equipment series to transmit/receive and converge DDN services. To cross-connect the 63
channels of Nx64 kbit/s signals and framed E1 signals on the system side.
Figure 11-43 shows the application of the DDN service processing boards. The DDN service
processing boards add DDN service signals to line signals and drops line signals to DDN service
signals.

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Figure 11-43 Networking and application of the DDN service processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.9.3 Functions and Features


The DXA cross-connects 63xE1 signals at the 64 kbit/s level on the system side.
Table 11-39 provides the functions and features of the DXA.
Table 11-39 Functions and features of the DXA
Function and
Feature

DXA

Basic functions

Cross-connects 63 channels of framed E1 signals.

Alarms and
performance events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Maintenance
features

Supports inloops and outloops.


Supports the CRC function.

11.9.4 Working Principle and Signal Flow


The DXA consists of the timeslot cross-connect module, framing/deframing module, mapping/
demapping module, logic and control module, and power module.
Figure 11-44 shows the functional block diagram of the DXA.

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Figure 11-44 Functional block diagram of the DXA


Backplane

64 kbit/s
timeslot
crossconnect
module

Framing/
Deframing
module

Signal
mapping/
demapping
module

Logic and
control module
+3.3 V
Power
module

Power
module

Crossconnect unit

SCC unit
Fuse
Fuse

-48 V/-60 V
-48 V/-60 V
+3.3 V
backup power

In the Transmit Direction


The mapping/demapping module demaps the VC-4 signals sent from the SDH cross-connect
unit and sends the demapped signals to the framing/deframing module. Then, the framing/
deframing module converts the signals into the framed E1 signals and sends the framed E1
signals to the timeslot cross-connect module. Finally, the timeslot cross-connect module crossconnects and grooms the signals at the 64 kbit/s granularity.

In the Receive Direction


The timeslot cross-connect module cross-connects and grooms the signals at the 64 kbit/s
granularity, and transmits the signals to the framing/deframing module. Then, the framing/
deframing module maps the signals into VC-4s and transmits the signals to the SDH crossconnect unit.

Logic and Control Module


The logic and control module performs the board communication, board control, and service
configuration functions. In addition, the logic and control module traces and selects the clock
signals and frame header signals sent from the active and standby cross-connect boards.

Power Module
The power module provides all the modules of the DX1 with the required DC voltages.

11.9.5 Front Panel


The front panel of the DXA has indicators.
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Diagram of the Front Panel


Figure 11-45 shows the appearance of the front panel of the DXA.
Figure 11-45 Front panel of the DXA

DXA
STAT
ACT
PROG
SRV

DXA

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.


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Interfaces
The front panel of the DXA does not have an interface.

11.9.6 Valid Slots


The slots valid for the DXA vary with the cross-connect capacity of the subrack.
The slots valid for the DXA are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the DXA can be installed in slots 18 and
1117.

11.9.7 Parameter Settings


You can set the parameters for the DXA by using the U2000.
You can set the following parameters for the DXA by using the U2000:
l

J2 byte

Tributary loopback

Service loading indication

Protocol mode of serial ports

DDN clock source management

For the description of each parameter, see 27 Parameter Settings.

11.9.8 Technical Specifications


The technical specifications of the DXA include the mechanical specifications and power
consumption.

Mechanical Specifications
The mechanical specifications of the DXA are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.8

Power Consumption
The maximum power consumption of the DXA at room temperature (25C) is 10 W.

11.10 SPQ4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SPQ4 (4xE4/STM-1 electrical processing board). This topic also
describes how to configure and commission the SPQ4.

11.10.1 Version Description


The SPQ4 is available in two functional versions, namely, N1 and N2. The difference between
the two versions is with regard to their functions. The N1SPQ4 is discontinued.
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Table 11-40 describes the versions of the SPQ4.


Table 11-40 Versions of the SPQ4
Item

Description

Functional versions

The SPQ4 is available in two functional versions, namely, N1 and N2.

Differences

The equipment of the V100R001 and V100R002 versions supports


the N1SPQ4. The equipment of the V100R003 and later versions
supports the N2SPQ2.

Substitution

The N1SPQ4 can be replaced with the N2SPQ4. When the N1SPQ4
is replaced with the N2SPQ4, the NE software needs to be upgraded.

11.10.2 Application
The SPQ4 is a PDH processing board. The SPQ4 can be used on the OptiX OSN equipment
series to transmit and receive E4/STM-1 electrical signals. To transmit/receive and process
4xE4/STM-1 electrical signals, the SPQ4 must be used with the interface board.
Figure 11-46 shows the application of the PDH processing boards. The PDH processing boards
add tributary signals to line signals and drops tributary signals to line signals.
Figure 11-46 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.10.3 Functions and Features


The SPQ4 processes 4xE4/STM-1 electrical signals, processes overhead bytes, reports alarms
and performance events, provides maintenance features, and supports protection schemes.
Table 11-41 provides the functions and features of the SPQ4.
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Table 11-41 Functions and features of the SPQ4


Function and
Feature

SPQ4

Basic functions

Processes 4xSTM-1/E4 signals.

Service
processing

Transmits/Receives and processes 4xE4/STM-1 electrical signals. The


E4 signals and STM-1 signals are compatible on each channel. Supports
the VC-12 services, VC-3 services, and VC-4 services.

Overhead
processing

l Processes the section overheads of the STM-1 signals, such as B1,


B2, K1, K2, M1, F1, and D1D12.
l Supports the transparent transmission and termination of the path
overhead bytes including J1, B3, C2, G1, and H4.
l Supports the setting and query of the J0, J1, and C2 bytes.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Maintenance
features

l Supports inloops and outloops at optical interfaces.


l Supports warm resets and cold resets. The warm reset does not affect
services.
l Supports the query of the manufacturing information of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting services.
l Does not support the CRC function.

Protection
schemes

l Supports the TPS protection when working with the interface board
and the switching and bridging board.
l Supports the Two-fiber ring MSP.
l Supports the Linear MSP.
l Supports the SNCP.

11.10.4 Working Principle and Signal Flow


The SPQ4 consists of the interface module, mapping/demapping module, SDH overhead
processing module, interface converting module, logic and control module, and power module.
Figure 11-47 shows the functional block diagram of the SPQ4. Figure 11-48 shows the
functional block diagram of the mapping/demapping module. Figure 11-49 shows the functional
block diagram of the SDH overhead processing module.

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Figure 11-47 Functional block diagram of the SPQ4


155 MHz
PLL

34 MHz
OSC

LIU

LIU

PPI/SPI

E4/STM-1

Mapping/
4x139 Mbit/s Demapping 4x155 Mbit/s
module
4x155 Mbit/s

Interface
module

SDH
overhead
processing
module

EN 140 Mbit/s/155 Mbit/s


LOS

4x155 Mbit/s

High-speed
bus
Interface
converting
module High-speed
bus

DCC
K1 and K2

Logic and
control module

Outloop/Inloop control

Backplane
Reference
Cross-connect
clock
unit

+3.3 V
Power
module

Cross-connect
unit A
Cross-connect
unit B
SCC unit
Cross-connect
unit

Frame header
Communication

Cross-connect
unit
SCC unit

Power
module

Fuse
Fuse

LIU: logic interface unit

PPI: PDH physical interface

OSC: oscillator

-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

Figure 11-48 Functional block diagram of the mapping/demapping module


Mapping/demapping module
139 Mbit/s

155 Mbit/s
LPA

PDH AIS E4 AIS


detector insertion

139 Mbit/s

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HPT

PG

J1/C2/B3

E4 AIS
insertion

LPA

HPT

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Figure 11-49 Functional block diagram of the SDH overhead processing module
SDH overhead processing module
K1 and K2 insertion/
extraction

Cross-connect unit

155 Mbit/s

155 Mbit/s

155 Mbit/s
RST

MST

MSA

HPT
155 Mbit/s

DCC

SCC unit

Interface Module
The PPI module consists of LIUs and provides the inloop and outloop functions. The PPI module
performs the following functions:
l

Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the PDH LOS signals.

The SPI module consists of LIUs and provides the inloop and outloop functions. The SPI module
performs the following functions:
l

Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the R_LOS signals.

SDH Overhead Processing Module (155 Mbit/s SDH Signals)


The SDH overhead processing module performs the functions that are required to manage 155
Mbit/s SDH signals.
l

RST Sub-Module
In the receive direction, the RST sub-module detects the frame alignment bytes (A1 and
A2), restores the regenerator section trace byte (J0), detects a J0 mismatch, and counts
BIP-8 errored blocks.
In the transmit direction, the RST sub-module inserts the frame alignment bytes, inserts
the J0 byte, and performs BIP-8 calculation and byte insertion.

MST Sub-Module
In the receive direction, the MST sub-module counts BIP-24 errored blocks, restores
the MS_REI, and detects the MS_RDI and MS_AIS.

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In the transmit direction, the MST sub-module performs BIP-24 calculation and
insertion and inserts the MS_REI, MS_RDI, and MS_AIS.
The MST sub-module extracts or inserts the K1 byte and K2 byte.
l

MSA Sub-Module
In the receive direction, the MSA sub-module interprets the AU-4 pointer, detects the
LOP and AIS, and performs pointer justifications.
In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4 pointer and the AU_AIS.

HPT Sub-Module
Terminates the overheads.
Restores the J1 path trace message.
Restores the REI information.
Detects the HP_RDI (monitors the status of the path).
Detects the UNEQ and AIS (monitors the signal label).
Counts the VC-4 BIP-8 errored blocks.

Mapping/Demapping Module (140 Mbit/s PDH Signals)


The mapping/demapping module performs the functions that are required to manage 140 Mbit/
s PDH signals.
l

LPA Sub-Module
The 140 Mbit/s plesiochronous stream is inserted in a C4 container to be adapted so that
the stream can be transported to the synchronous network. The PDH AIS is monitored and
the E4 AIS in inserted.

HPT Sub-Module
The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH. The POH contains nine octets equally distributed within the frame.
The following overhead bytes can be extracted: J1, B3. C2, G1, F2, H4, F3, K3, and N1.
The E4 AIS can be inserted in the downstream direction.

Pointer generator (PG)


A fixed pointer value is inserted into the SOH to structure the AU-4 signal.

MST Sub-Module and RST Sub-Module


These sub-modules are required to create a proprietary STM1 signal so that the interface
converting module can be connected. In the receive direction, these sub-modules detect the
frame alignment bytes (A1 and A2).

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


l
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Manages and configures the other modules of the board.


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Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots when
the GSCC cannot be detected.

Selects the clock signal and frame header signal from the active and standby cross-connect
units.

Controls the indicators on the board.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

11.10.5 Front Panel


The front panel of the SPQ4 has indicators.

Diagram of the Front Panel


Figure 11-50 shows the appearance of the front panel of the SPQ4.

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Figure 11-50 Front panel of the SPQ4

SPQ4
STAT
ACT
PROG
SRV

SPQ4

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the SPQ4 does not have an interface. Hence, the SPQ4 needs to work with
the MU04 to receive and transmit the E4/STM-1 signals. For details, see the topic that describes
the MU04.
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11.10.6 Jumpers and DIP Switches


The SPQ4 does not have any jumpers or DIP switches that are used for board settings.

11.10.7 Valid Slots


The SPQ4 must be used with the MU04. In addition, the SPQ4 must be installed in a valid slot
in the subrack. Otherwise, the SPQ4 fails to work normally.
The SPQ4 can be installed in slots 25 and 1316.
Table 11-42 lists the slots valid for the SPQ4 and the corresponding slots for the MU04.
Table 11-42 Slots valid for the SPQ4 and the corresponding slots for the MU04
Slot Valid for the SPQ4

Corresponding Slot for the MU04

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

11.10.8 Feature Code


The SPQ4 does not have a feature code.

11.10.9 Board Protection


The SPQ4 supports the 1:N TPS protection.

Protection Principle
The SPQ4 can be configured into two 1:N (N3) TPS protection groups when the SPQ4 works
with the MU04 and TSB8/TSB4.
Figure 11-51 shows the TPS protection provided by the SPQ4.

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Figure 11-51 TPS protection provided by the SPQ4


Service signal

Service signal
Switching
control bus

Crossconnect and
timing board

Interface board N

Interface board

Working board N

Working board

Working board 1

Protection board

Interface board 1

Protection
switching board

Failed

Normal state
When each working board functions normally, the traffic signal is directly transmitted to
the working board through position 1 of the control switch on the interface board.

Switching state
When a working board detects a failure and requires the switching operation, the control
switch of the corresponding interface board switches from position 1 to position 2. At the
same time, the control switch of the protection switching board switches to the
corresponding position so that the protection board can protect the failed working board.
NOTE

TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing board.
Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

Hardware Configuration
Figure 11-52 shows the slot configuration for the 1:3 TPS protection of the SPQ4.

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S
L
O
T
3
1

S
L
O
T
3
2

S
L
O
T
3
3

S
L
O
T
3
5

S
L
O
T
3
4

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8

GSCC

Working 1

S
L
O
T
1
1

Working 2

Working 1

S
L
O
T
1
0

Working 2

Protection 1

S
L
O
T
9

S
L
O
T
3
7

FAN

Working 2

S S S S
L L L L
O O O O
T T T T
5 6 7 8

XCS

S
L
O
T
4

XCS

S S S
L L L
O O O
T T T
1 2 3

S
L
O
T
3
6

AUX

S
L
O
T
3
0

FAN

FAN

Working 1

S
L
O
T
2
9

TSB8/TSB4

S
L
O
T
2
8

Protection 2

S
L
O
T
2
7

MU04

S
L
O
T
2
6

MU04

S
L
O
T
2
5

MU04

S
L
O
T
2
4

PIU

S
L
O
T
2
3

MU04

S
L
O
T
2
2

MU04

S
L
O
T
2
1

MU04

S
L
O
T
2
0

TSB8/TSB4

S
L
O
T
1
9

PIU

Figure 11-52 Slot configuration for the two 1:3 TPS protection groups of the SPQ4

Fiber routing area

In Figure 11-52, the board in slot 2 protects the boards in slots 3-5. The board in slot 16 protects
the boards in slots 13-15.
Table 11-43 lists the slots for the SPQ4, MU04, and TSB8/TSB4.
Table 11-43 Slots for the SPQ4, MU04, and TSB8/TSB4

Issue 03 (2013-02-20)

Board

Protection Group 1

Protection Group 2

SPQ4 (working
board)

Slots 3-5

Slots 13-15

SPQ4 (protection
board)

Slot 2

Slot 16

MU04

Slots 21, 23, and 25

Slots 29, 31, and 33

TSB8/TSB4

Slot 19

Slot 35

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11.10.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the interface board and cable match the board. Ensure that the
impedance of the cable matches the impedance of the board.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Set the PDH interface.
l J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS and
the default value of the J2 to be received is Disabled.
l V5 byte: The setting of the V5 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the V5 byte is Asynchronous.
l Service load indication: When a service channel does not process its carried services, select
Non-Loaded. When the service channel processes its carried services, select Load.
For details, see 28.7 Checking Board Parameters.
Step 3 Optional: Create the protection. For details, see Creating a TPS Protection Group for Boards.
Step 4 Required: Configure services. For details, see Configuring the SDH Services.
NOTE

Before you configure services, learn the type of protection subnet configured for the ring network. For the
method for querying the protection subnet, see 28.1 Querying the Protection Subnet.

Step 5 Set parameters on the U2000. For the parameters to be set, see 27.6 PDH Boards.
----End
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Commissioning the Board


Step 1 Required: Test the connection between the cable and the service interface. For details, see
Testing Connection Between the Cables and the PDH Service Interfaces.
Step 2 Optional: Test the TPS of the electrical interface. For details, see Testing the TPS of the
Electrical Interfaces.
Step 3 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

11.10.11 Parameter Settings


You can set the parameters for the SPQ4 by using the U2000.
You can set the following parameters for the SPQ4 by using the U2000:
l

J1 byte

C2 byte

For the description of each parameter, see 27 Parameter Settings.

11.10.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 11-44 lists the faults that occur on the SPQ4 frequently and the troubleshooting methods.

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Table 11-44 Methods used to troubleshoot the faults that occur on the SPQ4 frequently
Fault
Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The cable or connector


becomes abnormal.

See Troubleshooting TDM Service


Interruptions.

l An incorrect operation is
performed.
l The types or settings of
the boards are
inconsistent.
Bit error

The equipment becomes


faulty.

See Troubleshooting Bit Errors.

Pointer
justification

l The clock configuration


is incorrect.

See Troubleshooting Pointer Justification.

l The precision of the


external clock source is
very low.
Protection
switching
failure

The TPS fails.

See Troubleshooting Protection Switching


Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SPQ4, see Replacing a PDH Board.

11.10.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

11.10.13.1 Alarms of N1SPQ4

Issue 03 (2013-02-20)

AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BDID_ERROR

BIP_EXC

BIP_SD

BIP8_ECC

C4_R_LAISD

C4_T_LAISD

CHIP_FAIL

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COMMUN_FAIL

EXT_LOS

FPGA_ABN

FSELECT_STG

HP_LOM

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

J0_MM

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

MS_AIS

MS_RDI

MS_REI

NO_BD_SOFT

OH_LOOP

PLL_FAIL

POWER_ABNORMAL

R_LOC

R_LOF

R_LOS

R_OOF

RELAY_FAIL

SLAVE_WORKING

SPARE_PATH_ALM

SUBCARD_ABN

T_LOSEX

TEST_STATUS

TPS_ALM

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BDID_ERROR

BIP_EXC

BIP_SD

BIP8_ECC

C4_R_LAISD

C4_T_LAISD

CHIP_FAIL

COMMUN_FAIL

EXT_LOS

FPGA_ABN

FSELECT_STG

HP_LOM

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

J0_MM

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

11.10.13.2 Alarms of N2SPQ4

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LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

MS_AIS

MS_RDI

MS_REI

NO_BD_SOFT

OH_LOOP

PLL_FAIL

POWER_ABNORMAL

R_LOC

R_LOF

R_LOS

R_OOF

RELAY_FAIL

SLAVE_WORKING

SPARE_PATH_ALM

SUBCARD_ABN

T_LOSEX

TEST_STATUS

TPS_ALM

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

PS

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

11.10.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

11.10.14.1 Performance Events of N1SPQ4

Issue 03 (2013-02-20)

AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

RSBBE

RSCSES

RSES

RSOFS

RSSES

RSUAS

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11.10.14.2 Performance Events of N2SPQ4


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

RSBBE

RSCSES

RSES

RSOFS

RSSES

RSUAS

11.10.15 Technical Specifications


The technical specifications of the SPQ4 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


The MU04 provides electrical interfaces for the SPQ4. For the parameters specified for the
electrical interfaces, see Technical Specifications of the MU04.

Mechanical Specifications
The mechanical specifications of the SPQ4 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.9

Power Consumption
The maximum power consumption of the SPQ4 at room temperature (25C) is 24 W.

11.11 D12B
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D12B (32xE1/T1 access board).

11.11.1 Version Description


The D12B is available in one functional version, namely, N1.

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11.11.2 Application
The D12B is a PDH interface board. The D12B can be used on the OptiX OSN equipment series
to transmit and receive signals for the PDH processing board. To transmit/receive and process
signals, the interface board must be used with its corresponding processing board.

11.11.3 Functions and Features


The D12B receives and transmits 32xE1/T1 electrical signals. The D12B must work with the
PQ1, or PQM.

11.11.4 Working Principle and Signal Flow


The D12B has the interface module.
Figure 11-53 shows the functional block diagram of the D12B by describing how to process
1xE1/T1 signals.
Figure 11-53 Functional block diagram of the D12B
Backplane

PQ1/PQM/PO1

E1/T1 electrical signal


Interface
module
E1/T1 electrical signal

PQ1/PQM/PO1

Interface Module
The interface module receives and transmits the E1/T1 electrical signals.

11.11.5 Front Panel


The front panel of the D12B has interfaces and a bar code.

Diagram of the Front Panel


Figure 11-54 shows the appearance of the front panel of the D12B.

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Figure 11-54 Front panel of the D12B

D12B

1~8
9~16
17~24
25~32

D12B

Interfaces
The front panel of the D12B has four DB44 interfaces. Table 11-45 describes the types and
usage of the interfaces of the D12B.
Table 11-45 Interfaces of the D12B

Issue 03 (2013-02-20)

Interface

Type of
Interface

Usage

18

DB44

Receives the 1st to the 8th channels of E1/T1


signals.

916

DB44

Receives the 9th to the 16th channels of E1/T1


signals.

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Interface

Type of
Interface

Usage

1724

DB44

Receives the 17th to the 24th channels of E1/T1


signals.

2532

DB44

Receives the 25th to the 32nd channels of E1/T1


signals.

Table 11-46 provides the pin assignments of the DB44 interface.


Table 11-46 Pin assignments of the DB44 interface
Front View
30

15

44

Pin

Usage

Pin

Usage

38

Receives the 1st


channel of signals
(R1).

34

Receives the 5th


channel of signals
(R5).

Receives the 2nd


channel of signals
(R2).

33

Receives the 3rd


channel of signals
(R3).

32

Receives the 4th


channel of signals
(R4).

31

Transmits the 1st


channel of signals
(T1).

11

Transmits the 2nd


channel of signals
(T2).

10

Transmits the 3rd


channel of signals
(T3).

Transmits the 4th


channel of signals
(T4).

23
37
22
36
21
35

31
16

20
15
30
14
29
13
28
12
27

19

18

17

16

26

25

24

Receives the 6th


channel of signals
(R6).
Receives the 7th
channel of signals
(R7).
Receives the 8th
channel of signals
(R8).
Transmits the 5th
channel of signals
(T5).
Transmits the 6th
channel of signals
(T6).
Transmits the 7th
channel of signals
(T7).
Transmits the 8th
channel of signals
(T8).

11.11.6 Valid Slots


The D12B can work as the interface board of the PQ1, or PQM.
The D12B can be installed in slots 1926 and 2936 in the main subrack.
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Table 11-47 lists the slots valid for the PQ1/PQM and the corresponding slots for the D12B.
The D12B installed in the slot with a smaller number transmits/receives the 1st to the 32nd
channels of E1/T1 electrical signals. The D12B installed in the slot with a larger number
transmits/receives the 33rd to the 63rd channels of E1/T1 electrical signals.
Table 11-47 Slots valid for the PQ1/PQM and the corresponding slots for the D12B
Slot Valid for the PQ1/PQM

Corresponding Slot for the D12B

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

11.11.7 Technical Specifications


The technical specifications of the D12B include the parameters specified for the electrical
interfaces, mechanical specifications and power consumption.

Parameters Specified for Electrical Interfaces


Table 11-48 Parameters specified for the electrical interfaces of the D12B
Nominal bit rate

1544 kbit/s

2048 kbit/s

Line code pattern

B8ZS and AMI

HDB3

Waveform at the output


interface

Complies with ITU-T G.703.

Signal bit rate at the output


interface
Allowed attenuation at the input
interface

Issue 03 (2013-02-20)

Allowed frequency deviation at


the input interface

Complies with ITU-T G.823.

Input jitter tolerance

Complies with ITU-T G.


824.

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Complies with ITU-T G.


823.

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Nominal bit rate

1544 kbit/s

2048 kbit/s

Anti-interference capability at
the input interface

Complies with ITU-T G.


703.

Reflection attenuation at the


input/output interface
Output jitter

Complies with ITU-T G.823 and G.824.

Mapping jitter

Complies with ITU-T G.783.

Combined jitter
Jitter transfer function

Complies with ITU-T G.


742.

Mechanical Specifications
The mechanical specifications of the D12B are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.3

Power Consumption
The maximum power consumption of the D12B at room temperature (25C) is 0 W.

11.12 D12S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D12S (32xE1/T1 switching access board).

11.12.1 Version Description


The D12S is available in one functional version, namely, N1.

11.12.2 Application
The D12S is a PDH interface switching board. The D12S can be used on the OptiX OSN
equipment series to transmit and receive signals for the PDH processing board. In addition, when
the corresponding PDH processing board is configured with the TPS protection, the interface
switching board is required to perform the TPS protection.

11.12.3 Functions and Features


The D12S receives and transmits 32xE1/T1 electrical signals. The D12S must work with the
PQ1, or PQM.

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11.12.4 Working Principle and Signal Flow


The D12S consists of the interface module, switch matrix module, and power access circuit.
Figure 11-55 shows the functional block diagram of the D12S by describing how to process
1xE1/T1 signals.
Figure 11-55 Functional block diagram of the D12S
Backplane
Cross-connect board
E1/T1 electrical
signal

Interface
module

Switch
matrix
module

E1/T1 electrical
signal

PQ1/PQM/PO1

PQ1/PQM/PO1

+3.3 V

Fuse

+3.3 V power

Interface Module
The interface module receives and transmits the E1/T1 electrical signals.

Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the PQ1 or PQM. When the TPS is performed, the switch matrix
module transmits the signal to the protection board for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

Power Access Circuit


The power access circuit provides all the modules of the D12S with the required DC voltages.

11.12.5 Front Panel


The front panel of the D12S has interfaces and a bar code.

Diagram of the Front Panel


Figure 11-56 shows the appearance of the front panel of the D12S.
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Figure 11-56 Front panel of the D12S

D12S

1~8
9~16
17~24
25~32

D12S

Interfaces
The front panel of the D12S has four DB44 interfaces. Table 11-49 describes the types and
usage of the interfaces of the D12S.
Table 11-49 Interfaces of the D12S

Issue 03 (2013-02-20)

Interface

Type of
Interface

Usage

18

DB44

Receives the 1st to the 8th channels of E1/T1 signals.

916

DB44

Receives the 9th to the 16th channels of E1/T1


signals.

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Interface

Type of
Interface

Usage

1724

DB44

Receives the 17th to the 24th channels of E1/T1


signals.

2532

DB44

Receives the 25th to the 32nd channels of E1/T1


signals.

Table 11-50 provides the pin assignments of the DB44 interface.


Table 11-50 Pin assignments of the DB44 interface
Front View
30

15

44

Pin

Usage

Pin

Usage

38

Receives the 1st


channel of signals
(R1).

34

Receives the 5th


channel of signals
(R5).

Receives the 2nd


channel of signals
(R2).

33

Receives the 3rd


channel of signals
(R3).

32

Receives the 4th


channel of signals
(R4).

31

Transmits the 1st


channel of signals
(T1).

11

Transmits the 2nd


channel of signals
(T2).

10

Transmits the 3rd


channel of signals
(T3).

Transmits the 4th


channel of signals
(T4).

23
37
22
36
21
35

31
16

20
15
30
14
29
13
28
12
27

19

18

17

16

26

25

24

Receives the 6th


channel of signals
(R6).
Receives the 7th
channel of signals
(R7).
Receives the 8th
channel of signals
(R8).
Transmits the 5th
channel of signals
(T5).
Transmits the 6th
channel of signals
(T6).
Transmits the 7th
channel of signals
(T7).
Transmits the 8th
channel of signals
(T8).

11.12.6 Valid Slots


The D12S can be installed in slots 1926 and 2936 in the main subrack. The D12S works as
the interface board of the PQ1, or PQM.
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Table 11-51 lists the slots valid for the PQ1/PQM and the corresponding slots for the D12S.
The D12S installed in the slot with a smaller number transmits/receives the 1st to the 32nd
channels of E1/T1 electrical signals. The D12S installed in the slot with a larger number
transmits/receives the 33rd to the 63rd channels of E1/T1 electrical signals.
Table 11-51 Slots valid for the PQ1/PQM and the corresponding slots for the D12S
Slot Valid for the PQ1/PQM

Corresponding Slot for the D12S

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

11.12.7 Technical Specifications


The technical specifications of the D12S include the parameters specified for the electrical
interfaces, mechanical specifications and power consumption.

Parameters Specified for Electrical Interfaces


Table 11-52 Parameters specified for the electrical interfaces of the D12S
Nominal bit rate

1544 kbit/s

2048 kbit/s

Line code pattern

B8ZS and AMI

HDB3

Waveform at the output


interface

Complies with ITU-T G.703.

Signal bit rate at the output


interface
Allowed attenuation at the input
interface

Issue 03 (2013-02-20)

Allowed frequency deviation at


the input interface

Complies with ITU-T G.823.

Input jitter tolerance

Complies with ITU-T G.


824.

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823.

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Nominal bit rate

1544 kbit/s

2048 kbit/s

Anti-interference capability at
the input interface

Complies with ITU-T G.


703.

Reflection attenuation at the


input/output interface
Output jitter

Complies with ITU-T G.823 and G.824.

Mapping jitter

Complies with ITU-T G.783.

Combined jitter
Jitter transfer function

Complies with ITU-T G.


742.

Mechanical Specifications
The mechanical specifications of the D12S are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.4

Power Consumption
At room temperature (25C), the maximum power consumption of the D12S is 0 W.

11.13 D75S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D75S (32xE1 switching access board).

11.13.1 Version Description


The D75S is available in one functional version, namely, N1.

11.13.2 Application
The D75S is a PDH interface switching board. The D75S can be used on the OptiX OSN
equipment series to transmit and receive signals for the PDH processing board. In addition, when
the corresponding PDH processing board is configured with the TPS protection, the interface
switching board is required to perform the TPS protection.

11.13.3 Functions and Features


The D75S receives and transmits 32xE1 electrical signals. The D75S must work with the PQ1.

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11.13.4 Working Principle and Signal Flow


The D75S consists of the interface module, switch matrix module, and power access circuit.
Figure 11-57 shows the functional block diagram of the D75S by describing how to process
1xE1 signals.
Figure 11-57 Functional block diagram of the D75S
Backplane
Cross-connect board
E1 electrical signal
Interface
module

Switch
matrix
module

E1 electrical signal

PQ1/PD1

PQ1/PD1

+3.3 V

Fuse

+3.3 V power

Backplane
Cross-connect board
E1 electrical signal
Interface
module

Switch
matrix
module

E1 electrical signal

PQ1

PQ1

+3.3 V

Fuse

+3.3 V power

Interface Module
The interface module receives and transmits the E1 electrical signals.

Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the PQ1. When the TPS is performed, the switch matrix module
transmits the signal to the protection board for bridging.
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In the transmit direction, the switch matrix module performs the reverse process.

Power Access Circuit


The power access circuit provides all the modules of the D75S with the required DC voltages.

11.13.5 Front Panel


The front panel of the D75S has interfaces and a bar code.

Diagram of the Front Panel


Figure 11-58 shows the appearance of the front panel of the D75S.
Figure 11-58 Front panel of the D75S

D75S

1~8
9~16
17~24
25~32

D75S

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Interfaces
The front panel of the D75S has four DB44 interfaces. Table 11-53 describes the types and
usage of the interfaces of the D75S.
Table 11-53 Interfaces of the D75S
Interface

Type of
Interface

Usage

18

DB44

Receives the 1st to the 8th channels of E1 signals.

916

DB44

Receives the 9th to the 16th channels of E1 signals.

1724

DB44

Receives the 17th to the 24th channels of E1 signals.

2532

DB44

Receives the 25th to the 32nd channels of E1 signals.

Table 11-54 provides the pin assignments of the DB44 interface.


Table 11-54 Pin assignments of the DB44 interface
Front View
30

15

44

Pin

Usage

Pin

Usage

38

Receives the 1st


channel of signals
(R1).

34

Receives the 5th


channel of signals
(R5).

Receives the 2nd


channel of signals
(R2).

33

Receives the 3rd


channel of signals
(R3).

32

Receives the 4th


channel of signals
(R4).

31

Transmits the 1st


channel of signals
(T1).

11

Transmits the 2nd


channel of signals
(T2).

10

Transmits the 3rd


channel of signals
(T3).

23
37
22
36
21
35

31
16

20
15
30
14
29
13
28

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19

18

17

16

26

25

24

Receives the 6th


channel of signals
(R6).
Receives the 7th
channel of signals
(R7).
Receives the 8th
channel of signals
(R8).
Transmits the 5th
channel of signals
(T5).
Transmits the 6th
channel of signals
(T6).
Transmits the 7th
channel of signals
(T7).

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Front View

11 PDH Boards

Pin

Usage

Pin

Usage

12

Transmits the 4th


channel of signals
(T4).

Transmits the 8th


channel of signals
(T8).

27

11.13.6 Valid Slots


The D75S can work as the interface board of the PQ1.
The D75S can be installed in slots 1926 and 2936 in the main subrack.
Table 11-55 lists the slots valid for the PQ1 and the corresponding slots for the D75S. The D75S
installed in the slot with a smaller number transmits/receives the 1st to the 32nd channels of E1
electrical signals. The D75S installed in the slot with a larger number transmits/receives the 33rd
to the 63rd channels of E1 electrical signals.
Table 11-55 Slots valid for the PQ1 and the corresponding slots for the D75S
Slot Valid for the PQ1

Corresponding Slot for the D75S

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

11.13.7 Technical Specifications


The technical specifications of the D75S include the parameters specified for the electrical
interfaces, mechanical specifications and power consumption.

Parameters Specified for Electrical Interfaces


Table 11-56 Parameters specified for the electrical interfaces of the D75S

Issue 03 (2013-02-20)

Nominal bit rate

2048 kbit/s

Line code pattern

HDB3

Waveform at the output interface

Complies with ITU-T G.703.

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Nominal bit rate

11 PDH Boards

2048 kbit/s

Signal bit rate at the output interface


Allowed attenuation at the input interface
Allowed frequency deviation at the input
interface

Complies with ITU-T G.823.

Input jitter tolerance


Anti-interference capability at the input
interface

Complies with ITU-T G.703.

Reflection attenuation at the input/output


interface
Output jitter

Complies with ITU-T G.823 and G.824.

Mapping jitter

Complies with ITU-T G.783.

Combined jitter
Jitter transfer function

Complies with ITU-T G.742.

Mechanical Specifications
The mechanical specifications of the D75S are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.4

Power Consumption
At room temperature (25C), the maximum power consumption of the D75S is 0 W.

11.14 D34S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D34S (6xE3/T3 switching access board).

11.14.1 Version Description


The D34S is available in one functional version, namely, N1.

11.14.2 Application
The D34S is a PDH interface switching board. The D34S can be used on the OptiX OSN
equipment series to transmit and receive signals for the PDH processing board. In addition, when
the corresponding PDH processing board is configured with the TPS protection, the interface
switching board is required to perform the TPS protection.

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11.14.3 Functions and Features


The D34S receives and transmits 6xE3/T3 electrical signals. The D34S must work with the PD3
or PQ3.

11.14.4 Working Principle and Signal Flow


The D34S consists of the interface module, switch matrix module, and power access circuit.
Figure 11-59 shows the functional block diagram of the D34S by describing how to process
1xE3/T3 signals.
Figure 11-59 Functional block diagram of the D34S
Backplane
Cross-connect board
E3/T3 electrical
signal

Interface
module

Switch
matrix
module

+3.3 V

Fuse

E3/T3 electrical
signal

PD3/PQ3
TSB8
TSB8
PD3/PQ3

+3.3 V power

Interface Module
The interface module receives and transmits the E3/T3 electrical signals.

Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the PD3 or PQ3. When the TPS is performed, the switch matrix
module transmits the signal to the TSB8 for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

Power Access Circuit


The power access circuit provides all the modules of the D34S with the required DC voltages.

11.14.5 Front Panel


The front panel of the D34S has interfaces and a bar code.
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Diagram of the Front Panel


Figure 11-60 shows the appearance of the front panel of the D34S.
Figure 11-60 Front panel of the D34S

D34S

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
OUT5
IN5
OUT6
IN6

D34S

Interfaces
The front panel of the D34S has six pairs of electrical interfaces.
Table 11-57 describes the types and usage of the interfaces of the D34S.

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Table 11-57 Interfaces of the D34S


Interface

Type of
Interface

Usage

IN1IN6

SMB

Receives the 1st to the 6th channels of E3/T3


electrical signals.

OUT1OUT6

SMB

Transmits the 1st to the 6th channels of E3/T3


electrical signals.

11.14.6 Valid Slots


The D34S can be installed in slots 1926 and 2936 in the subrack.

11.14.7 Technical Specifications


The technical specifications of the D34S include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


Table 11-58 lists the parameters specified for the electrical interfaces of the D34S.
Table 11-58 Parameters specified for the electrical interfaces of the D34S
Nominal bit rate

34368 kbit/s

44736 kbit/s

Line code pattern

HDB3

B3ZS

Waveform at the output


interface

Complies with ITU-T G.703.

Signal bit rate at the output


interface
Allowed attenuation at the input
interface
Allowed frequency deviation at
the input interface

Complies with ITU-T G.823.

Input jitter tolerance

Complies with ITU-T G.


823.

Complies with ITU-T G.824.

Anti-interference capability at
the input interface

Complies with ITU-T G.


703.

Reflection attenuation at the


input/output interface
Output jitter
Issue 03 (2013-02-20)

Complies with ITU-T G.823 and G.824.


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Nominal bit rate

34368 kbit/s

44736 kbit/s

Mapping jitter

Complies with ITU-T G.783.

Combined jitter
Jitter transfer function

Complies with ITU-T G.


751.

Mechanical Specifications
The mechanical specifications of the D34S are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.4

Power Consumption
At room temperature (25C), the maximum power consumption of the D34S is 0 W.

11.15 C34S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the C34S (3xE3/T3 switching access board).

11.15.1 Version Description


The C34S is available in one functional version, namely, N1.

11.15.2 Application
The C34S is a PDH interface switching board. The C34S can be used on the OptiX OSN
equipment series to transmit and receive signals for the PDH processing board. In addition, when
the corresponding PDH processing board is configured with the TPS protection, the interface
switching board is required to perform the TPS protection.

11.15.3 Functions and Features


The C34S receives and transmits 3xE3/T3 electrical signals. The C34S must work with the PL3.

11.15.4 Working Principle and Signal Flow


The C34S consists of the interface module, switch matrix module, and power access circuit.
Figure 11-61 shows the functional block diagram of the C34S by describing how to process
1xE3/T3 signals.
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Figure 11-61 Functional block diagram of the C34S


Backplane
Cross-connect board
E3/T3 electrical
signal

Interface
module

Switch
matrix
module

E3/T3 electrical
signal
+3.3 V

Fuse

PL3
TSB4/TSB8
TSB4/TSB8
PL3

+3.3 V power

Interface Module
The interface module receives and transmits the E3/T3 electrical signals.

Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the PL3. When the TPS is performed, the switch matrix module
transmits the signal to the TSB4 or TSB8 for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

Power Access Circuit


The power access circuit provides all the modules of the C34S with the required DC voltages.

11.15.5 Front Panel


The front panel of the C34S has interfaces and a bar code.

Diagram of the Front Panel


Figure 11-62 shows the appearance of the front panel of the C34S.

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Figure 11-62 Front panel of the C34S

C34S

OUT1
IN1
OUT2
IN2
OUT3
IN3

C34S

Interfaces
The front panel of the C34S has three pairs of electrical interfaces.
Table 11-59 describes the type and usage of the interface of the C34S.
Table 11-59 Interfaces of the C34S

Issue 03 (2013-02-20)

Interface

Type of Interface

Usage

IN1IN3

SMB

Receives the 1st to the 3rd channels of E3/T3


electrical signals.

OUT1OUT3

SMB

Transmits the 1st to the 3rd channels of E3/T3


electrical signals.

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11.15.6 Valid Slots


The C34S can be installed in slots 19, 21, 23, 25, 29, 31, 33, and 35 in the main subrack.
Table 11-60 lists the slots valid for the PL3 and the corresponding slots for the C34S.
Table 11-60 Slots valid for the PL3 and the corresponding slots for the C34S
Slot Valid for the PL3

Corresponding Slot for the C34S

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

11.15.7 Technical Specifications


The technical specifications of the C34S include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


Table 11-61 lists the parameters specified for the electrical interfaces of the C34S.
Table 11-61 Parameters specified for the electrical interfaces of the C34S
Nominal bit rate

34368 kbit/s

44736 kbit/s

Line code pattern

HDB3

B3ZS

Waveform at the output


interface

Complies with ITU-T G.703.

Signal bit rate at the output


interface
Allowed attenuation at the input
interface

Issue 03 (2013-02-20)

Allowed frequency deviation at


the input interface

Complies with ITU-T G.823.

Input jitter tolerance

Complies with ITU-T G.


823.

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Nominal bit rate

34368 kbit/s

44736 kbit/s

Anti-interference capability at
the input interface

Complies with ITU-T G.


703.

Reflection attenuation at the


input/output interface
Output jitter

Complies with ITU-T G.823 and G.824.

Mapping jitter

Complies with ITU-T G.783.

Combined jitter
Jitter transfer function

Complies with ITU-T G.


751.

Mechanical Specifications
The mechanical specifications of the C34S are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.3

Power Consumption
At room temperature (25C), the maximum power consumption of the C34S is 0 W.

11.16 MU04
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the MU04 (4xE4/STM-1 electrical interface board).

11.16.1 Version Description


The MU04 is available in one functional version, namely, N1.

11.16.2 Application
The MU04 is an E4/STM-1 electrical interface board. The MU04 can be used on the OptiX OSN
equipment series to transmit and receive signals for the E4/STM-1 electrical processing board.

11.16.3 Functions and Features


The MU04 receives and transmits 4xE4/STM-1 electrical signals. The MU04 must work with
the SPQ4.

11.16.4 Working Principle and Signal Flow


The MU04 consists of the interface module, switch matrix module, and power module.
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Figure 11-63 shows the functional block diagram of the MU04 by describing how to process
1xE4/STM-1 signals.
Figure 11-63 Functional block diagram of the MU04
Backplane
Cross-connect board
E4/STM-1 electrical
signal
Interface
module
E4/STM-1 electrical
signal
+3.3 V

Switch
matrix
module

Power
module

Fuse

SPQ4
TSB4/TSB8
TSB4/TSB8
SPQ4

+3.3 V power

Interface Module
The interface module receives and transmits the E4/STM-1 electrical signals.

Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the SPQ4. When the TPS is performed, the switch matrix module
transmits the signal to the TSB4 or TSB8 for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

Power Module
The power module provides all the modules of the MU04 with the required DC voltages.

11.16.5 Front Panel


The front panel of the MU04 has interfaces and a bar code.

Diagram of the Front Panel


Figure 11-64 shows the appearance of the front panel of the MU04.

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Figure 11-64 Front panel of the MU04

MUO4

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

MUO4

Interfaces
The front panel of the MU04 has four pairs of electrical interfaces.
Table 11-62 describes the types and usage of the interfaces of the MU04.
Table 11-62 Interfaces of the MU04

Issue 03 (2013-02-20)

Interface

Type of
Interface

Usage

IN1IN4

SMB

Receives the 1st to the 4th channels of E4/STM-1


electrical signals.

OUT1OUT4

SMB

Transmits the 1st to the 4th channels of E4/STM-1


electrical signals.

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11.16.6 Valid Slots


The MU04 can be installed in slots 19, 21, 23, 25, 29, 31, 33, and 35 in the subrack and works
as the interface board of the SPQ4.
Table 11-63 lists the slots valid for the SPQ4 and the corresponding slots for the MU04.
Table 11-63 Slots valid for the SPQ4 and the corresponding slots for the MU04
Slot Valid for the SPQ4

Corresponding Slot for the MU04

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

11.16.7 Technical Specifications


The technical specifications of the MU04 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


Table 11-64 lists the parameters specified for the electrical interfaces of the MU04.
Table 11-64 Parameters specified for the electrical interfaces of the MU04
Nominal bit rate

139264 kbit/s

155520 kbit/s

Line code pattern

CMI

CMI

Waveform at the output


interface

Complies with ITU-T G.703.

Signal bit rate at the output


interface
Allowed attenuation at the
input interface
Allowed frequency deviation
at the input interface
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Complies with ITU-T G.823.

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Nominal bit rate

139264 kbit/s

155520 kbit/s

Input jitter tolerance

Complies with ITU-T G.


823.

Complies with ITU-T G.825.

Anti-interference capability at
the input interface

Reflection attenuation at the


input/output interface

Complies with ITU-T G.703.

Output jitter

Complies with ITU-T G.823 and G.824.

Mapping jitter

Complies with ITU-T G.


783.

Complies with ITU-T G.


751.

Combined jitter
Jitter transfer function

Mechanical Specifications
The mechanical specifications of the MU04 are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.4

Power Consumption
The maximum power consumption of the MU04 at room temperature (25C) is 2 W.

11.17 DM12
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the DM12 (DDN service interface board).

11.17.1 Version Description


The DM12 is available in one functional version, namely, N1.

11.17.2 Application
The DM12 is a DDN service interface board. The DM12 can be used on the OptiX OSN
equipment series to transmit and receive electrical signals of the DDN service.

11.17.3 Functions and Features


The DM12 receives and transmits four channels of Nx64 kbit/s signals and eight channels of
framed E1 electrical signals. The DM12 must work with the DX1.

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11.17.4 Working Principle and Signal Flow


The DM12 consists of the interface module, switch matrix module, and power module.
Figure 11-65 shows the functional block diagram of the DM12 by describing how to process
one channel of Nx64 kbit/s or framed E1 electrical signals.
Figure 11-65 Functional block diagram of the DM12
Backplane
Cross-connect board
Nx64 kbit/s/
Framed E1
electrical signal

Switch
matrix
module

Interface
module

Nx64 kbit/s/
Framed E1
electrical signal

+3.3 V

Power
module

Fuse

DX1

DX1

+3.3 V backup power

Interface Module
The interface module receives and transmits the Nx64 kbit/s or framed E1 electrical signals.

Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the DX1. When the TPS is performed, the switch matrix module
transmits the signal to the protection DX1 for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

Power Module
The power module provides all the modules of the DM12 with the required DC voltages.

11.17.5 Front Panel


The front panel of the DM12 has interfaces and a bar code.

Diagram of the Front Panel


Figure 11-66 shows the appearance of the front panel of the DM12.
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Figure 11-66 Front panel of the DM12

DM12

E1(1-8)
DDN1
DDN2
DDN3
DDN4

DM12

Interfaces
The front panel of the DM12 has DB44 and DB28 interfaces. Table 11-65 describes the types
and usage of the interfaces of the DM12.
Table 11-65 Interfaces of the DM12

Issue 03 (2013-02-20)

Interface

Type of
Interface

Usage

E1 (18)

DB44

Transmits/Receives eight channels of framed E1


signals.

DDN1DDN4

DB28

Transmits/Receives the 1st to the 4th channels of


Nx64 kbit/s signals.

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Table 11-66 provides the pin assignments of the DB44 interface.


Table 11-66 Pin assignments of the DB44 interface
Front View
30

15

Pin

Usage

Pin

Usage

30

Transmits the
1st channel of
signals (T1).

Transmits the 8th


channel of signals
(T8).

Transmits the
2nd channel of
signals (T2).

36

Transmits the
3rd channel of
signals (T3).

35

Transmits the
4th channel of
signals (T4).

34

Transmits the
5th channel of
signals (T5).

33

Transmits the
6th channel of
signals (T6).

32

Transmits the
7th channel of
signals (T7).

31

Receives the 1st


channel of
signals (R1).

4439 and
61

15

44

29
14
28
13
27
31
16

12
26
11
25
10
24
9
38
23
37
22

21

20

19

18

17

16

Receives the 3rd


channel of signals
(R3).
Receives the 4th
channel of signals
(R4).
Receives the 5th
channel of signals
(R5).
Receives the 6th
channel of signals
(R6).
Receives the 7th
channel of signals
(R7).
Receives the 8th
channel of signals
(R8).
Grounding

Receives the
2nd channel of
signals (R2).

Table 11-67 provides the pin assignments of the DB28 interface.

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Table 11-67 Pin assignments of the DB28 interface


Front View
28

Pin

Usage

Pin

Usage

Transmits data
signals.

19

Receives data signals.

Transmits
clock signals.

21

Grounding

22

Receives the
loopback control
signal.

Detects the
carrier.

23

Permits the
transmission.

Requests for
transmission.

25

Receives the
clock to be used
in the transmit
direction from
the external
equipment.

27

Receives clock
signals.

2
3
4

11
12
1

13
14
15
16

17
18

20

24

26

28

Receives the DCE


ready signal.
Transmits the DTE
ready signal.

11.17.6 Valid Slots


The DM12 can be installed in slots 1926 and 2936 in the subrack and works as the interface
board of the DX1.
Table 11-68 lists the slots valid for the DX1 and the corresponding slots for the DM12. The
DM12 installed in the slot with a smaller number transmits/receives eight channels of framed
E1 signals and four channels of Nx64 kbit/s signals. The DM12 installed in the slot with a larger
number transmits/receives only four channels of Nx64 kbit/s signals.
Table 11-68 Slots valid for the DX1 and the corresponding slots for the DM12

Issue 03 (2013-02-20)

Slot Valid for the DX1

Corresponding Slot for the DM12

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30
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Slot Valid for the DX1

Corresponding Slot for the DM12

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

11.17.7 Technical Specifications


The technical specifications of the DM12 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


Table 11-69 lists the parameters specified for the electrical interfaces of the DM12.
Table 11-69 Parameters specified for the electrical interfaces of the DM12
Interface Type

Description of the Interface

Specification of the Interface

Framed E1
interface (DB44)

Framed E1 signals

The physical and electrical


characteristics of the interface
comply with ITU-T G.703. The
frame structure of the interface
complies with ITU-T G.704.

NX64 kbit/s
interface (DB28)

V.35 interface

Complies with ITU-T V.35.

V.24 interface

Complies with ITU-T V.24.

X.21 interface

Complies with ITU-T X.21.

RS-449 interface

Complies with EIA RS-449


(RS-423A and RS-422A).

RS-530 interface

Complies with EIA RS-530.

RS-530A interface

Complies with EIA RS-530A.

Mechanical Specifications
The mechanical specifications of the DM12 are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.4

Power Consumption
At room temperature (25C), the maximum power consumption of the DM12 is 0 W.
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11.18 TSB4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TSB4 (4-channel electrical interface protection switching board).

11.18.1 Version Description


The TSB4 is available in one functional version, namely, N1.

11.18.2 Application
The TSB4 is a PDH electrical interface protection switching board. The TSB4 can be used on
the OptiX OSN equipment series to realize the TPS protection on the PDH board.

11.18.3 Functions and Features


The TSB4 is used to provide the TPS protection.
The TSB4 can work with the MU04, C34S, or EU04 to realize the TPS protection on different
processing boards.
l

The TSB4 can work with the MU04 to realize the TPS protection on the SPQ4.

The TSB4 can work with the C34S to realize the TPS protection on the PL3.

The TSB4 can work with the EU04 to realize the TPS protection on the SEP.

11.18.4 Working Principle and Signal Flow


The TSB4 consists of the switch matrix module and power module.
Figure 11-67 shows the functional block diagram of the TSB4.
Figure 11-67 Functional block diagram of the TSB4
Backplane

Backplane
Cross-connect board

Interface board 1
Interface board 2

Standby processing board

Interface board 3
Switch matrix
module
+3.3 V

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Power
module

Fuse

+3.3 V backup power

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Switch Matrix Module


In the receive direction, the switch matrix module selects signals from one of the three interface
boards according to the TPS protection control signal sent from the cross-connect board, and
transmits the signals to the standby processing board.
In the transmit direction, the switch matrix module performs the reverse process.

Power Module
The power module provides all the modules of the TSB4 with the required DC voltages.

11.18.5 Front Panel


The front panel of the TSB4 has a bar code.

Diagram of the Front Panel


Figure 11-68 shows the appearance of the front panel of the TSB4.
Figure 11-68 Front panel of the TSB4

TSB4

TSB4

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11.18.6 Valid Slots


When the TSB4 works with different processing boards and interface boards to realize the TPS
protection, the TSB4 can be installed in different slots.
The TSB4 can be installed in slots 19 and 35 in the main subrack.
Table 11-70 lists the slots valid for the TSB4 and the corresponding slots for the SPQ4 and
MU04.
Table 11-70 Slots valid for the TSB4 and the corresponding slots for the SPQ4 and MU04
Slot Valid for the TSB4

Slot Valid for the SPQ4

Corresponding Slot for the


MU04

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 35

Table 11-71 lists the slots valid for the TSB4 and the corresponding slots for the SEP1 and
EU04.
Table 11-71 Slots valid for the TSB4 and the corresponding slots for the SEP1 and EU04
Slot Valid for the TSB4

Slot Valid for the SEP1

Corresponding Slot for


the EU04

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 6

Slot 29

Slot 13

Slot 31

Slot 14

Slot 33

Slot 35

NOTE

The SEP1 is displayed as SEP or SEP1 on the U2000. When the interfaces are available on the front panel
of the SEP1, the SEP1 is displayed as SEP1 on the U2000. When the SEP1 works with the interface board
to realize the TPS protection, the SEP1 is displayed as SEP on the U2000.

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Table 11-72 lists the slots valid for the TSB4 and the corresponding slots for the PL3 and C34S.
Table 11-72 Slots valid for the TSB4 and the corresponding slots for the PL3 and C34S
Slot Valid for the TSB4

Slot Valid for the PL3

Corresponding Slot for


the C34S

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 35

11.18.7 Technical Specifications


The technical specifications of the TSB4 include the mechanical specifications and power
consumption.

Mechanical Specifications
The mechanical specifications of the TSB4 are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.3

Power Consumption
The maximum power consumption of the TSB4 at room temperature (25C) is 3 W.

11.19 TSB8
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TSB8 (8-channel electrical interface protection switching board).

11.19.1 Version Description


The TSB8 is available in one functional version, namely, N1.

11.19.2 Application
The TSB8 is a PDH electrical interface protection switching board. The TSB8 can be used on
the OptiX OSN equipment series to realize the TPS protection on the PDH board.

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11.19.3 Functions and Features


The TSB8 is used to provide the TPS protection.
The TSB8 can work with the C34S, EU04, EU08, ETS8, MU04 and D34S to realize the TPS
protection on different processing boards.
l

The TSB8 can work with the MU04 to realize the TPS protection on the SPQ4.

The TSB8 can work with the C34S to realize the TPS protection on the PL3.

The TSB8 can work with the D34S to realize the TPS protection on the PD3.

The TSB8 can work with the D34S to realize the TPS protection on the PQ3.

The TSB8 can work with the EU04 to realize the TPS protection on the SEP1.

The TSB8 can work with the EU08 to realize the TPS protection on the SLH1/SEP1.

The TSB8 can work with the ETS8 to realize the TPS protection on the EFS0.

The TSB8 can work with the ETS8 to realize the TPS protection on the EFS0A.

11.19.4 Working Principle and Signal Flow


The TSB8 consists of the switch matrix module and power module.
Figure 11-69 shows the functional block diagram of the TSB8 by describing how to process
one channel of signals.
Figure 11-69 Functional block diagram of the TSB8
Backplane

Backplane
Cross-connect board

Interface board 1
Interface board 2

Standby processing board

Interface board 3
Switch matrix
module
+3.3 V

Power
module

Fuse

+3.3 V backup power

Switch Matrix Module


In the receive direction, the switch matrix module selects signals from one of the three interface
boards according to the TPS protection control signal sent from the cross-connect board, and
transmits the signals to the standby processing board.
In the transmit direction, the switch matrix module performs the reverse process.
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Power Module
The power module provides all the modules of the TSB8 with the required DC voltages.

11.19.5 Front Panel


The front panel of the TSB8 has a bar code.

Diagram of the Front Panel


Figure 11-70 shows the appearance of the front panel of the TSB8.
Figure 11-70 Front panel of the TSB8

TSB8

TSB8

11.19.6 Valid Slots


The TSB8 can be installed in slots 19, 20, 35, and 36 in the main subrack.
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Table 11-73 lists the slots valid for the TSB8 and the corresponding slots for the SPQ4 and
MU04.
Table 11-73 Slots valid for the TSB8 and the corresponding slots for the SPQ4 and MU04
Slot Valid for the TSB8

Slot Valid for the SPQ4

Corresponding Slot for the


MU04

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 35

Table 11-74 lists the slots valid for the TSB8 and the corresponding slots for the PL3 and C34S.
Table 11-74 Slots valid for the TSB8 and the corresponding slots for the PL3 and C34S
Slot Valid for the TSB8

Slot Valid for the PL3

Corresponding Slot for


the C34S

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 35

Table 11-75 lists the slots valid for the TSB8 and the corresponding slots for the PD3 and D34S.
Table 11-75 Slots valid for the TSB8 and the corresponding slots for the PD3 and D34S
Slot Valid for the TSB8

Slot Valid for the PD3

Corresponding Slot for


the D34S

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 35
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Slot Valid for the TSB8

11 PDH Boards

Slot Valid for the PD3

Corresponding Slot for


the D34S

Slot 14

Slot 31

Slot 15

Slot 33

Table 11-76 lists the slots valid for the TSB8 and the corresponding slots for the PQ3 and D34S.
Table 11-76 Slots valid for the TSB8 and the corresponding slots for the PQ3 and D34S
Slot Valid for the TSB8

Slot Valid for the PQ3

Corresponding Slot for the


D34S

Slots 19 and 20

Slots 25

Slots 2126

Slots 35 and 36

Slots 1316

Slots 2934

Table 11-77 lists the slots valid for the TSB8 and the corresponding slots for the SEP1 and
EU04.
Table 11-77 Slots valid for the TSB8 and the corresponding slots for the SEP1 and EU04
Slot Valid for the TSB8

Slot Valid for the SEP1

Corresponding Slot for


the EU04

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 35

Table 11-78 lists the slots valid for the TSB8 and the corresponding slots for the SEP1 and
EU08.
Table 11-78 Slots valid for the TSB8 and the corresponding slots for the SEP1 and EU08

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Slot Valid for the TSB8

Slot Valid for the SEP1

Corresponding Slot for


the EU08

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

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Slot Valid for the TSB8

Slot 35

11 PDH Boards

Slot Valid for the SEP1

Corresponding Slot for


the EU08

Slot 5

Slot 25

Slot 6

Slot 29

Slot 13

Slot 31

Slot 14

Slot 33

Table 11-79 lists the slots valid for the TSB8 and the corresponding slots for the SLH1 and
EU08.
Table 11-79 Slots valid for the TSB8 and the corresponding slots for the SLH1 and EU08
Slot Valid for the TSB8

Slot Valid for the SLH1

Corresponding Slot for


the EU08

Slot 19 and 20

Slot 3

Slot 21 and 22

Slot 4

Slot 23 and 24

Slot 5

Slot 25 and 26

Slot 6

Slot 29 and 30

Slot 13

Slot 31 and 32

Slot 14

Slot 33 and 34

Slot 35 and 36

NOTE

The SEP1 is displayed as SEP or SEP1 on the U2000. When the interfaces are available on the front panel
of the SEP1, the SEP1 is displayed as SEP1 on the U2000. When the SEP1 works with the interface board
to realize the TPS protection, the SEP1 is displayed as SEP on the U2000.

Table 11-80 lists the slots valid for the TSB8 and the corresponding slots for the EFS0 and
ETS8.
Table 11-80 Slots valid for the TSB8 and the corresponding slots for the EFS0 and ETS8
Slot Valid for the TSB8

Slot Valid for the EFS0

Corresponding Slot for


the ETS8

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 6

Slot 29

Slot 13

Slot 31

Slot 35

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Slot Valid for the TSB8

11 PDH Boards

Slot Valid for the EFS0

Corresponding Slot for


the ETS8

Slot 14

Slot 33

Table 11-81 lists the slots valid for the TSB8 and the corresponding slots for the EFS0A and
ETS8.
Table 11-81 Slots valid for the TSB8 and the corresponding slots for the EFS0A and ETS8
Slot Valid for the TSB8

Slot Valid for the EFS0A

Corresponding Slot for


the ETS8

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 6

Slot 29

Slot 13

Slot 31

Slot 14

Slot 33

Slot 35

11.19.7 Technical Specifications


The technical specifications of the TSB8 include the mechanical specifications and power
consumption.

Mechanical Specifications
The mechanical specifications of the TSB8 are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.3

Power Consumption
At room temperature (25C), the maximum power consumption of the TSB8 is 0 W.

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12

EoS Boards

About This Chapter


The EoS boards include the interface boards and processing boards for FE and GE services.
12.1 EFT8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFT8 (8xFE/16xFE transparent transmission board). This topic
also describes how to configure and commission the EFT8.
12.2 EFT8A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFT8A (8xFE transparent transmission board). This topic also
describes how to configure and commission the EFT8A.
12.3 EGT2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGT2 (2xGE transparent transmission board). This topic also
describes how to configure and commission the EGT2.
12.4 EFS0
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFS0 (8xFE switching and processing board). This topic also
describes how to configure and commission the EFS0.
12.5 EFS0A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFS0A (16xFE switching and processing board). This topic also
describes how to configure and commission the EFS0A.
12.6 EFS4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFS4 (4xFE switching and processing board). This topic also
describes how to configure and commission the EFS4.
12.7 EGS2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGS2 (2xGE switching and processing board). This topic also
describes how to configure and commission the EGS2.
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12.8 EMS2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EMS2 (2xGE and 16xFE switching and processing board). This
topic also describes how to configure and commission the EMS2.
12.9 EMS4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EMS4 (4xGE and 16xFE switching and processing board). This
topic also describes how to configure and commission the EMS4.
12.10 EGS4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGS4 (4xGE switching and processing board). This topic also
describes how to configure and commission the EGS4.
12.11 EAS2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EAS2 (2-port 10xGE switching and processing board). This topic
also describes how to configure and commission the EAS2.
12.12 EFF8
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the EFF8 (8x100M Ethernet optical interface board).
12.13 EFF8A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the EFF8A (8x100M Ethernet optical interface board).
12.14 ETF8
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the ETF8 (8x100M Ethernet twisted pair interface board).
12.15 ETF8A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the ETF8A (8x100M Ethernet twisted pair interface board).
12.16 ETS8
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the ETS8 (8x10/100M Ethernet twisted pair interface switching
board).

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12.1 EFT8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFT8 (8xFE/16xFE transparent transmission board). This topic
also describes how to configure and commission the EFT8.

12.1.1 Version Description


The EFT8 is available in the following functional version: N1.

12.1.2 Application
The EFT8 is used to transmit/receive Ethernet services, manage bandwidths, and converge
Ethernet services.
Figure 12-1 shows the typical networking and application of the Ethernet transparent
transmission board. The Ethernet transparent transmission board realizes point-to-point
transparent transmission of Ethernet services. The Ethernet transparent transmission board
provides the following functions by using the interfaces on the board: data receipt, data
transmission, data mapping, and traffic control. In addition, the Ethernet transparent
transmission board performs port-based point-to-point transparent transmission, encapsulation/
decapsulation, overhead bytes and pointers processing, virtual concatenation, SDH mapping/
demapping, and LCAS function.
Figure 12-1 Networking and application of the Ethernet transparent transmission board

NMS

User A2
NE1

PORT 1
NE2

MSP ring

PORT 2

NE4

NE3

User B2

Service flow
Line board

PORT 1

PORT 2

Data board
Cross-connect and
timing board

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User B1

User A1

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12.1.3 Functions and Features


The EFT8 supports the transparent transmission of Ethernet services, LCAS function, and test
frames.
Table 12-1 provides the functions and features of the EFT8.
Table 12-1 Functions and features of the EFT8
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Transparently transmits 8xFE or 16xFE services.

Interfa
ce
types

l Supports 10BASE-T/100BASE-TX signals. The electrical ports comply with


IEEE 802.3u.
l Supports 10BASE-T/100BASE-TX signals when the EFT8 is used with the
ETF8.
l Supports 100BASE-FX/100BASE-LX signals when the EFT8 is used with the
EFF8. The optical interfaces comply with IEEE 802.3u.

Functi
ons
when
being
used
with
an
interfa
ce
board

l Receives/Transmits 16 Ethernet signals through the electrical interface when the


EFT8 is used with the ETF8.

Interfa
ce
charac
teristic
s

Working
modes

100M full-duplex, 10M full-duplex, auto-negotiation

Traffic
control at
ports

Auto-negotiation mode

Not supported

Non-autonegotiation mode

Supported

l Receives/Transmits 8 Ethernet optical signals and 8 Ethernet electrical signals


when the EFT8 is used with the EFF8.

Query/
Supported
Setting of
port
status
Query of
interface
types

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Supported

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Funct
ion
and
Featu
re

12 EoS Boards

Description

Setting of Not supported


optical
power
threshold
s
Pluggabl
e optical
module

Issue 03 (2013-02-20)

Not supported

EPL
servic
e

Supports the PORT-based transparent transmission.

Servic
e
specifi
cation
s

Formats
of
Ethernet
data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1q TAG

Supported

Frame
length
range

l Supports the setting of the packet length, which ranges from 1518
bytes to 1535 bytes. Ports 1-4 and 9-12 on the board support a jumbo
frame with a maximum length of 6144 bytes, whereas ports 5-8 and
13-16 support a jumbo frame with a maximum length of 9600 bytes.

Bound
bandwidt
h

24xVC-3, or 126xVC-12 + 18xVC-3

Mapping
granularit
ies

Supports VC-12, VC-3, VC-12-Xv (X 63), and VC-3-Xv (X 3)


granularities.

Encapsul
ation
formats

HDLC

Supported

LAPS

Supported

GFP-F

Supported

MPLS
technolo
gy

Does not support the MPLS.

VLAN
technolo
gy

Supports VLAN transparent transmission.

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Funct
ion
and
Featu
re

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Description

Maximu
m uplink
bandwidt
h

The maximum uplink bandwidth is 1.25 Gbit/s. The EFT8 can adapt to
the bandwidth of the slot.

VCTRU
NK
specificat
ions

Number of supported VCTRUNKs: 16


Configuration principles are as follows:
l A VCTRUNK can be bound with the VC-12 path or VC-3 path at
one time. A VCTRUNK should not be bound with VC-12 and VC-3
paths at the same time.
l A VCTRUNK can be bound with a maximum of three VC-3s or a
maximum of 63 VC-12s.
l VCTRUNK 1-VCTRUNK 8 can be bound with VC-3s 1-12 or
VC-12s 1-63.
l VCTRUNK 9-VCTRUNK 16 can be bound with VC-3s 13-24 or
VC-12s 64-126.
l A VCTRUNK cannot be bound with VC-12s numbered 1-63 and
VC-3s numbered 10-12 at the same time. In addition, a VCTRUNK
cannot be bound with VC-12s numbered 64-126 and VC-3s
numbered 22-24 at the same time.
l VC-4s numbered 4 and 8 support the binding of VC-3 and VC-12
paths. The other VC-4s support the binding of VC-3 paths only.
l In the case of the configuration of cross-connection, VC-12s
numbered 163 should be configured into the fourth VC-4, and
VC-12s numbered 64126 should be configured into the eighth
VC-4.

Protec
tion
schem
es

Issue 03 (2013-02-20)

TPS

Not supported

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports P2P LPT, which comply with ITU-T G.7042.

LAG

Not supported

Clock
synchr
onizati
on

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Not supported

Maint
enanc

ETH
OAM

Does not support the ETH OAM function.

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Funct
ion
and
Featu
re

Description

e
featur
es

Test
Frame

Supports test frames in GFP bearer mode.

Response
to ping

Not supported

Port
mirroring

Does not support the port mirroring function.

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Inloops

MAC layer at Ethernet ports

Inloops

VC-4 level

Not supported

VC-3 level

Inloops and outloops

VC-12 level

Not supported

RMON

Supports Ethernet performance monitoring at the port level.

Warm
resets

Supported

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

QoS

Does not support the QoS function.

Traffi
c
contro
l

Supports the FE port-based traffic control function that complies with IEEE 802.3x.

12.1.4 Working Principle and Signal Flow


The EFT8 consists of the Ethernet access module, mapping module, interface converting
module, logic and control module, clock module, and power module.
Figure 12-2 shows the functional block diagram of the EFT8 by describing how to process 1xFE
signals.

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Figure 12-2 Functional block diagram of the EFT8


Backplane

FE

Ethernet
access
module

Cross-connect unit

ENCP

Interface
converting
module

VCP
DENCP

Cross-connect unit

Mapping module
Laser
shutdown

LOS

Logic and
control module

Communication
Reference clock and frame header

+3.3 V
Clock module
50 77 125 155
MHz MHz MHz MHz

Power
module

ENCP: data encapsulation module

Power
module

SCC unit
SCC unit
Fuse

-48 V/-60 V
-48 V/-60 V

+3.3 V

+3.3 V backup power

Fuse

DENCP: decapsulation module

VCP: virtual concatenation processing module

Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or routers
are converted into electrical signals. If the signals are accessed through electrical interfaces, O/
E conversion is not required. At the PHY layer, the electrical signals are decoded and the
ETH_LOS alarm is detected. The electrical signals are converted from serial signals into parallel
signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Mapping Module
The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, HDLC, or
GFP format. The concatenation is performed. Then, the Ethernet signals are converted into SDH
signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

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Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and HDLC
controller. This module is connected to external circuits through the bus. The logic and control
module performs the following functions:
l

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:
l

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

Clock Module
The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.1.5 Front Panel


The front panel of the EFT8 has indicators, interfaces, and a bar code.

Diagram of the Front Panel


Figure 12-3 shows the appearance of the front panel of the EFT8.

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Figure 12-3 Front panel of the EFT8

EFT8
STAT
ACT
PROG
SRV
FE1

FE2

FE3

FE4

FE5

FE6

FE7

FE8

EFT8

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 24 Indicators.

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Interfaces
The front panel of the EFT8 has eight FE interfaces. Table 12-2 describes the types and usage
of the interfaces of the EFT8. For information about the cables connected to the interfaces, see
23.4.6 Straight-Through Cable and 23.4.7 Crossover Cable.
Table 12-2 Interfaces of the EFT8
Interface

Type of
Interface

Usage

FE1

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE2

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE3

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE4

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE5

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE6

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE7

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE8

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

Table 12-3 describes the pins of the RJ45 connector.


Table 12-3 Pins of the RJ45 connector

Issue 03 (2013-02-20)

Pin

Description

Positive data transmit end

Negative data transmit end

Positive data receive end

Grounding

Grounding

Negative data receive end

Grounding

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Pin

Description

Grounding

12 EoS Boards

12.1.6 Jumpers and DIP Switches


The EFT8 does not have any jumpers or DIP switches that are used for board settings.
NOTE

The daughter board of the EFT8 has only one push-button switch, which is used for resetting the EFT8.
When the EFT8 operates normally, do not push the switch. Otherwise, a cold reset is performed on the
EFT8 and the services may be lost.

12.1.7 Valid Slots


The EFT8 must be installed in a valid slot in the subrack. Otherwise, the EFT8 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the EFT8 vary with the cross-connect capacity of the subrack and whether
the EFT8 works with an interface board.
The slots valid for the EFT8 are as follows:
l

When the EFT8 does not work with an interface board:


The EFT8 can be installed in slots 16 and 1316. In this case, the bandwidth is 622 Mbit/
s.

When the EFT8 works with an interface board:


When the cross-connect capacity is 200 Gbit/s, the EFT8 can be installed in slots 25
and 1316. In this case, the bandwidth is 1.25 Gbit/s.

12.1.8 Feature Code


The EFT8 does not have the feature code.

12.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
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l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring EPL Services on Ethernet
Transparent Transmission Board.
Step 3 Required: Set the Ethernet interface.
l Set the overhead byte as follows:
J1/J2 byte: The setting of the J1/J2 byte on the interconnected equipment must be
consistent. Generally, use the default value. The default mode of the J1/J2 to be sent is
16-Byte CRC Mode and the default value of the J1/J2 to be sent is HuaWei SBS ; the
default mode of the J1/J2 to be received is Single-Byte Mode and the default value of
the J1/J2 to be received is 0x00.
l Set the Ethernet interface as follows:
Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.
Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of
traffic, services may be completely interrupted.
For details, see 28.7 Checking Board Parameters.
NOTE

For more information about the parameters of the board, see 27.4.2 Ethernet Parameters.

Step 4 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End
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Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

12.1.10 Configuring the Board Functions


The EFT8 supports multiple Ethernet functions and features such as LCAS and LPT. Configure
the functions according to actual requirements.
You can configure the following Ethernet functions for the EFT8 by using the U2000:
l

LCAS

LPT

Test Frame

12.1.11 Parameter Settings


You can set parameters for the EFT8 by using the U2000.
You can set the following main parameters for the EFT8 by using the U2000:
l

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

12.1.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 12-4 lists the faults that occur on the EFT8 frequently and the troubleshooting methods.

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Table 12-4 Methods used to troubleshoot the faults that occur on the EFT8 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on a single


Ethernet port are interrupted.
l The services on all the Ethernet
ports are interrupted.
Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The services on a single


Ethernet port are transiently
interrupted.
l The protocol becomes
abnormal.
l The negotiated working mode
of the Ethernet ports is the halfduplex mode.

Packet loss

See Troubleshooting Service


Packet Loss.

l Bit errors occur on the line side.


Interconnection
fault

l The interconnection fault


occurs on a single Ethernet port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCG port.
l The LCAS interconnection
fault occurs.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EFT8, see Replacing an EOS Board.

12.1.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

12.1.13.1 Alarms of N1EFT8

Issue 03 (2013-02-20)

ALM_GFP_dLFD

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BDID_ERROR

BIP_EXC

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BIP_SD

BOOTROM_BAD

COMMUN_FAIL

ETH_LOS

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

FCS_ERR

FPGA_ABN

HARD_BAD

HP_LOM

LCAS_BAND_DECREASED

LASER_MOD_ERR

LCAS_PLCR

LCAS_FOPR

LCAS_FOPT

LCAS_TLCT

LCAS_PLCT

LCAS_TLCR

LP_RDI_VC3

LOOP_ALM

LP_RDI_VC12

LP_SLM_VC12

LP_REI_VC12

LP_REI_VC3

LP_TIM_VC3

LP_SLM_VC3

LP_TIM_VC12

LP_UNEQ_VC12

LP_UNEQ_VC3

LPT_INEFFECT

LPT_RFI

LSR_NO_FITED

MSSW_DIFFERENT

NO_BD_SOFT

SLAVE_WORKING

SUBCARD_ABN

TEST_STATUS

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_SQM_VC12

VCAT_SQM_VC3

W_R_FAIL

TR_LOC

T_LOSEX

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

ETH_NO_FLOW

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.1.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

12.1.14.1 Performance Events of N1EFT8


Table 12-5 SDH

Issue 03 (2013-02-20)

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

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LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPSES

LPUAS

DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Table 12-6 RMON alarm

Table 12-7 Statistics of RMON basic performance


Multicast Packets Received
(packets)

Undersize Packets
Received(packets)

Oversize Packets Received


(packets)

Fragments(packets)

Packets Received and


Transmitted(64 Octets in
Length)(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets Received(256~511
Octets in Length)(packets)

Packets Received
(512~1023 Octets in
Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

Broadcast Packets Received


(packets)

Table 12-8 Statistics of RMON extended performance

Issue 03 (2013-02-20)

Packets Transmitted(64
Octets in Length)(packets)

Packets Transmitted(65~127
Octets in Length)(packets)

Packets Transmitted
(128~255 Octets in Length)
(packets)

Packets Transmitted
(256~511 Octets in Length)
(packets)

Packets Transmitted
(512~1023 Octets in Length)
(packets)

Packets Transmitted
(1024~1518 Octets in
Length)(packets)

Packets Received and


Transmitted(64 Octets in
Length)(packets)

Packets Received and


Transmitted(65~127 Octets in
Length)(packets)

Packets Received and


Transmitted(128~255
Octets in Length)(packets)

Packets Received and


Transmitted(256~511
Octets in Length)(packets)

Packets Received and


Transmitted(512~1023 Octets
in Length)(packets)

Packets Received and


Transmitted(1024~1518
Octets in Length)(packets)

Unicast Packets Received


(packets)

Unicast Packets Transmitted


(packets)

Pause Frames Received


(frames)

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Pause Frames Transmitted


(frames)

Multicast Packets Transmitted


(packets)

Broadcast Packets
Transmitted(packets)

Good Octets Received


(Byte)

Good Octets Transmitted


(Byte)

Bad Octets Received(Byte)

Bad Octets Transmitted


(Byte)

FCS Errors(frames)

12.1.15 Technical Specifications


The technical specifications of the EFT8 include the Ethernet performance specifications,
mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


Table 12-9 lists the parameters specified for the electrical interfaces of the EFT8.
Table 12-9 Parameters specified for the optical interfaces of the EFT8
Parameter

Value

Nominal bit rate

10 Mbit/s or 100 Mbit/s

Line code pattern

Manchester encoding signal (10M) or MLT-3 encoding signal


(100M)

Specifications of the
interface

Complies with IEEE 802.3u.

Ethernet Performance Specifications


NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EFT8 board of the N1 version.

Figure 12-4 shows the connection for testing the throughput specifications, packet loss ratio in
the case of overloading, and latency specifications of the EFT8.
Figure 12-4 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, and latency specifications
Port 1
Tested
equipment 1

Tested
equipment 2
Port 2

Port 1

Port 2

Data network
performance
analyzer

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Figure 12-5 shows the connection for testing the back-to-back specifications of the EFT8.
Figure 12-5 Connection for testing the back-to-back specifications
Tested
equipment 1

Port 1

Port 2

Data network
performance
analyzer

Table 12-10 lists the throughput specifications of the EFT8. Table 12-11 lists the packet loss
ratio in the case of overloading of the EFT8. Table 12-12 lists the latency specifications of the
EFT8. Table 12-13 lists the back-to-back specifications of the EFT8.
NOTE

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual environment
are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and 63 VC-12s are bound on the FE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-10 lists the throughput specifications of the EFT8. The values are obtained when the
SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

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Table 12-10 Throughput specifications of the EFT8


Frame Size
(Byte)

Passed Rate
(%)

(01,01,01) to
(01,01,02) (pks/
sec)

(01,01,02) to
(01,01,01) (pks/
sec)

Total (pks/
sec)

64

100.00

148810

148810

297620

128

100.00

84459

84459

168918

256

100.00

45290

45290

90580

512

100.00

23496

23496

46992

1024

100.00

11973

11973

23946

1280

100.00

9615

9615

19230

1518

100.00

8127

8127

16254

Table 12-11 lists the packet loss ratio in the case of overloading of the EFT8. The values are
obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

Table 12-11 Packet loss ratio in the case of overloading of the EFT8
Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,01,02) (%)

(01,01,02) to
(01,01,01) (%)

Average (%)

64

100.00

0.000

0.000

0.000

128

100.00

0.000

0.000

0.000

256

100.00

0.000

0.000

0.000

512

100.00

0.000

0.000

0.000

1024

100.00

0.000

0.000

0.000

1280

100.00

0.000

0.000

0.000

1518

100.00

0.000

0.000

0.000

Table 12-12 lists the latency specifications of the EFT8. The values are obtained when the
SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The test duration is set to 60 seconds.

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The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested
equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.

Table 12-12 Latency specifications of the EFT8


Frame
Size
(Byte)

Rate
Tested
(%)

(01,01,01) to
(01,01,02) (us)CT (us)

Average
(CT) (us)

(01,01,01) to
(01,01,02)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

506.4

506.4

501.2

501.2

128

100.00

518.8

518.8

508.5

508.5

256

100.00

536.2

536.2

515.8

515.8

512

100.00

578.9

578.9

538.0

538.0

1024

100.00

653.4

653.4

571.4

571.4

1280

100.00

688.1

688.1

585.6

585.6

1518

100.00

720.6

720.6

599.1

599.1

Table 12-13 lists the back-to-back specifications of the EFT8. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission rate
is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is set to
a value more than 50 on the Smart Application.

The tested traffic is set to the wire speed.

The test duration is set to 10 seconds.

Table 12-13 Back-to-back specifications of the EFT8

Issue 03 (2013-02-20)

Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,01,02) Burst
Size (Number of
Frames)

(01,01,02) to
(01,01,01)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

297620

297620

595240

128

100.00

168918

168918

337836

256

100.00

90580

90580

181160

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Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,01,02) Burst
Size (Number of
Frames)

(01,01,02) to
(01,01,01)
(Number of
Frames)

Total
(Number of
Frames)

512

100.00

46992

46992

93984

1024

100.00

23946

23946

47892

1280

100.00

19230

19230

38460

1518

100.00

16254

16254

32508

Mechanical Specifications
The mechanical specifications of the EFT8 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the EFT8 at room temperature (25C) is 26 W.

12.2 EFT8A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFT8A (8xFE transparent transmission board). This topic also
describes how to configure and commission the EFT8A.

12.2.1 Version Description


The EFT8A is available in the following functional version: N1.

12.2.2 Application
The EFT8A is used to transmit/receive Ethernet services, manage bandwidths, and converge
Ethernet services.
Figure 12-6 shows the typical networking and application of the Ethernet transparent
transmission board. The Ethernet transparent transmission board realizes point-to-point
transparent transmission of Ethernet services. The Ethernet transparent transmission board
provides the following functions by using the interfaces on the board: data receipt, data
transmission, data mapping, and traffic control. In addition, the Ethernet transparent
transmission board performs port-based point-to-point transparent transmission, encapsulation/
decapsulation, overhead bytes and pointers processing, virtual concatenation, SDH mapping/
demapping, and LCAS function.

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Figure 12-6 Networking and application of the Ethernet transparent transmission board

NMS

User A2
NE1

PORT 1
NE2

MSP ring

PORT 2

NE4

NE3

User B2

Service flow
Line board

PORT 1

PORT 2

Data board
Cross-connect and
timing board

User B1

User A1

12.2.3 Functions and Features


The EFT8A supports the transparent transmission of Ethernet services, LCAS function, and test
frames.
Table 12-14 provides the functions and features of the EFT8A.
Table 12-14 Functions and features of the EFT8A

Issue 03 (2013-02-20)

Funct
ion
and
Featu
re

Description

Basic
functi
ons

Transparently transmits 8xFE services.

Interfa
ce
types

l Supports 10BASE-T/100BASE-TX signals.


l The optical interfaces comply with IEEE 802.3u.

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Funct
ion
and
Featu
re

Description

Functi
ons
when
being
used
with
an
interfa
ce
board

Receives/Transmits 8xFE signals by providing interfaces on the front panel.

Interfa
ce
charac
teristic
s

Working
modes

100M full-duplex, 10M full-duplex, and auto-negotiation

Traffic
control at
ports

Auto-negotiation mode

Not supported

Non-autonegotiation mode

Supported

Query/
Supported
Setting of
port
status
Query of
interface
types

Supported

Setting of Not supported


optical
power
threshold
s
Pluggabl
e optical
module

Issue 03 (2013-02-20)

Not supported

EPL
servic
e

Supports the PORT-based transparent transmission.

Servic
e
specifi
cation
s

Formats
of
Ethernet
data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1q TAG

Supported

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Description

Frame
length
range

l Supports the setting of the method used for processing frames with
less than 64 bytes or error frames.

Bound
bandwidt
h

12xVC-3, or 63xVC-12 + 9xVC-3

Mapping
granularit
ies

Supports VC-12, VC-3, VC-12-Xv (X 63), and VC-3-Xv (X 3)


granularities.

Encapsul
ation
formats

HDLC

Supported

LAPS

Supported

GFP-F

Supported

l Supports the setting of the packet length, which ranges from 1518
bytes to 1535 bytes. The first four ports support a jumbo frame with
a maximum length of 6144 bytes, whereas the last four ports support
a jumbo frame with a maximum length of 9600 bytes.

MPLS
technolo
gy

Does not support the MPLS.

VLAN
technolo
gy

Supports VLAN transparent transmission.

Maximu
m uplink
bandwidt
h

622 Mbit/s

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Description

VCTRU
NK
specificat
ions

Number of supported VCTRUNKs: 8


Configuration principles are as follows:
l A VCTRUNK can be bound with the VC-12 path or VC-3 path at
one time. A VCTRUNK should not be bound with VC-12 and VC-3
paths at the same time.
l A VCTRUNK can be bound with a maximum of three VC-3s or a
maximum of 63 VC-12s.
l A VCTRUNK cannot be bound with VC-12s numbered 163 and
VC-3s numbered 1012 at the same time.
l VC-4 numbered 4 supports the binding of VC-3 and VC-12 paths.
The other VC-4s support the binding of VC-3 paths only.
l VCTRUNK 1VCTRUNK 8 can be bound with VC-3s numbered
112 or VC-12s numbered 163.

TPS

Not supported

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports P2P LPT in compliance with ITU-T G.7042.

LAG

Not supported

Clock
synchr
onizati
on

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Not supported

Maint
enanc
e
featur
es

ETH
OAM

Not supported

Test
Frame

Supports test frames in GFP bearer mode.

Response
to ping

Not supported

Port
mirroring

Does not support the port mirroring function.

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Inloops

MAC layer at Ethernet ports

Inloops

VC-4 level

Not supported

Protec
tion
schem
es

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Funct
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Featu
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12 EoS Boards

Description

VC-3 level

Inloops and outloops

VC-12 level

Not supported

RMON

Supports Ethernet performance monitoring at the port level.

Warm
resets

Supported

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

QoS

Does not support the QoS function.

Traffi
c
contro
l

Supports the FE interface-based traffic control function that complies with IEEE
802.3x.

12.2.4 Working Principle and Signal Flow


The EFT8A consists of the Ethernet access module, mapping module, interface converting
module, logic and control module, clock module, and power module.
Figure 12-7 shows the functional block diagram of the EFT8A by describing how to process
1xFE signals.

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Figure 12-7 Functional block diagram of the EFT8A


Backplane

FE

Ethernet
access
module

ENCP

Interface
converting
module

VCP
DENCP

Cross-connect unit
Cross-connect unit

Mapping module
LOS
Logic and
control module

Communication
Reference clock and frame header

+3.3 V
Clock
module

Power
module

Power
module

Fuse

-48 V/-60 V
-48 V/-60 V

+3.3 V
Fuse

50 77 125 155
MHz MHz MHz MHz

SCC unit
SCC unit

+3.3 V backup power

ENCP: data encapsulation module

DENCP: decapsulation module

VCP: virtual concatenation processing module

Ethernet Access Module


In the receive direction, the Ethernet access module receives the Ethernet electrical signals from
Ethernet equipment such as switches or routers. At the PHY layer, the electrical signals are
decoded and the ETH_LOS alarm is detected. The electrical signals are converted from serial
signals into parallel signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY layer,
signals are encoded.

Mapping Module
The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, HDLC, or
GFP format. The concatenation is performed. Then, the Ethernet signals are converted into SDH
signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.
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Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and HDLC
controller. This module is connected to external circuits through the bus. The logic and control
module performs the following functions:
l

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:
l

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Implements communication.

Controls indicators.

Clock Module
The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.2.5 Front Panel


The front panel of the EFT8A has indicators, interfaces, and a bar code.

Diagram of the Front Panel


Figure 12-8 shows the appearance of the front panel of the EFT8A.

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Figure 12-8 Front panel of the EFT8A

EFT8A
STAT
ACT
PROG
SRV
FE1

FE2

FE3

FE4

FE5

FE6

FE7

FE8

EFT8A

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 24 Indicators.

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Interfaces
The front panel of the EFT8A has eight FE interfaces. Table 12-15 describes the types and usage
of the interfaces of the EFT8A. For information about the cables connected to the interfaces, see
23.4.6 Straight-Through Cable and 23.4.7 Crossover Cable.
Table 12-15 Interfaces of the EFT8A
Interface

Type of
Interface

Usage

FE1

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE2

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE3

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE4

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE5

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE6

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE7

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE8

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

Table 12-16 describes the pins of the RJ45 connector.


Table 12-16 Pins of the RJ45 connector

Issue 03 (2013-02-20)

Pin

Description

Positive data transmit end

Negative data transmit end

Positive data receive end

Grounding

Grounding

Negative data receive end

Grounding

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Pin

Description

Grounding

12 EoS Boards

12.2.6 Jumpers and DIP Switches


The EFT8A does not have any jumpers or DIP switches that are used for board settings.
NOTE

The daughter board of the EFT8A has only one push-button switch, which is used for resetting the EFT8A.
When the EFT8A operates normally, do not push the switch. Otherwise, a cold reset is performed on the
EFT8A and the services may be lost.

12.2.7 Valid Slots


The EFT8A must be installed in a valid slot in the subrack. Otherwise, the EFT8A cannot work
normally.
The EFT8A can be installed in slots 18 and 1116 in the subrack. In this case, the bandwidth
is 622 Mbit/s.

12.2.8 Feature Code


The EFT8A does not have the feature code.

12.2.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End
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Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring EPL Services on Ethernet
Transparent Transmission Board.
Step 3 Required: Set the Ethernet interface.
l Set the overhead byte as follows:
J1/J2 byte: The setting of the J1/J2 byte on the interconnected equipment must be
consistent. Generally, use the default value. The default mode of the J1/J2 to be sent is
16-Byte CRC Mode and the default value of the J1/J2 to be sent is HuaWei SBS ; the
default mode of the J1/J2 to be received is Single-Byte Mode and the default value of
the J1/J2 to be received is 0x00.
l Set the Ethernet interface as follows:
Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.
Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of
traffic, services may be completely interrupted.
For details, see 28.7 Checking Board Parameters.
NOTE

For more information about the parameters of the board, see 27.4.2 Ethernet Parameters.

Step 4 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

12.2.10 Configuring the Board Functions


The EFT8A supports multiple Ethernet functions and features such as LCAS and LPT. Configure
the functions according to actual requirements.
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You can configure the following Ethernet functions for the EFT8A by using the U2000:
l

LCAS

LPT

Test Frame

12.2.11 Parameter Settings


You can set parameters for the EFT8A by using the U2000.
You can set the following main parameters for the EFT8A by using the U2000:
l

Working mode

LCAS

Maximum frame length

Mapping protocol

Byte packet

CRC error frame

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

12.2.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 12-17 lists the faults that occur on the EFT8A frequently and the troubleshooting methods.
Table 12-17 Methods used to troubleshoot the faults that occur on the EFT8A frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on a single


Ethernet port are interrupted.
l The services on all the Ethernet
ports are interrupted.
Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The services on a single


Ethernet port are transiently
interrupted.
l The protocol becomes
abnormal.
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Fault Symptom

Common Fault Cause

Troubleshooting Method

Packet loss

l The negotiated working mode


of the Ethernet ports is the halfduplex mode.

See Troubleshooting Service


Packet Loss.

l Bit errors occur on the line side.


Interconnection
fault

l The interconnection fault


occurs on a single Ethernet port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCG port.
l The LCAS interconnection
fault occurs.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EFT8A, see Replacing an EOS Board.

12.2.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

12.2.13.1 Alarms of N1EFT8A

Issue 03 (2013-02-20)

ALM_GFP_dLFD

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BDID_ERROR

BIP_EXC

BIP_SD

BOOTROM_BAD

COMMUN_FAIL

ETH_LOS

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNFL
CT

FCS_ERR

FPGA_ABN

HARD_BAD

HP_LOM

LCAS_BAND_DECREASED

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

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LP_UNEQ_VC3

LPT_INEFFECT

LPT_RFI

NO_BD_SOFT

SLAVE_WORKING

TEST_STATUS

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_SQM_VC12

VCAT_SQM_VC3

W_R_FAIL

TR_LOC

T_LOSEX

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

ETH_NO_FLOW

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.2.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

12.2.14.1 Performance Events of N1EFT8A


Table 12-18 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPSES

LPUAS

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPSES

LPUAS

Table 12-19 SDH

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Table 12-20 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Table 12-21 Statistics of RMON basic performance


Multicast Packets Received
(packets)

Undersize Packets
Received(packets)

Oversize Packets Received


(packets)

Fragments(packets)

Packets Received and


Transmitted(64 Octets in
Length)(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets Received(256~511
Octets in Length)(packets)

Packets Received
(512~1023 Octets in
Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

Broadcast Packets Received


(packets)

Table 12-22 Statistics of RMON extended performance

Issue 03 (2013-02-20)

Packets Transmitted(64
Octets in Length)(packets)

Packets Transmitted(65~127
Octets in Length)(packets)

Packets Transmitted
(128~255 Octets in Length)
(packets)

Packets Transmitted
(256~511 Octets in Length)
(packets)

Packets Transmitted
(512~1023 Octets in Length)
(packets)

Packets Transmitted
(1024~1518 Octets in
Length)(packets)

Packets Received and


Transmitted(64 Octets in
Length)(packets)

Packets Received and


Transmitted(65~127 Octets in
Length)(packets)

Packets Received and


Transmitted(128~255
Octets in Length)(packets)

Packets Received and


Transmitted(256~511
Octets in Length)(packets)

Packets Received and


Transmitted(512~1023 Octets
in Length)(packets)

Packets Received and


Transmitted(1024~1518
Octets in Length)(packets)

Unicast Packets Received


(packets)

Unicast Packets Transmitted


(packets)

Pause Frames Received


(frames)

Pause Frames Transmitted


(frames)

Multicast Packets Transmitted


(packets)

Broadcast Packets
Transmitted(packets)

Good Octets Received


(Byte)

Good Octets Transmitted


(Byte)

Bad Octets Received(Byte)

Bad Octets Transmitted


(Byte)

FCS Errors(frames)

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12.2.15 Technical Specifications


The technical specifications of the EFT8A include the Ethernet performance specifications,
mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


Table 12-23 lists the parameters specified for the electrical interfaces of the EFT8A.
Table 12-23 Parameters specified for the optical interfaces of the EFT8A
Parameter

Value

Nominal bit rate

10 Mbit/s or 100 Mbit/s

Line code pattern

Manchester encoding signal (10M) or MLT-3 encoding signal


(100M)

Specifications of the
interface

Complies with IEEE 802.3u.

Ethernet Performance Specifications


NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EFT8A board of the N1 version.

Figure 12-9 shows the connection for testing the throughput specifications, packet loss ratio in
the case of overloading, and latency specifications of the EFTA.
Figure 12-9 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, and latency specifications
Port 1
Tested
equipment 1

Tested
equipment 2
Port 2

Port 1

Port 2

Data network
performance
analyzer

Figure 12-10 shows the connection for testing the back-to-back specifications of the EFT8A.
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Figure 12-10 Connection for testing the back-to-back specifications


Tested
equipment 1

Port 1

Port 2

Data network
performance
analyzer

Table 12-24 lists the throughput specifications of the EFT8A. Table 12-25 lists the packet loss
ratio in the case of overloading of the EFT8A. Table 12-26 lists the latency specifications of the
EFT8A. Table 12-27 lists the back-to-back specifications of the EFT8A.
NOTE

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual environment
are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and 63 VC-12s are bound on the FE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-24 lists the throughput specifications of the EFT8A. The values are obtained when the
SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Table 12-24 Throughput specifications of the EFT8A

Issue 03 (2013-02-20)

Frame Size
(Byte)

Passed Rate
(%)

(01,01,01) to
(01,01,02) (pks/
sec)

(01,01,02) to
(01,01,01) (pks/
sec)

Total (pks/
sec)

64

100.00

148810

148810

297620

128

100.00

84459

84459

168918

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Frame Size
(Byte)

Passed Rate
(%)

(01,01,01) to
(01,01,02) (pks/
sec)

(01,01,02) to
(01,01,01) (pks/
sec)

Total (pks/
sec)

256

100.00

45290

45290

90580

512

100.00

23496

23496

46992

1024

100.00

11973

11973

23946

1280

100.00

9615

9615

19230

1518

100.00

8127

8127

16254

Table 12-25 lists the packet loss ratio in the case of overloading of the EFT8A. The values are
obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

Table 12-25 Packet loss ratio in the case of overloading of the EFT8A
Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,01,02) (%)

(01,01,02) to
(01,01,01) (%)

Average (%)

64

100.00

0.000

0.000

0.000

128

100.00

0.000

0.000

0.000

256

100.00

0.000

0.000

0.000

512

100.00

0.000

0.000

0.000

1024

100.00

0.000

0.000

0.000

1280

100.00

0.000

0.000

0.000

1518

100.00

0.000

0.000

0.000

Table 12-26 lists the latency specifications of the EFT8A. The values are obtained when the
SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The test duration is set to 60 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time

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when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested
equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.
Table 12-26 Latency specifications of the EFT8A
Frame
Size
(Byte)

Rate
Tested
(%)

(01,01,01) to
(01,01,02) (us)CT (us)

Average
(CT) (us)

(01,01,01) to
(01,01,02)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

506.4

506.4

501.2

501.2

128

100.00

518.8

518.8

508.5

508.5

256

100.00

536.2

536.2

515.8

515.8

512

100.00

578.9

578.9

538.0

538.0

1024

100.00

653.4

653.4

571.4

571.4

1280

100.00

688.1

688.1

585.6

585.6

1518

100.00

720.6

720.6

599.1

599.1

Table 12-27 lists the back-to-back specifications of the EFT8A. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission rate
is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is set to
a value more than 50 on the Smart Application.

The tested traffic is set to the wire speed.

The test duration is set to 10 seconds.

Table 12-27 Back-to-back specifications of the EFT8A

Issue 03 (2013-02-20)

Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,01,02) Burst
Size (Number of
Frames)

(01,01,02) to
(01,01,01)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

297620

297620

595240

128

100.00

168918

168918

337836

256

100.00

90580

90580

181160

512

100.00

46992

46992

93984

1024

100.00

23946

23946

47892

1280

100.00

19230

19230

38460

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Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,01,02) Burst
Size (Number of
Frames)

(01,01,02) to
(01,01,01)
(Number of
Frames)

Total
(Number of
Frames)

1518

100.00

16254

16254

32508

Mechanical Specifications
The mechanical specifications of the EFT8A are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the EFT8A at room temperature (25C) is 26 W.

12.3 EGT2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGT2 (2xGE transparent transmission board). This topic also
describes how to configure and commission the EGT2.

12.3.1 Version Description


The EGT2 is available in two functional versions, namely, N1 and N2.
Table 12-28 describes the versions of the EGT2.
Table 12-28 Versions of the EGT2
Item

Description

Functional versions

The EGT2 is available in two functional versions, namely, N1 and


N2.

Differences

l Regarding interface specifications: interface types, interface


characteristics
l Regarding service specifications: MTU, VCTRUNK
specifications, Mapping granularities
l Regarding maintenance features: ETH OAM

Substitution

Issue 03 (2013-02-20)

The N2EGT2 can substitute for the N1EGT2.

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12.3.2 Application
The EGT2 is used to transmit/receive Ethernet services, manage bandwidths, and converge
Ethernet services.
Figure 12-11 shows the typical networking and application of the Ethernet transparent
transmission board. The Ethernet transparent transmission board realizes point-to-point
transparent transmission of Ethernet services. The Ethernet transparent transmission board
provides the following functions by using the interfaces on the board: data receipt, data
transmission, data mapping, and traffic control. In addition, the Ethernet transparent
transmission board performs port-based point-to-point transparent transmission, encapsulation/
decapsulation, overhead bytes and pointers processing, virtual concatenation, SDH mapping/
demapping, and LCAS function.
Figure 12-11 Networking and application of the Ethernet transparent transmission board

NMS

User A2
NE1

PORT 1
NE2

MSP ring

PORT 2

NE4

NE3

User B2

Service flow
Line board

PORT 1

PORT 2

Data board
Cross-connect and
timing board

User B1

User A1

12.3.3 Functions and Features


The EGT2 supports the transparent transmission of Ethernet services, LCAS function, and test
frames.
Table 12-29 provides the functions and features of the EGT2.

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Table 12-29 Functions and features of the EGT2


Funct
ion
and
Featu
re

Description

Basic
functi
ons

Transparently transmits 2xGE services.

Interfa
ce
types

l Supports the 1000BASE-SX/LX/ZX/VX Ethernet optical interfaces. The optical


interfaces support the auto-negotiation function in compliance with IEEE 802.3z.
The optical interfaces use the SFP optical module and support hot swapping.
When the multi-mode optical fiber is used, the maximum transmission distance
is 550 m. When the single-mode optical fiber is used, the maximum transmission
distance is 10 km. The optical modules that can meet different requirements for
the transmission distance such as 40 km and 80 km can also be used.
l The N2EGT2 also supports the 1000BASE-T RJ-45 Ethernet electrical interface.
The electrical interface supports the 1000M full-duplex working mode. The
N2EGT2 uses the SFP electrical interface and supports hot swapping. The
maximum transmission distance is 100 m.

Functi
ons
when
being
used
with
an
interfa
ce
board

Provides interfaces on the front panel.

Interfa
ce
charac
teristic
s

Working
modes

1000M full-duplex and auto-negotiation

Traffic
control at
ports

Auto-negotiation mode

Not supported

Non-autonegotiation mode

Supported

Query/
Supported
Setting of
port
status

Issue 03 (2013-02-20)

Query of
interface
types

Supported

RMON
measure
ment

Supported

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Description

Setting of Not supported


optical
power
threshold
s
Pluggabl
e optical
module

Issue 03 (2013-02-20)

Supports SFP optical modules.

EPL
servic
e

Supports the PORT-based transparent transmission.

Servic
e
specifi
cation
s

Formats
of
Ethernet
data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1q TAG

Supported

Frame
length
range

l Supports the setting of the packet length, which ranges from 1518
bytes to 9600 bytes.

Bound
bandwidt
h

16xVC-4, or 48xVC-3

Mapping
granularit
ies

Supports VC-3, VC-4, VC-3-Xv (X 24), and VC-4-Xv (X 8)


granularities.

Encapsul
ation
formats

HDLC

Supported

LAPS

Supported

GFP-F

Supported

l Supports a jumbo frame with a length less than 9600 bytes.

MPLS
technolo
gy

Not supported

VLAN
technolo
gy

Supports the VLAN transparent transmission.

Maximu
m uplink
bandwidt
h

The maximum uplink bandwidth is 2.5 Gbit/s. The EGT2 can adapt to
the bandwidth of the slot.

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ion
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Featu
re

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Description

VCTRU
NK
specificat
ions

Number of supported VCTRUNKs: 2


Configuration principles are as follows:
l A VCTRUNK can be bound with a maximum of 8 VC-4s or a
maximum of 24 VC-3s. A VCTRUNK can be bound with VC-4s
numbered 1-16 or VC-3s numbered 1-48.
l The virtual concatenation modes of the two VCTRUNKs of the
board should be the same. That is, the two VCTRUNKs should be
of the VC-4 virtual concatenation or of the VC-3 virtual
concatenation.

Protec
tion
schem
es

Clock
synchr
onizati
on

Maint
enanc
e
featur
es

Issue 03 (2013-02-20)

TPS

Not supported

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports the P2P LPT in GFP bearer mode.

LAG

Not supported

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Not supported
l The N1EGT2 does not support the ETH OAM function.
l The N2EGT2 supports CC, LB test, and LT test. The ETH OAM
function complies with IEEE 802.1ag.

Test
Frame

Supports test frames in GFP bearer mode.

Response
to ping

Not supported

Port
mirroring

Not supported

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Inloops

MAC layer at Ethernet ports

Inloops

VC-4 level

Not supported

VC-3 level

Not supported

VC-12 level

Not supported

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Description

RMON

Supports Ethernet performance monitoring at the port level.

Warm
resets

Supported

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

QoS

Not supported

Traffi
c
contro
l

Supports the GE port-based traffic control function that complies with IEEE 802.3x.

12.3.4 Working Principle and Signal Flow


The EGT2 consists of the Ethernet access module, mapping module, interface converting
module, logic and control module, clock module, and power module.
Figure 12-12 shows the functional block diagram of the EGT2 by describing how to process
1xGE signals.

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Figure 12-12 Functional block diagram of the EGT2


Backplane

GE

Ethernet
access
module

ENCP
VCP
DENCP

Interface
converting
module

Cross-connect unit
Cross-connect unit

Mapping module
Laser
shutdown

LOS

Logic and
control module

Communication
Reference clock and frame header

+3.3 V
Clock module

Power
module

50 77 125 155
MHz MHz MHz MHz

ENCP: data encapsulation module

Power
module

SCC unit
SCC unit

Fuse

-48 V/-60 V
-48 V/-60 V

+3.3 V

+3.3 V backup power

Fuse

DENCP: decapsulation module

VCP: virtual concatenation processing module

Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or routers
are converted into electrical signals. If the signals are accessed through electrical interfaces, O/
E conversion is not required. At the PHY layer, the electrical signals are decoded and the
ETH_LOS alarm is detected. The electrical signals are converted from serial signals into parallel
signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Mapping Module
The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, HDLC, or
GFP format. The concatenation is performed. Then, the Ethernet signals are converted into SDH
signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

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Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and HDLC
controller. This module is connected to external circuits through the bus. The logic and control
module performs the following functions:
l

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:
l

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

Clock Module
The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.3.5 Front Panel


The front panel of the EGT2 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 12-13 shows the appearance of the front panel of the N1EGT2/N2EGT2 that has the GE
optical interface.

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Figure 12-13 Front panel of the N1EGT2/N2EGT2 that has the GE optical interface

EGT2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2
CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2

EGT2

The N2EGT2 can also be installed with the GE electrical interface. Figure 12-14 shows the
appearance of the front panel of the N2EGT2 that has the GE electrical interface.

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Figure 12-14 Front panel of the N2EGT2 that has the GE electrical interface

EGT2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2

OUT1
IN1
OUT2
IN2

EGT2

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 24 Indicators.

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Interfaces
The front panel of the N1EGT2/N2EGT2 has two GE optical interfaces. Table 12-30 describes
the types and usage of the optical interfaces of the N1EGT2/N2EGT2.
Table 12-30 Optical interfaces of the N1EGT2/N2EGT2
Interface

Type of Interface

Usage

IN1/OUT1

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/


VX signals.

IN2/OUT2

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/


VX signals.

The two GE electrical interfaces of the N2EGT2 are of the same type and have the same usage.
Table 12-31 describes the types and usage of the electrical interfaces of the N2EGT2.
Table 12-31 Electrical interfaces of the N2EGT2
Interface

Type of Interface

Usage

GE

RJ-45 (swappable)

Transmits and receives 1000BASE-T signals.

Table 12-32 provides the pin assignments of the RJ-45 interface of the N2EGT2.
Table 12-32 Pin assignments of the RJ-45 interface of the N2EGT2
Pin

Description

BI_DA+

BI_DA

BI_DB+

BI_DC+

BI_DC

BI_DB

BI_DD+

BI_DD

12.3.6 Jumpers and DIP Switches


The EGT2 does not have any jumpers or DIP switches that are used for board settings.

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12.3.7 Valid Slots


The EGT2 must be installed in a valid slot in the subrack. Otherwise, the EGT2 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The EGT2 can be installed in slots 18 and 1116 in the subrack.


l

When the cross-connect capacity is 200 Gbit/s, the slots valid for the EGT2 are as follows:
The N1EGT2 can be installed in slots 14, 58, 1114, and 1516. When the N1EGT2
is installed in slots 14 and 1516, the bandwidth is 1.25 Gbit/s. When the N1EGT2 is
installed in slots 58 and 1114, the bandwidth is 2.5 Gbit/s.
The N2EGT2 can be installed in slots 18 and 1116. In this case, the bandwidth is 2.5
Gbit/s.

12.3.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the EGT2 indicates the type of interface.
Table 12-33 provides the relationship between the feature code of the EGT2 and the type of
interface.
Table 12-33 Relationship between the feature code of the EGT2 and the type of interface
Board

Feature Code

Type of Interface

SSN1EGT210 and
SSN2EGT210

10

1000BASE-SX (0.5 km)

SSN1EGT211 and
SSN2EGT211

11

1000BASE-LX (10 km)

SSN1EGT212 and
SSN2EGT212

12

1000BASE-VX (40 km)

SSN1EGT213 and
SSN2EGT213

13

1000BASE-ZX (80 km)

SSN2EGT214

14

1000BASE-T (100 m)

12.3.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.
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Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring EPL Services on Ethernet
Transparent Transmission Board.
Step 3 Required: Set the Ethernet interface.
l Set the overhead byte as follows:
J1/J2 byte: The setting of the J1/J2 byte on the interconnected equipment must be
consistent. Generally, use the default value. The default mode of the J1/J2 to be sent is
16-Byte CRC Mode and the default value of the J1/J2 to be sent is HuaWei SBS ; the
default mode of the J1/J2 to be received is Single-Byte Mode and the default value of
the J1/J2 to be received is 0x00.
l Set the Ethernet interface as follows:
Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.
Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of
traffic, services may be completely interrupted.
For details, see 28.7 Checking Board Parameters.
NOTE

For more information about the parameters of the board, see 27.4.2 Ethernet Parameters.

Step 4 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

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Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

12.3.10 Configuring the Board Functions


The EGT2 supports multiple Ethernet functions and features such as LCAS and LPT. Configure
the functions according to actual requirements.
You can configure the following Ethernet functions for the EGT2 by using the U2000:
l

LCAS

LPT

Test Frame

12.3.11 Parameter Settings


You can set parameters for the EGT2 by using the U2000.
You can set the following main parameters for the EGT2 by using the U2000:
l

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

12.3.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 12-34 lists the faults that occur on the EGT2 frequently and the troubleshooting methods.
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Table 12-34 Methods used to troubleshoot the faults that occur on the EGT2 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on a single


Ethernet port are interrupted.
l The services on all the Ethernet
ports are interrupted.
Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The services on a single


Ethernet port are transiently
interrupted.
l The protocol becomes
abnormal.
l The negotiated working mode
of the Ethernet ports is the halfduplex mode.

Packet loss

See Troubleshooting Service


Packet Loss.

l Bit errors occur on the line side.


Interconnection
fault

l The interconnection fault


occurs on a single Ethernet port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCG port.
l The LCAS interconnection
fault occurs.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EGT2, see Replacing an EOS Board.

12.3.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

12.3.13.1 Alarms of N1EGT2

Issue 03 (2013-02-20)

ALM_GFP_dLFD

AU_AIS

AU_LOP

B3_EXC_VC3

B3_EXC_VC4

B3_SD_VC3

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B3_SD_VC4

BD_STATUS

BDID_ERROR

COMMUN_FAIL

ETH_LOS

FPGA_ABN

HARD_BAD

HP_RDI

HP_SLM

HP_TIM

HP_UNEQ

LASER_MOD_ERR

LCAS_BAND_DECREASED

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LINK_ERR

LOOP_ALM

LP_RDI_VC3

LP_SLM_VC3

LP_TIM_VC3

LP_UNEQ_VC3

LPT_RFI

LSR_NO_FITED

NO_BD_SOFT

TEST_STATUS

TU_AIS_VC3

TU_LOP_VC3

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

T_LOSEX

TR_LOC

ETH_NO_FLOW

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.3.13.2 Alarms of N2EGT2

Issue 03 (2013-02-20)

ALM_GFP_dLFD

AU_AIS

AU_LOP

B3_SD_VC3

B3_EXC_VC3

B3_EXC_VC4

B3_SD_VC4

BD_STATUS

COMMUN_FAIL

ETH_CFM_RDI

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_UNEXPERI

ETH_LOS

ETH_NO_FLOW

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

FCS_ERR

FLOW_OVER

FPGA_ABN

HARD_BAD

HP_RDI

HP_SLM

HP_TIM

HP_UNEQ

LASER_MOD_ERR

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LINK_ERR

LOOP_ALM

LP_RDI_VC3

LP_SLM_VC3

LP_TIM_VC3

LP_UNEQ_VC3

LPT_RFI

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LSR_NO_FITED

LSR_WILL_DIE

LTEMP_OVER

MOD_TYPE_MISMATCH

NO_BD_SOFT

PORT_MODULE_OFFLINE

SUM_INPWR_HI

SUM_INPWR_LOW

SUM_OUTPWR_HI

SUM_OUTPWR_LOW

T_LOSEX

TD

TEMP_OVER

TF

TR_LOC

TU_AIS_VC3

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC3

VCAT_LOM_VC4

VCAT_SQM_VC3

VCAT_SQM_VC4

VCTRUNK_NO_FLOW

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.3.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

12.3.14.1 Performance Events of N1EGT2


Table 12-35 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFECSES

LPFEES

LPFESES

LPSES

DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

FCSErrors

LPUAS

Table 12-36 RMON alarm

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Table 12-37 Statistics of RMON basic performance


Packets Received(64
Octets in Length)
(packets/s)

Packets Received(65~127
Octets in Length)(packets/
s)

Packets Received(128~255 Octets


in Length)(packets/s)

Packets Received
(256~511 Octets in
Length)(packets/s)

Packets Received
(512~1023 Octets in
Length)(packets/s)

Packets Received(1024~1518
Octets in Length)(packets/s)

Multicast Packets
Received(packets/s)

Broadcast Packets
Received(packets/s)

Drop Events(times/s)

Undersize Packets
Received(packets/s)

Oversize Packets Received


(packets/s)

Fragments(packets/s)

Jabbers(packets/s)

Octets Received(Byte/s)

Packets Received(packets/s)

Table 12-38 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)(packets/s)

Packets Transmitted
(65~127 Octets in Length)
(packets/s)

Packets Transmitted(128~255
Octets in Length)(packets/s)

Packets Transmitted
(256~511 Octets in Length)
(packets/s)

Packets Transmitted
(512~1023 Octets in
Length)(packets/s)

Packets Transmitted
(1024~1518 Octets in Length)
(packets/s)

Unicast Packets Received


(packets/s)

Unicast Packets
Transmitted(packets/s)

Multicast Packets Transmitted


(packets/s)

Broadcast Packets
Transmitted(packets/s)

Pause Frames Received


(frames/s)

Pause Frames Transmitted


(frames/s)

FCS Errors(frames/s)

Packets Received and


Transmitted(64 Octets in
Length)(packets/s)

Packets Received and


Transmitted(65~127 Octets in
Length)(packets/s)

Packets Received and


Transmitted(128~255 Octets
in Length)(packets/s)

Packets Received and


Transmitted(256~511
Octets in Length)(packets/
s)

Packets Received and


Transmitted(512~1023 Octets
in Length)(packets/s)

Packets Received and


Transmitted(1024~1518
Octets in Length)(packets/s)

12.3.14.2 Performance Events of N2EGT2


Table 12-39 SDH
HPBBE
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HPCSES
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HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

XCSTMPCUR

XCSTMPMAX

XCSTMPMIN

Table 12-40 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

FCSErrors

Table 12-41 Statistics of RMON basic performance


Packets Received(64
Octets in Length)
(packets/s)

Packets Received(65~127
Octets in Length)(packets/
s)

Packets Received(128~255 Octets


in Length)(packets/s)

Packets Received
(256~511 Octets in
Length)(packets/s)

Packets Received
(512~1023 Octets in
Length)(packets/s)

Packets Received(1024~1518
Octets in Length)(packets/s)

Multicast Packets
Received(packets/s)

Broadcast Packets
Received(packets/s)

Drop Events(times/s)

Undersize Packets
Received(packets/s)

Oversize Packets Received


(packets/s)

Fragments(packets/s)

Jabbers(packets/s)

Octets Received(Byte/s)

Packets Received(packets/s)

Table 12-42 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)(packets/s)
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Packets Transmitted
(65~127 Octets in Length)
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Packets Transmitted
(256~511 Octets in Length)
(packets/s)

Packets Transmitted
(512~1023 Octets in
Length)(packets/s)

Packets Transmitted
(1024~1518 Octets in Length)
(packets/s)

Unicast Packets Received


(packets/s)

Unicast Packets
Transmitted(packets/s)

Multicast Packets Transmitted


(packets/s)

Broadcast Packets
Transmitted(packets/s)

Pause Frames Received


(frames/s)

Pause Frames Transmitted


(frames/s)

FCS Errors(frames/s)

Packets Received and


Transmitted(64 Octets in
Length)(packets/s)

Packets Received and


Transmitted(65~127 Octets in
Length)(packets/s)

Packets Received and


Transmitted(128~255 Octets
in Length)(packets/s)

Packets Received and


Transmitted(256~511
Octets in Length)(packets/
s)

Packets Received and


Transmitted(512~1023 Octets
in Length)(packets/s)

Packets Received and


Transmitted(1024~1518
Octets in Length)(packets/s)

12.3.15 Technical Specifications


The technical specifications of the EGT2 include the parameters specified for optical interfaces,
laser safety class, Ethernet performance specifications, mechanical specifications, and power
consumption.

Parameters Specified for Optical Interfaces


Table 12-43 lists the parameters specified for the optical interfaces of the EGT2.
Table 12-43 Parameters specified for the optical interfaces of the EGT2

Issue 03 (2013-02-20)

Parameter

Value

Type of optical
interface

1000BASEZX (80 km)

1000BASE-VX
(40 km)

1000BASELX (10 km)

1000BASE-SX
(0.5 km)

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Multi-mode LC

Launched
optical power
range (dBm)

-2 to 5

-5 to 0

-9 to -3

-9.5 to -2.5

Operating
wavelength
range (nm)

1500 to 1580

1275 to 1350

1270 to 1355

770 to 860

Minimum
overload (dBm)

-3

-3

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Parameter

Value

Receiver
sensitivity
(dBm)

-23

-23

-20

-17

Minimum
extinction ratio
(dB)

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

Ethernet Electrical Interfaces


Table 12-44 lists the parameters specified for the electrical interfaces of the EGT2.
Table 12-44 Parameters specified for the electrical interfaces of the EGT2
Type of Interface

Code Type

1000BASE-T, RJ-45

4D-PAM5

NOTE

Only the EGT2 boards of the N2 version supports the GE electrical interfaces.

Ethernet Performance Specifications


NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EGT2 board of the N1 version.

Figure 12-15 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, and latency specifications of the N1EGT2.

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Figure 12-15 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, and latency specifications of the N1EGT2
Port 1
Tested
equipment 1

Tested
equipment 2
Port 2

Port 1

Port 2

Data network
performance
analyzer

Figure 12-16 shows the connection for testing the back-to-back specifications of the N1EGT2.
Figure 12-16 Connection for testing the back-to-back specifications of the N1EGT2
Tested
equipment 1

Port 1

Port 2

Data network
performance
analyzer

Table 12-45 lists the throughput specifications of the N1EGT2. Table 12-46 lists the packet
loss ratio in the case of overloading of the N1EGT2. Table 12-47 lists the latency specifications
of the N1EGT2. Table 12-48 lists the back-to-back specifications of the N1EGT2.

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NOTE

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual environment
are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and 24 VC-3s are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-45 lists the throughput specifications of the N1EGT2. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Table 12-45 Throughput specifications of the N1EGT2


Frame Size
(Byte)

Passed Rate
(%)

(01,02,01) to
(01,02,02) (pks/
sec)

(01,02,02) to
(01,02,01) (pks/
sec)

Total (pks/
sec)

64

100.00

1488095

1488095

2976190

128

100.00

844595

844595

1689190

256

100.00

452899

452899

905798

512

100.00

234962

234962

469924

1024

100.00

119732

119732

239464

1280

100.00

96154

96154

192308

1518

100.00

81274

81274

162548

Table 12-46 lists the packet loss ratio in the case of overloading of the N1EGT2. The values are
obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

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Table 12-46 Packet loss ratio in the case of overloading of the N1EGT2
Frame Size
(Byte)

Rate Tested
(%)

(01,02,01) to
(01,02,02) (%)

(01,02,02) to
(01,02,01) (%)

Average (%)

64

100.00

0.000

0.000

0.000

128

100.00

0.000

0.000

0.000

256

100.00

0.000

0.000

0.000

512

100.00

0.000

0.000

0.000

1024

100.00

0.000

0.000

0.000

1280

100.00

0.000

0.000

0.000

1518

100.00

0.000

0.000

0.000

Table 12-47 lists the latency specifications of the N1EGT2. The values are obtained when the
SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The test duration is set to 60 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested
equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.

Table 12-47 Latency specifications of the N1EGT2

Issue 03 (2013-02-20)

Frame
Size
(Byte)

Rate
Tested
(%)

(01,02,01) to
(01,02,02) (us)CT (us)

Average
(CT) (us)

(01,02,02) to
(01,02,01)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

35.7

35.7

35.2

35.2

128

100.00

37.1

37.1

36.1

36.1

256

100.00

39.5

39.5

37.4

37.4

512

100.00

44.1

44.1

40.1

40.1

1024

100.00

53.2

53.2

45.1

45.1

1280

100.00

57.6

57.6

47.4

47.4

1518

100.00

61.9

61.9

49.7

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Table 12-48 lists the back-to-back specifications of the N1EGT2. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission rate
is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is set to
a value more than 50 on the Smart Application.

The tested traffic is set to the wire speed.

The test duration is set to 10 seconds.

Table 12-48 Back-to-back specifications of the N1EGT2


Frame Size
(Byte)

Rate Tested
(%)

(01,02,01) to
(01,02,02) Burst
Size (Number of
Frames)

(01,02,02) to
(01,02,01)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

2976190

2976190

5952380

128

100.00

1689190

1689190

3378380

256

100.00

905798

905798

1811596

512

100.00

469924

469924

939848

1024

100.00

239464

239464

478928

1280

100.00

192308

192308

384616

1518

100.00

162548

162548

325096

NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EGT2 board of the N2 version.

Figure 12-17 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N2EGT2.
Figure 12-17 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, latency specifications, and back-to-back specifications of the N2EGT2
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

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Table 12-49 lists the throughput specifications of the N2EGT2. Table 12-50 lists the packet
loss ratio in the case of overloading of the N2EGT2. Table 12-51 lists the latency specifications
of the N2EGT2. Table 12-52 lists the back-to-back specifications of the N2EGT2.
NOTE

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual environment
are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and two VC-3s are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-49 lists the throughput specifications of the N2EGT2. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 15

Maximum rate (%): 15

Mode: Uni-directional

Table 12-49 Throughput specifications of the N2EGT2

Issue 03 (2013-02-20)

Frame Size
(byte)

Passed Rate (%)

(01,05,02) to (01,05,01)
(pks/sec)

Total (pks/sec)

64

11.23

167112

334224

128

10.48

88527

177054

256

9.75

44138

88276

512

9.74

22894

45788

1024

9.75

11674

23348

1280

9.75

9373

18746

1518

9.75

7922

15844

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Table 12-50 lists the packet loss ratio in the case of overloading of the N2EGT2. The values are
obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 11.23

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Table 12-50 Packet loss ratio in the case of overloading of the N2EGT2
Frame Size
(byte)

Rate Tested (%)

(01,05,02) to (01,05,01)
(%)

Average (%)

64

11.23

0.000

0.000

128

10.48

0.000

0.000

256

9.75

0.000

0.000

512

9.74

0.000

0.000

1024

9.75

0.000

0.000

1280

9.75

0.000

0.000

1518

9.75

0.000

0.000

Table 12-51 lists the latency specifications of the N2EGT2. The values are obtained when the
SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The test duration is set to 100 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested

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equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.
l

Measure on one receiving card only

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 11.23

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Table 12-51 Latency specifications of the N2EGT2


Frame
Size
(byte)

Rate
Tested
(%)

(01,05,02) to
(01,05,01) (us)CT (us)

Average
(CT) (us)

(01,05,02) to
(01,05,01)
(us)-S&F (us)

Average
(S&F) (us)

64

11.23

92.7

92.7

92.1

92.1

128

10.48

97.7

97.7

96.6

96.6

256

9.75

109.5

109.5

107.5

107.5

512

9.74

133.1

133.1

129.0

129.0

1024

9.75

178.8

178.8

170.6

170.6

1280

9.75

204.1

204.1

193.9

193.9

1518

9.75

224.0

224.0

211.9

211.9

Table 12-52 lists the back-to-back specifications of the N2EGT2. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission rate
is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is set to
a value more than 1 on the SmartApplication.

The tested traffic is set to the wire speed.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 11.23

Maximum rate (%): 10.00

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Resolution rate (%): None

Mode: Uni-directional

12 EoS Boards

Table 12-52 Back-to-back specifications of the N2EGT2


Frame Size
(byte)

Rate Tested (%)

(01,05,02) to (01,05,01)
Burst Size (frames)

Total (frames)

64

11.23

334224

668448

128

10.48

177054

354108

256

9.75

88276

176552

512

9.74

45754

91508

1024

9.75

23348

46696

1280

9.75

18752

37504

1518

9.75

15848

31696

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EGT2 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.9

Power Consumption
The maximum power consumption of the N1EGT2 at room temperature (25C) is 29 W.
The maximum power consumption of the N2EGT2 at room temperature (25C) is 15 W.

12.4 EFS0
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFS0 (8xFE switching and processing board). This topic also
describes how to configure and commission the EFS0.

12.4.1 Version Description


The EFS0 is available in several functional versions. Select a functional board according to
actual requirements.
The EFS0 is available in the following functional versions: N1, N2, N4, and N5. The
N2EFS0/N1EFS0 is discontinued.
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Table 12-53 describes the versions of the EFS0.


Table 12-53 Versions of the EFS0
Item

Description

Functional
versions

The EFS0 is available in the following functional versions: N1, N2, N4,
and N5.

Differences

l Regarding interface specifications: interface types, functions when


being used with an interface board
l Regarding service specifications: MTU, bound bandwidth,
maximum uplink bandwidth, VCTRUNK specifications
l Regarding protection schemes: TPS, LCAS, LPT, LAG
l Regarding maintenance features: ETH OAM, test frame, , port
mirroring, loopback capability, warm resets
l QoS

Substitution

The N2EFS0 supports the board version replacement function and can
replace the N1EFS0.
The N4EFS0 supports the board version replacement function and can
replace the N2EFS0/N1EFS0.
The N5EFS0 supports the board version replacement function and can
replace the N4EFS0/N2EFS0/N1EFS0.

12.4.2 Application
The EFS0 is used to transmit/receive Ethernet services, manage bandwidths, and realize Layer
2 switching of Ethernet services.
Figure 12-18 shows the typical networking and application of the Ethernet switching board. the
Ethernet switching board accesses and converges Ethernet services, and provides the Ethernet
data with the following data features: Layer 2 switching, port isolation, flow classification, traffic
control, VLAN management, and priority configuration. In addition, the Ethernet switching
board performs encapsulation/decapsulation, virtual concatenation, and SDH mapping/
demapping for data. The Ethernet switching board can be interconnected with the bandwidth
access equipment and the data communication equipment at the same time, thus to provide a
network-level solution.

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Figure 12-18 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

12.4.3 Functions and Features


The EFS0 supports the Layer 2 switching, MPLS, and broadcast functions.
Table 12-54 provides the functions and features of the EFS0.
Table 12-54 Functions and features of the EFS0
Function and
Feature

Description

Basic functions

Processes 8xFE services.

Interface types

l Supports 10BASE-T/100BASE-TX signals when the EFS0 is used


with the ETF8.
l Supports 100BASE-FX/LX/VX/ZX signals when the EFS0 is used
with the EFF8. The optical interfaces comply with IEEE 802.3u.
l The N5EFS0 supports 10BASE-T/100BASE-TX signals when it is
used with the ETF8A.
l The N5EFS0 supports 100BASE-FX/LX signals when it is used
with the EFF8A. The optical interfaces comply with IEEE 802.3u.

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Function and
Feature

Description

Functions when
being used with an
interface board

l Receives/Transmits 8xFE signals through the electrical interface


when the EFS0 is used with the ETF8.
l Receives/Transmits 8xFE signals through the optical interface when
the EFS0 is used with the EFF8.
l Provides the TPS protection for the 8xFE signals through the
electrical interface when the EFS0 is used with the ETS8 and TSB8.
l The N5EFS0 can receive/transmit 8xFE signals through the
electrical interface when it is used with the ETF8A.
l The N5EFS0 can receive/transmit 8xFE signals through the optical
interface when it is used with the EFF8A.
Workin
g
modes

Interface
characteristics

l FE electrical port: auto-negotiation, 100M full-duplex,


100M half-duplex, 10M full-duplex, and 10M halfduplex
l FE optical port: 100M full-duplex
l An N5EFS0 board supports only the auto-negotiation and
100M full-duplex working mode when working with an
EFF8A board.

Service categories

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Traffic
control
at ports

Auto-negotiation mode

Supported (Not supported by


FE optical ports)

Non-autonegotiation mode

Supported (not supported if


an EFS0 board works with an
EFF8 board)

Query/
Setting
of port
status

Supported

Query
of
interfac
e types

Supported

Setting
of
optical
power
thresho
lds

Not supported

Plugga
ble
optical
module

Not supported

EPL
service

Supports the PORT-based transparent transmission.

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Function and
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Description
EVPL
service

l Supports PORT-shared EVPL services.


l Supports VCTRUNK-shared EVPL services.
The services are isolated by VLAN tags.
The services are isolated by MPLS tags.
The services are isolated by QinQ tags.
l Supports a maximum of 4096 links.

EPLA
N
service

N4EFS0/N5EFS0 boards support the EPLAN services that


are based on the IEEE 802.1d MAC bridge.
l Supports the blacklist that can contain 2K records and
also the static MAC address table that can contain 2K
records. The sum of the number of records in the blacklist
and the number of addresses in the static MAC address
table must not exceed 2K. The blacklist function of
N5EFS0 boards supports verification of destination
MAC addresses only.
l Supports the self-learning of the source MAC address.
The capacity of the MAC address table is 16K. The aging
time of the MAC address can be set and queried.
l Supports the configuration of static MAC routes.
l N4EFS0/N5EFS0 boards support the query of dynamic
MAC addresses.
l The maximum number of supported VBs is 16. The
maximum number of logical ports for each VB is 30.
l Queries the number of actually learned MAC addresses
based on VB+VLAN or VB+LP.

Service
specifications

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EVPL
AN
service
s

l Supports data isolation based on VB+VLAN.

Format
s of
Etherne
t data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1 q/p

Supported

Frame
length
range

l Supports the setting of the frame length to a value ranging


from 1518 bytes to 9600 bytes.

l Supports the setting of a maximum of 4096 VLAN


services.
l Supports the EVPLAN services that are based on the
IEEE 802.1q virtual bridge.

l Supports a jumbo frame with a maximum length of 9600


bytes.

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Function and
Feature

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Description
Bound
bandwi
dth

N1EFS0: 12xVC-3, or 63xVC-12 + 9xVC-3

Mappin
g
granula
rities

Supports VC-12, VC-3, VC-12-Xv (X 63), and VC-3-Xv


(X 12) granularities.

Encaps
ulation
formats

HDLC

Not supported

LAPS

Not supported

GFP-F

Supported

N2EFS0/N4EFS0/N5EFS0: 24xVC-3, or 126xVC-12 +


18xVC-3

MPLS
technol
ogy

Supports the MPLS.

VLAN
technol
ogy

Supports 4094 VLANs. The VLAN technology complies


with IEEE 802.1q/p.

Maxim
um
uplink
bandwi
dth

l The maximum uplink bandwidth of the N1EFS0 is 622


Mbit/s.

VCTR
UNK
specific
ations

The number of supported VCTRUNKs is as follows:

l The maximum uplink bandwidth of the N2EFS0/


N4EFS0/N5EFS0 is 1.25 Gbit/s.
l The EFS0 can adapt to the bandwidth of the slot.

l The number of VCTRUNKs supported by the N1EFS0


is 12.
l The number of VCTRUNKs supported by the N2EFS0/
N4EFS0/N5EFS0 is 24.
Configuration principles are as follows:
l VCTRUNK 1VCTRUNK 12 can be bound with VC-4s
numbered 14 only. VCTRUNK 13VCTRUNK 24 can
be bound with VC-4s numbered 58 only.
l VC-4s numbered 4 and 8 support the binding of VC-3
and VC-12 paths. The other VC-4s support the binding
of VC-3 paths only.
l A VCTRUNK can be bound with the VC-12 path or VC-3
path at one time. A VCTRUNK should not be bound with
VC-12 and VC-3 paths at the same time.

Protection schemes

Issue 03 (2013-02-20)

TPS

Not supported by the N1EFS0 but supported by the N2EFS0/


N4EFS0/N5EFS0.

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Function and
Feature

12 EoS Boards

Description
BPS

Not supported

PPS

Not supported

DLAG

Not supported

LAG

The N1EFS0 does not support link aggregation, but the


N2EFS0/N4EFS0/N5EFS0 supports manual link
aggregation and the load sharing mode that comply with
IEEE 802.3ad and IEEE 802.1AX.

LCAS

Not supported by the N1EFS0/N2EFS0


Dynamically increases or decreases the bandwidth and
protects the bandwidth in compliance with ITU-T G.7042.
This protection scheme is supported by the N4EFS0/
N5EFS0.

Clock
synchronization

LPT

The N1EFS0/N2EFS0 supports the P2P LPT. The N4EFS0/


N5EFS0 supports the P2P LPT and P2MP LPT.

STP/
RSTP

Supports the broadcast packet suppression function and


RSTP that comply with IEEE 802.1w.

MSTP

Not supported

Synchr
onous
Etherne
t

Not supported

IEEE
1588v2

Not supported
l The N1EFS0 and N2EFS0 do not support the ETH OAM
function.

Maintenance
features

l N4EFS0 and N5EFS0 boards support CC, LB tests, and


LT tests in compliance with IEEE 802.1ag, LM and DM
in compliance with ITU-T Y.1731, and OAM ping in
compliance with Huawei proprietary protocol.
l N4EFS0 and N5EFS0 boards support OAM autodiscovery, remote loopbacks, fault detection, and link
performance detection in compliance with IEEE 802.3ah,
and selfloop detection in compliance with Huawei
proprietary protocol.
Test
Frame

l The N1EFS0/N2EFS0 supports test frames in Ethernet


bearer mode.
l The N4EFS0/N5EFS0 supports test frames in Ethernet/
GFP bearer mode.

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Function and
Feature

12 EoS Boards

Description
Respon
se to
ping

Not supported

Port
mirrori
ng

The N1EFS0/N2EFS0/N4EFS0 does not supports port


mirroring. The N5EFS0 supports ingress mirroring.

Loopba
ck
capabili
ty

PHY layer at Ethernet ports

Inloops

MAC layer at Ethernet ports

Inloops

VC-4 level

Not supported

VC-3 level

The N1EFS0/N2EFS0/
N4EFS0 supports inloops
and outloops. The N5EFS0
does not support inloops or
outloops.

VC-12 level

Not supported

RMON

Supports Ethernet performance monitoring at the port level.

Warm
resets

N1EFS0/N2EFS0/N4EFS0/N5EFS0 boards support warm


resets. If a warm reset is performed on an N1EFS0/N2EFS0
board, traffic on the board is interrupted, whereas if a warm
reset is performed on an N4EFS0/N5EFS0 board, traffic on
the board is not interrupted. If an N4EFS0/N5EFS0 board
substitutes for an N1EFS0/N2EFS0 board, traffic on the
N4EFS0/N5EFS0 board is not interrupted.

Cold
resets

Supported

Alarms
and
perfor
mance
events

Reports various alarms and performance events, which


facilitates the management and maintenance of the
equipment.

l Supports the CAR. The granularity is 64 kbit/s.

QoS

l The N1EFS0 supports the service classification based on PORT,


PORT+VLAN ID, or PORT+VLAN PRI.
l The N2EFS0, N4EFS0, and N5EFS0 support the flow classification
based on PORT, PORT++VLAN ID, or PORT+VLAN ID+VLAN
PRI.
IGMP snooping

Issue 03 (2013-02-20)

Protoco
l
enablin
g

Supported

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Function and
Feature

Traffic control

12 EoS Boards

Description
Port
aging
time

Supported

Fast
leave

Not supported by N1EFS0/N2EFS0/N4EFS0 boards

Discard
ing of
unkno
wn
broadca
st
packets

Not supported by N1EFS0/N2EFS0/N4EFS0 boards

Static
broadca
st entry

Not supported

Supported by N5EFS0 boards

Supported by N5EFS0 boards

Supports the port-based traffic control function that complies with IEEE
802.3x.

12.4.4 Working Principle and Signal Flow


The EFS0 consists of the Ethernet access module, network processor module, mapping module,
interface converting module, logic and control module, clock module, and power module.
Figure 12-19 shows the functional block diagram of the EFS0 by describing how to process
1xFE signals.

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Figure 12-19 Functional block diagram of the EFS0


Backplane

Control

Switch
fabric

Data

Cross-connect unit

Cross-connect unit

Mapping module

Network processor module


Laser
shutdown

Interface
converting
module

VCP

Network
processor

DENCP

Ethernet
access
module

ENCP

FE

LOS
Communication
Reference clock and frame header

Logic and
control module

+3.3 V
Clock module

Power Fuse
module

Power
module

-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

50 77 125 155
MHz MHz MHz MHz

ENCP: data encapsulation module

SCC unit
SCC unit

Fuse

DENCP: decapsulation module

VCP: virtual concatenation processing module

Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or routers
are converted into electrical signals. If the signals are accessed through electrical interfaces, O/
E conversion is not required. At the PHY layer, the electrical signals are decoded and the
ETH_LOS alarm is detected. The electrical signals are converted from serial signals into parallel
signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module


The network processor module consists of the network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The following formats are supported:
l

Multi-protocol label switching (MPLS)

L2 MPLS VPN

Ethernet/VLAN

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In the receive direction, services are mapped and forwarded after the Tunnel and VC tags are
added according to the service configuration. In the transmit direction, the Tunnel or VC tag is
extracted based on the level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module supports the following functions:
l

Flow sense and flow classification

Unicast, multicast, and broadcast of the flow

Setting of data priorities

Weighted fair queuing (WFQ)

Four classes of service (CoSs)

Mapping Module
The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in GFP format. The
concatenation is performed. Then, the Ethernet signals are converted into SDH signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and HDLC
controller. This module is connected to external circuits through the bus. The logic and control
module performs the following functions:
l

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:
l

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

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Clock Module
The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.4.5 Front Panel


The front panel of the EFS0 has indicators and a bar code.

Diagram of the Front Panel


Figure 12-20 shows the appearance of the front panel of the EFS0.
Figure 12-20 Front panel of the EFS0

EFS0
STAT
ACT
PROG
SRV

EFS0

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Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the EFS0 has no interfaces. The interfaces are available on the ETF8 or on
the EFF8. When the N5EFS0 is used with the ETF8A or EFF8A, the interfaces are available on
the ETF8A or on the EFF8A.

12.4.6 Jumpers and DIP Switches


The EFS0 does not have any jumpers or DIP switches that are used for board settings.

12.4.7 Valid Slots


The EFS0 must be installed in a valid slot in the subrack. Otherwise, the EFS0 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The EFS0 must be used with the ETF8, EFF8, and ETS8. When the ETS8 is used as the interface
board, the TSB8 must be used as the bridging board. For the slots valid for the EFS0, ETS8, and
TSB8 when the EFS0 works with the ETS8 and TSB8, see 12.4.9 Board Protection.
The N5EFS0 can be used with the ETF8A and EFF8A. When the N5EFS0 works with the ETF8A
or EFF8A, the slots valid for the N5EFS0 are the same as the slots valid for the N5EFS0 when
the N5EFS0 works with the ETF8 or EFF8.
The slots valid for the EFS0 vary with the version of the board and the cross-connect capacity
of the subrack. The slots valid for the board are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the N1EFS0 can be installed in slots 25
and 1316. In this case, the bandwidth is 622 Mbit/s.

When the cross-connect capacity is 200 Gbit/s, the N2EFS0, N4EFS0, and N5EFS0 can
be installed in slots 25 and 1316. In this case, the bandwidth is 1.25 Gbit/s.

Table 12-55 lists the slots valid for the EFS0 and the corresponding slots for the ETF8 and EFF8.
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Table 12-55 Slots valid for the EFS0 and the corresponding slots for the ETF8 and EFF8
Slot Valid for the EFS0

Corresponding Slot for the ETF8 and EFF8

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

12.4.8 Feature Code


The EFS0 does not have the feature code.

12.4.9 Board Protection


The EFS0 supports the 1:1 TPS protection.
NOTE

TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing board.
Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

Figure 12-21 shows the slot configuration for the 1:1 TPS protection for the EFS0.

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S
L
O
T
2
7

S
L
O
T
2
8

S
L
O
T
3
1

S
L
O
T
3
2

S
L
O
T
3
3

S
L
O
T
3
5

S
L
O
T
3
4

S
L
O
T
1
0

XCS

S
L
O
T
3
6

S
L
O
T
3
7

FAN

S
L
O
T
1
1

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8
Working 2

S
L
O
T
9

XCS

S S S S
L L L L
O O O O
T T T T
5 6 7 8

Working 1

Protection 1

S
L
O
T
4

S
L
O
T
3
0

FAN

FAN

S S S
L L L
O O O
T T T
1 2 3

S
L
O
T
2
9

AUX

S
L
O
T
2
6

GSCC

S
L
O
T
2
5

TSB8

S
L
O
T
2
4

Protection 2

S
L
O
T
2
3

ETS8

S
L
O
T
2
2

ETS8

S
L
O
T
2
1

PIU

S
L
O
T
2
0

TSB8

S
L
O
T
1
9

PIU

Figure 12-21 Slot configuration for the 1:1 TPS protection for the EFS0

Fiber routing area

In Figure 12-21, the board in slot 2 protects the board in slot 3 and the board in slot 16 protects
the board in slot 15. The ETS8 is used with the working EFS0 and the TSB8 is used with the
protection EFS0. Table 12-56 lists the slots for the EFS0, ETS8, and TSB8.
Table 12-56 Slots for the EFS0, ETS8, and TSB8

Issue 03 (2013-02-20)

Board

Protection Group 1

Protection Group 2

EFS0 (protection)

Slot 2

Slot 16

EFS0 (working)

Slot 3

Slot 15

TSB8

Slot 19

Slot 35

ETS8

Slot 21

Slot 33

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12.4.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring Ethernet Services.
Step 3 Required: Set the Ethernet interface.
l Set the overhead byte as follows:
J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.
l Set the Ethernet interface as follows:
Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.
Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of
traffic, services may be completely interrupted.
For details, see 28.7 Checking Board Parameters.
NOTE

For more information about the parameters of the board, see 27.4.2 Ethernet Parameters.

Step 4 Optional: Configure the Layer 2 switching management service, including the following tasks:
l Enabling the IGMP Snooping Protocol
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l Configuring the Spanning Tree


l Setting the Aging Time for the Multicast Router Port
Step 5 Optional: Configure the QoS. For details, see Configuring QoS.
Step 6 Optional: Configure the link aggregation function on the Ethernet port. For details, see Creating
a LAG.
Step 7 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

12.4.11 Configuring the Board Functions


The EFS0 supports multiple Ethernet functions and features such as Layer 2 switching, LCAS,
and QoS. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EFS0 by using the U2000:
l

LCAS

QoS

LPT

LAG

ETH OAM

Test Frame

STP/RSTP

IGMP Snooping

12.4.12 Parameter Settings


You can set parameters for the EFS0 by using the U2000.
You can set the following main parameters for the EFS0 by using the U2000:
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Working mode

LCAS

Maximum frame length

Mapping protocol

12 EoS Boards

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

12.4.13 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 12-57 lists the faults that occur on the EFS0 frequently and the troubleshooting methods.
Table 12-57 Methods used to troubleshoot the faults that occur on the EFS0 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on a single


Ethernet port are interrupted.
l The services on all the Ethernet
ports are interrupted.
Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The services on a single


Ethernet port are transiently
interrupted.
l The protocol becomes
abnormal.
l The negotiated working mode
of the Ethernet ports is the halfduplex mode.

Packet loss

See Troubleshooting Service


Packet Loss.

l Bit errors occur on the line side.


Interconnection
fault

l The interconnection fault


occurs on a single Ethernet port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCG port.
l The LCAS interconnection
fault occurs.

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Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EFS0, see Replacing an EOS Board.

12.4.14 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

12.4.14.1 Alarms of N1EFS0


ALM_GFP_dLFD

AU_AIS

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_LOS

FCS_ERR

FPGA_ABN

HARD_BAD

LCAS_BAND_DECREASED

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_RFI

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

LSR_NO_FITED

NO_BD_SOFT

SUBCARD_ABN

TEMP_OVER

T_LOS

TU_LOP_VC12

TU_AIS_VC12

TU_AIS_VC3

VCAT_LOM_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_SQM_VC3

VCAT_LOM_VC3

VCAT_SQM_VC12

W_R_FAIL

PROTOCOL_MM

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.4.14.2 Alarms of N2EFS0

Issue 03 (2013-02-20)

ALM_GFP_dLFD

AU_AIS

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_LOS

FCS_ERR

FPGA_ABN

HARD_BAD

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LAG_FAIL

LCAS_BAND_DECREASED

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

LSR_NO_FITED

NO_BD_SOFT

SLAVE_WORKING

SUBCARD_ABN

T_LOS

TPS_ALM

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.4.14.3 Alarms of N4EFS0

Issue 03 (2013-02-20)

ALM_GFP_dLFD

AU_AIS

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_LOS

ETHOAM_DISCOVER_FAI
L

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_RMT_CRIT_FA
ULT

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_LOO
P

FLOW_OVER

FPGA_ABN

FCS_ERR

HP_LOM

LAG_FAIL

HARD_BAD

LCAS_PLCR

LASER_MOD_ERR

LCAS_FOPT

LCAS_TLCT

LCAS_FOPR

LCAS_TLCR

LP_REI_VC12

LCAS_PLCT

LOOP_ALM

LP_SLM_VC3

LP_RDI_VC12

LINK_ERR

LP_UNEQ_VC12

LP_REI_VC3

LP_RDI_VC3

LSR_NO_FITED

LP_TIM_VC12

LP_SLM_VC12

NO_BD_SOFT

LP_UNEQ_VC3

LP_TIM_VC3

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SUM_INPWR_HI

LSR_WILL_DIE

LPT_RFI

SUM_OUTPWR_LOW

SLAVE_WORKING

LTEMP_OVER

TF

SUM_INPWR_LOW

SUBCARD_ABN

TU_AIS_VC3

T_LOS

SUM_OUTPWR_HI

VCAT_LOA

TPS_ALM

TD

VCAT_LOM_VC3

TU_LOP_VC12

TU_AIS_VC12

TR_LOC

VCAT_LOM_VC12

TU_LOP_VC3

T_LOSEX

EX_ETHOAM_CC_LO
S

EX_ETHOAM_MPID_CNFL
CT

PATCH_NOT_CONFIRM

ALM_GFP_dCSF

PATCH_ERR

PATCHFILE_NOTEXIST

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.4.14.4 Alarms of N5EFS0

Issue 03 (2013-02-20)

ALM_GFP_dCSF

ALM_GFP_dLFD

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_UNEXPERI

ETH_LOS

ETH_NO_FLOW

ETHOAM_DISCOVER_FA
IL

ETHOAM_RMT_CRIT_FA
ULT

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_L
OOP

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

FCS_ERR

FLOW_OVER

FPGA_ABN

HARD_BAD

HP_LOM

LASER_MOD_ERR

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LINK_ERR

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

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LP_UNEQ_VC3

LPT_RFI

LSR_NO_FITED

LSR_WILL_DIE

LTEMP_OVER

NO_BD_SOFT

SUBCARD_ABN

SUM_INPWR_HI

SUM_INPWR_LOW

SUM_OUTPWR_HI

SUM_OUTPWR_LOW

T_LOSEX

TD

TEMP_OVER

TF

TPS_ALM

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_SQM_VC12

VCAT_SQM_VC3

VCTRUNK_NO_FLOW

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.4.15 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

12.4.15.1 Performance Events of N1EFS0


Table 12-58 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

Table 12-59 RMON alarm

Issue 03 (2013-02-20)

DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

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Table 12-60 Statistics of RMON basic performance


Packets Received(64
Octets in Length)
(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets Received
(256~511 Octets in
Length)(packets)

Packets Received(512~1023
Octets in Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

Multicast Packets
Received(packets)

Broadcast Packets Received


(packets)

Drop Events(times)

Undersize Packets
Received(packets)

Oversize Packets Received


(packets)

Fragments(packets)

Jabbers(packets)

Collisions(times)

Octets Received(Byte)

Packets Received
(packets)

Table 12-61 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)(packets)

Packets Transmitted(65~127
Octets in Length)(packets)

Packets Transmitted
(256~511 Octets in
Length)(packets)

Packets Transmitted
Packets Transmitted
(512~1023 Octets in Length) (1024~1518 Octets in Length)
(packets)
(packets)

Unicast Packets Received


(packets)

Unicast Packets Transmitted


(packets)

Multicast Packets Transmitted


(packets)

Broadcast Packets
Transmitted(packets)

Good Octets Transmitted


(Byte)

Alignment Errors(frames)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Octets


Transmitted(Byte)

Good Full Frame Octets


Received(Byte)

Good Full Frame Speed


Transmitted(Byte/s)

Packets Transmitted(128~255
Octets in Length)(packets)

12.4.15.2 Performance Events of N2EFS0


Table 12-62 SDH

Issue 03 (2013-02-20)

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

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HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

Table 12-63 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Table 12-64 Statistics of RMON basic performance


Packets Received(64
Octets in Length)
(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets Received
(256~511 Octets in
Length)(packets)

Packets Received(512~1023
Octets in Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

Multicast Packets
Received(packets)

Broadcast Packets Received


(packets)

Drop Events(times)

Undersize Packets
Received(packets)

Oversize Packets Received


(packets)

Fragments(packets)

Jabbers(packets)

Collisions(times)

Octets Received(Byte)

Packets Received
(packets)

Table 12-65 Statistics of RMON extended performance

Issue 03 (2013-02-20)

Packets Transmitted(64
Octets in Length)(packets)

Packets Transmitted(65~127
Octets in Length)(packets)

Packets Transmitted
(256~511 Octets in
Length)(packets)

Packets Transmitted
Packets Transmitted
(512~1023 Octets in Length) (1024~1518 Octets in Length)
(packets)
(packets)

Unicast Packets Received


(packets)

Unicast Packets Transmitted


(packets)

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Packets Transmitted(128~255
Octets in Length)(packets)

Multicast Packets Transmitted


(packets)

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Broadcast Packets
Transmitted(packets)

Good Octets Transmitted


(Byte)

Alignment Errors(frames)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Octets


Transmitted(Byte)

Good Full Frame Octets


Received(Byte)

Good Full Frame Speed


Transmitted(Byte/s)

12.4.15.3 Performance Events of N4EFS0


Table 12-66 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

Table 12-67 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Table 12-68 Statistics of RMON basic performance

Issue 03 (2013-02-20)

Packets Received(64
Octets in Length)
(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets Received
(256~511 Octets in
Length)(packets)

Packets Received(512~1023
Octets in Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

Multicast Packets
Received(packets)

Broadcast Packets Received


(packets)

Drop Events(times)

Undersize Packets
Received(packets)

Oversize Packets Received


(packets)

Fragments(packets)

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Jabbers(packets)

Collisions(times)

12 EoS Boards

Octets Received(Byte)

Packets Received
(packets)

Table 12-69 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)(packets)

Packets Transmitted(65~127
Octets in Length)(packets)

Packets Transmitted(128~255
Octets in Length)(packets)

Packets Transmitted
(256~511 Octets in
Length)(packets)

Packets Transmitted
Packets Transmitted
(512~1023 Octets in Length) (1024~1518 Octets in Length)
(packets)
(packets)

Unicast Packets Received


(packets)

Unicast Packets Transmitted


(packets)

Multicast Packets Transmitted


(packets)

Broadcast Packets
Transmitted(packets)

Good Octets Transmitted


(Byte)

Alignment Errors(frames)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Octets


Transmitted(Byte)

Good Full Frame Octets


Received(Byte)

Good Full Frame Speed


Transmitted(Byte/s)

12.4.15.4 Performance Events of N5EFS0


Table 12-70 SDH

Issue 03 (2013-02-20)

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

XCSTMPCUR

XCSTMPMAX

XCSTMPMIN

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Table 12-71 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Table 12-72 Statistics of RMON basic performance


Packets Received(64
Octets in Length)(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets Received(256~511
Octets in Length)(packets)

Packets Received(512~1023
Octets in Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

Multicast Packets Received


(packets)

Broadcast Packets Received


(packets)

Drop Events(times)

Undersize Packets
Received(packets)

Oversize Packets Received


(packets)

Fragments(packets)

Jabbers(packets)

Collisions(times)

Octets Received(Byte)

Packets Received(packets)

Table 12-73 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)(packets)

Packets Transmitted
(65~127 Octets in Length)
(packets)

Packets Transmitted(128~255
Octets in Length)(packets)

Packets Transmitted
(256~511 Octets in Length)
(packets)

Packets Transmitted
(512~1023 Octets in
Length)(packets)

Packets Transmitted
(1024~1518 Octets in Length)
(packets)

Unicast Packets Received


(packets)

Unicast Packets
Transmitted(packets)

Multicast Packets Transmitted


(packets)

Broadcast Packets
Transmitted(packets)

Good Octets Transmitted


(Byte)

Alignment Errors(frames)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Speed


Transmitted(Byte/s)

Good Full Frame Octets


Received(Byte)

Good Full Frame Octets


Transmitted(Byte)

12.4.16 Technical Specifications


The technical specifications of the EFS0 include the dimensions, weight, and power
consumption.
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Ethernet Performance Specifications


NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EFS0 board of the N4 version.

Figure 12-22 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N4EFS0.
Figure 12-22 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, latency specifications, and back-to-back specifications of the N4EFS0
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-74 lists the throughput specifications of the N4EFS0. Table 12-75 lists the packet loss
ratio in the case of overloading of the N4EFS0. Table 12-76 lists the latency specifications of
the N4EFS0. Table 12-77 lists the back-to-back specifications of the N4EFS0.
NOTE

l The specifications vary according to the configuration and networking of the test environment, port
rate, and VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.
l The specifications in the following tables are obtained in the following scenario: EPL services are
configured and five VC-12s are bound on the FE port.
l The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.
l The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.
l In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-74 lists the throughput specifications of the N4EFS0. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

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Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 10.00

Maximum rate (%): 12.00

Mode: bidirectional

12 EoS Boards

Table 12-74 Throughput specifications of the N4EFS0


Frame Size
(Byte)

Passed Rate
(%)

(01,02,03) to
(01,02,05) (pks/
sec)

(01,02,05) to
(01,02,03) (pks/
sec)

Total (pks/
sec)

64

11.48

17088

17088

34176

128

11.25

9502

9502

19004

256

11.13

5042

5042

10084

512

11.12

2613

2613

5226

1024

11.07

1326

1326

2652

1280

11.10

1067

1067

2134

1518

11.12

904

904

1808

Table 12-75 lists the packet loss ratio in the case of overloading of the N4EFS0. The values are
obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Table 12-75 Packet loss ratio in the case of overloading of the N4EFS0

Issue 03 (2013-02-20)

Frame Size
(Byte)

Rate Tested
(%)

(01,02,03) to
(01,02,05) (%)

(01,02,05) to
(01,02,03) (%)

Average (%)

64

100.00

88.507

88.507

88.507

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Frame Size
(Byte)

Rate Tested
(%)

(01,02,03) to
(01,02,05) (%)

(01,02,05) to
(01,02,03) (%)

Average (%)

128

100.00

88.730

88.745

88.737

256

100.00

88.851

88.831

88.841

512

100.00

88.876

88.846

88.861

1024

100.00

88.901

88.890

88.895

1280

100.00

88.878

88.878

88.878

1518

100.00

88.850

88.844

88.847

Table 12-76 lists the latency specifications of the N4EFS0. The values are obtained when the
SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The test duration is set to 60 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested
equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 10.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Table 12-76 Latency specifications of the N4EFS0

Issue 03 (2013-02-20)

Frame
Size
(Byte)

Rate
Tested
(%)

(01,02,03) to
(01,02,05) (us)CT (us)

Average
(CT) (us)

(01,02,03) to
(01,02,05)
(us)-S&F (us)

Average
(S&F) (us)

64

10.00

561.4

561.4

556.2

556.2

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Frame
Size
(Byte)

Rate
Tested
(%)

(01,02,03) to
(01,02,05) (us)CT (us)

Average
(CT) (us)

(01,02,03) to
(01,02,05)
(us)-S&F (us)

Average
(S&F) (us)

128

10.00

644.4

644.4

634.2

634.2

256

10.00

738.4

738.4

718.0

718.0

512

10.00

948.8

948.8

907.9

907.9

1024

10.00

1371.5

1371.5

1289.6

1289.6

1280

10.00

1604.1

1604.1

1501.7

1501.7

1518

10.00

1790.4

1790.4

1669.0

1669.0

Table 12-77 lists the back-to-back specifications of the N4EFS0. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission rate
is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is set to
a value more than 50 on the Smart Application.

The tested traffic is set to the wire speed.

The test duration is set to 10 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Table 12-77 Back-to-back specifications of the N4EFS0

Issue 03 (2013-02-20)

Frame Size
(Byte)

Rate Tested
(%)

(01,02,03) to
(01,02,05) Burst
Size (Number of
Frames)

(01,02,05) to
(01,02,03)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

1333

1335

2668

128

100.00

848

850

1698

256

100.00

586

587

1173

512

100.00

445

447

892

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Frame Size
(Byte)

Rate Tested
(%)

(01,02,03) to
(01,02,05) Burst
Size (Number of
Frames)

(01,02,05) to
(01,02,03)
(Number of
Frames)

Total
(Number of
Frames)

1024

100.00

224

224

448

1280

100.00

211

212

423

1518

100.00

201

201

402

NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EFS0 board of the N5 version.

Figure 12-23 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N5EFS0.
Figure 12-23 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, latency specifications, and back-to-back specifications of the N5EFS0
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-78 lists the throughput specifications of the N5EFS0. Table 12-79 lists the packet loss
ratio in the case of overloading of the N5EFS0. Table 12-80 lists the latency specifications of
the N5EFS0. Table 12-81 lists the back-to-back specifications of the N5EFS0.

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NOTE

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual environment
are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured 3 VC-3s are bound on the FE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-78 lists the throughput specifications of the N5EFS0. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 1%.

The test duration is set to 5 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): None

Mode: Uni-directional

Table 12-78 Throughput specifications of the N5EFS0


Frame Size
(byte)

Passed Rate (%)

(01,06,01) to (01,06,02)
(pks/sec)

Total (pks/sec)

64

100.00

148810

148810

128

100.00

84459

84459

256

100.00

45290

45290

512

100.00

23496

23496

1024

100.00

11973

11973

1280

100.00

9615

9615

1518

100.00

8127

8127

Table 12-79 lists the packet loss ratio in the case of overloading of the N5EFS0. The values are
obtained when the SmartApplication is set as follows:
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The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 5 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Table 12-79 Packet loss ratio in the case of overloading of the N5EFS0
Frame Size
(byte)

Rate Tested (%)

(01,06,01) to (01,06,02)
(%)

Average (%)

64

100.00

0.000

0.000

128

100.00

0.000

0.000

256

100.00

0.000

0.000

512

100.00

0.000

0.000

1024

100.00

0.000

0.000

1280

100.00

0.000

0.000

1518

100.00

0.000

0.000

Table 12-80 lists the latency specifications of the N5EFS0. The values are obtained when the
SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The test duration is set to 5 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested
equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.

CT: Cut Through (or FIFO),S&F: Store & Forward (or LIFO)

Measure on one receiving card only, Mode: SmartMetrics Comp. Mode

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Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

12 EoS Boards

Table 12-80 Latency specifications of the N5EFS0


Frame
Size
(byte)

Rate
Tested
(%)

(01,06,01) to
(01,06,02) (us)CT (us)

Average
(CT) (us)

(01,06,01) to
(01,06,02)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

124.3

124.3

119.2

119.2

128

100.00

137.4

137.4

127.2

127.2

256

100.00

169.6

169.6

149.2

149.2

512

100.00

211.5

211.5

170.6

170.6

1024

100.00

294.4

294.4

212.4

212.4

1280

100.00

334.5

334.5

232.1

232.1

1518

100.00

368.7

368.7

247.3

247.3

Table 12-81 lists the back-to-back specifications of the N5EFS0. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission rate
is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is set to
a value more than 50 on the SmartApplication.

The tested traffic is set to the wire speed.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

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Table 12-81 Back-to-back specifications of the N5EFS0


Frame Size
(byte)

Rate Tested (%)

(01,01,03) to (01,01,06)
Burst Size (frames)

Total (frames)

64

100.00

297620

297620

128

100.00

168918

168918

256

100.00

90580

90580

512

100.00

46992

46992

1024

100.00

23946

23946

1280

100.00

19230

19230

1518

100.00

16254

16254

Mechanical Specifications
The mechanical specifications of the EFS0 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight of the N1EFS0 (kg): 1.0

Weight of the N2EFS0 (kg): 1.0

Weight of the N4EFS0 (kg): 1.0

Weight of the N5EFS0 (kg): 0.6

Power Consumption
The maximum power consumption of the N1EFS0 at room temperature (25C) is 35 W.
The maximum power consumption of the N2EFS0 at room temperature (25C) is 35 W.
The maximum power consumption of the N4EFS0 at room temperature (25C) is 35 W.
The maximum power consumption of the N5EFS0 at room temperature (25C) is 22 W.

12.5 EFS0A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFS0A (16xFE switching and processing board). This topic also
describes how to configure and commission the EFS0A.

12.5.1 Version Description


The EFS0A is available in one functional version, namely, N1.

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12.5.2 Application
The EFS0A is used to transmit/receive Ethernet services, manage bandwidths, and realize Layer
2 switching of Ethernet services.
Figure 12-24 shows the typical networking and application of the Ethernet switching board. the
Ethernet switching board accesses and converges Ethernet services, and provides the Ethernet
data with the following data features: Layer 2 switching, port isolation, flow classification, traffic
control, VLAN management, and priority configuration. In addition, the Ethernet switching
board performs encapsulation/decapsulation, virtual concatenation, and SDH mapping/
demapping for data. The Ethernet switching board can be interconnected with the bandwidth
access equipment and the data communication equipment at the same time, thus to provide a
network-level solution.
Figure 12-24 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

12.5.3 Functions and Features


The EFS0A supports the Layer 2 switching, MPLS, and broadcast functions.
Table 12-82 provides the functions and features of the EFS0A.

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Table 12-82 Functions and features of the EFS0A


Funct
ion
and
Featu
re

Description

Basic
functi
ons

Processes 16xFE services.

Interfa
ce
types

l Supports 10BASE-T/100BASE-TX signals when the EFS0A is used with the


ETF8.

Functi
ons
when
being
used
with
an
interfa
ce
board

l Receives/Transmits 16xFE signals through the electrical interface when the


EFS0A is used with the ETF8.

Interfa
ce
charac
teristic
s

Working
modes

l Supports 100BASE-FX/LX signals when the EFS0A is used with the EFF8. The
optical interfaces comply with IEEE 802.3u.

l Receives/Transmits 16xFE signals through the optical interface when the EFS0A
is used with the EFF8.
l Receives/Transmits 8xFE signals through the electrical interface and 8xFE
signals through the optical interface when the EFS0A is used with the ETF8 and
EFF8.
l Provides the TPS protection for the 16xFE signals through the electrical interface
when the EFS0A is used with the ETS8 and TSB8.
l FE electrical port: auto-negotiation, 100M full-duplex, 100M halfduplex, 10M full-duplex, and 10M half-duplex
l FE optical port: 100M full-duplex
Traffic
control at
ports

Auto-negotiation mode

Supported (Not supported by FE


optical ports)

Non-autonegotiation mode

Supported

Query/
Supported
Setting of
port
status
Query of
interface
types

Supported

RMON
measure
ment

Supported

Setting of Not supported


optical
power
threshold
s

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Funct
ion
and
Featu
re

Servic
e
catego
ries

12 EoS Boards

Description

Pluggabl
e optical
module

Not supported

EPL
service

Supports the PORT-based transparent transmission.

EVPL
service

l Supports PORT-shared EVPL services.


l Supports VCTRUNK-shared EVPL services.
The services are isolated by VLAN tags.
The services are isolated by MPLS tags.
The services are isolated by QinQ tags.
l Supports a maximum of 4096 links.

EPLAN
service

l Supports the blacklist that can contain 2K records and also the static
MAC address table that can contain 2K records. The sum of the
number of records in the blacklist and the number of addresses in
the static MAC address table must not exceed 2K. The blacklist
function supports verification of destination MAC addresses only.
l Supports the self-learning of the source MAC address. The capacity
of the MAC address table is 16K. The aging time of the MAC
address can be set and queried.
l Supports the configuration of static MAC routes.
l N1EFS0, N2EFS0, and N5EFS0 boards support the query of
dynamic MAC addresses.
l Supports the query of dynamic MAC addresses.
l The maximum number of supported VBs is 16. The maximum
number of logical ports for each VB is 48.
l Queries the number of actually learned MAC addresses based on
VB+VLAN or VB+LP.
l Supports the EPLAN services that are based on the IEEE 802.1d
MAC bridge.

EVPLA
N service

l Supports data isolation based on VB+VLAN.


l Supports the setting of a maximum of 4096 VLAN services.
l Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge.
l Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge and IEEE 802.1ad provider bridge.

Servic
e
specifi

Issue 03 (2013-02-20)

Formats
of
Ethernet

IEEE 802.3

Supported

Ethernet II

Supported

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Funct
ion
and
Featu
re

Description

cation
s

data
frames

IEEE 802.1 q/p

Frame
length
range

l Supports the setting of the frame length to a value ranging from 1518
bytes to 9600 bytes.

Bound
bandwidt
h

48xVC-3, or 252xVC-12 + 36xVC-3

Mapping
granularit
ies

Supports VC-12, VC-3, VC-12-Xv (X 63), and VC-3-Xv (X 12)


granularities.

Encapsul
ation
formats

HDLC

Not supported

LAPS

Not supported

GFP-F

Supported

Supported

l Supports a jumbo frame with a maximum length of 9600 bytes.

MPLS
technolo
gy

Supports the MPLS.

VLAN
technolo
gy

Supports 4094 VLANs. The VLAN technology complies with IEEE


802.1q/p.

Maximu
m uplink
bandwidt
h

The maximum uplink bandwidth is 2.5 Gbit/s.

VCTRU
NK
specificat
ions

Number of supported VCTRUNKs: 32

The EFS0A can adapt to the bandwidth of the slot.

Configuration principles are as follows:


l A VCTRUNK can be bound with the VC-12 path or VC-3 path at
one time. A VCTRUNK should not be bound with VC-12 and VC-3
paths at the same time.
l VC-4s numbered 4, 8, 12, and 16 support the binding of VC-3 and
VC-12 paths. The other VC-4s support the binding of VC-3 paths
only.

Protec
tion
schem
es

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TPS

Supported

BPS

Not supported

PPS

Not supported

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Funct
ion
and
Featu
re

Clock
synchr
onizati
on

Description

DLAG

Not supported

LAG

Supports manual link aggregation and the load sharing mode that
comply with IEEE 802.3ad and IEEE 802.1AX.

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports the P2P LPT and P2MP LPT.

STP/
RSTP

Supports the broadcast packet suppression function and RSTP that


comply with IEEE 802.1w.

MSTP

Not supported

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Not supported
l Supports CC, LB tests, and LT tests in compliance with IEEE
802.1ag, LM and DM in compliance with ITU-T Y.1731, and OAM
ping in compliance with Huawei proprietary protocol.

Maint
enanc
e
featur
es

l Supports OAM auto-discovery, remote loopbacks, fault detection,


and link performance detection in compliance with IEEE 802.3ah,
and selfloop detection in compliance with Huawei proprietary
protocol.
Test
Frame

Supports test frames in ETH and GFP bearer modes.

Response
to ping

Not supported

Port
mirroring

Supports ingress mirroring.

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Inloops

MAC layer at Ethernet ports

Inloops

VC-4 level

Not supported

VC-3 level

Not supported

VC-12 level

Not supported

RMON

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Supports RMON of the Ethernet performance of Ethernet ports .

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Funct
ion
and
Featu
re

QoS

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Description

Warm
resets

Supported

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

l Supports the CAR. The granularity is 64 kbit/s.


l Supports the flow classification based on PORT, PORT+VLAN ID, or PORT
+VLAN ID+VLAN PRI.

IGMP
snoopi
ng

Traffi
c
contro
l

Protocol
enabling

Supported

Port
aging
time

Supported

Fast
leave

Not supported

Discardin
g of
unknown
broadcast
packets

Not supported

Static
broadcast
entry

Not supported

Supports the port-based traffic control function that complies with IEEE 802.3x.

12.5.4 Working Principle and Signal Flow


The EFS0A consists of the Ethernet access module, network processor module, mapping
module, interface converting module, logic and control module, clock module, and power
module.

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Figure 12-25 shows the functional block diagram of the EFS0A by describing how to process
1xFE signals.
Figure 12-25 Functional block diagram of the EFS0A
Backplane

Control

Switch
fabric

Data
Network processor module

Laser
shutdown

Interface
converting
module

VCP

Network
processor

DENCP

Ethernet
access
module

ENCP

FE

Cross-connect unit

Cross-connect unit

Mapping module

LOS
Communication
Reference clock and frame header

Logic and
control module

+3.3 V
Clock module

Power Fuse
module

Power
module

-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

50 77 125 155
MHz MHz MHz MHz

ENCP: data encapsulation module

SCC unit
SCC unit

Fuse

DENCP: decapsulation module

VCP: virtual concatenation processing module

Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or routers
are converted into electrical signals. If the signals are accessed through electrical interfaces, O/
E conversion is not required. At the PHY layer, the electrical signals are decoded and the
ETH_LOS alarm is detected. The electrical signals are converted from serial signals into parallel
signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module


The network processor module consists of the network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The following formats are supported:
l

MPLS

L2 MPLS VPN

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Ethernet/VLAN

In the receive direction, services are mapped and forwarded after the Tunnel and VC tags are
added according to the service configuration. In the transmit direction, the Tunnel or VC tag is
extracted based on the level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module supports the following functions:
l

Flow sense and flow classification

Unicast, multicast, and broadcast of the flow

Setting of data priorities

WFQ

Four CoSs

Mapping Module
The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.
The concatenation is performed. Then, the Ethernet signals are converted into SDH signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and HDLC
controller. This module is connected to external circuits through the bus. The logic and control
module performs the following functions:
l

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:
l

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

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Clock Module
The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.5.5 Front Panel


The front panel of the EFS0A has indicators and a bar code.

Diagram of the Front Panel


Figure 12-26 shows the appearance of the front panel of the EFS0A.
Figure 12-26 Front panel of the EFS0A

EFS0A
STAT
ACT
PROG
SRV

EFS0A

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Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the EFS0A has no interfaces. The interfaces are available on the ETF8 board
or on the EFF8 board.

12.5.6 Jumpers and DIP Switches


The EFS0A does not have any jumpers or DIP switches that are used for board settings.

12.5.7 Valid Slots


The EFS0A must be installed in a valid slot in the subrack. Otherwise, the EFS0A cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The EFS0A can be used with the ETF8, EFF8, and ETS8. When the ETS8 is used as the interface
board, the TSB8 must be used as the bridging board. For the slots valid for the EFS0A, ETS8,
and TSB8 when the EFS0A works with the ETS8 and TSB8, see 12.5.9 Board Protection.
The slots valid for the EFS0A vary with the cross-connect capacity of the subrack. The slots
valid for the EFS0A are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the EFS0A can be installed in slots 25 and
1316 in the subrack. In this case, the bandwidth is 2.5 Gbit/s.

Table 12-83 lists the slots valid for the EFS0A and the corresponding slots for the ETF8 and
EFF8.
Table 12-83 Slots valid for the EFS0A and the corresponding slots for the ETF8 and EFF8

Issue 03 (2013-02-20)

Slot Valid for the EFS0A

Corresponding Slot for the ETF8 and EFF8

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22
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Slot Valid for the EFS0A

Corresponding Slot for the ETF8 and EFF8

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

12.5.8 Feature Code


The EFS0A does not have the feature code.

12.5.9 Board Protection


The EFS0A supports the 1:1 TPS protection.
NOTE

TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing board.
Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

Figure 12-27 shows the slot configuration for the 1:1 TPS protection for the EFS0A.

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S
L
O
T
2
8

S
L
O
T
9

S
L
O
T
1
0

XCS

XCS

S S S S
L L L L
O O O O
T T T T
5 6 7 8

Working 1

Protection 1

S
L
O
T
4

S
L
O
T
3
0

S
L
O
T
3
1

S
L
O
T
3
2

S
L
O
T
3
3

S
L
O
T
3
4

S
L
O
T
3
5

S
L
O
T
3
6

S
L
O
T
3
7

FAN

FAN

S S S
L L L
O O O
T T T
1 2 3

S
L
O
T
2
9

AUX

S
L
O
T
2
7

FAN

S
L
O
T
1
1

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8

GSCC

S
L
O
T
2
6

TSB8

S
L
O
T
2
5

Protection 2

S
L
O
T
2
4

ETS8
TSB8

S
L
O
T
2
3

Working 2

S
L
O
T
2
2

ETS8

TSB8
ETS8
ETS8

S
L
O
T
2
1

PIU

S
L
O
T
2
0

PIU

S
L
O
T
1
9

TSB8

Figure 12-27 Slot configuration for the 1:1 TPS protection for the EFS0A

Fiber routing area

The board in slot 2 protects the board in slots 3 and the board in slot 16 protects the board in slot
15. The ETS8 is used with the working EFS0A and the TSB8 is used with the protection EFS0A.
Table 12-84 lists the slots for the EFS0A, ETS8, and TSB8.
Table 12-84 Slots for the EFS0A, ETS8, and TSB8

Issue 03 (2013-02-20)

Board

Protection Group 1

Protection Group 2

EFS0A (protection)

Slot 2

Slot 16

EFS0A (working)

Slot 3

Slot 15

TSB8

Slots 19 and 20

Slots 35 and 36

ETS8

Slots 21 and 22

Slots 33 and 34

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12.5.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring Ethernet Services.
Step 3 Required: Set the Ethernet interface.
l Set the overhead byte as follows:
J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.
l Set the Ethernet interface as follows:
Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.
Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of
traffic, services may be completely interrupted.
For details, see 28.7 Checking Board Parameters.
NOTE

For more information about the parameters of the board, see 27.4.2 Ethernet Parameters.

Step 4 Optional: Configure the Layer 2 switching management service, including the following tasks:
l Enabling the IGMP Snooping Protocol
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l Configuring the Spanning Tree


l Setting the Aging Time for the Multicast Router Port
Step 5 Optional: Configure the QoS. For details, see Configuring QoS.
Step 6 Optional: Configure the link aggregation function on the Ethernet port. For details, see Creating
a LAG.
Step 7 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

12.5.11 Configuring the Board Functions


The EFS0A supports multiple Ethernet functions and features such as Layer 2 switching, LCAS,
and QoS. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EFS0A by using the U2000:
l

LCAS

QoS

LPT

LAG

ETH OAM

Test Frame

STP/RSTP

IGMP Snooping

12.5.12 Parameter Settings


You can set parameters for the EFS0A by using the U2000.
You can set the following main parameters for the EFS0A by using the U2000:
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Working mode

LCAS

Maximum frame length

Mapping protocol

12 EoS Boards

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

12.5.13 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 12-85 lists the faults that occur on the EFS0A frequently and the troubleshooting methods.
Table 12-85 Methods used to troubleshoot the faults that occur on the EFS0A frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on a single


Ethernet port are interrupted.
l The services on all the Ethernet
ports are interrupted.
Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The services on a single


Ethernet port are transiently
interrupted.
l The protocol becomes
abnormal.
l The negotiated working mode
of the Ethernet ports is the halfduplex mode.

Packet loss

See Troubleshooting Service


Packet Loss.

l Bit errors occur on the line side.


Interconnection
fault

l The interconnection fault


occurs on a single Ethernet port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCG port.
l The LCAS interconnection
fault occurs.

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Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EFS0A, see Replacing an EOS Board.

12.5.14 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

12.5.14.1 Alarms of N1EFS0A

Issue 03 (2013-02-20)

ALM_GFP_dLFD

ALM_GFP_dCSF

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_LOS

FCS_ERR

FPGA_ABN

HARD_BAD

HP_LOM

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LPT_RFI

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

LSR_NO_FITED

NO_BD_SOFT

TEMP_OVER

TD

T_LOSEX

TU_LOP_VC12

TU_AIS_VC12

TU_AIS_VC3

VCAT_LOM_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_SQM_VC3

VCAT_LOM_VC3

VCAT_SQM_VC12

VCTRUNK_NO_FLOW

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_UNEXPERI

ETH_NO_FLOW

ETHOAM_DISCOVER_FA
IL

ETHOAM_RMT_CRIT_FA
ULT

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_L
OOP

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

FLOW_OVER

LASER_MOD_ERR

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

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LCAS_TLCT

LINK_ERR

LSR_WILL_DIE

LTEMP_OVER

IN_PWR_HIGH

IN_PWR_LOW

OUT_PWR_HIGH

OUT_PWR_LOW

SUBCARD_ABN

TF

TPS_ALM

TR_LOC

WRG_BD_TYPE

12.5.15 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

12.5.15.1 Performance Events of N1EFS0A


Table 12-86 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

XCSTMPCUR

XCSTMPMAX

XCSTMPMIN

Table 12-87 RMON alarm

Issue 03 (2013-02-20)

DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

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Table 12-88 Statistics of RMON basic performance


Packets Received(64
Octets in Length)(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets Received(256~511
Octets in Length)(packets)

Packets Received(512~1023
Octets in Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

Multicast Packets Received


(packets)

Broadcast Packets Received


(packets)

Drop Events(times)

Undersize Packets
Received(packets)

Oversize Packets Received


(packets)

Fragments(packets)

Jabbers(packets)

Collisions(times)

Octets Received(Byte)

Packets Received(packets)

Table 12-89 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)(packets)

Packets Transmitted
(65~127 Octets in Length)
(packets)

Packets Transmitted(128~255
Octets in Length)(packets)

Packets Transmitted
(256~511 Octets in Length)
(packets)

Packets Transmitted
(512~1023 Octets in
Length)(packets)

Packets Transmitted
(1024~1518 Octets in Length)
(packets)

Unicast Packets Received


(packets)

Unicast Packets
Transmitted(packets)

Multicast Packets Transmitted


(packets)

Broadcast Packets
Transmitted(packets)

Good Octets Transmitted


(Byte)

Alignment Errors(frames)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Speed


Transmitted(Byte/s)

Good Full Frame Octets


Received(Byte)

Good Full Frame Octets


Transmitted(Byte)

12.5.16 Technical Specifications


The technical specifications of the EFS0A include the dimensions, weight, and power
consumption.

Ethernet Performance Specifications


NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EFS0A board of the N1 version.

Figure 12-28 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the EFS0A.
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Figure 12-28 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, latency specifications, and back-to-back specifications
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-90 lists the throughput specifications of the EFS0A. Table 12-91 lists the packet loss
ratio in the case of overloading of the EFS0A. Table 12-92 lists the latency specifications of the
EFS0A. Table 12-93 lists the back-to-back specifications of the EFS0A.
NOTE

The specifications vary according to the configuration and networking of the test environment, port
rate, and VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured, one VC-3 is bound on the FE port, and the MAC port is set to auto-negotiation mode.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-90 lists the throughput specifications of the EFS0A. The values are obtained when the
SmartApplication is set as follows:
l

Test duration (sec): 3

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 53.33

Maximum rate (%): 54.00

Resolution rate (%): 0.01

Mode: bidirectional

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Table 12-90 Throughput specifications of the EFS0A


Frame Size
(Byte)

Passed Rate
(%)

(01,11,01) to
(01,11,02) (pks/
sec)

(01,11,02) to
(01,11,01) (pks/
sec)

Total (pks/
sec)

64

53.50

79618

79618

159236

128

51.21

43253

43253

86506

256

49.95

22624

22624

45248

512

49.31

11585

11585

23170

1024

49.14

5884

5884

11768

1280

49.15

4726

4726

9452

1518

49.19

3998

3998

7996

Table 12-91 lists the packet loss ratio in the case of overloading of the EFS0A. The values are
obtained when the SmartApplication is set as follows:
l

Test duration (sec): 10

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Table 12-91 Packet loss ratio in the case of overloading of the EFS0A

Issue 03 (2013-02-20)

Frame Size
(Byte)

Rate Tested
(%)

(01,11,01) to
(01,11,02) (%)

(01,11,02) to
(01,11,01) (%)

Average (%)

64

100.00

46.497

46.497

46.497

128

100.00

48.820

48.820

48.820

256

100.00

50.127

50.127

50.127

512

100.00

50.804

50.804

50.804

1024

100.00

51.115

51.115

51.115

1280

100.00

51.159

51.159

51.159

1518

100.00

51.176

51.176

51.176

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Table 12-92 lists the latency specifications of the EFS0A. The values are obtained when the
SmartApplication is set as follows:
l

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested
equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Test duration (sec): 100

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Table 12-92 Latency specifications of the EFS0A


Frame
Size
(Byte)

Rate
Tested
(%)

(01,11,01) to
(01,11,02) (us)CT (us)

Average
(CT) (us)

(01,11,01) to
(01,11,02)
(us)-S&F (us)

Average
(S&F) (us)

64

40.00

164.3

164.3

159.2

159.2

128

40.00

199.0

199.0

188.8

188.8

256

40.00

247.0

247.0

226.6

226.6

512

40.00

357.6

357.6

357.6

357.6

1024

40.00

514.8

514.8

432.9

432.9

1280

40.00

613.1

613.1

510.7

510.7

1518

40.00

699.4

699.4

578.0

578.0

Table 12-93 lists the back-to-back specifications of the EFS0A. The values are obtained when
the SmartApplication is set as follows:
l

Test duration (sec): 2

Minimum frame size (byte): 64

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Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

12 EoS Boards

Table 12-93 Back-to-back specifications of the EFS0A


Frame Size
(Byte)

Rate Tested
(%)

(01,11,01) to
(01,11,02) Burst
Size (Number of
Frames)

(01,11,02) to
(01,11,01)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

353

353

706

128

100.00

342

342

684

256

100.00

380

380

761

512

100.00

368

368

736

1024

100.00

282

282

564

1280

100.00

279

279

559

1518

100.00

291

291

582

Mechanical Specifications
The mechanical specifications of the EFS0A are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.7

Power Consumption
The maximum power consumption of the EFS0A at room temperature (25C) is 32 W.

12.6 EFS4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFS4 (4xFE switching and processing board). This topic also
describes how to configure and commission the EFS4.

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12.6.1 Version Description


The EFS4 is available in three functional versions, namely, N1, N2 and N3. The difference
between the three versions is their different maximum uplink bandwidths. The N1EFS4 is
discontinued.
Table 12-94 describes the versions of the EFS4.
Table 12-94 Versions of the EFS4
Item

Description

Functional versions

The EFS4 is available in three functional versions, namely, N1, N2


and N3.

Differences

l Regarding service specifications: MTU, bound bandwidth,


maximum uplink bandwidth, VCTRUNK specifications
l Regarding protection schemes: LCAS, LPT, LAG
l Regarding maintenance features: ETH OAM, test frame, port
mirroring, loopback capability, warm resets
l QoS

Substitution

l The N2EFS4 can substitute for the N1EFS4.


l The N3EFS4 can substitute for the N2EFS4 and N1EFS4.

12.6.2 Application
The EFS4 is used to transmit/receive Ethernet services, manage bandwidths, and realize Layer
2 switching of Ethernet services.
Figure 12-29 shows the typical networking and application of the Ethernet switching board. the
Ethernet switching board accesses and converges Ethernet services, and provides the Ethernet
data with the following data features: Layer 2 switching, port isolation, flow classification, traffic
control, VLAN management, and priority configuration. In addition, the Ethernet switching
board performs encapsulation/decapsulation, virtual concatenation, and SDH mapping/
demapping for data. The Ethernet switching board can be interconnected with the bandwidth
access equipment and the data communication equipment at the same time, thus to provide a
network-level solution.

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Figure 12-29 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

12.6.3 Functions and Features


The EFS4 supports the Layer 2 switching, MPLS, and broadcast functions.
Table 12-95 provides the functions and features of the EFS4.
Table 12-95 Functions and features of the EFS4

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Funct
ion
and
Featu
re

Description

Basic
functi
ons

Processes 4xFE services.

Interfa
ce
types

Supports 10BASE-T/100BASE-TX signals. The optical interfaces comply with


IEEE 802.3u.

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Funct
ion
and
Featu
re

Description

Functi
ons
when
being
used
with
an
interfa
ce
board

Receives/Transmits 4xFE signals by providing interfaces on the front panel.

Interfa
ce
charac
teristic
s

Working
modes

Auto-negotiation, 100M full-duplex, 100M half-duplex, 10M fullduplex, and 10M half-duplex

Traffic
control at
ports

Auto-negotiation mode

Supported

Non-autonegotiation mode

Supported

Query/
Supported
Setting of
port
status
Query of
interface
types

Supported

Setting of Not supported


optical
power
threshold
s

Servic
e
catego
ries

Pluggabl
e optical
module

Not supported

EPL
service

Supports the PORT-based transparent transmission.

EVPL
service

l Supports PORT-shared EVPL services.


l Supports VCTRUNK-shared EVPL services.
The services are isolated by VLAN tags.
The services are isolated by MPLS tags.
The services are isolated by QinQ tags.
l Supports a maximum of 4096 links.

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Description

EPLAN
service

The N2EFS4 and N3EFS4 support the EPLAN services that are based
on the IEEE 802.1d MAC bridge.
l Supports switching on the client and SDH sides.
l Supports the blacklist that can contain 2K records and also the static
MAC address table that can contain 2K records. The sum of the
number of records in the blacklist and the number of addresses in
the static MAC address table must not exceed 2K. The blacklist
function of N3EFS4 boards supports verification of destination
MAC addresses only.
l Supports the self-learning of the source MAC address. The capacity
of the MAC address table is 16K. The aging time of the MAC
address can be set and queried.
l Supports the configuration of static MAC routes.
l N2EFS4 and N3EFS4 boards support the query of dynamic MAC
addresses.
l N1EFS4 boards do not support the query of dynamic MAC
addresses.
l The maximum number of supported VBs is 16. The maximum
number of logical ports for each VB is 30.
l Queries the number of actually learned MAC addresses based on
VB+VLAN or VB+LP.

Servic
e
specifi
cation
s

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EVPLA
N
services

l Supports data isolation based on VB+VLAN.

Formats
of
Ethernet
data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1 q/p

Supported

l Supports the setting of a maximum of 4096 VLAN services.


l Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge.

Frame
length
range

l Supports the setting of the frame length to a value ranging from 1518
bytes to 9600 bytes.

Bound
bandwidt
h

l N1EFS4: 12xVC-3, or 63xVC-12 + 9xVC-3

Mapping
granularit
ies

Supports VC-12, VC-3, VC-12-Xv (X 63), and VC-3-Xv (X 12)


granularities.

l Supports a jumbo frame with a maximum length of 9600 bytes.

l N2EFS4/N3EFS4: 24xVC-3 or 126xVC-12 + 18xVC-3

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Description

Encapsul
ation
formats

HDLC

Not supported

LAPS

Not supported

GFP-F

Supported

MPLS
technolo
gy

Supports the MPLS.

VLAN
technolo
gy

Supports 4094 VLANs. The VLAN technology complies with IEEE


802.1q/p.

Maximu
m uplink
bandwidt
h

l The maximum uplink bandwidth of the N1EFS4 is 622 Mbit/s.

VCTRU
NK
specificat
ions

l The number of VCTRUNKs supported by the N1EFS4 is 12.

l The maximum uplink bandwidth of the N2EFS4 and N3EFS4 is 1.25


Gbit/s.
l The EFS4 can adapt to the bandwidth of the slot.

l The number of VCTRUNKs supported by the N2EFS4 and N3EFS4


is 24.
Configuration principles are as follows:
l A VCTRUNK can be bound with the VC-12 path or VC-3 path at
one time. A VCTRUNK should not be bound with VC-12 and VC-3
paths at the same time.
l VCTRUNK 1VCTRUNK 12 can be bound with VC-4s numbered
14 only. VCTRUNK 13VCTRUNK 24 can be bound with VC-4s
numbered 58 only.
l VC-4s numbered 4 and 8 support the binding of VC-3 and VC-12
paths. The other VC-4s support the binding of VC-3 paths only.

Protec
tion
schem
es

TPS

Not supported

BPS

Not supported

PPS

Not supported

DLAG

Not supported

LCAS

Not supported by the N1EFS4


Dynamically increases or decreases the bandwidth and protects the
bandwidth in compliance with ITU-T G.7042. This protection scheme
is supported by the N2EFS4/N3EFS4.

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Description

l The N1EFS4 supports the P2P LPT.

LPT

l The N2EFS4 and N3EFS4 support the P2P LPT and P2MP LPT.
l LPT complies with ITU-T G.7042.

Clock
synchr
onizati
on

STP/
RSTP

Supports the broadcast packet suppression function and RSTP that


comply with IEEE 802.1w.

MSTP

Not supported

LAG

The N1EFS4 does not support this protection scheme. The N2EFS4/
N3EFS4 supports manual link aggregation and the load sharing mode
that comply with IEEE 802.3ad and IEEE 802.1AX.

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Does not support the high-precision time.


l The N1EFS4 does not support the ETH OAM function.

Maint
enanc
e
featur
es

l N2EFS4 and N3EFS4 boards support CC, LB tests, and LT tests in


compliance with IEEE 802.1ag, LM and DM in compliance with
ITU-T Y.1731, and OAM ping in compliance with Huawei
proprietary protocol.
l N2EFS4 and N3EFS4 boards support OAM auto-discovery, remote
loopbacks, fault detection, and link performance detection in
compliance with IEEE 802.3ah, and selfloop detection in
compliance with Huawei proprietary protocol.

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Test
Frame

l The N1EFS4 supports test frames in Ethernet bearer mode.

Response
to ping

Not supported

Port
mirroring

The N3EFS4 supports ingress mirroring.

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Supports inloops

MAC layer at Ethernet ports

Supports inloops

VC-4 level

Not supported

VC-3 level

The N1EFS4/N2EFS4 supports


inloops and outloops.

l The N2EFS4/N3EFS4 supports test frames in Ethernet/GFP bearer


mode.

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VC-12 level

QoS

12 EoS Boards

Not supported

RMON

Supports Ethernet performance monitoring at the port level.

Warm
resets

N1EFS4/N2EFS4/N3EFS4 boards support warm resets. If a warm reset


is performed on an N1EFS4 board, traffic on the board is interrupted,
whereas if a warm reset is performed on an N2EFS4/N3EFS4 board,
traffic on the board is not interrupted. If an N2EFS4/N3EFS4 board
substitutes for an N1EFS4 board, traffic on the N2EFS4/N3EFS4 board
is not interrupted.

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

l Supports the CAR. The granularity is 64 kbit/s.


l The N1EFS4 supports the service classification based on PORT, PORT+VLAN
ID, or PORT+VLAN PRI.
l The N2EFS4 and N3EFS4 support the flow classification based on PORT, PORT
++VLAN ID, or PORT+VLAN ID+VLAN PRI.

IGMP
snoopi
ng

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Protocol
enabling

Supported

Port
aging
time

Supported

Fast
leave

Not supported

Discardin
g of
unknown
broadcast
packets

Not supported

Static
broadcast
entry

Not supported

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Funct
ion
and
Featu
re

Description

Traffi
c
contro
l

Supports the port-based traffic control function that complies with IEEE 802.3x.

12.6.4 Working Principle and Signal Flow


The EFS4 consists of the Ethernet access module, network processor module, mapping module,
interface converting module, logic and control module, clock module, and power module.
Figure 12-30 shows the functional block diagram of the EFS4 by describing how to process
1xFE signals.
Figure 12-30 Functional block diagram of the EFS4
Backplane

Control

Switch
fabric

Data
Network processor module

Interface
converting
module

VCP

Network
processor

DENCP

Ethernet
access
module

ENCP

FE

Cross-connect unit

Cross-connect unit

Mapping module

LOS
Communication
Reference clock and frame header

Logic and
control module

+3.3 V
Clock module

Power Fuse
module

Power
module

-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

50 77 125 155
MHz MHz MHz MHz

ENCP: data encapsulation module

SCC unit
SCC unit

Fuse

DENCP: decapsulation module

VCP: virtual concatenation processing module

Ethernet Access Module


In the receive direction, the Ethernet access module receives the Ethernet electrical signals from
Ethernet equipment such as switches or routers. At the PHY layer, the electrical signals are
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decoded and the ETH_LOS alarm is detected. The electrical signals are converted from serial
signals into parallel signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY layer,
signals are encoded.

Network Processor Module


The network processor module consists of the network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The following formats are supported:
l

MPLS

L2 MPLS VPN

Ethernet/VLAN

In the receive direction, services are mapped and forwarded after the Tunnel and VC tags are
added according to the service configuration. In the transmit direction, the Tunnel or VC tag is
extracted based on the level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module supports the following functions:
l

Flow sense and flow classification

Unicast, multicast, and broadcast of the flow

Setting of data priorities

WFQ

Four CoSs

Mapping Module
The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.
The concatenation is performed. Then, the Ethernet signals are converted into SDH signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and HDLC
controller. This module is connected to external circuits through the bus. The logic and control
module performs the following functions:
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Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:
l

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Implements communication.

Controls indicators.

Clock Module
The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.6.5 Front Panel


The front panel of the EFS4 has indicators, interfaces, and a bar code.

Diagram of the Front Panel


Figure 12-31 shows the appearance of the front panel of the EFS4.

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Figure 12-31 Front panel of the EFS4

EFS4
STAT
ACT
PROG
SRV

FE1

FE2

FE3

FE4

EFS4

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 24 Indicators.

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Interfaces
The front panel of the EFS4 has four FE interfaces. Table 12-96 describes the types and usage
of the interfaces of the EFS4. For information about the cables connected to the interfaces, see
23.4.6 Straight-Through Cable and 23.4.7 Crossover Cable.
Table 12-96 Interfaces of the EFS4
Interface

Type of
Interface

Usage

FE1

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE2

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE3

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE4

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

Table 12-97 describes the pins of the RJ45 connector.


Table 12-97 Pins of the RJ45 connector
Pin

Description

Positive data transmit end

Negative data transmit end

Positive data receive end

Grounding

Grounding

Negative data receive end

Grounding

Grounding

12.6.6 Jumpers and DIP Switches


The EFS4 does not have any jumpers or DIP switches that are used for board settings.

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12.6.7 Valid Slots


The EFS4 must be installed in a valid slot in the subrack. Otherwise, the EFS4 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the EFS4 vary with the cross-connect capacity of the subrack.
The relationship between the slots valid for the EFS4 and the bandwidth is as follows:
l

When the cross-connect capacity is 200 Gbit/s, the EFS4 can be installed in slots 18 and
1117.
When the N1EFS4 is installed in slots 18 and 1117, the bandwidth is 622 Mbit/s.
When the N2EFS4 or N3EFS4 is installed in slots 18 and 1117, the bandwidth is 1.25
Gbit/s.

12.6.8 Feature Code


The EFS4 does not have the feature code.

12.6.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End
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Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring Ethernet Services.
Step 3 Required: Set the Ethernet interface.
l Set the overhead byte as follows:
J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.
l Set the Ethernet interface as follows:
Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.
Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of
traffic, services may be completely interrupted.
For details, see 28.7 Checking Board Parameters.
NOTE

For more information about the parameters of the board, see 27.4.2 Ethernet Parameters.

Step 4 Optional: Configure the L2 switching management service. Perform the following tasks:
l Enabling the IGMP Snooping Protocol
l Configuring the Spanning Tree
l Setting the Aging Time for the Multicast Router Port
Step 5 Optional: Configure the aggregation function for the Ethernet port. For details, see Creating a
LAG.
Step 6 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
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cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

12.6.10 Configuring the Board Functions


The EFS4 supports multiple Ethernet functions and features such as Layer 2 switching, LCAS,
and QoS. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EFS4 by using the U2000:
l

LCAS

QoS

LPT

LAG

ETH OAM

Test Frame

STP/RSTP

IGMP Snooping

12.6.11 Parameter Settings


You can set parameters for the EFS4 by using the U2000.
You can set the following main parameters for the EFS4 by using the U2000:
l

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

12.6.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 12-98 lists the faults that occur on the EFS4 frequently and the troubleshooting methods.

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Table 12-98 Methods used to troubleshoot the faults that occur on the EFS4 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on a single


Ethernet port are interrupted.
l The services on all the Ethernet
ports are interrupted.
Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The services on a single


Ethernet port are transiently
interrupted.
l The protocol becomes
abnormal.
l The negotiated working mode
of the Ethernet ports is the halfduplex mode.

Packet loss

See Troubleshooting Service


Packet Loss.

l Bit errors occur on the line side.


Interconnection
fault

l The interconnection fault


occurs on a single Ethernet port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCG port.
l The LCAS interconnection
fault occurs.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EFS4, see Replacing an EOS Board.

12.6.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

12.6.13.1 Alarms of N1EFS4

Issue 03 (2013-02-20)

ALM_GFP_dLFD

AU_AIS

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

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BIP_SD

COMMUN_FAIL

ETH_LOS

FCS_ERR

FPGA_ABN

HARD_BAD

LCAS_BAND_DECREASED

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_RFI

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

TU_AIS_VC12

NO_BD_SOFT

TU_LOP_VC12

TU_LOP_VC3

T_LOS

VCAT_LOM_VC12

VCAT_LOM_VC3

TU_AIS_VC3

VCAT_SQM_VC3

W_R_FAIL

VCAT_LOA

PATCH_ERR

PATCHFILE_NOTEXIST

VCAT_SQM_VC12

PATCH_NOT_CONFIRM

PROTOCOL_MM

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.6.13.2 Alarms of N2EFS4

Issue 03 (2013-02-20)

ALM_GFP_dLFD

AU_AIS

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_LOS

ETHOAM_DISCOVER_F
AIL

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_RMT_CRIT_F
AULT

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_L
OOP

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNFL
CT

FCS_ERR

FLOW_OVER

FPGA_ABN

HARD_BAD

HP_LOM

LAG_FAIL

LCAS_FOPT

LCAS_PLCR

LCAS_FOPR

LCAS_TLCR

LCAS_TLCT

LCAS_PLCT

LP_RDI_VC12

LP_RDI_VC3

LOOP_ALM

LP_REI_VC3

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LP_SLM_VC12

LP_REI_VC12

LP_TIM_VC12

LP_TIM_VC3

LP_SLM_VC3

LP_UNEQ_VC3

LPT_RFI

LP_UNEQ_VC12

NO_BD_SOFT

SLAVE_WORKING

TU_AIS_VC3

T_LOS

TU_AIS_VC12

VCAT_LOA

TU_LOP_VC12

TU_LOP_VC3

VCAT_LOM_VC3

VCAT_LOM_VC12

TR_LOC

T_LOSEX

ALM_GFP_dCSF

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.6.13.3 Alarms of N3EFS4

Issue 03 (2013-02-20)

ALM_GFP_dCSF

ALM_GFP_dLFD

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_UNEXPERI

ETH_LOS

ETH_NO_FLOW

ETHOAM_DISCOVER_F
AIL

ETHOAM_RMT_CRIT_FA
ULT

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_L
OOP

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

FCS_ERR

FLOW_OVER

FPGA_ABN

HARD_BAD

HP_LOM

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

LPT_RFI

NO_BD_SOFT

T_LOSEX

TEMP_OVER

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TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_SQM_VC12

VCAT_SQM_VC3

VCTRUNK_NO_FLOW

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.6.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

12.6.14.1 Performance Events of N1EFS4


Table 12-99 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

Table 12-100 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Table 12-101 Statistics of RMON basic performance


Packets Received(64
Octets in Length)
(packets)

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Packets Received(65~127
Octets in Length)(packets)

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Packets Received
(256~511 Octets in
Length)(packets)

Packets Received(512~1023
Octets in Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

Multicast Packets
Received(packets)

Broadcast Packets Received


(packets)

Drop Events(times)

Undersize Packets
Received(packets)

Oversize Packets Received


(packets)

Fragments(packets)

Jabbers(packets)

Collisions(times)

Octets Received(Byte)

Packets Received
(packets)

Table 12-102 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)(packets)

Packets Transmitted(65~127
Octets in Length)(packets)

Packets Transmitted(128~255
Octets in Length)(packets)

Packets Transmitted
(256~511 Octets in
Length)(packets)

Packets Transmitted
Packets Transmitted
(512~1023 Octets in Length) (1024~1518 Octets in Length)
(packets)
(packets)

Unicast Packets Received


(packets)

Unicast Packets Transmitted


(packets)

Multicast Packets Transmitted


(packets)

Broadcast Packets
Transmitted(packets)

Good Octets Transmitted


(Byte)

Alignment Errors(frames)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Octets


Transmitted(Byte)

Good Full Frame Octets


Received(Byte)

Good Full Frame Speed


Transmitted(Byte/s)

12.6.14.2 Performance Events of N2EFS4


Table 12-103 SDH

Issue 03 (2013-02-20)

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

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LPSES

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LPUAS

Table 12-104 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Table 12-105 Statistics of RMON basic performance


Packets Received(64
Octets in Length)
(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets Received
(256~511 Octets in
Length)(packets)

Packets Received(512~1023
Octets in Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

Multicast Packets
Received(packets)

Broadcast Packets Received


(packets)

Drop Events(times)

Undersize Packets
Received(packets)

Oversize Packets Received


(packets)

Fragments(packets)

Jabbers(packets)

Collisions(times)

Octets Received(Byte)

Packets Received
(packets)

Table 12-106 Statistics of RMON extended performance

Issue 03 (2013-02-20)

Packets Transmitted(64
Octets in Length)(packets)

Packets Transmitted(65~127
Octets in Length)(packets)

Packets Transmitted
(256~511 Octets in
Length)(packets)

Packets Transmitted
Packets Transmitted
(512~1023 Octets in Length) (1024~1518 Octets in Length)
(packets)
(packets)

Unicast Packets Received


(packets)

Unicast Packets Transmitted


(packets)

Multicast Packets Transmitted


(packets)

Broadcast Packets
Transmitted(packets)

Good Octets Transmitted


(Byte)

Alignment Errors(frames)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Octets


Transmitted(Byte)

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Good Full Frame Octets


Received(Byte)

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Good Full Frame Speed


Transmitted(Byte/s)

12.6.14.3 Performance Events of N3EFS4


Table 12-107 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

XCSTMPCUR

XCSTMPMAX

XCSTMPMIN

Table 12-108 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Table 12-109 Statistics of RMON basic performance


Packets Received(64
Octets in Length)(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets Received(256~511
Octets in Length)(packets)

Packets Received(512~1023
Octets in Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

Multicast Packets Received


(packets)

Broadcast Packets Received


(packets)

Drop Events(times)

Undersize Packets
Received(packets)

Oversize Packets Received


(packets)

Fragments(packets)

Jabbers(packets)

Collisions(times)

Octets Received(Byte)

Packets Received(packets)

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Table 12-110 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)(packets)

Packets Transmitted
(65~127 Octets in Length)
(packets)

Packets Transmitted(128~255
Octets in Length)(packets)

Packets Transmitted
(256~511 Octets in Length)
(packets)

Packets Transmitted
(512~1023 Octets in
Length)(packets)

Packets Transmitted
(1024~1518 Octets in Length)
(packets)

Unicast Packets Received


(packets)

Unicast Packets
Transmitted(packets)

Multicast Packets Transmitted


(packets)

Broadcast Packets
Transmitted(packets)

Good Octets Transmitted


(Byte)

Alignment Errors(frames)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Speed


Transmitted(Byte/s)

Good Full Frame Octets


Received(Byte)

Good Full Frame Octets


Transmitted(Byte)

12.6.15 Technical Specifications


The technical specifications of the EFS4 include the dimensions, weight, and power
consumption.

Parameters Specified for Electrical Interfaces


Table 12-111 lists the parameters specified for the electrical interfaces of the EFS4.
Table 12-111 Parameters specified for the optical interfaces of the EFS4
Parameter

Value

Nominal bit rate

10 Mbit/s or 100 Mbit/s

Line code pattern

Manchester encoding signal (10M) or MLT-3 encoding signal


(100M)

Specifications of the
interface

Complies with IEEE 802.3u.

Ethernet Performance Specifications


NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EFS4 board of the N2 version.

Figure 12-32 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N2EFS4.
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Figure 12-32 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, latency specifications, and back-to-back specifications of the N2EFS4
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-112 lists the throughput specifications of the N2EFS4. Table 12-113 lists the packet
loss ratio in the case of overloading of the N2EFS4. Table 12-114 lists the latency specifications
of the N2EFS4. Table 12-115 lists the back-to-back specifications of the N2EFS4.
NOTE

The specifications vary according to the configuration and networking of the test environment, port
rate, and VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and five VC-12s are bound on the FE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-112 lists the throughput specifications of the N2EFS4. The values are obtained when
the SmartApplication is set as follows:
l

Test duration (sec): 10

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 10.00

Maximum rate (%): 15.00

Resolution rate (%): 0.01

Mode: bidirectional

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Table 12-112 Throughput specifications of the N2EFS4


Frame Size
(Byte)

Passed Rate
(%)

(01,02,03) to
(01,02,05) (pks/
sec)

(01,02,05) to
(01,02,03) (pks/
sec)

Total (pks/
sec)

64

11.41

16984

16984

33968

128

11.18

9441

9441

18882

256

11.10

5026

5026

10052

512

11.09

2605

2605

5210

1024

11.00

1317

1317

2634

1280

11.09

1066

1066

2132

1518

11.07

900

900

1800

Table 12-113 lists the packet loss ratio in the case of overloading of the N2EFS4. The values
are obtained when the SmartApplication is set as follows:
l

Test duration (sec): 10

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Table 12-113 Packet loss ratio in the case of overloading of the N2EFS4

Issue 03 (2013-02-20)

Frame Size
(Byte)

Rate Tested
(%)

(01,02,03) to
(01,02,05) (%)

(01,02,05) to
(01,02,03) (%)

Average (%)

64

100.00

88.510

88.513

88.512

128

100.00

88.724

88.729

88.726

256

100.00

88.858

88.859

88.859

512

100.00

88.858

88.861

88.859

1024

100.00

88.888

88.914

88.901

1280

100.00

88.895

88.875

88.885

1518

100.00

88.870

88.871

88.870

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Table 12-114 lists the latency specifications of the N2EFS4. The values are obtained when the
SmartApplication is set as follows:
l

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested
equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Test duration (sec): 10

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 10.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Table 12-114 Latency specifications of the N2EFS4


Frame
Size
(Byte)

Rate
Tested
(%)

(01,02,03) to
(01,02,05) (us)CT (us)

Average
(CT) (us)

(01,02,03) to
(01,02,05)
(us)-S&F (us)

Average
(S&F) (us)

64

10.00

586.1

586.1

581.0

581.0

128

10.00

644.4

644.4

634.2

634.2

256

10.00

726.3

726.3

705.9

705.9

512

10.00

969.0

969.0

928.1

928.1

1024

10.00

1382.6

1382.6

1300.6

1300.6

1280

10.00

1609.0

1609.0

1506.6

1506.6

1518

10.00

1804.9

1804.9

1683.4

1683.4

Table 12-115 lists the back-to-back specifications of the N2EFS4. The values are obtained when
the SmartApplication is set as follows:
l

Test duration (sec): 10

Minimum frame size (byte): 64

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Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

12 EoS Boards

Table 12-115 Back-to-back specifications of the N2EFS4


Frame Size
(Byte)

Rate Tested
(%)

(01,02,03) to
(01,02,05) Burst
Size (Number of
Frames)

(01,02,05) to
(01,02,03)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

1337

1339

2676

128

100.00

852

852

1704

256

100.00

583

583

1166

512

100.00

441

441

882

1024

100.00

225

228

453

1280

100.00

210

210

420

1518

100.00

200

200

400

NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EFS4 board of the N3 version.

Figure 12-33 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N3EFS4.
Figure 12-33 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, latency specifications, and back-to-back specifications of the N3EFS4
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

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Table 12-116 lists the throughput specifications of the N3EFS4. Table 12-117 lists the packet
loss ratio in the case of overloading of the N3EFS4. Table 12-118 lists the latency specifications
of the N3EFS4. Table 12-119 lists the back-to-back specifications of the N3EFS4.
NOTE

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual environment
are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and three VC-3s are bound on the FE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-116 lists the throughput specifications of the N3EFS4. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 1%.

The test duration is set to 5 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100

Maximum rate (%): None

Mode: Uni-directional

Table 12-116 Throughput specifications of the N3EFS4

Issue 03 (2013-02-20)

Frame Size
(byte)

Passed Rate (%)

(01,04,01) to (01,04,02)
(pks/sec)

Total (pks/sec)

64

100.00

148810

148810

128

100.00

84459

84459

256

100.00

45290

45290

512

100.00

23496

23496

1024

100.00

11973

11973

1280

100.00

9615

9615

1518

100.00

8127

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Table 12-117 lists the packet loss ratio in the case of overloading of the N3EFS4. The values
are obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 5 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Table 12-117 Packet loss ratio in the case of overloading of the N3EFS4
Frame Size
(byte)

Rate Tested (%)

(01,04,01) to (01,04,02)
(%)

Average (%)

64

100.00

0.000

0.000

128

100.00

0.000

0.000

256

100.00

0.000

0.000

512

100.00

0.000

0.000

1024

100.00

0.000

0.000

1280

100.00

0.000

0.000

1518

100.00

0.000

0.000

Table 12-118 lists the latency specifications of the N3EFS4. The values are obtained when the
SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The test duration is set to 5 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested

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equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.
l

Measure on one receiving card only

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Table 12-118 Latency specifications of the N3EFS4


Frame
Size
(byte)

Rate
Tested
(%)

(01,04,01) to
(01,04,02) (us)CT (us)

Average
(CT) (us)

(01,04,01) to
(01,04,02)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

129.3

129.3

124.2

124.2

128

100.00

142.6

142.6

132.4

132.4

256

100.00

171.1

171.1

150.6

150.6

512

100.00

215.7

215.7

174.7

174.7

1024

100.00

298.4

298.4

216.5

216.5

1280

100.00

339.8

339.8

237.4

237.4

1518

100.00

374.7

374.7

253.3

253.3

Table 12-119 lists the back-to-back specifications of the N3EFS4. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission rate
is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is set to
a value more than 1 on the SmartApplication.

The tested traffic is set to the wire speed.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

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Resolution rate (%): None

Mode: Uni-directional

12 EoS Boards

Table 12-119 Back-to-back specifications of the N3EFS4


Frame Size
(byte)

Rate Tested (%)

(01,01,03) to (01,01,06)
Burst Size (frames)

Total (frames)

64

100.00

297620

297620

128

100.00

168918

168918

256

100.00

90580

90580

512

100.00

46992

46992

1024

100.00

23946

23946

1280

100.00

19230

19230

1518

100.00

16254

16254

Mechanical Specifications
The mechanical specifications of the EFS4 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight of the N1EFS4 (kg): 1.0

Weight of the N2EFS4 (kg): 1.0

Weight of the N3EFS4 (kg): 0.6

Power Consumption
The maximum power consumption of the N1EFS4 at room temperature (25C) is 30 W.
The maximum power consumption of the N2EFS4 at room temperature (25C) is 30 W.
The maximum power consumption of the N3EFS4 at room temperature (25C) is 18 W.

12.7 EGS2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGS2 (2xGE switching and processing board). This topic also
describes how to configure and commission the EGS2.

12.7.1 Version Description


The EGS2 is available in two functional versions, namely, N2 and N3.
Table 12-120 describes the versions of the EGS2.
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Table 12-120 Versions of the EGS2


Item

Description

Functional version

The EGS2 is available in two functional versions, namely, N2 and N3.

Difference

l Regarding interface specifications: interface types


l Regarding protection schemes: , LPT
l Regarding maintenance features: ETH OAM, , , port mirroring,
loopback capability, warm resets
l IGMP snooping

Substitution

The N3EGS2 can substitute for the N2EGS2.

12.7.2 Application
The EGS2 is used to transmit/receive Ethernet services, manage bandwidths, and realize Layer
2 switching of Ethernet services.
Figure 12-34 shows the typical networking and application of the Ethernet switching board. the
Ethernet switching board accesses and converges Ethernet services, and provides the Ethernet
data with the following data features: Layer 2 switching, port isolation, flow classification, traffic
control, VLAN management, and priority configuration. In addition, the Ethernet switching
board performs encapsulation/decapsulation, virtual concatenation, and SDH mapping/
demapping for data. The Ethernet switching board can be interconnected with the bandwidth
access equipment and the data communication equipment at the same time, thus to provide a
network-level solution.
Figure 12-34 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

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User A1

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NOTE

When the service converging FE services into GE services is configured, the GE switching board can be
set to the 1000M full-duplex mode or auto-negotiation mode, the VLAN of the convergence service is
variable, and the binding granularity can be at the VC-3 or VC-12 level.

12.7.3 Functions and Features


The EGS2 supports the Layer 2 switching, MPLS, and broadcast functions.
Table 12-121 provides the functions and features of the EGS2.
Table 12-121 Functions and features of the EGS2
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Processes 2xGE services.

Interfa
ce
types

l Supports the 1000BASE-SX/LX/ZX/VX Ethernet optical interfaces. The optical


interfaces support the auto-negotiation function in compliance with IEEE 802.3z.
The optical interfaces use the SFP optical module and support hot swapping.
When the multi-mode optical fiber is used, the maximum transmission distance
is 550 m. When the single-mode optical fiber is used, the maximum transmission
distance is 10 km. The optical modules that can meet different requirements for
the transmission distance such as 40 km and 80 km can also be used.
l The N3EGS2 also supports the 1000BASE-T RJ-45 Ethernet electrical interface.
The electrical interface supports the auto-negotiation function. The negotiated
rate can be 10 Mbit/s, 100 Mbit/s, or 1000 Mbit/s. The N3EGS2 uses the SFP
electrical interface and supports hot swapping. The maximum transmission
distance is 100 m.

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Functi
ons
when
being
used
with
an
interfa
ce
board

Provides interfaces on the front panel.

Interfa
ce
charac
teristic
s

Working
modes

l GE electrical port: auto-negotiation, 1000M full-duplex, 100M fullduplex, and 10M full-duplex (only N3EGS2 boards support GE
electrical port.)
l GE optical port: auto-negotiation and 1000M full-duplex

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Description

Traffic
control at
ports

Auto-negotiation mode

Supported

Non-autonegotiation mode

Supported

Query/
Supported
Setting of
port
status
Query of
interface
types

Supported

Setting of Not supported


optical
power
threshold
s

Servic
e
catego
ries

Pluggabl
e optical
module

Supports SFP optical modules.

EPL
service

Supports the PORT-based transparent transmission.

EVPL
service

l Supports PORT-shared EVPL services.


l Supports VCTRUNK-shared EVPL services.
The services are isolated by VLAN tags.
The services are isolated by MPLS tags.
The services are isolated by QinQ tags.
l Supports a maximum of 4096 links.

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Description

EPLAN
service

l Supports the blacklist that can contain 2K records and also the static
MAC address table that can contain 2K records. The sum of the
number of records in the blacklist and the number of addresses in
the static MAC address table must not exceed 2K. The blacklist
function of N3EGS2 boards supports verification of destination
MAC addresses only.
l Supports the self-learning of the source MAC address. The capacity
of the MAC address table is 16K. The aging time of the MAC
address can be set and queried.
l Supports the configuration of static MAC routes.
l The maximum number of supported VBs is 2. The maximum
number of logical ports for each VB is 30.
l N3EGS2 supports the EPLAN services that are based on the IEEE
802.1d MAC bridge.

EVPLA
N service

l Supports data isolation based on VB+VLAN.


l Supports the setting of a maximum of 4096 VLAN services.
l Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge.

Servic
e
specifi
cation
s

Formats
of
Ethernet
data
frames

Supported

Ethernet II

Supported

IEEE 802.1 q/p

Supported

Frame
length
range

l Supports the setting of the frame length to a value ranging from 1518
bytes to 9600 bytes.

Bound
bandwidt
h

48xVC-3, or 252xVC-12 + 36xVC-3

Mapping
granularit
ies

VC-12, VC-3, VC-12-Xv (X 63), VC-3-Xv (X 12).

Encapsul
ation
formats

HDLC

Not supported

LAPS

Not supported

GFP-F

Supported

MPLS
technolo
gy

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IEEE 802.3

l Supports a jumbo frame with a maximum length of 9600 bytes.

Supported

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Description

VLAN
technolo
gy

Supports 4094 VLANs. The VLAN technology complies with IEEE


802.1q/p.

Maximu
m uplink
bandwidt
h

The maximum uplink bandwidth is 2.5 Gbit/s. The EGS2 can adapt to
the bandwidth of the slot.

VCTRU
NK
specificat
ions

Number of supported VCTRUNKs: 48


Configuration principles are as follows:
l A VCTRUNK can be bound with the VC-12 path or VC-3 path at
one time. A VCTRUNK should not be bound with VC-12 and VC-3
paths at the same time.
l VCTRUNK 1VCTRUNK 12 can be bound with VC-4s numbered
14 only. VCTRUNK13VCTRUNK 24 can be bound with VC-4s
numbered 58 only. VCTRUNK 25VCTRUNK 36 can be bound
with VC-4s numbered 912 only. VCTRUNK 37VCTRUNK 48
can be bound with VC-4s numbered 1316 only.
l VC-4s numbered 4, 8, 12, and 16 support the binding of VC-3 and
VC-12 paths. The other VC-4s support the binding of VC-3 paths
only.

Protec
tion
schem
es

TPS

Not supported

BPS

Not supported

PPS

Not supported

DLAG

Not supported

LAG

Supports manual link aggregation and the load sharing mode that
comply with IEEE 802.3ad and IEEE 802.1AX.

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

l The N2EGS2 supports the P2P LPT.


l The N3EGS2 supports the P2P LPT and P2MP LPT.
l Complies with ITU-T G.7042.

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STP/
RSTP

Supports the broadcast packet suppression function and RSTP that


comply with IEEE 802.1w.

MSTP

Not supported

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ion
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Description

Clock
synchr
onizati
on

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Not supported
l The N2EGS2 does not support the ETH OAM function.

Maint
enanc
e
featur
es

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l N3EGS2 boards support CC, LB tests, and LT tests in compliance


with IEEE 802.1ag, LM and DM in compliance with ITU-T Y.1731,
and OAM ping in compliance with Huawei proprietary protocol.
l N3EGS2 boards support OAM auto-discovery, remote loopbacks,
fault detection, and link performance detection in compliance with
IEEE 802.3ah, and selfloop detection in compliance with Huawei
proprietary protocol.
Test
Frame

Supports test frames in Ethernet bearer mode.

Response
to ping

Not supported

Port
mirroring

The N3EGS2 supports ingress mirroring.

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Inloops

MAC layer at Ethernet ports

Inloops

VC-4 level

Not supported

VC-3 level

The N2EGS2 supports inloops


and outloops. The N3EGS2 does
not support inloops or outloops.

VC-12 level

Not supported

RMON

Supports Ethernet performance monitoring at the port level.

Warm
resets

N2EGS2/N3EGS2 boards support warm resets. If a warm reset is


performed on an N2EGS2 board, traffic on the board is interrupted,
whereas if a warm reset is performed on an N3EGS2 board, traffic on
the board is not interrupted. If an N3EGS2 board substitutes for an
N2EGS2 board, traffic on the N3EGS2 board is not interrupted.

Cold
resets

Supported

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Alarms
and
performa
nce
events
QoS

12 EoS Boards

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

l Supports the CAR. The granularity is 64 kbit/s.


l Supports the flow classification based on PORT, PORT+VLAN ID, or PORT
+VLAN ID+VLAN PRI.

IGMP
snoopi
ng

Traffi
c
contro
l

Protocol
enabling

Supported

Port
aging
time

Supported

Fast
leave

Supported by N3EGS2 boards

Discardin
g of
unknown
broadcast
packets

Supported by N3EGS2 boards

Static
broadcast
entry

Supported by N3EGS2 boards

NOTE
N3EGS2 boards support the IGMP snooping fast-leave function when they
substitute for N2EGS2 boards using the board version replacement function.

Supports the port-based traffic control function that complies with IEEE 802.3x.

12.7.4 Working Principle and Signal Flow


The EGS2 consists of the Ethernet access module, network processor module, mapping module,
interface converting module, logic and control module, clock module, and power module.
Figure 12-35 shows the functional block diagram of the EGS2 by describing how to process
1xGE signals.

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Figure 12-35 Functional block diagram of the EGS2


Backplane

Cross-connect unit
Interface
converting
module

VCP

Laser
shutdown

DENCP

Network processor module

ENCP

Network Control Switch


processor
fabric
Data

GE Ethernet
access
module

Cross-connect unit

Mapping module

LOS

Communication

Logic and
control module

Reference clock and frame header

+3.3 V
Clock module
50
77
MHz MHz

Power
module

Power
module

SCC unit

-48 V/-60 V
-48 V/-60 V

Fuse
+3.3 V backup power

125 155
MHz MHz

ENCP: data encapsulation module

Fuse

SCC unit

DENCP: decapsulation module

VCP: virtual concatenation processing module

Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or routers
are converted into electrical signals. If the signals are accessed through electrical interfaces, O/
E conversion is not required. At the PHY layer, the electrical signals are decoded and the
ETH_LOS alarm is detected. The electrical signals are converted from serial signals into parallel
signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module


The network processor module consists of the network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The following formats are supported:
l

MPLS

L2 MPLS VPN

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Ethernet/VLAN

In the receive direction, services are mapped and forwarded after the Tunnel and VC tags are
added according to the service configuration. In the transmit direction, the Tunnel or VC tag is
extracted based on the level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module supports the following functions:
l

Flow sense and flow classification

Unicast, multicast, and broadcast of the flow

Setting of data priorities

WFQ

Four CoSs

Mapping Module
The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.
The concatenation is performed. Then, the Ethernet signals are converted into SDH signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and HDLC
controller. This module is connected to external circuits through the bus. The logic and control
module performs the following functions:
l

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:
l

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

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Clock Module
The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.7.5 Front Panel


The front panel of the EGS2 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 12-36 shows the appearance of the front panel of the N2EGS2/N3EGS2 that has the GE
optical interface.
Figure 12-36 Front panel of the N2EGS2/N3EGS2 that has the GE optical interface

EGS2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2
CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2

EGS2

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The N3EGS2 can also be installed with the GE electrical interface. Figure 12-37 shows the
appearance of the front panel of the N3EGS2 that has the GE electrical interface.
Figure 12-37 Front panel of the N3EGS2 that has the GE electrical interface

EGS2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2

OUT1
IN1
OUT2
IN2

EGS2

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

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Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the N2EGS2/N3EGS2 has two GE optical interfaces. Table 12-122 describes
the types and usage of the optical interfaces of the N2EGS2/N3EGS2.
Table 12-122 Optical interfaces of the N2EGS2/N3EGS2
Interface

Type of Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/


VX signals.

OUT2/IN2

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/


VX signals.

When the N3EGS2 has the electrical interfaces, the two GE electrical interfaces are of the same
type and have the same usage. Table 12-123 describes the types and usage of the electrical
interfaces of the N3EGS2.
Table 12-123 Electrical interfaces of the N3EGS2
Interface

Type of Interface

Usage

GE

RJ-45 (swappable)

Transmits and receives 1000BASE-T signals.

Table 12-124 provides the pin assignments of the RJ-45 interface of the N3EGS2.
Table 12-124 Pin assignments of the RJ-45 interface of the N3EGS2

Issue 03 (2013-02-20)

Pin

Description

BI_DA+

BI_DA

BI_DB+

BI_DC+

BI_DC

BI_DB

BI_DD+

BI_DD

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12.7.6 Jumpers and DIP Switches


The EGS2 does not have any jumpers or DIP switches that are used for board settings.

12.7.7 Valid Slots


The EGS2 must be installed in a valid slot in the subrack. Otherwise, the EGS2 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the EGS2 and the bandwidth of the EGS2 vary with the cross-connect capacity
of the subrack and the version of the board. The slots valid for the EGS2 are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the slots valid for the EGS2 are as follows:
The N2EGS2 can be installed in slots 18 and 1116. When the N2EGS2 is installed
in slots 14, 15, and 16, the bandwidth is 1.25 Gbit/s. When the N2EGS2 is installed in
slots 58 and 1114, the bandwidth is 2.5 Gbit/s.
The N3EGS2 can be installed in slots 18 and 1116. In this case, the bandwidth is 2.5
Gbit/s.

12.7.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the EGS2 indicates the type of interface.
Table 12-125 provides the relationship between the feature code of the EGS2 and the type of
interface.
Table 12-125 Relationship between the feature code of the EGS2 and the type of interface

Issue 03 (2013-02-20)

Board

Feature Code

Type of Interface

SSN2EGS210 and
SSN2EGS310

10

1000BASE-SX (0.5 km)

SSN2EGS211 and
SSN2EGS311

11

1000BASE-LX (10 km)

SSN2EGS212 and
SSN2EGS312

12

1000BASE-VX (40 km)

SSN2EGS213 and
SSN2EGS213

13

1000BASE-ZX (80 km)

SSN3EGS214

14

1000BASE-T (100 m)

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12.7.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring Ethernet Services.
Step 3 Required: Set the Ethernet interface.
l Set the overhead byte as follows:
J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.
l Set the Ethernet interface as follows:
Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.
Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of
traffic, services may be completely interrupted.
For details, see 28.7 Checking Board Parameters.
NOTE

For more information about the parameters of the board, see 27.4.2 Ethernet Parameters.

Step 4 Optional: Configure the Layer 2 switching management service, including the following tasks:
l Enabling the IGMP Snooping Protocol
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l Configuring the Spanning Tree


l Setting the Aging Time for the Multicast Router Port
Step 5 Optional: Configure the QoS. For details, see Configuring QoS.
Step 6 Optional: Configure the link aggregation function on the Ethernet port. For details, see Creating
a LAG.
Step 7 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

12.7.10 Configuring the Board Functions


The EGS2 supports multiple Ethernet functions and features such as Layer 2 switching, LCAS,
and QoS. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EGS2 by using the U2000:
l

LCAS

QoS

LPT

LAG

ETH OAM

Test Frame

STP/RSTP

IGMP Snooping

12.7.11 Parameter Settings


You can set parameters for the EGS2 by using the U2000.
You can set the following main parameters for the EGS2 by using the U2000:
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LCAS

Maximum frame length

Mapping protocol

12 EoS Boards

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

12.7.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 12-126 lists the faults that occur on the EGS2 frequently and the troubleshooting methods.
Table 12-126 Methods used to troubleshoot the faults that occur on the EGS2 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on a single


Ethernet port are interrupted.
l The services on all the Ethernet
ports are interrupted.
Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The services on a single


Ethernet port are transiently
interrupted.
l The protocol becomes
abnormal.
l The negotiated working mode
of the Ethernet ports is the halfduplex mode.

Packet loss

See Troubleshooting Service


Packet Loss.

l Bit errors occur on the line side.


Interconnection
fault

l The interconnection fault


occurs on a single Ethernet port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCG port.
l The LCAS interconnection
fault occurs.

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Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EGS2, see Replacing an EOS Board.

12.7.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

12.7.13.1 Alarms of N2EGS2

Issue 03 (2013-02-20)

ALM_GFP_dLFD

AU_AIS

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_LOS

FCS_ERR

FPGA_ABN

HARD_BAD

HP_LOM

LAG_FAIL

LASER_MOD_ERR

LCAS_FOPR

LCAS_PLCT

LCAS_FOPT

LCAS_PLCR

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC3

LP_REI_VC12

LP_RDI_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_REI_VC3

LP_TIM_VC3

LP_UNEQ_VC12

LP_TIM_VC12

LSR_NO_FITED

NO_BD_SOFT

LP_UNEQ_VC3

SUBCARD_ABN

T_LOS

SLAVE_WORKING

TU_AIS_VC12

TU_AIS_VC3

TPS_ALM

TU_LOP_VC3

VCAT_LOA

TU_LOP_VC12

VCAT_LOM_VC3

PATCHFILE_NOTEXIST

VCAT_LOM_VC12

PATCH_NOT_CONFIRM

TR_LOC

PATCH_ERR

T_LOSEX

ETH_NO_FLOW

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

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12.7.13.2 Alarms of N3EGS2


ALM_GFP_dLFD

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_UNEXPERI

ETH_LOS

ETH_NO_FLOW

ETHOAM_DISCOVER_F
AIL

ETHOAM_RMT_CRIT_FA
ULT

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_L
OOP

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

FCS_ERR

FLOW_OVER

FPGA_ABN

HARD_BAD

HP_LOM

LASER_MOD_ERR

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LINK_ERR

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

LPT_RFI

LSR_NO_FITED

LSR_WILL_DIE

LTEMP_OVER

MOD_TYPE_MISMATCH

NO_BD_SOFT

PORT_MODULE_OFFLINE

SUM_INPWR_HI

SUM_INPWR_LOW

SUM_OUTPWR_HI

SUM_OUTPWR_LOW

T_LOSEX

TD

TEMP_OVER

TF

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_SQM_VC12

VCAT_SQM_VC3

VCTRUNK_NO_FLOW

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.7.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.
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12.7.14.1 Performance Events of N2EGS2


Table 12-127 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

Table 12-128 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments Jabbers

AlignmentErrors

FCSErrors

AlignmentErrors

Table 12-129 Statistics of RMON basic performance

Issue 03 (2013-02-20)

Packets Received(64 Octets


in Length)(packets/s)

Packets Received(65~127
Octets in Length)(packets/
s)

Packets Received(128~255
Octets in Length)(packets/s)

Packets Received(256~511
Octets in Length)(packets/
s)

Packets Received
(512~1023 Octets in
Length)(packets/s)

Packets Received(1024~1518
Octets in Length)(packets/s)

Multicast Packets Received


(packets/s)

Broadcast Packets
Received(packets/s)

Drop Events(times/s)

Undersize Packets
Received(packets/s)

Oversize Packets Received


(packets/s)

Fragments(packets/s)

Jabbers(packets/s)

Octets Received(Byte/s)

Packets Received(packets/s)

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Table 12-130 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)(packets/
s)

Packets Transmitted
(65~127 Octets in Length)
(packets/s)

Packets Transmitted(128~255
Octets in Length)(packets/s)

Packets Transmitted
(256~511 Octets in Length)
(packets/s)

Packets Transmitted
(512~1023 Octets in
Length)(packets/s)

Packets Transmitted
(1024~1518 Octets in Length)
(packets/s)

Unicast Packets Received


(packets/s)

Unicast Packets
Transmitted(packets/s)

Multicast Packets Transmitted


(packets/s)

Broadcast Packets
Transmitted(packets/s)

Good Octets Transmitted


(Byte/s)

Alignment Errors(frames/s)

FCS Errors(frames/s)

12.7.14.2 Performance Events of N3EGS2


Table 12-131 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

RPLMAX

RPLMIN

RPLCUR

TPLMAX

TPLMIN

TPLCUR

TLBMAX

TLBMIN

TLBCUR

XCSTMPMAX

XCSTMPMIN

XCSTMPCUR

Table 12-132 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

AlignmentErrors

FCSErrors

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Table 12-133 Statistics of RMON basic performance


Packets Received(64 Octets
in Length)(packets/s)

Packets Received(65~127
Octets in Length)(packets/
s)

Packets Received(128~255
Octets in Length)(packets/s)

Packets Received(256~511
Octets in Length)(packets/
s)

Packets Received
(512~1023 Octets in
Length)(packets/s)

Packets Received(1024~1518
Octets in Length)(packets/s)

Multicast Packets Received


(packets/s)

Broadcast Packets
Received(packets/s)

Drop Events(times/s)

Undersize Packets
Received(packets/s)

Oversize Packets Received


(packets/s)

Fragments(packets/s)

Jabbers(packets/s)

Octets Received(Byte/s)

Packets Received(packets/s)

Table 12-134 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)(packets/
s)

Packets Transmitted
(65~127 Octets in Length)
(packets/s)

Packets Transmitted(128~255
Octets in Length)(packets/s)

Packets Transmitted
(256~511 Octets in Length)
(packets/s)

Packets Transmitted
(512~1023 Octets in
Length)(packets/s)

Packets Transmitted
(1024~1518 Octets in Length)
(packets/s)

Unicast Packets Received


(packets/s)

Unicast Packets
Transmitted(packets/s)

Multicast Packets Transmitted


(packets/s)

Broadcast Packets
Transmitted(packets/s)

Good Octets Transmitted


(Byte/s)

Alignment Errors(frames/s)

FCS Errors(frames/s)

12.7.15 Technical Specifications


The technical specifications of the EGS2 include the parameters specified for optical interfaces,
laser safety class, Ethernet performance specifications, mechanical specifications, and power
consumption.

Parameter Specified for Optical Interfaces


Table 12-135 lists the parameters specified for the optical interfaces of the EGS2.

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Table 12-135 Parameters specified for the optical interfaces of the EGS2
Parameter

Value

Type of optical
interface

1000BASE-ZX
(80 km)

1000BASEVX (40 km)

1000BASELX (10 km)

1000BASE-SX
(0.5 km)

Type of fiber

Single-mode LC

Single-mode
LC

Single-mode
LC

Multi-mode LC

Launched optical
power range
(dBm)

-2 to 5

-5 to 0

-9 to -3

-9.5 to -2.5

Operating
wavelength range
(nm)

1500 to 1580

1275 to 1350

1270 to 1355

770 to 860

Minimum
overload (dBm)

-3

-3

-3

Receiver
sensitivity (dBm)

-23

-23

-20

-17

Minimum
extinction ratio
(dB)

Maximum -20 dB
spectral width
(nm)

30

Minimum side
30
mode suppression
ratio (dB)

Ethernet Electrical Interfaces


Table 12-136 lists the parameters specified for the electrical interfaces of the EGS2.
Table 12-136 Parameters specified for the electrical interfaces of the EGS2
Type of Interface

Code Type

1000BASE-T, RJ-45

4D-PAM5

NOTE

Only the EGS2 boards of the N3 version supports the GE electrical interfaces.

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Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Ethernet Performance Specifications


NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EGS2 board of the N2 version.

Figure 12-38 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N2EGS2.
Figure 12-38 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, latency specifications, and back-to-back specifications of the N2EGS2
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-137 lists the throughput specifications of the N2EGS2. Table 12-138 lists the packet
loss ratio in the case of overloading of the N2EGS2. Table 12-139 lists the latency specifications
of the N2EGS2. Table 12-140 lists the back-to-back specifications of the N2EGS2.
NOTE

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual environment
are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and five VC-12s are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-137 lists the throughput specifications of the N2EGS2. The values are obtained when
the SmartApplication is set as follows:
l

Test duration (sec): 10

Minimum frame size (byte): 64

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Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 1.00

Maximum rate (%): 2.00

Resolution rate (%): 0.01

Mode: bidirectional

12 EoS Boards

Table 12-137 Throughput specifications of the N2EGS2


Frame Size
(Byte)

Passed Rate
(%)

(01,01,01) to
(01,01,02) (pks/
sec)

(01,01,02) to
(01,01,01) (pks/
sec)

Total (pks/
sec)

64

1.15

17086

17086

34172

128

1.12

9501

9501

19002

256

1.12

5094

5094

10188

512

1.13

2660

2660

5320

1024

1.12

1346

1346

2692

1280

1.13

1088

1088

2176

1518

1.14

925

925

1850

Table 12-138 lists the packet loss ratio in the case of overloading of the N2EGS2. The values
are obtained when the SmartApplication is set as follows:
l

Test duration (sec): 10

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Table 12-138 Packet loss ratio in the case of overloading of the N2EGS2

Issue 03 (2013-02-20)

Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,01,02) (%)

(01,01,02) to
(01,01,01) (%)

Average (%)

64

100.00

98.846

98.846

98.846

128

100.00

98.869

98.868

98.868

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Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,01,02) (%)

(01,01,02) to
(01,01,01) (%)

Average (%)

256

100.00

98.874

98.875

98.874

512

100.00

98.866

98.863

98.865

1024

100.00

98.870

98.870

98.870

1280

100.00

98.863

98.861

98.862

1518

100.00

98.855

98.855

98.855

Table 12-139 lists the latency specifications of the N2EGS2. The values are obtained when the
SmartApplication is set as follows:
l

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested
equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Test duration (sec): 10

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 1.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Table 12-139 Latency specifications of the N2EGS2

Issue 03 (2013-02-20)

Frame
Size
(Byte)

Rate
Tested
(%)

(01,01,01) to
(01,01,02) (us)CT (us)

Average
(CT) (us)

(01,01,01) to
(01,01,02)
(us)-S&F (us)

Average
(S&F) (us)

64

1.00

555.8

555.8

555.3

555.3

128

1.00

615.2

615.2

614.2

614.2

256

1.00

734.6

734.6

732.6

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Frame
Size
(Byte)

Rate
Tested
(%)

(01,01,01) to
(01,01,02) (us)CT (us)

Average
(CT) (us)

(01,01,01) to
(01,01,02)
(us)-S&F (us)

Average
(S&F) (us)

512

1.00

914.0

914.0

909.9

909.9

1024

1.00

1313.7

1313.7

1305.6

1305.6

1280

1.00

1523.1

1523.1

1512.9

1512.9

1518

1.00

1706.6

1706.6

1694.4

1694.4

Table 12-140 lists the back-to-back specifications of the N2EGS2. The values are obtained when
the SmartApplication is set as follows:
l

Test duration (sec): 10

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Table 12-140 Back-to-back specifications of the N2EGS2


Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,01,02) Burst
Size (Number of
Frames)

(01,01,02) to
(01,01,01)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

1236

1236

2472

128

100.00

1321

1323

2644

256

100.00

1070

1070

2140

512

100.00

934

934

1868

1024

100.00

468

468

936

1280

100.00

458

458

916

1518

100.00

450

453

903

NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EGS2 board of the N3 version.

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Figure 12-39 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N3EGS2.
Figure 12-39 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, latency specifications, and back-to-back specifications of the N3EGS2
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-141 lists the throughput specifications of the N3EGS2. Table 12-142 lists the packet
loss ratio in the case of overloading of the N3EGS2. Table 12-143 lists the latency specifications
of the N3EGS2. Table 12-144 lists the back-to-back specifications of the N3EGS2.
NOTE

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual environment
are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and 12 VC-3s are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-141 lists the throughput specifications of the N3EGS2. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 1%.

The test duration is set to 10 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 58

Maximum rate (%): 65

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Mode: Uni-directional

Table 12-141 Throughput specifications of the N3EGS2


Frame Size
(byte)

Passed Rate (%)

(01,04,01) to (01,04,02)
(pks/sec)

Total (pks/sec)

64

60.00

892857

892857

128

58.73

496032

496032

256

57.98

262605

262605

512

58.08

136463

136463

1024

58.00

69444

69444

1280

58.04

55804

55804

1518

58.04

47170

47170

Table 12-142 lists the packet loss ratio in the case of overloading of the N3EGS2. The values
are obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 10 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Table 12-142 Packet loss ratio in the case of overloading of the N3EGS2

Issue 03 (2013-02-20)

Frame Size
(byte)

Rate Tested (%)

(01,04,01) to (01,04,02)
(%)

Average (%)

64

100.00

39.033

39.033

128

100.00

40.323

40.323

256

100.00

41.081

41.081

512

100.00

41.492

41.492

1024

100.00

41.703

41.703

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Frame Size
(byte)

Rate Tested (%)

(01,04,01) to (01,04,02)
(%)

Average (%)

1280

100.00

41.744

41.744

1518

100.00

41.769

41.769

Table 12-143 lists the latency specifications of the N3EGS2. The values are obtained when the
SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The test duration is set to 10 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested
equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.

CT: Cut Through (or FIFO),S&F: Store & Forward (or LIFO)

Measure on one receiving card only, Mode: SmartMetrics Comp. Mode

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 1.00

Maximum rate (%): 60.00

Step rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Table 12-143 Latency specifications of the N3EGS2

Issue 03 (2013-02-20)

Frame
Size
(byte)

Rate
Tested
(%)

(01,04,01) to
(01,04,02) (us)CT (us)

Average
(CT) (us)

(01,04,01) to
(01,04,02)
(us)-S&F (us)

Average
(S&F) (us)

64

60.00

89.9

89.9

89.4

89.4

128

58.73

94.8

94.8

93.8

93.8

256

57.98

97.4

97.4

95.3

95.3

512

58.08

108.9

108.9

104.9

104.9

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Frame
Size
(byte)

Rate
Tested
(%)

(01,04,01) to
(01,04,02) (us)CT (us)

Average
(CT) (us)

(01,04,01) to
(01,04,02)
(us)-S&F (us)

Average
(S&F) (us)

1024

58.00

123.4

123.4

115.3

115.3

1280

58.04

129.2

129.2

119.0

119.0

1518

58.04

138.0

138.0

125.8

125.8

Table 12-144 lists the back-to-back specifications of the N3EGS2. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission rate
is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is set to
a value more than 1 on the SmartApplication.

The tested traffic is set to the wire speed.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 60.00

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Table 12-144 Back-to-back specifications of the N3EGS2

Issue 03 (2013-02-20)

Frame Size
(byte)

Rate Tested (%)

(01,04,01) to (01,04,02)
Burst Size (frames)

Total (frames)

64

60.00

1785714

1785714

128

58.73

992064

992064

256

57.98

525210

525210

512

58.08

272926

272926

1024

58.00

138888

138888

1280

58.04

111608

111608

1518

58.04

94340

94340

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Mechanical Specifications
The mechanical specifications of the EGS2 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight of the N2EGS2 (kg): 1.0

Weight of the N3EGS2 (kg): 0.6

Power Consumption
The maximum power consumption of the N2EGS2 at room temperature (25C) is 43 W.
The maximum power consumption of the N3EGS2 at room temperature (25C) is 25 W.

12.8 EMS2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EMS2 (2xGE and 16xFE switching and processing board). This
topic also describes how to configure and commission the EMS2.

12.8.1 Version Description


The EMS2 is available in one functional version, namely, N1.

12.8.2 Application
The EMS2 is used to transmit/receive Ethernet services, manage bandwidths, and realize Layer
2 switching of Ethernet services.
Figure 12-40 shows the typical networking and application of the Ethernet switching board. the
Ethernet switching board accesses and converges Ethernet services, and provides the Ethernet
data with the following data features: Layer 2 switching, port isolation, flow classification, traffic
control, VLAN management, and priority configuration. In addition, the Ethernet switching
board performs encapsulation/decapsulation, virtual concatenation, and SDH mapping/
demapping for data. The Ethernet switching board can be interconnected with the bandwidth
access equipment and the data communication equipment at the same time, thus to provide a
network-level solution.

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Figure 12-40 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

NOTE

When the service converging FE services into GE services is configured, the GE switching board can be
set only to the 1000M full-duplex mode, the VLAN of the convergence service is variable, and the binding
granularity can be at the VC-3 or VC-12 level.

12.8.3 Functions and Features


The EMS2 supports the Layer 2 switching, link convergence, and multicast functions.
Table 12-145 provides the functions and features of the EMS2.
Table 12-145 Functions and features of the EMS2

Issue 03 (2013-02-20)

Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits and processes 2xGE and 16xFE services.

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Funct
ion
and
Featu
re

Description

Interfa
ce
types

l Supports the 1000BASE-SX/LX/ZX/VX Ethernet optical interfaces. The optical


interfaces support the auto-negotiation function in compliance with IEEE 802.3z.
The optical interfaces use pluggable SFP optical modules. When the multi-mode
optical fiber is used, the maximum transmission distance is 550 m. When the
single-mode optical fiber is used, the maximum transmission distance is 10 km.
The optical modules that can meet different requirements for the transmission
distance such as 40 km and 80 km can also be used.
l Supports the 1000BASE-T RJ-45 Ethernet electrical interface. The electrical
interface supports the auto-negotiation function. The negotiated rate can be 10
Mbit/s, 100 Mbit/s, or 1000 Mbit/s. The board uses the SFP electrical interface
and supports hot swapping. The maximum transmission distance is 100 m.
l Supports 10BASE-T/100BASE-TX signals when the EMS2 is used with the
ETF8 and supports 100BASE-FX signals when the EMS2 is used with the EFF8.
l The optical interfaces comply with IEEE 802.3u.

Functi
ons
when
being
used
with
an
interfa
ce
board

l Receives/Transmits 16xFE signals through the electrical interface when the


EMS2 is used with the ETF8.

Interfa
ce
charac
teristic
s

Working
modes

l Receives/Transmits 16xFE signals through the optical interface when the EMS2
is used with the EFF8.
l Receives/Transmits 8xFE signals through the electrical interface and 8xFE
signals through the optical interface when the EMS2 is used with the ETF8 and
EFF8.

l GE electrical port: auto-negotiation, 1000M full-duplex, 100M fullduplex, and 10M full-duplex
l GE optical port: auto-negotiation and 1000M full-duplex
l FE electrical port: auto-negotiation, 100M full-duplex, 100M halfduplex, 10M full-duplex, and 10M half-duplex (This working mode
is supported only when the EMS2 board works with the ETF8
board.)
l FE optical port: 100M full-duplex (This working mode is supported
only when the EMS2 board works with the EFF8 board.)

Traffic
control at
ports

Auto-negotiation mode

Supported (Not supported by FE


optical ports)

Non-autonegotiation mode

Supported

Query/
Supported
Setting of
port
status

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Description

Query of
interface
types

Supported

Setting of Not supported


optical
power
threshold
s

Servic
e
catego
ries

Pluggabl
e optical
module

Supports SFP optical modules.

EPL
service

Supports PORT-based transparent transmission.

EVPL
service

l Supports PORT-shared EVPL services.


l Supports VCTRUNK-shared EVPL services.
The services are isolated by VLAN tags.
The services are isolated by MPLS tags.
The services are isolated by QinQ tags.
l Supports a maximum of 4096 links.

EPLAN
service

l Supports the blacklist that can contain 2K records and also the static
MAC address table that can contain 2K records. The sum of the
number of records in the blacklist and the number of addresses in
the static MAC address table must not exceed 2K. The blacklist
function supports verification of destination MAC addresses only.
l Supports the self-learning of the source MAC address. The capacity
of the MAC address table is 16K. The aging time of the MAC
address can be set and queried.
l Supports the configuration of static MAC routes.
l Supports the query of dynamic MAC addresses.
l The maximum number of supported VBs is 16. The maximum
number of logical ports for each VB is 66.
l Supports the EPLAN services that are based on the IEEE 802.1d
MAC bridge.

EVPLA
N service

l Supports data isolation based on VB+VLAN.


l Supports the configuration of up to 4096 VLAN services.
l Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge.

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ion
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Featu
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Description

Servic
e
specifi
cation
s

Formats
of
Ethernet
data
frames

12 EoS Boards

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1q/p

Supported

Frame
length
range

l Supports the setting of the frame length to a value ranging from 1518
bytes to 9600 bytes.

Bound
bandwidt
h

48xVC-3, or 252xVC-12 + 36xVC-3

Mapping
granularit
ies

VC-3, VC-12-Xv (X 63), VC-3-Xv (X 12).

Encapsul
ation
formats

HDLC

Not supported

LAPS

Not supported

GFP-F

Supported

l Supports a jumbo frame with a maximum length of 9600 bytes.

MPLS
technolo
gy

Not supported

VLAN
technolo
gy

Supports a total number of 4094 VLANs, which comply with IEEE


802.1q/p.

Maximu
m uplink
bandwidt
h

2.5 Gbit/s

VCTRU
NK
specificat
ions

Number of supported VCTRUNKs: 48


Configuration principles are as follows:
l A VCTRUNK can be bound with the VC-12 path or VC-3 path at
one time. A VCTRUNK should not be bound with VC-12 and VC-3
paths at the same time.
l VC-4s numbered 4, 8, 12, and 16 support the binding of VC-3 and
VC-12 paths. The other VC-4s support the binding of VC-3 paths
only.

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ion
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Description

Protec
tion
schem
es

TPS

Not supported

BPS

Not supported

PPS

Not supported

DLAG

Not supported

LAG

Supports manual link aggregation and load sharing link aggregation in


compliance with IEEE 802.3ad and IEEE 802.1AX.

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports the P2P LPT and P2MP LPT in compliance with ITU-T G.
7042.

STP/
RSTP

Supports the broadcast packet suppression function and RSTP, which


complies with IEEE 802.1w.

MSTP

Not supported

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Not supported

Clock
synchr
onizati
on

l Supports CC, LB tests, and LT tests in compliance with IEEE


802.1ag, LM and DM in compliance with ITU-T Y.1731, and OAM
ping in compliance with Huawei proprietary protocol.

Maint
enanc
e
featur
es

Issue 03 (2013-02-20)

12 EoS Boards

l Supports OAM auto-discovery, remote loopbacks, fault detection,


and link performance detection in compliance with IEEE 802.3ah,
and selfloop detection in compliance with Huawei proprietary
protocol.
Test
Frame

Supports test frames in Ethernet/GFP bearer mode.

Response
to ping

Not supported

Port
mirroring

Supports ingress mirroring.

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Inloops

MAC layer at Ethernet ports

Inloops

VC-4 level

Not supported

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QoS

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Description

VC-3 level

Not supported

VC-12 level

Not supported

RMON

Supports RMON of the Ethernet performance of Ethernet ports and


VCTRUNKs.

Warm
resets

Supported

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

l Supports the CAR. The granularity is 64 kbit/s.


l Supports the flow classification based on PORT, PORT+VLAN, PORT
+SVLAN, and PORT+VLAN+PRI.

IGMP
snoopi
ng

Traffi
c
contro
l

Issue 03 (2013-02-20)

Protocol
enabling

Supported

Port
aging
time

Supported

Fast
leave

Supported

Discardin
g of
unknown
broadcast
packets

Supported

Static
broadcast
entry

Supported

Supports the port-based traffic control function that complies with IEEE 802.3x.

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12.8.4 Working Principle and Signal Flow


The EMS2 consists of the Ethernet access module, network processor module, mapping module,
interface converting module, logic and control module, clock module, and power module.
Figure 12-41 shows the functional block diagram of the EMS2 by describing how to process
1xGE/FE signals.
Figure 12-41 Functional block diagram of the EMS2
Backplane

Cross-connect unit
Interface
converting
module

VCP

Laser
shutdown

DENCP

Network processor module

ENCP

Network Control Switch


processor
fabric
Data

GE/FE Ethernet
access
module

Cross-connect unit

Mapping module

LOS

Communication

Logic and
control module

Reference clock and frame header

+3.3 V
Clock module
77
50
MHz MHz

Power
module

Power
module

Fuse

SCC unit
SCC unit

-48 V/-60 V
-48 V/-60 V

125 155
MHz MHz

ENCP: data encapsulation module

DENCP: decapsulation module

VCP: virtual concatenation processing module

Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or routers
are converted into electrical signals. If the signals are accessed through electrical interfaces, O/
E conversion is not required. At the PHY layer, the electrical signals are decoded and the
ETH_LOS alarm is detected. The electrical signals are converted from serial signals into parallel
signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module


The network processor module consists of the network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check, and Ethernet performance statistics.
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After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The Ethernet/VLAN format is supported.
The network processor module supports the following functions:
l

Flow sense and flow classification

Unicast, multicast, and broadcast of the flow

Setting of data priorities

WFQ

Four CoSs

Mapping Module
The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP-F, or
HDLC format. The concatenation is performed. The LCAS function is supported. Then, the
Ethernet signals are converted into SDH signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and HDLC
controller. This module is connected to external circuits through the bus. The logic and control
module performs the following functions:
l

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:
l

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

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Clock Module
The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.8.5 Front Panel


The front panel of the EMS2 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 12-42 shows the appearance of the front panel of the EMS2 that has the GE optical
interface.
Figure 12-42 Front panel of the EMS2 that has the GE optical interface

EMS2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2
CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2

EMS2

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Figure 12-43 shows the appearance of the front panel of the EMS2 that has the GE electrical
interface.
Figure 12-43 Front panel of the EMS2 that has the GE electrical interface

EMS2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2

OUT1
IN1
OUT2
IN2

EMS2

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

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Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the EMS2 has two interfaces. Table 12-146 describes the types and usage of
the interfaces of the EMS2 when the EMS2 has the optical interfaces. When the EMS2 has the
electrical interfaces, the two GE electrical interfaces are of the same type and have the same
usage. Table 12-147 describes the types and usage of the electrical interfaces of the EMS2.
Table 12-146 Optical interfaces of the EMS2
Interface

Type of
Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

OUT2/IN2

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

Table 12-147 Electrical interfaces of the EMS2


Interface

Type of
Interface

Usage

GE

RJ-45
(swappable)

Transmits and receives 1000BASE-T signals.

Table 12-148 provides the pin assignments of the RJ-45 interface of the EMS2.
Table 12-148 Pin assignments of the RJ-45 interface of the EMS2

Issue 03 (2013-02-20)

Pin

Description

BI_DA+

BI_DA

BI_DB+

BI_DC+

BI_DC

BI_DB

BI_DD+

BI_DD

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12.8.6 Jumpers and DIP Switches


The EMS2 does not have any jumpers or DIP switches that are used for board settings.

12.8.7 Valid Slots


The EMS2 must be installed in a valid slot in the subrack. Otherwise, the EMS2 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The EMS2 can be used with the ETF8 and EFF8.


The EMS2 can be installed in slots 16 and 1316 in the subrack. The slots valid for the EMS2
vary with the bandwidth and the cross-connect capacity of the subrack.
l

When the cross-connect capacity is 200 Gbit/s, the EMS2 can be installed in slots 16 and
1316. In this case, the bandwidth is 2.5 Gbit/s.

Table 12-149 lists the slots valid for the EMS2 and the corresponding slots for the ETF8 and
EFF8.
Table 12-149 Slots valid for the EMS2 and the corresponding slots for the ETF8 and EFF8
Slot Valid for the EMS2

Corresponding Slots for the ETF8 and EFF8

Slot 1

Without an interface board

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 6

Without an interface board

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

12.8.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the EMS2 indicates the type of interface.
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Table 12-150 provides the relationship between the feature code of the EMS2 and the type of
interface.
Table 12-150 Relationship between the feature code of the EMS2 and the type of interface
Board

Feature Code

Type of Interface

SSN1EMS210

10

1000BASE-ZX (80 km)

SSN1EMS211

11

1000BASE-SX (0.5 km)

SSN1EMS212

12

1000BASE-LX (10 km)

SSN1EMS213

13

1000BASE-VX (40 km)

SSN1EMS214

14

1000BASE-T (100 m)

12.8.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring Ethernet Services.
Step 3 Required: Set the Ethernet interface.
l Set the overhead byte as follows:
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J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.
l Set the Ethernet interface as follows:
Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.
Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of
traffic, services may be completely interrupted.
For details, see 28.7 Checking Board Parameters.
NOTE

For more information about the parameters of the board, see 27.4.2 Ethernet Parameters.

Step 4 Optional: Configure the Layer 2 switching management service, including the following tasks:
l Enabling the IGMP Snooping Protocol
l Configuring the Spanning Tree
l Setting the Aging Time for the Multicast Router Port
Step 5 Optional: Configure the QoS. For details, see Configuring QoS.
Step 6 Optional: Configure the link aggregation function on the Ethernet port. For details, see Creating
a LAG.
Step 7 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

12.8.10 Configuring the Board Functions


The EMS2 supports multiple Ethernet functions and features such as Layer 2 switching, LCAS,
and LPT. Configure the functions according to actual requirements.
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You can configure the following Ethernet functions for the EMS2 by using the U2000:
l

LCAS

LPT

LAG

ETH OAM

Test Frame

STP/RSTP

IGMP Snooping

12.8.11 Parameter Settings


You can set parameters for the EMS2 by using the U2000.
You can use set the following main parameters for the EMS2 by using the U2000:
l

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

12.8.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 12-151 lists the faults that occur on the EMS2 frequently and the troubleshooting methods.
Table 12-151 Methods used to troubleshoot the faults that occur on the EMS2 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on a single


Ethernet port are interrupted.
l The services on all the Ethernet
ports are interrupted.

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Fault Symptom

Common Fault Cause

Troubleshooting Method

Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The services on a single


Ethernet port are transiently
interrupted.
l The protocol becomes
abnormal.
l The negotiated working mode
of the Ethernet ports is the halfduplex mode.

Packet loss

See Troubleshooting Service


Packet Loss.

l Bit errors occur on the line side.


Interconnection
fault

l The interconnection fault


occurs on a single Ethernet port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCG port.
l The LCAS interconnection
fault occurs.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EMS2, see Replacing an EOS Board.

12.8.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

12.8.13.1 Alarms of N1EMS2

Issue 03 (2013-02-20)

ALM_GFP_dCSF

ALM_GFP_dLFD

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_LOS

ETH_NO_FLOW

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_UNEXPERI

ETHOAM_RMT_LOOP

ETHOAM_DISCOVER_FA
IL

ETHOAM_RMT_CRIT_FA
ULT

EX_ETHOAM_CC_LOS

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EX_ETHOAM_MPID_CNF
LCT

ETHOAM_RMT_SD

FPGA_ABN

HARD_BAD

FLOW_OVER

HP_LOM

LASER_MOD_ERR

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LINK_ERR

LOOP_ALM

LP_RDI_VC3

LP_RDI_VC12

LP_REI_VC3

LP_REI_VC12

LP_SLM_VC3

LP_SLM_VC12

LP_TIM_VC3

LP_TIM_VC12

LP_UNEQ_VC3

LP_UNEQ_VC12

LPT_RFI

LSR_NO_FITED

LTEMP_OVER

MOD_TYPE_MISMATCH

NO_BD_SOFT

PORT_MODULE_OFFLINE

SUBCARD_ABN

SUM_INPWR_HI

SUM_INPWR_LOW

SUM_OUTPWR_HI

SUM_OUTPWR_LOW

T_LOSEX

TD

TEMP_OVER

TF

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

LSR_WILL_DIE

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_LOA

VCAT_SQM_VC12

VCAT_SQM_VC3

VCTRUNK_NO_FLOW

FCS_ERR

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_LO
OP

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.8.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

12.8.14.1 Performance Events of N1EMS2


Table 12-152 SDH

Issue 03 (2013-02-20)

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

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HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

XCSTMPCUR

XCSTMPMAX

XCSTMPMIN

Table 12-153 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Table 12-154 Statistics of RMON basic performance


Packets Received(64
Octets in Length)(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets Received(256~511
Octets in Length)(packets)

Packets Received(512~1023
Octets in Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

Multicast Packets Received


(packets)

Broadcast Packets Received


(packets)

Drop Events(times)

Undersize Packets
Received(packets)

Oversize Packets Received


(packets)

Fragments(packets)

Jabbers(packets)

Collisions(times)

Octets Received(Byte)

Packets Received(packets)

Table 12-155 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)(packets)

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Packets Transmitted
(65~127 Octets in Length)
(packets)

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Packets Transmitted
(256~511 Octets in Length)
(packets)

Packets Transmitted
(512~1023 Octets in
Length)(packets)

Packets Transmitted
(1024~1518 Octets in Length)
(packets)

Unicast Packets Received


(packets)

Unicast Packets
Transmitted(packets)

Multicast Packets Transmitted


(packets)

Broadcast Packets
Transmitted(packets)

Good Octets Transmitted


(Byte)

Alignment Errors(frames)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Speed


Transmitted(Byte/s)

Good Full Frame Octets


Received(Byte)

Good Full Frame Octets


Transmitted(Byte)

12.8.15 Technical Specifications


The technical specifications of the EMS2 include the parameters specified for optical interfaces,
laser safety class, dimensions, weight, and power consumption.

Parameters Specified for Optical Interfaces


Table 12-156 lists the parameters specified for the optical interfaces of the EMS2.
Table 12-156 Parameters specified for the optical interfaces of the EMS2

Issue 03 (2013-02-20)

Parameter

Value

Type of optical
interface

1000BASE-ZX
(80 km)

1000BASEVX (40 km)

1000BASELX (10 km)

1000BASE-SX
(0.5 km)

Type of fiber

Single-mode LC

Single-mode
LC

Single-mode
LC

Multi-mode LC

Launched optical
power range
(dBm)

-2 to 5

-5 to 0

-9 to -3

-9.5 to -2.5

Operating
wavelength range
(nm)

1500 to 1580

1275 to 1350

1270 to 1355

770 to 860

Minimum
overload (dBm)

-3

-3

-3

Receiver
sensitivity (dBm)

-23

-23

-20

-17

Minimum
extinction ratio
(dB)

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Parameter

Value

Maximum -20 dB
spectral width
(nm)

12 EoS Boards

Minimum side
30
mode suppression
ratio (dB)

30

Ethernet Electrical Interfaces


Table 12-157 lists the parameters specified for the electrical interfaces of the EMS2.
Table 12-157 Parameters specified for the electrical interfaces of the EMS2
Type of Interface

Code Type

1000BASE-T, RJ-45

4D-PAM5

Ethernet Performance Specifications


NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EMS2 board of the N1 version.

Figure 12-44 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the EMS2.
Figure 12-44 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, latency specifications, and back-to-back specifications
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-158 and Table 12-159 list the throughput specifications of the EMS2. Table 12-160
and Table 12-161 list the packet loss ratio in the case of overloading of the EMS2. Table
12-162 and Table 12-163 list the latency specifications of the EMS2. Table 12-164 and Table
12-165 list the back-to-back specifications of the EMS2.
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NOTE

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual environment
are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and three VC-3s is bound on the FE port, or EPL services are configured and 48 VC-12s
are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-158 lists the throughput specifications of the EMS2 (three VC-3s is bound on the FE
port). The values are obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 5 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): none

Mode: Uni-directional

Table 12-158 Throughput specifications of the EMS2 (three VC-3s is bound on the FE port)
Frame Size
(byte)

Passed Rate (%)

(01,09,01) to (01,09,02)
(pks/sec)

Total (pks/sec)

64

100.00

148810

148810

128

100.00

84459

84459

256

100.00

45290

45290

512

100.00

23496

23496

1024

100.00

11973

11973

1280

100.00

9615

9615

1518

100.00

8127

8127

Table 12-159 lists the throughput specifications of the EMS2 (48 VC-12s are bound on the GE
port). The values are obtained when the SmartApplication is set as follows:
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The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 100.00

Resolution rate (%): 1.00

Mode: Uni-directional

Table 12-159 Throughput specifications of the EMS2 (48 VC-12s are bound on the GE port)
Frame Size
(byte)

Passed Rate (%)

(01,05,01) to (01,05,02)
(pks/sec)

Total (pks/sec)

64

11.41

169837

339674

128

10.82

91374

182748

256

10.19

46160

92320

512

10.20

23965

47930

1024

10.20

12212

24424

1280

10.20

9809

19618

1518

10.20

8288

16576

Table 12-160 lists the packet loss ratio in the case of overloading of the EMS2 (three VC-3s is
bound on the FE port). The values are obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 5 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

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Table 12-160 Packet loss ratio in the case of overloading of the EMS2 (three VC-3s is bound
on the FE port)
Frame Size
(byte)

Rate Tested (%)

(01,09,01) to (01,09,02)
(%)

Average (%)

64

100.00

0.000

0.000

128

100.00

0.000

0.000

256

100.00

0.000

0.000

512

100.00

0.000

0.000

1024

100.00

0.000

0.000

1280

100.00

0.000

0.000

1518

100.00

0.000

0.000

Table 12-161 lists the packet loss ratio in the case of overloading of the EMS2 (48 VC-12s are
bound on the GE port). The values are obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 11.41

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Table 12-161 Packet loss ratio in the case of overloading of the EMS2 (48 VC-12s are bound
on the GE port)

Issue 03 (2013-02-20)

Frame Size
(byte)

Rate Tested (%)

(01,05,01) to (01,05,02)
(%)

Average (%)

64

11.41

0.000

0.000

128

10.82

0.000

0.000

256

10.19

0.000

0.000

512

10.20

0.000

0.000

1024

10.20

0.000

0.000

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Frame Size
(byte)

Rate Tested (%)

(01,05,01) to (01,05,02)
(%)

Average (%)

1280

10.20

0.000

0.000

1518

10.20

0.000

0.000

Table 12-162 lists the latency specifications of the EMS2 (three VC-3s is bound on the FE port).
The values are obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The test duration is set to 10 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested
equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Table 12-162 Latency specifications of the EMS2 (three VC-3s is bound on the FE port)

Issue 03 (2013-02-20)

Frame
Size
(byte)

Rate
Tested
(%)

(01,09,01) to
(01,09,02) (us)CT (us)

Average
(CT) (us)

(01,09,01) to
(01,09,02)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

127.1

127.1

121.9

121.9

128

100.00

144.1

144.1

133.9

133.9

256

100.00

172.2

172.2

151.8

151.8

512

100.00

215.3

215.3

174.4

174.4

1024

100.00

299.8

299.8

217.8

217.8

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Frame
Size
(byte)

Rate
Tested
(%)

(01,09,01) to
(01,09,02) (us)CT (us)

Average
(CT) (us)

(01,09,01) to
(01,09,02)
(us)-S&F (us)

Average
(S&F) (us)

1280

100.00

341.7

341.7

239.3

239.3

1518

100.00

377.1

377.1

255.7

255.7

Table 12-163 lists the latency specifications of the EMS2 (48 VC-12s are bound on the GE
port). The values are obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The test duration is set to 100 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested
equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 11.41

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Table 12-163 Latency specifications of the EMS2 (48 VC-12s are bound on the GE port)

Issue 03 (2013-02-20)

Frame
Size
(byte)

Rate
Tested
(%)

(01,03,01) to
(01,03,02) (us)CT (us)

Average
(CT) (us)

(01,03,01) to
(01,03,02)
(us)-S&F (us)

Average
(S&F) (us)

64

11.41

657.9

657.9

657.4

657.4

128

10.82

663.9

663.9

662.8

662.8

256

10.19

683.6

683.6

681.6

681.6

512

10.20

717.3

717.3

713.3

713.3

1024

10.20

789.6

789.6

781.5

781.5

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Frame
Size
(byte)

Rate
Tested
(%)

(01,03,01) to
(01,03,02) (us)CT (us)

Average
(CT) (us)

(01,03,01) to
(01,03,02)
(us)-S&F (us)

Average
(S&F) (us)

1280

10.20

822.1

822.1

811.9

811.9

1518

10.20

846.9

846.9

834.8

834.8

Table 12-164 lists the back-to-back specifications of the EMS2 (three VC-3s is bound on the
FE port). The values are obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission rate
is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is set to
a value more than 1 on the Smart Application.

The tested traffic is set to the wire speed.

The test duration is set to 2 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Table 12-164 Back-to-back specifications of the EMS2 (three VC-3s is bound on the FE port)
Frame Size
(byte)

Rate Tested (%)

(01,01,03) to (01,01,06)
Burst Size (frames)

Total (frames)

64

100.00

297620

297620

128

100.00

168918

168918

256

100.00

90580

90580

512

100.00

46992

46992

1024

100.00

23946

23946

1280

100.00

19230

19230

1518

100.00

16254

16254

Table 12-165 lists the back-to-back specifications of the EMS2 (48 VC-12s are bound on the
GE port). The values are obtained when the SmartApplication is set as follows:
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The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission rate
is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is set to
a value more than 1 on the Smart Application.

The tested traffic is set to the wire speed.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 11.41

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Table 12-165 Back-to-back specifications of the EMS2 (48 VC-12s are bound on the GE port)
Frame Size
(byte)

Rate Tested (%)

(01,03,01) to (01,03,02)
Burst Size (frames)

Total (frames)

64

11.41

339674

679348

128

10.82

182748

365496

256

10.19

92320

184640

512

10.20

47930

95860

1024

10.20

24424

48848

1280

10.20

19610

39220

1518

10.20

16576

33152

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EMS2 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.8

Power Consumption
The maximum power consumption of the EMS2 at room temperature (25C) is 40 W.
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12.9 EMS4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EMS4 (4xGE and 16xFE switching and processing board). This
topic also describes how to configure and commission the EMS4.

12.9.1 Version Description


The EMS4 is available in one functional version, namely, N1.

12.9.2 Application
The EMS4 is used to transmit/receive Ethernet services, manage bandwidths, and realize Layer
2 switching of Ethernet services.
Figure 12-45 shows the typical networking and application of the Ethernet switching board. the
Ethernet switching board accesses and converges Ethernet services, and provides the Ethernet
data with the following data features: Layer 2 switching, port isolation, flow classification, traffic
control, VLAN management, and priority configuration. In addition, the Ethernet switching
board performs encapsulation/decapsulation, virtual concatenation, and SDH mapping/
demapping for data. The Ethernet switching board can be interconnected with the bandwidth
access equipment and the data communication equipment at the same time, thus to provide a
network-level solution.
Figure 12-45 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

Issue 03 (2013-02-20)

User A1

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NOTE

When the service converging FE services into GE services is configured, the GE switching board can be
set only to the 1000M full-duplex mode, the VLAN of the convergence service is variable, and the binding
granularity can be at the VC-3 or VC-12 level.

12.9.3 Functions and Features


The EMS4 supports the Layer 2 switching, link convergence, and multicast functions.
Table 12-166 provides the functions and features of the EMS4.
Table 12-166 Functions and features of the EMS4
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits and processes 4xGE and 16xFE services

Interfa
ce
types

l Supports the 1000BASE-SX/LX/ZX/VX Ethernet optical interfaces. The optical


interfaces support the auto-negotiation function in compliance with IEEE 802.3z.
The optical interfaces use the SFP optical modules. When the multi-mode optical
fiber is used, the maximum transmission distance is 550 m. When the singlemode optical fiber is used, the maximum transmission distance is 10 km. The
optical modules that can meet different requirements for the transmission
distance such as 40 km and 80 km can also be used.
l Supports the 1000BASE-T RJ-45 Ethernet electrical interface. The electrical
interface supports the auto-negotiation function. The negotiated rate can be 10
Mbit/s, 100 Mbit/s, or. 1000 Mbit/s. The EMS4 uses the SFP electrical interface
and supports hot swapping. The maximum transmission distance is 100 m.
l Supports 10BASE-T/100BASE-TX signals when the EMS4 is used with the
ETF8 and supports 100BASE-FX signals when the EMS4 is used with the EFF8.
l The optical interfaces comply with IEEE 802.3u.

Issue 03 (2013-02-20)

Functi
ons
when
being
used
with
an
interfa
ce
board

l Receives/Transmits 16xFE signals through the electrical interface when the


EMS4 is used with the ETF8.

Interfa
ce
charac

Working
modes

l Receives/Transmits 16xFE signals through the optical interface when the EMS4
is used with the EFF8.
l Receives/Transmits 8xFE signals through the electrical interface and 8xFE
signals through the optical interface when the EMS4 is used with the ETF8 and
EFF8.

1000M full-duplex

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Funct
ion
and
Featu
re

Description

teristic
s

Traffic
control at
ports

12 EoS Boards

Auto-negotiation mode

Supported

Non-autonegotiation mode

Not supported

Query/
Supported
Setting of
port
status
Query of
interface
types

Supported

Setting of Not supported


optical
power
threshold
s

Servic
e
catego
ries

Pluggabl
e optical
module

Supports SFP optical modules.

EPL
service

Supports PORT-based transparent transmission.

EVPL
service

l Supports PORT-shared EVPL services.


l Supports VCTRUNK-shared EVPL services.
The services are isolated by VLAN tags.
The services are isolated by MPLS tags.
The services are isolated by QinQ tags.
l Supports a maximum of 8000 links.

EPLAN
service

l Supports the blacklist that can contain 512 records and also the static
MAC address table that can contain 512 records. The blacklist
function supports verification of destination MAC addresses only.
l Supports the self-learning of the source MAC address. The capacity
of the MAC address table is 128K. The aging time of the MAC
address can be set and queried.
l Supports the configuration of static MAC routes.
l Supports the query of dynamic MAC addresses.
l The maximum number of supported VBs is 2. The maximum
number of logical ports for each VB is 40.
l Supports the EPLAN services that are based on the IEEE 802.1d
MAC bridge.

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Description

EVPLA
N service

l Supports data isolation based on VB+VLAN.


l Supports the setting of a maximum of 4000 VLAN services.
l Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge and IEEE 802.1ad provider bridge.

Servic
e
specifi
cation
s

Issue 03 (2013-02-20)

Formats
of
Ethernet
data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1 q/p

Supported

Frame
length
range

l Supports the setting of the frame length to a value ranging from 1518
bytes to 9216 bytes.

Bound
bandwidt
h

16xVC-4, or 48xVC-3, or 1008xVC-12

Mapping
granularit
ies

VC-12, VC-3, VC-4, VC-12-Xv (X 64), VC-3-Xv (X 24), and


VC-4-Xv (X 8).

Encapsul
ation
formats

HDLC

Supported

LAPS

Supported

GFP-F

Supported

l Supports a jumbo frame with a maximum length of 9216 bytes.

MPLS
technolo
gy

Not supported

VLAN
technolo
gy

Supports a total number of 4094 VLANs, which comply with IEEE


802.1q/p.

Maximu
m uplink
bandwidt
h

2.5 Gbit/s.

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ion
and
Featu
re

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Description

VCTRU
NK
specificat
ions

Number of VCTRUNKs: 64
Notes for configuration:
l A VCTRUNK can be bound with the VC-12 path or VC-3 path at
one time. A VCTRUNK should not be bound with VC-12 and VC-3
paths at the same time.
l The maximum bandwidth of a VCTRUNK is 1.25 Gbit/s. A
VCTRUNK can be bound to a maximum of eight VC-4s, 24 VC-3s,
or 63 VC-12s.

Protec
tion
schem
es

TPS

Not supported

BPS

Supported

PPS

Supported

DLAG

Supported

LAG

Supports manual link aggregation and static link aggregation.


Supports the load sharing mode and load non-sharing mode.
Complies with IEEE 802.3ad and IEEE 802.1AX.

Clock
synchr
onizati
on

Maint
enanc
e
featur
es

Issue 03 (2013-02-20)

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports P2P LPT and P2MP LPT in compliance with ITU-T G.7042.

STP/
RSTP

Supports the broadcast packet suppression function and RSTP, which


comply with IEEE 802.1w.

MSTP

Does not support the MSTP.

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Not supported
l Supports CC, LB tests, and LT tests in compliance with IEEE
802.1ag, LM and DM in compliance with ITU-T Y.1731, and OAM
ping in compliance with Huawei proprietary protocol.
l Supports OAM auto-discovery, remote loopbacks, fault detection,
and link performance detection in compliance with IEEE 802.3ah,
and selfloop detection in compliance with Huawei proprietary
protocol.

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ion
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QoS

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Description

Test
Frame

Supports test frames in GFP bearer mode.

Response
to ping

Not supported

Port
mirroring

Not supported

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Inloops

MAC layer at Ethernet ports

Not supported

VC-4 level

Not supported

VC-3 level

Not supported

VC-12 level

Not supported

RMON

Supports RMON of the Ethernet performance of Ethernet ports and


VCTRUNKs.

Warm
resets

Supported

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates


management and maintenance of the equipment.

l Supports the CAR. The granularity is 64 kbit/s.


l Supports the flow classification based on PORT, PORT+VLAN, or PORT
+SVLAN.

IGMP
snoopi
ng

Issue 03 (2013-02-20)

Protocol
enabling

Supported

Port
aging
time

Supported

Fast
leave

Supported

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Traffi
c
contro
l

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Description

Discardin
g of
unknown
broadcast
packets

Supported

Static
broadcast
entry

Supported

Supports the port-based traffic control function that complies with IEEE 802.3x.

12.9.4 Working Principle and Signal Flow


The EMS4 consists of the Ethernet access module, network processor module, mapping module,
interface converting module, logic and control module, clock module, and power module.
Figure 12-46 shows the functional block diagram of the EMS4 by describing how to process
1xGE/FE signals.

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Figure 12-46 Functional block diagram of the EMS4


Backplane

Cross-connect unit
Interface
converting
module

VCP

Laser
shutdown

DENCP

Network processor module

ENCP

Network Control Switch


processor
fabric
Data

GE/FE Ethernet
access
module

Cross-connect unit

Mapping module

LOS

Communication

Logic and
control module

Reference clock and frame header

+3.3 V
Clock module
77
50
MHz MHz

Power
module

Power
module

Fuse

SCC unit
SCC unit

-48 V/-60 V
-48 V/-60 V

125 155
MHz MHz

ENCP: data encapsulation module

DENCP: decapsulation module

VCP: virtual concatenation processing module

Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or routers
are converted into electrical signals. If the signals are accessed through electrical interfaces, O/
E conversion is not required. At the PHY layer, the electrical signals are decoded and the
ETH_LOS alarm is detected. The electrical signals are converted from serial signals into parallel
signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module


The network processor module consists of the network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The Ethernet/VLAN format is supported.
The network processor module supports the following functions:
l
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Unicast, multicast, and broadcast of the flow

Setting of data priorities

WFQ

Four CoSs

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Mapping Module
The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP-F, or
HDLC format. The concatenation is performed. The LCAS function is supported. Then, the
Ethernet signals are converted into SDH signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and HDLC
controller. This module is connected to external circuits through the bus. The logic and control
module performs the following functions:
l

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:
l

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

Clock Module
The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.
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Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.9.5 Front Panel


The front panel of the EMS4 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 12-47 shows the appearance of the front panel of the EMS4 that has the GE optical
interface.
Figure 12-47 Front panel of the EMS4 that has the GE optical interface

EMS4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
LINK ACT
1
2
3
4

EMS4

Figure 12-48 shows the appearance of the front panel of the EMS4 that has the GE electrical
interface.
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Figure 12-48 Front panel of the EMS4 that has the GE electrical interface

EMS4
STAT
ACT
PROG
SRV

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
LINK ACT
1
2
3
4

EMS4

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 24 Indicators.

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Interfaces
The front panel of the EMS4 has four interfaces. Table 12-167 describes the types and usage of
the optical interfaces of the EMS4. When the EMS4 has the electrical interfaces, the four GE
electrical interfaces are of the same type and have the same usage. Table 12-168 describes the
types and usage of the electrical interfaces of the EMS4.
Table 12-167 Optical interfaces of the EMS4
Interface

Type of
Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

OUT2/IN2

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

OUT3/IN3

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

OUT4/IN4

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

Table 12-168 Electrical interfaces of the EMS4


Interface

Type of
Interface

Usage

GE

RJ-45
(swappable)

Transmits and receives 1000BASE-T signals.

Table 12-169 provides the pin assignments of the RJ-45 interface of the EMS4.
Table 12-169 Pin assignments of the RJ-45 interface of the EMS4

Issue 03 (2013-02-20)

Pin

Description

BI_DA+

BI_DA

BI_DB+

BI_DC+

BI_DC

BI_DB

BI_DD+

BI_DD
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12.9.6 Jumpers and DIP Switches


The EMS4 does not have any jumpers or DIP switches that are used for board settings.

12.9.7 Valid Slots


The EMS4 must be installed in a valid slot in the subrack. Otherwise, the EMS4 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The EMS4 can be used with the ETF8 and EFF8.


The EMS4 can be installed in slots 16 and 1316 in the subrack. The slots valid for the EMS4
vary with the bandwidth and cross-connect capacity of the subrack.
l

When the cross-connect capacity is 200 Gbit/s, the EMS4 can be installed in slots 16 and
1316. When the EMS4 is installed in slots 14, 15, and 16, the bandwidth is 1.25 Gbit/s.
When the EMS4 is installed in slots 5, 6, 13, and 14, the bandwidth is 2.5 Gbit/s.

Table 12-170 lists the slots valid for the EMS4 and the corresponding slots for the ETF8 and
EFF8.
Table 12-170 Slots valid for the EMS4 and the corresponding slots for the ETF8 and EFF8

Issue 03 (2013-02-20)

Slot Valid for the EMS4

Corresponding Slots for the ETF8 and EFF8

Slot 1

Without an interface board

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 6

Without an interface board

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

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12.9.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the EMS4 indicates the type of interface.
Table 12-171 provides the relationship between the feature code of the EMS4 and the type of
interface.
Table 12-171 Relationship between the feature code of the EMS4 and the type of interface
Board

Feature Code

Type of Interface

SSN1EMS410

10

1000BASE-LX (0.5 km)

SSN1EMS411

11

1000BASE-SX (10 km)

SSN1EMS412

12

1000BASE-VX (40 km)

SSN1EMS413

13

1000BASE-ZX (80 km)

SSN1EMS414

14

1000BASE-T (100 m)

12.9.9 Board Protection


The EMS4 supports the BPS, PPS, and distributed link aggregation group (DLAG) protection.

Protection Principle
When the BPS protection is provided for the EMS4, the GE and FE ports are protected by using
the single-fed and selective-receiving scheme. The EMS4 has four GE ports and 16 FE ports
and hence may be connected to many sets of communication equipment. Normally, the active
board is working and services are transmitted in two directions of the active link. On the standby
link, the EMS4 disables the transmission of all ports. In this case, the ports of the opposite board
are in the link-down state. In addition, the opposite board enables the transmission but does not
transmit services. In this manner, the receive ports of the standby EMS4 are not in the link-down
state. The solid lines in Figure 12-49 show how the EMS4 normally works.

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Figure 12-49 Normal working of the EMS4

No.1

Active
EMS4

Active
communication
equipment

Standby
communication
equipment

No.2

No.3

Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EMS4

No.3

Active
communication
equipment
Standby
communication
equipment

BPS Protection

When the BPS protection is provided, if the active board detects the link-down state of any link,
any fault in the board, or the offline state of any board, the cross-connect board switches all the
services to the standby board. In this manner, services are protected. The solid lines in Figure
12-50 show how the BPS protection functions. The services numbered 1, 2 and 3 are all switched
to the standby EMS4 and the corresponding communication equipment.

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Figure 12-50 Principle of the BPS protection for the EMS4

No.1

Active
EMS4

Active
communication
equipment
Standby
communication
equipment

No.2

No.3

Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EMS4

No.3

Active
communication
equipment
Standby
communication
equipment

PPS Protection

When the PPS protection is provided, if the active board detects the link-down state of any link,
the cross-connect board switches all the services to the standby board. In this manner, services
are protected. The solid lines in Figure 12-51 show how the PPS protection functions. Only the
service numbered 1 is switched to the standby EMS4 and the standby communication equipment.

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Figure 12-51 Principle of the PPS protection for the EMS4

No.1

Active
communication
equipment

Active
EMS4

Standby
communication
equipment

No.2

No.3
Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EMS4

No.3

Active
communication
equipment

Standby
communication
equipment

NOTE

In the case of the PPS, when a link failure occurs on a port, only the link services on the port are switched
generally. If the services of two ports are associated, for example, the services of port IP1 and port IP2 are
converged into the same VCTRUNK, port IP1 and port IP2 are defined as associated ports. When one port
of the associated ports is faulty, the services of the entire associated port group are switched.

DLAG Protection

The DLAG is a group where the two mapping ports on two identical boards are aggregated to
from a protection group, providing 1+1 protection for the ports. By default, the port on the active
board is working, and the port on the standby board is protecting the working port.
When the DLAG is configured, the cross-connect board switches all services from the active
board to the standby board if the active board detects a link failure on a port, a board offline
event, or a board hardware failure. As shown in Figure 12-52, the services carried on port 1 are
switched to port 1 of the standby EMS4 and the associated equipment.

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Figure 12-52 Principle of the DLAG protection for the EMS4


PORT1

Active

PORT2

EMS4

PORT3

Active
communication
equipment

1#

A
2#

Standby
communication
equipment

VCG
3#

XCS
1#

Active
communication
equipment
Standby
communication
equipment

VCG
2#
PORT1

Standby
EMS4

PORT2
PORT3
3#

Active
communication
equipment
Standby
communication
equipment

WARNING
When the board-level BPS/PPS protection is performed, the FE ports support only the 100M
full-duplex mode and the GE optical ports support the auto-negotiation and 1000M full-duplex
mode.

Board Configuration
Two EMS4 boards should be configured on an NE to provide the board-level protection. One
EMS4 is the active board and the other is the standby board. When you configure the EMS4
board protection, ensure that the access capacity of the slot that houses the standby board must
not be less than the access capacity of the slot that houses the active board.

12.9.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
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l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring Ethernet Services.
Step 3 Required: Set the Ethernet interface.
l Set the overhead byte as follows:
J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.
l Set the Ethernet interface as follows:
Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.
Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of
traffic, services may be completely interrupted.
For details, see 28.7 Checking Board Parameters.
NOTE

For more information about the parameters of the board, see 27.4.2 Ethernet Parameters.

Step 4 Optional: Configure the Layer 2 switching management service, including the following tasks:
l Enabling the IGMP Snooping Protocol
l Configuring the Spanning Tree
l Setting the Aging Time for the Multicast Router Port
Step 5 Optional: Configure the QoS. For details, see Configuring QoS.
Step 6 Optional: Configure the link aggregation function on the Ethernet port. For details, see Creating
a LAG.
Step 7 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End
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Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

12.9.11 Configuring the Board Functions


The EMS4 supports multiple Ethernet functions and features such as Layer 2 switching, LCAS,
and LPT. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EMS4 by using the U2000:
l

LCAS

LPT

LAG

ETH OAM

Test Frame

STP/RSTP

IGMP Snooping

12.9.12 Parameter Settings


You can set parameters for the EMS4 by using the U2000.
You can set the following main parameters for the EMS4 by using the U2000:
l

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

12.9.13 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.
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Troubleshooting
Table 12-172 lists the faults that occur on the EMS4 frequently and the troubleshooting methods.
Table 12-172 Methods used to troubleshoot the faults that occur on the EMS4 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on a single


Ethernet port are interrupted.
l The services on all the Ethernet
ports are interrupted.
Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The services on a single


Ethernet port are transiently
interrupted.
l The protocol becomes
abnormal.
l The negotiated working mode
of the Ethernet ports is the halfduplex mode.

Packet loss

See Troubleshooting Service


Packet Loss.

l Bit errors occur on the line side.


Interconnection
fault

l The interconnection fault


occurs on a single Ethernet port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCG port.
l The LCAS interconnection
fault occurs.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EMS4, see Replacing an EOS Board.

12.9.14 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

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12.9.14.1 Alarms of N1EMS4

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B3_SD_VC4

ALM_GFP_dCSF

ALM_GFP_dLFD

AU_AIS

AU_LOP

B3_EXC_VC3

B3_EXC_VC4

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

BOOTROM_BAD

COMMUN_FAIL

ETH_LOS

ETHOAM_RMT_LOOP

ETHOAM_DISCOVER_FA
IL

ETHOAM_RMT_CRIT_FA
ULT

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

ETHOAM_RMT_SD

FPGA_ABN

HARD_BAD

FLOW_OVER

HP_LOM

HP_RDI

HP_CROSSTR

HP_SLM

HP_TIM

HP_REI

LASER_MOD_ERR

LCAS_PLCR

HP_UNEQ

LCAS_TLCR

LCAS_TLCT

LCAS_PLCT

LOOP_ALM

LP_CROSSTR

LINK_ERR

LP_RDI_VC3

LP_REI

LP_RDI

LP_SLM

LP_SLM_VC3

LP_REI_VC3

LP_TIM_VC3

LP_UNEQ

LP_TIM

LPT_RFI

LSR_NO_FITED

LP_UNEQ_VC3

LTEMP_OVER

NO_BD_SOFT

LSR_WILL_DIE

SUBCARD_ABN

LAG_PORT_FAIL

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

TD

TEMP_OVER

TF

TU_AIS

TU_AIS_VC3

TU_LOP

TU_LOP_VC3

VC3_CROSSTR

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_LOM_VC4

VCAT_SQM_VC12

VCAT_SQM_VC3

VCAT_SQM_VC4

ETH_NO_FLOW

VCTRUNK_NO_FLOW

W_R_FAIL

TR_LOC

T_LOSEX

PORTMODE_MISMATCH

ETHOAM_VCG_SELF_LO
OP

DLAG_PROTECT_FAIL

ETHOAM_SELF_LOOP

MOD_TYPE_MISMATCH

PORT_MODULE_OFFLINE

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IN_PWR_HIGH

IN_PWR_LOW

OUT_PWR_HIGH

OUT_PWR_LOW

SWDL_PKG_NOBDSOFT

ETH_CFM_MISMERGE

ETH_CFM_UNEXPERI

ETH_CFM_LOC

ETH_CFM_RDI

WRG_BD_TYPE

12.9.15 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

12.9.15.1 Performance Events of N1EMS4


Table 12-173 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

XCSTMPCUR

XCSTMPMAX

XCSTMPMIN

Table 12-174 RMON alarm

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OversizePkts

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Table 12-175 Statistics of RMON basic performance


Broadcast Packets
Received(packets)

Multicast Packets Received


(packets)

Undersize Packets Received


(packets)

Oversize Packets Received


(packets)

Table 12-176 Statistics of RMON extended performance


Unicast Packets Received
(packets)

Unicast Packets
Transmitted(packets)

Pause Frames Received(frames)

Pause Frames Transmitted


(frames)

Multicast Packets
Transmitted(packets)

Broadcast Packets Transmitted


(packets)

Good Octets Received


(Byte)

Good Octets Transmitted


(Byte)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Speed


Transmitted(Byte/s)

Table 12-177 Statistics of RMON VCG performance


Octets Received(Byte)

Octets Transmitted(Byte)

Packets Received(packets)

Packets Transmitted
(packets)

Good Packets Received


(packets)

Good Packets Transmitted


(packets)

Full Frame Speed


Received(Byte/s)

Full Frame Speed


Transmitted(Byte/s)

12.9.16 Technical Specifications


The technical specifications of the EMS4 include the parameters specified for optical interfaces,
laser safety class, Ethernet performance specifications, mechanical specifications, and power
consumption.

Parameters Specified for Optical Interfaces


Table 12-178 lists the parameters specified for the optical interfaces of the EMS4.
Table 12-178 Parameters specified for the optical interfaces of the EMS4

Issue 03 (2013-02-20)

Parameter

Value

Type of optical
interface

1000BASE-ZX
(80 km)

1000BASEVX (40 km)

1000BASELX (10 km)

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Parameter

Value

Type of fiber

Single-mode LC

Single-mode
LC

Single-mode
LC

Multi-mode LC

Launched optical
power range
(dBm)

-2 to 5

-5 to 0

-9 to -3

-9.5 to -2.5

Operating
wavelength range
(nm)

1500 to 1580

1275 to 1350

1270 to 1355

770 to 860

Minimum
overload (dBm)

-3

-3

-3

Receiver
sensitivity (dBm)

-23

-23

-20

-17

Minimum
extinction ratio
(dB)

Maximum -20 dB
spectral width
(nm)

30

Minimum side
30
mode suppression
ratio (dB)

Ethernet Electrical Interfaces


Table 12-179 lists the parameters specified for the electrical interfaces of the EMS4.
Table 12-179 Parameters specified for the electrical interfaces of the EMS4
Type of Interface

Code Type

1000BASE-T, RJ-45

4D-PAM5

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Ethernet Performance Specifications


NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EMS4 board of the N1 version.

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Figure 12-53 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the EMS4.
Figure 12-53 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, latency specifications, and back-to-back specifications
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-180 and Table 12-181 list the throughput specifications of the EMS4. Table 12-182
and Table 12-183 list the packet loss ratio in the case of overloading of the EMS4. Table
12-184 and Table 12-185 list the latency specifications of the EMS4. Table 12-186 and Table
12-187 list the back-to-back specifications of the EMS4.
NOTE

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual environment
are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and one VC-4 is bound on the FE port, or EPL services are configured and 24 VC-3s are
bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-180 lists the throughput specifications of the EMS4 (one VC-4 is bound on the FE
port). The values are obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

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Maximum rate (%): none

Mode: Uni-directional

12 EoS Boards

Table 12-180 Throughput specifications of the EMS4 (one VC-4 is bound on the FE port)
Frame Size
(Byte)

Passed Rate (%)

(01,01,03) to (01,01,06)
(pks/sec)

Total (pks/sec)

64

100.00

148810

148810

128

100.00

84459

84459

256

100.00

45290

45290

512

100.00

23496

23496

1024

100.00

11973

11973

1280

100.00

9615

9615

1518

100.00

8127

8127

Table 12-181 lists the throughput specifications of the EMS4 (24 VC-3s are bound on the GE
port). The values are obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 100.00

Resolution rate (%): 1.00

Mode: Uni-directional

Table 12-181 Throughput specifications of the EMS4 (24 VC-3s are bound on the GE port)

Issue 03 (2013-02-20)

Frame Size
(Byte)

Passed Rate (%)

(01,03,01) to (01,03,02)
(pks/sec)

Total (pks/sec)

64

100.00

1488095

1488095

128

100.00

844595

844595

256

100.00

452899

452899

512

100.00

234962

234962

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Frame Size
(Byte)

Passed Rate (%)

(01,03,01) to (01,03,02)
(pks/sec)

Total (pks/sec)

1024

100.00

119732

119732

1280

100.00

96154

96154

1518

100.00

81274

81274

Table 12-182 lists the packet loss ratio in the case of overloading of the EMS4 (one VC-4 is
bound on the FE port). The values are obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Table 12-182 Packet loss ratio in the case of overloading of the EMS4 (one VC-4 is bound on
the FE port)
Frame Size
(Byte)

Rate Tested (%)

(01,01,03) to (01,01,06)
(%)

Average (%)

64

100.00

0.000

0.000

128

100.00

0.000

0.000

256

100.00

0.000

0.000

512

100.00

0.000

0.000

1024

100.00

0.000

0.000

1280

100.00

0.000

0.000

1518

100.00

0.000

0.000

Table 12-183 lists the packet loss ratio in the case of overloading of the EMS4 (24 VC-3s are
bound on the GE port). The values are obtained when the SmartApplication is set as follows:
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The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Table 12-183 Packet loss ratio in the case of overloading of the EMS4 (24 VC-3s are bound on
the GE port)
Frame Size
(Byte)

Rate Tested (%)

(01,03,01) to (01,03,02)
(%)

Average (%)

64

100.00

0.000

0.000

128

100.00

0.000

0.000

256

100.00

0.000

0.000

512

100.00

0.000

0.000

1024

100.00

0.000

0.000

1280

100.00

0.000

0.000

1518

100.00

0.000

0.000

Table 12-184 lists the latency specifications of the EMS4 (one VC-4 is bound on the FE port).
The values are obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The test duration is set to 60 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested
equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

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Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Table 12-184 Latency specifications of the EMS4 (one VC-4 is bound on the FE port)
Frame
Size
(Byte)

Rate
Tested
(%)

(01,01,03) to
(01,01,06) (us)CT (us)

Average
(CT) (us)

(01,01,03) to
(01,01,06)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

110.6

110.6

105.5

105.5

128

100.00

123.8

123.8

113.6

113.6

256

100.00

149.2

149.2

128.8

128.8

512

100.00

195.5

195.5

154.6

154.6

1024

100.00

285.6

285.6

203.7

203.7

1280

100.00

344.6

344.6

240.5

240.5

1518

100.00

373.1

373.1

251.7

251.7

Table 12-185 lists the latency specifications of the EMS4 (24 VC-3s are bound on the GE port).
The values are obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The test duration is set to 60 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested
equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

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Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

12 EoS Boards

Table 12-185 Latency specifications of the EMS4 (24 VC-3s are bound on the GE port)
Frame
Size
(Byte)

Rate
Tested
(%)

(01,03,01) to
(01,03,02) (us)CT (us)

Average
(CT) (us)

(01,03,01) to
(01,03,02)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

80.9

80.9

80.4

80.4

128

100.00

83.0

83.0

82.0

82.0

256

100.00

86.9

86.9

84.9

84.9

512

100.00

94.9

94.9

90.9

90.9

1024

100.00

108.8

108.8

100.7

100.7

1280

100.00

115.2

115.2

105.0

105.0

1518

100.00

120.7

120.7

108.6

108.6

Table 12-186 lists the back-to-back specifications of the EMS4 (one VC-4 is bound on the FE
port). The values are obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission rate
is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is set to
a value more than 50 on the Smart Application.

The tested traffic is set to the wire speed.

The test duration is set to 10 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

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Table 12-186 Back-to-back specifications of the EMS4 (one VC-4 is bound on the FE port)
Frame Size
(Byte)

Rate Tested (%)

(01,01,03) to (01,01,06)
Burst Size (Number of
Frames)

Total (Number of
Frames)

64

100.00

1488100

1488100

128

100.00

844590

844590

256

100.00

452900

452900

512

100.00

234960

234960

1024

100.00

119730

119730

1280

100.00

96150

96150

1518

100.00

81270

81270

Table 12-187 lists the back-to-back specifications of the EMS4 (24 VC-3s are bound on the GE
port). The values are obtained when the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission rate
is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is set to
a value more than 50 on the Smart Application.

The tested traffic is set to the wire speed.

The test duration is set to 10 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Table 12-187 Back-to-back specifications of the EMS4 (24 VC-3s are bound on the GE port)

Issue 03 (2013-02-20)

Frame Size
(Byte)

Rate Tested (%)

(01,03,01) to (01,03,02)
Burst Size (Number of
Frames)

Total (Number of
Frames)

64

100.00

2976190

2976190

128

100.00

1689190

1689190

256

100.00

905798

905798

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Frame Size
(Byte)

Rate Tested (%)

(01,03,01) to (01,03,02)
Burst Size (Number of
Frames)

Total (Number of
Frames)

512

100.00

469924

469924

1024

100.00

239464

239464

1280

100.00

192308

192308

1518

100.00

162548

162548

Mechanical Specifications
The mechanical specifications of the EMS4 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.1

Power Consumption
The maximum power consumption of the EMS4 at room temperature (25C) is 65 W.

12.10 EGS4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGS4 (4xGE switching and processing board). This topic also
describes how to configure and commission the EGS4.

12.10.1 Version Description


The EGS4 is available in three functional versions, namely, N1, N3 and N4. The N3EGS4 is
discontinued.
Table 12-188 describes the versions of the EGS4.
Table 12-188 Versions of the EGS4
Item

Description

Functional versions

The EGS4 is available in three functional versions, namely, N1, N3


and N4.

Differences

l Regarding interface specifications: interface types


l Regarding service specifications: bound bandwidth,
VCTRUNK specifications
l Regarding maintenance features: ETH OAM
l QoS

Substitution

Issue 03 (2013-02-20)

The N4EGS4 can substitute for the N3EGS4.

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12.10.2 Application
The EGS4 is used to transmit/receive Ethernet services, manage bandwidths, and realize Layer
2 switching of Ethernet services.
Figure 12-54 shows the typical networking and application of the Ethernet switching board. the
Ethernet switching board accesses and converges Ethernet services, and provides the Ethernet
data with the following data features: Layer 2 switching, port isolation, flow classification, traffic
control, VLAN management, and priority configuration. In addition, the Ethernet switching
board performs encapsulation/decapsulation, virtual concatenation, and SDH mapping/
demapping for data. The Ethernet switching board can be interconnected with the bandwidth
access equipment and the data communication equipment at the same time, thus to provide a
network-level solution.
Figure 12-54 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

NOTE

When the service converging FE services into GE services is configured, the GE switching board can be
set only to the 1000M full-duplex mode, the VLAN of the convergence service is variable, and the binding
granularity can be at the VC-3 or VC-12 level.

12.10.3 Functions and Features


The EGS4 supports the Layer 2 switching, link aggregation, and multicast functions.
Table 12-189 provides the functions and features of the EGS4.
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Table 12-189 Functions and features of the EGS4


Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits and processes 4xGE services.

Interfa
ce
types

l Supports the 1000BASE-SX/LX/ZX/VX Ethernet optical interfaces. The optical


interfaces support the auto-negotiation function in compliance with IEEE 802.3z.
The optical interfaces use the SFP optical modules. When the multi-mode optical
fiber is used, the maximum transmission distance is 550 m. When the singlemode optical fiber is used, the maximum transmission distance is 10 km. The
optical modules that can meet different requirements for the transmission
distance such as 40 km and 80 km can also be used.
l The N1EGS4 and N4EGS4 also support GE electrical interfaces using RJ45
connectors, whose specifications comply with IEEE 802.3 1000BASE-T. The
GE electrical interfaces on the N1EGS4 can adapt to 1000 Mbit/s, and those on
the N4EGS4 can adapt to 10 Mbit/s, 100 Mbit/s, or 1000 Mbit/s automatically.
The GE electrical interfaces using hot-swapping electrical SFP modules support
signal transmission over a maximum distance of 100 meters.

Functi
ons
when
being
used
with
an
interfa
ce
board

Provides interfaces on the front panel.

Interfa
ce
charac
teristic
s

Working
modes

l GE electrical port (available only on N1EGS4 and N4EGS4


boards): auto-negotiation, 1000M full-duplex, 100M full-duplex,
and 10M full-duplex.
l GE optical port: auto-negotiation and 1000M full-duplex.

Traffic
control at
ports

Auto-negotiation mode

Supported

Non-autonegotiation mode

Supported

Query/
Supported
Setting of
port
status
Query of
interface
types

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Supported

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Funct
ion
and
Featu
re

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Description

Setting of Not supported


optical
power
threshold
s

Servic
e
catego
ries

Pluggabl
e optical
module

Supports SFP optical modules.

EPL
service

Supports PORT-based transparent transmission.

EVPL
service

l Supports PORT-shared EVPL services.


l Supports VCTRUNK-shared EVPL services.
The services are isolated by VLAN tags.
The services are isolated by QinQ tags.
l Supports a maximum of 8000 links.

EPLAN
service

l Supports switching on the client and SDH sides.


l Supports the blacklist that can contain 512 records and also the static
MAC address table that can contain 512 records. The blacklist
function supports verification of destination MAC addresses only.
l Supports the self-learning of the source MAC address. The capacity
of the MAC address table is 128K. The aging time of the MAC
address can be set and queried.
l Supports the configuration of static MAC routes.
l Supports the query of dynamic MAC addresses.
l Supports a maximum of two VBs. The maximum number of logical
ports for each VB is 68.
l Queries the number of actually learned MAC addresses based on
VB+VLAN or VB+LP.
l Supports the EPLAN services that are based on the IEEE 802.1d
MAC bridge.

EVPLA
N service

l Supports data isolation based on VB+VLAN.


l Supports the setting of a maximum of 4000 VLAN services.
l Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge and IEEE 802.1ad provider bridge.

Servic
e
specifi

Issue 03 (2013-02-20)

Formats
of
Ethernet

IEEE 802.3

Supported

Ethernet II

Supported

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Funct
ion
and
Featu
re

Description

cation
s

data
frames

IEEE 802.1 q/p

Frame
length
range

l Supports the setting of the frame length to a value ranging from 1518
bytes to 9216 bytes.

Bound
bandwidt
h

l N1EGS4: 16xVC-4, or 48xVC-3, or 1008xVC-12

Mapping
granularit
ies

VC-12, VC-3, VC-4, VC-12-Xv (X 64), VC-3-Xv (X 24), and


VC-4-Xv (X 8).

Encapsul
ation
formats

HDLC

Supported

LAPS

Supported

GFP-F

Supported

Supported

l Supports a jumbo frame with a maximum length of 9216 bytes.

l N3EGS4/N4EGS4: 16xVC-4, or 48xVC-3, or 504xVC-12

MPLS
technolo
gy

Not supported

VLAN
technolo
gy

Supports a total number of 4094 VLANs, which comply with IEEE


802.1q/p.

Maximu
m uplink
bandwidt
h

2.5 Gbit/s

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ion
and
Featu
re

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Description

VCTRU
NK
specificat
ions

64
Configuration principles are as follows:
l A VCTRUNK can be bound with the VC-12 path or VC-3 path at
one time. A VCTRUNK should not be bound with VC-12 and VC-3
paths at the same time.
l VC-4s numbered 1-4 and 9-12 of the N3EGS4/N4EGS4 support the
binding of VC-3 and VC-12 paths. The other VC-4s support the
binding of VC-3 paths only.
l VC-4s numbered 1-8 and VC-4s numbered 9-16 of the N3EGS4/
N4EGS4 belong to two areas. VC-4 binding must not span the two
areas. A maximum of 8 VC-4s can be bound to one VCTRUNK.
l VC-4s numbered 1-4 and VC-4s numbered 9-12 of the N3EGS4/
N4EGS4 belong to two areas. VC-12 binding must not span the two
areas.

Protec
tion
schem
es

TPS

Not supported

BPS

Supported

PPS

Supported

DLAG

Supported

LAG

Supports manual link aggregation and static link aggregation.


Supports the load sharing mode and load non-sharing mode.
Complies with IEEE 802.3ad and IEEE 802.1AX.

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports the P2P LPT and the P2MP LPT in compliance with ITU-T
G.7042.

STP/
RSTP

Supports the RSTP, which complies with IEEE 802.1w.

MSTP

Does not support the MSTP.

Data DNI Not supported


Protectio
n
Clock
synchr
onizati
on

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Synchron
ous
Ethernet

Not supported

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Description

IEEE
1588v2

Not supported
l N1EGS4/N3EGS4 boards support CC and LB tests in compliance
with IEEE 802.1ag.

Maint
enanc
e
featur
es

l N4EGS4 boards support CC, LB tests, and LT tests in compliance


with IEEE 802.1ag, LM and DM in compliance with ITU-T Y.1731,
and OAM ping in compliance with Huawei proprietary protocol.
l Supports OAM auto-discovery, remote loopbacks, fault detection,
and link performance detection in compliance with IEEE 802.3ah,
and selfloop detection in compliance with Huawei proprietary
protocol (N1EGS4/N3EGS4 boards can only initiate remote
loopbacks).

Issue 03 (2013-02-20)

Test
Frame

Supports test frames in GFP bearer mode.

Response
to ping

Not supported

Port
mirroring

The N4EGS4 supports ingress mirroring.

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Inloops

MAC layer at Ethernet ports

Not supported

VC-4 level

Not supported

VC-3 level

Not supported

VC-12 level

Not supported

RMON

Supports RMON of the Ethernet performance of Ethernet ports and


VCTRUNKs.

Warm
resets

Supported

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

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Funct
ion
and
Featu
re

Description

QoS

l Supports the CAR. The granularity is 64 kbit/s. The N1EGS4 supports 512 rate
modes, and the N3EGS4 and N4EGS4 support 60 rate modes.
l Supports the flow classification based on PORT, PORT+VLAN, or PORT
+SVLAN.

IGMP
snoopi
ng

Traffi
c
contro
l

Protocol
enabling

Supported

Port
aging
time

Supported

Fast
leave

Not supported

Discardin
g of
unknown
broadcast
packets

Not supported

Static
broadcast
entry

Not supported

Supports the port-based traffic control function that complies with IEEE 802.3x.

12.10.4 Working Principle and Signal Flow


The EGS4 consists of the Ethernet access module, network processor module, mapping module,
interface converting module, logic and control module, clock module, and power module.
Figure 12-55 shows the functional block diagram of the EGS4 by describing how to process
1xGE signals.

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Figure 12-55 Functional block diagram of the EGS4


Backplane

Cross-connect unit
Interface
converting
module

VCP

Laser
shutdown

DENCP

Network processor module

ENCP

Network Control Switch


processor
fabric
Data

GE Ethernet
access
module

Cross-connect unit

Mapping module

LOS

Communication

Logic and
control module

Reference clock and frame header

+3.3 V
Clock module
50
77
MHz MHz

Power
module

Power
module

Fuse

SCC unit
SCC unit

-48 V/-60 V
-48 V/-60 V

125 155
MHz MHz

Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or routers
are converted into electrical signals. If the signals are accessed through electrical interfaces, O/
E conversion is not required. At the PHY layer, the electrical signals are decoded and the
ETH_LOS alarm is detected. The electrical signals are converted from serial signals into parallel
signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module


The network processor module consists of the network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The Ethernet/VLAN format is supported.
The network processor module supports the following functions:
l

Flow sense and flow classification

Unicast, multicast, and broadcast of the flow

Setting of data priorities

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Three CoSs

12 EoS Boards

Mapping Module
The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP-F, or
HDLC format. The concatenation is processed. The LCAS function is supported. Then, the
Ethernet signals are converted into SDH signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and HDLC
controller. This module is connected to external circuits through the bus. The logic and control
module performs the following functions:
l

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module has the following functions:
l

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

Clock Module
The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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12.10.5 Front Panel


The front panel of the EGS4 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 12-56 shows the appearance of the front panel of the N1EGS4/N3EGS4/N4EGS4 that
has the optical interface.
Figure 12-56 Front panel of the N1EGS4/N3EGS4/N4EGS4 that has the optical interface

EGS4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
LINK ACT
1
2
3
4

EGS4

The N1EGS4/N4EGS4 can also has the GE electrical interface. Figure 12-57 shows the
appearance of the front panel of the N1EGS4/N4EGS4 that has the GE electrical interface.

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Figure 12-57 front panel of the N1EGS4/N4EGS4 that has the GE electrical interface

EGS4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
LINK ACT
1
2
3
4

EGS4

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 24 Indicators.

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Interfaces
The front panel of the N1EGS4/N3EGS4/N4EGS4 has four GE optical interfaces. Table
12-190 describes the types and usage of the optical interfaces of the N1EGS4/N3EGS4/N4EGS4.
Table 12-190 Optical interfaces of the N1EGS4/N3EGS4/N4EGS4
Interface

Type of
Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

OUT2/IN2

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

OUT3/IN3

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

OUT4/IN4

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

The four GE electrical interfaces of the N1EGS4/N4EGS4 are of the same type and have the
same usage. Table 12-191 describes the types and usage of the electrical interfaces of the
N1EGS4/N4EGS4.
Table 12-191 Electrical interfaces of the N1EGS4/N4EGS4
Interface

Type of
Interface

Usage

GE

RJ-45
(swappable)

Transmits and receives 1000BASE-T signals.

Table 12-192 provides the pin assignments of the RJ-45 interface of the N1EGS4/N4EGS4.
Table 12-192 Pin assignments of the RJ-45 interface of the N1EGS4/N4EGS4

Issue 03 (2013-02-20)

Pin

Description

BI_DA+

BI_DA

BI_DB+

BI_DC+

BI_DC

BI_DB
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Pin

Description

BI_DD+

BI_DD

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12.10.6 Jumpers and DIP Switches


The EGS4 does not have any jumpers or DIP switches that are used for board settings.

12.10.7 Valid Slots


The EGS4 must be installed in a valid slot in the subrack. Otherwise, the EGS4 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The EGS4 can be installed in slots 18 and 1116 in the subrack. The relationship between the
slots valid for the EGS4 and the bandwidth is as follows:
l

When the cross-connect capacity is 200 Gbit/s, the EGS4 can be installed in slots 18 and
1116. When the EGS4 is installed in slots 14, 15, and 16, the bandwidth is 1.25 Gbit/s.
When the EGS4 is installed in slots 58 and 1114, the bandwidth is 2.5 Gbit/s.

12.10.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the EGS4 indicates the type of interface.
Table 12-193 provides the relationship between the feature code of the EGS4 and the type of
interface.
Table 12-193 Relationship between the feature code of the EGS4 and the type of interface

Issue 03 (2013-02-20)

Board

Feature Code

Type of Interface

SSN1EGS410,
SSN3EGS410, and
SSN4EGS10

10

1000BASE-SX (0.5 km)

SSN1EGS411,
SSN3EGS411, and
SSN4EGS411

11

1000BASE-LX (10 km)

SSN1EGS412,
SSN3EGS412, and
SSN4EGS412

12

1000BASE-VX (40 km)

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Board

Feature Code

Type of Interface

SSN1EGS413,
SSN3EGS413, and
SSN4EGS413

13

1000BASE-ZX (80 km)

SSN1EGS414 and
SSN4EGS414

14

1000BASE-T (100 m)

12.10.9 Board Protection


The EGS4 supports the BPS, PPS, and DLAG protection.

Protection Principle
When the BPS protection is provided for the EGS4, the GE and FE ports are protected by using
the single-fed and selective-receiving scheme. The EGS4 may be connected to many sets of
communication equipment. Normally, the active board is working and services are transmitted
in two directions of the active link. On the standby link, the EGS4 disables the transmission of
all ports. In this case, the ports of the opposite board are in the link-down state. In addition, the
opposite board enables the transmission but does not transmit services. In this manner, the
receive ports of the standby EGS4 are not in the link-down state. The solid lines in Figure
12-58 show how the EGS4 normally works.
Figure 12-58 Normal working of the EGS4

No.1

Active
EGS4

Active
communication
equipment
Standby
communication
equipment

No.2

No.3

Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EGS4

No.3

Active
communication
equipment
Standby
communication
equipment

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BPS Protection

When the BPS protection is provided, if the active board detects the link-down state of any link,
any fault in the board, or the offline state of any board, the cross-connect board switches all the
services to the standby board. In this manner, services are protected. The solid lines in Figure
12-59 show how the BPS protection functions. The services numbered 1, 2 and 3 are all switched
to the standby EGS4 and the corresponding communication equipment.
Figure 12-59 Principle of the BPS protection for the EGS4

No.1

Active
EGS4

Active
communication
equipment
Standby
communication
equipment

No.2

No.3

Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EGS4

No.3

Active
communication
equipment
Standby
communication
equipment

PPS Protection

When the PPS protection is provided, if the active board detects the link-down state of any link,
the cross-connect board switches all the services to the standby board. In this manner, services
are protected. The solid lines in Figure 12-60 show how the PPS protection functions. Only the
service numbered 1 is switched to the standby EGS4 and the standby communication equipment.

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Figure 12-60 Principle of the PPS protection for the EGS4

No.1

Active
communication
equipment

Active
EGS4

Standby
communication
equipment

No.2

No.3
Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EGS4

No.3

Active
communication
equipment

Standby
communication
equipment

NOTE

In the case of the PPS, when a link failure occurs on a port, only the link services on the port are switched
generally. If the services of two ports are associated, for example, the services of port IP1 and port IP2 are
converged into the same VCTRUNK, port IP1 and port IP2 are defined as associated ports. When one port
of the associated ports is faulty, the services of the entire associated port group are switched.

DLAG Protection

The DLAG is a group where the two mapping ports on two identical boards are aggregated to
from a protection group, providing 1+1 protection for the ports. By default, the port on the active
board is working, and the port on the standby board is protecting the working port.
When the DLAG is configured, the cross-connect board switches all services from the active
board to the standby board if the active board detects a link failure on a port, a board offline
event, or a board hardware failure. As shown in Figure 12-61, the services carried on port 1 are
switched to port 1 of the standby EGS4 and the associated equipment.

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Figure 12-61 Principle of the DLAG protection for the EGS4


PORT1

Active

PORT2

EGS4

PORT3

1#

A
2#

Active
communication
equipment
Standby
communication
equipment

VCG
3#

XCS
1#

VCG
2#

Active
communication
equipment
Standby
communication
equipment

PORT1

Standby
EGS4

PORT2
PORT3
3#

Active
communication
equipment
Standby
communication
equipment

WARNING
When the board-level protection is performed, the GE optical ports support the auto-negotiation
and 1000M full-duplex mode.

Board Configuration
Two EGS4 boards should be configured on an NE to provide the board-level protection. One
EGS4 is the active board and the other is the standby board. When you configure the EGS4 board
protection, ensure that the access capacity of the slot that houses the standby board must not be
less than the access capacity of the slot that houses the active board.

12.10.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
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l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring Ethernet Services.
Step 3 Required: Set the Ethernet interface.
l Set the overhead byte as follows:
J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.
l Set the Ethernet interface as follows:
Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.
Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of
traffic, services may be completely interrupted.
For details, see 28.7 Checking Board Parameters.
NOTE

For more information about the parameters of the board, see 27.4.2 Ethernet Parameters.

Step 4 Optional: Configure the Layer 2 switching management service, including the following tasks:
l Enabling the IGMP Snooping Protocol
l Configuring the Spanning Tree
l Setting the Aging Time for the Multicast Router Port
Step 5 Optional: Configure the QoS. For details, see Configuring QoS.
Step 6 Optional: Configure the link aggregation function on the Ethernet port. For details, see Creating
a LAG.
Step 7 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End
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Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

12.10.11 Configuring the Board Functions


The EGS4 supports multiple Ethernet functions and features such as Layer 2 switching, LCAS,
and LPT. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EGS4 by using the U2000:
l

LCAS

LPT

LAG

ETH OAM

Test Frame

STP/RSTP

IGMP Snooping

12.10.12 Parameter Settings


You can set parameters for the EGS4 by using the U2000.
You can set the following main parameters for the EGS4 by using the U2000:
l

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

12.10.13 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.
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Troubleshooting
Table 12-194 lists the faults that occur on the EGS4 frequently and the troubleshooting methods.
Table 12-194 Methods used to troubleshoot the faults that occur on the EGS4 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on a single


Ethernet port are interrupted.
l The services on all the Ethernet
ports are interrupted.
Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The services on a single


Ethernet port are transiently
interrupted.
l The protocol becomes
abnormal.
l The negotiated working mode
of the Ethernet ports is the halfduplex mode.

Packet loss

See Troubleshooting Service


Packet Loss.

l Bit errors occur on the line side.


Interconnection
fault

l The interconnection fault


occurs on a single Ethernet port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCG port.
l The LCAS interconnection
fault occurs.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EGS4, see Replacing an EOS Board.

12.10.14 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

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12.10.14.1 Alarms of N1EGS4

Issue 03 (2013-02-20)

ALM_GFP_dCSF

ALM_GFP_dLFD

ETHOAM_RMT_SD

AU_AIS

AU_LOP

B3_EXC_VC3

B3_SD_VC4

B3_EXC_VC4

B3_SD_VC3

BIP_SD

BD_STATUS

BIP_EXC

ETH_LOS

BOOTROM_BAD

COMMUN_FAIL

FLOW_OVER

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

HP_CROSSTR

FPGA_ABN

HARD_BAD

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LCAS_PLCT

LASER_MOD_ERR

LCAS_PLCR

LINK_ERR

LCAS_TLCR

LCAS_TLCT

LP_RDI

LOOP_ALM

LP_CROSSTR

LP_REI_VC3

LP_RDI_VC3

LP_REI

LP_TIM

LP_SLM

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

LP_UNEQ

LSR_WILL_DIE

LPT_RFI

LSR_NO_FITED

OUT_PWR_HIGH

LTEMP_OVER

NO_BD_SOFT

IN_PWR_LOW

OUT_PWR_LOW

IN_PWR_HIGH

TD

ETHOAM_DISCOVER_FAIL

ETHOAM_RMT_CRIT_FA
ULT

TU_AIS

TEMP_OVER

TF

TU_LOP_VC3

TU_AIS_VC3

TU_LOP

VCAT_LOM_VC12

VC3_CROSSTR

VCAT_LOA

VCAT_SQM_VC12

VCAT_LOM_VC3

VCAT_LOM_VC4

VCAT_SQM_VC3

VCAT_SQM_VC4

ETHOAM_RMT_LOOP

W_R_FAIL

ETH_NO_FLOW

VCTRUNK_NO_FLOW

TR_LOC

T_LOSEX

LAG_PORT_FAIL

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_LOO
P

DLAG_PROTECT_FAIL

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

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MOD_TYPE_MISMATCH

PORT_MODULE_OFFLINE

SWDL_PKG_NOBDSOFT

ETH_CFM_MISMERGE

ETH_CFM_UNEXPERI

ETH_CFM_LOC

ETH_CFM_RDI

WRG_BD_TYPE

12.10.14.2 Alarms of N3EGS4

Issue 03 (2013-02-20)

ALM_GFP_dCSF

ALM_GFP_dLFD

ETHOAM_RMT_SD

AU_AIS

AU_LOP

B3_EXC_VC3

B3_SD_VC4

B3_EXC_VC4

B3_SD_VC3

BIP_SD

BD_STATUS

BIP_EXC

ETH_LOS

BOOTROM_BAD

COMMUN_FAIL

FLOW_OVER

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNFL
CT

HP_CROSSTR

FPGA_ABN

HARD_BAD

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LCAS_PLCT

LASER_MOD_ERR

LCAS_PLCR

LINK_ERR

LCAS_TLCR

LCAS_TLCT

LP_RDI

LOOP_ALM

LP_CROSSTR

LP_REI_VC3

LP_RDI_VC3

LP_REI

LP_TIM

LP_SLM

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

LP_UNEQ

LSR_WILL_DIE

LPT_RFI

LSR_NO_FITED

OUT_PWR_HIGH

LTEMP_OVER

NO_BD_SOFT

IN_PWR_LOW

OUT_PWR_LOW

IN_PWR_HIGH

TD

ETHOAM_DISCOVER_F
AIL

ETHOAM_RMT_CRIT_FAU
LT

TU_AIS

TEMP_OVER

TF

TU_LOP_VC3

TU_AIS_VC3

TU_LOP

VCAT_LOM_VC12

VC3_CROSSTR

VCAT_LOA

VCAT_SQM_VC12

VCAT_LOM_VC3

VCAT_LOM_VC4

VCAT_SQM_VC3

VCAT_SQM_VC4

ETHOAM_RMT_LOOP

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W_R_FAIL

DLAG_PROTECT_FAIL

VCTRUNK_NO_FLOW

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_L
OOP

ETH_NO_FLOW

LAG_PORT_FAIL

T_LOSEX

TR_LOC

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.10.14.3 Alarms of N4EGS4

Issue 03 (2013-02-20)

ALM_GFP_dCSF

ALM_GFP_dLFD

AU_AIS

AU_LOP

B3_EXC_VC3

B3_EXC_VC4

B3_SD_VC3

B3_SD_VC4

BD_STATUS

BIP_EXC

BIP_SD

BOOTROM_BAD

COMMUN_FAIL

DLAG_PROTECT_FAIL

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_UNEXPERI

ETH_LOS

ETH_NO_FLOW

ETHOAM_DISCOVER_FA
IL

ETHOAM_RMT_CRIT_FA
ULT

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_L
OOP

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

FCS_ERR

FLOW_OVER

FPGA_ABN

HARD_BAD

HP_CROSSTR

HP_LOM

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

IN_PWR_HIGH

IN_PWR_LOW

LAG_PORT_FAIL

LASER_MOD_ERR

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LINK_ERR

LOOP_ALM

LP_CROSSTR

LP_RDI

LP_RDI_VC3

LP_REI

LP_REI_VC3

LP_SLM

LP_SLM_VC3

LP_TIM

LP_TIM_VC3

LP_UNEQ

LP_UNEQ_VC3

LPT_RFI

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LSR_NO_FITED

LSR_WILL_DIE

LTEMP_OVER

MOD_TYPE_MISMATCH

NO_BD_SOFT

OUT_PWR_HIGH

OUT_PWR_LOW

PORT_MODULE_OFFLINE

T_LOSEX

TD

TEMP_OVER

TF

TR_LOC

TU_AIS

TU_AIS_VC3

TU_LOP

TU_LOP_VC3

VC3_CROSSTR

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_LOM_VC4

VCAT_SQM_VC12

VCAT_SQM_VC3

VCAT_SQM_VC4

VCTRUNK_NO_FLOW

W_R_FAIL

WRG_BD_TYPE

12.10.15 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

12.10.15.1 Performance Events of N1EGS4


Table 12-195 SDH

Issue 03 (2013-02-20)

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

RPLMAX

RPLMIN

RPLCUR

TPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

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VC3FEUAS

VC3SES

VC3UAS

XCSTMPCUR

XCSTMPMAX

XCSTMPMIN

Table 12-196 RMON alarm


UndersizePkts

OversizePkts

LateCollisions

DeferredTransmissions

FCSErrors

Table 12-197 Statistics of RMON basic performance


Broadcast Packets
Received(packets)

Multicast Packets Received


(packets)

Undersize Packets Received


(packets)

Oversize Packets Received


(packets)

Table 12-198 Statistics of RMON extended performance


Unicast Packets Received
(packets)

Unicast Packets
Transmitted(packets)

Pause Frames Received(frames)

Pause Frames Transmitted


(frames)

Multicast Packets
Transmitted(packets)

Broadcast Packets Transmitted


(packets)

Good Octets Received


(Byte)

Good Octets Transmitted


(Byte)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Speed


Transmitted(Byte/s)

Table 12-199 Statistics of RMON VCG performance

Issue 03 (2013-02-20)

Octets Received(Byte)

Octets Transmitted(Byte)

Packets Received(packets)

Packets Transmitted
(packets)

Good Packets Received


(packets)

Good Packets Transmitted


(packets)

Full Frame Speed


Received(Byte/s)

Full Frame Speed


Transmitted(Byte/s)

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12.10.15.2 Performance Events of N3EGS4


Table 12-200 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

RPLMAX

RPLMIN

RPLCUR

TPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

XCSTMPCUR

XCSTMPMAX

XCSTMPMIN

Table 12-201 RMON alarm


UndersizePkts

OversizePkts

LateCollisions

DeferredTransmissions

FCSErrors

Table 12-202 Statistics of RMON basic performance


Broadcast Packets
Received(packets)

Multicast Packets Received


(packets)

Undersize Packets Received


(packets)

Oversize Packets Received


(packets)

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Table 12-203 Statistics of RMON extended performance


Unicast Packets Received
(packets)

Unicast Packets
Transmitted(packets)

Pause Frames Received(frames)

Pause Frames Transmitted


(frames)

Multicast Packets
Transmitted(packets)

Broadcast Packets Transmitted


(packets)

Good Octets Received


(Byte)

Good Octets Transmitted


(Byte)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Speed


Transmitted(Byte/s)

Table 12-204 Statistics of RMON VCG performance


Octets Received(Byte)

Octets Transmitted(Byte)

Packets Received(packets)

Packets Transmitted
(packets)

Good Packets Received


(packets)

Good Packets Transmitted


(packets)

Full Frame Speed


Received(Byte/s)

Full Frame Speed


Transmitted(Byte/s)

12.10.15.3 Performance Events of N4EGS4


Table 12-205 SDH

Issue 03 (2013-02-20)

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

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VC3FEUAS

VC3SES

VC3UAS

XCSTMPCUR

XCSTMPMAX

XCSTMPMIN

Table 12-206 RMON alarm


OversizePkts

UndersizePkts

FCSErrors

Table 12-207 Statistics of RMON basic performance


Broadcast Packets
Received(packets)

Multicast Packets Received


(packets)

Oversize Packets Received


(packets)

Drop Events(times/s)

Undersize Packets Received


(packets)

Table 12-208 Statistics of RMON extended performance


Unicast Packets Received
(packets)

Unicast Packets
Transmitted(packets)

Pause Frames Received(frames)

Pause Frames Transmitted


(frames)

Multicast Packets
Transmitted(packets)

Broadcast Packets Transmitted


(packets)

Good Octets Received


(Byte)

Good Octets Transmitted


(Byte)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Speed


Transmitted(Byte/s)

Table 12-209 Statistics of RMON VCG performance


Octets Received(Byte)

Octets Transmitted(Byte)

Packets Received(packets)

Packets Transmitted
(packets)

Good Packets Received


(packets)

Good Packets Transmitted


(packets)

Full Frame Speed


Received(Byte/s)

Full Frame Speed


Transmitted(Byte/s)

12.10.16 Technical Specifications


The technical specifications of the EGS4 include the parameters specified for optical interfaces,
laser safety class, Ethernet performance specifications, mechanical specifications, and power
consumption.
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Parameters Specified for Optical Interfaces


Table 12-210 lists the parameters specified for the optical interfaces of the EGS4.
Table 12-210 Parameters specified for the optical interfaces of the EGS4
Parameter

Value

Type of optical
interface

1000BASE-ZX
(80 km)

1000BASEVX (40 km)

1000BASELX (10 km)

1000BASE-SX
(0.5 km)

Type of fiber

Single-mode LC

Single-mode
LC

Single-mode
LC

Multi-mode LC

Launched optical
power range
(dBm)

-2 to 5

-5 to 0

-9 to -3

-9.5 to -2.5

Operating
wavelength range
(nm)

1500 to 1580

1275 to 1350

1270 to 1355

770 to 860

Minimum
overload (dBm)

-3

-3

-3

Receiver
sensitivity (dBm)

-23

-23

-20

-17

Minimum
extinction ratio
(dB)

Maximum -20 dB
spectral width
(nm)

Minimum side
mode suppression
ratio (dB)

30

30

Parameters Specified for Electrical Interfaces


Table 12-211 lists the parameters specified for the electrical interfaces of the EGS4.
Table 12-211 Parameters specified for the electrical interfaces of the EGS4

Issue 03 (2013-02-20)

Type of Electrical Interface

Code Pattern

1000BASE-T, RJ-45

4D-PAM5

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WARNING
Only the EGS4 boards of the N1 and N4 versions support the GE electrical interfaces.

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Ethernet Performance Specifications


NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EGS4 board of the N1 version.

Figure 12-62 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N1EGS4.
Figure 12-62 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, latency specifications, and back-to-back specifications of the N1EGS4
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-212 lists the throughput specifications of the N1EGS4. Table 12-213 lists the packet
loss ratio in the case of overloading of the N1EGS4. Table 12-214 lists the latency specifications
of the N1EGS4. Table 12-215 lists the back-to-back specifications of the N1EGS4.

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NOTE

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual environment
are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured 24 VC-3s are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-212 lists the throughput specifications of the N1EGS4. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 100.00

Resolution rate (%): 1.00

Mode: Uni-directional

Table 12-212 Throughput specifications of the N1EGS4


Frame Size
(Byte)

Passed Rate (%)

(01,03,01) to (01,03,02)
(pks/sec)

Total (pks/sec)

64

100.00

1488095

1488095

128

100.00

844595

844595

256

100.00

452899

452899

512

100.00

234962

234962

1024

100.00

119732

119732

1280

100.00

96154

96154

1518

100.00

81274

81274

Table 12-213 lists the packet loss ratio in the case of overloading of the N1EGS4. The values
are obtained when the SmartApplication is set as follows:
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The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Table 12-213 Packet loss ratio in the case of overloading of the N1EGS4
Frame Size
(Byte)

Rate Tested (%)

(01,03,01) to (01,03,02)
(%)

Average (%)

64

100.00

0.000

0.000

128

100.00

0.000

0.000

256

100.00

0.000

0.000

512

100.00

0.000

0.000

1024

100.00

0.000

0.000

1280

100.00

0.000

0.000

1518

100.00

0.000

0.000

Table 12-214 lists the latency specifications of the N1EGS4. The values are obtained when the
SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The test duration is set to 60 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested
equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

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Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

12 EoS Boards

Table 12-214 Latency specifications of the N1EGS4


Frame
Size
(Byte)

Rate
Tested
(%)

(01,03,01) to
(01,03,02) (us)CT (us)

Average
(CT) (us)

(01,03,01) to
(01,03,02)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

80.9

80.9

80.4

80.4

128

100.00

83.0

83.0

82.0

82.0

256

100.00

86.9

86.9

84.9

84.9

512

100.00

94.9

94.9

90.9

90.9

1024

100.00

108.8

108.8

100.7

100.7

1280

100.00

115.2

115.2

105.0

105.0

1518

100.00

120.7

120.7

108.6

108.6

Table 12-215 lists the back-to-back specifications of the N1EGS4. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission rate
is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is set to
a value more than 50 on the SmartApplication.

The tested traffic is set to the wire speed.

The test duration is set to 10 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

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Table 12-215 Back-to-back specifications of the N1EGS4


Frame Size
(Byte)

Rate Tested (%)

(01,03,01) to (01,03,02)
Burst Size (Number of
Frames)

Total (Number of
Frames)

64

100.00

2976190

2976190

128

100.00

1689190

1689190

256

100.00

905798

905798

512

100.00

469924

469924

1024

100.00

239464

239464

1280

100.00

192308

192308

1518

100.00

162548

162548

NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EGS4 board of the N4 version.

Figure 12-63 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N4EGS4.
Figure 12-63 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, latency specifications, and back-to-back specifications of the N4EGS4
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-216 lists the throughput specifications of the N4EGS4. Table 12-217 lists the packet
loss ratio in the case of overloading of the N4EGS4. Table 12-218 lists the latency specifications
of the N4EGS4. Table 12-219 lists the back-to-back specifications of the N4EGS4.

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NOTE

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual environment
are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and one VC-4 are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-216 lists the throughput specifications of the N4EGS4. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 1%.

The test duration is set to 30 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 16.54

Maximum rate (%): 16.54

Mode: Uni-directional

Table 12-216 Throughput specifications of the N4EGS4


Frame Size
(byte)

Passed Rate (%)

(01,01,02) to (01,01,01)
(pks/sec)

Total (pks/sec)

64

16.54

246063

492126

128

15.81

133547

267094

256

15.40

69754

139508

512

15.20

35714

71428

1024

15.10

18074

36148

1280

15.07

14488

28976

1518

15.06

12238

24476

Table 12-217 lists the packet loss ratio in the case of overloading of the N4EGS4. The values
are obtained when the SmartApplication is set as follows:
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The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 30 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 16.54

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Table 12-217 Packet loss ratio in the case of overloading of the N4EGS4
Frame Size
(byte)

Rate Tested (%)

(01,01,02) to (01,01,01)
(%)

Average (%)

64

16.54

0.000

0.000

128

15.81

0.000

0.000

256

15.40

0.000

0.000

512

15.20

0.000

0.000

1024

15.10

0.000

0.000

1280

15.07

0.000

0.000

1518

15.06

0.000

0.000

Table 12-218 lists the latency specifications of the N4EGS4. The values are obtained when the
SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The test duration is set to 30 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the first bit of the transmitted frame reaches the input port of the tested
equipment. In store forward mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the tested equipment
and the time when the last bit of the transmitted frame reaches the input port of the tested
equipment. In the table, the CT values are obtained in cut through mode and the S&F values
are obtained in store forward mode.

CT: Cut Through (or FIFO),S&F: Store & Forward (or LIFO)

Measure on one receiving card only, Mode: SmartMetrics Comp. Mode

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Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 16.54

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

12 EoS Boards

Table 12-218 Latency specifications of the N4EGS4


Frame
Size
(byte)

Rate
Tested
(%)

(01,01,02) to
(01,01,01) (us)CT (us)

Average
(CT) (us)

(01,01,02) to
(01,01,01)
(us)-S&F (us)

Average
(S&F) (us)

64

16.54

103.3

103.3

102.8

102.8

128

15.81

115.2

115.2

114.2

114.2

256

15.40

126.7

126.7

124.7

124.7

512

15.20

154.4

154.4

150.4

150.4

1024

15.10

3721.4

3721.4

3713.3

3713.3

1280

15.07

223.9

223.9

213.7

213.7

1518

15.06

3447.5

3447.5

3435.4

3435.4

Table 12-219 lists the back-to-back specifications of the N4EGS4. The values are obtained when
the SmartApplication is set as follows:
l

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission rate
is set to 100%, the test duration is set to 30 seconds, and the number of repetitions is set to
a value more than 1 on the SmartApplication.

The tested traffic is set to the wire speed.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 16.54

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

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Table 12-219 Back-to-back specifications of the N4EGS4


Frame Size
(byte)

Rate Tested (%)

(01,01,02) to (01,01,01)
Burst Size (frames)

Total (frames)

64

16.54

7381890

14763780

128

15.81

4006410

8012820

256

15.40

2092620

4185240

512

15.20

1071420

2142840

1024

15.10

542220

1084440

1280

15.07

434640

869280

1518

15.06

367140

734280

Mechanical Specifications
The mechanical specifications of the EGS4 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight of the N1EGS4 or N3EGS4 (kg): 1.1

Weight of the N4EGS4 (kg): 0.7

Power Consumption
The maximum power consumption of the N1EGS4 and N3EGS4 at room temperature (25C) is
70 W.
The maximum power consumption of the N4EGS4 at room temperature (25C) is 34 W.

12.11 EAS2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EAS2 (2-port 10xGE switching and processing board). This topic
also describes how to configure and commission the EAS2.

12.11.1 Version Description


The EAS2 is available in the following functional version: N1.

12.11.2 Application
The EAS2 is used to transmit/receive Ethernet services, manage bandwidths, and realize Layer
2 switching of Ethernet services.
Figure 12-64 shows the typical networking and application of the Ethernet switching board. the
Ethernet switching board accesses and converges Ethernet services, and provides the Ethernet
data with the following data features: Layer 2 switching, port isolation, flow classification, traffic
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control, VLAN management, and priority configuration. In addition, the Ethernet switching
board performs encapsulation/decapsulation, virtual concatenation, and SDH mapping/
demapping for data. The Ethernet switching board can be interconnected with the bandwidth
access equipment and the data communication equipment at the same time, thus to provide a
network-level solution.
Figure 12-64 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

12.11.3 Functions and Features


The EAS2 supports the transmission of 10 GE Ethernet services, LCAS, and test frame functions.
Table 12-220 provides the functions and features of the EAS2.
Table 12-220 Functions and features of the EAS2

Issue 03 (2013-02-20)

Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits 2x10 GE Ethernet services.

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Funct
ion
and
Featu
re

Description

Interfa
ce
types

The optical interfaces are 10GBASE-LR and 10GBASE-LW Ethernet optical


interfaces, which comply with IEEE 802.3ae.

Functi
ons
when
being
used
with
an
interfa
ce
board

Provides interfaces on the front panel.

Interfa
ce
charac
teristic
s

Working
modes

10GE full-duplex in both WAN mode and LAN mode

Traffic
control at
ports

Auto-negotiation mode

Not supported

Non-autonegotiation mode

Supported

Query/
Supported
Setting of
port
status
Query of
interface
types

Supported

Setting of Not supported


optical
power
threshold
s

Servic
e
catego
ries

Issue 03 (2013-02-20)

Pluggabl
e optical
module

Supports XFP optical modules.

EPL
service

Supports the PORT-based transparent transmission.

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ion
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Featu
re

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Description

EVPL
service

l Supports PORT-shared EVPL services.


l Supports VCTRUNK-shared EVPL services.
The services are isolated by VLAN tags.
The services are isolated by QinQ tags.
l Supports a maximum of 2048 links.

EPLAN
service

l Supports a maximum of one virtual bridge (VB). The maximum


number of logical ports for each VB is 26.
l Supports the blacklist that can contain 512 records and also the static
MAC address table that can contain 512 records.
l Supports the self-learning of the source MAC address. The capacity
of the MAC address table is 16K. The aging time of the MAC
address can be set and queried.
l Supports the configuration of static MAC routes.
l Supports the query of the aging time of an MAC address.
l Supports the query of learned MAC addresses by VB+VLAN or VB
+LP.
l Supports EPLAN services that are based on IEEE 802.1d MAC
bridges.

EVPLA
N service

l Supports EVPLAN services that use the stack VLAN encapsulation.


l Supports data isolation based on VB+VLAN.
l Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge and IEEE 802.1ad provider bridge.

Servic
e
specifi
cation
s

Issue 03 (2013-02-20)

Formats
of
Ethernet
data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1q TAG

Supported

Frame
length
range

l Supports the setting of the frame length to a value ranging from 1518
bytes to 9600 bytes.

Bound
bandwidt
h

64xVC-4 or 192xVC-3

Mapping
granularit
ies

Supports the following adjacent concatenation granularities: VC-4-Xv


(X 8), VC-3-Xv (X 24), and VC-4-4c.

l Supports a jumbo frame with a maximum length of 9600 bytes.

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Description

Encapsul
ation
formats

HDLC

Not supported

LAPS

Not supported

GFP-F

Supported

MPLS
technolo
gy

Not supported

VLAN
technolo
gy

Supports a total number of 4094 VLANs, which comply with IEEE


802.1q/p.

Maximu
m uplink
bandwidt
h

10 Gbit/s

VCTRU
NK
specificat
ions

The maximum number of VCTRUNKs supported by the N1EAS2 is


24.

The EAS2 can adapt to the bandwidth of the slot.

Configuration principles are as follows:


l A VCTRUNK can be bound with a maximum of eight VC-4s or a
maximum of 24 VC-3s.
l A VCTRUNK can be bound with the VC-4 path or VC-3 path at one
time. A VCTRUNK should not be bound with VC-4 and VC-3 paths
at the same time. Different VCTRUNKs can be bound with paths at
different levels.
l Supports VC-4-4c adjacent concatenation and VC-3/VC-4 virtual
concatenation.
l Only VCTRUNKs numbered 14 support the Jumbo frame with a
length of 9600 bytes. The other VCG ports do not support the Jumbo
frame.

Protec
tion
schem
es

TPS

Not supported

BPS

Not supported

PPS

Not supported

DLAG

Supported

LAG

Supports manual link aggregation and static link aggregation.


Supports the load sharing mode and load non-sharing mode.
Complies with IEEE 802.3ad and IEEE 802.1AX.

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Funct
ion
and
Featu
re

Clock
synchr
onizati
on

12 EoS Boards

Description

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports the P2P LPT and P2MP LPT.

STP/
RSTP

Supports the broadcast packet suppression and RSTP, which comply


with IEEE 802.1w.

MSTP

Does not support the MSTP

ERPS

Does not support the ERPS.

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Not supported
l Supports CC, LB tests, and LT tests in compliance with IEEE
802.1ag, LM and DM in compliance with ITU-T Y.1731, and OAM
ping in compliance with Huawei proprietary protocol.

Maint
enanc
e
featur
es

l Supports OAM auto-discovery, remote loopbacks, fault detection,


and link performance detection in compliance with IEEE 802.3ah,
and selfloop detection in compliance with Huawei proprietary
protocol.
Test
Frame

Supports test frames in ETH and GFP bearer modes.

Response
to ping

Not supported

Port
mirroring

Supported

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Inloops

MAC layer at Ethernet ports

Inloops

VC-4 level

Not supported

VC-3 level

Not supported

VC-12 level

Not supported

RMON

l Supports the Ethernet performance monitoring at the port level.


l Supports the query of the rate of a port.

Warm
resets

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ion
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re

QoS

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Description

Cold
resets

Supported

Alarms
and
performa
nce
events

Provides various alarm and performance events, which facilitates the


management and maintenance of the equipment.

l Supports traffic classification based on PORT, PORT+VLAN ID, PORT


+VLAN ID+VLAN PRI, MPLS labels, or MPLS label+EXP value.
l Supports the CAR. The granularity is 64 kbit/s.
l Each port supports eight priority queues.
l Supports shaping based on ports or queues.

IGMP
snoopi
ng

Traffi
c
contro
l

Protocol
enabling

Supported

Port
aging
time

Supported

Fast
leave

Not supported

Discardin
g of
unknown
broadcast
packets

Not supported

Static
broadcast
entry

Supported

Supports the port-based traffic control function that complies with IEEE 802.3x.

12.11.4 Working Principle and Signal Flow


The EAS2 consists of the interface processing module, mapping module, interface converting
module, logic and control module, clock module, and power module.
Figure 12-65 shows the functional block diagram of the EAS2 by describing how to process
1x10 GE signals.
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Figure 12-65 Functional block diagram of the EAS2


Backplane

10GE

Interface
processing
module

Laser
shutdown

Service
processing
module

Interface
converting
module

Encapsulation
module
Digital encapsulation module
Mapping module

Virtual
concatenation
processing
module

Cross-connect unit

Cross-connect unit

LOS

Logic and
control module

Communication
Clock reference and frame delimitation

+3.3 V
Clock module

Power
module

Power
module

Fuse

SCC unit
SCC unit
-48 V/-60 V
-48 V/-60 V

In the Transmit Direction


The encapsulation or conversion module demaps and decapsulates the signals received from the
cross-connect unit. Then, the interface converting module performs the interface converting
operations and transmits the signals to the service processing module. The service processing
module implements the functions of the Layer 2 switching and private line service. After the
interface processing module converts parallel signals to serial signals and encodes the serial
signals, the Ethernet interface module transmits the serial signals.

In the Receive Direction


The XFP optical module performs O/E conversion on the 10 GE Ethernet signals, and then
transmits the signals to the Ethernet interface module. The Ethernet interface module transmits
the parallel signals to the service processing module to realize the functions of the Layer 2
switching and private line service. The encapsulation module encapsulates and maps the Ethernet
GFP-F frames, and then transmits the signals to the cross-connect unit.

Logic and Control Module


The logic and control module provides the communication, control, and service configuration
functions of the board.

Clock Module
The clock module traces the system reference clock, and generates the required clock signals
when the board is working.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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12.11.5 Front Panel


The front panel of the EAS2 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 12-66 shows the appearance of the front panel of the EAS2.
Figure 12-66 Front panel of the EAS2

EAS2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2
CLASS 1
LASER
PRODUCT

OUT1

IN1
OUT2

IN2

EAS2

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the EAS2 has two 10 GE interfaces. Table 12-221 describes the types and
usage of the interfaces of the EAS2.
Table 12-221 Interfaces of the EAS2
Interface

Type of Interface

Usage

IN1IN2

LC

Receives 10 GE signals.

OUT1OUT2

LC

Transmits 10 GE signals.

12.11.6 Jumpers and DIP Switches


The EAS2 does not have any jumpers or DIP switches that are used for board settings.

12.11.7 Valid Slots


The slots valid for the EAS2 vary with the cross-connect capacity of the subrack.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the EAS2 are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the EAS2 can be installed in slots 58 and
1114 in the subrack and the bandwidth is 10 Gbit/s.

12.11.8 Feature Code


The EAS2 does not have the feature code.

12.11.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.
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Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring Ethernet Services.
Step 3 Required: Configure the Ethernet interface.
l Set the overhead byte as follows:
J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 byte to be sent is Huawei
SBS and the default value of the J1 byte is Disabled.
l Set the parameters of the Ethernet interface as follows:
Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.
Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same mode. If the working modes on two sides do not match,
packets may be lost or the bit rate may decrease. In the case of large volume of traffic,
services may be completely interrupted.
For details, see 28.7 Checking Board Parameters.
NOTE

For more information about the parameters of the board, see 27.4.2 Ethernet Parameters.

Step 4 Optional: Configure the Layer 2 switching management service. Perform the following tasks:
l Enabling the IGMP Snooping Protocol
l Configuring the Spanning Tree
l Setting the Aging Time for the Multicast Router Port
Step 5 Optional: Configure the QoS. For details, see Configuring QoS.
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Step 6 Optional: Configure the aggregation function for the Ethernet port. For details, see Creating a
LAG.
Step 7 Optional: Configure test frames. For details, see Configuring Test Frames.
----End

Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

12.11.10 Configuring the Board Functions


The EAS2 supports multiple Ethernet functions and features such as Layer 2 switching, LCAS,
and LAG. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EAS2 by using the U2000:
l

LCAS

LPT

LAG

DLAG

ETH OAM

Test Frame

STP/RSTP

IGMP Snooping

QoS

12.11.11 Parameter Settings


You can set parameters for the EAS2 by using the U2000.
You can set the following main parameters for the EAS2 by using the U2000:
l

Working mode

LCAS

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Maximum frame length

Mapping protocol

12 EoS Boards

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

12.11.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 12-222 lists the faults that occur on the EAS2 frequently and the troubleshooting methods.
Table 12-222 Methods used to troubleshoot the faults that occur on the EAS2 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on a single


Ethernet port are interrupted.
l The services on all the Ethernet
ports are interrupted.
Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The services on a single


Ethernet port are transiently
interrupted.
l The protocol becomes
abnormal.
l The negotiated working mode
of the Ethernet ports is the halfduplex mode.

Packet loss

See Troubleshooting Service


Packet Loss.

l Bit errors occur on the line side.


Interconnection
fault

l The interconnection fault


occurs on a single Ethernet port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCG port.
l The LCAS interconnection
fault occurs.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

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For information on how to replace the EAS2, see Replacing an EOS Board.

12.11.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

12.11.13.1 Alarms of N1EAS2


ALM_GFP_dCSF

ALM_GFP_dLFD

AU_AIS

AU_LOP

B3_EXC_VC3

B3_EXC_VC4

B3_SD_VC3

B3_SD_VC4

BD_STATUS

BDID_ERROR

BOOTROM_BAD

CHIP_ABN

COMMUN_FAIL

DLAG_PROTECT_FAIL

EX_ETHOAM_MPID_C
NFLCT

ETH_LOS

EX_ETHOAM_CC_LOS

HP_RDI

FCS_ERR

HARD_BAD

IN_PWR_ABN

HP_SLM

HP_UNEQ

LASER_MOD_ERR

LAG_PORT_FAIL

LAG_VC_PORT_FAIL

LCAS_PLCR

LCAS_FOPR

LCAS_FOPT

LCAS_TLCT

LCAS_PLCT

LCAS_TLCR

LP_RDI_VC3

LINK_ERR

LOOP_ALM

LPT_RFI

LP_SLM_VC3

LP_UNEQ_VC3

LSR_WILL_DIE

LSR_BCM_ALM

LSR_NO_FITED

SLAVE_WORKING

NO_BD_SOFT

OUT_PWR_ABN

TEM_HA

SO_SK_MISMATCH

T_LOSEX

TEST_STATUS

TEM_LA

TEMP_OVER

TU_AIS_VC3

TF

TR_LOC

VCAT_LOM_VC3

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC4

VCTRUNK_NO_FLOW

ETH_NO_FLOW

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.11.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.
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12.11.14.1 Performance Events of N1EAS2


Table 12-223 SDH
HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

HPFESES

HPFEUAS

HPFECSES

VC3BBE

VC3ES

VC3SES

VC3UAS

VC3CSES

VC3FEBBE

VC3FEES

VC3FESES

VC3FECSES

VC3FEUAS

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

TPLMAX

TPLMIN

TPLCUR

TLBMAX

TLBMIN

TLBCUR

RPLMAX

RPLMIN

RPLCUR

XCSTMPMAX

XCSTMPMIN

XCSTMPCUR

Table 12-224 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

FCSErrors

Table 12-225 Statistics of RMON basic performance

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Packets Received(64 Octets


in Length)(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets Received(256~511
Octets in Length)(packets)

Packets Received(512~1023
Octets in Length)(packets)

Packets Received
(1024~1518 Octets in
Length)(packets)

Multicast Packets Received


(packets)

Broadcast Packets Received


(packets)

Drop Events(times)

Undersize Packets Received


(packets)

Oversize Packets Received


(packets)

Fragments(packets)

Jabbers(packets)

Octets Received(Byte)

Packets Received(packets)

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Table 12-226 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)
(packets)

Packets Transmitted(65~127
Octets in Length)(packets)

Packets Transmitted
(128~255 Octets in Length)
(packets)

Packets Transmitted
(256~511 Octets in
Length)(packets)

Packets Transmitted(512~1023
Octets in Length)(packets)

Packets Transmitted
(1024~1518 Octets in Length)
(packets)

Unicast Packets Received


(packets)

Unicast Packets Transmitted


(packets)

Multicast Packets
Transmitted(packets)

Broadcast Packets
Transmitted(packets)

Pause Frames Received


(frames)

Pause Frames Transmitted


(frames)

FCS Errors(frames)

Packets Received and


Transmitted(64 Octets in
Length)(packets)

Packets Received and


Transmitted(65~127 Octets
in Length)(packets)

Packets Received and


Transmitted(128~255
Octets in Length)
(packets)

Packets Received and


Packets Received and
Transmitted(256~511 Octets in Transmitted(512~1023
Length)(packets)
Octets in Length)(packets)

Packets Received and


Transmitted(1024~1518
Octets in Length)
(packets)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Speed


Transmitted(Byte/s)

Good Full Frame Octets


Received(Byte)

Good Full Frame Octets


Transmitted(Byte)

Control Frames Received


(frames)

Control Frames
Transmitted(frames)

Packets Transmitted(packets)

Octets Transmitted(Byte)

Table 12-227 Statistics of RMON VCG performance


Octets Received(Byte)

Octets Transmitted(Byte)

Packets Received(packets)

Packets Transmitted
(packets)

Good Packets Received


(packets)

Good Packets Transmitted


(packets)

Full Frame Speed Received


(Byte/s)

Full Frame Speed


Transmitted(Byte/s)

12.11.15 Technical Specifications


The technical specifications of the EAS2 include the parameters specified for optical interfaces,
dimensions, weight, and power consumption.

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Parameters Specified for Optical Interfaces


Table 12-228 lists the parameters specified for the optical interfaces of the EAS2.
Table 12-228 Parameters specified for the optical interfaces of the EAS2
Parameter

Value

Transmission rate

LAN: 10.3125Gbit/s
WAN: 9.953Gbit/s

Processing capability

2x10GE signals

Type of optical interface

10GBASE-LR(LAN)
10GBASE-LW(WAN)

Type of fiber

Single-mode LC

Operating wavelength
range (nm)

1290 to 1330

Transmission distance (km)

10

Maximum mean launched


power (dBm)

-1

Minimum mean launched


power (dBm)

-6

Receiver sensitivity (dBm)

-11

Minimum extinction ratio


(dB)

Connector type

LC

Maximum -20 dB spectral


width (nm)

Minimum side mode


suppression ratio (dB)

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Ethernet Performance Specifications


NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EAS2 board of the N1 version.

Figure 12-67 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the EAS2.
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Figure 12-67 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading and latency specifications
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-229 lists the throughput specifications of the EAS2. Table 12-230 lists the packet loss
ratio in the case of overloading of the EAS2. Table 12-231 lists the latency specifications of the
EAS2.
NOTE

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual environment
are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and 64 VC-4s are bound on the 10xGE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-229 Throughput specifications of the EAS2

Issue 03 (2013-02-20)

Frame Size
(Byte)

Passed Rate
(%)

Number of Tx
Frames (pks/sec)

Number of Rx
Frames (pks/sec)

Total (%)

64

100.00000

148809440

148613326

99.29688

128

100.00000

84459360

84457314

99.29688

256

99.29687

44974080

44719807

98.59375

512

97.89062

23001600

22892340

97.1875

1024

96.48437

11552000

11552000

96.48438

1280

96.48437

9277280

9277280

96.48438

1518

96.48437

7841440

7831693

95.78125

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Table 12-230 Packet loss ratio in the case of overloading of the EAS2
Frame Size
(Byte)

Rate Tested
(%)

Number of Tx
Frames (pks/sec)

Number of Rx
Frames (pks/sec)

Total (%)

64

100.00000

148809440

148614523

0.13

128

100.00000

84459360

84457396

0.00

256

100.00000

45289760

44709723

1.28

512

100.00000

23496160

22868728

2.67

1024

100.00000

11973120

11566750

3.39

1280

100.00000

9615360

9274900

3.54

1518

100.00000

8127360

7832064

3.63

Table 12-231 Latency specifications of the EAS2


Frame
Size
(Byte)

Rate
Tested
(%)

Number
of Tx
Frames
(pks/sec)

Number of
Rx Frames
(pks/sec)

Minimum
Latency
(us)

Average
Latency
(us)

Maximu
m
Latency
(us)

64

100.0000
0

14880950

14880950

59.7

90.798

98.2

128

100.0000
0

8445940

8445940

55.9

92.201

99.5

256

100.0000
0

4528980

4528980

61

96.178

103.7

512

100.0000
0

2349620

2349620

72.7

102.403

109.9

1024

100.0000
0

1197310

1197310

81.8

116.101

123.7

1280

100.0000
0

961530

961530

88.2

122.479

130.2

1518

100.0000
0

812740

812740

99.1

128.928

136.3

Mechanical Specifications
The mechanical specifications of the EAS2 board are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.2

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Power Consumption
The maximum power consumption of the EAS2 is 70 W at room temperature (25C).

12.12 EFF8
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the EFF8 (8x100M Ethernet optical interface board).

12.12.1 Version Description


The EFF8 is available in one functional version, namely, N1.

12.12.2 Application
The EFF8 is an Ethernet optical interface board. The EFF8 can be used on the OptiX OSN
equipment series to transmit and receive 100M Ethernet optical signals for the data board.

12.12.3 Functions and Features


The EFF8 receives and transmits 8x100M Ethernet optical signals. The EFF8 must work with
the Ethernet processing board.

12.12.4 Working Principle and Signal Flow


The EFF8 consists of the interface module and power module.
Figure 12-68 shows the functional block diagram of the EFF8 by describing how to process
1x100 Mbit/s Ethernet signals.
Figure 12-68 Functional block diagram of the EFF8
Backplane

100 Mbit/s
Ethernet signal

EFT8/EFS0/EMS4/EMR0
Interface
module

100 Mbit/s
Ethernet signal

+3.3 V

Issue 03 (2013-02-20)

EFT8/EFS0/EMS4/EMR0

Power
module

Fuse

+3.3 V backup power

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Interface Module
In the receive direction, the interface module performs O/E conversion for the Ethernet signals
and transmits the signals to the EFT8, EFS0, EMS4, or EMR0.
In the transmit direction, the interface module performs E/O conversion for the Ethernet signals
and transmits the signals to the optical interface.

Power Module
The power module provides all the modules of the EFF8 with the required DC voltages.

12.12.5 Front Panel


The front panel of the EFF8 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 12-69 shows the appearance of the front panel of the EFF8.
Figure 12-69 Front panel of the EFF8

EFF8
1
2
3
4
5
6
7
8
LINK ACT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4
OUT5 IN5
OUT6 IN6
OUT7 IN7
OUT8 IN8
CLASS 1
LASER
PRODUCT

EFF8

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Indicators
The front panel of the board has the following indicators:
l

Eight connection status indicators (LINK) one color (green)

Eight data receiving and transmission indicators (ACT) one color (orange)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the EFF8 has eight optical interfaces.
Table 12-232 describes the types and usage of the interfaces of the EFF8.
Table 12-232 Interfaces of the EFF8
Interface

Type of
Interface

Usage

IN1IN8

LC

Receives the 1st to the 8th channels of Ethernet


optical signals.

OUT1OUT8

LC

Transmits the 1st to the 8th channels of Ethernet


optical signals.

12.12.6 Valid Slots


The EFF8 can be installed in slots 19, 21, 23, 25, 29, 31, 33, and 35 in the subrack and works
as the interface board of the EFT8, EFS0 or EMR0. The EFF8 can be installed in slots 1926
and 2936 in the subrack and works as the interface board of the EMS4, EMS2 or EFS0A.
Table 12-233 lists the slots valid for the EFT8/EFS0/EMR0 and the corresponding slots for the
EFF8.
Table 12-233 Slots valid for the EFT8/EFS0/EMR0 and the corresponding slots for the EFF8

Issue 03 (2013-02-20)

Slot Valid for the EFT8/EFS0/EMR0

Corresponding Slot for the EFF8

Slot 2

Slots 19

Slot 3

Slots 21

Slot 4

Slots 23

Slot 5

Slots 25

Slot 13

Slots 29

Slot 14

Slots 31

Slot 15

Slots 33
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Slot Valid for the EFT8/EFS0/EMR0

Corresponding Slot for the EFF8

Slot 16

Slots 35

Table 12-234 lists the slots valid for the EMS4/EMS2/EFS0A and the corresponding slots for
the EFF8.
Table 12-234 Slots valid for the EMS4/EMS2/EFS0A and the corresponding slots for the EFF8
Slot Valid for the EMS4/EMS2/EFS0A

Corresponding Slot for the EFF8

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

12.12.7 Technical Specifications


The technical specifications of the EFF8 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 12-235 lists the parameters specified for the optical interfaces of the EFF8.
Table 12-235 Parameters specified for the optical interfaces of the EFF8

Issue 03 (2013-02-20)

Parameter

Value

Nominal bit rate

10 Mbit/s or 100 Mbit/s

Line code pattern

Manchester encoding signal (10M) or NRZI encoding signal


(100M)

Type of optical interface

100BASE-LX

100BASE-FX

Operating wavelength
range (nm)

1261 to 1360

1270 to 1380

Type of fiber

Single-mode LC (15 km)

Multi-mode LC (2 km)

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Parameter

Value

Mean launched optical


power (dBm)

-15 to -8

-19 to -14

Receiver sensitivity
(dBm)

-28

-30

Minimum overload
(dBm)

-8

-14

Minimum extinction ratio


(dB)

8.2

10

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EFF8 are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.4

Power Consumption
The maximum power consumption of the EFF8 at room temperature (25C) is 6 W.

12.13 EFF8A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the EFF8A (8x100M Ethernet optical interface board).

12.13.1 Version Description


The EFF8A is available in one functional version, namely, N1.

12.13.2 Application
The EFF8A is an Ethernet optical interface board. The EFF8A can be used on the OptiX OSN
equipment series to transmit and receive 100M Ethernet optical signals for the data board.

12.13.3 Functions and Features


The EFF8A receives and transmits 8x100M Ethernet optical signals. The EFF8A must work
with the N5EFS0.

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12.13.4 Working Principle and Signal Flow


The EFF8A consists of the interface module and power module.
Figure 12-70 shows the functional block diagram of the EFF8A by describing how to process
1x100 Mbit/s Ethernet signals.
Figure 12-70 Functional block diagram of the EFF8A
Backplane

100 Mbit/s
Ethernet signal

N5EFS0
Interface
module

100 Mbit/s
Ethernet signal

N5EFS0

+3.3 V

Power
module

Fuse

+3.3 V backup power

Interface Module
In the receive direction, the interface module performs O/E conversion for the Ethernet signals
and transmits the signals to the N5EFS0.
In the transmit direction, the interface module performs E/O conversion for the Ethernet signals
and transmits the signals to the optical interface.

Power Module
The power module provides all the modules of the EFF8A with the required DC voltages.

12.13.5 Front Panel


The front panel of the EFF8A has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 12-71 shows the appearance of the front panel of the EFF8A.

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Figure 12-71 Front panel of the EFF8A

EFF8
1
2
3
4
5
6
7
8
LINK ACT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4
OUT5 IN5
OUT6 IN6
OUT7 IN7
OUT8 IN8
CLASS 1
LASER
PRODUCT

EFF8

Indicators
The front panel of the board has the following indicators:
l

Eight connection status indicators (LINK) one color (green)

Eight data receiving and transmission indicators (ACT) one color (orange)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the EFF8A has eight optical interfaces.
Table 12-236 describes the types and usage of the interfaces of the EFF8A.

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Table 12-236 Interfaces of the EFF8A


Interface

Type of Interface

Usage

IN1IN8

LC

Receives the 1st to the 8th channels of Ethernet


optical signals.

OUT1OUT8

LC

Transmits the 1st to the 8th channels of Ethernet


optical signals.

12.13.6 Valid Slots


The EFF8A can be installed in slots 19, 21, 23, 25, 29, 31, 33, 35 in the subrack and works as
the interface board of the N5EFS0.
Table 12-237 lists the slots valid for the N5EFS0 and the corresponding slots for the EFF8A.
Table 12-237 Slots valid for the N5EFS0 and the corresponding slots for the EFF8A
Slot Valid for the N5EFS0

Corresponding Slot for the EFF8A

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

12.13.7 Technical Specifications


The technical specifications of the EFF8A include the parameters specified for optical interfaces,
mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 12-238 lists the parameters specified for the optical interfaces of the EFF8A.
Table 12-238 Parameters specified for the optical interfaces of the EFF8A

Issue 03 (2013-02-20)

Parameter

Value

Nominal bit rate

10 Mbit/s or 100 Mbit/s

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Parameter

Value

Line code pattern

Manchester encoding signal (10M) or NRZI encoding signal


(100M)

Type of optical interface

100BASE-LX

100BASE-FX

Operating wavelength
range (nm)

1261 to 1360

1270 to 1380

Type of fiber

Single-mode LC (15 km)

Multi-mode LC (2 km)

Mean launched optical


power (dBm)

-15 to -8

-19 to -14

Receiver sensitivity
(dBm)

-28

-30

Minimum overload
(dBm)

-8

-14

Minimum extinction ratio


(dB)

8.2

10

Mechanical Specifications
The mechanical specifications of the EFF8A are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.4

Power Consumption
The maximum power consumption of the EFF8A at room temperature (25C) is 15 W.

12.14 ETF8
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the ETF8 (8x100M Ethernet twisted pair interface board).

12.14.1 Version Description


The ETF8 is available in one functional version, namely, N1.

12.14.2 Application
The ETF8 is an Ethernet electrical interface board. The ETF8 can be used on the OptiX OSN
equipment series to transmit and receive 100M Ethernet electrical signals for the data board.

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12.14.3 Functions and Features


The ETF8 receives and transmits 8x100M Ethernet electrical signals. The ETF8 must work with
the Ethernet processing board.

12.14.4 Working Principle and Signal Flow


The ETF8 consists of the interface module and power module.
Figure 12-72 shows the functional block diagram of the ETF8 by describing how to process
1x100 Mbit/s Ethernet signals.
Figure 12-72 Functional block diagram of the ETF8
Backplane

100 Mbit/s
Ethernet signal

EFT8/EFS0/EMS4/EMR0
Interface
module

100 Mbit/s
Ethernet signal

+3.3 V

EFT8/EFS0/EMS4/EMR0

Power
module

Fuse

+3.3 V backup power

Interface Module
In the receive direction, the interface module performs O/E conversion for the Ethernet signals
and transmits the signals to the EFT8, EFS0, EMS4, or EMR0.
In the transmit direction, the interface module performs E/O conversion for the Ethernet signals
and transmits the signals to the optical interface.

Power Module
The power module provides all the modules of the ETF8 with the required DC voltages.

12.14.5 Front Panel


The front panel of the ETF8 has interfaces and a bar code.

Diagram of the Front Panel


Figure 12-73 shows the appearance of the front panel of the ETF8.
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Figure 12-73 Front panel of the ETF8

ETF8

FE1
FE2
FE3
FE4
FE5
FE6
FE7
FE8

ETF8

Interfaces
The front panel of the ETF8 has eight electrical interfaces.
Table 12-239 describes the types and usage of the interfaces of the ETF8. For information about
the cables connected to the interfaces, see 23.4.6 Straight-Through Cable and 23.4.7
Crossover Cable.
Table 12-239 Interfaces of the ETF8

Issue 03 (2013-02-20)

Interface

Type of
Interface

Usage

FE1FE8

RJ-45

Receives the 1st to the 8th channels of Ethernet


electrical signals.

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Table 12-240 provides the pin assignments of the RJ45 connector of the ETF8.
Table 12-240 Pin assignments of the RJ45 connector of the ETF8
Front View

8 7

6 5

3 2

Pin

Description

Transmitting (+)

Transmitting ()

Receiving (+)

Grounding

Grounding

Receiving ()

Grounding

Grounding

12.14.6 Valid Slots


The ETF8 can be installed in slots 19, 21, 23, 25, 29, 31, 33, and 35 in the subrack and works
as the interface board of the EFT8, EFS0 or EMR0. The ETF8 can be installed in slots 1926
and 2936 in the subrack and works as the interface board of the EMS4, EMS2 or EFS0A.
Table 12-241 lists the slots valid for the EFT8/EFS0/EMR0 and the corresponding slots for the
ETF8.
Table 12-241 Slots valid for the EFT8/EFS0/EMR0 and the corresponding slots for the ETF8
Slot Valid for the EFT8/EFS0/EMR0

Corresponding Slot for the ETF8

Slot 2

Slots 19

Slot 3

Slots 21

Slot 4

Slots 23

Slot 5

Slots 25

Slot 13

Slots 29

Slot 14

Slots 31

Slot 15

Slots 33

Slot 16

Slots 35

Table 12-242 lists the slots valid for the EMS4/EMS2/EFS0A and the corresponding slots for
the ETF8.
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Table 12-242 Slots valid for the EMS4/EMS2/EFS0A and the corresponding slots for the ETF8
Slot Valid for the EMS4/EMS2/EFS0A

Corresponding Slot for the ETF8

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

12.14.7 Technical Specifications


The technical specifications of the ETF8 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


Table 12-243 lists the parameters specified for the electrical interfaces of the ETF8.
Table 12-243 Parameters specified for the optical interfaces of the ETF8
Parameter

Value

Nominal bit rate

10 Mbit/s or 100 Mbit/s

Line code pattern

Manchester encoding signal (10M) or MLT-3 encoding signal


(100M)

Specifications of the
interface

Complies with IEEE 802.3u.

Mechanical Specifications
The mechanical specifications of the ETF8 are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.4

Power Consumption
The maximum power consumption of the ETF8 at room temperature (25C) is 2 W.
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12.15 ETF8A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the ETF8A (8x100M Ethernet twisted pair interface board).

12.15.1 Version Description


The ETF8A is available in one functional version, namely, N1.

12.15.2 Application
The ETF8A is an Ethernet electrical interface board. The ETF8A can be used on the OptiX OSN
equipment series to transmit and receive 100M Ethernet electrical signals for the data board.

12.15.3 Functions and Features


The ETF8A receives and transmits 8x100M Ethernet electrical signals. The ETF8A must work
with the N5EFS0.

12.15.4 Working Principle and Signal Flow


The ETF8A consists of the interface module and power module.
Figure 12-74 shows the functional block diagram of the ETF8A by describing how to process
1x100 Mbit/s Ethernet signals.
Figure 12-74 Functional block diagram of the ETF8A
Backplane

100 Mbit/s
Ethernet signal

N5EFS0
Interface
module

100 Mbit/s
Ethernet signal

+3.3 V

N5EFS0

Power
module

Fuse

+3.3 V backup power

Interface Module
In the receive direction, the interface module performs O/E conversion for the Ethernet signals
and transmits the signals to the N5EFS0.
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In the transmit direction, the interface module performs E/O conversion for the Ethernet signals
and transmits the signals to the optical interface.

Power Module
The power module provides all the modules of the ETF8A with the required DC voltages.

12.15.5 Front Panel


The front panel of the ETF8A has interfaces and a bar code.

Diagram of the Front Panel


Figure 12-75 shows the appearance of the front panel of the ETF8A.
Figure 12-75 Front panel of the ETF8A

ETF8A

FE1
FE2
FE3
FE4
FE5
FE6
FE7
FE8

ETF8A

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Interfaces
The front panel of the ETF8A has eight electrical interfaces.
Table 12-244 describes the types and usage of the interfaces of the ETF8A. For information
about the cables connected to the interfaces, see 23.4.6 Straight-Through Cable and 23.4.7
Crossover Cable.
Table 12-244 Interfaces of the ETF8A
Interface

Type of
Interface

Usage

FE1FE8

RJ-45

Receives the 1st to the 8th channels of Ethernet


electrical signals.

Table 12-245 provides the pin assignments of the RJ45 connector of the ETF8A.
Table 12-245 Pin assignments of the RJ45 connector of the ETF8A
Front View

8 7

6 5

3 2

Pin

Description

Transmitting (+)

Transmitting ()

Receiving (+)

Grounding

Grounding

Receiving ()

Grounding

Grounding

12.15.6 Valid Slots


The ETF8A can be installed in slots 19, 21, 23, 25, 29, 31, 33, 35 in the subrack and works as
the interface board of the N5EFS0.
Table 12-246 lists the slots valid for the N5EFS0 and the corresponding slots for the ETF8A.
Table 12-246 Slots valid for the N5EFS0 and the corresponding slots for the ETF8A

Issue 03 (2013-02-20)

Slot Valid for the N5EFS0

Corresponding Slot for the ETF8A

Slot 2

Slot 19

Slot 3

Slot 21
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Slot Valid for the N5EFS0

Corresponding Slot for the ETF8A

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

12.15.7 Technical Specifications


The technical specifications of the ETF8A include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


Table 12-247 lists the parameters specified for the electrical interfaces of the ETF8A.
Table 12-247 Parameters specified for the optical interfaces of the ETF8A
Parameter

Value

Nominal bit rate

10 Mbit/s or 100 Mbit/s

Line code pattern

Manchester encoding signal (10M) or MLT-3 encoding signal


(100M)

Specifications of the
interface

Complies with IEEE 802.3u.

Mechanical Specifications
The mechanical specifications of the ETF8A are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.4

Power Consumption
The maximum power consumption of the ETF8A at room temperature (25C) is 11 W.

12.16 ETS8
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the ETS8 (8x10/100M Ethernet twisted pair interface switching
board).
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12.16.1 Version Description


The ETS8 is available in one functional version, namely, N1.

12.16.2 Application
The ETS8 is an Ethernet electrical interface protection switching board. The ETS8 can be used
on the OptiX OSN equipment series to realize the TPS protection on the data board.

12.16.3 Functions and Features


The ETS8 is used to provide the TPS protection for 8xFE signals at the electrical interface. The
ETS8 must work with the EFS0 or EFS0A.

12.16.4 Working Principle and Signal Flow


The ETS8 consists of the interface module, switch matrix module, and power module.
Figure 12-76 shows the functional block diagram of the ETS8 by describing how to process
1x100 Mbit/s Ethernet signals.
Figure 12-76 Functional block diagram of the ETS8
Backplane
Cross-connect board
100 Mbit/s
Ethernet signal

Interface
module

100 Mbit/s
Ethernet signal
+3.3 V

Switch
matrix
module

Power
module

Fuse

EFS0
TSB8
TSB8
EFS0

+3.3 V backup power

Interface Module
The interface module receives and transmits the Ethernet optical signals.

Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the EFS0. When the TPS is performed, the switch matrix module
transmits the signal to the TSB8 for bridging.
In the transmit direction, the switch matrix module performs the reverse process.
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Power Module
The power module provides all the modules of the ETS8 with the required DC voltages.

12.16.5 Front Panel


The front panel of the ETS8 has interfaces and a bar code.

Diagram of the Front Panel


Figure 12-77 shows the appearance of the front panel of the ETS8.
Figure 12-77 Front panel of the ETS8

ETS8

FE1
FE2
FE3
FE4
FE5
FE6
FE7
FE8

ETS8

Interfaces
The front panel of the ETS8 has eight electrical interfaces.
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Table 12-248 describes the types and usage of the interfaces of the ETS8. For information about
the cables connected to the interfaces, see 23.4.6 Straight-Through Cable and 23.4.7
Crossover Cable.
Table 12-248 Interfaces of the ETS8
Interface

Type of
Interface

Usage

FE1FE8

RJ-45

Receives the 1st to the 8th channels of Ethernet


electrical signals.

Table 12-249 provides the pin assignments of the RJ45 connector of the ETS8.
Table 12-249 Pin assignments of the RJ45 connector of the ETS8
Front View

8 7

6 5

3 2

Pin

Description

Transmitting (+)

Transmitting ()

Receiving (+)

Grounding

Grounding

Receiving ()

Grounding

Grounding

12.16.6 Valid Slots


The ETS8 can be installed in slots 19, 21, 23, 25, 29, 31, 33, and 35 in the subrack and works
as the interface board of the EFS0. The ETS8 can be installed in slots 19, 21, 22, 23, 25, 29, 31,
33, 34, and 35 in the subrack and works as the interface board of the EFS0A.
Table 12-250 lists the slots valid for the EFS0 and the corresponding slots for the ETS8.
Table 12-250 Slots valid for the EFS0 and the corresponding slots for the ETS8

Issue 03 (2013-02-20)

Slot Valid for the EFS0

Corresponding Slot for the ETS8

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23
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Slot Valid for the EFS0

Corresponding Slot for the ETS8

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

Table 12-251 lists the slots valid for the EFS0A and the corresponding slots for the ETS8.
Table 12-251 Slots valid for the EFS0A and the corresponding slots for the ETS8
Slot Valid for the EFS0A

Corresponding Slot for the ETS8

Slot 2

Slot 19

Slot 3

Slot 21 and 22

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33 and 34

Slot 16

Slot 35

12.16.7 Technical Specifications


The technical specifications of the ETS8 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


Table 12-252 lists the parameters specified for the electrical interfaces of the ETS8.
Table 12-252 Parameters specified for the optical interfaces of the ETS8

Issue 03 (2013-02-20)

Parameter

Value

Nominal bit rate

10 Mbit/s or 100 Mbit/s

Line code pattern

Manchester encoding signal (10M) or MLT-3 encoding signal


(100M)

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Parameter

Value

Specifications of the
interface

Complies with IEEE 802.3u.

12 EoS Boards

Mechanical Specifications
The mechanical specifications of the ETS8 are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.4

Power Consumption
At room temperature (25C), the maximum power consumption of the ETS8 is 0 W.

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13

ATM Boards

About This Chapter


The ATM boards include STM-1 and STM-4 ATM service processing boards.
13.1 ADL4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the ADL4 (1xSTM-4 ATM service processing board). This topic also
describes how to configure and commission the ADL4.
13.2 ADQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the ADQ1 (4xSTM-1 ATM service processing board). This topic also
describes how to configure and commission the ADQ1.
13.3 IDL4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the IDL4 (1xSTM-4 ATM service processing board). This topic also
describes how to configure and commission the IDL4.
13.4 IDQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the IDQ1 (4xSTM-1 ATM service processing board). This topic also
describes how to configure and commission the IDQ1.

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13.1 ADL4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the ADL4 (1xSTM-4 ATM service processing board). This topic also
describes how to configure and commission the ADL4.

13.1.1 Version Description


The ADL4 is available in one functional version, namely, N1.

13.1.2 Application
The ATM board is used in the network that is based on ATM switching and transmission. The
ATM board can carry various types of ATM services.
The ADL4 provides one standard STM-4 optical interface and can be interconnected with the
switch or DSLAM to transmit the ATM services. In addition, the ADL4 can switch cell headers
to converge and multiplex bandwidths so that the bandwidths are not wasted. The ADL4 supports
the following types of application of the ATM services:
l

Application of the ATM services that occupy bandwidths exclusively

Application of the ATM services that share bandwidths

Application of the ATM Services That Occupy Bandwidths Exclusively


When the ATM services do not share bandwidths, only the ATM service processing boards on
the source NE and sink NE perform ATM layer processing for the ATM services. The
intermediate NEs that the ATM services traverse do not perform ATM layer processing and only
pass through the ATM services on the SDH timeslots. In this case, each ATM service occupies
the VC-3 or VC-4 channel exclusively. The ATM services can be converged at the central node
and then transmitted on the STM-4 optical interface. Figure 13-1 shows the networking and
application of the ATM services that occupy bandwidths exclusively.

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Figure 13-1 Networking and application of the ATM services that occupy bandwidths
exclusively
DSLAM

34 Mbit/s
ATM traffic

Service
convergence

NE1
155 Mbit/s
ATM traffic

622 Mbit/s
ATM traffic

2.5 Gbit/s
SDH ring
NE4

NE2
DSLAM

Router

NE3

34 Mbit/s
ATM traffic
DSLAM

Application of the ATM Services That Share Bandwidths


The VP-ring and VC-ring realize bandwidth sharing and statistical multiplexing for the ATM
services. The ATM services on each NE share one VC (VC-3, VC-4, or VC-4-Xv) channel. In
this case, each NE performs ATM layer processing for the ATM services. Figure 13-2 shows
the networking and application of the ATM services that share bandwidths.

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Figure 13-2 Networking and application of the ATM services that share bandwidths
The ATM services on NE1 are
dropped on NE2, then converged DSLAM
with the other ATM services, and
finally sent to the VP/VC-ring.
NE1

34 Mbit/s
ATM traffic

155 Mbit/s
ATM traffic

NE4
VC4-Xv
VP/VC-ring

DSLAM

Router

622 Mbit/s
ATM traffic

NE2

NE3
34 Mbit/s
ATM traffic
DSLAM

13.1.3 Functions and Features


The ADL4 supports the ATM switching and ATM protection.
Table 13-1 provides the functions and features of the ADL4.
Table 13-1 Functions and features of the ADL4

Issue 03 (2013-02-20)

Function and
Feature

ADL4

Basic functions

Transmits/Receives and processes 1xSTM-4 ATM services.

Type of optical
interface

Supports the following types of optical interfaces: S-4.1, L-4.1,


L-4.2 and Ve-4.2.

Connector type

LC

Type of optical module

SFP

E3 ATM interface

Supports 12xE3 signals, which are accessed through the PD3, PL3,
or N1PL3A.

IMA function

Does not support the IMA function.

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Function and
Feature

ADL4

Maximum uplink
bandwidth

Supports a bandwidth of 8xVC-4s, or a bandwidth of 12xVC-3s


and 4xVC-4s.
NOTE
Only VC-4s numbered 5-8 support the binding of VC-3 paths.
A VC-4 cannot be bound with VC-3 and VC-4 paths at the same time.
VCTRUNK1VCTRUNK4 can be bound with VC-4s numbered 14 only.
VCTRUNK5VCTRUNK16 can be bound with VC-4s numbered 58 and
VC-3s numbered 112.

ATM switching
capability

Unidirectional: 1.2 Gbit/s; bidirectional: 600 Mbit/s

Mapping granularities

Supports VC-3, VC-4, and VC4-Xv (X = 14) granularities.

Service types

Supports the CBR, rt-VBR, nrt-VBR, and UBR.

Number of supported
ATM connections

2048

Statistical multiplexing

Supports the statistical multiplexing.

Flow types and QoS

Complies with IETF RFC2514 and ATM forum TM4.0.

ATM multicast
connection

Supports the spatial multicast and logical multicast.

ATM protection (ITUT I.630)

Supports the unidirectional/bidirectional 1+1, unidirectional/


bidirectional 1:1, VP-Ring, and VC-Ring protection schemes.

OAM functions (ITU-T


I.610)

Supports the AIS, RDI, LB, and CC.

Maintenance features

Supports inloops at the ATM layer and on optical interfaces.


Supports outloops at the ATM layer.
These features can be used to locate faults quickly.

Alarms and
performance events

Reports various alarms and performance events, which can be used


to locate faults and maintain the equipment.

13.1.4 Working Principle and Signal Flow


The ADL4 consists of the O/E converting module, physical layer module, ATM module, E3
module, mapping module, logic and control module, clock module, and power module.
Figure 13-3 shows the functional block diagram of the ADL4 by describing how to process
1xSTM-4 signals.

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Figure 13-3 Functional block diagram of the ADL4


Backplane
622
Mbit/s

622
Mbit/s

E/O

622
Mbit/s

High-speed
bus

Physical
layer
622 module
Mbit/s

O/E

Cross-connect unit

Mapping
module

ATM
module
E3
module

High-speed
bus

Cross-connect unit

O/E converting
module

Reference clock and frame header

LOS
Laser shutdown

Logic and
control module

Communication

Cross-connect unit
SCC unit

50 MHz
77 MHz
100 MHz

Clock
module

+3.3 V

Power
module

Fuse

Fuse
Power
module

-48 V/-60 V
-48 V/-60 V

+3.3 V backup power

O/E Converting Module


In the receive direction, optical signals are converted into electrical signals. In the transmit
direction, electrical signals are converted into optical signals.

Physical Layer Module


The physical layer module mainly performs the following functions:
l

Maps ATM cells into SDH frames.

Demaps SDH frames to ATM cells.

Implements the following functions at the ATM service physical layer: cell delimitation,
and test and generation of header error control (HEC) sequence.

ATM Module
The ATM module mainly performs the following ATM layer functions that are specified in
ATM protocols:
l

Flow control

Extraction and generation of cell headers

ATM switching

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E3 Module
The E3 module mainly processes ATM services at the E3 rate. This module performs the
following functions:
l

Maps the ATM cells into E3 containers.

Demaps E3 containers to ATM cells.

Implements functions at the ATM physical layer for ATM services at the E3 rate.

Mapping Module
The mapping module performs the following functions:
l

Maps ATM cells into SDH frame payloads.

Demaps SDH frame payloads to ATM cells.

Implements functions at the ATM physical layer.

Implements the VC4-Xv (X4) virtual concatenation.

Logic and Control Module


The logic and control module performs the following functions:
l

Controls writing and reading of each chip.

Communicates with the NE.

Issues configured services.

Reports alarms of each functional module.

Detects R_LOS alarms of optical modules.

Controls the shutting down of the laser.

Clock Module
This module mainly generates the required working clock for each chip. The frequency of the
clock can be 50 MHz, 77 MHz, or 100 MHz.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

13.1.5 Front Panel


The front panel of the ADL4 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 13-4 shows the appearance of the front panel of the ADL4.

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Figure 13-4 Front panel of the ADL4

ADL4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1

ADL4

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the ADL4 has one optical interface. Table 13-2 describes the type and usage
of the optical interface of the ADL4.
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Table 13-2 Optical interface of the ADL4


Interface

Type of
Interface

Usage

OUT1/IN1

LC
(swappable)

Transmits and receives STM-4 optical signals.

13.1.6 Jumpers and DIP Switches


The ADL4 does not have any jumpers or DIP switches that are used for board settings.

13.1.7 Valid Slots


The ADL4 must be installed in a valid slot in the subrack. Otherwise, the ADL4 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the ADL4 vary with the cross-connect capacity of the subrack. The slots valid
for the ADL4 are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the ADL4 can be installed in slots 18 and
1117. In this case, the bandwidth is 1.25 Gbit/s.

13.1.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the ADL4 indicates the type of optical interface.
Table 13-3 provides the relationship between the feature code of the ADL4 and the type of
optical interface.
Table 13-3 Relationship between the feature code of the ADL4 and the type of optical interface

Issue 03 (2013-02-20)

Board

Feature Code

Type of Optical Interface

SSN1ADL410

10

S-4.1

SSN1ADL411

11

L-4.1

SSN1ADL412

12

L-4.2

SSN1ADL413

13

Ve-4.2

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13.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring ATM and IMA Services.
Step 3 Required: Set the interface.
l Set the overhead byte as follows:
J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.
C2 byte: Check whether the ATM parameter is set on both ends. The setting of the C2
byte on the interconnected equipment must be consistent.
For details, see 28.7 Checking Board Parameters.
----End

Commissioning the Board


Step 1 Connect the ATM instrument to the external optical interface of the board.
Step 2 Perform an outloop at the ATM port on the cross-connect side of the board. For the settings, see
28.7 Checking Board Parameters.
Step 3 Configure the basic ATM services on the instrument.
Step 4 Send the ATM services on the instrument.
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Step 5 Check whether the services received on the instrument are normal and check whether certain
cells are discarded.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

13.1.10 Parameter Settings


You can set parameters for the ADL4 by using the U2000.
You can set the following main parameters for the ADL4 by using the U2000:
l

Port type

Flow type

Service type

Peak cell rate (PCR)

Sustainable cell rate (SCR)

Maximum cell burst size

Cell delay variation tolerance (CDVT)

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

13.1.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 13-4 lists the faults that occur on the ADL4 frequently and the troubleshooting methods.

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Table 13-4 Methods used to troubleshoot the faults that occur on the ADL4 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on an ATM port


are interrupted.
l The services on all the ATM
ports are interrupted.
Packet loss

Bit errors occur on the line side.

See Troubleshooting Service


Packet Loss.

Interconnection
fault

l The interconnection fault


occurs on a single ATM port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCTRUNK port.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the ADL4, see Replacing an ATM Board.

13.1.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

13.1.12.1 Alarms of N1ADL4

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AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

CC_LOC

CHCS

COMMUN_FAIL

FPGA_ABN

HARD_BAD

HP_LOM

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

IN_PWR_ABN

J0_MM

LASER_MOD_ERR

LASER_SHUT

LCD

LOOP_ALM

LP_RDI_VC3

LP_REI_VC3

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LP_SLM_VC3

LP_TIM_VC3

LP_UNEQ_VC3

LSR_NO_FITED

LSR_WILL_DIE

MS_AIS

MS_RDI

MS_REI

NO_BD_SOFT

OCD

OUT_PWR_ABN

POWER_ABNORMAL

R_LOF

R_LOS

R_LOSYNC

R_OOF

SLAVE_WORKING

TEM_HA

TEM_LA

TF

TU_AIS_VC3

TU_LOP_VC3

UHCS

VC_AIS

VC_RDI

VCAT_LOA

VCAT_LOM_VC4

VCAT_SQM_VC4

VP_AIS

VP_RDI

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

13.1.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

13.1.13.1 Performance Events of N1ADL4


Table 13-5 SDH

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AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSSES

MSUAS

RSBBE

RSCSES

RSES

RSSES

RSUAS

TUPJCHIGH

TUPJCLOW

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

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VC3FEES

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VC3FESES

VC3SES

VC3UAS

Table 13-6 ATM


ATM_INGCELL

ATM_EGCELL

ATM_CORRECTED_HC
SERR

ATM_UNCORRECTED_HC
SERR

ATM_RECV_CELL

ATM_RECV_IDLECELL

ATM_TRAN_CELL

13.1.14 Technical Specifications


The technical specifications of the ADL4 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 13-7 lists the parameters specified for the optical interfaces of the ADL4.
Table 13-7 Parameters specified for the optical interfaces of the ADL4

Issue 03 (2013-02-20)

Parameter

Value

Type of optical
interface

S-4.1

L-4.1

L-4.2

Ve-4.2

Type of fiber

Single-mode LC

Single-mode
LC

Single-mode
LC

Single-mode
LC

Operating
wavelength range
(nm)

1274 to 1356

1280 to 1335

1480 to 1580

1480 to 1580

Launched optical
power range
(dBm)

-15 to -8

-3 to +2

-3 to +2

-3 to +2

Minimum
overload (dBm)

-8

-8

-8

-13

Receiver
sensitivity (dBm)

-28

-28

-28

-34

Minimum
extinction ratio
(dB)

8.2

10

10

10.5

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Parameter

Value

Maximum -20 dB
spectral width
(nm)

Minimum side
mode suppression
ratio (dB)

30

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the ADL4 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.9

Power Consumption
The maximum power consumption of the ADL4 at room temperature (25C) is 41 W.

13.2 ADQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the ADQ1 (4xSTM-1 ATM service processing board). This topic also
describes how to configure and commission the ADQ1.

13.2.1 Version Description


The ADQ1 is available in one functional version, namely, N1.

13.2.2 Application
The ATM board is used in the network that is based on ATM switching and transmission. The
ATM board can carry various types of ATM services.
The ADQ1 provides four standard STM-1 optical interfaces and can be interconnected with the
switch or DSLAM to transmit the ATM services. In addition, the ADQ1 can switch cell headers
to converge and multiplex bandwidths so that the bandwidths are not wasted. The ADQ1 supports
the following types of application of the ATM services:
l

Application of the ATM Services That Occupy Bandwidths Exclusively

Application of the ATM Services That Share Bandwidths

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Application of the ATM Services That Occupy Bandwidths Exclusively


When the ATM services do not share bandwidths, only the ATM service processing boards on
the source NE and sink NE perform ATM layer processing for the ATM services. The
intermediate NEs that the ATM services traverse do not perform ATM layer processing and only
pass through the ATM services on the SDH timeslots. In this case, each ATM service occupies
the VC-3 or VC-4 channel exclusively. The ATM services can be converged at the central node
and then transmitted on the STM-4 optical interface. Figure 13-5 shows the networking and
application of the ATM services that occupy bandwidths exclusively.
Figure 13-5 Networking and application of the ATM services that occupy bandwidths
exclusively
DSLAM

34 Mbit/s
ATM traffic

Service
convergence

NE1
155 Mbit/s
ATM traffic

622 Mbit/s
ATM traffic

2.5 Gbit/s
SDH ring
NE4

NE2
DSLAM

Router

NE3

34 Mbit/s
ATM traffic
DSLAM

Application of the ATM Services That Share Bandwidths


The VP-ring and VC-ring realize bandwidth sharing and statistical multiplexing for the ATM
services. The ATM services on each NE share one VC (VC-3, VC-4, or VC-4-Xv) channel. In
this case, each NE performs ATM layer processing for the ATM services. Figure 13-6 shows
the networking and application of the ATM services that share bandwidths.

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Figure 13-6 Networking and application of the ATM services that share bandwidths
The ATM services on NE1 are
dropped on NE2, then converged DSLAM
with the other ATM services, and
finally sent to the VP/VC-ring.
NE1

34 Mbit/s
ATM traffic

155 Mbit/s
ATM traffic

NE4
VC4-Xv
VP/VC-ring

DSLAM

Router

622 Mbit/s
ATM traffic

NE2

NE3
34 Mbit/s
ATM traffic
DSLAM

13.2.3 Functions and Features


The ADQ1 supports the ATM switching and ATM protection.
Table 13-8 provides the functions and features of the ADQ1.
Table 13-8 Functions and features of the ADQ1

Issue 03 (2013-02-20)

Function and
Feature

ADQ1

Basic functions

Transmits/Receives and processes 4xSTM-1 ATM services.

Type of optical
interface

Supports different types of standard optical interfaces, namely, the


Ie-1, S-1.1, L-1.1, L-1.2, and Ve-1.2. The characteristics of the
optical interfaces of the I-1, S-1.1, L-1.1, and L-1.2 types comply
with ITU-T G.957. The characteristics of the optical interfaces of
the Ie-1 and Ve-1.2 types comply with the standards defined by
Huawei.

Connector type

LC

Optical module type

SFP

E3 ATM interface

Supports 12xE3 signals, which are accessed through the PD3, PL3,
or N1PL3A.

IMA function

Does not support the IMA function.


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Function and
Feature

ADQ1

Maximum uplink
bandwidth

Supports a bandwidth of 8xVC-4s, or a bandwidth of 12xVC-3s and


4xVC-4s.
NOTE
Only VC-4s numbered 5-8 support the binding of VC-3 paths.
A VC-4 cannot be bound with VC-3 and VC-4 paths at the same time.
VCTRUNK1VCTRUNK4 can be bound with VC-4s numbered 14 only.
VCTRUNK5VCTRUNK16 can be bound with VC-4s numbered 58 and
VC-3s numbered 112.

ATM switching
capability

Unidirectional: 1.2 Gbit/s; bidirectional: 600 Mbit/s

Mapping granularities

Supports VC-3, VC-4, and VC4-Xv (X = 14) granularities.

Service types

Supports the CBR, rt-VBR, nrt-VBR and UBR.

Number of supported
ATM connections

2048

Statistical
multiplexing

Supports the statistical multiplexing.

Flow types and QoS

Complies with IETF RFC2514 and ATM forum TM4.0.

ATM multicast
connection

Supports the spatial multicast and logical multicast.

ATM protection (ITUT I.630)

Supports the unidirectional/bidirectional 1+1, unidirectional/


bidirectional 1:1, VP-Ring, and VC-Ring protection schemes.

OAM functions (ITUT I.610)

Supports the AIS, RDI, LB, and CC.

Maintenance features

Supports inloops at the ATM layer and on optical interfaces.


Supports outloops at the ATM layer.
These features can be used to locate faults quickly.

Alarms and
performance events

Reports various alarms and performance events, which can be used


to locate faults and maintain the equipment.

13.2.4 Working Principle and Signal Flow


The ADQ1 consists of the O/E converting module, physical layer module, ATM module, E3
module, mapping module, logic and control module, clock module, and power module.
Figure 13-7 shows the functional block diagram of the ADQ1.

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Figure 13-7 Functional block diagram of the ADQ1


Backplane
4x155
Mbit/s

4x155
Mbit/s

E/O

4x155
Mbit/s

O/E

Physical
layer
4x155 module
Mbit/s

ATM
module

High-speed
bus

Cross-connect unit

High-speed
bus

Cross-connect unit

Mapping
module
E3
module

O/E converting
module

Reference clock and frame header

LOS
Laser shutdown

Logic and
control module

Communication

Cross-connect unit
SCC unit

50 MHz
77 MHz
100 MHz

Clock
module

+3.3 V

Power
module

Fuse

Fuse
Power
module

-48 V/-60 V
-48 V/-60 V

+3.3 V backup power

O/E Converting Module


In the receive direction, optical signals are converted into electrical signals. In the transmit
direction, electrical signals are converted into optical signals.

Physical Layer Module


The physical layer module mainly performs the following functions:
l

Maps ATM cells into SDH frames.

Demaps SDH frames to ATM cells.

Implements the following functions at the ATM service physical layer: cell delimitation,
and test and generation of header error control (HEC) sequence.

ATM Module
The ATM module mainly performs the following ATM layer functions that are specified in
ATM protocols:
l

Flow control

Extraction and generation of cell headers

ATM switching

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E3 Module
The E3 module mainly processes ATM services at the E3 rate. This module performs the
following functions:
l

Maps the ATM cells into E3 containers.

Demaps E3 containers to ATM cells.

Implements functions at the ATM physical layer for ATM services at the E3 rate.

Mapping Module
The mapping module performs the following functions:
l

Maps ATM cells into SDH frame payloads.

Demaps SDH frame payloads to ATM cells.

Implements functions at the ATM physical layer.

Implements the VC4-Xv (X4) virtual concatenation.

Logic and Control Module


The logic and control module performs the following functions:
l

Controls writing and reading of each chip.

Communicates with the NE.

Issues configured services.

Reports alarms of each functional module.

Detects R_LOS alarms of optical modules.

Controls the shutting down of the laser.

Clock Module
This module mainly generates the required working clock for each chip. The frequency of the
clock can be 50 MHz, 77 MHz, or 100 MHz.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

13.2.5 Front Panel


The front panel of the ADQ1 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 13-8 shows the appearance of the front panel of the ADQ1.

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Figure 13-8 Front panel of the ADQ1

ADQ1
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

ADQ1

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the ADQ1 has four optical interfaces. Table 13-9 describes the types and
usage of the optical interfaces of the ADQ1.
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Table 13-9 Optical interfaces of the ADQ1


Interface

Type of
Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives STM-1 optical signals.

OUT2/IN2

LC (swappable)

Transmits and receives STM-1 optical signals.

OUT3/IN3

LC (swappable)

Transmits and receives STM-1 optical signals.

OUT4/IN4

LC (swappable)

Transmits and receives STM-1 optical signals.

13.2.6 Jumpers and DIP Switches


The ADQ1 does not have any jumpers or DIP switches that are used for board settings.

13.2.7 Valid Slots


The ADQ1 must be installed in a valid slot in the subrack. Otherwise, the ADQ1 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the ADQ1 vary with the cross-connect capacity of the subrack. The slots valid
for the ADQ1 are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the ADQ1 can be installed in slots 18 and
1117. In this case, the bandwidth is 1.25 Gbit/s.

13.2.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the ADQ1 indicates the type of optical interface.
Table 13-10 provides the relationship between the feature code of the ADQ1 and the type of
optical interface.
Table 13-10 Relationship between the feature code of the ADQ1 and the type of optical interface

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Board

Feature Code

Type of Optical Interface

SSN1ADQ110

10

S-1.1

SSN1ADQ111

11

L-1.1

SSN1ADQ112

12

L-1.2

SSN1ADQ113

13

Ve-1.2

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Board

Feature Code

Type of Optical Interface

SSN1ADQ114

14

Ie-1

13.2.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring ATM and IMA Services.
Step 3 Required: Set the interface.
l Set the overhead byte as follows:
J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.
C2 byte: Check whether the ATM parameter is set on both ends. The setting of the C2
byte on the interconnected equipment must be consistent.
For details, see 28.7 Checking Board Parameters.
----End

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Commissioning the Board


Step 1 Connect the ATM instrument to the external optical interface of the board.
Step 2 Perform an outloop at the ATM port on the cross-connect side of the board. For the settings, see
28.7 Checking Board Parameters.
Step 3 Configure the basic ATM services on the instrument.
Step 4 Send the ATM services on the instrument.
Step 5 Check whether the services received on the instrument are normal and check whether certain
cells are discarded.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

13.2.10 Parameter Settings


You can set parameters for the ADQ1 by using the U2000.
You can set the following main parameters for the ADQ1 by using the U2000:
l

Port type

Flow type

Service type

PCR

SCR

Maximum cell burst size

CDVT

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

13.2.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 13-11 lists the faults that occur on the ADQ1 frequently and the troubleshooting methods.
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Table 13-11 Methods used to troubleshoot the faults that occur on the ADQ1 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on an ATM port


are interrupted.
l The services on all the ATM
ports are interrupted.
Packet loss

Bit errors occur on the line side.

See Troubleshooting Service


Packet Loss.

Interconnection
fault

l The interconnection fault


occurs on a single ATM port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCTRUNK port.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the ADQ1, see Replacing an ATM Board.

13.2.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

13.2.12.1 Alarms of N1ADQ1

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AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

CC_LOC

CHCS

COMMUN_FAIL

FPGA_ABN

HARD_BAD

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

IN_PWR_ABN

J0_MM

LASER_MOD_ERR

LASER_SHUT

LCD

LOOP_ALM

LP_RDI_VC3

LP_REI_VC3

LP_SLM_VC3

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LP_TIM_VC3

LP_UNEQ_VC3

LSR_NO_FITED

LSR_WILL_DIE

MS_AIS

MS_RDI

MS_REI

NO_BD_SOFT

OCD

OUT_PWR_ABN

POWER_ABNORMAL

R_LOF

R_LOS

R_LOSYNC

R_OOF

SLAVE_WORKING

TEM_HA

TEM_LA

TF

TU_AIS_VC3

TU_LOP_VC3

UHCS

VC_AIS

VC_RDI

VCAT_LOA

VCAT_LOM_VC4

VCAT_SQM_VC4

VP_AIS

VP_RDI

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

13.2.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

13.2.13.1 Performance Events of N1ADQ1


Table 13-12 SDH

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AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSSES

MSUAS

RSBBE

RSCSES

RSES

RSSES

RSUAS

TUPJCHIGH

TUPJCLOW

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

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VC3FEES

13 ATM Boards

VC3FESES

VC3SES

VC3UAS

Table 13-13 ATM


ATM_INGCELL

ATM_EGCELL

ATM_CORRECTED_HC
SERR

ATM_UNCORRECTED_HC
SERR

ATM_RECV_CELL

ATM_RECV_IDLECELL

ATM_TRAN_CELL

13.2.14 Technical Specifications


The technical specifications of the ADQ1 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 13-14 lists the parameters specified for the optical interfaces of the ADQ1.
Table 13-14 Parameters specified for the optical interfaces of the ADQ1

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Parameter

Value

Type of optical
interface

Ie-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Type of fiber

Multimode LC

Single-mode
LC

Single-mode
LC

Singlemode LC

Single-mode
LC

Operating
wavelength
range (nm)

1270 to
1380

1261 to 1360

1263 to 1360

1480 to
1580

1480 to 1580

Transmission
distance (km)

0 to 0.5

2 to 15

15 to 40

40 to 80

80 to 100

Launched
optical power
range (dBm)

-19 to -14

-15 to -8

-5 to 0

-5 to 0

-3 to 0

Receive optical
power (dBm)

-30

-28

-34

-34

-34

Minimum
overload (dBm)

-14

-8

-10

-10

-10

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Parameter

Value

Minimum
extinction ratio
(dB)

10

8.2

10

10

10

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the ADQ1 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the ADQ1 at room temperature (25C) is 41 W.

13.3 IDL4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the IDL4 (1xSTM-4 ATM service processing board). This topic also
describes how to configure and commission the IDL4.

13.3.1 Version Description


The IDL4 is available in one functional version, namely, N1.

13.3.2 Application
The IMA technology demultiplexes the assembled ATM cell flow into multiple low-speed links,
and multiplexed the multiple low-speed links on the remote end to restore the original assembled
cell flow. The IMA technology realizes the interconnection between high-speed links and lowspeed links.
The IMA board is applicable to the transmission of the ATM cells on the E1 interface or
interfaces at the other rates. The IMA board only provides a channel and does not process the
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service type or ATM cells. That is, the IMA board transparently transmits the ATM layer signals
and higher-layer signals. Figure 13-9 shows the networking and application of the IMA services.
Figure 13-9 Networking and application of the IMA services
RNC
NE1
NMS
25 km
NodeB 1

40 km

NE2

NE4

Two-fiber bidirectional
MSP ring

NodeB 4
35 km

30 km
NE3

NodeB 2

NodeB 3

13.3.3 Functions and Features


The IDL4 supports the ATM switching, IMA, and ATM protection.
Table 13-15 provides the functions and features of the IDL4.
Table 13-15 Functions and features of the IDL4

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Function and
Feature

IDL4

Basic functions

Transmits/Receives and processes 1xSTM-4 ATM services.

Type of optical
interface

Supports the following types of optical interfaces: S-4.1, L-4.1, L-4.2


and Ve-4.2.

Connector type

LC

Optical module type

SFP

E3 ATM interface

Does not support the E3 ATM interface.

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Function and
Feature

IDL4

IMA functions
(ATM Forum IMA
1.1)

l Transmits/Receives and processes IMA services when the IDL4


is used with the E1 service processing board N1PQ1 or N1PQM.
l Supports a maximum of 63 E1 IMA services.
l Supports the mapping between ATM ports and a maximum of 16
IMA groups. Each IMA group supports 132 E1 signals.
l Supports the mapping between ATM ports and a maximum of 16
E1 links that belong to non-IMA groups.
l Supports the maximum IMA multichannel delay of 226 ms.

Maximum uplink
bandwidth

Supports a bandwidth of 8xVC-4s, or a bandwidth of 63xVC-12s and


7xVC-4s.
NOTE
Only the first VC-4 supports the binding of VC-12 paths.
A VC-4 cannot be bound with VC-12 and VC-4 paths at the same time.
VCTRUNK 1VCTRUNK 66 can be bound with VC-4s numbered 14 or
VC-12s numbered 163 only. VCTRUNK 67VCTRUNK 70 can be bound
with VC-4s numbered 58.

ATM switching
capability

Unidirectional: 1.2 Gbit/s; bidirectional: 600 Mbit/s

Mapping
granularities

Supports VC-12, VC-4, VC4-Xc (X = 14), and VC12-Xv (X = 1


32) granularities.

Service types

Supports the CBR, rt-VBR, nrt-VBR and UBR.

Number of supported
ATM connections

2048

Statistical
multiplexing

Supports the statistical multiplexing.

Flow types and QoS

Complies with IETF RFC2514 and ATM forum TM4.0.

ATM multicast
connection

Supports the spatial multicast and logical multicast.

ATM protection
(ITU-T I.630)

Supports the unidirectional/bidirectional 1+1, unidirectional/


bidirectional 1:1, VP-Ring, and VC-Ring protection schemes.

Board-level 1+1
protection

Supports the board-level 1+1 protection.

OAM functions
(ITU-T I.610)

Supports the AIS, RDI, LB, and CC.

Maintenance
features

Supports inloops at the ATM layer and on optical interfaces.


Supports outloops at the ATM layer.
These features can be used to locate faults quickly.

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Function and
Feature

IDL4

Alarms and
performance events

Reports various alarms and performance events, which can be used


to locate faults and maintain the equipment.

Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group can
coexist with a single E1 signal. The IMA group can dynamically increase or decrease the
bandwidth to improve the bandwidth utilization. The IMA group can also be used to converge
2 Mbit/s services and to interconnect with other IMA equipment.

13.3.4 Working Principle and Signal Flow


The IDL4 consists of the O/E converting module, physical layer module, ATM module, IMA
module, mapping module, logic and control module, clock module, and power module.
Figure 13-10 shows the functional block diagram of the IDL4 by describing how to process
1xSTM-4 signals.
Figure 13-10 Functional block diagram of the IDL4
Backplane
622
Mbit/s

622
Mbit/s

622
Mbit/s

E/O

622
Mbit/s

O/E

Physical
layer
module

ATM
module

High-speed
bus

Cross-connect unit A

High-speed
bus

Cross-connect unit B

Mapping
module
IMA
module

O/E converting
module

Reference clock and frame header

LOS
Laser shutdown

Logic and
control module

Communication

Cross-connect unit
SCC unit

50 MHz
77 MHz
100 MHz

Clock
module

+3.3 V

Power
module

Fuse

Fuse
Power
module

-48 V/-60 V
-48 V/-60 V

+3.3 V backup power

O/E Converting Module


In the receive direction, optical signals are converted into electrical signals. In the transmit
direction, electrical signals are converted into optical signals.
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Physical Layer Module


The physical layer module mainly performs the following functions:
l

Maps ATM cells into SDH frames.

Demaps SDH frames to ATM cells.

Implements the following functions at the ATM service physical layer: cell delimitation,
and test and generation of header error control (HEC) sequence.

ATM Module
The ATM module mainly performs the following ATM layer functions that are specified in
ATM protocols:
l

Flow control

Extraction and generation of cell headers

ATM switching

IMA Module
This module mainly performs the following functions that are specified in IMA protocols:
l

Separation and re-creation of ATM cells

Frame synchronization

Insertion and extraction of IMA control protocol (ICP) cells

Management of IMA groups

Mapping Module
The mapping module performs the following functions:
l

Maps ATM cells into SDH frame payloads.

Demaps SDH frame payloads to ATM cells.

Implements functions at the ATM physical layer.

Implements the VC4-Xv (X4) virtual concatenation.

Logic and Control Module


The logic and control module performs the following functions:
l

Controls writing and reading of each chip.

Communicates with the NE.

Issues configured services.

Reports alarms of each functional module.

Detects R_LOS alarms of optical modules.

Controls the shutting down of the laser.

Clock Module
This module mainly generates the required working clock for each chip. The frequency of the
clock can be 50 MHz, 77 MHz, or 100 MHz.
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Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

13.3.5 Front Panel


The front panel of the IDL4 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 13-11 shows the appearance of the front panel of the IDL4.
Figure 13-11 Front panel of the IDL4

IDL4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1

IDL4

Indicators
The front panel of the board has the following indicators:
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Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

13 ATM Boards

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the IDL4 has one optical interface. Table 13-16 describes the type and usage
of the optical interface of the IDL4.
Table 13-16 Optical interface of the IDL4
Interface

Type of
Interface

Usage

OUT1/IN1

LC
(swappable)

Transmits and receives STM-4 optical signals.

13.3.6 Jumpers and DIP Switches


The IDL4 does not have any jumpers or DIP switches that are used for board settings.

13.3.7 Valid Slots


The IDL4 must be installed in a valid slot in the subrack. Otherwise, the IDL4 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the IDL4 vary with the cross-connect capacity of the subrack. The slots valid
for the IDL4 are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the IDL4 can be installed in slots 18 and
1117. In this case, the bandwidth is 1.25 Gbit/s.

13.3.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL1 indicates the type of optical interface.
Table 13-17 provides the relationship between the feature code of the IDL4 and the type of
optical interface.
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Table 13-17 Relationship between the feature code of the IDL4 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1IDL410

10

S-4.1

SSN1IDL411

11

L-4.1

SSN1IDL412

12

L-4.2

SSN1IDL413

13

Ve-4.2

13.3.9 Board Protection


The IDL4 supports the 1+1 board-level protection. The working IDL4 and protection IDL4
should be installed in paired slots.
The paired slots valid for the IDL4 vary with the cross-connect capacity.
l

When the cross-connect capacity is 200 Gbit/s: (slot 8, slot 11), (slot 7, slot 12), (slot 6,
slot 13), (slot 5, slot 14), (slot 4, slot 15), (slot 3, slot 16), and (slot 2, slot 17)

13.3.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring ATM and IMA Services.
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Step 3 Required: Set the interface.


l Set the overhead byte as follows:
J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.
C2 byte: Check whether the ATM parameter is set on both ends. The setting of the C2
byte on the interconnected equipment must be consistent.
For details, see 28.7 Checking Board Parameters.
----End

Commissioning the Board


Step 1 Use the ATM instrument (for example, AX4000) to test the ATM services.
1.

Connect the ATM instrument to the external optical interface of the board.

2.

Perform an outloop at the ATM port on the cross-connect side of the board. For the settings,
see 28.7 Checking Board Parameters.

3.

Configure the basic ATM services on the instrument.

4.

Send the ATM services on the instrument.

5.

Check whether the services received on the instrument are normal and check whether
certain cells are discarded.

Step 2 Use the IMA instrument (for example, AX4000) to test the IMA services.
1.

Connect the IMA instrument to the cross-connect side of the board. The connection can be
realized by using the E1 tributary board.

2.

Perform an outloop on the optical interface side of the board by using optical fiber pairs.

3.

Configure the basic IMA services on the instrument.

4.

Send the IMA services on the instrument.

5.

Check whether the services received on the instrument are normal and check whether
certain cells are discarded.

----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

13.3.11 Parameter Settings


You can set parameters for the IDL4 by using the U2000.
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You can set the following main parameters for the IDL4 by using the U2000:
l

Port type

Flow type

Service type

PCR

SCR

Maximum cell burst size

CDVT

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

13.3.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 13-18 lists the faults that occur on the IDL4 frequently and the troubleshooting methods.
Table 13-18 Methods used to troubleshoot the faults that occur on the IDL4 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on an ATM port


are interrupted.
l The services on all the ATM
ports are interrupted.
Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The services on an ATM port


are transiently interrupted.
l The protocol becomes
abnormal.
Packet loss

Bit errors occur on the line side.

See Troubleshooting Service


Packet Loss.

Interconnection
fault

l The interconnection fault


occurs on a single ATM port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCTRUNK port.
l The IMA interconnection fault
occurs.

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Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the IDL4, see Replacing an ATM Board.

13.3.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

13.3.13.1 Alarms of N1IDL4

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ALM_E1AIS

ALM_IMA_LIF

ALM_IMA_LINK_LCD

ALM_IMA_LODS

ALM_IMA_RE_RX_UNUSABLE

ALM_IMA_RE_TX_UNUSABLE

ALM_IMA_RFI

AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_SD

BD_STATUS

BIP_EXC

BIP_SD

CC_LOC

CHCS

COMMUN_FAIL

FPGA_ABN

HARD_BAD

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

IN_PWR_ABN

J0_MM

LASER_MOD_ER
R

LASER_SHUT

LCD

LFA

LMFA

LOOP_ALM

LP_RDI

LP_REI

LP_SLM

LP_TIM

LP_UNEQ

LSR_NO_FITED

LSR_WILL_DIE

MS_AIS

MS_RDI

MS_REI

NO_BD_SOFT

OCD

OUT_PWR_ABN

POWER_ABNORMAL

R_LOF

R_LOS

R_LOSYNC

R_OOF

SLAVE_WORKIN
G

TEM_HA

TEM_LA

TF

TU_AIS

TU_LOP

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UHCS

VC_AIS

VC_RDI

VCAT_LOA

VCAT_LOM_VC4

VCAT_SQM_VC4

VCG_MM

VP_AIS

VP_RDI

VPG_MM

W_R_FAIL

WRG_BD_TYPE

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

SWDL_PKG_NOB
DSOFT

13.3.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

13.3.14.1 Performance Events of N1IDL4


Table 13-19 SDH

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AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPSES

LPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSSES

MSUAS

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

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Table 13-20 ATM


ATM_INGCELL

ATM_EGCELL

ATM_CORRECTED_HC
SERR

ATM_UNCORRECTED_HC
SERR

ATM_RECV_CELL

ATM_RECV_IDLECELL

ATM_TRAN_CELL

13.3.15 Technical Specifications


The technical specifications of the IDL4 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 13-21 lists the parameters specified for the optical interfaces of the IDL4.
Table 13-21 Parameters specified for the optical interfaces of the IDL4

Issue 03 (2013-02-20)

Parameter

Value

Type of optical
interface

S-4.1

L-4.1

L-4.2

Ve-4.2

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Single-mode
LC

Operating
wavelength range
(nm)

1274 to 1356

1280 to 1335

1480 to 1580

1480 to 1580

Launched optical
power range (dBm)

-15 to -8

-3 to +2

-3 to +2

-3 to +2

Receiver sensitivity
(dBm)

-28

-28

-28

-34

Minimum overload
(dBm)

-8

-8

-8

-13

Minimum extinction
ratio (dB)

8.2

10

10

10.5

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio
(dB)

30

30

30

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Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the IDL4 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the IDL4 at room temperature (25C) is 41 W.

13.4 IDQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the IDQ1 (4xSTM-1 ATM service processing board). This topic also
describes how to configure and commission the IDQ1.

13.4.1 Version Description


The IDQ1 is available in one functional version, namely, N1.

13.4.2 Application
The IMA technology demultiplexes the assembled ATM cell flow into multiple low-speed links,
and multiplexed the multiple low-speed links on the remote end to restore the original assembled
cell flow. The IMA technology realizes the interconnection between high-speed links and lowspeed links.
The IMA board is applicable to the transmission of the ATM cells on the E1 interface or
interfaces at the other rates. The IMA board only provides a channel and does not process the
service type or ATM cells. That is, the IMA board transparently transmits the ATM layer signals
and higher-layer signals. Figure 13-12 shows the networking and application of the IMA
services.

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Figure 13-12 Networking and application of the IMA services


RNC
NE1
NMS
25 km
NodeB 1

40 km

NE2

NE4

Two-fiber bidirectional
MSP ring

NodeB 4
35 km

30 km
NE3

NodeB 2

NodeB 3

13.4.3 Functions and Features


The IDQ1 supports the ATM switching, IMA, and ATM protection.
Table 13-22 provides the functions and features of the IDQ1.
Table 13-22 Functions and features of the IDQ1

Issue 03 (2013-02-20)

Function and
Feature

IDQ1

Basic functions

Transmits/Receives and processes 4xSTM-1 ATM services.

Type of optical
interface

Supports different types of standard optical interfaces, namely, the Ie-1,


S-1.1, L-1.1, L-1.2, and Ve-1.2. The characteristics of the optical
interfaces of the I-1, S-1.1, L-1.1, and L-1.2 types comply with ITU-T
G.957. The characteristics of the optical interfaces of the Ie-1 and Ve-1.2
types comply with the standards defined by Huawei.

Connector type

LC

Optical module
type

SFP

E3 ATM interface

Does not support the E3 ATM interface.

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Function and
Feature

IDQ1

IMA functions
(ATM Forum IMA
1.1)

l Transmits/Receives and processes IMA services when the IDQ1 is


used with the E1 service processing board N1PQ1 or N1PQM.
l Supports a maximum of 63 E1 IMA services.
l Supports the mapping between ATM ports and a maximum of 93
IMA groups. Each IMA group supports 132 E1 signals.
l Supports the mapping between ATM ports and a maximum of 16 E1
links that belong to non-IMA groups.
l Supports the maximum IMA multichannel delay of 226 ms.

Maximum uplink
bandwidth

Supports a bandwidth of 8xVC-4s, or a bandwidth of 63xVC-12s and


7xVC-4s. The IDQ1 can adapt to the bandwidth of the slot.
NOTE
Only the first VC-4 supports the binding of VC-12 paths.
A VC-4 cannot be bound with VC-12 and VC-4 paths at the same time.
VCTRUNK 1VCTRUNK 66 can be bound with VC-4s numbered 14 or
VC-12s numbered 163 only. VCTRUNK 67VCTRUNK 70 can be bound with
VC-4s numbered 58.

ATM switching
capability

Unidirectional: 1.2 Gbit/s; bidirectional: 600 Mbit/s

Mapping
granularities

Supports VC-12, VC-4, VC4-Xc (X = 14), and VC12-Xv (X = 132)


granularities.

Service types

Supports the CBR, rt-VBR, nrt-VBR, and UBR.

Number of
supported ATM
connections

2048

Statistical
multiplexing

Supports the statistical multiplexing.

Flow types and


QoS

Complies with IETF RFC2514 and ATM forum TM4.0.

ATM multicast
connection

Supports the spatial multicast and logical multicast.

ATM protection
(ITU-T I.630)

Supports unidirectional/bidirectional 1+1, unidirectional/bidirectional


1:1, VP-Ring, and VC-Ring protection schemes.

Board-level 1+1
protection

Supports the board-level 1+1 protection.

OAM functions
(ITU-T I.610)

Supports the AIS, RDI, LB, and CC.

Maintenance
features

Supports inloops at the ATM layer and on optical interfaces.


Supports outloops at the ATM layer.
These features can be used to locate faults quickly.

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Function and
Feature

IDQ1

Alarm and
performance event

Reports various alarms and performance events, which can be used to


locate faults and maintain the equipment.

Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group can
coexist with a single E1 signal. The IMA group can dynamically increase or decrease the
bandwidth to improve the bandwidth utilization. The IMA group can also be used to converge
2 Mbit/s services and to interconnect with other IMA equipment.

13.4.4 Working Principle and Signal Flow


The IDQ1 consists of the O/E converting module, physical layer module, ATM module, IMA
module, mapping module, logic and control module, clock module, and power module.
Figure 13-13 shows the functional block diagram of the IDQ1.
Figure 13-13 Functional block diagram of the IDQ1
Backplane
4x155
Mbit/s

4x155
Mbit/s

E/O

4x155
Mbit/s

O/E

Physical
layer
4x155 module
Mbit/s

ATM
module

High-speed
bus

Cross-connect unit A

High-speed
bus

Cross-connect unit B

Mapping
module
IMA
module

O/E converting
module

Reference clock and frame header

LOS
Laser shutdown

Logic and
control module

Communication

Cross-connect unit
SCC unit

50 MHz
77 MHz
100 MHz

Clock
module

+3.3 V

Power
module

Fuse

Fuse
Power
module

-48 V/-60 V
-48 V/-60 V

+3.3 V backup power

O/E Converting Module


In the receive direction, optical signals are converted into electrical signals. In the transmit
direction, electrical signals are converted into optical signals.
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Physical Layer Module


The physical layer module mainly performs the following functions:
l

Maps ATM cells into SDH frames.

Demaps SDH frames to ATM cells.

Implements the following functions at the ATM service physical layer: cell delimitation,
and test and generation of header error control (HEC) sequence.

ATM Module
The ATM module mainly performs the following ATM layer functions that are specified in
ATM protocols:
l

Flow control

Extraction and generation of cell headers

ATM switching

IMA Module
This module mainly performs the following functions that are specified in IMA protocols:
l

Separation and re-creation of ATM cells

Frame synchronization

Insertion and extraction of IMA control protocol (ICP) cells

Management of IMA groups

Mapping Module
The mapping module performs the following functions:
l

Maps ATM cells into SDH frame payloads.

Demaps SDH frame payloads to ATM cells.

Implements functions at the ATM physical layer.

Implements the VC4-Xv (X4) virtual concatenation.

Logic and Control Module


The logic and control module performs the following functions:
l

Controls writing and reading of each chip.

Communicates with the NE.

Issues configured services.

Reports alarms of each functional module.

Detects R_LOS alarms of optical modules.

Controls the shutting down of the laser.

Clock Module
This module mainly generates the required working clock for each chip. The frequency of the
clock can be 50 MHz, 77 MHz, or 100 MHz.
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Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

13.4.5 Front Panel


The front panel of the IDQ1 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 13-14 shows the appearance of the front panel of the IDQ1.
Figure 13-14 Front panel of the IDQ1

IDQ1
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

IDQ1

Indicators
The front panel of the board has the following indicators:
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Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the IDQ1 has four optical interfaces. Table 13-23 describes the types and
usage of the optical interfaces of the IDQ1.
Table 13-23 Optical interfaces of the IDQ1
Interface

Type of
Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives STM-1 optical signals.

OUT2/IN2

LC (swappable)

Transmits and receives STM-1 optical signals.

OUT3/IN3

LC (swappable)

Transmits and receives STM-1 optical signals.

OUT4/IN4

LC (swappable)

Transmits and receives STM-1 optical signals.

13.4.6 Jumpers and DIP Switches


The IDQ1 does not have any jumpers or DIP switches that are used for board settings.

13.4.7 Valid Slots


The IDQ1 must be installed in a valid slot in the subrack. Otherwise, the IDQ1 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the IDQ1 vary with the cross-connect capacity of the subrack. The slots valid
for the IDQ1 are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the IDQ1 can be installed in slots 18 and
1117. In this case, the bandwidth is 1.25 Gbit/s.

13.4.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the IDQ1 indicates the type of optical interface.
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Table 13-24 provides the relationship between the feature code of the IDQ1 and the type of
optical interface.
Table 13-24 Relationship between the feature code of the IDQ1 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1IDQ110

10

S-1.1

SSN1IDQ111

11

L-1.1

SSN1IDQ112

12

L-1.2

SSN1IDQ113

13

Ve-1.2

SSN1IDQ114

14

Ie-1

13.4.9 Board Protection


The IDQ1 supports the 1+1 board-level protection. The active and standby IDQ1 should be
housed in paired slots.
The valid paired slots for the IDQ1 vary with the cross-connect capacity.
l

When the cross-connect capacity is 200 Gbit/s: (slot 8, slot 11), (slot 7, slot 12), (slot 6,
slot 13), (slot 5, slot 14), (slot 4, slot 15), (slot 3, slot 16), (slot 2, slot 17)

13.4.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End
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Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring ATM and IMA Services.
Step 3 Required: Set the interface.
l Set the overhead byte as follows:
J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.
C2 byte: Check whether the ATM parameter is set on both ends. The setting of the C2
byte on the interconnected equipment must be consistent.
For details, see 28.7 Checking Board Parameters.
----End

Commissioning the Board


Step 1 Use the ATM instrument (for example, AX4000) to test the ATM services.
1.

Connect the ATM instrument to the external optical interface of the board.

2.

Perform an outloop at the ATM port on the cross-connect side of the board. For the settings,
see 28.7 Checking Board Parameters.

3.

Configure the basic ATM services on the instrument.

4.

Send the ATM services on the instrument.

5.

Check whether the services received on the instrument are normal and check whether
certain cells are discarded.

Step 2 Use the IMA instrument (for example, AX4000) to test the IMA services.
1.

Connect the IMA instrument to the cross-connect side of the board. The connection can be
realized by using the E1 tributary board.

2.

Perform an outloop on the optical interface side of the board by using optical fiber pairs.

3.

Configure the basic IMA services on the instrument.

4.

Send the IMA services on the instrument.

5.

Check whether the services received on the instrument are normal and check whether
certain cells are discarded.

----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
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cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

13.4.11 Parameter Settings


You can set parameters for the IDQ1 by using the U2000.
You can set the following main parameters for the IDQ1 by using the U2000:
l

Port type

Flow type

Service type

PCR

SCR

Maximum cell burst size

CDVT

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

13.4.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 13-25 lists the faults that occur on the IDQ1 frequently and the troubleshooting methods.
Table 13-25 Methods used to troubleshoot the faults that occur on the IDQ1 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on an ATM port


are interrupted.
l The services on all the ATM
ports are interrupted.
Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The services on an ATM port


are transiently interrupted.
l The protocol becomes
abnormal.
Packet loss

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Bit errors occur on the line side.

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Packet Loss.
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Fault Symptom

Common Fault Cause

Troubleshooting Method

Interconnection
fault

l The interconnection fault


occurs on a single ATM port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCTRUNK port.
l The IMA interconnection fault
occurs.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the IDQ1, see Replacing an ATM Board.

13.4.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

13.4.13.1 Alarms of N1IDQ1

Issue 03 (2013-02-20)

ALM_E1AIS

ALM_IMA_LIF

ALM_IMA_LINK_LCD

ALM_IMA_LODS

ALM_IMA_RE_RX_UNUSABLE

ALM_IMA_RE_TX_UNUSABLE

ALM_IMA_RFI

AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_SD

BD_STATUS

BIP_EXC

BIP_SD

CC_LOC

CHCS

COMMUN_FAIL

FPGA_ABN

HARD_BAD

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

IN_PWR_ABN

J0_MM

LASER_MOD_ER
R

LASER_SHUT

LCD

LFA

LMFA

LOOP_ALM

LP_RDI

LP_REI

LP_SLM

LP_TIM

LP_UNEQ

LSR_NO_FITED

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LSR_WILL_DIE

MS_AIS

MS_RDI

MS_REI

NO_BD_SOFT

OCD

OUT_PWR_ABN

POWER_ABNORMAL

R_LOF

R_LOS

R_LOSYNC

R_OOF

SLAVE_WORKIN
G

TEM_HA

TEM_LA

TF

TU_AIS

TU_LOP

UHCS

VC_AIS

VC_RDI

VCAT_LOA

VCAT_LOM_VC4

VCAT_SQM_VC4

VCG_MM

VP_AIS

VP_RDI

VPG_MM

W_R_FAIL

WRG_BD_TYPE

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

SWDL_PKG_NOB
DSOFT

13.4.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

13.4.14.1 Performance Events of N1IDQ1


Table 13-26 SDH

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AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPSES

LPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSSES

MSUAS

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OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

Table 13-27 ATM


ATM_INGCELL

ATM_EGCELL

ATM_CORRECTED_HC
SERR

ATM_UNCORRECTED_HC
SERR

ATM_RECV_CELL

ATM_RECV_IDLECELL

ATM_TRAN_CELL

13.4.15 Technical Specifications


The technical specifications of the IDQ1 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 13-28 lists the parameters specified for the optical interfaces of the IDQ1.
Table 13-28 Parameters specified for the optical interfaces of the IDQ1

Issue 03 (2013-02-20)

Parameter

Value

Type of optical
interface

Ie-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Type of fiber

Multimode LC

Singlemode LC

Single-mode
LC

Singlemode LC

Single-mode
LC

Operating
wavelength
range (nm)

1270 to
1380

1261 to
1360

1263 to 1360

1480 to
1580

1480 to 1580

Transmission
distance (km)

0 to 0.5

2 to 15

15 to 40

40 to 80

80 to 100

Launched optical
power range
(dBm)

-19 to -14

-15 to -8

-5 to 0

-5 to 0

-3 to 0

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Parameter

Value

Receiver
sensitivity
(dBm)

-30

-28

-34

-34

-34

Minimum
overload (dBm)

-14

-8

-10

-10

-10

Minimum
extinction ratio
(dB)

10

8.2

10

10

10

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression ratio
(dB)

30

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the IDQ1 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the IDQ1 at room temperature (25C) is 41 W.

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14

RPR Boards

About This Chapter


The RPR boards include FE/GE Ethernet ring processing boards.
14.1 EGR2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGR2 (2xGE ring processing board). This topic also describes
how to configure and commission the EGR2.
14.2 EMR0
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EMR0 (12xFE and 1xGE ring processing board). This topic also
describes how to configure and commission the EMR0.

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14.1 EGR2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGR2 (2xGE ring processing board). This topic also describes
how to configure and commission the EGR2.

14.1.1 Version Description


The EGR2 is available in one functional version, namely, N2.

14.1.2 Application
The EGR2 is used to transmit/receive Ethernet services, manage bandwidths, and realize Layer
2 switching of Ethernet services.
Figure 14-1 shows the typical networking and application of the RPR board. The RPR board
accesses and converges Ethernet services, and provides the Ethernet data with the following data
features: Layer 2 switching, port isolation, flow classification, traffic control, VLAN
management, and priority configuration. In addition, the RPR board performs encapsulation/
decapsulation, virtual concatenation, and SDH mapping/demapping for data. The RPR board
can be interconnected with the bandwidth access equipment and the data communication
equipment at the same time, thus to provide a network-level solution.
NOTE

When the service converging FE services into GE services is configured, the GE switching board can be
set to the 1000M full-duplex mode or auto-negotiation mode, the VLAN of the convergence service is
variable, and the binding granularity is at the VC-3 or VC-4 level.

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Figure 14-1 Networking and application of the RPR board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

14.1.3 Functions and Features


The EGR2 supports the Layer 2 switching, port aggregation, and RPR functions.
Table 14-1 provides the functions and features of the EGR2.
Table 14-1 Functions and features of the EGR2
Function and
Feature

EGR2

Basic functions

Transmits/Receives and processes 2xGE services.


Supports the RPR feature.

Functions when
being used with the
interface board

Issue 03 (2013-02-20)

Transmits/Receives 2xGE signals by providing interfaces on the front


panel.

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Function and
Feature

EGR2

Specifications of the
optical interface

l The optical interfaces are 1000BASE-SX/LX/ZX/VX Ethernet


optical interfaces.
l The optical interfaces support the auto-negotiation function in
compliance with IEEE 802.3z.
l The optical interfaces use the SFP optical module and support hot
swapping.
When the multi-mode optical fiber is used, the maximum
transmission distance is 550 m.
When the single-mode optical fiber is used, the maximum
transmission distance is 10 km.
The optical modules that can meet different requirements for
the transmission distance such as 40 km and 80 km can also be
used.

Format of service
frames

l Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG formats.
l Supports the setting of the frame length to a value ranging from
1518 bytes to 9600 bytes.
l Supports the Jumbo frame with a length less than 9600 bytes.

Maximum uplink
bandwidth

2.5 Gbit/s
The EGR2 can adapt to the bandwidth of the slot.

Mapping
granularities

Supports VC-3, VC3-Xv (X2), VC-4 and VC4-Xv (X8)


granularities.
NOTE
VC-3 virtual concatenation on the SDH side supports only one or two VC-3s.
In addition, only the first two VC-3 timeslots of the first VC-4 in the first
STM-4 frame of each VCTRUNK can be used.

Encapsulation
format

Supports the GFP-F and LAPS protocols.

EPL services

Supports the PORT-based transparent transmission.

EVPL services

l Supports EVPL services. The frame format can be Ethernet II,


IEEE 802.3, IEEE 802.1q TAG, or MPLS Martini.
l Supports the MPLS encapsulation and forwarding based on PORT
or PORT+VLAN.
l Supports five types of LSPs, including ingress LSP, egress LSP,
transit LSP, RPR ingress LSP, and RPR transit LSP.
l Supports a maximum of 512 LSPs.

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Function and
Feature

EGR2

EVPLAN services

l Supports EVPLAN services that use the stack VLAN


encapsulation.
l Supports the self-learning of the source MAC address. The
capacity of the MAC address table in the N2 functional version is
64K. The aging time of the MAC address can be set and queried.
l Supports the blacklist that can contain 4K records and also the
static MAC address table that can contain 4K records. The sum of
the number of records in the blacklist and the number of addresses
in the static MAC address table must not exceed 4K.
l Supports the configuration of the static MAC routes. A maximum
of 4K static MAC routes can be configured.
l Supports data isolation based on VB+VLAN.
l Supports the creation, deletion, and query of the VB. The
maximum number of supported VBs is 16. The maximum number
of logical ports for each VB is 32.
l Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge.

MPLS

Supports MartinioE.

Stack VLAN

Supports the stack VLAN.

VLAN

l Supports 4096 VLAN tags, and the addition, deletion, and


exchanging of VLAN tags in compliance with IEEE 802.1q/p.
l Supports the replacement of VLAN tags in Ethernet signal frames.

Link aggregation
function

Supports the aggregation of the links of two GE ports.

RPR

l Supports the RPR feature that complies with IEEE 802.17.


l Supports a maximum of 255 nodes on the ring network, and
supports stripping at the destination node and weighted fairness
algorithm.
l Supports five priority levels, including A0, A1, B_EIR, B_CIR,
and C, and supports automatic discovery of topologies, which can
display the network status in real time.
l Supports three protection modes, including Steering, Wrapping,
and Wrapping+Steering. Hence, the signal failure time is less than
50 ms.
l Supports the manual configuration of routes for the services on the
RPR ring network.
l Supports the self-learning of routes on the ring, that is, supports
the learning of mapping between MAC addresses and node
numbers.

RSTP

Issue 03 (2013-02-20)

Supports the broadcast packet suppression and RSTP, which comply


with IEEE 802.1w.

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Function and
Feature

EGR2

IGMP snooping

Supports the IGMP snooping function.

QoS

l Supports the CAR. The granularity is 64 kbit/s.

14 RPR Boards

l Supports the flow classification based on PORT, PORT+VLAN


ID, or PORT+VLAN ID+VLAN PRI.
LCAS function

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT function

Supports the P2MP LPT.

Flow control
function

Supports the port-based flow control function that complies with


IEEE 802.3x.

IEEE 1588v2

Not supported.

Echo test frames

Supports the echo function specified in the RPR OAM function, which
is used to test the connectivity of the link.

Port mirroring

Does not support port mirroring.

Loopback function

Supports inloops on Ethernet ports (at the PHY layer or MAC layer).

Protection schemes

Supports the following protection schemes at the Ethernet network


level:
l STP/RSTP
l LCAS
l LPT
l LAG

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Ethernet
performance
monitoring

Supports Ethernet performance monitoring at the port level.

Alarms and
performance events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Warm resets

EGR2 boards support warm resets. If a warm reset is performed on


an EGR2 board, traffic on the board is interrupted.

Cold resets

Supported

Weighted fairness
algorithm

Supports the weighted fairness algorithm.

Automatic discovery
of topologies

Supports the automatic discovery of topologies.

Maximum number of
supported nodes

255

Service priority
levels

Supports A0, A1, B_CIR, B_EIR, and C.

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14.1.4 Working Principle and Signal Flow


The EGR2 consists of the Ethernet access module, network processor module, RPR protocol
processing module, mapping module, interface converting module, logic and control module,
clock module, and power module.
Figure 14-2 shows the functional block diagram of the EGR2 by describing how to process
1xGE/FE signals.
Figure 14-2 Functional block diagram of the EGR2
Backplane

RPR protocol
processing module

Logic and
control module

Cross-connect unit

Cross-connect unit

Mapping module

Laser shutdown
LOS

Interface
converting
module

VCP

RPR
MAC
(west)

DENCP

Network processor module

RPR
MAC
(east)

ENCP

Control
Network signal Switch
processor
fabric
Data

GE/FE Ethernet
access
module

Communication

SCC unit

Reference clock and frame header

50 MHz
77 MHz
125 MHz Clock module
100 MHz

+3.3 V
Power
module

Power
module

Fuse
Fuse

Cross-connect unit

-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

RPR: resilient package ring

Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or routers
are converted into electrical signals. If the signals are accessed through electrical interfaces, O/
E conversion is not required. At the PHY layer, the electrical signals are decoded and the
ETH_LOS alarm is detected. The electrical signals are converted from serial signals into parallel
signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module


The network processor module consists of the network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check, and Ethernet performance statistics.
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After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The following formats are supported:
l

MPLS

L2 MPLS VPN

Ethernet/VLAN

In the receive direction, services are mapped and forwarded after the Tunnel and VC tags are
added according to the service configuration. In the transmit direction, the Tunnel or VC tag is
extracted based on the level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module supports the following functions:
l

Flow sense and flow classification

Unicast, multicast, and broadcast of the flow

Setting of data priorities

WFQ

Four CoSs

RPR Protocol Processing Module


The RPR implements the weighted fairness algorithm and statistical multiplexing for the ring
bandwidth. In addition, the RPR provides protection switching schemes. By using the RPR
protocol and RPR weighted fairness algorithm, the RPR protocol processing module controls
the bandwidth of each node accessed by the ring network. In addition, the RPR ring has the
features of spatial reuse and statistical multiplexing. Hence, the bandwidth utilization is
improved.
Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol for
topology auto-discovery provides correct and reliable ways of discovering topologies of all
nodes and changes occurring on these topologies.
RPR unicast frames are striped at the destination node and thus the bandwidth on the ring is
reused spatially.
The RPR ring supports a maximum of 255 nodes.

Mapping Module
The mapping module performs encapsulation and mapping functions.
In the upstream direction, virtual concatenation services support the LCAS function. The
encapsulation formats are LAPS and GFP-F.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the RPR protocol processing module in packets.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.
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Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and HDLC
controller. This module is connected to external circuits through the bus. The logic and control
module performs the following functions:
l

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:
l

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

Clock Module
The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 100 MHz.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

14.1.5 Front Panel


The front panel of the EGR2 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 14-3 shows the appearance of the front panel of the EGR2.

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Figure 14-3 Front panel of the EGR2

EGR2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2
CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2

EGR2

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 24 Indicators.

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Interfaces
The front panel of the EGR2 has two optical interfaces. Table 14-2 describes the types and usage
of the optical interfaces of the EGR2.
Table 14-2 Optical interfaces of the EGR2
Interface

Type of Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/


VX signals.

OUT2/IN2

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/


VX signals.

14.1.6 Jumpers and DIP Switches


The EGR2 does not have any jumpers or DIP switches that are used for board settings.

14.1.7 Valid Slots


The EGR2 must be installed in a valid slot in the subrack. Otherwise, the EGR2 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The EGR2 can be installed in slots 18 and 1116 in the subrack. The relationship between the
slots valid for the EGR2 and the bandwidth is as follows:
l

When the cross-connect capacity is 200 Gbit/s, the EGR2 can be installed in slots 18 and
1116. When the EGR2 is installed in slots 14, 15, and 16, the bandwidth is 1.25 Gbit/s.
When the EGR2 is installed in slots 58 and 1114, the bandwidth is 2.5 Gbit/s.

14.1.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the EGR2 indicates the type of optical interface.
Table 14-3 provides the relationship between the feature code of the EGR2 and the type of
optical interface.
Table 14-3 Relationship between the feature code of the EGR2 and the type of optical interface

Issue 03 (2013-02-20)

Board

Feature Code

Type of Optical Interface

SSN2EGR210

10

1000BASE-SX (0.5 km)

SSN2EGR211

11

1000BASE-LX (10 km)

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Board

Feature Code

Type of Optical Interface

SSN2EGR212

12

1000BASE-VX (40 km)

SSN2EGR213

13

1000BASE-ZX (80 km)

14.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring Ethernet Services.
Step 3 Required: Set the Ethernet interface.
l Set the overhead byte as follows:
J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.
l Set the Ethernet interface as follows:
Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.
Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of
traffic, services may be completely interrupted.
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For details, see 28.7 Checking Board Parameters.


NOTE

For more information about the parameters of the board, see 27.4.2 Ethernet Parameters.

Step 4 Optional: Configure the L2 switching management service. Perform the following tasks:
l Enabling the IGMP Snooping Protocol
l Configuring the Spanning Tree
l Setting the Aging Time for the Multicast Router Port
Step 5 Optional: Configure the QoS. For details, see Configuring QoS.
Step 6 Optional: Configure the aggregation function for the Ethernet port. For details, see Creating a
LAG.
----End

Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

14.1.10 Configuring the Board Functions


The EGR2 supports multiple Ethernet functions and features such as Layer 2 switching and
LCAS. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EGR2 by using the U2000:
l

STP/RSTP

LCAS

LPT

LAG

Test Frame

IGMP Snooping

14.1.11 Parameter Settings


You can set parameters for the EGR2 by using the U2000.
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You can set the following main parameters for the EGR2 by using the U2000:
l

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

14.1.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 14-4 lists the faults that occur on the EGR2 frequently and the troubleshooting methods.
Table 14-4 Methods used to troubleshoot the faults that occur on the EGR2 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on a single


Ethernet port are interrupted.
l The services on all the Ethernet
ports are interrupted.
Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The services on a single


Ethernet port are transiently
interrupted.
l The protocol becomes
abnormal.
Packet loss

Bit errors occur on the line side.

See Troubleshooting Service


Packet Loss.

Interconnection
fault

l The interconnection fault


occurs on a single Ethernet port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCG port.
l The LCAS interconnection
fault occurs.

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Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EGR2, see Replacing an EOS Board.

14.1.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

14.1.13.1 Alarms of N2EGR2

Issue 03 (2013-02-20)

AU_AIS

AU_LOP

B3_EXC_VC3

B3_EXC_VC4

B3_SD_VC3

B3_SD_VC4

BD_STATUS

COMMUN_FAIL

ETH_LOS

FCS_ERR

FPGA_ABN

HARD_BAD

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

LAG_FAIL

LCAS_BAND_DECREASED

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC3

LP_REI_VC3

LP_SLM_VC3

LP_TIM_VC3

LP_UNEQ_VC3

LSR_NO_FITED

NO_BD_SOFT

RPR_DUPLICATE_MAC

RPR_ECHO_DLOC

RPR_ECHO_LOC

RPR_MISCONFIG

RPR_NB_INCONSIS

RPR_PM_INCONSIS

RPR_PS_CHANGE

RPR_STATIONS_EXCEED

RPR_SUM_A0_EXCEED

SLAVE_WORKING

T_LOS

TU_AIS_VC3

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC3

VCAT_LOM_VC4

LASER_MOD_ERR

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

LINK_ERR

LPT_RFI

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

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14.1.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

14.1.14.1 Performance Events of N2EGR2


Table 14-5 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

Table 14-6 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

rprSpanErrorUnavailableSeconds

rprSpanErrorTtlExpFrames

rprSpanErrorTooLongFrames

rprSpanErrorTooShortFrames

rprSpanErrorBadHecFrames

rprSpanErrorBadFcsFrames

rprSpanErrorSelfSrcUcastFrames

rprSpanErrorPmdAbortFrames

rprSpanErrorBadAddrFrames

rprSpanErrorBadParityFrames

rprSpanErrorContainedFrames

rprSpanErrorBadDataFcsFrames

rprSpanErrorBadCtrlFcsFrames

rprSpanErrorScffErrors

rprSpanErrorErroredSeconds

rprSpanErrorSeverelyErroredSeconds

Table 14-7 Statistics of RMON basic performance

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Packets Received(64 Octets


in Length)(packets/s)

Packets Received(65~127
Octets in Length)(packets/s)

Packets Received(512~1023
Octets in Length)(packets/s)

Packets Received(256~511
Octets in Length)(packets/s)

Packets Received(128~255
Octets in Length)(packets/s)

Packets Received
(1024~1518 Octets in
Length)(packets/s)

Multicast Packets Received


(packets/s)

Broadcast Packets Received


(packets/s)

Drop Events(times/s)

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Undersize Packets Received


(packets/s)

Oversize Packets Received


(packets/s)

Fragments(packets/s)

Jabbers(packets/s)

Collisions(times/s)

Octets Received(Byte/s)

Packets Received(packets/
s)

Table 14-8 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)(packets/s)

Packets Transmitted(65~127
Octets in Length)(packets/s)

Packets Transmitted
(128~255 Octets in Length)
(packets/s)

Packets Transmitted
(256~511 Octets in Length)
(packets/s)

Packets Transmitted
(512~1023 Octets in Length)
(packets/s)

Packets Transmitted
(1024~1518 Octets in Length)
(packets/s)

Unicast Packets Received


(packets/s)

Unicast Packets Transmitted


(packets/s)

Multicast Packets
Transmitted(packets/s)

Broadcast Packets
Transmitted(packets/s)

Good Octets Transmitted


(Byte/s)

Alignment Errors(frames/s)

FCS Errors(frames/s)

Table 14-9 Statistics of RMON VCG performance (receive frame count at Span side)
rprSpanRxUcastClassAFrames(frames/s)

rprSpanRxUcastClassABytes(Byte/s)

rprSpanRxUcastClassBCirFrames(frames/s)

rprSpanRxUcastClassBCirBytes(Byte/s)

rprSpanRxUcastClassBEirFrames(frames/s)

rprSpanRxUcastClassBEirBytes(Byte/s)

rprSpanRxUcastClassCFrames(frames/s)

rprSpanRxUcastClassCBytes(Byte/s)

rprSpanRxMcastClassAFrames(frames/s)

rprSpanRxMcastClassABytes(Byte/s)

rprSpanRxMcastClassBCirFrames(frames/s)

rprSpanRxMcastClassBCirBytes(Byte/s)

rprSpanRxMcastClassBEirFrames(frames/s)

rprSpanRxMcastClassBEirBytes(Byte/s)

rprSpanRxMcastClassCFrames(frames/s)

rprSpanRxMcastClassCBytes(Byte/s)

Table 14-10 Statistics of RMON VCG performance (transmit frame count at Span side)
rprSpanTxUcastClassAFrames(frames/s)
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rprSpanTxUcastClassABytes(Byte/s)

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rprSpanTxUcastClassBCirBytes(Byte/s)

rprSpanTxUcastClassBEirFrames(frames/s)

rprSpanTxUcastClassBEirBytes(Byte/s)

rprSpanTxUcastClassCFrames(frames/s)

rprSpanTxUcastClassCBytes(Byte/s)

rprSpanTxMcastClassAFrames(frames/s)

rprSpanTxMcastClassABytes(Byte/s)

rprSpanTxMcastClassBCirFrames(frames/s)

rprSpanTxMcastClassBCirBytes(Byte/s)

rprSpanTxMcastClassBEirFrames(frames/s)

rprSpanTxMcastClassBEirBytes(Byte/s)

rprSpanTxMcastClassCFrames(frames/s)

rprSpanTxMcastClassCBytes(Byte/s)

Table 14-11 Statistics of RMON VCG performance (count of control layer frames)
rprSpanTxCtrlFrames
(frames/s)

rprSpanTxOamEchoFrames
(frames/s)

rprSpanTxOamFlushFrames
(frames/s)

rprSpanTxOamOrgFrames
(frames/s)

rprSpanTxTopoAtdFrames
(frames/s)

rprSpanTxTopoChkSumFrames(frames/s)

rprSpanTxTopoTpFrames
(frames/s)

rprSpanRxCtrlFrames
(frames/s)

rprSpanRxOamEchoFrames
(frames/s)

rprSpanRxOamFlushFrames
(frames/s)

rprSpanRxOamOrgFrames
(frames/s)

rprSpanRxTopoAtdFrames
(frames/s)

rprSpanRxTopoChkSumFrames(frames/s)

rprSpanRxTopoTpFrames
(frames/s)

Table 14-12 Statistics of RMON VCG performance (frames received by Client)

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rprClientTxUcastClassAFrames(frames/s)

rprClientTxUcastClassABytes(Byte/s)

rprClientTxUcastClassBCirFrames(frames/s)

rprClientTxUcastClassBCirBytes(Byte/s)

rprClientTxUcastClassBEirFrames(frames/s)

rprClientTxUcastClassBEirBytes(Byte/s)

rprClientTxUcastClassCFrames(frames/s)

rprClientTxUcastClassCBytes(Byte/s)

rprClientTxMcastClassAFrames(frames/s)

rprClientTxMcastClassABytes(Byte/s)

rprClientTxMcastClassBCirFrames(frames/s)

rprClientTxMcastClassBCirBytes(Byte/s)

rprClientTxMcastClassBEirFrames(frames/s)

rprClientTxMcastClassBEirBytes(Byte/s)

rprClientTxMcastClassCFrames(frames/s)

rprClientTxMcastClassCBytes(Byte/s)

rprClientTxBcastFrames
(frames/s)

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Table 14-13 Statistics of RMON VCG performance (frames transmitted by client)


rprClientRxUcastClassAFrames(frames/s)

rprClientRxUcastClassABytes(Byte/s)

rprClientRxUcastClassBCirFrames(frames/s)

rprClientRxUcastClassBCirBytes(Byte/s)

rprClientRxUcastClassBEirFrames(frames/s)

rprClientRxUcastClassBEirBytes(Byte/s)

rprClientRxUcastClassCFrames(frames/s)

rprClientRxUcastClassCBytes(Byte/s)

rprClientRxMcastClassAFrames(frames/s)

rprClientRxMcastClassABytes(Byte/s)

rprClientRxMcastClassBCirFrames(frames/s)

rprClientRxMcastClassBCirBytes(Byte/s)

rprClientRxMcastClassBEirFrames(frames/s)

rprClientRxMcastClassBEirBytes(Byte/s)

rprClientRxMcastClassCFrames(frames/s)

rprClientRxMcastClassCBytes(Byte/s)

rprClientRxBcastFrames
(frames/s)

Table 14-14 Statistics of RMON VCG performance (count of error frames)


rprSpanErrorTtlExpFrames
(frames/s)

rprSpanErrorTooLongFrames(frames/s)

rprSpanErrorTooShortFrames(frames/s)

rprSpanErrorBadHecFrames
(frames/s)

rprSpanErrorBadFcsFrames
(frames/s)

rprSpanErrorSelfSrcUcastFrames(frames/s)

rprSpanErrorPmdAbortFrames(frames/s)

rprSpanErrorBadAddrFrames(frames/s)

rprSpanErrorBadParityFrames(frames/s)

rprSpanErrorContainedFrames(frames/s)

rprSpanErrorBadDataFcsFrames(frames/s)

rprSpanErrorBadCtrlFcsFrames(frames/s)

rprSpanErrorScffErrors
(frames/s)

rprSpanErrorErroredSeconds(seconds/s)

rprSpanErrorSeverelyErroredSeconds(seconds/s)

rprSpanErrorUnavailableSeconds(seconds/s)

14.1.15 Technical Specifications


The technical specifications of the EGR2 include the parameters specified for optical interfaces,
laser safety class, Ethernet performance specifications, mechanical specifications, and power
consumption.

Parameters Specified for Optical Interfaces


Table 14-15 lists the parameters specified for the optical interfaces of the EGR2.

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Table 14-15 Parameters specified for the optical interfaces of the EGR2
Parameter

Value

Type of optical
interface

1000BASE-ZX
(80 km)

1000BASEVX (40 km)

1000BASELX (10 km)

1000BASE-SX
(0.5 km)

Type of fiber

Single-mode LC

Single-mode
LC

Single-mode
LC

Multi-mode LC

Launched optical
power range
(dBm)

-2 to 5

-5 to 0

-9 to -3

-9.5 to -2.5

Operating
wavelength range
(nm)

1500 to 1580

1275 to 1350

1270 to 1355

770 to 860

Minimum
overload (dBm)

-3

-3

-3

Receiver
sensitivity (dBm)

-23

-23

-20

-17

Minimum
extinction ratio
(dB)

Maximum -20 dB
spectral width
(nm)

30

Minimum side
30
mode suppression
ratio (dB)

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Ethernet Performance Specifications


NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EGR2 board of the N2 version.

Figure 14-4 shows the connection for testing the throughput specifications, packet loss ratio in
the case of overloading, latency specifications, and back-to-back specifications of the EGR2.

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Figure 14-4 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, latency specifications, and back-to-back specifications
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 14-16 lists the throughput specifications of the EGR2. Table 14-17 lists the packet loss
ratio in the case of overloading of the EGR2. Table 14-18 lists the latency specifications of the
EGR2. Table 14-19 lists the back-to-back specifications of the EGR2.
NOTE

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual environment
are used.

The specifications in the following tables are obtained in the following scenario: EVPL bidirectional
unicast services are configured and eight VC-4s are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 14-16 lists the throughput specifications of the EGR2. The values are obtained when the
SmartApplication is set as follows:
l

Test duration (sec): 3

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 90.00

Maximum rate (%): 100.00

Resolution rate (%): 1.00

Mode: bidirectional

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Table 14-16 Throughput specifications of the EGR2


Frame Size
(Byte)

Passed Rate
(%)

(01,08,01) to
(01,08,02) (pks/
sec)

(01,08,02) to
(01,08,01) (pks/
sec)

Total (pks/
sec)

64

80.77

1201923

1201923

2403846

128

94.87

801282

801282

1602564

256

100.00

452899

452899

905798

512

100.00

234962

234962

469924

1024

100.00

119732

119732

239464

1280

100.00

196154

96154

192308

1518

100.00

81274

81274

162548

Table 14-17 lists the packet loss ratio in the case of overloading of the EGR2. The values are
obtained when the SmartApplication is set as follows:
l

Test duration (sec): 4

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Table 14-17 Packet loss ratio in the case of overloading of the EGR2

Issue 03 (2013-02-20)

Frame Size
(Byte)

Rate Tested
(%)

(01,08,01) to
(01,08,02) (%)

(01,08,02) to
(01,08,01) (%)

Average (%)

64

100.00

16.719

16.720

16.719

128

100.00

4.315

4.328

4.321

256

100.00

0.000

0.000

0.000

512

100.00

0.000

0.000

0.000

1024

100.00

0.000

0.000

0.000

1280

100.00

0.000

0.000

0.000

1518

100.00

0.000

0.000

0.000

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Table 14-18 lists the latency specifications of the EGR2. The values are obtained when the
SmartApplication is set as follows:
l

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the equipment and the
time when the first bit of the transmitted frame reaches the input port of the equipment. In
store forward mode, the analyzer calculates the difference between the time when the first
bit of the transmitted frame reaches the output port of the equipment and the time when the
last bit of the transmitted frame reaches the input port of the equipment. In the table, the
CT values are obtained in cut through mode and the S&F values are obtained in store
forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Test duration (sec): 4

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 80.77

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Table 14-18 Latency specifications of the EGR2


Frame
Size
(Byte)

Rate
Tested
(%)

(01,08,01) to
(01,08,02) (us)CT (us)

Average
(CT) (us)

(01,08,01) to
(01,08,02)
(us)-S&F (us)

Average
(S&F) (us)

64

80.77

117.8

117.8

117.3

117.3

128

94.87

121.2

121.2

120.2

120.2

256

100.00

126.6

126.6

124.6

124.6

512

100.00

137.7

137.7

133.7

133.7

1024

100.00

159.9

159.9

151.8

151.8

1280

100.00

170.2

170.2

160.0

160.0

1518

100.00

182.9

182.9

170.8

170.8

Table 14-19 lists the back-to-back specifications of the EGR2. The values are obtained when
the SmartApplication is set as follows:
l

Test duration (sec): 2

Minimum frame size (byte): 64

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Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

14 RPR Boards

Table 14-19 Back-to-back specifications of the EGR2


Frame Size
(Byte)

Rate Tested
(%)

(01,08,01) to
(01,08,02) Burst
Size (Number of
Frames)

(01,08,02) to
(01,08,01)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

298

300

598

128

100.00

650

650

1300

256

100.00

905798

905798

1811596

512

100.00

469924

469924

939848

1024

100.00

239464

239464

478928

1280

100.00

192308

192308

384616

1518

100.00

162548

162548

325096

Mechanical Specifications
The mechanical specifications of the EGR2 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.1

Power Consumption
The maximum power consumption of the EGR2 at room temperature (25C) is 40 W.

14.2 EMR0
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EMR0 (12xFE and 1xGE ring processing board). This topic also
describes how to configure and commission the EMR0.

14.2.1 Version Description


The EMR0 is available in one functional version, namely, N2.

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14.2.2 Application
The EMR0 is used to transmit/receive Ethernet services, manage bandwidths, and realize Layer
2 switching of Ethernet services.
Figure 14-5 shows the typical networking and application of the RPR board. The RPR board
accesses and converges Ethernet services, and provides the Ethernet data with the following data
features: Layer 2 switching, port isolation, flow classification, traffic control, VLAN
management, and priority configuration. In addition, the RPR board performs encapsulation/
decapsulation, virtual concatenation, and SDH mapping/demapping for data. The RPR board
can be interconnected with the bandwidth access equipment and the data communication
equipment at the same time, thus to provide a network-level solution.
NOTE

When the service converging FE services into GE services is configured, the GE switching board can be
set to the 1000M full-duplex mode or auto-negotiation mode, the VLAN of the convergence service is
variable, and the binding granularity is at the VC-3 or VC-4 level.

Figure 14-5 Networking and application of the RPR board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

14.2.3 Functions and Features


The EMR0 supports the Layer 2 switching, port aggregation, and RPR functions.
Table 14-20 provides the functions and features of the EMR0.

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Table 14-20 Functions and features of the EMR0


Function and
Feature

EMR0

Basic functions

Transmits/Receives and processes 12xFE services and 1xGE


services.
Supports the RPR feature.

Functions when
being used with the
interface board

l Supports four FE ports and one GE port.


l Transmits/Receives 12xFE signals through the electrical interface
when the EMR0 is used with the ETF8.
l Transmits/Receives 8xFE signals through the optical interface
when the EMR0 is used with the EFF8.

Specifications of the
optical interface

l Supports 10BASE-T/100BASE-TX signals when the EMR0 is


used with the ETF8. The maximum transmission distance is 100
m.
l Supports 100BASE-FX signals in compliance with IEEE 802.3u
when the EMR0 is used with the EFF8.

Format of service
frames

l Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG formats.
l Supports the setting of the packet length, which ranges from 1518
bytes to 9600 bytes.
l Supports the Jumbo frame with a length less than 9600 bytes.

Maximum uplink
bandwidth

2.5 Gbit/s
The EMR0 can adapt to the bandwidth of the slot.

Mapping
granularities

Supports VC-3, VC3-Xv (X2), VC-4 and VC4-Xv (X8)


granularities.
NOTE
VC-3 virtual concatenation on the SDH side supports only one or two VC-3s.
In addition, only the first two VC-3 timeslots of the first VC-4 in the first
STM-4 frame of each VCTRUNK can be used.

Encapsulation format

Supports the GFP-F and LAPS protocols.

EPL services

Supports the PORT-based transparent transmission.

EVPL services

l Supports EVPL services. The frame format can be Ethernet II,


IEEE 802.3, IEEE 802.1q TAG, or MPLS Martini.
l Supports the MPLS encapsulation and forwarding based on PORT
or PORT+VLAN.
l Supports five types of LSPs, including ingress LSP, egress LSP,
transit LSP, RPR ingress LSP, and RPR transit LSP.
l Supports a maximum of 512 LSPs.

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Function and
Feature

EMR0

EVPLAN services

l Supports EVPLAN services that use the stack VLAN


encapsulation.
l Supports the self-learning of the source MAC address. The
capacity of the MAC address table in the N2 functional version is
64K. The capacity of the MAC address table in the N1 functional
version is 16K. The aging time of the MAC address can be set and
queried.
l Supports the blacklist that can contain 4K records and also the
static MAC address table that can contain 4K records. The sum of
the number of records in the blacklist and the number of addresses
in the static MAC address table must not exceed 4K.
l Supports the configuration of the static MAC routes. A maximum
of 4K static MAC routes can be configured.
l Supports data isolation based on VB+VLAN.
l Supports the creation, deletion, and query of the VB. The
maximum number of VBs supported by the N2EMR0 is 16. The
maximum number of logical ports for each VB is 32.
l Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge.

MPLS

Supports MartinioE.

Stack VLAN

Supports the stack VLAN.

VLAN

l Supports 4096 VLAN tags, and the addition, deletion, and


exchanging of VLAN tags in compliance with IEEE 802.1q/p.
l Supports the replacement of VLAN tags in Ethernet signal frames.

Link aggregation
function

Supports the aggregation of the links of a maximum of eight FE ports.

RPR

l Supports the RPR feature that complies with IEEE 802.17.


l Supports a maximum of 255 nodes on the ring network, and
supports stripping at the destination node and weighted fairness
algorithm.
l Supports five priority levels, including A0, A1, B_EIR, B_CIR,
and C, and supports automatic discovery of topologies, which can
display the network status in real time.
l Supports three protection modes, including Steering, Wrapping,
and Wrapping+Steering. Hence, the signal failure time is less than
50 ms.
l Supports the self-learning of routes on the ring, that is, supports
the learning of mapping between MAC addresses and node
numbers.
l The N2EMR0 supports the manual configuration of routes for the
services on the RPR ring network.

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Function and
Feature

EMR0

RSTP

Supports the broadcast packet suppression and RSTP, which comply


with IEEE 802.1w.

IGMP snooping

Supports the IGMP snooping function.

QoS function

l Supports the CAR. The granularity is 64 kbit/s.


l The N2EMR0 supports the flow classification based on PORT,
PORT+VLAN ID, or PORT+VLAN ID+VLAN PRI.

LCAS function

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

Flow control function

Supports the port-based flow control function that complies with


IEEE 802.3x.

Echo test frames

Supports the echo function specified in the RPR OAM function,


which is used to test the connectivity of the link.

Loopback function

Supports inloops on Ethernet ports (at the PHY layer or MAC layer).

Protection schemes

Supports the following protection schemes at the Ethernet network


level:
l STP/RSTP
l LCAS
l LAG

Ethernet
performance
monitoring

Supports Ethernet performance monitoring at the port level.

Alarms and
performance events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Warm resets

EMR0 boards support warm resets. If a warm reset is performed on


an EMR0 board, traffic on the board is interrupted.

Cold resets

Supported

Weighted fairness
algorithm

Supports the weighted fairness algorithm.

Automatic discovery
of topologies

Supports the automatic discovery of topologies.

Maximum number of 255


supported nodes
Service priority
levels

Issue 03 (2013-02-20)

Supports A0, A1, B_CIR, B_EIR, and C.

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14.2.4 Working Principle and Signal Flow


The EMR0 consists of the Ethernet access module, network processor module, RPR protocol
processing module, mapping module, interface converting module, logic and control module,
clock module, and power module.
Figure 14-6 shows the functional block diagram of the EMR0 by describing how to process
1xGE/FE signals.
Figure 14-6 Functional block diagram of the EMR0
Backplane

RPR protocol
processing module

Logic and
control module

Cross-connect unit

Cross-connect unit

Mapping module

Laser shutdown
LOS

Interface
converting
module

VCP

RPR
MAC
(west)

DENCP

Network processor module

RPR
MAC
(east)

ENCP

Control
Network signal Switch
processor
fabric
Data

GE/FE Ethernet
access
module

Communication

SCC unit

Reference clock and frame header

50 MHz
77 MHz
125 MHz Clock module
100 MHz

+3.3 V
Power
module

Power
module

Fuse
Fuse

Cross-connect unit

-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

RPR: resilient package ring

Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or routers
are converted into electrical signals. If the signals are accessed through electrical interfaces, O/
E conversion is not required. At the PHY layer, the electrical signals are decoded and the
ETH_LOS alarm is detected. The electrical signals are converted from serial signals into parallel
signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module


The network processor module consists of the network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The following formats are supported:
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MPLS

L2 MPLS VPN

Ethernet/VLAN

14 RPR Boards

In the receive direction, services are mapped and forwarded after the Tunnel and VC tags are
added according to the service configuration. In the transmit direction, the Tunnel or VC tag is
extracted based on the level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module supports the following functions:
l

Flow sense and flow classification

Unicast, multicast, and broadcast of the flow

Setting of data priorities

WFQ

Four CoSs

RPR Protocol Processing Module


The RPR implements the weighted fairness algorithm and statistical multiplexing for the ring
bandwidth. In addition, the RPR provides protection switching schemes. By using the RPR
protocol and RPR weighted fairness algorithm, the RPR protocol processing module controls
the bandwidth of each node accessed by the ring network. In addition, the RPR ring has the
features of spatial reuse and statistical multiplexing. Hence, the bandwidth utilization is
improved.
Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol for
topology auto-discovery provides correct and reliable ways of discovering topologies of all
nodes and changes occurring on these topologies.
RPR unicast frames are striped at the destination node and thus the bandwidth on the ring is
reused spatially.
The RPR ring supports a maximum of 255 nodes.

Mapping Module
The mapping module performs encapsulation and mapping functions.
In the upstream direction, virtual concatenation services support the LCAS function. The
encapsulation formats are LAPS and GFP-F.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the RPR protocol processing module in packets.

Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into the
parallel bus. The high-rate backplane interface is connected to the low-rate interface chip of the
transmit system through the interface converting module.

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Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and HDLC
controller. This module is connected to external circuits through the bus. The logic and control
module performs the following functions:
l

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:
l

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

Clock Module
The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 100 MHz.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

14.2.5 Front Panel


The front panel of the EMR0 has indicators, interfaces, a bar code, and a laser safety class label.

Diagram of the Front Panel


Figure 14-7 shows the appearance of the front panel of the EMR0.

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Figure 14-7 Front panel of the EMR0

EMR0
STAT
ACT
PROG
SRV
LINK
ACT

CLASS 1
LASER
PRODUCT

OUT1
IN1
FE1

FE2

FE3

FE4

EMR0

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 24 Indicators.

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Interfaces
The front panel of the EMR0 has five interfaces. Table 14-21 describes the types and usage of
the interfaces of EMR0.
Table 14-21 Interfaces of the EMR0
Interface

Type of
Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX


signals.

FE1

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE2

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE3

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE4

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

14.2.6 Jumpers and DIP Switches


The EMR0 does not have any jumpers or DIP switches that are used for board settings.

14.2.7 Valid Slots


The EMR0 must be installed in a valid slot in the subrack. Otherwise, the EMR0 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The EMR0 can be used with the ETF8 and EFF8.


The slots valid for the EMR0 are as follows:
l

When the cross-connect capacity is 200 Gbit/s, the EMR0 can be installed in slots 16 and
1316. When the EMR0 is installed in slots 14, 15, and 16, the bandwidth is 1.25 Gbit/s.
When the EMR0 is installed in slots 5, 6, 13, and 14, the bandwidth is 2.5 Gbit/s.

Table 14-22 lists the slots valid for the EMR0 and the corresponding slots for the ETF8 and
EFF8.

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Table 14-22 Slots valid for the EMR0 and the corresponding slots for the ETF8 and EFF8
Slot Valid for the EMR0

Corresponding Slot for the ETF8 and EFF8

Slot 1

Without an interface board

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 6

Without an interface board

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

14.2.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the EMR0 indicates the type of optical interface.
Table 14-23 provides the relationship between the feature code of the EMR0 and the type of
optical interface.
Table 14-23 Relationship between the feature code of the EMR0 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN2EMR010

10

1000BASE-SX (0.5 km)

SSN2EMR011

11

1000BASE-LX (10 km)

SSN2EMR012

12

1000BASE-VX (40 km)

SSN2EMR013

13

1000BASE-ZX (80 km)

14.2.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
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l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring Ethernet Services.
Step 3 Required: Set the Ethernet interface.
l Set the overhead byte as follows:
J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.
l Set the Ethernet interface as follows:
Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.
Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same working mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume of
traffic, services may be completely interrupted.
For details, see 28.7 Checking Board Parameters.
NOTE

For more information about the parameters of the board, see 27.4.2 Ethernet Parameters.

Step 4 Optional: Configure the L2 switching management service. Perform the following tasks:
l Enabling the IGMP Snooping Protocol
l Configuring the Spanning Tree
l Setting the Aging Time for the Multicast Router Port
Step 5 Optional: Configure the QoS. For details, see Configuring QoS.
Step 6 Optional: Configure the aggregation function for the Ethernet port. For details, see Creating a
LAG.
----End
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Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

14.2.10 Configuring the Board Functions


The EMR0 supports multiple Ethernet functions and features such as Layer 2 switching and
LCAS. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EMR0 by using the U2000:
l

STP/RSTP

LCAS

LAG

Test Frame

IGMP Snooping

14.2.11 Parameter Settings


You can set parameters for the EMR0 by using the U2000.
You can set the following main parameters for the EMR0 by using the U2000:
l

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 27 Parameter
Settings.

14.2.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.
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Troubleshooting
Table 14-24 lists the faults that occur on the EMR0 frequently and the troubleshooting methods.
Table 14-24 Methods used to troubleshoot the faults that occur on the EMR0 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on a single


Ethernet port are interrupted.
l The services on all the Ethernet
ports are interrupted.
Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The services on a single


Ethernet port are transiently
interrupted.
l The protocol becomes
abnormal.
Packet loss

Bit errors occur on the line side.

See Troubleshooting Service


Packet Loss.

Interconnection
fault

l The interconnection fault


occurs on a single Ethernet port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCG port.
l The LCAS interconnection
fault occurs.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EMR0, see Replacing an EOS Board.

14.2.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

14.2.13.1 Alarms of N2EMR0


AU_AIS
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AU_LOP
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B3_EXC_VC4

B3_SD_VC3

B3_SD_VC4

BD_STATUS

COMMUN_FAIL

ETH_LOS

FCS_ERR

FPGA_ABN

HARD_BAD

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

LAG_FAIL

LCAS_BAND_DECREASED

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC3

LP_REI_VC3

LP_SLM_VC3

LP_TIM_VC3

LP_UNEQ_VC3

LSR_NO_FITED

NO_BD_SOFT

RPR_DUPLICATE_MAC

RPR_ECHO_DLOC

RPR_ECHO_LOC

RPR_MISCONFIG

RPR_NB_INCONSIS

RPR_PM_INCONSIS

RPR_PS_CHANGE

RPR_STATIONS_EXCEED

RPR_SUM_A0_EXCEED

SLAVE_WORKING

SUBCARD_ABN

T_LOS

TU_AIS_VC3

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC3

VCAT_LOM_VC4

LASER_MOD_ERR

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

ETH_NO_FLOW

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

14.2.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

14.2.14.1 Performance Events of N2EMR0


Table 14-25 SDH

Issue 03 (2013-02-20)

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

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Table 14-26 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

rprSpanErrorUnavailableSeconds

rprSpanErrorTtlExpFrames

rprSpanErrorTooLongFrames

rprSpanErrorTooShortFrames

rprSpanErrorBadHecFrames

rprSpanErrorBadFcsFrames

rprSpanErrorSelfSrcUcastFrames

rprSpanErrorPmdAbortFrames

rprSpanErrorBadAddrFrames

rprSpanErrorBadParityFrames

rprSpanErrorContainedFrames

rprSpanErrorBadDataFcsFrames

rprSpanErrorBadCtrlFcsFrames

rprSpanErrorScffErrors

rprSpanErrorErroredSeconds

rprSpanErrorSeverelyErroredSeconds

Table 14-27 Statistics of RMON basic performance


Packets Received(64 Octets
in Length)(packets/s)

Packets Received(65~127
Octets in Length)(packets/s)

Packets Received(512~1023
Octets in Length)(packets/s)

Packets Received(256~511
Octets in Length)(packets/s)

Packets Received(128~255
Octets in Length)(packets/s)

Packets Received
(1024~1518 Octets in
Length)(packets/s)

Multicast Packets Received


(packets/s)

Broadcast Packets Received


(packets/s)

Drop Events(times/s)

Undersize Packets Received


(packets/s)

Oversize Packets Received


(packets/s)

Fragments(packets/s)

Jabbers(packets/s)

Collisions(times/s)

Octets Received(Byte/s)

Packets Received(packets/
s)

Table 14-28 Statistics of RMON extended performance

Issue 03 (2013-02-20)

Packets Transmitted(64
Octets in Length)(packets/s)

Packets Transmitted(65~127
Octets in Length)(packets/s)

Packets Transmitted
(128~255 Octets in Length)
(packets/s)

Packets Transmitted
(256~511 Octets in Length)
(packets/s)

Packets Transmitted
(512~1023 Octets in Length)
(packets/s)

Packets Transmitted
(1024~1518 Octets in Length)
(packets/s)

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Unicast Packets Received


(packets/s)

Unicast Packets Transmitted


(packets/s)

Multicast Packets
Transmitted(packets/s)

Broadcast Packets
Transmitted(packets/s)

Good Octets Transmitted


(Byte/s)

Alignment Errors(frames/s)

FCS Errors(frames/s)

Table 14-29 Statistics of RMON VCG performance (receive frame count at Span side)
rprSpanRxUcastClassAFrames(frames/s)

rprSpanRxUcastClassABytes(Byte/s)

rprSpanRxUcastClassBCirFrames(frames/s)

rprSpanRxUcastClassBCirBytes(Byte/s)

rprSpanRxUcastClassBEirFrames(frames/s)

rprSpanRxUcastClassBEirBytes(Byte/s)

rprSpanRxUcastClassCFrames(frames/s)

rprSpanRxUcastClassCBytes(Byte/s)

rprSpanRxMcastClassAFrames(frames/s)

rprSpanRxMcastClassABytes(Byte/s)

rprSpanRxMcastClassBCirFrames(frames/s)

rprSpanRxMcastClassBCirBytes(Byte/s)

rprSpanRxMcastClassBEirFrames(frames/s)

rprSpanRxMcastClassBEirBytes(Byte/s)

rprSpanRxMcastClassCFrames(frames/s)

rprSpanRxMcastClassCBytes(Byte/s)

Table 14-30 Statistics of RMON VCG performance (transmit frame count at Span side)
rprSpanTxUcastClassAFrames(frames/s)

rprSpanTxUcastClassABytes(Byte/s)

rprSpanTxUcastClassBCirFrames(frames/s)

rprSpanTxUcastClassBCirBytes(Byte/s)

rprSpanTxUcastClassBEirFrames(frames/s)

rprSpanTxUcastClassBEirBytes(Byte/s)

rprSpanTxUcastClassCFrames(frames/s)

rprSpanTxUcastClassCBytes(Byte/s)

rprSpanTxMcastClassAFrames(frames/s)

rprSpanTxMcastClassABytes(Byte/s)

rprSpanTxMcastClassBCirFrames(frames/s)

rprSpanTxMcastClassBCirBytes(Byte/s)

rprSpanTxMcastClassBEirFrames(frames/s)

rprSpanTxMcastClassBEirBytes(Byte/s)

rprSpanTxMcastClassCFrames(frames/s)

rprSpanTxMcastClassCBytes(Byte/s)

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Table 14-31 Statistics of RMON VCG performance (count of control layer frames)
rprSpanTxCtrlFrames
(frames/s)

rprSpanTxOamEchoFrames
(frames/s)

rprSpanTxOamFlushFrames
(frames/s)

rprSpanTxOamOrgFrames
(frames/s)

rprSpanTxTopoAtdFrames
(frames/s)

rprSpanTxTopoChkSumFrames(frames/s)

rprSpanTxTopoTpFrames
(frames/s)

rprSpanRxCtrlFrames
(frames/s)

rprSpanRxOamEchoFrames
(frames/s)

rprSpanRxOamFlushFrames
(frames/s)

rprSpanRxOamOrgFrames
(frames/s)

rprSpanRxTopoAtdFrames
(frames/s)

rprSpanRxTopoChkSumFrames(frames/s)

rprSpanRxTopoTpFrames
(frames/s)

Table 14-32 Statistics of RMON VCG performance (frames received by Client)


rprClientTxUcastClassAFrames(frames/s)

rprClientTxUcastClassABytes(Byte/s)

rprClientTxUcastClassBCirFrames(frames/s)

rprClientTxUcastClassBCirBytes(Byte/s)

rprClientTxUcastClassBEirFrames(frames/s)

rprClientTxUcastClassBEirBytes(Byte/s)

rprClientTxUcastClassCFrames(frames/s)

rprClientTxUcastClassCBytes(Byte/s)

rprClientTxMcastClassAFrames(frames/s)

rprClientTxMcastClassABytes(Byte/s)

rprClientTxMcastClassBCirFrames(frames/s)

rprClientTxMcastClassBCirBytes(Byte/s)

rprClientTxMcastClassBEirFrames(frames/s)

rprClientTxMcastClassBEirBytes(Byte/s)

rprClientTxMcastClassCFrames(frames/s)

rprClientTxMcastClassCBytes(Byte/s)

rprClientTxBcastFrames
(frames/s)

Table 14-33 Statistics of RMON VCG performance (frames transmitted by client)

Issue 03 (2013-02-20)

rprClientRxUcastClassAFrames(frames/s)

rprClientRxUcastClassABytes(Byte/s)

rprClientRxUcastClassBCirFrames(frames/s)

rprClientRxUcastClassBCirBytes(Byte/s)

rprClientRxUcastClassBEirFrames(frames/s)

rprClientRxUcastClassBEirBytes(Byte/s)

rprClientRxUcastClassCFrames(frames/s)

rprClientRxUcastClassCBytes(Byte/s)

rprClientRxMcastClassAFrames(frames/s)

rprClientRxMcastClassABytes(Byte/s)

rprClientRxMcastClassBCirFrames(frames/s)

rprClientRxMcastClassBCirBytes(Byte/s)

rprClientRxMcastClassBEirFrames(frames/s)

rprClientRxMcastClassBEirBytes(Byte/s)

rprClientRxMcastClassCFrames(frames/s)

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rprClientRxMcastClassCBytes(Byte/s)

14 RPR Boards

rprClientRxBcastFrames
(frames/s)

Table 14-34 Statistics of RMON VCG performance (count of error frames)


rprSpanErrorTtlExpFrames
(frames/s)

rprSpanErrorTooLongFrames(frames/s)

rprSpanErrorTooShortFrames(frames/s)

rprSpanErrorBadHecFrames
(frames/s)

rprSpanErrorBadFcsFrames
(frames/s)

rprSpanErrorSelfSrcUcastFrames(frames/s)

rprSpanErrorPmdAbortFrames(frames/s)

rprSpanErrorBadAddrFrames(frames/s)

rprSpanErrorBadParityFrames(frames/s)

rprSpanErrorContainedFrames(frames/s)

rprSpanErrorBadDataFcsFrames(frames/s)

rprSpanErrorBadCtrlFcsFrames(frames/s)

rprSpanErrorScffErrors
(frames/s)

rprSpanErrorErroredSeconds(seconds/s)

rprSpanErrorSeverelyErroredSeconds(seconds/s)

rprSpanErrorUnavailableSeconds(seconds/s)

14.2.15 Technical Specifications


The technical specifications of the EMR0 include the parameters specified for optical interfaces,
laser safety class, Ethernet performance specifications, mechanical specifications, and power
consumption.

Parameters Specified for Optical Interfaces


Table 14-35 lists the parameters specified for the optical interfaces of the EMR0.
Table 14-35 Parameters specified for the optical interfaces of the EMR0

Issue 03 (2013-02-20)

Parameter

Value

Type of optical
interface

1000BASE-ZX (80
km)

1000BASE-LX
(10 km)

1000BASE-SX (0.5
km)

Type of fiber

Single-mode LC

Single-mode LC

Multi-mode LC

Launched optical
power range (dBm)

-2 to 5

-9 to -3

-9.5 to -2.5

Operating wavelength
range (nm)

1500 to 1580

1270 to 1355

770 to 860

Minimum overload
(dBm)

-3

-3

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Parameter

Value

Receiver sensitivity
(dBm)

-23

-20

-17

Minimum extinction
ratio (dB)

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio (dB)

30

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Ethernet Performance Specifications


NOTE

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EMR0 board of the N2 version.

Figure 14-8 shows the connection for testing the throughput specifications, packet loss ratio in
the case of overloading, latency specifications, and back-to-back specifications of the EMR0.
Figure 14-8 Connection for testing the throughput specifications, packet loss ratio in the case
of overloading, latency specifications, and back-to-back specifications
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 14-36 and Table 14-37 list the throughput specifications of the EMR0. Table 14-38 and
Table 14-39 list the packet loss ratio in the case of overloading of the EMR0. Table 14-40 and
Table 14-41 list the latency specifications of the EMR0. Table 14-42 and Table 14-43 list the
back-to-back specifications of the EMR0.

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NOTE

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual environment
are used.

The specifications in the following tables are obtained in the following scenario: EVPL bidirectional
unicast services are configured and eight VC-4s are bound on the FE port, or EVPL bidirectional
unicast services are configured and eight VC-4s are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 14-36 lists the throughput specifications of the EMR0 (eight VC-4s are bound on the FE
port). The values are obtained when the SmartApplication is set as follows:
l

Test duration (sec): 5

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 100.00

Resolution rate (%): 1.00

Mode: bidirectional

Table 14-36 Throughput specifications of the EMR0 (eight VC-4s are bound on the FE port)
Frame Size
(Byte)

Passed Rate
(%)

(01,06,05) to
(01,06,06) (pks/
sec)

(01,06,06) to
(01,06,05) (pks/
sec)

Total (pks/
sec)

64

100.00

148810

148810

297620

128

100.00

84459

84459

168918

256

100.00

45290

45290

90580

512

100.00

23496

23496

46992

1024

100.00

11973

11973

23946

1280

100.00

9615

9615

19230

1518

100.00

8127

8127

16254

Table 14-37 lists the throughput specifications of the EMR0 (eight VC-4s are bound on the GE
port). The values are obtained when the SmartApplication is set as follows:
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Test duration (sec): 20

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 100.00

Resolution rate (%): 1.00

Mode: bidirectional

14 RPR Boards

Table 14-37 Throughput specifications of the EMR0 (eight VC-4s are bound on the GE port)
Frame Size
(Byte)

Passed Rate
(%)

(01,01,01) to
(01,04,01) (pks/
sec)

(01,04,01) to
(01,01,01) (pks/
sec)

Total (pks/
sec)

64

72.41

1077586

1077586

2155172

128

94.87

801282

801282

1602564

256

100.00

452899

452899

905798

512

100.00

234962

234962

469924

1024

100.00

119732

119732

239464

1280

100.00

96154

96154

192308

1518

100.00

81274

81274

162548

Table 14-38 lists the packet loss ratio in the case of overloading of the EMR0 (eight VC-4s are
bound on the FE port). The values are obtained when the SmartApplication is set as follows:
l

Test duration (sec): 5

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Step rate: 10.00

Resolution rate (%): none

Mode: bidirectional

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Table 14-38 Packet loss ratio in the case of overloading of the EMR0 (eight VC-4s are bound
on the FE port)
Frame Size
(Byte)

Rate Tested
(%)

(01,06,05) to
(01,06,06) (%)

(01,06,06) to
(01,06,05) (%)

Average (%)

64

100.00

0.000

0.000

0.000

128

100.00

0.000

0.000

0.000

256

100.00

0.000

0.000

0.000

512

100.00

0.000

0.000

0.000

1024

100.00

0.000

0.000

0.000

1280

100.00

0.000

0.000

0.000

1518

100.00

0.000

0.000

0.000

Table 14-39 lists the packet loss ratio in the case of overloading of the EMR0 (eight VC-4s are
bound on the GE port). The values are obtained when the SmartApplication is set as follows:
l

Test duration (sec): 5

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Step rate: 10.00

Resolution rate (%): none

Mode: bidirectional

Table 14-39 Packet loss ratio in the case of overloading of the EMR0 (eight VC-4s are bound
on the GE port)

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Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,04,01) (%)

(01,04,01) to
(01,01,01) (%)

Average (%)

64

100.00

29.833

29.827

29.830

128

100.00

4.306

4.309

4.307

256

100.00

0.000

0.000

0.000

512

100.00

0.000

0.000

0.000

1024

100.00

0.000

0.000

0.000

1280

100.00

0.000

0.000

0.000

1518

100.00

0.000

0.000

0.000

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Table 14-40 lists the latency specifications of the EMR0 (eight VC-4s are bound on the FE port).
The values are obtained when the SmartApplication is set as follows:
l

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the equipment and the
time when the first bit of the transmitted frame reaches the input port of the equipment. In
store forward mode, the analyzer calculates the difference between the time when the first
bit of the transmitted frame reaches the output port of the equipment and the time when the
last bit of the transmitted frame reaches the input port of the equipment. In the table, the
CT values are obtained in cut through mode and the S&F values are obtained in store
forward mode.

Test duration (sec): 5

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Step rate: 10.00

Resolution rate (%): none

Mode: bidirectional

Table 14-40 Latency specifications of the EMR0 (eight VC-4s are bound on the FE port)
Frame
Size
(Byte)

Rate
Tested
(%)

(01,06,05) to
(01,06,06) (us)CT (us)

Average
(CT) (us)

(01,06,05) to
(01,06,06)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

126.1

126.1

121.0

121.0

128

100.00

131.0

131.0

120.8

120.8

256

100.00

149.2

149.2

128.8

128.8

512

100.00

176.9

176.9

136.0

136.0

1024

100.00

237.0

237.0

155.1

155.1

1280

100.00

266.7

266.7

164.3

164.3

1518

100.00

289.3

289.3

167.9

167.9

Table 14-41 lists the latency specifications of the EMR0 (eight VC-4s are bound on the GE
port). The values are obtained when the SmartApplication is set as follows:
l

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The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the time
when the first bit of the transmitted frame reaches the output port of the equipment and the
time when the first bit of the transmitted frame reaches the input port of the equipment. In
store forward mode, the analyzer calculates the difference between the time when the first
bit of the transmitted frame reaches the output port of the equipment and the time when the
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last bit of the transmitted frame reaches the input port of the equipment. In the table, the
CT values are obtained in cut through mode and the S&F values are obtained in store
forward mode.
l

Test duration (sec): 20

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 72.41

Step rate: 10.00

Resolution rate (%): none

Mode: bidirectional

Table 14-41 Latency specifications of the EMR0 (eight VC-4s are bound on the GE port)
Frame
Size
(Byte)

Rate
Tested
(%)

(01,01,01) to
(01,04,01) (us)CT (us)

Average
(CT) (us)

(01,01,01) to
(01,04,01)
(us)-S&F (us)

Average
(S&F) (us)

64

72.41

130.1

130.1

129.6

129.6

128

94.87

143.1

143.1

142.1

142.1

256

100.00

123.4

123.4

121.4

121.4

512

100.00

130.7

130.7

126.7

126.7

1024

100.00

154.4

154.4

146.3

146.3

1280

100.00

164.6

164.6

154.4

154.4

1518

100.00

174.4

174.4

162.3

162.3

Table 14-42 lists the back-to-back specifications of the EMR0 (eight VC-4s are bound on the
FE port). The values are obtained when the SmartApplication is set as follows:
l

Test duration (sec): 2

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Step rate: 10.00

Resolution rate (%): none

Mode: bidirectional

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Table 14-42 Back-to-back specifications of the EMR0 (eight VC-4s are bound on the FE port)
Frame Size
(Byte)

Rate Tested
(%)

(01,06,05) to
(01,06,06) Burst
Size (Number of
Frames)

(01,06,06) to
(01,06,05)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

297620

297620

595240

128

100.00

168918

168918

337836

256

100.00

90580

90580

181160

512

100.00

46992

46992

93984

1024

100.00

23946

23946

47892

1280

100.00

19230

19230

38460

1518

100.00

16254

16254

32508

Table 14-43 lists the back-to-back specifications of the EMR0 (eight VC-4s are bound on the
GE port). The values are obtained when the SmartApplication is set as follows:
l

Test duration (sec): 2

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Step rate: 10.00

Resolution rate (%): none

Mode: bidirectional

Table 14-43 Back-to-back specifications of the EMR0 (eight VC-4s are bound on the GE port)

Issue 03 (2013-02-20)

Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,04,01) Burst
Size (Number of
Frames)

(01,04,01) to
(01,01,01)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

3410

3410

6820

128

100.00

29054

29054

58108

256

100.00

905798

905798

1811596

512

100.00

469924

469924

939848

1024

100.00

239464

239464

478928

1280

100.00

192308

192308

384616

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Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,04,01) Burst
Size (Number of
Frames)

(01,04,01) to
(01,01,01)
(Number of
Frames)

Total
(Number of
Frames)

1518

100.00

162548

162548

325096

Mechanical Specifications
The mechanical specifications of the EMR0 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.2

Power Consumption
The maximum power consumption of the EMR0 at room temperature (25C) is 50 W.

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15

15 SAN/Video Boards

SAN/Video Boards

About This Chapter


The SAN boards are multi-service transparent transmission processing boards.
15.1 MST4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the MST4 (4-port multi-service transparent transmission board). This
topic also describes how to configure and commission the MST4.
15.2 VST4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the VST4 (4-port video-service transparent transmission board). This
topic also describes how to configure and commission the VST4.

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15.1 MST4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the MST4 (4-port multi-service transparent transmission board). This
topic also describes how to configure and commission the MST4.

15.1.1 Version Description


The MST4 is available in one functional version, namely, N1.

15.1.2 Application
The MST4 is a multi-service transparent transmission board. The MST4 is used in remote
disaster recovery, remote backup and data centralization, and integration of storage resources.
The MST4 is used in the fields of the SAN services and video services. The MST4 can transmit/
receive the FC100/FICON, FC200, ESCON, and DVB-ASI services, and provides the FC100
and FC200 services with the distance extension function. Hence, the MST4 is applicable to the
long-distance transmission of the FC services on the SDH network. In addition, the MST4 meets
the transmission requirements of the storage network and extends the types of services supported
by the equipment. Figure 15-1 shows the networking and application of the SAN services.
Figure 15-1 Networking and application of the SAN services
NE1

MST4

NE2

MST4

FC Switch

FC Switch

15.1.3 Functions and Features


The MST4 supports the access of multiple services, alarms, and other maintenance functions.
Table 15-1 provides the functions and features of the MST4.

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Table 15-1 Functions and features of the MST4


Function and
Feature

MST4

Basic functions

Provides four independent ports to transmit/receive multiple services.


Supports the transparent transmission of the SAN and Video services.

Connector type

LC

Optical module
type

SFP

Service types

l Supports FC100/FICON, FC200, ESCON, and DVB-ASI services.


Table 15-2 describes types and rates of the services.
l Transmits/Receives four-channel FC services (FC100/FICON and
FC200) at the same time, and the total bandwidth is less than 2.5 Gbit/
s.
l Supports the full-rate transmission of FC services (one-channel FC200
services or two-channel FC100 services).
l Transmits/Receives four-channel ESCON or DVB-ASI services, and
the total bandwidth is less than 2.5 Gbit/s.

Distance
extension

The first and second ports support the distance extension function on the
SDH side.
l FC100 services: 3000 km
l FC200 services: 1500 km

Maximum
uplink
bandwidth

2.5 Gbit/s
The backplane provides four 622 Mbit/s buses that are directly connected
to the cross-connect unit.
The MST4 can adapt to the bandwidth of the slot.

Issue 03 (2013-02-20)

Mapping
granularity

Supports the VC-4-Xc (X = 4, 8, or 16) granularity.

ESCON
services

Transmits/Receives four-channel ESCON services, and the total


bandwidth is less than 2.5 Gbit/s.

DVB-ASI
services

Transmits/Receives four-channel DVB-ASI services, and the total


bandwidth is less than 2.5 Gbit/s.

Encapsulation
format

Supports the GFP-T protocol, which complies with ITU-T G.7041.

Maintenance
features

Supports inloops and outloops on ports on the customer side, which can
be used to locate faults quickly.
Supports port-based RMON performance management.

Alarms and
performance
events

Reports various alarms and performance events, which can be used to


locate faults and maintain the equipment.

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Table 15-2 Service types and service rates supported by the MST4
Service Type

Rate

Remarks

FC100/FICON

1062.5 Mbit/s

SAN service

FC200

2125 Mbit/s

SAN service

ESCON

200 Mbit/s

SAN service

DVB-ASI

270 Mbit/s

Video service

15.1.4 Working Principle and Signal Flow


The MST4 consists of the client-side access module, FC protocol processing module,
encapsulation and mapping module, logic and control module, clock module, and power module.
Figure 15-2 shows the functional block diagram of the MST4 by describing how to process
1xFC100 signals, 1xFC200 signals, 1xFICON signals, 1xDVB-ASI signals, or 1xESCON
signals.
Figure 15-2 Functional block diagram of the MST4
Backplane

FC100
FC200
FICON
DVB-ASI
ESCON

Clientside
access
module

FC1_
RCV
FC1_
SND

FC2

FC1_
SND

FC2

FC1_
RCV

FC protocol
processing module

Logic and control module


100 MHz
125 MHz
135 MHz
212.5 MHz
622 MHz

Clock
module

Encapsulation
Decapsulation

Encapsulation and
mapping module

Communication

Reference clock and frame header

+3.3 V
Power
module

Interface
converting
module

Mapping

Power
module

Fuse
Fuse

Cross-connect unit A/B


Cross-connect unit A/B

SCC unit
Cross-connect unit

-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

Client-Side Access Module


The client-side access module transmits/receives FC100, FC200, FICON, DVB-ASI, and
ESCON services. The client-side interface unit performs O/E conversion for services and
monitors the optical signals on the client side.
In the upstream direction, the client-side data interface (CDI) receives serial data signals accessed
through the SFP optical module. The serial data signals are then transmitted to the PCS functional
module for physical layer and 8B/10B line performance monitoring.
In the downstream direction, 8B/ 10B conversion is performed for the signals from FC. The
signals are then adapted into client reference clocks by inserting or discarding idle packets. After
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being converted from parallel signals into serial signals, the signals are transmitted through the
CDI interface to the optical module on the client side.

FC Protocol Processing Module


The FC protocol processing unit mainly extends the distance of FC service transmission. This
module supports the maximum transmission distance of 3000 km for 2xFC100 services or the
maximum transmission distance of 1500 km for 1xFC200 services.
The FC protocol processing unit performs FC1 layer and FC2 layer functions. The FC1 layer
functions include the following:
l

8B/10B conversion

Synchronous processing

Extraction of primitive signal and primitive sequence

The FC2 layer functions include the following:


l

Check and counting of all special frames

Modification of values of certain special frames (FLOG1, PLOG1, and ELP)

CRC check

Encapsulation and Mapping Module


The encapsulation and mapping module mainly performs the following functions:
l

Encapsulates and maps data.

Decapsulates and demaps data.

According to the direction of the signal flow, the functional modules inside the chip can be
classified into modules in the ingress direction and modules in the egress direction. In the ingress
direction, signals from the client side to the line side are processed. In the egress direction, signals
from the line side to the client side are processed.
Ingress direction
Through GFP encapsulation, 64B/65B conversion is performed for data bytes after decoding.
The data bytes are then mapped in compliance with the GFP protocol.
Egress direction
SDH data frames are received from the line-side interface module. After overheads are
processed, GFP data frames are extracted from SDH concatenated channels and are then
transmitted to the decapsulation module for decapsulation.

Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and HDLC
controller. This module is connected to external circuits through buses. The logic and control
module manages and configures other modules of the board. This module contains basic logic
units and performs the following functions:
l

Writes and reads the register.

Provides interfaces for the CPU.

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Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

Clock Module
This module provides required reference clocks for boards. The clock frequency can be 100
MHz or 125 MHz.

Power Module
It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

15.1.5 Front Panel


The front panel of the MST4 has indicators, interfaces, and a bar code.

Diagram of the Front Panel


Figure 15-3 shows the appearance of the front panel of the MST4.

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Figure 15-3 Front panel of the MST4

MST4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

MST4

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the MST4 has four pair of optical interfaces. Table 15-3 describes the types
and usage of the optical interfaces of the MST4.
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Table 15-3 Optical interfaces of the MST4


Interface

Type of
Interface

Usage

IN1IN4

LC

Receives multi-service optical signals.

OUT1OUT4

LC

Transmits multi-service optical signals.

15.1.6 Jumpers and DIP Switches


The MST4 does not have any jumpers or DIP switches that are used for board settings.

15.1.7 Valid Slots


The MST4 must be installed in a valid slot in the subrack. Otherwise, the MST4 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The MST4 can be installed in slots 18 and 1116 in the subrack.


l

When the cross-connect capacity is 200 Gbit/s, the MST4 can be installed in slots 18 and
1116. When the MST4 is installed in slots 14, 15, and 16, the bandwidth is 1.25 Gbit/s.
When the MST4 is installed in slots 58 and 1114, the bandwidth is 2.5 Gbit/s.

15.1.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the MST4 indicates the type of supported services, type of optical interface,
and transmission distance.
Table 15-4 provides the relationship between the feature code of the MST4, the type of supported
services, type of optical interface, and transmission distance.
Table 15-4 Relationship between the feature code of the MST4, the type of supported services,
type of optical interface, and transmission distance

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Board

Feature
Code

Type of Supported Services


(Type of Optical Interface)

Transmission
Distance

SSN1MST410

10

2xFC (SM)

2 km

SSN1MST411

11

2xFC (SM)

15 km

SSN1MST412

12

2xFC (MM)

0.5 km

SSN1MST413

13

4xESCON/DVB-ASI (SM)

15 km

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Board

Feature
Code

Type of Supported Services


(Type of Optical Interface)

Transmission
Distance

SSN1MST414

14

4xESCON/DVB-ASI (MM)

2 km

SSN1MST415

15

1xFC2 (MM)

ESCON/DVB-ASI (MM)
SSN1MST416

16

1xFC2 (MM)

ESCON/DVB-ASI (SM)
SSN1MST417

SSN1MST418

17

18

1xFC (SM)

2 km

2xESCON/DVB-ASI (SM)

1xFC (SM)

2 km

2xESCON/DVB-ASI (MM)

15.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring the SAN Service.
----End
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Commissioning the Board


Step 1 Required: Test the SAN service channel. For details, see 28.8 Testing the SAN Service
Channel.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms of the board. Modify the connections or configurations of the board
according to the alarms until the alarms are cleared. For the method for querying the alarms of
a board, see Viewing the Current Alarms.
----End

15.1.10 Parameter Settings


You can set parameters for the MST4 by using the U2000.
You can set the following parameters for the MST4 by using the U2000:
l

J1 byte

C2 byte

For the description of each parameter, see 27 Parameter Settings.

15.1.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 15-5 lists the faults that occur on the MST4 frequently and the troubleshooting methods.
Table 15-5 Methods used to troubleshoot the faults that occur on the MST4 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

l The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

l The services on a single


Ethernet port are interrupted.
Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The protocol becomes


abnormal.
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Fault Symptom

Common Fault Cause

Troubleshooting Method

Packet loss

Bit errors occur on the line side.

See Troubleshooting Service


Packet Loss.

Interconnection
fault

l The interconnection fault


occurs on a single service port.

See Troubleshooting Device


Interconnection Faults.

l The interconnection fault


occurs on the VCG port.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the MST4, see Replacing an SAN/Video Board.

15.1.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

15.1.12.1 Alarms of N1MST4


AU_AIS

AU_CMM

AU_LOP

B3_EXC

B3_SD

BD_STATUS

BDID_ERROR

COMMUN_FAIL

HARD_BAD

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

IN_PWR_ABN

LASER_MOD_ERR

LOOP_ALM

LSR_COOL_ALM

LSR_NO_FITED

LSR_WILL_DIE

NO_BD_SOFT

NO_LSR_PARA_FILE

PLL_FAIL

POWER_ABNORMAL

R_LOC

R_LOS

TEM_LA

T_LOSEX

TEM_HA

PATCHFILE_NOTEXIST

TF

TR_LOC

PATCH_NOT_CONFIRM

PATCH_ERR

SPARE_PATH_ALM

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

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15.1.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

15.1.13.1 Performance Events of N1MST4


Table 15-6 SDH
AUPJCHIGH

AUPJCLOW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

Table 15-7 FC
WSys_los_cnt

Client_Invld_Words

Client_Crc_Err

LinkRst_Cnt

Client_RxFrmCnt_C1

Client_RxFrmCnt_C2

Client_RxFrmCnt_C3

Client_RxFrmCnt_C4

Client_RxFrmCnt_Cf

Client_RxFrmCnt_Sum

Client_TxFrmCnt_C1

Client_TxFrmCnt_C2

Client_TxFrmCnt_C3

Client_TxFrmCnt_C4

Client_TxFrmCnt_Cf

Client_TxFrmCnt_Sum

Client_RxByteCnt_sum

Client_TxByteCnt_sum

Client_unsupos_cnt

15.1.14 Technical Specifications


The specifications of the MST4 include the parameters specified for optical interfaces, laser
safety class, dimensions, weight, and power consumption.

Parameters Specified for Optical Interfaces


The optical interfaces of the MST4 can use several types of optical modules. Table 15-8 lists
the parameters specified for the optical interfaces of the MST4.
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Table 15-8 Parameters specified for the optical interfaces of the MST4
Parameter

Value

Service type

ESCON/DVB-ASI

FC200/FC100/FICON

Service rate

l ESCON: 200 Mbit/s

l FC200: 2125 Mbit/s

l DVB-ASI: 270
Mbit/s

l FC100/FICON: 1062.5 Mbit/s

Optical interface type

X3.296/(DVB-ASI)
EN50083-9
200-M5-SN-I

200-SM-LC-I

Part number of optical


module

34060277

34060287

34060325

34060288

34060278

Fiber type

Singlemode LC

Multimode LC

Multimode LC

Singlemode LC

Singlemode LC

Operating wavelength
range (nm)

1310

850

1310

Transmission distance
(km)

15

0.5

15

Maximum launched
optical power (dBm)

-8

-14

-2.5

-3

Minimum launched
optical power (dBm)

-15

-19

-9.5

-10

-5

Receiver sensitivity
(dBm)

-31

-30

-17

-21

Minimum overload
(dBm)

-8

-14

-3

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the MST4 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.9

Power Consumption
The maximum power consumption of the MST4 at room temperature (25C) is 26 W.
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15.2 VST4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the VST4 (4-port video-service transparent transmission board). This
topic also describes how to configure and commission the VST4.

15.2.1 Version Description


The VST4 is available in one functional version, namely, N1.

15.2.2 Application
The VST4 is a transparent transmission board used for receiving/transmitting various types of
video services.
The VST4 can transmit/receive DVB-ASI, SD-SDI, and HD-SDI services. Figure 15-4 shows
the networking and application of the VST4.
Figure 15-4 Networking and application of the VST4
NE1

NE2

VST4

VST4

SDI/DVB-ASI
Switch

SDI/DVB-ASI
Switch

15.2.3 Functions and Features


The VST4 receives/transmits video services, alarms, and other maintenance functions.
Table 15-9 provides the functions and features of the VST4.
Table 15-9 Functions and features of the VST4

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Function and
Feature

VST4

Basic functions

Provides four independent ports to transmit/receive services; supports the


transparent transmission of four-channel video services.

Interface type

SMB (SMB interfaces can be converted into BNC interfaces by means of


transit cables.)
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Function and
Feature

VST4

Service types

Supports DVB-ASI, SD-SDI, and HD-SDI services. Table 15-10


describes types and rates of the services.

Maximum
upstream
bandwidth

l When a VST4 is installed in any slot of slots 1-4 and 15-16, the
maximum upstream bandwidth is 5 Gbit/s. The VST4 can adapt to the
bandwidth of the slot.
l When a VST4 is installed in any slot of slots 5-8 and 11-14, the
maximum upstream bandwidth is 10 Gbit/s. The VST4 can adapt to the
bandwidth of the slot.

Mapping
granularity

Supports the VC-4-Xc (X = 4 or 16) granularity.

DVB-ASI

Transmits/Receives four-channel DVB-ASI services.

SD-SDI

Transmits/Receives four-channel SD-SDI services.

HD-SDI

l When a VST4 is installed in any slot of slots 1-4 and 15-16, it transmits/
receives two-channel HD-SDI services. The VST4 can adapt to the
bandwidth of the slot.
l When a VST4 is installed in any slot of slots 5-8 and 11-14, it transmits/
receives four-channel HD-SDI services. The VST4 can adapt to the
bandwidth of the slot.

Encapsulation
format

Supports the GFP protocol, which complies with ITU-T G.7041.

Maintenance
features

Supports inloops and outloops on electrical ports for locating faults


quickly.
Supports port-based RMON performance management.

Alarms and
performance
events

Reports various alarms and performance events, which can be used to


locate faults and maintain the equipment.

Table 15-10 Service types and service rates supported by the VST4
Service Type

Rate

Remarks

DVB-ASI

270 Mbit/s

Video service

SD-SDI

270 Mbit/s

Video service

HD-SDI

1.485 Gbit/s

Video service

15.2.4 Working Principle and Signal Flow


The VST4 consists of the client-side access module, encapsulation and mapping module, logic
and control module, clock module, and power module.
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Figure 15-5 shows the functional block diagram of the VST4 with the processing of 1xSD-SDI
signal, 1xHD-SDI signal, or 1xDVB-ASI signal.
Figure 15-5 Functional block diagram of the VST4
Backplane
Encaps
ulation
SD- SDI
HD- SDI
DVB- ASI

Clientside
access
module

Bus
converting
module

Mapping

Decaps
ulation

Cross-connect unit A/B

Cross-connect unit A/B


Encapsulation and
mapping module
Communication

Logic and control module

66 MHz
100 MHz
155 MHz

Reference clock and frame header

SCC unit
Cross-connect unit A/B

Clock
module

+3.3V
Power
module

Power
module

Fuse

- 48 V/- 60 V
- 48V/- 60V

Fuse
+3.3 V backup power

Client-Side Access Module


The client-side access module transmits/receives SD-SDI, HD-SDI, and DVB-ASI services. The
client-side interface unit processes input/output electrical signals.
In the upstream direction, the client-side access module receives serial data signals received
through the SMB interface. The serial data signals are then transmitted to the encapsulation and
mapping module and finally to the backplane through the bus conversion module.
In the downstream direction, bus conversion is performed for the signals from the backplane.
The signals are then transmitted to the encapsulation and mapping module. After being
decapsulated and demapped, the signals are transmitted to the client-side access module.

Encapsulation and Mapping Module


The encapsulation and mapping module mainly performs the following functions: encapsulating/
mapping data, decapsulating/demapping data, processing LCAS and SDH/SONET overheads,
converging services, and encapsulating services.

Logic Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and HDLC
controller. This module is connected to external circuits through buses. The logic and control
module manages and configures other modules of the board. This module contains basic logic
units and performs the following functions:
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Writes into and reads from the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Implements communication.

Controls indicators.

Clock Module
This module provides required reference clocks for the board.

Power Module
This module converts the -48 V/-60 V power supply into the DC voltages that the modules of
the board require.

15.2.5 Front Panel


The front panel of the VST4 has indicators, interfaces, and a bar code.

Diagram of the Front Panel


Figure 15-6 shows the appearance of the front panel of the VST4.

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Figure 15-6 Front panel of the VST4


VST4
STAT
ACT
PROG
SRV

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

VST4

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) - two colors (red and green)

Service activation status indicator (ACT) - one color (green)

Board software status indicator (PROG) - two colors (red and green)

Service alarm indicator (SRV) - three colors (red, green, and yellow)

For the meanings of indicator states, see 24 Indicators.

Interfaces
The front panel of the VST4 has four electrical interfaces. Table 15-11 describes the types and
usage of the electrical interfaces of the VST4.

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Table 15-11 Electrical interfaces of the VST4


Interface

Type of Interface

Usage

IN1-IN4

SMB (BNC
interfaces can also
be provided after
conversion cables
are connected to the
SMB interfaces.)

75-ohm interfaces that are used to receive electrical


signals.

OUT1-OUT4

SMB (BNC
interfaces can also
be provided after
conversion cables
are connected to the
SMB interfaces.)

75-ohm interfaces that are used to transmits


electrical signals.

15.2.6 Jumpers and DIP Switches


The VST4 does not have any jumpers or DIP switches that are used for board settings.

15.2.7 Valid Slots


The VST4 must be installed in a valid slot in the subrack. Otherwise, the VST4 cannot work
properly.
The VST4 can be installed in slots 1-8 and 11-16. When the VST4 is installed in slots 1-4, 15,
and 16, the bandwidth is 5 Gbit/s. When the VST4 is installed in slots 5-8 and 11-14, the
bandwidth is 10 Gbit/s.

15.2.8 Feature Code


VST4 boards do not have feature codes.

15.2.9 Configuring and Commissioning a Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the board hardware, configuring the board, commissioning
the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the cable
matches the board.
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Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

Configuring the Board


Step 1 Required: Add a logical board. For details, see Adding Boards.
Step 2 Required: Configure services. For details, see Configuring Video Services.
----End

Commissioning the Board


Step 1 Required: Test SDI service channels. For details, see 28.9 Testing the SDI Service Channel.
----End

Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to check whether
the board starts working properly. If all the indicators are on and green, the board operates
properly. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the board alarms. Modify the connections or configurations of the board
according to the alarms until the alarms are cleared. For the method of querying the alarms of a
board, see Viewing the Current Alarms.
----End

15.2.10 Parameter Settings


You can set parameters for the VST4 by using the U2000.
You can set the following parameters for the VST4 by using the U2000:
l

J1 byte

C2 byte

For the description of each parameter, see 27 Parameter Settings.

15.2.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
Table 15-12 lists the faults that occur on the VST4 frequently and the troubleshooting methods.
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Table 15-12 Methods used to troubleshoot the faults that occur on the VST4 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

The services on a VCTRUNK port


are interrupted.

See Troubleshooting TDM Service


Interruptions.

Transient service
interruption

l The services on a VCTRUNK


port are transiently interrupted.

See Troubleshooting Transient


Service Interruptions.

l The protocol becomes


abnormal.
Packet loss

Bit errors occur on the line side.

See Troubleshooting Service


Packet Loss.

Interconnection
fault

The interconnection fault occurs on


a single service port.

See Troubleshooting Device


Interconnection Faults.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the VST4, see Replacing an SAN/Video Board.

15.2.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

15.2.12.1 Alarms of N1VST4

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BD_STATUS

COMMUN_FAIL

R_LOS

R_LOC

AU_AIS

AU_LOP

HP_TIM

HP_SLM

HP_UNEQ

HP_RDI

HP_REI

B3_EXC

B3_SD

AU_CMM

LOOP_ALM

NO_BD_SOFT

TR_LOC

T_LOSEX

SPARE_PATH_ALM

BDID_ERROR

PLL_FAIL

HARD_BAD

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

WRG_BD_TYPE

POWER_ABNORMAL

TEMP_OVER

TEST_STATUS

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15.2.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

15.2.13.1 Performance Events of N1VST4


AUPJCHIGH

AUPJCLOW

HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

HPFESES

HPFECSES

XCSTMPMAX

XCSTMPMIN

XCSTMPCUR

15.2.14 Technical Specifications


The technical specifications of the VST4 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

Parameters Specified for Electrical Interfaces


Table 15-13 lists the parameters specified for the electrical interfaces of the VST4.
Table 15-13 Parameters specified for the electrical interfaces of the VST4
Parameter

Value

Rate

270 Mbit/s

1.485 Gbit/s

270 Mbit/s

Code type

NRZI

NRZI

MPEG-2

Interface type

SD-SDI

HD-SDI

DVB-ASI

Connector

SMB (A BNC connector is available by connecting a


conversion cable to the SMB connector.)

Transmission distance (m)

100

100

100

Interface standard compliance

SMPTE
259M

SMPTE 292M

EN 50083-9

Mechanical Specifications
The mechanical specifications of the VST4 are:
l

Dimensions (H x W x D): 254.1 mm x 25.4 mm x 220 mm

Weight: 0.8 kg

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Power Consumption
The maximum power consumption of the VST4 at room temperature (25C) is 37 W.

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16

16 Microwave Boards

Microwave Boards

About This Chapter


The microwave boards include the microwave intermediate frequency (IF) board IFSD1 and
microwave power board RPWR.
16.1 IFSD1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the IFSD1 (dual-port IF board). This topic also describes how to
configure and commission the IFSD1.
16.2 RPWR
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the RPWR (6-channel ODU power board). This topic also describes
how to configure and commission the RPWR.
16.3 ODU
When the microwave board is used, it needs to work with the microwave outdoor unit (ODU).
The ODU types supported by the equipment are standard power (SP) and high power (HP).

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16.1 IFSD1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the IFSD1 (dual-port IF board). This topic also describes how to
configure and commission the IFSD1.

16.1.1 Version Description


The IFSD1 is available in one functional version, namely, N1.

16.1.2 Application
Working as the microwave module on the OptiX OSN equipment, the IFSD1 can receive and
transmit two IF signals and work with the OptiX RTN 600 to transmit microwave signals.
The OptiX OSN equipment can be configured with multiple IFSD1 boards according to the
service configuration so that the microwave services in multiple directions can be connected.
Figure 16-1 shows the position of the OptiX OSN equipment that is configured with the IFSD1
in the network.
Figure 16-1 Position of the OptiX OSN equipment that is configured with the IFSD1 in the
network
SDH/PDH
IFSD1: 11-13
STM-64/STM-16/STM-4 ring
SDH/PDH

SDH/PDH

OptiX OSN
equipment

OptiX optical
transmission product

OptiX RTN 600

16.1.3 Functions and Features


The IFSD1 transmits and receives two IF signals, provides the management channel to the ODU,
and supplies the 48 V power to the ODU.
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Table 16-1 provides the functions and features of the IFSD1.


Table 16-1 Functions and features of the IFSD1
Function and
Feature

IFSD1

Basic functions

Supports 2xSTM-1 SDH or PDH IF signals and management control


signals between the IDU and ODU, and supplies power to the ODU.

IF processing

l Maps PDH signals and SDH signals into IF signals.


l Codes and decodes IF signals.
l Modulates and demodulates IF signals.
l Modulates and demodulates ODU control signals.
l Combines and splits service signals, ODU control signals, and
48 V power supplies.

Microwave features

l Supports the software programmable radio (SPR) function. That


is, you can set the microwave capacity and modulation scheme by
using the software.
l Supports the microwave frame that is based on the tributary and
STM-1, and hence supports the interconnection with the OptiX
OSN products or the OptiX RTN 600 products that support this
type of microwave frame through the air interface.
l Supports the automatic transmit power control (ATPC) function.

Service processing

Supports the configuration of VC-12, VC-3, and VC-4 services.

Overhead processing

l Processes the section overheads of the STM-1 IF signals.


l Supports the transparent transmission and termination of the path
overheads of the STM-1 IF signals.
l Supports the setting and query of the J1 and C2 bytes.

Pointer processing

l Processes AU pointers of SDH IF signals.


l Processes TU pointers of PDH IF signals.

Alarms and
performance events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection schemes

Supports the following protection schemes:


l 1+1 HSB
l 1+1 FD
l 1+1 SD
l N+1 Protection
l Microwave lower order SNCP

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Function and
Feature

IFSD1

Maintenance
features

l Supports loopbacks on VC-4 paths.


l Supports loopbacks on IF ports.
l Supports the detection of the board temperature.
l Supports warm resets and cold resets. The warm reset does not
affect the services.
l Supports the query of the manufacturing information of the board.
l Supports the query of the version information of the board.
l Supports the in-service loading of the FPGA.
l Supports the detection of the hardware fault.
l Supports the PRBS function.

16.1.4 Working Principle and Signal Flow


The IFSD1 consists of the combiner interface module, IF processing module, MODEM module,
FPGA module, rate converting module, and communication and control module.
This topic considers the processing of one IF signal that is sent from the ODU as an example to
describe the working principle and signal flow of the IFSD1.
Figure 16-2 shows the functional block diagram of the IFSD1.
Figure 16-2 Functional block diagram of the IFSD1
Backplane

ODU

IF Combiner
interface
module

IF
processing
module

MODEM
module

SMOD
EM

M
U
X/
D
E
M
U
X

Rate
converting

FPGA module

Overhead
processing

Overhead
s related
to HSM

Cross-connect
unit

Board in the paired slot


SCC

-48 V
Clock
module
Power
module
Service bus
Overhead bus

Communication and
control module

IF signal
Control bus

SCC
SCC

ODU control signal


Communication bus

-48 V power supply

Signal Processing Flow in the Transmit Direction


After the service signals are processed by the rate converting module, the signals from the crossconnect unit are sent to the MUX/DEMUX module of the FPGA module where the signals are
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scrambled and the overhead byte and pointer are set. Then, the signals are sent to the MODEM
module for FEC coding and digital modulation and to the IF processing module for D/A
converting and analog modulation. The ODU control signals sent from the logic and control
module are sent to the combiner interface module after being modulated by the SMODEM
module. Finally, the IF signals, ODU control signals, and 48 V power supplies are combined
at the combiner interface module and then sent to the ODU over IF cables.

Signal Processing Flow in the Receive Direction


The combiner interface module divides the ODU control signals and IF signals from the received
IF signals. The ODU control signals are sent to the SMODEM module for demodulation and
then to the logic and control module. The IF signals are sent to the IF processing module for
filtering and A/D converting and then to the FPGA module for demultiplexing and overhead
processing. Then, the signals are sent to the rate converting module. Finally, the signals are sent
to the cross-connect unit.

Auxiliary Modules
The auxiliary modules include the logic and control module, clock module, and power module.
The functions of these modules are as follows:
l

Logic and control module

This module realizes the alarm display, performance monitoring, and communication with the
system control and communication board and the other boards through the Ethernet interface.
In addition, this module provides two pairs of RS485 data buses and can provide quick response
in real time. This module supports the in-service loading of programs.
l

Clock module
Extracts the clock from the received signal and sends the 8 KHz clock to the clock unit.
Supports the 38 MHz system clock in the transmit direction.

Power module
Provides two 48 V power input interfaces and supports the DC power supply whose
input voltage ranges from 38.4 V to 72 V.
Provides DC power supplies for all the modules on the IFSD1.
Monitors all the power supplies for the IFSD1 and reports alarms in the case of a board
voltage abnormality.
Provides one 48 V DC power supply for the ODU.

16.1.5 Front Panel


The front panel of the IFSD1 has indicators, interfaces, power switches, and labels.

Diagram of the Front Panel


Figure 16-3 shows the appearance of the front panel of the IFSD1.

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Figure 16-3 Front panel of the IFSD1


IFSD1
STAT
PROG
SRV
LINK1
ODU1
ACT1
LINK2
ODU2
ACT2

!
WARNING

-48V OUTPUT
TURNOFFPOWERBEFORE
DISCONNECTING IF CABLE

IF1

ODU-PWR1
I
O
PWR1

PWR2

ODU-PWR2
I
O
IF2

IFSD1

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Board software status indicator (PROG) two colors (red and green)

Active/Standby state indicator (ACT1) one color (green)

Active/Standby state indicator (ACT2) one color (green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator 1 (LINK1) two colors (red and green)

Connection status indicator 2 (LINK2) two colors (red and green)

Working indicator of ODU 1 (ODU1) two colors (red and green)

Working indicator of ODU 2 (ODU2) two colors (red and green)

For the meanings of the status of the indicators, see 24 Indicators.

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Interfaces
Table 16-2 Interfaces of the IFSD1
Interface

Description

Usage

IF1

IF port 1

IF port 1 refers to the IF interface between the


IDU and the ODU. This port transmits the
signal that combines the IF service signal,
ODU control signal, and 48 V power supply
required by the ODU. A single type-N IF
cable is used for connection.

IF2

IF port 2

IF port 2 refers to the IF interface between the


IDU and the ODU. This port transmits the
signal that combines the IF service signal,
ODU control signal, and 48 V power supply
required by the ODU. A single N-Type IF
cable is used for connection.

PWR1

Power interface 1

The power supply provided by the RPWR is


transferred by the combiner unit of the IF
board to supply power to the ODU. The IF
board can provide a maximum throughcurrent of 1.76 A for the ODU. The PWR1
interface must be connected to the dedicated
power cable that is delivered with the
equipment.

PWR2

Power interface 2

The power supply provided by the RPWR is


transferred by the combiner unit of the IF
board to supply power to the ODU. The IF
board can provide a maximum throughcurrent of 1.76 A for the ODU. The PWR2
interface must be connected to the dedicated
power cable that is delivered with the
equipment.

ODU-PWR1a

ODU power switch 1

Turns on or turns off the 48 V DC power


supply for the ODU.

ODU-PWR2a

ODU power switch 2

Turns on or turns off the 48 V DC power


supply for the ODU.

CAUTION
a: The ODU-PWR1 and ODU-PWR2 switches are equipped with lockup devices. To move the
switch, you need to pull the switch lever partially. When the switch is set to "O", it indicates that
the circuit is open. When the switch is set to "I", it indicates that the circuit is closed.

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Labels
The front label has a high temperature warning label and an operation warning label.
The high temperature warning label indicates that the board surface temperature may exceed
70C when the ambient temperature is higher than 55C. In this case, you need to wear protective
gloves before touching the board.
The operation warning label indicates that the ODU power switch must be turned off before the
IF cable is removed.

16.1.6 Jumpers and DIP Switches


The IFSD1 does not have any jumpers or DIP switches that are used for board settings.

16.1.7 Valid Slots


The IFSD1 must be installed in a valid slot in the subrack. Otherwise, the IFSD1 cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the IFSD1 are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the IFSD1 can be installed in slots 18 and
1117.

16.1.8 Feature Code


The IFSD1 does not have the feature code.

16.1.9 Board Protection


The IFSD1 supports the 1+1 HSB/FD/SD protection and N+1 protection.

16.1.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the appearance of the board. Ensure that the board is not damaged.
l The front panel and the steel plate in the rear must not be deformed.
l There must be no unexpected sound when you shake the board gently.
l The screws on the daughter board must be tightened.
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l The power switch of the ODU must be intact and be in the OFF position.
Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check the status of the indicators of the board when and after the board is powered
on. For the meanings of the status of the indicators, see 24 Indicators.
Step 4 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
Step 5 Required: Check whether the cable between the IF board and the power board (N1RPWR) and
the cable between the IF board and the ODU are properly connected. In addition, check whether
the accessories such as antennas are installed.
Step 6 Required: Switch on the ODU and check whether the ODU starts to work.
----End

Configuring the Board


Step 1 Required: Add a logical board for the IF board and ODU. For details, see Adding Boards.
Step 2 Required: Set the interface parameters of the ODU. For details, see Configuring Parameters of
ODU Interfaces.
Step 3 Required: Configure the IF/ODU information. For details, see Configuring the IF/ODU
Information of a Radio Link.
Step 4 Required: Set the parameters of the IF interface. For details, see Setting the Parameters of the
IF Interface.
Step 5 Required: Configure the SDH or PDH services. For details, see Configuring the SDH/PDH
Services (on a Per-NE Basis).
Step 6 Required: Create the IF protection. For details, see Creating IF 1+1 Protection or Creating an
N+1 Protection Group (perform this operation according to actual requirements).
----End

Commissioning the Board


Step 1 Required: Query the current alarms of the IF board and ODU. For details, see Querying Current
Alarms for the IF Board and ODU.
Step 2 Required: Align the antennas. For details, see Aligning the Antennas.
Step 3 Required: Log in to the NE on the opposite end. For details, see Logging In to the Opposite
NE.
Step 4 Required: Query the receive power of the ODU. For details, see Aligning the Single-Polarized
Antennas.
Step 5 Optional: Test the 24hour BER. For details, see Testing the Point-to-Point BER.
Step 6 Optional: Test the IF protection switching. For details, see Testing the protection switch.
----End
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Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 24.2 Alarm Indicators on the
Boards.
Step 2 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms are
cleared. For the method for querying the alarms and performance events of a board, see Viewing
the Current Alarms.
----End

16.1.11 Parameter Settings


You can set parameters for the IFSD1 by using the U2000 LCT and U2000.
You can set the following parameters for the IFSD1 by using the network management system:
l

Radio work mode

Radio link ID

ATPC attributes

J1 byte

The J1 byte is applicable to SDH microwave only. The other parameters are applicable to both
PDH and SDH microwaves.

Radio Work Mode


Table 16-3 Radio work modes

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Service Capacity

Modulation Scheme

Channel Spacing (MHz)

4xE1

QPSK

4xE1

16QAM

3.5

8xE1

QPSK

14 (13.75)

8xE1

16QAM

16xE1

QPSK

28 (27.5)

16xE1

16QAM

14 (13.75)

22xE1

32QAM

14 (13.75)

26xE1

64QAM

14 (13.75)

35xE1

16QAM

28 (27.5)

44xE1

32QAM

28 (27.5)

53xE1

64QAM

28 (27.5)

STM-1

128QAM

28 (27.5)

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NOTE

l The channel spacings 13.75 MHz and 27.5 MHz are applied to the 18 GHz frequency band.
l The channel spacings provided in the table are the minimum channel spacings supported by the OptiX OSN
equipment series. The channel spacings equal to or larger than the values are also supported.

Radio Link ID
The radio link ID is an identification of the radio link. The transmit end sends the radio link ID
byte continuously so that the receive end can learn that the transmit end is in a constant
connection state. If the receive end detects a mismatch of the radio link ID, the receive end inserts
the all "1"s signal and the corresponding IF port reports the MW_LIM alarm.

ATPC Attributes
The ATPC is a technology that automatically adjusts the transmit power of the transmitter
according to the attenuation of the received signal level (RSL) at the receive end. The ATPC
attributes include the following parameters:
l

ATPC enable status


This parameter specifies whether the NE enables the ATPC function to control the transmit
power of the transmitter. By default, the ATPC function is disabled.

ATPC upper threshold


When the RSL at the receive end is higher than the set value of this parameter, the receive
end notifies the transmit end to reduce the transmit power by using the ATPC overhead in
the microwave frame. The decrement depends on the value of the ATPC adjustment
parameter.

ATPC lower threshold


When the RSL at the receive end is lower than the set value of this parameter, the receive
end notifies the transmit end to increase the transmit power by using the ATPC overhead
in the microwave frame. The increment depends on the value of the ATPC adjustment
parameter.

ATPC adjustment
This parameter specifies the decrement/increment of an ATPC adjustment.
NOTE

The ATPC adjustment cannot exceed the range of the ODU transmit power.

J1 Byte
The IFSD1 board supports four byte modes, which are as follows:
l

Single-byte mode

16-byte mode with CRC

16-byte mode without CRC

64-byte mode

By default, the IFSD1 board does not monitor the received J1 byte. That is, the J1 byte to be
received is set to the disabled mode. The J1 byte to be sent is a 16-byte string with CRC. The
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first byte is created automatically and the following 15 bytes are the ASCII codes "HuaWei SBS
". The last five characters of the string are blank spaces.

16.1.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
For the faults that occur on the IFSD1 frequently, the common fault causes, and the
troubleshooting methods, see Troubleshooting Microwave Links.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the IFSD1, see Replacing the IF Board.

16.1.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

16.1.13.1 Alarms of N1IFSD1

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AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_SD

BDID_ERROR

BD_STATUS

CHIP_ABN

COMMUN_FAIL

FSELECT_STG

HARD_BAD

HP_CROSSTR

HP_LOM

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

IF_CABLE_OPEN

LOOP_ALM

MS_AIS

MS_CROSSTR

MS_RDI

MS_REI

MSAD_CROSSTR

MW_BER_EXC

MW_BER_SD

MW_FEC_UNCOR

MW_LIM

MW_LOF

MW_RDI

NO_BD_SOFT

PLL_FAIL

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

R_LOC

R_LOF

R_LOS

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RS_CROSSTR

SLAVE_WORKING

TEMP_ALARM

TR_LOC

VOLT_LOS

POWER_ABNORMAL

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

16.1.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The performance
events are reported according to the logical board on the U2000.

16.1.14.1 Performance Events of N1IFSD1


AUPJCHIGH

AUPJCLOW

AUPJCNEW

FEC_BEF_COR_ER

FEC_COR_BYTE_CNT

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

RSBBE

RSCSES

RSES

RSOFS

RSOOF

RSSES

RSUAS

XCSTMPMAX

XCSTMPMIN

XCSTMPCUR

16.1.15 Technical Specifications


The technical specifications of the IFSD1 include the IF performance, baseband signal
processing performance, board mechanical specifications, and power consumption.

Microwave Capacity
One IFSD1 board can access microwave signals in both directions. The capacity of microwave
signals in each direction depends on the radio work mode of these microwave signals. For details
about the radio work modes, see 16.1.11 Parameter Settings.

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IF Performance
Table 16-4 IF performance
Item

Performance

IF signal
Transmit frequency of the IF
board (MHz)

350

Receive frequency of the IF


board (MHz)

140

Impedance (ohm)

50

ODU O&M signal


Modulation scheme

ASK

Transmit frequency of the IF


board (MHz)

5.5

Receive frequency of the IF


board (MHz)

10

Baseband Signal Processing Performance of the Modem


Table 16-5 Baseband signal processing performance of the modem
Item

Performance

Coding mode

l Uses Reed-Solomon (RS) coding for PDH signals.


l Uses Trellis-Coded Modulation (TCM) and RS two-level coding
for SDH signals.

Adaptive timedomain equalizer for


baseband signals

Consists of the feed forward equalizer filter and decision feedback


equalizer.

Mechanical Specification
The mechanical specifications of the IFSD1 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.1

Power Consumption
The maximum power consumption of the IFSD1 at room temperature (25C) is 24 W.
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16.2 RPWR
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the RPWR (6-channel ODU power board). This topic also describes
how to configure and commission the RPWR.

16.2.1 Version Description


The RPWR is available in one functional version, namely, N1.

16.2.2 Application
The RPWR is a power access board and is not related to the service features. The RPWR,
however, must be configured if the product needs to provide the IF feature. The RPWR receives
two 38.4 V to 72 V DC power supplies, provides the IFSD1 with six independent 48 V power
supplies, and finally feeds power to the ODU after the IFSD1 processes the six 48 V power
supplies.
Figure 16-4 shows the position of the OptiX OSN equipment that is configured with the RPWR
in the network.
Figure 16-4 Position of the OptiX OSN equipment that is configured with the RPWR in the
network
SDH/PDH
RPWR: 11-13
STM-64/STM-16/STM-4 ring
SDH/PDH

SDH/PDH

OptiX OSN
equipment

OptiX optical
transmission product

OptiX RTN 600

16.2.3 Functions and Features


The RPWR receives two 48 V/60 V DC power supplies and supplies the 48 V power to six
ODUs.
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Table 16-6 provides the functions and features of the RPWR.


Table 16-6 Functions and features of the RPWR
Function and
Feature

RPWR

Input power

l Provides the 48 V power supply after converting the 48 V DC


power supply, which is realized through the internal power module.
l Receives the 48 V/60 V DC power system. The voltage of the two
input DC power supplies ranges from 38.4 V to 72 V.

Combiner function

Combines the power supplies.

Protection against
lightning, surge,
and short-circuit

Provides protection against lightning, surge, and short-circuit.

Protection function

In the case of the DC power interface, the differential-mode voltage


must be more than 2 kV and the common-mode voltage must be more
than 4 kV.

Filtering function

Provides the filtering for the power interface and has the structural
shielding that improves the electromagnetic compatibility.

Power output

Provides six 48 V power supplies for the ODU. The maximum power
consumption of each power supply is 60 W.

Alarm and
indication

Provides one board operation indicator.


l When the indicator turns red, it indicates that one or more power
modules are faulty.
l When the indicator is on and green, it indicates that the board works
normally and no alarms are reported.

Power supply
backup

The input of the power board supports the 1+1 hot backup. The output
of the power module has no backup.

16.2.4 Working Principle and Signal Flow


The RPWR consists of the combiner module, protection module, filtering module, DC/DC power
module (that is, power module), and status detection module.
Figure 16-5 shows the functional block diagram of the RPWR.

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Figure 16-5 Functional block diagram of the RPWR

Fuse 1

Power
module 1

IF port 1

Fuse 2

Power
module 2

IF port 2

Fuse 3

Power
module 3

IF port 3

Fuse 4

Power
module 4

IF port 4

Fuse 5

Power
module 5

IF port 5

Fuse 6

Power
module 6

IF port 6

-48V_1
-48V_2

Combiner
module

Protection
module

Filtering
module

Soft start
module

Board operation
indicator

Status
detection
module

Optical
coupling
isolation

Six channels

Signal Flow
The two 48 V power supplies pass through the combiner, protection, filtering, soft start, and
power modules after they are accessed to the power board. The voltage converting operation is
performed on the two 48 V power supplies at the power module (using the DC_I and DC_C
grounding mode). Then, six isolated ODU power supplies are sent to the IF board for processing
and finally are used to supply power to ODUs.

Status Detection Module


The status detection module checks whether the output power supply exists and reports the real
condition so that the STAT indicator indicates the condition. When the STAT indicator turns
red, it indicates that one ore more power modules are faulty. When the STAT indicator is on and
green, it indicates that the power supply works normally.

Power Module
The two 48 V power supplies enter the DC/DC power converting module after they traverse
the protection, filtering, and soft start modules. The power supplies are isolated by the internal
transformer of the power module so that six independent stable power supplies can be sent to
the status detection module and finally to the IF board.

16.2.5 Front Panel


The front panel of the RPWR has indicators, power input interfaces, and power output interfaces.

Diagram of the Front Panel


Figure 16-6 shows the appearance of the front panel of the RPWR.
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Figure 16-6 Front panel of the RPWR

RPWR
STAT

NEG(-)
RTN(+)
NEG(-)
RTN(+)
POWER1
POWER2
POWER3
POWER4
POWER4
POWER4

RPWR

Indicators
The front panel of the board has one indicator as follows: board hardware status indicator (STAT)
two colors (red and green)
For the meanings of the status of the indicator, see 24 Indicators.

Interfaces
The front panel of the RPWR has two power input interfaces and six power output interfaces.
Table 16-7 describes the types and usage of the interfaces of the RPWR.

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Table 16-7 Interfaces of the RPWR


Interface

Type of Interface

Usage

PWR1

48 V power input interface

Receives the 48 V power supply.

PWR2

48 V power input interface

Receives the 48 V power supply.

POWER1
POWER6

48 V power output interface

Supplies the 48 V power to the IF


board for processing. Then, the IF
board supplies the power to the ODU.

16.2.6 Valid Slots


The RPWR must be installed in a valid slot in the subrack. Otherwise, the RPWR cannot work
normally.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the RPWR are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the RPWR can be installed in slots 18 and
1117.

16.2.7 Feature Code


The RPWR does not have the feature code.

16.2.8 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the appearance of the board. Ensure that the board is not damaged. The front
panel and the steel plate in the rear must not be deformed.
Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check the connection of the hardware.
l The subrack power cable must be correctly connected to the RPWR in the corresponding
subrack. The connector of the subrack power cable must be tightened. If the connector is not
tightened, use a screwdriver to tighten the screws on the connector.
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l The power cable between the RPWR and the IF board must be correctly connected and
tightened.
For the connection between the RPWR and the subrack power cable and the connection of the
cable between the RPWR and the IFSD1, see "Installing and Routing IF Cables Connection
of IF Cables" in Quick Installation Guide.
Step 4 Required: Check the status of the indicator of the board. The indicator should be on and green,
which indicates that the board works normally.
----End

Configuring the Board


Step 1 The RPWR does not need to be configured on the U2000.
----End

Commissioning the Board


Step 1 Required: Use a multimeter to test the resistance between the 48 V interface and the BGND
interface of the DB3 cable connector. In normal cases, the resistance is not zero and is less than
100 Kohms. In this case, you can power on the RPWR.
Step 2 Check the color of the indicator of the RPWR. If the indicator is green, the RPWR works
normally. If the indicator is red, the RPWR is faulty.
----End

Checking the Operation of the Board


Step 1 Check whether the system works normally after the system is powered on.
----End

16.2.9 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

Troubleshooting
The power module output fault occurs on the RPWR frequently. When the power module output
fault occurs, the indicator is on and red, indicating an alarm. To rectify the fault, replace the
RPWR.
NOTE

The RPWR does not report the fault alarm signal and only turns on the alarm indicator.

Replacing the Board


NOTE

See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

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For information on how to replace the RPWR, see Replacing the Power Supply Board of the
ODU.

16.2.10 List of Alarms


The RPWR is not loaded with the software. Hence, the RPWR does not report an alarm.

16.2.11 List of Performance Events


The RPWR is not loaded with the software. Hence, the RPWR does not report a performance
event.

16.2.12 Technical Specifications


The technical specifications of the RPWR include the mechanical specifications, power
consumption, input voltage, and specifications of the fuse.

Mechanical Specifications
The mechanical specifications of the RPWR are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.4

Power Consumption
The maximum power consumption of the RPWR at room temperature (25C) is 45 W.

Input Voltage
The input voltage range of the RPWR is as follows:
l

If the standard voltage of the accessed power supply is -48 V, the voltage of the power
supply ranges from -38.4 V to -57.6 V.

If the standard voltage of the accessed power supply is -60 V, the voltage of the power
supply ranges from -48 V to -72 V.

Specifications of the Fuses


Two types of fuses are available for the main circuit and power modules of the RPWR.
l

Specifications of the fuse for the main circuit are as follows: fast blow fuse, 250 V, 20 A,
UL certificated, 0.00355 ohms, 631 A x A x second, UL/CSA/METI

Specifications of the fuse for the power modules of the RPWR are as follows: slow blow
fuse, surface-mounted fuse, 125 V, 4 A, UL certificated, 0.023 ohms, 23 A x A x second,
UL.

16.3 ODU
When the microwave board is used, it needs to work with the microwave outdoor unit (ODU).
The ODU types supported by the equipment are standard power (SP) and high power (HP).
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For more information on the ODU, see the ODU Hardware Description.

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17

WDM Boards

About This Chapter


The WDM boards include the CMR2, CMR4, MR2, MR2A, MR2C, MR4, LWX, and FIB.
17.1 CMR2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11CMR2 (2-channel optical add/drop multiplexing board).
17.2 CMR4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11CMR4 (4-channel optical add/drop multiplexing board).
17.3 CMD2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the CMD2 (2-channel bidirectional CWDM optical add/drop
multiplexing board).
17.4 MR2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11MR2 (2-channel optical add/drop multiplexing board).
17.5 MR2A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the MR2A (2-channel optical add/drop multiplexing board).
17.6 MR2C
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the MR2C (2-channel optical add/drop multiplexing board).
17.7 MR4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11MR4 (4-channel optical add/drop multiplexing board).
17.8 LWX
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the LWX (arbitrary bit rate wavelength conversion board).
17.9 FIB
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This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the FIB (filter isolating board).

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17.1 CMR2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11CMR2 (2-channel optical add/drop multiplexing board).

17.1.1 Version Description


The CMR2 is available in one functional version, namely, TN11.

17.1.2 Application
The CMR2 is mainly used to add/drop and multiplex two channels of wavelength signals to/
from the multiplexed signals.
Figure 17-1 shows the application of the CMR2 in the CWDM system.
Figure 17-1 Application of the CMR2 in the CWDM system

Optical transmission
network

CMR2

CMR2

Line
board

Line
board

Line
board

Remarks: The line board in this figure supports CWDM wavelength signals.

17.1.3 Functions and Features


The CMR2 is applied to the coarse wavelength division multiplexing (CWDM) system. The
channel spacing is 20 nm. The CMR2 supports the add/drop multiplexing function and channel
expansion function.
Table 17-1 provides the functions and features of the CMR2.
Table 17-1 Functions and features of the CMR2

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Function and
Feature

CMR2

Basic functions

Adds/Drops and multiplexes two signals to/from the multiplexed


signals.

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Function and
Feature

CMR2

Channel expansion

Provides the interface to cascade another optical add/drop


multiplexing board to realize the expansion of the add/drop channel.

17.1.4 Working Principle and Signal Flow


The CMR2 consists of the OADM module, communication and control module, and power
module.
Figure 17-2 shows the functional block diagram of the CMR2.
Figure 17-2 Functional block diagram of the CMR2
D1

IN

D2

MO

MI

Drop optical
module

A1

A2

Add optical
module

OUT

OADM optical
module
Control
Memory

CPU

Communication

Control and communication module


Power supply
module
Fuse

Required
voltage

DC power supply
from a backplane

Backplane
(controlled by SCC)
SCC

The CMR2 contains the OADM module that adds, drops, and multiplexes two channels of
signals. In addition, the CMR2 provides the interface to cascade another optical add/drop
multiplexing board to increase the add/drop capability. The CMR2 is a passive board and does
not have an interface with the backplane.

OADM Module
The board receives one multiplexed optical signal that is sent by the upstream station on the IN
interface. Then, the drop optical module drops two wavelengths from the signal through optical
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interfaces D01 and D02. The two dropped wavelengths are transmitted through the MO optical
interface.
The board receives one multiplexed signal that travels over the main optical path on the MI
optical interface. Then, the add optical module adds two wavelengths through optical interfaces
A01 and A02 and multiplexes them with the signal on the main optical path into one signal. This
multiplexed signal is transmitted through the OUT interface.

Communication and Control Module


l

Controls the operations of the entire board.

Collects the following information of each functional module of the board: alarms,
performance events, working status, and voltage detection.

Communicates data with the SCC.

DC/DC Converter
It converts 48 V DC or 60 V DC into a voltage required by each module of the board.

17.1.5 Front Panel


The front panel of the CMR2 has indicators, interfaces, and a laser safety class label.

Diagram of the Front Panel


Figure 17-3 shows the appearance of the front panel of the CMR2.

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Figure 17-3 Front panel of the CMR2


CMR2
STAT
LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

OUT
IN
MO
MI
D1
A1
D2
A2

CMR2

Indicator
The front panel of the CMR2 has one indicator as follows: board hardware status indicator
(STAT) two colors (red and green)
For the meanings of the status of the indicator, see 24 Indicators.

Interfaces
The front panel of the CMR2 has eight optical interfaces. Table 17-2 describes the types and
usage of the optical interfaces of the CMR2.
Table 17-2 Optical interfaces of the CMR2

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Interface

Type of
Interface

Usage

A1A2

LC

Receives the signals sent from the optical wavelength


converting board or centralized client-side equipment.

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Interface

Type of
Interface

Usage

D1D2

LC

Transmits signals to the optical wavelength converting board


or centralized client-side equipment.

IN

LC

Receives the multiplexed signals.

OUT

LC

Transmits the multiplexed signals.

MO

LC

Works as a cascading output optical interface and is connected


to the input optical interface of an OADM board.

MI

LC

Works as a cascading input optical interface and is connected


to the output optical interface of an OADM board.

17.1.6 Valid Slots


The CMR2 can be installed in slots 18 and 1117 in the main subrack.

17.1.7 Feature Code


The feature code of the CMR2 contains eight characters, which indicate the wavelengths of the
two channels of optical signals processed by the CMR2.
Table 17-3 describes the feature code of the CMR2.
Table 17-3 Feature code of the CMR2
Feature Code

Indication

Description

First four characters

Wavelength of optical
signals

Indicates the wavelength of


the first channel of optical
signals processed by the
CMR2.

Last four characters

Wavelength of optical
signals

Indicates the wavelength of


the second channel of optical
signals processed by the
CMR2.

Consider the TN11CMR2 whose feature code is "14711571" as an example. The meaning of
the feature code of the TN11CMR2 is as follows:
l

"1471" indicates that the wavelength of the first channel of optical signals is 1471 nm.

"1571" indicates that the wavelength of the second channel of optical signals is 1571 nm.

17.1.8 Technical Specifications


The technical specifications of the CMR2 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.
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Parameters Specified for Optical Interfaces


Table 17-4 lists the parameters specified for the optical interfaces of the CMR2.
Table 17-4 Parameters specified for the optical interfaces of the CMR2
Optical
Interface

Parameter

Value

Operating wavelength range


(nm)

1271 to 1611

Channel spacing (nm)

20

IN-D1
IN-D2

0.5 dB passband bandwidth


(nm)

6.5

Insertion loss (dB) on the


drop channel

1.5

Adjacent channel isolation


(dB)

> 25

Non-adjacent channel
isolation (dB)

> 35

0.5 dB passband bandwidth


(nm)

6.5

Insertion loss (dB) on the add


channel

1.5

IN-MO
MI-OUT

Insertion loss (dB)

1.0

Isolation (dB)

> 13

Return loss (dB)

> 40

A1-OUT
A2-OUT

Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power of
the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
The mechanical specifications of the CMR2 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.8

Power Consumption
The power consumption of the CMR2 at room temperature (25C) is 0 W.
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17.2 CMR4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11CMR4 (4-channel optical add/drop multiplexing board).

17.2.1 Version Description


The CMR4 is available in one functional version, namely, TN11.

17.2.2 Application
The CMR4 is mainly used to add/drop and multiplex four channels of wavelength signals to/
from the multiplexed signals.
Figure 17-4 shows the application of the CMR4 in the CWDM system.
Figure 17-4 Application of the CMR4 in the CWDM system

Optical transmission
network

CMR4

Line
board

Line
board

CMR4

Line
board

Line
board

Remarks: The line board in this figure supports CWDM wavelength signals.

17.2.3 Functions and Features


The CMR4 is applied to the CWDM system. The channel spacing is 20 nm. The CMR4 supports
the add/drop multiplexing function and channel expansion function.
Table 17-5 provides the functions and features of the CMR4.
Table 17-5 Functions and features of the CMR4

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Function and
Feature

CMR4

Basic functions

Adds/Drops and multiplexes four signals to/from the multiplexed


signals.

Channel expansion

Provides the interface to cascade another optical add/drop


multiplexing board to realize the expansion of the add/drop channel.

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17.2.4 Working Principle and Signal Flow


The CMR4 consists of the OADM module, communication and control module, and power
module.
Figure 17-5 shows the functional block diagram of the CMR4.
Figure 17-5 Functional block diagram of the CMR4
D01 D02 D03 D04

MO

MI

A01 A02 A03 A04

Drop

IN

Add

OUT

OADM module

Communication and control module

Pow er module
DC/DC
converter
Delayed
startup
Fuse
SCC

Backplane

-48 V/-60 V

-48 V/-60 V

SCC

OADM Module
The board receives one multiplexed optical signal that is sent by the upstream station on the IN
interface. Then, the drop optical module drops four wavelengths from the signal through optical
interfaces D01D04. The four dropped wavelengths are transmitted through the MO optical
interface.
The board receives one multiplexed signal that travels over the main optical path on the MI
optical interface. Then, the add optical module adds four wavelengths through optical interfaces
A01A04 and multiplexes them with the signal on the main optical path into one signal. This
multiplexed signal is transmitted through the OUT interface.

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Communication and Control Module


l

Controls the operations of the entire board.

Collects the following information of each functional module of the board: alarms,
performance events, working status, and voltage detection.

Communicates data with the SCC.

DC/DC Converter
It converts 48 V DC or 60 V DC into a voltage required by each module of the board.

17.2.5 Front Panel


The front panel of the CMR4 has indicators, interfaces, and a laser safety class label.

Diagram of the Front Panel


Figure 17-6 shows the appearance of the front panel of the CMR4.
Figure 17-6 Front panel of the CMR4
CMR4
STAT
LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

OUT
IN
MO
MI
D1
A1
D2
A2
D3
A3
D4
A4

CMR4

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Indicators
The front panel of the CMR4 has one indicator as follows: board hardware status indicator
(STAT) two colors (red and green)
For the meanings of the status of the indicator, see 24 Indicators.

Interfaces
The front panel of the CMR4 has 12 optical interfaces. Table 17-6 describes the types and usage
of the optical interfaces of the CMR4.
Table 17-6 Optical interfaces of the CMR4
Interface

Type of
Interface

Usage

A1A4

LC

Receives the signals sent from the optical wavelength


converting board or centralized client-side equipment.

D1D4

LC

Transmits signals to the optical wavelength converting


board or centralized client-side equipment.

IN

LC

Receives the multiplexed signals.

OUT

LC

Transmits the multiplexed signals.

MO

LC

Works as a cascading output optical interface and is


connected to the input optical interface of an OADM
board.

MI

LC

Works as a cascading input optical interface and is


connected to the output optical interface of an OADM
board.

17.2.6 Valid Slots


The CMR4 can be installed in slots 18 and 1117 in the main subrack.

17.2.7 Feature Code


The feature code of the CMR4 contains eight characters, which indicate the wavelengths of the
four channels of optical signals processed by the CMR4.
Table 17-7 describes the feature code of the CMR4.

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Table 17-7 Feature code of the CMR4


Feature Code

Indication

Description

1st and 2nd characters

Wavelength of optical
signals

The two characters are the


two middle characters of the
figure that indicates the
wavelength of the first
channel of optical signals
processed by the CMR4.

3rd and 4th characters

Wavelength of optical
signals

The two characters are the


two middle characters of the
figure that indicates the
wavelength of the second
channel of optical signals
processed by the CMR4.

5th and 6th characters

Wavelength of optical
signals

The two characters are the


two middle characters of the
figure that indicates the
wavelength of the third
channel of optical signals
processed by the CMR4.

7th and 8th characters

Wavelength of optical
signals

The two characters are the


two middle characters of the
figure that indicates the
wavelength of the fourth
channel of optical signals
processed by the CMR4.

Consider the TN11CMR4 whose feature code is "47495961" as an example. The meaning of
the feature code of the TN11CMR4 is as follows:
l

"47" indicates that the wavelength of the first channel of optical signals is 1471 nm.

"49" indicates that the wavelength of the second channel of optical signals is 1491 nm.

"59" indicates that the wavelength of the third channel of optical signals is 1591 nm.

"61" indicates that the wavelength of the fourth channel of optical signals is 1611 nm.

17.2.8 Technical Specifications


The technical specifications of the CMR4 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 17-8 lists the parameters specified for the optical interfaces of the CMR4.

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Table 17-8 Parameters specified for the optical interfaces of the CMR4
Optical
Interface

Parameter

Value

Operating wavelength range


(nm)

1291 to 1611 (1371 nm excluded)

Channel spacing (nm)

20

IN-D1
IN-D2
IN-D3
IN-D4

0.5 dB passband bandwidth


(nm)

6.5

Insertion loss (dB) on the


drop channel

Adjacent channel isolation


(dB)

> 25

Non-adjacent channel
isolation (dB)

> 35

A1-OUT
A2-OUT
A3-OUT
A4-OUT

0.5 dB passband bandwidth


(nm)

6.5

Insertion loss (dB) on the add


channel

IN-MO
MI-OUT

Insertion loss (dB)

1.5

Isolation (dB)

> 13

Return loss (dB)

> 40

Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power of
the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
The mechanical specifications of the CMR4 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.9

Power Consumption
The power consumption of the CMR4 at room temperature (25C) is 0 W.

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17.3 CMD2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the CMD2 (2-channel bidirectional CWDM optical add/drop
multiplexing board).

17.3.1 Version Description


The CMD2 is available in one functional version, namely, SSN1.

17.3.2 Application
The CMD2 adds/drops two channels of signals to/from the multiplexed channel in two
directions. The CMD2 complies with CWDM technical specifications.
The CMD2 supports two-fiber bidirectional transmission. Figure 17-7 shows the application of
the CMD2 in a CWDM system.
Figure 17-7 Application of the CMD2 in a CWDM system

Optical transmission
network

CMD2

Line board

Line board

CMD2

Line board

Line board

Remarks: The line board in this figure supports CWDM wavelength signals.

17.3.3 Functions and Features


The CMD2 is used to add/drop two channels of signals in a CWDM system.
Table 17-9 provides the functions and features of the CMD2.
Table 17-9 Functions and features of the CMD2
Function and
Feature
Basic functions

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CMD2
Adds/Drops two channels of signals to/from the multiplexed channel
in two directions.

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Function and
Feature

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CMD2

CWDM
specifications

Complies with CWDM technical specifications.

17.3.4 Working Principle and Signal Flow


The CMD2 consists of an OADM module and a communication module.
Figure 17-8 shows the functional block diagram of the CMD2.
Figure 17-8 Functional block diagram of the CMD2
D11 D12

IN1

A11

Drop

A12

Add

A21 A22

D21 D22

Add

OADM
module

Drop

IN2

OADM
module

OUT1

OUT2

Signal Flow
Optical port IN1 receives a multiplexed channel of signals from an upstream station and sends
the signals to the OADM module. The OADM module then demultiplexes two channels of
signals from the multiplexed channel, and sends one channel of signals to optical port D11 and
the other channel of signals to optical port D12.
Optical ports A11 and A12 each receive one channel of signals from the local station and send
the received signals to the OADM module. The OADM module then multiplexes the two
channels of signals and sends the multiplexed channel of signals to optical port OUT1.
Optical ports IN2 and OUT2 process signals in the same way as optical ports IN1 and OUT1
do, but in different directions.

Functions of the Board Modules


l

OADM module
Adds/Drops two CWDM channels of signals to/from the multiplexed channel.

17.3.5 Front Panel


The front panel of the CMD2 has optical interfaces.
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Diagram of the Front Panel


Figure 17-9 shows the appearance of the front panel of the CMD2.
Figure 17-9 Front panel of the CMD2
CMD2

CAUTION
HAZARDLEVEL 1M INVISIBLE
LASER RADIATION
DO NOT VIEW DIRECTLY WITH
NON-ATTENUATING OPTICAL
INSTRUMENTS

IN1 OUT1 A11 D11 A12 D12 IN2 OUT2 A21 D21 A22 D22

CMD2

NOTE

The number in the silkscreen under an optical interface on the front panel indicates one of the wavelengths
that are supported by the optical interface.

Indicators
The front panel of the CMD2 does not have any indicators.

Interfaces
The front panel of the CMD2 has 12 optical interfaces. Table 17-10 describes the types and
usage of the optical interfaces of the CMD2.
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Table 17-10 Optical interfaces of the CMD2


Interface

Type of
Interface

Usage

IN1

LC

Receives the first multiplexed channel of signals.

OUT1

LC

Transmits the first multiplexed channel of signals.

A11/A12

LC

Receives the first channel of signals transmitted from an optical


transponder board or the integrated client equipment.

D11/D12

LC

Transmits the first channel of signals to an optical transponder


board or the integrated client equipment.

IN2

LC

Receives the second multiplexed channel of signals.

OUT2

LC

Transmits the second multiplexed channel of signals.

A21/A22

LC

Receives the second channel of signals transmitted from an


optical transponder board or the integrated client equipment.

D21/D22

LC

Transmits the second channel of signals to an optical


transponder board or the integrated client equipment.

17.3.6 Valid Slots


The CMD2 occupies one slot.
The CMD2 can be installed in slots 19-26 and 29-36 in a main subrack. If an extended subrack
is connected to the main subrack, the CMD2 can also be installed in slots 69-76 and 79-86 in
the extended subrack.

17.3.7 Feature Code


No feature code is defined for the CMD2.

17.3.8 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The following
tasks need to be performed: checking the hardware of the board, configuring the board,
commissioning the board, and checking the operation of the board.

Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.
l The labels on the front panel of the board must be correct and clear.
l The daughter board of the board must be properly installed.
l All the components on both surfaces of the board must be available and intact.
Step 2 Required: Check whether the active board and standby board are installed in the correct slots.
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Step 3 Required: Check whether the wavelength specified on the label, attached to the front panel of
the board, is the same as the actually used wavelength.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
----End

Configuring the Board


Step 1 Required: The CMD2 is a passive board, and therefore a logical board needs to be added for it
on the NMS. For information on how to add a logical board for the CMD2 on the NMS, see
Adding Boards.
----End

Commissioning the Board


Step 1 Required: Test the insertion loss of the board. For details, see 17.3.10 Maintaining the
Board.
----End

Checking the Operation of the Board


Step 1 Required: Verify that the input/output directions of fibers connected to the board are correct.
Step 2 Required: Verify that the optical wavelength used by each optical port on the board is the same
as the information specified on the label.
----End

17.3.9 Parameter Settings


The CMD2 does not have any parameters to be set.

17.3.10 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also provides
the methods and precautions to be taken for rectifying the faults.

Testing Insertion Loss


Insertion loss is a key specification of an optical add/drop multiplexing board. If the insertion
loss of a board is normal, the board is not faulty; otherwise, the board is faulty or optical ports
on the board need to be cleaned. The methods of testing the insertion loss of an optical multiplexer
and demultiplexer board are as follows.
Figure 17-10 shows the diagram for testing the insertion loss of the CMD2.

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Figure 17-10 Diagram for testing the insertion loss of the CMD2
D11 D12

D21 D22

IN1

IN2
CMD2

OUT1

OUT2

A11 A12

A21 A22

Step 1 Required: Measure the input optical power Pi at the A11 port and the output optical power Po
at the OUT1 port on the CMD2. The optical power is expressed in dBm.
The value obtained by subtracting Po from Pi represents the insertion loss from the A11 port to
the OUT1 port.
In the case of the CMD2, use the preceding method to measure the insertion loss of IN1-D11,
A11-OUT1, IN1-D12, A12-OUT1, IN2-D21, A21-OUT2, IN2-D22, and A22-OUT2.
For the normal insertion loss value of the board, see 17.3.13 Technical Specifications.
----End

Troubleshooting
When all services on an NE are interrupted or a service on a WDM-side channel of the CMD2
is interrupted, the CMD2 may be faulty.
Step 1 Required: Check whether the insertion loss of the CMD2 is normal. For details, see the insertion
loss specification of the CMD2. If the insertion loss is excessively high, go to the next step.
Step 2 Required: Use a fiber cleaning tool to clean the internal and external fibers and optical ports
on the CMD2. Then, test the insertion loss again. If the insertion loss returns to normal, the fault
is rectified; if the insertion loss is still excessively high, go to the next step.
Step 3 Optional: The CMD2 is faulty. In this case, replace the CMD2.
----End

17.3.11 List of Alarms


No alarm is defined for the CMD2.

17.3.12 List of Performance Events


No performance event is defined for the CMD2.

17.3.13 Technical Specifications


The technical specifications of the CMD2 include the parameters specified for optical interfaces,
mechanical specifications, and power consumption.
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Parameters Specified for Optical Interfaces


Table 17-11 lists the parameters specified for the optical interfaces of the CMD2.
Table 17-11 Parameters specified for the optical interfaces of the CMD2
Optical
Interface

Parameter

Value

Operating wavelength range


(nm)

1471 to 1611

Channel spacing (nm)

20

IN1-D11
IN1-D12
IN2-D21
IN2-D22

1.0 dB passband bandwidth


(nm)

13.0

Insertion loss (dB) on the


drop channel

< 1.5

Adjacent channel isolation


(dB)

> 30

Non-adjacent channel
isolation (dB)

> 40

A11-OUT1
A12-OUT1
A21-OUT2
A22-OUT2

1.0 dB passband bandwidth


(nm)

13.0

Insertion loss (dB) on the add


channel

< 1.5

Reflectance (dB)

< -40

Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power of
the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
The mechanical specifications of the CMD2 are as follows:
l

Dimensions (mm): 22.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.6

Power Consumption
The power consumption of the CMD2 at room temperature (25C) is 0 W.

17.4 MR2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11MR2 (2-channel optical add/drop multiplexing board).
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17.4.1 Version Description


The MR2 is available in one functional version, namely, TN11.

17.4.2 Application
The MR2 is mainly used to add/drop and multiplex two channels of wavelength signals to/from
the multiplexed signals.
Figure 17-11 shows the application of the MR2 in the DWDM system.
Figure 17-11 Application of the MR2 in the DWDM system

Optical transmission
network

MR2

Line
board

Line
board

MR2

Line
board

Line
board

Remarks: The line board in this figure supports DWDM wavelength signals.

17.4.3 Functions and Features


The MR2 is applied to the dense wavelength division multiplexing (DWDM) system. The
channel spacing is 0.8 nm. The MR2 supports the add/drop multiplexing function and channel
expansion function.
Table 17-12 provides the functions and features of the MR2.
Table 17-12 Functions and features of the MR2

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Function and
Feature

MR2

Basic functions

Adds/Drops and multiplexes any two signals to/from the multiplexed


signals.

Channel expansion

Provides the interface to cascade another optical add/drop


multiplexing board to realize the expansion of the add/drop channel.

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17.4.4 Working Principle and Signal Flow


The MR2 consists of the OADM module, communication and control module, and power
module.
Figure 17-12 shows the functional block diagram of the MR2.
Figure 17-12 Functional block diagram of the MR2
D1

IN

D2

MO

MI

Drop optical
module

A1

A2

Add optical
module

OUT

OADM optical
module
Control
Memory

CPU

Communication

Control and communication module


Power supply
module
Fuse

Required
voltage

DC power supply
from a backplane

Backplane
(controlled by SCC)
SCC

OADM Module
The board receives one multiplexed optical signal that is sent by the upstream station on the IN
interface. Then, the drop optical module drops two wavelengths from the signal through optical
interfaces D01 and D02. The two dropped wavelengths are transmitted through the MO optical
interface.
The board receives one multiplexed signal that travels over the main optical path on the MI
optical interface. Then, the add optical module adds two wavelengths through optical interfaces
A01 and A02 and multiplexes them with the signal on the main optical path into one signal. This
multiplexed signal is transmitted through the OUT interface.

Communication and Control Module


l

Controls the operations of the entire board.

Collects the following information of each functional module of the board: alarms,
performance events, working status, and voltage detection.

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Communicates data with the SCC.

DC/DC Converter
It converts 48 V DC or 60 V DC into a voltage required by each module of the board.

17.4.5 Front Panel


The front panel of the MR2 has indicators, interfaces, and a laser safety class label.

Diagram of the Front Panel


Figure 17-13 shows the appearance of the front panel of the MR2.
Figure 17-13 Front panel of the MR2
MR2
STAT

LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

OUT
IN
MO
MI
D1
A1
D2
A2

MR2

Indicators
The front panel of the MR2 has one indicator as follows: board hardware status indicator (STAT)
two colors (red and green)
For the meanings of the status of the indicator, see 24 Indicators.
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Interfaces
The front panel of the MR2 has eight optical interfaces. Table 17-13 describes the types and
usage of the optical interfaces of the MR2.
Table 17-13 Optical interfaces of the MR2
Interface

Type of
Interface

Usage

A1A2

LC

Receives the signals sent from the optical wavelength


converting board or centralized client-side equipment.

D1D2

LC

Transmits signals to the optical wavelength converting


board or centralized client-side equipment.

IN

LC

Receives the multiplexed signals.

OUT

LC

Transmits the multiplexed signals.

MO

LC

Works as a cascading output optical interface and is


connected to the input optical interface of an OADM
board.

MI

LC

Works as a cascading input optical interface and is


connected to the output optical interface of an OADM
board.

17.4.6 Valid Slots


The MR2 can be installed in slots 18 and 1117 in the main subrack.

17.4.7 Feature Code


The feature code of the MR2 contains eight characters, which indicate the frequencies of the
two channels of optical signals processed by the MR2.
Table 17-14 describes the feature code of the MR2.
Table 17-14 Feature code of the MR2

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Feature Code

Indication

Description

First four (14) characters

Frequency of optical signals

The four characters are the


last four characters of the
figure that indicates the
frequency of the first channel
of optical signals processed
by the MR2.

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Feature Code

Indication

Description

Last four (58) characters

Frequency of optical signals

The four characters are the


last four characters of the
figure that indicates the
frequency of the second
channel of optical signals
processed by the MR2.

Consider the TN11MR2 whose feature code is "93609370" as an example. The meaning of the
feature code of the TN11MR2 is as follows:
l

"9360" indicates that the frequency of the first channel of optical signals is 193.60 THz.

"9370" indicates that the frequency of the second channel of optical signals is 193.70 THz.

17.4.8 Technical Specifications


The technical specifications of the MR2 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 17-15 lists the parameters specified for the optical interfaces of the MR2.
Table 17-15 Parameters specified for the optical interfaces of the MR2
Optical
Interface

Parameter

Value

Operating wavelength range


(nm)

1529 to 1561

Channel spacing (GHz)

100

IN-D1
IN-D2

0.5 dB passband bandwidth


(nm)

0.11

Insertion loss (dB) on the


drop channel

1.5

Adjacent channel isolation


(dB)

> 25

Non-adjacent channel
isolation (dB)

> 35

0.5 dB passband bandwidth


(nm)

0.11

Insertion loss (dB) on the add


channel

1.5

Insertion loss (dB)

1.0

A1-OUT
A2-OUT

IN-MO
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Optical
Interface

Parameter

Value

MI-OUT

Isolation (dB)

> 13

Return loss (dB)

> 40

Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power of
the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
The mechanical specifications of the MR2 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.9

Power Consumption
The power consumption of the MR2 at room temperature (25C) is 0 W.

17.5 MR2A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the MR2A (2-channel optical add/drop multiplexing board).

17.5.1 Version Description


The MR2A is available in one functional version, namely, N1. The N1MR2A is discontinued.

17.5.2 Application
The MR2A is mainly used to add/drop and multiplex two channels of wavelength signals to/
from the multiplexed signals.
Figure 17-14 shows the application of the MR2A in the DWDM system.

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Figure 17-14 Application of the MR2A in the DWDM system

Optical transmission
network

MR2A

Line
board

MR2A

Line
board

Line
board

Line
board

Remarks: The line board in this figure supports DWDM wavelength signals.

17.5.3 Functions and Features


The MR2A is applied to the DWDM system. The channel spacing is 0.8 nm. The MR2A supports
the add/drop multiplexing function between any two adjacent wavelengths.
Table 17-16 provides the functions and features of the MR2A.
Table 17-16 Functions and features of the MR2A

Issue 03 (2013-02-20)

Function and
Feature

MR2A

Basic functions

Adds/Drops any two adjacent standard wavelengths defined in ITU-T


G.692 (DWDM). The signals are transparently transmitted and the
operating wavelength ranges from 1535.82 nm to 1560.61 nm.

OTM function

One MR2A board can work as a two-channel add/drop OTM station,


as shown in Figure 17-15. Two MR2A boards can be cascaded to work
as a four-channel add/drop OTM station, as shown in Figure 17-16.

OADM function

Works as a two-channel add/drop OADM station when working with


the LWX. For details, see Figure 17-17.

Central wavelength

Supports the standard wavelengths defined in ITU-T


Recommendations. The channel spacing is 100 GHz.

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Figure 17-15 One MR2A board working as a two-channel add/drop OTM station
D2

D1

IN

MO

Drop

OUT

MI

Add
MR2A
A1

A2

Figure 17-16 Two MR2A boards being cascaded to work as a four-channel add/drop OTM
station
D2

D1

IN

D1

MO IN

Drop

OUT

Drop

MI OUT

Add
MR2A

D2

MO

MI

Add
MR2A

A1

A2

A1

A2

Figure 17-17 MR2A and LWX working as a two-channel add/drop OADM station

LWX
A2

D2
MO

Out
MR2A

In
D1

MI
A1

LWX

17.5.4 Working Principle and Signal Flow


The MR2A consists of the OADM module.
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Figure 17-18 shows the functional block diagram of the MR2A.


Figure 17-18 Functional block diagram of the MR2A
D01

D02

MO

MI

Drop

IN

A01

A02

Add

OUT

OADM
module

The MR2A contains the OADM module that adds, drops, and multiplexes two channels of
signals. In addition, the MR2A provides the interface to cascade another optical add/drop
multiplexing board to increase the add/drop capability. The MR2A is a passive board and does
not have an interface with the backplane.

OADM Module
The board receives one multiplexed optical signal that is sent by the upstream station on the IN
interface. Then, the drop optical module drops two wavelengths from the signal through optical
interfaces D01 and D02. The two dropped wavelengths are transmitted through the MO optical
interface.
The board receives one multiplexed signal that travels over the main optical path on the MI
optical interface. Then, the add optical module adds two wavelengths through optical interfaces
A01 and A02 and multiplexes them with the signal on the main optical path into one signal. This
multiplexed signal is transmitted through the OUT interface.

17.5.5 Front Panel


The front panel of the MR2A has interfaces and a laser safety class label.

Diagram of the Front Panel


Figure 17-19 shows the appearance of the front panel of the MR2A.

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Figure 17-19 Front panel of the MR2A

MR2A

CLASS 1
LASER
PRODUCT

OUT
IN
MO
MI
D1
A1
D2 A2

MR2A

Interfaces
The front panel of the MR2A has four LC optical interfaces. Table 17-17 describes the types
and usage of the optical interfaces of the MR2A.
Table 17-17 Optical interfaces of the MR2A

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Interface

Type of
Interface

Usage

A01A02

LC

Adds two wavelengths of signals from the local equipment.

D01D02

LC

Drops two wavelengths of signals to the local equipment.

IN

LC

Receives the multiplexed signals of two wavelengths.

OUT

LC

Transmits the multiplexed signals of two wavelengths.

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Interface

Type of
Interface

Usage

MO/MI

LC

Works as a cascading interface and cascades several MR2A


boards.

17.5.6 Valid Slots


The slots valid for the MR2A vary with the cross-connect capacity and subrack of the equipment.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the MR2A are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the MR2A can be installed in slots 18 and
1117 in the subrack.

17.5.7 Technical Specifications


The technical specifications of the MR2A include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 17-18 lists the parameters specified for the optical interfaces of the MR2A.
Table 17-18 Parameters specified for the optical interfaces of the MR2A

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Parameter

Value

Operating wavelength
range (nm)

The operating wavelength range is from 1535.82 nm to 1560.61


nm. The working wavelengths can be any two adjacent standard
wavelengths defined in ITU-T G.692 (DWDM).

Line code pattern

NRZ

Channel spacing (GHz)

100

Insertion loss on the add


channel or drop channel
(dB)

<2

Adjacent channel isolation


(dB)

> 25

Non-adjacent channel
isolation (dB)

> 35

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Parameter

Value

-0.5 dB channel bandwidth


(nm)

< 0.11

17 WDM Boards

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the MR2A are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the MR2A at room temperature (25C) is 0 W.

17.6 MR2C
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the MR2C (2-channel optical add/drop multiplexing board).

17.6.1 Version Description


The MR2C is available in one functional version, namely, N1.

17.6.2 Application
The MR2C is mainly used to add/drop and multiplex two channels of wavelength signals to/
from the multiplexed signals.
Figure 17-20 shows the application of the MR2C in the DWDM system.
Figure 17-20 Application of the MR2C in the DWDM system

MR2C

Line
board

Optical transmission
network

Line
board

MR2C

Line
board

Line
board

Remarks: The line board in this figure supports DWDM wavelength signals.

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17.6.3 Functions and Features


The MR2C is applied to the DWDM system. The channel spacing is 0.8 nm. The MR2C supports
the add/drop multiplexing function between any two adjacent wavelengths.
Table 17-19 provides the functions and features of the MR2C.
Table 17-19 Functions and features of the MR2C
Function and
Feature

MR2C

Basic functions

Adds/Drops any two adjacent standard wavelengths defined in ITUT G.692 (DWDM). The signals are transparently transmitted and the
operating wavelength ranges from 1535.82 nm to 1560.61 nm.

OTM function

One MR2C board can work as a two-channel add/drop OTM station,


as shown in Figure 17-21. Two MR2C boards can be cascaded to
work as a four-channel add/drop OTM station, as shown in Figure
17-22.

OADM function

Works as a two-channel add/drop OADM station when working with


the LWX. For details, see Figure 17-23.

Central wavelength

Supports the standard wavelengths defined in ITU-T


Recommendations. The channel spacing is 100 GHz.

Figure 17-21 One MR2C board working as a two-channel add/drop OTM station
D2

D1

IN

Drop

OUT

MO

MI

Add
MR2C
A1

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Figure 17-22 Two MR2C boards being cascaded to work as a four-channel add/drop OTM
station
D2

D1

IN

D1

MO IN

Drop

OUT
MR2C

MO

Drop

MI OUT

Add

D2

MI

Add

MR2C
A1

A2

A1

A2

Figure 17-23 MR2C and LWX working as a two-channel add/drop OADM station

LWX
A2

D2
MO

Out
MR2C

In
D1

MI
A1

LWX

17.6.4 Working Principle and Signal Flow


The MR2C consists of the OADM module.
Figure 17-24 shows the functional block diagram of the MR2C.
Figure 17-24 Functional block diagram of the MR2C
D01

IN

D02

MO

MI

Drop

A01

A02

Add

OUT

OADM
module

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The MR2C contains the OADM module that adds, drops, and multiplexes two channels of
signals. In addition, the MR2C provides the interface to cascade another optical add/drop
multiplexing board to increase the add/drop capability. The MR2C is a passive board and does
not have an interface with the backplane.

OADM Module
The board receives one multiplexed optical signal that is sent by the upstream station on the IN
interface. Then, the drop optical module drops two wavelengths from the signal through optical
interfaces D01 and D02. The two dropped wavelengths are transmitted through the MO optical
interface.
The board receives one multiplexed signal that travels over the main optical path on the MI
optical interface. Then, the add optical module adds two wavelengths through optical interfaces
A01 and A02 and multiplexes them with the signal on the main optical path into one signal. This
multiplexed signal is transmitted through the OUT interface.

17.6.5 Front Panel


The front panel of the MR2C has interfaces and a laser safety class label.

Diagram of the Front Panel


Figure 17-25 shows the appearance of the front panel of the MR2C.

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Figure 17-25 Front panel of the MR2C

MR2C

OUT AO1
AO2
MI
MO
DO2
DO1
IN
CLASS 1
LASER
PRODUCT

MR2C

Interfaces
The front panel of the MR2C has four pairs of LC optical interfaces. Table 17-20 describes the
types and usage of the optical interfaces of the MR2C.
Table 17-20 Optical interfaces of the MR2C

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Interface

Type of
Interface

Usage

A01A02

LC

Adds two wavelengths of signals from the local equipment.

D01D02

LC

Drops two wavelengths of signals to the local equipment.

IN

LC

Receives the multiplexed signals of two wavelengths.

OUT

LC

Transmits the multiplexed signals of two wavelengths.

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Interface

Type of
Interface

Usage

MO/MI

LC

Works as a cascading interface and cascades several MR2C


boards.

17.6.6 Valid Slots


The slots valid for the MR2C vary with the cross-connect capacity and subrack of the equipment.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the MR2C are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the MR2C can be installed in slots 1926
and 2936 in the subrack.

17.6.7 Technical Specifications


The technical specifications of the MR2C include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 17-21 lists the parameters specified for the optical interfaces of the MR2C.
Table 17-21 Parameters specified for the optical interfaces of the MR2C

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Parameter

Value

Operating wavelength
range (nm)

The operating wavelength range is from 1535.82 nm to 1560.61


nm. The working wavelengths can be any two adjacent standard
wavelengths defined in ITU-T G.692 (DWDM).

Line code pattern

NRZ

Channel spacing (GHz)

100

Insertion loss on the add


channel or drop channel
(dB)

<2

Adjacent channel isolation


(dB)

> 25

Non-adjacent channel
isolation (dB)

> 35

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Parameter

Value

-0.5 dB channel bandwidth


(nm)

< 0.11

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the MR2C are as follows:
l

Dimensions (mm): 22 (W) x 110 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the MR2C at room temperature (25C) is 0 W.

17.7 MR4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11MR4 (4-channel optical add/drop multiplexing board).

17.7.1 Version Description


The MR4 is available in one functional version, namely, TN11.

17.7.2 Application
The MR4 is mainly used to add/drop and multiplex four channels of wavelength signals to/from
the multiplexed signals.
Figure 17-26 shows the application of the MR4 in the DWDM system.
Figure 17-26 Application of the MR4 in the DWDM system

Optical transmission
network

MR4

Line
board

Line
board

MR4

Line
board

Line
board

Remarks: The line board in this figure supports DWDM wavelength signals.

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17.7.3 Functions and Features


The MR4 is applied to the DWDM system. The channel spacing is 0.8 nm. The MR4 supports
the add/drop multiplexing function and channel expansion function.
Table 17-22 provides the functions and features of the MR4.
Table 17-22 Functions and features of the MR4
Function and
Feature

MR4

Basic functions

Adds/Drops and multiplexes four continuous signals to/from the


multiplexed signals.

Channel expansion

Provides the interface to cascade another optical add/drop


multiplexing board to realize the expansion of the add/drop channel.

17.7.4 Working Principle and Signal Flow


The MR4 consists of the OADM module, communication and control module, and power
module.
Figure 17-27 shows the functional block diagram of the MR4.
Figure 17-27 Functional block diagram of the MR4
D01 D02 D03 D04

MO

MI

A01 A02 A03 A04

Drop

IN

Add

OUT

OADM module

Communication and control module

Pow er module
DC/DC
converter
Delayed
startup
Fuse
SCC

Backplane

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-48 V/-60 V

-48 V/-60 V

SCC

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OADM Module
The board receives one multiplexed optical signal that is sent by the upstream station on the IN
interface. Then, the drop optical module drops four wavelengths from the signal through optical
interfaces D01D04. The four dropped wavelengths are transmitted through the MO optical
interface.
The board receives one multiplexed signal that travels over the main optical path on the MI
optical interface. Then, the add optical module adds four wavelengths through optical interfaces
A01A04 and multiplexes them with the signal on the main optical path into one signal. This
multiplexed signal is transmitted through the OUT interface.

Communication and Control Module


l

Controls the operations of the entire board.

Collects the following information of each functional module of the board: alarms,
performance events, working status, and voltage detection.

Communicates data with the SCC.

DC/DC Converter
It converts 48 V DC or 60 V DC into a voltage required by each module of the board.

17.7.5 Front Panel


The front panel of the MR4 has indicators, interfaces, and a laser safety class label.

Diagram of the Front Panel


Figure 17-28 shows the appearance of the front panel of the MR4.

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Figure 17-28 Front panel of the MR4


MR4
STAT

OUT
IN
MO
IN
D1
A1
D2
A2
D3
A3
D4
A4
LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

MR4

Indicators
The front panel of the MR4 has one indicator as follows: board hardware status indicator (STAT)
two colors (red and green)
For the meanings of the status of the indicator, see 24 Indicators.

Interfaces
The front panel of the MR4 has 12 optical interfaces. Table 17-23 describes the types and usage
of the optical interfaces of the MR4.
Table 17-23 Optical interfaces of the MR4

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Interface

Type of
Interface

Usage

A1A4

LC

Receives the signals sent from the optical wavelength


converting board or centralized client-side equipment.

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Interface

Type of
Interface

Usage

D1D4

LC

Transmits signals to the optical wavelength converting


board or centralized client-side equipment.

IN

LC

Receives the multiplexed signals.

OUT

LC

Transmits the multiplexed signals.

MO

LC

Works as a cascading output optical interface and is


connected to the input optical interface of an OADM
board.

MI

LC

Works as a cascading input optical interface and is


connected to the output optical interface of an OADM
board.

17.7.6 Valid Slots


The MR4 can be installed in slots 18 and 1117 in the subrack.

17.7.7 Feature Code


The feature code of the MR4 contains eight characters, which indicate the frequencies of the
first channel and fourth channel of optical signals processed by the MR4.
Table 17-24 describes the feature code of the MR4.
Table 17-24 Feature code of the MR4
Feature Code

Indication

Description

First four (14) characters

Frequency of optical signals

The four characters are the


last four characters of the
figure that indicates the
frequency of the first channel
of optical signals processed
by the MR4.

Last four (58) characters

Frequency of optical signals

The four characters are the


last four characters of the
figure that indicates the
frequency of the fourth
channel of optical signals
processed by the MR4.

Consider the TN11MR4 whose feature code is "92109240" as an example. The meaning of the
feature code of the TN11MR4 is as follows:
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"9210" indicates that the frequency of the first channel of optical signals is 192.10 THz.

"9240" indicates that the frequency of the fourth channel of optical signals is 192.40 THz.

The four channels of optical signals processed by the MR4 are successive. Hence, we can infer
the following:
l

The frequency of the second channel of optical signals is 192.20 THz.

The frequency of the third channel of optical signals is 192.30 THz.

17.7.8 Technical Specifications


The technical specifications of the MR4 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 17-25 lists the parameters specified for the optical interfaces of the MR4.
Table 17-25 Parameters specified for the optical interfaces of the MR4
Optical Interface

Parameter

Value

Operating wavelength range (nm)

1529 to 1561

Channel spacing (GHz)

100

IN-D1
IN-D2
IN-D3
IN-D4

0.5 dB passband bandwidth (nm)

0.11

Insertion loss on the drop channel (dB)

2.2

Adjacent channel isolation (dB)

> 25

Non-adjacent channel isolation (dB)

> 35

A1-OUT
A2-OUT
A3-OUT
A4-OUT

0.5 dB passband bandwidth (nm)

0.11

Insertion loss on the add channel (dB)

2.2

IN-MO
MI-OUT

Insertion loss (dB)

1.5

Isolation (dB)

> 13

Return loss (dB)

> 40

Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power of
the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
The mechanical specifications of the MR4 are as follows:
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Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.9

Power Consumption
The power consumption of the MR4 at room temperature (25C) is 0 W.

17.8 LWX
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the LWX (arbitrary bit rate wavelength conversion board).

17.8.1 Version Description


The LWX is available in one functional version, namely, N1. The N1LWX is discontinued.

17.8.2 Application
The LWX is a wavelength conversion board. The LWX converts a wavelength at an arbitrary
rate (10 Mbit/s to 2.7 Gbit/s) into a standard wavelength defined in ITU-T G.692, and performs
the reverse process.
Figure 17-29 shows the application of the LWX in the DWDM system.
Figure 17-29 Application of the LWX in the DWDM system

Client side

Multiplexing

10 Mbit/s-2.7 Gbit/s

LWX

Demultiplexing

G.692

WDM side

G.692
LWX

WDM side

Client side

17.8.3 Functions and Features


The LWX converts a wavelength at an arbitrary rate (10 Mbit/s to 2.7 Gbit/s, NRZ code) on the
client side into a standard wavelength defined in ITU-T G.692, and performs the reverse process.
The LWX supports the optical wavelength conversion, 3R function, protection, and loopback
function.
Table 17-26 provides the functions and features of the LWX.
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Table 17-26 Functions and features of the LWX


Function
and Feature

LWX

Basic
functions

Converts a wavelength on the client side into a standard wavelength defined


in ITU-T G.692 (DWDM), and performs the reverse process.
Transparently transmits signals.

3R function

Provides the 3R function for the signals at a rate ranging from 10 Mbit/s to
2.7 Gbit/s on the client side, restores the clock, and monitors the rate.

Protection
schemes

Single fed and single


receiving

Supports the inter-board protection and 1+1 interboard hot standby protection. The protection
switching time is less than 50 ms.

Dual fed and


selective receiving

Supports the intra-board protection. One board can


realize the optical channel protection. The protection
switching time is less than 50 ms.

ALS function

Supports the ALS function. When the LWX does not receive light, the LWX
automatically turns off the corresponding optical transmit module.

Loopback
function

Supports inloops and outloops at optical interfaces so that faults can be


located quickly.

Performance
and alarm
monitoring

Reports various alarms and performance events, which facilitates the


maintenance of the equipment.

Central
wavelength

Supports the standard wavelengths defined in ITU-T Recommendations. The


channel spacing is 100 GHz.

17.8.4 Working Principle and Signal Flow


The LWX consists of the O/E converting module, cross-connect module, CDR module, logic
and control module, DC/DC converter, and other modules.
Figure 17-30 shows the functional block diagram of the LWX.

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Figure 17-30 Functional block diagram of the LWX


Loopback control

Reference clock

10 Mbit/s to 2.7
Gbit/s
Optical module on
the client side
10 Mbit/s to 2.7
Gbit/s

O/E

E/O

2x2 crossconnection

WDM side
loopback

Data
LOS
Laser
Communication
shutdown
and control
module
LOS

10 Mbit/s to 2.7
Gbit/s
Optical module 2
on the WDM side

Multi-rate
CDR

Client side
loopback
O/E
2x2 crossconnection

Multi-rate
CDR

Loopback control

Reference
clock

10 Mbit/s to 2.7
Gbit/s
Optical module 1
on the WDM side

O/E
Clock

10 Mbit/s to 2.7
Gbit/s
Optical
splitter

E/O

Data

LOS

Communication
and control
module
Communication

Laser shutdown

+3.3
V
DC/DC
converter

DC/DC
converter

Fuse

SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V backup
power

O/E Converting Module


l

The optical module on the client side applies SFP encapsulation and can be configured as
different types of optical modules. This module can transmit/receive the optical signals at
a rate ranging from 10 Mbit/s to 2.7 Gbit/s.

The optical module on the WDM side can be configured as an optical transceiver module,
or both an optical transceiver module and an optical receiver module. When two modules
are configured on the WDM side, an optical splitter is used to perform dual feeding.

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In the receive direction, the module converts the received optical signals into electrical
signals.

In the transmit direction, the module converts the electrical signals into SDH optical signals
and sends the SDH optical signals to fibers for transmission.

Detects the R_LOS alarm and provides the function of shutting down the laser.

Cross-Connect Module
l

Supports the data selection from the client side to the WDM side and the data selection
from the WDM side to the client side.

Supports the selection of WDM-side optical modules.

Supports the loopback of client-side signals.

Supports the loopback of WDM-side signals.

Restores the data and clock signals from the signals that are at a rate ranging from 10 Mbit/
s to 2.7 Gbit/s.

Reads the rates of the accessed services.

CDR Module

Logic and Control Module


l

Supports Ethernet communication.

Supports the reference clock of the CDR module.

Selects and configures the services of the other modules.

Controls the laser.

Selects the clock signal from the active and standby cross-connect boards.

Controls the indicators on the board.

DC/DC Converter
It converts the 48/60 V power supply into the DC voltages that the modules of the board
require.

17.8.5 Front Panel


The front panel of the LWX has indicators, interfaces, and a laser safety class label.

Diagram of the Front Panel


Figure 17-31 shows the appearance of the front panel of the LWX.

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Figure 17-31 Front panel of the LWX

LWX
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

TX
RX
OUT1 IN1
OUT2 IN2

LWX

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the LWX has six optical interfaces. Table 17-27 describes the types and usage
of the optical interfaces of the LWX.
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Table 17-27 Optical interfaces of the LWX


Interface

Type of
Interface

Usage

IN1IN2

LC

Receives the signals sent from the MR2A.

OUT1OUT2

LC

Transmits signals to the MR2A.

TX

LC

Transmits signals to the client-side equipment.

RX

LC

Receives the signals sent from the client-side


equipment.

17.8.6 Valid Slots


The slots valid for the LWX vary with the cross-connect capacity and subrack of the equipment.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the LWX are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the LWX can be installed in slots 18 and
1117 in the subrack.

17.8.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the LWX indicates the scheme that the optical interfaces use to receive and
transmit signals.
Table 17-28 provides the relationship between the feature code of the LWX and the signal
receive/transmit scheme.
Table 17-28 Relationship between the feature code of the LWX and the signal receive/transmit
scheme
Board

Feature Code

Signal Receive/Transmit Scheme

SSN1LWX01

01

Single fed and single receiving

SSN1LWX02

02

Dual fed and selective receiving

17.8.8 Parameter Settings


You can set the parameters for the LWX by using the U2000.
You can set the following parameters for the LWX by using the U2000:
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Path use status

Optical interface loopback

Service type

Client service bearer rate (M)

Laser status

Automatic laser shutdown

Current bearer rate (M)

Actual wavelength No./wavelength (nm)/frequency (THz)

Actual band type

Configure wavelength No./wavelength (nm)/frequency (THz)

Configure band type

SD trigger condition

17.8.9 Technical Specifications


The technical specifications of the LWX include the parameters specified for optical interfaces,
the safety class of the laser, mechanical specifications and power consumption.

Parameters Specified for Optical Interfaces


Table 17-29 and Table 17-30 list the parameters specified for the client-side and WDM-side
optical interfaces of the LWX.
Table 17-29 Parameters specified for the client-side optical interfaces of the LWX
Parameter

Value

Nominal bit rate

10 Mbit/s to 2.7 Gbit/s

Line code pattern

NRZ

Type of fiber

Single-mode LC

Single-mode LC

Single-mode LC

Transmission
distance (km)

15

40

80

Characteristics of the transmitter at point S

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Operating
wavelength range
(nm)

1260 to 1360

1260 to 1360

1500 to 1580

Maximum mean
launched power
(dBm)

+3

+3

Minimum mean
launched power
(dBm)

-5

-2

-2

Minimum extinction
ratio (dB)

+8.2

+8.2

+8.2

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Parameter

Value

Minimum side mode


suppression ratio
(dB)

30

30

30

Eye pattern mask

Complies with the


mask defined in ITUT G.957.

Complies with the


mask defined in ITUT G.957.

Complies with the


mask defined in ITUT G.957.

Characteristics of the receiver at point S


Receiver type

PIN

APD

APD

Receiver wavelength
range (nm)

1200 to 1600

1200 to 1600

1200 to 1600

Receiver sensitivity
(dBm)

-18

-27

-28

Minimum overload
(dBm)

-9

-9

Maximum
reflectance (dB)

-27

-27

-27

Table 17-30 Parameters specified for the WDM-side optical interfaces of the LWX
Parameter

Value

Channel
spacing (GHz)

100

Line code
pattern

NRZ

Characteristics of the transmitter at point Sn

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Transmission
distance (km)

640

170 (2 mW)

170 (10 mW)

360

Maximum mean
launched power
(dBm)

+3

+3

+7

+3

Minimum mean
launched power
(dBm)

-2

-2

-2

Minimum
extinction ratio
(dB)

+10

+10

+10

+10

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Parameter

Value

Nominal central
frequency
(THz)

192.10 to
196.00

192.10 to
196.00

192.10 to
196.00

192.10 to
196.00

Central
frequency
deviation (GHz)

12.5

12.5

12.5

12.5

Maximum -20
dB spectral
width (nm)

0.2

0.4

0.4

0.4

Minimum side
mode
suppression
ratio (dB)

35

35

35

35

Dispersion
compensation
(ps/nm)

12800

3400

3400

7200

Eye pattern
mask

Complies with
the mask
defined in ITUT G.957.

Complies with
the mask
defined in ITUT G.957.

Complies with
the mask
defined in ITUT G.957.

Complies with
the mask
defined in ITUT G.957.

Characteristics of the receiver at point Rn


Receiver type

APD

PIN

Receiver
wavelength
range (nm)

1200 to 1600

1200 to 1600

Receiver
sensitivity
(dBm)

-28

-18

Minimum
overload (dBm)

-9

Maximum
reflectance (dB)

-27

-27

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the LWX are as follows:
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Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.1

Power Consumption
The maximum power consumption of the LWX at room temperature (25C) is 30 W.

17.9 FIB
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the FIB (filter isolating board).

17.9.1 Version Description


The FIB is available in one functional version, namely, N1.

17.9.2 Application
The FIB is used in the remote optical pumping amplifier system. The FIB can realize longdistance optical regeneration transmission when it works with the single-wavelength longdistance board ROP.
Figure 17-32 shows the position of the FIB in an optical transmission system.
Figure 17-32 Position of the FIB in an optical transmission system
C (single span)
a (54 dB)
Optical
transmitter

BA17

G.652 fiber

FIB

b (18 dB)

Erbium
ROP
doped fiber G.652 fiber

->

ISO

Filter
1550.12

Optical
receiver

17.9.3 Functions and Features


The FIB filters and isolates one optical signals.
Table 17-31 provides the functions and features of the FIB.
Table 17-31 Functions and features of the FIB

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Function and
Feature

FIB

Optical isolator

The isolator allows optical signals to pass in a single direction. The


operating wavelength ranges from 1529 nm to 1561 nm.

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Function and
Feature

FIB

Optical filter

The filter filters out the wavelengths other than the 1550.12 nm
wavelength.

17.9.4 Working Principle and Signal Flow


The FIB consists of an isolator and a filter.
Figure 17-33 shows the functional block diagram of the FIB.
Figure 17-33 Functional block diagram of the FIB
Isolator

Filter

Optical signals are heavily attenuated and degraded after they travel for a long distance in fibers.
The degraded signals cannot be normally received by an optical receiver. Hence, an ROP needs
to be used to amplify the gain of the optical signals. To prevent other factors from affecting the
ROP because the ROP has high optical power, the FIB needs to be used to filter wavelengths.
The isolator of the FIB allows the optical signals to pass in a single direction. The filter of the
FIB filters out the wavelengths other than the 1550.12 nm wavelength. As a result, the optical
receiver receives the optical signals normally.

17.9.5 Front Panel


The front panel of the FIB has one channel of optical interface.

Diagram of the Front Panel


Figure 17-34 shows the appearance of the front panel of the FIB.

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Figure 17-34 Front panel of the FIB

FIB

CLASS 1
LASER
PRODUCT

OUT
IN

FIB

Interfaces
The front panel of the FIB has one optical interface. The optical interface is used to receive and
transmit one channel of optical signals. Table 17-32 describes the types and usage of the optical
interfaces of the FIB.
Table 17-32 Optical interfaces of the FIB

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Interface

Type of
Interface

Usage

IN

LSH

Receives one channel of optical signals.

OUT

LC

Transmits one channel of optical signals.

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17.9.6 Valid Slots


The slots valid for the FIB vary with the cross-connect capacity and subrack of the equipment.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the FIB are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the FIB can be installed in slots 18 and
1117 in the main subrack.

17.9.7 Technical Specifications


The technical specifications of the FIB include the parameters specified for optical interfaces,
mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 17-33 lists the parameters specified for the optical interfaces of the FIB.
Table 17-33 Parameters specified for the optical interfaces of the FIB
Parameter

Value

Nominal bit rate

2488320 kbit/s

Line code pattern

NRZ

Central wavelength
(nm)

1550.120.05

-0.5 dB bandwidth
(nm)

> 0.4

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the FIB are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.4

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Power Consumption
The maximum power consumption of the FIB at room temperature (25C) is 0 W.

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18

18 Auxiliary Boards

Auxiliary Boards

About This Chapter


This topic describes the auxiliary boards including the AUX and FAN.
18.1 AUX
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the AUX (system auxiliary interface board).
18.2 FAN
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the FAN (fan board).

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18.1 AUX
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the AUX (system auxiliary interface board).

18.1.1 Version Description


The AUX is available in one functional version, namely, N1.

18.1.2 Application
The AUX is a system auxiliary interface board. The AUX can be used on the OptiX OSN
equipment series to provide various management interfaces and auxiliary interfaces.

18.1.3 Functions and Features


The AUX provides various management and auxiliary interfaces for the system, and provides
the centralized backup for the +3.3 V power supply of the boards in the subrack.
Table 18-1 provides the functions and features of the AUX.
Table 18-1 Functions and features of the AUX
Item

AUX

Management
interface

l Provides the OAM interface, which supports the X.25 protocol.


l Provides the management serial interface F&f.
l Provides the 10M/100M NM interface.

Auxiliary interface

l Provides the serial interfaces Serial 1Serial 4, which can


function as four broadcast data interfaces or two pairs of time
interfaces. The two functions of the interfaces are mutually
exclusive.
l The two pairs of time interfaces work in full-duplex mode and
support synchronous time input and output of two channels.
l Both the time interface and the broadcast data interface support
the RS-422 level and RS-232 level.
l Provides one F1 interface for the 64 kbit/s codirectional data
channel.

External time
interface

l Supports the input and output of two channels of time signals,


with the external time transmitted in 1pps+TOD mode.
l For details about the external time input and output interfaces,
see Table 18-2 and Table 18-3.

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Item

AUX

Clock interface

l Provides two BITS clock input interfaces and two BITS clock
output interfaces (impedance: 120 ohms).
l Provides two BITS clock input interfaces and two BITS clock
output interfaces (impedance: 75 ohms).

Alarm interface

l Provides 16-input and 4-output alarm interfaces.


l Provides 4-output alarm cascading interfaces.

Cabinet alarm
indicator

l Provides four cabinet alarm indicator output interfaces.

Orderwire interface

l Provides two NNI connection signaling interfaces.

l Provides four cabinet alarm indicator input cascading interfaces.

l Provides one orderwire phone interface.


l Provides two NNI voice interfaces.
Commissioning
interface

Provides one commissioning interface COM.

Internal
communication

Realizes communication between boards in the subrack.

Power supply backup


and checking

l Monitors the two independent 48 V power supplies, detects the


overvoltage (72 V) and undervoltage (38.4 V) conditions, and
reports alarms to the SCC unit in the case of overvoltage or
undervoltage occurs.
l Provides the centralized backup for the +3.3 V power supply of
the boards in the subrack, which realizes the 1:N protection for
the secondary power supply of each board.
l Detects the overvoltage (+3.8 V) and undervoltage (+3.1 V)
conditions for the +3.3 V backup power supply.

Audible alarm

Supports the audible alarm and the clearing of the audible alarm.

Ethernet port
connection status
checking

Supports the checking of the Ethernet port connection status.

Note: The COM interface is used for internal commissioning only. That is, the COM interface
cannot be used for equipment monitoring. Otherwise, the Ethernet communication between
boards may become abnormal.

Table 18-2 External time input interfaces


External Time Input

TOD-Related Interfacea

1pps-Related Interface

Channel 1

S1

S3 (using the RS422 level)

S1

ALMI4 (using the TTL level)

S2

S4 (using the RS422 level)

Channel 2
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External Time Input

18 Auxiliary Boards

TOD-Related Interfacea

1pps-Related Interface

S2

ALMI4 (using the TTL level)

a: The TOD-related interfaces can use the RS232 level or RS422 level as required.

Table 18-3 External time input interfaces


External Time Output

TOD-Related Interfacea

1pps-Related Interface

Channel 1

S1

S3 (using the RS422 level)

Channel 2

S2

S4 (using the RS422 level)

a: The TOD-related interfaces can use the RS232 level or RS422 level as required.

18.1.4 Working Principle and Signal Flow


The AUX consists of the communication module, interface module, and power module.
Figure 18-1 shows the functional block diagram of the AUX.
Figure 18-1 Functional block diagram of the AUX
Backplane

F&f
OAM
One orderwire phone
interface
Two NNI voice interfaces
S1~S4
F1
16-input and 4-output alarm
interfaces
2-input and 2-output clock
interfaces

SCC A
SCC B

Interface
module

Cross-connect
unit

Four channels of subrack


indicator interface
Alarm cascading interface
ETH interface
(VLAN A)
COM interface
(VLAN B)

100/10 Mbit/s

EXT interface
(VLAN B)

100/10 Mbit/s

100/10 Mbit/s

19x100/10 Mbit/s
Ethernet bus
Communication
module

100/10 Mbit/s
100/10 Mbit/s

Power supply
module

Other units (VLAN B)


SCC A (VLAN A)
SCC B (VLAN A)

-48 V/-60 V
+3.3 V backup
power supply

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Communication Module
This module provides the network management interface for the active and standby GSCC
boards, OAM interface for remote maintenance, and interface for communication between
boards.

Interface Module
This module provides various auxiliary interfaces, including the F&f interface, OAM interface,
F1 interface, and clock input\output interface.

Power Module
This module provides the working power supply for the board and centralized +3.3 V backup
power supply for the other boards.

18.1.5 Jumpers
The jumper J9 is available in the lower right corner of the side panel of the AUX. The jumper
J9 is used to specify the subrack that works as the main subrack or extended subrack.
Figure 18-2 and Figure 18-3 show the position of the jumper J9 on the AUX.
Figure 18-2 Position of the jumper J9 on the AUX(version B)

Power
Module
J9

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Figure 18-3 Position of the jumper J9 on the AUX(version C)

NOTE

The AUX is available in two versions: version B and version C. For the AUX of version C, jumper J9 is
under the daughter board. You can find it only after the daughter board is removed.

Set the jumper J9 as follows:


l

To enable the subrack to work as the main subrack, cap the jumper J9.

To enable the subrack to work as the extended subrack, do not cap the jumper J9.

18.1.6 Front Panel


The front panel of the AUX has indicators and interfaces of various types.

Diagram of the Front Panel


Figure 18-4 shows the appearance of the front panel of the AUX.

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Figure 18-4 Front panel of the AUX

AUX
STAT

CLKI2

CLKO2

CLKI1

CLKO1

CLK2

CLK1

ETH

REV

COM

F&f

EXT

F1

LAMP1

PHONE

LAMP2 ALMO1 ALMO2

V1
V2
OAM

ALMI1

S1

ALMI2

S2

ALMI3

S3

ALMI4

S4

AUX

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the AUX has 28 interfaces. Table 18-4 describes the types and usage of the
interfaces of the AUX.
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Table 18-4 Interfaces of the AUX

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Interface

Type of
Interface

Usage

CLKO1

SMB

75-ohm clock output interface 1

CLKO2

SMB

75-ohm clock output interface 2

CLK1

RJ-45

120-ohm clock input/output interface 1

REV

RJ-45

Reserved

F&f

RJ-45

F&f interface

F1

RJ-45

F1 interface

PHONE

RJ-45

Orderwire phone interface

V1

RJ-45

NNI voice interface 1

V2

RJ-45

NNI voice interface 2

OAM

RJ-45

OAM interface

S1

RJ-45

Serial 1

S2

RJ-45

Serial 2

S3

RJ-45

Serial 3

S4

RJ-45

Serial 4

CLKI1

SMB

75-ohm clock input interface 1

CLKI2

SMB

75-ohm clock input interface 2

CLK2

RJ-45

120-ohm clock input/output interface 2

ETH

RJ-45

NM interface

COM

RJ-45

Commissioning interface

EXT

RJ-45

Interface for connection to the extended subrack

LAMP1

RJ-45

Cabinet alarm indicator output interface

LAMP2

RJ-45

Cabinet alarm indicator cascading input interface

ALMO1

RJ-45

Interface for the 1st to the 4th channels of alarm


outputs

ALMO2

RJ-45

Alarm signal cascading interface

ALMI1

RJ-45

Interface for the 1st to the 4th channels of alarm


inputs

ALMI2

RJ-45

Interface for the 5th to the 8th channels of alarm


inputs

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Interface

Type of
Interface

Usage

ALMI3

RJ-45

Interface for the 9th to the 12th channels of alarm


inputs

ALMI4

RJ-45

Interface for the 13th to the 16th channels of alarm


inputs

Note: S1/S3 and S2/S4 form a pair of time input and output interfaces.

Table 18-5 describes the pins of the CLK1 and CLK2 interfaces.
Table 18-5 Pins of the CLK1 and CLK2 interfaces
Front View

Pin

Usage

Receiving ()

Receiving (+)

Grounding

Transmitting ()

Transmitting (+)

Grounding

7, 8

Unspecified

Table 18-6 describes the pins of the ETH, COM, EXT, and F1 interfaces.
Table 18-6 Pins of the ETH, COM, EXT, and F1 interfaces
Front View

Pin

Usage

Transmitting (+)

Transmitting ()

Receiving (+)

Unspecified

Unspecified

Receiving ()

7, 8

Unspecified

Table 18-7 describes the pins of the F&f interface.


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Table 18-7 Pins of the F&f interface


Front View

Pin

Usage

Receive end for RS-232 data

Grounding

Transmit end for RS-232 data

1, 2, 3, 6, 7

Unspecified

Table 18-8 describes the pins of the PHONE, V1, and V2 interfaces.
Table 18-8 Pins of the PHONE, V1, and V2 interfaces
Front View

Pin

Usage

Signal 1

Signal 2

1, 2, 3, 6, 7, 8

Unspecified

Table 18-9 describes the pins of the LAMP1 and LAMP2 interfaces.
Table 18-9 Pins of the LAMP1 and LAMP2 interfaces
Front View

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Pin

Usage

Critical alarm signal (+)

Critical alarm signal ()

Major alarm signal (+)

Power indicator driving signal


(+)

Power indicator driving signal


()

Major alarm signal ()

Minor alarm signal (+)

Minor alarm signal ()

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Table 18-10 describes the pins of the ALM01 and ALM02 interfaces.
Table 18-10 Pins of the ALM01 and ALM02 interfaces
Front View

Pin

Usage

Critical and major alarm signal output


(+)

Critical and major alarm signal output


()

Minor and warning alarm signal output


(+)

Alarm signal output 1 (+)

Alarm signal output 1 ()

Minor and warning alarm signal output


()

Alarm signal output 1 (+)

Alarm signal output 1 ()

Table 18-11 describes the pins of the OAM interface.


Table 18-11 Pins of the OAM interface
Front View

Pin

Usage

Requests for transmission.

Transmits the DTE ready signal.

Transmits data.

Grounding

Grounding

Receives data.

Transmits the DCE ready signal.

Ready for receiving signals.

Table 18-12 describes the pins of the S1, S2, S3, and S4 interfaces.

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Table 18-12 Pins of the S1, S2, S3, and S4 interfaces of the AUX
Front View

Pin

Usage

RS-422 data transmitting (+)

RS-422 data transmitting ()

RS-422 data receiving (+)

Receive end for RS-232 data

Grounding

RS-422 data receiving ()

Unspecified

Transmit end for RS-232 data

Table 18-13 describes the pins of the ALMI1 interface.


Table 18-13 Pins of the ALMI1 interface
Front View

Pin

Usage

Alarm input 1

Ground for alarm input 1

Alarm input 2

Alarm input 3

Ground for alarm input 3

Ground for alarm input 2

Alarm input 4

Ground for alarm input 4

Table 18-14 lists the pins of the ALMI2 interface.

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Table 18-14 Pins of the ALMI2 interface


Front View

Pin

Usage

Alarm input 5

Ground for alarm input 5

Alarm input 6

Alarm input 7

Ground for alarm input 7

Ground for alarm input 6

Alarm input 8

Ground for alarm input 8

Table 18-15 describes the pins of the ALMI3 interface.


Table 18-15 Pins of the ALMI3 interface
Front View

Pin

Usage

Alarm input 9

Ground for alarm input 9

Alarm input 10

Alarm input 11

Ground for alarm input 11

Ground for alarm input 10

Alarm input 12

Ground for alarm input 12

Table 18-16 describes the pins of the ALMI4 interface.

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Table 18-16 Pins of the ALMI4 interface


Front View

Pin

Usage

Alarm input 13

Ground for alarm input 13

Alarm input 14

Alarm input 15

Ground for alarm input 15

Ground for alarm input 14

Alarm input 16

Ground for alarm input 16

Connections for Alarm Cascading


l

Connections for alarm signal cascading

Figure 18-5 shows the connections when one or multiple cabinets input or output alarm signals.
Connect the alarm output interface to the alarm cascading interface of a lower level. Make the
connections one by one until the alarm output is connected to the centralized alarm system.
Figure 18-5 Connections for alarm input, alarm cascading, and alarm output
Cabinet1

Cabinet2

Subrack1

Centralized
alarm system

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Subrack3

ALMO1

ALMO1

ALMO2

ALMO2

ALMI1

ALMI1

Subrack2

Subrack4

ALMO1

ALMO1

ALMO2

ALMO2

ALMI1

ALMI1

Connections of cabinet alarm indicators

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Figure 18-6 shows the connections of the 4-channel cabinet alarm indicators. Connect LAMP1
of subrack 2 to LAMP2 of subrack 1. Finally, connect LAMP1 of subrack 1 to the indicator
interface at the top of the cabinet.
Figure 18-6 Connections of cabinet alarm indicators
4 cabinet
alarm indicators

Cabinet indicator
subrack 1

LAMP1
LAMP2

subrack 2
LAMP1
LAMP2

18.1.7 Valid Slots


The AUX can be installed in slot 37 in the subrack.

18.1.8 Technical Specifications


The technical specifications of the AUX include the mechanical specifications and power
consumption.

Mechanical Specifications
The mechanical specifications of the AUX are as follows:
l

Dimensions (mm): 44 (W) x 110 (D) x 254.1 (H)

Weight: 1.0 kg

Power Consumption
At room temperature (25C), the maximum power consumption of the AUX is 19 W.

18.2 FAN
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the FAN (fan board).

18.2.1 Version Description


The FAN is available in one functional version, namely, N1.
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The logical board of fan tray assembly XE1FAN is displayed as N1FAN on the U2000. The
XE1FAN is of the two-layer structure. The one-layer fan is no longer manufactured.

18.2.2 Application
The FAN is a system fan board. The FAN can be used on the OptiX OSN equipment series to
provide the heat dissipation function.

18.2.3 Functions and Features


The FAN adjusts the fan speed, checks the fan status, reports the fault of the fan control board,
and reports the off-position alarm of the fan.
Table 18-17 provides the functions and features of the FAN.
Table 18-17 Functions and features of the FAN
Function and
Feature

FAN

Function of
intelligent speed
adjustment

Provides the following functions of intelligent speed adjustment:


l Automatically adjusts the fan speed.
When the temperature difference in the local area is more than
43C, the fans operate at low speed.
When the temperature difference in the local area is less than
43C, the fans operate at medium speed.
When the temperature difference in the local area is less than
33C, the fans operate at high speed.
l Ensures that the fan operates at full speed when the speed
adjustment signal is abnormal.
l In normal situations, all the fan tray assemblies operate normally.
When one fan tray assembly reports an alarm, the other fan tray
assemblies adjust the fan speed to operate at full speed.

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Hot swapping
function

Provides the hot swapping function for the fan tray assembly.

Backup function

Provides the mutual backup function for the power supplies of the fans
in the fan tray assemblies.

Status checking

Supports the checking of the fan status.

Alarm function

Reports the fan alarm and in-service information.

Fan backup

The two fans in the fan tray assembly function as a backup for each
other. The two fans operate at the same time. When one fan is faulty,
the other fan adjusts the speed to operate at full speed.

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NOTE

When one fan of the three fan tray assemblies fails, the system can work normally for 96 hours at
the ambient temperature ranging from 0C to 45C.

The fan tray assembly must be replaced when one of the following situations occurs.
l One or more fans in each fan tray assembly of the three fan tray assemblies are faulty.
l Two fans in a fan tray assembly are faulty.

When a fan tray assembly works normally, the upper fan and lower fan in the fan tray assembly
operate at the same speed.

18.2.4 Working Principle and Signal Flow


The FAN consists of the fan control unit and fan power supply unit.
Figure 18-7 shows the functional block diagram of the XE1FAN.
Figure 18-7 Functional block diagram of the XE1FAN
Status signal
Speed adjusting signal
Status signal

Fan control
unit
Fan

Alarm signal
Power
Fan power
supply
unit

External power supply 1


External power supply 2

Fan Power Supply Unit


This unit provides the driving voltage for the fan to operate.

Fan Control Unit


The fan control unit controls the operation speed of the fan through the speed adjusting signal.
The fan control unit also detects its faults, faults in the fans, and faults in the fan power supply
unit. When detecting any fault, the fan control unit reports alarm information and the SCC then
issues commands to enable other fans to operate at full speed. The fan control unit also receives
commands from the SCC when the temperature is very low, and stops the fans. The fan control
unit detects the fault in the fan power supply unit, speed adjusting signal, fan state, and in-position
state of the FAN.

18.2.5 Front Panel


The front panel of the FAN has indicators.

Diagram of the Front Panel


The OptiX OSN equipment series use a modular fan platform.
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One subrack uses three fan tray assemblies, as shown in Figure 18-8.
Figure 18-8 Modular fan tray assembly

Indicators
The indicator (STATE) on the front panel of the board indicates the running state of the hardware.
This indicator is red, green, or yellow when it is on.
For the meanings of the status of the indicator, see 24 Indicators.

18.2.6 Valid Slots


The FAN can be installed in slots 3840 in the subrack.

18.2.7 Technical Specifications


The technical specifications of the FAN include the mechanical specifications, power
consumption, and working voltages.

Mechanical Specifications
The mechanical specifications of the FAN are as follows:
l

Dimensions (mm): 120 (W) x 120 (D) x 50.8 (H)

Weight of the XE1FAN: 1.5 kg

Weight of the XE3FAN:1.2 kg

Power Consumption
At room temperature (25C), the maximum power consumption of each fan assembly of the
XE1FAN is 16 W when the input voltage is -48 V.
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At room temperature (25C), the maximum power consumption of each fan assembly of the
XE3FAN is 16 W when the input voltage is -48 V.

Working Voltages
The working voltages of the FAN can be -48 V20% DC or -60 V20% DC.

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19

19 Optical Amplifier Boards and Dispersion Compensation


Boards

Optical Amplifier Boards and

Dispersion Compensation Boards

About This Chapter


This topic describes the optical amplifier boards and the dispersion compensation boards.
19.1 BA2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the BA2 (optical booster amplifier board).
19.2 BPA
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the BPA (optical booster and pre-amplifier board).
19.3 COA
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the COA (case-shaped optical amplifier).
19.4 RPC01
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the RPC01 (forward Raman driving board).
19.5 RPC02
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the RPC02 (backward Raman driving board).
19.6 OBU1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11OBU1 (optical booster amplifier board).
19.7 DCU
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the DCU (dispersion compensation board).

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Boards

19.1 BA2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the BA2 (optical booster amplifier board).

19.1.1 Version Description


The BA2 is available in one functional version, namely, N1.

19.1.2 Application
The BA2 is a two-channel optical power amplifier board. The BA2 amplifies the power of optical
signals and is applicable to the long-distance optical fiber transmission.
Figure 19-1 shows the position of the BA in an optical transmission system.
Figure 19-1 Position of the BA in an optical transmission system
Tx

BA

Rx

19.1.3 Functions and Features


During the long-haul transmission of optical signals, the attenuation of the signals is high. Hence,
the BA is required to ensure that the optical receiver can receive normal optical signals.
The BA2 amplifies the power of two-channel optical signals. Table 19-1 provides the functions
and features of the BA2.
Table 19-1 Functions and features of the BA2

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Function and
Feature

BA2

Basic functions

Increases the launched optical power of the line board to 1315 dBm
or 1518 dBm. As a result, when the G.652 optical fiber with a loss
of 0.275 dB/km is used, the transmission distance can be 120 km, 130
km, or above.

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Boards

Function and
Feature

BA2

Supporting the
EDFA

Supports the automatic control of the laser temperature and optical


power of the EDFA module.
Supports the automatic monitoring of the input and output optical
power of the EDFA module and query of the optical power of the
EDFA module.
Supports the protection function of the EDFA module. When no
optical signals are received, the laser is automatically turned off.
When optical signals are received, the laser is automatically turned
on.

Performance events
and alarms
monitoring

Supports the reporting of the performance parameters of the laser.


Reports various alarms and performance events, which facilitates the
management and maintenance of the equipment.

Software upgrade

Supports the software upgrade and expansion without interrupting


services.

CAUTION
The wavelength of the optical signal transmitted to the BA2 must be within the range from 1530
nm to 1565 nm. Otherwise, the input optical signal cannot be amplified correctly. Hence, make
sure that the output wavelength of the line board that is interconnected with the BA2 is within
the required range.
NOTE

The BA2 provides the intelligent power adjustment (IPA) function. When the IPA function is enabled and
no input signals are detected on the receive side of a line board, the pumping laser is turned off to prevent
high laser power from damaging the eyes.

19.1.4 Working Principle and Signal Flow


The BA2 consists of the EDFA module, control module, communication module, and DC/DC
converter module.
Figure 19-2 shows the functional block diagram of the BA2.

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Boards

Figure 19-2 Functional block diagram of the BA2


Optical
input

Fiber
distributor

EDFA module
Doped
erbium
fiber
WDM
Input
Output
isolate
isolate
coupler

Input
power
monitor
(Pin1)
Input
power

Optical
splitter

Filter

Optical
output

Output
power
monitor
(Pin2)

Laser pump

Pump Pump Temperat


current
ure
current detect
Laser
shutdown
Manual
LOS in
control
AD/DA

Output
power
Pump
temperature
control

Control&Generation alarms
Control module

Communication
module
+3.3 V
DC/DC
converter
module

DC/DC
converter
module

Communication
SCC unit

Fuse

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V
backup
power

EDFA Module
The optical amplifier unit consists of two EDFA modules. One module is the BA and the other
module is the PA. When the board is used as a PA, an optical filter with 1550.12 nm as the
central wavelength is added to the optical output end of the module. A BA does not have the
filter. A semi-conductor laser bump with 980 nm as the central wavelength is in the erbium fiber
inside the EDFA module. Bump light and input signal light are coupled into the erbium fiber
through an optical coupler. The input and output optical signals of the module are led out by two
fiber splitters according to a specific coupling ratio. Then, the optical signals are converted into
optical current by two PIN photoelectrical diodes. The input and output power of the EDFA
module is determined according to the optical signals. The module also applies optical isolating
measures at the input and output ends to improve the performance of the module.

Control Module
The control module performs the following functions:
l

Detects and drives bump electricity.

Controls the temperature of the bump laser.

Detects the input and output power.

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Boards

Reports alarms.

The control module consists of the A/D converting unit, D/A converting unit, and CPU. The A/
D converting unit converts the temperature value of the cooling electricity and the input/output
optical power from analog values into digital values. The converted values are sent to the CPU,
which generates performance reporting events or alarms. The A/D converting unit also converts
bump electricity from analog values into digital values. The converted values are also sent to
the CPU. After the CPU processes the converted values, the D/A converting unit precisely
controls the driving analog circuit of the bump laser of the EDFA optical module. The internal
temperature of the bump laser module remains at 25C. The temperature sensor inside the bump
laser outputs temperature change to drive the cooler to keep the internal temperature of the bump
laser module at 25C.

Communication Module
The communication module supports Ethernet communication.

DC/DC Converter Module


It converts the 48/60 V power supply into the DC voltages that the modules of the board
require.

19.1.5 Front Panel


The front panel of the BA2 has indicators and interfaces.

Diagram of the Front Panel


The BA2 is available in two types, namely, one-interface BA2 and two-interface BA2.
Figure 19-3 shows the appearance of the front panel of the one-interface BA2.

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Figure 19-3 Front panel of the one-interface BA2

BA2
STAT
ACT
PROG
SRV

LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

OUT1
IN1

BA2

Figure 19-4 shows the appearance of the front panel of the two-interface BA2.

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Boards

Figure 19-4 Front panel of the two-interface BA2

BA2
STAT
ACT
PROG
SRV

LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

OUT1
IN1
OUT2 IN2

BA2

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the one-interface BA2 has one optical interface. The optical interface transmits
and receives one channel of optical signals. The one-interface BA2 uses the swappable optical
module, which facilitates the maintenance and upgrading of the optical module.
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Boards

The front panel of the two-interface BA2 has two optical interfaces. The optical interfaces
transmit and receive two channels of optical signals. The two-interface BA2 uses the swappable
optical module, which facilitates the maintenance and upgrading of the optical module.

WARNING
If the front panel of the one-interface BA2 has two LC optical interfaces, only the upper optical
interface (IN1/OUT1) is valid. In the case of the BA2 whose front panel has two LC optical
interfaces, determine whether the BA2 is a one-interface BA2 or a two-interface BA2 according
to 19.1.7 Feature Code.
Table 19-2 describes the type and usage of the optical interface of the one-interface BA2.
Table 19-2 Optical interface of the one-interface BA2
Interface

Type of
Interface

Usage

IN

LC

Receives one channel of optical signals.

OUT

LC

Transmits one channel of optical signals.

Table 19-3 describes the types and usage of the optical interfaces of the two-interface BA2.
Table 19-3 Optical interfaces of the two-interface BA2
Interface

Type of Interface

Usage

IN1

LC

Receives the first channel of optical signals.

OUT1

LC

Transmits the first channel of optical signals.

IN2

LC

Receives the second channel of optical signals.

OUT2

LC

Transmits the second channel of optical signals.

19.1.6 Valid Slots


The slots valid for the BA2 vary with the cross-connect capacity and subrack of the OptiX OSN
equipment.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the BA2 are as follows:


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Boards

When the cross-connect capacity is 200 Gbit/s, the BA2 can be installed in slots 18 and
1117 in the subrack.

19.1.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the BA2 indicates the output optical power of the optical interfaces.
Table 19-4 provides the relationship between the feature code of the BA2 and the output optical
power.
Table 19-4 Relationship between the feature code of the BA2 and the output optical power
Board

Feature Code

Output Optical Power

SSN1BA201

01

Dual-channel optical power


amplification: 14 dBm

SSN1BA202

02

Dual-channel optical power


amplification: 17 dBm

SSN1BA203

03

Optical power amplification:


14 dBm

SSN1BA204

04

Optical power amplification:


17 dBm

SSN1BA205

05

Dual-channel optical power


amplification: 14 dBm and 17
dBm

19.1.8 Technical Specifications


The technical specifications of the BA2 include the parameters specified for optical interfaces,
mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 19-5 lists the parameters specified for the optical interfaces of the BA2.
Table 19-5 Parameters specified for the optical interfaces of the BA2

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Parameter

Value

Nominal bit rate

2488320 kbit/s and 9953280 kbit/s

Application code

V-16.2, U-16.2, L-64.2, V-64.2, and U-64.2

Line code pattern

NRZ

Input wavelength (nm)

BA: 1530 to 1565

Input optical power


(dBm)

BA: -6 to +3

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Boards

Parameter

Value

Output optical power


(dBm)

BA: 13 to 15 or 15 to 17

Noise figure (dB)

BA: < 6.5

Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power of
the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
The mechanical specifications of the BA2 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 1.0

Power Consumption
The maximum power consumption of the BA2 at room temperature (25C) is 20 W.

19.2 BPA
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the BPA (optical booster and pre-amplifier board).

19.2.1 Version Description


The BPA is available in the following functional versions: N1 and N2. The N1BPA is
discontinued.
Table 19-6 describes the versions of the BPA.
Table 19-6 Versions of the BPA

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Item

Description

Functional Versions

The BPA is available in two functional versions, namely, N1


and N2.

Differences

The N1BPA consists of two EDFA optical modules, whereas


the N2BPA has only one EDFA optical module.

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Boards

Item

Description

Substitution

The two versions can substitute for each other when certain
conditions are met. If the ALS function is required and the
N2BPA is used to substitute for the N1BPA, enable the ALS
function on the N2BPA. If the ALS function is required and the
N1BPA is used to substitute for the N2BPA, enable the ALS
function on the line board. If the ALS function is not required,
this restriction is not applicable.

19.2.2 Application
The BPA is an optical booster and pre-amplifier board. The BPA provides a BA and a PA, which
are respectively used at the transmit end and receive end of the OptiX OSN equipment.
Figure 19-5 shows the position of the BA and PA in an optical transmission system.
Figure 19-5 Position of the BA and PA in an optical transmission system

Optical
transmitter

BA

PA

Optical
receiver

1550.12nm

19.2.3 Functions and Features


During the long-haul transmission of optical signals, the attenuation of the signals is high. Hence,
the BA and PA are required to ensure that the optical receiver can receive normal optical signals.
Table 19-7 provides the functions and features of the BPA.
Table 19-7 Functions and features of the BPA

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Function and
Feature

BPA

Basic functions

Increases the launched optical power of the line board to 1315


dBm or 1517 dBm. As a result, when the G.652 optical fiber with
a loss of 0.275 dB/km is used, the transmission distance can be 120
km, 130 km, or above.

Pre-amplification
function

Provides the PA module to pre-amplify the received optical signals.


Increases the power of the small-volume optical signals by 22-25
dB (N1BPA) or 22-33 dB (N2BPA) so that the sensitivity of the
receiver increases to -38 dBm.

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19 Optical Amplifier Boards and Dispersion Compensation


Boards

Function and
Feature

BPA

Supporting the EDFA

l Supports the automatic control of the laser temperature and


optical power of the EDFA module.
l Supports the automatic monitoring of the input and output
optical power of the EDFA module and query of the optical
power of the EDFA module.
l Supports the protection function of the EDFA module. When
no optical signals are received, the laser is automatically turned
off. When optical signals are received, the laser is automatically
turned on.

Performance events
and alarms monitoring

Supports the reporting of the performance parameters of the laser.


Reports various alarms and performance events, which facilitates
the management and maintenance of the equipment.

Software upgrade

Supports the software upgrade and expansion without interrupting


services.

19.2.4 Working Principle and Signal Flow


The BPA consists of the optical part, driving and detecting part, and data processing and
communication part.
Figure 19-6 shows the functional block diagram of the N1BPA.
Figure 19-6 Functional block diagram of the N1BPA
Optical input

Optical output

Optical input

Pump current
check

Drive
module

Optical
part

EDFA optical module 2

EDFA optical module 1

Module
temperature
control

Optical output

Input/output
power
check

Pump
Drive
current
module
check

Module
temperature
control

Input
power
check

Output
power
check

Driving
and
detecting
Fixed filter
part

A/D or D/A conversion

SCC

Communication
module

Control
module

Data processing and


communication part

Figure 19-7 shows the functional block diagram of the N2BPA.

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Boards

Figure 19-7 Functional block diagram of the N2BPA


Optical input

Optical output

Optical input

Optical output

Fixed
filter

For pre-amplification

Optical part

EDFA optical module

Pump current
check

Drive
module

Module
temperature
control

Input/output
power
check

Pump
current
check

Module
Drive
temperature
module
control

Input/output
power
check

Driving and
detecting part

A/D or D/A conversion

SCC

Communication
module

Control
module

Data processing and


communication part

Optical Part
The N1BPA consists of two EDFA optical modules. The N2BPA has only one EDFA optical
module. The EDFA optical module magnifies the optical power.

Driving and Detecting Part


The driving and detecting part provides the EDFA optical module with the driving current. It
also checks the working status of each part in the EDFA optical module. In addition, it predicts
and handles possible faults.
The driving and detecting part performs the following functions: checking the pump current,
driving the optical module, controlling the temperature of the optical module, and checking the
input and output optical power.

Data Processing and Communication Part


The data processing and communication part consists of the CPU and peripheral chips. The data
processing and communication part analyzes the test result of the tested circuit. Then, it adjusts
the driving circuit based on the analysis result so that the gain or output optical power of the
EDFA optical module remains in the range of the rated value. It also classifies the abnormal
states represented by the measured values and reports the abnormal states to the NMS.

19.2.5 Front Panel


The front panel of the BPA has indicators, interfaces, and a laser safety class label.

Diagram of the Front Panel


Figure 19-8 shows the appearance of the front panel of the BPA.
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Figure 19-8 Front panel of the BPA

BPA
STAT
ACT
PROG
SRV

LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

BOUT
BIN
POUT
PIN

BPA

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the BPA has two LC optical interfaces. Table 19-8 describes the types and
usage of the optical interfaces of the BPA.
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Table 19-8 Optical interfaces of the BPA


Interface

Type of
Interface

Usage

BIN

LC

Receives one channel of optical signals for


amplification.

BOUT

LC

Transmits one channel of amplified optical signals.

PIN

LC

Receives one channel of optical signals for preamplification.

POUT

LC

Transmits one channel of pre-amplified optical


signals.

19.2.6 Valid Slots


The slots valid for the BPA vary with the cross-connect capacity and subrack of the OptiX OSN
equipment.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the BPA are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the BPA can be installed in slots 18 and
1117 in the subrack.

19.2.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the BPA indicates the output optical power of the optical interfaces.
Table 19-9 provides the relationship between the feature code of the BPA and the output optical
power.
Table 19-9 Relationship between the feature code of the BPA and the output optical power

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Board

Feature Code

Description

SSN1BPA01 and
SSN2BPA01

01

The output optical power of the BA


module is 14 dBm.

SSN1BPA02

02

The output optical power of the BA


module is 17 dBm.

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Boards

19.2.8 Technical Specifications


The technical specifications of the BPA include the parameters specified for optical interfaces,
mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 19-10 lists the parameters specified for the optical interfaces of the BPA.
Table 19-10 Parameters specified for the optical interfaces of the BPA
Parameter

Value

Nominal bit rate

2488320 kbit/s or 9953280 kbit/s

Application code

V-16.2, U-16.2, L-64.2, V-64.2, and U-64.2

Line code pattern

NRZ

Input wavelength (nm)

BA: 1530 to 1565


PA: 1550.12

Input optical power


(dBm)

BA: -6 to +3

Output optical power


(dBm)

N1BPA: 13 to 15 or 15 to 17 (BA)

PA: -44 to -10

N1BPA: -16 to +15 (PA)


N2BPA: 13 to 15 (BA)
N2BPA: -16 to +23 (PA)

Noise figure (dB)

BA: < 6.5


PA: < 6

Signal gain (dB)

N1BPA: +22 to +25 (PA)


N2BPA: +22 to +33 (PA)

NOTE

When you perform a loopback on the PA module of the BPA, prevent the damage caused by high input
optical power to the optical module.

Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power of
the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
The mechanical specifications of the BPA are as follows:
l
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Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)


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Weight of the N1BPA (kg): 1.0

Weight of the N2BPA (kg): 1.2

19 Optical Amplifier Boards and Dispersion Compensation


Boards

Power Consumption
The maximum power consumption of the N1BPA at room temperature (25C) is 20 W.
The maximum power consumption of the N2BPA at room temperature (25C) is 11 W.

19.3 COA
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the COA (case-shaped optical amplifier).

19.3.1 Version Description


The COA is available in three functional versions, namely, 61, 62, and N1.
The working principle of the 62COA is basically the same as the working principle of the 61COA
or N1COA. The difference between the 62COA and the 61COA (N1COA) is with regard to the
used optical amplifier modules. The 62COA uses the Raman optical amplifier module, whereas
the 61COA and N1COA use the EDFA optical amplifier module.
NOTE

The COA that occurs in the following text includes the 61COA, N1COA, and 62COA. The characteristics
of the COA are the common characteristics of the three types of COAs.

Table 19-11 describes the versions of the COA.


Table 19-11 Versions of the COA
Item

Description

Functional versions

The COA is available in three functional versions, namely, 61, 62, and
N1.

Differences

The 61COA can function as a BA or a PA. The BA is the EDFA optical


amplifier in the 1530 nm to 1560 nm fiber communication window;
the PA is the EDFA optical amplifier in the 1550 nm fiber
communication window.
The N1COA can function as a PA. The PA is the EDFA optical
amplifier in the 1530 nm to 1560 nm fiber communication window.
The N1COA does not have a filter and is a multi-wavelength amplifier.
The 62COA uses the Raman optical amplifier module.

Substitution

Issue 03 (2013-02-20)

The versions cannot be substituted with each other.

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19.3.2 Application
The COA is a case-shaped optical amplifier that is not installed in a slot of the subrack. The
COA is mainly used to amplify optical signals and is applicable to the long-distance optical fiber
transmission.
The application of the COA is the same as that of the BA and PA on the OptiX OSN equipment
series. For details, see Figure 19-5.

19.3.3 Functions and Features


The COA integrates the optical amplifier module, the driving circuit, and the communication
circuit in an aluminium case.
The COA is an external and independent amplifier and does not occupy a slot in the subrack.
The COA can work independently. The equipment supports a maximum of two 61COAs, two
N1COAs, or one 62COA.

61COA and N1COA


The 61COA/N1COA is equipped with only one EDFA optical module. The 61COA/N1COA
can work as a power amplifier, a pre-amplifier, or a line amplifier. Figure 19-9 shows the
appearance of the 61COA/N1COA.
The optical characteristics of the 61COA/N1COA are the same as the optical characteristics of
the optical amplifier boards such as the BPA and BA2. The difference between the 61COA/
N1COA and the optical amplifier boards is that the 61COA/N1COA is an external optical
amplifier unit, which does not occupy a slot in the subrack. The 61COA/N1COA can be directly
installed in the ETSI cabinet but requires separate power supply.
Figure 19-9 Appearance of the 61COA/N1COA (PA)

The application of the 61COA/N1COA in the optical transmission system is the same as the
application of the BA2 and BPA in the optical transmission system. Table 19-12 provides the
functions and features of the 61COA/N1COA.

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Table 19-12 Functions and features of the 61COA/N1COA


Function and
Feature

61COA/N1COA

Power amplification
function

The 61COA increases the launched optical power of the line board.
As a result, the valid transmission distance of optical signals is
extended.

Pre-amplification
function

The 61COA/N1COA provides the pre-amplification function.

ALS function

Supports the ALS function.

Communication
through serial ports

Communicates with the GSCC through the RS-232 serial port,


reports the alarms and performance events of the COA to the NMS,
and receives the configuration commands issued by the NMS.

62COA
The 62COA is a case-shaped Raman optical amplifier and is used at the receive end of the SDH
equipment.
The 62COA transmits counter-propagated pumping optical signals to fibers for distributed
Raman amplification. The gain medium of distributed Raman amplification is the line fiber that
can realize better noise performance. This is different from the 61COA. Hence, the 62COA can
extend the transmission distance, reduce the signal-to-noise ratio, and realize ultra long hop
transmission for a single span.
Figure 19-10 shows the appearance of the 62COA.
Figure 19-10 Appearance of the 62COA
4

2
3

1. Captive screw
4. ESD jack

Issue 03 (2013-02-20)

2. Ejector lever
5. Power access board

3. COA board

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The 62COA is a case-shaped Raman optical amplifier and is used at the receive end of the optical
transmission system. The optical signals are amplified during transmission based on the
stimulated Raman scattering effect of the fiber. The 62COA needs to work with the EDFA to
realize the transmission of optical signals for more than 170 km. For details, see Figure
19-11.
Figure 19-11 Application of the 62COA
Raman amplifier
Signal light
EDFA

Pump light

Pump light

Fiber
Transmitting end

EDFA

Laser

Coupler

Receiving end

The Raman amplifier amplifies optical signals during transmission by transmitting counterpropagated pumping optical signals to fibers for distributed Raman amplification. As a result,
the phase of optical signals is significantly different from the phase of pump signals. The power
fluctuation of the Raman pumping is offset in the counter-propagation. Hence, the noise caused
by the pump can be effectively suppressed.
Table 19-13 provides the functions and features of the 62COA.
Table 19-13 Functions and features of the 62COA
Function and
Feature

62COA

Basic functions

Is configured at the receive end of the SDH system, and realizes


extra long-haul transmission (more than 170 km) when working
with an EDFA whose output power is 17 dBm at the transmit end.

Pre-amplification
function

The 62COA provides the pre-amplification function.

ALS function

Supports the ALS function.

Communication
through serial ports

Communicates with the GSCC through the RS-232 serial port,


reports the alarms and performance events of the COA to the NMS,
and receives the configuration commands issued by the NMS.

19.3.4 Working Principle and Signal Flow


The 61COA and N1COA consist of the EDFA module, control module, communication module,
and DC/DC converter module.
The working principle of the N1COA is similar to the working principle of the 61COA. The
61COA has the filter unit, whereas the N1COA does not have the filter unit.
Figure 19-12 shows the functional block diagram of the 61COA/N1COA.
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Figure 19-12 Functional block diagram of the 61COA/N1COA


Optical output
Optical input
Fixed
filter

For pre-amplification

EDFA optical
module

Pump
power check

Drive
module

Module
temperature
control

Optical part

Input/Output
Power check

Driving and
detecting part

A/D or D/A conversion

SCC

Communication
module

Control
module

Data processing and


communication part

EDFA Module
The optical amplifier unit consists of two EDFA modules. One module is the BA and the other
module is the PA. When the board is used as a PA, an optical filter with 1550.12 nm as the
central wavelength is added to the optical output end of the module. A BA does not have the
filter. A semi-conductor laser bump with 980 nm as the central wavelength is in the erbium fiber
inside the EDFA module. Bump light and input signal light are coupled into the erbium fiber
through an optical coupler. The input and output optical signals of the module are led out by two
fiber splitters according to a specific coupling ratio. Then, the optical signals are converted into
optical current by two PIN photoelectrical diodes. The input and output power of the EDFA
module is determined according to the optical signals. The module also applies optical isolating
measures at the input and output ends to improve the performance of the module.

Control Module
The control module performs the following functions:
l

Detects and drives bump electricity.

Controls the temperature of the bump laser.

Detects the input and output power.

Reports alarms.

The control module consists of the A/D converting unit, D/A converting unit, and CPU. The A/
D converting unit converts the temperature value of the cooling electricity and the input/output
optical power from analog values into digital values. The converted values are sent to the CPU,
which generates performance reporting events or alarms. The A/D converting unit also converts
bump electricity from analog values into digital values. The converted values are also sent to
the CPU. After the CPU processes the converted values, the D/A converting unit precisely
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controls the driving analog circuit of the bump laser of the EDFA optical module. The internal
temperature of the bump laser module remains at 25C. The temperature sensor inside the bump
laser outputs temperature change to drive the cooler to keep the internal temperature of the bump
laser module at 25C.

Communication Module
The communication module supports Ethernet communication.

DC/DC Converter Module


It converts the 48/60 V power supply into the DC voltages that the modules of the board
require.

19.3.5 Front Panel


The front panel of the COA has indicators and interfaces.

Diagram of the Front Panel


Figure 19-13 shows the appearance of the front panel of the 61COA/N1COA.
Figure 19-13 Front panel of the 61COA/N1COA
9

10

1. ID DIP switch

2. Running indicator

4. RS-232-1
7. MONITOR-2

5. RS-232-2
6. MONITOR-1
8. IN: input optical interface

9. OUT: output optical interface 10. Power switch

11

3. Alarm indicator

11. -48 V power interface

Figure 19-14 shows the appearance of the front panel of the 62COA.

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Figure 19-14 Front panel of the 62COA

1. SC/PC optical interface (OUT)

2. LSH optical interface (IN)

3. Air filter

4. Fan board

5. RJ-45 interface

6. RS-232-1

7. RS-232-2

8. DIP switch (bits 8-5)

9. DIP switch (bits 4-1)

10. Power input interface

11. Power switch

Indicators
The front panel of the board has the following indicators:
l

Board running status indicator (RUN) one color (green)

Fan alarm indicator (ALM) one color (red)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the 61COA/N1COA has one SC/PC optical interface. The optical interface
receives and transmits one channel of optical signals. The input optical interface of the 62COA
is connected to the LSH flange and the output optical interface is connected to the SC flange.
Figure 19-15 shows the SC/PC fiber connector that the SC/PC optical interfaces of the 61COA
and N1COA use.
Figure 19-15 SC/PC fiber connector

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Figure 19-16 shows the flange and fiber connector that the input optical interface of the 62COA
uses.
Figure 19-16 LSH flange and fiber connector

NOTE

The protective cap of the LSH fiber jumper is specially designed. When you connect the LSH fiber jumper
to an LSH flange, do not remove the protective cap but insert the LSH fiber jumper into the LSH flange
directly.

The COA has two RS-232 serial ports, which function as the control and communication ports.
The serial ports communicate with the SCC unit and report alarms and performance events.
Table 19-14 provides the pin assignments of the RS-232 serial port.
Table 19-14 Pin assignments of the RS-232 serial port
Front View

Pin of RS-232-2

Definition

Used to receive
data.

Used to transmit
data.

Used for common


grounding.

Pin of RS-232-1

TIP

To realize the communication between the COA and the GSCC, use a serial port control line to connect
the RS-232-1 serial port of the COA to the F&f port of the subrack.

The RS-232-2 serial port is used in the scenario where several COAs are used at a single station.
To enable each COA to communicate with the SCC unit, use a serial port line to connect the
RS-232-2 port of COA 1 to the RS-232-1 port of COA 2, and use another serial port line to
connect the RS-232-2 port of COA 2 to the RS-232-1 port of COA 3. Connect the other COAs
similarly. In this case, each COA communicates with the SCC unit through the RS-232-1 serial
port of COA 1.
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NOTE

When you cascade COAs, set the last four digits of the DIP switch on the front panel of each COA to a
unique value. The values are used to identify the COAs. One OptiX OSN 3500 subrack supports a maximum
of two COAs. When bit 1 of the DIP switch is set downwards, the logical slot of the COA on the NMS is
slot 101. When bit 2 of the DIP switch is set downwards, the logical slot of the COA on the NMS is slot
102.

The COA has two MONITOR interfaces. When the 61COA is used alone, the MONITOR-1
interface and MONITOR-2 interface are the alarm output interfaces. In this case, the two
MONITOR interfaces have the same functions. Table 19-15 provides the pin assignments of
the MONITOR interfaces.
Table 19-15 Pin assignments of the MONITOR interfaces
Front View

Pin of
MONITOR-2

Definition

1 and 6

1 and 6

The input optical power of the


EDFA module is very low.

2 and 7

2 and 7

The working current of the pump


laser of the EDFA module
exceeds the threshold.

3 and 8

3 and 8

The cooling current of the pump


laser of the EDFA module
exceeds the threshold.

4 and 9

4 and 9

The ambient temperature of the


EDFA module exceeds the
threshold.

Digital ground

Pin of
MONITOR1

The 62COA has one RJ45 connector, through which the 62COA is connected to the computer
for software loading. Table 19-16 provides the pin assignments of the RJ45 connector of the
62COA.
Table 19-16 Pin assignments of the RJ45 connector of the 62COA
Front View

8 7 6 5 4 3 2 1

Issue 03 (2013-02-20)

Pin

Description

Transmitting (+)

Transmitting ()

Receiving (+)

Not defined

Not defined

Receiving ()

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19 Optical Amplifier Boards and Dispersion Compensation


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Pin

Description

78

Not defined

The COA has one 48 V power interface. The 48 V power interface receives the 48 V power
provided by the PIU in the OptiX OSN 3500 subrack or the PDU at the top of the cabinet. The
working voltage under normal working conditions ranges from 38.4 V to 57.6 V (48 V20%).
The COA has one DIP switch.
l

The DIP switches of the 61COA/N1COA are in the lower left corner of the front panel.
The DIP switches are used to set the ID of the 61COA/N1COA. When a bit of the DIP
switch is set upwards, the bit is in the OFF position. When the bit is set downwards, the bit
is in the ON position. The SCC identifies a 61COA/N1COA through the ID of the 61COA/
N1COA. The SCC communicates with the 61COAs/N1COAs whose IDs are different in
the master-slave calling mode.

The DIP switch of the 62COA is used to set the ID of the 62COA and the type of fiber.
The DIP switch has eight bits. The bit on the leftmost side is numbered "8" and the bit on
the rightmost side is numbered "1". When a bit of the DIP switch is set upwards, the bit
indicates "0". When the bit is set downwards, the bit indicates "1". The first four bits (1
4) are used to set the board ID, which ranges from 20 to 35. In actual situations, the first
four bits indicate only the range from 20 to 27. The fifth bit is used to set the type of fiber.
When bit 5 indicates "0", the fiber is of the G.652 type. When bit 5 indicates "1", the fiber
is of the G.655 type.

19.3.6 Valid Slots


The COA adopts the case-shape design. Hence, the COA does not require a slot in the subrack.
In the ETSI cabinet, the 61COA or N1COA is installed on a special bracket, and the 62COA is
installed directly in the cabinet through the mounting ears. On the NMS, the logical slots of the
61COA, N1COA, and 62COA are slots 101 and 102.

Installation Position of the 61COA or N1COA


The installation of the 61COA is considered as an example. The bracket is fixed on the crossbars
on both sides of the cabinet. There are guide rails on the bracket. The 61COA is pushed onto
the bracket along the guide rails and is fixed on the bracket. One bracket can hold two 61COAs
horizontally. The front panels of the two 61COAs are on the front side of the cabinet, as shown
in Figure 19-17.

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Figure 19-17 Position of the 61COA in the ETSI cabinet

Installation Position of the 62COA


The case-shaped 62COA can be installed in the 300 mm or 600 mm ETSI cabinet through
mounting ears and screws. If the upward-wiring scheme is applied, the 62COA is installed at
the bottom of the ETSI cabinet (positions of the first and third floating nuts). If the downwardwiring scheme is applied, the 62COA is installed in any idle place of the 2.6 m high cabinet or
in the ETSI cabinet that is not fully configured.

19.3.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the 61COA indicates the output optical power of the optical interfaces.
Table 19-17 provides the relationship between the feature code of the 61COA and the output
optical power.
Table 19-17 Relationship between the feature code of the 61COA and the output optical power
Board

Feature Code

Description

SS61COA01

01

The output optical power of the


BA module is 14 dBm.

SS61COA02

02

The output optical power of the


BA module is 17 dBm.

19.3.8 Technical Specifications


The technical specifications of the COA include the parameters specified for optical interfaces,
mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 19-18 lists the parameters specified for the optical interfaces of the COA.
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Table 19-18 Parameters specified for the optical interfaces of the COA
Parameter

Value
61COA

Line code pattern

NRZ

Operating
wavelength range
(nm)

1550

Input optical power


range (dBm)

BA: -6 to +3

N1COA

62COA

1550.12

-10 to -37

-43 to -20
(The LOS alarm is reported
when the input optical
power reaches -45 dBm.)

15 to 17

> 23

13

PA: -28 to -10 (when


the BPA works with
the line board at the
rate of 10 Gbit/s)
PA: -38 to -10 (when
the BPA works with
the line board at the
rate less than 10 Gbit/
s)

Launched optical
power range (dBm)

BA14: 13 to 15
BA17: 15 to 17
PA: -2 to +16 (when
the BPA works with
the line board at the
rate of 10 Gbit/s)
PA: -12 to +16 (when
the BPA works with
the line board at the
rate less than 10 Gbit/
s)
NOTE
"BA14" indicates that
the output optical power
of a BA is always 14
dBm.
"BA17" indicates that
the output optical power
of a BA is always 17
dBm.

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Signal gain (dB)

PA: > 26

Pump wavelength
(nm)

1451.2

Maximum on/off
gain (dB)

> 15 (in the case of the G.


652 fiber)

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19 Optical Amplifier Boards and Dispersion Compensation


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Value
61COA

Noise figure (dB)

N1COA

BA14: < 7

62COA
< -1.5

BA17: < 7
PA: < 5

Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power of
the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
The mechanical specifications of the 61COA and N1COA are as follows:
l

Dimensions (mm): 240 (W) x 190 (D) x 50 (H)

Weight (kg): 3.5

The mechanical specifications of the 62COA are as follows:


l

Dimensions (mm): 294 (W) x 436 (D) x 86 (H)

Weight (kg): 8.0

Power Consumption
The maximum power consumption of the 61COA at room temperature (25C) is 10 W.
The maximum power consumption of the 62COA at room temperature (25C) is 75 W.
The maximum power consumption of the N1COA at room temperature (25C) is 10 W.

19.4 RPC01
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the RPC01 (forward Raman driving board).

19.4.1 Version Description


The RPC01 is available in one functional version, namely, N1.

19.4.2 Application
The RPC01 is an external forward Raman driving board that must work with the EDFA.
Figure 19-18 shows the position of the RPC01 in an optical transmission system.
Figure 19-18 Position of the RPC01 in an optical transmission system
Transmitting

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RPC01

Receiving

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19.4.3 Functions and Features


The RPC01 supports the online optical performance monitoring function and other functions.
Table 19-19 provides the functions and features of the RPC01.
Table 19-19 Functions and features of the RPC01
Function and
Feature

RPC01

Basic functions

l Generates multi-channel pump light of high power, which


provides energy for the amplification of signals in the fiber.
l Realizes the distributed online amplification of signals over long
distance with wide bandwidth and low noise.

Online optical
performance
monitoring function

Provides the online monitoring interface. A small amount of optical


signal can be transmitted to the spectrum analyzer through the
interface so that the spectrum and optical performance of the
multiplexed optical signal can be monitored without a service
interruption.

Performance events
and alarms
monitoring

l Detects the pump optical power, temperature control current,


pump current, and back facet current.
l Supports the setting of the LOS value to disable the output port of
the laser.

19.4.4 Working Principle and Signal Flow


The RPC01 consists of the Raman pump optical module, driving and detecting module,
communication and control module, and power supply module.
The RPC01 is used at the transmit end of the system. The RPC01 utilizes the stimulated Raman
scattering effect of the fiber to amplify the optical signals during transmission.

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Figure 19-19 Functional block diagram of the RPC01 (forward pump)


Splitter Signal light

Signal light

LINE

Pump light
Pump source

Control the
pumping current
and temperature.

SYS
MON

Raman pump optical module

Detect the pump


light power and
current.

PIN

Detect the
temperature.

Driving and detecting module

Control
Memory

CPU

Communication

Communication and control module


Power supply
module
Fuse

Voltages required
by the board

DC power provided
by the backplane

SCC

Backplane
(controlled by
the SCC)

Signal Flow
The signal light is received at the SYS interface and transmitted to the optical line through the
LINE interface. A few supervisory signals are transmitted to the test instrument through the
MON interface for online optical performance monitoring. The pump light that is generated by
the RPC01 is transmitted to the optical line through the LINE interface in the same direction of
the signal light, to realize the distributed amplification of the optical signal. The Ethernet
interface of the RPC01 is connected to the COM interface of an NE directly or through a hub to
realize the communication with the SCC.

Functional Modules
l

Raman pump optical module


The laser in the pump source module generates the pump light and sends the pump light
to the optical line for transmission. The Raman pump optical module utilizes the
stimulated Raman scattering effect of the fiber to amplify the optical signals during
transmission.
The splitter splits one channel of optical signals from the pump source module into two
channels of signals of different power. One channel of signals are transmitted through
the SYS interface to the main optical path. The other channel of signals are transmitted
to the MON interface for spectrum detection and supervising.

l
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Driving and detecting module


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Detects the optical power of the service signals in real time.


Detects the driving current, back facet current, cooling current, and operating
temperature of the pump inside the pump optical module in real time.
Drives the pump laser inside the pump optical module.
Reports alarms and performance events to the logic and control module.
l

Communication and control module


Controls the operations on the board.
Controls the operations on each module of the board according to the CPU instructions.
Collects the alarms, performance events, working status, and voltage detection
information of each functional module of the board.
Communicates with the SCC.

Power supply module


Converts the DC power provided by the backplane into the power required by each module
of the board.

19.4.5 Front Panel


The front panel of the RPC01 has indicators, interfaces, and a laser safety class label.

Diagram of the Front Panel


Figure 19-20 shows the appearance of the front panel of the RPC01.
Figure 19-20 Front panel of the RPC01

03793010860000002 Y SSN1 RPC 01

Board manufacturing
information
MON

SYS

Board serial
number and name
LINE

LASER
RADIATION
AVOID EYE OR SKIN
EXPOSURE TO DIRECT OR
SCATTERED RADIATION

CRPC

CLASS 4 LASER
PRODUCT

ALM

RUN

WARNING: FIBERS MUST


BE CONNECTED SEFORE
POWER UP

RS232-1

RS232-2

LAN

Indicators
The front panel of the board has the following indicators:
l

Board running status indicator (RUN) one color (green)

Fan alarm indicator (ALM) one color (red)

For the meanings of the status of the indicators, see 24 Indicators.


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Interfaces
The front panel of the RPC01 has six interfaces. Table 19-20 describes the types and usage of
the interfaces of the RPC01.
Table 19-20 Interfaces of the RPC01
Interface

Type of
Interface

Usage

LINE

LSH/APC

Transmits the amplified signals to the fibers.

SYS

LC

Is connected to the BA and receives the optical signals


transmitted from the BA.
NOTE
The permissible input power for the SYS interface on the
RPC01 board ranges from +5 dBm to +8 dBm. Therefore,
when the output power of a BA is +14 dBm or +17 dBm, you
need to add an optical attenuator ranging from 5 dB to 10 dB
in front of the SYS interface.

MON

LC

Monitors the optical performance.


The power of the MON interface is 1/99 of the power
of the SYS interface. That is, the power of the MON
interface is 20 dB less than the power of the SYS
interface.

LAN

RJ-45

Is connected to the COM interface of an NE directly or


through a hub to realize the communication with the
SCC.

RS232-1/
RS232-2

Is an RS-232 communication interface.

19.4.6 Valid Slots


The RPC01 is an external forward Raman driving board. Hence, the RPC01 is not installed in
the subrack. The RPC01 is connected to the COM interface of an NE directly or through a hub
to realize the communication with the SCC. The logical slot of the RPC01 on the NMS is slot
104.
NOTE

Only two logical slots are designed for the RPC, one for monitoring the RPC01 (using logical slot 104)
and the other for monitoring the RPC02 (using logical slot 105). Otherwise, an IP address conflict occurs.

19.4.7 Jumpers and DIP Switches


The RPC01 has two groups of jumpers, namely, group J3 and group J4.
Figure 19-21 shows the jumpers of the RPC01.

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Boards

Figure 19-21 Jumpers of the RPC01


RPC01

10

10

J3

J4

CPU

To ensure that the board can operate normally, set the jumpers as follows:
l

Short-circuit jumpers 1 and 2 of group J4.

Short-circuit jumpers 3 and 4 of group J4.

Short-circuit jumpers 5 and 6 of group J4.

Short-circuit jumpers 9 and 10 of group J3.

19.4.8 Feature Code


The feature code of the RPC01 contains three characters, which indicate the gain of the optical
signal processed by the RPC01.
Table 19-21 describes the feature code of the RPC01.
Table 19-21 Feature code of the RPC01
Feature Code

Indication

Description

The first character

Is always "G".

The second and third


characters

Gain

Indicates the gain.

Consider the N1RPC01 whose feature code is "G10" as an example. "G10" indicates that the
maximum gain of the optical signal is 10 dB.

19.4.9 Parameter Settings


You can set the parameters for the RPC01 by using the U2000.
You can set the following parameters for the RPC01 by using the U2000:
l

Laser status

Board work type

Fixed Pump Optical Power (dBm)

Min. Fixed Pump Optical Power (dBm)

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Boards

Max. Fixed Pump Optical Power (dBm)

For the description of each parameter, see 27.9 Optical Amplifier Boards.

Interface Display
Table 19-22 shows the serial numbers of the optical interfaces on the front panel of the RPC01
on the NMS.
Table 19-22 Serial numbers of the optical interfaces on the front panel of the RPC01 on the
NMS
Interface on the Front Panel

Serial Number of the NMS Interface

LINE

SYS

MON

19.4.10 Technical Specifications


The technical specifications of the RPC01 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 19-23 lists the parameters specified for the optical interfaces of the RPC01.
Table 19-23 Parameters specified for the optical interfaces of the RPC01

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Parameter

Value

Pump wavelength (nm)

1400 to 1500

Operating wavelength (nm)

1529 to 1561

Maximum pump power (dBm)

29

Gain on the G.652 fiber (dB)

10

Gain on the LEAF fiber (dB)

12

Equivalent noise figure on the G.652 fiber


(dB)

Equivalent noise figure on the LEAF fiber


(dB)

-1

Polarization dependent loss (dB)

0.5

Type of output connector

LSH/APC or LC/PC

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Laser Safety Class


The safety class of the laser on the board is Class 4. The maximum launched optical power of
the optical interfaces is more than 27 dBm (500 mW).

Mechanical Specifications
l

Dimensions (mm): 76.0 (W) x 218.5 (D) x 345.0 (H)

Weight (kg): 4.0

Power Consumption
The maximum power consumption of the RPC01 at room temperature (25C) is 70 W.
The maximum power consumption of the RPC01 at room temperature (55C) is 77 W.

19.5 RPC02
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the RPC02 (backward Raman driving board).

19.5.1 Version Description


The RPC02 is available in one functional version, namely, N1.

19.5.2 Application
The RPC02 is an external backward Raman driving board that must work with the EDFA.
Figure 19-22 shows the position of the RPC02 in an optical transmission system.
Figure 19-22 Position of the RPC02 in an optical transmission system
Transmitting

RPC02

Receiving

19.5.3 Functions and Features


The RPC02 supports the online optical performance monitoring function and other functions.
Table 19-24 provides the functions and features of the RPC02.

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Table 19-24 Functions and features of the RPC02


Function and
Feature

RPC02

Basic functions

l Generates multi-channel pump light of high power, which


provides energy for the amplification of signals in the fiber.
l Realizes the distributed online amplification of signals over long
distance with wide bandwidth and low noise.

Online optical
performance
monitoring function

Provides the online monitoring interface. A small amount of optical


signal can be transmitted to the spectrum analyzer through the
interface so that the spectrum and optical performance of the
multiplexed optical signal can be monitored without a service
interruption.

Performance events
and alarms
monitoring

l Detects the pump optical power, temperature control current,


pump current, and back facet current.
l Supports the setting of the LOS value to disable the output port of
the laser.

19.5.4 Working Principle and Signal Flow


The RPC02 consists of the Raman pump optical module, driving and detecting module,
communication and control module, and power supply module.
The RPC02 is used at the receive end of the system. The RPC02 utilizes the stimulated Raman
scattering effect of the fiber to amplify the optical signals during transmission. The pump light
travels in the reverse direction of the signal light. The RPC02 must work with the EDFA.
Figure 19-23 shows the functional block diagram of the RPC02.

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Figure 19-23 Functional block diagram of the RPC02 (backward pump)


Splitter Signal light

Signal light

LINE

Pump light
Pump source

Control the
pumping current
and temperature.

SYS
MON

Raman pump optical module

Detect the pump


light power and
current.

PIN

Detect the
temperature.

Driving and detecting module

Control
Memory

CPU

Communication

Communication and control module


Power supply
module
Fuse

Voltages required
by the board

DC power provided
by the backplane

SCC

Backplane
(controlled by
the SCC)

Signal Flow
The pump source of the RPC02 sends the pump light to the WDM side through the LINE optical
interface. On the line, the signals that are amplified through the distributed amplification are
received through the LINE interface. Then, the splitter splits the signals into two channels. The
service optical signals are transmitted through the SYS interface. A few supervisory signals are
transmitted to the test instrument through the MON interface for online optical performance
monitoring. The Ethernet interface of the RPC02 is connected to the COM interface of an NE
directly or through a hub to realize the communication with the SCC.

Functional Modules
l

Raman pump optical module


The laser in the pump source module generates the pump light and sends the pump light
to the optical line for transmission. The Raman pump optical module utilizes the
stimulated Raman scattering effect of the fiber to amplify the optical signals during
transmission.
The splitter splits one channel of optical signals from the pump source module into two
channels of signals of different power. One channel of signals are transmitted through
the SYS interface to the main optical path. The other channel of signals are transmitted
to the MON interface for spectrum detection and supervising.

Driving and detecting module


Detects the optical power of the service signals in real time.

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Detects the driving current, back facet current, cooling current, and operating
temperature of the pump inside the pump optical module in real time.
Drives the pump laser inside the pump optical module.
Reports alarms and performance events to the logic and control module.
l

Communication and control module


Controls the operations on the board.
Controls the operations on each module of the board according to the CPU instructions.
Collects the alarms, performance events, working status, and voltage detection
information of each functional module of the board.
Communicates with the SCC.

Power supply module


Converts the DC power provided by the backplane into the power required by each module
of the board.

19.5.5 Front Panel


The front panel of the RPC02 has indicators, interfaces, and a laser safety class label.

Diagram of the Front Panel


Figure 19-24 shows the appearance of the front panel of the RPC02.
Figure 19-24 Front panel of the RPC02

03793010860000002 Y SSN1 RPC02

Board manufacturing
information
MON

Board serial
number and name

SYS

LINE

LASER
RADIATION
AVOID EYE OR SKIN
EXPOSURE TO DIRECT OR
SCATTERED RADIATION

CRPC

CLASS 4 LASER
PRODUCT

ALM

RUN

WARNING: FIBERS MUST


BE CONNECTED SEFORE
POWER UP

RS232-1

RS232-2

LAN

Indicators
The front panel of the board has the following indicators:
l

Board running status indicator (RUN) one color (green)

Fan alarm indicator (ALM) one color (red)

For the meanings of the status of the indicators, see 24 Indicators.


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Interfaces
The front panel of the RPC02 has six interfaces. Table 19-25 describes the types and usage of
the interfaces of the RPC02.
Table 19-25 Interfaces of the RPC02
Interface

Type of
Interface

Usage

LINE

LSH/APC

Receives the optical signals transmitted from the line.

SYS

LC

Is connected to the BA and transmits the amplified


signals to the fibers.

MON

LC

Monitors the optical performance.


The power of the MON interface is 1/99 of the power
of the SYS interface. That is, the power of the MON
interface is 20 dB less than the power of the SYS
interface.

LAN

RJ-45

Is connected to the COM interface of an NE directly or


through a hub to realize the communication with the
SCC.

RS232-1/
RS232-2

Is an RS-232 communication interface.

19.5.6 Valid Slots


The RPC02 is an external backward Raman driving board. Hence, the RPC02 is not installed in
the subrack. The RPC02 is connected to the COM interface of an NE directly or through a hub
to realize the communication with the SCC. The logical slot of the RPC02 on the NMS is slot
105.
NOTE

Only two logical slots are designed for the RPC, one for monitoring the RPC01 (using logical slot 104)
and the other for monitoring the RPC02 (using logical slot 105). If more than two RPC boards are monitored,
an IP address conflict occurs.

19.5.7 Jumpers and DIP Switches


The RPC02 has two groups of jumpers, namely, group J3 and group J4.
Figure 19-25 shows the jumpers of the RPC02.

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Figure 19-25 Jumpers of the RPC02


RPC02

10

10

J3

J4

CPU

To ensure that the board can operate normally, set the jumpers as follows:
l

Short-circuit jumpers 1 and 2 of group J4.

Short-circuit jumpers 3 and 4 of group J4.

Short-circuit jumpers 5 and 6 of group J4.

Do not short-circuit jumpers 9 and 10 of group J3.

19.5.8 Feature Code


The feature code of the RPC02 contains three characters, which indicate the gain of the optical
signal processed by the RPC02.
Table 19-26 describes the feature code of the RPC02.
Table 19-26 Feature code of the RPC02
Feature Code

Indication

Description

The first character

Is always "G".

The second and third


characters

Gain

Indicates the gain.

Consider the N1RPC02 whose feature code is "G10" as an example. "G10" indicates that the
maximum gain of the optical signal is 10 dB.

19.5.9 Parameter Settings


You can set the parameters for the RPC02 by using the U2000.
You can set the following parameters for the RPC02 by using the U2000:
l

Laser status

Board work type

Fixed Pump Optical Power (dBm)

Min. Fixed Pump Optical Power (dBm)

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Max. Fixed Pump Optical Power (dBm)

For the description of each parameter, see 27.9 Optical Amplifier Boards.

Interface Display
Table 19-27 shows the serial numbers of the optical interfaces on the front panel of the RPC02
on the NMS.
Table 19-27 Serial numbers of the optical interfaces on the front panel of the RPC02 on the
NMS
Interface on the Front Panel

Serial Number of the NMS Interface

LINE

SYS

MON

19.5.10 Technical Specifications


The technical specifications of the RPC02 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 19-28 lists the parameters specified for the optical interfaces of the RPC02.
Table 19-28 Parameters specified for the optical interfaces of the RPC02

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Parameter

Value

Pump wavelength (nm)

1400 to 1500

Operating wavelength (nm)

1529 to 1561

Maximum pump power (dBm)

29.5

Gain on the G.652 fiber (dB)

> 10

Gain on the LEAF fiber (dB)

NA

Equivalent noise figure on the G.652 fiber (dB)

NA

Equivalent noise figure on the LEAF fiber (dB)

NA

Polarization dependent loss (dB)

0.5

Type of output connector

LSH/APC or LC/PC

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Laser Safety Class


The safety class of the laser on the board is Class 4. The maximum launched optical power of
the optical interfaces is more than 27 dBm (500 mW).

Mechanical Specifications
The mechanical specifications of the RPC02 are as follows:
l

Dimensions (mm): 76.0 (W) x 218.5 (D) x 345.0 (H)

Weight (kg): 4.2

Power Consumption
The maximum power consumption of the RPC02 at room temperature (25C) is 110 W.
The maximum power consumption of the RPC02 at room temperature (55C) is 121 W.

19.6 OBU1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11OBU1 (optical booster amplifier board).

19.6.1 Version Description


The OBU1 is available in the following functional version: TN11.

19.6.2 Application
The OBU1 is an optical booster amplifier board that amplifies optical signals.
The OBU1 is available in two types, namely, OBU101 and OBU103. The OBU101 is used at
the receive end and the OBU103 is used at the transmit end. Figure 19-26 shows the position
of the OBU1 in an optical transmission system.
Figure 19-26 Position of the OBU1 in an optical transmission system
Transmitting

Transmitting

OBU103

OBU101

Receiving

Receiving

19.6.3 Functions and Features


The OBU1 supports the online optical performance monitoring function, gain lock, transient
control, and other functions.
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Table 19-29 provides the functions and features of the OBU1.


Table 19-29 Functions and features of the OBU1
Function and
Feature

OBU1

Basic functions

Amplifies a maximum of 40 channels of optical signals with the channel


spacing of 100 GHz at the same time.
Supports the system to transmit services over different fiber spans
without electrical regeneration.

Typical gain

The typical gain of the OBU101 is 20 dB and the typical gain of the
OBU103 is 23 dB.

Online optical
performance
monitoring
function

Provides the online monitoring interface. A small amount of optical


signal can be transmitted to the spectrum analyzer through the interface
so that the spectrum and optical performance of the multiplexed optical
signal can be monitored without a service interruption.

Gain lock function

The EDFA inside the board has the gain lock function. When one or
more channels are added or dropped, or optical signals of certain
channels fluctuate, the signal gain of other channels is not affected.

Transient control
function

The EDFA inside the board has the transient control function. When
channels are added or dropped, the board can suppress the fluctuation
of the optical power in the path to realize the smooth upgrading and
expansion.

Performance
events and alarms
monitoring

Checks and reports the optical power.


Controls the temperature of the pump laser.
Detects the pump driving current, back facet current, cooling current,
temperature of the pump laser, and ambient temperature of the board.

NOTE

The OBU1 is available in two types, namely, OBU101 and OBU103. The OBU101 is used at the receive
end and the OBU103 is used at the transmit end.

19.6.4 Working Principle and Signal Flow


The OBU1 consists of the EDFA optical module, splitter, driving and detecting module,
communication and control module, and power supply module.
Figure 19-27 shows the functional block diagram of the OBU1.

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Figure 19-27 Functional block diagram of the OBU1

Splitter

EDFA optical module


IN

OUT
Driving
current

MON

Detect the pump


current and
temperature.

PIN

Driving and detecting module

Control
Memory

CPU

Communication

Communication and control module


Power supply
module
Voltages required
by the board

Fuse

DC power provided
by the backplane

Backplane
(controlled
by the
SCC
SCC)

Signal Flow
The OBU1 receives the multiplexed optical signals, which are amplified by the EDFA optical
module. Then, the OBU1 sends the amplified optical signals to the splitter and transmits the
signals through the OUT interface. The OBU1 also sends a few supervisory signals to the test
instrument for online optical performance monitoring.

EDFA Optical Module


The EDFA optical module amplifies the input optical signals. The EDFA optical module adopts
the automatic gain control technology. Hence, the gain of each operating wavelength signal can
remain in the allowed range.

Splitter
The splitter splits one channel of optical signals from the EDFA optical module into two channels
of signals of different power. One channel of signals is transmitted through the OUT interface
to the main optical path. The other channel of signals is transmitted to the MON interface for
spectrum detection and supervising.
The power of the MON interface is 1/99 of the power of the OUT interface. That is, the power
of the MON interface is 20 dB less than the power of the OUT interface.
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Driving and detecting module


l

Detects the optical power of the service signals in real time.

Detects the driving current, back facet current, cooling current, and operating temperature
of the pump inside the pump optical module in real time.

Drives the pump laser inside the pump optical module.

Reports alarms and performance events to the logic and control module.

Communication and control Module


l

The communication and control module controls and monitors the functional modules of
the board, and manages the communication.

The communication and control module collects the alarms, performance events, working
status, voltage detection information, and other information of each functional module of
the board, and reports the collected information to the SCC.

The communication and control module receives the commands issued by the SCC to
control and coordinate the operation of each functional module.

Power supply module


Converts the DC power provided by the backplane into the power required by each module of
the board.

19.6.5 Front Panel


The front panel of the OBU1 has indicators, interfaces, and a laser safety class label.

Diagram of the Front Panel


Figure 19-28 shows the appearance of the front panel of the OBU1.

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Figure 19-28 Front panel of the OBU1

OBU1
STAT
ACT
PROG
SRV
LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

MON
OUT
IN

OBU1

Indicators
The front panel of the board has the following indicators:
l

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 24 Indicators.

Interfaces
The front panel of the OBU1 has three optical interfaces. Table 19-30 describes the types and
usage of the optical interfaces of the OBU1.
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Table 19-30 Optical interfaces of the OBU1


Interface

Type of
Interface

Usage

IN

LC

Receives the multiplexed signals to be amplified.

OUT

LC

Transmits the amplified multiplexed signals.

MON

LC

Is connected to the test instrument to monitor the inservice performance.

19.6.6 Valid Slots


The OBU1 can be installed in slots 18 and 1117 in the main subrack.

19.6.7 Feature Code


The feature code of the OBU1 contains six characters, which indicate the gain and maximum
nominal input optical power of the optical signals processed by the OBU1.
Table 19-31 describes the feature code of the OBU1.
Table 19-31 Feature code of the OBU1
Feature Code

Indication

Description

The first character

Is always "G".

The second and third


characters

Gain

Indicates the gain.

The fourth character

Is always "I".

The fifth and sixth characters

Maximum nominal input


optical power

Indicates the maximum


nominal input optical power.

Consider the TN11OBU1 whose feature code is "G23I-3" as an example. "G23I-3" indicates
that the gain is 23 dB and the maximum nominal input optical power is -3 dBm.

19.6.8 Parameter Settings


You can set the parameters for the OBU1 by using the U2000.
You can set the following parameters for the OBU1 by using the U2000:
l

Threshold of input power loss

Laser status

Gain

Nominal gain upper threshold

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Nominal gain lower threshold

Rated optical power

Configure band

Configure working band parity

Actual band

Actual working band parity

19 Optical Amplifier Boards and Dispersion Compensation


Boards

For the description of each parameter, see 27 Parameter Settings.

19.6.9 Technical Specifications


The technical specifications of the OBU1 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 19-32 lists the parameters specified for the optical interfaces of the OBU1.
Table 19-32 Parameters specified for the optical interfaces of the OBU1
Parameter

Value
TN11OBU101

TN11OBU103

Operating wavelength range (nm)

1529 to 1561

1529 to 1561

Nominal input power range


(dBm)

-32 to -4

-32 to -3

Input power range per


channel

40
channe
ls

-32 to -20

-32 to -19

80
channe
ls

-32 to -23

-32 to -22

40
channe
ls

-20

-19

80
channe
ls

-23

-22

Input power (dBm) of a typical


single wavelength

-20

-19

Maximum nominal output optical


power (dBm) of a single
wavelength

Noise figure (dB)

5.5

6.0

Nominal gain (dB)

20

23

Nominal singlewavelength input


optical power

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Parameter

19 Optical Amplifier Boards and Dispersion Compensation


Boards

Value
TN11OBU101

TN11OBU103

Gain response time on adding/


dropping of channels (ms)

< 10

< 10

Channel gain (dB)

201.5

231.5

Gain flatness (dB)

2.0

2.0

Input reflectance (dB)

< -40

< -40

Output reflectance (dB)

< -40

< -40

Pump leakage at input (dBm)

< -30

< -30

Maximum reflectance tolerance at


input (dB)

-27

-27

Maximum reflectance tolerance at


output (dB)

-27

-27

Maximum total output optical


power (dBm)

16

20

Multi-channel gain slope (dB/dB)

2.0

2.0

Polarization dependent loss (dB)

0.5

0.5

Pre-incline of the gain spectral


form (dB)

00.2

1.00.2

Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power of
the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
The mechanical specifications of the OBU1 are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg):
TN11OBU1: 1.3
TN12OBU1: 1.1

Power Consumption
l

The maximum power consumption of the TN11OBU101 at room temperature (25C) is 16


W.

The maximum power consumption of the TN11OBU103 at room temperature (25C) is 13


W.

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19.7 DCU
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the DCU (dispersion compensation board).

19.7.1 Version Description


The DCU is available in the following functional versions: N1 and N2. The difference between
the two versions is with regard to the insertion attenuation and compensation.
Table 19-33 describes the versions of the DCU.
Table 19-33 Versions of the DCU
Item

Description

Functional versions

The DCU is available in two functional versions, namely, N1 and N2.

Commonness

The working principle of the N1DCU is the same as the working


principle of the N2DCU.

Differences

The insertion loss of the N2DCU is 3 to 5 dB less than the insertion


loss of the N1DCU.
In the case of the N1DCU, two compensation modes are available,
namely, 60 km and 80 km. In the case of the N2DCU, three
compensation modes are available, namely, 40 km, 60 km, and 80
km.
Use attenuators to prevent overloaded optical power when you use
the N2DCU to substitute for the N1DCU.

Substitution

19.7.2 Application
The DCU is a dispersion compensation board. The DCU compensates for the dispersion that is
accumulated in the fiber during the transmission of the optical signals in the 10 Gbit/s system,
and compresses optical signal pulse. In this manner, the optical signals that are transmitted can
be restored. In addition, the DCU can realize long-haul optical transmission when it works with
an optical amplifier board.
During the long-haul transmission (more than 80 km) of 10 Gbit/s signals, the pulse width of
the optical signals is expanded and the signals are severely distorted due to the impact of
dispersion. As a result, the optical signals cannot be normally received by the optical receiver.
Therefore, the DCU is required to compensate for the dispersion. Figure 19-29 shows the
position of the DCU in an optical transmission system.
Figure 19-29 Position of the DCU in an optical transmission system
Pulse broadening Pulse compression

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PA

DCU

Optical
receiver

Optical
transmitter
1550.12 nm

BA

1550.12 nm

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19 Optical Amplifier Boards and Dispersion Compensation


Boards

NOTE

The operating wavelength of the chirp grating of the DCU is 1550.12 nm. Therefore, the central wavelength
of the optical signals transmitted by the optical interface board on the opposite end must also be 1550.12
nm. Otherwise, the dispersion of the optical signals cannot be compensated for and the insertion loss is
high. As a result, no optical signals can be transmitted.

19.7.3 Functions and Features


The DCU can compensate for the dispersion for a maximum of two channels of optical signals.
The DCU can be used with the BA and PA.
Table 19-34 provides the functions and features of the DCU.
Table 19-34 Functions and features of the DCU
Function
and Feature

N1DCU

N2DCU

Basic
functions

Compensates for the dispersion of a


maximum of two channels of optical
signals at the same time. Supports the
compensated dispersion of 1020 ps/
nm (for the dispersion caused by the
60 km G.652 optical fiber), 1360 ps/
nm (for the dispersion caused by the
80 km G.652 optical fiber), or any
combination.

Compensates for the dispersion of a


maximum of two channels of optical
signals at the same time. Supports the
compensated dispersion of 680 ps/
nm (for the dispersion caused by the
40 km G.652 optical fiber), 1020 ps/
nm (for the dispersion caused by the
60 km G.652 optical fiber), 1360 ps/
nm (for the dispersion caused by the
80 km G.652 optical fiber), or any
combination.

Dispersion
compensatio
n method

Compensates for the dispersion accumulated during the transmission by using


the chirp grating and suppresses the pulse signals to restore the optical signals.

Long haul
transmission
with optical
regeneration

Realizes long haul transmission with optical regeneration when working with
the BA and PA.

19.7.4 Working Principle and Signal Flow


The DCU consists of the dispersion compensation module.
Figure 19-30 shows the functional block diagram of the DCU.
Figure 19-30 Functional block diagram of the DCU
IN

Dispersion compensation

OUT

module

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Boards

The dispersion compensation module is used behind the PA to provide optical signals of required
compensation and path penalty.

19.7.5 Front Panel


The front panel of the DCU has interfaces, and a laser safety class label.

Diagram of the Front Panel


Figure 19-31 shows the appearance of the front panel of the one-interface DCU.
Figure 19-31 Front panel of the one-interface DCU

DCU

CLASS 1
LASER
PRODUCT

OUT
IN

DCU

Figure 19-32 shows the appearance of the front panel of the two-interface DCU.

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19 Optical Amplifier Boards and Dispersion Compensation


Boards

Figure 19-32 Front panel of the two-interface DCU

DCU

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2 IN2

DCU

Interfaces
The front panel of the one-interface DCU has one optical interface. The optical interface
transmits and receives one channel of optical signals.
The front panel of the two-interface DCU has two optical interfaces. The optical interfaces
transmit and receive two channels of optical signals.

WARNING
If the front panel of the one-interface DCU has two LC optical interfaces, only the upper optical
interface (IN1/OUT1) is valid. In the case of the DCU whose front panel has two LC optical
interfaces, determine whether the DCU is a one-interface DCU or a two-interface DCU according
to 19.7.7 Feature Code.
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Boards

Table 19-35 describes the type and usage of the optical interface of the one-interface DCU.
Table 19-35 Optical interface of the one-interface DCU
Interface

Type of
Interface

Usage

IN

LC

Receives one channel of optical signals.

OUT

LC

Transmits one channel of optical signals.

Table 19-36 describes the types and usage of the optical interfaces of the two-interface DCU.
Table 19-36 Optical interfaces of the two-interface DCU
Interface

Type of
Interface

Usage

IN1

LC

Receives the first channel of optical signals.

OUT1

LC

Transmits the first channel of optical signals.

IN2

LC

Receives the second channel of optical signals.

OUT2

LC

Transmits the second channel of optical signals.

19.7.6 Valid Slots


The slots valid for the DCU vary with the cross-connect capacity and subrack of the OptiX OSN
equipment.
NOTE

The slots valid for a board are determined by the following factors:
l Slot bandwidth
l Cross-connect capacity
l Board version

The slots valid for the DCU are as follows:


l

When the cross-connect capacity is 200 Gbit/s, the DCU can be installed in slots 18 and
1117 in the subrack.

19.7.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the DCU indicates the compensated dispersion for the optical signals.
Table 19-37 provides the relationship between the feature code of the DCU and the compensated
dispersion.
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Boards

Table 19-37 Relationship between the feature code of the DCU and the compensated dispersion
Board

Feature Code

Compensated Dispersion

SSN1DCU01

01

Compensated dispersion for a single channel: 60


km

SSN1DCU02

02

Compensated dispersion for a single channel: 80


km

SSN1DCU03

03

Compensated dispersion for dual channels: 60


km/60 km

SSN1DCU04

04

Compensated dispersion for dual channels: 80


km/80 km

SSN1DCU05

05

Compensated dispersion for dual channels: 60


km/80 km

SSN2DCU01

01

Compensated dispersion for a single channel: 40


km

SSN2DCU02

02

Compensated dispersion for a single channel: 60


km

SSN2DCU03

03

Compensated dispersion for a single channel: 80


km

SSN2DCU04

04

Compensated dispersion for dual channels: 40


km/40 km

SSN2DCU05

05

Compensated dispersion for dual channels: 60


km/60 km

SSN2DCU06

06

Compensated dispersion for dual channels: 80


km/80 km

SSN2DCU07

07

Compensated dispersion for dual channels: 40


km/60 km

SSN2DCU08

08

Compensated dispersion for dual channels: 40


km/80 km

SSN2DCU09

09

Compensated dispersion for dual channels: 60


km/80 km

19.7.8 Technical Specifications


The technical specifications of the DCU include the parameters specified for optical interfaces,
mechanical specifications, and power consumption.

Parameters Specified for Optical Interfaces


Table 19-38 lists the parameters specified for the optical interfaces of the DCU.

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Boards

Table 19-38 Parameters specified for the optical interfaces of the DCU
Parameter

Value

Nominal bit rate

9953280 kbit/s

Line code pattern

NRZ

Central wavelength
(nm)

1550.120.05

-0.5 dB bandwidth
(nm)

> 0.4

Compensated
dispersion (ps/nm)

N1DCU: 1020 (60 km); 1360 (80 km)

Insertion loss (dB)

Less than 8.3 dB in the case of the N1DCU and less than 3 dB in
the case of the N2DCU

N2DCU: 680 (40 km); 1020 (60 km); 1360 (80 km)

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the DCU are as follows:
l

Dimensions (mm): 25.4 (W) x 220 (D) x 254.1 (H)

Weight (kg): 0.4

Power Consumption
The maximum power consumption of the DCU at room temperature (25C) is 0 W.

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20 Power Boards

20

Power Boards

About This Chapter


This topic describes the power boards such as the UPM, PIU and PIUA.
20.1 UPM
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the UPM (uninterruptible power module).
20.2 PIU
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PIU (power interface board).
20.3 PIUA
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PIUA (power interface board).
20.4 PIUB
The PIUB board is the power interface unit between the DC power distribution box and each
board on the subrack. This section describes the versions, functions, working principle, front
panel, configuration, and technical specifications of the PIUB board.

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20.1 UPM
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the UPM (uninterruptible power module).

20.1.1 Version Description


None.

20.1.2 Application
The UPM is an external uninterruptible power module. The UPM can directly convert 110 V/
220 V AC mains power into -48 V DC power required by the transmission equipment. The UPM
is suitable for the telecom carriers who cannot provide -48 V DC power supply or requires
batteries.
Figure 20-1 shows the application of the UPM on the OptiX OSN equipment series.
Figure 20-1 Application of the UPM on the OptiX OSN equipment series
OptiX OSN equipment
110 V/220 V

UPM

Backplane

-48 V
PIU

Board A

-48 V
PIU

Board B
-48 V

Table 20-1 shows different mapping policies of UPM.


Table 20-1 Mapping policies of UPM on the OptiX OSN 3500

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Type of Subrack

Mapping PDU

Mapping PIU

Mapping UPM

General OptiX OSN


3500 subrack

N1PDU,
DPD100-2-8 PDU

N1PIU, N1PIUA

EPS75-4815AF

Enhanced OptiX
OSN 3500 subrack
(1100 W)

N1PDU,
DPD100-2-8 PDU

N1PIUA

EPS75-4815AF

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Type of Subrack

Mapping PDU

Mapping PIU

Mapping UPM

OptiX OSN 3500


type III subrack
(2300 W)

TN51PDU,
DPD63-8-8 PDU

N1PIUB

EPS75-4815AF

20.1.3 Functions and Features


The UPM is a special power supply system and is numbered EPS75-4815AF. The UPM can
directly convert 110 V/220 V AC power into 48 V DC power that the transmission equipment
requires. The UPM is suitable for the telecom carriers who cannot provide 48 V DC power for
the equipment or telecom carriers who require storage batteries.
The UPM consists of the rectifier module, monitoring module, and DC/AC power distribution
frame. The rectifier module and monitoring module are hot-swappable so that faulty modules
can be replaced without the system being shut down.
The output power of a single EPS75-4815AF power system is 1700 W. The EPS75-4815AF
power system is 3U high. Figure 20-2 shows the appearance of the EPS75-4815AF power
system.
Figure 20-2 Appearance of the EPS75-4815AF power system

The UPM power box can be installed in an ETSI cabinet.


The storage batteries of the UPM work with one EPS75-4815AF power system. When the
external AC power system supplies power normally, the batteries store power. When the 110
V/220 V AC power supply is interrupted, the batteries can supply power for 3 to 4 hours. To
supply power to the OptiX OSN equipment, only one power system is required to be connected
to the batteries.
The full configuration of an EPS75-4815AF power system includes five rectifier modules and
one monitoring module.
NOTE

The storage batteries do not belong to the EPS75-4815AF power system. They need to be configured
separately. If the batteries are required, a battery cabinet is provided generally or a dedicated space in the
equipment cabinet is reserved for the batteries.

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Table 20-2 provide the functions and features of the UPM.


Table 20-2 Functions and features of the EPS75-4815AF power system
Function and
Feature

EPS75-4815AF

Hot-swappable
function

The AC/DC rectifier module of the UPM is hot-swappable. When


you replace a faulty rectifier module, the other rectifier module can
still work normally. Therefore, the maintainability of the system is
improved.

Storage battery
protection function

The UPM provides the storage battery protection function. When the
mains supply is interrupted, the power system of the equipment
automatically switches to the storage battery, which ensures that the
equipment operates normally. The battery module provides a capacity
of 40 to 500 Ah. The default capacity is 65 Ah.

Lightning-proof
function

The rectifier module is embedded with the lightning-proof protector.


The rectifier module can bear 5 lightning-simulated surges with an
8/20 s current waveform at the amplitude of 5 kA. When the
lightning current enters the rectifier module along with the power
cable, install category-C and category-B light arresters before you
connect the AC mains supply to the power system to prevent the
overvoltage caused by the direct lightning strike from damaging the
rectifier module.

20.1.4 Working Principle and Signal Flow


The UPM is fed by one 110 V/220 V AC mains power supply. The rectifier module converts
the input power into 48 V DC voltage to provide four DC branches and one battery branch.
The UPM consists of the rectifier module and the monitoring module. Figure 20-3 shows the
block diagram of the UPM.
Figure 20-3 Block diagram of the UPM
110 V/220 V AC

Rectifier
module

48 V DC

PIU

Monitoring
module

System control unit

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Rectifier Module
The rectifier module converts the 110 V/220 V AC mains power supply into 48 V DC voltage
required by the transmission equipment.

Monitoring Module
When the UPM works normally, the monitoring module controls the rectifier module, storage
battery loop, and load loop, which work according to the preset parameters or user settings. The
monitoring module also monitors the status and data of the rectifier module, storage battery loop,
and load loop.
In the case of a mains supply failure, the equipment is fed by the storage battery group that is
connected to the UPM. The battery group must be connected to the UPM before the mains supply
fails. When the batteries start to discharge due to a mains supply failure, the monitoring module
reports the no-mains-supply alarm. With the discharge of the batteries, the battery voltage starts
to drop. When the battery voltage is lower than 45 V, the monitoring module reports the DC
undervoltage alarm. When the battery voltage reaches 43 V, the battery group enables the poweroff protection function to interrupt the connection between the battery group and the equipment.
As a result, the batteries are automatically protected.
When the mains supply is restored, the UPM resumes normal operations.

20.1.5 Front Panel


The front panel of the UPM has indicators and ports of many types.

Diagram of the Front Panel


Figure 20-4 shows the front panel of the EPS75-4815AF power system (subject to the UPM
onsite).
Figure 20-4 Front panel of the EPS75-4815AF power system
1

10

5 6

14

11

12

13

15

1. Control circuit breaker of the AC 2. Control circuit breaker of the 3. Control circuit breaker of load 1 (10
input (30 A)
battery branch (80 A)
A)
4. Control circuit breaker of load 2 5. Control circuit breaker of load 6. Control circuit breaker of load 4 (40
(30 A)
3 (40 A)
A)
7. AC phase line terminal

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8. AC zero line terminal

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9. Negative 48 V terminal of the battery


branch

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10. Negative 48 V terminal of the


load branch

11. Positive 48 V terminal of the 12. Positive 48 V terminal of the load


battery branch
branch

13. Connecting terminal of the


PGND cable

14. DB44 signal port

15. Communication port (COM)

Indicators of the EPS75-4815AF


The front panel of each rectifier module has the following indicators:
l

Running status indicator (RUN) one color (green)

Alarm and protection indicator (ALM) one color (yellow)

Faulty state indicator (FAULT) one color (red)

The front panel of the monitoring module has the following indicators:
l

Power supply system fault indicator (ALM) one color (red)

Power supply system status indicator (RUN) one color (green)

For the meanings of the status of the indicators, see 24 Indicators.

Ports of the EPS75-4815AF Power System


The front panel of the EPS75-4815AF has six ports. Table 20-3 describes the types and usage
of these ports.
Table 20-3 Ports of the EPS75-4815AF power system

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Port

Type

Usage

Power input port

Power port

"7" and "8" indicate the AC mains input


terminals, which receive 110 V/220 V AC
power.

Power output port

Power port

The power output ports are in the lower left


corner on the front panel of the UPM. The
terminals indicated by "9" and "11" form a
battery port, through which the power system is
connected to the battery input socket at the back
of the storage battery box through a battery
cable. "10" and "12" indicate the output ports of
four loads. The output ports can supply power
to the OptiX OSN equipment by using power
cables.

Connecting
terminal of the
PGND cable

Power port

The UPM is grounded through the cabinet.

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Port

Type

Usage

DB44 signal port

DB44

The backplane of the subrack can be connected


to the sensor transfer box (an optional device)
through the DB44 signal port and to the
monitoring module through the 96-pin DIN
connector. In addition, the sensor transfer box
can be connected to multiple sensors. As a
result, the monitoring function is extended.

Communication
port (COM)

RJ-45

Reserved

Switch button

Button

The switch buttons are on the left of the UPM,


as shown in Figure 20-4. "1" indicates the
control circuit breaker of the AC input (30 A),
which enables and disables the input of the AC
mains supply. "2", "3", "4", and "5" indicate the
load control switches, which enable and disable
the load output.

Table 20-4 provides the definition of DB44 signal pins.


Table 20-4 Definition of DB44 signal pins
Pin Diagram

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Pin

Definiti
on

Function

Pin

Definit
ion

Function

24 V

Auxiliary power
output

23

SMOK
E

Smoke sensor

12 V

Auxiliary power
output

24

WATE
R

Water damage detection

12 V

Auxiliary power
output

25

DOOR

Door status switch (DSS)


signal detection

GND

Signal ground

26

WIRE

Distribution frame
connection

GND

Signal ground

27

JK1+

Positive terminal of dry


contact 1

SIM1

Voltage
detection of the
first battery pack

28

JK1-

Negative terminal of dry


contact 1

SIM2

Voltage
detection of the
second battery
pack

29

JK2+

Positive terminal of dry


contact 2

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Pin Diagram

20 Power Boards

Pin

Definiti
on

Function

Pin

Definit
ion

Function

30

JK2-

Negative terminal of dry


contact 2

31

CONT1
O+

Positive terminal for output


control of optical coupler 1

10

GND

Signal ground

32

CONT1
O-

Negative terminal for output


control of optical coupler 1

11

VHUM

Ambient
humidity
measurement

33

CONT2
O+

Positive terminal for output


control of optical coupler 2

12

VBTEM
1

Battery
temperature
measurement 1

34

CONT2
O-

Negative terminal for output


control of optical coupler 2

13

VBTEM
2

Battery
temperature
measurement 2

35

FANCT
R1+

Positive terminal for fan


rotation control

14

VTEM1

Ambient
temperature
measurement 1

36

FANCT
R1-

Negative terminal for fan


rotation control

15

VTEM2

Ambient
temperature
measurement 2

37

JKM1+

Positive terminal for a surge


protector failure alarm

16

JTD1

Backup 1

38

JKM1-

Negative terminal for a surge


protector failure alarm

17

JTD2

Backup 2

39

JKM2+

Positive terminal for an AC


power-off alarm

18

JTD3

Backup 3

40

JKM2-

Negative terminal for an AC


power-off alarm

19

JTD4

Backup 4

41

JKM3+

Positive terminal for a battery


undervoltage alarm

20

JTD5

Backup 5

42

JKM3-

Negative terminal for a


battery undervoltage alarm

21

JTD6

Backup 6

43

JKM4+

Positive terminal for power


supply system failure

22

JTD7

Backup 7

44

JKM4-

Negative terminal for power


supply system failure

20.1.6 Valid Slots


The UPM is case shaped. Hence, the UPM does not occupy a slot in the subrack.
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20.1.7 Technical Specifications


The technical specifications of the UPM include the power parameters and mechanical
specifications.
The equipment supports the 110 V/220 V power supply through an uninterrupted power modules
(UPM). The UPM is used to convert 110 V/220 V AC into -48 V DC, and to provide power
supply for the equipment.
The type of UPM supported by the OptiX OSN equipment is 75-4815AF. If the 110 V/220 V
AC power fails, the storage battery can provide power supply for 4 hours.

Power Parameters
Table 20-5 lists the power parameters of the UPM.
Table 20-5 Power parameters of the EPS75-4815AF
Parameter

Value

Voltage range of
the AC input

90-290 V AC

AC input

One single-phase three-wire system: 45-65 Hz

Rated input current

28 A

Output nominal
voltage

53.50.5 V

Rated output
current

DC output branches

Load MCB 1: 10 A
Load MCB 2: 3 0A
Load MCB 3: 40 A
Load MCB 4: 40 A
Battery MCB: 80 A

Total output DC current

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37.53 A to 753 A

Regulated voltage
precision

1%

Non-balance of
load sharing

5% (50%-100% load)

Rated efficiency of
the integrated
equipment

89%

Power factor

0.99 (nominal input or output)

Peak-to-peak noise
voltage

200mV (within the range of 20 MHz)

Electrical network
adjustment rate

0.1%

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Parameter

Value

Lightning
protection
performance

When the UPM works alone, the input end can bear the simulated
lightning surge current whose waveform is 8/20s and amplitude is 5
kA for five times in both directions. The interval between two surges
must not be less than one minute. If the lightning surge current is higher
than the preceding indexes, the UPM may be damaged and cannot work
normally.

Cooling method

The fan that is embedded in the rectifier module cools the module.

Mechanical Specifications
The mechanical specifications of the EPS75-4815AF are as follows:
l
l

Dimensions of the UPM (mm): 133mm (W) x 255mm (D) x 436mm (H)
Weight: 15 kg

20.2 PIU
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PIU (power interface board).

20.2.1 Version Description


The PIU is available in one functional version, namely, N1. The N1PIU is discontinued.

20.2.2 Application
The PIU is a power interface board that is mainly used to receive the power supply for the OptiX
OSN equipment.
Figure 20-5 shows the application of the PIU on the OptiX OSN equipment series.
Figure 20-5 Application of the PIU on the OptiX OSN equipment series
OptiX OSN equipment

-48 V

PIU
Backplane

-48 V

PIU

Board A

Board B
-48 V

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-48 V

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20.2.3 Functions and Features


The PIU is used to receive the power supply and to provide the lightning protection function
and filtering function.
Table 20-6 provides the functions and features of the PIU.
Table 20-6 Functions and features of the PIU
Function and
Feature

PIU

Lightning
protection function

Provides the lightning protection function and reports the alarm that
indicates a surge protection failure.

Filtering function

Enhances the electromagnetic compatibility of the system by filtering


the power supply interface and shielding the structure of the board.

Power supply
interface

Provides two 50 W power interfaces for external devices such as the


COA.

Power supply of the


FAN

Provides the FAN with normal working voltages.

Alarm monitoring

Reports the board in-position alarm.

Power supply
backup

Supports the 1+1 hot backup. Any one PIU can supply power to an
entire subrack.

NOTE

One PIU can supply power to an entire subrack.

20.2.4 Working Principle and Signal Flow


The PIU consists of the power access unit, filtering unit, and unit that detects whether the
lightning-proof unit fails.
Figure 20-6 shows the functional block diagram of the PIU.
Figure 20-6 Functional block diagram of the PIU
COA power supply unit

Power
access
unit

Unit that detects


whether the
lightning-proof
unit f ails

Filtering
unit

Filtering
unit

Backplane

Alarm indicating a
lightning-proof unit f ailure
Sy stem controlunit

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Power Access Unit


This unit receives the 48 V or 60 V power supply for the system.

Unit That Detects Whether the Lightning-Proof Unit Fails


This unit protects the equipment from overcurrent and lightning and reports the alarm that
indicates its failure to the SCC unit.

Filtering Unit
This unit filters the electromagnetic interference signals to ensure that the equipment operates
stably.

20.2.5 Front Panel


The front panel of the PIU has power interfaces.

Diagram of the Front Panel


Figure 20-7 shows the appearance of the front panel of the PIU.

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Figure 20-7 Front panel of the PIU

PIU

PWR

PS1

PS2

PIU

Interfaces
The front panel of the PIU has two power interfaces. Table 20-7 describes the types and usage
of the interfaces of the PIU.
Table 20-7 Interfaces of the PIU

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Interface

Type of Interface Usage

PWR

3V3 terminal

Receives the 48 V power supply.

PS1/PS2

Four-phase socket

Provides the 50 W power output and can supply


power to the COA.

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20.2.6 Valid Slots


The PIU can be installed in slots 27 and 28 in the subrack.

20.2.7 Technical Specifications


The technical specifications of the PIU include the mechanical specifications, power
consumption, input voltage, and fuse.

Mechanical Specifications
The mechanical specifications of the PIU are as follows:
l

Dimensions (mm): 44.0 (W) x 110 (D) x 254.1 (H)

Weight: 1.2 kg

Power Consumption
At room temperature (25C), the maximum power consumption of the PIU is 8W.

Input Voltage
The input voltage range of the PIU is as follows:
l

If the standard voltage of the input power is -48 V, the power voltage ranges from -38.4 V
to -57.6 V.

If the standard voltage of the input power is -60 V, the power voltage ranges from -48 V
to -72 V.

Fuse
The main loop fuse F7 of the PIU is 250 V-20 A-0.00355 ohms.

20.3 PIUA
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PIUA (power interface board).

20.3.1 Version Description


The PIUA is available in one functional version, namely, N1.

20.3.2 Application
The PIUA is a power interface board that is mainly used to receive the power supply for the
OptiX OSN equipment.
Figure 20-8 shows the application of the PIUA on the OptiX OSN equipment series.
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Figure 20-8 Application of the PIUA on the OptiX OSN equipment series
OptiX OSN equipment

-48 V

PIUA
Backplane
PIUA

-48 V

Board A

Board B
-48 V

-48 V

20.3.3 Functions and Features


The PIUA is used to receive the power supply and to provide the lightning protection function
and filtering function.
Table 20-8 provides the functions and features of the PIUA.
Table 20-8 Functions and features of the PIUA
Function and
Feature

PIUA

Lightning
protection function

Provides the lightning protection function and reports the alarm that
indicates a surge protection failure.

Filtering function

Enhances the electromagnetic compatibility of the system by filtering


the power supply interface and shielding the structure of the board.

Power supply
interface

Provides two 50 W power interfaces for external devices such as the


COA and hub.

Alarm monitoring

Reports the board in-position alarm.

Power supply
backup

Supports the 1+1 hot backup. Any one PIUA can supply power to the
entire subrack.

20.3.4 Working Principle and Signal Flow


The PIUA consists of the power access unit, filtering unit, and unit that detects whether the
lightning-proof unit fails.
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Figure 20-9 shows the functional block diagram of the PIUA.


Figure 20-9 Functional block diagram of the PIUA
Unit that detects
whether the lightningproof unit fails

Power
access
unit

Filtering
unit

Backplane

Alarm indicating a
lightning-proofunitfailure
System control unit

Power Access Unit


This unit receives the 48 V or 60 V power supply for the system.

Unit That Detects Whether the Lightning-Proof Unit Fails


This unit protects the equipment from overcurrent and lightning and reports the alarm that
indicates a lightning-proof unit failure to the SCC unit.

Filtering Unit
This unit filters the electromagnetic interference signals to ensure that the equipment can operate
stably.

20.3.5 Front Panel


The front panel of the PIUA has indicators and power interfaces.

Diagram of the Front Panel


Figure 20-10 shows the appearance of the front panel of the PIUA.

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Figure 20-10 Front panel of the PIUA

PIUA

POWER

NEG(-)
PWR
RTN(+)

PS1

RTN(+)

NEG(-)

PS2

RTN(+)

NEG(-)

PIUA

Indicators
The front panel of the board has a power supply indicator (POWER). The POWER indicator is
green when it is on.
For the meanings of the status of the indicator, see 24 Indicators.

Interfaces
The front panel of the PIUA has two power interfaces. Table 20-9 describes the types and usage
of the interfaces of the PIUA.

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Table 20-9 Interfaces of the PIUA


Interface

Type of Interface

Usage

PWR

3V3 terminal

Receives the 48 V power supply.

PS1/PS2

Four-phase socket

Provides the 50 W power output and can supply


power to the COA.

20.3.6 Valid Slots


The PIUA can be installed in slots 27 and 28 in the subrack.

20.3.7 Technical Specifications


The technical specifications of the PIUA include the mechanical specifications, power
consumption, input voltage, and the fuse.

Mechanical Specifications
The mechanical specifications of the PIUA are as follows:
l

Dimensions (mm): 44.0 (W) x 110 (D) x 254.1 (H)

Weight: 0.5 kg

Power Consumption
At room temperature (25C), the maximum power consumption of the PIUA is 3 W.

Input Voltage
The input voltage range of the PIUA is as follows:
l

If the standard voltage of the input power is -48 V, the power voltage ranges from -38.4 V
to -57.6 V.

If the standard voltage of the input power is -60 V, the power voltage ranges from -48V to
-72 V.

Fuse
The main loop fuse of the PIUA is 250 V-32 A-0.00355 ohms.

20.4 PIUB
The PIUB board is the power interface unit between the DC power distribution box and each
board on the subrack. This section describes the versions, functions, working principle, front
panel, configuration, and technical specifications of the PIUB board.

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20.4.1 Version Description


The PIUB is available in one functional version, namely, N1. The PIUB board only can be used
on a type III subrack (2300 W).

20.4.2 Application
The PIUB board is a power interface board that provides power supply for the OptiX OSN
3500.
Figure 20-11 shows the application of the PIUB board in the OptiX OSN system.
Figure 20-11 Application of the PIUB board in the OptiX OSN system
OptiX OSN equipment

-48 V

PIU
Backplane

-48 V

PIU

Board A

Board B
-48 V

-48 V

20.4.3 Functions and Features


The PIUB is a power interface board that provides power supply, lightning protection, and
filtering functions.
Table 20-10 provides the functions and features of the PIUB board.
Table 20-10 Functions and features of the PIUB board

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Functions and
Features

Description

Lightning
protection function

Provides the lightning protection function and reports the alarm that
indicates a surge protection failure.

Filtering function

Enhances the electromagnetic compatibility of the system by filtering


the power supply interface and shielding the structure of the board.

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Functions and
Features

Description

Power supply
interface

Provides two 50 W power interfaces for external units such as the COA.

Alarm monitoring

Reports the board in-position alarm.

Power supply
backup

Supports 1+1 hot backup. Any one PIUB can supply power to an entire
subrack.

20.4.4 Working Principle and Signal Flow


The PIUB board consists of the filtering unit, protection unit, protection circuit failure detecting
unit, and power detecting unit.
Figure 20-12 shows the functional block diagram of the PIUB.
Figure 20-12 Functional block diagram of the PIUB
COA power supply interface
COA

NEG(-)

NEG(-)
Protection
unit

Filtering
unit
RTN(+)

RTN(+)
Protection
circuit failure
detecting unit

System control unit

Power
detecting
unit

LED
indication

Filtering Unit
This unit filters the electromagnetic interference signals to ensure that the equipment operates
stably.

Protection Unit
This unit protects the equipment from overcurrent and lightning.
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Protection Circuit Failure Detecting Unit


This unit monitors the protection unit and reports the alarm that indicates a protection unit failure
to the SCC unit.

Power Detecting Unit


This unit checks whether the input power supply is valid, and uses the indicator to indicate the
status of the input power supply.

20.4.5 Front Panel


The front panel of the PIUB has indicators and power interfaces.

Diagram of the Front Panel


Figure 20-13 shows the appearance of the front panel of the PIUB board.
Figure 20-13 Front panel of the PIUB

PIUB
POWER

RTN(+)

NEG(-)

PS1

RTN(+)

NEG(-)

PS2

RTN(+)

NEG(-)

PIUB

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Indicators
The front panel of the board has a power supply indicator (POWER). The POWER indicator is
green when it is on.
For the meanings of the status of the indicator, see 24 Indicators.

Interfaces
The front panel of the PIUB board has two power interfaces. Table 20-11 provides the types
and usage of the power interfaces of the PIUB board.
Table 20-11 Description of the interfaces on the PIUB board
Interface

Silkscreen

Type of
Interface

Usage

PWR

RTN(+),
NEG(-)

Dual-OT
terminal

Provides -48 V power input.

PWS

PS1, PS2

Four-phase
socket

Provides two 50 W power outputs for the COA.

Table 20-12 provides the pin description of the PS1 and PS2 interfaces on the PIUB board.
Table 20-12 Pin description of the PWS interfaces on the PIUB board
Front View

Pin

Usage

48 V

48 V

Grounding

Not defined

20.4.6 Valid Slots


The PIUB board can be installed in slots 27 and 28 on the subrack.

20.4.7 Technical Specifications


The technical specifications of the PIUB board include the mechanical specifications, power
consumption, input voltage.
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Mechanical Specifications
The mechanical specifications of the PIUB are as follows:
l

Dimensions (mm): 44.0 (W) x 110 (D) x 254.1 (H)

Weight (kg): 0.6

Power Consumption
The maximum power consumption of the PIUB at room temperature (25C) is 6 W.

Input Voltage
The input voltage range of the PIUB is as follows:
l

If the standard voltage of the input power is -48 V, the power voltage ranges from -38.4 V
to -57.6 V.

If the standard voltage of the input power is -60 V, the power voltage ranges from -48 V
to -72 V.

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21

21 Pluggable Optical Module

Pluggable Optical Module

About This Chapter


Certain boards on the OptiX OSN equipment supports the small form-factor pluggable (SFP),
enhanced small form-factor pluggable (eSFP), and 10 Gigabit small form-factor pluggable
(XFP) optical modules. When you need to adjust the type of accessed services or replace such
a faulty optical module, you just need to directly replace the pluggable optical module without
replacing its board.
21.1 Overview
The SFP/eSFP is a small form-factor pluggable optical transceiver. It is mainly used for SDH
optical communication and Ethernet data communication. The XFP is a 10-Gigabit small formfactor pluggable optical transceiver. It is mainly for SDH optical communication, GE/10GE data
communication, and DWDM communication.
21.2 SFP/eSFP
This topic describes the BOM number, name, specifications, and supported boards of the SFP/
eSFP optical modules.
21.3 XFP
This topic describes the BOM number, name, specifications, and supported boards of the XFP
optical modules.
21.4 CWDM/DWDM
This topic describes the BOM number, name, specifications, and supported boards of the
CWDM/DWDM optical modules.

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21.1 Overview
The SFP/eSFP is a small form-factor pluggable optical transceiver. It is mainly used for SDH
optical communication and Ethernet data communication. The XFP is a 10-Gigabit small formfactor pluggable optical transceiver. It is mainly for SDH optical communication, GE/10GE data
communication, and DWDM communication.

Appearance
Figure 21-1 shows the appearances of the SFP and eSFP optical modules, and Figure 21-2
shows the appearance of the XFP optical module.
Figure 21-1 SFP/eSFP optical module

The dimensions of the SFP and eSFP optical modules are 13.4 mm (W) x 56.5 mm (D) x 8.5
mm (H).
Figure 21-2 XFP optical module

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21 Pluggable Optical Module

The dimensions of the XFP optical module are 18.3 mm (W) x 78 mm (D) x 8.5 mm (H).

BOM
The BOM of a pluggable optical module is used to identify different types of optical modules.
The BOM can be marked on a label that is attached to each pluggable optical module.
Figure 21-3 shows the label of a pluggable optical module.
Figure 21-3 Label of a pluggable optical module

NOTE

You can check the specifications of an optical module in this manual according to the BOM of the optical
module.

21.2 SFP/eSFP
This topic describes the BOM number, name, specifications, and supported boards of the SFP/
eSFP optical modules.
Table 21-1 lists the BOM numbers and specifications of the SFP/eSFP optical modules.
Table 21-1 Mapping table of the BOM numbers and the types of the SFP/eSFP optical modules

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BOM
Numb
er

Name

340605
88

2 Mbit/s eSFP
optical module

Optical transceiver, eSFP,


1310 nm, 2.048 Mb/s, 15
dBm, 8 dBm, 26 dBm, LC,
SM, 2 km

N1PFL1

340602
87

155 Mbit/s SFP


optical module

Optical transceiver, SFP,


1310 nm, STM1, -19 to -14
dBm, -30 dBm, LC, MM, 2
km

N1ADQ1, N1EFF8,
N1IDQ1, N1MST4,
N1SLQ1, N1SLQ1A,
N1IDQ1A, N1EFF8A,
N1PEFF8, R1PEF4F

Specifications

Compatible Board

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output
Optical Power-Maximum
Output Optical PowerReceiver SensitivityOptical Interface TypeOptical Fiber TypeTransmission Distance)

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BOM
Numb
er

Name

340602
76

155 Mbit/s eSFP


optical module

340602
81

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Specifications

21 Pluggable Optical Module

Compatible Board

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output
Optical Power-Maximum
Output Optical PowerReceiver SensitivityOptical Interface TypeOptical Fiber TypeTransmission Distance)
Optical transceiver, eSFP,
1310 nm, STM1, -15 to -8
dBm, -31 dBm, LC, SM, 15
km

N1OU08, N1SL1, N2SL1,


N1SLQ1, N2SLQ1,
R1SLQ1, R1SL1, N1ADQ1,
N1EFF8, N1IDQ1, N1SLT1,
Q2CXL1, N2SLO1,
Q3CXL1, N1SL1A,
N1SLQ1A, R1CXLLN,
R2CXLLN, Q5CXLLN,
Q6CXLLN, R1CXLD41,
R1CXLQ41, R2CXLQ41,
Q5CXLQ41, Q6CXLQ41,
N1IDQ1A, N3SLO1,
R3SL1, R3SLQ1,
N1EFF8A, R1PCXLN,
N1PEFF8, R1PEF4F,
N1EDQ41, TNN1CO1,
TNN1AFO1

Optical transceiver, eSFP,


1310 nm, STM1, -5 to 0 dBm,
-37 dBm, LC, SM, 40 km

N1SL1, N2SL1, N1SLQ1,


N2SLQ1, N1ADQ1,
N1IDQ1, Q2CXL1,
Q3CXL1, N2SLO1,
N1SL1A, N1SLQ1A,
N3SLO1, R1CXLLN,
R2CXLLN, Q5CXLLN,
Q6CXLLN, R1CXLD41,
R1CXLQ41, R2CXLQ41,
Q5CXLQ41, Q6CXLQ41,
R1SL1, R3SL1, R1SLQ1,
R3SLQ1, N1SLT1,
R1PCXLN, N1PEFF8,
R1PEF4F, N1EDQ41,
TNN1CO1, TNN1AFO1

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BOM
Numb
er

Name

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Compatible Board

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output
Optical Power-Maximum
Output Optical PowerReceiver SensitivityOptical Interface TypeOptical Fiber TypeTransmission Distance)

340602
82

340602
77

Specifications

21 Pluggable Optical Module

622 Mbit/s eSFP


optical module

Optical transceiver, eSFP,


1550 nm, STM1, -5 to 0 dBm,
-37 dBm, LC, SM, 80 km

N1SL1, N2SL1, N1SLQ1,


N2SLQ1, R1SLQ1, R1SL1,
N1ADQ1, N1IDQ1,
Q2CXL1, Q3CXL1,
N1SL1A, N1SLQ1A,
R1CXLLN, R2CXLLN,
Q5CXLLN, Q6CXLLN,
R1CXLD41, R1CXLQ41,
R2CXLQ41, Q5CXLQ41,
Q6CXLQ41, N3SLO1,
R3SL1, R3SLQ1, N1SLT1,
N1PEFF8, R1PEF4F,
N1EDQ41, TNN1CO1,
TNN1AFO1

Optical transceiver, eSFP,


1310 nm, STM4, -15 to -8
dBm, -30 dBm, LC, SM, 15
km

N1SL4, N2SL4, N1SL4A,


N1SLD4, N2SLD4,
N1SLD4A, N1SLQ4,
N2SLQ4, N1SLQ4A,
R1PCXLN, N1EDQ41,
Q2CXL4, Q3CXL4,
Q5CXLLN, Q6CXLLN,
Q5CXLQ41, Q6CXLQ41,
R1CXLD41, R1CXLLN,
R2CXLLN, R1CXLQ41,
R2CXLQ41, R1SL4,
R3SL4, R1SLD4, R3SLD4

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BOM
Numb
er

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Name

Specifications

21 Pluggable Optical Module

Compatible Board

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output
Optical Power-Maximum
Output Optical PowerReceiver SensitivityOptical Interface TypeOptical Fiber TypeTransmission Distance)

340602
80

Optical transceiver, eSFP,


1310 nm, STM4, -3 to 2 dBm,
-30 dBm, LC, SM, 40 km

N2SLQ4, N2SL4, N1SL4,


N1SLD4, N2SLD4,
N1SLQ4, N2SLQ4, R1SL4,
R1SLD4, N1ADL4,
N1IDL4, Q2CXL4,
Q3CXL4, N1MST4,
N1SL4A, N1SLD4A,
N1SLQ4A, R1CXLLN,
R2CXLLN, R1CXLD41,
R1CXLQ41, R2CXLQ41,
Q5CXLLN, Q6CXLLN,
Q5CXLQ41, Q6CXLQ41,
R3SL4, R3SLD4,
R1PCXLN, N1EDQ41

340602
84

Optical transceiver, eSFP,


1550 nm, STM4, -3 to 2dBm,
-30 dBm, LC, SM, 80 km

N1SL4, N2SL4, N1SLD4,


N2SLD4, N1SLQ4,
N2SLQ4, R1SL4, R1SLD4,
N1ADL4, N1IDL4,
Q2CXL4, Q3CXL4,
N1SL4A, N1SLD4A,
N1SLQ4A, R1CXLLN,
R2CXLLN, Q5CXLLN,
Q6CXLLN, R1CXLD41,
R1CXLQ41, R2CXLQ41,
Q5CXLQ41, Q6CXLQ41,
N1SL4A, N1SLD4A,
N1SLQ4A, R3SL4,
R3SLD4, R1PCXLN,
N1EDQ41

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BOM
Numb
er

Name

Compatible Board

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output
Optical Power-Maximum
Output Optical PowerReceiver SensitivityOptical Interface TypeOptical Fiber TypeTransmission Distance)

340602
85

Optical transceiver, eSFP,


1550 nm, STM4, -3 to +2
dBm, -36 dBm, LC, SM, 100
km

N1SL4, N2SL4, N1SL4A,


N1SLD4, N2SLD4,
N1SLD4A, N2SLQ4,
N1SLQ4A, Q2CXL4,
Q3CXL4, Q5CXLLN,
Q6CXLLN, Q5CXLQ41,
Q6CXLQ41, R1CXLD41,
R1CXLLN, R2CXLLN,
R1CXLQ41, R2CXLQ41,
R1SL4, R3SL4, R1SLD4,
R3SLD4

Optical transceiver, eSFP,


1310 nm, 1.25 Gbit/s, -9 to -3
dBm, -20 dBm, LC, SM, 10
km

N2EGS2, N1EGT2,
N2EGR2, N2EMR0,
N1EGS4, N1EMS4,
N3EGS4, N2EGT2,
N3EGS2, N4EGS4,
N1EMS2, N1PEG16,
N1PEG8, R1PEGS1,
Q1PEGS2, TNN1EG8

340602
98

Optical transceiver, eSFP,


1310 nm, 1.25 Gbit/s, -5 to -0
dBm, -23 dBm, LC, SM, 40
km

N2EGS2, N3EGS2,
N1EGT2, N2EGT2,
N2EGR2, N2EMR0,
N1EGS4, N3EGS4,
N4EGS4, N1EMS4,
N1EMS2, N1PEG16,
N1PEG8, R1PEGS1,
Q1PEGS2, TNN1EG8

340603
60

Optical transceiver, eSFP,


1550 nm, 1.25 Gbit/s, -2 to 5
dBm, -23 dBm, LC, SM, 80
km

N1EGT2, N3EGS2,
N2EGT2, N4EGS4,
N1PEG16, N1PEG8,
R1PEGS1, Q1PEGS2,
TNN1EG8

340604
73

Issue 03 (2013-02-20)

Specifications

21 Pluggable Optical Module

1.25 Gbit/s eSFP


optical module

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1397

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

Issue 03 (2013-02-20)

Specifications

21 Pluggable Optical Module

BOM
Numb
er

Name

Compatible Board

340602
86

2.125 Gbit/s eSFP


optical module

Optical transceiver, eSFP,


850 nm, 2.125 Gbit/s (multi
rate), -9.5 to -2.5 dBm,
-17dBm, LC, MM, 0.5 km

N2EGS2, N1EGT2,
N2EMR0, N1EGS4,
N1EMS4, N3EGS4,
N2EGT2, N3EGS2,
N4EGS4, N1EMS2,
N1PEG16, N1PEG8,
R1PEGS1, Q1PEGS2,
TNN1EG8

340602
78

2.5 Gbit/s eSFP


optical module

Optical Transceiver, eSFP,


1310 nm, STM16, -5 to 0
dBm, -21 dBm, LC, SM, 15
km

N1SLD16, N2SLQ16

340602
88

Optical transceiver, eSFP,


1310 nm, STM16, -10 to -3
dBm, -21 dBm, LC, SM, 2
km

N1SLQ16, N2SLQ16,
N1SLD16

340604
84

Optical Transceiver, eSFP,


1310 nm, 155 Mbit/s to 2.67
Gbit/s, -10 to -3 dBm, -21
dBm, LC, SM, 2 km

N1SLO16, N3SL16A,
Q2CXL16, Q5CXLLN,
Q6CXLLN, R1CXLLN,
R2CXLLN

340604
85

Optical transceiver, eSFP,


1310 nm, 155 Mbit/s to 2.67
Gbit/s, -5 to 0 dBm, -21 dBm,
LC, SM, 15 km

Q2CXL16, Q3CXL16,
N2SL16A, N3SL16A,
R1CXLLN, R2CXLLN,
Q5CXLLN, Q6CXLLN,
N1SLO16, R1PCXLN

340602
89

Optical transceiver, eSFP,


1310 nm, STM16, -2 to 3
dBm, -29 dBm, LC, SM, 40
km

R1CXLLN, R2CXLLN,
Q5CXLLN, Q6CXLLN

340604
88

Optical transceiver, eSFP,


1550 nm, STM16, -2 to 3
dBm, -30 dBm, LC, SM, 80
km

N1SLQ16, N2SLQ16,
N2SL16A, N3SL16A,
N1SLD16, Q5CXLLN,
Q6CXLLN, R2CXLLN,
N1SLO16, R1PCXLLN

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output
Optical Power-Maximum
Output Optical PowerReceiver SensitivityOptical Interface TypeOptical Fiber TypeTransmission Distance)

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

BOM
Numb
er

Name

Specifications

21 Pluggable Optical Module

Compatible Board

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output
Optical Power-Maximum
Output Optical PowerReceiver SensitivityOptical Interface TypeOptical Fiber TypeTransmission Distance)

03030
GGV

OptiX HPLAT,
SSX2T1SA02, 2.5 Gbit/s
ESFP transceiver (-30 dBm
to -9 dBm, 1310 nm, 40 km,
-2 dBm to +3 dBm, LC)

N1SLD16, N1SLO16,
N1SLQ16, N2SLQ16,
N3SL16A, Q2CXL16,
Q3CXL16

NOTE

Optical module data is subject to product versions, so contact Huawei local office for latest data.

21.3 XFP
This topic describes the BOM number, name, specifications, and supported boards of the XFP
optical modules.
Table 21-2 lists the BOM numbers and specifications of the XFP optical modules.
Table 21-2 Mapping table of the BOM numbers and the types of the XFP optical modules

Issue 03 (2013-02-20)

BOM
Numb
er

Name

340603
13

9.95 Gbit/s to
10.71 Gbit/s XFP
optical module

Specifications

Compatible Board

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output
Optical Power-Maximum
Output Optical PowerReceiver SensitivityOptical Interface TypeOptical Fiber TypeTransmission Distance)
Optical transceiver, XFP,
1310 nm, 9.95 Gbit/s to 10.71
Gbit/s, -6 dBm to -1 dBm, -11
dBm, LC, SM, 10 km

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N1SLD64, N1EAS2,
N4SL64, N1PEX1,
N2PEX1, N1PEX2,
TNN1EX2

1399

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

Specifications

21 Pluggable Optical Module

BOM
Numb
er

Name

Compatible Board

03030J
CB

9.95 Gbit/s to 11.1


Gbit/s XFP optical
module

Optical transceiver, XFP,


1550 nm, 9.95 Gbit/s to 11.1
Gbit/s, -1 dBm to 2 dBm, -17
dBm, LC, SM, 40 km

N1SLD64, N4SL64

340603
62

10.3 Gbit/s XFP


optical module

Optical transceiver, XFP,


850 nm, 10.3 Gbit/s, -7.3
dBm to -1.3 dBm, -7.5 dBm,
LC, MM, 0.3 km

N1PEX1

340603
22

9.95 Gbit/s to 11.1


Gbit/s XFP optical
module

Optical transceiver, XFP,


1550 nm, 9.95 Gbit/s to 11.1
Gbit/s, -1 dBm to 2 dBm, -15
dBm, LC, SM, 40 km

N1PEX1, N2PEX1,
N1PEX2, TNN1EX2

340603
61

9.95 Gbit/s to 11.1


Gbit/s XFP optical
module

Optical transceiver, XFP,


1550 nm, 9.95 Gbit/s to 11.1
Gbit/s, 0 dBm to 4 dBm, -24
dBm, LC, SM, 80 km

N1PEX1, N2PEX1,
N1PEX2, TNN1EX2,
N4SL64

03030J
HE

10.71 Gbit/s XFP


optical module

Optical transceiver (-19 dBm


to 0 dBm, 1550 nm, 800 ps/
nm, -1 dBm to +2 dBm, 193.4
THz, LC/PC), 100 GHz
spacing wavelength, FEC,
EA

N4SL64

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output
Optical Power-Maximum
Output Optical PowerReceiver SensitivityOptical Interface TypeOptical Fiber TypeTransmission Distance)

NOTE

Optical module data is subject to product versions, so contact Huawei local office for latest data.

21.4 CWDM/DWDM
This topic describes the BOM number, name, specifications, and supported boards of the
CWDM/DWDM optical modules.

Issue 03 (2013-02-20)

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Copyright Huawei Technologies Co., Ltd.

1400

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

21 Pluggable Optical Module

CWDM Optical Module


Table 21-3 lists the BOM numbers and specifications of the 2.5 Gbit/s CWDM eSFP optical
modules. Table 21-4 lists the BOM numbers and specifications of the 10 Gbit/s CWDM XFP
optical modules.
Table 21-3 Mapping table of the BOM numbers and the types of the 2.5 Gbit/s CWDM eSFP
optical modules

Issue 03 (2013-02-20)

BOM
Numb
er

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power,
Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

Compatible Board

340604
83

2.5 Gbit/s CWDM


eSFP optical
module

Transceiver, eSFP, 1471 nm,


100 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -28 dBm, LC,
80 km

N3SLH41, N1SL4A,
N3SLQ41, N3SL16A,
N1PEG8, N4SLO16,
N4SLQ16, TNN1EG8

340604
81

Transceiver, eSFP, 1491 nm,


100 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -28 dBm, LC,
80 km

340604
79

Transceiver, eSFP, 1511 nm,


100 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -28 dBm, LC,
80 km

340604
82

Transceiver, eSFP, 1531 nm,


100 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -28 dBm, LC,
80 km

340604
78

Transceiver, eSFP, 1551 nm,


100 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -28 dBm, LC,
80 km

340604
76

Transceiver, eSFP, 1571 nm,


100 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -28 dBm, LC,
80 km

340604
77

Transceiver, eSFP, 1591 nm,


100 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -28 dBm, LC,
80 km
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1401

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

BOM
Numb
er

Issue 03 (2013-02-20)

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power,
Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

340604
80

Transceiver, eSFP, 1611 nm,


100 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -28 dBm, LC,
80 km

340604
16

Transceiver, eSFP, 1471 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

340604
17

Transceiver, eSFP, 1491 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

340604
18

Transceiver, eSFP, 1511 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

340604
19

Transceiver, eSFP, 1531 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

340604
20

Transceiver, eSFP, 1551 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

340604
21

Transceiver, eSFP, 1571 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

340604
22

Transceiver, eSFP, 1591 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

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21 Pluggable Optical Module

Compatible Board

N1PEG16, R1PEGS1,
Q1PEGS2, N1PEG8,
TNN1EG8

1402

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

BOM
Numb
er

Name

340604
23

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power,
Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

21 Pluggable Optical Module

Compatible Board

Transceiver, eSFP, 1611 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

Table 21-4 Mapping table of the BOM numbers and the types of the 10 Gbit/s CWDM XFP
optical modules

Issue 03 (2013-02-20)

BOM
Numb
er

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power,
Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

Compatible Board

340605
47

9.95 Gbit/s to 11.1


Gbit/s CWDM
XFP optical
module

Transceiver, XFP, 1471 nm,


9.95 Gbit/s to 11.1 Gbit/s, 1
dBm, 4 dBm, -23 dBm, LC,
70 km

TNN1EX2, N4SL64,
N4SLD64, N1PEX2,
N2PEX1

340605
48

Transceiver, XFP, 1491 nm,


9.95 Gbit/s to 11.1 Gbit/s, 1
dBm, 4 dBm, -23 dBm, LC,
70 km

340605
49

Transceiver, XFP, 1511 nm,


9.95 Gbit/s to 11.1 Gbit/s, 1
dBm, 4 dBm, -23 dBm, LC,
70 km

340605
50

Transceiver, XFP, 1531 nm,


9.95 Gbit/s to 11.1 Gbit/s, 1
dBm, 4 dBm, -23 dBm, LC,
70 km

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1403

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

BOM
Numb
er

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power,
Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

340605
51

Transceiver, XFP, 1551 nm,


9.95 Gbit/s to 11.1 Gbit/s, 1
dBm, 4 dBm, -23 dBm, LC,
70 km

340605
52

Transceiver, XFP, 1571 nm,


9.95 Gbit/s to 11.1 Gbit/s, 1
dBm, 4 dBm, -23 dBm, LC,
70 km

340605
53

Transceiver, XFP, 1591 nm,


9.95 Gbit/s to 11.1 Gbit/s, 0
dBm, 3 dBm, -21 dBm, LC,
70 km

340605
54

Transceiver, XFP, 1611 nm,


9.95 Gbit/s to 11.1 Gbit/s, 0
dBm, 3 dBm, -21 dBm, LC,
70 km

21 Pluggable Optical Module

Compatible Board

DWDM Optical Module


Table 21-5 lists the BOM numbers and specifications of the 2.5 Gbit/s DWDM eSFP optical
modules. Table 21-6 lists the BOM numbers and specifications of the 10 Gbit/s DWDM XFP
optical modules.

Issue 03 (2013-02-20)

Huawei Proprietary and Confidential


Copyright Huawei Technologies Co., Ltd.

1404

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

21 Pluggable Optical Module

Table 21-5 Mapping table of the BOM numbers and the types of the 2.5 Gbit/s DWDM eSFP
optical modules

Issue 03 (2013-02-20)

BOM
Numb
er

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power,
Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

Compatible Board

340603
66

2.5 Gbit/s DWDM


eSFP optical
module

Optical transceiver, eSFP,


1560.61 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

N3SLH41, N1SL4A,
N3SLQ41, N3SL16A,
N1PEG8, TNN1EG8,
N4SLO16, N4SLQ16

340603
72

Optical transceiver, eSFP,


1559.79 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
73

Optical transceiver, eSFP,


1558.98 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
74

Optical transceiver, eSFP,


1558.17 nm, 125 Mbit/s to
2.67 G bit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
75

Optical transceiver, eSFP,


1557.36 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
76

Optical transceiver, eSFP,


1556.55 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
77

Optical transceiver, eSFP,


1555.75 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
78

Optical transceiver, eSFP,


1554.94 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

Huawei Proprietary and Confidential


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1405

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

BOM
Numb
er

Issue 03 (2013-02-20)

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power,
Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

340603
79

Optical transceiver, eSFP,


1554.13 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
80

Optical transceiver, eSFP,


1553.33 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
81

Optical transceiver, eSFP,


1552.52 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
82

Optical transceiver, eSFP,


1551.72 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
83

Optical transceiver, eSFP,


1550.92 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
84

Optical transceiver, eSFP,


1550.12 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
85

Optical transceiver, eSFP,


1549.32 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
86

Optical transceiver, eSFP,


1548.51 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

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Copyright Huawei Technologies Co., Ltd.

21 Pluggable Optical Module

Compatible Board

1406

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

BOM
Numb
er

Issue 03 (2013-02-20)

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power,
Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

340603
87

Optical transceiver, eSFP,


1547.72 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
88

Optical transceiver, eSFP,


1546.92 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
89

Optical transceiver, eSFP,


1546.12 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
90

Optical transceiver, eSFP,


1545.32 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
91

Optical transceiver, eSFP,


1544.53 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
92

Optical transceiver, eSFP,


1543.73 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
93

Optical transceiver, eSFP,


1542.94 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
94

Optical transceiver, eSFP,


1542.14 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

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Copyright Huawei Technologies Co., Ltd.

21 Pluggable Optical Module

Compatible Board

1407

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

BOM
Numb
er

Issue 03 (2013-02-20)

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power,
Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

340603
95

Optical transceiver, eSFP,


1541.35 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
96

Optical transceiver, eSFP,


1540.56 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
97

Optical transceiver, eSFP,


1539.77 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
98

Optical transceiver, eSFP,


1538.98 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
99

Optical transceiver, eSFP,


1538.19 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
00

Optical transceiver, eSFP,


1537.40 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
01

Optical transceiver, eSFP,


1536.61 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
02

Optical transceiver, eSFP,


1535.82 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

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Copyright Huawei Technologies Co., Ltd.

21 Pluggable Optical Module

Compatible Board

1408

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

BOM
Numb
er

Issue 03 (2013-02-20)

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power,
Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

340604
03

Optical transceiver, eSFP,


1535.04 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
04

Optical transceiver, eSFP,


1534.25 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
05

Optical transceiver, eSFP,


1533.47 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
06

Optical transceiver, eSFP,


1532.68 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
07

Optical transceiver, eSFP,


1531.90 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
08

Optical transceiver, eSFP,


1531.12 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
09

Optical transceiver, eSFP,


1530.33 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
10

Optical transceiver, eSFP,


1529.55 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

Huawei Proprietary and Confidential


Copyright Huawei Technologies Co., Ltd.

21 Pluggable Optical Module

Compatible Board

1409

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

21 Pluggable Optical Module

Table 21-6 Mapping table of the BOM numbers and the types of the 10 Gbit/s DWDM XFP
optical modules

Issue 03 (2013-02-20)

BOM
Numb
er

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power, Maximum
Output Optical Power,
Receiver Sensitivity,
Optical Interface Type,
Optical Fiber Type,
Transmission Distance)

Compatible Board

03030J
GQ

9.95 Gbit/s to 11.1


Gbit/s DWDM
XFP optical
module

Optical transceiver, XFP,


1560.61 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

N1SL64, N1PEX2,
N2PEX1, N4SL64,
TNN1EX2

03030J
GR

Optical transceiver, XFP,


1559.79 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
GS

Optical transceiver, XFP,


1558.98 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
GT

Optical transceiver, XFP,


1558.17 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
GU

Optical transceiver, XFP,


1557.36 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
GV

Optical transceiver, XFP,


1556.55 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
GW

Optical transceiver, XFP,


1555.75 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
GX

Optical transceiver, XFP,


1554.94 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

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Hardware Description

BOM
Numb
er

Issue 03 (2013-02-20)

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power, Maximum
Output Optical Power,
Receiver Sensitivity,
Optical Interface Type,
Optical Fiber Type,
Transmission Distance)

03030J
GY

Optical transceiver, XFP,


1554.13 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HA

Optical transceiver, XFP,


1553.33 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HB

Optical transceiver, XFP,


1552.52 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HC

Optical transceiver, XFP,


1551.72 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HD

Optical transceiver, XFP,


1550.92 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HE

Optical transceiver, XFP,


1550.12 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HF

Optical transceiver, XFP,


1549.32 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HG

Optical transceiver, XFP,


1548.51 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HH

Optical transceiver, XFP,


1547.72 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

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Compatible Board

1411

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

BOM
Numb
er

Issue 03 (2013-02-20)

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power, Maximum
Output Optical Power,
Receiver Sensitivity,
Optical Interface Type,
Optical Fiber Type,
Transmission Distance)

03030J
HJ

Optical transceiver, XFP,


1546.92 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HK

Optical transceiver, XFP,


1546.12 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HL

Optical transceiver, XFP,


1545.32 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HM

Optical transceiver, XFP,


1544.53 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HN

Optical transceiver, XFP,


1543.73 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HP

Optical transceiver, XFP,


1542.94 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HQ

Optical transceiver, XFP,


1542.14 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HR

Optical transceiver, XFP,


1541.35 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HS

Optical transceiver, XFP,


1540.56 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

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Compatible Board

1412

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

BOM
Numb
er

Issue 03 (2013-02-20)

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power, Maximum
Output Optical Power,
Receiver Sensitivity,
Optical Interface Type,
Optical Fiber Type,
Transmission Distance)

03030J
HT

Optical transceiver, XFP,


1539.77 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HU

Optical transceiver, XFP,


1538.98 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HV

Optical transceiver, XFP,


1538.19 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HW

Optical transceiver, XFP,


1537.40 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HX

Optical transceiver, XFP,


1536.61 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HY

Optical transceiver, XFP,


1535.82 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
JA

Optical transceiver, XFP,


1535.04 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
JB

Optical transceiver, XFP,


1534.25 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
JC

Optical transceiver, XFP,


1533.47 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

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Compatible Board

1413

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

BOM
Numb
er

Issue 03 (2013-02-20)

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power, Maximum
Output Optical Power,
Receiver Sensitivity,
Optical Interface Type,
Optical Fiber Type,
Transmission Distance)

03030J
JD

Optical transceiver, XFP,


1532.68 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
JE

Optical transceiver, XFP,


1531.90 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
JF

Optical transceiver, XFP,


1531.12 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
JG

Optical transceiver, XFP,


1530.33 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
JH

Optical transceiver, XFP,


1529.55 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

340605
33

Optical transceiver, XFP,


1551.72 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
01

Optical transceiver, XFP,


1550.92 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
02

Optical transceiver, XFP,


1550.12 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
14

Optical transceiver, XFP,


1549.32 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

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21 Pluggable Optical Module

Compatible Board

N1PEX2, N2PEX1,
N4SLD64, N4SL64,
TNN1EX2

1414

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

BOM
Numb
er

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output
Optical Power, Maximum
Output Optical Power,
Receiver Sensitivity,
Optical Interface Type,
Optical Fiber Type,
Transmission Distance)

340605
31

Optical transceiver, XFP,


1548.51 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
34

Optical transceiver, XFP,


1532.68 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
03

Optical transceiver, XFP,


1531.90 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
04

Optical transceiver, XFP,


1531.12 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
15

Optical transceiver, XFP,


1530.33 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
32

Optical transceiver, XFP,


1529.55 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

21 Pluggable Optical Module

Compatible Board

NOTE

Optical module data is subject to product versions, so contact Huawei local office for latest data.

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Hardware Description

22

22 Pluggable Electrical Module

Pluggable Electrical Module

A pluggable electrical module is used at an SFP interface to transmit/receive electrical signals.

Appearance
Figure 22-1 shows the appearance of the SFP electrical module.
Figure 22-1 Appearance of the GE SFP electrical module

SFP electrical module


Table 22-1lists the BOM numbers and specifications of the pluggable electrical modules.
Table 22-1 Mapping table of the BOM numbers and the types of the electrical modules

Issue 03 (2013-02-20)

BOM Number

Name

Specifications

Compatible Board

34100052

1000BASE-T SFP
electrical module

1000BASE-T (RJ45)
SFP electrical
module, 100 m

TNN1EG8,
N1PEG8,
Q1PEGS2,
R1PEGS1, N3EGS2,
N2EGT2, N1EGS4,
N4EGS4, N1EMS4,
N1EMS2

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Hardware Description

22 Pluggable Electrical Module

NOTE

Electrical module data is subject to product versions, so contact Huawei local office for latest data.

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

23 Cables

23

Cables

About This Chapter


This topic describes the cables that the equipment uses, including the fiber jumper, power cable,
alarm cable, management cable, signal cable, and clock cable.
23.1 Fiber Jumper
This topic describes the categories and connectors of the fiber jumpers.
23.2 Power Cable and Ground Cable
The power cables and ground cables include the cabinet power cable, subrack power cable, COA
power cable, and ground cable of the cabinet door.
23.3 Alarm Cable
The alarm cables that the equipment uses include the cabinet indicator cable, alarm cascading
cable, and alarm input/output cable.
23.4 Management Cable
The management cables include the serial cable, ordinary phone line, COA cascading cable, and
network cable.
23.5 Signal Cable
The signal cables include the E1/E3 signal cable, framed E1 signal cable, and Nx64 kbit/s signal
cable.
23.6 Clock Cable
The clock cables include the 75-ohm/120-ohm clock cable and clock transit cable.

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Hardware Description

23 Cables

23.1 Fiber Jumper


This topic describes the categories and connectors of the fiber jumpers.

23.1.1 Categories of the Fiber Jumpers


The OptiX OSN equipment uses various types of fiber jumpers.
Table 23-1 lists the categories of the fiber jumpers that the OptiX OSN equipment uses.
Table 23-1 Categories of the fiber jumpers that the OptiX OSN equipment uses
Usage

Connector
1

Connector
2

Fiber

Available Length

Used to connect
the OptiX OSN
equipment to the
ODF or to
connect an
interface board of
the OptiX OSN
equipment to
other equipment

LC/PC

FC/PC

2 mm singlemode fiber

6 m, 10 m, 20 m, 30 m,
and 50 m

2 mm multimode fiber

3 m, 5 m, 10 m, 20 m,
30 m, and 50 m

2 mm singlemode fiber

5 m, 10 m, 20 m, 30 m,
and 50 m

2 mm multimode fiber

10 m, 20 m, 30 m, and
50 m

Used to connect
the OptiX OSN
equipment

LC/PC

SC/PC

SC/PC

SC/PC

2 mm singlemode fiber

2 m, 5 m, 10 m, 20 m,
30 m, 50 m, and 80 m

LC/PC

LC/PC

2 mm singlemode fiber

1.5 m, 3 m, 5 m, 10 m,
20 m, and 30 m

2 mm multimode fiber

3 m, 5 m, 10 m, 20 m,
and 30 m

LC/PC

FC/PC

2 mm singlemode fiber

6 m, 10 m, 20 m, 30 m,
and 50 m

LC/PC

SC/PC

2 mm multimode fiber

5 m, 10 m, 20 m, 30 m,
and 50 m

Select the fiber connector and fiber length according to the on-site survey.

23.1.2 Connector
The OptiX OSN equipment uses various types of fiber connectors.
The four types of fiber connectors are described as follows:
l

Issue 03 (2013-02-20)

Most of the optical interfaces on the front panels of the boards are the LC/PC optical
interfaces. See Figure 23-1.
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Hardware Description

23 Cables

The N2OU08 and 61COA provide the SC/PC optical interfaces.

The "IN" interface on the case-shaped 62COA that is externally installed uses the LSH/
APC connector. See Figure 23-4.

Generally, the ODF on the client side provides the FC/PC or SC/PC optical interface.
Figure 23-3 and Figure 23-2 show the corresponding FC/PC and SC/PC fiber connectors.

Table 23-2 describes the four types of fiber connectors.


Table 23-2 Types of fiber connectors
Type of Internal
Fiber Connector

Description

LC/PC

Plug-in square fiber connector/protruding polished

LSH/APC

Connector with a dust-proof cover/protruding polished (eight


degrees)

FC/PC

Round fiber connector/protruding polished

SC/PC

Square fiber connector/protruding polished

LC/PC Fiber Connector


Figure 23-1 shows the appearance of the LC/PC fiber connector.
Figure 23-1 Appearance of the LC/PC fiber connector

The axial operation instead of rotation is required to insert or remove an LC/PC fiber connector.
To insert a fiber jumper that uses an LC/PC connector, align the head of the fiber jumper with
the optical interface and apply proper force. To remove the fiber jumper, first, press the clip,
then, slightly push the fiber connector inward, and finally, pull out the connector.

SC/PC Fiber Connector


Figure 23-2 shows the appearance of the SC/PC fiber connector.
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Hardware Description

23 Cables

Figure 23-2 Appearance of the SC/PC fiber connector

FC/PC Fiber Connector


Figure 23-3 shows the appearance of the FC/PC fiber connector.
Figure 23-3 Appearance of the FC/PC fiber connector

LSH/APC Fiber Connector


Figure 23-4 shows the appearance of the LSH/APC fiber connector.
Figure 23-4 Appearance of the LSH/APC fiber connector

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

23 Cables

23.2 Power Cable and Ground Cable


The power cables and ground cables include the cabinet power cable, subrack power cable, COA
power cable, and ground cable of the cabinet door.

23.2.1 Power Cable of the Cabinet


The -48 V power cable, BGND power cable, and PGND power cable are used to supply power
to the equipment in a cabinet. One end of the power cable is connected to the power distribution
cabinet and the ground bar in the equipment room, and the other end is connected to the DC
PDU at the top of the cabinet.

Structure
Figure 23-5 shows the structure of the -48 V/BGND power cable of the cabinet. Figure 23-6
and Figure 23-7 show the structure of the PGND power cable of the cabinet.
Figure 23-5 Structure of the -48 V/BGND power cable of the cabinet
1

3
1. Cord end terminal

2. Bare crimping terminal - type OT

3. Cable tie

Figure 23-6 Structure of the PGND power cable of the cabinet (JG2)

1. Bare crimping terminal - type OT

2. Cable tie

3. Bare crimping terminal (JG2)

4. Heat shrink tubing

5. Main label

6. Wire

7. Heat shrink tubing

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Hardware Description

23 Cables

Figure 23-7 Structure of the PGND power cable of the cabinet (OT)

1. Bare crimping terminal - type OT

2. Cable tie

3. Bare crimping terminal (OT)

4. Heat shrink tubing

5. Main label

6. Wire

7. Heat shrink tubing

Technical Specifications
Table 23-3 Technical specifications of the cabinet power cable
Item
-48 V power
cable of the
cabinet

BGND power
cable of the
cabinet

PGND power
cable of the
cabinet

Issue 03 (2013-02-20)

Description
Terminal 2
(telecommu
nications
room side)

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2

Terminal 1
(PDU side)

Single cord end terminal - 0.024 m - insertion depth of 12


mm - 80 A - green - 16 mm2/25 mm2

Cable type

Power cable - 450 V/750 V - blue - 85 A - 16 mm2/25


mm2

Terminal 2

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2

Terminal 1

Single cord end terminal - 0.024 m - insertion depth of 12


mm - 80 A - green - 16 mm2/25 mm2

Cable type

Power cable - 450 V/750 V - black - 16 mm2/25 mm2

Terminal 1

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2

Terminal 3

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

Item

23 Cables

Description
Cable type

Power cable - 450 V/750 V - yellow/green - 16 mm2/25


mm2

Fireproof class

IEC60332-3A

Length

Determined by the site survey result.

Structure
Figure 23-8 shows the structure of the -48 V/BGND power cable of the cabinet. Figure 23-9
shows the structure of the PGND power cable of the cabinet.
Figure 23-8 Structure of the -48 V/BGND power cable

1. Bare crimping terminal (OT)

2. Cord end terminal

Figure 23-9 Structure of the PGND power cable

1. Bare crimping terminal (OT)

Issue 03 (2013-02-20)

2. Cord end terminal

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23 Cables

Technical Specifications
Table 23-4 Technical specifications of the cabinet power cable
Item

Description

-48 V power
cable of the
cabinet

BGND power
cable of the
cabinet

PGND power
cable of the
cabinet

Terminal 2
(telecommu
nications
room side)

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2/35 mm2

Terminal 1
(PDU side)

Bare crimping terminal - type JG2 - M6 - tin plated - round


bare terminal - 16 mm2/25 mm2/35 mm2

Cable type

Power cable - 450 V/750 V - blue - 16 mm2/25 mm2/35


mm2

Terminal 2

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2/35 mm2

Terminal 1

Bare crimping terminal - type JG2 - M6 - tin plated - round


bare terminal - 16 mm2/25 mm2/35 mm2

Cable type

Power cable - 450 V/750 V - black - 16 mm2/25 mm2/35


mm2

Terminal 1

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2/35 mm2

Terminal 3

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2/35 mm2

Cable type

Power cable - 450 V/750 V - yellow/green - 16 mm2/25


mm2/35 mm2

Fireproof class

IEC60332-3A

Length

Determined by the site survey result.

Structure
Figure 23-10 shows the structure of the -48 V/BGND power cable of the cabinet. Figure
23-11 shows the structure of the PGND power cable of the cabinet.
Figure 23-10 Structure of the -48 V/BGND power cable
Bare crimping terminal (JG2)

Issue 03 (2013-02-20)

Bare crimping terminal (type OT)

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Hardware Description

23 Cables

Figure 23-11 Structure of the PGND power cable

1. Bare crimping terminal (OT)

2. Cord end terminal

Technical Specifications
Table 23-5 Technical specifications of the cabinet power cable
Item

Description

Terminal

Bare crimping terminal - type JG2 - 25 mm2 -M6 - 95 A - in plated


Bare crimping terminal - type OT - 25 mm2- M8 - tin plated - round
bare terminal

NOTE

Select cables with proper cross-sectional areas according to the required length of cabinet power cables:
l If the length of the cabinet power cable is required to be not more than 20 m, select the cable with a
cross-sectional area of 16 mm2.
l If the length of the cabinet power cable is required to be in the range from 21 m to 30 m, select the
cable with a cross-sectional area of 25 mm2.
l If the length of the cabinet power cable is required to be in the range from 31 m to 50 m, select the
cable with a cross-sectional area of 35 mm2.

Pin Assignments
None.

23.2.2 Ground Cable of the Cabinet Door


The ground cable of the cabinet door grounds the front door, rear door and side panels of the
cabinet. The ground cables of the cabinet door are correctly connected before delivery.

Structure
Figure 23-12 shows the structure of the ground cable of the cabinet door.
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Figure 23-12 Structure of the ground cable of the cabinet door

1. Bare crimping terminal - type OT

2. Heat shrink tubing

3. Main label

Pin Assignments
None.

Technical Specifications
Item

Description

Terminal X1/X2

Bare crimping terminal - OT - 6 mm2 - M6 - tin plated - round


insulated terminal - 12 to 10 AWG

Cable

Type

Wire - 600 V - UL1015 - 10 AWG - 105-core twisted pair yellow and green, round - 50 A

Fireproof
class

UL1015

Length

0.35 m

23.2.3 Subrack Power Cable


The subrack power cable connects the DC PDU at the top of the cabinet and the PIU in the
subrack. The subrack power cable leads the -48 V power from the top of the cabinet to the
subrack. The subrack power cable is correctly connected before delivery.
NOTE

A type III subrack (2300 W) uses different power cables from those used by a general subrack or an
enhanced subrack (1100 W).

Structure
Figure 23-13 shows the structure of the power cable for the general subrack and enhanced
subrack (1100 W).

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Figure 23-13 Structure of the power cable for the general subrack and enhanced subrack (1100
W)

1. Cable connector

2. Main label

3. Cable tie

4. Label

5. Cord end terminal

Figure 23-14 shows the structure of the power cable for the type III subrack (2300 W).
Figure 23-14 Structure of the power cable for the type III subrack (2300 W)

1
W1

W1

W2

W2

X1

X2

1. Bare crimping terminal - type OT

Pin Assignments
Table 23-6 provides the pin assignments of the power cable for the general subrack and enhanced
subrack (1100 W).

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Table 23-6 Pin assignments of the power cable for the general subrack and enhanced subrack
(1100 W)
Cable
Connector

Bare
Crimping
Terminal

Connection

Color of the Core

X1.A1

X2

A1 is connected to X2.

Blue (-48 V power)

X1.A3

X3

A3 is connected to X3.

Black (power ground)

Technical Specifications
Table 23-7 Technical specifications of the power cable for the general subrack and enhanced
subrack (1100 W)
Item

Description

Cable connector X1

Cable connector - type D - 3-pin - female - without intermediate


male terminals

Bare crimping terminals


X2 and X3

Single cord end terminal - 4 mm2 - 20 A - insertion depth of 10


mm - gray

Cable

Type

Power cable - 600 V - 5.26 mm2 - 10 AWG - black (the core is in


blue and black) - 41 A

Number of
cores

Fireproof
class

CM

Color

The core is in blue and black.

Length

2.5 m, 3 m, and 3.5 m

Table 23-8 Technical specifications of the power cable for the type III subrack (2300 W)
Item

Description

Cable connector

Bare crimping terminal - OT2- 10 mm2 - 60 A - tin plated

Cable

l Wire - 450 V/750 V - H07Z - K UL3386 - 10 mm2 - blue

Type

l Wire - 450 V/750 V - H07Z - K UL3386 - 10 mm2 - black

23.2.4 COA Power Cable


The PIU can supply power to a maximum of two pieces of external equipment (for example, the
COA).
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The COA power cable connects a power interface on the PIU to a power interface of the external
equipment. Both ends of the COA power cable use the 4-pin connector. One end of the COA
power cable is connected to the PIU and the other end is connected to the power interface of the
external equipment (for example, the COA).

Structure
Figure 23-15 shows the structure of the COA power cable.
Figure 23-15 Structure of the COA power cable
1

A-A

W1

3 1

4 2

X1
A 2
X3

W2
X2
W1.1
W1
W1.2
W2.1

X3

W2
W2.2

1. Common terminal - female 2. Common connector - 4-pin 3. Main label A-A. Sectional view in direction A

Pin Assignments
Table 23-9 provides the pin assignments of the COA power cable.
Table 23-9 Pin assignments of the COA power cable
Connectors X1
and X2

Cables W1 and W2

Color

Connector X3

X1.1

W1.1

Brown

X3.1

X2.1

W2.1

X1.3

W1.2

Black

X3.3

X2.3

W2.2

Technical Specifications

Issue 03 (2013-02-20)

Item

Description

Connector X3

Common connector - 4-pin - double rows/4.20 mm


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Item

Description

Connector X1/X2

Common terminal - female - 4-pin - 18/26 AWG - 13.7 mm in


length

Model of wire W1/W2

Symmetrical twisted-pair cable - 0 ohms - UL2464 - 0.64 mm 22 AWG - one pair - black

Number of cores

Fireproof class

CM

Color

Black

Length

1.8 m

23.2.5 RPC Power Cable


One end of the RPC power cable is connected to the power input interface of the case-shaped
Raman amplifier, and the other end is connected to the output interface of the DC power
distribution box at the top of the cabinet.

Structure
Figure 23-16 shows the structure of the RPC power cable.
Figure 23-16 Structure of the RPC power cable

Label 3

Main label

Label 1

Label 2

1. Bare crimping terminal 2. Common connector - 4- 3. Common terminal pin


female

A-A. Sectional view in


direction A

Pin Assignments
Table 23-10 provides the pin assignments of the RPC power cable.

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Table 23-10 Pin assignments of the RPC power cable


Connectors X1
and X2

Cables W1 and W2

Color

Connector X3

X1

W1

Blue

X3.1

X2

W1

Black

X3.3

Technical Specifications
Table 23-11 lists the technical specifications of the RPC power cable.
Table 23-11 Technical specifications of the RPC power cable
Item

Description

Connector X3

Common terminal - female - 18/26 AWG 13.7 mm in length, common connector - 4-pin
- double rows - 4.2 mm

Connector X1/X2

Bare crimping terminal - single cord end


terminal - 1 mm2 - 5 A - tin plated - insertion
depth of 6 mm - yellow

Model of wire W1/W2

Power cable - 600 V - UL1015 - 18 AWG black - OA

Number of cores

Fireproof class

VM-1

Color

Blue and black

Length

3.5 m

23.3 Alarm Cable


The alarm cables that the equipment uses include the cabinet indicator cable, alarm cascading
cable, and alarm input/output cable.

23.3.1 Cabinet Indicator Cable


The cabinet indicator cable is used to connect the AUX in the subrack to the cabinet indicators.
The cabinet indicator cable leads the indicator signal from the AUX to the cabinet indicators.

Structure
Figure 23-17 shows the structure of the cabinet indicator cable.
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Figure 23-17 Structure of the cabinet indicator cable

X2

X3
X1
X4

X5

A-A. Sectional view in direction A

B-B. Sectional view in direction B

Pin Assignments
Table 23-12 provides the pin assignments of the cabinet indicator cable.
Table 23-12 Pin assignments of the cabinet indicator cable
Connector
X1

Direction

Connector X2/X3/X4/X5

Relations
hip

Print on the
Label

X1.4

Out

X2.2

Green

X1.5

Out

X2.1

Twisted
pair

X1.1

Out

X3.2

Red

X1.2

Out

X3.1

Twisted
pair

X1.3

Out

X4.2

Orange

X1.6

Out

X4.1

Twisted
pair

X1.7

Out

X5.2

Yellow

X1.8

Out

X5.1

Twisted
pair

Technical Specifications

Issue 03 (2013-02-20)

Item

Description

Connector X1

Network interface connector - 8-pin - 8-bit - shielded RJ45 connector

Connector X2/X3/X4/X5

Common connector - 2-pin - single row/2.5 mm

Cable type

Symmetrical twisted-pair cable - 120 ohms - SEYPVPV


- 0.5 mm - 24 AWG - 8-core - PANTONE 430U

Number of cores

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Item

Description

Fireproof class

CM

Diameter of the core

0.5 mm

Length

2.5 m, 3 m, and 3.5 m

23.3.2 Indicator Cascading Cable Between Subracks or Alarm


Cascading Cable Between the OptiX OSN Equipment
The indicator cascading cable between subracks or the alarm cascading cable between the OptiX
OSN equipment cascades the indicator signals or alarm signals between the subracks of the
OptiX OSN equipment.
Both ends of the cable use the RJ45 connector. One end of the cable is connected to the LAMP1
or ALMO2 interface of the AUX in one subrack. The other end of the cable is connected to the
LAMP2 or ALMO1 interface of the AUX in another subrack.

Structure
Figure 23-18 shows the structure of the indicator cascading cable between subracks or the alarm
cascading cable between the OptiX OSN equipment.
Figure 23-18 Structure of the indicator cascading cable between subracks or the alarm cascading
cable between the OptiX OSN equipment

1. RJ-45 network interface connector

2. Label 1

A-A. Sectional view in direction A

Pin Assignments
Table 23-13 provides the pin assignments of the indicator cascading cable between subracks or
the alarm cascading cable between the OptiX OSN equipment.
Table 23-13 Pin assignments of the indicator cascading cable between subracks or the alarm
cascading cable between the OptiX OSN equipment

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Connect
or X1

Directio
n

Connect
or X2

Relationshi
p

Alarm Output

X1.1

Out

X2.1

Twisted pair

Critical alarm output and major


alarm output (+)

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Connect
or X1

Directio
n

Connect
or X2

X1.2

Out

X2.2

X1.3

Out

X2.3

X1.6

Out

X2.6

X1.4

Out

X2.4

X1.5

Out

X2.5

X1.7

Out

X2.7

X1.8

Out

X2.8

23 Cables

Relationshi
p

Alarm Output
Critical alarm signal output and
major alarm signal output (-)

Twisted pair

Minor alarm signal output and


warning alarm signal output (+)
Minor alarm signal output and
warning alarm signal output (-)

Twisted pair

Alarm signal output 1 (+)


Alarm signal output 1 (-)

Twisted pair

Alarm signal output 2 (+)


Alarm signal output 2 (-)

Technical Specifications
Item

Description

Connector X1/
X2

Network interface connector - 8-pin - 8-bit - shielded - RJ45 connector

Cable type

Symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.5 mm - 24


AWG - 8-core - PANTONE 430U

Number of cores

Fireproof class

CM

Diameter of the
core

0.5 mm

Length

3 m, 5 m, 10 m, and 20 m

23.3.3 Alarm Cascading Cable Between the OptiX OSN Equipment


and the Other Huawei Transmission Equipment
The alarm cascading cable cascades the alarm signals of the OptiX OSN equipment and the
alarm signals of the other Huawei transmission equipment such as the OptiX 2500+ and OptiX
OSN 9500.
Both ends of the cable use the RJ45 connector. One end of the cable is connected to the
ALMO1 or ALMO2 interface of the OptiX OSN subrack. The other end of the cable is connected
to the alarm output interface or the alarm cascading interface of the subrack of the other Huawei
transmission equipment.

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Structure
Figure 23-19 shows the structure of the alarm cascading cable between the OptiX OSN
equipment and the other Huawei transmission equipment.
Figure 23-19 Structure of the alarm cascading cable between the OptiX OSN equipment and
the other Huawei transmission equipment

1. RJ-45 network interface connector 2. Main label 3. Label 1 4. Cable connector - type D - 9-pin - female
L: 5 m, 10 m, and 20 m

Pin Assignments
Table 23-14 provides the pin assignments of the alarm cascading cable between the OptiX OSN
equipment and the other Huawei transmission equipment.
Table 23-14 Pin assignments of the alarm cascading cable between the OptiX OSN equipment
and the other Huawei transmission equipment
Connector
X1

Direction

Connector
X2

Relations
hip

Description

X1.1

Out

X2.7

Critical alarm signal output (+)

X1.2

Out

X2.3

Twisted
pair

X1.3

Out

X2.6

Major alarm signal output (+)

X1.6

Out

X2.1

Twisted
pair

Critical alarm signal output (-)

Major alarm signal output (-)

Technical Specifications

Issue 03 (2013-02-20)

Item

Description

Connector
X1

Network interface connector - 8-pin - 8-bit - shielded - RJ45 connector

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Item

Description

Connector
X2

Cable connector - type D - 9-pin - female

Cable type

Symmetrical twisted-pair cable - 100 ohms - SEYVP - 0.48 mm - 26 AWG


- 4-core - black

Number of
cores

Fireproof
class

CM

Diameter of
the core

0.5 mm

Length

5 m, 10 m, and 20 m

23.3.4 Alarm Input/Output Cable


The alarm input cable transmits the alarm signals of the external equipment to the OptiX OSN
equipment. The alarm output cable transmits the alarm signals of the OptiX OSN equipment to
the centralized alarm monitoring equipment.
The alarm input/output cable uses an RJ45 connector at one end to connect to the alarm input/
output interface of the equipment. The other end of the alarm input/output cable is connected to
the external equipment or the centralized alarm monitoring equipment. The connector needs to
be prepared on site as required. Each alarm input/output cable transmits four channels of alarm
signals.

Structure
Figure 23-20 shows the structure of the alarm input/output cable.
Figure 23-20 Structure of the alarm input/output cable

1. RJ-45 network interface connector

Issue 03 (2013-02-20)

2. Main label

A-A. Sectional view in direction A

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Pin Assignments
Table 23-15 provides the pin assignments of the alarm input/output cable.
Table 23-15 Pin assignments of the alarm input/output cable
Connector X1

Color

Relationship

Usage

X1.1

Blue

Twisted pair

Critical or major alarm input/


output (+)

X1.2

White

X1.3

Orange

X1.6

White

X1.4

Green

X1.5

White

X1.7

Brown

X1.8

White

Critical or major alarm input/


output (-)
Twisted pair

Minor or warning alarm input/


output (+)
Minor or warning alarm input/
output (-)

Twisted pair

Alarm signal input/output 1 (+)


Alarm signal input/output 1 (-)

Twisted pair

Alarm signal input/output 2 (+)


Alarm signal input/output 2 (-)

NOTE

X1.1 to X1.8 can be set to alarm signal input or alarm signal output as required.

Technical Specifications
Item

Description

Connector X1

Network interface connector - 8-pin - 8-bit - shielded - RJ45 connector

Cable type

Symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.5 mm - 24 AWG


- 8-core - PANTONE 430U

Number of
cores

Fireproof class

CM

Core diameter

0.5 mm

Length

10 m, 20 m, and 30 m

23.4 Management Cable


The management cables include the serial cable, ordinary phone line, COA cascading cable, and
network cable.
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23.4.1 OAM Serial Cable


The OAM serial cable is used for the management and remote maintenance of the OptiX OSN
equipment.
The OAM serial cable uses an RJ45 connector at one end to connect to the OAM interface of
the equipment and uses a DB25 connector at the other end to connect to a laptop computer, serial
NMS, or modem.

Structure
Figure 23-21 shows the structure of the OAM serial cable (using the DB25 connector).
Figure 23-21 Structure of the OAM serial cable

1. RJ-45 network
interface connector

2. Main label 3. Cable connector DB25 male

A-A. Sectional view in B-B. Sectional view in


direction A
direction B

Pin Assignments
Table 23-16 provides the pin assignments of the OAM serial cable.
Table 23-16 Pin assignments of the OAM serial cable

Issue 03 (2013-02-20)

Connecto
r X1

Direction

Connector X2

Relationshi
p

Description

X1.2

Out

X2.20

Single

Data terminal ready (DTR)

X1.3

Out

X2.2

Single

Transmitting data (TD)

X1.6

In

X2.3

Single

Receiving data (RD)

X1.4

X2.7

Twisted pair

Signaling ground (SG)

X1.5

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Technical Specifications
Item

Description

Connector X1

Network interface connector - RJ45 connector - 8-pin - 8-bit - shielded connector

Connector X2

Cable connector - type D - 25-pin - male, or cable connector - type D - 9pin - male

Type

Symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.5 mm - 24


AWG - 8-core - PANTONE 430U

Number of
cores

Fireproof class

CM

Length

5000 mm

23.4.2 Serial 1 to 4/F1/F&f Serial Cable


The serial 1-4/F1/F&f serial cable uses an RJ45 connector at one end to connect to the serial 1-4
interfaces, F1 serial port, or F&f serial port, and uses a DB9 connector at the other end to connect
to the external detecting equipment or external managed equipment.
The serial 1-4/F1/F&f serial cable performs the following functions:
l

Transparently transmits the environment monitoring data signal.

Manages external devices such as the COA.

Structure
Figure 23-22 shows the structure of the serial 1-4/F1/F&f serial cable.
Figure 23-22 Structure of the serial 1-4/F1/F&f serial cable

1. RJ-45 network
interface connector

Issue 03 (2013-02-20)

2. Main label 3. Cable connector DB9 male

A-A. Sectional view in B-B. Sectional view in


direction A
direction B

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Pin Assignments
Table 23-17 provides the pin assignments of the serial 1-4/F1/F&f serial cable.
Table 23-17 Pin assignments of the serial 1-4/F1/F&f serial cable
Connector
X1

Direction

Connector X2

Relationshi
p

Description

X1.1

Out

X2.8

Twisted pair

RS422TX+

X1.2

Out

X2.9

X1.3

In

X2.6

X1.6

In

X2.7

X1.4

In

X2.3

X1.8

Out

X2.2

X1.5

X2.5

RS422TXTwisted pair

RS422RX+
RS422RX-

Twisted pair

RS232RX
RS232TX

Single

SG

Technical Specifications
Item

Description

Connector X1

Network interface connector - RJ45 connector - 8-pin - 8-bit - shielded connector

Connector X2

Cable connector - type D - 9-pin - male

Cable type

(1) Symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.5 mm - 24


AWG - 8-core - PANTONE 430U (2) Symmetrical twisted-pair cable - 100
ohms - SEYVP - 0.48 mm - 26 AWG - 8-core - black

Number of
cores

Fireproof class

CM

Length

15 m in the case of cable type 1 and 3 m in the case of cable type 2

23.4.3 RS-232/RS-422 Serial Cable


The RS-232/RS-422 serial cable is used to transport the management signals between subnets.
Both ends of the RS-232/RS-422 serial cable use the RJ45 connector. One end of the RS-232/
RS-422 serial cable is connected to the RS-232/RS-422 serial port of the equipment. The other
end is connected to the RS-232/RS-422 serial port of another piece of equipment that needs to
make orderwire calls to the other equipment.

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Structure
Figure 23-23 shows the structure of the RS-232/RS4-22 serial cable.
Figure 23-23 Structure of the RS-232/RS-422 serial cable

1. RJ-45 network interface connector

2. Main label

A-A. Sectional view in direction A

Pin Assignments
Table 23-18 provides the pin assignments of the RS-232/RS-422 serial cable.
Table 23-18 Pin assignments of the RS-232/RS-422 serial cable
Connecto
r X1

Direction

Connector X2

Relationship

Description

X1.3

In

X2.1

Twisted pair

RX+

X1.6

In

X2.2

X1.1

Out

X2.3

X1.2

Out

X2.6

X1.5

Out

X2.5

X1.4

In

X2.8

X1.8

X2.4

RXTwisted pair

TX+
TX-

Twisted pair

232TX
232RX

Single

SG

Technical Specifications

Issue 03 (2013-02-20)

Item

Description

Connector X1/X2

Network interface connector - RJ45 connector - 8-pin - 8-bit - shielded


- connector

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Item

Description

Cable type

Symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.5 mm - 24


AWG - 8-core - PANTONE 430U

Number of cores

Fireproof class

CM

Length

15 m

23.4.4 Ordinary Telephone Line


The ordinary telephone line is used to connect the orderwire phone. Both ends of the ordinary
telephone line use the RJ45 connector. One end of the ordinary telephone line is connected to
the PHONE interface of the equipment, and the other end is connected to the interface of the
orderwire phone.

Structure
Figure 23-24 shows the structure of the ordinary telephone line.
Figure 23-24 Structure of the ordinary telephone line

1. RJ45 connector

2. Main label

Pin Assignments
Table 23-19 provides the pin assignments of the ordinary telephone line.
Table 23-19 Pin assignments of the ordinary telephone line

Issue 03 (2013-02-20)

Connector X1

Connector X2

Description

X1.1

X2.1

Not connected

X1.2

X2.2

Not connected

X1.3

X2.3

TIP

X1.4

X2.4

RING

X1.5

X2.5

Not connected

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Connector X1

Connector X2

Description

X1.6

X2.6

Not connected

Technical Specifications
Item

Description

Connector X1/X2

Network interface connector - 6-pin - 26 to 28 AWG

Cable type

Power cable - 150 V - UL20251 - 0.08 mm2 - 28 AWG - black - 1


A - 2-core telephone line

Number of cores

Fireproof class

CM

Length

15 m

23.4.5 COA Cascading Cable


When multiple COAs are installed in a cabinet, use COA cascading cables to cascade the COAs.
Both ends of the COA cascading cable use the DB9 connector. One end of the COA cascading
cable is connected to the RS232-1 serial port of one COA, and the other end is connected to the
RS232-2 serial port of another COA.

Structure
Figure 23-25 shows the structure of the COA cascading cable.
Figure 23-25 Structure of the COA cascading cable

1. Cable connector - DB9 male

2. Label

A-A. Sectional view in direction A

Pin Assignments
Table 23-20 provides the pin assignments of the COA cascading cable.
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Table 23-20 Pin assignments of the COA cascading cable


Connector X1

Connector X2

Remarks

One pair

Grounding

Technical Specifications
Item

Description

Connector X1/X2

Cable connector - type D - 9-pin - male

Cable type

Symmetrical twisted-pair cable - 100 ohms - UL2464 - 0.32 mm 28 AWG - 2P - Huawei gray

Number of cores

Two pairs

Fireproof class

CM

Length

0.6 m and 2.5 m

23.4.6 Straight-Through Cable


The straight-through cable is used to connect the OptiX OSN equipment to an NM computer.
Both ends of the straight-through cable use the RJ45 connector. One end of the straight-through
cable is connected to the ETH interface of the equipment, and the other end is connected to the
network interface of the NM computer.
NOTE

As the ETH interface of the OptiX OSN equipment supports the auto-sensing function, the ETH interface
can use a straight-through cable or a crossover cable.

Structure
Figure 23-26 shows the structure of the straight-through cable.

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23 Cables

Figure 23-26 Structure of the straight-through cable

1. RJ-45 network interface connector

2. Label 1

3. Main label

4. Label 2

Pin Assignments
Table 23-21 provides the pin assignments of the straight-through cable.
Table 23-21 Pin assignments of the straight-through cable
Connector X1

Connector X2

Color

Relationship

X1.1

X2.1

White/Orange

Twisted pair

X1.2

X2.2

Orange

X1.3

X2.3

White/Green

X1.6

X2.6

Green

X1.4

X2.4

Blue

X1.5

X2.5

White/Blue

X1.7

X2.7

White/Brown

X1.8

X2.8

Brown

Twisted pair

Twisted pair

Twisted pair

Technical Specifications

Issue 03 (2013-02-20)

Item

Description

Connector X1/X2

Network interface connector - RJ45 connector - 8-pin - 8-bit - shielded


- connector - 24 to 26 AWG - CAT 6/configured with the SFTP network
cable

Cable type

Communication cable - 10015 ohms - CAT5E SFTP 24 AWG - 8core - PANTONE 445U

Number of cores

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Item

Description

Fireproof class

CM

Length

5 m, 10 m, 20 m, and 30 m

23.4.7 Crossover Cable


The crossover cable is used to connect the OptiX OSN equipment, network management
computer, and Ethernet to achieve communication. Both ends of the crossover cable use the
RJ45 connector.

Structure
Figure 23-27 shows the structure of the crossover cable.
Figure 23-27 Structure of the crossover cable

1. RJ-45 network interface connector

2. Label 1

3. Main label

4. Network cable

5. Label 2

Pin Assignments
Table 23-22 provides the pin assignments of the crossover cable.
Table 23-22 Pin assignments of the crossover cable

Issue 03 (2013-02-20)

Connector X1

Connector X2

Color

Relationship

X1.6

X2.2

Orange

Twisted pair

X1.3

X2.1

White/Orange

X1.1

X2.3

White/Green

X1.2

X2.6

Green

X1.4

X2.4

Blue

X1.5

X2.5

White/Blue

X1.7

X2.7

White/Brown

X1.8

X2.8

Brown

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Twisted pair

Twisted pair

Twisted pair

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Technical Specifications
Item

Description

Connector X1/X2

Network interface connector - RJ45 connector - 8-pin - 8-bit - shielded


- connector - 24 to 26 AWG - CAT 6/configured with the SFTP
network cable

Cable type

Communication cable - 1005 ohms - CAT5E SFTP 24 AWG - 8core - PANTONE 646U

Number of cores

Fireproof class

CM

Length

5 m and 30 m

23.5 Signal Cable


The signal cables include the E1/E3 signal cable, framed E1 signal cable, and Nx64 kbit/s signal
cable.

23.5.1 75-ohm 8xE1 Cable


The 75-ohm 8xE1 cable is used to receive and transmit E1 signals.
The 75-ohm 8xE1 cable uses a DB44 connector at one end to connect to the D75S. The other
end of the 75-ohm 8xE1 cable is connected to the digital distribution frame (DDF). The connector
needs to be prepared on site as required. Each 75-ohm 8xE1 cable can transmit 8xE1 signals.

Structure
Figure 23-28 shows the structure of the 75-ohm 8xE1 cable.

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23 Cables

Figure 23-28 Structure of the 75-ohm 8xE1 cable


View A

Pos.1

Pos.44

MO55

Main label
W

1. Cable connector - type D - 44-pin - male

2. Main label

Pin Assignments
Table 23-23 provides the pin assignments of the 75-ohm 8xE1 cable.
Table 23-23 Pin assignments of the 75-ohm 8xE1 cable

Issue 03 (2013-02-20)

Connect
or

Cable W
Cor
e

No.

38

Rin
g

23

Tip

37

Rin
g

22

Tip

36

Rin
g

21

Tip

35

Rin
g

20

Tip

15

Rin
g

30

Tip

Rema
rks

Direct
ion

Connect
or

Cable W
Cor
e

No.

R1

In

34

Rin
g

In

19

Tip

In

33

Rin
g

In

18

Tip

In

32

Rin
g

In

17

Tip

In

31

Rin
g

In

16

Tip

Out

11

Rin
g

Out

26

Tip

R2

R3

R4

T1

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Rema
rks

Direct
ion

R5

In
In

11

R6

In
In

13

R7

In
In

15

R8

In
In

10

T5

Out
Out
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Hardware Description

Connect
or

Cable W

23 Cables

Rema
rks

Direct
ion

Connect
or

Cable W
Cor
e

No.

T2

Out

10

Rin
g

12

Out

25

Tip

Out

Rin
g

Out

24

Tip

Out

Rin
g

Rema
rks

Direct
ion

T6

Out

Cor
e

No.

14

Rin
g

29

Tip

13

Rin
g

28

Tip

12

Rin
g

27

Tip

Out

Tip

Out

Shell

External braid shield


layer/Without the
external braid shield
layer

Shell

External braid shield


layer/Without the
external braid shield
layer

T3

T4

Out
14

T7

Out
Out

16

T8

Out

Technical Specifications
The external layer of the 75-ohm E1 cable may be of the shielded type or unshielded type. The
specifications of the 75-ohm E1 cable with the shielded layer are different from the specifications
of the 75-ohm E1 cable with the unshielded layer. Table 23-24 lists the specifications of the 75ohm E1 cable with the external braid shield layer. Table 23-25 lists the specifications of the 75ohm E1 cable without the external braid shield layer.
Table 23-24 Specifications of the 75-ohm E1 cable with the external braid shield layer

Issue 03 (2013-02-20)

Item

Description

Connector X

Connector accessories- type D - 44-pin - male - cable welding type


- 3-row pins

Cable type

Coaxial cable - SYFVZP-LC 75-1-1x16 - 75 ohms - 13.10 mm - 1.2


mm - 0.254 mm - Pantone Warm Gray 1U

Fireproof class

Complies with IEC60332-3C.

Number of cores

16 cores, 8xE1

Diameter of the shield


layer - diameter of the
internal insulation
layer - diameter of the
internal conductor

13.10 mm - 1.2 mm - 0.254 mm

Length

3 m, 10 m, 15 m, 20 m, 25 m, 30 m, 35 m, 40 m, 45 m, and 50 m

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Table 23-25 Specifications of the 75-ohm E1 cable without the external braid shield layer
Item

Description

Connector X

Connector accessories- type D - 44-pin - male - cable welding type


- 3-row pins

Cable type

Coaxial cable - SYFVZP-LC 75-1-1x16 - 75 ohms - 12.40 mm - 1.2


mm - 0.254 mm - Pantone Warm Gray 1U

Fireproof class

Complies with IEC60332-3C.

Number of cores

16 cores, 8xE1

Diameter of the shield


layer - diameter of the
internal insulation
layer - diameter of the
internal conductor

12.40 mm - 1.2 mm - 0.254 mm

Length

5 m, 10 m, 15 m, 20 m, 25 m, 30 m, 35 m, 40 m, 45 m, and 50 m

CAUTION
The pin assignment table is delivered with the 75-ohm 8xE1 cable in a packing bag. You must
keep the table carefully.

23.5.2 120-ohm 8xE1 Cable


The 120-ohm 8xE1 cable is used to receive and transmit E1 signals.
The 120-ohm 8xE1 cable uses a DB44 connector at one end to connect to the 120-ohm E1
electrical interface board. The other end of the 120-ohm 8xE1 cable is connected to the DDF.
The connector needs to be prepared on site as required. Each 120-ohm 8xE1 cable can transmit
8xE1 signals.

Structure
Figure 23-29 shows the structure of the 120-ohm 8xE1 cable.

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23 Cables

Figure 23-29 Structure of the 120-ohm 8xE1 cable

1. Cable connector - type D - 44-pin - male

2. Label 1, marked with "W1 (TX1-8)"

3. Label 3, marked with "W2 (RX1-8)"

4. Main label

Pin Assignments
Table 23-26 provides the pin assignments of the 120-ohm 8xE1 cable.
Table 23-26 Pin assignments of the 120-ohm 8xE1 cable

Issue 03 (2013-02-20)

Connec
tor

Cable W1
Cor
e

No.

15

Blue

30

Whi
te

14

Ora
nge

29

Whi
te

13

Gree
n

28

Whi
te

12

Bro
wn

27

Whi
te

Rema
rks

Direc
tion

Connec
tor

Cable W2
Cor
e

No.

Twist
ed
pair

TX1

Out

38

Blue

Out

23

Whit
e

Twist
ed
pair

TX2

Out

37

Oran
ge

Out

22

Whit
e

Twist
ed
pair

TX3

Out

36

Gree
n

Out

21

Whit
e

Twist
ed
pair

TX4

Out

35

Bro
wn

Out

20

Whit
e

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Rema
rks

Direc
tion

Twisted
pair

RX1

In

Twisted
pair

RX2

In
In
In

Twisted
pair

RX3

In
In

Twisted
pair

RX4

In
In

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Connec
tor

Cable W1

23 Cables

Rema
rks

Direc
tion

Connec
tor

Cable W2
Cor
e

No.

Out

34

Gray

Twisted
pair

Out

19

Whit
e

Out

33

Blue

Out

18

Red

Out

32

Oran
ge

Out

17

Red

Out

31

Gree
n

Out

16

Red

In

Shell

External braided shield

Cor
e

No.

11

Gra
y

TX5

26

Whi
te

Twist
ed
pair

10

Blue

TX6

25

Red

Twist
ed
pair

Ora
nge

TX7

24

Red

Twist
ed
pair

Gree
n

TX8

Red

Twist
ed
pair

Shell

External braided shield

Rema
rks

Direc
tion

RX5

In
In

Twisted
pair

RX6

Twisted
pair

RX7

In
In
In
In

Twisted
pair

RX8

In

Technical Specifications
Item

Description

Connector X

Cable connector - type D - 44-pin - male

Cable type

Communication cable - 120 ohms - SEYPVPV - 0.5 mm - 24 AWG 16-core - PANTONE 430U

Number of cores

16

Diameter of the
internal conductor

0.5 mm

Fireproof class

CM

Length

10 m, 15 m, 20 m, 30 m, and 40 m

23.5.3 E3/T3/STM-1 Cable


The E3/T3/STM-1 cable is used to receive and transmit E3/T3/STM-1 electrical signals. The
E3/T3/STM-1 cable uses an SMB connector at one end to connect to the E3/T3/STM-1 electrical
access board. The other end of the E3/T3/STM-1 cable is connected to the DDF. The connector
needs to be chosen on site as required.

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Structure
Figure 23-30 shows the structure of the E3/T3/STM-1 cable.
Figure 23-30 Structure of the E3/T3/STM-1 cable

1. Coaxial connector - SMB

2. Main label

3. Coaxial cable

Pin Assignments
None.

Technical Specifications
Item

Description

Connector

Coaxial connector - SMB connector - 75 ohms - straight - female

Cable I

Coaxial cable - 75 ohms - 3.9 mm - 2.1 mm - 0.34 mm - shielded


Diameter of the shield layer - diameter of the internal insulation layer diameter of the internal conductor: 3.9 mm - 2.1 mm - 0.34 mm
Length: 10 m, 15 m, 20 m, and 30 m

Cable II

Coaxial cable - 75 ohms - 4.4 mm - 2.4 mm - 0.4 mm - shielded - gray


Diameter of the shield layer - diameter of the internal insulation layer diameter of the internal conductor: 4.4 mm - 2.4 mm - 0.4 mm
Length: 15 m, 20 m, 25 m, 30 m, and 40 m

Cable III

Coaxial cable - 75 ohms - 6.7 mm - 3.8 mm - 0.61 mm - shielded - gray


Diameter of the shield layer - diameter of the internal insulation layer diameter of the internal conductor: 6.7 mm - 3.8 mm - 0.61 mm
Length: 15 m, 20 m, 25 m, 30 m, and 130 m

Cable IV

Coaxial cable - 75 ohms - 5.80 mm - 3.71 mm - 0.643 mm - black


Diameter of the shield layer - diameter of the internal insulation layer diameter of the internal conductor: 5.80 mm - 3.71 mm - 0.643 mm
Length: 30 cm

Cable V
Issue 03 (2013-02-20)

Coaxial cable - 75 ohms - 3.9 mm - 2.1 mm - 0.34 mm - shielded


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Item

23 Cables

Description
Diameter of the shield layer - diameter of the internal insulation layer diameter of the internal conductor: 3.9 mm - 2.1 mm - 0.34 mm
Length: 10 m

Fireproof class

CM

23.5.4 Framed E1 Cable


The framed E1 cable is connected to the DB44 connector of the DM12 to transmit/receive eight
channels of framed E1 signals.
The framed E1 cables are available in two types, namely, 75-ohm framed E1 cable and 120-ohm
framed E1 cable.
l

For the structure, pin assignments, and technical specifications of the 75-ohm framed E1
cable, see the topic that describes the 75-ohm 8xE1 cable.

For the structure, pin assignments, and technical specifications of the 120-ohm framed E1
cable, see the topic that describes the 120-ohm 8xE1 cable.

23.5.5 Nx64 kbit/s Cable


The Nx64 kbit/s cable is connected to the DB28 connector of the DM12 to transmit/receive one
channel of Nx64 kbit/s signals.
Table 23-27 provides the pin assignments of the DB28 connector.
Table 23-27 Pin assignments of the DB28 connector of the DM12

Issue 03 (2013-02-20)

Pin

Signal

Direction

Description

TXD+

--->

Transmits data.

TXD-

--->

Transmits data.

TXC+

<-->

Transmits the clock signal provided by the


DCE to the DTE.

TXC-

<-->

Transmits the clock signal provided by the


DCE to the DTE.

NC

GND

-----

Circuit_GND

MODE0

<---

Receives the signal that identifies the type of


cable.

MODE1

<---

Receives the signal that identifies the type of


cable.

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23 Cables

Pin

Signal

Direction

Description

MODE2

<---

Receives the signal that identifies the type of


cable.

10

MODE_DC
E

<---

Receives the signal that identifies the type of


DCE/DTE cable.

11

DCD+

<-->

Detects the carrier.

12

DCD-

<-->

Detects the carrier.

13

RTS+

--->

Requests for transmission.

14

RTS-

--->

Requests for transmission.

15

TXCE+

--->

Transmits the data clock in the case of the


DCE and loops back the clock in the case of
the DTE.

16

TXCE-

--->

Transmits the data clock in the case of the


DCE and loops back the clock in the case of
the DTE.

17

RXC+

<---

Receives clock signals.

18

RXC-

<---

Receives clock signals.

19

RXD+

<---

Receives data.

20

RXD-

<---

Receives data.

21

GND

-----

Shield_GND

22

LL

<-->

Receives the loopback control signal.

23

CTS+

<---

Permits the transmission.

24

CTS-

<---

Permits the transmission.

25

DSR+

<---

Receives the DCE ready signal.

26

DSR-

<---

Receives the DCE ready signal.

27

DTR+

--->

Transmits the DTE ready signal.

28

DTR-

--->

Transmits the DTE ready signal.

The Nx64 kbit/s cables are classified into the following categories according to the protocol,
which the Nx64 kbit/s signals comply with:
l

V.35 DCE cable

V.35 DTE cable

V.24 DCE cable

V.24 DTE cable

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X.21 DCE cable

X.21 DTE cable

RS-449 DCE cable

RS-449 DTE cable

RS-530 DCE cable

RS-530 DTE cable

23 Cables

V.35 DCE Cable


Figure 23-31 shows the structure of the V.35 DCE cable.
Figure 23-31 Structure of the V.35 DCE cable
A-A

B-B

Pos.28
W

Pos.1
C
H

X1

X2

M
S
W
AA
EE
KK

A
E
K
P
U
Y
CC
HH
MM

1. Cable connector - D28 - male

2. Main label

3. Cable connector - D34 - female + D34 plastic shell

D
J
N
T
X
BB
FF
LL

B
F
L
R
V
Z
DD
JJ
NN

Table 23-28 provides the pin assignments of the V.35 DCE cable.
Table 23-28 Pin assignments of the V.35 DCE cable

Issue 03 (2013-02-20)

Connector X1

Connector X2

Relationship

19

Twisted pair

20

15

16

AA

17

U
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Twisted pair

Twisted pair

Twisted pair

Twisted pair
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23 Cables

Connector X1

Connector X2

Relationship

18

11

22

23

13

25

27

21

6+7+8

Pins 6, 7, and 8 are shortcircuited.

The technical specifications of the V.35 DCE cable are as follows.


Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight male - cable welding type - spacing 0.80 mm - matching with 28 to 30
AWG, exclusively used by the OEM

Connector X2

Cable connector - V35 plug - 34-pin - molding shell - kit, exclusively


used by the OEM
Cable connector - V35 DCE plug - 34-pin - female - cable crimping
type - housing core, exclusively used by the OEM

Cable type

Symmetrical twisted-pair cable - 100 ohms - 0.38 mm - 28 AWG - 5


pairs - 8 cores - PANTONE 296U - exclusively used by the OEM

Number of cores

Five pairs and eight cores

Diameter of the
core

0.32 mm

Length

3m

V.35 DTE Cable


Figure 23-32 shows the structure of the V.35 DTE cable.

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23 Cables

Figure 23-32 Structure of the V.35 DTE cable


A-A

B-B

Pos.28

Pos.1

X1

X2

1. Cable connector - D28 - male 2. Main label


4. Ordinary terminal

A
B
C
D
E
F
H
J
L N K M
R T P S
V X U W
Z BB Y AA
DD FF CC EE
JJ LL HH KK
NN MM

3. Cable connector - D34 - plastic shell

5. Cable connector - D34 - male

Table 23-29 provides the pin assignments of the V.35 DTE cable.
Table 23-29 Pin assignments of the V.35 DTE cable

Issue 03 (2013-02-20)

Connector X1

Connector X2

Relationship

Twisted pair

19

20

17

18

AA

15

16

11

22

13

23

27

25

21

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Twisted pair

Twisted pair

Twisted pair

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23 Cables

Connector X1

Connector X2

Relationship

6 + 10 + 7 + 8

Pins 6, 7, 8, and 10 are shortcircuited.

The technical specifications of the V.35 DTE cable are as follows.


Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight - male


- cable welding type - spacing 0.80 mm - matching with 28 to 30 AWG,
exclusively used by the OEM

Connector X2

Cable connector - V35 plug - 34-pin - molding shell - kit, exclusively used
by the OEM
Cable connector - V35 DTE plug - 34-pin - female - cable crimping type housing core, exclusively used by the OEM

Cable type

Symmetrical twisted-pair cable - 100 ohms - 0.38 mm - 28 AWG - 5 pairs


- 8 cores - PANTONE 296U - exclusively used by the OEM

Number of
cores

Five pairs and eight cores

Diameter of
the core

0.32 mm

Length

3m

V.24 DCE Cable


Figure 23-33 shows the structure of the V.24 DCE cable.
Figure 23-33 Structure of the V.24 DCE cable
A-A

B-B

Pos.25
Pos.1

Pos.28
Pos.1

X1

X2

1. Cable connector - D25 - female

2. Main label

3. Cable connector - D28 - male

Table 23-30 provides the pin assignments of the V.24 DCE cable.
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23 Cables

Table 23-30 Pin assignments of the V.24 DCE cable


Connector X1

Connector X2

Relationship

19

Twisted pair

23

13

25

20

27

11

22

18

15

17

24

15

17

21

Single

6+7

Pins 6 and 7 are shortcircuited.

Twisted pair

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the V.24 DCE cable are as follows.


Table 23-31 Technical specifications of the V.24 DCE cable

Issue 03 (2013-02-20)

Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight - male


- cable welding type - spacing 0.80 mm - matching with 28 to 30 AWG,
exclusively used by the OEM

Connector X2

Cable connector - type D - 25-pin - female - cable welding type

Cable type

Symmetrical twisted-pair cable - 100 ohms - 0.38 mm - 28 AWG - 5 pairs


- 8 cores - PANTONE 296U - exclusively used by the OEM

Number of
cores

Five pairs and eight cores

Diameter of the
core

0.32 mm

Length

3m

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23 Cables

V.24 DTE Cable


Figure 23-34 shows the structure of the V.24 DTE cable.
Figure 23-34 Structure of the V.24 DTE cable
A-A

B-B
1

Pos.1
Pos.1

Pos.28
Pos.25

X1

X2

1. Cable connector - D25 - male

2. Main label

3. Cable connector - D28 - male

Table 23-32 provides the pin assignments of the V.24 DTE cable.
Table 23-32 Pin assignments of the V.24 DTE cable
Connector X1

Connector X2

Relationship

Twisted pair

19

13

23

27

20

25

11

22

18

15

15

24

17

17

21

Single

6 + 10 + 7

Pins 6, 10, and 7 are shortcircuited.

Twisted pair

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the V.24 DTE cable are as follows.


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23 Cables

Table 23-33 Technical specifications of the V.24 DTE cable


Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight - male


- cable welding type - spacing 0.80 mm - matching with 28 to 30 AWG,
exclusively used by the OEM

Connector X2

Cable connector - type D - 25-pin - male - cable welding type

Cable type

Symmetrical twisted-pair cable - 100 ohms - 0.38 mm - 28 AWG - 5 pairs


- 8 cores - PANTONE 296U - exclusively used by the OEM

Number of
cores

Five pairs and eight cores

Diameter of the
core

0.32 mm

Length

3m

X.21 DCE Cable


Figure 23-35 shows the structure of the X.21 DCE cable.
Figure 23-35 Structure of the X.21 DCE cable
A-A

B-B
2

Pos.15

Pos.1

Pos.28

Pos.1

X1

X2

1. Cable connector - D15 - female

2. Main label

3. Cable connector - D28 - male

Table 23-34 provides the pin assignments of the X.21 DCE cable.
Table 23-34 Pin assignments of the X.21 DCE cable

Issue 03 (2013-02-20)

Connector X1

Connector X2

Relationship

13

Twisted pair

14

12

23

24

10
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23 Cables

Connector X1

Connector X2

Relationship

19

Twisted pair

20

11

15

16

13

21

6+9

Pins 6 and 9 are shortcircuited.

Twisted pair

Twisted pair

The technical specifications of the X.21 DCE cable are as follows.


Table 23-35 Technical specifications of the X.21 DCE cable
Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight - male


- cable welding type - spacing 0.80 mm - matching with 28 to 30 AWG,
exclusively used by the OEM

Connector X2

Cable connector - type D - 15-pin - female - cable welding type

Cable type

Symmetrical twisted-pair cable - 100 ohms - 0.38 mm - 28 AWG - 5 pairs


- 8 cores - PANTONE 296U - exclusively used by the OEM

Number of
cores

Five pairs and eight cores

Diameter of
the core

0.32 mm

Length

3m

X.21 DTE Cable


Figure 23-36 shows the structure of the X.21 DTE cable.

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Figure 23-36 Structure of the X.21 DTE cable


A-A

B-B
2

Pos.1

Pos.1

Pos.28

Pos.15

X2

X1

1. Cable connector - D15 - male

2. Main label

3. Cable connector - D28 - male

Table 23-36 provides the pin assignments of the X.21 DTE cable.
Table 23-36 Pin assignments of the X.21 DTE cable
Connector X1

Connector X2

Relationship

13

Twisted pair

14

10

23

24

12

19

20

11

15

16

13

17

18

13

21

6 + 10 + 9

Pins 6, 10, and 9 are shortcircuited.

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the X.21 DTE cable are as follows.

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Table 23-37 Technical specifications of the X.12 DTE cable


Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight - male


- cable welding type - spacing 0.80 mm - matching with 28 to 30 AWG,
exclusively used by the OEM

Connector X2

Cable connector - type D - 15-pin - male - cable welding type

Cable type

Symmetrical twisted-pair cable - 100 ohms - 0.38 mm - 28 AWG - 5 pairs


- 8 cores - PANTONE 296U - exclusively used by the OEM

Number of
cores

Five pairs and eight cores

Diameter of the
core

0.32 mm

Length

3m

RS-449 DCE Cable


Figure 23-37 shows the structure of the RS-449 DCE cable.
Figure 23-37 Structure of the RS-449 DCE cable
A-A

B-B
2

Pos.1

Pos.1

Pos.28

Pos.15

X2

X1

1. Cable connector - D28 - male

2. Main label

3. Cable connector - D37 - female - I

Table 23-38 provides the pin assignments of the RS-449 DCE cable.
Table 23-38 Pin assignments of the RS-449 DCE cable

Issue 03 (2013-02-20)

Connector X1

Connector X2

Relationship

27

11

Twisted pair

28

29

25

12

26

30
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Connector X1

Connector X2

Relationship

13

Twisted pair

14

27

23

24

25

11

13

12

31

19

20

22

24

15

16

26

17

17

18

35

23

22

10

21

6+8

19

Pins 6 and 8 are shortcircuited.

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the RS-449 DCE cable are as follows.


Table 23-39 Technical specifications of the RS-449 DCE cable

Issue 03 (2013-02-20)

Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight male - cable welding type - spacing 0.80 mm - matching with 28 to 30
AWG, exclusively used by the OEM

Connector X2

Cable connector - type D - 37-pin - female - cable welding type,


exclusively used by the OEM

Cable type

Symmetrical twisted-pair cable - 100 ohms - communication cable 0.32 mm - 28 AWG - 26-core - PANTONE 296U - exclusively used
by the OEM
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Item

Description

Number of cores

26

Diameter of the
core

0.32 mm

Length

3m

23 Cables

RS-449 DTE Cable


Figure 23-38 shows the structure of the RS-449 DTE cable.
Figure 23-38 Structure of the RS-449 DTE cable
A-A

B-B
1

3
Pos.37

Pos.28

Pos.1

X1
X2

1. Cable connector - D28 - male

2. Main label

Pos.1

3. Cable connector - D37 - male - I

Table 23-40 provides the pin assignments of the RS-449 DTE cable.
Table 23-40 Pin assignments of the RS-449 DTE cable

Issue 03 (2013-02-20)

Connector X1

Connector X2

Relationship

27

12

Twisted pair

28

30

25

11

26

29

13

14

25

23

24

27

11

13

12

31
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Twisted pair

Twisted pair

Twisted pair

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23 Cables

Connector X1

Connector X2

Relationship

19

Twisted pair

20

24

22

15

17

16

35

17

18

26

23

22

10

21

6 + 8 + 10

19

Pins 6, 8, and 10 are shortcircuited.

Twisted pair

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the RS-449 DTE cable are as follows.


Table 23-41 Technical specifications of the RS-449 DTE cable
Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight - male


- cable welding type - spacing 0.80 mm - matching with 28 to 30 AWG,
exclusively used by the OEM

Connector X2

Cable connector - type D - SUB plug - 37-pin - straight - male - cable welding
type - two rows, standard installation holes, exclusively used by the OEM

Cable type

Symmetrical twisted-pair cable - 100 ohms - communication cable - 0.32


mm - 28 AWG - 26-core - PANTONE 296U - exclusively used by the OEM

Number of
cores

26

Diameter of
the core

0.32 mm

RS-530 DCE Cable


Figure 23-39 shows the structure of the RS-530 DCE cable.
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Figure 23-39 Structure of the RS-530 DCE cable


A-A
Pos.25

B-B
3

Pos.1

X1
Pos.1

Pos.28

X2

1. Cable connector - D25 - female

2. Main label

3. Cable connector - D28 - male

Table 23-42 provides the pin assignments of the RS-530 DCE cable.
Table 23-42 Pin assignments of the RS-530 DCE cable

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Connector X1

Connector X2

Relationship

28

22

Twisted pair

27

26

23

25

20

24

19

23

22

18

Single

21

Single

20

14

Twisted pair

19

18

11

17

24

16

15

17

14

13

13

12

10

11

12
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Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair
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23 Cables

Connector X1

Connector X2

15

16

6+7+9

Relationship

Twisted pair

Pins 6, 7, and 9 are shortcircuited.

The technical specifications of the RS-530 DCE cable are as follows.


Table 23-43 Technical specifications of the RS-530 DCE cable
Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight - male


- cable welding type - spacing 0.80 mm - matching with 28 to 30 AWG,
exclusively used by the OEM

Connector X2

Cable connector - type D - 25-pin - female - cable welding type

Cable type

Symmetrical twisted-pair cable - 100 ohms - communication cable - 0.32


mm - 28 AWG - 26-core - PANTONE 296U - exclusively used by the
OEM

Number of
cores

26

Diameter of the
core

0.32 mm

Length

3m

RS-530 DTE Cable


Figure 23-40 shows the structure of the RS-530 DTE cable.
Figure 23-40 Structure of the RS-530 DTE cable
B-B

A-A
1

Pos.1
Pos.1

X1
Pos.25

X2

1. Cable connector - D25 - male

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Pos.28

2. Main label

3. Cable connector - D28 - male

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Table 23-44 provides the pin assignments of the RS-530 DTE cable.
Table 23-44 Pin assignments of the RS-530 DTE cable
Connector X1

Connector X2

Relationship

27

20

Twisted pair

28

23

25

26

22

13

14

19

23

24

13

11

12

10

19

20

16

14

15

24

16

11

17

17

18

15

12

22

18

21

6 + 7 + 9 + 10

Pins 6, 7, 9, and 10 are shortcircuited.

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the RS-530 DTE cable are as follows.

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Table 23-45 Technical specifications of the RS-530 DTE cable


Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight - male


- cable welding type - spacing 0.80 mm - matching with 28 to 30 AWG,
exclusively used by the OEM

Connector X2

Cable connector - type D - 25-pin - male - cable welding type

Cable type

Symmetrical twisted-pair cable - 100 ohms - communication cable - 0.32


mm - 28 AWG - 26-core - PANTONE 296U - exclusively used by the OEM

Number of
cores

26

Diameter of the
core

0.32 mm

Length

3m

23.6 Clock Cable


The clock cables include the 75-ohm/120-ohm clock cable and clock transit cable.

23.6.1 75-ohm/120-ohm Clock Cable


The clock cables are available in two types, namely, 75-ohm clock cable and 120-ohm clock
cable. The clock cable is used to receive and transmit external clock signals. In the case of the
75-ohm clock cable, the cable uses an SMB connector at one end to connect to the external clock
interface of the OptiX OSN equipment. The other end of the cable is connected to the external
clock equipment. The connector needs to be prepared on site as required. In the case of the 120ohm clock cable, the cable uses an RJ45 connector at one end to connect to the external clock
interface of the OptiX OSN equipment. The other end of the cable is connected to the external
clock equipment. The connector needs to be prepared on site as required.

Structure
Figure 23-41 shows the structure of the 75-ohm clock cable. Figure 23-42 shows the structure
of the 120-ohm clock cable.
Figure 23-41 Structure of the 75-ohm clock cable

1. Coaxial connector - SMB

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Figure 23-42 Structure of the 120-ohm clock cable

1. Label 1 (R) and label 2 (T) 2. Communication cable 3. Main label 4. Network interface connector - RJ-45

Pin Assignments
Table 23-46 provides the pin assignments of the 120-ohm clock cable.
Table 23-46 Pin assignments of the 120-ohm clock cable
X1

Remarks

X1.1

Blue

W1

X1.2

White

X1.4

Orange

X1.5

White

W2

Table 23-47 Pin assignments of the 120-ohm clock cable


X1

Relationship

Description
External Clock Mode

External Time Mode


(1 PPS + Time
Information)

X1.1

Twisted pair

X1.2
X1.3

Twisted pair

X1.6
X1.4

Twisted pair

X1.5
X1.7
X1.8

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Twisted pair

CLK receive end (-)

Not defined

CLK receive end (+)

Not defined

Not defined

1 PPS signal (-)

Not defined

1 PPS signal (+)

CLK transmit end (-)

Grounding end

CLK transmit end (+)

Grounding end

Not defined

Time information (-)

Not defined

Time information (+)

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Technical Specifications
Item

Description

75-ohm
clock cable

Connector: coaxial connector - SMB - 75 ohms - straight - female


Cable type: coaxial cable - 75 ohms - 3.9 mm - 2.1 mm - 0.34 mm - shielded
Diameter of the shield layer - diameter of the internal insulation layer - diameter
of the internal conductor: 3.9 mm - 2.1 mm - 0.34 mm
Length: 10 m, 15 m, 20 m, and 30 m

120-ohm
clock cable

Connector X: network interface connector - 8-pin - 8-bit - shielded - crystal


model connector
Cable type: symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.4 mm
- 26 AWG - 2 pairs - PANTONE 430U
Diameter of the internal conductor: 0.4 mm/26 AWG
Length: 5 m, 10 m, 20 m, 30 m, 40 m, 50 m, 70 m, and 100 m

23.6.2 One-Channel Clock Transit Cable and Two-Channel Clock


Transit Cable
The clock transit cables are available in two types, namely, one-channel 75-ohm-to-120-ohm
clock transit cable and two-channel 75-ohm-to-120-ohm clock transit cable.

Structure
Figure 23-43 shows the structure of the one-channel 75-ohm-to-120-ohm clock transit cable.
Figure 23-44 shows the structure of the two-channel 75-ohm-to-120-ohm clock transit cable.
Figure 23-43 Structure of the one-channel 75-ohm-to-120-ohm clock transit cable

1. Coaxial connector - SMB - 75 ohms - straight/plug female

Issue 03 (2013-02-20)

2. Main label 3. 75-ohm-to-120-ohm transit PCB

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Figure 23-44 Structure of the two-channel 75-ohm-to-120-ohm clock transit cable

1. Coaxial connector - SMB - 75 ohms - straight/plug - female 2. Label 1: "1#" 3. Label 2: "2#" 4. Main label
5. 75-ohm-to-120-ohm transit PCB

6. Label 3: "1#" 7. Label 4: "2#"

Pin Assignments
Table 23-48 provides the pin assignments of the two-channel 75-ohm-to-120-ohm clock transit
cable.
Table 23-48 Pin assignments of the two-channel 75-ohm-to-120-ohm clock transit cable
Connector

75-ohm Cable

Color

120-ohm Cable

X1

Core

Blue

W3

Shield layer

White

Core

Blue

Shield layer

White

X2

W4

Technical Specifications
Item

Description

One
channel

Connector: coaxial connector - SMB - 75 ohms - straight - female


75-ohm cable: coaxial cable - 75 ohms - 3.9 mm - 2.1 mm - 0.34 mm - shielded
75-ohm cable: diameter of the shield layer (3.9 mm) - diameter of the internal
insulation layer (2.1 mm) - diameter of the internal conductor (0.34 mm)
120-ohm cable: symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.4
mm - 26 AWG - 2 pairs - PANTONE 430U
Diameter of the internal conductor of the 120-ohm cable: 0.4 mm/26 AWG
Length: 30 m

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Item

Description

Two
channels

Connector X1/X2: coaxial connector - SMB - 75 ohms - straight - female


75-ohm cable: coaxial cable - 75 ohms - 3.9 mm - 2.1 mm - 0.34 mm - shielded
75-ohm cable: diameter of the shield layer (3.9 mm) - diameter of the internal
insulation layer (2.1 mm) - diameter of the internal conductor (0.34 mm)
120-ohm cable: symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.4
mm - 26 AWG - 2 pairs - PANTONE 430U
Diameter of the internal conductor of the 120-ohm cable: 0.4 mm/26 AWG
Length: 30 m

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24 Indicators

24

Indicators

About This Chapter


This topic describes the indicators on the OptiX OSN equipment and the indicators on the boards
of the OptiX OSN equipment.
24.1 Indicators on the Cabinet
This topic describes the indicators on the cabinet of the OptiX OSN equipment.
24.2 Alarm Indicators on the Boards
This topic describes the alarm indicators on the boards.

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24 Indicators

24.1 Indicators on the Cabinet


This topic describes the indicators on the cabinet of the OptiX OSN equipment.
Indicator

Description

Power indicator Power (green)

On: Power is supplied to the equipment.


Off: Power is not supplied to the equipment.

Critical alarm indicator Critical (red)

On: A critical alarm occurs on the equipment.


Off: No critical alarm occurs on the equipment.

Major alarm indicator Major (orange)

On: A major alarm occurs on the equipment.


Off: No major alarm occurs on the equipment.

Minor alarm indicator Minor


(yellow)

On: A minor alarm occurs on the equipment.


Off: No minor alarm occurs on the equipment.

24.2 Alarm Indicators on the Boards


This topic describes the alarm indicators on the boards.

Board Hardware Status Indicator (STAT)


Status

Meaning

On (green)

The board operates properly.

On (red)

The hardware of the board is faulty or does not match


the equipment.

Off

The board is not powered on or does not start to work.

NOTE

STAT indicators are designed for non-service alarms such as alarms related to power, temperature,
abnormal communication, or absent optical modules.

Service Activation Status Indicator/Board Status (Active/Standby) Indicator (ACT)

Issue 03 (2013-02-20)

Status

Meaning of the Service


Activation Status Indicator

Meaning of the Board Status


(Active/Standby) Indicator

On (green)

The services are activated. The


board is in the working state.

The board works as the working


board.

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24 Indicators

Status

Meaning of the Service


Activation Status Indicator

Meaning of the Board Status


(Active/Standby) Indicator

Off

The services are not activated.

The board works as the


protection board.

Board Software Status Indicator (PROG)


Status

Meaning

On (green)

The board software or FPGA in the flash is


successfully loaded and stored, or the board software
is successfully initiated.

On for 100 ms and off for 100 ms


repeatedly (green)

The board software is being loaded to the flash or the


FPGA software is being loaded to the FPGA.

On for 300 ms and off for 300 ms


repeatedly (green)

l The board software is being initialized and is in


the BIOS boot state.
l The board is in the BIOS state because the board
is reset for three times in five minutes.
l The board software or FPGA in the flash is lost.

On (red)

l The board software fails to be loaded.


l The board software fails to be initialized.
l No power is accessed.

Off

l The high-power-consumption board enters the


low-power-consumption mode.

Service Alarm Indicator (SRV)


Type of Board

Status

Meaning

Service board

On (green)

The services are normal and no


service alarm is generated.

On (red)

A critical or major alarm occurs in


the services.

On (yellow)

A minor or remote alarm occurs in


the services.

Off

The services are not configured and


no alarm is generated, or no power is
supplied to the board.

On (green)

The services are normal and no


service alarm is generated.

Cross-connect and timing


board

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Type of Board

System control board

24 Indicators

Status

Meaning

On (red)

A critical alarm occurs.

On (yellow)

A minor alarm occurs.

Off

The services are not configured and


no alarm is generated, or no power is
supplied to the board.

On (green)

The services are normal and no


service alarm is generated.

On (red)

A critical or major alarm occurs in


the subrack.

On (yellow)

A minor or remote alarm occurs in


the subrack.

Off

The services are not configured and


no alarm is generated, or no power is
supplied to the board.

Synchronization Clock Status Indicator (SYNC)


Status

Meaning

On (green)

l The clock works in free-run mode and the system


clock priority list is not set. By default, the system
clock priority list contains only internal sources.
l The clock works in locked mode and is tracing a
clock source other than the internal sources in the
priority list.
The system clock priority list is set. All the clock
sources, however, are lost except for the internal
clock sources. The clock works in holdover mode or
free-run mode.

On (red)

Alarm Mute Indicator (ALMC)

Issue 03 (2013-02-20)

Status

Meaning

On (yellow)

The board is in the alarm mute state.

Off

When an alarm is generated, the equipment emits an alarm


sound.

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24 Indicators

Power Monitoring Indicators


Indicator

Status

Meaning

48 V power supply indicator of


channel A (PWRA)

On (green)

The 48 V power supply of channel


A is normal.

On (red)

The 48 V power supply of channel


A is faulty (lost or failed).

On (green)

The 48 V power supply of channel B


is normal.

On (red)

The 48 V power supply of channel B


is faulty (lost or failed).

On (green)

The +3.3 V backup power supply of


the system is normal.

On (red)

The +3.3 V backup power supply of


the system is lost.

48 V power supply indicator of


channel B (PWRB)

+3.3 V backup power supply


indicator of the system (PWRC)

Ethernet Indicators
Indicator

Status

Meaning

Connection status indicator


LINK (green)

On

The fiber cable is successfully


connected to the equipment.

Off

The fiber cable is not connected to the


equipment.

Flashing

The Ethernet interface is receiving or


transmitting data.

Off

The Ethernet interface is not receiving


or transmitting data.

Data receiving and


transmission indicator ACT
(orange)

FAN Running Status Indicator (STATE)

Issue 03 (2013-02-20)

Status

Meaning

On (green)

The fan operates properly.

On (red)

The fan, fan power supply board, or fan control board


is abnormal.

On (yellow)

The fan stops when the temperature is very low.

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24 Indicators

Indicators on the Front Panel of the COA


Indicator

Status

Meaning

Running indicator
RUN (green)

Flashing once every two


seconds (green)

The COA operates properly.

Flashing once every four


seconds (green)

The COA is in database protection mode.


The communication between the COA
and the SCC is interrupted.

Flashing five times every


second (green)

The program is being started or loaded.

On (red)

Errors occur during the memory selfcheck.

Flashing thrice every other


second (red)

A critical alarm occurs.

Flashing twice every other


second (red)

A major alarm occurs.

Flashing once every other


second (red)

A minor alarm occurs.

Alarm indicator
ALM

Power Indicator (POWER)


Status

Meaning

On (green)

The input of the power supply is normal.

Off

No power is supplied or the power supply fails.

Indicators on the UPM


Module

Indicator

Status

Meaning

Rectifier
module

RUN (green)

On

The rectifier module operates properly.

Off

The rectifier module is faulty or is disabled.

Off

The rectifier module operates properly.

On

An alarm and revertive protection occur on


the module.

Flashing

The communication is interrupted.

On

The rectifier module is faulty.

ALM
(yellow)

FAULT
(red)

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24 Indicators

Module

Indicator

Status

Meaning

Monitoring
module

RUN

Flashing
(green)

Flashing slowly (on for 1s and off for 1s


repeatedly): The entire power system is
normal.
Flashing quickly (on for 125 ms and off for
125 ms repeatedly): The power system is not
registered or the communication is
interrupted.

ALM

On (red)

The entire power system is faulty. In normal


situations, the indicator is off.

Indicators on the Microwave Boards


Indicator

Status

Meaning

Connection status indicator 1


(LINK1) two colors (red and
green)

On (green)

The link at the microwave layer is


normal.

On (red)

The link at the microwave layer is


faulty.

Connection status indicator 2


(LINK2) two colors (red and
green)

On (green)

The link at the microwave layer is


normal.

On (red)

The link at the microwave layer is


faulty.

Active/Standby state
indicator (ACT1) one color
(green)

On (green)

The board is in the active state when


the board is in the 1+1 protection
system.
The board is activated when the board
is not protected.

Off

The board is in the standby state when


the board is in the 1+1 protection
system.
The board is not activated when the
board is not protected.

On (green)

The board is in the active state when


the board is in the 1+1 protection
system.
The board is activated when the board
is not protected.

Off

The board is in the standby state when


the board is in the 1+1 protection
system.
The board is not activated when the
board is not protected.

Active/Standby state
indicator (ACT2) one color
(green)

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Issue 03 (2013-02-20)

24 Indicators

Indicator

Status

Meaning

Working indicator of ODU 1


(ODU1) two colors (red and
green)

On (green)

ODU 1 operates properly.

On (red)

ODU 1 is faulty.

Working indicator of ODU 2


(ODU2) two colors (red and
green)

On (green)

ODU 2 operates properly.

On (red)

ODU 2 is faulty.

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25 Labels

25

Labels

About This Chapter


This topic describes the safety labels and engineering labels on the OptiX OSN equipment.
25.1 Safety Labels
Various safety labels are attached to the equipment. This topic provides the indications and
positions of the safety labels.
25.2 Engineering Labels
The engineering labels should be prepared according to the local engineering specifications or
Huawei engineering specifications.

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25 Labels

25.1 Safety Labels


Various safety labels are attached to the equipment. This topic provides the indications and
positions of the safety labels.

25.1.1 Label Description


Labels, such as the ESD protection label, grounding label, and fan warning label are attached to
the subrack.
Table 25-1 Labels on the equipment
Label

! ATTENTION
CLEAN PERIODICALLY

Label Name

Indication

ESD protection
label

The equipment is
sensitive to static
electricity.

Laser safety class


label

The power class of the


laser source

Grounding label

The grounding
position

Periodic cleaning
label

The air filter should be


cleaned periodically.

Fan warning label

The fan blades should


not be touched when
the fan is rotating.

APD warning label

The overload point of


the indicator is 9
dBm.

RoHS label

The equipment may


contain some of the
poisonous substances
specified by the
regulations in China,
but can be safely used
within a period of 50
years. The equipment
should be recycled or
reused after 50 years.

DON'T TOUCH THE


FANLEAVESBEFORE
THEYSLOW DOWN !

APD

Receiver
MAX:-9dBm

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Label

25 Labels

Label Name

Indication

Product nameplate
label

The product name and


certification

Certificate of
qualification label

The equipment is
qualified.

In the case of the enhanced subrack:

25.1.2 Label Position


The ESD protection label and grounding label are attached to the subrack. The laser safety class
label and APD warning label are attached to the front panel of the board.

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25 Labels

Figure 25-1 Positions of the labels attached to the OptiX OSN 3500 subrack (1)

50

DON'T

TOUCH THE

FAN LEAVES BEFORE


THEY SLOW DOWN !

ATTENTION
CLEAN PERIODICALLY

Figure 25-2 Positions of the labels attached to the OptiX OSN 3500 subrack (2)

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25 Labels

Figure 25-3 Positions of the labels attached to the board


SL16

CLASS 1
LASER
PRODUCT

APD

Receiver
MAX:-9dBm

BA2

LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS
CLASS 1M LASER
PRODUCT

25.2 Engineering Labels


The engineering labels should be prepared according to the local engineering specifications or
Huawei engineering specifications.
Table 25-2 provides the engineering specifications of Huawei.
For information on how to prepare and attach labels, see the OptiX OSN 3500 Intelligent Optical
Transmission System Installation Guide.

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25 Labels

Table 25-2 Huawei specifications for the engineering labels


Label
Engineer
ing label
for the
power
cable

Illustration
TO:
A01
B08

(1)

-48V2

Description
TO:
B03

-48V2

(2)

(1) Label on the loaded cabinet side, that is,


the position of the cable on the power
distribution cabinet side
(2) Label on the power distribution cabinet
side, that is, the position of the cable on the
loaded cabinet side

Engineer
ing label
for the
external
alarm
cable

On the loaded cabinet side, the


label marked with "A01/B08
48V2" on the cable indicates that
the cable supplies the 48 V2
power. This cable is led out from
the eighth connector in the
second row of the 48 V bus bar
in the power distribution cabinet
in row A and column 01 in the
equipment room.
On the power distribution cabinet
side, the label marked with "B03
48V2" on the cable indicates
that the cable supplies the 48 V2
power. This cable is led out from
the loaded cabinet in row B and
column 03 in the equipment
room. In the case of the PGND
cable and BGND cable, specify
only the row number and column
number of the power distribution
cabinet. It is not required to
specify the connector on the bus
bar.
The external alarm cable is
connected to the power
distribution cabinet (the first
cabinet in each row used for
power distribution). Attach labels
to the terminals of the power
distribution cabinet to indicate
the equipment that uses the
terminals. No engineering label
needs to be attached to the
equipment side, unless otherwise
specified.
"A01" indicates that the alarm
cable connects the power
distribution cabinet and the
cabinet in row A and column 01
in the equipment room.

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Hardware Description

Label

Illustration

Engineer
ing label
for the
network
cable

25 Labels

Description
"A01-03-06-05" indicates that
the local end of the network cable
is connected to network port 05 in
slot 06 of subrack 03 in the
cabinet in row A and column 01
in the equipment room.
"B02-03-12" indicates that the
opposite end of the network cable
is connected to network port 12 in
subrack 03 in the cabinet in row
B and column 02 in the
equipment room. It is not
required to specify the slot
number.

Issue 03 (2013-02-20)

Engineer
ing label
for the
fiber that
connects
two
pieces of
equipme
nt

"A01-01-05-05-R" indicates that


the local end of the fiber is
connected to optical receiving
port 05 in slot 05 of subrack 01 in
the cabinet in row A and column
01 in the equipment room.

Engineer
ing label
for the
fiber that
connects
the
equipme
nt and
the ODF

"ODF-G01-01-01-R" indicates
that the local end of the fiber is
connected to the optical receiving
terminal in row 01 and column 01
of the ODF in row G and column
01 in the equipment room.

"G01-01-01-01-T" indicates that


the opposite end of the fiber is
connected to optical transmitting
port 01 in slot 01 of subrack 01 in
the cabinet in row G and column
01 in the equipment room.

"A01-01-05-05-R" indicates that


the opposite end of the fiber is
connected to optical receiving
port 05 in slot 05 of subrack 01 in
the cabinet in row A and column
01 in the equipment room.

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Label

Illustration

25 Labels

Description

Engineer
ing label
for the
trunk
cable
that
connects
the
equipme
nt and
the DDF

"A01-03-01-01-R" indicates that


the local end of the trunk cable is
connected to the receiving
terminal of trunk cable 01 in slot
01 of subrack 03 in the cabinet in
row A and column 01 in the
equipment room.

Engineer
ing label
for the
subscrib
er cable

"A01-03-01-01" indicates that


the local end of the subscriber
cable is connected to cable 01 in
slot 01 of subrack 03 in the
cabinet in row A and column 01
in the equipment room.

"DDF-G01-01-01-AR" indicates
that the opposite end of the trunk
cable is connected to the
receiving terminal of direction A
(connected to the optical
transmission equipment) in row
01 and column 01 of the DDF in
row G and column 01 in the
equipment room.

TO:

"MDF-G01-01-01" indicates that


the opposite end of the subscriber
cable is connected to the terminal
in row 01 and column 01 of the
MDF in row G and column 01 in
the equipment room.

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26

26 Board Information Quick Reference

Board Information Quick Reference

About This Chapter


This topic provides information about whether a board is supported by the OptiX OSN products,
the parameters specified for the interfaces of the boards (including the parameters specified for
optical interfaces, electrical interfaces, and auxiliary interfaces), the loopback capability of each
board, the functions supported by each board, and the protection schemes supported by each
board.
26.1 Board Version Replacement
The board version replacement function is used only for some specified boards. Before using
this function, you should be familiar with the mapping between boards and their substitute
boards.
26.2 Quick Reference Table for Optical Interfaces
This topic lists the common parameters specified for the interfaces of boards.
26.3 Quick Reference of Board Functions
This topic describes the functions supported by SDH boards, PDH boards, data boards, and
packet boards.
26.4 Loopback Capability of the Boards
The SDH boards, PDH boards, and data boards of the OptiX OSN equipment support various
types of loopbacks.
26.5 Protection Schemes Supported by Each Board
The SDH boards, PDH boards, data boards, microwave boards, and packet boards of the OptiX
OSN equipment support various protection schemes.
26.6 Quick Reference of Power Consumption and Weight of Each Board
This section lists the power consumption and weight of each board of the OptiX OSN series
equipment.

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26 Board Information Quick Reference

26.1 Board Version Replacement


The board version replacement function is used only for some specified boards. Before using
this function, you should be familiar with the mapping between boards and their substitute
boards.
Table 26-1 provides the mapping between boards and their substitute boards.
Table 26-1 Mapping between boards and their substitute boards
Substitute Board

To-Be-Substituted Board

Physical Board

Logical Board

Physical Board

N1PSXCS

N1SXCSA

N1SXCSA

N1PSXCS
N1SXCSA

N1SXCSB

N1EXCSA
N1SXCSA
N1UXCSA

N1EXCSA

N1UXCSB

N1UXCSB

N1UXCSA

N1SXCSB
N2PSXCSA

N1PSXCS

N1PSXCS

N2PSXCSA
N3PSXCSA

N1SL1A

N1SXCSA
N1PSXCS
N2PSXCSA
N3PSXCSA

N1SXCSA

N1SL1

N1SL1

N1PSXCS
N2PSXCSA

N1SL1A
N1SL4A

N1SL4

N1SL4

N1SL4A
N1SL64

N1SLD4A

N1SL64
N2SL64
T2SL64

N2SL64

N1SLD4

N1SLD4

T2SL64

N1SLD4A
N1SLQ1A

N1SLQ1

N1SLQ1

N1SLQ1A
N1SLQ4A

N1SLQ4

N1SLQ4

N1SLQ4A

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26 Board Information Quick Reference

Substitute Board

To-Be-Substituted Board

Physical Board

Logical Board

Physical Board

N2SLQ16

N1SLQ16

N1SLQ16

N2SLQ16
N3SL16

N1SL16

N1SL16

N3SL16
N3SL16A

N1SL16

N1SL16A

N3SL16
N3SLQ41

N1SLQ1
N1SLQ4
N2SLQ1
N2SLQ4

N1SLQ1
N1SLQ4
N2SLQ1

N3SLQ41

N2SLQ4

N4SF64

N1SF64

N1SF64

N4SL64

N1SL64
N2SL64
T2SL64
N4SL64

N1SL64

N1SLD64

N1SLD64

N4SLD64

N2SL64
T2SL64

N4SLD64
N4SLO16

N1SLO16

N1SLO16

N4SLO16
N4SLQ16

N2PD3

N1SLQ16
N2SLQ16
N4SLQ16

N1SLQ16

N1PD3

N1PD3

N2SLQ16

N2PD3
N2PL3

N1PL3

N1PL3

N2PL3
N2PL3A

N1PL3A

N1PL3A

N2PL3A
N2PQ1

N1PQ1

N1PQ1

N2PQ1

Issue 03 (2013-02-20)

N2PQ1A

N2PQ1

N1PQ1A

N2PQ1B

N2PQ1

N1PQ1B

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26 Board Information Quick Reference

Substitute Board

To-Be-Substituted Board

Physical Board

Logical Board

Physical Board

N2SPQ4

N1SPQ4

N1SPQ4

N2SPQ4
R2PD1

R1PD1

R1PD1

R2PD1
R2PD1A

R2PD1

R1PD1A

R2PD1B

R2PD1

R1PD1B

N2EFS0

N1EFS0

N1EFS0

N2EFS0
N2EFS4

N1EFS4

N1EFS4

N2EFS4
N2EFT8

N1EFT8

N1EFT8

N2EFT8A

N1EFT8A

N1EFT8A

N2EGS2

N1EGS2

N1EGS2

N2EGS2
N2EGT2

N1EGT2

N1EGT2

N2EGT2
N3EFS4

N3EGS2

N4EFS0

N4EGS4

N1EFS4
N2EFS4
N3EFS4

N1EFS4

N1EGS2
N2EGS2
N3EGS2

N1EGS2

N1EFS0
N2EFS0
N4EFS0

N1EFS0

N3EGS4

N3EGS4

N2EFS4

N2EGS2

N2EFS0

N4EGS4
N5EFS0

Q2SAP

N1EFS0
N2EFS0
N4EFS0
N5EFS0

N1EFS0

Q1SAP

Q1SAP

N2EFS0
N4EFS0

Q2SAP

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26 Board Information Quick Reference

Substitute Board

To-Be-Substituted Board

Physical Board

Logical Board

Physical Board

TN12OBU1

TN11OBU1

TN11OBU1

A substitute board may not support all the functions of its to-be-substituted board. Therefore,
when you replace a board with its substitute board, consider the differences between the two
boards. If a substitute board does not support an enabled function of its to-be-substituted board
and the enabled function may be used on the live network, the board cannot be replaced. For
restrictions on board replacement, see Table 26-2.
Table 26-2 Restrictions on board replacement
Board That Supports the
Board Version
Replacement Function

Board That Cannot Be


Substituted

Condition

N1SL16A

N2SL16A

The TCM function is enabled


for the N2SL16A/N3SL16A.

N3SL16A
N1SL64

N2SL64
T2SL64

N1SLQ16

N2SLQ16

The TCM function is enabled


or AU-3 services are
configured for the N2SLQ16.

N3SL16

N2SL16

The TCM function is enabled


or AU-3 services are
configured for the N2SL16.

N3SL16A

N2SL16A

AU-3 services are configured


for the N2SL16A.

N3SLO1

N2SLO1

AU-3 services are configured


for the N2SLO1.

N4SL64

N2SL64

The TCM function is enabled


or AU-3 services are
configured for the N2SL64/
T2SL64.

T2SL64

Issue 03 (2013-02-20)

The TCM function is enabled


or AU-3 services are
configured for the N2SL64/
T2SL64.

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26 Board Information Quick Reference

Board That Supports the


Board Version
Replacement Function

Board That Cannot Be


Substituted

Condition

N2EFS0

N1EFS0

l The N1EFS0 is
configured with QoS
functions.

N4EFS0

l If an N4EFS0/N2EFS0 is
configured as an N1EFS0
and the simulation
package loading method
is used, the board
software of the N1EFS0 is
loaded. As a result, a cold
reset is performed on the
board and the board
version replacement
function becomes
ineffective. Therefore, an
N4EFS0/N2EFS0 must
not be configured as an
N1EFS0.

Issue 03 (2013-02-20)

N2EFS4

N1EFS4

If an N2EFS4 is configured
as an N1EFS4 and the
simulation package loading
method is used, the board
software of the N1EFS4 is
loaded. As a result, a cold
reset is performed on the
board and the board version
replacement function
becomes ineffective.
Therefore, an N2EFS4 must
not be configured as an
N1EFS4.

N4EFS0

N2EFS0

If an N4EFS0 is configured
as an N2EFS0 and the
simulation package loading
method is used, the board
software of the N2EFS0 is
loaded. As a result, a cold
reset is performed on the
board and the board version
replacement function
becomes ineffective.
Therefore, an N4EFS0 must
not be configured as an
N2EFS0.

N2EGS2

N1EGS2

The N1EGS2 is configured


with QoS functions.

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26 Board Information Quick Reference

Board That Supports the


Board Version
Replacement Function

Board That Cannot Be


Substituted

Condition

N1BPA

N2BPA

The ALS function is required


but not enabled on the line
board.

N2BPA

N1BPA

The ALS function is required


but not enabled on the
N2BPA.

26.2 Quick Reference Table for Optical Interfaces


This topic lists the common parameters specified for the interfaces of boards.

26.2.1 Common Parameters Specified for Optical Interfaces of SDH


Boards
This topic describes common parameters specified for optical interfaces of SDH boards.
Table 26-3 lists the common parameters specified for the optical interfaces of the SDH boards.
Table 26-3 Common parameters specified for the optical interfaces of the SDH boards
Board
Name

SL1 and
SL1A

Issue 03 (2013-02-20)

Optical Module
Type of
Support
ed
Optical
Interface

Mean Launched
Optical Power
Minimum
(dBm)

Maximum
(dBm)

I-1

-15

S-1.1

Type of
Fiber

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d

-8

-23

-8

Singlemode
LC

-15

-8

-28

-8

Singlemode
LC

L-1.1

-5

-34

-10

Singlemode
LC

L-1.2

-5

-34

-10

Singlemode
LC

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Board
Name

Optical Module
Type of
Support
ed
Optical
Interface

Mean Launched
Optical Power
Minimum
(dBm)

Maximum
(dBm)

Ve-1.2

-3

I-1

Type of
Fiber

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d

-34

-10

Singlemode
LC

-15

-8

-23

-8

Singlemode
LC

S-1.1

-15

-8

-28

-8

Singlemode
LC

L-1.1

-5

-34

-10

Singlemode
LC

L-1.2

-5

-34

-10

Singlemode
LC

Ve-1.2

-3

-34

-10

Singlemode
LC

Ie-1

-19

-14

-30

-14

Multimode
LC

SLT1

S-1.1

-15

-8

-28

-8

Singlemode
LC

SL4,
SL4A,
SLD4,
SLD4A,
SLQ4, and
SLQ4A

I-4

-15

-8

-23

-8

Singlemode
LC

S-4.1

-15

-8

-28

-8

Singlemode
LC

L-4.1

-3

-28

-8

Singlemode
LC

L-4.2

-3

-28

-8

Singlemode
LC

SLQ1 and
SLQ1A

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26 Board Information Quick Reference

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Board
Name

SL16

Optical Module
Type of
Support
ed
Optical
Interface

Mean Launched
Optical Power
Minimum
(dBm)

Maximum
(dBm)

Ve-4.2

-3

L-16.2

SLD16

Issue 03 (2013-02-20)

Type of
Fiber

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d

-34

-13

Singlemode
LC

-2

-28

-9

Singlemode
LC

L-16.2Je

-28

-9

Singlemode
LC

V-16.2Je
(BA)

-2 (without
the BA)

3 (without
the BA)

-28

-9

13 (with the
BA)

15 (with the
BA)

Singlemode
LC

-2 (without
the BA or
PA)

3 (without
the BA or
PA)

-28
(without the
BA or PA)

Singlemode
LC

15 (with the
BA)

18 (with the
BA)

-32 (with
the PA)

-9
(without
the BA or
PA)

I-16

-10

-3

-18

-3

Singlemode
LC

S-16.1

-5

-18

Singlemode
LC

L-16.1

-2

-27

-9

Singlemode
LC

L-16.2

-2

-28

-9

Singlemode
LC

I-16

-10

-3

-18

-3

Singlemode
LC

S-16.1

-5

-18

Singlemode
LC

U-16.2Je
(BA+PA)

SL16A

26 Board Information Quick Reference

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-10 (with
the PA)

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OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

Board
Name

SLQ16

SLO16

SL64

Issue 03 (2013-02-20)

26 Board Information Quick Reference

Optical Module
Type of
Support
ed
Optical
Interface

Mean Launched
Optical Power
Minimum
(dBm)

Maximum
(dBm)

L-16.1

-2

L-16.2

Type of
Fiber

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d

-27

-9

Singlemode
LC

-2

-28

-9

Singlemode
LC

I-16

-10

-3

-18

-3

Singlemode
LC

S-16.1

-5

-18

Singlemode
LC

L-16.1

-2

-27

-9

Singlemode
LC

L-16.2

-2

-28

-9

Singlemode
LC

I-16

-10

-3

-18

-3

Singlemode
LC

S-16.1

-5

-18

Singlemode
LC

L-16.1

-2

-27

-9

Singlemode
LC

L-16.2

-2

-28

-9

Singlemode
LC

I-64.1

-6

-1

-11

-1

Singlemode
LC

I-64.2

-5

-1

-14

-1

Singlemode
LC

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Board
Name

SLD64

SLQ41

Issue 03 (2013-02-20)

26 Board Information Quick Reference

Optical Module
Type of
Support
ed
Optical
Interface

Mean Launched
Optical Power
Minimum
(dBm)

Maximum
(dBm)

S-64.2b

-1

L-64.2b
(BA)

Type of
Fiber

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d

-14

-1

Singlemode
LC

-4 (without
the BA)

2 (without
the BA)

-14

-1

13 (with the
BA)

15 (with the
BA)

Singlemode
LC

P1L1-2D
2

-24

-7

Singlemode
LC

Le-64.2

-21

-8

Singlemode
LC

Ls-64.2

-21

-8

Singlemode
LC

V-64.2b
(BA+PA
+DCU)

-4 (without
the BA, PA,
or DCU)

-1 (without
the BA, PA,
or DCU)

-1

Singlemode
LC

13 (with the
BA)

15 (with the
BA)

-14
(without the
BA, PA, or
DCU)

I-64.1

-6

-1

-11

-1

Singlemode
LC

S-64.2b

-1

-14

-1

Singlemode
LC

I-1

-15

-8

-23

-8

Singlemode
LC

S-1.1

-15

-8

-28

-8

Singlemode
LC

L-1.1

-5

-34

-10

Singlemode
LC

-26 (with
the PA)

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Board
Name

SLH41

26 Board Information Quick Reference

Optical Module
Type of
Support
ed
Optical
Interface

Mean Launched
Optical Power
Minimum
(dBm)

Maximum
(dBm)

L-1.2

-5

Ve-1.2

Type of
Fiber

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d

-34

-10

Singlemode
LC

-3

-34

-10

Singlemode
LC

I-4

-15

-8

-23

-8

Singlemode
LC

S-4.1

-15

-8

-28

-8

Singlemode
LC

L-4.1

-3

-28

-8

Singlemode
LC

L-4.2

-3

-28

-8

Singlemode
LC

Ve-4.2

-3

-34

-13

Singlemode
LC

S-1.1

-15

-8

-28

-8

Singlemode
LC

L-1.1

-5

-34

-10

Singlemode
LC

S-4.1

-15

-8

-28

-8

Singlemode
LC

Table 26-4 lists common parameters specified for optical interfaces of SDH boards (FEC
boards).

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26 Board Information Quick Reference

Table 26-4 Common parameters specified for optical interfaces of SDH boards (FEC boards)
Board
Name

SF16

Optical Module
Type of
Support
ed
Optical
Interface

Mean Launched
Optical Power
Minimu
m (dBm)

Maximu
m (dBm)

Ue-16.2c

Without
BA or PA:
-5

Without
BA or PA:
-1

With BA:
13

With BA:
15

Without
BA or PA:
-5

Without
BA or PA:
-1

With BA:
13

With BA:
15

Without
BA, RA, or
PA: -5

Without
BA, RA, or
PA: -1

Without
BA, RA, or
PA: -27.5

With BA:
15

With BA:
18

With PA:
-42

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d (dBm)

Without BA
or PA: -27.5

-10

Singlemode
LC

-10

Singlemode
LC

-10

Singlemode
LC

Ue-64.2c

-3

-14

-1

Singlemode
LC

Ue-64.2d

-3

-14

-1

Singlemode
LC

Ue-64.2e

-3

-14

-1

Singlemode
LC

Ue-64.2c

-4

-1

-14

-1

Singlemode
LC

Ue-64.2d

-4

-1

-14

-1

Singlemode
LC

Ue-64.2e

-4

-1

-14

-1

Singlemode
LC

Ue-64.2c

-4

-1

-14

-1

Singlemode
LC

Ue-16.2d

Ue-16.2f

SF64

SF64A

SFD64

Issue 03 (2013-02-20)

Type of
Fiber

With PA:
-37
Without BA
or PA: -27.5
With PA:
-37

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Board
Name

26 Board Information Quick Reference

Optical Module
Type of
Support
ed
Optical
Interface

Mean Launched
Optical Power
Minimu
m (dBm)

Maximu
m (dBm)

Ue-64.2d

-4

Ue-64.2e

-4

Type of
Fiber

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d (dBm)

-1

-14

-1

Singlemode
LC

-1

-14

-1

Singlemode
LC

26.2.2 Parameters Specified for the Optical Ports of PDH Boards


This topic lists parameters specified for optical ports of PDH boards.
Table 26-5 lists the common parameters specified for the optical interfaces of the PDH boards.
Table 26-5 Common parameters specified for the optical interfaces of the PDH boards
Board
Name

PFL1

Optical Module
Type of
Support
ed
Optical
Interface

Mean Launched
Optical Power
Minimum
(dBm)

Maximum
(dBm)

I-2M

-15

-8

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d

-23

-8

Type of
Fiber

Singlemode
LC

26.2.3 Common Parameters Specified for Optical Interfaces of


Packet Boards
This topic describes common parameters specified for optical interfaces of packet boards.
Table 26-6 lists common parameters specified for optical interfaces of packet processing
boards.Table 26-7 lists common parameters specified for optical interfaces of packet interface
boards.

Issue 03 (2013-02-20)

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26 Board Information Quick Reference

Table 26-6 Parameters specified for optical interfaces of packet processing boards
Board Name

N1PEX1

N2PEX1

PEG16

Issue 03 (2013-02-20)

Optical Module
Type
of
Interf
ace

Mean Launched
Optical Power
Minim
um
(dBm)

Maxim
um
(dBm)

10GB
ASESR/SW

-7.3

10GB
ASELR/
LW

Type
of
Fiber

Trans
missi
on
Dista
nce
(km)

Receive
r
Sensiti
vity
(dBm)

Mini
mum
Overl
oad
(dBm)

-1.3

-7.5

-1

Multimode
LC

0.3

-6

-1

-11

-1

Single
-mode
LC

10

10GB
ASEER/
EW

-1

-15

-1

Single
-mode
LC

40

10GB
ASEZR/
ZW

-24

-7

Single
-mode
LC

80

10GB
ASELR

-6

-1

-11

-1

Single
-mode
LC

10

10GB
ASEER

-1

-15

-1

Single
-mode
LC

40

10GB
ASEZR

-24

-7

Single
-mode
LC

80

1000B
ASEZX

-2

-23

-3

Single
-mode
LC

80

1000B
ASEVX

-5

-23

-3

Single
-mode
LC

40

1000B
ASELX

-9

-3

-20

-3

Single
-mode
LC

10

1000B
ASESX

-9.5

-2.5

-17

Multimode
LC

0.5

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Board Name

26 Board Information Quick Reference

Optical Module

PEX2

PEG8

Type
of
Interf
ace

Mean Launched
Optical Power
Minim
um
(dBm)

Maxim
um
(dBm)

10GB
ASELR

-6

10GB
ASEER

Type
of
Fiber

Trans
missi
on
Dista
nce
(km)

Receive
r
Sensiti
vity
(dBm)

Mini
mum
Overl
oad
(dBm)

-1

-11

-1

Single
-mode
LC

10

-1

-15

-1

Single
-mode
LC

40

10GB
ASEZR

-24

-7

Single
-mode
LC

80

1000B
ASEZX

-2

-23

-3

Single
-mode
LC

80

1000B
ASEVX

-5

-23

-3

Single
-mode
LC

40

1000B
ASELX

-9

-3

-20

-3

Single
-mode
LC

10

1000B
ASESX

-9.5

-2.5

-17

Multimode
LC

0.5

Table 26-7 Parameters specified for optical interfaces of packet interface boards
Board
Name

CQ1

Issue 03 (2013-02-20)

Optical Module
Type of
Interfac
e

Mean Launched
Optical Power
Minim
um
(dBm)

Maxim
um
(dBm)

S-1.1

-15

L-1.1

-5

Type of
Fiber

Transm
ission
Distanc
e (km)

Receive
r
Sensiti
vity
(dBm)

Minim
um
Overloa
d (dBm)

-8

-28

-8

Singlemode LC

2 to 15

-34

-10

Singlemode LC

15 to 40

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Board
Name

PEFF8

26 Board Information Quick Reference

Optical Module
Type of
Interfac
e

Mean Launched
Optical Power
Minim
um
(dBm)

Maxim
um
(dBm)

L-1.2

-5

100BAS
E-ZX

Type of
Fiber

Transm
ission
Distanc
e (km)

Receive
r
Sensiti
vity
(dBm)

Minim
um
Overloa
d (dBm)

-34

-10

Singlemode LC

40 to 80

-5

-34

-10

Singlemode LC

80

100BAS
E-VX

-5

-34

-10

Singlemode LC

40

100BAS
E-LX

-15

-8

-28

-8

Singlemode LC

15

100BAS
E-FX

-19

-14

-30

-14

Multimode LC

26.2.4 Common Parameters Specified for Optical Interfaces of


Packet Boards
This topic describes common parameters specified for optical interfaces of the EoD.
Table 26-8 lists the parameters specified for optical interfaces of the EoD.
Table 26-8 Parameters specified for optical interfaces of the EoD
Board
Name

EDQ41

Issue 03 (2013-02-20)

Optical Module
Type of
Interface

Mean Launched Optical


Power

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d (dBm)

Type of
Fiber

Maximu
m (dBm)

Minimum
(dBm)

S-1.1

-8

-15

-28

-8

Singlemode
LC

L-1.1

-5

-34

-10

Singlemode
LC

L-1.2

-5

-34

-10

Singlemode
LC

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Board
Name

26 Board Information Quick Reference

Optical Module
Type of
Interface

Mean Launched Optical


Power

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d (dBm)

Type of
Fiber

Maximu
m (dBm)

Minimum
(dBm)

S-4.1

-8

-15

-28

-8

Singlemode
LC

L-4.1

-2

-3

-28

-8

Singlemode
LC

L-4.2

-2

-3

-28

-8

Singlemode
LC

Ve-4.2

-2

-3

-34

-13

Singlemode
LC

26.2.5 Common Parameters Specified for Optical Interfaces of Data


Boards
This topic describes common parameters specified for optical interfaces of data boards.
Table 26-9 lists the common parameters specified for the optical interfaces of the data boards.
Table 26-9 Common parameters specified for the optical interfaces of the data boards
Board Name

Optical Module

EGS2, EGS4, EGR2, EGT2,


EMS2, EMS4, EGS4, EGS4A
and EMR0

Issue 03 (2013-02-20)

Type
of
Supp
orted
Optic
al
Interf
ace

Mean Launched
Optical Power
Minim
um
(dBm)

Maxim
um
(dBm)

1000B
ASEZX (80
km)

-2

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Receiv
er
Sensiti
vity
(dBm)

Mini
mum
Overl
oad
(dBm)

-23

-3

Type
of
Fiber

Singl
emode
LC

1511

OptiX OSN 3500 Intelligent Optical Transmission System


Hardware Description

Board Name

Optical Module
Type
of
Supp
orted
Optic
al
Interf
ace

Mean Launched
Optical Power
Minim
um
(dBm)

Maxim
um
(dBm)

1000B
ASEVX (40
km)

-5

1000B
ASELX (10
km)

Type
of
Fiber

Receiv
er
Sensiti
vity
(dBm)

Mini
mum
Overl
oad
(dBm)

-23

-3

Singl
emode
LC

-9

-3

-20

-3

Singl
emode
LC

1000B
ASESX
(0.5
km)

-9.5

-2.5

-17

Multi
mode
LC

EAS2

10GB
ASELR/
LW

-6

-1

-11

-1

Singl
emode
LC

EFF8, EFF8A

100BA
SE-LX
(15
km)

-15

-8

-28

-8

Singl
emode
LC

100BA
SE-FX
(2 km)

-19

-14

-30

-14

Multi
mode
LC

S-4.1

-15

-8

-28

-8

Singl
emode
LC

L-4.1

-3

-28

-8

Singl
emode
LC

ADL4, IDL4

Issue 03 (2013-02-20)

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Board Name

ADQ1, IDQ1

MST4

Issue 03 (2013-02-20)

26 Board Information Quick Reference

Optical Module
Type
of
Supp
orted
Optic
al
Interf
ace

Mean Launched
Optical Power
Minim
um
(dBm)

Maxim
um
(dBm)

L-4.2

-3

Ve-4.2

Type
of
Fiber

Receiv
er
Sensiti
vity
(dBm)

Mini
mum
Overl
oad
(dBm)

-28

-8

Singl
emode
LC

-3

-34

-13

Singl
emode
LC

Ie-1

-19

-14

-30

-14

Multi
mode
LC

S-1.1

-15

-8

-28

-8

Singl
emode
LC

L-1.1

-5

-34

-10

Singl
emode
LC

L-1.2

-5

-34

-10

Singl
emode
LC

Ve-1.2

-3

-34

-10

Singl
emode
LC

X3.29
6/
(DVBASI)
EN500
83-9
200M5SN-I

-15

-8

-31

-8

Singl
emode
LC

-19

-14

-30

-14

Singl
emode
LC

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Board Name

26 Board Information Quick Reference

Optical Module
Type
of
Supp
orted
Optic
al
Interf
ace

Mean Launched
Optical Power
Minim
um
(dBm)

Maxim
um
(dBm)

200SMLC-I

-9.5

Type
of
Fiber

Receiv
er
Sensiti
vity
(dBm)

Mini
mum
Overl
oad
(dBm)

-2.5

-17

Singl
emode
LC

-10

-3

-21

-3

Multi
mode
LC

-5

-21

Singl
emode
LC

26.3 Quick Reference of Board Functions


This topic describes the functions supported by SDH boards, PDH boards, data boards, and
packet boards.

26.3.1 Information Quick Reference of SDH Boards


This topic describes the functions supported by different types of SDH boards.
Table 26-10 provides the functions supported by SDH boards.
Table 26-10 Basic functions of SDH boards

Issue 03 (2013-02-20)

Func
tion

ALS

REG
Speci
ficati
ons

PRBS

AU-3

TCM

FEC

Fixed
Wave
lengt
h

Color
ed
Wave
lengt
h

Tuna
ble
Wave
lengt
h

N1SL
64

N2SL
64

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26 Board Information Quick Reference

Func
tion

ALS

REG
Speci
ficati
ons

PRBS

AU-3

TCM

FEC

Fixed
Wave
lengt
h

Color
ed
Wave
lengt
h

Tuna
ble
Wave
lengt
h

N4SL
64

T2SL
64

T2SL
64A

N1SF
64

N1SF
64A

N1SL
D64

N4SL
D64

N1SL
16

N2SL
16

N3SL
16

N1SL
16A

N2SL
16A

N3SL
16A

N1SL
D16

N1SL
Q16

N2SL
Q16

N4SL
Q16

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26 Board Information Quick Reference

Func
tion

ALS

REG
Speci
ficati
ons

PRBS

AU-3

TCM

FEC

Fixed
Wave
lengt
h

Color
ed
Wave
lengt
h

Tuna
ble
Wave
lengt
h

N1SL
O16

N4SL
O16

N1SF
16

N3SL
Q41

N3SL
H41

N1SL
4

N2SL
4

R1SL
4

N1SL
4A

N1SL
Q4

N2SL
Q4

N1SL
Q4A

N1SL
D4

N2SL
D4

R1SL
D4

R3SL
D4

N1SL
D4A

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26 Board Information Quick Reference

Func
tion

ALS

REG
Speci
ficati
ons

PRBS

AU-3

TCM

FEC

Fixed
Wave
lengt
h

Color
ed
Wave
lengt
h

Tuna
ble
Wave
lengt
h

N1SL
T1

N1SL
Q1

N2SL
Q1

R1SL
Q1

N1SL
Q1A

R3SL
Q1

N1SL
1

N2SL
1

N1SL
1A

R1SL
1

R3SL
1

N1SL
H1

N1SE
P1

N2SL
O1

N3SL
O1

26.3.2 Information Quick Reference of PDH Boards


This topic describes the functions supported by different types of PDH boards.
Table 26-11 provides the functions supported by PDH boards.
Issue 03 (2013-02-20)

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26 Board Information Quick Reference

Table 26-11 Basic functions of PDH boards


Function

PRBS

TPS

E13

M13

R1PL1

R1PD1

R2PD1

R3PD1

YNote

N1PQ1

N2PQ1

N1PQM

N1PL3

N2PL3

N1PL3A

N2PL3A

N1PD3

N2PD3

N2PQ3

N1DX1

N1DXA

N1SPQ4

N2SPQ4

N1PFL1

NOTE
The R3PD1 supports the E13 function only in server mode.

26.3.3 Information Quick Reference of Data Boards


This topic describes the functions supported by different types of data boards.
Table 26-12 provides the functions supported by Ethernet boards.

Issue 03 (2013-02-20)

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26 Board Information Quick Reference

Table 26-12 Basic functions of Ethernet boards

Issue 03 (2013-02-20)

Fu
nct
ion

EP
L

EV
PL

EP
LA
N

EV
PL
AN

MP
LS

VC
TR
UN
K
spe
cifi
cati
ons

Qo
S

ET
H
OA
M
(80
2.1
ag)

ET
H
OA
M
(80
2.3
ah)

Tes
t
Fra
me
s

Qi
nQ

R
M
ON

IG
MP
Sn
oo
pin
g

R1
EF
T4

N1
EF
T8

16

N1
EF
T8
A

N1
EG
T2

N2
EG
T2

N1
EF
S0

12

N2
EF
S0

24

N4
EF
S0

24

N5
EF
S0

24

N1
EF
S0
A

32

N1
EF
S4

12

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Issue 03 (2013-02-20)

26 Board Information Quick Reference

Fu
nct
ion

EP
L

EV
PL

EP
LA
N

EV
PL
AN

MP
LS

VC
TR
UN
K
spe
cifi
cati
ons

Qo
S

ET
H
OA
M
(80
2.1
ag)

ET
H
OA
M
(80
2.3
ah)

Tes
t
Fra
me
s

Qi
nQ

R
M
ON

IG
MP
Sn
oo
pin
g

N2
EF
S4

24

N3
EF
S4

24

N2
EG
S2

48

N3
EG
S2

48

N1
EM
S4

64

N1
EM
S2

48

N1
EG
S4

64

N3
EG
S4

64

N4
EG
S4

64

N2
EG
R2

N2
EM
R0

N1
EA
S2

24

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Fu
nct
ion

EP
L

EV
PL

EP
LA
N

EV
PL
AN

26 Board Information Quick Reference

MP
LS

VC
TR
UN
K
spe
cifi
cati
ons

Qo
S

ET
H
OA
M
(80
2.1
ag)

ET
H
OA
M
(80
2.3
ah)

Tes
t
Fra
me
s

Qi
nQ

R
M
ON

IG
MP
Sn
oo
pin
g

NOTE
For the ETH OAM functions supported by data boards, see "Availability" in the Feature Description.

Table 26-13 provides basic functions supported by SAN/Video boards.


Table 26-13 Basic functions supported by SAN/Video boards
Functio
n

FC100

FC200

FICON

ESCON

DVBASI

SD-SDI

HDSDI

N1MST
4

N1VST4

26.3.4 Information Quick Reference of Packet Boards


This topic describes the functions supported by different types of packet boards.
Table 26-14 provides the functions supported by packet Ethernet boards.

Issue 03 (2013-02-20)

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26 Board Information Quick Reference

Table 26-14 Basic functions of packet Ethernet boards

Issue 03 (2013-02-20)

F
u
n
ct
io
n

E
L
i
n
e

E
L
A
N

E
A
G
G
R

H
Q
o
S

L
A
G

M
P
L
S
T
u
n
n
el
A
P
S

P
W
A
P
S

M
P
L
S
O
A
M

M
C
L
A
G

M L
S P
T T
P

M
SP
W

E
T
H
O
A
M

Q
i
n
Q

I
G
M
P
S
n
o
o
pi
n
g

1
5
8
8
V
2

I
n
b
a
n
d
D
C
N

R
M
O
N

T
N
N
1
E
G
8

T
N
N
1
E
X
2

N
1
P
E
G
1
6

N
1
P
E
G
8

N
1
P
E
X
1

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26 Board Information Quick Reference

F
u
n
ct
io
n

E
L
i
n
e

E
L
A
N

E
A
G
G
R

H
Q
o
S

L
A
G

M
P
L
S
T
u
n
n
el
A
P
S

P
W
A
P
S

M
P
L
S
O
A
M

M
C
L
A
G

M L
S P
T T
P

M
SP
W

E
T
H
O
A
M

Q
i
n
Q

I
G
M
P
S
n
o
o
pi
n
g

1
5
8
8
V
2

I
n
b
a
n
d
D
C
N

R
M
O
N

N
2
P
E
X
1

N
1
P
E
X
2

N
1
P
E
T
F
8

N
1
P
E
F
F
8

N
1
E
D
Q
4
1

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F
u
n
ct
io
n

E
L
i
n
e

E
L
A
N

E
A
G
G
R

H
Q
o
S

L
A
G

M
P
L
S
T
u
n
n
el
A
P
S

P
W
A
P
S

M
P
L
S
O
A
M

M
C
L
A
G

M L
S P
T T
P

M
SP
W

E
T
H
O
A
M

Q
i
n
Q

I
G
M
P
S
n
o
o
pi
n
g

1
5
8
8
V
2

I
n
b
a
n
d
D
C
N

R
M
O
N

Q
1
P
E
G
S
2

R
1
P
E
G
S
1

R
1
P
E
F
4
F

R
1
P
E
F
S
8

T
N
N
1
E
T
M
C

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26 Board Information Quick Reference

F
u
n
ct
io
n

E
L
i
n
e

E
L
A
N

E
A
G
G
R

H
Q
o
S

L
A
G

M
P
L
S
T
u
n
n
el
A
P
S

P
W
A
P
S

M
P
L
S
O
A
M

M
C
L
A
G

M L
S P
T T
P

M
SP
W

E
T
H
O
A
M

Q
i
n
Q

I
G
M
P
S
n
o
o
pi
n
g

1
5
8
8
V
2

I
n
b
a
n
d
D
C
N

R
M
O
N

T
N
N
1
E
F
F
8

26.4 Loopback Capability of the Boards


The SDH boards, PDH boards, and data boards of the OptiX OSN equipment support various
types of loopbacks.
Table 26-15 provides the loopback capability of the SDH boards of the OptiX OSN equipment.
Table 26-15 Loopback capability of the SDH boards

Issue 03 (2013-02-20)

Board

Inloop at an
Interface

Outloop at
an
Interface

Inloop on a
VC-4 Path

Outloop on
a VC-4 Path

Outloop on
a VC-3 or
VC-12 Path

N1SL1

Supported

Supported

Supported

Not
supported

Not
supported

R1SL1

Supported

Supported

Supported

Not
supported

Not
supported

N1SL4

Supported

Supported

Supported

Not
supported

Not
supported

R1SL4

Supported

Supported

Supported

Not
supported

Not
supported

N1SL16

Supported

Supported

Supported

Not
supported

Not
supported

N3SL16

Supported

Supported

Supported

Supported

Not
supported

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26 Board Information Quick Reference

Board

Inloop at an
Interface

Outloop at
an
Interface

Inloop on a
VC-4 Path

Outloop on
a VC-4 Path

Outloop on
a VC-3 or
VC-12 Path

N1SL64

Supported

Supported

Supported

Supported

Not
supported

N2SL64

Supported

Supported

Not
supported

Not
supported

Not
supported

N4SL64

Supported

Supported

Supported

Supported

Not
supported

N1SF64

Supported

Supported

Supported

Supported

Not
supported

N1SF64A

Supported

Supported

Supported

Supported

Not
supported

N1SLD64

Supported

Supported

Supported

Supported

Not
supported

N4SLD64

Supported

Supported

Supported

Supported

Not
supported

N1SL16

Supported

Supported

Supported

Not
supported

Not
supported

N2SL16

Supported

Supported

Not
supported

Not
supported

Not
supported

N3SL16

Supported

Supported

Supported

Supported

Not
supported

N1SL16A

Supported

Supported

Supported

Not
supported

Not
supported

N2SL16A

Supported

Supported

Not
supported

Not
supported

Not
supported

N3SL16A

Supported

Supported

Supported

Supported

Not
supported

N1SLD16

Supported

Supported

Supported

Supported

Not
supported

N1SLQ16

Supported

Supported

Supported

Supported

Not
supported

N2SLQ16

Supported

Supported

Not
supported

Not
supported

Not
supported

N4SLQ16

Supported

Supported

Supported

Supported

Not
supported

N1SLO16

Supported

Supported

Supported

Supported

Not
supported

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26 Board Information Quick Reference

Board

Inloop at an
Interface

Outloop at
an
Interface

Inloop on a
VC-4 Path

Outloop on
a VC-4 Path

Outloop on
a VC-3 or
VC-12 Path

N4SLO16

Supported

Supported

Supported

Supported

Not
supported

N1SF16

Supported

Supported

Supported

Not
supported

Not
supported

N3SLQ41

Supported

Supported

Supported

Supported

Not
supported

N3SLH41

Supported

Supported

Supported

Supported

Not
supported

N1SL4

Supported

Supported

Supported

Not
supported

Not
supported

N1SL4A

Supported

Supported

Supported

Supported

Not
supported

N2SL4

Supported

Supported

Not
supported

Not
supported

Not
supported

R1SL4

Supported

Supported

Supported

Not
supported

Not
supported

N1SLQ4

Supported

Supported

Supported

Not
supported

Not
supported

N1SLQ4A

Supported

Supported

Supported

Supported

Not
supported

N2SLQ4

Supported

Supported

Not
supported

Not
supported

Not
supported

N1SLD4

Supported

Supported

Supported

Not
supported

Not
supported

N1SL4DA

Supported

Supported

Supported

Supported

Not
supported

N2SLD4

Supported

Supported

Not
supported

Not
supported

Not
supported

R1SLD4

Supported

Supported

Supported

Not
supported

Not
supported

N1SLT1

Supported

Supported

Supported

Supported

Not
supported

N1SLQ1

Supported

Supported

Supported

Not
supported

Not
supported

N1SLQ1A

Supported

Supported

Supported

Supported

Not
supported

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26 Board Information Quick Reference

Board

Inloop at an
Interface

Outloop at
an
Interface

Inloop on a
VC-4 Path

Outloop on
a VC-4 Path

Outloop on
a VC-3 or
VC-12 Path

N2SLQ1

Supported

Supported

Not
supported

Not
supported

Not
supported

R1SLQ1

Supported

Supported

Supported

Not
supported

Not
supported

N1SL1

Supported

Supported

Supported

Not
supported

Not
supported

N1SL1A

Supported

Supported

Supported

Supported

Not
supported

N2SL1

Supported

Supported

Not
supported

Not
supported

Not
supported

R1SL1

Supported

Supported

Supported

Not
supported

Not
supported

N1SLH1

Supported

Supported

Supported

Supported

Not
supported

N1SEP1

Supported

Supported

Supported

Not
supported

Not
supported

N2SLO1

Supported

Supported

Not
supported

Not
supported

Not
supported

N3SLO1

Supported

Supported

Supported

Supported

Not
supported

Table 26-16 provides information on whether each SDH board of the OptiX OSN equipment
supports the insertion of the AU_AIS when the board is looped back.
Table 26-16 Information on whether each SDH board of the OptiX OSN equipment supports
the insertion of the AU_AIS when the board is looped back

Issue 03 (2013-02-20)

Board

Insertion of
the AU_AIS to
the Port Side
(Inloop at an
Interface)

Insertion of the
AU_AIS to the
Cross-Connect
Side (Outloop
at an Interface)

Insertion of
the AU_AIS to
the CrossConnect Side
(Inloop on a
VC-4 Path)

Insertion of
the AU_AIS
to the Port
Side
(Outloop on a
VC-4 Path)

N1SL64

Supported

Supported

Supported

Supported

N4SL64

Supported

Supported

Supported

Supported

N2SL64

Not supported

Supported

Not supported

Not supported

N1SF64

Supported

Supported

Supported

Supported

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26 Board Information Quick Reference

Board

Insertion of
the AU_AIS to
the Port Side
(Inloop at an
Interface)

Insertion of the
AU_AIS to the
Cross-Connect
Side (Outloop
at an Interface)

Insertion of
the AU_AIS to
the CrossConnect Side
(Inloop on a
VC-4 Path)

Insertion of
the AU_AIS
to the Port
Side
(Outloop on a
VC-4 Path)

N1SF64A

Supported

Supported

Supported

Supported

N1SLD64

Supported

Supported

Supported

Supported

N1SL16

Not supported

Supported

Not supported

Not supported

N2SL16

Not supported

Supported

Not supported

Not supported

N3SL16

Supported

Supported

Supported

Supported

N1SL16A

Not supported

Supported

Not supported

Not supported

N2SL16A

Not supported

Supported

Not supported

Not supported

N3SL16A

Supported

Supported

Supported

Supported

N1SLD16

Supported

Supported

Supported

Supported

N1SLQ16

Supported

Supported

Supported

Supported

N2SLQ16

Not supported

Supported

Not supported

Not supported

N1SLO16

Supported

Supported

Supported

Supported

N1SF16

Not supported

Supported

Not supported

Not supported

N3SLQ41

Supported

Supported

Supported

Supported

N3SLH41

Supported

Supported

Supported

Supported

N1SL4

Not supported

Supported

Not supported

Not supported

N1SL4A

Supported

Supported

Supported

Supported

N2SL4

Not supported

Supported

Not supported

Not supported

R1SL4

Not supported

Supported

Not supported

Not supported

N1SLQ4

Not supported

Supported

Not supported

Not supported

N1SLQ4A

Supported

Supported

Supported

Supported

N2SLQ4

Not supported

Supported

Not supported

Not supported

N1SLD4

Not supported

Supported

Not supported

Not supported

N1SLD4A

Supported

Supported

Supported

Supported

N2SLD4

Not supported

Supported

Not supported

Not supported

R1SLD4

Not supported

Supported

Not supported

Not supported

N1SLT1

Supported

Supported

Supported

Supported

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Board

Insertion of
the AU_AIS to
the Port Side
(Inloop at an
Interface)

Insertion of the
AU_AIS to the
Cross-Connect
Side (Outloop
at an Interface)

Insertion of
the AU_AIS to
the CrossConnect Side
(Inloop on a
VC-4 Path)

Insertion of
the AU_AIS
to the Port
Side
(Outloop on a
VC-4 Path)

N1SLQ1

Not supported

Supported

Not supported

Not supported

N1SLQ1A

Supported

Supported

Supported

Supported

N2SLQ1

Not supported

Supported

Not supported

Not supported

R1SLQ1

Not supported

Supported

Not supported

Not supported

N1SL1

Not supported

Supported

Not supported

Not supported

N1SL1A

Supported

Supported

Supported

Supported

N2SL1

Not supported

Supported

Not supported

Not supported

R1SL1

Not supported

Supported

Not supported

Not supported

N1SLH1

Supported

Supported

Supported

Supported

N1SEP1

Not supported

Supported

Not supported

Not supported

N2SLO1

Not supported

Supported

Not supported

Not supported

N3SLO1

Supported

Supported

Supported

Supported

Table 26-17 provides the loopback capability of the PDH boards of the OptiX OSN equipment.
Table 26-17 Loopback capability of the PDH boards

Issue 03 (2013-02-20)

Board

Inloop at an Interface

Outloop at an Interface

R1PL1

Supported

Supported

R1PD1

Supported

Supported

N1PQ1

Supported

Supported

N1PQM

Supported

Supported

N1PD3

Supported

Supported

N1PL3

Supported

Supported

N2PQ3

Supported

Supported

N2SPQ4

Supported

Supported

N1PFL1

Supported

Supported

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Table 26-18 provides the loopback capability of the data boards of the OptiX OSN equipment.
Table 26-18 Loopback capability of the data boards of the OptiX OSN equipment

Issue 03 (2013-02-20)

Board

Outloop
at the
MAC
Layer

Inloop at
the MAC
Layer

Outloop
at the
PHY
Layer

Inloop at
the PHY
Layer

Inloop
and
Outloop
on a
VC-4
Path

Inloop
and
Outloop
on a VC-3
Path

N1EFS4

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N2EFS4

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N3EFS4

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N1EFS0

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N2EFS0

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N4EFS0

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N5EFS0

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N1EFS0A

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N1EGT2

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N2EGT2

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N1EFT8

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N1EFT8A

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

R1EFT4

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N1EMS4

Not
supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

N1EMS2

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

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26 Board Information Quick Reference

Board

Outloop
at the
MAC
Layer

Inloop at
the MAC
Layer

Outloop
at the
PHY
Layer

Inloop at
the PHY
Layer

Inloop
and
Outloop
on a
VC-4
Path

Inloop
and
Outloop
on a VC-3
Path

N1EGS4

Not
supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

N3EGS4

Not
supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

N2EGS4

Not
supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

N4EGS4

Not
supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

N2EGS2

Not
supported

Not
supported

Not
supported

Supported

Not
supported

Supported

N3EGS2

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N2EGR2

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N1EAS2

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N2EMR0

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

Table 26-19 provides the loopback capability of the ATM/IMA boards of the OptiX OSN
equipment.
Table 26-19 Loopback capability of the ATM/IMA boards of the OptiX OSN equipment

Issue 03 (2013-02-20)

Board

Outloop at an
External
Interface

Inloop at an
External
Interface

Outloop at an
Internal
Interface

Inloop at an
Internal
Interface

N1ADL4

Not supported

Supported

Supported

Supported

N1ADQ1

Not supported

Supported

Supported

Supported

N1IDL4

Not supported

Supported

Supported

Supported

N1IDL4A

Not supported

Supported

Supported

Supported

N1IDQ1

Not supported

Supported

Supported

Supported

N1IDQ1A

Not supported

Supported

Supported

Supported

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Table 26-20 provides the loopback capability of the packet Ethernet boards of the OptiX OSN
equipment.
Table 26-20 Loopback capability of the packet Ethernet boards of the OptiX OSN equipment

Issue 03 (2013-02-20)

Board

Outloop
at the
MAC
Layer

Inloop at
the MAC
Layer

Outloop
at the
PHY
Layer

Inloop at
the PHY
Layer

Inloop
and
Outloop
on a
VC-4
Path

Inloop
and
Outloop
on a VC-3
Path

N1PEX1

Not
supported

Supported

Supported

Supported

Not
supported

Not
supported

N2PEX1

Supported

Supported

Not
supported

Not
supported

Not
supported

Not
supported

N1PEX2

Supported

Supported

Not
supported

Not
supported

Not
supported

Not
supported

N1PEG16

Not
supported

Supported

Supported

Supported

Not
supported

Not
supported

N1PEG8

Supported

Supported

Not
supported

Not
supported

Not
supported

Not
supported

N1PETF8

Supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N1PEFF8

Supported

Supported

Not
supported

Supported

Not
supported

Not
supported

R1PEFS8

Supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

R1PEF4F

Supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

R1PEGS1

Supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

Q1PEGS2

Supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

TNN1EG8

Supported

Supported

Not
supported

Not
supported

Not
supported

Not
supported

TNN1EX2

Supported

Supported

Not
supported

Not
supported

Not
supported

Not
supported

TNN1ETM
C

Supported

Supported

Supported
(only by
GE ports)

Supported

Not
supported

Not
supported

TNN1EFF
8

Supported

Supported

Not
supported

Supported

Not
supported

Not
supported

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26 Board Information Quick Reference

Table 26-21 provides the loopback capability of the channelized STM-1 CES boards of the
OptiX OSN equipment.
Table 26-21 Loopback capability of the channelized STM-1 CES boards of the OptiX OSN
equipment
Board

Inloop
at a
Port

Outloo
p at a
Port

Inloop
on a
VC-4
Path

Outloo
p on a
VC-4
Path

Inloop on a
VC-12 Path

Outloop on a
VC-12 Path

N1CQ1

Support
ed

Support
ed

Not
support
ed

Not
support
ed

Not supported

Not supported

TNN1CO1

Support
ed

Support
ed

Not
support
ed

Not
support
ed

Supported

Supported

Table 26-22 provides the loopback capability of the packet ATM boards of the OptiX OSN
equipment.
Table 26-22 Loopback capability of the packet ATM boards of the OptiX OSN equipment
Board

Inloop at
a Port

Outloop
at a Port

Inloop on a VC-4
Path

Outloop on a
VC-4 Path

TNN1AFO1

Supported

Supported

Not supported

Not supported

Table 26-23 provides the loopback capability of the dual-domain boards of the OptiX OSN
equipment.
Table 26-23 Loopback capability of the dual-domain boards of the OptiX OSN equipment
Board

Inloop at
a Port

Outloop
at a Port

Inloop
on a VC-4
Path

Outloop
on a
VC-4
Path

Outloop on a
VC-3/VC-12
Path

N1EDQ41

Supported

Supported

Supported

Supported

Not supported

Table 26-24 provides the loopback capability of the SAN/Video boards of the OptiX OSN
equipment.

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26 Board Information Quick Reference

Table 26-24 Loopback capability of the SAN/Video boards of the OptiX OSN equipment
Board

Inloop at
a Port

Outloop
at a Port

Inloop
on a VC-4
Path

Outloop
on a
VC-4
Path

Outloop on a
VC-3/VC-12
Path

N1MST4

Supported

Supported

Not
supported

Not
supported

Not supported

N1VST4

Supported

Supported

Not
supported

Not
supported

Not supported

26.5 Protection Schemes Supported by Each Board


The SDH boards, PDH boards, data boards, microwave boards, and packet boards of the OptiX
OSN equipment support various protection schemes.
Table 26-25 lists the protection schemes that the SDH boards of the OptiX OSN equipment
support.
Table 26-25 Protection schemes that the SDH boards of the OptiX OSN equipment support
Board

Issue 03 (2013-02-20)

Protection Scheme
TwoFiber
Ring
MSP

FourFiber
Ring
MSP

Linear
MSP

SNCP

SNCT
P

SNC
MP

MS
P
and
SN
CP
Fibe
rSha
red
Prot
ecti
on

TPS
Prote
ction

N1SL64

N2SL64

N4SL64

N1SF64
A

N1SLD6
4

N4SLD6
4

N1SL16

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Board

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26 Board Information Quick Reference

Protection Scheme
TwoFiber
Ring
MSP

FourFiber
Ring
MSP

Linear
MSP

SNCP

SNCT
P

SNC
MP

MS
P
and
SN
CP
Fibe
rSha
red
Prot
ecti
on

TPS
Prote
ction

N2SL16

N3SL16

N1SL16
A

N2SL16
A

N3SL16
A

N1SLD1
6

N1SLQ1
6

N4SLQ1
6

N1SLO1
6

N4SLO1
6

N1SF16

N3SLQ4
1

N3SLH4
1

N1SL4

N2SL4

N1SL4A

R1SL4

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Board

26 Board Information Quick Reference

Protection Scheme
TwoFiber
Ring
MSP

FourFiber
Ring
MSP

Linear
MSP

SNCP

SNCT
P

SNC
MP

MS
P
and
SN
CP
Fibe
rSha
red
Prot
ecti
on

TPS
Prote
ction

N1SLQ4

N2SLQ4

N1SLQ4
A

N2SLD4

N1SLD4
A

R1SLD4

N1SLT1

N1SLQ1

N2SLQ1

R1SLQ1

N1SL1

N2SL1

N1SL1A

N1SLH1

N1SEP1

N3SLO1

Note: "" means that the board supports the protection scheme and "x" means that the board
does not support the protection scheme.

Table 26-26 lists the protection schemes that the PDH boards of the OptiX OSN equipment
support.

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26 Board Information Quick Reference

Table 26-26 Protection schemes that the PDH boards of the OptiX OSN equipment support
Board

Protection Scheme
TPS
Protection
for the E1
Services

TPS
Protection
for the E1/
T1 Services

TPS
Protection
for the E3/
T3 Services

TPS
Protection
for the E4/
STM-1
Services

TPS
Protection
for the DDN
Services

R1PL1

R1PD1

N1PQ1

N1PQM

N1PL3

N2PL3

N1PL3A

N2PL3A

N1PD3

N2PD3

N2PQ3

N1DX1

N1DXA

N2SPQ4

N1PFL1

Table 26-27 lists the protection schemes that the data boards of the OptiX OSN equipment
support.

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26 Board Information Quick Reference

Table 26-27 Protection schemes that the data boards of the OptiX OSN equipment support
Board

Issue 03 (2013-02-20)

Protection Scheme
LCAS

STP/
RSTP

TP
S
Pro
tect
ion

B
PS
Pr
ot
ec
tio
n

PP
S
Pr
ot
ect
io
n

L
A
G

D
L
A
G

LP
T

R
P
R

MSP,
SNCP,
SNCM
P, and
SNCTP

ATM
Protecti
on

R1EFT
4

N1EFT
8

N1EFT
8A

N1EGT
2

N2EGT
2

N1EFS
0

N2EFS
0

N4EFS
0

N5EFS
0

N1EFS
0A

N1EFS
4

N2EFS
4

N3EFS
4

N2EGS
2

N3EGS
2

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Board

26 Board Information Quick Reference

Protection Scheme
LCAS

STP/
RSTP

TP
S
Pro
tect
ion

B
PS
Pr
ot
ec
tio
n

PP
S
Pr
ot
ect
io
n

L
A
G

D
L
A
G

LP
T

R
P
R

MSP,
SNCP,
SNCM
P, and
SNCTP

ATM
Protecti
on

N1EMS
4

N1EMS
2

N1EGS
4

N3EGS
4

N4EGS
4

N2EGR
2

N2EMR
0

N1EAS
2

N1ADL
4

N1ADQ
1

N1IDL4

N1IDQ
1

N1MST
4

N1VST
4

Table 26-28 lists the protection schemes that the microwave boards of the OptiX OSN equipment
support.

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26 Board Information Quick Reference

Table 26-28 Protection schemes that the microwave boards of the OptiX OSN equipment
support
Board

Protection schemes
1+1 HSB/FD/SD Protection

N+1 Protection

N1IFSD1

N1RPWR

Table 26-29 lists the protection schemes that the packet boards of the OptiX OSN equipment
support.
Table 26-29 Protection schemes that the packet boards of the OptiX OSN equipment support
Board

Protection Scheme
MPLS
Tunnel
1+1/1:1
Protecti
on

Packetbased
linear
MSP

LPT

LAG

MPLS
PW 1
+1/1:1

MC-LAG

N1PEX1

N2PEX1

N1PEX2

N1PEG16

N1PEG8

TNN1EG8

TNN1EX2

N1PETF8

N1PEFF8

TNN1ETMC

R1PEFS8

R1PEF4F

R1PEGS1

Q1PEGS2

TNN1EFF8

Table 26-30 lists the protection schemes that the dual-domain boards of the OptiX OSN
equipment support.
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26 Board Information Quick Reference

Table 26-30 Protection schemes that the dual-domain boards of the OptiX OSN equipment
support
Board

Protection Scheme
SDH Protection

N1ED
Q41

Packet
Protection

Twofiber
MSP
ring

Fourfiber
MSP
ring

Linear
MSP

SNCP

SNCM
P

SNCT
P

LAG

MCLAG

26.6 Quick Reference of Power Consumption and Weight of


Each Board
This section lists the power consumption and weight of each board of the OptiX OSN series
equipment.
Table 26-31 lists the power consumption and weight of each board.
Table 26-31 Power consumption and weight of each board
Board

Power
Consumption
(W)

Weight
(kg)

Board

Power
Consumption
(W)

Weight
(kg)

SDH boards
N1SLQ41

12

0.6

N1SLD4

17

0.6

N1SF64A

33(the OptiX
OSN 3500
supports)

1.1

N2SLD4

15

1.0

1.1

R1SLD4

11

0.5

1.1

N1SL4A

17

0.6

26(the OptiX
OSN 7500
supports)
N1SF64

33(the OptiX
OSN 3500
supports)
26(the OptiX
OSN 7500
supports)

N1SL64A

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26 Board Information Quick Reference

Board

Power
Consumption
(W)

Weight
(kg)

Board

Power
Consumption
(W)

Weight
(kg)

N1SL64

30(the OptiX
OSN 3500
supports)

1.1

N1SL4

17

0.6

22(the OptiX
OSN 7500
supports)
N2SL64

32

1.1

N2SL4

15

1.0

T2SL64

40

1.1

R1SL4

10

0.5

N1SF16

26

1.1

R3SL4

11

0.5

N1SLO16

38

1.0

N1SEP1

17

1.0

N1SLQ16

20

0.9

N1SLH1

27

1.0

N2SLQ16

35

1.3

N1SLT1

22

1.3

N1SLD16

23

0.9

N2SLO1

26

1.1

N1SL16A

20

0.6

N3SLO1

20

1.2

N2SL16A

20

1.1

N1SLQ1A

15

1.0

N3SL16A

22

0.9

N1SLQ1

15

1.0

N1SL16

19

1.1

N2SLQ1

15

1.0

N2SL16

19

1.1

R1SLQ1

12

0.4

N3SL16

22

1.1

N1SL1A

17

0.6

N1SLQ4A

17

1.0

N1SL1

17

0.6

N1SLQ4

17

1.0

N2SL1

14

1.0

N2SLQ4

16

1.0

R1SL1

10

0.3

N1SLD4A

17

0.6

R3SL1

11

0.3

T2SL64A

40

1.1

N3SLQ41

16

0.7

N1EU08

11

0.4

N1EU04

0.4

N1OU08

0.4

N2OU08

0.4

N3SLH41

49

1.5

N1SLD64

41

1.2

N4SL64

15(the OptiX
OSN 3500
supports)

1.1

14(the OptiX
OSN 7500
supports)
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Board

Power
Consumption
(W)

26 Board Information Quick Reference

Weight
(kg)

Board

Power
Consumption
(W)

Weight
(kg)

PDH boards
N1SPQ4

24

0.9

N2PL3

12

0.9

N2SPQ4

24

0.9

N1PQM

22

1.0

N1DXA

10

0.8

N1PQ1

19

1.0

N1DX1

15

1.0

N2PQ1

13

1.0

N1PQ3

13

0.9

R1PD1

15

0.6

N1PD3

19

1.1

R2PD1

15

0.6

N2PD3

12

1.1

R3PD1

0.4

N1PL3A

15

1.0

N1PL1

0.5

N2PL3A

12

0.9

R1PL1

0.5

N1PL3

15

1.0

N2PQ3

13

0.9

N1DM12

0.4

N1TSB8

0.3

N1TSB4

0.3

N1MU04

0.4

N1C34S

0.3

R1L12S

0.3

N1D34S

0.4

N1D12B

0.3

N1D75S

0.4

N1L75S

0.3

N1D12S

0.4

N1PFL1

17

Data boards (TDM mode)

Issue 03 (2013-02-20)

N1MST4

26

0.9

N2EFS4

30

1.0

N1IDQ1

41

1.0

N3EFS4

18

0.6

N1IDL4

41

1.0

N1EFS0A

32

0.7

N1ADQ1

41

1.0

N1EFS0

35

1.0

N1ADL4

41

0.9

N2EFS0

35

1.0

N1EAS2

70

1.2

N4EFS0

35

1.0

N1EMR0

47

1.2

N5EFS0

22

0.6

N2EGR2

40

1.1

N1EGT2

29

0.9

N1EGS4A

53

1.1

N2EGT2

15

0.9

N1EGS4

70

1.1

N1EFT8A

26

1.0

N3EGS4

70

1.1

N1EFT8

26

1.0

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26 Board Information Quick Reference

Board

Power
Consumption
(W)

Weight
(kg)

Board

Power
Consumption
(W)

Weight
(kg)

N4EGS4

34

0.7

N1EFT4

14

0.5

N1EMS4

65

1.1

N1EFT8

26

1.0

N1EMS2

40

0.8

N1EFT4

14

0.5

N2EGS2

43

1.0

R1EFT4

14

0.5

N3EGS2

25

0.6

N2EMR0

50

1.2

N1EFS4

30

1.0

N1ETF8A

11

0.4

N1ETS8

0.4

N1EFF8A

15

0.4

N1EFF8

0.4

N1ETF8

0.4

N1IDL4A

46

1.5

N1VST4

37

0.8

Packet boards
R1PEFS8

12

0.3

N1PETF8

0.4

Q1PEGS2

0.6

N1PEG16

137

2.3

R1PEGS1

0.4

N1PEX1

107

2.4

N1PEG8

47

1.2

N1PEX2

49

1.4

N2PEX1

48

1.4

N1PEFF8

13

0.5

R1PEF4F

15

0.4

EoD Boards
N1EDQ41

70

1.0

CES boards

N1MD75

12

0.5

N1MD12

12

0.5

N1CQ1

10

0.5

R1ML1A/
B

16

0.4

45

1.4

Microwave boards
N1IFSD1

24

1.1

N1RPWR
WDM boards

Issue 03 (2013-02-20)

N1FIB

0.4

N1MR2B

1.0

N1MR2A

1.0

N1MR2

0.9

N1LWX

30

1.1

N1CMR4

0.9

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26 Board Information Quick Reference

Board

Power
Consumption
(W)

Weight
(kg)

Board

Power
Consumption
(W)

Weight
(kg)

N1MR4

0.9

N1CMR2

0.8

N1MR2C

1.0

Cross-Connect and system control boards


N1PSXCS

90

2.1

R1PCXLN

60

1.0

N2PSXCS
A

80

1.2

N3PSXCS
A

74

1.5

N1SXCSA

63

2.0

T1PSXCS
A

95

1.4

N4GSCC

19

1.0

Auxiliary boards
N1FANA

19

1.2

R1AMU

0.5

XE1FAN

16

1.5

R1AUX

19

1.0

XE3FAN

10

1.2

R2AUX

19

1.0

R1FAN

20

0.8

Q1AUX

10

0.5

Q1SEI

10

0.9

N1AUX

19

1.0

N1SEI

0.9

T1AUX

0.4

Q1SAP

20

0.7

T1EOW

13

0.5

Q2SAP

25

1.0

R1EOW

10

0.4

Optical amplifier boards and dispersion compensation boards


N1DCU

0.4

62COA

75

8.0

N2DCU

0.4

N1COA

10

3.5

N1RPC02

110

4.2

N1BPA

20

1.0

N1RPC01

70

4.0

N2BPA

11

1.2

61COA

10

3.5

N1BA2

20

1.0

TN11OBU
101

16

1.3

TN11OBU
102

18

1.3

TN12OBU
101

10

1.1

TN12OBU
103

11

1.1

1.2

Power interface boards


R1PIUA

Issue 03 (2013-02-20)

0.5

N1PIU

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26 Board Information Quick Reference

Board

Power
Consumption
(W)

Weight
(kg)

Board

Power
Consumption
(W)

Weight
(kg)

R1PIUB

0.4

Q2PIU

0.3

R1PIUC

0.5

Q1PIU

1.3

N1PIUA

0.5

R1PIU

0.4

N1PIUB

0.6

T1PIUB

0.5

T1PIU

1.3

UPM
(EPS75-48
15AF)

15

UPM
(EPS30-48
15AF)

10

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27

27 Parameter Settings

Parameter Settings

About This Chapter


You can set the parameters for the SDH boards, PDH boards, data boards, packet boards, WDM
boards, optical amplifier boards, and cross-connect and timing unit by using the U2000.
27.1 Packet Processing Boards
The parameters that need to be set for the packet boards include the working mode and maximum
frame length.
27.2 EoD Boards
The parameters that need to be set for the EoD boards include the SDH parameters and Ethernet
parameters.
27.3 Packet Interface Boards
The parameters that you need to set for packet interface boards include J0 byte, J1 byte, J2 byte,
C2 byte, V5 byte, SDH interfaces, PDH interfaces, and recovery value of idle timeslots.
27.4 Data Boards
The parameters that need to be set for the data boards include the SDH parameters, Ethernet
parameters, and ATM parameters.
27.5 SDH Processing Boards
The parameters that need to be set for the SDH processing boards include the J0 byte, J1 byte,
J2 byte, and C2 byte.
27.6 PDH Boards
The parameters that need to be set for the PDH boards include the J1 byte, C2 byte, J2 byte, V5
byte, and tributary loopback.
27.7 WDM Boards
The parameters that need to be set for the WDM boards include the path use status, optical
interface loopback, service type, client service bearer rate (M), laser status, automatic laser
shutdown, current bearer rate (M), actual wavelength no./wavelength (nm)/frequency (THz),
actual band type, configure wavelength no./wavelength (nm)/frequency (THz), configure band
type, and SD trigger condition.
27.8 Cross-Connect and Timing Units
The parameters that need to be set for the cross-connect and timing units include the clock source
parameters and clock subnet parameters.
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27 Parameter Settings

27.9 Optical Amplifier Boards


The parameters that need to be set for the optical amplifier boards include the laser status, board
work type, configure band, configure working band parity, actual band, actual working band
parity, threshold of input power loss, gain, rated optical power, nominal gain upper threshold,
and nominal gain lower threshold.

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27 Parameter Settings

27.1 Packet Processing Boards


The parameters that need to be set for the packet boards include the working mode and maximum
frame length.

27.1.1 General Attributes


This topic describes the parameters for configuring the general attributes of an Ethernet port.
The parameters include Port Mode, Enable Port, and Encapsulation Type.
Table 27-1 lists the parameters for configuring the general attributes of an Ethernet port.
Table 27-1 Parameters for configuring the general attributes of an Ethernet port
Field

Value

Description

Port

For example, 21-N1PETF8-1


(Port-1)

Indicates the port name.

Name

For example, Port1

User-defines a port name.

Enable Port

Enabled, Disabled.

The Enable Port parameter


sets whether the Ethernet port
is usable.

Default: Enabled

Click Enable Port(Ethernet


Interface) for more
information.
Layer 2, Layer 3

Port Mode

Selects the working mode of


the Ethernet port.
Layer 2: The port can access
the user-side equipment or
carry Ethernet services that
use the port exclusively.
Layer 3: The port can carry
tunnels.

Encapsulation Type

Null, 802.1Q, QinQ


Default: For details, see
configuration guidelines.

The Encapsulation Type


parameter sets the link layer
encapsulation type of the
port, and specifies the link
layer encapsulation type that
can be identified by this port.
Click Encapsulation Type
(Ethernet Interface) for more
information.

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27 Parameter Settings

Field

Value

Description

Working Mode

10M Half-Duplex, 10M FullDuplex, Auto-Negotiation,


100M Half-Duplex, 100M
Full-Duplex, 1000M FullDuplex, 10G Full-Duplex
LAN, 10G Full-Duplex
WAN

Set the Working Mode


parameter to set the working
mode of the Ethernet port on
the board. The Working
Mode parameter indicates
the maximum transmission
rate and communication
mode of a port.

Default: Auto-Negotiation

CAUTION
When configuring a service, set
Working Mode to the same
value if possible for the port and
its interconnected port.
Otherwise, the service may fail.

Click Working Mode


(Ethernet Interface) for more
information.
Max Frame Length (byte)

For OptiX OSN 3500/7500:


960 to 9600
For other products: 960 to
9000
Default: 1620

The maximum frame length


is also the maximum
transport unit (MTU).
Click Max Frame Length
(byte) for an Ethernet Port for
more information.

27.1.2 Flow Control


This topic describes the parameters, such as autonegotiation and non-autonegotiation, which are
used for configuring flow control function of an Ethernet port.
Table 27-2 lists the parameters for configuring flow control of an Ethernet port.
Table 27-2 Parameters for configuring flow control of an Ethernet port
Field

Value Range

Description

Port

PORTn

Displays all the available


MAC ports on an Ethernet
board.
Specifies the PORT port. The
letter n indicates the number of
the PORT port.

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Field

Value Range

Description

Non-Autonegotiation
Flow Control Mode

Disabled, Enable Symmetric


Flow Control, Send Only,
Receive Only
Default value: Disable

The Non-Autonegotiation
Flow Control Mode
(Ethernet Port Attribute)
specifies the flow control
mode adopted when an
Ethernet port works in nonauto-negotiation mode.
Click Non-Autonegotiation
Flow Control Mode (Ethernet
Port Attribute) for more
information.

Autonegotiation Flow
Control Mode

The value ranges of the


parameters are different from
each other for different boards
and products. You can click
the hyperlink in the
description to display the
specific information.

The Autonegotiation Flow


Control Mode (Ethernet
Port Attribute) specifies the
flow control mode adopted
when an Ethernet port works in
auto-negotiation mode.
The N1EMS4 and N1EGS4
boards do not support the
autonegotiation traffic control
attribute.
Click Autonegotiation Flow
Control Mode (Ethernet Port
Attribute) for more
information.

27.1.3 Layer 2 Attributes


This topic describes the parameters for configuring the Layer 2 attributes of an Ethernet port.
The parameters include QinQ Type Domain, Tag, Default VLAN ID, and VLAN Priority
Table 27-3 lists the parameters for configuring the Layer 2 attributes of an Ethernet port.
Table 27-3 Parameters for configuring the Layer 2 attributes of an Ethernet port

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Field

Value

Description

Port

For example, 21-N1PETF8-1


(Port-1)

Displays the port name.

QinQ Type Domain

0x0600 to 0xFFFE

Sets the QinQ type domain.

NOTE
For the PEG8, PEX2, PEX1,
and EDQ41, this parameter can
be set only to 0x88A8.

This parameter is available


only when you set
Encapsulation Type in
General Attributes to
QinQ.

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Field

Value

Description

Tag

Tag Aware, Access, Hybrid

Indicates which type of


packets can be processed.
Tag Aware: The port
transparently transmits the
packet with a VLAN ID
(tagged). If a packet does not
have a VLAN ID (untagged),
the port discards this packet.
In this case, Default VLAN
ID and VLAN Priority are
meaningless.
Access: The port adds the
default VLAN ID to the
packet without any VLAN ID
(untagged). If the packet has
a VLAN ID (tagged), the port
discards this packet.
Hybrid: The port adds the
default VLAN ID to the
packet without any VLAN ID
(untagged). If the packet has
a VLAN ID (tagged), the port
transparently transmits the
packet.
This parameter is unavailable
when you set Encapsulation
Type in General Attributes
to QinQ.

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27 Parameter Settings

Field

Value

Description

Default VLAN ID

1 to 4094

Sets the default VLAN ID of


packets that passes through
the port.
When you set Tag to
Access, packets that have a
VLAN ID the same as the
default VLAN ID are
discarded, and packets
without a VLAN are tagged
with the default VLAN ID
and then pass the port.
When you set Tag to
Hybrid, tagged packets are
allowed to pass, and
untagged packets are tagged
with the default VLAN ID
and then pass the port.
NOTE
If an MPLS tunnel needs to
traverse a Layer 2 network, set
the VLAN IDs for the tunnels
connected to the NNI ports at
both ends to the same value
according to the VLAN
planning requirements on the
Layer 2 network.

VLAN Priority

0 to 7

Sets the QoS level. When the


network is busy, packets of a
higher VLAN priority are
processed first and those of a
lower VLAN priority may be
discarded. 0 indicates the
lowest priority and 7 the
highest.

27.1.4 Layer 3 Attributes


This topic describes the parameters for configuring the Layer 3 attributes of an Ethernet port.
The parameters include Enable Tunnel, Specify IP, IP Address, and IP Mask
Table 27-4 lists the parameters for configuring the Layer 3 attributes of an Ethernet port.
Table 27-4 Parameters for configuring the Layer 3 attributes of an Ethernet port

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Field

Value

Description

Port

For example, 21-N1PETF8-1


(Port-1)

Displays the port name.

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Field

Value

Description

Enable Tunnel

Enabled, Disabled

The Enable Tunnel


(Ethernet Interface)
parameter sets the MPLS
enabling state of the port.
When Enable Tunnel is set
to Enabled, it indicates that
the port can identify and
process the MPLS label.

Default: Enabled

Click Enable Tunnel


(Ethernet Interface)for more
information.
Manually, Unspecified

Specify IP

Default: Unspecified

The Specify IP parameter,


set by port, indicates the
method of specifying the IP
address parameter of a
specified port.
Click Specify IP(Ethernet
Interface) for more
information.

IP Address

For example, 192.168.0.1

Sets the IP address for the


port.

IP Mask

For example, 255.255.255.0

Sets the subnet mask of the


port.

27.1.5 Advanced Attributes


This topic describes the parameters for configuring the advanced attributes of an Ethernet port.
The parameters include Port Physical parameters, MAC Loopback, and Loopback Check
Table 27-5 lists the parameters for configuring the advanced attributes of an Ethernet port.
Table 27-5 Parameters for configuring the advanced attributes of an Ethernet port

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Field

Value

Description

Port

For example, 21-N1PETF8-1


(Port-1)

Displays the port name.

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27 Parameter Settings

Field

Value

Description

Port Physical parameters

For example:

Displays physical parameters


of the port.

l Port Enable: Enabled


l Working Mode: AutoNegotiation
l Non-Autonegotiation
Flow Control Mode:
Disabled
l MAC Loopback: NonLoopback
l PHY Loopback: NonLoopback
MAC Loopback

Non-Loopback, Inloop,
Outloop

Sets the loopback state of the


MAC layer.

PHY Loopback

Non-Loopback, Inloop,
Outloop

The PHY Loopback


parameter indicates the
loopback status of the
physical layer of an Ethernet
port. This parameter is an
advanced attribute of the
Ethernet port.

Default: Non-Loopback

Click PHY Loopback


(Ethernet Interface) for more
information.
For example,
00-5A-3D-03-4C-1B

MAC Address

Displays the MAC address of


the port.

Default: FF-FF-FF-FF-FFFF
Transmitting Rate(kbit/s)

For example, 1024

Displays the rate at which


packets are transmitted.

Receiving Rate(kbit/s)

For example, 1024

Displays the rate at which


packets are received.

Loopback Check

Enabled, Disabled

Sets loop detection.

Default: Disabled

When this function is


enabled, the equipment
automatically checks
whether a loop is generated
on the link. If a loop is
generated, the related alarm
is reported.
Currently, the OptiX OSN
equipment does not support
this function.

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27 Parameter Settings

Field

Value

Description

Loopback Port Block

Enabled, Disabled

Sets the automatic shutdown


of the port.

Default: Disabled

When Loopback Check is


set to Enabled and
Loopback Port Block is set
to Enabled, the equipment
automatically checks
whether a loop is generated
on the link. If a loop is
generated, the port is
automatically shut down to
release the loop.

27.2 EoD Boards


The parameters that need to be set for the EoD boards include the SDH parameters and Ethernet
parameters.

SDH Parameters
l

J0

J1

J2

C2

For the description of the parameter, see 27.5 SDH Processing Boards.

Packet Data Parameters


l

Ethernet interface

For the description of the parameter, see 27.1 Packet Processing Boards.

EoS Parameters
l

Working mode

Maximum frame length

For more parameters and the description of the parameters, see 27.4.2 Ethernet Parameters.

27.3 Packet Interface Boards


The parameters that you need to set for packet interface boards include J0 byte, J1 byte, J2 byte,
C2 byte, V5 byte, SDH interfaces, PDH interfaces, and recovery value of idle timeslots.

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27 Parameter Settings

27.3.1 SDH Parameters


The SDH parameters that need to be set for the data boards include the J1 byte, C2 byte, J2 byte,
and V5 byte.

J1 Byte
J1 is the path trace byte. Successive transmission of the J1 byte at the transmit end helps the
receive end learn that its connection with the specified transmit end is in the continuous
connection state.
When a J1 mismatch is detected at the receive end, the VC-3 path generates an LP_TIM_VC3
alarm and the VC-4 path generates an HP_TIM alarm.
When the J1 byte to be sent is set to the single-byte "" by default, the alarms are not reported.
NOTE

l In the case of the N1EFS4/MST4/EAS2, the J1 byte to be sent is set to " HuaWei SBS " by default.
In the case of the other boards, the J1 byte to be sent is set to the single-byte "" by default.
l In the case of the EMS4/EGS4, it is recommended that you set the J1 byte to be sent to " HuaWei
SBS ".

C2 Byte
C2 is the signal label byte, which is used to indicate the multiplexing structure of the VC frames
and the payload property. The C2 byte to be sent must match the C2 byte to be received.
When a C2 mismatch is detected, the VC-3 path generates an LP_SLM_VC3 alarm and the
VC-4 path generates an HP_SLM alarm.

J2 Byte
J2 is the VC-12 path trace byte. This byte is used to transmit repetitively a low order path access
point identifier so that a path receiving terminal can verify its continued connection to the
intended transmitter.
When a J2 mismatch is detected, the VC-12 path generates an LP_TIM_VC12 alarm.
When the J2 byte is set to the single-byte "" by default, the alarms are not reported.

V5 Byte
V5 is the path status and signal label byte. This byte is used to detect bit errors and indicate
remote errors or remote failures on lower order paths. The LP_REI and LP_RFI alarms are
generated accordingly.
When a V5 mismatch is detected at the receive end, the VC-12 path generates an LP_SLM_VC12
alarm.
Table 27-6 shows the relationship between the service type and the value of the V5 byte.

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Table 27-6 relationship between the service type and the value of the V5 byte
Service Type

Value of the V5 Byte (Hexadecimal)

Unequipped or supervisory-unequipped

00

Equipped-non-specific payload

01

Asynchronous

02

Bit synchronization

03

Byte synchronization

04

Retained signal flag

05

O.181 test signal

06

VC-AIS

07

Other mapping (For test)

08

ATM mapping

09

HDLC/PPP mapping

0A

HDLC/LAPS mapping

0B

Virtual connection test signal (O.181


special mapping)

0C

GFP mapping

0D

27.3.2 Channelized STM-1 Port


Configuring a channelized STM-1 port includes setting of the parameters such as the
encapsulation type of the port, the maximum data packet size, and the enabling status of the
laser.
Table 27-7 Parameters for the attributes of an SDH port

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Field

Value Range

Description

Port

For example, 21-CQ1-1


(PORT-1)

Displays the port name.

Name

For example, port1

Specifies the name of the port


specified by the user.

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27 Parameter Settings

Field

Value Range

Description

Port Mode

Layer 1

Displays the working mode


of the CES port Layer 1
indicates the channelized
STM port is currently
available.
The OptiX OSN equipment
currently supports only
Layer 1 in Port Mode. In
this case, the OptiX OSN
equipment can transmit
channelized STM-1 services.

Encapsulation Type

Null

Indicates the link layer


encapsulation type of the
port. It specifies the link layer
encapsulation type that can
be identified and processed
by the port.
When Encapsulation Type
is set to Null, no link layer
encapsulation is available or
the link layer encapsulation is
not performed.
The OptiX OSN equipment
currently supports only
Layer 1 in Port Mode. For
this reason, Encapsulation
Type can only be set to Null
and cannot be changed.

No

Channelize

Displays whether the port is a


channelized port.
Channelize refers to the use
of the low-speed tributary
signals in the STM-N service.
One fiber is used to transmit
multiple channels of data that
are separated from each
other. Each channel of data
exclusively occupies the
bandwidth, in addition to the
starting point, terminating
point, and monitoring policy.

Max Data Packet Size (byte)

Specifies the maximum size


of the packets that can be
received by the port.
This parameter is currently
inapplicable to the OptiX
OSN equipment.

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27 Parameter Settings

Field

Value Range

Description

Laser Interface Enabling


Status

On, Off

Specifies the enabling status


of the laser on the port.

Default: On

Laser Transmission Distance (m)

Displays the transmission


distance of the laser on the
port.
This parameter is currently
inapplicable to the OptiX
OSN equipment.

Scrambling Capability

Suppresses multiple 0s and


1s in the data when the
Scrambling Capability is
enabled.
This parameter is currently
inapplicable to the OptiX
OSN equipment.

CRC Check Length

Specifies the length of the


CRC field in the mapping
protocol.
This parameter is currently
inapplicable to the OptiX
OSN equipment.

Clock Mode

The Clock Mode parameter


specifies the re-timing mode
of a port.
NOTE
This parameter is currently
inapplicable to an SDH port.

Loopback Mode

Issue 03 (2013-02-20)

Non-loopback, Inloop,
Outloop

Specifies the loopback status


of the port.

Default: Non-loopback

The loopback mode is used


for locating a fault. Outloop
is used for testing whether the
port module and external
fiber or cable of a board are
proper. Inloop is used for
testing whether the crossconnect unit and service path
of the equipment are proper.

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27 Parameter Settings

Field

Value Range

Description

CES Encapsulation Clock


Mode

Null, Line Clock Mode,


System Clock Mode

Specifies the encapsulation


mode of the clock signal on a
UNI port on the master side
of the CES service.

Default: Null

l Null: The clock signal is


not encapsulated in the
service packets.
l Line Clock Mode: The
clock frequency signal
extracted on a line port is
used as the time stamp,
which is encapsulated in
the RTP packet header
and transmitted to the
downstream.
l System Clock Mode:
The system frequency
signal is used as the time
stamp, which is
encapsulated in the RTP
packet header and
transmitted to the
downstream.
CES Encapsulation Clock
Poke

Specifies the enabling status


of the CES encapsulation
clock poke.
This parameter is currently
inapplicable to the OptiX
OSN equipment.

Table 27-8 Parameters for an associated service


Field

Value Range

Description

Service Type

For example, CES service

Displays the type of the


service associated with the
port.

Service ID

For example, 20

Displays the ID of the service


associated with the port.
When you select the value of
the service ID, the active
window changes to the
service management dialog
box of the corresponding
service type.

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Field

Value Range

Description

Service Name

For example, CES

Displays the name of the


service associated with the
port.

Used Resource

For example, 64K


Timeslot1-31

Displays the resource used by


the service associated with
the port.

27.3.3 E1 Port
In addition to the general attributes of an E1 port, you need to set the frame format based on the
advanced attributes to ensure that the frame format specified for the E1 port is the same as the
service encapsulation format.
Table 27-9 Parameters for the general attributes of a PDH port
Field

Value Range

Description

Port

Slot ID-Board name-Port


(Port No.)

Displays the port name.

Name

For example, Port 1

Enters the port name


specified by the user.

Port Mode

Layer 1, Layer 2, Layer 3

Specifies the working mode


of the PDH port.

NOTE
For the OptiX OSN equipment,
Port Mode can be set to only
Layer 1.

Encapsulation Type

Null

When this parameter is set to


Layer 1, the port can transmit
TDM signals.
Specifies Encapsulation
Type.
When Port Mode is set to
Layer 1, Encapsulation
Type is defaulted to Null and
cannot be changed.

Max Data Packet Size (byte)

Specifies the maximum size


of the packets.
NOTE
This parameter is not applicable
to an E1 port in the CES service.

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Table 27-10 Parameters for the advanced attributes of a PDH port


Field

Value Range

Description

Port

Slot ID-Board name-Port


(Port No.)

Displays the port name.

Frame Format

Unframe, Double Frame,


CRC-4 Multiframe

Specifies the frame format.

Line Encoding Format

HDB3

When the E1 port transmits


CES services in CESoPSN
mode, this parameter can be
set to Double Frame or
CRC-4 Multiframe. It is
recommended that you set
this parameter to CRC-4
Multiframe. When the CES
services are in SAToP mode,
this parameter needs to be set
to Unframe.
Displays the line encoding
format.
The HDB3 codes are
transmitted on the E1 port.

Clock Mode

Master Mode, Slave Mode,


Line Clock Mode
Default: Master Mode

The Clock Mode parameter


specifies the re-timing mode
of a port.
Click Clock Mode for more
information.

Loopback Mode

Non-loopback, Inloop,
Outloop

Specifies the loopback status


of the port.

Impedance

75 ohm, 120 ohm

Displays the impedance of


the port.

NOTE
When the OptiX OSN
3500/7500 uses the N1MD75
board, Impedance is set to 75
ohm and cannot be changed.
When the N1MD12 board is
used, Impedance is set to 120
ohm and cannot be changed.

Frame Mode

Specifies the value of the


frame mode.
The frame modes of the local
port and opposite port need to
be consistent.
NOTE
This parameter is not applicable
to an E1 port in the CES service.

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27 Parameter Settings

Field

Value Range

Description

CES Encapsulation Clock


Mode

Null, Line Clock Mode,


System Clock Mode

Queries the encapsulation


mode of the clock signal on a
UNI port on the master side
of the CES service.

Default: Null

l Null: The clock signal is


not encapsulated in the
service packets.
l Line Clock Mode: The
clock frequency signal
extracted on a line port is
used as the time stamp,
which is encapsulated in
the RTP packet header
and transmitted to the
downstream.
l System Clock Mode:
The system frequency
signal is used as the time
stamp, which is
encapsulated in the RTP
packet header and
transmitted to the
downstream.
CES Encapsulation Clock
Poke

Queries the encapsulation


time stamp in the CES
service.
NOTE
This parameter is not applicable
to an E1 port in the CES service.

Idle Timeslot Recovery


Value

Queries the recovery value of


an idle timeslot in the CES
service.
NOTE
This parameter is not applicable
to an E1 port in the CES service.

Table 27-11 Parameters for an associated service

Issue 03 (2013-02-20)

Field

Value Range

Description

Service Type

For example, CES service

Displays the type of the


service associated with the
port.

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Field

Value Range

Description

Service ID

For example, 20

Displays the ID of the service


associated with the port.
When you select the value of
the service ID, the active
window changes to the
service management dialog
box of the corresponding
service type.

Service Name

For example, CES

Displays the name of the


service associated with the
port.

Used Resource

For example, 64K


Timeslot1-31

Displays the resource used by


the service associated with
the port.

27.4 Data Boards


The parameters that need to be set for the data boards include the SDH parameters, Ethernet
parameters, and ATM parameters.

27.4.1 SDH Parameters


The SDH parameters that need to be set for the data boards include the J1 byte, C2 byte, J2 byte,
and V5 byte.

J1 Byte
J1 is the path trace byte. Successive transmission of the J1 byte at the transmit end helps the
receive end learn that its connection with the specified transmit end is in the continuous
connection state.
When a J1 mismatch is detected at the receive end, the VC-3 path generates an LP_TIM_VC3
alarm and the VC-4 path generates an HP_TIM alarm.
When the J1 byte to be sent is set to the single-byte "" by default, the alarms are not reported.
NOTE

l In the case of the N1EFS4/MST4/EAS2, the J1 byte to be sent is set to " HuaWei SBS " by default.
In the case of the other boards, the J1 byte to be sent is set to the single-byte "" by default.
l In the case of the EMS4/EGS4, it is recommended that you set the J1 byte to be sent to " HuaWei
SBS ".

C2 Byte
C2 is the signal label byte, which is used to indicate the multiplexing structure of the VC frames
and the payload property. The C2 byte to be sent must match the C2 byte to be received.
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When a C2 mismatch is detected, the VC-3 path generates an LP_SLM_VC3 alarm and the
VC-4 path generates an HP_SLM alarm.

J2 Byte
J2 is the VC-12 path trace byte. This byte is used to transmit repetitively a low order path access
point identifier so that a path receiving terminal can verify its continued connection to the
intended transmitter.
When a J2 mismatch is detected, the VC-12 path generates an LP_TIM_VC12 alarm.
When the J2 byte is set to the single-byte "" by default, the alarms are not reported.

V5 Byte
V5 is the path status and signal label byte. This byte is used to detect bit errors and indicate
remote errors or remote failures on lower order paths. The LP_REI and LP_RFI alarms are
generated accordingly.
When a V5 mismatch is detected at the receive end, the VC-12 path generates an LP_SLM_VC12
alarm.
Table 27-12 shows the relationship between the service type and the value of the V5 byte.
Table 27-12 relationship between the service type and the value of the V5 byte

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Service Type

Value of the V5 Byte (Hexadecimal)

Unequipped or supervisory-unequipped

00

Equipped-non-specific payload

01

Asynchronous

02

Bit synchronization

03

Byte synchronization

04

Retained signal flag

05

O.181 test signal

06

VC-AIS

07

Other mapping (For test)

08

ATM mapping

09

HDLC/PPP mapping

0A

HDLC/LAPS mapping

0B

Virtual connection test signal (O.181


special mapping)

0C

GFP mapping

0D

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27.4.2 Ethernet Parameters


The Ethernet parameters that need to be set for the data boards include the working mode and
Maximum Frame Length.

27.4.2.1 Basic Attributes


This topic describes the parameters, such as the port attribute, port enabling status, and maximum
frame length, for configuring the basic attributes of an Ethernet port.
Table 27-13 lists the parameters for configuring the basic attributes of an Ethernet port.
Table 27-13 Parameters for configuring the basic attributes of an Ethernet port
Field

Value Range

Description

Port

PORTn

Displays all the available ports


on an Ethernet port. The letter
n indicates the number of the
PORT port.

Name

For example, PORT-1

Specifies the name of a PORT


port. The name can contain up
to 32 characters in English or
16 characters in Chinese.

Enable Port

Disabled, Enabled

"Enabled" indicates that this


port is used and services are
available. "Disabled" indicates
that the services on this port are
not processed. Hence, when
configuring a service, you need
to enable the port to be used.

Default value: Disabled

Click Enable Port (Ethernet


Port Attribute) for more
information.
Working Mode

Issue 03 (2013-02-20)

Auto-Negotiation, 10M HalfDuplex, 10M Full-Duplex,


100M Half-Duplex, 100M
Full-Duplex, 1000M HalfDuplex, 1000M Full-Duplex,
10GE Full-Duplex LAN,
10GE Full-Duplex WAN

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Specifies the working mode of


the Ethernet port on a board.
This parameter determines the
maximum transmission rate
and communication mode of
the Ethernet port.
When setting this parameter,
you must ensure the working
modes of the interconnected
ports are the same. Otherwise,
the services are not available.

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Field

Value Range

Description

Max. Frame Length

The value ranges of the


parameters are different from
each other for different boards
and products. You can click
the hyperlink in the
description to display the
specific information.

The Max. Frame Length


(Ethernet Port Attribute)
parameter specifies the
maximum frame length that is
supported at an Ethernet port.
Click Max. Frame Length
(Ethernet Port Attribute) for
more information.

MAC Loopback

Non-Loopback, Inloop

The MAC Loopback


(Ethernet Port Attribute)
parameter specifies the MAC
loopback state at an Ethernet
port. Port loopback setting is
applied to locating faults only.
Click MAC Loopback
(Ethernet Port Attribute) for
more information.

Default value: Non-Loopback

PHY Loopback

Non-Loopback, Inloop
Default value: Non-Loopback

Logic Type

SDH-OPPORT, SDH-EPORT

The PHY Loopback


(Ethernet Port Attribute)
parameter specifies the PHY
loopback state at an Ethernet
port. Port loopback setting is
applied to locating faults only.
Click PHY Loopback
(Ethernet Port Attribute) for
more information.
Displays the logic type of port.

27.4.2.2 Flow Control


This topic describes the parameters, such as autonegotiation and non-autonegotiation, which are
used for configuring flow control function of an Ethernet port.
Table 27-14 lists the parameters for configuring flow control of an Ethernet port.
Table 27-14 Parameters for configuring flow control of an Ethernet port
Field

Value Range

Description

Port

PORTn

Displays all the available


MAC ports on an Ethernet
board.
Specifies the PORT port. The
letter n indicates the number of
the PORT port.

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Field

Value Range

Description

Non-Autonegotiation
Flow Control Mode

Disabled, Enable Symmetric


Flow Control, Send Only,
Receive Only
Default value: Disable

The Non-Autonegotiation
Flow Control Mode
(Ethernet Port Attribute)
specifies the flow control
mode adopted when an
Ethernet port works in nonauto-negotiation mode.
Click Non-Autonegotiation
Flow Control Mode (Ethernet
Port Attribute) for more
information.

Autonegotiation Flow
Control Mode

The value ranges of the


parameters are different from
each other for different boards
and products. You can click
the hyperlink in the
description to display the
specific information.

The Autonegotiation Flow


Control Mode (Ethernet
Port Attribute) specifies the
flow control mode adopted
when an Ethernet port works in
auto-negotiation mode.
The N1EMS4 and N1EGS4
boards do not support the
autonegotiation traffic control
attribute.
Click Autonegotiation Flow
Control Mode (Ethernet Port
Attribute) for more
information.

27.4.2.3 Network Attributes


This topic describes the parameters, such as port attribute and P port encapsulation format, which
are used for configuring network attributes of an Ethernet port.
Table 27-15 lists the parameters for configuring network attributes of an Ethernet port.
Table 27-15 Parameters for configuring network attributes of an Ethernet port

Issue 03 (2013-02-20)

Field

Value Range

Description

Port

PORTn or VCTRUNKn

Specifies the PORT or


VCTRUNK port. The letter n
indicates the number of the
port.

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Field

Value Range

Description

Port Attribute

The value ranges of the


parameters are different from
each other for different boards
and products. You can click
the hyperlink in the
description to display the
specific information.

The Port Attribute (Ethernet


Port) parameter specifies the
position of a port in the
network. Different port
attributes support different
packets.

MartinioE, stack VLAN

Encapsulation Format of P
Port (Network Attributes)
indicates that the board
supports receiving of data
packets in the MPLS
encapsulation format and
normal Ethernet data packets.
The port needs to process
different types of packets in
different ways, so you need to
set the port to a PE port or a P
port. The PE port is not
configured with the
encapsulation format, while
the P port is configured with
the encapsulation format. The
P port indicates a port for
connecting the equipment of
the network provider, so the P
port receives data packets in
the MPLS encapsulation
format. You can set the packet
encapsulation format of the P
port by running the
configuration command.

Encapsulation Format of P
Port

Default value: MartinioE

Click Port Attribute (Ethernet


Port) for more information.

This parameter is not


supported by a board that
supports the QinQ function.
Click Encapsulation Format of
P Port (Network Attributes) for
more information.

27.4.2.4 Advanced Attributes


This topic describes the parameters, such as the loop detection, loop port shutdown, and traffic
threshold (Mbit/s), which are used for configuring the advanced attributes of an Ethernet port.
Table 27-16 lists the parameters for configuring the advanced attributes of an Ethernet port.

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Table 27-16 Parameters for configuring the advanced attributes of an Ethernet port
Field

Value Range

Description

Port

PORTn or VCTRUNKn

Indicates the PORT or


VCTRUNK port. The letter
n indicates the number of
the PORT port.

Enabling Broadcast Packet


Suppression

Enabled, Disabled

The Enabling Broadcast


Packet Suppression
(Ethernet Interface
Attributes) parameter
specifies whether to enable
the function for a port to
suppress the broadcast
packets and to control the
traffic of the broadcast data
packets that enter the port.
If the broadcast packet
suppression function is
enabled, and if the
broadcast traffic exceeds
the specified threshold
value, the broadcast
packets that enter the port
are discarded.

Default value: Disabled

Click Enabling Broadcast


Packet Suppression
(Ethernet Interface
Attributes) for more
information.
Broadcast Packet Suppression
Threshold

1-10
Default value: 3

The Broadcast Packet


Suppression Threshold
(Ethernet Interface
Attributes) parameter
allocates the specified
bandwidth to the broadcast
packets. The bandwidth is
allocated on the basis of the
traffic proportion at the
port. If the bandwidth
allocated to the broadcast
packets reaches the
specified threshold, the port
discards the broadcast data
packets that are received.
Click Broadcast Packet
Suppression Threshold
(Ethernet Interface
Attributes) for more
information.

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Field

Value Range

Description

Traffic Threshold(Mpbs)

0-100 (FE), 0-1000 (GE), in


step length of 1

The Traffic Threshold


(Mpbs) (External
Ethernet Port Attribute)
parameter specifies the data
flow threshold at external
physical ports.

Default value: 100 (FE),


1000 (GE)

Click Traffic Threshold


(Mpbs)(External Ethernet
Port Attribute) for more
information.
Port Traffic Threshold Time
Window(Min)

1-30
Default value: 0

The Port Traffic


Threshold Time Window
(Min) parameter specifies
the duration for a
VCTRUNK or an IP port to
monitor the traffic after the
zero traffic monitoring
function of the port is
enabled.
Click Port Traffic
Threshold Time Window
(Min) for more
information.

Loop Detection

Enabled, Disabled
Default value: Disabled

The Loop Detection


(Ethernet Port Attribute)
parameter specifies the
function of reporting the
self-loop alarms after one
of the following loopback
cases is detected.
Click Loop Detection
(Ethernet Port Attribute)
for more information.

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Field

Value Range

Description

Loop Port Shutdown

Enabled, Disabled

The Loop Port Shutdown


(Ethernet Port Attribute)
parameter is set to disable
the self-loop port after a
self-loop port is detected if
the loop port shutdown
function is enabled. After
the self-loop port is shut
down, the self-loop port
only transmits or receives
the self-loop detection
packets rather than any
other packets. If the port is
not a self-loop port, it starts
to work again.

Default value: Enabled

Click Loop Port Shutdown


(Ethernet Port Attribute)
for more information.
Zero-Flow Monitor

Enabled, Disabled
Default value: Disabled

The Zero-Flow Monitor


parameter specifies
whether the traffic on a port
is monitored.
Click Zero-Flow Monitor
(Ethernet Interface
Attributes) for more
information.

Jumbo Frame Type

0 to 65535
Default value: 34928

The Jumbo Frame Type


parameter specifies the
value of the jumbo frame
type on an Ethernet port.
The jumbo frame indicates
the oversized Ethernet
frame, whose maximum
length is 65535 bytes. The
Ethernet service board
determines whether the
Ethernet frame is a jumbo
frame according to the
value of the jumbo frame
type.
Click Jumbo Frame Type
for more information.

DNI Status

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Enabled, Disabled

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Indicates whether to enable


the DNI status of the
VCTRUNK port on a data
board.

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27.4.2.5 TAG Attributes


Tag attributes are important attributes for configuring Ethernet services, including the
parameters such as the default VLAN ID, VLAN priority, ingress detection setting, and tag ID.
Table 27-17 lists the parameters for configuring the tag attributes of an Ethernet port.
Table 27-17 Parameters for configuring the tag attributes of an Ethernet port
Field

Value Range

Description

Port

PORTn or VCTRUNKn

Specifies the PORT or VCTRUNK


port. The letter n indicates the
number of the port.

Tag Identifier

Access, Tag Aware, Hybrid

The Tag Identifier parameter


indicates that the Ethernet port
supports IEEE 802.1Q Ethernet
packets that contain VLAN tags.
You can set three attributes to
differentiate the packets from each
other so that these packets can be
transmitted efficiently.

Default value: Tag Aware

Click Tag Identifier for more


information.
Default VLAN ID

1-4095
Default value: 1

Issue 03 (2013-02-20)

The Default VLAN ID (Ethernet


Port Attribute) parameter
specifies the default VLAN ID of
a port.
Click Default VLAN ID (Ethernet
Port Attribute) for more
information.

VLAN Priority

0-7
Default value: 0

The VLAN Priority (Ethernet


Port Attribute) parameter
specifies the priority of the default
VLAN ID of a port. It indicates the
priority of the service quality.
Click VLAN Priority (Ethernet
Port Attribute) for more
information.

Entry Detection

Enabled, Disabled
Default value: Enabled

The Entry Detection (Ethernet


Port Attribute) parameter
specifies whether to identify the
tag labels in the data packets.
Click Entry Detection (Ethernet
Port Attribute) for more
information.

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27.4.2.6 Encapsulation/Mapping
The equipment supports the setting of encapsulation and mapping protocols for Ethernet packets,
including the parameters such as mapping protocol, scrambling code, and CRC or not.
Table 27-18 lists the parameters for configuring the encapsulation and mapping of an Ethernet
port.
Table 27-18 Parameters for configuring the encapsulation and mapping of an Ethernet port
Field

Value Range

Description

Port

VCTRUNKn

Indicates the VCTRUNK


port. The letter n indicates the
number of the VCTRUNK
port.

Mapping Protocol

The value ranges of the


parameters are different from
each other for different
boards and products. You can
click the hyperlink in the
description to display the
specific information.

The Mapping Protocol


parameter specifies the
mapping protocol of the
VCTRUNK port.
Click Mapping Protocol for
more information.

Scramble

The value ranges of the


parameters are different from
each other for different
boards and products. You can
click the hyperlink in the
description to display the
specific information.

The Scramble parameter


specifies whether to scramble
the payload area of the
encapsulation protocol and
the scramble mode.
You can set this parameter
only when the mapping
protocol is GFP, HDLC, or
LAPS.
Click Scramble for more
information.

Set Inverse Value for CRC

Yes, No
Default value: Yes

The Set Inverse Value for


CRC parameter specifies
whether to set an inverse
value for the CRC field of the
HDLC or LAPS protocol.
You can set this parameter
only when the mapping
protocol is HDLC or LAPS.
Click Set Inverse Value for
CRC for more information.

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Field

Value Range

Description

Check Field Length

The value ranges of the


parameters are different from
each other for different
boards and products. You can
click the hyperlink in the
description to display the
specific information.

The Check Field Length


parameter specifies the length
of the CRC field of the
mapping protocol.
You can set this parameter
only when the mapping
protocol is GFP, HDLC, or
LAPS.
Click Check Field Length for
more information.

FCS Calculated Bit


Sequence

The value ranges of the


parameters are different from
each other for different
boards and products. You can
click the hyperlink in the
description to display the
specific information.

The FCS Calculated Bit


Sequence parameter
specifies the sequence of
storing the bits in the CRC
field of the mapping protocol.
You can set this parameter
only when the mapping
protocol is GFP, HDLC, or
LAPS.
Click FCS Calculated Bit
Sequence for more
information.

Extension Header Option

The value ranges of the


parameters are different from
each other for different
boards and products. You can
click the hyperlink in the
description to display the
specific information.

The Extension Header


Option parameter specifies
whether Mapping Protocol
of the GFP protocol supports
the extension header.
You can set this parameter
only when the mapping
protocol is GFP.
Click Extension Header
Option for more information.

27.4.2.7 Bound Paths


This topic describes the parameters, such as available resources, available timeslots, and service
direction, which are used for binding a path with an Ethernet port.
NOTE

The configured cross-connections must correspond to the bound bandwidth timeslots. Otherwise, the
services are unavailable.

Table 27-19 lists the parameters that are used for binding a path.

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Table 27-19 Parameters for binding paths


Field

Value Range

Description

Configurable Ports

For example, VCTRUNKn

Displays all the available


VCTRUNK ports on the
board.

Available Resources

For example, VC4-1

Displays all the available


VC-4s.

Available Timeslots

For example, VC12-1

Displays all the available


timeslots.

VCTRUNK Port

VCTRUNKn

Displays the number (n) of


the VCTRUNK port.

Level

For example, VC12-xv

Specifies the level of a path


that is bound with the
VCTRUNK.

Service Direction

Bidirectional, Uplink,
Downlink

Specifies the direction of the


Ethernet service.

Default value: Bidirectional


Bound Path

For example, VC4-1-VC12


(1-3)

Specifies the number of the


path to be bound, for
example, VC4-1-VC12(1-3).

Number of Bound Paths

Displays the number of


VCTRUNKs to be bound.

The Used Channel

For example, VC4-1-VC12


(1)

Displays the actually used


channel.

Activation Status

Active, Deactive

Displays whether the path is


active.

Display in Combination

If you select Display in


Combination, the bound
paths are displayed in a
centralized manner.
Otherwise, the bound paths
are displayed in a distributed
manner.

27.4.3 ATM Parameters


The ATM parameters that need to be set for the ATM boards include the port type and traffic
type.

Port Type
The port types include NNI and UNI. The default port type is UNI.
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Traffic Type
The traffic type must meet the requirements of the port.

Service Type
Five service types are available, namely, CBR, rt-VBR, nrt-VBR, UBR, and UBR+.

Peak Cell Rate


Set the peak cell rate of the ATM services. This parameter must be set for each service type.

Sustainable Cell Rate


Set the sustainable cell rate of the ATM services. In the case of the rt-VBR and nrt-VBR services,
set this parameter.

MBS
Set the MBS of the ATM services. In the case of the rt-VBR and nrt-VBR services, set this
parameter.

CDVT
Set the CDVT of the ATM services. In the case of the CBR, rt-VBR, and UBR services, set this
parameter.

27.5 SDH Processing Boards


The parameters that need to be set for the SDH processing boards include the J0 byte, J1 byte,
J2 byte, and C2 byte.

J0 Byte
The J0 byte is used to transmit repetitively a section access point identifier so that a section
receiver can verify its continued connection to the intended transmitter. It is recommended that
you set the J0 byte to the default value, namely, single-byte "Disabled".

J1 Byte
J1 is the higher order path trace byte. This byte is used to transmit repetitively a path access
point identifier so that a path receiving terminal can verify its continued connection to the
intended transmitter. When a J1 mismatch is detected at the receive end, the corresponding VC-4
path generates an HP_TIM alarm.
NOTE

Generally, the J1 byte retains the default. However, when Huawei equipment is interconnected with thirdparty equipment, the J1 byte must be set to the same value at both ends.

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J2 Byte
J2 is the lower order path trace byte. This byte is used to transmit repetitively a low order path
access point identifier so that a path receiving terminal can verify its continued connection to
the intended transmitter.
To set and query the J2 byte to be received, enable the lower order monitoring function.
NOTE

In the case of the SDH processing boards, the J2 byte to be sent cannot be set.

C2 Byte
C2 is the signal label byte, which is used to indicate the multiplexing structure of the VC frames
and the payload property. The C2 byte to be sent must match the C2 byte to be received. When
a C2 mismatch is detected, the corresponding VC-4 path at the local end generates an HP_SLM
alarm.
Table 27-20 shows the relationship between the service type and the value of the C2 byte.
Table 27-20 relationship between the service type and the value of the C2 byte
Service Type

Value of the C2 Byte (Hexadecimal)

TUG structure

02

34M/45M into C-3

04

140M into C-4

12

Unequipped

00

27.6 PDH Boards


The parameters that need to be set for the PDH boards include the J1 byte, C2 byte, J2 byte, V5
byte, and tributary loopback.

J1 Byte
J1 is the path trace byte. This byte is used to transmit repetitively a path access point identifier
so that a path receiving terminal can verify its continued connection to the intended transmitter.
When a J1 mismatch is detected at the receive end, the corresponding VC-4 path generates an
HP_TIM alarm.
The J1 byte is set to the single-byte "" by default.
NOTE

The J1 byte was set to " HuaWei SBS

" by default.

C2 Byte
C2 is the signal label byte, which is used to indicate the multiplexing structure of the VC frames
and the payload property. The C2 byte to be sent must match the C2 byte to be received. When
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a C2 mismatch is detected, the corresponding VC-4 path at the local end generates an HP_SLM
alarm.
Table 27-21 shows the relationship between the service type and the value of the C2 byte.
Table 27-21 relationship between the service type and the value of the C2 byte
Service Type

Value of the C2 Byte (Hexadecimal)

TUG structure

02

34M/45M into C-3

04

140M into C-4

12

Unequipped

00

J2 Byte
J2 is the VC-12 path trace byte. This byte is used to transmit repetitively a low order path access
point identifier so that a path receiving terminal can verify its continued connection to the
intended transmitter.

V5 Byte
V5 is the path status and signal label byte. This byte is used to detect bit errors and indicate
remote errors or remote failures on lower order paths. The LP_REI and LP_RFI alarms are
generated accordingly. Table 27-22 shows the relationship between the service type and the
value of the V5 byte.
Table 27-22 relationship between the service type and the value of the V5 byte

Issue 03 (2013-02-20)

Service Type

Value of the V5 Byte (Hexadecimal)

Unequipped or supervisory-unequipped

00

Equipped-non-specific payload

01

Asynchronous

02

Bit synchronization

03

Byte synchronization

04

Retained signal flag

05

O.181 test signal

06

VC-AIS

07

Other mapping (For test)

08

ATM mapping

09

HDLC/PPP mapping

0A

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Service Type

Value of the V5 Byte (Hexadecimal)

HDLC/LAPS mapping

0B

Virtual connection test signal (O.181


special mapping)

0C

GFP mapping

0D

Equipping Indication
When a service channel only carries the service and does not process the service, select
Unequipped or Supervisory-Unequipped.
When a service channel carries the service and also processes the service, select EquippedUnspecific Payload.

Tributary Loopback
The tributary loopback function is used to locate faults in the service channels.
The tributary loopback is also a diagnosis function. When the tributary loopback is performed,
related services are interrupted.

Path Service Type


This parameter is set to specify service type for the channel.
l

Select E1 or T1 for E1/T1 processing boards according to the actual service type in the
channel.

Select E3 or T3 for E3/T3 processing boards according to the actual service type in the
channel.

Serial Port Protocol Mode


For the DX1, select the protocol mode of the N x 64 kbit/s signals. The protocol mode includes
V.35, V.24, X.21, RS449, RS530 and RS530A.

DDN Clock Source Management


The timing scheme and working clock source can be set for the DX1.
l

Set the timing scheme of the DDN channels 1012 and 1416 to the DCE internal scheme,
DCE slave scheme or DTE external scheme.

Set the timing scheme of the DDN channels 9 and 13 to the DCE internal scheme, DCE
slave scheme, DTE external scheme, DTE internal scheme, DTE slave scheme or DCE
external scheme. By default, the timing scheme is the DCE internal scheme for channels 9
and 13 is the DCE internal scheme.

27.7 WDM Boards


The parameters that need to be set for the WDM boards include the path use status, optical
interface loopback, service type, client service bearer rate (M), laser status, automatic laser
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shutdown, current bearer rate (M), actual wavelength no./wavelength (nm)/frequency (THz),
actual band type, configure wavelength no./wavelength (nm)/frequency (THz), configure band
type, and SD trigger condition.

Path Use Status


Item

Description

Parameter description

Used to set the path use status

Parameter values

Used and Unused

Parameter value description

Default value: Used

Recommended value

Used

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

When the Path Use Status of an optical interface


is set to Unused, service alarms at this interface
are suppressed, which disables the automatic laser
turn on function.

Relevant boards

LWX

Configuration requirements

When the channel is not required, its Path Use


Status can be set to Unused. In this case, a
command should be issued to shut down the laser
of this path; otherwise, an alarm indicates that the
laser is forcibly turned on is reported.

Optical Interface Loopback


Item

Description

Parameter description

Used to set the loopback mode of the current


optical interface.

Parameter values

Non-Loopback, Outloop, and Inloop

Parameter value description

Default value: Non-Loopback


Non-Loopback: indicates that the equipment is in
normal state. Optical interface loopback is not
required when the equipment normally operates.
Inloop: indicates a mode that signals to be output
from the output interface of the local-end
equipment are looped back to the signal input
interface of this equipment. Inloop is used to test
the signal processing on the board.

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Item

27 Parameter Settings

Description
Outloop: indicates a mode that unprocessed
signals accessed to the local-end equipment are
directly looped back to the corresponding output
interface without the signal structure changed.
Outloop is used to test connections between fiber
lines and connectors.

Recommended value

Non-Loopback

Application scenarios

In commissioning and maintenance stages

Impact on the system

When the loopback mode is set to Inloop or


Outloop, services are interrupted.

Relevant boards

RPC01 and RPC02

Configuration requirements

None

Item

Description

Parameter description

Used to set the type of services at a client-side


optical interface.

Parameter values

LWX: GE, FE, STM-1, STM-16, OC-3, OC-12,


OC-48, FC-100, FC-200 FICON, FICON
Express, DVB-ASI DVB-SDI, and ESCON

Parameter value description

Default value: Any

Recommended value

None

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

LWX

Configuration requirements

The type of actually accessed services must be the


same as the type of configured services.
Otherwise, the services are not available.

Service Type

Client Service Bearer Rate (M)

Issue 03 (2013-02-20)

Item

Description

Parameter description

Used to set the bearer rate of client-side services.

Parameter values(M)

16 to 2500

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27 Parameter Settings

Item

Description

Parameter value
description

The bearer rate of client-side services can be set only when the
client-side services are of Any type. The set value should equal
to the maximum rate of actually accessed services.

Recommended value

None

Application scenarios

In configuration, commissioning, and maintenance stages

Impact on the system

A SPEED_OVER alarm is reported when the rate of actually


accessed services exceeds the set value.

Relevant boards

LWX

Configuration
requirements (the set
value of bearer rate
should be the same as the
rate of actually accessed
services)

Actually
accessed
services

Set value
(M)

Actually
accessed
services

Set value (M)

STM-1

155.5

GE

1250

STM-4

622

FE

125

STM-16

2488.3

FC100

1062

OC3

155.5

FC200

2124

OC12

622

FICON

1062

OC48

2488.3

FICON
Express

2124

HDTV

270

ESCON

200

DVB-SDI

270

FDDI

125

DVB-ASI

270

Laser Status

Issue 03 (2013-02-20)

Item

Description

Parameter description

Used to set the laser Open/Close status.

Parameter values

Open and Close


Default value: Open

Parameter value description

Open: The laser is turned on to start transmitting


services.
Close: The laser is turned off to stop service
transmitting.

Recommended value

Open

Application scenarios

In configuration, commissioning, and


maintenance stages

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27 Parameter Settings

Item

Description

Impact on the system

When the laser is set to Close, services are


interrupted.

Relevant boards

LWX

Configuration requirements

When an optical interface is unused or is not


connected to a fiber, the laser at this interface
should be set to Open.

Automatic Laser Shutdown


Item

Description

Parameter description

Used to set whether to enable automatic laser


shutdown (ALS) of the downstream laser of the
local board in the case of loss of received signals.
If ALS is enabled, when the received signals are
lost, the laser is automatically shut down and stops
transmitting signals. ALS prolongs the service life
of a laser and avoids personal injury from the laser.

Parameter values

Enabled and Disabled

Parameter value description

By default, ALS of optical interfaces on client


sides is set to Enabled and ALS of optical
interfaces on WDM sides is set to Disabled.

Recommended value

ALS of optical interfaces on client sides is set to


Enabled and ALS of optical interfaces on WDM
sides is set to Disabled.

Application scenarios

In configuration and maintenance stages

Impact on the system

None

Relevant boards

LWX

Configuration requirements

If the optical interface on a WDM side does not


use the ESC as the network management channel
or no fiber is connected, you can set ALS of the
optical interface to Enabled to prolong the service
life of the laser.

Current Bearer Rate (M)

Issue 03 (2013-02-20)

Item

Description

Parameter description

Used to query the current bearer rate of client-side


services.

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27 Parameter Settings

Item

Description

Parameter values

Can only be queried

Parameter value description

None

Recommended value

None

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

LWX

Configuration requirements

None

Actual Wavelength No./Wavelength (nm)/Frequency (THz)


Item

Description

Parameter description

Used to query the operating wavelength at the


WDM-side optical interface of a board.

Parameter values

Can only be queried

Parameter value description

None

Recommended value

None

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

LWX

Configuration requirements

None

Actual Band Type

Issue 03 (2013-02-20)

Item

Description

Parameter description

Used to query the band type.

Parameter values

Can only be queried

Parameter value description

None

Recommended value

None

Application scenarios

In commissioning and maintenance stages

Impact on the system

None

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27 Parameter Settings

Item

Description

Relevant boards

LWX

Configuration requirements

None

Configure Wavelength No./Wavelength (nm)/Frequency (THz)


Item

Description

Parameter description

Used to configure the operating wavelength at the


WDM-side optical interface of a board.

Parameter values

C-band wavelength spacing: 100G


(192.100-196.00 THz)
CWDM-band wavelength spacing: 20 nm
(1271-1611 nm)

Parameter value description

The operating wavelength of a fixed-wavelength


OTU should be set to the actual wavelength of the
OTU. The operating wavelength of a tunablewavelength OTU should be set according to the
network wavelength planning.

Recommended value

None

Application scenarios

In configuration stage

Impact on the system

l The same wavelength should be used for a


service in the receive and transmit directions.
l If a service travels through multiple
regenerating stations, it is recommended that
these regenerating sections use the same
wavelength.
l It is recommended that the active and standby
channels use the same wavelength when the
inter-board channel protection or client-side
path protection is adopted.

Issue 03 (2013-02-20)

Relevant boards

LWX

Configuration requirements

The configured logic wavelength must be the same


as the actual physical wavelength. Otherwise, a
CFGDATA_OUTRANGE alarm is reported. In
the case of tunable optical modules, issuing the
captioned command directly changes their
physical wavelengths (but does not change the
band). In the case of non-tunable optical modules,
issuing this command changes their logic
wavelengths only.

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27 Parameter Settings

Configure Band Type


Item

Description

Parameter description

Used to configure the band type.

Parameter values(dBm)

C and CWDM

Parameter value description

None

Recommended value

None

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

LWX

Configuration requirements

The configured logic band must be the same as the


actual physical band. Otherwise, a
CFGDATA_OUTRANGE alarm is reported.

SD Trigger Condition
Item

Description

Parameter description

Used to configure the trigger condition to perform


SD switching on the board.

Parameter values(dBm)

B1_SD, OTUk_DEG, ODUk_PM_DEG, and


None

Parameter value description

B1_SD: Regeneration section (B1) signal degrade


OTUk_DEG: OTUk signal degrade
ODUk_PM_DEG: ODUk_PM signal degrade
None: No condition is configured for SD
switching.

Issue 03 (2013-02-20)

Recommended value

Set the value to None.

Application scenarios

In commissioning and maintenance stages

Impact on the system

When the B1_SD, OTUk_DEG, or


ODUk_PM_DEG alarm occurs, the protection
group might be triggered to perform protection
switching.

Relevant boards

LWX

Configuration requirements

Set the value to B1_SD, OTUk_DEG, or


ODUk_PM_DEG if the protection mechanism
needs such a trigger condition.

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27 Parameter Settings

27.8 Cross-Connect and Timing Units


The parameters that need to be set for the cross-connect and timing units include the clock source
parameters and clock subnet parameters.
Table 27-23 lists the parameters that need to be set for the cross-connect and timing units.
Table 27-23 Parameters that need to be set for the cross-connect and timing units
Domain

Parameter

Value

Configuration

Clock
Synchroni
zation
Status

NE Name

Displays the name of an NE.

NE Clock
Working Mode

Tracing Mode,
Holdover Mode,
Free-Run Mode

This field shows the current working


mode of the clock function board on
the NE. This field is read-only.
Tracing Mode: It is the normal
working mode and indicates that the
clock is synchronized with the input
reference clock source under the
actual service conditions.
Holdover Mode: Indicates that the
clock works with the stored
frequency information as the timing
reference after all the timing
references are lost.
Free-Run Mode: Indicates that the
clock works through the internal
oscillator.

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S1 Byte
Synchronization
Quality
Information

For example: NA

Displays the S1 byte synchronous


quality information in the clock
function on the current NE. For query
only.

S1 Byte Clock
Synchronous
Source

For example: NA

Displays the trace source of the


current NE clock. For query only.
This field displays no information
until the S1 byte (clock protection
function) is activated. Similarly, this
field displays NA until you press the
Query button, and then it displays the
related information.

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Domain

Clock
source
priority

Clock
source
switching
condition

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27 Parameter Settings

Parameter

Value

Configuration

Synchronous
Source

For example:
External Clock
Source 1

Displays the trace source of the


current NE clock. For query only.

Data Output
Method in
Holdover Mode

Normal Data
Output Mode,
Keep the Latest
Data
Default: Normal
Data Output Mode

Displays the data output method.

Clock source

The clock sources currently used by


the NE are listed in sequence. The top
clock source is of the highest priority.

External clock
source mode

2 MHz and 2 Mbit/


s

Select the mode only for the input


external clock source.

Synchronous
status byte

Sa4, Sa5, Sa6,


Sa7, and Sa8

Select the synchronous status byte


only for the input external clock
source that is in 2 Mbit/s mode.

AlS alarm
generated

Selected and not


selected

This parameter specifies the


condition for determining the clock
source switching. When an AIS alarm
occurs on an NE, the NE determines
whether to perform the clock source
switching.

B1 BER
thresholdcrossing
generated

Selected and not


selected

This parameter specifies the


condition for determining the clock
source switching. When the B1 BER
on an NE crosses the threshold, the
NE determines whether to perform
the clock source switching.

RLOS, RLOF and


OOF alarms
generated

Selected

When an R_LOS, R_LOF, or OOF


alarm occurs on an NE, the NE
considers that the corresponding
clock source fails.

Normally, the synchronous source


should be a clock source with the
highest priority among the clock
stratums. If the synchronous source
cannot be traced, try to trace a clock
source with a lower priority level
according to the sequence of the clock
stratums.

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27 Parameter Settings

Domain

Parameter

Value

Configuration

Phaselocked
source
output by
external
clock

External clock
output mode
when 2M output
synchronous
source is invalid

Synchronization
quality
unavailable,
output AIS, and
shut off

This parameter is used to set the


operation to be performed by the
system when the output of the
synchronous clock (that is, 2M phaselocked source) fails.

Default value:
Shut off
Output mode of
external clock
source 1

2 Mbit/s and 2
MHz

The NE provides two external clock


outputs. This parameter is used to set
the output mode for external clock
source 1.

Output mode of
external clock
source 2

2 Mbit/s and 2
MHz

The NE provides two external clock


outputs. This parameter is used to set
the output mode for external clock
source 2.

Clock source
threshold

No threshold
value, G.813 SDH
equipment timing
source (SETS)
signal, G.812
local clock signal,
G.812 transit
clock signal, G.
811 clock signal,
and unknown

Set a threshold for the 2M


synchronous output sources. The
threshold is set for the clock
protection function of the S1 byte.
The NE clock system uses this
threshold as the basis for ensuring the
quality of the output clock. If a clock
is of a quality higher than the
threshold, the clock system transmits
clock signals.

Clock
source
switching

Lock status

Lockout and
unlock

This parameter is used to set whether


the clock source switching is allowed.

Switching
operation

Forced switching,
manual switching,
and clear
switching

This parameter specifies the


switching operation to be performed
on the clock source.

Clock
source
reversion
parameter

Higher priority
clock source
reversion mode

Auto-revertive
and non-revertive

When the clock source of a higher


priority degrades, the NE
automatically switches to the clock
source of a lower priority. When this
parameter is set to "Auto-revertive",
the NE automatically switches back
to the clock source of a higher priority
when the clock source of the higher
priority is restored. When this
parameter is set to "Non-revertive",
the NE does not automatically switch
back to the clock source of a higher
priority when the clock source of the
higher priority is restored.

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Domain

Parameter

Value

Configuration

Clock source
WTR time

0 to 12 minutes

This parameter is used to set the


period from the time when the
recovery of the clock is detected to
the time when the clock selector
responds. This setting prevents
repeated switching from occurring in
the case of unstable signals.

Affiliated subnet

Default value: 0

This parameter is used to set the


subnet ID.

Protection status

Start extended
SSM protocol,
start standard
SSM protocol, and
stop SSM protocol

This parameter specifies whether to


start up the SSM protocol.

Clock source ID

1 to 15

Huawei equipment uses the first four


bits of the S1 byte to identify the
clock source. Hence, the subnet clock
source ID is the four bits.

SSM
output
control

Line port

All the line ports


of the current NE

This parameter displays the line ports


that can be controlled.

Control status

Enabled and
disabled

This parameter specifies whether the


line port allows the output of the
quality information carried by the S1
byte. Generally, set this parameter to
"Disabled" at edges of a network to
prevent impact on the other
equipment.

Clock
quality

Configuration
quality

Unknown
synchronization
quality, G.811
clock signal, G.
812 transit clock
signal, G.812
local clock signal,
G.813 SDH
equipment timing
source (SETS)
signal, do not use
for
synchronization,
and automatic
extraction
Default value:
Automatic
extraction

This parameter is used to set the clock


quality. Specify the clock quality of
the clock source listed in the priority
table. If an option other than
"Automatic extraction" is selected,
the NE considers the specified clock
quality (other than the actual clock
quality) as the criteria.

Clock
subnet

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27 Parameter Settings

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Domain

Clock ID
status

27 Parameter Settings

Parameter

Value

Configuration

Clock quality

Unknown
synchronization
quality, G.811
clock signal, G.
812 transit clock
signal, G.812
local clock signal,
G.813 SDH
equipment timing
source (SETS)
signal, do not use
for
synchronization,
and automatic
extraction

The clock source quality information


actually received by the NE is
extracted by the NE from the S1 byte
of each clock source. When the
customer queries the actual clock
quality and the NE successfully
returns the result, the quality can be
displayed. Otherwise, it displays "no
information".

Line port

All the line ports


of the current NE

This parameter displays the line ports


that can be configured with the clock
ID.

Enabled status

Enabled and
disabled
Default value:
Enabled

This parameter specifies whether to


enable the setting of the clock ID.

27.9 Optical Amplifier Boards


The parameters that need to be set for the optical amplifier boards include the laser status, board
work type, configure band, configure working band parity, actual band, actual working band
parity, threshold of input power loss, gain, rated optical power, nominal gain upper threshold,
and nominal gain lower threshold.

Laser Status
Item

Description

Parameter description

Used to set the laser Open/Close status.

Parameter values

Open and Close


Default value of the OBU1: Open
Default value of the RPC01/RPC02: Close

Issue 03 (2013-02-20)

Recommended value

Close

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

When the laser is set to Close, services are


interrupted.

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27 Parameter Settings

Item

Description

Relevant boards

OBU1, RPC01, and RPC02

Configuration requirements

When services are normal, the laser of the optical


amplifying unit should be set to Open.

Board Work Type


Item

Description

Parameter description

Used to query and set the Board Work Type.

Parameter values

C, C+L, and L

Parameter value description

None

Recommended value

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

RPC01 and RPC02

Configuration requirements

None

Configure Band

Issue 03 (2013-02-20)

Item

Description

Parameter description

Used to configure the type of the working band of


a board.

Parameter values

Parameter value description

Supports only C band.

Recommended value

None

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

OBU1, RPC01, and RPC02

Configuration requirements

None

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27 Parameter Settings

Configure Working Band Parity


Item

Description

Parameter description

Selects the required parity of the working band.

Parameter values

All, Even, and Odd

Parameter value description

All: All 192.10 THz to 196.05 THz odd and even


wavelengths at 50 GHz channel spacing in C band.
There are 80 wavelengths in total. It is applicable
for the OBU1, RPC01, and PRC02 boards.
Even: All 192.10 THz to 196.00 THz even
wavelengths at 100 GHz channel spacing. There
are 40 wavelengths in total. It is applicable for the
RPC01 and PRC02 boards.
Odd: All 192.15 THz to 196.05 THz odd
wavelengths at 100 GHz channel spacing. There
are 40 wavelengths in total. It is applicable for the
RPC01 and PRC02 boards.

Recommended value

Corresponding wavelengths are used according to


different requirements.

Application scenarios

In commissioning and maintenance stages

Impact on the system

None

Relevant boards

OBU1, RPC01, and RPC02

Configuration requirements

When configuring the parity of wavelengths,


make sure that the parity configured is consistent
with the parity of the actual working wavelengths.

Item

Description

Parameter description

Used to query the actual working band of the


board.

Parameter values

Can only be queried

Parameter value description

None

Recommended value

None

Application scenarios

In commissioning and maintenance stages

Impact on the system

None

Relevant boards

OBU1

Configuration requirements

None

Actual Band

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27 Parameter Settings

Actual Working Band Parity


Item

Description

Parameter description

Used to query the parity of the actual working band


of the board.

Parameter values

Can only be queried

Parameter value description

None

Recommended value

None

Application scenarios

In commissioning and maintenance stages

Impact on the system

None

Relevant boards

OBU1, RPC01, and RPC02

Configuration requirements

None

Threshold of Input Power Loss (dBm)


Item

Description

Parameter description

Indicates the lower threshold of input optical


power loss (an MUT_LOS alarm is reported).

Parameter values

Can only be queried

Parameter value description

The default value varies with the boards and


subjects to the on-site queried result.

Recommended value

None

Application scenarios

In commissioning and maintenance stages

Impact on the system

None

Relevant boards

OBU1

Configuration requirements

None

Item

Description

Parameter description

Used to query the optical power gain of the current


optical amplifying unit.

Parameter values

Can only be queried

Parameter value description

None

Gain (dB)

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27 Parameter Settings

Item

Description

Recommended value

None

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

OBU1

Configuration requirements

Normally, the queried result should range from the


nominal gain minus 2.5 dB to the nominal gain
plus 2.5 dB.

Nominal Gain Upper Threshold (dB)


Item

Description

Parameter description

Used to query the nominal gain upper threshold.

Parameter values

Can only be queried

Parameter value description

None

Recommended value

None

Application scenarios

In commissioning and maintenance stages

Impact on the system

None

Relevant boards

OBU1

Configuration requirements

None

Nominal Gain Lower Threshold (dB)

Issue 03 (2013-02-20)

Item

Description

Parameter description

Used to query the nominal gain lower threshold.

Parameter values

Can only be queried

Parameter value description

None

Recommended value

None

Application scenarios

In commissioning and maintenance stages

Impact on the system

None

Relevant boards

OBU1

Configuration requirements

None

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27 Parameter Settings

Rated Optical Power (dBm)


Item

Description

Parameter description

Used to set and query the single-wavelength rated


optical power as the reference value for automatic
optical power adjustment.

Parameter values (dBm)

30.0 to 30.0

Parameter value description

Default value at the input optical interface: 19


dBm
Default value at the output optical interface: 4
dBm

Recommended value

OBUC01: input interface: 20 dBm; output


interface: 0 dBm
OBUC03: input interface: 19 dBm; output
interface: 4 dBm

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

OBU1

Configuration requirements

The rated input and output optical power should


be configured by referring to the actual
configurable input and output range of the optical
amplifying unit and should be the same as the
input and output values measured when the
optical amplifying unit operates normally.

Fixed Pump Optical Power (dBm)

Issue 03 (2013-02-20)

Item

Description

Parameter description

Used to set or query the output optical power of


an optical amplifier board.

Parameter values (dBm)

5 to 30.0 (continuously tunable)

Parameter value description

Normally, the fixed pump optical power of the


RPC board should be larger than 23 dBm. The
value is related to the system specifications.

Recommended value

None

Application scenarios

In configuration, commissioning, and


maintenance stages

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27 Parameter Settings

Item

Description

Impact on the system

Fixed Pump Optical Power (dBm) must be set


within a range between Min. Fixed Pump
Optical Power (dBm) and Max. Fixed Pump
Optical Power (dBm). If the fixed pump optical
power value is beyond the range, the board might
work abnormally.

Relevant boards

RPC01 and RPC02

Configuration requirements

None

Min. Fixed Pump Optical Power (dBm)


Item

Description

Parameter description

Used to query the minimum pump optical power


that an optical amplifier board can fix. If the fixed
pump optical power value is smaller than the
minimum value, the board might work
abnormally.

Parameter values (dBm)

5 to 30.0

Parameter value description

None

Recommended value

Default value: 20 dBm

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

If the configured value of Fixed Pump Optical


Power (dBm) is smaller than the value of Min.
Fixed Pump Optical Power (dBm), the board
might work abnormally.

Relevant boards

RPC01 and RPC02

Configuration requirements

None

Max. Fixed Pump Optical Power (dBm)

Issue 03 (2013-02-20)

Item

Description

Parameter description

Used to query the maximum pump optical power


that an optical amplifier board can fix. If the fixed
pump optical power value is larger than the
maximum value, the board might work
abnormally.

Parameter values (dBm)

5 to 30.0

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27 Parameter Settings

Item

Description

Parameter value description

None

Recommended value

Default value: 26 dBm

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

If the configured value of Fixed Pump Optical


Power (dBm) is larger than the value of Max.
Fixed Pump Optical Power (dBm), the board
might work abnormally.

Relevant boards

RPC01 and RPC02

Configuration requirements

None

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28 Task Collection

28

Task Collection

About This Chapter


This topic describes the operation tasks to be performed during board commissioning and board
configuration.
28.1 Querying the Protection Subnet
You can know the network protection schemes by querying the protection subnet to which an
NE belongs. Then, you can configure services for the board according to the protection schemes.
28.2 Troubleshooting Service Unavailability
In certain cases, the services become unavailable after the cross-connections related to the
services are configured. This topic describes the methods of troubleshooting service
unavailability.
28.3 Troubleshooting the Clock Tracing Failure
In many cases, the equipment still fails to trace the clock after you configure the clock source
priority list. To locate the clock tracing problem, you need to check all the stations that the clock
travels along the clock tracing direction and from the source station to the sink station.
28.4 Configuring the F&f Debugging Serial Port and OAM NM Port
The OAM NM port provides the network management function and is used for remote
maintenance. The F&f debugging serial port is used for managing the external equipment such
as the COA, TDA, and DCU. The F&f debugging serial port supports a maximum transmission
distance of 15 m. The AUX board provides the ports for connecting the F&f debugging serial
port and OAM NM port.
28.5 Testing the Frequency Accuracy of the Free-Run Clock
The frequency accuracy indicates the deviation of the actual clock frequency from the nominal
clock frequency, which is a highly stable frequency. Generally, the frequency accuracy is
represented by the relative frequency deviation.
28.6 Testing the Clock Holdover Accuracy
The SDH equipment supports the clock holdover function. That is, the SDH equipment can retain
the clock accuracy of 0.37 ppm or a higher clock accuracy (at a temperature from 20C to 30
C) relative to the clock frequency at the service interruption moment, within 24 hours after the
external clock source is interrupted.
28.7 Checking Board Parameters
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To learn about board parameter status, you can check board parameters. Before actual
configuration operations in networking, you need to check board parameters, to make sure that
the board parameter status meets the requirements of actual networking.
28.8 Testing the SAN Service Channel
When a network carries services, you need to check the availability of the service channels.
28.9 Testing the SDI Service Channel
When a network carries services, you need to check the availability of the service channels.

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28.1 Querying the Protection Subnet


You can know the network protection schemes by querying the protection subnet to which an
NE belongs. Then, you can configure services for the board according to the protection schemes.

Prerequisites
l

You must be an NM user with "NE operator" authority or higher.

The SDH board must be created.

Procedure
Step 1 Choose Protection Subnet > SDH Protection Subnet Maintenance from the Main Menu to
display the Protection Subnet Attributes dialog box.
Step 2 In Protection Subnet Attributes, the left pane displays the protection subnet to which the NE
belongs, and the right pane displays the attribute information of the protection subnet.
----End

28.2 Troubleshooting Service Unavailability


In certain cases, the services become unavailable after the cross-connections related to the
services are configured. This topic describes the methods of troubleshooting service
unavailability.

Context
After the cross-connections are configured, the services are unavailable.

Impacts on the System


The services are unavailable.

Possible Causes
l

Cause 1: The type of the logical board is different from the type of the physical board.

Cause 2: The services are configured incorrectly.

Cause 3: The other boards on the NE do not operate normally.

Tools, Instruments, and Materials


l

U2000

Procedure
Step 1 Ensure that the type of the logical board configured on the U2000 is the same as the type of the
physical board. If the type of the logical board configured on the U2000 is different from the
type of the physical board, delete the current logical board and then add the correct logical board.
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For the operations of deleting a logical board, see Deleting Boards. For the operations of adding
a logical board, see Adding Boards.
Step 2 Ensure that the cross-connect services are configured correctly and that the cross-connect
services are activated. If the cross-connect services are configured correctly, modify the
configuration of the cross-connect services. For details, see Modifying the Service Configuration
Data.
Step 3 Check whether all the boards on the NE operate normally and whether any critical or major
alarms are generated on the boards.
Step 4 Switch the services from the working cross-connect board to the protection cross-connect board.
If the services are restored after the switching, replace the working cross-connect board. If the
services are still unavailable after the switching, perform Step 5.
Step 5 Contact Huawei technical support personnel.
----End

28.3 Troubleshooting the Clock Tracing Failure


In many cases, the equipment still fails to trace the clock after you configure the clock source
priority list. To locate the clock tracing problem, you need to check all the stations that the clock
travels along the clock tracing direction and from the source station to the sink station.

Prerequisites
l

The NE must be connected to the NMS through an NMS port or using a DCC
communication management device.

The U2000 software must be installed on the PC and the PC must be started.

Procedure
Step 1 Ensure that the clock source priority list is configured correctly.
If the problems are detected in Steps 113, correct the configurations according to the operations
in Configuring Clocks.
Step 2 Query the input mode of the external clock and ensure that the input mode of the external clock
source is set correctly. That is, ensure that the input mode of the external clock source is set to
the 2 MHz or 2 Mbit/s.
Step 3 Ensure that the SSM mode is enabled.
Step 4 Ensure that the clock source to be traced is available.
Step 5 If the line source is unavailable, check whether the LOS or LOF alarm occurs on the
corresponding optical port. If the LOS or LOF alarm occurs on the corresponding optical port,
clear the alarm. If the LOS or LOF alarm does not occur on the corresponding optical port, run
the test command to check whether the inter-board communication is normal. If the inter-board
communication is not normal, it indicates that the equipment fails to trace the clock due to the
abnormal inter-board communication.
Step 6 Check whether the external clock is derived from the BITS or other NEs. If the source of the
external clock is incorrect, set the correct external clock source.
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Step 7 Check whether the clock source is locked. If the clock source is locked, unlock the clock source.
Step 8 Check whether the switching mode of the clock source is non-revertive on the U2000. If the
switching mode of the clock source is non-revertive, change the switching mode to revertive.
Step 9 Check whether any forced switching or manual switching is performed for other clock sources.
If a forced switching or manual switching is performed for other clock sources, clear the
switching.
Step 10 Check whether the S1 byte that carries the clock source signal is DNU. If the S1 byte that carries
the clock source signal is DNU, go to step 13.
Step 11 Check whether the S1 byte is correct. If the S1 byte is incorrect, set the correct S1 byte.
Step 12 If the S1 byte is correct, check whether the external clock is derived from the BITS or other NEs.
If the source of the external clock is incorrect, set the correct external clock source. Check
whether the clock source is locked. If the clock source is locked, unlock the clock source. Check
whether any forced switching or manual switching is performed for other clock sources. If a
forced switching or manual switching is performed for other clock sources, clear the switching.
Step 13 In the case of the line clock source, check whether the timeslot for receiving the S1 byte is any
of sa4sa8. If the timeslot for receiving the S1 byte is not any of sa4sa8, set the timeslot for
receiving the S1 byte to any of sa4sa8.
----End

28.4 Configuring the F&f Debugging Serial Port and OAM


NM Port
The OAM NM port provides the network management function and is used for remote
maintenance. The F&f debugging serial port is used for managing the external equipment such
as the COA, TDA, and DCU. The F&f debugging serial port supports a maximum transmission
distance of 15 m. The AUX board provides the ports for connecting the F&f debugging serial
port and OAM NM port.

Prerequisites
l

The PC must be connected to the equipment through a network cable. The PC must be
started.

The U2000 must be started.

Procedure
Step 1 Open the NE whose F&f debugging serial port and OAM NM port need to be configured on the
U2000.
Step 2 Choose Communication > Access Control from the Function Tree. See Figure 28-1.

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Figure 28-1 Configuring the F&f debugging serial port and OAM NM port

Step 3 Configure the OAM NM port. Select Enable OAM Access. This operation is optional.
Step 4 Configure the F&f debugging serial port. Select Enable Serial Port Access and set the baud
rate to 38400.
Step 5 Click Apply so that the settings can take effect.
----End

28.5 Testing the Frequency Accuracy of the Free-Run Clock


The frequency accuracy indicates the deviation of the actual clock frequency from the nominal
clock frequency, which is a highly stable frequency. Generally, the frequency accuracy is
represented by the relative frequency deviation.

Tools and Instruments


Frequency meter

Test Connection Diagram


Connect the frequency meter to the NE as shown in Figure 28-2.

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Figure 28-2 Connection for testing the frequency accuracy of the free-run clock
2 MHz
Standard clock

Equipment

Frequency meter

Procedure
Step 1 Use the frequency meter to measure the frequency of the standard clock.
Step 2 Set the clock to be in free-run mode. Set the output mode of the external clock to the 2 MHz or
2 Mbit/s mode. Connect the output clock signal to the frequency meter for measurement.
Step 3 Use the frequency meter to measure the frequency of the free-run clock. Compare the actual
frequency of the free-run clock with the frequency of the standard clock to calculate the
frequency accuracy of the free-run clock.
Step 4 You can calculate the frequency deviation and determine the frequency accuracy only after you
check the clock frequencies at different time periods within several months and perform
frequency tests under different conditions. In addition, you need to perform the frequency tests
at appropriate time periods based on the actual situations.
----End

28.6 Testing the Clock Holdover Accuracy


The SDH equipment supports the clock holdover function. That is, the SDH equipment can retain
the clock accuracy of 0.37 ppm or a higher clock accuracy (at a temperature from 20C to 30
C) relative to the clock frequency at the service interruption moment, within 24 hours after the
external clock source is interrupted.

Prerequisites
The following operations must be performed:
l

The U2000 LCT must be started.

You must log in to the NE.

Tools and Instruments


Frequency meter, SDH analyzer, and U2000 LCT

Test Connection Diagram


Connect the testing tools to the NE as shown in Figure 28-3.

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Figure 28-3 Connection for testing the clock holdover accuracy


Standard clock

Frequency
meter

Equipment

SDH
analyzer

Procedure
Step 1 Turn on Switch K. Configure the standard clock source for the OptiX OSN 3500 on the
U2000 LCT.
Step 2 After performing all the preparations before locking the clock source, record the frequency.
Then, the equipment locks the standard clock source for 24 hours. Turn off Switch K. Then, the
clock of the OptiX OSN 3500 changes to holdover mode. Then, record the clock frequency every
other hour.
Step 3 Check the records in 24 hours. The test requires that the frequency stability of the standard clock
should be higher than 1x1010/day.
----End

28.7 Checking Board Parameters


To learn about board parameter status, you can check board parameters. Before actual
configuration operations in networking, you need to check board parameters, to make sure that
the board parameter status meets the requirements of actual networking.

Procedure
Step 1 Check SDH board parameters. For the SDH board parameters, see Table 28-1.
Table 28-1 SDH board parameters
Boar
d
Type

Paramete
r
MSP
sharing

SDH

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Laser
Switch

Navigation Path

Application Scenario

1. In the NE
Explorer,
select a board.
2. Choose
Configuratio
n > SDH
Interface from
the Function
Tree.

When configuring MSP shared services on an


optical interface of a board, enable this
parameter.
When configuring services on an optical
interface of a board, enable this parameter.

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Boar
d
Type

Paramete
r
Optical
(Electrical
)Interface
Loopback

28 Task Collection

Navigation Path

Application Scenario

3. Click
By
Board/Port
(channel) and
select
Port
from the dropdown list.

l Non-loopback: It is a normal state. When the


equipment runs normally, set this parameter
to non-loopback.
l Inloop: The loop is performed toward the
local NE.
l Outloop: The loop is performed toward the
opposite NE. Inloop and outloop of an optical
interface affect services. They are used to
locate faults.
In the REG working mode, the board processes
only the framer header and regenerator section
overheads. In the case of the non-REG service
configuration, set this parameter to Disabled.

Hardware
REG
Enable

Step 2 Check PDH board parameters. For the PDH board parameters, see Table 28-2.
Table 28-2 PDH board parameters
Boar
d
Type

Paramete
r
Service
Load
Indication

PDH

Tributary
Loopback

Navigation Path

1. In the NE
Explorer,
select a board.
2. Choose
Configuratio
n > PDH
Interface from
the Function
Tree.
3. Click
By
Board/Port
(channel) and
select
Port
from the dropdown list.

Application Scenario
l Non-loaded: The service path does not
process the services that are carried, to
suppress alarms in non-loaded service paths.
l Load: The service path processes the services
that are carried. In the case of a tributary board
that has services, set this parameter to Load.
l Non-loopback: It is a normal state. When the
equipment runs normally, set this parameter
to non-loopback.
l Inloop: When input service signals reach the
tributary board of the target NE, the signals
revert to the original trail. This function is
used to locate faults of each service path.
l Outloop: When input service signals reach the
tributary board through the input port of the
local NE, the signals are looped back directly
to the service output end.

Step 3 Check RTN board parameters. For the RTN board parameters, see Table 28-3.

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Table 28-3 RTN board parameters


Boar
d
Type

Paramete
r

Navigation Path

Radio
Work
Mode

Application Scenario
Specifies the microwave working mode. Its
formats are service capacity, working bandwidth
and modulation mode.
The transmit end and the receive end must have
the same settings of the microwave working
mode.

Radio Link
ID

Radio Link ID: 1 to 4094

IF Port
Loopback

Sets the loopback status of an intermediate


frequency interface on the equipment.
1. In the NE
Explorer,
select a board.
2. Choose
Configuratio
n
>
IF
Interface from
the Function
Tree.
3. Click
By
Board/Port
(channel) and
select
Port
from the dropdown list.

RTN

Non-Loopback refers to the normal status. It is


not required to set loopback during normal
equipment operation.
Outloop means that the input signal passes
through the ingress port and reaches the
intermediate frequency board at the local NE and
then is directly looped back to the service egress
end.
Inloop means that the input signal returns from
the intermediate frequency board of the
destination NE along the original trail.
This function is usually used to locate faults for
various IF interfaces. Performing loopback on an
intermediate frequency interface is a diagnosis
function that may affect services of related ports.
Exercise caution before performing this function.

2M
Wayside
Enable
Status

Enables or disables a 2 Mbit/s bypath service.


This parameter is available only when you set
Radio Work Mode to STM-1,28MHz,
128QAM.

ATPC
Enable
Status

When the ATPC is enabled, according to the


current receive power of the ODU and the set
ATPC thresholds, the ATPC module inserts the
ATPC overhead. According to the ATPC
overhead, the opposite ODU adjusts the transmit
power.
When the ATPC is disabled, the ATPC module
does not insert any ATPC overhead.

Step 4 Check data board parameters. For the data board parameters, see Table 28-4.

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Table 28-4 Data board parameters


Board
Type

Paramet
er

Application Scenario

Enabled/
Disabled

When configuring Ethernet board port


services, set the port to Enabled.

Working
Mode

Set the working mode of Ethernet ports


according to networking configuration
requirements.

Maximu
m Frame
Length

When a packet exceeds the maximum


frame length that is set, the packet is
discarded. Alternatively, the packet length
is minimized to satisfy the specified frame
length. By default, the value is set to 1522,
unless otherwise specified.

MAC
Loopbac
k

Ethern
et

Navigation Path

1. In the NE Explorer,
select a board.
2. Choose
Configuration
>
Ethernet Interface
Management
>
Ethernet Interface
from the Function
Tree.
3. Click External Port.
4. Click the Basic
Attributes tab.

l Non-loopback: It is a normal state.


When the equipment runs normally, set
this parameter to non-loopback.
l Inloop: Inside the equipment, services
from the cross-connect side are looped
back to the cross-connect side. This
operation affects services configured on
ports and is used to locate faults.
l Non-loopback: It is a normal state.
When the equipment runs normally, set
this parameter to non-loopback.

PHY
Loopbac
k

l Inloop: Inside the equipment, services


from the cross-connect side are looped
back to the cross-connect side. This
operation affects services configured on
ports and is used to locate faults.
TAG

Entry
Detection

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1. In the NE Explorer,
select a board.
2. Choose
Configuration
>
Ethernet Interface
Management
>
Ethernet Interface
from the Function
Tree.
3. Click External Port.
4. Click the TAG
Attributes tab.

l Tag Aware: If the client-side equipment


sends tag packets, set the TAG attribute
of external ports to Tag Aware.
l Access: If the client-side equipment
sends untagged packets, set the TAG
attribute of external ports to Access.
l Hybrid: If the client-side equipment
sends tag and untagged packets, set the
TAG attribute of external ports to
Hybrid.
This parameter is used to identify tags in
data packets. During the configuration of
VLAN services, set this parameter to
Enabled.

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Board
Type

Paramet
er

Navigation Path

ATM

Application Scenario
l UNI: The maximum number of VPI bits
is 8. The UNI is used on edge nodes
between the user network and ATM
network.

Port Type

UPC/
NPC
Enabled/
Disabled

28 Task Collection

1. In the NE Explorer,
select a board.
2. Choose
Configuration
>
ATM
Interface
Management
>
ATM
Interface
Management from
the Function Tree.
3. Click External Port.

l NNI: The maximum number of VPI bits


is 12. The NNI is used between ATM
networks.
l Enabled: When the traffic parameter is
valid and strict control of traffic is
required, set this parameter to
Enabled.
l Disabled: When the traffic parameter is
invalid (excepting the PCR of CBR
services) and service burst and
grooming are permitted, set this
parameter to Disabled.

Loopbac
k

Inloop is used to locate faults. During


normal service configuration, set this
parameter to No Loopback.

Laser
Switch

This parameter is used to set the on/off


status of a laser. During normal service
configuration, set this parameter to Open.

----End

28.8 Testing the SAN Service Channel


When a network carries services, you need to check the availability of the service channels.

Testing the Loopback Function When the FC Flow Control Function Is Disabled
Step 1 Connect the optical fibers to the equipment according to Figure 28-4. Ensure that the mode of
the GBIC optical module of the SmartBits and the mode of the SFP optical module of the MST4
match the mode of the optical fibers.

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Figure 28-4 Connection for testing the loopback function when the FC flow control function is
disabled
NE1

NE2
SDH
network

SmartBits

Signal flow

Step 2 Disable the FC flow control function on both the local and remote MST4 boards.
Step 3 Loop back the port of the remote MST4 by using an optical fiber or set an inloop on the port of
the remote MST4.
Step 4 Connect the SmartBits to NE1 and set the SmartBits to the private Pt-2-Pt mode.
Step 5 Check whether the services are normal on the SmartBits.
Step 6 If the services are unavailable, configure a loopback to the remote MST4 on the cross-connect
board of NE1 and a loopback to the local MST4 on the cross-connect board of NE2. Then,
perform the test section by section to locate the fault.
----End

Testing the Connection to the FC Switch When the FC Flow Control Function Is
Disabled
Step 1 Connect the optical fibers to the equipment according to Figure 28-5 after ensuring that services
are available on the SmartBits when the FC flow control function is disabled. In addition, do not
modify the configuration of the boards.

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28 Task Collection

Figure 28-5 Connection for testing the connection to the FC switch when the FC flow control
function is disabled
Switch A

NE1

NE2

Switch B

SDH
network

SmartBits

SmartBits

Step 2 Set the port of the SmartBits to the public Pt-2-Pt mode. Then, perform the following operations:
link_up, login, public, commit, and packet transmission.
l If an error occurs when you perform the link_up or login operation, check the connection
between the SmartBits and the switch. In addition, check the port rate.
l If an error occurs when you perform the public operation, check whether the mode of the
SFP optical module of the MST4, the mode of the SFP optical module that is installed on the
FC port to which the MST4 is connected, and the mode of the optical fibers match each other.
If the connection is correct, log in to the switch and issue the portcfgshow command to check
the configuration status of the switch port. The configuration of the port must meet the
requirement and the configurations of the ports at both ends must be consistent. Then, issue
the switchshow command to check the status of the FC switch and check whether the port
is in the Online state. In addition, you need to check whether WWW of the switch at the
opposite end, the downstream information, and the upstream information are displayed.
l If the configuration of the switch port is correct and WWW of the switch at the opposite end
is displayed but the downstream information and upstream information are not displayed,
check whether the configuration of the SmartBits is correct. In addition, check whether
WWN Src and WWN Dst are correctly set on the SmartBits.
l If the configuration of the SmartBits is correct, check whether network segments are set on
the FC switches. If network segments are set on the FC switches, ensure that the switch ports
to which the SmartBits is connected are in the same network segment.
----End

28.9 Testing the SDI Service Channel


When a network carries services, you need to check the availability of the service channels.

SDI Service Loopback Test


Step 1 Connect the cables to the equipment according toFigure 28-6.
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Figure 28-6 Connection for an SDI service loopback test


NE1
SDH
network
Video generator

NE2

Video analyzer

Signal flow

Step 2 Set the service type on a video generator.


Step 3 Set the eye diagram, image, BER, and jitter on a video analyzer.
Step 4 Before the test, set the BER window to 0. Observe the video analyzer to check whether the
service is available.
Step 5 If the service is unavailable, configure a loopback from the local cross-connect board to the
opposite VST4 board and a loopback from the opposite cross-connect board to the local VST4
board. Perform a test section by section to locate the fault.
----End

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A Glossary

Glossary

Numerics
2DM

two-way delay measurement

3G

See 3rd Generation.

3R

reshaping, retiming, regenerating

3rd Generation (3G)

The third generation of digital wireless technology, as defined by the International


Telecommunications Union (ITU). Third generation technology is expected to deliver
data transmission speeds between 144 kbit/s and 2 Mbit/s, compared to the 9.6 kbit/s to
19.2 kbit/s offered by second generation technology.

802.1Q in 802.1Q
(QinQ)

A VLAN feature that allows the equipment to add a VLAN tag to a tagged frame. The
implementation of QinQ is to add a public VLAN tag to a frame with a private VLAN
tag to allow the frame with double VLAN tags to be transmitted over the service
provider's backbone network based on the public VLAN tag. This provides a layer 2
VPN tunnel for customers and enables transparent transmission of packets over private
VLANs.

A
AAL

See ATM Adaptation Layer.

ABR

See available bit rate.

AC

alternating current

ACH

associated channel header

ACL

See access control list.

ACR

allowed cell rate

ADM

add/drop multiplexer

ADMC

automatically detected and manually cleared

ADSL

asymmetric digital subscriber line

AF

See assured forwarding.

AGC

automatic gain control

AIS

alarm indication signal

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A Glossary

ALC

See automatic level control.

ALS

See automatic laser shutdown.

AM

See adaptive modulation.

AMI

See alternate mark inversion.

AMU

ATM cell multiplex unit

ANSI

See American National Standards Institute.

APD

See avalanche photodiode.

APS

automatic protection switching

ARP

See Address Resolution Protocol.

ASCII

American Standard Code for Information Interchange

ASK

amplitude shift keying

ATM

asynchronous transfer mode

ATM Adaptation
Layer (AAL)

An interface between higher-layer protocols and Asynchronous Transfer Mode (ATM).


The AAL provides a conversion function to and from ATM for various types of
information, including voice, video, and data.

ATPC

See automatic transmit power control.

AU

See administrative unit.

AUG

See administrative unit group.

AWG

arrayed waveguide grating

Address Resolution
Protocol (ARP)

An Internet Protocol used to map IP addresses to MAC addresses. It allows hosts and
routers to determine the link layer addresses through ARP requests and ARP responses.

American National
Standards Institute
(ANSI)

An organization that defines U.S standards for the information processing industry.
ANSI participates in defining network protocol standards.

access control list


(ACL)

A list of entities, together with their access rights, which are authorized to have access
to a resource.

adaptive modulation
(AM)

A technology that is used to automatically adjust the modulation mode according to the
channel quality. When the channel quality is favorable, the equipment uses a highefficiency modulation mode to improve the transmission efficiency and the spectrum
utilization of the system. When the channel quality is degraded, the equipment uses the
low-efficiency modulation mode to improve the anti-interference capability of the link
that carries high-priority services.

administrative unit
(AU)

The information structure which provides adaptation between the higher order path layer
and the multiplex section layer. It consists of an information payload (the higher order
VC) and an AU pointer which indicates the offset of the payload frame start relative to
the multiplex section frame start.

administrative unit
group (AUG)

One or more administrative units occupying fixed, defined positions in an STM payload.
An AUG consists of AU-4s.

alternate mark
inversion (AMI)

A synchronous clock encoding technique which uses bipolar pulses to represent logical
1 values.

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A Glossary

assured forwarding
(AF)

One of the four per-hop behaviors (PHB) defined by the Diff-Serv workgroup of IETF.
It is suitable for certain key data services that require assured bandwidth and short delay.
For traffic within the bandwidth limit, AF assures quality in forwarding. For traffic that
exceeds the bandwidth limit, AF degrades the service class and continues to forward the
traffic instead of discarding the packets.

automatic laser
shutdown (ALS)

A technique (procedure) to automatically shutdown the output power of laser transmitters


and optical amplifiers to avoid exposure to hazardous levels.

automatic level control A feature that identifies speech signals and adjusts the sound volume to stay within a
(ALC)
comfortable range, improving user experience.
automatic transmit
A method of adjusting the transmit power based on fading of the transmit signal detected
power control (ATPC) at the receiver
available bit rate (ABR) A kind of service categories defined by the ATM forum. ABR only provides possible
forwarding service and applies to the connections that does not require the real-time
quality. It does not provide any guarantee in terms of cell loss or delay.
avalanche photodiode
(APD)

A semiconductor photodetector with integral detection and amplification stages.


Electrons generated at a p/n junction are accelerated in a region where they free an
avalanche of other electrons. APDs can detect faint signals but require higher voltages
than other semiconductor electronics.

B
B-ISDN

See broadband integrated services digital network.

BA

booster amplifier

BBE

background block error

BC

boundary clock

BCD

binary coded decimal

BDI

See backward defect indication.

BE

See best effort.

BER

bit error rate

BFD

See Bidirectional Forwarding Detection.

BGP

Border Gateway Protocol

BIOS

See basic input/output system.

BIP

See bit interleaved parity.

BIP-8

See bit interleaved parity-8.

BIP-X

bit interleaved parity-X

BITS

See building integrated timing supply.

BMC

best master clock

BNC

See bayonet-neill-concelman.

BPDU

See bridge protocol data unit.

BPS

board protection switching

BRAS

See broadband remote access server.

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A Glossary

BSC

binary synchronous communication

BSS

base station subsystem

BTS

base transceiver station

BWS

backbone wavelength division multiplexing system

Bidirectional
Forwarding Detection
(BFD)

A fast and independent hello protocol that delivers millisecond-level link failure
detection and provides carrier-class availability. After sessions are established between
neighboring systems, the systems can periodically send BFD packets to each other. If
one system fails to receive a BFD packet within the negotiated period, the system regards
that the bidirectional link fails and instructs the upper layer protocol to take actions to
recover the faulty link.

backplane

An electronic circuit board containing circuits and sockets into which additional
electronic devices on other circuit boards or cards can be plugged.

backward defect
indication (BDI)

A function that the sink node of a LSP, when detecting a defect, uses to inform the
upstream end of the LSP of a downstream defect along the return path.

basic input/output
system (BIOS)

A firmware stored in the computer mainboard. It contains basic input/output control


programs, power-on self test (POST) programs, bootstraps, and system setting
information. The BIOS provides hardware setting and control functions for the computer.

bayonet-neillconcelman (BNC)

A connector used for connecting two coaxial cables.

best effort (BE)

A traditional IP packet transport service. In this service, the diagrams are forwarded
following the sequence of the time they reach. All diagrams share the bandwidth of the
network and routers. The amount of resource that a diagram can use depends of the time
it reaches. BE service does not ensure any improvement in delay time, jitter, packet loss
ratio, and high reliability.

bit interleaved parity


(BIP)

A method of error monitoring. With even parity an X-bit code is generated by equipment
at the transmit end over a specified portion of the signal in such a manner that the first
bit of the code provides even parity over the first bit of all X-bit sequences in the covered
portion of the signal, the second bit provides even parity over the second bit of all X-bit
sequences within the specified portion, and so on. Even parity is generated by setting the
BIP-X bits so that there is an even number of 1s in each monitored partition of the signal.
A monitored partition comprises all bits which are in the same bit position within the Xbit sequences in the covered portion of the signal. The covered portion includes the BIPX.

bit interleaved parity-8 Consists of a parity byte calculated bit-wise across a large number of bytes in a
transmission transport frame. Divide a frame is into several blocks with 8 bits (one byte)
(BIP-8)
in a parity unit and then arrange the blocks in matrix. Compute the number of "1" or "0"
over each column. Then fill a 1 in the corresponding bit for the result if the number is
odd, otherwise fill a 0.
bridge protocol data
unit (BPDU)

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The data messages that are exchanged across the switches within an extended LAN that
uses a spanning tree protocol (STP) topology. BPDU packets contain information on
ports, addresses, priorities and costs and ensure that the data ends up where it was
intended to go. BPDU messages are exchanged across bridges to detect loops in a
network topology. The loops are then removed by shutting down selected bridges
interfaces and placing redundant switch ports in a backup, or blocked, state.

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A Glossary

broadband integrated A standard defined by the ITU-T to handle high-bandwidth applications, such as voice.
services digital network It currently uses the ATM technology to transmit data over SONNET-based circuits at
(B-ISDN)
155 to 622 Mbit/s or higher speed.
broadband remote
access server (BRAS)

A new type of access gateway for broadband networks. As a bridge between backbone
networks and broadband access networks, BRAS provides methods for fundamental
access and manages the broadband access network. It is deployed at the edge of network
to provide broadband access services, convergence, and forwarding of multiple services,
meeting the demands for transmission capacity and bandwidth utilization of different
users. BRAS is a core device for the broadband users' access to a broadband network.

building integrated
timing supply (BITS)

In the situation of multiple synchronous nodes or communication devices, one can use
a device to set up a clock system on the hinge of telecom network to connect the
synchronous network as a whole, and provide satisfactory synchronous base signals to
the building integrated device. This device is called BITS.

built-in WDM

A function which integrates some simple WDM systems into products that belong to the
OSN series. That is, the OSN products can add or drop several wavelengths directly.

C
CAR

committed access rate

CAS

See channel associated signaling.

CAS multiframe

A multiframe set up based on timeslot 16. Each CAS multiframe contains 16 E1 PCM
frames. Among the 8 bits of timeslot 16 in the first frame, the first 4 bits are used for
multiframe synchronization. The multiframe alignment signal (MFAS) for
synchronization is 0000. The last 4 bits are used as the not multiframe alignment signal
(NMFAS). The NMFAS is XYXX. For the other 15 frames, timeslot 16 is used to
transmit exchange and multiplexing (E&M) signaling corresponding to each timeslot.

CAU

See client automatic upgrade.

CBR

See constant bit rate.

CBS

See committed burst size.

CC

See continuity check.

CDVT

cell delay variation tolerance

CE

See customer edge.

CES

See circuit emulation service.

CFM

connectivity fault management

CFR

cell fill rate

CGMP

Cisco Group Management Protocol

CIR

committed information rate

CISPR

International Special Committee on Radio Interference

CIST

See Common and Internal Spanning Tree.

CLEI

common language equipment identification

CLNP

connectionless network protocol

CLP

See cell loss priority.

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A Glossary

CMI

coded mark inversion

CRC

See cyclic redundancy check.

CRC-4 multiframe

A multiframe recommended by ITU-T G.704 and set up based on the first bit of timeslot
0. The CRC-4 multiframe is different from the CAS multiframe in principle and
implementation. Each CRC-4 multiframe contains 16 PCM frames. Each CRC-4
multiframe consists of two CRC-4 sub-multiframes. Each CRC-4 sub-multiframe is a
CRC-4 check block that contains 2048 (256 x 8) bits. Bits C1 to C4 of a check block can
check the previous check block.

CSA

Canadian Standards Association

CSES

consecutive severely errored second

CSF

Client Signal Fail

CSMA/CD

See carrier sense multiple access with collision detection.

CSPF

constraint shortest path first

CST

See common spanning tree.

CV

connectivity verification

CW

control word

CWDM

See coarse wavelength division multiplexing.

Common and Internal The single spanning tree jointly calculated by STP and RSTP, the logical connectivity
Spanning Tree (CIST) using MST bridges and regions, and MSTP. The CIST ensures that all LANs in the
bridged local area network are simply and fully connected.
Coordinated Universal The world-wide scientific standard of timekeeping. It is based upon carefully maintained
Time (UTC)
atomic clocks and is kept accurate to within microseconds worldwide.
carrier sense multiple
access with collision
detection (CSMA/CD)

Carrier sense multiple access with collision detection (CSMA/CD) is a computer


networking access method in which:
l

A carrier sensing scheme is used.

A transmitting data station that detects another signal while transmitting a frame,
stops transmitting that frame, transmits a jam signal, and then waits for a random
time interval before trying to send that frame again.

cell loss priority (CLP) A field in the ATM cell header that determines the probability of a cell being dropped
if the network becomes congested. Cells with CLP = 0 are insured traffic, which is
unlikely to be dropped. Cells with CLP = 1 are best-effort traffic, which might be
dropped.
channel associated
signaling (CAS)

A signaling system in which signaling information is transmitted within a dedicated voice


channel. China Signaling System No. 1 is a type of CAS signaling.

circuit emulation
service (CES)

A function with which the E1/T1 data can be transmitted through ATM networks. At the
transmission end, the interface module packs timeslot data into ATM cells. These ATM
cells are sent to the reception end through the ATM network. At the reception end, the
interface module re-assigns the data in these ATM cells to E1/T1 timeslots. The CES
technology guarantees that the data in E1/T1 timeslots can be recovered to the original
sequence at the reception end.

client automatic
upgrade (CAU)

A function that enables a user to automatically detect the update of the client version and
upgrade the client. This keeps the version of the client is the same as that of the server.

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A Glossary

coarse wavelength
division multiplexing
(CWDM)

A signal transmission technology that multiplexes widely-spaced optical channels into


the same fiber. CWDM widely spaces wavelengths at a spacing of several nm. CWDM
does not support optical amplifiers and is applied in short-distance chain networking.

collision

A condition in which two packets are being transmitted over a medium at the same time.
Their interference makes both unintelligible.

committed burst size


(CBS)

A parameter used to define the capacity of token bucket C, that is, the maximum burst
IP packet size when the information is transferred at the committed information rate.
This parameter must be larger than 0. It is recommended that this parameter should be
not less than the maximum length of the IP packet that might be forwarded.

common spanning tree A single spanning tree that connects all the MST regions in a network. Every MST region
(CST)
is considered as a switch; therefore, the CST can be considered as their spanning tree
generated with STP/RSTP.
constant bit rate (CBR) A kind of service categories defined by the ATM forum. CBR transfers cells based on
the constant bandwidth. It is applicable to service connections that depend on precise
clocking to ensure undistorted transmission.
continuity check (CC)

Ethernet CFM can detect the connectivity between MEPs. The detection is achieved after
MEPs transmit Continuity Check Messages (CCMs) periodically.

customer edge (CE)

A part of BGP/MPLS IP VPN model. It provides interfaces for direct connection to the
Service Provider (SP) network. A CE can be a router, switch, or host.

cyclic redundancy
check (CRC)

A procedure used in checking for errors in data transmission. CRC error checking uses
a complex calculation to generate a number based on the data transmitted. The sending
device performs the calculation before transmission and includes it in the packet that it
sends to the receiving device. The receiving device repeats the same calculation after
transmission. If both devices obtain the same result, it is assumed that the transmission
was error free. The procedure is known as a redundancy check because each transmission
includes not only data but extra (redundant) error-checking values.

D
DC

direct current

DC-C

See DC-return common (with ground).

DC-I

See DC-return isolate (with ground).

DC-return common
(with ground) (DC-C)

A power system, in which the BGND of the DC return conductor is short-circuited with
the PGND on the output side of the power supply cabinet and also on the line between
the output of the power supply cabinet and the electric equipment.

DC-return isolate (with A power system, in which the BGND of the DC return conductor is short-circuited with
ground) (DC-I)
the PGND on the output side of the power supply cabinet and is isolated from the PGND
on the line between the output of the power supply cabinet and the electric equipment.
DCC

See data communications channel.

DCE

data connection equipment

DCM

See dispersion compensation module.

DCN

See data communication network.

DDF

digital distribution frame

DDN

See digital data network.

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DE

discard eligible

DEI

device emulation interrupt

DHCP

See Dynamic Host Configuration Protocol.

DIP switch

dual in-line package switch

DLAG

See distributed link aggregation group.

DM

See delay measurement.

DNI

dual node interconnection

DRDB

dynamic random database

DSCP

See differentiated services code point.

DSL

See digital subscriber line.

DSLAM

See digital subscriber line access multiplexer.

DTE

See data terminal equipment.

DTMF

See dual tone multiple frequency.

DVB-ASI

digital video broadcast-asynchronous serial interface

DVMRP

See Distance Vector Multicast Routing Protocol.

DWDM

See dense wavelength division multiplexing.

DiffServ

See Differentiated Services.

A Glossary

Differentiated Services An IETF standard that defines a mechanism for controlling and forwarding traffic in a
(DiffServ)
differentiated manner based on CoS settings to handle network congestion.
Distance Vector
Multicast Routing
Protocol (DVMRP)

An Internet gateway protocol mainly based on the RIP. The protocol implements a typical
dense mode IP multicast solution. The DVMRP protocol uses IGMP to exchange routing
datagrams with its neighbors.

Dynamic Host
A client-server networking protocol. A DHCP server provides configuration parameters
Configuration Protocol specific to the DHCP client host requesting, generally, information required by the host
(DHCP)
to participate on the Internet network. DHCP also provides a mechanism for allocation
of IP addresses to hosts.
data communication
network (DCN)

A communication network used in a TMN or between TMNs to support the data


communication function.

data communications
channel (DCC)

The data channel that uses the D1D12 bytes in the overhead of an STM-N signal to
transmit information about operation, management, maintenance and provision
(OAM&P) between NEs. The DCC channels that are composed of bytes D1D3 are
referred to as the 192 kbit/s DCC-R channel. The other DCC channels that are composed
of bytes D4D12 are referred to as the 576 kbit/s DCC-M channel.

data terminal
equipment (DTE)

A user device composing the UNI. The DTE accesses the data network through the DCE
equipment (for example, a modem) and usually uses the clock signals produced by DCE.

delay measurement
(DM)

The time elapsed since the start of transmission of the first bit of the frame by a source
node until the reception of the last bit of the loopbacked frame by the same source node,
when the loopback is performed at the frame's destination node.

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A Glossary

dense wavelength
division multiplexing
(DWDM)

The technology that utilizes the characteristics of broad bandwidth and low attenuation
of single mode optical fiber, employs multiple wavelengths with specific frequency
spacing as carriers, and allows multiple channels to transmit simultaneously in the same
fiber.

differentiated services
code point (DSCP)

According to the QoS classification standard of the Differentiated Service (Diff-Serv),


the type of services (ToS) field in the IP header consists of six most significant bits and
two currently unused bits, which are used to form codes for priority marking.
Differentiated services code point (DSCP) is the six most important bits in the ToS. It is
the combination of IP precedence and types of service. The DSCP value is used to ensure
that routers supporting only IP precedence can be used because the DSCP value is
compatible with IP precedence. Each DSCP maps a per-hop behavior (PHB). Therefore,
terminal devices can identify traffic using the DSCP value.

digital data network


(DDN)

A high-quality data transport tunnel that combines the digital channel (such as fiber
channel, digital microwave channel, or satellite channel) and the cross multiplex
technology.

digital subscriber line


(DSL)

A technology for providing digital connections over the copper wire or the local
telephone network. DSL performs data communication over the POTS lines without
affecting the POTS service.

digital subscriber line


access multiplexer
(DSLAM)

A network device, usually situated in the main office of a telephone company that
receives signals from multiple customer Digital Subscriber Line (DSL) connections and
puts the signals on a high-speed backbone line using multiplexing techniques.

dispersion

The maximum error of the local clock compared with the reference clock.

dispersion
compensation module
(DCM)

A module, which contains dispersion compensation fibers to compensate for the


dispersion of transmitting fiber.

distributed link
aggregation group
(DLAG)

A board-level port protection technology used to detect unidirectional fiber cuts and to
negotiate with the opposite end. Once a link down failure occurs on a port or a hardware
failure occurs on a board, the services can automatically be switched to the slave board,
achieving 1+1 protection for the inter-board ports.

dual tone multiple


frequency (DTMF)

In telephone systems, multifrequency signaling in which standard set combinations of


two specific voice band frequencies, one from a group of four low frequencies and the
other from a group of four higher frequencies, are used.

E
E-Aggr

See Ethernet aggregation.

E-LAN

See Ethernet local area network.

E-Line

See Ethernet line.

EBS

See excess burst size.

ECC

See embedded control channel.

EDFA

See erbium-doped fiber amplifier.

EEPROM

See electrically erasable programable read-only memory.

EF

See expedited forwarding.

EFM

Ethernet in the First Mile

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EFM OAM

Ethernet in the first mile OAM

EIA

See Electronic Industries Alliance.

EIR

See excess information rate.

EMC

See electromagnetic compatibility.

EPD

early packet discard

EPL

See Ethernet private line.

EPLAN

See Ethernet private LAN service.

EPON

See Ethernet passive optical network.

ERPS

Ethernet ring protection switching

ESC

See electric supervisory channel.

ESCON

See enterprise system connection.

ESD

electrostatic discharge

ESN

See equipment serial number.

ETS

European Telecommunication Standards

ETSI

See European Telecommunications Standards Institute.

EVC

Ethernet virtual connection

EVPL

See Ethernet virtual private line.

EVPLAN

See Ethernet virtual private LAN service.

Electronic Industries
Alliance (EIA)

An association based in Washington, D.C., with members from various electronics


manufacturers. It sets standards for electronic components. RS-232-C, for example, is
the EIA standard for connecting serial components.

EoD

See Ethernet over dual domains.

Ethernet

A LAN technology that uses Carrier Sense Multiple Access/Collision Detection. The
speed of an Ethernet interface can be 10 Mbit/s, 100 Mbit/s, 1000 Mbit/s or 10000 Mbit/
s. An Ethernet network features high reliability and is easy to maintain.

Ethernet aggregation
(E-Aggr)

A type of Ethernet service that is based on a multipoint-to-point EVC (Ethernet virtual


connection).

Ethernet line (E-Line)

A type of Ethernet service that is based on a point-to-point EVC (Ethernet virtual


connection).

Ethernet local area


network (E-LAN)

A type of Ethernet service that is based on a multipoint-to-multipoint EVC (Ethernet


virtual connection).

Ethernet over dual


domains (EoD)

A type of boards. EoD boards bridge the PSN and TDM networks, enabling Ethernet
service transmission across PSN and TDM networks.

Ethernet passive
optical network
(EPON)

A passive optical network based on Ethernet. It is a new generation broadband access


technology that uses a point-to-multipoint structure and passive fiber transmission. It
supports upstream/downstream symmetrical rates of 1.25 Gbit/s and a reach distance of
up to 20 km. In the downstream direction, the bandwidth is shared based on encrypted
broadcast transmission for different users. In the upstream direction, the bandwidth is
shared based on TDM. EPON meets the requirements for high bandwidth.

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A Glossary

Ethernet private LAN


service (EPLAN)

A type of Ethernet service provided by SDH, PDH, ATM, or MPLS networks. This
service is carried over a dedicated bridge and point-to-multipoint connections.

Ethernet private line


(EPL)

A type of Ethernet service that is provided with dedicated bandwidth and point-to-point
connections on an SDH, PDH, ATM, or MPLS server layer network.

Ethernet virtual
private LAN service
(EVPLAN)

A type of Ethernet service provided by SDH, PDH, ATM, or MPLS networks. This
service is carried over a shared bridge and point-to-multipoint connections.

Ethernet virtual
private line (EVPL)

A type of Ethernet service provided by SDH, PDH, ATM, or MPLS networks. This
service is carried over a shared bridge and point-to-point connections.

European
Telecommunications
Standards Institute
(ETSI)

A standards-setting body in Europe. Also the standards body responsible for GSM.

eSFP

enhanced small form-factor pluggable

electric supervisory
channel (ESC)

A technology that implements communication among all the nodes and transmission of
monitoring data in an optical transmission network. The monitoring data of ESC is
introduced into DCC service overhead and is transmitted with service signals.

electrically erasable
A type of EPROM that can be erased with an electrical signal. It is useful for stable
programable read-only storage for long periods without electricity while still allowing reprograming. EEPROMs
memory (EEPROM)
contain less memory than RAM, take longer to reprogram, and can be reprogramed only
a limited number of times before wearing out.
electromagnetic
compatibility (EMC)

A condition which prevails when telecommunications equipment is performing its


individually designed function in a common electromagnetic environment without
causing or suffering unacceptable degradation due to unintentional electromagnetic
interference to or from other equipment in the same environment.

embedded control
channel (ECC)

A logical channel that uses a data communications channel (DCC) as its physical layer,
to enable transmission of operation, administration, and maintenance (OAM)
information between NEs.

encapsulation

A technology for layered protocols, in which a lower-level protocol accepts a message


from a higher-level protocol and places it in the data portion of the lower-level frame.
Protocol A's packets have complete header information, and are carried by protocol B
as data. Packets that encapsulate protocol A have a B header, an A header, followed by
the information that protocol A is carrying. Note that A could equal to B, as in IP inside
IP.

enterprise system
connection (ESCON)

A path protocol which connects the host with various control units in a storage system.
It is a serial bit stream transmission protocol. The transmission rate is 200 Mbit/s.

equalization

A method of avoiding selective fading of frequencies. Equalization can compensate for


the changes of amplitude frequency caused by frequency selective fading.

equipment serial
number (ESN)

A string of characters that identify a piece of equipment and ensures correct allocation
of a license file to the specified equipment. It is also called "equipment fingerprint".

erbium-doped fiber
amplifier (EDFA)

An optical device that amplifies the optical signals. The device uses a short length of
optical fiber doped with the rare-earth element Erbium and the energy level jump of
Erbium ions activated by pump sources. When the amplifier passes the external light
source pump, it amplifies the optical signals in a specific wavelength range.

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A Glossary

excess burst size (EBS) A parameter related to traffic. In the single rate three color marker (srTCM) mode, the
traffic control is achieved by the token buckets C and E. Excess burst size is a parameter
used to define the capacity of token bucket E, that is, the maximum burst IP packet size
when the information is transferred at the committed information rate. This parameter
must be larger than 0. It is recommended that this parameter should be not less than the
maximum length of the IP packet that might be forwarded.
excess information rate The bandwidth for excessive or burst traffic above the CIR; it equals the result of the
(EIR)
actual transmission rate without the safety rate.
exercise switching

An operation to check whether the protection switching protocol functions properly. The
protection switching is not really performed.

expedited forwarding
(EF)

The highest order QoS in the Diff-Serv network. EF PHB is suitable for services that
demand low packet loss ratio, short delay, and broad bandwidth. In all the cases, EF
traffic can guarantee a transmission rate equal to or faster than the set rate. The DSCP
value of EF PHB is "101110".

F
FC

See fiber channel.

FCC

Federal Communications Commission

FDD

See frequency division duplex.

FDDI

See fiber distributed data interface.

FDI

See forward defect indication.

FDI packet

See forward defect indication packet.

FDV

See frame delay variation.

FEC

See forwarding equivalence class.

FFD

fast failure detection

FIB

See forward information base.

FICON

See Fiber Connect.

FIFO

See first in first out.

FLR

See frame loss ratio.

FPGA

See field programmable gate array.

FPS

See fast protection switching.

FRR

See fast reroute.

FTN

FEC to NHLFE

FTP

File Transfer Protocol

Fiber Connect
(FICON)

A new generation connection protocol which connects the host to various control units.
It carries single byte command protocol through the physical path of fiber channel, and
provides higher rate and better performance than ESCON.

fast protection
switching (FPS)

A type of pseudo wire automatic protection switching (PW APS). When the working
PW is faulty, the source transmits services to the protection PW and the sink receives
the services from the protection PW. FPS generally works with the interworking function
(IWF) to provide end-to-end protection for services.

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A Glossary

fast reroute (FRR)

A technology which provides a temporary protection of link availability when part of a


network fails. The protocol enables the creation of a standby route or path for an active
route or path. When the active route is unavailable, the traffic on the active route can be
switched to the standby route. When the active route is recovered, the traffic can be
switched back to the active route. FRR is categorized into IP FRR, VPN FRR, and TE
FRR.

fiber channel (FC)

A high-speed transport technology used to build storage area networks (SANs). Fiber
channel can be on the networks carrying ATM and IP traffic. It is primarily used for
transporting SCSI traffic from servers to disk arrays. Fiber channel supports single-mode
and multi-mode fiber connections. Fiber channel signaling can run on both twisted pair
copper wires and coaxial cables. Fiber channel provides both connection-oriented and
connectionless services.

fiber distributed data


interface (FDDI)

A standard developed by the American National Standards Institute (ANSI) for highspeed fiber-optic local area networks (LANs). FDDI provides specifications for
transmission rates of 100 megabits (100 million bits) per second on networks based on
the token ring network.

field programmable
gate array (FPGA)

A type of semi-customized circuit used in the application specific integrated circuit


(ASIC) field. It is developed on the basis of the programmable components, such as the
PAL, GAL, and EPLD. It not only remedies the defects of customized circuits but also
overcomes the disadvantage of the original programmable components in terms of the
limited number of gate arrays.

first in first out (FIFO) A stack management mechanism. The first saved data is first read and invoked.
forward defect
indication (FDI)

A packet generated and traced forward to the sink node of the LSP by the node that first
detects defects. It includes fields to indicate the nature of the defect and its location. Its
primary purpose is to suppress alarms being raised at affected higher level client LSPs
and (in turn) their client layers.

forward defect
A packet that responds to the detected failure event. It is used to suppress alarms of the
indication packet (FDI upper layer network where failure has occurred.
packet)
forward information
base (FIB)

A table that provides information for network hardware (bridges and routers) for them
to forward data packets to other networks. The information contained in a routing table
differs according to whether it is used by a bridge or a router. A bridge relies on both the
source (originating) and destination addresses to determine where and how to forward a
packet.

forwarding equivalence A class-based forwarding technology that classifies the packets with the same forwarding
class (FEC)
mode. Packets with the same FEC are processed similarly on an MPLS network. The
division of FECs is flexible, and can be a combination of the source address, destination
address, source port, destination port, protocol type, and VPN.
frame delay variation
(FDV)

A measurement of the variations in the frame delay between a pair of service frames,
where the service frames belong to the same CoS instance on a point to point ETH
connection.

frame loss ratio (FLR) A ratio, is expressed as a percentage, of the number of service frames not delivered
divided by the total number of service frames during time interval T, where the number
of service frames not delivered is the difference between the number of service frames
arriving at the ingress ETH flow point and the number of service frames delivered at the
egress ETH flow point in a point-to-point ETH connection.

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frequency division
duplex (FDD)

A Glossary

An application in which channels are divided by frequency. In an FDD system, the uplink
and downlink use different frequencies. Downlink data is sent through bursts. Both
uplink and downlink transmission use frames with fixed time length.

G
G-ACH

generic associated channel header

GAL

generic associated channel header label

GCC

general communication channel

GCP

GMPLS control plan

GCRA

generic cell rate algorithm

GFC

generic flow control

GFP

See Generic Framing Procedure.

GMPLS

generalized multiprotocol label switching

GNE

See gateway network element.

GPON

gigabit-capable passive optical network

GPS

See Global Positioning System.

GRE

See Generic Routing Encapsulation.

GSM

See Global System for Mobile Communications.

Generic Framing
Procedure (GFP)

A framing and encapsulation method which can be applied to any data type. It has been
standardized by ITU-T SG15.

Generic Routing
Encapsulation (GRE)

A mechanism for encapsulating any network layer protocol over any other network. GRE
is used for encapsulating IP datagrams tunneled through the Internet. GRE serves as a
Layer 3 tunneling protocol and provides a tunnel for transparently transmitting data
packets.

Global Positioning
System (GPS)

A global navigation satellite system. It provides reliable positioning, navigation, and


timing services to worldwide users.

Global System for


Mobile
Communications
(GSM)

The second-generation mobile networking standard defined by European


Telecommunications Standards Institute (ETSI). It is aimed at designing a standard for
global mobile phone networks. The standard allows a subscriber to use a phone globally.
GSM consists of three main parts: mobile switching subsystem (MSS), base station
subsystem (BSS), and mobile station (MS).

gain

The difference between the optical power from the input optical interface of the optical
amplifier and the optical power from the output optical interface of the jumper fiber,
which expressed in dB.

gateway network
element (GNE)

A network element that is used for communication between the NE application layer and
the NM application layer.

H
HCS

higher order connection supervision

HD

high definition

HD-SDI

See high definition-serial digital interface signal.

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A Glossary

HDB3

See high density bipolar of order 3 code.

HDLC

High-Level Data Link Control

HDTV

See high definition television.

HEC

See header error control.

HPA

high order path adaptation

HPT

higher order path termination

HQoS

See hierarchical quality of service.

HSDPA

See High Speed Downlink Packet Access.

HSI

high-speed Internet

HSL

See high-level script language.

High Speed Downlink


Packet Access
(HSDPA)

A modulating-demodulating algorithm put forward in 3GPP R5 to meet the requirement


for asymmetric uplink and downlink transmission of data services. It enables the
maximum downlink data service rate to reach 14.4 Mbit/s without changing the
WCDMA network topology.

header error control


(HEC)

A field within the ATM frame whose purpose is to correct any single bit error in the cell
Header and also to detect any multi-bit errors. It actually performs a CRC check in the
first four header bits and also at the receiving end.

hierarchical quality of
service (HQoS)

A type of QoS that controls the traffic of users and performs the scheduling according
to the priority of user services. HQoS has an advanced traffic statistics function, and the
administrator can monitor the usage of bandwidth of each service. Hence, the bandwidth
can be allocated reasonably through traffic analysis.

high definition
television (HDTV)

A type of TV that is capable of displaying at least 720 progressive or 1080 interlaced


active scan lines. It must be capable of displaying a 16:9 image using at least 540
progressive or 810 interlaced active scan lines.

high definition-serial
digital interface signal
(HD-SDI)

High definition video signal transported by serial digital interface.

high density bipolar of A code used for baseband transmissions between telecommunications devices. The
order 3 code (HDB3)
HDB3 code has the following feature: high capability of clock extraction, no direct
current component, error-checking capability, and a maximum of three consecutive
zeros.
high-level script
language (HSL)

A script language. Based on python, the HSL syntax is simple, clear, and extendable.

hot patch

A patch that is used to repair a deficiency in the software or add a new feature to a program
without restarting the software and interrupting the service. For the equipment using the
built-in system, a hot patch can be loaded, activated, confirmed, deactivated, deleted, or
queried.

I
IAE

incoming alignment error

IANA

See Internet Assigned Numbers Authority.

IC

See integrated circuit.

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A Glossary

ICC

See ITU carrier code.

ICMP

See Internet Control Message Protocol.

ICP

IMA Control Protocol

IEEE

See Institute of Electrical and Electronics Engineers.

IETF

See Internet Engineering Task Force.

IF

See intermediate frequency.

IGMP

See Internet Group Management Protocol.

IGMP snooping

A multicast constraint mechanism running on a layer 2 device. This protocol manages


and controls the multicast group by listening to and analyzing Internet Group
Management Protocol (IGMP) packets between hosts and Layer 3 devices. In this
manner, the spread of the multicast data on layer 2 network can be prevented efficiently.

IGP

See Interior Gateway Protocol.

ILM

incoming label map

IMA

See inverse multiplexing over ATM.

IN

intelligent network

IP

Internet Protocol

IPA

See intelligent power adjustment.

IPTV

See Internet Protocol television.

IPv4

See Internet Protocol version 4.

IPv6

See Internet Protocol version 6.

IS-IS

See Intermediate System to Intermediate System.

ISDN

integrated services digital network

ISO

International Organization for Standardization

ISP

See Internet service provider.

IST

internal spanning tree

ITC

independent transmit clock

ITU

See International Telecommunication Union.

ITU carrier code (ICC) A code assigned to a network operator/service provider, maintained by the ITU-T
Telecommunication Standardization Bureau (TSB).
ITU-T

See International Telecommunication Union-Telecommunication Standardization


Sector.

Institute of Electrical
and Electronics
Engineers (IEEE)

A society of engineering and electronics professionals based in the United States but
boasting membership from numerous other countries. The IEEE focuses on electrical,
electronics, computer engineering, and science-related matters.

Interior Gateway
Protocol (IGP)

A routing protocol that is used within an autonomous system. The IGP runs in smallsized and medium-sized networks. The commonly used IGPs are the routing information
protocol (RIP), the interior gateway routing protocol (IGRP), the enhanced IGRP
(EIGRP), and the open shortest path first (OSPF).

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A Glossary

Intermediate System to A protocol used by network devices (routers) to determine the best way to forward
Intermediate System
datagram or packets through a packet-based network.
(IS-IS)
International
Telecommunication
Union (ITU)

A United Nations agency, one of the most important and influential recommendation
bodies, responsible for recommending standards for telecommunication (ITU-T) and
radio networks (ITU-R).

International
Telecommunication
UnionTelecommunication
Standardization Sector
(ITU-T)

An international body that develops worldwide standards for telecommunications


technologies. These standards are grouped together in series which are prefixed with a
letter indicating the general subject and a number specifying the particular standard. For
example, X.25 comes from the "X" series which deals with data networks and open
system communications and number "25" deals with packet switched networks.

Internet Assigned
Numbers Authority
(IANA)

A department operated by the IAB. IANA delegates authority for IP address-space


allocation and domain-name assignment to the NIC and other organizations. IANA also
maintains a database of assigned protocol identifiers used in the TCP/IP suite, including
autonomous system numbers.

Internet Control
Message Protocol
(ICMP)

A network-layer (ISO/OSI level 3) Internet protocol that provides error correction and
other information relevant to IP packet processing. For example, it can let the IP software
on one machine inform another machine about an unreachable destination. See also
communications protocol, IP, ISO/OSI reference model, packet (definition 1).

Internet Engineering
Task Force (IETF)

A worldwide organization of individuals interested in networking and the Internet.


Managed by the Internet Engineering Steering Group (IESG), the IETF is charged with
studying technical problems facing the Internet and proposing solutions to the Internet
Architecture Board (IAB). The work of the IETF is carried out by various working groups
that concentrate on specific topics such as routing and security. The IETF is the publisher
of the specifications that led to the TCP/IP protocol standard.

Internet Group
Management Protocol
(IGMP)

One of the TCP/IP protocols for managing the membership of Internet Protocol multicast
groups. It is used by IP hosts and adjacent multicast routers to establish and maintain
multicast group memberships.

Internet Protocol
television (IPTV)

A system in which video is transmitted in IP packets. Also called "TV over IP", IPTV
uses streaming video techniques to deliver scheduled TV programs or video-on-demand
(VOD). Unlike transmitting over the air or through cable to a TV set, IPTV uses the
transport protocol of the Internet for delivery and requires either a computer and software
media player or an IPTV set-top box to decode the images in real time.

Internet Protocol
version 4 (IPv4)

The current version of the Internet Protocol (IP). IPv4 utilizes a 32bit address which is
assigned to hosts. An address belongs to one of five classes (A, B, C, D, or E) and is
written as 4 octets separated by periods and may range from 0.0.0.0 through to
255.255.255.255. Each IPv4 address consists of a network number, an optional
subnetwork number, and a host number. The network and subnetwork numbers together
are used for routing, and the host number is used to address an individual host within the
network or subnetwork.

Internet Protocol
version 6 (IPv6)

An update version of IPv4, which is designed by the Internet Engineering Task Force
(IETF) and is also called IP Next Generation (IPng). It is a new version of the Internet
Protocol. The difference between IPv6 and IPv4 is that an IPv4 address has 32 bits while
an IPv6 address has 128 bits.

Internet service
provider (ISP)

An organization that offers users access to the Internet and related services.

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A Glossary

integrated circuit (IC)

A combination of inseparable associated circuit elements that are formed in place and
interconnected on or within a single base material to perform a microcircuit function.

intelligent power
adjustment (IPA)

A mechanism used to reduce the optical power of all the amplifiers in an adjacent
regeneration section in the upstream to a safety level if the system detects the loss of
optical signals on the link. If the fiber is broken, the device performance degrades, or the
connector is not plugged well, the loss of optical signals may occur. With IPA,
maintenance engineers will not be hurt by the laser sent out from the slice of broken
fiber.

intermediate frequency The transitional frequency between the frequencies of a modulated signal and an RF
(IF)
signal.
inverse multiplexing
over ATM (IMA)

A technique that involves inverse multiplexing and de-multiplexing of ATM cells in a


cyclical fashion among links grouped to form a higher bandwidth logical link whose rate
is approximately the sum of the link rates.

L
L2VPN

Layer 2 virtual private network

L3VPN

Layer 3 virtual private network

LACP

See Link Aggregation Control Protocol.

LACPDU

Link Aggregation Control Protocol data unit

LAG

See link aggregation group.

LAN

See local area network.

LAPD

link access procedure on the D channel

LAPS

Link Access Protocol-SDH

LB

local battery

LC

Lucent connector

LCAS

See link capacity adjustment scheme.

LCK

See Locked signal function.

LCN

local communications network

LDP

Label Distribution Protocol

LED

See light emitting diode.

LER

See label edge router.

LIFO

See last in first out.

LLC

See logical link control.

LLID

local loopback ID

LM

See loss measurement.

LMP

link management protocol

LOC

loss of clock

LOM

loss of multiframe

LOP

loss of pointer

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A Glossary

LOS

See loss of signal.

LPA

low order path adaptation

LPT

link-state pass through

LSP

See label switched path.

LSR

See label switching router.

LT

linktrace

LVDS

See low voltage differential signal.

Layer 2 switching

A data forwarding method. In a LAN, a network bridge or 802.3 Ethernet switch


transmits and distributes packet data based on the MAC address. Since the MAC address
is at the second layer of the OSI model, this data forwarding method is called Layer 2
switching.

Link Aggregation
Control Protocol
(LACP)

A dynamic link aggregation protocol that improves the transmission speed and
reliability. The two ends of the link send LACP packets to inform each other of their
parameters and form a logical aggregation link. After the aggregation link is formed,
LACP maintains the link status in real time and dynamically adjusts the ports on the
aggregation link upon detecting the failure of a physical port.

Locked signal function A function administratively locks an MEG end point (MEP) at the server layer, informs
(LCK)
consequential data traffic interruption to the peer MEP at the client layer, and suppresses
the alarm at the client layer.
label edge router (LER) A device that sits at the edge of an MPLS domain, that uses routing information to assign
labels to datagrams and then forwards them into the MPLS domain.
label switched path
(LSP)

A sequence of hops (R0...Rn) in which a packet travels from R0 to Rn through label


switching mechanisms. A label-switched path can be chosen dynamically, based on
common routing mechanisms or through configuration.

label switching router


(LSR)

Basic element of an MPLS network. All LSRs support the MPLS protocol. The LSR is
composed of two parts: control unit and forwarding unit. The former is responsible for
allocating the label, selecting the route, creating the label forwarding table, creating and
removing the label switch path; the latter forwards the labels according to groups
received in the label forwarding table.

last in first out (LIFO) A play mode of the voice mails, the last voice mail is played firstly.
light emitting diode
(LED)

A display and lighting technology used in almost every electrical and electronic product
on the market, to from a tiny on/off light to digital readouts, flashlights, traffic lights and
perimeter lighting. LEDs are also used as the light source in multimode fibers, optical
mice and laser-class printers.

linear MSP

linear multiplex section protection

link aggregation group An aggregation that allows one or more links to be aggregated together to form a link
(LAG)
aggregation group so that a MAC client can treat the link aggregation group as if it were
a single link.
link capacity
adjustment scheme
(LCAS)

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LCAS in the virtual concatenation source and sink adaptation functions provides a
control mechanism to hitless increase or decrease the capacity of a link to meet the
bandwidth needs of the application. It also provides a means of removing member links
that have experienced failure. The LCAS assumes that in cases of capacity initiation,
increases or decreases, the construction or destruction of the end-to-end path is the
responsibility of the network and element management systems.

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A Glossary

local area network


(LAN)

A network formed by the computers and workstations within the coverage of a few square
kilometers or within a single building. It features high speed and low error rate. Ethernet,
FDDI, and Token Ring are three technologies used to implement a LAN. Current LANs
are generally based on switched Ethernet or Wi-Fi technology and running at 1,000 Mbit/
s (that is, 1 Gbit/s).

logical link control


(LLC)

According to the IEEE 802 family of standards, Logical Link Control (LLC) is the upper
sublayer of the OSI data link layer. The LLC is the same for the various physical media
(such as Ethernet, token ring, WLAN).

loss measurement (LM) A method used to collect counter values applicable for ingress and egress service frames
where the counters maintain a count of transmitted and received data frames between a
pair of MEPs.
loss of signal (LOS)

No transitions occurring in the received signal.

low voltage differential A low noise, low power, low amplitude method for high-speed (gigabits per second) data
signal (LVDS)
transmission over copper wire.
M
MA

maintenance association

MAC

See Media Access Control.

MADM

multiple add/drop multiplexer

MAN

See metropolitan area network.

MBS

maximum burst size

MCF

message communication function

MCR

minimum cell rate

MD

See maintenance domain.

MDF

See main distribution frame.

MDP

message dispatch process

MDU

See multi-dwelling unit.

ME

See maintenance entity.

MEG

See maintenance entity group.

MEL

maintenance entity group level

MEP

maintenance end point

MFAS

See multiframe alignment signal.

MIB

See management information base.

MIP

maintenance intermediate point

MLD

See multicast listener discovery.

MP

maintenance point

MPLS

See Multiprotocol Label Switching.

MPLS TE

multiprotocol label switching traffic engineering

MPLS TP

See Multiprotocol Label Switching traffic policing.

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A Glossary

MPLS VPN

See multiprotocol label switching virtual private network.

MPLS-TP

See multiprotocol label switching transport profile.

MS

multiplex section

MSA

multiplex section adaptation

MSB

most significant bit

MSOH

multiplex section overhead

MSP

See multiplex section protection.

MST

See multiplex section termination.

MSTI

See multiple spanning tree instance.

MSTP

See Multiple Spanning Tree Protocol.

MTBF

See mean time between failures.

MTTR

See mean time to repair.

MTU

See maximum transmission unit.

MUX

See multiplexer.

Media Access Control


(MAC)

A protocol at the media access control sublayer. The protocol is at the lower part of the
data link layer in the OSI model and is mainly responsible for controlling and connecting
the physical media at the physical layer. When transmitting data, the MAC protocol
checks whether to be able to transmit data. If the data can be transmitted, certain control
information is added to the data, and then the data and the control information are
transmitted in a specified format to the physical layer. When receiving data, the MAC
protocol checks whether the information is correct and whether the data is transmitted
correctly. If the information is correct and the data is transmitted correctly, the control
information is removed from the data and then the data is transmitted to the LLC layer.

Multiple Spanning
Tree Protocol (MSTP)

A protocol that can be used in a loop network. Using an algorithm, the MSTP blocks
redundant paths so that the loop network can be trimmed as a tree network. In this case,
the proliferation and endless cycling of packets is avoided in the loop network. The
protocol that introduces the mapping between VLANs and multiple spanning trees. This
solves the problem that data cannot be normally forwarded in a VLAN because in STP/
RSTP, only one spanning tree corresponds to all the VLANs.

Multiprotocol Label
Switching (MPLS)

A technology that uses short tags of fixed length to encapsulate packets in different link
layers, and provides connection-oriented switching for the network layer on the basis of
IP routing and control protocols. It improves the cost performance and expandability of
networks, and is beneficial to routing.

Multiprotocol Label
Switching traffic
policing (MPLS TP)

It is a scheme that supervises the specific traffic entering the communication devices.
By policing the speed of traffic that enters the network, it "punishes" the traffic out of
the threshold, so the traffic going into network is limited to a reasonable range, protecting
the network resources and the interests of the carriers.

main distribution
frame (MDF)

A device at a central office, on which all local loops are terminated.

maintenance domain
(MD)

The network or the part of the network for which connectivity is managed by connectivity
fault management (CFM). The devices in a maintenance domain are managed by a single
Internet service provider (ISP).

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A Glossary

maintenance entity
(ME)

An ME consists of a pair of maintenance entity group end points (MEPs), two ends of a
transport trail, and maintenance association intermediate points (MIPs) on the trail.

maintenance entity
group (MEG)

A MEG consists of MEs that meet the following criteria:


l

Exist within the same management edges.

Have the same MEG hierarchy.

Belong to the same P2P or P2MP connection.

management
A type of database used for managing the devices in a communications network. It
information base (MIB) comprises a collection of objects in a (virtual) database used to manage entities (such as
routers and switches) in a network.
maximum transmission The largest packet of data that can be transmitted on a network. MTU size varies,
unit (MTU)
depending on the network576 bytes on X.25 networks, for example, 1500 bytes on
Ethernet, and 17,914 bytes on 16 Mbit/s token ring. Responsibility for determining the
size of the MTU lies with the link layer of the network. When packets are transmitted
across networks, the path MTU, or PMTU, represents the smallest packet size (the one
that all networks can transmit without breaking up the packet) among the networks
involved.
mean time between
failures (MTBF)

The average time between consecutive failures of a piece of equipment. It is a measure


of the reliability of the system.

mean time to repair


(MTTR)

The average time that a device will take to recover from a failure.

metropolitan area
network (MAN)

A network that interconnects users with computer resources in a geographic area or


region larger than that covered by even a large LAN but smaller than the area covered
by an WAN. The term is applied to the interconnection of networks in a city into a single
larger network (which may then also offer efficient connection to a wide area network).
It is also used to mean the interconnection of several local area networks by bridging
them with backbone lines. The latter usage is also sometimes referred to as a campus
network.

mirror

An action to store a copy of a file to another archive site to release the load of the original
site, or to provide an archive site closer to the users geographically.

mirroring

The duplication of data for backup or to distribute network traffic among several
computers with identical data.

multi-dwelling unit
(MDU)

A network access unit used for multi-dwelling units. It provides Ethernet and IP services
and optionally VoIP or CATV services; has multiple broadband interfaces on the user
side and optionally POTS ports or CATV RF ports. It is mainly applicable to FTTB,
FTTC, or FTTCab networks.

multicast listener
discovery (MLD)

A protocol used by an IPv6 router to discover the multicast listeners on their directly
connected network segments, and to set up and maintain member relationships. On IPv6
networks, after MLD is configured on the receiver hosts and the multicast router to which
the hosts are directly connected, the hosts can dynamically join related groups and the
multicast router can manage members on the local network.

multiframe alignment
signal (MFAS)

A distinctive signal inserted in every multiframe or once in every n multiframes, always


occupying the same relative position within the multiframe, and used to establish and
maintain multiframe alignment.

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A Glossary

multiple spanning tree A type of spanning trees calculated by MSTP within an MST Region, to provide a simply
instance (MSTI)
and fully connected active topology for frames classified as belonging to a VLAN that
is mapped to the MSTI by the MST Configuration. A VLAN cannot be assigned to
multiple MSTIs.
multiplex section
protection (MSP)

A function, which is performed to provide capability for switching a signal between and
including two multiplex section termination (MST) functions, from a "working" to a
"protection" channel.

multiplex section
termination (MST)

A function, which is performed to generate the MSOH during the process of forming an
SDH frame signal and terminates the MSOH in the reverse direction.

multiplexer (MUX)

Equipment which combines a number of tributary channels onto a fewer number of


aggregate bearer channels, the relationship between the tributary and aggregate channels
being fixed.

multiprotocol label
switching transport
profile (MPLS-TP)

A packet transport technology proposed by IETF that combines the packet experience
of MPLS with the operational experience of transport networks.

multiprotocol label
switching virtual
private network
(MPLS VPN)

An Internet Protocol (IP) virtual private network (VPN) based on the multiprotocol label
switching (MPLS) technology. It applies the MPLS technology for network routers and
switches, simplifies the routing mode of core routers, and combines traditional routing
technology and label switching technology. It can be used to construct the broadband
Intranet and Extranet to meet various service requirements.

N
NAS

network access server

NDF

new data flag

NHLFE

next hop label forwarding entry

NMC

network management center

NNI

network-to-network interface

NPC

See network parameter control.

NPE

network provider edge

NRT-VBR

non-real-time variable bit rate

NRZ

non-return to zero

NRZI

non-return to zero inverted

NSAP

See network service access point.

NSF

non-stop forwarding

NTP

Network Time Protocol

network parameter
control (NPC)

During communications, UPC is implemented to monitor the actual traffic on each virtual
circuit that is input to the network. Once the specified parameter is exceeded, measures
will be taken to control. NPC is similar to UPC in function. The difference is that the
incoming traffic monitoring function is divided into UPC and NPC according to their
positions. UPC locates at the user/network interface, while NPC at the network interface.

network service access A network address defined by ISO, at which the OSI Network Service is made available
point (NSAP)
to a Network service user by the Network service provider.

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Hardware Description

A Glossary

O
O&M

operation and maintenance

OA

optical amplifier

OADM

See optical add/drop multiplexer.

OAM

See operation, administration and maintenance.

OAMPDU

operation, administration and maintenance protocol data unit

OAU

See optical amplifier unit.

OC

ordinary clock

OCP

optical channel protection

OCS

optical core switching

ODF

optical distribution frame

ODU

See outdoor unit.

OLT

optical line terminal

ONT

See optical network terminal.

ONU

See optical network unit.

OPEX

operating expense

OPU

optical channel payload unit

OSC

See optical supervisory channel.

OSI

See open systems interconnection.

OSN

optical switch node

OSNR

See optical signal-to-noise ratio.

OSPF

See Open Shortest Path First.

OTDR

See optical time domain reflectometer.

OTM

optical terminal multiplexer

OTN

optical transport network

OTU

See optical transponder unit.

OTUk

optical channel transport unit-k

Open Shortest Path


First (OSPF)

A link-state, hierarchical interior gateway protocol (IGP) for network routing. Dijkstra's
algorithm is used to calculate the shortest path tree. It uses cost as its routing metric. A
link state database is constructed with the network topology which is identical on all
routers in the area.

open systems
interconnection (OSI)

A framework of ISO standards for communication between different systems made by


different vendors, in which the communications process is organized into seven different
categories that are placed in a layered sequence based on their relationship to the user.
Each layer uses the layer immediately below it and provides a service to the layer above.
Layers 7 through 4 deal with end-to-end communication between the message source
and destination, and layers 3 through 1 deal with network functions.

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A Glossary

operation,
administration and
maintenance (OAM)

A group of network support functions that monitor and sustain segment operation,
support activities that are concerned with, but not limited to, failure detection,
notification, location, and repairs that are intended to eliminate faults and keep a segment
in an operational state, and support activities required to provide the services of a
subscriber access network to users/subscribers.

optical add/drop
multiplexer (OADM)

A device that can be used to add the optical signals of various wavelengths to one channel
and drop the optical signals of various wavelengths from one channel.

optical amplifier unit


(OAU)

A board that is mainly responsible for amplifying optical signals. The OAU can be used
in both the transmitting direction and the receiving direction.

optical network
terminal (ONT)

A device that terminates the fiber optical network at the customer premises.

optical network unit


(ONU)

A form of Access Node that converts optical signals transmitted via fiber to electrical
signals that can be transmitted via coaxial cable or twisted pair copper wiring to
individual subscribers.

optical signal-to-noise
ratio (OSNR)

The ratio of signal power and noise power in a transmission link. OSNR is the most
important index of measuring the performance of a DWDM system. OSNR = signal
power/noise power.

optical supervisory
channel (OSC)

A technology that uses specific optical wavelengths to realize communication among


nodes in optical transmission network and transmit the monitoring data in a certain
channel.

optical time domain


reflectometer (OTDR)

A device that sends a very short pulse of light down a fiber optic communication system
and measures the time history of the pulse reflection to measure the fiber length, the light
loss and locate the fiber fault.

optical transponder
unit (OTU)

A device or subsystem that converts the accessed client signals into the G.694.1/G.694.2compliant WDM wavelength.

orderwire

A channel that provides voice communication between operation engineers or


maintenance engineers of different stations.

outdoor unit (ODU)

The outdoor unit of the split-structured radio equipment. It implements frequency


conversion and amplification for radio frequency (RF) signals.

P
P2MP

point-to-multipoint

P2P

See point-to-point service.

PADR

PPPoE active discovery request

PBS

See peak burst size.

PCB

See printed circuit board.

PCM

See pulse code modulation.

PCR

See peak cell rate.

PDH

See plesiochronous digital hierarchy.

PDU

See power distribution unit.

PE

See provider edge.

PHB

See per-hop behavior.

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A Glossary

PHP

penultimate hop popping

PIM-DM

Protocol Independent Multicast - Dense Mode

PIM-SM

Protocol Independent Multicast - Sparse Mode

PIR

peak information rate

PLL

See phase-locked loop.

PM

performance monitoring

PMS

Product Management System

POH

path overhead

PON

passive optical network

POS

See packet over SDH/SONET.

PPD

partial packet discard

PPI

PDH physical interface

PPP

Point-to-Point Protocol

PPPoE

Point-to-Point Protocol over Ethernet

PPS

port protection switching

PQ

See priority queuing.

PRBS

See pseudo random binary sequence.

PRC

primary reference clock

PRI

primary rate interface

PSD

See power spectrum density.

PSN

See packet switched network.

PSTN

See public switched telephone network.

PSU

power supply unit

PT

payload type

PTI

payload type indicator

PTN

packet transport network

PTP

See point to point.

PVID

See port default VLAN ID.

PVP

See permanent virtual path.

PW

See pseudo wire.

PWE3

See pseudo wire emulation edge-to-edge.

packet over SDH/


SONET (POS)

A MAN and WAN technology that provides point-to-point data connections. The POS
interface uses SDH/SONET as the physical layer protocol, and supports the transport of
packet data (such as IP packets) in MAN and WAN.

packet switched
network (PSN)

A telecommunications network that works in packet switching mode.

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A Glossary

packet switching

A network technology in which information is transmitted by means of exchanging


packets and the bandwidth of a channel can be shared by multiple connections.

parity check

A method for character level error detection. An extra bit is added to a string of bits,
usually a 7-bit ASCII character, so that the total number of bits 1 is odd or even (odd or
even parity). Both ends of a data transmission must use the same parity. When the
transmitting device frames a character, it counts the numbers of 1s in the frame and
attaches the appropriate parity bit. The recipient counts the 1s and, if there is parity error,
may ask for the data to be retransmitted.

peak burst size (PBS)

A parameter that is used to define the capacity of token bucket P, that is, the maximum
burst IP packet size when the information is transferred at the peak information rate. This
parameter must be larger than 0. It is recommended that PBS should be not less than the
maximum length of the IP packet that might be forwarded. See also CIR, CBS, and PIR.

peak cell rate (PCR)

The maximum rate at which an ATM connection can accept cells.

per-hop behavior
(PHB)

IETF Diff-Serv workgroup defines forwarding behaviors of network nodes as per-hop


behaviors (PHB), such as, traffic scheduling and policing. A device in the network should
select the proper PHB behaviors, based on the value of DSCP. At present, the IETF
defines four types of PHB. They are class selector (CS), expedited forwarding (EF),
assured forwarding (AF), and best-effort (BE).

permanent virtual path Virtual path that consists of PVCs.


(PVP)
phase-locked loop
(PLL)

A circuit that consists essentially of a phase detector which compares the frequency of
a voltage-controlled oscillator with that of an incoming carrier signal or referencefrequency generator; the output of the phase detector, after passing through a loop filter,
is fed back to the voltage-controlled oscillator to keep it exactly in phase with the
incoming or reference frequency.

plesiochronous digital
hierarchy (PDH)

A multiplexing scheme of bit stuffing and byte interleaving. It multiplexes the minimum
rate 64 kit/s into the 2 Mbit/s, 34 Mbit/s, 140 Mbit/s, and 565 Mbit/s rates.

point to point (PTP)

A type of service in which data is sent from a single network termination to another
network termination.

point-to-point service
(P2P)

A service between two terminal users. In P2P services, senders and recipients are
terminal users.

port default VLAN ID


(PVID)

A default VLAN ID of a port. It is allocated to a data frame if the data frame carries no
VLAN tag when reaching the port.

power distribution unit A unit that performs AC or DC power distribution.


(PDU)
power spectrum
density (PSD)

The power layout of random signals in the frequency domain.

printed circuit board


(PCB)

A board used to mechanically support and electrically connect electronic components


using conductive pathways, tracks, or traces, etched from copper sheets laminated onto
a non-conductive substrate.

priority queuing (PQ)

A queue scheduling algorithm based on the absolute priority. According to the PQ


algorithm, services of higher priorities are ensured with greater bandwidth, lower
latency, and less jitter. Packets of lower priorities must wait to be sent till all packets of
higher priorities are sent. In this manner, services of higher priorities are processed earlier
than others.

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provider edge (PE)

A Glossary

A device that is located in the backbone network of the MPLS VPN structure. A PE is
responsible for managing VPN users, establishing LSPs between PEs, and exchanging
routing information between sites of the same VPN. A PE performs the mapping and
forwarding of packets between the private network and the public channel. A PE can be
a UPE, an SPE, or an NPE.

pseudo random binary A sequence that is random in a sense that the value of an element is independent of the
sequence (PRBS)
values of any of the other elements, similar to real random sequences.
pseudo wire (PW)

An emulated connection between two PEs for transmitting frames. The PW is established
and maintained by PEs through signaling protocols. The status information of a PW is
maintained by the two end PEs of a PW.

pseudo wire emulation An end-to-end Layer 2 transmission technology. It emulates the essential attributes of a
edge-to-edge (PWE3) telecommunication service such as ATM, FR or Ethernet in a packet switched network
(PSN). PWE3 also emulates the essential attributes of low speed time division
multiplexing (TDM) circuit and SONET/SDH. The simulation approximates to the real
situation.
public switched
telephone network
(PSTN)

A telecommunications network established to perform telephone services for the public


subscribers. Sometimes it is called POTS.

pulse code modulation A method of encoding information in a signal by changing the amplitude of pulses.
(PCM)
Unlike pulse amplitude modulation (PAM), in which pulse amplitude can change
continuously, pulse code modulation limits pulse amplitudes to several predefined
values. Because the signal is discrete, or digital, rather than analog, pulse code
modulation is more immune to noise than PAM.
Q
QAM

See quadrature amplitude modulation.

QPSK

See quadrature phase shift keying.

QinQ

See 802.1Q in 802.1Q.

QoS

See quality of service.

quadrature amplitude
modulation (QAM)

Both an analog and a digital modulation scheme. It conveys two analog message signals,
or two digital bit streams, by changing (modulating) the amplitudes of two carrier waves,
using the amplitude-shift keying (ASK) digital modulation scheme or amplitude
modulation (AM) analog modulation scheme. These two waves, usually sinusoids, are
out of phase with each other by 90 and are thus called quadrature carriers or quadrature
components hence the name of the scheme.

quadrature phase shift A modulation method of data transmission through the conversion or modulation and
keying (QPSK)
the phase determination of the reference signals (carrier). It is also called the fourth period
or 4-phase PSK or 4-PSK. QPSK uses four dots in the star diagram. The four dots are
evenly distributed on a circle. On these phases, each QPSK character can perform twobit coding and display the codes in Gray code on graph with the minimum BER.
quality of service (QoS) A commonly-used performance indicator of a telecommunication system or channel.
Depending on the specific system and service, it may relate to jitter, delay, packet loss
ratio, bit error ratio, and signal-to-noise ratio. It functions to measure the quality of the
transmission system and the effectiveness of the services, as well as the capability of a
service provider to meet the demands of users.

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A Glossary

R
RADIUS

See Remote Authentication Dial In User Service.

RAN

See radio access network.

RDI

remote defect indication

RED

See random early detection.

REG

See regenerator.

REI

remote error indication

RIP

See Routing Information Protocol.

RMEP

remote maintenance association end point

RMON

remote network monitoring

RNC

See radio network controller.

ROPA

See remote optical pumping amplifier.

RPR

resilient packet ring

RSOH

regenerator section overhead

RST

regenerator section termination

RSTP

See Rapid Spanning Tree Protocol.

RSVP

See Resource Reservation Protocol.

RSVP-TE

See Resource ReserVation Protocol-Traffic Engineering.

RTN

radio transmission node

RTP

real-time performance

RTS

request to send

Rapid Spanning Tree


Protocol (RSTP)

An evolution of the Spanning Tree Protocol, providing for faster spanning tree
convergence after a topology change. The RSTP protocol is backward compatible with
the STP protocol.

Remote Authentication A networking protocol that provides centralized Authentication, Authorization, and
Dial In User Service
Accounting (AAA) management for computers to connect and use a network service.
(RADIUS)
Resource ReserVation
Protocol-Traffic
Engineering (RSVPTE)

An extension to the RSVP protocol for setting up label switched paths (LSPs) in MPLS
networks. The RSVP-TE protocol is used to establish and maintain the LSPs by initiating
label requests and allocating label binding messages. It also supports LSP rerouting and
LSP bandwidth increasing.

Resource Reservation
Protocol (RSVP)

A network control protocol like Internet Control Message Protocol (ICMP) and designed
for Integrated Service and used to reserve resources on every node along a path. RSVP
operates on the transport layer; however, RSVP does not transport application data.

RoHS

restriction of the use of certain hazardous substances

Routing Information
Protocol (RIP)

A simple routing protocol that is part of the TCP/IP protocol suite. It determines a route
based on the smallest hop count between source and destination. RIP is a distance vector
protocol that routinely broadcasts routing information to its neighboring routers and is
known to waste bandwidth.

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A Glossary

radio access network


(RAN)

The network that provides the connection between CPEs and the CN. It isolates the CN
from wireless network.

radio network
controller (RNC)

A piece of equipment in the RNS which is in charge of controlling the use and the integrity
of the radio resources.

random early detection A packet loss algorithm used in congestion avoidance. It discards the packet according
(RED)
to the specified higher limit and lower limit of a queue so that global TCP synchronization
resulting from traditional tail drop can be prevented.
real-time variable bit
rate (rt-VBR)

A parameter intended for real-time applications, such as compressed voice over IP


(VoIP) and video conferencing. The rt-VBR is characterized by a peak cell rate (PCR),
sustained cell rate (SCR), and maximum burst size (MBS). You can expect the source
device to transmit in bursts and at a rate that varies with time.

receiver sensitivity

The minimum acceptable value of average received power at point R to achieve a 1 x


10-12 BER (The FEC is open).

reflectance

The ratio of the reflected optical power to the incident optical power.

regenerator (REG)

A piece of equipment or device that regenerates electrical signals.

remote optical
pumping amplifier
(ROPA)

A remote optical amplifier subsystem designed for applications where power supply and
monitoring systems are unavailable. The ROPA subsystem is a power compensation
solution to the ultra-long distance long hop (LHP) transmission.

rt-VBR

See real-time variable bit rate.

S
SAI

service area identifier

SAN

storage area network

SAToP

Structure-Agnostic Time Division Multiplexing over Packet

SC

square connector

SCR

sustainable cell rate

SD

See signal degrade.

SD-SDI

See standard definition-serial digital interface signal.

SDH

See synchronous digital hierarchy.

SDI

See serial digital interface.

SDP

serious disturbance period

SDRAM

See synchronous dynamic random access memory.

SELV

safety extra-low voltage

SEMF

synchronous equipment management function

SES

severely errored second

SF

See signal fail.

SFP

small form-factor pluggable

SFTP

See Secure File Transfer Protocol.

SHDSL

See single-pair high-speed digital subscriber line.

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A Glossary

SLA

See service level agreement.

SLIP

See Serial Line Interface Protocol.

SMB

Server Message Block

SMSR

side mode suppression ratio

SNCMP

subnetwork connection multipath protection

SNCP

subnetwork connection protection

SNCTP

subnetwork connection tunnel protection

SNMP

See Simple Network Management Protocol.

SOH

section overhead

SONET

See synchronous optical network.

SP

See service provider.

SPC

soft permanent connection

SPE

See superstratum provider edge.

SPI

SDH physical interface

SRG

See shared risk group.

SRLG

shared risk link group

SSH

See Secure Shell.

SSL

See Secure Sockets Layer.

SSM

See Synchronization Status Message.

SSMB

synchronization status message byte

SSU

synchronization supply unit

STP

Spanning Tree Protocol

Secure File Transfer


Protocol (SFTP)

A network protocol designed to provide secure file transfer over SSH.

Secure Shell (SSH)

A set of standards and an associated network protocol that allows establishing a secure
channel between a local and a remote computer. A feature to protect information and
provide powerful authentication function for a network when a user logs in to the network
through an insecure network. It prevents IP addresses from being deceived and plain text
passwords from being captured.

Secure Sockets Layer


(SSL)

A security protocol that works at a socket level. This layer exists between the TCP layer
and the application layer to encrypt/decode data and authenticate concerned entities.

Serial Line Interface


Protocol (SLIP)

A protocol that defines the framing mode over the serial line to implement transmission
of messages over the serial line and provide the remote host interconnection function
with a known IP address.

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Simple Network
Management Protocol
(SNMP)

A Glossary

A network management protocol of TCP/IP. It enables remote users to view and modify
the management information of a network element. This protocol ensures the
transmission of management information between any two points. The polling
mechanism is adopted to provide basic function sets. According to SNMP, agents, which
can be hardware as well as software, can monitor the activities of various devices on the
network and report these activities to the network console workstation. Control
information about each device is maintained by a management information block.

Synchronization Status A message that carries quality levels of timing signals on a synchronous timing link.
Nodes on an SDH network and a synchronization network acquire upstream clock
Message (SSM)
information through this message. Then the nodes can perform proper operations on their
clocks, such as tracing, switching, or converting to holdoff, and forward the
synchronization information to downstream nodes.
serial digital interface
(SDI)

An interface that transmits data in a single channel in sequence.

service level agreement A service agreement between a customer and a service provider. SLA specifies the
(SLA)
service level for a customer. The customer can be a user organization (source domain)
or another differentiated services domain (upstream domain). An SLA may include
traffic conditioning rules which constitute a traffic conditioning agreement as a whole
or partially.
service provider (SP)

An entity that offers service subscriptions to individual subscribers and contracts with
carriers to implement services for a specific DN. A service provider may contract with
more than one carrier.

shared risk group


(SRG)

A group of resources that share a common risk component whose failure can cause the
failure of all the resources in the group.

signal degrade (SD)

A signal indicating that associated data has degraded in the sense that a degraded defect
condition is active.

signal fail (SF)

A signal indicating that associated data has failed in the sense that a near-end defect
condition (non-degrade defect) is active.

single-pair high-speed
digital subscriber line
(SHDSL)

A symmetric digital subscriber line technology developed from HDSL, SDSL, and
HDSL2, which is defined in ITU-T G.991.2. The SHDSL port is connected to the user
terminal through the plain telephone subscriber line and uses trellis coded pulse
amplitude modulation (TC-PAM) technology to transmit high-speed data and provide
the broadband access service.

span

The physical reach between two pieces of WDM equipment. The number of spans
determines the signal transmission distance supported by a piece of equipment and varies
according to transmission system type.

standard definitionserial digital interface


signal (SD-SDI)

Standard definition video signal transported by serial digital interface.

superstratum provider Core devices that are located within a VPLS full-meshed network. The UPE devices that
edge (SPE)
are connected with the SPE devices are similar to the CE devices. The PWs set up
between the UPE devices and the SPE devices serve as the ACs of the SPE devices. The
SPE devices must learn the MAC addresses of all the sites on UPE side and those of the
UPE interfaces that are connected with the SPE. SPE is sometimes called NPE.

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synchronous digital
hierarchy (SDH)

A Glossary

A transmission scheme that follows ITU-T G.707, G.708, and G.709. It defines the
transmission features of digital signals such as frame structure, multiplexing mode,
transmission rate level, and interface code. SDH is an important part of ISDN and BISDN. It interleaves the bytes of low-speed signals to multiplex the signals to high-speed
counterparts, and the line coding of scrambling is used only for signals. SDH is suitable
for the fiber communication system with high speed and a large capacity since it uses
synchronous multiplexing and flexible mapping structure.

synchronous dynamic A new type of DRAM that can run at much higher clock speeds than conventional
random access memory memory. SDRAM actually synchronizes itself with the CPU's bus and is capable of
running at 100 MHz, about three times faster than conventional FPM RAM, and about
(SDRAM)
twice as fast as EDO DRAM or BEDO DRAM. SDRAM is replacing EDO DRAM in
computers.
synchronous optical
network (SONET)

A high-speed network that provides a standard interface for communications carriers to


connect networks based on fiber optical cable. SONET is designed to handle multiple
data types (voice, video, and so on). It transmits at a base rate of 51.84 Mbit/s, but
multiples of this base rate go as high as 2.488 Gbit/s.

T
TCI

tag control information

TCM

See trellis coded modulation scheme.

TCP/IP

Transmission Control Protocol/Internet Protocol

TDC

tunable dispersion compensator

TDM

See time division multiplexing.

TE

See traffic engineering.

TFTP

See Trivial File Transfer Protocol.

TIM

trail trace identifier mismatch

TLV

See type-length-value.

TM

See terminal multiplexer.

TMN

See telecommunications management network.

TOD

time of day

TPID

tag protocol identifier

TPS

See tributary protection switching.

TST

See Test.

TTI

trail trace identifier

TTSI

See trail termination source identifier.

TUG

tributary unit group

Telnet

A standard terminal emulation protocol in the TCP/IP protocol stack. Telnet allows users
to log in to remote systems and use resources as if they were connected to a local system.
Telnet is defined in RFC 854.

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Hardware Description

A Glossary

Test (TST)

A function which is used to perform one-way on-demand in-service or out-of-service


diagnostics tests. This includes verifying bandwidth throughput, frame loss, bit errors,
and so on.

Trivial File Transfer


Protocol (TFTP)

A small and simple alternative to FTP for transferring files. TFTP is intended for
applications that do not need complex interactions between the client and server. TFTP
restricts operations to simple file transfers and does not provide authentication. TFTP is
small enough to be contained in ROM to be used for bootstrapping diskless machines.

tail drop

A congestion management mechanism, in which packets arrive later are discarded when
the queue is full. This policy of discarding packets may result in network-wide
synchronization due to the TCP slow startup mechanism.

telecommunications
management network
(TMN)

A protocol model defined by ITU-T for managing open systems in a communications


network. An architecture for management, including planning, provisioning, installation,
maintenance, operation and administration of telecommunications equipment, networks
and services.

terminal multiplexer
(TM)

A device used at a network terminal to multiplex multiple channels of low rate signals
into one channel of high rate signals, or to demultiplex one channel of high rate signals
into multiple channels of low rate signals.

throughput

The maximum transmission rate of the tested object (system, equipment, connection,
service type) when no packet is discarded. Throughput can be measured with bandwidth.

time division
multiplexing (TDM)

A multiplexing technology. TDM divides the sampling cycle of a channel into time slots
(TSn, n=0, 1, 2, 3), and the sampling value codes of multiple signals engross time slots
in a certain order, forming multiple multiplexing digital signals to be transmitted over
one channel.

traceroute

A program that prints the path to a destination. Traceroute sends a sequence of datagrams
with the time-to-live (TTL) set to 1,2, and so on, and uses ICMP time exceeded messages
that return to determine routers along the path.

traffic engineering (TE) A technology that is used to dynamically monitor the traffic of the network and the load
of the network elements, to adjust in real time the parameters such as traffic management
parameters, route parameters and resource restriction parameters, and to optimize the
utilization of network resources. The purpose is to prevent the congestion caused by
unbalanced loads.
trail termination source A TTSI uniquely identifies an LSP in the network. A TTSI is carried in the connectivity
identifier (TTSI)
verification (CV) packet for checking the connectivity of a trail. If it matches the TTSI
received by the sink point, the trail has no connectivity defect.
trellis coded
modulation scheme
(TCM)

A modulation scheme which allows highly efficient transmission of information over


band-limited channels such as telephone lines.

tributary protection
switching (TPS)

A function that uses a standby tributary processing board to protect N tributary


processing boards.

tunnel

A channel on the packet switching network that transmits service traffic between PEs.
In VPN, a tunnel is an information transmission channel between two entities. The tunnel
ensures secure and transparent transmission of VPN information. In most cases, a tunnel
is an MPLS tunnel.

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type-length-value
(TLV)

A Glossary

An encoding type that features high efficiency and expansibility. It is also called CodeLength-Value (CLV). T indicates that different types can be defined through different
values. L indicates the total length of the value field. V indicates the actual data of the
TLV and is most important. TLV encoding features high expansibility. New TLVs can
be added to support new features, which is flexible in describing information loaded in
packets.

U
UART

universal asynchronous receiver/transmitter

UAS

unavailable second

UAT

See unavailable time event.

UBR

unspecified bit rate

UBR+

Unspecified Bit Rate Plus

UDP

See User Datagram Protocol.

UNI

See user-to-network interface.

UPC

See usage parameter control.

UPE

user-end provider edge

UPI

user payload identifier

UPM

uninterruptible power module

UPS

uninterruptible power supply

UTC

See Coordinated Universal Time.

User Datagram
Protocol (UDP)

A TCP/IP standard protocol that allows an application program on one device to send a
datagram to an application program on another. User Datagram Protocol (UDP) uses IP
to deliver datagram. UDP provides application programs with the unreliable
connectionless packet delivery service. There is a possibility that UDP messages will be
lost, duplicated, delayed, or delivered out of order. The destination device does not
confirm whether a data packet is received.

unavailable time event An event that is reported when the monitored object generates 10 consecutive severely
(UAT)
errored seconds (SES) and the SESs begin to be included in the unavailable time. The
event will end when the bit error ratio per second is better than 10-3 within 10 consecutive
seconds.
usage parameter
control (UPC)

During communications, UPC is implemented to monitor the actual traffic on each virtual
circuit that is input to the network. Once the specified parameter is exceeded, measures
will be taken to control. NPC is similar to UPC in function. The difference is that the
incoming traffic monitoring function is divided into UPC and NPC according to their
positions. UPC locates at the user/network interface, while NPC at the network interface.

user-to-network
interface (UNI)

The interface between user equipment and private or public network equipment (for
example, ATM switches).

V
V-NNI

virtual network-network interface

V-UNI

See virtual user-network interface.

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VB

virtual bridge

VBR

See variable bit rate.

VCC

See virtual channel connection.

VCCV

virtual circuit connectivity verification

VCG

See virtual concatenation group.

VCI

virtual channel identifier

VDSL

very-high-data-rate digital subscriber line

VDSL2

See very-high-speed digital subscriber line 2.

VLAN

virtual local area network

VOA

variable optical attenuator

VP

See virtual path.

VPI

See virtual path identifier.

VPLS

See virtual private LAN service.

VPN

virtual private network

VPWS

See virtual private wire service.

VRRP

See Virtual Router Redundancy Protocol.

VSI

See virtual switch instance.

Virtual Router
Redundancy Protocol
(VRRP)

A protocol used for multicast or multicast LANs such as an Ethernet. A group of routers
(including an active router and several backup routers) in a LAN is regarded as a virtual
router, which is called a backup group. The virtual router has its own IP address. The
host in the network communicates with other networks through this virtual router. If the
active router in the backup group fails, one of the backup routers in this backup group
becomes active and provides routing service for the host in the network.

VoIP

See voice over IP.

variable bit rate (VBR) One of the traffic classes used by ATM (Asynchronous Transfer Mode). Unlike a
permanent CBR (Constant Bit Rate) channel, a VBR data stream varies in bandwidth
and is better suited to non real time transfers than to real-time streams such as voice calls.
very-high-speed digital An extension of the VDSL technology, which complies with ITU G.993.2, supports
subscriber line 2
multiple spectrum profiles and encapsulation modes, and provides short-distance and
(VDSL2)
high-speed access solutions to the next-generation FTTx access service.
virtual channel
connection (VCC)

A VC logical trail that carries data between two end points in an ATM network. A pointto-multipoint VCC is a set of ATM virtual connections between two or multiple end
points.

virtual concatenation
group (VCG)

A group of co-located member trail termination functions that are connected to the same
virtual concatenation link

virtual path (VP)

A bundle of virtual channels, all of which are switched transparently across an ATM
network based on a common VPI.

virtual path identifier


(VPI)

The field in the Asynchronous Transfer Mode (ATM) cell header that identifies to which
virtual path the cell belongs.

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virtual private LAN


service (VPLS)

A type of point-to-multipoint L2VPN service provided over the public network. VPLS
enables geographically isolated user sites to communicate with each other through the
MAN/WAN as if they are on the same LAN.

virtual private wire


service (VPWS)

A technology that bears Layer 2 services. VPWS emulates services such as ATM, FR,
Ethernet, low-speed TDM circuit, and SONET/SDH in a PSN.

virtual switch instance An instance through which the physical access links of VPLS can be mapped to the
(VSI)
virtual links. Each VSI provides independent VPLS service. VSI has Ethernet bridge
function and can terminate PW.
virtual user-network
interface (V-UNI)

A virtual user-network interface, works as an action point to perform service


classification and traffic control in HQoS.

voice over IP (VoIP)

An IP telephony term for a set of facilities used to manage the delivery of voice
information over the Internet. VoIP involves sending voice information in a digital form
in discrete packets rather than by using the traditional circuit-committed protocols of the
public switched telephone network (PSTN).

W
WAN

See wide area network.

WCDMA

See Wideband Code Division Multiple Access.

WDM

wavelength division multiplexing

WEEE

waste electrical and electronic equipment

WFQ

See weighted fair queuing.

WLAN

See wireless local area network.

WRED

See weighted random early detection.

WRR

weighted round robin

WTR

See wait to restore.

Wideband Code
Division Multiple
Access (WCDMA)

A standard defined by the ITU-T for the third-generation wireless technology derived
from the Code Division Multiple Access (CDMA) technology.

wait to restore (WTR)

The number of minutes to wait before services are switched back to the working line.

weighted fair queuing


(WFQ)

A fair queue scheduling algorithm based on bandwidth allocation weights. This


scheduling algorithm allocates the total bandwidth of an interface to queues, according
to their weights and schedules the queues cyclically. In this manner, packets of all priority
queues can be scheduled.

weighted random early A packet loss algorithm used for congestion avoidance. It can prevent the global TCP
detection (WRED)
synchronization caused by traditional tail-drop. WRED is favorable for the high-priority
packet when calculating the packet loss ratio.
wide area network
(WAN)

A network composed of computers which are far away from each other which are
physically connected through specific protocols. WAN covers a broad area, such as a
province, a state or even a country.

wireless local area


network (WLAN)

A hybrid of the computer network and the wireless communication technology. It uses
wireless multiple address channels as transmission media and carriers out data interaction
through electromagnetic wave to implement the functions of the traditional LAN.

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Z
Z interface extension

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Extending the analogue subscriber to another place by extending the Z interface.

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