Professional Documents
Culture Documents
Case 333
Case 333
What is the normal process flow of the production system at Donner? Draw a
process flow diagram?
1) Preparation stage:
Artwork Generation :
Master artwork to be received from the customer.
A negative image to be produced out replicating the exact circuit pattern with Actual
dimensions
Depending on final size, The images are repeated to maximize the number of images.
Inspect & shear
Row materials (double-sided copper-clad glass epoxy sheets) in 36 by 48 size and
0.059 thick are purchased and inspected visually for defects.
The sheets to be sheared into 8 panels 12x18size
Punch Tooling Holes
The location holes to be punched to help for aligning the panels in drilling, imaging
and routing.
Drill
The operator first pins the panel to the drill table using the location holes created in
the previous stage.
Approximately 500 holes per circuit board are drilled, either manually or
automatically.
Metallization
Each panel is processed through a copper immersion bath (This process, called
Metallization ) deposits a thin (.00005") layer of copper in the drilled holes.
Dry film photoresist
1. Panel Prep
The panels are washed, after metallization, scrubbed and coated with dry film
photo resist (DFRP).
2. Laminate and expose
The film of the customer artwork is laid on top of the coated panels and
exposed to ultraviolet (UV) light.
3. Develop
The developing machine washes away the DFPR that has not been cured with
the UV light.
Electroplate
Additional 0.0015 of copper is deposited on those areas of both surfaces not
covered by DFPR and through the drilled and metallized holes.
Strip DFPR
Tin is then flashplated with 0.0005" thick over the copper plating.
DFPR that had been exposed to UV light is chemically stripped from the
panel.
Etch & tin strip
The copper that had not been previously electroplated is then chemically
etched off the glass epoxy base.
The tin is chemically stripped from the circuits leaving only a copper image
on the panel to create the desired circuit pattern on both sides.
3) Fabrication stage
Solder mask
The panels to be processed through solder mask silk-screening leaving a protective
epoxy coating.
Solder Dip
Each panel is then dipped into a molten solder bath and the exposed copper in holes
are covered with solder.
Profiling
Each individual circuit board is then separated from the panel and reduced to its
desired size either by CNC routing or by stamping using a 20 ton punch press.
Inspect, Test ,Pack
After profiling, Boards are visually inspected, electrically tested packed and shipped.
Customers modifications to the original specs and ask for changes in production