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BTA416Y Series B and C: 1. Product Profile
BTA416Y Series B and C: 1. Product Profile
BTA416Y Series B and C: 1. Product Profile
1. Product profile
1.1 General description
Passivated, new generation, high commutation triacs in an internally insulated TO-220
plastic package.
1.2 Features
n Very high commutation performance
n Isolated mounting base
n High operating junction temperature
1.3 Applications
n Heating and cooking appliances
n High power motor control e.g. vacuum
cleaners
n Solid-state relays
2. Pinning information
Table 1.
Pinning
Pin
Description
Simplified outline
Symbol
T2
gate (G)
sym051
mb
mb
T1
G
1 2 3
SOT78D (TO-220)
NXP Semiconductors
3. Ordering information
Table 2.
Ordering information
Type number
Package
BTA416Y-600B
Name
Description
TO-220
BTA416Y-600C
Version
BTA416Y-800B
BTA416Y-800C
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDRM
Parameter
Conditions
BTA416Y-600B; BTA416Y-600C
[1]
Min
Max
Unit
600
BTA416Y-800B; BTA416Y-800C
800
16
t = 20 ms
160
t = 16.7 ms
176
t = 10 ms
128
A2s
ITM = 20 A; IG = 0.2 A;
dIG/dt = 0.2 A/s
100
A/s
0.5
IT(RMS)
ITSM
I2t
I2t
dIT/dt
IGM
PGM
PG(AV)
Tstg
storage temperature
40
+150
Tj
junction temperature
150
[1]
for fusing
Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The
rate of rise of current should not exceed 15 A/s.
BTA416Y_SER_B_C_1
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003aab816
20
Ptot
(W)
conduction
angle
(degrees)
form
factor
a
30
60
90
120
180
4
2.8
2.2
1.9
1.57
16
12
= 180
120
90
60
30
0
0
10
12
14
16 I
18
T(RMS) (A)
= conduction angle
Fig 1. Total power dissipation as a function of RMS on-state current; maximum values
003aab817
180
ITSM
(A)
150
120
90
ITSM
IT
60
30
1/f
Tj(init) = 25 C max
0
1
102
10
n (number of cycles)
103
f = 50 Hz
Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
BTA416Y_SER_B_C_1
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003aab818
103
ITSM
(A)
(1)
102
ITSM
IT
t
tp
Tj(init) = 25 C max
10
10-5
10-4
10-3
10-2
tp (s)
10-1
tp 20 ms
(1) dIT/dt limit
Fig 3. Non-repetitive peak on-state current as a function of pulse duration; maximum values
003aab819
60
IT(RMS)
(A)
50
003aab820
20
IT(RMS)
(A)
16
40
12
30
8
20
4
10
0
10-2
10-1
1
10
surge duration (s)
0
-50
50
100
150
Tmb (C)
f = 50 Hz;
Tmb = 108 C
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5. Thermal characteristics
Table 4.
Thermal characteristics
Symbol
Parameter
Rth(j-mb)
Rth(j-a)
Conditions
Min
Typ
Max
Unit
1.9
K/W
60
K/W
003aab821
10
Zth(j-mb)
(K/W)
1
101
102
tp
103
105
104
103
102
101
10
tp (s)
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse duration
6. Isolation characteristics
Table 5.
Isolation limiting values and characteristics
Th = 25 C unless otherwise specified.
Symbol
Parameter
Visol(RMS)
Cisol
Conditions
Min
Typ
Max
Unit
2500
isolation capacitance
10
pF
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7. Static characteristics
Table 6.
Static characteristics
Tj = 25 C unless otherwise specified.
Symbol Parameter
IGT
IL
gate trigger
current
Conditions
BTA416Y-600B
BTA416Y-800B
BTA416Y-600C
BTA416Y-800C
Unit
Min
Typ
Max
Min
Typ
Max
T2+ G+
50
35
mA
T2+ G
50
35
mA
T2 G
50
35
mA
T2+ G+
60
50
mA
T2+ G
90
60
mA
60
50
mA
IH
holding current
T2 G
60
35
mA
VT
on-state
voltage
IT = 20 A; see Figure 9
1.2
1.5
1.2
1.5
VGT
gate trigger
voltage
0.7
1.5
0.7
1.5
0.25
0.4
0.25
0.4
0.1
0.5
0.1
0.5
mA
VD = VDRM(max); Tj = 150 C
0.4
0.4
mA
ID
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8. Dynamic characteristics
Table 7.
Dynamic characteristics
Symbol
Parameter
Conditions
BTA416Y-600B
BTA416Y-800B
Min
dVD/dt
rate of rise of
off-state voltage
dIcom/dt
Max
Min
Typ
Max
Unit
1000 -
500
V/s
Tj = 150 C
600
300
V/s
15
10
A/ms
Tj = 150 C
A/ms
gate-controlled
turn-on time
tgt
Typ
BTA416Y-600C
BTA416Y-800C
001aag168
1.6
001aag165
VGT
IGT
VGT(25C)
IGT(25C)
1.2
(1)
(2)
(3)
0.8
0.4
50
50
100
Tj (C)
150
0
50
50
100
Tj (C)
150
(1) T2 G
(2) T2+ G
(3) T2+ G+
BTA416Y_SER_B_C_1
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003aab822
50
001aag166
IT
(A)
IL
IL(25C)
40
30
(1)
20
(2)
(3)
10
0
0
0.5
1.5
VT (V)
0
50
50
100
150
Tj (C)
Vo = 1.086 V
Rs = 0.017
(1) Tj = 150 C; typical values
(2) Tj = 150 C; maximum values
(3) Tj = 25 C; maximum values
3
IH
IH(25C)
2
0
50
50
100
Tj (C)
150
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9. Package outline
Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead TO-220
SOT78D
A1
p
mounting
base
q
D1
L1
b2
L
b1
b
e
10 mm
scale
A1
b1
b2
D1
ref
L1
ref
mm
4.7
4.3
1.40
1.25
0.9
0.6
1.4
1.1
1.72
1.32
0.6
0.4
16.0
15.2
6.5
10.3
9.7
2.54
14.0
12.8
3.0
3.7
3.5
2.6
2.2
3.0
2.7
0.2
OUTLINE
VERSION
SOT78D
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
07-04-04
07-07-10
TO-220
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NXP Semiconductors
Revision history
Document ID
Release date
Change notice
Supersedes
BTA416Y_SER_B_C_1
20071003
BTA416Y_SER_B_C_1
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NXP Semiconductors
Product status[3]
Definition
Development
This document contains data from the objective specification for product development.
Qualification
Production
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
11.3 Disclaimers
General Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
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13. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
Isolation characteristics . . . . . . . . . . . . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section Legal information.