Production Specification

Samples approval sheet

Li

Customer name
8mm 0.5W

Model

YX-827WC

Part number

th

gh

Production name

2012-3-23

Date

ou

Checked by

Approved by

Market Dept.

LE

se

Prepared by

Confirmed by

Checked by

CUSTOMER CONFIRMATION

Approved by

Production Specification

YX-827WC

Model

Page: 1/7

Outline dimensions

ou

th

gh

Li
se
s

LE

Unit

Tolerance

mm

0.2mm

Die material
InGaN

Lens color

Emission color

Water Clear

White

RemarkP/N & Model in samples approval sheet can be used to inquireplease provide corresponding P/N& model if
customer need .

Production Specification

YX-827WC

Model

Page2/7

Photoelectricity Parameter

Ambient temperature25

humidityRH60%

Li

Test condition

Item

Symbol

Type

Max

Unit

3.2

--

3.6

--

--

--

35

LM

gh

Min

VF

IF=120mA

Reverse current

IR

VR=5V

Luminous flux

LM

IF=120mA

th

Forward voltage

30

ou

Chromatically
Coordinates (note 4)

IF=120mA

0.29

nm

IF=120mA

0.30

nm

IF=120mA

--

120

--

se

Spectrum line half width

nm

15%1nm0.05V

RemarkThe tolerance of intensity:15%, The tolerance of wave length:1nm,The tolerance of forwards voltage: 0.05V.

Only reference

for above data when testing.

Ambient temperature25

Item

Forward Current

Reverse Voltage

Power Dissipation
Operation
temperature

Storage temperature

Soldering temperature

Model

Symbol

Value

Unit

IF

120

mA

IFM

175

mA

F=1KHZ,(duty cycle)1/10

VRP

15

---

Pm

165

mw

---

Tamb

-25 +80

---

Tstg

-35 +85

---

Tsol

320

YX-827WC

Remark
---

Peck forward current

humidityRH60%

LE

Absolute Maximum Rating

, 3mm 5S
Wave soldering, 3mm out of physical body, 5S

Page 3/7

Production Specification
Typical photoelectricity characteristic curve chart

Li

Flg.1 relative intensity vs. wavelength

110

1.0

100

Forward current (mA)

th

Relative radiant intensity

gh

90

0.5

Flg.2 Forward current derating curve

vs. Ambient temperature

80

70

60

80

wavelength (nm)

Flg.3 Forward current vs. Forward voltage

110

120

40

60

Flg.4 Relative luminous intensity

Vs. Ambient temperature

2.0

Relative luminous intensity

90

70

1.5

se

80

1.0

0.5

0
-40

-20

Forward voltage(v)

20

Ambient temperature Ta()

LE

2.0

100

2.5

100

Forward current (mA)

3.0

ou

110

90

Ambient temperature Ta()

Flg.5 Relative luminous intensity

vs. Forward current

Flg.6 Radiation diagram

0

20

40

Relative radiant intensity

1.5

1.0

0.5

1.0

80

0.9

100

Relative luminous intensity(@80mA)

60

0.8

120
140

0.7

160
180

70

80

90

100

110

Forward current(mA)

Model

YX-827WC

0.5

0.3

0.1

0.2

0.4

0.6

Page 4/7

Production Specification

R Reliability Test Project

Description

Item

Test criterion

Test condition

Test time

Qty

Fail qty

Life test

Life test(room temperature)

JIS7021:B4

Ta=255IF=30mA

1000Hrs

22

Ta=855

1000Hrs

22

1000Hrs

22

1000Hrs

22

50Cycles

22

50Cycles

22

Li

High temperature store

gh

JIS7021:B10
MIL-STD-202:210A
MIL-STD-750:2031

Low temperature store

JIS7021:B12

Ta= -355

JIS7021:B11

Ta=855

High temperature/ humidity test

MIL-STD-202:103D

RH=85%

JIS7021::B4

30min

MIL-STD-202:107D

-1051005

th

Ambience
test

Cold / Heat strike test

5min

ou

MIL-STD-750:1026

Cold and heat cycle test

JIS7021:A3

5min

5min 5min 5min

MIL-STD-202:107D

-352585-35

MIL-STD-705:105E

30min 5min 30min 5min

se
LE

Judging criterion:

Item

Symbol

Experiment condition

Forward Voltage

VF

IF=120mA

----

Reverse Current

IR

VR=5V

----

30A

Luminous Intensity

LM

IF=120mA

Initial Datex0.7

----

Min.

Criteria

Max.

Initial Datex1.1

Production Specification

YX-827WC

Model

Page 5/7

Note

ou

th

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Li

Led bracket forming method

1 2
The pin of led can be bent where is at least 2mm out of led colloid.
2
Must use fixture to deform the led bracket.
3
Finishing the forming of led bracket must be before soldering.
4
Guarantee the gap between two pin of led tallys with LED pads in PCB when forming.
Manual soldering
30W 330 3 3
The tip temperature of soldering iron dont exceed 330 soldering time dont exceed 3s and
soldering position must be 3mm out of led colloid
A B Soldering temperature curve chartfigure Afigure B

se

Preheat

LE
A

D
B

Model

YX-827WC

Page 6/7

Production Specification
ESD countermeasure
LED InGaN

Static electricity and high volt can damage ledThe production whose Die material is InGaN must strictly required to
prevent ESDMust put on static glove and static filletSoldering tool and the cover of device must connect the ground
soldering condition follows the related stating of production specification manual

Li

Protecting countermeasure when over current

Need add the protecting resistor in circuit in order to avoid damaging led due to big current and voltage fluctuation

gh

LED LED installation method

th

1
Pay attention to the led polarity and avoid installation wrongLed cant be close to euthermic componentwork
condition should tally with its specification
2 LED
Dont install the LED under the condition of the led pin deformation

ou

3 LED PCB LED

The led bracket dont load any pressure when installing the led into PCB or fitting hole
4 LED
Must avoid any strike and force on led before the soldering temperature return to room temperature

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Storage time

1 535 RH60%
Led can be stored for a year under the condition: the temperature of 5 35 and humidity of RH60%These
production must be re-inspected and tested before use if their storage time exceed a year

LE

2 535RH60% 655
24
If led is exposed in air for a week under the condition: the temperature of 5 35 humidity of RH60%must place
the led in the ambience of 65 5 for 24 hours and use it in 15 days for best

Cleaning

3
Be careful of some chemical results in the led colloid fades and damage when using chemical clean the ledsuch as
chloroethylene, acetone etc can use ethanol to wash or soak led but the time dont exceed 3 minutes.

(Kinked
LED LED

The kinked tooling scrape easily the pin of led, where the led bracket is rusting easily, especial expose it in moist air. To
decrease the led bracket rust, advise using plated tin led bracket.

Model

YX-827WC

Page 7/7

Production Specification
Packing
(1)Packing materialstatic bag

gh

Li

200mm

Static bag
Static bag

ou

th
150mm

LED LAMP
DATE:

P/N:
IV:
QTY:

VF:

WLD:
N.W.:

LE

se

(2)remark

(3) Qty/per bag

250PCS Can change the qty according to actual status
(4) Packing box

:
RemarkDecide detail packing box according to customer order or actual status