Chapter1 Fundamentals of Microwave Engineering

MICROWAVE INTERGRATED CIRCUITS
Huynh Phu Minh Cuong, Ph.D.

hpmcuong@hcmut.edu.vn
Department of Telecommunications
Faculty of Electrical and Electronics Engineering
Ho Chi Minh city University of Technology
Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT
Telecommunications Engineering
-an introduction-
Comm.
Engineering
Comm.
Network
Microwave
Engineering
& Integrated
Circuits
Signal
processing
Communications Engineering
1. Thng tin s
Communications Network
5. Mng thng tin d liu
(Digital Communications)
2. Thng tin v tuyn
(Wireless communications)
3. L thuyt thng tin v m ha
(Information theory and coding)
4. Thng tin si quang
(Optical fiber communications)
(Data Communication Networks)

6. Mng cm bin v tuyn
(Wireless sensor networks)
7. Mt m ho v an ninh mng
(Cryptography and network security)
8. Cht lng dch v mng
(Network quality of service)
Signal Processing and Applications Microwave Engineering and ICs

9. X l tn hiu ngu nhin
14. Mch tch hp siu cao tn
(Stochastic Signal Processing)
10. X l s tn hiu nng cao
(Advanced digital signal processing)
11. X l nh nng cao
(Advanced image processing)
12. X l a phng tin
(Multimedia Processing)
13. Phng php ti u v ng dng
(Opti. methods and applications)
(Microwave Integrated Circuits)

15. Thit k vi mch cao tn
(RF Integrated Circuit Design)
16. Thit k vi mch tng t nng cao
(Advanced analog IC design)
17. K thut logic nhanh
(Fast logic circuits)
18. Phn tch v Thit k Anten
(Antenna Analysis and Design)
Thit k, ch to cc mch, thnh phn

v h thng siu cao tn cho cc h
thng vin thng v tuyn v Radar.
Vi mch siu cao tn
Mch v h thng siu cao tn
Anten v truyn sng
Comm. Systems
Radar Systems
Huynh Phu Minh Cuong, Ph.D.


Instructor:
Cuong Huynh P.M. (PhD)
Office:
114 B3 , HCMUT
Office Hours: Tuesday :300-5:00 PM
E-mail:
Textbook:
[1] David M. Pozar, Microwave Engineering, John Wiley & Sons, Inc, 4th ed.,
2012.
References:
[2] Gonzalez, Microwave Transistor Amplifiers, Prentice Hall, 2nd ed. 1997
[3] I.D. Robertson, S. Lucyszyn, RFIC and MMIC Design and Technology, The
Institution of Electrical Engineers, London, 2001
[4] V nh Thnh, Mch Siu Cao Tn, NXB HQG, 2006
[5] V nh Thnh, K Thut Siu Cao Tn, NXB HQG, 2004.

Learning outcomes
Understand effects of noise and nonlinearity distortion on microwave systems
and system parameters such as noise figure, input/output referred noise, 1-dB
compression point and third-order intercept point.
Analyze various microwave transceiver architectures and design system
parameters for microwave transceivers.
Analysis and design of microwave passive components such as power
divider/combiner, directional coupler, hybrid coupler, circulator and T/R switch.
Analysis and design of microwave filters using distributed elements.
Analysis and design of microwave amplifiers including low noise amplifier,
broadband amplifier and power amplifier.
Analysis and design of microwave mixers and oscillators.
Use microwave simulation soft-wares such as ADS, CST and SDH, and
equipments such as network analyzer, spectrum analyzer, synthesizer and noise
figure analyzer.

Grading
Homework 25%
You are encouraged to work together with your classmates
on the homework. HW can be turned in via Email.
No late homework will be graded
Final Project 25%

Report and PowerPoint presentation are required
Final Exams 50%
Closed book
One single-sided A4 of notes is allowed

Outline
Chapter 1: Fundamentals of Microwave Engineering
Chapter 2: System Parameters and Transceiver
Architectures
Chapter 3: Power Dividers and Directional Couplers
Chapter 4: Microwave Amplifier
Chapter 5: Microwave Filters
Chapter 6: Oscillators and Mixers
10

Chapter 1
Fundamentals of Microwave Engineering
Huynh Phu Minh Cuong

11
1.1 Introduction
The field of radio frequency (RF) and microwave engineering generally covers the
behavior of AC signals with frequencies in the range of 300 KHz to 300 GHz.
RF signals :
300 KHz to 300 GHz
Wave length: 1 Km 1mm
Microwave signals:
0.3 Ghz 300 GHz
Wave length: 1 m 1mm
Millimeter-wave signals: 30 GHz 300 GHz
Wave length: 10 mm 1mm
12
1.1 Introduction
ISM: Industrial, scientific and medical

DBS: Direct broadcast satellite
13
1.1 Introduction
Why do we need Microwave Engineering? The key Engineering in:
Wireless Communication Systems
Mordern RF/Microwave Transmitter Architectures
Radar Systems
14
1.1 Introduction
The Design of Microwave Circuits is Different
Because of the high frequencies (and short wavelengths), standard

circuit theory often cannot be used directly to solve microwave
network problems.
Microwave components often act as distributed elements, where
the phase of the voltage or current changes significantly over the
physical dimension.
Some lump components is not available at microwave frequency,
such as : Inductors
?
15
1.1 Introduction
What is it ?
16
1.1 Introduction
What is it ?
17
1.1 Introduction
18
1.1 Introduction
19
1.1 Introduction
How to bias a transistor
working at Microwave
frequencies?
What happen with this

inductor at microwave
frequencies ?
20
1.1 Introduction
Advantages of the use of higher frequencies
Larger instantaneous BW for much information,
Higher resolution for radar, imaging and sensing, bigger
doppler shift
Reduced dimensions for components
Less interference from nearby applications
Higher speed for digital systems, signal processing, data
transmission
Less crowded spectrum
Difficulty in jamming (military)
21
1.1 Introduction
RF and Microwave Applications
Wireless Communications (space, cellular phones, cordless
phones, WLANs, Bluetooth, satellites etc.)
Radar, sensing and Navigation (Airborne, vehicle, weather
radars, GPS, MLS, imaging radar, police radars, etc.)
RF Identification (Security, product tracking, animal
tracking, toll collection etc.)
Broadcasting (AM,FM radio, TV etc.)
Automobiles and Highways (Collision avoidance, GPS,
adaptive cruise control, traffic control etc.)
Medical, Radio Astronomy and Space Exploration (radio
telescopes, deep space probes, space monitoring etc.)
22
1.1Introduction
Introduction
1.1 Introduction
Cellular Communication System
1.1 Introduction
1.1 Introduction
RF and microwave Engineering Applications: Electronic Warfare
26
1.1 Introduction
Radio Frequency Integrated Circuits for Communications
27
1.1 Introduction
Transceiver Architecture
28
1.2 Fabrication Technologies for Microwave Integrated Circuits

Microwave Integrated Circuits (MICs) consist of three types
of circuit elements:
Distributed transmission lines (microstrip, strip, etc.)
Lumped elements (R, L and C)
Solid state/Semiconductor devices (FETs, BJTs, diodes, etc.)
Microwave integrated circuits (MICs) Technologies replace
bulky and expensive waveguide and coaxial components with small
and inexpensive planar components for smaller size, lighter weight,
lower power requirements, lower cost, and increased complexity.
MICs can be fabricated in forms of HMIC and MMIC/RFIC
Hybrid MICs
MIC
Hybrid Microwave Integrated Circuits

Monolithic Microwave Integrated Circuits
Radio Frequency Integrated Circuits
MMIC/RFIC
29

Hybrid Microwave Integrated Circuits (HMICs): where
solid state devices and passive elements (both lumped and
distributed) are bonded to its dielectric substrate.
Single/multiple-level
metallization
for
conductors
&
transmissionl ines with discrete circuit elements (such as
transistors, inductors, capacitors, etc.) bonded to the substrate
30

Monolithic Microwave Integrated Circuits (MMICs): is a
type of circuit in which all active and passive elements as well as
transmission lines are integrated into a bulk or onto the surface of a
substance by some special processes such as: deposition, epitaxy,
ion implantation, sputtering, evaporation, diffusion.
31
32
33
34
35
1.2 Technology and device for microwave integrated circuits

MMIC/RFIC
Hybrid MICs
Designed by
Cuong Huynh
36

Hybrid versus Monolithic Microwave Integrated Circuits:
MMIC/RFIC has advantages over HMIC for Cost, Size and weight,
Design flexibility, Broadband performance, Reproducibility, Reliability.
RF/MW MMIC circuits are important as :
The trend in advanced microwave electronic systems is toward
increasing integration, reliability, and volume of production with lower
costs.
The new millimeter-wave circuit applications demand the effects of
bond-wire parasitics to be minimized and use of discrete elements to be
avoided.
New developments in military, commercial and consumer markets
demand a new approach for mass production and for multi-octave
bandwidth response in circuits.
37
CMOS RFIC
Technology
The metaloxidesemiconductor field-effect

transistor (MOSFET)
was first patented
by Julius Edgar Lilienfeld in 1925, well before
the invention of BJT.
Due to the fabrication limitation, MOSFET
has not been used until the early years of 1960s.
CMOS (Complementary MOS p- and n-type
device) was patented by Frank Wanlass in 1967,
initiating a revolution in the semiconductor
industry.
CMOS initially dominates in the digital
circuit/systems while others for analog.
Why CMOS now ? Low cost, high integration
and solution for SOC.
38
CMOS Technology
CMOS Transistors
Interconnect
Diodes
Resistors
Capacitors
Inductors
Bipolar Transistors
39
CMOS Technology
Intel 45 nm CMOS Process
40
1.3 Simulation Software
Circuit Simulator:
EM simulator:
ADS, Cadence
Momentum, HFSS,IE3D, CST, SONET
41
1.4 Fundamentals of Microwave Engineering

Transmission Lines
Characteristic impedance : Zo
Transmission Lines
Propagation constant: = j
Reflection Coefficient
Transmission Line Impedance
Standing Waves
Power Matching on TL
Voltage, current and power calculation at any location
42

A transmission line is a distributed parameter network.
2V ( x, ) 2
( ).V ( x, )
2
x
2 I ( x, ) 2
( ). I ( x, )
2
x
43

Transmission Lines
Characteristic impedance : Zo
Propagation constant: = j
V ( x) V .e . x V .e . x
V . x V . x
I ( x)
e
e
Z0
Z0
1 ( x )
Z ( x) Z0
1 ( x )
Z( x ) Z 0
( x )
Z( x ) Z 0
Z L j.Z 0 .tg ( d )
Z ( x) Z0
Z 0 j.Z L .tg ( d )
( l )
Z L Z0
Z L Z0
( x) (l ).e
1
1
2 d
VSWR
44
1.1 Fundamentals
Fundamentals of
of Microwave
microwave Engineering
engineering
1.4
Smith Chart: Z, Y, Z/Y Section 2.4, [1]
z r jx
Re() j Im()
1
z
1
z 1
z 1
45
1.1 Fundamentals
Fundamentals of
of Microwave
engineering
1.4
Z Smith Chart:
46
1.1 Fundamentals
Fundamentals of
of Microwave
engineering
1.4
Y Smith Chart:
47
1.1 Fundamentals
Fundamentals of
of Microwave
engineering
1.4
Z/Y Smith Chart:
48
1.1 Fundamentals
Fundamentals of
of Microwave
engineering
1.4
Impedance Matching
Using lump elements

Using transmission lines
ADS Smith chart tool
49
1.1 Fundamentals
Fundamentals of
of Microwave
engineering
1.4
HW1
2.8
2.14
2.11
50
1.1 Fundamentals
Fundamentals of
of Microwave
engineering
1.4
Scattering Parameters
At microwave regime: S-parameters
matrix, defined in terms of traveling
waves, is used instead.
The scattering matrix represents the
relation between the voltage incident
waves on the ports to voltage reflected
wave from the ports.
S-parameters are measured with
matched loads rather than open- or
short-circuits.
At microwave frequencies, matched
loads are relatively easy to realize.
S-parameters are measured using
Vector Network Analyzer (VNA).
51
S-Parameter Definition
V+n is the incident voltage wave on port n
V n is the reflected voltage wave from port n.

The scattering matrix, or [S] matrix, is defined in relation to these incident
and reflected voltage waves.
Example: Find [S]
Thit k cc mch phi hp tr khng cho mch khuch i sau cho mch khuch i c li ln nht:
Home Work 2 Due day: Sept. 21

Thit k cc mch phi hp tr khng cho mch khuch i sao cho
mch khuch i c li ln nht:
Mch phi hp tr khng dng FR4-TL

Thit k dng th Smith. (nh km th Smith vo bi lm)
Thit k dng ADS: Tool Smith Chart.
M phng kim chng dng ADS

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MICROWAVE INTERGRATED CIRCUITS

Huynh Phu Minh Cuong, Ph.D.

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

(Data Communication Networks)

Signal Processing and Applications Microwave Engineering and ICs

(Microwave Integrated Circuits)

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

Thit k, ch to cc mch, thnh phn

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

MICROWAVE INTERGRATED CIRCUITS

Huynh Phu Minh Cuong, Ph.D.

MICROWAVE INTERGRATED CIRCUITS

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

MICROWAVE INTERGRATED CIRCUITS

MICROWAVE INTERGRATED CIRCUITS

Final Project 25%

MICROWAVE INTERGRATED CIRCUITS

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

MICROWAVE INTERGRATED CIRCUITS

Fundamentals of Microwave Engineering

Huynh Phu Minh Cuong

300 KHz to 300 GHz

Wave length: 1 Km 1mm

0.3 Ghz 300 GHz

Wave length: 1 m 1mm

Millimeter-wave signals: 30 GHz 300 GHz

Wave length: 10 mm 1mm

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

ISM: Industrial, scientific and medical

Mordern RF/Microwave Transmitter Architectures

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

Because of the high frequencies (and short wavelengths), standard

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

What happen with this

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

1.2 Fabrication Technologies for Microwave Integrated Circuits

Hybrid Microwave Integrated Circuits

1.2 Fabrication Technologies for Microwave Integrated Circuits

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

1.2 Fabrication Technologies for Microwave Integrated Circuits

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

1.2 Fabrication Technologies for Microwave Integrated Circuits

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

1.2 Fabrication Technologies for Microwave Integrated Circuits

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

1.2 Fabrication Technologies for Microwave Integrated Circuits

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

1.2 Fabrication Technologies for Microwave Integrated Circuits

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

1.2 Technology and device for microwave integrated circuits

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

1.2 Technology and device for microwave integrated circuits

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT