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Module # Module #38 38: High Temperature Deformation of Crystalline Materials
Module # Module #38 38: High Temperature Deformation of Crystalline Materials
Module #38
#38
[Excerpt from Deformation and Fracture of Crystalline and Non-crystalline
Non crystalline Solids Course Notes]
HIGH
TEMPERATURE
DEFORMATION
MODES
design so < ys
design so < ys
We must also consider
permanent deformation
occurring by CREEP over
long periods of time.
2/13/2012
Stress
YIELDING
glide
/G
creep
elastic
creep
Temperature
T/Tmp
Phenomenological
Description of Creep
STRAIN
CREEP
TIME DEPENDENT
Elastic
CONSTANT
LOAD!
YIELDING
TIME INDEPENDENT
Elastic
Plastic
t1
time
When stress is removed
2/13/2012
III
d
dt
III
I
INC. ,T
II
II
INC. ,T
III
II
II
III
0
tf
time
time
tf
Strain
Constant
Load
SS
d
dt
Fracture
X
Constant
Stress
dt
II
III
Tertiary creep
time
Primary (transient)
creep
2/13/2012
STAGES OF CREEP
STAGE 0:
STAGE I:
Cause
STAGE II:
Cause
to deformation
Constant
minimum
creep rate,
t II
rate of
due to recovery
2/13/2012
CREEP
Design Considerations
Usually either II or t f
This parameter is usually addressed in
scientific analyses as it is most readily
correlated with microstructures and
creep mechanisms.
tf:
II :
Sttrain
Constant
Load
SS
d
dt
Fracture
X
Constant
Stress
dt
Tertiary creep
Gives a
good fit to
experimental
data
time
Primary (transient)
creep
Garofalos relationship
creep o t 1 e rt sst
o instantaneous strain on loading
t limit for transient creep
F. Garofalo, Fundamentals of Creep and Creep-Rupture in Metals, (Macmillan, New York, 1965) p. 16.
Prof. M.L. Weaver
2/13/2012
Decomposition of
strain into components
STRAIN
Primary
creep
Secondary
creep
creep
sst
t 1 e rt
time
creep o t 1 e rt sst
Prof. M.L. Weaver
2/13/2012
STAGE II
Steady-State Creep Rate (Sherby-Dorn Relationship)
n
Q
Q
II ss A exp c o exp c
RT
RT
o
n
Vary with
&T
due to changes in the
creep mechanism
Qc R
ln
1 1
T T
1
2
Activatio
on Energy for Self Diffusion, QSDD (MJ/mole)
100
Nb
-Fe
Fe UO2
MgO
NaCl
Ni
Al O
-Fe 2 3
-Co
AgBr
Cu
Al
Zn Mg
-Ti
10-1
In
Ca
Au
Pb
Ag
-Ti
Sn
Li
Na
K
Qc = QSD
10-2
10-2
10-1
100
Activation energies for steady state creep and self diffusion for a select group of crystalline materials.
Adapted from O.D. Sherby and A.K. Miller, J. Eng. Mater. Technol., v. 101 (1979) p. 387.
Prof. M.L. Weaver
2/13/2012
Several deformation
mechanisms are
operative
Slip
Climb
Cross slip
Twinning
Diffusion???
etc.
Single deformation
mechanism is
operative
(Diffusional flow)
Q = variable
Q = constant
Qc
Hsd
COPPER
1.0
Qc
ALUMINUM
0.8
Q sd 0.6
TUNGSTEN
0.4
SODIUM CHLORIDE
0.2
0
0
02
0.2
04
0.4
06
0.6
08
0.8
10
1.0
Figure. Ratio between activation energy for steady state creep and activation energy for
self/bulk diffusion as a function of temperature. Data from O.D. Sherby and A.K. Miller, J.
Eng. Mater. Technol., 101 (1979) 387. Figure adapted from Meyers and Chawla,
Mechanical Behavior of Materials, 1st edition, Prentice Hall, Upper Saddle River, NJ, 1999,
p. 554.
Prof. M.L. Weaver
2/13/2012
ADGb b
, where D Do exp(Q / kT )
kT G d
D = diffusion coefficient
d = grain size
b = Burgers vector
k = Boltzmanns constant
T = the absolute temperature (degrees Kelvin)
G = the shear modulus
= applied stress
n = stress exponent
p = inverse grain size exponent
A = a dimensionless constant.
This form of the Dorn equation applies for all creep mechanisms.
Prof. M.L. Weaver
Creep Mechanisms
Diffusion Creep
Nabarro-Herring
Coble
All involve
some form of
diffusion
Solute
S
drag
Dislocation climb-glide
2/13/2012
CREEP MECHANISMS
T
It is convenient to discuss
deformation (and creep)
mechanisms in terms of
temperature and/or
applied stress.
/G
Deformation mechanism
maps (DMMs) *
* Adapted from: M.F. Ashby, Acta
Metall., v. 20 (1972) p. 887-897.
Yield strength
(low temp)
Dislocation creep
(Power law creep)
(high temp)
or
/G
Coble (g.b.)
Diffusion creep
NH (lattice)
Elastic
El
i
regime
T/Tmp
Prof. M.L. Weaver
10
2/13/2012
Enerrgy
The figures below show the lattice energy before and after a bypasses an
obstacle on its slip plane.
Enerrgy
No stress
applied
With stress
applied
Eo
Eo
E
Obstacle to motion
Obstacle to motion
Position
Position
kT
Thermal energy
Reverse reaction rate:
E
[Slower than in forward dir
dir.]]
Reverse rate exp o
kT
Net flow rate strain rate, scales with the difference betw.:
Eo
E 1
exp
kT
kT
dg o exp
Materials
parameter based
on freq. atomic
vibration
E
E
o exp o exp
kT
kT
Eo
bAs
exp
kT
kT
dg o exp
depends on ratio
bAs
kT
E
exp
1 at low T
kT
11
2/13/2012
Arrows denote
vacancy flux
Vacancy
current
After flux
Contraction
Poisson effect
Original
shape
Vacancy sink
Vacancy source
12
2/13/2012
# atoms
Qf
nV
NV exp
no
kT
Qf
NV 1
exp
kT
= atomic volume
compression
Ctensile Co exp
kT
Ccompressive Co exp
kT
Obviously the
concentration is higher
on the tensile side
There will be a net flux of vacancies from the higher concentration (i.e.,
tensile) to the lower concentration (i.e., compressive) areas. From Ficks
law, this is:
C
J DV c DV
assuming that the diffusion distance (x) is equivalent to the grain size (d)
and that is a numerical constant.
13
2/13/2012
Multiplication of the flux J by the diffusion area (~d2) gives the volumetric
flow rate which is the number of vacancies passing through an area per
second.
V
Jd 2
t
3 Jd 2 3
dt
d
d
or
C DV Co
exp
DV
exp
2
d
d
kT
kT
d
exp
1
kT
kT
Since << kT:
Therefore:
C DV Co 2 2 DV Co
DV
1 kT 1 kT
d
d
d2
kTd 2
NH
2 DL
ANH
kTd 2
DL
2
d kT
14
2/13/2012
NH
ANH DLGb b
kT
d G
ANH 10 16
15