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Ohmega Resistors For PWBs Recent Development in Lead Free A PDF
Ohmega Resistors For PWBs Recent Development in Lead Free A PDF
COPPER
COPPER
ELECTROPLATING
RCM
NICKEL
PHOSPHOROUS
LAMINATION
NiP LAMINATE
TOCIII
DFF
Hi Tg Epoxy
PTFE
Ohmega/Faradflex
Polyimide
Rogers Duroid
BC12
Lead-Free
Arlon CLTE
BC8
Rogers 4003
Ohmega/Faradflex
Ceramic-Filled
BC24
BC16
Flex
NiP Resistors Embedded in DRAM PCB FR4 Dielectric for Lead-Free Assembly
5
NiP Resistors
-0.57
-0.27
-1.39
-1.25
-0.58
-0.37
open
open
-0.62
-0.46
-0.54
-0.27
-0.24
-0.16
% R AT
% R AT TEST METHOD
20 CYCLE 25 CYCLE
T260. 20 sec
-0.13
0.17
-0.08
0.26
T288, 10 sec
T288, 10 sec
T288, 10 sec
T288, 10 sec
CONDITION
no bake
5 hr bake
no bake
5 hr bake
no bake
Memory board, 10 layers with one layer of 22 ohm resistors, 23 mils x 10 mils.
Built using Double Treat 1/2A50ohm NiP laminate.
The FR-4 PCB used a standard multifunctional epoxy laminate.
The "lead-free" PCB used a phenolic-cured laminate.
Testing per IPC-TM-650, Method 2.4.13.1, baking was performed at 125 dC.
0.026 x 0.0145
A v e ra g e d B / in c h
-0.04
-0.06
-0.08
-0.10
Ohmega
on Reverse
NiP
on TOC
foil treated foil (smooth)
Ohmega
on high
NiP
on PT
foil profile ED foil (rough)
-0.12
-0.14
-0.16
Calculated smooth
-0.18
Calculated rough
-0.20
0.0
2.0
4.0
6.0
8.0
10.0
12.0
Frequency, GHz
Average dB/inch
-0.050
-0.100
1oz ED (control)
-0.150
NiP 1R25 PT
NiP 1A50 DFF
OhmegaPly 1R25 TOC
-0.200
1oz RT (control)
-0.250
2.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
Frequency (GHz)
10
Ohmega /FaradFlex
FaradFlex capacitor
plate (copper)
Ohmega NiP resistive
alloy
FaradFlex dielectric/
capacitor core
Ohmega/FaradFlex laminate
Ohmega/FaradFlex Layer.
80 1st Street
Hoosick Falls, NY 12090
Phone: (518)686-4961
Fax:
(518)686-8080
Web: http://www.faradflex.com
11
Ohmega/FaradFlex Core
Copper Weight, m
35
Nominal
25
Nominal
Dielectric Thickness, m
24
Nominal
1.0 (155)
IPC-TM 650
2.5.5.3
Dk @1MHz
4.4
0.015
IPC-TM 650
2.5.5.3
IPC-TM 650
2.5.5.3
5.0
IPC-TM 650
2.4.9
5.3
IPC-TM 650
2.5.6.3
152(22.0)
Elongation, %
18.5
Properties
Ohmega/FaradFlex
Core
Ohmega Core
FR-4 (control)
25
+/-5%
25
+/-5 %
1.6
1.2
<5
<-23
<-15
0.5
0.5
-6.0
50
0.2
-0.5
-0.4
-0.6
0.5
0.45
0.15
ASTM
D-882 A
Synergistic Effect!
ASTM
D-882 A
Nominal
MIL-STD-202-108I
Ambient Temp: 70C
On Cycle: 1.5 hrs
Off Cycle: 1.5 hrs
Length Of Test: 10000 hrs
MIL-STD-202-308
Voltage Applied: 5.6 Volts
MIL-STD-202-103A
Temp: 40 C
Relative Humidity: 95%
Time: 240 hrs
MIL-STD-202-304
Hot Cycle: 25, 50,75 125C
Cold Cycle: 25, 0,-25, -55C
MIL-STD-202-107B
No of Cycles: 25
Hot Cycle Temp: 125 C
Cold Cycle Temp: -65 C
MIL-STD-202-210D
Temp: 260C
Immersion: 20 Second
Step-up Power Test
Resistor Size: 0.020" X 0.035"
12
OhmegaPly Sheet
Resistivities (Ohm/square)
10
25
50
100
250
Cp @ 1MHz/1GHz (pF/cm2)
FaradFlex Products
BC24
x
x
x
x
x
BC16
x
x
x
x
x
BC12
o
x
x
o
o
BC8
o
x
x
o
o
180/160
250/225
300/270
480/430
BC12TM
o
o
o
o
o
BC16T
o
o
o
o
o
700/600 1700/1450
X- Currently Available
O- Available 2008
13
Conclusion
14