BFT 528 - QUALITY & PRODUCTIVITY

MANAGEMENT

INDUSTRIAL CASE STUDY

TITLE:
Soldering Defects in SMT Assembly
Prepared by:

Program

Azim Azuan Bin Osman

1333430133

Mohd. Irfan Muzammil Bin Shuib

1333430146

Lim You En

1333430137

Muhammad Khairudden Bin Sulaiman

1333430131

Abdul Aziz Bin Yaacob

1333430129

: MBA (Engineering Management)

Academic Session

: 2013/2014

Prepared For

: Dr. Hasbullah Ashari

CHAPTER 1 - INTRODUCTION

1.1

Background of the Case

TVs, computers, stereos, phones and many other electronic products that characterize
life at the end of the 20th century contain printed circuit boards (PCBs). During the last two
decades technological advances have given rise to PCBs of increasing complexity
(Chevalier, 1997). Boards that require hundreds or thousands of assembly operations are not
uncommon in the manufacture of todays electronic products. Consumers of these products
are also demanding higher quality and more reliable items (Joseph, 1990). Under these
circumstances, greater control is necessary over the manufacturing processes used to
produce PCBs. The continuing miniaturization of personal electronics devices, such as
mobile phones, personal music devices, and personal computing devices has driven the need
for increasingly smaller active and passive electrical components. Due to this
miniaturization trend, many PCBs now utilize Surface Mount Technology (SMT) to
assemble the miniaturized electronic components onto the PCBs.
Circuit board assemblies come in two general types: through-hole and surfacemount, commonly referred to as SMT assemblies. In a through-hole assembly, leads for the
necessary electronic components are inserted through holes. For an SMT assembly,
components are placed on the outer surface of the printed circuit board. Currently, Surface
Mount Technology (SMT) is more widely used because it is faster and more precise [Moyer,
1997]. It can be automated with ease. Surface Mount Technology (SMT) uses an assembly
process in which the components are soldered to lands on the surface of the board, rather
than inserted into holes running through the board. By eliminating the need for leads
inserted into through holes in the board, several advantages accrue: (1) smaller components
can be made with leads closer together, (2) packing densities can be increased, (3)
components can be mounted on both sides of the board, (4) smaller PCBs can be used for
the same electronic systems, (5) drilling of the many through holes during board fabrication
is eliminated, but via holes to interconnect layers are still required, and (6) undesirable
electrical effects are reduced such as spurious capacitances and inductances. Typical areas
on the board surface taken by SMT components range between 20% and 60% compared to
through-hole components.
Todays electronic manufacturer such as Flextronics Technology is dealing with
many miniaturized components that were previously considered impossible to work with,
but now can be realized using Surface Mount Technology (SMT) to perform PCBs
assembly. The need to solder miniaturized components taxed the assembly process,
stretching the capabilities of placement equipment and solders paste, and increasing the
incidence of defects such as tombstoning, opens soldering and bridging effect. These defects
are even more common when thick, multilayer and high complexity PCBs are being
assembled. The purpose of this paper is to examine the causes of these defects which

occurred in SMT production line of Flextronics Technology (Penang) Plant 5 using quality
tools such as 5 Whys, Cause-Effect Diagram and FMEA.

1.2

Background of the Company

Flextronics offers the broadest worldwide Electronic Manufacturing Service (EMS)

capabilities, from design resources to end-to-end vertically integrated global supply chain
services. Flextronics designs, builds and ships complete packaged products for its OEM
customers and provides after-market and field services to support customer end-to-end
supply chain requirements. Flextronics provides more value and innovation to customers by
leveraging its global economies of scale in manufacturing, logistics, procurement, design,
engineering and ODM services across a wide range of products and customer segments
through the following four business groups which are High Reliability Solutions, High
Velocity Solutions, Integrated Network Solutions and Industrial and Emerging Industries.
High Reliability Solutions covers avionics, flight and engine controls, ruggedized
communications, wire harness for ground and air vehicles, night vision systems, security
systems and surveillance while High Velocity Solutions includes consumer electronics
products such as mobile phones, smartphones, portable audio devices, wearable electronics,
wireless modules, home entertainment equipment, game consoles, printers, PCs, notebook
computers and tablets. On the other hand, Integrated Networks Solutions consists of end-toend solutions in telecommunications, including optical networking; networking, such as
enterprise infrastructure; and servers and storage space, including cloud computing
hardware. The fourth business group, Industrial and Emerging Industries covers appliances,
capital equipment and self-service solutions, safety and security, meters and controls and
printers), navigation and positioning technologies.

Figure 1.1: Flextronics logo

Flextronics operates in 30 countries with a world-class work force and welldiversified customer market segments and business units. Flextronics strengthened global
presence and increased resources provide enhanced design and engineering solutions that are
vertically integrated with manufacturing, logistics, and component technologies to optimize
customer operations by lowering costs and reducing time to market. In Malaysia, Flextronics
Technology owned two branches which are in Bukit Raja, Shah Alam, Selangor and Penang.
Flextronics Technology (Penang) Sdn. Bhd. operating at 5 plant bases named A1, P1, P2, P3

and P5. P2 and P3 are located at Bukit Minyak Prai Industrial Park while A1, P1 and P5 are
located at Prai Industrial Park.
What Flextronics creates is value. By increasing speed to market and driving
competitive positioning for customers, Flextronics in essence solves customers most
challenging problems better, faster and more cost effectively than any other company. With
an unmatched global presence, customers are supported with unprecedented speed in
product ramp-up, delivery, and the ability to manage volume regardless of complexity or
product mix. Leveraging state-of-the-art LEAN practices, Six Sigma, are the key
investments in infrastructure and FlexQ, a proprietary quality program that is beyond
leading edge.

CHAPTER 2 - QUALITY MANAGEMENT SYSTEMS

2.1

Quality Policies

Flextronics under its quality program FlexQ, is focused on its customers' ultimate
success and is committed to having the highest level of quality in the industry. Flextronics
guiding principle is to provide its external and internal customers with a level of quality and
service that consistently meets or exceeds expectations through the following philosophies:
Continually maintaining and improving the effectiveness of our Quality
Management System (QMS) - Periodic review of current quality policy and
objectives to ensure its effectiveness and suitability.
Meeting or exceeding customer and organizational requirements - Constant
striving for quality products that meet or exceed the customers and/or organizational
requirements.
Effectively communicating up and down the "Supply Chain" - Effective
communication of quality policy and objectives to customers, suppliers and our
employees.
Hiring the best people in the industry - Training those people on our system and
focusing those people on executing our processes flawlessly.
Creating and managing the best processes in the industry - These processes are
documented and described in a comprehensive Quality Management System (QMS).
Aligning ourselves with the most competent base of suppliers available in the
industry - The ability of our suppliers to provide us with quality goods and services
is critical to our success. We will strive to achieve excellence in our supply chain
with a common vision in the areas of quality, continuous improvement and
excellence in customer service.

Figure 2.1: FlexQ Triangle

Flextronics as worldwide Electronic Manufacturing Service (EMS) provider serves

other worldwide companies in assembling printed circuit board (PCB) mostly for
networking device. Electronic manufacturing services (EMS) is a term used for companies
that design, test, manufacture, distribute, and provide return/repair services for electronic
components and assemblies for original equipment manufacturers (OEMs). The concept is
also referred to as electronic contract manufacturing (ECM). Production of networking
server devices for Dell Company produced in Flextronics Technology (Penang) Plant 5 is
analyzed as the case study. ESD (Electrostatic Sensitive Device), MSC (Moisture Sensitive
Components) and RoHS (Restriction of Hazardous Substances) are common quality issues
which inevitable face by any EMS companies.

2.2

Electrostatic Sensitive Device (ESD)

An electrostatic-sensitive device (often abbreviated ESD) is any component

(primarily electrical) which can be damaged by common static charges which build up on
people, tools, and other non-conductors or semiconductors. As electronic parts like computer
central processing units (CPUs) become packed more and more densely with transistors and
integrated circuits (ICs), these components shrink and become more and more vulnerable to
ESD. ESD commonly also stands for electrostatic discharge, is the transfer of electrostatic
charge between bodies at different electrical potentials. It is also referred to as static
electricity. The electrostatic charge if not prevented, can commit damage to the companys
products which are sensitive electronic devices, and resulting in higher manufacturing costs
spend for rework/ repair or scrap and effect on customers satisfactory (shorter product life,
unreliable product). Often an ESD-safe foam or ESD-safe bag are required for handling and
transporting such components. When working with them, Flextronics operators are
positioned at static free workstations. Static free workstations are equipped with grounding
tools and accessories (see Appendix A) to keep from damaging the equipment. They also
must wear antistatic garments (Appendix B) all the time while in production line and
antistatic wrist strap while working in sitting position.

Figure 2.2: ESD Symbol

2.3

Moisture Sensitive Components (MSC)

Moisture sensitive components are referring to those plastic encapsulated SMD

(surface mount device) packages such as ICs namely BGA (ball grid array), QFP (quad flat
pack), TSOP (thin small outline package), PLCC (plastic leaded chip carrier), CSP (chip
scale package) and other packages made with moisture permeable polymeric material
(silicones, epoxies & etc.) when left in the open air environment will absorb moisture from
the air via diffusion. The moisture trapped in the plastic molded package will cause process
and reliability problem later after it is being subjected to reflow or hot air soldering process.
During reflow process, the PCB with the moisture sensitive SMD mounted are sent through
the reflow oven with the temperature gradually increases to more than 200 C. The moisture
absorbed and trapped in the SMD package will be vaporized during reflow and vapor
pressure will build up inside the package. If the vapor pressure is high enough, it can cause
internal damage such as delaminating of packaging material from die/ lead frame/ substrate
or internal crack or bond damage, die lifting or cause popcorn phenomenon or package
warping which can affect components reliability.

Figure 2.3: MSC Label

In order to maintain the level of humidity or moisture absorbed by the components,

MSC usually keeps inside the dry bag. When dealing with PCB mounted with MSC, the
operator needs to check 2 items:
i. the seal date on the label, and
ii. the moisture indicator from within the dry bag.
If the bag seal date is over 1 year and / or the humidity indicator card shows >20% RH, the
product needs to be re-baked prior to reflow. If both the seal date and humidity indicator
card are within the requirements, then the product may be used. The solder reflow must be
accomplished within the specified floor life shown on the warning label. Failure to do so
may result in damage to the product. Other precaution act, operators need to wear safety
mask to prevent direct moisture emission through breathing.

2.4

Restriction of Hazardous Substances (RoHS) Directive

RoHS is the directive on the restriction of the use of certain hazardous substances in
electrical and electronic equipment 2002/95/EC was adopted in February 2003 by the
European Union. The RoHS directive took effect on 1 July 2006, and is required to be
enforced and become law in each member state. The RoHS directive aims to restrict certain
dangerous substances commonly used in electronic and electronic equipment. 2 categories
of RoHS which Flextronics industry deals with are RoHS-5 and RoHS-6. RoHS-6 means the
parts should not contain these 6 substances over the allowed percent weight (unless
technology exemption listed in the exemption list):
i.
Lead - Pb (max 0.1wt%)
ii.
Mercury - Hg (max 0.1wt%)
iii.
Cadmium - Cd (max 0.01wt%)
iv. Hexavalent Chromium - Cr(VI) (max 0.1wt%)
v. Polybrominated biphenyls - PBB (max 0.1wt%)
vi.
Polybrominated diphenylethers - PBDE (max 0.1wt%)

Figure 2.4: RoHS Logo

PCB production under RoHS-6 directive is called lead free production. RoHS-5
means the parts allowed to contain lead in solder, but should not contain these 5 substances
over the allowed percent weight (unless technology exemption listed in the exemption list):
i. Mercury - Hg (max 0.1wt%)
ii. Cadmium - Cd (max 0.01wt%)
iii. Hexavalent Chromium - Cr(VI) (max 0.1wt%)
iv. Polybrominated biphenyls - PBB (max 0.1wt%)
v. Polybrominated diphenylethers - PBDE (max 0.1wt%)
Knowledge and precaution on ESD, MSC and RoHS issues are important and crucial to take
concern since it is related to companys quality policies and customers trust. These
precaution steps need to be practiced efficiently by all employees to maintain companys
credibility. ESD and MSC are related to Flextronicss premier customer which is Dell, while
RoHS compliance is related to the secondary or end customer which is the user of Dell
product. In business, quality usually defines according to customers expectation or
requirement. For Dell, they expect to receive non-defective network server panel from
Flextronics while the end customers (users), expect to receive non-hazardous product for
their health.

2.5

Certification to ISO 9001:2008

ISO 9001:2008 sets out the criteria for a quality management system and is the only
standard in the family that can be certified to. It can be used by any organization, large or
small, regardless of its field of activity. In fact ISO 9001:2008 is implemented by over one
million companies and organizations in over 170 countries including Flextronics of course.
This standard is based on a number of quality management principles including a strong

customer focus, the motivation and implication of top management, the process approach
and continual improvement. Using ISO 9001:2008 helps ensure that customers get
consistent, good quality products and services, which in turn brings many business benefits.
By following ISO 9001:2008 standard guidelines, Flextronics indirectly shows how
customer satisfaction towards its service being monitored and measured within its QMS
(Quality Management System).
Checking that the system works is a vital part of ISO 9001:2008. An organization
must perform internal audits to check how its quality management system is working. An
organization also may decide to invite an independent certification body to verify that it is in
conformity to the standard, but there is no requirement for this. Alternatively, it might invite
its clients to audit the quality system for themselves. Flextronics indeed have done internal
audits under the responsible of its Quality Audit (QA) department and as well as inviting
their client, personnel from Dell to do weekly audit. By getting certified with ISO
9001:2008 (see Appendix C), Flextronics have proved that its quality management system is
effective and working efficiently.

2.6

Suppliers Quality System

Flextronics also has outlined several criteria for suppliers selection as a part of its
quality management system. As a basic requirement, the supplier shall be certified according
to ISO 9001, but must fulfill the requirements of ISO/TS 16949. ISO9001 is seen as a first
step in becoming ISO/TS16949 certified. Supplier shall ensure that the latest valid versions
from standards and regulatory frameworks are implemented at all times. (e.g.: ISO, VDA,
AIAG etc.). Other additional requirements which might provide extra advantage to supplier
companies are:
i. Suppliers shall use the latest versions of Advanced Product Quality Planning and
Control Plan (APQP), Potential Failure Mode and Effects Analysis (FMEA),
Measurement System Analysis (MSA), Production Part Approval Process (PPAP)
and shall use Statistical Process Control (SPC) as the guideline for their system
development.
ii. Suppliers shall maintain and demonstrate the effectiveness of the special processes
(e.g. CQI-9 Special Process: Heat Treat System Assessment).
iii. The same quality system requirements shall apply to sub-suppliers, and the Supplier
is responsible for the compliance of all sub-suppliers.
iv. Resumption plan: Supplier agrees to provide product availability over the complete
customer project lifetime. A Business Resumption plan including all environmentally
relevant risks must be submitted before the first delivery for mass production.

v. Supplier shall adopt the standards of ZERO DEFECTS and 100% on time delivery to
Buyer. Any established PPM-target is not an accepted quality level, but represents an
intermediate continuous improvement step towards shipments of products
(components/materials) meeting the Zero-defect requirement.
vi. Supplier shall demonstrate continuous improvement in all business areas.

CHAPTER 3 APPLICATION OF QUALITY TOOLS & TECHNIQUES

3.1

Critical Processes that have Impact on Quality

Production of networking server devices for Dell Company produced in Flextronics
Technology (Penang) Plant 5 is implemented using Surface Mount Technology (SMT). SMT
is now the most widely used technology for printed circuit board design and manufacturing.
Surface mount offers several economic, quality and performance advantages that have
established it as the dominant technology. These include board size and weight reduction,
component density and cost, higher speed assembly, and faster operating speeds. Despite of
the maturity of SMTs materials, manufacturing equipment and technology methods to the
point where repeatable and stable surface mount assembly processes can be implemented
and maintained, the occurrences of defects still emerge due to the continuation towards
component miniaturization (Briggs & Lasky, 2012).

Solder paste printing provides the majority of the opportunities for defects in surface
mount assembly because every component land is an opportunity for a defect. In many
surface mount operations, the opportunity for a defect can be defined as one for each
component lead that's soldered plus an additional one for the component itself (Association
Connecting Electronics Industries, 2010). According to Briggs and Lasky (2012), it is
commonly accepted that 60-70% of solder defects occur at the printing stage. With the
continuation towards component miniaturization, the stencil printing process window
becomes even more challenging, increasing the opportunity for insufficient or inconsistent
solder paste deposits. The math is easy; no or too little solder paste deposited onto the PCB
pad results in no solder joint. Too much solder paste can cause an electrical short circuit.

3.2

Flow Process of SMT

Figure 3.1 and 3.2 below show the machines include in SMT production line of
Flextronics Technology (Penang) Plant 5 and its Process Flow Mapping. The first step of the
surface mount process is to apply solder paste to the specific areas of the circuit board where
the surface mount components will be attached. Solder paste printing is commonly referred
to as stencil, or screen printing. The solder paste is pressed through openings in the stencil or
screen onto the lands of the circuit board. This is done by the use of squeegees. Once solder
paste has been applied to the lands, the board is moved to one or more pick and place
machines or other automated component placement devices. The final surface mount
operation is reflow soldering. Reflow soldering is a process of joining metallic surfaces by
melting the solder in the solder paste as well as any soldering coatings. The heat causes the
solder to melt, and since the solder may have been melted before, the term reflow describes
the action taking place.

Figure 3.1: Machines of SMT Production Line in Flextronics P5

Figure 3.2: SMT Line Process Flow Mapping

3.3

Root-Cause Diagram and 5 Whys

Defects such as open solder, bridging effect, insufficient solder and tombstone are
commonly occurred on PCBs which has been assembled in SMT line. In order to trace what
are the causes of these defects the production team uses a well-known Quality Control (QC)

tool which is Ishikawas Fishbone Diagram or also known as Cause and Effect Diagram.
With few simple steps this diagram helps the user to identify, analyze, and graphically depict
with increasing detail, all potential causes related to a problem or current condition in order
to discover its root causes. The common 5 categories of causes in Fishbone Diagram are
based on 4 basic production resources (man, machine, material and method/technique) plus
the environment factor. However for this case study, only the problems contributed by
machinery (specifically solder paste printer) are discussed.
Focused problem in this case study is solder paste printer which perform screen
printing operation contribute to improper SMT device placement which cause soldering
defects such as open solder, bridging effect, insufficient solder and tombstone (Refer
Appendix D). Open solder defect is solder has only wetted to one surface, bridging defect
occurs solder running from one component contact to another resulting in a short circuit,
tomb stoning is one end of the component is pulled away from the surface and insufficient
solder means not enough or no solder to make a complete bond between the lead and the
pad. Therefore, in order to trace what are the root causes of this screen printing operation
Fishbone Diagram as in Figure 3.3 had been developed.

Figure 3.3: Fishbone Diagram of Improper SMT Device Placement

Before developing the Root-Cause Diagram, the Process Mapping should be

established first. Process Mapping (Figure 3.2) is like an input for developing Fishbone
Diagram which gives brief description of the resources flow from where to where, which
way, when and how. These two tools become more powerful when being combined with 5
Whys approach. By repeatedly asking the question Why (five is a good rule of thumb), the
user able to peel away the layers of symptoms which can lead to the root cause of a problem.
Very often the ostensible reason for a problem will lead you to another question. Although
this technique is called 5 Whys, the user may find the need to ask the question fewer or
more times than five before you find the issue related to a problem. For example related to
this case study:
1. Why improper SMT device placements occur?
Answer: Machine (Solder paste printer)
2. Why it is solder printer fault?
Answer: Screen printing operation
3. Why screen printing operations not properly perform?
Answer: Printing misalignment
4. Why printing misalignment possibly occur?
Answer: Mismatch between the stencil and PCB
5. Why they can be mismatched?
Answer: NPI (New Product Introduction)
With these combination tools, the production team can trace which process and operation
cause the defect on the product, what machine involved and how come the process behave
that way.

3.4

Failure Mode and Effect Analysis (FMEA)

A Failure Mode and Effect Analysis (FMEA) is an engineering method used to

define, identify and eliminate a known/or potential problems, errors and so on from the
system, design, process or service before they reach the customer or it is a methodology to
maximize the satisfaction of the customer by eliminating and /or reducing known or
potential problems. The essence of the FMEA is to identify and prevent known and potential
problems from reaching the customer. To do that, assumptions have to be made, one of
which is that problems have different priorities. There are three components that help define
the priority of failures:
i.
Occurrence (O)

ii.
iii.

Severity of effect (S)

Detection (D)
Occurrence is the assessment of the probability that the specific cause of the Failure
mode will occur. Failure history is helpful in increasing the truth of the probability. Severity
is an assessment of the seriousness of the Effect and refers directly to the potential failure
mode being studied. The severity ranking is also an estimate of how difficult it will be for
the subsequent operations to be carried out to its specification in Performance, Cost, and
Time. Detection is an assessment of the probability that the proposed Process Controls will
detect a potential cause of Failure or a Process weakness. Assume the Failure has occurred
and then assess the ability of the Controls to prevent shipment of the part with that defect.
Low Occurrence does not mean Low Detection in spite the Control should detect the Low
Occurrence. Risk Priority Number is a mathematical product of the numerical Severity,
Occurrence, and Detection ratings (RPN = S . O . D). This number is used to place priority
on items than require additional quality planning.
Brainstorming tools that will assist or can be considered as input item to develop a
process FMEA are Fishbone Diagram (as in Figure 3.3) and 5 Whys approach (as discussed
earlier). Table 3.1 below shows FMEA for four failure modes (defects) mentioned before
(open solder, bridging effect, insufficient solder and tombstone). For higher definition view
please refer Appendix E.

Table 3.1: Failure Mode and Effect Analysis of Screen Printing Process

From this table, the Flextronics team had identified the possible ways in which nonconformities was occurred in PCBs assembly process, and stated recommend actions to
prevent the nonconformities and/or detect them before the non-conforming parts are shipped
to the customer.

3.5

Andon, Jidoka and Poka Yoke

Andon derives from Japanese term means paper lantern is a method of signaling a
quality or process problem. It can be a signboard incorporating signal lights to indicate
which machine or station has a problem. The signal can be triggered by pushing a button or
a cord, or even by the equipment itself. Think for example of the stack lights present on
some of your machines (Figure 3.4). This system is an integral component of the Jidoka
principle. Jidoka is a Japanese term means autonomation. This autonomation allows
machines to run autonomously, as they will stop when a problem occurs. Ultimately, it is
about transferring human (or better) intelligence to machines. According to this principle,
any operator is empowered to take control and stop the production line if he/she detects any
abnormality in the operation or process. This is the way that defects and problems are
highlighted and actions are taken.

Figure 3.4: Andon a.k.a. signal lights

Through Jidoka, production team dont just stop the process, it allows them to
highlight the problem, correct it and then tackle root cause to prevent the problem ever
happening again. So through a sometimes initially painful series of line stops, production
team starts to remove problems from our process, within a short period of time the numbers
of line stops begin to reduce as problems are removed and productivity begins to improve as
root causes of problems are removed. Simply said, Andon and Jidoka are powerful and
effective communication tools that:

a) Bring immediate attention to problems (defects) as they occur in the manufacturing

process
b) Provide a simple and consistent mechanism for communicating information on the
plant floor
c) Encourage immediate reaction to quality, down time, and safety problems
d) Improve accountability of operators by increasing their responsibility for good
production and empowering them to take action when problems occur
e) Improve the ability of supervisors to quickly identify and resolve manufacturing
issues
Andon and Jidoka are mostly practiced at Front-end production line (SMT line) in
Flextronics P5 plant.
Poka Yoke literally is a Japanese term used for error proofing, failsafe, or mistake
proofing, devices. Technically, a poka-yoke is any mechanism in production line that helps
an equipment operator avoids (yokeru) mistakes (poka). A poka-yoke device (Figure 3.5) is
one that prevents incorrect parts from being made or assembled, or easily identifies a flaw or
error. Errors can be classified into several types which are, processing error, setup error,
operation error, measurement error, missing parts and improper/wrong parts. Poka Yoke
device which available at Middle-end production line in Flextronics P5 plant can be used
for detecting missing parts and improper items.

Figure 3.5: Poka Yoke device

3.6

Product Audit

At Back-end production line, is where the complete assembled PCBs are being
tested, audited and packed for shipping. QA here is stands for Quality Audit whereby QA
operator inspects the complete assembled and tested PCBs through magnifier lenses,
checking carrier condition, also brushing and polishing PCBs before packing process.
Packing process includes wrapping PCB with ESD-safe bag, and then put inside box which
covered by ESD-safe foam to avoid vibration and electrostatic effect that might cause
damage while shipping. OBA which stands for Open Box Audit is the operation of reopening the box of packed network panel to check its content whether the components have
been fully secured with ESD-safe bag and ESD-safe foam alongside manual book inclusion
for the network panel.

3.7

IKW (Internal Kaizen Workshop) Team

Kaizen is a Japanese workplace philosophy which focuses on making continuous

gradual improvements which keep a business at the top of its field. Literally, kai means
change and zen means betterment/improvement therefore it is simply translated into
Continuous Improvement. The philosophy involves everyone in the organization from top
management to common workers and urges them to make never-ending efforts for
improvement. Continuous improvement is one of the TQM (Total Quality Management)
objectives. The IKW team of Flextronics Penang P5 consists of Quality Engineer,
Equipment Engineer, Process Engineer, Production Engineer as well as Industrial Engineer
and chaired by Senior Manager of Engineering Department. This cross-functional team
discusses quality improvement for each department point of view they represent.

CHAPTER 4 CONCLUSION

In conclusion, the application of quality tools and techniques can be summary in

critical process that has impact on quality. The critical process that has impact on quality can
be explain in this company system is about how to make sure that the solder paste printing
not affects the PCB. As we know the PCB is very sensitive and cannot be defect in surface
mount assembly because every component land is an opportunity for a defect. it is
commonly accepted that 60-70% of solder defects occur at the printing stage. To ensure that
not happen, the surface of the PCB no or too little solder paste deposited onto the PCB pad
results in no solder joint. Too much solder paste can cause an electrical short circuit. The
flow process of SMT must be suitable to the development of PCB board. This is done by the
use of squeegees. Once solder paste has been applied to the lands, the board is moved to one
or more pick and place machines or other automated component placement devices. It also
must remind that the heat causes the solder to melt, and since the solder may have been
melted before, the term reflow describes the action taking place. All of stage in the flow
process is important to ensure that the development of PCB board is in the goo condition
and free from defect.
We also must consider the root-cause Diagram and 5 whys meaning that we must
know what cause on the PCB board is so that from the we can know how that happens and
we can investigate the problem and fit it. The failure mode and effect analysis is one of the
step of application of quality tools and techniques define, identify and eliminate a known/or
potential problems, errors and so on from the system, design, process or service before they
reach the customer or it is a methodology to maximize the satisfaction of the customer by
eliminating and /or reducing known or potential problems. We can analysis the problem of
the defeat and we can control the defeat by using this step which way are effective way to
ensure the development of PCB board are zero defeat. Andon paper lantern is a method of
signaling a quality or process problem. It can be a signboard incorporating signal lights to
indicate which machine or station has a problem, Jidoka Japanese term means
autonomation. This autonomation allows machines to run autonomously, as they will stop
when a problem occurs. Ultimately, it is about transferring human (or better) intelligence to
machines and Poka Yeke is a Japanese term used for error proofing, failsafe, or mistake
proofing, devices. Technically, a poka-yoke is any mechanism in production line that helps
an equipment operator avoids (yokeru) mistakes (poka). This as caution sign to prevent from
continues happing defeat. We also can consider product audit and IKW (Internal Kaizen
Workshop) Team is the last step to recheck the condition of the packaging after all the step
are settle to ensure the PCB board are in the good condition before it will transfer to other
department or the marketing line.

BIBLIOGRAPHY
Bero, J. (2010). Road map to customer impact 6 Sigma. Retrieved from Manufacturing Process
Excellent: http://www.southjerseyasq.org/documents/Manufacturing%20Process%20excellence
%20handout%20(J%20Bero).pdf
Business Group. (2011, Jun). Retrieved from Flextronic:
http://www.flextronics.com/business_groups/pages/quality%20certifications.aspx
Chevalier, P.B. and L.M. Wein. (1997). Inspection for Circuit Board Assembly. Management
Science, Vol. 43, No. 9 , p. 1198-1213.
Industries Association Connecting Electronics. (2010). Solder Paste Printing, Defect Analysis and
Prevention. Retrieved from www.ipctraining.org/dvd/35c/script.pdf
Intranet. (2006). Retrieved from Flextronics: http://intranet_apac.flextronics.com
ISO - International Organization for Standardization. (2004, January). Retrieved from
http://www.iso.org/iso/home/about.htm
Joseph, L.A., J.T. Watt, and N. Wigglesworth. (1990). Modeling and Analysis of a New Product
Development in Electronics Sub-Assembly Manufacturing. Proceedings of the 1990 Winter
Simulation Conference , p. 899-903.
Lasky, E. B. (2012). Process Guidelines to Ensure Optomal SMT Electronics Assembly. Retrieved
from http://kicthermal.com/wp-content/uploads/2012/11/Process-Guidelines-to-Ensure-OptimalSMT-Electronics-Assembly-98776-R0.pdf.pdf
Lean Manufacturing Tools, Techniques and Philosophy. (2011, May). Retrieved from Lean
Manufacturing Tools: http://leanmanufacturingtools.org/621/what-is-kaizen/
Moyer, L.K. and S.M. Gupta. (1997). An efficient assembly sequencing heuristics for Printed Circuit
Boards configurations. Journal of Electronics Manufacturing, Vol. 7, No. 2 , p. 143-160.
SMT Troubleshooting (SMT/SMD Problem and Solution). (2002, November). Retrieved from
Electronics and You: http://www.electronicsandyou.com/blog/smt-troubleshooting-smt-smdproblem-and-solution.html
Supplier Information. (2008). Retrieved from Flextronics:
http://www.flextronics.com/supplier/default.aspx
The Importance of ISO and ESD Certification. (2012). Retrieved from Components Direct:
http://info.componentsdirect.com/blog/bid/216420/The-Importance-of-ISO-and-ESD-Certification

APPENDIX A: STATIC FREE WORK STATION

APPENDIX B: ESD-SAFE GARMENTS

APPENDIX C: ISO CERTIFICATE

APPENDIX D: SOLDERING DEFECTS

APPENDIX E: FMEA TABLE