Interview

Session

Self
Introduction

Khoo Chun Yong

Biography

Malaysian
D.O.B: February 6, 1983
Age: 31 years old
Horoscope: Aquarius
Born in Klang The Royal
City, Selangor, Malaysia
Raised up in Banting, a
small town

Educational Background
2001
|
2006

Universiti Teknologi Malaysia (UTM)

Bachelor of Engineering (Hons) (Mechanical Materials)
Optimization of Duplex Black Chromium Coating
for Solar Applications

2006
|
2009

2009
|
2014

National Taipei University of Technology (NTUT),

Taipei, Taiwan
Ph.D., Department of Energy and Refrigerating AirConditioning Engineering
Experimental Study on the Moisture Removal of
Wafer Carrier

Master of Engineering (M.Eng.) by Research

(Mechanical)
Fabrication of Laser Crystal for Electro-Optics
Application

Languages + Dialects

Employment History
1. Company Name
Position Title
Specialization

: Center for Cleaning Technology (CCTR), National Taipei University of Technology

: Field Certifier / Third Party Verification Examiner
: Field certification - Biological safety cabinet / Third party verification - Biological safety
laboratory, Hospital, Pharmaceutical, Clean spaces, etc.
: Building Services
: September 2009 Present

Industry
Duration
Work Description
Responsibilities
: Perform various performance tests identified in the NSF/ANSI Standard 49
Perform various performance tests identified in the ISO 14644 Standards,
Standards/Guidelines published by CDC TW, etc.

Employment History
2. Company Name
Position Title
Specialization
Industry
Duration
Work Description
Responsibilities

:
:
:
:
:

Shimano Components (M) Sdn. Bhd.

Industrial Interns & Junior Engineer Assistant
Value Engineering (Heat Treatment Low Carbon Steel)
Manufacturing
January 2005 June 2005

Perform product failure testing and analysis.

Monitor product quality improvement project.
Initiate course information and materials for internal employees job training.
Develop work instructions for heat treatment processes of various steel parts.

Employment History
3. Company Name
a. Position Title
Specialization
Industry
Duration
Work Description
Project Involved
Responsibilities

:
:
:
:
:

Airgate (M) Sdn. Bhd.

Site Supervisor
Clean Space
Consultation and Construction
March June 2004

: Construction of Spray Paint Production Line (in Ipoh)

: Supervise the progress of clean space construction including various performance
testing, rectification of structure defects or uneven finishes checking based on
engineering drawing, approval rules and clients notification.
Prepare handover documents for main contractor and client.
Involve in the testing and commissioning of at-rest clean space

Part of My Thesis


EXPERIMENTAL STUDY ON THE MOISTURE
CONTROL IN WAFER CARRIER
PRESENTED BY: KHOO CHUN YONG
GUIDING PROFESSOR: PROF. HU SHIH-CHENG
DATE: JULY 31, 2014

Introduction
Front Opening Unified Pods (FOUPs), the polymeric-based wafer carrier, have
three (3) critical performance functions:
1. The FOUP must exhibit precise wafer access for reliable, high throughput wafer
transfer.
2. The FOUP must provide secure wafer protection, keeping the wafer isolated
from contamination and damage due to mechanical or electrical effects.
3. The FOUP must enable reliable interoperability with process tools and
automated material handling systems (AMHS)
(Niebeling, 2000)
10

Introduction
Moisture inside a FOUP is also a problematic contaminant :
More difficult to be expelled than oxygen - ingress of moisture through the wall
surfaces of the polymeric based FOUP.
Polarity - moisture adsorbs onto metallic surfaces strongly relative to other
gases, cannot be effectively removed with inert gas purging.
Strong hydrogen bonding ability - moisture can attract polar contaminants to the
surface.
(Rana et al, 2003 ; Verghese et al.,1999)

11

Introduction
Table: Advanced processes (below 45 nm node) with high sensitivity to impurities.
FEOL Process

Impurities
Oxygen

Moisture

Organic

Exposed copper corrosion

Gate oxide

Hemispherical grained

Ultra shallow junction

SiGe epitaxy (EPI)

EPI / Pre-EPI

Salicide / contact formation

Copper seed to plate

Acid

Dopant

interface
X

(HSG) poly-Si
X

X
12

Introduction
Transition of 300 mm towards 450 mm wafer manufacturing, the
stringent cleanliness requirement of a 450 mm wafer FOUP includes:
AMC,
Oxygen ( 100 ppm), and
moisture contents (relative humidity, RH 5%)

(ITRS, 2013)

Studies and investigations reported on 450 mm FOUP and other

correlated mechanical devices are considered scarce.
Hence, it is believed to be beneficial in studying and developing the
state-of-the-art for the associated hardware.
13

Objectives
The objectives of the study are as follows:
450 mm PC FOUP
To investigate the effect of CDA purging rates on purging efficiency.
300 mm FOUP
To investigate the effect of different base materials on purging
efficiency.
14

Experimental parameters
* (5 pieces)
Moisture
Transmitter

* Only one Logger was drawn due to the simplification of schematic diagram.
Parameter

300 mm FOUP

450 mm FOUP

PC (alpha version)
LCP (alpha version)
Barrier (Commercial)

PC (alpha version)

CDA Flow rate

15 to 105 LPM

30 to 180 LPM

No. of inlets/
outlets

2inlets-2outlets,

2inlets-2outlets,

Purging time

30 minutes

30 minutes

Recovery time

90 minutes

90 minutes

Material base

Wafer
300 mm
Diameter

450 mm

Thickness

775 m

925 m

Area

706 cm2

1,589 cm2

Volume

32 L

73.5 L

Weight

125 g

342 g

640

1490

10 mm
Die /Wafer

*Alpha version: a preview version or an early version of a

product that under the development status, most likely unstable,
but is useful to show what the product will do to a selected
15
group.
[Wikipedia]

Results and Discussion

16

1. Moisture Depletion in 450 mm PC FOUP

TCRI =

FOUP Volume (L)

Flow Rate (LPM) X 60 (sec)

TCRI

17

2. Moisture Depletion in 300mm PC FOUP (based on testing conditions)

18

19

20

Conclusions
For a 450 mm PC FOUP,
Higher purging rates of CDA demonstrate favorable moisture
depletion rate within the spaces between wafers in a fully loaded
FOUP.
- Convection of purging gas : dominant mode of mass transfer in early stage, and
- Diffusion of purging gas into the tiny spaces between wafer slots later

21

Conclusions
For 300 mm FOUPs,
Base materials show significant effects on purging efficiency.
Moisture decay trend: PC << LCP Barrier FOUP
LCP FOUP demonstrates the promising moisture decay rates that are
highly comparative to the results of Barrier FOUP fully loaded.

22

Thank you for your attention.

Q&A
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