2011-03-23

Silicon Mitus

Silicon Mitus

Mega-trend
More-Moore vs. More-then-Moore
Key Enabler
Opportunities of Analog/Power
PMIC Engineering Challenges
Silicon Mitus

 Mega-trend
Moving toward Solutions => System level Solutions

Pattern =>Twin Peak Model: Brand vs. Generic

=> Value-chain System solution
Mobile Application Hardware Device //

Mandate for Energy efficiency => Analog/Power

IDM to Foundry/Fabless model
Digital SoC => Deep Nano scaling
=>
New applications =>
Mobile/cloud computing,
Bio and medical health care,
Energy/ecology smart grid, etc.

Silicon Mitus

Disparity in Market

Old

Volume

New

Generic
Products

Low end

Silicon Mitus

Brand
Products

High end
4

 : Vertical to Horizontal
Foundry/Fabless Model
Capex
IP Value

IDM
Intel
TI
STM
Samsung
Hynix

ARM

IP
House
IDM

Fabless

Foundry
1970s ~ 1980s

2000s ~

Qualcomm
Broadcom
Nvidia
MediaTek
Silicon Mitus

TSMC
UMC
CSM
SMIC
Dongbu

TSMC Pure play foundry model

Silicon Mitus

Personal Computing Redefined

2,000

Million units

Smartphones
Tablets
1,500

Netbooks
Notebooks
Desktops

New segment

1,000

500

Old segment
0
2001

Silicon Mitus

2002

2003

2004

2005

2006

2007

2008

2009

2010

2011

2012

2013

2014

2015

Source: IDC, Gartner, Morgan Stanley

6

World population and Market Prospect

Developed countries vs. Emerging countries
10,000

Million people

9.15B
2050

9,000
8,000

6.91B

6.12B

7,000

2010

2000
6,000

Growing
7.87B market

5,000
4,000

4.92B

Emerging countries

5.67B

requires more energy and

resources.

3,000
2,000
1,000

1.19B

1.24B

1995

2005

Developed countries

1.28B

0
1980

Silicon Mitus

1985

1990

2000

2010

2015

2020

2025

2030

2035

2040

2045

Matured
market

2050

Source: United Nations Population Division, World Population Prospects

7

Moores Law in CPU and SoC

386 vs. Nehalem

CPU Transistor Counts 1971-2008 & Moores Law

386

Nehalem

Debut

1985

2008

Transistor
Count

280 thousand
@1um process

731 million
@45nm process

Frequency

16 MHz

>3.6 GHz

# Cores

Cache Size

None

8 MB

I/O Peak
Bandwidth

64 MB/sec

50 GB/sec

None

Sleep Mode
Turbo Mode
Power Gating
Adaptive Frequency
Clocking

Adaptive
Circuits

Silicon Mitus

Tr. count: 2,600X, Freq: 240X

Digital SoC

Increasing Capex and Development Cost

Process Development and Fab Capex

Silicon Mitus

Product Development Cost

Affordability of Deep Nano Scale Fab

IDMs moving toward Fab-lite
The issue is economics rather than technology.
TSMC Market Share(%)

15
Siemens

14

Mitsubishi

NXP

Philips

Renesas

Hitachi

Infineon

Motorola

Sony

STM

STM

NEC

40%

0.18um

65nm

Renesas

90nm STM
Samsung

NEC

NEC

Mitsubishi

Fujitsu

Fujitsu

Samsung
Hynix
Toshiba
TSMC
Global Foundry
+

TI

TI

TI

TI

AMD

AMD

AMD

AMD

Toshiba

Toshiba

Toshiba

Toshiba

Toshiba

IBM

IBM

IBM

IBM

IBM

Intel

Intel

Intel

Intel

Intel

Intel

65nm(2005)

45nm(2007)

32nm(2009)

0.13um(2001)

Silicon Mitus

45nm

70%

Samsung

Fujitsu 0.13um Fujitsu

30%

11

Mitsubishi 60% Freescale

Sony

Samsung

80%

90nm(2003)

22nm(2012)

Source: IBC 2008 and GSA

10

The Other Dimension for System Solutions

More-Moore vs. More-than-Moore
More than Moore: Diversification

More Moore: Miniaturization

Baseline CMOS: CPU, Memory, Logic

Analog/RF

HV
Power

Sensors
Actuators

Biochips

Interacting with people

and environment

130nm

Non-digital content
System-in-package
(SiP)

90nm
65nm
45nm
32nm

Information Processing

22nm
.
.
.
V

Digital content
System-on-chip
(SoC)

Beyond CMOS

Silicon Mitus

Passives

Source: ITRS 2005

11

MEMS* Sensor Process

Accelerator Sensor for Motion-cognitive Phones

* MEMS: Micro Electro Mechanical System

Side Wall Passivation

Width= 0.8u
Depth= 15.0u

g-Sensor

Deep Si Etch

Sensor
Center

Bottom

Silicon Mitus

Medical and Sensor Applications

Lab-on-a-Chip

Gyro-sensor

Pressure

Acceleration
Electronic
Capsule
(Endoscope)

Silicon Mitus

Smart
Pill
Chemical

Yaw

Impact of shrinking feature size

Feature size
in biology

Red blood cell

(7um)

7um

Bacterium
(0.5 ~ 1um)

1um

SARS virus (100nm)

Bird flue virus (20~100nm)
10nm
DNA
(10nm)

An atom
(0.1nm)

0.1nm
3um

0.5um

90nm

10nm

Semiconductor process technology

Silicon Mitus

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Technology Convergence

Semiconductor as a Key Enabler

MEMS/Sensor/Bio

SOC/NANO/Analog
Convergence

IT Centric

Mobile
Handset

Silicon Mitus

Home
Network

BT Centric

Next Generation Products

Telematics

E-Car

Robot

Health

Bio

Power Analog
The real world is in analog.
RF

RF

Input from
real world:
Sensors,
Transducers,
LAN,
etc.

.
.
.

A/D

Computation World
in Digital

D/A

.
.
.

Output to
real world:
Drivers,
Actuators,
LAN,
etc.

...
Power Management Functions

Silicon Mitus

16

New Opportunities in Power Analog

IDM Power analog .
, Trend Power management
Paradigm shift => Power analog as a Solution

Solution means functional integration and customization

Value-add and differentiation thru circuit design
Further optimization with device engineering
Availability of Analog foundry supporting BCD process
Fabless opportunity in Power Analog

Silicon Mitus

17

WW Analog/Power Semi Market (Yr 2011 est)

WW Semi Market
U$320B

WW Analog/Power Market
U$51.9B
Analog Specific IC
$4.8B, 9%

$23.5B
$66.4B

$25.2B

Analog
$51.9B

$83.6B

Amplifiers
$3.9B, 7%
Interface
$3.1B, 6%
Data Converters
$4.0B, 8%

Power IC
$36.1B, 70%

$64.2B

Discrete Semiconductor
Analog
Memory
Logic

Optoelectronics
Microcomponents*
Sensors

Power IC
Amplifiers
Data Converters

Analog Specific IC
Interface

*Microcomponents include microprocessor, microcontroller, and DSP.

Silicon Mitus

Source: iSuppli, 2011

18

Analog/Power Products by Process Geometry

Level of integration

Digital SoC
Mixed signal IPs

Stand-alone mixed signal, analog, RF

Power management ICs

Power Discrete

Trench MOSFET

Process geometry
>1u

Silicon Mitus

0.5u

0.35u

0.18u

0.13/0.11u

90n

65n

45n

32n

20n
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Trend of Power Analog

Energy efficiency It is a mandate, not an option.
CPU(SoC) Computational performance Power
efficiency

Power management Circuit Architecture

level
, Battery Mobile computing devices Power
efficiency Form factor .
Power management => Solution with integrated functions

Silicon Mitus

20

PMIC (Power Management IC)

LCD Bias
PMIC

Smart
PMIC

Smart
LED
Controller

Battery
PMIC

IC System
, , ,
. Green Power Analog
Smart , Digital Interface Control .

Silicon Mitus

21

Smart PMIC Technology

22

Core Technology
Conversion
Analog/Digital/Power

High Speed
/
Low Noise

PMIC
CMOS / BCDMOS
Suited Design Rule
Low RDS(ON)
Latch-up

Clock

Vin

Control
Logic

Package

Silicon Mitus

Thermal performance
Smaller size
Thin
Cost effective

Smart
functions

IC

System Level

22

Power Analog

Brain driven business rather than muscle driven business

10~20 Pool
95% , 2~3%
Practice
.
.

Pyramid Barrel type

Fabless .

Silicon Mitus

23

Direction of System Solution

Future Direction of Power Analog
In nano scale design below 45nm, a system solution will consist
of two major solution chips:
SoC: digital and mixed signal
PA-SoC: Power Analog Based Solution on Chip

Power analog process node is 0.35um BCDMOS today, and is

moving to 0.18/0.15um for cost reduction (die shrink), power
efficiency improvement and performance enhancement.
BCDMOS will move further to 90 nm process to support
integration of more functions and digital logic/memory contents.

Silicon Mitus

24

Future Smart Phone will have two major sockets

in Nano-scale Design
Wireless
Connectivity*

Baseband
Processor

Audio
CODEC,
Headphone
& Speaker
amplifier

Misc.
Real time
clock, Flash
& LED
drivers

Interface
USB switch,
USB
transceiver,
Sim-card
level
translator

Power Management

Application
Processor

Battery charger, DC-DC, LDO,

Temp Sensor

SoC

PA-SoC

(Digital + Mixed Signal)

90nm~110nm
100 Pin, WLCSP

45nm
* PAM, RF ICs

Silicon Mitus

25

Trend of Integration Level in PA-SoC

Mobile SOC:
Boost, Bucks, Buck-boost,
LDO, Audio, RTC,
Temp Management,
USB, Card interface,
Battery Charger,
LED Driver
LCD TV SOC:
Boost, Bucks,
Buck-boost, Charge Pump
VCOM, Scan-driver, Switches,
Opamps, LDO

Silicon Mitus 2009

Pin Count

200

100

50

LCD PMIC:
Boost, LDO, Charge-pump,
VCOM, Scan-driver
LED driver
Boost or buck

1~2

3~5

6~15

20~30

Number of Integrated Functional Blocks

Silicon Mitus

26

Digital vs. Analog

Digital SoC: ECAD development => High level design => Architect
Analog design: More experience based => Art rather than science
Requirement

Specification
Software
Algorithm
Architecture
RTL
Gate
Circuit
Layout

Complexity management by
Abstraction and Hierarchy
Well established Design Automation
software

Abstraction
Complexity management

Device/Process

Silicon Mitus

Digital SoC

Power Analog
Circuit level design
SPICE based verification
Difficulty in Abstraction

27

Engineering Issues of Power Analog IC

Management of design complexity

Limited role of ECAD Far from automation (vs. digital SoC)

Design verification
Analog and digital mixed simulation
Difficulty in multi level simulation due to analog abstraction
Testability
Big difference of test model between Digital vs. Analog
Observability and Controllability to internal points for test and
debugging of design
Difficulty in setting up access to internal points
TEST mode for mass production

Typical problems: Latch-up, parasitic effects, leakage, ESD, etc.

Silicon Mitus

28

Engineering Issues of Power Analog IC

Noise isolation for switching converter
Margin analysis and thermal issues
Relationship among Circuit design, Layout and Device engineering
Reuse of IP => IP based design
Size reduction of embedded power switch transistor
DC-DC switching frequency: 600KHz => 2~4MHz
Higher frequency for smaller inductor size and higher
conversion efficiency, but increasing switching loss

=> Need trade-off

DC-DC architecture with digital control and using DSP
Using DSP for better power efficiency and power control.

Silicon Mitus

29

(Silicon Mitus)

Leading the smart power management technology

PMIC Fabless company

2007 2 (: 6)

$12M VC
Walden International
ePlanet Ventures

Design Center: 3, 1

: 91

: 2009 250, 2010 525

: Maxim, TI, STM,

PMIC

Silicon Mitus

U.S.A.
Silicon Valley
Korea
Japan
China

Taiwan

Seoul
Gumi

Silicon Mitus
Samsung
LG

30

Silicon Mitus Product Portfolio

Display PMIC
LCD:
Notebook, Monitor, TV, Tablet
LED-BLU: Notebook, Monitor, TV
AMOLED*
Mobile PMIC
Main PMIC*
Sub PMIC*
Chargers* (Switch mode)
Green

Silicon Mitus

Energy
PFC
BMIC(Battery Management IC)*
LED lighting*
* Engineering Samples available in 2011
31

Silicon Mitus won

the 2009 GSA Start up to Watch Award
* GSA (Global Semiconductor Association) is the world wide semiconductor organization
joined by 450 member companies such Intel, TI, Qualcomm, STM, nVidia, MediaTek,
Samsung, TSMC, etc.

Receiving the Award at the GSA Annual Award Dinner

held at Santa Clara Convention Center on December 10, 2009

Silicon Mitus

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Silicon Mitus

33

World Champion of Power Analog
Silicon Mitus

34




SoC =>
, Analog/Power Fabless

Renaissance of PMIC
Solution Power Analog
Solution => PMIC Analog/Power SoC
Mobile Green energy
Technical challenges

Power Analog Career Development .

Silicon Mitus

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Silicon Mitus

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