Application Note 9.

18
SMSC USB 2.0 Analog Routing
Guidelines

General Description
This application note discusses the fundamental Layout practices that should be used for the Analog portion
(RTERM, USB+/-, FS+/-, RBIAS, XTAL1, XTAL2) of the SMSC USB 2.0 products to alleviate problems with EMI, and
USB Signal integrity.

SMSC AN 9.18

Rev. 07/09/2002

PRELIMINARY

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Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete
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SMSC AN 9.18

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The XTAL and USB I/O buffers on the USB 2.0 products are powered from the VDDA/ VSSA analog power rail. For
the reason discussed previously the crystal circuit (XTAL lines, Crystal, Filter capacitors), USB+/-, and FS+/- should
be referenced to this same analog ground.
Furthermore, it is suggested that the XTAL and USB signals are separated by at least 50 mils as quickly as possible
after breaking out of the chip, thus minimizing the area for cross talk to occur.

Here are some guidelines, which have been used on the SMSC evaluation platform:
Analog ground should be tied to Digital Ground through a "Moating" technique, or through a resistor, to isolate analog
and digital loop currents. Avoid any digital signals encroaching on or crossing the analog ground plane as well as any
analog signals crossing or encroaching on the Digital Ground plane.
(See Figure 1).
Signals that should be referenced to the Analog Ground plane are:
RBIAS
RTERM
XTAL1
XTAL2
USB +/FS +/USB+/- and FS+/- should be routed to have a differential impedance of 90 ohms. This can be accomplished with a
7.5 mil trace and a 7.5 mil space on a 4.5 mil FR4 dielectric.

7.5
mil
0.7 mil

7.5
mil

Trace

7.5
mil
Trace

Dielectric

4.5
mil

Gnd Plane

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USB Routing Example

Figure 1 details a simple PCB routing example using the USB97C210. The green traces are top-side routing, and the
blue is the layer 2 ground plane.
It can be seen in Figure 1 that the USB Analog Ground plane is created underneath the chip. The moating technique
used isolates the High Frequency Loop currents to a much smaller area thus minimizing the area, which can radiate
EMI.
A minimum spacing of 25 mils between the Digital and Analog ground planes is recommended. This further isolates
the two ground planes, restricting capacitive coupling between the two planes.
The RBIAS and RTERM resistors, and the Crystal filter capacitors are not depicted here. In this example they are
placed on the bottom side. A Ground plane similar to the one depicted here was implemented on the adjacent
ground plane layer to the bottom side traces so that RBIAS, RTERM, and the Crystal filter caps are still referenced to
an analog ground. If these components are placed on the top side, then the Analog ground should be modified to
encompass their associated signals.

Ground Moating

XTAL Lines

USB FS Termination
Resistors

USB Analog
ground plane
Digital
ground plane

USB Lines

FIGURE 1 - USB ANALOG SECTION ROUTING EXAMPLE

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USB Connector Pin Connections

D+/- :

Connect directly to USB silicon USB +/- and route through termination resistors (value
recommended by SMSC specification) to FS +/-

USBVCC :

Connected to +5V plane. (Recommended to use a Ferrite Bead to connect to any local voltage)

USBGND :

Connected to the Analog Ground Plane directly or through a Ferrite Bead

Shield GND :

Connected as a chassis ground. If a metal enclosure is used connect to that, if only plastic is used
for any enclosure leave unconnected

Conclusion
Following the guidelines in this application note will ensure a reduction in EMI, and increased Signal integrity for the
analog portion of any SMSC USB 2.0 chip.
Note that this application note serves only as a general set of guidelines that should be followed when using an
SMSC USB 2.0 chip. Specific customer requirements may both create new guidelines, which must be followed,
and/or force specific rules dictated here to be broken.

SMSC AN 9.18

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