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Technical White Paper for System Reliability Prediction of eLTE 2.

3
INTERNAL

Product Name

Confidentiality

eLTE

Confidential

Product Version

22 pages in total

V2.3

Technical White Paper for System Reliability


Prediction of eLTE 2.3
(For internal use only)

Prepared by

Liu Hao (employee ID: 00273140)

Date

Reviewed by

Date

Approved by

Date

Huawei Technologies Co., Ltd


All rights reserved.

2014-06-03

Technical White Paper for System Reliability Prediction of eLTE 2.3


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Change History
Date

Issue

Description

Author

2014-06-20

1.01

Added the eCNS610-related


information.

Liu Hao (employee ID:


00273140)

2014-06-03

1.00

Completed the draft.

Liu Hao (employee ID:


00273140)

2014-06-20

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Technical White Paper for System Reliability


Prediction of eLTE 2.3
Key words:
eLTE 2.3, reliability, eCNS600, eCNS610, DBS3900
Abstract:
This document describes the methods for calculating the reliability indicators of the network elements (NEs)
in the eLTE 2.3 solution.

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1 Reliability Modeling
The reliability modeling involves the following steps:
1.

Defining functions and physical components

2.

Defining faults

3.

Defining fault properties

4.

Constructing reliability models

5.

Determining the number of simulations and the life cycle

6.

Determining assumptions in reliability prediction

1.2 Defining Functions and Physical Components


The first step for calculating system reliability is to determine the physical components used for reliability
modeling. Not all components in the system need to be incorporated in reliability modeling. The
components that do not impact key services, such as maintenance terminals, can be ignored in reliability
modeling if not required. Component selection for reliability modeling also depends on actual applications.
For example, if the voice broadcast system is used for management assistance, which is not a key service,
the components in the system can be ignored in reliability modeling. However, if the voice broadcast
system is involved in security tracing, the components need to be incorporated in reliability modeling.
In system-level reliability modeling, typical components include the eCNS, eNodeB, terminals involving
security services (for example, a vehicle-mounted terminal for train control), transmission devices, antenna
feeder devices, and power supply modules. Sometimes, a mobile terminal is ignored in system-level
reliability modeling, but its reliability can be independently calculated.

1.3 Defining Faults


System reliability indicators have a close relationship with system fault definitions. Different fault
definitions lead to different calculation results of reliability indicators.
When system or subsystem faults are defined for NEs or boards working in redundancy mode, the
redundancy type needs to be considered. For example, an eNodeB fault is determined for an eNodeB with
three carriers working in 2+1 backup mode only when two or more carriers are faulty. For a co-site network
hosting two eNodeBs working in 1+1 backup mode, a fault in only one eNodeB is not considered as a
system fault.
However, the duration for active/standby switchover needs to be considered in the preceding situations. For
details, see section 1.4 "Defining Fault Properties."
Besides hardware faults, other fault types may be involved in a project, such as software faults, faults
caused by human errors, and faults caused by external factors (for example, lightning stroke and violent
damage).

1.4 Defining Fault Properties


Common fault properties are defined as follows:

Failure distribution curve, failure rate, and mean-time-to-failure (MTTF)/mean time between failures
(MTBF)

Mean time to repair (MTTR) and definition of repairs and spare parts

Fault impact

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Failure Distribution Curve, Failure Rate, and MTTF/MTBF


A failure rate is the average number of failures for a component per unit of time after the component begins
to fail. Generally, a failure rate is expressed as . Accordingly, the failure rate function is expressed as (t)
because the failure rate is a function of the time t. The failure rate function corresponds to the failure
distribution curve, the value of which may vary according to the component. The failure rate for an
electronic component within its life cycle is generally a constant, and exponential distribution is used for
such a failure rate. The failure rate for a mechanical component, however, varies depending on the time
segment. Weibull distribution is generally used for such a failure rate.
MTTF indicates the average interval at which a fault occurs on a component. MTTF is a reciprocal of a
failure rate expressed by exponential distribution.
To calculate the MTTF of a board to determine the reliability of the board, the failure distribution curve (or
failure model) must be first determined, and then the failure rate can be determined.
MTBF indicates the average time between consecutive failures of a component, which can be calculated in
the following formula: MTBF = MTTF + MTTR.

MTTR and Definition of Repairs and Spare Parts


MTTR is closely related to service availability. The value of MTTR equals the sum of Mean Active Repair
Time (MART) and Mean Logistical and administrative Delay Time (MLDT). MART is related to factors
such as architecture design, fault management design, and board startup time and is the intrinsic reliability
feature of components, while MLDT is the mean delay time to ensure network maintenance, such as the
time spent on personnel dispatch, transportation, and acquisition of spare parts. MLDT is related to the
staffing and equipment for the maintenance team.
The definition of repairs and spare parts involves resources and spare parts required for a repair. With the
definition, the number of spare parts in the system and the maintenance cost for the life cycle of a project
can be calculated. The transportation of spare parts also affects MTTR.

Fault Impact
The fault impact determines the impact of a fault on the functions and subsystem. The impact can be
classified into high, medium, and low levels. The impact of a fault that affects the entire system and causes
a failure to provide services is a high-level impact. If a fault leads to short-period service interruption in a
specific area served by multiple eNodeBs, the impact of the fault is a medium-level impact. A low-level
impact indicates short-period service interruption for a single service channel caused by, for example, ring
topology switchover after transmission interruption. An example of a low-level impact is 2s voice service
interruption. The fault impact is defined so that it can be used with the failure rate to determine the list of
critical items in the system, which facilitates the availability optimization of the entire system.

1.5 Constructing Reliability Models


Huawei uses reliability block diagrams (RBDs) to construct systematic reliability models for analysis and
calculation of reliability indicators.
The structure of an RBD indicates the logical relationships of faults in a system. Each block indicates a
fault of a component, a subsystem fault, or an event that affects the system fault. As for a subsystem fault,
the structure of another RBD can be used to indicate its internal logical relationships. The logical flow of an
RBD starts from the input on the left and ends at the output on the right. Between the input and the output
of the RBD, multiple blocks are arranged in serial or parallel connections depending on the characteristics
of a system.
A system with serially connected blocks indicates that a fault in any component will result in a system
failure.

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Figure 1-1 System with serially connected blocks


Block 1

Block 2

Block 3

A system with parallel connected blocks indicates that the components work in redundancy mode.
Figure 1-2 System with parallel connected blocks
Block 1

Block 2

Block 3

A complex system consists of both serial and parallel connections, indicating that serially and parallel
connected subsystems exist in the system.
An RBD can also indicate the redundancy relationship of a decision system (k out of n). As indicated by
the number 2 in Figure 1-3, at least two paths of the three parallel paths must work properly. When two
paths are faulty, the system is faulty.
Figure 1-3 Decision system
Block 1

Block 2

Block 3

An RBD can also be used to analyze common cause failures. The common cause failure indicates a fault
that can lead to failures of multiple functional components. If there is a common cause failure in a system
with redundancy design, the failure must be expressed as a block serially connected to other blocks in an
RBD. As shown in Figure 1-4, blocks 1 and 2 are failures of independent components working in
redundancy mode, and the failure expressed by block 3 can lead to simultaneous failures of the two
components.

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Figure 1-4 System with a common cause failure


Block 1
Block 3
Block 2

1.6 Determining the Number of Simulations and the Life Cycle


The number of simulations and the life cycle are involved as two important parameters in the calculation of
the system unavailability based on the reliability model and fault model. The number of simulations is the
number of times the system reliability model runs in simulation mode. Each time a system reliability model
runs in simulation mode, the system determines whether it stably runs for a specified period. The specified
period is the life cycle. For example, if the number of simulations is 1000, the life cycle is one year, and the
number of times a fault occurs within the life cycle of the entire system calculated based on the system
reliability model is 50, the system unavailability is 5%.

1.7 Determining Assumptions in Reliability Prediction


1.7.1 MTTR
MTTR is defined depending on the actual maintenance capability in a project. For example, the in-transit
time for the repair of eNodeBs in a remote area is different from that for the repair of eNodeBs near a city.
There is an assumption for the calculation of MTTR for each NE. For details, see the reliability prediction
report of each NE.

1.7.2 Software Availability


Software reliability is the capability that the software possesses to implement the required functionality
under specified conditions within a specified period. Software reliability can be measured by availability.
Software availability is the probability for the software not to cause system failures under specified
conditions within a specified period. Software reliability and hardware reliability have many differences,
which are caused by the fault mechanisms of software and hardware. Therefore, software reliability is
assessed differently from hardware reliability.
No mature quantitative measure is available for the analysis of software availability in the industry.
Therefore, software availability is excluded from the reliability models in this document. If software
availability needs to be considered in a project, an assumed target value can be given to an associated NE.

1.7.3 External Factors


External factors are not considered in the reliability models in this document.
In some projects, however, some external factors need to be considered as required. For example, the
probability of optical fiber faults caused by rodents need to be considered in areas where no rodent-free
measure is used for optical fibers. In areas flooded with violence, the probability of violent damages to the
outdoor equipment needs to be considered.
Lightning protection measures are taken for Huawei outdoor eNodeBs, and therefore the probability of
damages caused by lightning stroke can be ignored.

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1.7.4 Human Factors


Human factor analysis or human error analysis is used to measure the impact of human errors on system
availability. Human errors are errors leading to system faults caused by misoperations of system operation
personnel. Humans are flexible in executing tasks. Humans can handle exceptions and faults at any time,
but human errors may also be introduced. Human errors mainly include the failure to execute a specified
function, incorrect execution of a specified function, and execution of an unspecified function.
Human errors are not considered in reliability models in this document. In actual projects, the system
operation behaviors of humans can be determined based on the application scenario of the system to
analyze the impact of human errors so as to calculate the probability of human errors that may lead to
system faults. A large number of methods can be used to analyze the probability of human errors, among
which there is a simple method that mainly depends on the judgment of experts, that is, human error
assessment and reduction technique (HEART).

2 Reliability Prediction Methods


2.1 Board Reliability Prediction Methods
2.1.1 Component Reliability Prediction Method
The formula for calculating the component failure rate is as follows:

SSi Gi Qi Si Ti
where,

Gi is the generic steady-state failure rate for the ith component.

Qi is the quality factor of the ith component.

Si is the stress factor of the ith component.

Ti is the steady-state temperature factor for the ith component under normal working temperature.

Under 40C and 50% stress, S equals T, which has a value of 1.0, and therefore the formula can be
simplified as:
Ssi = Gi Qi

2.1.2 Method for Calculating the Board Failure Rate


The board failure rate is the sum of the component failure rates and can be calculated in the following
formula:
n

SS E N i SSi
i 1

where,

n is the number of component types.

Ni is the number of components of the ith component type.

E is the board environment factor. For the fixed and controlled environment on the ground, E has a
value of 1.0.

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2.2 System Reliability Prediction Methods


The calculation of system reliability depends on the system fault definitions to a large extent. Different
system fault definitions lead to use of different algorithms. For example, some board faults in the system
lead to a failure of the entire system, whereas some board faults lead to unavailability of only some
functions in the system. According to Bellcore SR-TSY-001171, there are two kinds of system-level faults:
total system downtime (TSD) and partial system downtime (PSD).

2.2.1 System Fault Definitions and Formula


TSD is an approximate time period during which the entire system breaks down and fails to handle any
requests. TSD is generally expressed as minutes per year.
PSD is the weighted mean of the downtime during which the system only partially fails. The weight factor
is the number of lines impacted by a specific failure mode.
The calculation formulas for the TSD and PSD are as follows:

TSD

Li N L
Ti NT

PSD

(D (L / N

0 Li N L

))

where,

Li is the number of subscriber lines impacted by failure mode i.

Ti is the number of trunk lines impacted by failure mode i.

NT is the total number of trunk lines in the system.

NL is the total number of subscriber lines in the system.

Di is the predicted downtime of failure mode i, expressed as minutes per year.

2.2.2 Calculation of Di
According to the preceding formulas, the calculation of system reliability or system availability depends on
the calculated Di value of each board.
The impact of a failure mode is first analyzed to determine which boards in the system will cause TSD and
which will cause PSD. Then, the Di values of these boards are calculated.
During Di calculation, boards with redundancy and boards without redundancy are differentiated.

Calculation of Di for Boards Without Redundancy


The availability of a board without redundancy can be calculated in the following formulas according to the
previously calculated failure rate and determined recovery rate (reciprocal of MTTR):

Availability (A) = MTBF/(MTBF + MTTR)

Downtime (Di) = 525,600 x (1-A) (expressed as minutes/year)

Failure rate (1 Failures In Time or FIT) = 10-9/hour

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Calculation of Di for Boards with Redundancy


The availability of boards with redundancy can be calculated by using the Markov model for repairable
products.
Boards with redundancy can be differentiated by work mode: active/standby backup and load sharing. The
availability of the two types of boards with redundancy can be calculated in one of the following formulas:

The availability of boards working in N+1 backup mode can be calculated as follows:

A 1 {C [1 a N ( N 1 N a)] N (1 C ) (1 a N ) N}

The availability of boards working in N+1 load sharing mode can be calculated as follows:

A 1 {C A [1 a N ( N 1 N a)] N (1 C A ) (1 a N 1 ) ( N 1)}
where,

A is the availability of boards working in N+1 redundancy mode.

C is the switchover ratio or the probability of successful switchover times.

CA is the probability of successful switchover times for the active board.

CS is the probability of successful switchover times for a standby board.

CA x CS indicates the switchover ratio of boards working in active/standby backup mode.

CA indicates the switchover rate of the boards working in load sharing mode.

a is the availability of each board working in N+1 redundancy mode, which can be calculated using
MTBF/(MTBF+MTTR).

Di can be calculated based on the availability.


In actual applications, the calculation of Di is complicated with many conditions considered. For example,
the backup mode can be warm backup or hot backup, and the time for an active/standby switchover cannot
be calculated using a simple formula. The lifetime distribution of different components can neither be
calculated using a simple formula.
To accurately calculate the system availability, Huawei adopts professional reliability simulation software.
The software creates system reliability models based on RBDs and then analyzes the system availability
and reliability based on Monte-Carlo simulation to simulate the availability indicators close to the actual
projects.

2.3 Other Relevant Parameters


The MTTR mentioned in this document refers to the onsite repair time and does not include the time
required for personnel transfer or logistics.
In this document, the MTTR of each board and equipment is determined to be 1, 2, 4, or 24 hours
according to the MIL-HDBK-472, engineering experience, and field data.
In addition, according to the reliability engineering baseline of Huawei, the failure detection rate of active
boards is 95%, the failure detection rate of standby boards is 90%, and the switchover success rate is 99%.

3 eCNS600 Configuration and Reliability Prediction


3.1 eCNS600 Reliability Prediction Models
eCNS600 reliability models can be constructed based on boards configured with or without redundancy.

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3.1.1 eCNS600 Reliability Model Constructed with Boards Configured


Without Redundancy
SMU
PEM

EPC

FAN

SWU
SDM

SMU

ISU

SWI

OMU

USI

SWU

OXI

3.1.2 eCNS600 Reliability Model Constructed with Boards Configured with


Redundancy
PEM

FPC

FAN

SMU

SDM

SWU

SWI

PEM

FPC

FAN

SMU

SDM

SWU

SWI

OMU

USI

ISU

QXI

OMU

USI

ISU

QXI

3.2 Typical Configurations of eCNS600 Reliability Models


3.2.1 Typical Configuration of eCNS600 Boards Without Redundancy
Board/Module

Description

Quantity

PEM

Power Entry Module

FPC

Flexible Printed Circuit

FAN

Fan

SMU

Service Management Unit

SDM

Service Data Management

SWU

Switch Unit

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Board/Module

Description

Quantity

SWI

Switch Interface Unit

OMU

Operation and Maintenance Unit

USI

Universal Service Interface

ISU

Integrative Session Unit

QXI

QUAD 10GE Interface Unit

3.2.2 Typical Configuration of eCNS600 Boards with Redundancy


Board/Module

Description

Quantity

PEM

Power Entry Module

FPC

Flexible Printed Circuit

FAN

Fan

SMU

Service Management Unit

SDM

Service Data Management

SWU

Switch Unit

SWI

Switch Interface Unit

OMU

Operation and Maintenance Unit

USI

Universal Service Interface

ISU

Integrative Session Unit

QXI

QUAD 10GE Interface Unit

3.3 eCNS600 Board Reliability Indicators


Board/Module

Failure Rate (FITs)

MTBF (Hours)

MTBF (Years)

OMU

2219.61

450529.60

51.43

USI

403.19

2480220.24

283.13

ISU

1973.01

506839.80

57.86

QXI

403.19

2480220.24

283.13

SMM

683.53

1462993.58

167.01

SDM

101.1

9891196.83

1129.13

SWU

2357.99

424090

48.41

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Board/Module

Failure Rate (FITs)

MTBF (Hours)

MTBF (Years)

SWI

518.08

1930203.83

220.34

PEM

487

2053261.6

234.4

FAN

1000

1000000

114.2

FPC

272.7

3667033.4

418.6

3.4 eCNS600 Reliability Prediction


3.4.1 Reliability Prediction for eCNS600 Boards Without Redundancy
MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

15.73

99.99928%

3.81

15.73

99.99854%

7.62

3.4.2 Reliability Prediction for eCNS600 Boards with Redundancy


MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

40.0

99.99972%

1.50

40.0

99.99943%

3.00

4 eCNS610 Configuration and Reliability Prediction


4.1 eCNS610 Reliability Prediction Models
Figure 4-1 eCNS610 reliability prediction model with eight hard disks, fans working in 7+1 backup mode, and
power supply modules working in 1+1 backup mode
Memory 1
Mother
board

RAID
controller
card

...

CPU

24

I/O card

Backplane
connecting
hard disks

Memory 24

Hard disk 1
...
Hard disk 8

2014-06-20

Power supply
module 1

Fan 1
8

...
Fan 8

7
Power supply
module 2

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4.2 Typical Configurations of eCNS610 Reliability Models


Board/Module

Quantity

Mother board

RAID controller card

CPU

Memory

24

I/O card

Backplane connecting hard disks

Hard disk

Fan

Power supply module

4.3 eCNS610 Board Reliability Indicators


Board/Module

Failure Rate (FITs)

MTBF (Hours)

MTBF (Years)

Mother board

3721.0

268744.96

30.7

RAID controller card

559.2

1788268.96

204.1

CPU

40.0

25000000

2853.8

Memory

5000.0

200000

22.83

Backplane connecting hard disks

82.9

12062726.2

1377.0

I/O card

82.6

12106537.5

1382.0

Fan

582.0

1718213.06

196.1

Hard disk

3425.0

291970.80

33.33

Power supply module

2000.0

500000

57.1

4.4 eCNS610 Reliability Prediction


MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

12.29

99.999071%

4.88

12.29

99.998143%

9.76

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5 DBS3900 Configuration and Reliability Prediction


A DBS3900 consists of two independent modules: baseband (BB) module and radio frequency (RF)
module, which are connected over the common public radio interface (CPRI) through an optical cable.

5.1 BBU3900/BBU3910
The BBU3900/BBU3910 is an indoor baseband unit, which fits into 2U space of any standard 19-inch
cabinet. The BBU3900/BBU3910 occupies small space and can be easily installed.
The BBU3900/BBU3910 includes boards such as UMPT, UPEU, and UBFA and is fed with 48 V DC
power.

5.2 RRU3251/RRU3232/RRU3252/RRU3253
The RRU3251, RRU3232, RRU3252, and RRU3253 are remote radio units used outdoors, which can be
installed on a pole or a wall near the antenna.
Figure 5-1 RRU

5.3 DBS3900 Reliability Prediction Models


5.3.1 DBS3900 Reliability Model Constructed with Boards Configured
Without Redundancy
Figure 5-2 DBS3900 reliability model 1
RRU
UPEUc

FANc

UMPT

LBBP

...
RRU

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5.3.2 DBS3900 Reliability Model Constructed with UPEUs and LBBPs


Configured with Redundancy
Figure 5-3 DBS3900 reliability model 2

UPEUc

LBBP
FANc

RRU

UMPT

UPEUc

...
LBBP

RRU

5.3.3 DBS3900 Reliability Model Constructed with UMPTs Configured


with Redundancy
Figure 5-4 DBS3900 reliability model 3

UPEUd

UMPT

LBBP

RRU

FANd

...

UPEUd

UMPT

LBBP

RRU

5.4 Typical Configurations of DBS3900 Reliability Models


5.4.1 Typical Configuration 1 for the DBS3900
Board/Module

Description

Quantity

UPEUc

Power and Environment interface unit

FANc

BBU Fan Module

UMPT

Main Processing & Transmission unit

LBBPd2

Baseband Process and Radio Interface unit

RRU3251

Remote Radio Unit

1-3

5.4.2 Typical Configuration 2 for the DBS3900


Board/Module

Description

Quantity

UPEUc

Power and Environment interface unit

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Board/Module

Description

Quantity

FANc

BBU Fan Module

UMPT

Main Processing & Transmission unit

LBBPd2

Baseband Process and Radio Interface unit

RRU3232/RRU3252/RRU3256

Remote Radio Unit

1-3

5.4.3 Typical Configuration 3 for the DBS3900


Board/Module

Description

Quantity

UPEUc

Power and Environment interface unit

FANc

BBU Fan Module

UMPT

Main Processing & Transmission unit

LBBPd2

Baseband Process and Radio Interface unit

RRU3251

Remote Radio Unit

1-3

5.4.4 Typical Configuration 4 for the DBS3900


Board/Module

Description

Quantity

UPEUc

Power and Environment interface unit

FANc

BBU Fan Module

UMPT

Main Processing & Transmission unit

LBBPd2

Baseband Process and Radio Interface unit

RRU3232/RRU3252/RRU3256

Remote Radio Unit

1-3

5.4.5 Typical Configuration 5 for the DBS3900


Board/Module

Description

Quantity

UPEUc

Power and Environment interface unit

FANc

BBU Fan Module

UMPT

Main Processing & Transmission unit

LBBPd2

Baseband Process and Radio Interface unit

RRU3251

Remote Radio Unit

1-3

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5.4.6 Typical Configuration 6 for the DBS3900


Board/Module

Description

Quantity

UPEUc

Power and Environment interface unit

FANc

BBU Fan Module

UMPT

Main Processing & Transmission unit

LBBPd2

Baseband Process and Radio Interface unit

RRU3232/RRU3252/RRU3256

Remote Radio Unit

1-3

5.4.7 Typical Configuration 7 for the DBS3900


Board/Module

Description

Quantity

UPEUd

Power and Environment interface unit

FANd

BBU Fan Module

UMPT

Main Processing & Transmission unit

LBBPd2

Baseband Process and Radio Interface unit

RRU3251

Remote Radio Unit

1-3

5.4.8 Typical Configuration 8 for the DBS3900


Board/Module

Description

Quantity

UPEUd

Power and Environment interface unit

FANd

BBU Fan Module

UMPT

Main Processing & Transmission unit

LBBPd2

Baseband Process and Radio Interface unit

RRU3232/RRU3252/RRU3256

Remote Radio Unit

1-3

5.4.9 Typical Configuration 9 for the DBS3900


Board/Module

Description

Quantity

UPEUd

Power and Environment interface unit

FANd

BBU Fan Module

UMPT

Main Processing & Transmission unit

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Board/Module

Description

Quantity

LBBPd2

Baseband Process and Radio Interface unit

RRU3251

Remote Radio Unit

1-3

5.4.10 Typical Configuration 10 for the DBS3900


Board/Module

Description

Quantity

UPEUd

Power and Environment interface unit

FANd

BBU Fan Module

UMPT

Main Processing & Transmission unit

LBBPd2

Baseband Process and Radio Interface unit

RRU3232/RRU3252/RRU3256

Remote Radio Unit

1-3

5.4.11 Typical Configuration 11 for the DBS3900


Board/Module

Description

Quantity

UPEUd

Power and Environment interface unit

FANd

BBU Fan Module

UMPT

Main Processing & Transmission unit

LBBPd2

Baseband Process and Radio Interface unit

RRU3251

Remote Radio Unit

1-3

5.4.12 Typical Configuration 12 for the DBS3900


Board/Module

Description

Quantity

UPEUd

Power and Environment interface unit

FANd

BBU Fan Module

UMPT

Main Processing & Transmission unit

LBBPd2

Baseband Process and Radio Interface unit

RRU3232/RRU3252/RRU3256

Remote Radio Unit

1-3

2014-06-20

Huawei confidential. No spreading without permission.

Page 19 of 22

Technical White Paper for System Reliability Prediction of eLTE 2.3


INTERNAL

5.5 DBS3900 Board Reliability Indicators


Board/Module

Failure Rate (FITs)

MTBF (Hours)

MTBF (Years)

UPEUc

380

2631578.95

300.4

UPEUd

560

1785714.29

203.8

FANc

940

1063829.79

121.4

FANd

950

1052631.58

120.1

UMPT

1550

645161.29

73.6

LBBPd

1120

892857.14

101.9

RRU3253/3259

5710

175131.35

19.9

RRU3251

2460

406504.07

46.4

RRU3232/RRU3252/RRU3256

3100

322580.65

234.4

5.6 DBS3900 Reliability Prediction


5.6.1 Reliability of the DBS3900 Configured in Mode 1
MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

28.99

99.99961%

2.07

28.99

99.99882%

6.21

5.6.2 Reliability of the DBS3900 Configured in Mode 2


MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

28.90

99.99960%

2.08

28.90

99.99881%

6.23

5.6.3 Reliability of the DBS3900 Configured in Mode 3


MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

46.20

99.99998%

1.30

46.20

99.99926%

3.90

2014-06-20

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Page 20 of 22

Technical White Paper for System Reliability Prediction of eLTE 2.3


INTERNAL

5.6.4 Reliability of the DBS3900 Configured in Mode 4


MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

46.12

99.99997%

1.30

46.12

99.99926%

3.90

5.6.5 Reliability of the DBS3900 Configured in Mode 5


MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

123.54

99.999908%

0.48

123.54

99.999723%

1.44

5.6.6 Reliability of the DBS3900 Configured in Mode 6


MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

122.22

99.999907%

0.49

122.22

99.999720%

1.47

5.6.7 Reliability of the DBS3900 Configured in Mode 7


MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

27.77

99.999589%

2.16

27.77

99.998767%

6.48

5.6.8 Reliability of the DBS3900 Configured in Mode 8


MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

27.54

99.999585%

2.18

27.54

99.998756%

6.54

5.6.9 Reliability of the DBS3900 Configured in Mode 9


MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

46.00

99.999752%

1.30

2014-06-20

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Page 21 of 22

Technical White Paper for System Reliability Prediction of eLTE 2.3


INTERNAL

MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

46.00

99.999255%

3.90

5.6.10 Reliability of the DBS3900 Configured in Mode 10


MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

45.86

99.999751%

1.31

45.86

99.999253%

3.92

5.6.11 Reliability of the DBS3900 Configured in Mode 11


MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

121.03

99.999906%

0.49

121.03

99.999717%

1.48

5.6.12 Reliability of the DBS3900 Configured in Mode 12


MTBF (Years)

MTTR (Hours)

Availability

Interruption Duration (Minutes/Year)

120.61

99.999905%

0.50

120.61

99.999716%

1.50

2014-06-20

Huawei confidential. No spreading without permission.

Page 22 of 22

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