All Core I7 Models - Hardware Secrets

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5/16/2015

All Core i7 Models | Hardware Secrets

All Core i7 Models


By Rafael Coelho e Gabriel Torres on October 18, 2013

Introduction
The Core i7 is a CPU series manufactured by Intel aimed at high-range computers. In this tutorial, we
will present a series of quick reference tables for you to compare the main differences between all
models released to date.
By the way, the correct name of this line of processors is Core i7, not Intel i7.
Currently, there are four different generations of Core i7 processors available. In the tables below,
we describe the main differences between these generations and the model series within each
generation.
Model
8xx
9xx
6xx
7xx
8xx and 9xx
Market
De sk top
De sk top
Mobile
Mobile
Mobile
Generation
First
First
First
First
First
Microarchitecture
Ne hale m
Ne hale m
Ne hale m
Ne hale m
Ne hale m
Manufacturing Process
45 nm
45 nm or 32 nm
32 nm
45 nm
45 nm
Number of Cores
4
4 or 6
2
4
4
Hyper-Threading
Ye s
Ye s
Ye s
Ye s
Ye s
L1 cache (per core) 32 k iB+32 k iB 32 k iB+32 k iB
32 k iB+32k B
32 k iB+32 k iB 32 k iB+32 k iB
L2 cache (per core)
256 k iB
256 k iB
256 k iB
256 k iB
256 k iB
L3 cache (total)
8 MiB
8 MiB or 12 MiB
4 MiB
6 MiB
8 MiB
DMI bus
1 GB/s
No
1 GB/s
1 GB/s
1 GB/s
Memory (DDR3)
1066, 1333
1066
800, 1066
1066, 1333
1066, 1333
Memory Channels
2
3
2
2
2
DDR3L and DDR3L-RS
No
No
No
No
No
Graphics Engine
No
No
HD Graphics
No
No
DirectX
No
No
10
No
No
Graphics Processors
No
No
6
No
No
Graphics Base Clock
No
No
166, 266 or 500 MHz
No
No
Graphics Boost Clock
No
No
500, 566 or 766 MHz
No
No
Displays Supported
None
None
2
None
None
PCIe Controller
2.0
No
2.0
2.0
2.0
PCIe Configuration
1x 16, 2x 8
NA
1x 16
1x 16
1x 16
Turbo Boost
1.0
1.0
1.0
1.0
1.0
EM64T
Ye s
Ye s
Ye s
Ye s
Ye s
Virtualization
Ye s
Ye s
Ye s
Ye s
Ye s
SSE4.2
Ye s
Ye s
Ye s
Ye s
Ye s
A ES-NI
No
O n 32 nm m ode ls
Ye s
No
No
A VX
No
No
No
No
No
A VX2
No
No
No
No
No
Base Clock
133 MHz
133 MHz
133 MHz
133 MHz
133 MHz
Pinout
LGA1156
LGA1366
G1 or BGA1288
G1
G1

Except for UM and UE models, which only support DDR3-800 memory.


Model
Market
Generation
Microarchitecture
Manufacturing
Process
Number of Cores
Hyper-Threading
L1 cache (per core)
L2 cache (per core)

2xxx
De sk top
Se cond
Sandy Bridge

38xx
De sk top
Se cond
Sandy Bridge

39xx
De sk top
Se cond
Sandy Bridge

2xxx
Mobile
Se cond
Sandy Bridge

32 nm

32 nm

32 nm

32 nm

4
Ye s
32 k iB+32 k iB

4
Ye s
32 k iB+32 k iB

6
Ye s
32 k iB+32 k iB

2 or 4
Ye s
32 k iB+32k B

256 k iB

256 k iB

256 k iB

256 k iB

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L3 cache (total)

8 MiB

10 MiB

12 MiB or 15 MiB

4 MiB, 6 MiB or 8 MiB

DMI bus

2 GB/s
1066, 1333

1066, 1333, 1600

Memory Channels
DDR3L and DDR3LRS

2 GB/s
1066, 1333,
1600
4

2 GB/s

Memory (DDR3)

2 GB/2
1066, 1333,
1600
4

No

No

No

No

No

No

HD 3000

No
No
No

No
No
No

10.1
12
350, 500 or 650 MHz
950 MHz, 1 GHz, 1.1 GHz, 1.2 GHz or 1.3
GHz
2
2.0
1x 16, 2x 8, 1x 8, 2x 4
2.0
Ye s
Ye s
Ye s
Ye s
Ye s
No
100 MHz
G2, BGA1023 or BGA1224

DirectX
Graphics Processors
Graphics Base Clock

HD 2000 or HD
3000
10.1
6 or 12
850 MHz

Graphics Boost Clock

1.35 GHz

No

No

Displays Supported
PCIe Controller
PCIe Configuration
Turbo Boost
EM64T
Virtualization
SSE4.2
A ES-NI
A VX
A VX2
Base Clock
Pinout

2
2.0
1x 16, 2x 8
2.0
Ye s
Ye s
Ye s
Ye s
Ye s
No
100 MHz
LGA1155

No
3.0
40 lane s
2.0
Ye s
Ye s
Ye s
Ye s
Ye s
No
100 MHz
LGA2011

None
3.0
40 lane s
2.0
Ye s
Ye s
Ye s
Ye s
Ye s
No
100 MHz
LGA2011

Graphics Engine

There are three ports, two of them supporting 1x16, 2x8, 4x4, 8x2, and 16x1 speeds, and one of
them supporting 1x8, 4x2, and 8x1 speeds. The best configuration allowed is x16/x16/x8, however
other configurations are supported, such as x8/x8/x8/x8/x8.
Model
37xx
3xxx
Market
De sk top
Mobile
Generation
Third
Third
Microarchitecture Ivy Bridge
Ivy Bridge
Manufacturing
22 nm
22 nm
Process
Number of Cores
4
2 or 4
Hyper-Threading
Ye s
Ye s
L1 cache (per
32 k iB+32k B
32 k iB+32 k iB
core)
L2 cache (per
256 k iB
256 k iB
core)
L3 cache (total)
8 MiB
4 MiB, 6 MiB or 8 MiB
DMI bus
2 GB/s
2 GB/s
Memory (DDR3) 1333, 1600
1333, 1600
Memory Channels
2
2
DDR3L and
No
Ye s
DDR3L-RS

4xxx
De sk top
Fourth
Haswe ll
22 nm

4xxx
Mobile
Fourth
Haswe ll
22 m m

4
Ye s

2 or 4
Ye s

32 k iB+32 k iB

32 k iB+32 k iB

256 k iB

256 k iB

8 MiB
2 GB/s
1333, 1600
2

4 MiB, 6 MiB or 8 MiB


2 GB/s
1333, 1600
2

Ye s

Ye s
HD 4200, HD 4400, HD 4600, HD 5000, Iris
5100 or Iris Pro 5200
11.1

Graphics Engine

HD 4000

HD 4000

DirectX
Graphics
Processors
Graphics Base
Clock
Graphics Boost
Clock
Displays
Supported
PCIe Controller
PCIe
Configuration
Turbo Boost

11

11

HD 4600 or Iris
Pro 5200
11.1

12

12

20 or 40

10, 20 or 40

650 MHz

350 MHz or 650 MHz

200 or 350 MHz

200 or 400 MHz

1.15 GHz

1.1, 1.2, 1.25, 1.3 or


1.35 GHz

1.2, 1.25 or 1.3


GHz
3

850 MHz, 1 GHz, 1.1 GHz, 1.15 GHz, 1.2 GHz


or 1.3 GHz
3

3.0
1x 16, 2x 8,
1x 8, 2x 4
2.0

3.0*

2.0 or 3.0

1x 16, 2x 8, 1x 8, 2x 4

1x 4, 4x 1 or 1x 16, 2x 8, 1x 8, 2x 4

2.0

3.0
1x 16, 2x 8, 1x 8,
2x 4
2.0

EM64T
Virtualization

Ye s
Ye s

Ye s
Ye s

Ye s
Ye s

Ye s
Ye s

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SSE4.2

Ye s

Ye s

Ye s

Ye s

A ES-NI
A VX
A VX2
Base Clock

Ye s
Ye s
No
100 MHz

Pinout

LGA1155

Ye s
Ye s
No
100 MHz
G2, BGA1023 or
BGA1224

Ye s
Ye s
Ye s
100 MHz
LGA1150

Ye s
Ye s
Ye s
100 MHz
FC PGA946, FC BGA1168 or FC BGA1364

* Except for U models, which have a PCI Express 2.0 controller.


Lets now take a detailed look at all Core i7 models launched so far.

First-Generation Core i7 Desktop Models


In the table below, we listed all Core i7-8xx and Core i7-9xx CPU models. These are desktop models
based on the Nehalem microarchitecture. They are also called first-generation Core i7 processors.
The 8xx models are based on socket LGA1156 and support 1,066 MHz and 1,333 MHz DDR3 memories
under dual-channel architecture. These models have an integrated PCI Express 2.0 controller
supporting one x16 datapath or two x8 datapaths. On these CPUs, communication with the
motherboard chipset is achieved through a DMI bus (1 GB/s per direction, listed as 2.5 GT/s by
Intel).
The 9xx models are based on socket LGA1366 and support 1,066 MHz memories under triple-channel
architecture. These models dont have an integrated PCI Express controller and they talk to the
motherboard chipset using a QPI bus working at 2.4 GHz (4.8 GB/s) on the regular models or at 3.2
GHz (6.4 GB/s) on the Extreme models, which are listed in a separate table below.
The first-generation Core i7 desktop models are quad-core or six-core CPUs using the HyperThreading technology. This means that the operating system will recognize all these CPUs as having
eight or 12 cores. However, only half the cores are real; the other half is simulated.
sSpec Model Clock Turbo Boost Cores HT Video L3 Cache Tech. TDP (W) Max.
SLBYU 980 3.33 GHz 3.60 GHz
6
Ye s No
12 MiB 32 nm
130
SLBVF 970 3.20 GHz 3.46 GHz
6
Ye s No
12 MiB 32 nm
130
SLBEU 960 3.20 GHz 3.46 GHz
4
Ye s No
8 MiB 45 nm
130
SLBEN 950 3.06 GHz 3.32 GHz
4
Ye s No
8 MiB 45 nm
130
SLBC K 940 2.93 GHz 3.20 GHz
4
Ye s No
8 MiB 45 nm
130
SLBKP 930 2.80 GHz 3.06 GHz
4
Ye s No
8 MiB 45 nm
130
SLBEJ 920 2.66 GHz 2.93 GHz
4
Ye s No
8 MiB 45 nm
130
SLBC H 920 2.66 GHz 2.93 GHz
4
Ye s No
8 MiB 45 nm
130
SLBPS 880 3.06 GHz 3.74 GHz
4
Ye s No
8 MiB 45 nm
95
SLBS2 875K 2.93 GHz 3.60 GHz
4
Ye s No
8 MiB 45 nm
95
SLBQ 7 870S 2.66 GHz 3.60 GHz
4
Ye s No
8 MiB 45 nm
82
SLBJG 870 2.93 GHz 3.60 GHz
4
Ye s No
8 MiB 45 nm
95
SLBLG 860s 2.53 GHz 3.46 GHz
4
Ye s No
8 MiB 45 nm
82
SLBJJ 860 2.80 GHz 3.46 GHz
4
Ye s No
8 MiB 45 nm
95

Temp. (C)* Socket


68.8
LGA1366
67.9
LGA1366
67.9
LGA1366
67.9
LGA1366
67.9
LGA1366
67.9
LGA1366
67.9
LGA1366
67.9
LGA1366
72.7
LGA1156
72.7
LGA1156
NA
LGA1156
72.7
LGA1156
76.7
LGA1156
72.7
LGA1156

In the table below, you will find all first-generation Core i7 Extreme models for desktops. These
models have the QPI bus running at a higher clock rate (3.2 GHz, 6.4 GB/s) and come with their clock
multiplier and Turbo Boost options unlocked, providing additional overclocking options.
sSpec Model Internal Clock Turbo Boost Cores HT Video L3 Cache Tech. TDP (W) Max.
SLBVZ 990X
3.46 GHz
3.73 GHz
6
Ye s No
12 MiB 32 nm
130
SLBUZ 980X
3.33 GHz
3.60 GHz
6
Ye s No
12 MiB 32 nm
130
SLBEQ 975
3.33 GHz
3.60 GHz
4
Ye s No
8 MiB 45 nm
130
SLBC J 965
3.20 GHz
3.46 GHz
4
Ye s No
8 MiB 45 nm
130

Temp. (C)* Socket


67.9
LGA1366
67.9
LGA1366
67.9
LGA1366
67.9
LGA1366

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU.
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On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature
of the CPU. The two are not comparable.

First-Generation Core i7 Mobile Models


The first-generation Core i7 processors targeted to laptops are based on the Nehalem
microarchitecture. They can use two different pinouts, G1 or BGA1288, and have an integrated dualchannel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories on models 6xx
(except for models UM and UE, which only support DDR3-800 memories), and 1,066 MHz and
1,333 MHz DDR3 memories on models 7xx, 8xx, and 9xx. They have an integrated PCI Express 2.0
controller, supporting one x16 connection. Communication with the motherboard chipset is achieved
through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). The 6xx models
have an integrated DirectX 10 video controller running at 166 MHz with a 500 MHz boost clock on
UM and UE models, 266 MHz with a 566 MHz boost clock on LM models, or 500 MHz with a 766
MHz boost clock on M and E models. This video controller uses an engine called Intel HD
Graphics, and models with integrated video support two video monitors.
First-generation Core i7 mobile CPUs can have two (6xx models) or four (all other models) processing
cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in
each physical core. Therefore, they are recognized by the operating system as four- or eight-core
CPUs. However, only half the cores are real; the other half is simulated.
sSpec Model
SLBMP 840Q M
SLBLX 820Q M
SLBQ G 740Q M
SLBLY 720Q M
SLBST 680UM
SLBSS 660UM
SLBW V 660UE
SLBMM 640UM
SLBMK 640LM
SLBTN 640M
SLBZU 640M
SLBMN 620UM
SLBTQ 620M
SLBPE 620M
SLBPD 620M
SLBSU 620LM
SLBML 620LM
SLBXX

610E

Clock
1.86
MHz
1.73
GHz
1.73
GHz
1.60
GHz
1.46
GHz
1.33
GHz
1.33
GHz
1.20
GHz
2.13
GHz
2.80
GHz
2.80
GHz
1.06
GHz
2.66
GHz
2.66
GHz
2.66
GHz
2.00
GHz
2.00
GHz
2.53
GHz

Turbo
Boost

Cores HT

Video

Video
Clock

Video
Boost

3.20 GHz

Ye s

No

No

No

3.06 GHz

Ye s

No

No

No

2.93 GHz

Ye s

No

No

No

2.80 GHz

Ye s

No

No

No

2.53 GHz

Ye s

166 MHz

500 MHz

2.40 GHz

Ye s

166 MHz

500 MHz

2.40 GHz

Ye s

166 MHz

500 MHz

2.26 GHz

Ye s

166 MHz

500 MHz

2.93 GHz

Ye s

266 MHz

566 MHz

3.46 GHz

Ye s

500 MHz

766 MHz

3.46 GHz

Ye s

500 MHz

766 MHz

2.13 GHz

Ye s

166 MHz

500 MHz

3.33 GHz

Ye s

500 MHz

766 MHz

3.33 GHz

Ye s

500 MHz

766 MHz

3.33 GHz

Ye s

500 MHz

766 MHz

2.80 GHz

Ye s

266 MHz

566 MHz

2.80 GHz

Ye s

266 MHz

566 MHz

3.20 GHz

Ye s

500 MHz

766 MHz

HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics

L3
Tech.
Cache
45
8 MiB
nm
45
8 MiB
nm
45
6 MiB
nm
45
6 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm

TDP
(W)

Max. Temp.
(C)*

Pinout

45

100

G1

45

100

G1

45

100

G1

45

100

G1

18

105

BGA1288

18

105

BGA1288

18

105

BGA1288

18

105

BGA1288

25

105

BGA1288

35

105

G1

35

105

BGA1288

18

105

BGA1288

35

105

G1

35

105

BGA1288

35

105

G1

25

105

BGA1288

25

105

BGA1288

35

105

BGA1288

In the table below, you will find all first-generation mobile Core i7 Extreme models. They come with
their cock multipliers and Turbo Boost options unlocked, adding more overclocking options for the
enthusiast.
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sSpec Model Clock Turbo Boost Cores HT Video L3 Cache Tech. TDP (W) Max. Temp. (C)* Pinout
SLBSC 940XM 2.13 GHz 3.33 GHz
4
Ye s No
8 MiB 45 nm
55
100
G1
SLBLW 920XM 2.00 GHz 3.20 GHz
4
Ye s No
8 MiB 45 nm
55
100
G1

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the
CPU. On some other models, the manufacturer lists Tcase, which is the maximum external
temperature of the CPU. The two are not comparable.

Second-Generation Core i7 Desktop Models


In the table below, we listed all second-generation Core i7 desktop processors, which are based on
the Sandy Bridge microarchitecture.
The 3xxx models are based on socket LGA2011 and have an integrated memory controller supporting
four channels as well as 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They have an
integrated PCI Express 3.0 controller with 40 lanes, available through two x16 ports and one x8 port.
This way, the CPU can be directly connected to two PCI Express 3.0 x16 slots and one PCI Express
3.0 x8 slot. Each port can be broken down, so the CPU also has direct support for five PCI Express
3.0 x8 slots, for example. These models dont have integrated video. Communication with the
motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel).
The 2xxx models are based on socket LGA1155 and have a dual-channel memory controller supporting
1,066 MHz and 1,333 MHz DDR3 memories. They have an integrated PCI Express 2.0 controller
supporting one x16 connection or two x8 connections. Communication with the motherboard chipset
is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models have
an integrated DirectX 10.1 video controller running at 850 MHz with a 1.35 GHz boost clock, with
six (HD 2000) or 12 (HD 3000) processing cores. Models with integrated video support two displays.
The second-generation Core i7 desktop models are quad-core or six-core CPUs using the HyperThreading technology. This means that the operating system will recognize all these CPUs as having
eight or 12 cores. However, only half the cores are real; the other half is simulated.
sSpec Model
SR 0KF 3960X
SR 0GW 3960X
SR 0KY 3930K
SR 0H9 3930K
SR 0LD

3820

SR 0DG 2700K
SR 00E 2600S
SR 00C 2600K
SR 00B

2600

Clock
3.3
GHz
3.3
GHz
3.2
GHz
3.2
GHz
3.6
GHz
3.5
GHz
2.80
GHz
3.40
GHz
3.40
GHz

Turbo
Boost

Cores HT Video

Video
Clock

Video
Boost

3.9 GHz

Ye s

No

No

No

3.9 GHz

Ye s

No

No

No

3.8 GHz

Ye s

No

No

No

3.8 GHz

Ye s

No

No

No

3.8 GHz

Ye s

No

No

No

3.9 GHz

Ye s

850 MHz

1.35 GHz

3.80 GHz

850 MHz

1.35 GHz

3.80 GHz

850 MHz

1.35 GHz

3.80 GHz

850 MHz

1.35 GHz

HD
3000
HD
Ye s
2000
HD
Ye s
3000
HD
Ye s
2000

L3
Tech.
Cache
32
15 MiB
nm
32
15 MiB
nm
32
12 MiB
nm
32
12 MiB
nm
32
10 MiB
nm
32
8 MiB
nm
32
8 MiB
nm
32
8 MiB
nm
32
8 MiB
nm

TDP
(W)

Max. Temp.
(C)*

Socket

130

66.8

LGA2011

130

66.8

LGA2011

130

66.8

LGA2011

130

66.8

LGA2011

130

66.8

LGA2011

95

72.6

LGA1155

65

69.1

LGA1155

95

72.6

LGA1155

95

72.6

LGA1155

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU.
On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature
of the CPU. The two are not comparable.
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Second-Generation Core i7 Mobile Models


The second-generation Core i7 processors targeted to laptops are based on the Sandy Bridge
microarchitecture and can be based on three different pinouts: BGA1023, BGA1224 or socket G2.
These processors have an integrated dual-channel DDR3 memory controller, supporting 1,066 MHz,
1,333 MHz and, on 27xx, 28xx, and 29xx models, 1,600 MHz memories. They also have an integrated
PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or
two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus
(2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated
DirectX 10.1 video controller running at 350 MHz, 500 MHz or 650 MHz (see table below for specific
clock rates), with 12 processing cores (HD 3000 graphics engine).
Second-generation Core i7 mobile CPUs can have two or four processing cores, supporting HyperThreading (HT) technology, which simulates two logical processing cores in each physical core.
Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only
half the cores are real; the other half is simulated.
sSpec

Model

Clock

Turbo
Boost

Cores HT Video

SR 02X 2860Q M 2.5 GHz 3.6 GHz

Ye s

SR 02Q 2860Q M 2.5 GHz 3.6 GHz

Ye s

SR 00U 2820Q M 2.3 GHz 3.40 GHz

Ye s

SR 012 2820Q M 2.3 GHz 3.4 GHz

Ye s

SR 02W 2760Q M 2.4 GHz 3.5 GHz

Ye s

SR 02R 2760Q M 2.4 GHz 3.5 GHz

Ye s

SR 00W 2720Q M 2.2 GHz 3.3 GHz

Ye s

SR 014 2720Q M 2.2 GHz 3.3 GHz

Ye s

SR 02T 2710Q E 2.1 GHz 3.0 GHz

Ye s

SR 0D2 2677M 1.8 GHz 2.9 GHz

Ye s

SR 02S 2675Q M 2.2 GHz 3.1 GHz

Ye s

SR 02N 2670Q M 2.2 GHz 3.1 GHz

Ye s

SR 03S 2657M 2.6 GHz 2.7 GHz

Ye s

SR 04N 2649M 2.3 GHz 3.2 GHz

Ye s

SR 043 2640M 2.8 GHz 3.5 GHz

Ye s

SR 03R 2640M 2.8 GHz 3.5 GHz

Ye s

SR 0D3 2637M 1.7 GHz 2.8 GHz

Ye s

SR 030 2635Q M 2.0 GHz 2.9 GHz

Ye s

SR 02Y 2630Q M 2.0 GHz 2.9 GHz

Ye s

SR 04D 2629M 2.1 GHz 3.0 GHz

Ye s

SR 03F 2620M 2.7 GHz 3.4 GHz

Ye s

SR 041 2620M 2.7 GHz 3.4 GHz

Ye s

SR 03T 2617M 1.5 GHz 2.6 GHz

Ye s

HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000

http://www.hardwaresecrets.com/printpage/All-Core-i7-Models/708

Video
Clock

Video
Boost

650 MHz

1.3 GHz

650 MHz

1.3 GHz

650 MHz

1.3 GHz

650 MHz

1.3 GHz

650 MHz

1.3 GHz

650 MHz

1.3 GHz

650 MHz

1.3 GHz

650 MHz

1.3 GHz

650 MHz

1.2 GHz

350 MHz

1.2 GHz

650 MHz

1.2 GHz

650 MHz

1.1 GHz

350 MHz

1 GHz

500 MHz

1.1 GHz

650 MHz

1.3 GHz

650 MHz

1.3 GHz

350 MHz

1.2 GHz

650 MHz

1.2 GHz

650 MHz

1.1 GHz

500 MHz

1.1 GHz

650 MHz

1.3 GHz

650 MHz

1.3 GHz

350 MHz

950 MHz

L3
Tech.
Cache
32
8 MiB
nm
32
8 MiB
nm
32
8 MiB
nm
32
8 MiB
nm
32
6 MiB
nm
32
6 MiB
nm
32
6 MiB
nm
32
6 MiB
nm
32
6 MiB
nm
32
4 MiB
nm
32
6 MiB
nm
32
6 MiB
nm
32
6 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
6 MiB
nm
32
6 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm

TDP
(W)

Max. Temp.
(C)*

Pinout

45

100

G2

45

100

BGA1224

45

100

BGA1224

45

100

G2

45

100

G2

45

100

BGA1224

45

100

BGA1224

45

100

G2

45

100

G2

17

100

BGA1023

45

100

BGA1224

45

100

G2

17

100

BGA1023

25

100

BGA1023

35

100

BGA1023

35

100

G2

17

100

BGA1023

45

100

BGA1224

45

100

G2

25

100

BGA1023

35

100

G2

35

100

BGA1023

17

100

BGA1023

6/11

5/16/2015

All Core i7 Models | Hardware Secrets

In the table below, you will find the only second-generation mobile Core i7 Extreme processor model
released so far. It comes with its clock multiplier and Turbo Boost options unlocked, adding more
overclocking options for the enthusiast.
sSpec Model
SR 02F 2960XM
SR 02E 2920XM

Clock
2.70
GHz
2.50
GHz

Turbo
Boost

Cores HT Video

3.70 GHz

Ye s

3.50 GHz

Ye s

HD
3000
HD
3000

Video
Clock

Video
Boost

650 MHz

1.3 GHz

650 MHz

1.3 GHz

L3
Tech.
Cache
32
8 MiB
nm
32
8 MiB
nm

TDP
(W)

Max. Temp.
(C)*

Pinout

55

100

G2

55

100

G2

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the
CPU. On some other models, the manufacturer lists Tcase, which is the maximum external
temperature of the CPU. The two are not comparable.

Third-Generation Core i7 Desktop Models


In the table below, we listed all third-generation Core i7 desktop processors, which are based on the
Ivy Bridge microarchitecture. The models released so far are based on socket LGA1155 and have a
dual-channel memory controller supporting 1,333 MHz and 1,600 MHz DDR3 memories. They have an
integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8
connection or two x4 connections. Communication with the motherboard chipset is achieved through
a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models have an integrated
DirectX 11 video controller running at 650 MHz with a 1.15 GHz boost clock, with 12 (HD 4000)
processing cores. All models support three displays (previous generations support two).
The third-generation Core i7 desktop models are quad- or six-core CPUs using the Hyper-Threading
technology. This means that the operating system will recognize all these CPUs as having either eight
or twelve cores. However, only half the cores are real; the other half is simulated.
sSpec Model Clock
SR 1AS 4960X
SR 1AT 4930K
SR 1AU 4920K
SR 0PL 3770K
SR 0PK 3770
SR 0PN 3770S
SR 0PQ 3770T

3.6
GHz
3.4
GHz
3.7
GHz
3.5
GHz
3.4
GHz
3.1
GHz
2.5
GHz

Turbo
Boost

Cores HT Video

Video
Clock

Video
Boost

4.0 GHz

Ye s

No

3.9 GHz

Ye s

No

3.9 GHz

Ye s

No

3.9 GHz

Ye s

650 MHz

1.15 GHz

3.9 GHz

Ye s

650 MHz

1.15 GHz

3.9 GHz

Ye s

650 MHz

1.15 GHz

3.7 GHz

Ye s

650 MHz

1.15 GHz

HD
4000
HD
4000
HD
4000
HD
4000

L3
Tech.
Cache
22
15 MiB
nm
22
12 MiB
nm
22
10 MiB
nm
22
8 MiB
nm
22
8 MiB
nm
22
8 MiB
nm
22
8 MiB
nm

TDP
(W)

Max. Temp.
(C)*

Socket

130

66.8

LGA2011

130

66.8

LGA2011

130

88.8

LGA2011

77

67.4

LGA1155

77

67.4

LGA1155

65

69.1

LGA1155

45

69.8

LGA1155

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU.
On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature
of the CPU. The two are not comparable.

Third-Generation Core i7 Mobile Models


The third-generation Core i7 processors targeted to laptops are based on the Ivy Bridge
microarchitecture and can be based on three different pinouts: BGA1023, BGA1224 or socket G2.
These processors have an integrated dual-channel DDR3 memory controller, supporting 1,333
http://www.hardwaresecrets.com/printpage/All-Core-i7-Models/708

7/11

5/16/2015

All Core i7 Models | Hardware Secrets

MHz and 1,600 MHz memories. They also have an integrated PCI Express 3.0 controller (in the U
models, this controller is 2.0) supporting one x16 connection, two x8 connections, one x8 connection
or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI
bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an
integrated DirectX 11 video controller running at 650 MHz (350 MHz on U models), with a boost
clock that depends on the model (see table below for specific clock rates), all with 12 processing
cores (HD 4000 graphics engine).
Third-generation Core i7 mobile CPUs can have two or four processing cores, supporting HyperThreading (HT) technology, which simulates two logical processing cores in each physical core.
Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only
half the cores are real; the other half is simulated.
sSpec

Model

NA

3840Q M

NA

3840Q M

SR 0MK 3820Q M
SR 0MJ 3820Q M
SR 0UV 3740Q M
SR 0MM 3720Q M
SR 0ML 3720Q M
SR 12R

3689Y

SR 0XH 3687U
SR 0N5 3667U
NA

3635Q M

SR 0V0 3632Q M
NA

3632Q M

NA

3630Q M

SR 0MP 3615Q M
SR 0MQ 3612Q M
SR 0MR 3612Q M
SR 0MN 3610Q M
SR 0X8 3540M
SR 0X6 3540M
SR 0XG 3537U
SR 0MU 3520M
SR 0MT 3520M
SR 0N6 3517U

Clock
2.8
GHz
2.8
GHz
2.7
GHz
2.7
GHz
2.7
GHz
2.6
GHz
2.6
GHz
1.5
GHz
2.1
GHz
2.0
GHz
2.4
GHz
2.2
GHz
2.2
GHz
2.4
GHz
2.3
GHz
2.1
GHz
2.1
GHz
2.3
GHz
3.0
GHz
3.0
GHz
2.0
GHz
2.9
GHz
2.9
GHz
1.9
GHz

Turbo
Boost

Cores HT Video

3.8 GHz

Ye s

3.8 GHz

Ye s

3.7 GHz

Ye s

3.7 GHz

Ye s

3.7 GHz

Ye s

3.6 GHz

Ye s

3.6 GHz

Ye s

2.6 GHz

Ye s

3.3 GHz

Ye s

3.2 GHz

Ye s

3.4 GHz

Ye s

3.2 GHz

Ye s

3.2 GHz

Ye s

3.4 GHz

Ye s

3.3 GHz

Ye s

3.1 GHz

Ye s

3.1 GHz

Ye s

3.3 GHz

Ye s

3.7 GHz

Ye s

3.7 GHz

Ye s

3.1 GHz

Ye s

3.6 GHz

Ye s

3.6 GHz

Ye s

3.0 GHz

Ye s

HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000

Video
Clock

Video
Boost

650 MHz

1.3 GHz

650 MHz

1.3 GHz

650 MHz

1.25 GHz

650 MHz

1.25 GHz

650 MHz

1.3 GHz

650 MHz

1.25 GHz

650 MHz

1.25 GHz

350 MHz

850 MHz

350 MHz

1.2 GHz

350 MHz

1.15 GHz

650 MHz

1.2 GHz

650 MHz

1.15 GHz

650 MHz

1.15 GHz

650 MHz

1.15 GHz

650 MHz

1.2 GHz

650 MHz

1.1 GHz

650 MHz

1.1 GHz

650 MHz

1.1 GHz

650 MHz

1.3 GHz

650 MHz

1.3 GHz

350 MHz

1.2 GHz

650 MHz

1.25 GHz

650 MHz

1.25 GHz

350 MHz

1.15 GHz

L3
Tech.
Cache
22
8 MiB
nm
22
8 MiB
nm
22
8 MiB
nm
22
8 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
4 MiB
nm
22
4 MiB
nm
22
4 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
4 MiB
nm
22
4 MiB
nm
22
4 MiB
nm
22
4 MiB
nm
22
4 MiB
nm
22
4 MiB
nm

TDP
(W)

Max. Temp.
(C)*

Pinout

45

105

G2

45

105

BGA1224

45

105

BGA1224

45

105

G2

45

105

G2

45

105

BGA1224

45

105

G2

13

105

BGA1023

17

105

BGA1023

17

105

BGA1023

45

105

BGA1224

35

105

G2

35

105

BGA1224

45

105

G2

45

105

BGA1224

45

105

G2

45

105

BGA1224

45

105

G2

35

105

BGA1023

35

105

G2

17

105

BGA1023

35

105

BGA1023

35

105

G2

17

105

BGA1023

In the table below, you will find all third-generation mobile Core i7 Extreme models. They come with
their clock multipliers and Turbo Boost options unlocked, adding more overclocking options for the
enthusiast.
http://www.hardwaresecrets.com/printpage/All-Core-i7-Models/708

8/11

5/16/2015

sSpec

All Core i7 Models | Hardware Secrets

Model

SR 0US 3940XM
SR 0T2 3920XM
SR 0MH 3920XM

Clock
3.0
GHz
2.9
GHz
2.9
GHz

Turbo
Boost

Video
Clock

Video
Boost

650 MHz

1.35 GHz

650 MHz

1.3 GHz

650 MHz

1.3 GHz

Cores HT Video

3.9 GHz

Ye s

3.8 GHz

Ye s

3.8 GHz

Ye s

HD
4000
HD
4000
HD
4000

L3
Tech.
Cache
22
8 MiB
nm
22
8 MiB
nm
22
8 MiB
nm

TDP
(W)

Max. Temp.
(C)*

Pinout

55

105

G2

55

105

G2

55

105

G2

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the
CPU. On some other models, the manufacturer lists Tcase, which is the maximum external
temperature of the CPU. The two are not comparable.

Fourth-Generation Core i7 Desktop Models


In the table below, we listed all fourth-generation Core i7 desktop processors, which are based on
the Haswell microarchitecture. The models released so far are based on socket LGA1150 and,
therefore, incompatible with motherboards designed for previous models.
These processors have a dual-channel memory controller supporting 1,333 MHz and 1,600 MHz DDR3
memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8
connections, one x8 connection or two x4 connections. Communication with the motherboard chipset
is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel).
A new feature brought by these models is the support for AVX2 instructions.
All models have an integrated DirectX 11.1 video controller and two graphics engines are available at
the moment: HD 4600 (codenamed GT2, 20 processing units), and Iris Pro 5200 (codenamed
GT3e, 40 processing units, and video memory integrated into the CPU).
The fourth-generation Core i7 desktop models are quad-core CPUs using the Hyper-Threading
technology. This means that the operating system will recognize all these CPUs as having eight
cores. However, only half the cores are real; the other half is simulated.
sSpec Model Clock
SR 1BW 4771
SR 147 4770K
SR 149

4770

NA

4770R

SR 14H 4770S
SR 14N 4770T
SR 14Q

4765T

3.5
GHz
3.4
GHz
3.4
GHz
3.2
GHz
3.1
GHz
2.5
GHz
2.0
GHz

Turbo
Boost

Cores HT

Video

Video
Clock

3.9 GHz

Ye s

HD 4600

350 MHz

3.9 GHz

Ye s

HD 4600

350 MHz

3.9 GHz

Ye s

HD 4600

350 MHz

3.9 GHz

Ye s

Iris Pro
5200

200 MHz

3.9 GHz

Ye s

HD 4600

350 MHz

3.7 GHz

Ye s

HD 4600

350 MHz

3.0 GHz

Ye s HD 4600

350 MHz

Video
Boost

L3
Tech.
Cache
22
1.2 GHz 8 MiB
nm
22
1.25 GHz 8 MiB
nm
22
1.2 GHz 8 MiB
nm
22
1.3 GHz 6 MiB
nm
22
1.2 GHz 8 MiB
nm
22
1.2 GHz 8 MiB
nm
22
1.2 GHz 8 MiB
nm

TDP
(W)

Max. Temp.
(C)*

Socket

84

72

LGA1150

84

72.72

LGA1150

84

72.72

LGA1150

65

66.45

LGA1150

65

71.35

LGA1150

45

71.45

LGA1150

35

66.35

LGA1150

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU.
On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature
of the CPU. The two are not comparable.

Fourth-Generation Core i7 Mobile Models


http://www.hardwaresecrets.com/printpage/All-Core-i7-Models/708

9/11

5/16/2015

All Core i7 Models | Hardware Secrets

The fourth-generation Core i7 processors targeted to laptops are based on the Haswell
microarchitecture.
A new feature brought by these models is the support for AVX2 instructions.
The U and Y models carry an integrated south bridge chip with a four-port USB 3.0 controller and
a four-port SATA-600 controller. On these models, the PCI Express controller is 2.0 and supports only
one x4 connection or four x1 connections. On the other models, the PCI Express controller is 3.0 and
supports one x16 connection, two x8 connections, one x8 connection or two x4
connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s
each direction, which is listed as 5 GT/s by Intel).
Several graphics engines are available, all DirectX 11.1: HD 4200 (codenamed GT1, 10 processing
units), HD 4400 (codenamed GT2, 20 processing units), HD 4600 (codenamed GT2, 20 processing
units), HD 5000 (codenamed GT3, 40 processing units), Iris 5100 (codenamed GT3, 40 processing
units), and Iris Pro 5200 (codenamed GT3e, 40 processing units, and video memory integrated into
the CPU).
The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600
MHz DDR3L and LPDDR3 (on models U and Y) memories.
Fourth-generation Core i7 mobile CPUs can have two or four processing cores, supporting HyperThreading (HT) technology, which simulates two logical processing cores in each physical core.
Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only
half the cores are real; the other half is simulated.
sSpec

Model

NA

4960HQ

SR 18G 4950HQ
SR 15K 4900MQ
SR 18H 4850HQ
SR 15L 4800MQ
SR 18J 4750HQ
SR 15F 4702HQ
SR 15J 4702MQ
SR 15E 4700HQ
SR 15H 4700MQ
SR 17L 4700EQ
SR 16H 4650U
NA

4610Y

NA

4600M

SR 1EA 4600U
SR 188 4558U
SR 16J 4550U
SR 16Z 4500U

Clock
2.6
GH
2.4
GHz
2.8
GHz
2.3
GHz
2.7
GHz
2.0
GHz
2.2
GHz
2.2
GHz
2.4
GHz
2.4
GHz
2.4
GHz
1.7
GHz
1.7
GHz
2.9
GHz
2.1
GHz
2.8
GHz
1.5
GHz
1.8
GHz

Turbo
Boost

Cores HT

Video
Iris Pro
5200
Iris Pro
5200

Video
Clock

Video
Boost

200 MHz

1.3 GHz

200 MHz

1.3 GHz

400 MHz

1.3 GHz

200 MHz

1.2 GHz

400 MHz

1.3 GHz

200 MHz

1.2 GHz

3.8 GHz

Ye s

3.6 GHz

Ye s

3.8 GHz

Ye s HD 4600

3.5 GHz

Ye s

3.7 GHz

Ye s HD 4600

3.2 GHz

Ye s

3.2 GHz

Ye s HD 4600

400 MHz 1.15 GHz

3.2 GHz

Ye s HD 4600

400 MHz 1.15 GHz

3.4 GHz

Ye s HD 4600

400 MHz

3.4 GHz

Ye s HD 4600

400 MHz 1.15 GHz

3.4 GHz

Ye s HD 4600

400 MHz

1 GHz

3.3 GHz

Ye s HD 5000

200 MHz

1.1 GHz

2.9 GHz

Ye s HD 4200

200 MHz 850 MHz

3.6 GHz

Ye s HD 4600

400 MHz

1.3 GHz

3.3 GHz

Ye s HD 4400

200 MHz

1.1 GHz

3.3 GHz

Ye s Iris 5100 200 MHz

1.2 GHz

3.0 GHz

Ye s HD 5000

200 MHz

1.1 GHz

3.0 GHz

Ye s HD 4400

200 MHz

1.1 GHz

Iris Pro
5200

Iris Pro
5200

http://www.hardwaresecrets.com/printpage/All-Core-i7-Models/708

1.2 GHz

L3
TDP
Tech.
Cache
(W)
22
6 MiB
47
nm
22
6 MiB
47
nm
22
8 MiB
47
nm
22
6 MiB
47
nm
22
6 MiB
47
nm
22
6 MiB
47
nm
22
6 MiB
37
nm
22
6 MiB
37
nm
22
6 MiB
47
nm
22
6 MiB
47
nm
22
6 MiB
47
nm
22
4 MiB
15
nm
22
4 MiB
11.5
nm
22
4 MiB
37
nm
22
4 MiB
15
nm
22
4 MiB
28
nm
22
4 MiB
15
nm
22
4 MiB
15
nm

Max. Temp.
(C)*

Package

100

NA

100

FC BGA1364

100

FC PGA946

100

FC BGA1364

100

FC PGA946

100

FC BGA1364

100

FC BGA1364

100

FC PGA946

100

FC BGA1364

100

FC PGA946

100

FC BGA1364

100

FC BGA1168

100

NA

100

NA

100

FC BGA1168

100

FC BGA1168

100

FC BGA1168

100

FC BGA1168

10/11

5/16/2015

All Core i7 Models | Hardware Secrets

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the
CPU. On some other models, the manufacturer lists Tcase, which is the maximum external
temperature of the CPU. The two are not comparable.
Originally at http://www.hardwaresecrets.com/article/All-Core-i7-Models/708

2004-15 C lube do Hardware, all Rights Reserved.


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