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All Core I7 Models - Hardware Secrets
All Core I7 Models - Hardware Secrets
All Core I7 Models - Hardware Secrets
Introduction
The Core i7 is a CPU series manufactured by Intel aimed at high-range computers. In this tutorial, we
will present a series of quick reference tables for you to compare the main differences between all
models released to date.
By the way, the correct name of this line of processors is Core i7, not Intel i7.
Currently, there are four different generations of Core i7 processors available. In the tables below,
we describe the main differences between these generations and the model series within each
generation.
Model
8xx
9xx
6xx
7xx
8xx and 9xx
Market
De sk top
De sk top
Mobile
Mobile
Mobile
Generation
First
First
First
First
First
Microarchitecture
Ne hale m
Ne hale m
Ne hale m
Ne hale m
Ne hale m
Manufacturing Process
45 nm
45 nm or 32 nm
32 nm
45 nm
45 nm
Number of Cores
4
4 or 6
2
4
4
Hyper-Threading
Ye s
Ye s
Ye s
Ye s
Ye s
L1 cache (per core) 32 k iB+32 k iB 32 k iB+32 k iB
32 k iB+32k B
32 k iB+32 k iB 32 k iB+32 k iB
L2 cache (per core)
256 k iB
256 k iB
256 k iB
256 k iB
256 k iB
L3 cache (total)
8 MiB
8 MiB or 12 MiB
4 MiB
6 MiB
8 MiB
DMI bus
1 GB/s
No
1 GB/s
1 GB/s
1 GB/s
Memory (DDR3)
1066, 1333
1066
800, 1066
1066, 1333
1066, 1333
Memory Channels
2
3
2
2
2
DDR3L and DDR3L-RS
No
No
No
No
No
Graphics Engine
No
No
HD Graphics
No
No
DirectX
No
No
10
No
No
Graphics Processors
No
No
6
No
No
Graphics Base Clock
No
No
166, 266 or 500 MHz
No
No
Graphics Boost Clock
No
No
500, 566 or 766 MHz
No
No
Displays Supported
None
None
2
None
None
PCIe Controller
2.0
No
2.0
2.0
2.0
PCIe Configuration
1x 16, 2x 8
NA
1x 16
1x 16
1x 16
Turbo Boost
1.0
1.0
1.0
1.0
1.0
EM64T
Ye s
Ye s
Ye s
Ye s
Ye s
Virtualization
Ye s
Ye s
Ye s
Ye s
Ye s
SSE4.2
Ye s
Ye s
Ye s
Ye s
Ye s
A ES-NI
No
O n 32 nm m ode ls
Ye s
No
No
A VX
No
No
No
No
No
A VX2
No
No
No
No
No
Base Clock
133 MHz
133 MHz
133 MHz
133 MHz
133 MHz
Pinout
LGA1156
LGA1366
G1 or BGA1288
G1
G1
2xxx
De sk top
Se cond
Sandy Bridge
38xx
De sk top
Se cond
Sandy Bridge
39xx
De sk top
Se cond
Sandy Bridge
2xxx
Mobile
Se cond
Sandy Bridge
32 nm
32 nm
32 nm
32 nm
4
Ye s
32 k iB+32 k iB
4
Ye s
32 k iB+32 k iB
6
Ye s
32 k iB+32 k iB
2 or 4
Ye s
32 k iB+32k B
256 k iB
256 k iB
256 k iB
256 k iB
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L3 cache (total)
8 MiB
10 MiB
12 MiB or 15 MiB
DMI bus
2 GB/s
1066, 1333
Memory Channels
DDR3L and DDR3LRS
2 GB/s
1066, 1333,
1600
4
2 GB/s
Memory (DDR3)
2 GB/2
1066, 1333,
1600
4
No
No
No
No
No
No
HD 3000
No
No
No
No
No
No
10.1
12
350, 500 or 650 MHz
950 MHz, 1 GHz, 1.1 GHz, 1.2 GHz or 1.3
GHz
2
2.0
1x 16, 2x 8, 1x 8, 2x 4
2.0
Ye s
Ye s
Ye s
Ye s
Ye s
No
100 MHz
G2, BGA1023 or BGA1224
DirectX
Graphics Processors
Graphics Base Clock
HD 2000 or HD
3000
10.1
6 or 12
850 MHz
1.35 GHz
No
No
Displays Supported
PCIe Controller
PCIe Configuration
Turbo Boost
EM64T
Virtualization
SSE4.2
A ES-NI
A VX
A VX2
Base Clock
Pinout
2
2.0
1x 16, 2x 8
2.0
Ye s
Ye s
Ye s
Ye s
Ye s
No
100 MHz
LGA1155
No
3.0
40 lane s
2.0
Ye s
Ye s
Ye s
Ye s
Ye s
No
100 MHz
LGA2011
None
3.0
40 lane s
2.0
Ye s
Ye s
Ye s
Ye s
Ye s
No
100 MHz
LGA2011
Graphics Engine
There are three ports, two of them supporting 1x16, 2x8, 4x4, 8x2, and 16x1 speeds, and one of
them supporting 1x8, 4x2, and 8x1 speeds. The best configuration allowed is x16/x16/x8, however
other configurations are supported, such as x8/x8/x8/x8/x8.
Model
37xx
3xxx
Market
De sk top
Mobile
Generation
Third
Third
Microarchitecture Ivy Bridge
Ivy Bridge
Manufacturing
22 nm
22 nm
Process
Number of Cores
4
2 or 4
Hyper-Threading
Ye s
Ye s
L1 cache (per
32 k iB+32k B
32 k iB+32 k iB
core)
L2 cache (per
256 k iB
256 k iB
core)
L3 cache (total)
8 MiB
4 MiB, 6 MiB or 8 MiB
DMI bus
2 GB/s
2 GB/s
Memory (DDR3) 1333, 1600
1333, 1600
Memory Channels
2
2
DDR3L and
No
Ye s
DDR3L-RS
4xxx
De sk top
Fourth
Haswe ll
22 nm
4xxx
Mobile
Fourth
Haswe ll
22 m m
4
Ye s
2 or 4
Ye s
32 k iB+32 k iB
32 k iB+32 k iB
256 k iB
256 k iB
8 MiB
2 GB/s
1333, 1600
2
Ye s
Ye s
HD 4200, HD 4400, HD 4600, HD 5000, Iris
5100 or Iris Pro 5200
11.1
Graphics Engine
HD 4000
HD 4000
DirectX
Graphics
Processors
Graphics Base
Clock
Graphics Boost
Clock
Displays
Supported
PCIe Controller
PCIe
Configuration
Turbo Boost
11
11
HD 4600 or Iris
Pro 5200
11.1
12
12
20 or 40
10, 20 or 40
650 MHz
1.15 GHz
3.0
1x 16, 2x 8,
1x 8, 2x 4
2.0
3.0*
2.0 or 3.0
1x 16, 2x 8, 1x 8, 2x 4
1x 4, 4x 1 or 1x 16, 2x 8, 1x 8, 2x 4
2.0
3.0
1x 16, 2x 8, 1x 8,
2x 4
2.0
EM64T
Virtualization
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
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2.0
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SSE4.2
Ye s
Ye s
Ye s
Ye s
A ES-NI
A VX
A VX2
Base Clock
Ye s
Ye s
No
100 MHz
Pinout
LGA1155
Ye s
Ye s
No
100 MHz
G2, BGA1023 or
BGA1224
Ye s
Ye s
Ye s
100 MHz
LGA1150
Ye s
Ye s
Ye s
100 MHz
FC PGA946, FC BGA1168 or FC BGA1364
In the table below, you will find all first-generation Core i7 Extreme models for desktops. These
models have the QPI bus running at a higher clock rate (3.2 GHz, 6.4 GB/s) and come with their clock
multiplier and Turbo Boost options unlocked, providing additional overclocking options.
sSpec Model Internal Clock Turbo Boost Cores HT Video L3 Cache Tech. TDP (W) Max.
SLBVZ 990X
3.46 GHz
3.73 GHz
6
Ye s No
12 MiB 32 nm
130
SLBUZ 980X
3.33 GHz
3.60 GHz
6
Ye s No
12 MiB 32 nm
130
SLBEQ 975
3.33 GHz
3.60 GHz
4
Ye s No
8 MiB 45 nm
130
SLBC J 965
3.20 GHz
3.46 GHz
4
Ye s No
8 MiB 45 nm
130
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU.
http://www.hardwaresecrets.com/printpage/All-Core-i7-Models/708
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5/16/2015
On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature
of the CPU. The two are not comparable.
610E
Clock
1.86
MHz
1.73
GHz
1.73
GHz
1.60
GHz
1.46
GHz
1.33
GHz
1.33
GHz
1.20
GHz
2.13
GHz
2.80
GHz
2.80
GHz
1.06
GHz
2.66
GHz
2.66
GHz
2.66
GHz
2.00
GHz
2.00
GHz
2.53
GHz
Turbo
Boost
Cores HT
Video
Video
Clock
Video
Boost
3.20 GHz
Ye s
No
No
No
3.06 GHz
Ye s
No
No
No
2.93 GHz
Ye s
No
No
No
2.80 GHz
Ye s
No
No
No
2.53 GHz
Ye s
166 MHz
500 MHz
2.40 GHz
Ye s
166 MHz
500 MHz
2.40 GHz
Ye s
166 MHz
500 MHz
2.26 GHz
Ye s
166 MHz
500 MHz
2.93 GHz
Ye s
266 MHz
566 MHz
3.46 GHz
Ye s
500 MHz
766 MHz
3.46 GHz
Ye s
500 MHz
766 MHz
2.13 GHz
Ye s
166 MHz
500 MHz
3.33 GHz
Ye s
500 MHz
766 MHz
3.33 GHz
Ye s
500 MHz
766 MHz
3.33 GHz
Ye s
500 MHz
766 MHz
2.80 GHz
Ye s
266 MHz
566 MHz
2.80 GHz
Ye s
266 MHz
566 MHz
3.20 GHz
Ye s
500 MHz
766 MHz
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
HD
Graphics
L3
Tech.
Cache
45
8 MiB
nm
45
8 MiB
nm
45
6 MiB
nm
45
6 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
TDP
(W)
Max. Temp.
(C)*
Pinout
45
100
G1
45
100
G1
45
100
G1
45
100
G1
18
105
BGA1288
18
105
BGA1288
18
105
BGA1288
18
105
BGA1288
25
105
BGA1288
35
105
G1
35
105
BGA1288
18
105
BGA1288
35
105
G1
35
105
BGA1288
35
105
G1
25
105
BGA1288
25
105
BGA1288
35
105
BGA1288
In the table below, you will find all first-generation mobile Core i7 Extreme models. They come with
their cock multipliers and Turbo Boost options unlocked, adding more overclocking options for the
enthusiast.
http://www.hardwaresecrets.com/printpage/All-Core-i7-Models/708
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5/16/2015
sSpec Model Clock Turbo Boost Cores HT Video L3 Cache Tech. TDP (W) Max. Temp. (C)* Pinout
SLBSC 940XM 2.13 GHz 3.33 GHz
4
Ye s No
8 MiB 45 nm
55
100
G1
SLBLW 920XM 2.00 GHz 3.20 GHz
4
Ye s No
8 MiB 45 nm
55
100
G1
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the
CPU. On some other models, the manufacturer lists Tcase, which is the maximum external
temperature of the CPU. The two are not comparable.
3820
SR 0DG 2700K
SR 00E 2600S
SR 00C 2600K
SR 00B
2600
Clock
3.3
GHz
3.3
GHz
3.2
GHz
3.2
GHz
3.6
GHz
3.5
GHz
2.80
GHz
3.40
GHz
3.40
GHz
Turbo
Boost
Cores HT Video
Video
Clock
Video
Boost
3.9 GHz
Ye s
No
No
No
3.9 GHz
Ye s
No
No
No
3.8 GHz
Ye s
No
No
No
3.8 GHz
Ye s
No
No
No
3.8 GHz
Ye s
No
No
No
3.9 GHz
Ye s
850 MHz
1.35 GHz
3.80 GHz
850 MHz
1.35 GHz
3.80 GHz
850 MHz
1.35 GHz
3.80 GHz
850 MHz
1.35 GHz
HD
3000
HD
Ye s
2000
HD
Ye s
3000
HD
Ye s
2000
L3
Tech.
Cache
32
15 MiB
nm
32
15 MiB
nm
32
12 MiB
nm
32
12 MiB
nm
32
10 MiB
nm
32
8 MiB
nm
32
8 MiB
nm
32
8 MiB
nm
32
8 MiB
nm
TDP
(W)
Max. Temp.
(C)*
Socket
130
66.8
LGA2011
130
66.8
LGA2011
130
66.8
LGA2011
130
66.8
LGA2011
130
66.8
LGA2011
95
72.6
LGA1155
65
69.1
LGA1155
95
72.6
LGA1155
95
72.6
LGA1155
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU.
On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature
of the CPU. The two are not comparable.
http://www.hardwaresecrets.com/printpage/All-Core-i7-Models/708
5/11
5/16/2015
Model
Clock
Turbo
Boost
Cores HT Video
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
Ye s
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
HD
3000
http://www.hardwaresecrets.com/printpage/All-Core-i7-Models/708
Video
Clock
Video
Boost
650 MHz
1.3 GHz
650 MHz
1.3 GHz
650 MHz
1.3 GHz
650 MHz
1.3 GHz
650 MHz
1.3 GHz
650 MHz
1.3 GHz
650 MHz
1.3 GHz
650 MHz
1.3 GHz
650 MHz
1.2 GHz
350 MHz
1.2 GHz
650 MHz
1.2 GHz
650 MHz
1.1 GHz
350 MHz
1 GHz
500 MHz
1.1 GHz
650 MHz
1.3 GHz
650 MHz
1.3 GHz
350 MHz
1.2 GHz
650 MHz
1.2 GHz
650 MHz
1.1 GHz
500 MHz
1.1 GHz
650 MHz
1.3 GHz
650 MHz
1.3 GHz
350 MHz
950 MHz
L3
Tech.
Cache
32
8 MiB
nm
32
8 MiB
nm
32
8 MiB
nm
32
8 MiB
nm
32
6 MiB
nm
32
6 MiB
nm
32
6 MiB
nm
32
6 MiB
nm
32
6 MiB
nm
32
4 MiB
nm
32
6 MiB
nm
32
6 MiB
nm
32
6 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
6 MiB
nm
32
6 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
32
4 MiB
nm
TDP
(W)
Max. Temp.
(C)*
Pinout
45
100
G2
45
100
BGA1224
45
100
BGA1224
45
100
G2
45
100
G2
45
100
BGA1224
45
100
BGA1224
45
100
G2
45
100
G2
17
100
BGA1023
45
100
BGA1224
45
100
G2
17
100
BGA1023
25
100
BGA1023
35
100
BGA1023
35
100
G2
17
100
BGA1023
45
100
BGA1224
45
100
G2
25
100
BGA1023
35
100
G2
35
100
BGA1023
17
100
BGA1023
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In the table below, you will find the only second-generation mobile Core i7 Extreme processor model
released so far. It comes with its clock multiplier and Turbo Boost options unlocked, adding more
overclocking options for the enthusiast.
sSpec Model
SR 02F 2960XM
SR 02E 2920XM
Clock
2.70
GHz
2.50
GHz
Turbo
Boost
Cores HT Video
3.70 GHz
Ye s
3.50 GHz
Ye s
HD
3000
HD
3000
Video
Clock
Video
Boost
650 MHz
1.3 GHz
650 MHz
1.3 GHz
L3
Tech.
Cache
32
8 MiB
nm
32
8 MiB
nm
TDP
(W)
Max. Temp.
(C)*
Pinout
55
100
G2
55
100
G2
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the
CPU. On some other models, the manufacturer lists Tcase, which is the maximum external
temperature of the CPU. The two are not comparable.
3.6
GHz
3.4
GHz
3.7
GHz
3.5
GHz
3.4
GHz
3.1
GHz
2.5
GHz
Turbo
Boost
Cores HT Video
Video
Clock
Video
Boost
4.0 GHz
Ye s
No
3.9 GHz
Ye s
No
3.9 GHz
Ye s
No
3.9 GHz
Ye s
650 MHz
1.15 GHz
3.9 GHz
Ye s
650 MHz
1.15 GHz
3.9 GHz
Ye s
650 MHz
1.15 GHz
3.7 GHz
Ye s
650 MHz
1.15 GHz
HD
4000
HD
4000
HD
4000
HD
4000
L3
Tech.
Cache
22
15 MiB
nm
22
12 MiB
nm
22
10 MiB
nm
22
8 MiB
nm
22
8 MiB
nm
22
8 MiB
nm
22
8 MiB
nm
TDP
(W)
Max. Temp.
(C)*
Socket
130
66.8
LGA2011
130
66.8
LGA2011
130
88.8
LGA2011
77
67.4
LGA1155
77
67.4
LGA1155
65
69.1
LGA1155
45
69.8
LGA1155
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU.
On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature
of the CPU. The two are not comparable.
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MHz and 1,600 MHz memories. They also have an integrated PCI Express 3.0 controller (in the U
models, this controller is 2.0) supporting one x16 connection, two x8 connections, one x8 connection
or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI
bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an
integrated DirectX 11 video controller running at 650 MHz (350 MHz on U models), with a boost
clock that depends on the model (see table below for specific clock rates), all with 12 processing
cores (HD 4000 graphics engine).
Third-generation Core i7 mobile CPUs can have two or four processing cores, supporting HyperThreading (HT) technology, which simulates two logical processing cores in each physical core.
Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only
half the cores are real; the other half is simulated.
sSpec
Model
NA
3840Q M
NA
3840Q M
SR 0MK 3820Q M
SR 0MJ 3820Q M
SR 0UV 3740Q M
SR 0MM 3720Q M
SR 0ML 3720Q M
SR 12R
3689Y
SR 0XH 3687U
SR 0N5 3667U
NA
3635Q M
SR 0V0 3632Q M
NA
3632Q M
NA
3630Q M
SR 0MP 3615Q M
SR 0MQ 3612Q M
SR 0MR 3612Q M
SR 0MN 3610Q M
SR 0X8 3540M
SR 0X6 3540M
SR 0XG 3537U
SR 0MU 3520M
SR 0MT 3520M
SR 0N6 3517U
Clock
2.8
GHz
2.8
GHz
2.7
GHz
2.7
GHz
2.7
GHz
2.6
GHz
2.6
GHz
1.5
GHz
2.1
GHz
2.0
GHz
2.4
GHz
2.2
GHz
2.2
GHz
2.4
GHz
2.3
GHz
2.1
GHz
2.1
GHz
2.3
GHz
3.0
GHz
3.0
GHz
2.0
GHz
2.9
GHz
2.9
GHz
1.9
GHz
Turbo
Boost
Cores HT Video
3.8 GHz
Ye s
3.8 GHz
Ye s
3.7 GHz
Ye s
3.7 GHz
Ye s
3.7 GHz
Ye s
3.6 GHz
Ye s
3.6 GHz
Ye s
2.6 GHz
Ye s
3.3 GHz
Ye s
3.2 GHz
Ye s
3.4 GHz
Ye s
3.2 GHz
Ye s
3.2 GHz
Ye s
3.4 GHz
Ye s
3.3 GHz
Ye s
3.1 GHz
Ye s
3.1 GHz
Ye s
3.3 GHz
Ye s
3.7 GHz
Ye s
3.7 GHz
Ye s
3.1 GHz
Ye s
3.6 GHz
Ye s
3.6 GHz
Ye s
3.0 GHz
Ye s
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
HD
4000
Video
Clock
Video
Boost
650 MHz
1.3 GHz
650 MHz
1.3 GHz
650 MHz
1.25 GHz
650 MHz
1.25 GHz
650 MHz
1.3 GHz
650 MHz
1.25 GHz
650 MHz
1.25 GHz
350 MHz
850 MHz
350 MHz
1.2 GHz
350 MHz
1.15 GHz
650 MHz
1.2 GHz
650 MHz
1.15 GHz
650 MHz
1.15 GHz
650 MHz
1.15 GHz
650 MHz
1.2 GHz
650 MHz
1.1 GHz
650 MHz
1.1 GHz
650 MHz
1.1 GHz
650 MHz
1.3 GHz
650 MHz
1.3 GHz
350 MHz
1.2 GHz
650 MHz
1.25 GHz
650 MHz
1.25 GHz
350 MHz
1.15 GHz
L3
Tech.
Cache
22
8 MiB
nm
22
8 MiB
nm
22
8 MiB
nm
22
8 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
4 MiB
nm
22
4 MiB
nm
22
4 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
6 MiB
nm
22
4 MiB
nm
22
4 MiB
nm
22
4 MiB
nm
22
4 MiB
nm
22
4 MiB
nm
22
4 MiB
nm
TDP
(W)
Max. Temp.
(C)*
Pinout
45
105
G2
45
105
BGA1224
45
105
BGA1224
45
105
G2
45
105
G2
45
105
BGA1224
45
105
G2
13
105
BGA1023
17
105
BGA1023
17
105
BGA1023
45
105
BGA1224
35
105
G2
35
105
BGA1224
45
105
G2
45
105
BGA1224
45
105
G2
45
105
BGA1224
45
105
G2
35
105
BGA1023
35
105
G2
17
105
BGA1023
35
105
BGA1023
35
105
G2
17
105
BGA1023
In the table below, you will find all third-generation mobile Core i7 Extreme models. They come with
their clock multipliers and Turbo Boost options unlocked, adding more overclocking options for the
enthusiast.
http://www.hardwaresecrets.com/printpage/All-Core-i7-Models/708
8/11
5/16/2015
sSpec
Model
SR 0US 3940XM
SR 0T2 3920XM
SR 0MH 3920XM
Clock
3.0
GHz
2.9
GHz
2.9
GHz
Turbo
Boost
Video
Clock
Video
Boost
650 MHz
1.35 GHz
650 MHz
1.3 GHz
650 MHz
1.3 GHz
Cores HT Video
3.9 GHz
Ye s
3.8 GHz
Ye s
3.8 GHz
Ye s
HD
4000
HD
4000
HD
4000
L3
Tech.
Cache
22
8 MiB
nm
22
8 MiB
nm
22
8 MiB
nm
TDP
(W)
Max. Temp.
(C)*
Pinout
55
105
G2
55
105
G2
55
105
G2
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the
CPU. On some other models, the manufacturer lists Tcase, which is the maximum external
temperature of the CPU. The two are not comparable.
4770
NA
4770R
SR 14H 4770S
SR 14N 4770T
SR 14Q
4765T
3.5
GHz
3.4
GHz
3.4
GHz
3.2
GHz
3.1
GHz
2.5
GHz
2.0
GHz
Turbo
Boost
Cores HT
Video
Video
Clock
3.9 GHz
Ye s
HD 4600
350 MHz
3.9 GHz
Ye s
HD 4600
350 MHz
3.9 GHz
Ye s
HD 4600
350 MHz
3.9 GHz
Ye s
Iris Pro
5200
200 MHz
3.9 GHz
Ye s
HD 4600
350 MHz
3.7 GHz
Ye s
HD 4600
350 MHz
3.0 GHz
Ye s HD 4600
350 MHz
Video
Boost
L3
Tech.
Cache
22
1.2 GHz 8 MiB
nm
22
1.25 GHz 8 MiB
nm
22
1.2 GHz 8 MiB
nm
22
1.3 GHz 6 MiB
nm
22
1.2 GHz 8 MiB
nm
22
1.2 GHz 8 MiB
nm
22
1.2 GHz 8 MiB
nm
TDP
(W)
Max. Temp.
(C)*
Socket
84
72
LGA1150
84
72.72
LGA1150
84
72.72
LGA1150
65
66.45
LGA1150
65
71.35
LGA1150
45
71.45
LGA1150
35
66.35
LGA1150
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU.
On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature
of the CPU. The two are not comparable.
9/11
5/16/2015
The fourth-generation Core i7 processors targeted to laptops are based on the Haswell
microarchitecture.
A new feature brought by these models is the support for AVX2 instructions.
The U and Y models carry an integrated south bridge chip with a four-port USB 3.0 controller and
a four-port SATA-600 controller. On these models, the PCI Express controller is 2.0 and supports only
one x4 connection or four x1 connections. On the other models, the PCI Express controller is 3.0 and
supports one x16 connection, two x8 connections, one x8 connection or two x4
connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s
each direction, which is listed as 5 GT/s by Intel).
Several graphics engines are available, all DirectX 11.1: HD 4200 (codenamed GT1, 10 processing
units), HD 4400 (codenamed GT2, 20 processing units), HD 4600 (codenamed GT2, 20 processing
units), HD 5000 (codenamed GT3, 40 processing units), Iris 5100 (codenamed GT3, 40 processing
units), and Iris Pro 5200 (codenamed GT3e, 40 processing units, and video memory integrated into
the CPU).
The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600
MHz DDR3L and LPDDR3 (on models U and Y) memories.
Fourth-generation Core i7 mobile CPUs can have two or four processing cores, supporting HyperThreading (HT) technology, which simulates two logical processing cores in each physical core.
Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only
half the cores are real; the other half is simulated.
sSpec
Model
NA
4960HQ
SR 18G 4950HQ
SR 15K 4900MQ
SR 18H 4850HQ
SR 15L 4800MQ
SR 18J 4750HQ
SR 15F 4702HQ
SR 15J 4702MQ
SR 15E 4700HQ
SR 15H 4700MQ
SR 17L 4700EQ
SR 16H 4650U
NA
4610Y
NA
4600M
SR 1EA 4600U
SR 188 4558U
SR 16J 4550U
SR 16Z 4500U
Clock
2.6
GH
2.4
GHz
2.8
GHz
2.3
GHz
2.7
GHz
2.0
GHz
2.2
GHz
2.2
GHz
2.4
GHz
2.4
GHz
2.4
GHz
1.7
GHz
1.7
GHz
2.9
GHz
2.1
GHz
2.8
GHz
1.5
GHz
1.8
GHz
Turbo
Boost
Cores HT
Video
Iris Pro
5200
Iris Pro
5200
Video
Clock
Video
Boost
200 MHz
1.3 GHz
200 MHz
1.3 GHz
400 MHz
1.3 GHz
200 MHz
1.2 GHz
400 MHz
1.3 GHz
200 MHz
1.2 GHz
3.8 GHz
Ye s
3.6 GHz
Ye s
3.8 GHz
Ye s HD 4600
3.5 GHz
Ye s
3.7 GHz
Ye s HD 4600
3.2 GHz
Ye s
3.2 GHz
Ye s HD 4600
3.2 GHz
Ye s HD 4600
3.4 GHz
Ye s HD 4600
400 MHz
3.4 GHz
Ye s HD 4600
3.4 GHz
Ye s HD 4600
400 MHz
1 GHz
3.3 GHz
Ye s HD 5000
200 MHz
1.1 GHz
2.9 GHz
Ye s HD 4200
3.6 GHz
Ye s HD 4600
400 MHz
1.3 GHz
3.3 GHz
Ye s HD 4400
200 MHz
1.1 GHz
3.3 GHz
1.2 GHz
3.0 GHz
Ye s HD 5000
200 MHz
1.1 GHz
3.0 GHz
Ye s HD 4400
200 MHz
1.1 GHz
Iris Pro
5200
Iris Pro
5200
http://www.hardwaresecrets.com/printpage/All-Core-i7-Models/708
1.2 GHz
L3
TDP
Tech.
Cache
(W)
22
6 MiB
47
nm
22
6 MiB
47
nm
22
8 MiB
47
nm
22
6 MiB
47
nm
22
6 MiB
47
nm
22
6 MiB
47
nm
22
6 MiB
37
nm
22
6 MiB
37
nm
22
6 MiB
47
nm
22
6 MiB
47
nm
22
6 MiB
47
nm
22
4 MiB
15
nm
22
4 MiB
11.5
nm
22
4 MiB
37
nm
22
4 MiB
15
nm
22
4 MiB
28
nm
22
4 MiB
15
nm
22
4 MiB
15
nm
Max. Temp.
(C)*
Package
100
NA
100
FC BGA1364
100
FC PGA946
100
FC BGA1364
100
FC PGA946
100
FC BGA1364
100
FC BGA1364
100
FC PGA946
100
FC BGA1364
100
FC PGA946
100
FC BGA1364
100
FC BGA1168
100
NA
100
NA
100
FC BGA1168
100
FC BGA1168
100
FC BGA1168
100
FC BGA1168
10/11
5/16/2015
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the
CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the
CPU. On some other models, the manufacturer lists Tcase, which is the maximum external
temperature of the CPU. The two are not comparable.
Originally at http://www.hardwaresecrets.com/article/All-Core-i7-Models/708
http://www.hardwaresecrets.com/printpage/All-Core-i7-Models/708
11/11