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Mediacom S470 Service Manual
Mediacom S470 Service Manual
Version:
Effective Date:
2014.11.12
Note:
This manual is guide to after-sales repair of DP34681 mobile phone, the repair
of product shall only be carried out by trained and well experienced technical
person and use of this manual by any other person for the service of the
product may result in serious damage to the product
Content
1. Introduction
1.1 Purpose
1.2 General safety Guidelines and use
2. General Characters
2.1 Overview
2.2 Introduction to main Functions
3. Introduction to capability and index
4. How the GSM system work
4.1 General
4.2 Introduction of GSM
5. System overview
5.1 RF Part
5.2 BB part
6. Assembly and Disassembly
6.1 product appearance
6.2 Introductions of disassembly
7. Repair requirement
8. Baseband Trouble
8.1 Flash programming does not download
8.2 Phone does not power on
8.3 Sound trouble
8.4 Can not charge up
8.5 LCD trouble
8.6 Microphone trouble
8.7 Earphone part trouble
8.8 Vibrator trouble
8.9 Receiver does not work
8.10 Camera trouble
8.11 WIFI and FM and BT and GPS circuit trouble
8.12 G-sensor has not function
8.13 Phone can not access SIM card
9. RF Trouble
9.1 Principle of operation
9.2 AGC failure
9.3 AFC failure
9.4 APC Failure
10. Maintenance tools
1. Introduction:
1.1 Purpose:
The main purpose of this manual is to provide a basic foundation for electrical
and mechanical repairs
1.2 General Safety guidelines and use:
Safety guidelines:
The product contains polar capacitors, which must not be short-circuited or
connected with polarities reversed. During repairs, due attention shall be paid
to static protection in order not to damage the ESD-sensitive components of
this device. It is strictly forbidden to use mobile phone dial up in the plane. It is
strictly forbidden to use this device near aerosol sprays or explosive gases
Use of mobile phone:
Please do not make mobile phone approach or touch the exposed parts of the
body(especially face or eye), If the user holds the mobile phone like the
receiver of a common telephone, it has best efficiency when its antenna is
upwards and above the shoulder. Please speak to microphone.
Each driver shall always pay attention to safety, Use of a mobile phone when
she/he drives in some areas is an illegal act.
2. General characters:
2.1 Overview:
DP34681 mobile phone are based upon platform MT6582M, including
baseband circuit and frequency circuits, Baseband parts is mainly comprised
of master chip MT6582M and its controlled peripheral circuits. DP34681 is
equipped with dual SIM and dual standby, single camera, single battery, CTP
G-sensorWIFIFM, Bluetooth ,DTVand single memory card.
Main Features:
Main dimension: 67.8 * 137.4*8mm
Smart phone
Frequency Range
Transmit : 880~915MHz
Receiver : 925~960MHz
Transmit: 1710~1785MHz
Receiver: 1805~1880MHz
Channel
Phase Error
<2%
<2%
Receiving Sensitivity
<-102dBm
<-102dBm
Voltage Range
3.2~4.5V
Temperature Range
10 ~+55
Item
Frequency Range
Transmit : 824~849MHz
Receiver : 869~894MHz
Transmit: 1850~1910MHz
Receiver: 1930~1990MHz
Channel
Phase Error
<2%
<2%
Receiving Sensitivity
<-102dBm
<-102dBm
Voltage Range
3.2~4.5V
Temperature Range
10 ~+55
14
15
16
17
18
15
13
11
9
7
3
3
5
5
5
4
4
6
6
6
19
7
8
9
10
11
12
13
14
16
14
12
10
8
6
4
2
3
3
4
4
4
4
4
5
4
4
5
5
5
5
5
6
15
switching system.
RF part :
RX SAW : U1103 ; DPX:
U1105/U1105/U1106
U1202 RF
Connector
U1101 RF
Transceiver
VBAT
26MHz
U1108 26MHz
Crystal
LNA, PGA, Amplifier, GMSK modem (GMSK modem exclude from RF chip),
PLL etc.
RF Amplifier circuit U1201: The periphery of U101 mainly includes
resistance, capacitor and inductance components. U1201 is directly powered
by batteries.
BB Parts:
Include analog baseband chip, Flash, Crystal oscillator (32.768KHz), BT chip,
FM chip, WIFI chip MIC, keys, SIM Card slot, battery connector, micro USB
connector (5pin), charger circuit etc.
6. Assembly and Disassembly:
Product appearance:
Front view
Back view
Instruction of disassembly:
Tool for repair: Tweezers, case removing tool, standard cross head
screwdriver
Disassembly Steps:
Removing the battery : Push the battery cover in the direction of the red arrow,
and take the battery cover off, and take the battery off.
F
A
7. Repair requirement:
Precautions:
A reliable work area must be available so that ESD-sensitive components are
safely used and no electrostatic shock occurs. This work area must be
configured as follows:
Work surfaces ----- All work surfaces must be covered with anti-static mats.
For the protection of powered equipment these mats must be grounded
through a connection with 1.2ohm resistance
Bracelet ----- A fixture with a soft wire and built-in resistance of 5.2ohm to
1.2ohm for quick dissipation of static electricity. The soft wire connection is
attached to common-ground.
Posy-repair Testing:
After repairs, tests must be carried out on the product to assure that its
operation is normal. When the component on main board is replaced, mobile
phone must be tested out on the fixture to assure that its operation is normal.
Testing is even more important in the case of replacement of logic or RF
compatible communications analyzer.
Attention: You must have the necessary equipment as well as the necessary
service training in order to repair CPU flash
8. Baseband Trouble
8.1 Flash programming does not download
Analysis Process
BL chip
LCM part
Analysis Process
Analysis Process
Analysis Process
Analysis Process
Analysis Process
Analysis Process
FM Analysis Process
BT Analysis Process
Analysis Process
Analysis Process
Analysis Process
9. RF Trouble
9.1 Principle of operation
Signal TX processes:
Acquisition voice - Amplification - ADC - filter - Speech Code - Complect encryption Channel Equalization - GMSK modulation -- ( into RF part) IQ
modulation (IQ modulator) - filter Frequency phase (phase frequency) - filter
- TX_VCO mixer (Mixer Mixer) - power amplifier (PA) - duplex -- Antenna
matching circuit - antenna TX.
Signal RX process:
Antenna RX - antenna matching circuit duplex Filter - SAW filter - LAN RX_VCO mixer - Amplification - filter - IQ demodulation (IQ Modulator) - GMSK
demodulator - Channel Equalization - decrypt Cutting Complect - voice
codecs - filter -- DAC - Amplification - voice output.
9.2 AGC failure
Analysis Process