Professional Documents
Culture Documents
IPC-AC-62A: Aqueous Post Solder Cleaning Handbook
IPC-AC-62A: Aqueous Post Solder Cleaning Handbook
ELECTRONICS INDUSTRIES
IPC-AC-62A
Aqueous Post Solder
Cleaning Handbook
IPC-AC-62A
January 1996
Supersedes IPC-AC-62
January 1996
IPC-AC-62A
Table of Contents
1.0
SCOPE ...................................................................... 1
1.1
Purpose .............................................................. 1
2.1
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
4.0
Aqueous Cleaning.........................................
Wash or Washing......................................
Rinse or Rinsing.......................................
Drying ...........................................................
Gross Drying.................................................
Defluxing (Flux Removal or Post
Solder Cleaning) .............................................
Fine Cleaning................................................
Screen and Stencil Cleaning ........................
Semi-Aqueous Cleaning ...............................
Organic Solvent Cleaning ............................
Non-Reactive Additives................................
Reactive Additives or Reactants ..................
Organic Solvent Emulsions in Aqueous
Media...............................................................
Manual Cleaning...........................................
Batch Cleaning..............................................
In-Line Cleaning...........................................
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
INTRODUCTION ....................................................... 2
6.1
6.2
6.3
6.4
4
4
6
6
7.1
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.3
7.4
7.4.1
7.4.2
Wetting of surfaces............................................
Dissolution .........................................................
Ionic Dissolution ...............................................
Non-Ionic Dissolution .......................................
Surface Agent Dissolution, Emulsification.......
Saponifier Dissolution .......................................
Chelation Dissolution ........................................
Solder Ball and Particulate Removal................
The Physics of Cleaning ...................................
Temperature .......................................................
Mechanical Agitation ........................................
7
7
7
7
7
7
7
8
8
8
8
7.4.3
7.5
7.6
8.1
8.1.1
8.1.2
8.1.3
8.2
8.3
8.4
8.5
8.6
8.7
8.7.1
9.0
9.1
9.1.1
9.1.2
9.2
9.3
9.3.1
9.3.2
9.3.3
9.3.4
10.0
10.1
10.2
10.3
10.4
10.5
10.6
11.0
11.1
11.1.1
11.1.2
11.1.3
11.1.4
11.1.5
14
14
15
15
16
16
16
16
16
16
16
17
iii
IPC-AC-62A
11.1.6
11.2
11.2.1
11.2.2
11.2.3
11.2.4
11.2.5
11.2.6
11.3
11.3.1
11.3.2
11.3.3
11.3.4
11.3.5
11.3.6
11.4
Ultrasonics .......................................................
Drying ..............................................................
Gross and Fine Drying....................................
Air-knife and Forced Air Drying ....................
Radiation Drying .............................................
Vacuum Drying................................................
Organic Solvent Drying Agents ......................
Centrifugal .......................................................
Solder Flux Removal ......................................
Water Soluble Organic Acid Flux...................
Rosin Type Flux ..............................................
SA Type Flux...................................................
Low Residue/No-Clean Flux ..........................
Removal of Other Materials ...........................
Solder Paste Removal from Stencils ..............
Fine Cleaning ..................................................
January 1996
17
18
18
18
18
18
18
19
19
19
19
19
19
19
20
20
12.1
12.1.1
12.1.2
12.2
12.3
12.4
12.5
12.6
13.0
13.1
13.1.1
13.1.2
13.1.3
13.2
13.2.1
13.2.2
13.2.3
13.3
13.4
Chemical Effects..............................................
Water without Additives..................................
Water with Additives.......................................
Thermal Effects ...............................................
Mechanical Effects from Spray
Impact ..............................................................
Effects from Ultrasonic Energy ......................
Effects from Centrifugal Forces......................
Electrostatic Discharge from Drying
Operations........................................................
20
20
20
20
20
20
21
21
14.1.2
14.1.3
14.2
14.2.1
21
21
21
21
21
21
22
23
23
24
25
25
15.1
15.1.1
15.1.2
15.1.3
15.2
15.2.1
15.2.2
15.2.3
25
26
26
27
27
27
27
30
Appendix A
................................................................. 32
Appendix B
................................................................. 37
Figures
Figure 41
Figure 42
Flux/Cleaning Options............................................... 4
Figure 43
Figure 151
Figure 152
Figure A1
Basic Steps............................................................... 33
24
25
Tables
Table 81
Table 82
Table 151
Table 152
14.1
14.1.1
iv
January 1996
IPC-AC-62A
mask
IPC-PE-740 Troubleshooting Guide for Printed Board
Manufacture and Assembly
2.1 Joint Industry Standards1
IPC-B-24
IPC-B-25
IPC-B-36
NOTE:
IPC-AC-61
IPC-CH-65
Assemblies
Organic Surface ContaminationIts Identification, Characterization, Record Effects on Surface Insulation Resistance and Conformal Coating Adhesion
IPC-TP-383
IPC-TM-650
(Dynamic Method)
2.3.26.1, Ionizable Detection of Surface Contaminants
(Static Method)
2.3.27, Cleanliness Test - Residual Rosin (UV Method)
2.3.27.1, Rosin Flux Residue Analysis, HPLC Method
2.3.28, Ionic Analysis of Circuit Boards, Ion Chromatography Method
a cleaning operation (usually following the wash step) where water replaces - via a
dilution mode - any residual contamination.
ing)