PHYSICAL VAPOR DEPOSITION Sputtering vs.

Electron Beam
Evaporation
Physical Vapor Deposition (PVD) is a family of processes that is used to deposit layers of atoms or molecules
from the vapor phase onto a solid substrate in a vacuum chamber. Two very common types of processes used
are Sputtering and Electron Beam Evaporation.
Sputtering process involves ejecting material from a target that is a source onto a substrate (such as a silicon
wafer) in a vacuum chamber. This effect is caused by the bombardment of the target by ionized gas which often
is an inert gas such as argon. Sputtering is used extensively in the semiconductor industry to deposit thin films
of various materials in integrated circuit processing. Anti-reflection coatings on glass for optical applications are
also deposited by sputtering. Because of the low substrate temperatures used, sputtering is an ideal method to
deposit metals for thin-film transistors. Perhaps the most familiar products of sputtering are low-emissivity
coatings on glass, used in double-pane window assemblies. An important advantage of sputtering is that even
materials with very high melting points are easily sputtered while evaporation of these materials in a resistance
evaporator or Knudsen cell is difficult and problematic
Electron Beam Evaporation (commonly referred to as E-beam Evaporation) is the process used at Abrisa
Technologies, the ZC&R Coatings for Optics division. This is a process in which a target material is
bombarded with an electron beam given off by a tungsten filament under high vacuum. The electron beam
causes atoms from the source material to evaporate into the gaseous phase. These atoms then precipitate into
solid form, coating everything in the vacuum chamber (within line of sight) with a thin layer of the anode
material. A clear advantage of this process is it permits direct transfer of energy to source during heating and
very efficient in depositing pure evaporated material to substrate. Also, deposition rate in this process can be as
low as 1 nm per minute to as high as few micrometers per minute. The material utilization efficiency is high
relative to other methods and the process offers structural and morphological control of films. Due to the very
high deposition rate, this process has potential industrial application for wear resistant and thermal barrier
coatings aerospace industries, hard coatings for cutting and tool industries, and electronic and optical films for
semiconductor industries. Additionally, coating uniformity and precise layer monitoring techniques are also some
advantages with this process.