Subject: Industrial Robotics

UNIT-3
1. What are the various factors in gripper's selection and design? Explain.

Considerations in robot gripper selection and design

The industrial robots use grippers as an end effector for picking up the raw and finished work parts. A
robot can perform good grasping of objects only when it obtains a proper gripper selection and design.
Therefore, Joseph F. Engelberger, who is referred as Father of Robotics has described several factors that
are required to be considered in gripper selection and design.
The gripper must have the ability to reach the surface of a work part.
The change in work part size must be accounted for providing accurate positioning.
During machining operations, there will be a change in the work part size. As a result, the gripper
must be designed to hold a work part even when the size is varied.
The gripper must not create any sort of distort and scratch in the fragile work parts.
The gripper must hold the larger area of a work part if it has various dimensions, which will
certainly increase stability and control in positioning.
The gripper can be designed with resilient pads to provide more grasping contacts in the work part.
The replaceable fingers can also be employed for holding different work part sizes by its
interchangeability facility.
Moreover, it is difficult to find out the magnitude of gripping force that a gripper must apply to pick up a
work part. The following significant factors must be considered to determine the necessary gripping force.
Consideration must be taken to the weight of a work part.
It must be capable of grasping the work parts constantly at its centre of mass.
The speed of robot arm movement and the connection between the direction of movement and
gripper position on the work part should be considered.
It must determine either friction or physical constriction helps to grip the work part.
It must consider the co-efficient of friction between the gripper and work part.
[10M]
2. What are the various techniques of image processing and analysis? Explain in detail.mital pg. 366
[10M]

3. Explain the various robotic application of machine vision.pg351

Robotic applications of a machine vision system
A machine vision system is employed in a robot for recognizing the objects. It is commonly used to perform
the inspection functions in which the industrial robots are not involved. It is usually mounted in a high-speed
production line for accepting or rejecting the work parts. The rejected work parts will be removed by other
mechanical apparatuses that are in contact with the machine vision system.
A machine vision system can be incorporated with an industrial robot for performing the following three
important tasks such as:
Inspection
Identification
Visual servoing and navigation
Inspection:
The industrial robots are only used to support the machine vision system when it performs the inspection
tasks. During this process, it checks for accurate surface finish, exact dimension, errors in labeling, presence

of holes in the work parts, and other factors. The machine vision system carries out this inspection processes
automatically with less time and errors. In addition, the human workers can also perform these operations
manually, but there is a high possibility of error occurrence and increased operation time.
Identification:
In this process, the machine vision system performs recognizing and categorizing of work parts instead of
inspecting it. It also helps in determining the work parts position and orientation. Some of the operations
accomplished by a machine vision system in the identification process are work part palletizing and
depalletizing, object sorting, and gripping the parts oriented from a conveyor. A robot is used in these tasks
to take successive action and decision.
Visual servoing and navigation:
In this application, a machine vision system controls the actions of a robot according to the visual input. For
example: In robot visual servoing process, a machine vision system directs the path of robots end effector to
a work part in the work cell. Some applications of this category consist of positioning of work parts, seam
tracking, bin picking, and retrieving and re-orienting the work parts that are moving along a conveyor. With
the help of visual data, the navigational control can be used in collision protection and automatic path
planning of a robot.
[10M]
4. Write about Segmentation and Object recognition in details.
[10M]
5. What are the different methods of Sensing and Digitizing image data?
Explain?
[10M]
UNIT-4
1. How do you define the BRANCHING related to Robot programming? Explain.
2. Write short notes on
a) Robot Programming Language.
b) Hydraulic Servo System.
3. Explain about importance of Robot Programming.
4. Explain in detail about imaging devices and lighting techniques of machine vision.
5. What are the features of First, Second and Future Generation languages?

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UNIT-5
1. A) How do you analyze the Robot Cycle time?
[10M]
b) Compare the Robot work cell controllers?
2. Short notes on:
a) Structure of Robot Language.
[10M]
b) Robots in Spray Coating.
3. Write briefly about different layouts of Robot Cell.
[10M]
4. Enumerate the Applications of Robots. Mittal389-411
[10M]
5. Explain with the help of sketches the Robot-Centered Cell and In-Line Robot Cell. Robot-centered work
cell
In industries, the working unit of a robot can be prepared in three different arrangements such as:
Robot-centered work cell
Mobile robot work cell
In-line robot work cell
In this article, the first arrangement (Robot-centered cell) is described briefly below:
Design of Robot-centered cell:

Robot-centered cell is one of the commonly used layouts in the industrial applications. In this arrangement, a
single robot will be incorporated at the center of the work cell for performing operations on several
machines that are set in a semi-circle form. This type of work cell is shown in the below figure.

This arrangement was organized because in 1960s a single robot was used to perform only one function,
either carrying out a production process or examining a production machine. Those times, the robots were
mostly employed in several operations like die casting, loading and unloading of parts, etc. where the usage
of robots was very low when compared with the machine usage times.
This inequity in performance was highly occurred in the metal machining operations. During this process, a
robot remains inactive for a longer period. As a result, Robot-centered cell was introduced to maximize the
usage of robots.
Application of Robot-centered cell:
Arc welding operation is an application of the Robot-centered cell. In this process, a robot is used to perform
the production process, instead of examining the production machine.
Additionally, this operation requires pallets, conveyors, and other devices for providing the work parts to the
cell. These devices will place the work parts in a preferred area for appropriate lifting. Human workers are
also employed for performing the part loading and unloading tasks.
In-Line robot work cell
An In-Line robot cell arrangement has a movable conveyor with the work parts. This conveyor travels near
the robots for performing a function on the work parts. This type of arrangement is mostly used in the
automobile industries for assembling the car bodies. To be more specific, the robots are placed beside the
assembly line to carry out some operations like spot welding.

In the in-line robot cell design, anyone of the following transfer system can be used:
Synchronous or intermittent transfer system
Continuous transfer system
Non synchronous transfer system
Synchronous or Intermittent transfer system:
In this transfer system, every work part is transported at the same time from one workplace and stored in
another workstation. The robots are placed in a fixed position near the moving line in which the work parts
travel. With the help of start and stop motion, the work parts are stopped next to a robot for performing the
operations on it.
Continuous transfer system:
The continuous transfer system transfers the work parts continuously at a constant time along a conveyor.
The continuous movement of work parts makes the robots tough to operate in a fixed position. As a result,
there are two tracking system that helps to solve this problem such as:
A moving baseline tracking system: During an operation, this system allows the robot to move
equivalent with the path of work parts. Hence, the traveling position of the robot and work parts will
remain the same.
A stationary baseline tracking system: In this method, the robot is placed in a fixed position along a
line. Instead of moving the robot, this system uses the manipulator for tracking the movable work
parts. Here, tracking refers to the ability of a robot to sustain the locations of the programmed points
relative to the work part even during the movement of the conveyor.
Non synchronous transfer system:
The non-synchronous transfer system allows the work parts to transfer separately along a conveyor. As like
synchronous transfer, this system also moves with a start and stop motion. Sometimes, there is the possibility
of uneven arrival timings. Therefore, sensors are used for specifying the starting time of the process to a
robot. This transfer system is also called as power and free system.
Apart from in-line robot cell, there are other two robot cell arrangements such as robot-centered cell and
mobile robot cell.
[10M]

Subject: Computer Aided Mfg.

UNIT-III
1. Explain the concept of using automatic tool chargers in machining centers and
Explain any two types of automatic tool chargers.
2. Write the functions of Post Processors in NC Machines.

[10M]
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3. What is the role of Post Processor in CNC Machining? Discuss its general structure. [10M]
4. Explain the functioning of DAPP based Post Processor in CNC Machining.
[10M]
UNIT-IV
1. A) Write a short note on role of ladder diagram in PLC programming.
b) What are Micro Controllers? Discuss the criteria for selection of Micro Controllers.
2. What is a PLC? Explain the application of PLCs in CNC Machines.
3. How Low-Level and High-Level computer type languages in programming of PLCs.
4. How PLC operates and describes its capabilities in Arithmetic functions, Matrix
Functions and Analog control?
5. Describe Hardware components, External memory, Counters and Timers used in
Micro Controllers and mentioning their working.

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UNIT-V
1. What is CAPP? Explain about Hybrid CAPP System.
[10M]
2. With a neat sketch, explain the working of a CMM and mention its limitations.
[10M]
3. A) Explain the role of Artificial Intelligence in CAD.
[05M]
b) Classify various types of Computer Aided Inspection methods. Explain about any one type
Of Optical Inspection Methods. Cad cam14.11
[05M]
4. A) Discuss about various types of APT motion commands.
[05M]
b) Describe about Artificial Neural Networks".
[05M]
5. Differentiate between Variant type and Generative type CAPP systems and explain the
Modular structure of Generative CAPP system.
[05M]
Subject: Special Mfg. Process:
UNIT-III
1. A) Describe about film deposition oxidation. Pg. 817
b) Briefly describe the process of lithography.
819
2. A) Discuss the various methods of surface mount technology. 843
b) Explain the role of Computer Aided Design in microelectronics.
3. A) Explain various steps involved in wafer preparation.814
b) Discuss about various bonding and packaging techniques applied to MEMS
Industries.
839
4. Explain the following:
a) Micro machining process. b) Applications of Nano technology
UNIT-IV
1. Define Nano and briefly describe about Nano technology.
2. Discuss the role of the following in the Manufacturing system:
a) Nanotechnology
b) E-Manufacturing.
3. Distinguish between AJM, and WJM with respect to their
a) Mechanics of material removal
b) Characteristics799,797
4. What are the features, limitations and applications of
a) EDM and
788
b) WEDM?

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UNIT-V
1. Explain the following process with a neat sketch, applications, advantages and
Limitations.
I) Laser Sintering.554
ii) Fused deposition method.550
2. With the help of neat sketch, explain the process of fused deposition modeling
Technique and also explain the advantages and applications.
3. A) what are the advantages and applications of high speed machining?
b) Explain how rapid prototyping is helpful in design of products.
547
[05M]
4. A) with the help of a neat sketch explain stereo-lithographic process.552
b) What is selective laser sintering? Explain the steps involved.
5. A) Explain the process of rapid prototyping technique.
b) With the help of neat sketch explain the stereo-lithograph technique

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SUBJECT: GEOMETRIC MODELLING:-

UNIT-III
1. Write the Bernstein Polynomial function for the Bezier Curve and also explain about
Characteristics of Bezier Curve based on Bernstein Polynomial. 202
[10M]
2. Determine seven points on the Bezier Curve from the given Vertices of a Bezier polygon
B0= [1, 1], B1 [2 3], B2 [4 3] and B3 [3 1].pg 295 r&m
3. A Cubic Spline Curve is defined by the equation P(u)=C3u3 + C2u2 + C1u + C0, 0 u 1
Where C3, C2, C1 and C0 are the Polynomial coefficients. Assuming these Coefficients
Are known, find the four control points that define an identical Bezier Curve.zeid 206
[10M]
4. Explain about the B-Spline Curve and write B-Spline functions and Characteristics.zeid 207
[10M]
5. Find the equation of a closed (periodic) B-Spline Curve defined by four control points.

215[10M]

UNIT-IV
1. Explain about the Hermite Bicubic Surface equation.270
2. Determine the point at t = 0.5, s = 0.5, on the sweep surface generated by
Simultaneously translating the line 10 units along the x-axis and rotating it through 2
About the x-axis. Consider the line segment in the xy plane and parallel to the y-axis 395

[10M]

Defined by end points p1 = [0 0 0] and p2 = [0 3 0].

R&a

395

[10M]
3. Find the equivalent Bicubic formulation of an Open and Closed cubic B Spline surface.zeid284
[10M]
4. Explain about the Coons Surface Patch.
[10M]

Zeid 287

UNIT-V
1. Take any typical 3D geometry for an Engineering component. Show how it can be
Represented in CAD by wireframe modeling.
[10M]
2. Write the Algebraic equation of the tricubic solids and denote the boundary
Conditions with the help of neat sketches.

[10M

3. a) Explain the neighborhood concept in Solid Modelling.

[05M]

B) Explain Five building Operations in Solid Modelling.

[05M]

4. Explain winged edge data structure with the example of a Solid object.

[10M]

Subject: Nano Technology [Elective]

UNIT-III
1. Describe in detail theory and working principle of STM with suitable schematic diagrakelsall85
[10M]
2. What are the different modes of AFM operations? Write working principle of AFM with
Suitable diagram.
[10M]

Kelsall 105

3. Write working principle and applications of SEM, STM and AFM.

[10M]

4. Write comments on Back scattered electrons, Secondary Electrons, Augur Electrons and

X-Ray emissions occur in Scanning Electron Missscroscopy Measurements.

Scanning electron
microscopy (SEM) is a method for high-resolution imaging of surfaces. The SEM uses electrons for
imaging, much as a light microscope uses visible light. The advantages of SEM over light microscopy
include much higher magnification (>100,000X) and greater depth of field up to 100 times that of light
microscopy. Qualitative and quantitative chemical analysis information is also obtained using an energy
dispersive x-ray spectrometer (EDS) with the SEM. (See Handbook section on EDS analysis.)
The SEM generates a beam of incident electrons in an electron column above the sample chamber. The
electrons are produced by a thermal emission source, such as a heated tungsten filament, or by a field
emission cathode. The energy of the incident electrons can be as low as 100 eV or as high as 30 keV
depending on the evaluation objectives. The electrons are focused into a small beam by a series
ofelectromagnetic lenses in the SEM column. Scanning coils near the end of the column direct and position
the focused beam onto the sample surface. The electron beam is scanned in a raster pattern over the surface
for imaging. The beam can also be focused at a single point or scanned along a line for x-ray analysis. The
beam can be focused to a final probe diameter as small as about 10 .

SEM Image of Metal Foam Structure

The incident electrons cause electrons to be emitted from the sample due to elastic and inelastic scattering
events within the samples surface and near-surface material. High-energy electrons that are ejected by an
elastic collision of an incident electron, typically with a sample atoms nucleus, are referred to as
backscattered electrons. The energy of backscattered electrons will be comparable to that of the incident
electrons. Emitted lower-energy electrons resulting from inelastic scattering are called secondary electrons.
Secondary electrons can be formed by collisions with the nucleus where substantial energy loss occurs or by
the ejection of loosely bound electrons from the sample atoms. The energy of secondary electrons is typically
50 eV or less.
To create an SEM image, the incident electron beam is scanned in a raster pattern across the sample's
surface. The emitted electrons are detected for each position in the scanned area by an electron detector. The
intensity of the emitted electron signal is displayed as brightness on a display monitor and/or in a digital
image file. By sychromizing the position in the image scan to that of the scan of the incident electron beam,
the display represents the morphology of the sample surface area. Magnification of the image is the ratio of
the image display size to the sample area scanned by the electron beam.

Two electron detector types are predominantly used for SEM imaging. Scintillator type detectors
(Everhart-Thornley) are used for secondary electron imaging. This detector is charged with a positive voltage
to attract electrons to the detector for improved signal to noise ratio. Detectors for backscattered electrons
can be scintillator types or a solid-state detector.
The SEM column and sample chamber are at a moderate vacuum to allow the electrons to travel freely from
the electron beam source to the sample and then to the detectors. High-resolution imaging is done with the
chamber at higher vacuum, typically from 10-5 to 10-7 Torr. Imaging of nonconductive, volatile, and
vacuum-sensitive samples can be performed at higher pressures.
[10M]

5. List out the Characterization equipment and theory for Surface Morphology. Describe the
Working principle of the SEM with a neat Diagram.

[10M]

UNIT-IV
1. Discuss various synthesis methods of metal and semiconductor Nano particles with examples.

[10M]

2. Write a short note on optical and electronic properties of metal and semiconductor Nano particles.

[10M]

3. Discuss the applications of metal and semiconductor Nano particles in catalysis and biology.

[10M]

4. Explain briefly the Vapor-liquid-solid growth of Nano wires with examples.

[10M]

5. Write a short note on Nano wire transistors and sensors.

[10M]

UNIT V
1. Discuss in detail mechanical, electronic and vibrational properties of CNTs.
[10M]

KELSALL 344

2. Write a short note on the structure of CNTs. Discuss the synthesis of CNTs by flame
Synthesis method.

[10M]

3. Discuss in detail about different types of CVD processes and the synthesis of CNTs by CVD process.kelsall 343
[10M]
4. Describe laser and arc discharge methods for CNTs and give the advantages and disadvantages
In each case.
.kelsall 343
[10M]
5. Discuss the applications of CNTs in computers, TV screens and mechanical reinforcements. Poole 136 141
[10M]

Subject: Computer Aided Process Planning [Elective-II]

UNIT-III
-1. Explain the mathematical models to compute
I) Minimum cost cutting speed
ii) Cutting speed for maximum production rate
2. Explain reduction procedure of total setup cost for a particular manufacturing
Sequence.
3. What are the methods for optimal selection of machining parameters and explain
The reasons behind it.
4. Enumerate the reasons for determining the optimal parameters for various
Machining operations.
UNIT-IV
1. A) what are the different methods of tolerance allocation? Explain.
b) What are the advantages of integrated approach over sequential approach of
Design and manufacturing tolerances?
2. What are the methods of tolerance allocation and explain them.
3. Explain the following terms
a) Design tolerances b) Manufacturing tolerances
4. Classify different types of tolerances and explain integration of manufacturing
And design tolerance.
5. Illustrate how tolerances play an important role in development of Manufacturing
Process plan.
UNIT-V
1. Determine optimal index positions for executing fixed sequence of tool path. [10M]

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a) Explain MIPLAN system.

[05M]
b) Explain computer integrated planning systems.
[05M]
2. A) briefly describe NC Tool path generation.
[05M]
b) Discuss about various types of computer programming languages used in CAPP.
[05M]
3. Describe various methods of determining optimal index positions for
Executing fixed sequence in the generation of NC tool path. 188 automation
[05M]
4. Write short notes on the following:
(a) Computer Integrated Planning Systems.
[05M]
(b) MIPLAN System
The process plan formatter may use other application programs. These could include programs to compute
machining conditions, work standards, & standard costs. Standard cost programs can be used to determine total
product costs for pricing purposes. A number of retrieval-type computer-aided process planning systems have been
developed. These include MIPLAN, one of the MICLASS modules, the CAPP system developed by Computer-Aided
Manufacturing --- International, COMCAPP V by MDSI, & systems by individual companies. We will use MIPLAN
as an example to illustrate these industrial systems. MIPLAN is a computer-aided process planning package
available from the Organization for Industrial Research, Inc., of Waltham, Massachusetts. It is basically a
retrieval-type CAPP system with some additional features. The MIPLAN system consists of several modules which
are used in an interactive, conversational mode. To operate the system, the user can select any of the four different
options to create the process plan for a new part:
1. The first option is a retrieval approach in which the user inputs a part code number & a standard process
plan is retrieved from the computer file for possible editing. To generate the part code number, the planner may elect
to use the MICLASS interactive parts classification & coding system. 2. In the second option, a process play is
retrieved from the computer files by entering an existing part number (rather than a part code number). Again, the
existing process plan can be edited by the user if required. 3. A process plan can be created from scratch, using
standard text material stored in computer files. This option is basically a specialized word-processing system in which
the planner selects from a menu of text related to machines & processes. The process plan is assembled from text
passages subject to editing for the particular requirements of the new part. 4. The user can call up an incomplete
process plan from the computer file. This may occur when the user is unable to complete the process plan for a new
part at one sitting. For example, the planner may interrupted in the middle of the procedure to solve some emergency
problem. When the procedure is resumed, the incomplete plan can be retrieved & finished. After the process plan has
been completed using one of the four MIPLAN options, the user can have a paper document printed out by the
computer. A typical MIPLAN output is shown in the figure in the next slide. It is also possible for the user to store the
completed process plan (or the partially completed plan as with the option 3) in the computer files, or to purge an
existing plan from the files. This might be done, for example, when an old machine tool is replaced by a more
productive machine, & this necessitates changes in some of the standard process plans. Computer graphics can be
utilized to enhance the MIPLAN output. This possibility is illustrated in the next slide, which shows a tooling setup
for the machining operation described. With this kind of pictorial process planning, drawings of workpart details, tool
paths, & other information can be presented visually to facilitate communication to the manufacturing shops.
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