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ENGINEERING MATERIALS SELECTION GUIDE

NuSil Technology is a global leader in the formulation and manufacture of silicones for the engineering industries, offering precise
and predictable material performance. ISO 9001-certified since 1994 and AS 9100-certified since 2008, NuSil operates state-ofthe-art laboratories and processing facilities in North America, providing on-site, in-person application engineering support worlddwide.
What differentiates NuSil from other silicone suppliers is our commitmentafforded by our capacity to optimize the vast, unique
array of properties silicones provideto deliver a full range of silicone materials to meet many diverse requirements. Below is a
list of the types of high quality, high performance silicone materials we offer.
Potting compounds
Encapsulants
Gels
Non-reactive fluids and greases
High elongation elastomers
Hard resins

Adhesives and sealants


Coatings
Foams
Thermally and electrically conductive adhesives and sealants
Functional and non-functional polymers
Gap Fillers

Silicones for Engineering Applications


Low modulus and low glass transition point enable silicone to remain elastic at
low temperatures and resist degradation at high temperatures or in UV light.
The ability of silicone to reduce stress on devices in harsh environments and at
extreme temperatures makes it a reliable material in a variety of industries,
from electronics to aircraft, to aerospace.
Key to the popularity and the legacy of silicone in the engineering industries is its ability
to be tailored to meet the needs of the intended application. For example, electrically
conductive fillers like carbon and silver can be incorporated into silicone for protection
against static accumulation and discharge that can damage sensitive electronic
components. Thermally conductive fillers such boron nitride make silicones excellent
Thermal Interface Materials (TIMs) for the transfer of heat between components.
Further, phenyl silicones are known for a high refractive index (RI) and broad operating
temperature, and fluorosilicones resist
swelling when in contact with various hydrocarbon materials, such as Jet A or
JP-8 engine fuels or cleaning solvents. In addition to providing solvent
resistance, some of NuSils fluorosilicone coatings also show very favorable
ice-phobic performance, significantly reducing the adhesion of ice on
aerodynamic surfaces. With silicones unique inherent properties and
unparalleled versatility, new uses such as this continue to emerge.
1

Ice-phobic coatings are the prominent topic of SAEs soon-to-be-released Aerospace Information Report (AIR) 6232.
It is the sole responsibility of each purchaser to ensure that any use of these materials is safe and complies with all applicable laws and regulations. It is the user's responsibility to
adequately test and determine the safety and suitability for their applications and NuSil Technology makes no warranty concerning fitness for any use or purpose.

Low Volatility Materials


As a testament to our expertise, NuSil can vary the degree of processing in order to meet the desired levels for common
contaminants, such as ions and low molecular weight species associated with outgassing. Because a vacuum environment
compounds the propensity of volatiles to condense on device components at elevated temperatures, mitigation of volatiles
is essential in space and terrestrial applications in which sensitive electronics are repeatedly exposed to these conditions.
This is of utmost importance in aerospace applications, materials for which the National Aeronautics and Space Agency
(NASA) and the European Space Agency (ESA) carefully assess volatile content prior to use in space. Whether or not the
application at hand is extraterrestrial, device functionality depends upon avoiding the contamination caused by the volatile
species.
NuSils silicones are categorized for application suitability as dictated by their outgassing levels. While standard materials
meet no outgassing or ion criteria, the rest meet or exceed the volatility allowances for various markets. Our electronic
packaging materials, prefixed EPM, are tested per lot per ASTM D 2288; these are common in photonic applications. In
compliance with space agency specifications, our controlled volatility products, prefixed CV, and our Ultra Low
OutgassingTM materials, prefixed SCV, are tested per lot per ASTM E 595 for TML% (Total Mass Loss) and CVCM%
(Collected Volatile Condensable Materials). (For more information on low outgassing testing, please see our ASTM E
595 Test Method tear sheet.)
NuSils processing accommodations are shown in the pyramid below, from standard at the bottom to Ultra Low
OutgassingTM at the top.

Tested per ASTM E 595 per lot and must meet:


0.10 % TML
0.01% CVCM
125C @ 10-5 torr for 24 hrs.

Tested per ASTM E 595 per lot and must meet:


1.0 % Total Mass Loss (TML)
0.10% Collectd Volatile Condensable
Material (CVCM)
125C @ 10-5 torr for 24 hrs.

Low Volatility requirement is 1%


@ 275C for 1 hour ASTM D 2288
Low Ion Content: < 20 ppm of individual
Na, K and Cl ions per MILSTD 883E

No outgassing or ion criteria


Successful performance history
Multiple Applications Heritage

ENGINEERING MATERIALS
General
Purpose

NuSil
Product
Number

Cure
System

Comments

Work
Time

Tack
Free
Time

Cure Time /
Temp C

Specific Durometer
Gravity
Type A

Tensile
psi (MPa)

Elongation
%

Tear ppi
(kN/m)

Lap Shear Dielectric


Strength
psi (MPa)
V/mil

Flow (Inches)
Viscosity (cP/mPasec)
Extrusion (g/min)

Mix
Ratio

Color

TWO PART
GELS

MOLD LIQUID SILICONE RUBBERS


MAKING
THREE
(LSR)
PART

ADHESIVES & SEALANTS

ONE PART

COATINGS

Properties listed are typical - Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations.

R -1009
R -1082
R 3-1075
R -1182
R -2180
R -2180-2
R -2182
R -2183
C F 19-2615
R -1130
R -1140
R 2-1140
R 4-1140
R -1400
R -1600
R -2140
R -2145
R 1-2145
R -2160
R -2175
C F 15-2186
C F 19-2186
R -2186
R -2186-2
R 28-2186
R 31-2186
R 32-2186
R 33-2186
R 34-2186
C F 1-6755
R -2185
C F 2-2186
C F 16-2186
C F 20-2186
R -2188
R -2550
R -2560
R -2588
R -2615
R -2615-3
R 21-2615
R -2620
R -2652
R -2655
R -2684

D ispersion C oating / C onform al, 32% S olids


D ispersion C oating / C onform al, 29% S olids
D ispersion C oating / C onform al, 60% S olids

O xim e
A cetoxy
O xim e
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
O xim e
A cetoxy
A cetoxy
A cetoxy
P latinum
O xim e
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latin um
P latinum
P latinum
Alkoxy
Alkoxy
Alkoxy
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum

> 72 h
> 24 h
4h
4h
15 m
60 m
50 m
1h
1m
15 m
2.5 h
3h
6m
15 m
15 h
2h
18 h
2h
1h
2h
15 m
3h
14 h
6h
1h
4h
2h
2h
4.6 m
10 m
5h
30 m

90 m
80 m
25 m
7m
9m
10 m
30 m
3.5 h
24 h
12 h
-

7 d / R .T ., H
5 d / R .T ., H
7 d / R .T ., H
S ee C om m ents
S ee C om m ents
S ee C om m ents
S ee C om m ents
30 m / 150
7 d / R .T ., H
72 h / R .T ., H
7 d / R .T ., H
72 h / R .T ., H
15 m / 200
7 d / R .T ., H
5 m / 177
2 h / 65
2 h / 65
30 m / 150
60 m / 150
24 h / R .T ., H
30 m / 150
15 m / 150
15 m / 150
30 m / 150
24 h / R .T ., H
15 m / 150
24 h / R .T ., H
15 m / 120
30 m / 150
30 m / 150
10 m / 150
60 m / 100
60 m / 100
30 m / 150
7 d / R .T ., H
7 d / R .T ., H
7 d/ R .T ., H
15 m / 150
30 m / 150
2 h / 50
30 m / 150
60 m / 100
60 m / 100
24 h / R .T ., H

1.10
1.09
1.06
0.96
1.10
1.09
1.03
1.12
1.18
1.10
1.09
1.17
1.16
1.20
1.11
1.12
1.15
1.12
1.12
1.12
1.12
1.09
1.14
0.96
1.10
1.12
1.10
1.05
1.08
1.41
1.44
1.03
1.06
1.07
1.22
1.01
1.03
1.12

45
25
40
40
45
35
30
35
30
23
25
19
45
40
45
45
20
50
25
25
30
35
25
20
15
20
48
30
40
20
30
30
20
35
55
65
50
50
80
60
See C om m ents
40
25

1,150 (7.9)
1,425 (9.8)
700 (4.8)
1,700 (11.7)
1,650 (11.4)
1,550 (10.7)
120 (0.9)
850 (5.9)
700 (4.8)
250 (1.7)
1,400 (9.7)
825 (5.7)
650 (4.5)
850 (5.9)
1,050 (7.2)
1,000 (6.9)
750 (5.2)
525 (3.5)
1,200 (8.3)
1,100 (7.6)
1,050 (7.2)
1,050 (7.2)
1,150 (7.9)
1,000 (6.9)
975 (6.7)
1,000 (6.9)
830 (5.7)
675 (4.7)
500 (3.4)
900 (6.2)
1,175 (8.1)
1,100 (7.6)
475 (3.3)
500 (3.5)
700 (4.8)
750 (5.2)
1,300 (9.0)
1,000 (6.9)
1,200 (8.3)
1,290 (8.9)
50 (0.3)
900 (6.2)
1,400 (9.7)

650
950
350
1,050
1,000
800
100
325
350
350
750
750
300
320
400
400
625
1,030
625
600
450
450
650
775
850
725
340
275
280
600
550
600
350
175
125
95
100
100
65
85
130
120
1,200

95 (16.8)
125 (22.0)
40 (7.1)
300 (52.9)
300 (52.9)
175 (30.9)
40 (7.1)
40 (7.0)
20 (3.5)
100 (17.6)
110 (19.4)
60 (11.4)
150 (25.5)
150 (26.5)
190 (33.5)
150 (25.5)
100 (17.6)
80 (14.1)
100 (17.6)
100 (17.6)
75 (13.2)
125 (21.2)
125 (21.2)
150 (26.5)
70 (12.3)
40 (7.1)
65 (11.5)
70 (12.3)
80 (14.1)
80 (14.1)
20 (3.5)
20 (3.5)
35 (6.2)
180 (17.6)

*1 )
485 (3.6)
*1 )
625 (4.3)
*1 )
235 (1.6)
*1 )
205 (1.4)
*2 )
600 (4.1)
*2 )
625 (4.3)
*2 )
330 (2.3)
*2 )
475 (3.3)
110 (0.8)
150 (1.0)
385 (2.7)
675 (4.7)
-

1,250
500
400
825
825
500
500
730
640
500
730
905
905
500
900
900
450
500
830
500
500
500

6,150
700
3,300
3,075
3,275
Z ahn C up, C up #2, 15 sec
850
A :1,300 / B :800
0.5 Inches
1.5 Inches
3 Inches
2 inches
400,000
N on-slum p
A :120,000 / B :270
A :310 g/min / B :280 g/min
A :280 g/min / B :290 g/min
A :250,000 / B :650
A :2,500 / B :1,500
A : 80,000 / B : 50,000
A :80,000 / B :65,000
A :83,000
A :85,000
A :0.02 Inches
A :82,000 / B :T hixotropic
A :80,000 / B :T hixotropic
A :83,500
9.0 g/min
A :40,000 / B :35,000
A :96,000
A : 38,000 / B : 18,000
A :70,000
A :80,000 / B : 50,000
A : 13,500 / B : 9,000
9,000
31,000
825,000
A :6,000 / B :90
A :6000 B :2500
A :30,000 / B :20,000
9,600
4,000
5,400
7,225

1:1
1:1
1:1
1:1
1:1
10:1
1:1
1:1
10:1
1:1
1:1
1:1
10:1
10:1
1:1
1:1
1:1
1:1
1:1
1:1
10:1
10:1
10:1
1:1
1:1
100:0.5
100:0.5
100:3.8
10:1
1:1
1:1
10:1
10:1
10:1
2-Part

T rans
T rans
T rans
T rans
T rans
B lack
T rans
T rans
C lear
T rans
T rans
T rans
T rans
B lack
C lear
G ray
G ray
G ray
R ed
B lack
T rans
T rans
T rans
B lack
T rans
T rans
T rans
T rans
T rans
C lear
W hite
T rans
T rans
T rans
T rans
T rans
R ed
R ed
C lear
R ed
C lear
T an
C lear
C lear
T rans

B etter A dhesion to P olycarbonate

P latinum

30 m / 150

1.14

20

550 (3.8)

325

25 (4.4)

A :48,500 / B :40,000 / C :1,350

1:1:0.1

C lear

LS R -5805
LS R -5810
LS R -5815
LS R -5820
LS R -5830
LS R -5840
LS R -5850
LS R -5860
LS R -5870
LS R -5880

Liquid Injection M olding, Low D urom eter


Liquid Injection M olding
Liquid Injection M olding
Liquid Injection M olding
Liquid Injection M olding
Liquid Injection M olding
Liquid Injection M olding
Liquid Injection M olding
Liquid Injection M olding
Liquid Injection M olding, H igh D urom eter

P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum

> 72
> 72
> 72
> 72
> 72
> 72
> 72
> 72
> 72
> 72

h
h
h
h
h
h
h
h
h
h

5
5
5
5
5
5
5
5
5
5

1.08
1.07
1.10
1.14
1.13
1.12
1.15
1.16
1.16
1.20

7
11
15
20
30
40
50
60
70
80

450 (3.1)
750 (5.2)
1,000 (6.9)
900 (6.2)
1,250 (8.6)
1,100 (7.6)
1,400 (9.7)
1,300 (9.0)
1,350 (9.3)
950 (6.6)

1,050
1,075
1,000
850
750
550
660
525
400
250

60 (10.6)
70 (12.3)
125 (22.0)
125 (22.0)
140 (24.7)
250 (44.1)
235 (40.6)
260 (45.9)
225 (35.2)
85 (15.0)

50 g/m in
A :80 g/min / B : 110 g/min
A :45 g/min / B :65 g/min
A :40g/min / B :50 g/min
A :100 g/min / B :120 g/min
A :160 g/min / B :300 g/min
A :45 g/min / B : 75 g/min
A :45 g/min / B :110 g/min
A :25 g/min / B :70 g/min
A :25 g/min / B :110 g/min

1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1

T rans
T rans
T rans
T rans
T rans
T rans
T rans
T rans
T rans
T rans

R -2200-11

C asting, C reating M olds

P latinum

> 2.5 h

30 / 150

1.24

60

800 (5.5)

155

90 (15.9)

A :150,000 / B :3,600

10:1

G ray

0.97
0.97
0.97
-

500
500
500
500

535
500
14,500
600
650

1:1
1:1
1:1
1:1
1:1

C lear
C lear
C lear
C lear
C lear

C ure: 30 M / 25 C : 45 M / 75 C : 135 M / 150 C , Ice P hobic, 20% S olids


C ure: 30 M / 25 C : 45 M / 75 C : 135 M / 150 C , Ice P hobic, 20% S olids
L ow CoF, Non - blocking, Cure: 5 m / R .T ., H : 5 m / 150
C ure: 30 M / R .T ., H : 45 M / 75 C : 135 M / 150 C
S olventless
A dhesive, N on-slum p
A dhesive, N on-slum p
A dhesive, S elf-leveling
A dhesive
Low D urom eter, N on F low able, G lob T op
Low / H igh T em perature, E ncapsulant
H igh T ear
E xtrem ely T ough , F ast C ure E lastom er
Longer W ork T im e, Y oung's M odulus 300 psi (2.1 M P a)
H igh T em perature E lastom er
Thermally Stable Silicone P otting E lastom er
S hort W ork T im e, Q uick C ure E lastom er
Longer W ork T im e, Low D urom eter
A ll P urpose, H igh T ear E lastom er
A ll P urpose, H igh T ear E lastom er
N on-slum p
F low able, F ast C ure A dhesive
F low able, F ast C ure A dhesive, Longer W ork T im e
F low able, Longer W ork T im e, A dhesive
F ast C ure A dhesive
T ough E lastom er
Flowable, Light-weight Elastomer
M edium V iscosity, A ll P urpose P otting & E ncapsulant
M edium w ork tim e, Q uick C ure E lastom er
Longer W ork T im e
High Power Electronics
Low V iscosity, A ll-purpose, T ough E lastom er
Low /H igh T em perature, F low able
H igh T em perature, G ood A dhesion
M edium D urom eter
Low V iscosity
P ost C ure D urom eter T ype A 75
Low viscosity, H igh D urom eter, Q uartz F illed
Low D urom eter - T ype '00' 65
Low / H igh T em perature E lastom er
S prayable F ilm A dhesive

R 2-6755

G E L-8100
G E L-8150
G E L1-8155
G E L-8170
G E L-8250

M edium G E L, P enetration 10 m m
F irm G E L, P enetration 0.4 m m , Longer W ork T im e
F irm G E L, P enetration 5 m m
H igh P urity, V olum e R esistivity 1x10 1 5 ohm cm
Low / H igh T em perature, P enetration 5 m m

= Designed for Broad Operating Temperatures

P latinum
P latinum
4h
P latinum
P latinum
P latinum
2h
d = day
h = hour
m = m inutes

m
m
m
m
m
m
m
m
m
m

/
/
/
/
/
/
/
/
/
/

150
150
150
150
150
150
150
165
165
165

60 m / 100
30 m / 100
30 m / 150
90 m / 80
30 m / 100
R .T . = R oom
T em perature
H = H um idity

P rim ed w ith S P -120


P rim ed w ith C F 1-135
*3)
P rim ed w ith S P -270
*1)

*2)

g/min = G ram s P er M inute

T rans = T ranslucent

ENGINEERING MATERIALS
General
Purpose

NuSil
Product
Number

Cure
System

Comments

Work
Time

Tack
Free
Time

Cure Time /
Temp C

Specific
Gravity

Durometer
Type A

Tensile
psi (MPa)

75
60
40
80
60
80
70
90
75
20
35
35
30
30
30
10
40
35
40
35
30
30
50
35
25

100 (.069)
525 (3.6)
700 (4.8)
600 (4.5)
250 (1.7)
210 (2.1)
260 (1.7)
300 (2.1)
700 (4.8)
275 (1.9)
185 (1.2)
750 (5.2)
600 (4.1)
700 (4.8)
550 (3.8)
500 (3.4)
1,150 (7.9)
850 (5.9)
700 (4.8)
600 (4.1)
450 (3.1)
850 (5.9)
125 (0.9)
850 (5.9)
425 (2.9)

Tear
ppi (kN/m)

Lap
Shear
psi (MPa)

Dielectric
Strength
V/mil

Flow (Inches)
Viscosity (cP/mPa sec)
Extrusion (g/min)

Mix
Ratio

Color

25
90
275
90
275
20
70
35
50
135
325
265
360
275
260
335
425
275
400
400
300
50
400
400

35 (6.2)
50 (8.8)
50 (8.8)
45 (7.9)
65 (11.5)
45 (7.9)
35 (6.2)
35 (6.2)
60 (10.6)
60 (10.6)
50 (8.8)
50 (8.8)
40 (7.1)
40 (7.1)
50 (8.8)
35 (6.2)

195 (1.3)
*2 )
350 (2.4)
*2 )
380 (2.6)
200
-

190
190
10
10
5
880
810
450
920
400
-

A :55,000 / B :50,000
A :4,100 / B :5,300
4,700
3,600
N on-slum p
20,000
100 g/m i n
90 g/m i n
P aste
P aste
A :70,000
P aste
A :75,000
A :12,000 / B :10,500
A :70,000 / B :10
P aste
A :90 g/m i n / B :150 g/m i n
240,000
1,200
A :40 g/m i n / B :35 g/m i n
350, 1,000 and 12,500
T hixotropic
T hixotropic
230 g/m i n
250 g/m i n
P aste
1,625

1:1
1:1
1:1
100:6
100:6
1 P art
10:1
1:1
100:0.5
20:1
15:1
15:1
20:1
15:1
1:1
10:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
15:1
-

G ray
T rans
G ray
T an
T an
B lack
B lack
B lack
T an
T an
W hite
W hite
G ray
W hite
T rans
R ed
T rans
B lack
T rans
B lack
G ray
W hite
T rans
T rans
G ray
W hite
G ray
T rans
T rans
T rans
W hite
T rans
T rans

A :800 / B :2,850

1:1

B lack
C lear
C lear
T rans
T rans
T rans
G ray
T rans
T rans
G ray
C lear
C lear
W hite
C lear
R ed
T rans
C lear
C lear
T rans
R ed
T rans
T rans
T rans

Elongation %

SILICONE
RESINS

PRIMERS

GREASES

FLUIDS

INKS

FLUOROSILICONES

THERMALLY ELECTRICALLY
CONDUCTIVE CONDUCTIVE

SILICONE
FOAMS

Properties listed are typical - Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations.

F lam e R esistant, 25 lb/ft 3 (0.400 g/cm 3 )


3
H igh S trength, S oft, 40 lb/ft 3 (0.640 g/cm )
3
3
F lam e R esistant, 28 lb/ft (0.450 g/cm )
Low D ensity, S oft, 10 lb/ft 3 (0.16 g/cm 3 )
M edium D ensity, S oft, 19 lb/ft 3 (0.31 g/cm 3 )
8 ohmcm , Static Dissipation
7 ohm cm , Low Viscosity
50 ohm cm , Low D urom ter, T ough
0.001 ohm cm , Low / H igh T em perature
0.006 ohm cm
*2 2 ) 1.46 W /m K
*2 2 )
0.75 W /m K
*2 2 )
0.84 W /m K , H igh D urom eter
*2 2 )
0.75 W /m K , Low / H igh T em perature
F uel R esistant G el, D urom eter -T ype '00' 50
F uel / S olvent R esistant, 100 m %
F ast C ure
F uel R esistant
Liquid Injection M olding, F uel R esistant
Liquid Injection M olding, F uel R esistant
S olvent R esistant
Fuel Resistant White Gel, 100 m %
Liquid Injection Molding Fluorosilicone, 1 00 m %
F luid, V olum e R esistivity 1x101 5 ohm scm
F uel / S olvent R esistant F oam , 50 lb/ft 3 (800 K g/m 3 )
A vailable in G ray / B lack / T ranslucent , 100 m %
Lap Shear after 7 days, 1) 275 psi (1.9 MPa), 100 m %
F uel R esistant, 100 m %
H igh T em perature, F uel R esistant
Extrusion o r C o m p re s s io n M o ld in g , P re c a talyzed
*2 2 )
T herm ally C onductive 1.25 W /m K , F uel R esistant
D ispersion C oating, Sprayable, 100 m %
H igh T em perature, D ispersion C oating Sprayable

S F M 5-2350
R 1-2354
R -2356
R -2370
R -2380
R -1505
R -2630
R -2631
R -2634
R -2637
R -2930
R -2939
R -2940
R -2949
G E L-3500
C F 1-3510
C F 2-3521
C F 2-3521-2
C F 3-3521
C F 5-3521-2
R 7-3521-11
F S -3502-1
F S -3511
F S -3606
C F 1-3710-2
F S -3730
F S -3730-11
F S 3-3730
F S -3775
F S -3781
C F 1-3800
R -3930
R -3975
R -2100-2

F ast C ure

S -7200
S -7201
S -7205
S -7400
S -7402
G -9000
G -9010
G -9020
G -9030
G -9040
G -9200
G -9340
S P -120
S P -121
S P -124
C F 1-135
C F 2-135
C F 6-135
C F 1-141
S P -142
S P -270
S P -271

V iscosity up to 7 M illion cps, V olatility 2% m ax.


Meets to F E D S pec. V V -D -1078
K inem atic V iscosity 0.62 cS t
Low / H igh T em perature, V olatile C ontent 4% m ax.
Low /H igh T em p, V olatile C ontent 3% M ax
V olatility 0.3% m ax.
S tiff C onsistency G rease, V olatile C ontent 0.2% m ax.
V olatility 0.3% m ax.
S tiff C onsistency,V olatile C ontent 0.3% m ax.
Low V iscosity, V olatile C ontent 0.5%
S tiff C onsistency G rease
T herm ally C onductive
G eneral P urpose, 4.0 % S olids
G eneral P urpose, 3.5% S olids
C ondensation C ure S ystem s, 10% S olids
A ddition C ure S ystem s, 4.5% S olids
A ddition C ure S ystem s, 4.5% S olids
A d d itio n C u re S ys te m s , In h ib itin g E n viro nm e n ts , 8 .5 % S o lid s
A ddition C ure S ystem s, D ispersed in IP A , 6% S olids
A ddition C ure S ystem s, 15% S olids
A ddition C ure S ystem s, D ifficult S ubstrates, 15% S olids
A ddition C ure S ystem s, D ifficult S ubstrates, 20% S olids

C F -4721

75 T ype D w ith D icum yl P eroxide C atalyst (C atalyst N ot Included)

C F 2-4721

75 T ype D , P recatalyzed
*22)

T ested per A S T M E1530

= Designed for Broad Operating Temperatures

P latinum
P latinum
P latinum
Alkoxy
Alkoxy
O xim e
P latinum
P latinum
Alkoxy
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinu m
P latinum
P latinum
P latinum
A cetoxy
A cetoxy
A cetoxy
A cetoxy
P eroxide
P latinum
A cetoxy
A cetoxy

23 m
11 h
8h
3h
4h
3h
4h
5h
3.5 h
12 h
7h
60 m
12 h
3.5 h
60 m
24 h
90 m
-

10 m
24 h
10 m
30 m
15 m
15 m
8m
-

45 m / 100
10 m / R .T .
15 m / R .T .
10 m / R .T ., H
10 m / R .T ., H
7 d / R .T ., H
30 m / 150
60 m / 65
7 d / R .T ., H
30 m / 150
30 m / 150
30 m / 150
30 m / 150
30 m / 150
45 m / 150
30 m / 150
30 m / 150
48 h / R .T .
30 m / 150
48 h / R .T .
48 h / R .T .
4 h / 50
30 m / 150
1 to 4 h / R .T .
72 h / R .T ., H
72 h / R .T ., H
72 h / R .T ., H
72 h / R .T ., H
30 m / 120
30 m / 150
72 h / R .T ., H
72 h / R .T ., H

0.35
0.45
0.35
0.34
1.23
1.10
1.07
3.36
3.60
1.55
1.34
2.41
1.44
1.30
1.28
1.26
1.30
1.27
1.39
1.40
1.48
1.35
1.29
1.33
1.53
1.36
1.29

P latinum

5 m / 150

H ydrolysis
H ydrolysis
H ydrolysis
H ydrolysis
H ydrolysis
H ydrolysis
H ydrolysis
H ydrolysis
H ydrolysis
H ydrolysis

P eroxide

d = day
h = hour
m = m inutes

1
1
1
1
1
1
1
1
1

h
h
h
h
h
h
h
h
h

/
/
/
/
/
/
/
/
/

R .T .,
R .T .,
R .T .,
R .T .,
R .T .,
R .T .,
R .T .,
R .T .,
R .T .,
-

H
H
H
H
H
H
H
H
H

15 m / 150

R .T . = R oom
T em perature
H = H um idity

S ee Com m ents

400
400
400
500
-

U p to 7 M illion c P
2 M illion and 2.5 M illion cP
40,000 to 2.5 M illion cP
M edium G rease
1,100,000
M edium G rease
980,000
Liquid
H eavy G rease
M edium G rease
1.0 cP
1.0 cP
1.0 cP
1.0 cP
1.0 cP
1.0 cP
1.0 cP
1.0 cP
1.0 cP
1.0 cP

See C om m ents

125

Lt. A m ber

See C om m ents

130

Lt. A m ber

1.00
0.98
1.01
1.01
1.11
1.14
1.08
1.11
0.97
1.12
2.26
0.77
0.77
0.78
0.77
0.77
0.78
0.80
0.80
0.77
0.80

1.10
1.09

*1)
*2)

P rim ed w ith S P -120


P rim ed w ith C F 1-135

g/min = G ram s P er M inute

T rans = T ranslucent

CONTROLLED VOLATILITY MATERIALS


General
Purpose

NuSil
Product
Number

Comments

ULTRA LOW
OUTGASSING

Materials are tested in accordance with ASTM E 595


Total Mass Loss (TML) of 0.10% and Collected Volatile Condensable Materials (CVCM) of 0.01%

S C V -2585
S C V -2586
S C V -2590
S C V -2590-2
S C V 1-2590
S C V 2-2590
S C V -2596
S C V 1-2596
S C V 1-2599
S C V 2-2599

P ourable E lastom er, *4) P rim ed Lap S hear 475 psi (3.3 M P a)
F ast C ure, Low D ensity, P rim ed Lap S hear 175psi
P ourable
Low V iscosity, F ast C ure
*4)
P rim ed Lap S hear 175 psi (1.2 M P a)
Low / H igh T em perature, *4) P rim ed Lap S hear 250 psi (1.7 M P a)
E lectrically C onductive, 2.5 ohm cm , C arbon F iber F illed
E lectricaly C onductive, 0.005 ohm cm ,*21, 22) 1.2 W /m K
T herm ally C onductive,*22) 1.60 W /m K
*22)
0.64 W /m K

TWO PART

ADHESIVES & SEALANTS

ONE PART

COATINGS

Controlled volatility or low out-gassing materials are tested in accordance with ASTM E 595
Total Mass Loss (TML) of 1.0% and Collected Volatile Condensable Materials (CVCM) of 0.10%

C V -1144-0
C V 1-1144-0
C V 3-1144-1
C V -1146-2
C V 2-1147
C V -1148
C V 1-1148
C V -1152
C V -1142
C V 1-1142
C V 1-1142-4
C V 2-1142
C V 3-1142
C V 7-1142-1
C V 9-1142
C V -1143
C V -2189-2
C V -2187
C V -2287
C V -2289
C V -2289-1
C V -2289-2
C V 1-2289-1
C V 2-2289-1
C V 3-2289-1
C V 4-2289-1
C V 7-2289-1
C V -2500
C V -2500-2
C V 3-2500
C V 4-2500
C V 10-2500
C V 14-2500
C V 15-2500
C V 16-2500
C V -2502
C V -2510
C V -2566
C V 1-2566
C V 2-2566
C V -2567
C V -2568
C V 10-2568

60% S olids, A tom ic O xygen P rotective O vercoat


50% S olids
60% S olids
72% S olids
60% S olids, N on-blocking O vercoat
70% S olids
40% S olids
P rotective O vercoat, 100% S olids
S pot B onding, A vailable in B lack & W hite
S elf-leveling, A vailable in B lack & W hite
S elf-leveling, B uilt-in U V T racer
A vailable in B lack & W hite
S pot B onding, A vailable in B lack & W hite
F low R ate 0.7" w ith 0.375" P lunge
H igh D urom eter, Lo D ensity
N on-S lum p
Thixotropic
T ough, F low able, F ast C ure
Low / H igh T em perature, F low able, F ast C ure
Lap S hear 400 psi
P ourable E lastom er
P ourable E lastom er
*4)
P rim ed Lap S hear 450 psi (3.1 M P a)
Low V iscosity,*4) P rim ed Lap S hear 300 psi (2.1 M P a)
Low V iscosity, A dded M icro-baloons for B ond Line C ontrol
N on-flow able
P rim erless A dhesion
P ourable, O ptically C lear
Low V iscosity, F ast C ure
Low V iscosity, P otting & E ncapsulant, O ptically C lear
Low D urom eter, Low V iscosity, O ptically C lear
H igh D urom eter, O ptically C lear
P rim erless A dhesion
*4)
P rim ed Lap S hear 225 psi (1.6 M P a), O ptically C lear
Low / H igh T em perature,*4) P rim ed Lap S hear 200 psi (4.1 M P a), O ptically C lear
Low F low
Low / H igh T em perature, F low able
P ourable R T V C ure, *1) P rim ed Lap S hear 500 psi (3.4 M P a)
*1)
P rim ed Lap S hear 650 psi (4.5 M P a)
*2)
P rim ed Lap S hear 625 psi (4.3 M P a)
D iluent for T in C ondensation C V S ilicones
Long W orktim e, Low D ensity *1), P rim ed Lap S hear 100 psi (0.69 M P a)
F ast C ure, Low D ensity,*4) P rim ed Lap S hear 175 psi (1.2 M P a)
*1)
= Designed for Broad Operating Temperatures
P rim ed w ith S P -120
*2)
Primed with SP-121
*4)
Primed with C F 1 - 1 3 5
*21)
T ested per A S T M C 1045
*22)
T ested per A S T M E 1530

Cure
System

Work
Time

Tack Free
Time

Cure Time
/ Temp C

Specific
Gravity

P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum

1h
4h
4.5 h
4h
2h
2.5 h
2h
3h

15 m / 150
30 m / 150
15 m / 150
30 m / 150
15 m / 150
4 h / 65
30 m / 150
30 m / 150
7 d / R .T ., H
30 m / 150

0.74
1.02
1.06
1.02
1.04
1.19
3.42
1.53
-

35
45
45
50
50
45
75
85
75
55

O xim e
O xim e
O xim e
O xim e
O xim e
O xim e
O xim e
O xim e
O xim e
O xim e
O xim e
O xim e
O xim e
O xim e
O xim e
O xim e
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
Alkoxy
Alkoxy
Alkoxy
Alkoxy
Alkoxy
Alkoxy
P latinum

7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
15 m / 200
15 m / 150
30 m / 150
15 m / 150
15 m / 150
15 m / 150
15 m / 150
4 h / 65
7 d / R .T . , H
30 m / 150
15 m / 150
15 m / 150
30 m / 150
30 m / 150
60 m / 65
15 m / 150
60 m / 65
15 m / 150
4 h / 65
7 d / R .T . , H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
30 m / 150
H = H um idity

1.00
1.11
1.26
1.12
1.34
1.07
1.01
1.11
1.06
1.05
1.11
1.13
0.82
1.10
1.15
1.10
1.11
1.10
1.02
1.05
1.02
1.02
1.01
1.02
1.04
1.06
1.19
1.49
1.45
1.50
1.01
0.64
0.76

45
30
35
50
45
40
55
45
17
35
30
30
30
30
30
30
35
30
30
50
50
40
25
50
30
50
40
40
45
55
50
55
21
50
40

Durometer
Type A

Tensile
Elongation
Tear
psi (MPa)
%
ppi (kN/m)

CTE
ppm/C

Dielectric
Strength
V/mil

Flow (Inches)
Viscosity (cP/mPasec)
Extrusion (g/min)

Mix
Ratio

Color

Properties listed are typical - Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations.

50 m
10 m
1h
2h
1h
40 m
50 m
20 m
15 m
20 m
25 m
15 m
3h
15 h
3.5 h
30 m
4h
30 m
5h
20 h
12 h
30 m
10 h
2h
10 h
3h
6h
3h
6h
2h
15 h
3h
5h
3h
6h
2h
4h
3h
3h
2h
6.5 h
4h
3h
h = hours
m = m inutes

700
225
950
950
925
4 75
475
450
200
400

(4.8)
(1.6)
(6.6)
(6.6)
(6.4)
(3.3)
(3.3)
(3.1)
(1.4)
(2.8)

300
150
125
150
90
85
90
30
225

40 (7.1)
55 (9.7)

370
400
490
580
215
225
-

850
540
-

A : 56,000 / B : 43,000
A : 375,000 / B : 275,000
A :8,000
A :9,500
A :3,800 / B :2,800
A :3,500
P aste
P aste
140 g/min

700 (4.8)
400 (2.8)
350 (2.4)
675 (4.7)
700 (4.8)
400 (2.8)
800 (5.5)
750 (5.2)
925 (6.4)
725 (5.0)
750 (5.2)
700 (4.8)
750 (5.2)
750 (5.2)
450 (3.1)
175 (1.2)
650 (4.5)
700 (4.8)
1,000 (6.9)
950 (6.6)
950 (6.6)
1,000 (6.9)
425 (2.9)
850 (5.9)
650 (4.5)
800 (5.5)
600 (4.1)
950 (6.6)
900 (6.2)
900 (6.2)
80 (0.6)
175 (1.2)
235 (1.6)

300
200
200
300
300
85
400
700
400
400
350
350
400
350
250
125
400
375
125
150
100
130
150
90
100
200
200
150
160
140
150
60
170

60 (10.6)
55 (9.7)
75 (13.2)
55 (9.7)
50 (8.8)
40 (7.1)
40 (7.1)
-

320
320
535
445
370
400
490
330
180
245

845
1,100
500
1,180
900
955
850
825
645
860

240
850
900
2,400
2,000
7,500
5,000
7,300
35 g/min
13,000
60 g/min
Non-slump
Non-slump
20 g/min
35 g/min
Non-slump
225,000
90,000
85,000
A :60,000 / B :40,000
A :65,000 / B :40,000
A :65,000 / B :40,000
A :14,000 / B :10,500
A :15,000 / B :14,000
A : 1,300,000 / B : 1,000,000
A : 57,500 / B :400,000
A :8,000
8,500
3,000
1,500
7,500
2,600
A :3,750 / B :2,700
A :3,600
0.3 Inches
45,000
55,000
45,000
T hixotropic
5,000
125,000
A :125,000 / B :80,000

g/min = G ram s P er M inute

1:1
1:1
10:1
10:1
1:1
10:1
10:1
20:1
15:1
20:1

T rans
R ed
C lear
B lack
C lear
C lear
B lack
T an
W hite
W hite

T rans
C lear
W hite
B lack
T rans
B lack
B lack
C lear
T rans
T rans
T rans
T rans
T rans
W hite
W hite
T rans
B lack
10:1
T rans
10:1
T rans
T rans
1:1
1:1
W hite
1:1
B lack
1:1
W hite
1:1
W hite
1:1
W hite
1:1
W hite
1:1
W hite
10:1
C lear
10:1
B lack
10:1
C lear
1:1
C lear
1:1
C lear
1:1
T rans
1:1
C lear
10:1
C lear
10:1
T rans
100:0.5
W hite
100:0.5
R ust
100:0.5
R ed
100:0.5
R ed
C lear
100:0.5
100:0.5
R ed
1:1
R ed
T rans = T ranslucent
C le a r = C le a r to
T ra ns p a re n t

CONTROLLED VOLATILITY MATERIALS


General
Purpose

NuSil
Product
Number

Cure
System

Comments

Work
Time

Tack Free
Time

Elongation
Tear
Cure Time Specific Durometer Tensile
psi (mPa)
%
ppi (kN/m)
/ Temp C Gravity Type A

FILMS
TAPES PRESSURE
SENSITIVE

PRIMERS

FOAMS

GELS

FILM ADHESIVES

DAMPENING
FLUIDS,
LUBRICANTS &
GREASES

THERMALLY CONDUCTIVE

ELECTRICALLY
CONDUCTIVE / STATIC
DISSAPATIVE

Materials are tested in accordance with ASTM E 595


Total Mass Loss (TML) of 1.0% and Collected Volatile Condensable Materials (CVCM) of 0.10%

100% S olids
3.0 ohmcm,*1) Primed Lap Shear 325 psi (2.2 MPa),*22) 0.32 W/mK
*4)
2.5 ohmcm, Primed Lap Shear 250 psi (1.7 MPa), Carbon Fiber Filled
25 ohmcm , Pumpable
Carbon Black Filled
6
2.2 x 10 ohmcm
*22)
0.005 ohmcm, 1.2 W/mK
0.004 ohmcm
Electrically Conductive, 0.007 ohmcm
0.005 ohmcm
*21, 22)
0.003 ohmcm,
1.5 W/mK , Remains Conductive at High Temperature
*22)
0.6 W/mK, Low Temperature
*22)
*4)
1.0 W/mK, Primed Lap Shear 375 psi (2.6 MPa)
*22)
*3)
1.2 W/mK, Primed Lap Shear 475 psi (3.3 MPa)
*22)
*4)
1.5 W/mK , Primed Lap Shear 160 psi (1.1 MPa)
*22)
0.6 W/mK, Thin Bond Line
*22)
*3)
2.0 W/mK, Primed Lap Shear 150 psi (1.0 MPa)
*22)
*4)
0.8 W/mK, Primed Lap Shear 205 psi (1.4 MPa), Low Viscosity
*22)
1.1 W/mK
*22) 1.0 W /mK , *5) P rim ed Lap S hear 120 ps i (0.8 MPa)

C V 2-1148
C V -1500
C V -2640
C V 1-2640
C V 2-2640
C V 3-2640
C V -2644
C V 2-2644
C V -2646
C V 1-2646
C V 2-2646
C V -2900
C V -2942
C V -2943
C V -2946
C V 2-2946
C V -2948
C V -2960
C V 1-2960
C V 1-2964
C V -2961
C V -2963
C V -7300

*22)

Volume Resistivity, 125 ohmcm, Lap Shear 70 psi (0.48 MPa)

CV-2681-12

Dielectric
Strength
V/mil

Flow (Inches)
Viscosity (cP/mPasec)
Extrusion (g/min)

Mix
Ratio

Color

Properties listed are typical - Do not use as a basis for preparing specifications. Please contact NuSil Technology for assistance and recommendations.

Thermally Conductive
15
Volume Resistivity 1x10 ohmcm, Thermally conductive
Thermally Conductive
0.012 inches (305 microns) Thick, 2-Part Film, Lap Shear 250 psi (1.7 MPa)

C V -9042
C V -9052
C V -9341
C V -2680-12

O xim e
O xim e
P latinum
P latinum
P latinum
P latinum
P latinum
P latinum
Alkoxy
Alkoxy
Alkoxy
O xim e
P latinum
Alkoxy
P latinum
P latinum
Alkoxy
P latinum
P latinum
P latinum
P latinum
P latinum
-

2h
60 m
3h
2.5 h
3.5 h
2.5 h
2h
2.5 h
2h
2h
3h
2.5 h
1.5 h
2h
2h
2h
-

10 m
10 h
40 m
4h
4.5 h
3h
4h
13 h
-

7 d / R .T ., H
7 d / R .T ., H
30 m / 150
2 h / 65
24 h / R .T ., H
7 d / R .T ., H
30 m / 150
30 m / 150
10 d / R .T ., H
7 d / R .T ., H
7 d / R .T ., H
72 h / R .T ., H
24 h / R .T ., H**
7 d / R .T ., H
7 d / R .T ., H
30 m / 150
7 d / R .T ., H
7 d / R .T ., H
4 h / 65
15 m / 150
30 m / 150
4 h / 65
4 h / 65
4 h / 65

P latinum

4h

P latinum

4h

1.07
1.25
1.19
1.07
1.06
1.01
3.39
3.04
3.86
2.20
3.23
2.33
2.40
2.55
1.53
1.57
1.34

80
75
40
30
25
85
85
80
90
75
65
85
90
75
55
80
60

650 (4.5)
475 (3.3)
525 (3.6)
500 (3.4)
70 (0.9)
525 (3.6)
500 (3.4)
400 (2.8)
300 (2.1)
400 (2.8)
650 (4.5)
750 (5.2)
200 (1.4)
400 (2.8)
250 (1.7)
205 (1.4)

20
90
225
350
120
100
90
70
150
15
35
30
225
30
110

30 (5.3)
60 (10.5)
55 (9.7)
55 (9.7)
90 (15.9)
50 (8.8)
55 (9.7)
45 (7.9)
45 (7.9)

435
580
215
185
130
275

430
540
-

Non-slump
T hixotropic
A :300 g/min / B :150 g/min
A :1,250,000 / B :100,000
A :10,000 / B :10,000
P aste
P aste
0.9 inches
0 inches
4 inches
40 g/min
P aste
P aste
P aste
140 g/min
P aste
A :130,000

10:1
10:1
1:1
1:1
20:1
20:1
100:0.5
100:0.5
100:0.5
20:1
100:0.2
15:1
20:1
100:0.2
10:1

B lack
B lack
B lack
B lack
B lack
B lack
T an
T an
T an
T an
G ray/G reen
W hite
G ray
G ray
W hite
W hite
W hite
W hite

1.45
2.34
1.38
1.27
0.97
1.61

75
65
75
60
-

250 (1.7)
180 (1.2)
275 (1.9)
425 (2.9)
-

60
50
40
250
-

55 (9.7)
45 (7.9)
50 (8.8)
-

275
-

A :900,000
52,000
A :300,000
P aste
100 to 100,000
M edium G rease

10:1
1:1
10:1
20:1
-

W hite
W hite
W hite
W hite
C lear
W hite

1.10
2.30
-

465

M edium G rease
M edium G rease
-

2-Part

G rey
W hite
T rans

2-Part

B lack

3,000

C lear

C V -1161

50% Solids, 7.5 ppi Release Force

C V 2-1161

35% Solids, 2.5 ppi Release Force

P eroxide

1 h / 60 + 1 h / 175

A :16,000 / B :8,500

100:1

C lear

Non-VOC Solvent, Tert Butyl Acetate, 1.5 ppi Release Force

P eroxide

1,200

100:1

C lear

0.005 inches (127 microns) Double Side Tape, Kapton Center, 2.0 ppi

T rans

Low Viscosity, Penetration 4.0 mm


Penetration 0.4 mm
Low/High Temperature, Penetration 3 mm

P latinum
P latinum
P latinum

> 30 h
24 h

30 m / 150
30 m / 150
40 m / 150

2,500

1:1

C lear

2,500
1,800

1:1
1:1

C lear
C lear

P latinum

1 h / R .T . , H

3,000

1:10

W hite

H ydrolysis
H ydrolysis
H ydrolysis
H ydrolysis
H ydrolysis
H ydrolysis
H ydrolysis

1
1
1
1
1
1

0.79
0.77
0.77
0.77
0.80
0.77
0.80

1.0
1.0
1.0
1.0
1.0
1.0

C lear
C lear
R ed
C lear
R ed
T rans
Trans

C V 3-1161
C V 4-1161-5
C V -8151
C V 1-8151
C V -8251

Low density, Soft, 14lb/ft (0.224g/cm )

C V -2391
SP1-204
S P -120
S P -121
C F 2-135
C F 1-141
S P -270

1 and 2 P art R TV S ystem , 3.3% S olids


General Purpose, 4.0% Solids
General Purpose, 3.5% Solids
Addition Cure Systems, 4.5% Solids
Addition Cure Systems, IPA Based, 6% Solids
Addition Cure Systems, Difficult Substrates, 15% Solids

S P -271

Addition Cure Systems, Difficult Substrates, 20% Solids

*3)

0.8 W/mK Low Viscosity, Primed Lap Shear 205 psi (1.4 MPa), Low Temp
*22)
*4)
0.6 W/mK, Primed Lap Shear 275 psi (1.9 MPa)
Refractive Index 1.40

CTE
ppm/C

= Designed for Broad Operating Temperatures

P rim ed w ith S P -120


P rim ed w ith S P -130
*4)
P rim ed w ith C F 1-135
*5)
P rim ed w ith S P -270
*21)
T ested per A S T M C 1045
*22)
T ested per A S T M E1530
*1)

*3)

d = days
h = hours
m = m inutes

h
h
h
h
h
h

/
/
/
/
/
/

R .T .,
R .T .,
R .T .,
R .T .,
R .T .,
R .T .,
-

H
H
H
H
H
H

R.T. = Room Temperature


H = H um idity
** P ost-cure 15 m / 150

g/min = G ram s P er M inute

T rans = T ranslucent
C lear = C lear to T ransparent

10

MATERIALS

Product Name Legend

Index Matching

The key properties of NuSil Technologys LightSpan Materials can easily be distinguished by the product name.

LightSpan materials are very effective for index matching of common materials used in Optical Applications.
Some common materials, shown in the table below, use the following LS products for index matching.

The first digit of the product name represents the hardness of the optical silicone.
Material Type

Optical Gels (Soft to 00 Durometer): LS-3XXX


Optical Thermosets (Type A and D durometer): LS-6XXX
Optical Fluids (do not cure): LS-5XXX

Acronym
MgF2
SiO2
PMMA
BK
COC, COP

Magnesium Fluoride
Fused Silica
Acrylate
Borosilicate
Cyclic Olefin

For all materials, excluding primers, the last 2 digits of the product name are the last 2 digits of the refractive index
measured at 589 nm.

Refractive Index
1.38
1.46
1.49
1.52
1.52

LS Products
LS-3238
LS-3246
LS-3249
LS-3252
LS-3252

For example: LS-3351 is an optical gel when cured and the refractive index is 1.51.
General
Purpose

NuSil
Product
Number

OPTICAL GELS

L S -3 2 3 8

Resistant to Hydrocarbon Solvents


Low Volatility, Penetration 0.4 mm, non-phenyl containing
Very Soft, Penetration 9.0 mm, non-phenyl containing
Firm and Tacky Gel, Penetration 0.4 mm, non phenyl containing
Soft and Tacky Gel, Penetration 5 mm
Index matches to glass such as fused silicates (Glass, Quartz)
Index matches to acrylates such as PMMA
Use with Phosphor,Index matches to Crown Glass such as BK7
Index matches to plastics such as COC
Low Viscosity and 1.52 RI, Index Matches BK7, GlassUse with Phosphor,
Index matches to plastic such as COC
Use with Phosphor
Contains adhesion promoter, use with Phosphor
Contains adhesion promoter, use with Phosphor
Longer work time for dispensing applications, 80 C minimum cure

L S -3 1 4 0
L S -3 4 4 0
L S -3 4 4 1
L S -3 4 4 3
L S -3 2 4 6
L S -3 2 4 9
L S -3 3 5 1
L S -3 2 5 2

OPTICAL OPTICAL
PRIMERS GREASES

OPTICAL
FLUIDS

OPTICAL ADHESIVES
AND ELASTOMERS

L S -3 3 5 4
L S 2 -3 3 5 4
L S 3 -3 3 5 4
L S 4 -3 3 5 4

11

Refractive
Index
589 nm

Comments

L S -6 1 4 0
L S 1 -6 1 4 0
L S 2 -6 1 4 0
L S -6 9 4 1
L S 1 -6 9 4 1
L S 2 -6 9 4 1
L S -8 9 4 1
L S -6 1 4 3
L S -6 9 4 3
L S -6 9 4 6

Low Volitility, non-phenyl containing


LS-6140 with longer work time for dispensing, 80 C minimum cure
Primerless version of LS1-6140
Non-phenyl containing

L S -5 2 3 8

Resistant to Hydrocarbon Solvents, available in 350 cPs & 1000 cPs

High Durometer to reduce tackiness, non-phenyl containing


Broad opearting temperature range
Broad opearting temperature range
Primed Lap Shear 510 psi, Youngs Modulus 425 psi

L S -5 2 4 6
L S -5 2 5 2
L S -5 2 5 7

1 .3 8

11 h

1 .4 0
1 .4 0
1 .4 1
1 .4 3
1 .4 6
1 .4 9

> 24 h
> 24 h
8 h
48 h
160 m
(1 .2 xV i)

1 .5 1

Tough, Tensile 750 psi, Tear 80 ppi


Low viscosity, non-phenyl containing

Work
Time

Durometer
0 0 / 0 0 0
15 / NA

Viscosity
cP/mPa-sec

Cure Time/
Temp C

Tensile
psi (MPa)

Elongation
%

CTE
ppm/ C

Mix
Ratio

1 ,5 0 0

30 m / 150

MBP
MBP
*31)
MBP
*31)
MBP
10 / NA
60

A:16,000/B:8,500
535
1 4 ,5 0 0
A:500/B:650
1 ,0 0 0
-

30 m / 150
60 m / 100
30 m / 150
30 m / 100
60 m / 65
60 m / 75

411
300
300
-

1 :1
1 :1
1 :1
1 :1
1 :1
1 :1
1 :1

NA / 55

6 ,0 0 0

60 m / 100

1 :1

*31)
*32)

1 .5 2

6 h

10 / 65

425

30 m / 150

1 :1

1 .5 4
1 .5 4
1 .5 4
1 .5 4

9 0 m (2 xV i)
2 h m in (2 xV i)
8 0 m (2 xV i)
-

65 / 65
15 / 53
60 / 55
60

5 ,4 0 0
6 ,0 0 0
5 ,2 0 0

60 m / 70
60 m / 70
60 m / 70
60 m / 70

1 :1
1 .1
1 :1

4 ,2 0 0

1 :1

1 .4 0
1 .4 0
1 .4 1
1 .4 1
1 .4 1
1 .4 1
1 .4 1
1 .4 3
1 .4 3
1 .4 6

3 h
4 h
>24 h
5 .5 h
>24 h
2 h
2 h

Type A
50
50
45
50
50
30
80
40
40
30

A:3,700/B:2,550
A:3,450/B:2,500
A:2,900/B:1,716
5 ,3 0 0
A:75,000/B:50,000
A :1 ,2 0 0 /B :8 0 0

15 m / 150
60 m / 150
60 m / 150
15 m / 150
30 m / 150
30 m / 150
30 m / 150

850 (5.9)
900 (6.2)
1,039 (7.2)
1,300 (9.0)
7 5 0 (5 .2 )

90
90
151
95
305
100
65

400
500
337
-

1 :1
1 :1
1 :1
1 0 :1
1 :1
1 :1
1 :1

490
-

3 5 0 o r 1 ,0 0 0

360
-

1 0 :1
1 0 :1
1 :1

1 .3 8

125
120
275
-

1 .4 6
1 .5 2
1 .5 7

30 m / 150
-

1 2 0 ( 0. 8 )
1 ,2 5 0 (8 .6 )
6 0 0 (4 .1 )
9 0 0 (6 .2 )
6 7 5 (4 .7 )
-

1 ,5 5 0
575
1 ,4 0 0

A:27,500/B:25,000
A :3 ,6 0 0
5 ,4 0 0
A:40,000/B:35,000

4 h / 65
60 m / 100

Application

Index Matches MgF2, AR Coating


Encapsulant, Potting
Encapsulant, Potting
Encapsulant, Potting
Encapsulant, Potting
Index Matches Silica, Optical Fiber, Glass, LCD Bonding
Bonding, Encapsulant
Excellent for Dispersing Phosphor
Excellent for LCD Display and LED Encapsulation
Excellent for Dispersing Phosphor
Excellent for Dispersing Phosphor
Excellent for Dispersing Phosphor
Excellent for Dispersing Phosphor
Bonding, Encapsulant, Dispersing Phosphor
Bonding, Casting or Injection Molding
Bonding, Casting or Injection Molding
Bonding, Encapsulant
Lenses made by Injecting or Compression Molding
Lower Durometer where Stress is Concerned
Lenses made by Injecting or Compression Molding
Bonding, Encapsulant
Bonding, Encapsulant
Bonding, Molding
Index Matches MgF2, AR Coating
Index Matches Silica, Optical Fiber, Glass
Index Matches BK7, Glass
Assemblies, Ionizing Radiation, Infrared Illumination

L S -1 2 4 6

Flows Under Pressure, Non-Slumping, Non-Curing

1 .4 6

L S 1 -3 2 0 0

All Purpose Primer for Optical Applications

1 .4 to 1 .4 2 5

1 .0

L S 2 -3 2 0 0

Improves Adhesion to Difficult Substrates

1 .0
1 .0

Adheres to Difficult Substrates

Improves Adhesion to Difficult Substrates

L S 3 -3 2 0 0

Maintains Transparency at 400 nm


= Designed for Broad Operating Temperatures

M B P = M easured by P enetration
Tested per N uS il TM 017
*32)
Tested per N uS il TM 036
*31)

1 .4 to 1 .4 2 5
1 .4 to 1 .4 2 5

Index Matches Silica, Optical Fiber, Glass


Adheres to Various Substrates

d = day
h = hour
m = m inutes

12

ELECTRONIC PACKAGING MATERIALS

General
Purpose

NuSil
Product
Number

Cure
System

Comments

Work Time
@ 25C

Cure
Time /
Temp C

*27) Ionic

Content
CI / K / Na
ppm

Specific
Gravity

Durometer
Type A

Tensile
psi (MPa)

Elongation
%

Tear
ppi (kN/m)

*28)
Volume
Resistivity
ohmcm

Dielectric
Strength
V/mil

Viscosity
cP / mPasec

Mix
Ratio

Color

E P M -2410
E P M -2420
E P M -2421

Ideal for S tatic M ix and D ispense A pplications.


Also available in B lack and W hite
Low V iscosity, S elf-leveling A dhesive
to P olyester and P olyether
Low V iscosity, S elf-leveling, G eneral A dhesive
and E ncapsulant

E P M -2422

E P M -2480

Useful for Potting Intricate Assemblies Due to Low Viscosity

E P M -2411-2

ELECTRICALLY
GREASE
CONDUCTIVE

STATIC
DISSAPATIVE

C arbon black filled for E M I shielding applications

E P M -2481

T ough F irm G el

E P M -2482

1.43 R efractive Index

G lob T op encapsulant. S hear T hinning Index 2.5

P latinum

30 m

15 m / 150

<5 / <2 / <4

30

675 (4.7)

350

1 x 10 15

A :62,000 / B :40,000

1:1

T rans

P latinum

5,000 cP s
max after 2 h

60 m / 65

<2 / <1 / <8

1.01

30

400 (2.8)

150

A :2,450 / B :1,200

1:1

C lear

P latinum

3h

15 m / 150

<5 / <2 / <4

1.02

50

800 (5.5)

90

1 x 10 15

*23)

550

A :3,750 / B :2,700

1:1

C lear

P latinum

7,000 cP s
max after 2 h

4 h / 65

<5 / <1 / <1

1.04

40

600 (4.1)

100

1 x 10 15

*23)

550

A :3,600

10:1

C lear

P latinum

60 m

24 h / R.T., H

<5 / <1 / <6

30

500 (3.4)

350

30 (5.3)

535

A :1,250,000 / B :100,000

1:1

B lack

P latinum

24 h

30 m / 150

<5 / <1 / <2

F irm G el

1 x 10 14

3,000 (m ixed)

1:1

T rans

P latinum

24 h

30 m / 150

<5 / <1 / <2

V ery F irm G el

1 x 10 14

A :15,000 / B :9,000

1:1

C lear

P latinum

24 h

40 m / 150

<5 / <1 / <4

F irm G el

1 x 10 14

1,800 (m ixed)

1:1

T rans

P latinum

>8 h

15 m / 200

1.16

17

750 (5.2)

700

55 (9.7)

300,000

B lack
W hite

1 x 10

15

*23)

400

<5 / <2 / <4

2.30

1 x 10 15

13 kV @
0.10 inch
spacing

M edium G rease

P latinum

3h

30 m / 150

<5 / <7 / <5

3.39

85

550 (3.4)

0.005

P aste

20:1

T an

100:0.5

G reenG ray

*24)

E P M -2401
E P M -2462
E P M -2463
E P M 1-2493

ADHESIVES

THERMAL INTERFACE MATERIAL (TIM)

E P M -2461

POTTING &
ENCAPSULATING
GELS

1.43 R efractive Index

GLOB
TOP

POTTING &
ENCAPSULATING
MATERIALS

EPM 's meet a low volatility specification of <1% weight loss when exposed to a minimum of 275C for 1 hour, reference ASTM D2288

E P M -2490
E P M -2492

*22)

*22)

0.7 W /m K , B LT < 1 n, Z inc filled

1.2 W /m K , good adhesion to A lum inum

*21, 22)

1.5 W /m K , rem ains conductive over


broad operating tem perature range

Low viscosity for com plex geom etries 0.95 W /m K


*22)

B ulk T herm al C onductivity 1.49 W /m K

*22)

0.6 W /m K , B LT 200 n, B N filled


*22)

E P M -2890
*21)
*22)

0.6 W /mK

T ested per A S T M C1045


T ested per A S T M E1530

T in/O xim e

2h

7 d / R .T ., H

< 5 / < 10 / < 5

3.30

80

300 (2.1)

75

55 (9.7)

P latinum

13 h

15 m / 150

<6 / <3 / <5

2.34

65

180 (1.2)

50

3.4 x 10

13

P latinum

2h

7 d / R .T .

< 5 / < 3 / < 10

1.53

75

200 (1.4)

30

50 (8.8)

5.3 x 10

14

P latinum

2h

30 m / 150

<5 / <1 / <1

75

250 (1.7)

40

T in/O xim e

72 h / R.T.,H.

< 5/ < 5/ < 5

2.33

65

400 (2.8)

150

= Designed for Broad Operating Temperatures

d = day
R .T . = R oom T em perature
h = hour
H = H um idity
m = m inutes

*27)

T ested per M IL S T D 883E

0.003

8 Inches per min.

*23)

36,000

1:1

W hite

540

P aste

15:1

W hite

A :470,000

10:1

W hite

1-P art

W hite

*28)

T ested per D 257

*23)
*24)

T ested per A S T M D 149


T ested per A S T M D 877

TIM Storage Modulus Log (MPa)


Epoxy versus Silicone
10,000
1,000

Storage
Modulus
(MPa)

100
10
1

Epoxy TIM
0.1

13

0.01

40 A
Durometer
Silicone
20 00
Durometer
Silicone

14

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