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HDI Layer Stackups For Large Dense PCB
HDI Layer Stackups For Large Dense PCB
Few days into a recent project for one of our customers, the
lead engineer called me to tell me that the PCB
design would have to changedrastically! The design as
originally conceived did not seem too difficulta 20-layer
board having active components on one side only, 2.75 x
4.0 in size, 284 parts with 2500 pins. That works out to
about 228 pins/sq. in. The new requirement was to reduce
the board size by 50%. Accomplishing this would prove to
Determining the StackOnly one component in the design required the use of micro-vias
(Via). That part is a .5mm pitch ball grid array (BGA). However, the
entire design would require a much more involved HDI stack-up and
fabrication to achieve full circuit connectivity. After numerous
discussions with our customer and the board fabricator, we
ultimately decided on a 16-layer, micro-via stack-up (See Fig. 2).
This stack-up includes:
Buried capacitance materials for layer pairs 5/6, 8/9 and 11/12.
With this stack-up, the PWR and GND pinsmost of which are
laser-drilled Viasstop one or two layers deep into the board. This
means that roughly 40% of the BGA pins break-out vias will no
longer occupy internal trace routing channels. This frees up a large
amount of routing space on the remaining internal layers, which
enabled us to reduce the layer count from the original
design.
The top-side BGA signal pins use Vias down to layers 3 and 4 (layers
14 and 15 for the bottom side) to break-out of the BGA areas for
routing, as required. Using this stack-ups combination
of Vias, buried-vias, and thru-vias allows for back-to-back,
high-pin-count BGAs and discrete components. The smaller HDI
feature sizes offered enough improvement in the routing density to
allow for full connectivity.
One Caveat
There is a downside to HDI construction. Due to having vias-in-pads
(VIP) and the extremely small size of the parts and Vias, assembling
the board, testing the circuits, and making any needed repairs are all
the more challenging. The affected departments should be consulted,
and methodologies must be created in order to provide solutions to
their concerns.
Conclusion
HDI construction offers many opportunities for product design. By
working with your designer and board fabricator and considering all
of the various processes and methods for board construction
available, cost-effective solutions can be found. By using the
techniques of HDI in this design, our customer was able to meet the
needs of two markets with one product, thereby increasing their
profitability. The engineer with whom I worked called me a few weeks
after the design was finished to let me know that they had finished
testing, and were entering the production cycle.
When used appropriately, the end result of HDI design methods will
be improved product performance, better price competitiveness, and
new product innovation.
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