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ADC0804
ADC0804
ADC0804
8-Bit, Microprocessor-
August 1997 Compatible, A/D Converters
Features Description
• 80C48 and 80C80/85 Bus Compatible - No Interfacing The ADC0802 family are CMOS 8-Bit, successive-approxi-
Logic Required mation A/D converters which use a modified potentiometric
• Conversion Time < 100µs ladder and are designed to operate with the 8080A control
bus via three-state outputs. These converters appear to the
• Easy Interface to Most Microprocessors processor as memory locations or I/O ports, and hence no
• Will Operate in a “Stand Alone” Mode interfacing logic is required.
• Differential Analog Voltage Inputs The differential analog voltage input has good common-
• Works with Bandgap Voltage References mode-rejection and permits offsetting the analog zero-input-
voltage value. In addition, the voltage reference input can be
• TTL Compatible Inputs and Outputs adjusted to allow encoding any smaller analog voltage span
• On-Chip Clock Generator to the full 8 bits of resolution.
• 0V to 5V Analog Voltage Input Range (Single + 5V Supply)
• No Zero-Adjust Required
Ordering Information
PART NUMBER ERROR EXTERNAL CONDITIONS TEMP. RANGE (oC) PACKAGE PKG. NO
ADC0803LCN ±1/2 LSB VREF/2 Adjusted for Correct Full Scale 0 to 70 20 Ld PDIP E20.3
Reading
ADC0803LCD ±3/4 LSB -40 to 85 20 Ld CERDIP F20.3
12 DB6
WR 3 18 DB0 (LSB) ANY
µPROCESSOR 13 DB5
CLK IN 4 17 DB1 8-BIT RESOLUTION
14 DB4 VIN (+) 6 OVER ANY
INTR 5 16 DB2 DIFF
15 7 DESIRED
DB3 VIN (-) INPUTS
VIN (+) ANALOG INPUT
6 15 DB3 16 DB2 AGND 8 VOLTAGE RANGE
VIN (-) 7 14 DB4 17 DB1 VREF/2 9 VREF/2
8 13 DB5 18 DB0 DGND 10
AGND
VREF/2 9 12 DB6
DGND 10 11 DB7 (MSB)
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. File Number 3094.1
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
6-5
ADC0802, ADC0803, ADC0804
Functional Diagram
2 READ
RD
DAC Q
LSB
AGND 8 VOUT
CLK A
V+
D
COMP DFF2
6 + - Q
VIN (+) ∑ +
- Q
11 12 13 14 15 16 17 18
8 X 1/f
DIGITAL OUTPUTS
THREE-STATE CONTROL
“1” = OUTPUT ENABLE
6-6
ADC0802, ADC0803, ADC0804
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
6-7
ADC0802, ADC0803, ADC0804
6-8
ADC0802, ADC0803, ADC0804
Timing Waveforms
tr = 20ns
tr
V+ 2.4V
90%
RD 50%
RD DATA 0.8V 10%
OUTPUT
CS t1H
VOH
CL 10K 90%
DATA
OUTPUTS
GND
tr = 20ns
V+ V+ tr
2.4V 90%
50%
10K RD
0.8V 10%
RD DATA
OUTPUT t0H
CS V+
CL
DATA
OUTPUTS
VOI 10%
6-9
ADC0802, ADC0803, ADC0804
1.8 500
-55oC TO 125oC
LOGIC INPUT THRESHOLD VOLTAGE (V)
1.7
400
DELAY (ns)
1.6
300
1.5
200
1.4
1.3 100
4.50 4.75 5.00 5.25 5.50 0 200 400 600 800 1000
V+ SUPPLY VOLTAGE (V) LOAD CAPACITANCE (pF)
FIGURE 2. LOGIC INPUT THRESHOLD VOLTAGE vs SUPPLY FIGURE 3. DELAY FROM FALLING EDGE OF RD TO OUTPUT
VOLTAGE DATA VALID vs LOAD CAPACITANCE
3.5 1000
CLK IN THRESHOLD VOLTAGE (V)
R = 10K
3.1
VT(+)
R = 50K
2.7
fCLK (kHz)
-55oC TO 125oC
2.3
1.9
VT(-)
R = 20K
1.5
100
4.50 4.75 5.00 5.25 5.50
10 100 1000
V+ SUPPLY VOLTAGE (V) CLOCK CAPACITOR (pF)
FIGURE 4. CLK IN SCHMITT TRIP LEVELS vs SUPPLY VOLTAGE FIGURE 5. fCLK vs CLOCK CAPACITOR
16
7 VIN(+) = VIN(-) = 0V
14 ASSUMES VOS = 2mV
6
FULL SCALE ERROR (LSBs)
FIGURE 6. FULL SCALE ERROR vs fCLK FIGURE 7. EFFECT OF UNADJUSTED OFFSET ERROR
6-10
ADC0802, ADC0803, ADC0804
8 1.6
V+ = 5V fCLK = 640kHz
BUFFERS V+ = 5.5V
6 1.4
5 ISOURCE
1.3
VOUT = 2.4V
V+ = 5.0V
4 1.2
Timing Diagrams
CS
WR
tWI
ACTUAL INTERNAL tW(WR)I “BUSY”
STATUS OF THE DATA IS VALID IN
CONVERTER “NOT BUSY” OUTPUT LATCHES
1 TO 8 x 1/fCLK INTERNAL TC
(LAST DATA READ)
INTR INTR
(LAST DATA NOT READ) ASSERTED
tVI 1/ f
2 CLK
INTR RESET
INTR
CS tRI
RD
tACC
t1H , t0H
6-11
ADC0802, ADC0803, ADC0804
+1 LSB
ERROR
D 0 * QUANTIZATION ERROR
3 4
-1 LSB
A-1 A A+1 A-1 A A+1
+1 LSB
DIGITAL OUTPUT CODE
5 1
D+1
6
ERROR
3 3 6
D 0 * QUANTIZATION
4 ERROR
1
D-1 2
4
2
-1 LSB
A-1 A A+1 A-1 A A+1
Understanding A/D Error Specs constant negative slope and the abrupt upside steps are always
1 LSB in magnitude, unless the device has missing codes.
A perfect A/D transfer characteristic (staircase wave-form) is
shown in Figure 11A. The horizontal scale is analog input volt- Detailed Description
age and the particular points labeled are in steps of 1 LSB
The functional diagram of the ADC0802 series of A/D
(19.53mV with 2.5V tied to the VREF/2 pin). The digital output
converters operates on the successive approximation princi-
codes which correspond to these inputs are shown as D-1, D,
ple (see Application Notes AN016 and AN020 for a more
and D+1. For the perfect A/D, not only will center-value (A - 1,
detailed description of this principle). Analog switches are
A, A + 1, . . .) analog inputs produce the correct output digital
closed sequentially by successive-approximation logic until
codes, but also each riser (the transitions between adjacent
the analog differential input voltage [VlN(+) - VlN(-)] matches
output codes) will be located ±1/2 LSB away from each center-
a voltage derived from a tapped resistor string across the
value. As shown, the risers are ideal and have no width. Correct
reference voltage. The most significant bit is tested first and
digital output codes will be provided for a range of analog input
after 8 comparisons (64 clock cycles), an 8-bit binary code
voltages which extend ±1/2 LSB from the ideal center-values.
(1111 1111 = full scale) is transferred to an output latch.
Each tread (the range of analog input voltage which provides
the same digital output code) is therefore 1 LSB wide. The normal operation proceeds as follows. On the high-to-low
transition of the WR input, the internal SAR latches and the
The error curve of Figure 11B shows the worst case transfer
shift-register stages are reset, and the INTR output will be set
function for the ADC0802. Here the specification guarantees
high. As long as the CS input and WR input remain low, the
that if we apply an analog input equal to the LSB analog volt-
A/D will remain in a reset state. Conversion will start from 1 to
age center-value, the A/D will produce the correct digital code.
8 clock periods after at least one of these inputs makes a low-
Next to each transfer function is shown the corresponding error to-high transition. After the requisite number of clock pulses to
plot. Notice that the error includes the quantization uncertainty of complete the conversion, the INTR pin will make a high-to-low
the A/D. For example, the error at point 1 of Figure 11A is transition. This can be used to interrupt a processor, or
+1/2 LSB because the digital code appeared 1/2 LSB in advance otherwise signal the availability of a new conversion. A RD
of the center-value of the tread. The error plots always have a operation (with CS low) will clear the INTR line high again.
6-12
ADC0802, ADC0803, ADC0804
The device may be operated in the free-running mode by con- to automatically subtract a fixed voltage value from the input
necting INTR to the WR input with CS = 0. To ensure start-up reading (tare correction). This is also useful in 4mA - 20mA cur-
under all possible conditions, an external WR pulse is rent loop conversion. In addition, common-mode noise can be
required during the first power-up cycle. A conversion-in-pro- reduced by use of the differential input.
cess can be interrupted by issuing a second start command. The time interval between sampling VIN(+) and VlN(-) is 41/2
Digital Operation clock periods. The maximum error voltage due to this slight
The converter is started by having CS and WR simultaneously time difference between the input voltage samples is given by:
low. This sets the start flip-flop (F/F) and the resulting “1” level 4.5
∆V E ( MAX ) = (V PEAK ) ( 2πf CM ) ------------
resets the 8-bit shift register, resets the Interrupt (INTR) F/F f CLK
and inputs a “1” to the D flip-flop, DFF1, which is at the input where:
end of the 8-bit shift register. Internal clock signals then trans- ∆VE is the error voltage due to sampling delay,
fer this “1” to the Q output of DFF1. The AND gate, G1, com-
VPEAK is the peak value of the common-mode voltage,
bines this “1” output with a clock signal to provide a reset
signal to the start F/F. If the set signal is no longer present fCM is the common-mode frequency.
(either WR or CS is a “1”), the start F/F is reset and the 8-bit For example, with a 60Hz common-mode frequency, fCM ,
shift register then can have the “1” clocked in, which starts the and a 640kHz A/D clock, fCLK , keeping this error to 1/4 LSB
conversion process. If the set signal were to still be present, (~5mV) would allow a common-mode voltage, VPEAK , given
this reset pulse would have no effect (both outputs of the start by:
F/F would be at a “1” level) and the 8-bit shift register would
∆V E ( MAX ) ( f
continue to be held in the reset mode. This allows for asyn- CLK )
chronous or wide CS and WR signals. V PEAK = -------------------------------------------------- ,
( 2πf CM ) ( 4.5 )
After the “1” is clocked through the 8-bit shift register (which
or
completes the SAR operation) it appears as the input to –3 3
( 5 × 10 ) ( 640 × 10 )
DFF2. As soon as this “1” is output from the shift register, the V PEAK = ---------------------------------------------------------- ≅ 1.9V .
( 6.28 ) ( 60 ) ( 4.5 )
AND gate, G2, causes the new digital word to transfer to the
Three-State output latches. When DFF2 is subsequently The allowed range of analog input voltage usually places
clocked, the Q output makes a high-to-low transition which more severe restrictions on input common-mode voltage
causes the INTR F/F to set. An inverting buffer then supplies levels than this.
the INTR output signal.
An analog input voltage with a reduced span and a relatively
When data is to be read, the combination of both CS and RD large zero offset can be easily handled by making use of the
being low will cause the INTR F/F to be reset and the three- differential input (see Reference Voltage Span Adjust).
state output latches will be enabled to provide the 8-bit digital
outputs. Analog Input Current
Digital Control Inputs The internal switching action causes displacement currents to
flow at the analog inputs. The voltage on the on-chip capaci-
The digital control inputs (CS, RD, and WR) meet standard tance to ground is switched through the analog differential
TTL logic voltage levels. These signals are essentially equiva- input voltage, resulting in proportional currents entering the
lent to the standard A/D Start and Output Enable control sig- VIN(+) input and leaving the VIN(-) input. These current tran-
nals, and are active low to allow an easy interface to sients occur at the leading edge of the internal clocks. They
microprocessor control busses. For non-microprocessor rapidly decay and do not inherently cause errors as the on-
based applications, the CS input (pin 1) can be grounded and chip comparator is strobed at the end of the clock perIod.
the standard A/D Start function obtained by an active low
pulse at the WR input (pin 3). The Output Enable function is Input Bypass Capacitors
achieved by an active low pulse at the RD input (pin 2). Bypass capacitors at the inputs will average these charges
Analog Operation and cause a DC current to flow through the output resistances
of the analog signal sources. This charge pumping action is
The analog comparisons are performed by a capacitive
worse for continuous conversions with the VIN(+) input voltage
charge summing circuit. Three capacitors (with precise
at full scale. For a 640kHz clock frequency with the VIN(+)
ratioed values) share a common node with the input to an
input at 5V, this DC current is at a maximum of approximately
auto-zeroed comparator. The input capacitor is switched
5µA. Therefore, bypass capacitors should not be used at
between VlN(+) and VlN(-) , while two ratioed reference capaci-
the analog inputs or the VREF/2 pin for high resistance
tors are switched between taps on the reference voltage sources (>1kΩ). If input bypass capacitors are necessary for
divider string. The net charge corresponds to the weighted dif- noise filtering and high source resistance is desirable to mini-
ference between the input and the current total value set by mize capacitor size, the effects of the voltage drop across this
the successive approximation register. A correction is made to input resistance, due to the average value of the input current,
offset the comparison by 1/2 LSB (see Figure 11A). can be compensated by a full scale adjustment while the
Analog Differential Voltage Inputs and Common-Mode given source resistor and input bypass capacitor are both in
Rejection place. This is possible because the average value of the input
This A/D gains considerable applications flexibility from the ana- current is a precise linear function of the differential input
log differential voltage input. The VlN(-) input (pin 7) can be used voltage at a constant conversion rate.
6-13
ADC0802, ADC0803, ADC0804
7
VIN(-)
6-14
ADC0802, ADC0803, ADC0804
6-15
ADC0802, ADC0803, ADC0804
10K
signal leads. Exposed leads to the analog inputs can cause
5V (VREF)
undesired digital noise and hum pickup; therefore, shielded
ADC0802 - ADC0804 leads may be necessary in many applications.
150pF
1 CS V+ 20 A single-point analog ground should be used which is separate
2 RD CLK R 19
+ from the logic ground points. The power supply bypass capaci-
10µF
DB0 18
tor and the self-clockIng capacitor (if used) should both be
3 WR LSB
N.O. returned to digital ground. Any VREF/2 bypass capacitors, ana-
4 CLK IN DB1 17
START
log input filter capacitors, or input signal shielding should be
5 INTR DB2 16 returned to the analog ground point. A test for proper grounding
ANALOG 6 VIN (+) DB3 15 DATA is to measure the zero error of the A/D converter. Zero errors in
INPUTS 7 VIN (-) DB4 14 OUTPUTS excess of 1/4 LSB can usually be traced to improper board
8 AGND DB5 13 layout and wiring (see Zero Error for measurement). Further
information can be found in Application Note AN018.
9 VREF/2 DB6 12
10 DGND DB7 11 MSB
Testing the A/D Converter
There are many degrees of complexity associated with testing
FIGURE 17. FREE-RUNNING CONNECTION
an A/D converter. One of the simplest tests is to apply a
known analog input voltage to the converter and use LEDs to
Driving the Data Bus display the resulting digital output code as shown in Figure 18.
This CMOS A/D, like MOS microprocessors and memories, For ease of testing, the VREF/2 (pin 9) should be supplied
will require a bus driver when the total capacitance of the with 2.560V and a V+ supply voltage of 5.12V should be
data bus gets large. Other circuItry, which is tied to the data used. This provides an LSB value of 20mV.
bus, will add to the total capacitive loading, even in three- If a full scale adjustment is to be made, an analog input volt-
state (high-impedance mode). Back plane busing also age of 5.090V (5.120 - 11/2 LSB) should be applied to the
greatly adds to the stray capacitance of the data bus. VIN(+) pin with the VIN(-) pin grounded. The value of the
There are some alternatives available to the designer to han- VREF/2 input voltage should be adjusted until the digital out-
dle this problem. Basically, the capacitive loading of the data put code is just changing from 1111 1110 to 1111 1111. This
bus slows down the response time, even though DC specifi- value of VREF/2 should then be used for all the tests.
cations are still met. For systems operating with a relatively The digital-output LED display can be decoded by dividing the 8
slow CPU clock frequency, more time is available in which to bits into 2 hex characters, one with the 4 most-significant bits
establish proper logic levels on the bus and therefore higher (MS) and one with the 4 least-significant bits (LS). The output is
capacitive loads can be driven (see Typical Performance then interpreted as a sum of fractions times the full scale voltage:
Curves).
VO UT = --------- + ---------- ( 5.12 )V .
MS LS
At higher CPU clock frequencies time can be extended for 16 256
I/O reads (and/or writes) by inserting wait states (8080) or
using clock-extending circuits (6800). 10kΩ
on the V+ supply. An lCL7663 can be used to regulate such FIGURE 18. BASIC TESTER FOR THE A/D
a supply from an input as low as 5.2V.
Wiring and Hook-Up Precautions For example, for an output LED display of 1011 0110, the
MS character is hex B (decimal 11) and the LS character is
Standard digital wire-wrap sockets are not satisfactory for
hex (and decimal) 6, so:
breadboarding with this A/D converter. Sockets on PC
boards can be used. All logic signal wires and leads should
VO UT = ------ + ---------- ( 5.12 ) = 3.64V.
11 6
be grouped and kept as far away as possible from the analog 16 256
6-16
ADC0802, ADC0803, ADC0804
Figures 19 and 20 show more sophisticated test circuits. Interfacing the Z-80 and 8085
The Z-80 and 8085 control buses are slightly different from
8-BIT VANALOG OUTPUT
10-BIT that of the 8080. General RD and WR strobes are provided
A/D UNDER
DAC and separate memory request, MREQ, and I/O request,
TEST
IORQ, signals have to be combined with the generalized
R strobes to provide the appropriate signals. An advantage of
R operating the A/D in I/O space with the Z-80 is that the CPU
ANALOG “B” - will automatically insert one wait state (the RD and WR
INPUTS A1 + “C” strobes are extended one clock period) to allow more time
R for the I/O devices to respond. Logic to map the A/D in I/O
100R space is shown in Figure 22. By using MREQ in place of
R IORQ, a memory-mapped configuration results.
- 100X ANALOG
Additional I/O advantages exist as software DMA routines are
“A” + ERROR VOLTAGE
A2 available and use can be made of the output data transfer
which exists on the upper 8 address lines (A8 to A15) during
I/O input instructions. For example, MUX channel selection for
FIGURE 19. A/D TESTER WITH ANALOG ERROR OUTPUT. THIS
the A/D can be accomplished with this operating mode.
CIRCUIT CAN BE USED TO GENERATE “ERROR
PLOTS” OF FIGURE 11. The 8085 also provides a generalized RD and WR strobe, with
an IO/M line to distinguish I/O and memory requests. The cir-
DIGITAL DIGITAL cuit of Figure 22 can again be used, with IO/M in place of IORQ
INPUTS VANALOG OUTPUTS for a memory-mapped interface, and an extra inverter (or the
10-BIT A/D UNDER
logic equivalent) to provide IO/M for an I/O-mapped connection.
DAC TEST Interfacing 6800 Microprocessor Derivatives (6502, etc.)
The control bus for the 6800 microprocessor derivatives does
FIGURE 20. BASIC “DIGITAL” A/D TESTER not use the RD and WR strobe signals. Instead it employs a
single R/W line and additional timing, if needed, can be derived
Typical Applications from the φ2 clock. All I/O devices are memory-mapped in the
6800 system, and a special signal, VMA, indicates that the cur-
Interfacing 8080/85 or Z-80 Microprocessors
rent address is valid. Figure 23 shows an interface schematic
This converter has been designed to directly interface with where the A/D is memory-mapped in the 6800 system. For sim-
8080/85 or Z-80 Microprocessors. The three-state output plicity, the CS decoding is shown using 1/2 DM8092. Note that
capability of the A/D eliminates the need for a peripheral in many 6800 systems, an already decoded 4/5 line is brought
interface device, although address decoding is still required out to the common bus at pin 21. This can be tied directly to the
to generate the appropriate CS for the converter. The A/D CS pin of the A/D, provided that no other devices are
can be mapped into memory space (using standard mem- addressed at HEX ADDR: 4XXX or 5XXX.
ory-address decoding for CS and the MEMR and MEMW
In Figure 24 the ADC0802 series is interfaced to the MC6800
strobes) or it can be controlled as an I/O device by using the
microprocessor through (the arbitrarily chosen) Port B of the
I/OR and I/OW strobes and decoding the address bits A0 →
MC6820 or MC6821 Peripheral Interface Adapter (PlA). Here
A7 (or address bits A8 → A15, since they will contain the
the CS pin of the A/D is grounded since the PlA is already
same 8-bit address information) to obtain the CS input.
memory-mapped in the MC6800 system and no CS decoding
Using the I/O space provides 256 additional addresses and
is necessary. Also notice that the A/D output data lines are con-
may allow a simpler 8-bit address decoder, but the data can
nected to the microprocessor bus under program control
only be input to the accumulator. To make use of the addi-
through the PlA and therefore the A/D RD pin can be grounded.
tional memory reference instructions, the A/D should be
mapped into memory space. See AN020 for more discus-
sion of memory-mapped vs I/O-mapped interfaces. An Application Notes
example of an A/D in I/O space is shown in Figure 21.
AnswerFAX
The standard control-bus signals of the 8080 (CS, RD and NOTE # DESCRIPTION DOC. #
WR) can be directly wired to the digital control inputs of the
A/D, since the bus timing requirements, to allow both starting AN016 “Selecting A/D Converters” 9016
the converter, and outputting the data onto the data bus, are
AN018 “Do’s and Don’ts of Applying A/D 9018
met. A bus driver should be used for larger microprocessor
Converters”
systems where the data bus leaves the PC board and/or
must drive capacitive loads larger than 100pF. AN020 “A Cookbook Approach to High Speed 9020
It is useful to note that in systems where the A/D converter is Data Acquisition and Microprocessor
Interfacing”
1 of 8 or fewer I/O-mapped devices, no address-decoding
circuitry is necessary. Each of the 8 address bits (A0 to A7) AN030 “The ICL7104 - A Binary Output A/D 9030
can be directly used as CS inputs, one for each I/O device. Converter for Microprocessors”
6-17
ADC0802, ADC0803, ADC0804
INT (14)
I/O WR (27) (NOTE)
I/O RD (25) (NOTE)
10K
ADC0802 - ADC0804
+
1 CS V+ 20 10µF
5V
2 RD CLK R 19
3 WR DB0 18 LSB DB0 (13) (NOTE)
4 CLK IN DB1 17 DB1 (16) (NOTE)
5 INTR DB2 16 DB2 (11) (NOTE)
5V
NOTE: Pin numbers for 8228 System Controller: Others are 8080A.
FIGURE 21. ADC0802 TO 8080A CPU INTERFACE
6-18
ADC0802, ADC0803, ADC0804
ADC0802 - ADC0804 +
10µF
1 CS V+ 20
ABC
2 RD CLK R 19 5V (8) 1 2 3
3 WR DB0 18 LSB D0 (33) [31]
RD 4 CLK IN DB1 17 D1 (32) [29]
RD
2 ANALOG 5 INTR DB2 16 D2 (31) [K]
INPUTS
6 VIN (+) DB3 15 D3 (30) [H]
7 VIN (-) DB4 14 D4 (29) [32]
IORQ ADC0802-
ADC0804 8 AGND DB5 13 D5 (28) [30]
150pF 9 VREF/2 DB6 12 D6 (27) [L]
MSB
WR 10 DGND DB7 11 D7 (26) [J]
WR 3
1
74C32 A12 (22) [34]
2
A13 (23) [N]
6 3
A14 (24) [M]
1/ DM8092 4
2 A15 (25) [33]
5
VMA (5) [F]
FIGURE 22. MAPPING THE A/D AS AN FIGURE 23. ADC0802 TO MC6800 CPU INTERFACE
I/O DEVICE FOR USE
WITH THE Z-80 CPU
18
CB1
19
CB2
10K
6-19
ADC0802, ADC0803, ADC0804
Die Characteristics
DIE DIMENSIONS: PASSIVATION:
(101 mils x 93 mils) x 525µm x 25µm Type: Nitride over Silox
Nitride Thickness: 8kÅ
METALLIZATION: Silox Thickness: 7kÅ
Type: Al
Thickness: 10kÅ ±1kÅ
WR
VREF/2
RD
DGND
CS
DB7 (MSB)
DB6
V+ OR VREF
V+ OR VREF
DB5
CLK R
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6-20