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MCP41XXX/42XXX: Single/Dual Digital Potentiometer With SPI Interface
MCP41XXX/42XXX: Single/Dual Digital Potentiometer With SPI Interface
MCP41XXX/42XXX
Description
The MCP41XXX and MCP42XXX devices are 256position, digital potentiometers available in 10 k,
50 k and 100 k resistance versions. The
MCP41XXX is a single-channel device and is offered in
an 8-pin PDIP or SOIC package. The MCP42XXX contains two independent channels in a 14-pin PDIP, SOIC
or TSSOP package. The wiper position of the
MCP41XXX/42XXX varies linearly and is controlled via
an industry-standard SPI interface. The devices consume <1 A during static operation. A software shutdown feature is provided that disconnects the A
terminal from the resistor stack and simultaneously connects the wiper to the B terminal. In addition, the dual
MCP42XXX has a SHDN pin that performs the same
function in hardware. During shutdown mode, the contents of the wiper register can be changed and the
potentiometer returns from shutdown to the new value.
The wiper is reset to the mid-scale position (80h) upon
power-up. The RS (reset) pin implements a hardware
reset and also returns the wiper to mid-scale. The
MCP42XXX SPI interface includes both the SI and SO
pins, allowing daisy-chaining of multiple devices. Channel-to-channel resistance matching on the MCP42XXX
varies by less than 1%. These devices operate from a
single 2.7 - 5.5V supply and are specified over the
extended and industrial temperature ranges.
Block Diagram
RS
SHDN
VDD
VSS
Wiper
Register
Control
Logic
SI
SCK
Wiper Resistor
Register Array 1*
16-Bit
Shift
Register
PB1
PA1
PW1
S0
*Potentiometer P1 is only available on the dual
MCP42XXX version.
Package Types
PDIP/SOIC
CS
SCK
SI
VSS
2
3
4
8
7
6
5
VDD
PB0
PW0
PA0
PDIP/SOIC/TSSOP
1
14
13
3
4
5
6
7
MCP42XXX
CS
SCK
SI
VSS
PB1
PW1
PA1
MCP41XXX
CS
PB0
Resistor
Array 0
PA0
PW0
12
11
10
9
8
VDD
SO
SHDN
RS
PB0
PW0
PA0
DS11195C-page 1
MCP41XXX/42XXX
1.0
ELECTRICAL CHARACTERISTICS
DC CHARACTERISTICS: 10 k VERSION
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to 5.5V, TA = -40C to +85C (TSSOP devices are only specified at +25C and
+85C). Typical specifications represent values for VDD = 5V, VSS = 0V, VB = 0V, TA = +25C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Rheostat Mode
Nominal Resistance
Rheostat Differential Non Linearity
Rheostat Integral Non Linearity
TA = +25C (Note 1)
10
12
R-DNL
-1
1/4
+1
LSB
Note 2
Note 2
R-INL
-1
1/4
+1
LSB
Rheostat Tempco
RAB/T
800
ppm/C
Wiper Resistance
RW
52
100
RW
73
125
IW
-1
+1
mA
R/R
0.2
Resolution
Bits
Monotonicity
Bits
Differential Non-Linearity
DNL
-1
1/4
+1
LSB
Note 3
Integral Non-Linearity
INL
-1
1/4
+1
LSB
Note 3
VW/T
Wiper Current
Nominal Resistance Match
Potentiometer Divider
VWFSE
-2
-0.7
LSB
VWFSE
-2
-0.7
LSB
VWZSE
+0.7
+2
LSB
VWZSE
+0.7
+2
LSB
Resistor Terminals
Voltage Range
VA,B,W
CW
VDD
15
pF
5.6
pF
Note 4
BW
MHz
tS
eNWB
nV/Hz
CT
-95
dB
Digital Inputs/Outputs (CS, SCK, SI, SO) See Figure 2-12 for RS and SHDN pin operation
Schmitt Trigger High-Level Input Voltage
VIH
0.7VDD
VIL
0.3VDD
VHYS
0.05VDD
VOL
0.40
VOH
VDD - 0.5
ILI
-1
+1
CIN, COUT
10
pF
VDD
2.7
5.5
IDDA
340
500
IDDS
0.01
PSS
0.0015
0.0035
%/%
PSS
0.0015
0.0035
%/%
Power Requirements
Note
1:
2:
3:
4:
5:
6:
DS11195C-page 2
MCP41XXX/42XXX
DC CHARACTERISTICS: 50 k VERSION
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to 5.5V, TA = -40C to +85C (TSSOP devices are only specified at +25C and
+85C). Typical specifications represent values for VDD = 5V, VSS = 0V, VB = 0V, TA = +25C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
35
50
65
R-DNL
-1
1/4
+1
LSB
Note 2
Note 2
Rheostat Mode
Nominal Resistance
Rheostat Differential Non-Linearity
Rheostat Integral Non-Linearity
TA = +25C (Note 1)
R-INL
-1
1/4
+1
LSB
Rheostat Tempco
RAB/T
800
ppm/C
Wiper Resistance
RW
125
175
RW
175
250
IW
-1
+1
mA
R/R
0.2
Wiper Current
Nominal Resistance Match
Potentiometer Divider
Resolution
Bits
Monotonicity
Bits
Differential Non-Linearity
DNL
-1
1/4
+1
LSB
Note 3
Integral Non-Linearity
INL
-1
1/4
+1
LSB
Note 3
VW/T
Full-Scale Error
VWFSE
-1
-0.25
LSB
VWFSE
-1
-0.35
LSB
VWZSE
+0.25
+1
LSB
VWZSE
+0.35
+1
LSB
Zero-Scale Error
Resistor Terminals
Voltage Range
VA,B,W
CW
VDD
11
pF
5.6
pF
Note 4
BW
280
MHz
tS
eNWB
20
nV/Hz
CT
-95
dB
Digital Inputs/Outputs (CS, SCK, SI, SO) See Figure 2-12 for RS and SHDN pin operation.
Schmitt Trigger High-Level Input Voltage
VIH
0.7VDD
VIL
0.3VDD
VHYS
0.05VDD
VOL
0.40
VOH
VDD - 0.5
ILI
-1
+1
CIN, COUT
10
pF
VDD
2.7
5.5
IDDA
340
500
IDDS
0.01
PSS
0.0015
0.0035
%/%
PSS
0.0015
0.0035
%/%
Power Requirements
Note
1:
2:
3:
4:
5:
6:
DS11195C-page 3
MCP41XXX/42XXX
DC CHARACTERISTICS: 100 k VERSION
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to 5.5V, TA = -40C to +85C (TSSOP devices are only specified at +25C and
+85C). Typical specifications represent values for VDD = 5V, VSS = 0V, VB = 0V, TA = +25C.
Parameters
Sym
Min
Typ
Max
R
R-DNL
Units
Conditions
70
100
130
-1
1/4
+1
LSB
Note 2
Note 2
Rheostat Mode
Nominal Resistance
Rheostat Differential Non-Linearity
Rheostat Integral Non-Linearity
TA = +25C (Note 1)
R-INL
-1
1/4
+1
LSB
Rheostat Tempco
RAB/T
800
ppm/C
Wiper Resistance
RW
125
175
RW
175
250
IW
-1
+1
mA
R/R
0.2
Resolution
Bits
Monotonicity
Bits
Differential Non-Linearity
DNL
-1
1/4
+1
LSB
Note 3
Integral Non-Linearity
INL
-1
1/4
+1
LSB
Note 3
VW/T
Full-Scale Error
VWFSE
-1
-0.25
LSB
VWFSE
-1
-0.35
LSB
VWZSE
+0.25
+1
LSB
VWZSE
+0.35
+1
LSB
Wiper Current
Nominal Resistance Match
Potentiometer Divider
Zero-Scale Error
Resistor Terminals
Voltage Range
VA,B,W
CW
VDD
11
pF
5.6
pF
Note 4
BW
145
MHz
tS
18
eNWB
29
nV/Hz
CT
-95
dB
Digital Inputs/Outputs (CS, SCK, SI, SO) See Figure 2-12 for RS and SHDN pin operation.
Schmitt Trigger High-Level Input Voltage
VIH
0.7VDD
VIL
0.3VDD
VHYS
0.05VDD
VOL
0.40
VOH
VDD - 0.5
ILI
-1
+1
CIN, COUT
10
pF
VDD
2.7
5.5
IDDA
340
500
IDDS
0.01
PSS
0.0015
0.0035
%/%
PSS
0.0015
0.0035
%/%
Power Requirements
Note
1:
2:
3:
4:
5:
6:
DS11195C-page 4
MCP41XXX/42XXX
Absolute Maximum Ratings
VDD...................................................................................7.0V
Notice: Stresses above those listed under maximum ratings may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
All inputs and outputs w.r.t. VSS ............... -0.6V to VDD +1.0V
Storage temperature .....................................-60C to +150C
Ambient temp. with power applied ................-60C to +125C
ESD protection on all pins .................................................. 2 kV
AC TIMING CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to 5.5V, TA = -40C to +85C.
Parameter
Sym
Min.
Typ.
Max.
Units
Clock Frequency
FCLK
10
MHz
tHI
40
ns
Conditions
VDD = 5V (Note 1)
tLO
40
ns
tCSSR
40
ns
tSU
40
ns
tHD
10
ns
tDO
80
ns
tCHS
ns
tCS0
10
ns
tCS1
100
ns
CS High Time
tCSH
40
ns
tRS
150
ns
Note 2
tRSCS
150
ns
Note 2
tSE
40
ns
Note 3
CS low time
tCSL
100
ns
Note 3
tSH
150
ns
Note 3
1:
2:
3:
30
CL = 30 pF (Note 2)
When using the device in the daisy-chain configuration, maximum clock frequency is determined by a combination of propagation delay
time (tDO) and data input setup time (tSU). Max. clock frequency is therefore ~ 5.8 MHz based on SCK rise and fall times of 5 ns, tHI =
40 ns, tDO = 80 ns and tSU = 40 ns.
Applies only to the MCP42XXX devices.
Applies only when using hardware pins to exit software shutdown mode, MCP42XXX only.
DS11195C-page 5
MCP41XXX/42XXX
tCSH
CS
1/FCLK
tCSSR
tHI
tCSO
SCK
tCHS
tLO
tCS1
tSU
tHD
SI
msb in
tDO
(First 16 bits out are always zeros)
SO
tS
1% Error Band
VOUT
FIGURE 1-1:
1%
CS
tRSCS
tRS
RS
tS
VOUT
FIGURE 1-2:
1% Error Band
1%
Reset Timing.
tCSL
CS
tSE
tRS
RS
tSE
tSH
SHDN
FIGURE 1-3:
DS11195C-page 6
MCP41XXX/42XXX
2.0
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, curve represents 10 k, 50 k and 100 k devices, VDD = 5V, VSS = 0V, TA = +25C,
VB = 0V.
14
VDD = +3V to +5V
Normalized Resistance ()
1
0.8
0.6
0.4
RWB
RWA
0.2
10
8
4
2
0
64
96
128 160
Code (Decimal)
192
224
TA = -40C to +85C
Refer to Figure 2-25
32
64
96
FIGURE 2-4:
vs. Temperature.
Nominal Resistance 10 k
70
60
RAB
50
40
30
RWB
Code = 80h
20
10
0
-40 -25 -10
TA = -40C to +85C
VA = 3V
60
50
40
30
20
10
0
-10
0
32
64
96
128
160
192
224
256
FIGURE 2-5:
vs. Temperature.
50
65
80
95 110 125
FIGURE 2-3:
Potentiometer Mode
Tempco vs. Code.
Nominal Resistance 50 k
120
RAB
100
80
RWB
Code = 80h
60
40
20
0
-40 -25 -10
20
35
50
65
80
95 110 125
Temperature (C)
Code (Decimal)
35
140
Nominal Resistance (k)
70
20
Temperature (C)
Code (Decimal)
FIGURE 2-2:
Code.
20 35 50 65 80 95 110 125
Temperature (C)
FIGURE 2-1:
Normalized Wiper to End
Terminal Resistance vs. Code.
0.5
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
256
32
RWB
Code = 80h
0
0
RAB
12
FIGURE 2-6:
vs. Temperature.
DS11195C-page 7
MCP41XXX/42XXX
TA = +85C
TA = +25C
TA = -40C
32
64
FIGURE 2-7:
Code.
96 128 160
Code (Decimal)
224
TA = -40C to +85C,
VA = no connect,
RWB measured
2500
2000
1500
1000
500
0
0
32
64
96
280
VDD = 5V
230
130
80
VDD = 3V
30
5
FIGURE 2-10:
Temperature.
1000
900
800
700
500
400
A
C
300
200
100
1k
10k
100
10
1
-40 -25 -10 5
20 35 50 65 80 95 11 12
0 5
Temperature (C)
FIGURE 2-9:
Temperature.
DS11195C-page 8
FIGURE 2-11:
Clock Frequency.
1000
600
20 35 50 65 80 95 110 125
Temperature (C)
Code (Decimal)
FIGURE 2-8:
Code.
FCLK = 3 MHz
Code = FFh
180
256
3000
Rheostat Mode TempCo
(ppm / C)
192
0.5
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
Note: Unless otherwise indicated, curve represents 10 k, 50 k and 100 k devices, VDD = 5V, VSS = 0V, TA = +25C,
VB = 0V.
100k
1M
Clock Frequency (Hz)
10M
VDD = 5.5V
0
-1
-2
-3
-4
-5
-6
-7
0
FIGURE 2-12:
Reset & Shutdown Pins
Current vs. Voltage.
MCP41XXX/42XXX
Note: Unless otherwise indicated, curve represents 10 k, 50 k and 100 k devices, VDD = 5V, VSS = 0V, TA = +25C,
VB = 0V.
Number of Occurrences
180
160
140
CL = 27 pF
MCP41010,MCP42010
Code = 00h,
Sample Size = 400
VOUT
120
FFh
100
80
00h
60
40
20
CS
0
47 48 49 50 51 52 53 54 55 56 57 58 59
Wiper Resistance ()
FIGURE 2-13:
10 k Device Wiper
Resistance Histogram.
Number of Occurrences
140
FIGURE 2-16:
CL = 27 pF
MCP41050, MCP41100,
MCP42050, MCP42100
Code = 00h,
Sample Size = 796
120
100
Code = 80h
VOUT
80
60
40
20
CS
0
115 117 119 121 123 125 127 129 131 133
Wiper Resistance ()
FIGURE 2-14:
50 k, 100 k Device Wiper
Resistance Histogram.
FIGURE 2-17:
Time.
CL = 17 pF
Code = FFh
Code = 80h
-6
Code = 40h
VOUT
Code = 7Fh
Code = 80h
Gain (dB)
-12
Code = 20h
-18
Code = 10h
-24
Code = 08h
-30
Code = 04h
-36
Code = 02h
-42
CS
-48
-54
-60
FIGURE 2-15:
Code = 01h
100
1k
10k
100k
Frequency (Hz)
1M
10M
FIGURE 2-18:
Gain vs. Frequency for
10 k Potentiometer.
DS11195C-page 9
MCP41XXX/42XXX
Note: Unless otherwise indicated, curve represents 10 k, 50 k and 100 k devices, VDD = 5V, VSS = 0V, TA = +25C,
VB = 0V.
6
35
Code = 80h
-6
Code = 40h
-12
Code = 10h
-24
Code = 08h
-30
Code = 04h
-36
Code = 02h
-42
100
1k
10k
100k
Frequency (Hz)
1M
100 k Potentiometer
Wiper Resistance ()
Code = 20h
-18
Code = 10h
-24
Code = 08h
-30
Code = 04h
-36
Code = 02h
-42
Code = 01h
-48
CL = 30pF, Refer to Figure 2-29
MCP41100, MCP42100 (100k potentiometers)
-54
100
1k
100k
Frequency (Hz)
10k
Frequency (Hz)
100k
VDD = 2.7V
500
400
300
200
VDD = 5V
100
0
FIGURE 2-23:
Voltage.
279 kHz
10 k
-18
-24
50 k
CL = 30 pF, Code = 80h
Refer to Figure 2-29
1k
FIGURE 2-21:
DS11195C-page 10
10k
100k
Frequency (Hz)
Code = 00h
Refer to Figure 2-27
-3 dB Bandwidths.
350
300
VDD = 2.7V
250
200
150
VDD = 5V
100
50
0
100 k
1M
Wiper Resistance ()
1.06 MHz
145 kHz
400
-6
450
-30
10M
MCP41010, MCP42010
Iw = 1 mA, Code = 00h,
Refer to Figure 2-27
600
1M
-12
1M
FIGURE 2-20:
Gain vs. Frequency for
100k Potentiometer.
-36
10k
700
Code = 40h
-12
1k
FIGURE 2-22:
Power Supply Rejection
Ratio vs. Frequency.
Code = 80h
-6
Gain (dB)
10M
Code = FFh
Gain (dB)
50 k Potentiometer
15
FIGURE 2-19:
Gain vs. Frequency for
50k Potentiometer.
-60
20
10
CL = 30pF, Refer to Figure 2-29
MCP41050, MCP42050 (50k potentiometers)
-54
-60
25
Code = 01h
-48
10 k Potentiometer
30
Code = 20h
-18
PSRR (dB)
Gain (dB)
40
Code = FFh
10M
FIGURE 2-24:
50 k & 100 k Wiper
Resistance vs. Voltage.
MCP41XXX/42XXX
2.1
V+
B
DUT
VA
V+ = VDD
1LSB = V+/256
VDD A
V+
B
DUT
+
VMEAS*
-
W
+ V
MEAS*
-
FIGURE 2-25:
Potentiometer Divider NonLinearity Error Test Circuit (DNL, INL).
No Connection
FIGURE 2-28:
Power Supply Sensitivity
Test Circuit (PSS, PSRR).
IW
W
+
- VMEAS*
DUT
A
VIN
Rsw = 0.1V
Isw
Code = 00h
A
W
B
ISW
+
-
+5V
W
VOUT
+
-
DUT
B
OFFSET
GND
FIGURE 2-26:
Resistor Position NonLinearity Error Test Circuit (Rheostat operation
DNL, INL).
DUT
VDD
)
VMEAS
2.5V DC
FIGURE 2-29:
Circuit.
0.1V
DUT
B
+5V
VSS = 0 to VDD
VIN
FIGURE 2-27:
Circuit.
+
2.5V DC
Offset
FIGURE 2-30:
VOUT
MCP601
DS11195C-page 11
MCP41XXX/42XXX
3.0
PIN DESCRIPTIONS
3.1
PA0, PA1
3.9
Shutdown (SHDN)
(MCP42XXX devices only)
3.4
TABLE 3-1:
3.2
PB0, PB1
3.3
PW0, PW1
This is the SPI port chip select pin and is used to execute a new command after it has been loaded into the
shift register. This pin has a Schmitt Trigger input.
3.5
3.6
This is the SPI port serial data input pin. The command
and data bytes are clocked into the shift register using
this pin. This pin is gated to the CS pin (i.e., the device
will not draw any more current if the SI pin is toggling
when the CS pin is high). This pin has a Schmitt Trigger
input.
3.7
This is the SPI port serial data output pin used for
daisy-chaining more than one device. Data is clocked
out of the SO pin on the falling edge of clock. This is a
push-pull output and does not go to a high-impedance
state when CS is high. It will drive a logic-low when CS
is high.
3.8
Reset (RS)
(MCP42XXX devices only)
DS11195C-page 12
MCP41XXX Pins
Pin # Name
Function
CS
Chip Select
SCK
Serial Clock
SI
VSS
Ground
PA0
PW0
PB0
VDD
Power
TABLE 3-2:
MCP42XXX Pins
Pin # Name
Function
CS
Chip Select
SCK
Serial Clock
SI
VSS
Ground
PB1
PW1
PA1
PA0
PW0
10
PB0
11
RS
Reset Input
12
13
SO
14
VDD
Power
MCP41XXX/42XXX
4.0
APPLICATIONS INFORMATION
PW0
PA0
PW1
PB0 PA1
PB1
RDAC2
RDAC1
Data Register 0
Data Register 1
D7
D7
D0
D0
RS
Decode
Logic
CS
D7
D0
SCK
SI
SO
SHDN
FIGURE 4-1:
Block diagram showing the MCP42XXX dual digital potentiometer. Data register 0 and
data register 1 are 8-bit registers allowing 256 positions for each wiper. Standard SPI pins are used with
the addition of the Shutdown (SHDN) and Reset (RS) pins. As shown, reset affects the data register and
wipers, bringing them to mid-scale. Shutdown disconnects the A terminal and connects the wiper to B,
without changing the state of the data registers.
VDD
VDD
C
Data Lines
MCP4XXXX
0.1 uF
0.1 uF
B
W
A
To Application
Circuit
When laying out the circuit for your digital potentiometer, bypass capacitors should be used. These capacitors should be placed as close as possible to the device
pin. A bypass capacitor value of 0.1 F is recommended. Digital and analog traces should be separated
as much as possible on the board, with no traces running underneath the device or the bypass capacitor.
Extra precautions should be taken to keep traces with
high-frequency signals (such as clock lines) as far as
possible from analog traces. Use of an analog ground
plane is recommended in order to keep the ground
potential the same for all devices on the board.
DS11195C-page 13
MCP41XXX/42XXX
4.1
Modes of Operation
4.1.1
RHEOSTAT MODE
4.1.2
POTENTIOMETER MODE
W
W
B
MCP4XXXX
V2
MCP4XXXX
Resistor
FIGURE 4-2:
Two-terminal or rheostat
configuration for the digital potentiometer. Acting
as a resistive element in the circuit, resistance is
controlled by changing the wiper setting.
Using the device in this mode allows control of the total
resistance between the two nodes. The total measured
resistance would be the least at code 00h, where the
wiper is tied to the B terminal. The resistance at this
code is equal to the wiper resistance, typically 52 for
the 10 k MCP4X010 devices, 125 for the 50 k
(MCP4X050), and 100 k (MCP4X100) devices. For
the 10 k device, the LSB size would be 39.0625
(assuming 10 k total resistance). The resistance
would then increase with this LSB size until the total
measured resistance at code FFh would be 9985.94.
The wiper will never directly connect to the A terminal
of the resistor stack.
FIGURE 4-3:
divider mode.
In the 00h state, the total resistance is the wiper resistance. To avoid damage to the internal wiper circuitry in
this configuration, care should be taken to ensure the
current flow never exceeds 1 mA.
For dual devices, the variation of channel-to-channel
matching of the total resistance from A to B is less than
1%. The device-to-device matching, however, can vary
up to 30%. In the rheostat mode, the resistance has a
positive temperature coefficient. The change in wiperto-end terminal resistance over temperature is shown
in Figure 2-8. The most variation over temperature will
occur in the first 6% of codes (code 00h to 0Fh) due to
the wiper resistance coefficient affecting the total resistance. The remaining codes are dominated by the total
resistance tempco RAB, typically 800 ppm/C.
DS11195C-page 14
MCP41XXX/42XXX
4.2
Typical Applications
4.2.1
PROGRAMMABLE SINGLE-ENDED
AMPLIFIERS
Potentiometers are often used to adjust system reference levels or gain. Programmable gain circuits using
digital potentiometers can be realized in a number of
different ways. An example of a single-supply, inverting
gain amplifier is shown in Figure 4-4. Due to the high
input impedance of the amplifier, the wiper resistance
is not included in the transfer function. For a single-supply, non-inverting gain configuration, the circuit in
Figure 4-5 can be used.
.
MCP41010
B
VDD
W
-IN
MCP606
+IN +
VREF
V OUT
VOUT
VSS
10
R
R
= V IN ------B- + V REF 1 + ------B-
R
R
A
Where:
VIN
R AB ( 256 D n )
R A = -------------------------------------256
R AB D n
R B = ----------------256
0.1
0
FIGURE 4-4:
Single-supply,
programmable, inverting gain amplifier using a
digital potentiometer.
VDD
VIN
+IN
MCP606
-IN RA
VOUT
VSS
RB
MCP41010
Where:
R AB ( 256 D n )
R A = -------------------------------------256
R
V OUT = V IN 1 + ------B-
R
A
R AB D n
R B = ----------------256
128
192
256
FIGURE 4-6:
Gain vs. Code for inverting
and differential amplifier circuits.
4.2.2
64
PROGRAMMABLE DIFFERENTIAL
AMPLIFIER
FIGURE 4-5:
Single-supply,
programmable, non-inverting gain amplifier.
2003 Microchip Technology Inc.
DS11195C-page 15
MCP41XXX/42XXX
4.3
1/2
MCP42010
A
B
VB
(SIG -)
-IN
VA
A
1/2
MCP42010
(SIG +)
Where:
RA
VDD
VOUT
MCP601
+IN
VSS
VREF
RB
R AB D n
= ----------------256
FIGURE 4-7:
Single Supply
programmable differential amplifier using digital
potentiometers.
PROGRAMMABLE OFFSET TRIM
VDD
MCP41010
R1
-IN
R2
MCP606
OUT
+IN +
VSS
0.1 uF
VSS
FIGURE 4-8:
By changing the values of
R1 and R2, the voltage output resolution of this
programmable voltage reference circuit is
affected.
DS11195C-page 16
R
V OUT = ( V A V B ) ------BRA
R AB ( 256 D n )
= -------------------------------------256
4.2.3
Calculating Resistances
PA
PW
PB
( R AB ) ( 256 D n )
- + RW
R WA ( D n ) = ------------------------------------------256
( R AB ) ( D n )
- + RW
R WB ( D n ) = --------------------------256
Where:
PA is the A terminal
PB is the B terminal
PW is the wiper terminal
RWA is resistance between Terminal A and wiper
RWB is resistance between Terminal B and Wiper
RAB is overall resistance for pot (10 k, 50 k or 100 k)
RW is wiper resistance
Dn is 8-bit value in data register for pot number n
FIGURE 4-9:
Potentiometer resistances
are a function of code. It should be noted that,
when using these equations for most feedback
amplifier circuits (see Figure 4-4 and Figure 4-5),
the wiper resistance can be omitted due to the
high impedance input of the amplifier.
PA
10 k
PW
Example:
R = 10 k
Code = C0h = 192d
PB
( R AB ) ( 256 D n )
R WA ( D n ) = ------------------------------------------- + RW
256
( 10k ) ( 256 192 )
R WA ( C0h ) = --------------------------------------------------- + 52
256
R WA ( C0h ) = 2552
( R AB ) ( D n )
- + RW
R WB ( D n ) = --------------------------256
( 10k ) ( 192 )
R WB ( C0h ) = ----------------------------------- + 52
256
R WB ( C0h ) = 7552
Note: All values shown are typical and
actual results will vary.
FIGURE 4-10:
calculations.
Example Resistance
MCP41XXX/42XXX
5.0
SERIAL INTERFACE
5.1
Command Byte
The first byte sent is always the command byte, followed by the data byte. The command byte contains
two command select bits and two potentiometer select
bits. Unused bits are dont care bits. The command
select bits are summarized in Figure 5-2. The command select bits C1 and C0 (bits 4:5) of the command
byte determine which command will be executed. If the
command bits are both 0s or 1s, then a NOP command will be executed once all 16 bits have been
loaded. This command is useful when using the daisychain configuration. When the command bits are 0,1, a
write command will be executed with the 8 bits sent in
the data byte. The data will be written to the potentiometer(s) determined by the potentiometer select bits. If
the command bits are 1,0, then a shutdown command
will be executed on the potentiometers determined by
the potentiometer select bits.
For the MCP42XXX devices, the potentiometer select
bits P1 and P0 (bits 0:1) determine which potentiometers are to be acted upon by the command. A corresponding 1 in the position signifies that the command
for that potentiometer will get executed, while a 0 signifies that the command will not effect that
potentiometer (see Figure 5-2).
5.2
When new data is written into one or more of the potentiometer data registers, the write command is followed
by the data byte for the new value. The command
select bits C1, C0 are set to 0,1. The potentiometer
selection bits P1 and P0 allow new values to be written
to potentiometer 0, potentiometer 1 (or both) with a single command. A 1 for either P1 or P0 will cause the
data to be written to the respective data register and a
0 for P1 or P0 will cause no change. See Figure 5-2
for the command format summary.
5.3
DS11195C-page 17
MCP41XXX/42XXX
Data is always latched
in on the rising edge
of SCK.
CS
1
10 11 12 13 14 15 16
SCK
COMMAND Byte
Dont
Care
Bits
SI
Command
Bits
Dont
Care
Bits
C1 C0 X
Data Byte
Channel
Select
Bits
X P1* P0 D7 D6 D5 D4 D3 D2 D1 D0
SO
There must always be multiples of 16 clocks while CS is low or commands will abort.
The serial data out pin (SO) is only available on the MCP42XXX device.
* P1 is a dont care bit for the MCP41XXX.
FIGURE 5-1:
X C1 C0 X
Command
Selection
Bits
C1 C0
Command
X P1* P0
Potentiometer
Selection
Bits
Command Summary
P1* P0
Potentiometer Selections
None
Write Data
Command executed on
Potentiometer 0.
Command executed on
Potentiometer 1.
Shutdown
None
FIGURE 5-2:
DS11195C-page 18
MCP41XXX/42XXX
5.4
Daisy-Chain Configuration
CS
1 2 3 4 5 6 7 8 9 10111213141516
1 2 3 4 5 6 7 8 9 10 111213141516
1 2 3 4 5 6 7 8 9 10 111213141516
SCK
Command Byte
for Device 3
SI
Data Byte
for Device 3
X XC C X X P P D DD DDDD D
SO
Command Byte
for Device 2
Data Byte
for Device 2
Command Byte
for Device 1
Data Byte
for Device 1
X XC C X X P P D DD DDDD D
X XC C X X P P D DD DDDD D
X XC C X X P P D DD DD DD D
X XC C X X P P D DD DDDD D
There must always be multiples of 16 clocks while CS is low or commands will abort.
The serial data out pin (SO) is only available on the MCP42XXX device.
FIGURE 5-3:
DS11195C-page 19
MCP41XXX/42XXX
CS
SCK
SO
Microcontroller
CS
SCK
SO
SI
Device 1
EXAMPLE:
CS
SCK
SI
SO
Device 2
SI
Device 3
XX10XX00 10101010
After 16 clocks, Device 2 and
Device 3 will both have all
zeros clocked in from the
previous parts shift register.
Device 1
XX10XX00 10101010
Device 2
00000000 00000000
d
Clock-In the command and
data for Device 2 (16 more
clocks). The data that was previously loaded gets shifted to
the next device on the chain.
SCK
Device 3*
Device 1
XX10XX11 11001100
CS
Device 3
00000000 00000000
Device 1
XX01XX10 11110000
Device 2
XX10XX00 10101010
Device 3
00000000 00000000
e
Clock-In the data for Device 1
(16 more clocks). The data that
was previously loaded into
Device 1 gets shifted into
Device 2 and Device 3 contains
the first byte loaded. Raise the
CS line to execute the commands for all 3 devices at the
same time.
FIGURE 5-4:
DS11195C-page 20
Device 1
XX10XX11 11001100
Device 2
XX01XX10 11110000
Device 3
XX10XX00 10101010
Daisy-Chain Configuration.
MCP41XXX/42XXX
5.5
The Reset pin (RS) will automatically set all potentiometer data latches to mid-scale (Code 80h) when pulled
low (provided that the pin is held low at least 150 ns
and CS is high). The reset will execute regardless of
the position of the SCK, SHDN and SI pins. It is possible to toggle RS low and back high while SHDN is low.
In this case, the potentiometer registers will reset to
mid-scale, but the potentiometer will remain in
shutdown mode until the SHDN pin is raised.
TABLE 5-1:
SCK
CS
RS
SHDN
Action
When held low, the shutdown pin causes the application circuit to go into a power-saving mode by open-circuiting the A terminal and shorting the B and W
terminals for all potentiometers. Data register contents
are not affected by entering shutdown mode (i.e., when
the SHDN pin is raised, the data register contents are
the same as before the shutdown mode was entered).
Static Operation.
All potentiometers exit hardware shutdown mode. Potentiometers will also exit software
shutdown mode if this rising
edge occurs after a low pulse
on CS. Contents of data
latches are restored.
Note:
5.6
5.7
Power-up Considerations
DS11195C-page 21
MCP41XXX/42XXX
5.8
10
11
12
13
14
15
16
D1
D0
SCK
COMMAND BYTE
Dont
Care
Bits
SI
SO
Command
Bits
C1
C0
Dont
Care
Bits
X
DATA BYTE
Channel
Select
Bits
P1* P0
D6
D5
D4
D3
D2
There must always be multiples of 16 clocks while CS is low or commands will abort.
The serial data out pin (SO) is only available on the MCP42XXX device.
FIGURE 5-5:
DS11195C-page 22
MCP41XXX/42XXX
6.0
PACKAGING INFORMATION
6.1
Example:
XXXXXXXX
XXXXXNNN
YYWW
MCP41010
I/P256
0313
Example:
XXXXXXXX
XXXXYYWW
NNN
MCP41050
I/SN0313
256
Example:
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
MCP42010
I/P
0313256
Example:
42050ISL
XXXXXXXXXXX
0313256
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
Example:
XXXXXXXX
YYWW
0313
NNN
256
Legend: XX...X
YY
WW
NNN
Note:
42100I
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard marking consists of Microchip part number, year code, week code, facility code, mask rev#,
and assembly code.
DS11195C-page 23
MCP41XXX/42XXX
8-Lead Plastic Dual In-line (P) 300 mil (PDIP)
E1
D
2
n
A2
A1
B1
p
eB
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
L
c
B1
B
eB
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS11195C-page 24
MCP41XXX/42XXX
8-Lead Plastic Small Outline (SN) Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
45
A2
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
h
L
c
B
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS11195C-page 25
MCP41XXX/42XXX
14-Lead Plastic Dual In-line (P) 300 mil (PDIP)
E1
2
n
E
A2
c
A1
B1
eB
Units
Dimension Limits
n
p
MIN
INCHES*
NOM
14
.100
.155
.130
MAX
MILLIMETERS
NOM
14
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
18.80
19.05
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
Molded Package Thickness
A2
.115
.145
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.300
.313
.325
Molded Package Width
E1
.240
.250
.260
Overall Length
D
.740
.750
.760
Tip to Seating Plane
L
.125
.130
.135
c
Lead Thickness
.008
.012
.015
Upper Lead Width
B1
.045
.058
.070
Lower Lead Width
B
.014
.018
.022
Overall Row Spacing
eB
.310
.370
.430
DS11195C-page 26
MAX
4.32
3.68
8.26
6.60
19.30
3.43
0.38
1.78
0.56
10.92
15
15
MCP41XXX/42XXX
14-Lead Plastic Small Outline (SL) Narrow, 150 mil (SOIC)
E
E1
2
B
h
45
c
A2
A1
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
h
L
c
B
MIN
.053
.052
.004
.228
.150
.337
.010
.016
0
.008
.014
0
0
INCHES*
NOM
14
.050
.061
.056
.007
.236
.154
.342
.015
.033
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.347
.020
.050
8
.010
.020
15
15
MILLIMETERS
NOM
14
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
5.99
3.81
3.90
8.56
8.69
0.25
0.38
0.41
0.84
0
4
0.20
0.23
0.36
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
8.81
0.51
1.27
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-065
DS11195C-page 27
MCP41XXX/42XXX
14-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
A
c
A1
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
L
c
B
MIN
.033
.002
.246
.169
.193
.020
0
.004
.007
0
0
INCHES
NOM
14
.026
.035
.004
.251
.173
.197
.024
4
.006
.010
5
5
A2
MAX
.043
.037
.006
.256
.177
.201
.028
8
.008
.012
10
10
MILLIMETERS*
NOM
MAX
14
0.65
1.10
0.85
0.90
0.95
0.05
0.10
0.15
6.25
6.38
6.50
4.30
4.40
4.50
4.90
5.00
5.10
0.50
0.60
0.70
0
4
8
0.09
0.15
0.20
0.19
0.25
0.30
0
5
10
0
5
10
MIN
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005 (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
DS11195C-page 28
MCP41XXX/42XXX
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
/XX
Device
Temperature
Range
Package
Device:
Temperature Range:
Package:
I
E
P
SN
SL
ST
=
=
-40C to +85C
-40C to +125C
=
=
=
=
Examples:
a)
b)
c)
h)
i)
MCP41010-I/SN:
I-Temp., 8LD SOIC pkg.
MCP41010-E/P:
E-Temp., 8LD PDIP pkg.
MCP41010T-I/SN: Tape and Reel, I-Temp.,
8LD SOIC pkg.
MCP41050-E/SN: E-Temp., 8LD SOIC pkg.
MCP41050-I/P:
I-Temp., 8LD PDIP pkg.
MCP41050-E/SN: E-Temp., 8LD SOIC pkg.
MCP41100-I/SN:
I-Temp., 8LD SOIC
package.
MCP41100-E/P:
E-Temp., 8LD PDIP pkg.
MCP41100T-I/SN: I-Temp., 8LD SOIC pkg.
a)
b)
c)
MCP42010-E/P:
MCP42010-I/SL:
MCP42010-E/ST:
d)
MCP42010T-I/ST:
e)
f)
MCP42050-E/P:
MCP42050T-I/SL:
g)
h)
MCP42050-E/SL:
MCP42050-I/ST:
i)
MCP42050T-I/SL:
j)
MCP42050T-I/ST:
k)
l)
m)
MCP42100-E/P:
MCP42100-I/SL:
MCP42100-E/ST:
n)
MCP42100T-I/SL:
o)
MCP42100T-I/ST:
d)
e)
f)
g)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS11195C-page 29
MCP41XXX/42XXX
NOTES:
DS11195C-page 30
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and
PowerSmart are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Accuron, Application Maestro, dsPICDEM, dsPICDEM.net,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, InCircuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,
SmartSensor, SmartShunt, SmartTel and Total Endurance are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Companys quality system processes and
procedures are QS-9000 compliant for its
PICmicro 8-bit MCUs, KEELOQ code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchips quality system for the
design and manufacture of development
systems is ISO 9001 certified.
DS11195C-page 31
M
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
Corporate Office
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DS11195C-page 32
Korea
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Taiwan
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EUROPE
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Germany
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Italy
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Netherlands
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United Kingdom
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07/28/03