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    Unit IV Bulk and Surface Micromachining

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    supriya
    This document discusses various topics related to bulk and surface micromachining processes and piezoelectricity. It defines processes such as CVD, PVD, wet etching, dry etching, sputtering, oxidation, diffusion and LIGA. It also compares wet and dry etching, anisotropic etching processes, and different types of CVD. The document requests explanations of the photolithography process, surface micromachining steps, oxidation, diffusion, ion implantation and sputtering. It also covers anisotropic wet and dry etching, physical vapor deposition, and different types of CVD and their applications. For piezoelectricity, it defines key concepts, lists piezoelectric materials, and requests explanations of piezoelectric actu

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    Unit IV Bulk and Surface Micromachining

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    supriya
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    This document discusses various topics related to bulk and surface micromachining processes and piezoelectricity. It defines processes such as CVD, PVD, wet etching, dry etching, sputtering, oxidation, diffusion and LIGA. It also compares wet and dry etching, anisotropic etching processes, and different types of CVD. The document requests explanations of the photolithography process, surface micromachining steps, oxidation, diffusion, ion implantation and sputtering. It also covers anisotropic wet and dry etching, physical vapor deposition, and different types of CVD and their applications. For piezoelectricity, it defines key concepts, lists piezoelectric materials, and requests explanations of piezoelectric actu

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    This document discusses various topics related to bulk and surface micromachining processes and piezoelectricity. It defines processes such as CVD, PVD, wet etching, dry etching, sputtering, oxidation, diffusion and LIGA. It also compares wet and dry etching, anisotropic etching processes, and different types of CVD. The document requests explanations of the photolithography process, surface micromachining steps, oxidation, diffusion, ion implantation and sputtering. It also covers anisotropic wet and dry etching, physical vapor deposition, and different types of CVD and their applications. For piezoelectricity, it defines key concepts, lists piezoelectric materials, and requests explanations of piezoelectric actu

    Copyright:

    © All Rights Reserved
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    Download as pdf or txt
    11 views2 pages

    Unit IV Bulk and Surface Micromachining

    Uploaded by

    supriya
    This document discusses various topics related to bulk and surface micromachining processes and piezoelectricity. It defines processes such as CVD, PVD, wet etching, dry etching, sputtering, oxidation, diffusion and LIGA. It also compares wet and dry etching, anisotropic etching processes, and different types of CVD. The document requests explanations of the photolithography process, surface micromachining steps, oxidation, diffusion, ion implantation and sputtering. It also covers anisotropic wet and dry etching, physical vapor deposition, and different types of CVD and their applications. For piezoelectricity, it defines key concepts, lists piezoelectric materials, and requests explanations of piezoelectric actu

    Copyright:

    © All Rights Reserved
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    Unit IV Bulk and surface Micromachining

    1. Differentiate CVD and PVD.


    2. Define wet etching.
    3. Define dry etching.
    4. What is sputtering?
    5. What is LIGA process?
    6. Define oxidation.
    7. Define diffusion.
    8. List 4 relevant points of comparison between wet etching and dry etching
    9. Differentiate between anisotropic etching process using DRIE and wet chemical etching
    10. What is stiction?
    11. What is critical point drying?
    12. What are etch stops? Give examples of etch stops are implemented.
    13. What do you mean by corner compensation?
    Part-B
    1. With neat labeled figures explain in detail the steps involved in photolithography process for
    microdevices?
    2. Explain steps involved in surface micromachining with relevant figures.
    3. Discuss in detail the MEMS fabrication processes: (i) Oxidation. (ii) Diffusion and (iii) Ion
    implanatation (iv) Sputtering
    4. Discuss in detail with relevant diagrams and equations anisotropic wet etching of Silicon.
    5. Discuss anisotropic dry etching processes in MEMS micro-machining
    6. Describe physical vapor deposition with neat diagrams.
    7. Compare APCVD, LPCVD and PECVD and give an application for each
    8. Explain LIGA process with relevant details and diagrams.
    .
    Unit III Piezoelectricity
    1. Define Piezo-electric effect.
    2. Define electromechanical coupling coefficient.
    3. Write the properties of Piezo electric materials.
    4. What is the principle of acoustic sensor?
    5. Write the governing equations of of piezoelectricity.

    6. Write the governing equations for inverse piezoelectric effect.


    7. List the commonly used Piezo electric materials.
    8. Write the principle of surface elastic wave devices.
    Part-B
    1. With schematic diagram explain theory, working and fabrication of a cantilever type
    piezoelectric actuator.
    2. With neat diagram explain Piezo electric accelerometer.
    3. With schematic diagram explain piezoelectric microphone and its fabrication process.
    4. With schematic diagram explain theory working and fabrication of a cantilever type piezoelectric
    microphone.
    5. Explain tactile sensor array with neat diagram.
    6. Explain piezoelectric flow sensor with neat diagram.
    7. Explain surface acoustic wave and flexural plate wave with neat diagram.

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