Professional Documents
Culture Documents
PFMEA Solder Paste Printing 03 Sept 2016 (Zul)
PFMEA Solder Paste Printing 03 Sept 2016 (Zul)
PFMEA Solder Paste Printing 03 Sept 2016 (Zul)
Total Pages
Customer
SPACELABS
Project No.
Project Name
Document No.
FMEA/MP/008
Document Title
Revision History
S/N
1
F-01-01 Rev. B
This is
Engineering
Wahyudi
Material
Production
Budiawan Wawan
Program
Quality Assurance
Ling CK
F-01-01 Rev. B
es
ver Page)
ame
N/A
Process FMEA of DEK Screen Printing and KOH YOUNG SPI
Machine
Title
History
F-01-01 Rev. B
Date
Revision
Originator
2-Sep-16
Zulfadli
F-01-01 Rev. B
Process Name
Part Name
: N/A
Customer
: Spacelabs
Step / Opr. #
Process Function
Requirements
Machine Installation
Machine Software
Solder Paste Inspection (SPI)
Machine
Operation Temperature
Max 30 C
Environmental
ESD Requirement
Machine grounding
Installation Manual
Operation Manual
Documentation
Electrical Drawing
Machine Programming
Machine Operation
Machine Maintenance
Training
Work Instruction
Operation
MES SYSTEM
Preventive Maintenance
Emergency Switch
Safety
Severity
Power failure
Power surge
Power failure
Power surge
Power failure
Power surge
Power failure
Power surge
Humidity > 80 %
10
10
Machine malfunction
SPI machine will not detect solder paste missalignment causing escapee from SPI
inspection
Barcode in activate
Machine Operation and Maintenance gudeline Machine operation and maintenance not
(WI) shall not avaiable
proper
PCB warpage
PCB magazine indexing pitch over than PCB Pusher will miss to push one or more PCB
stacking
stacking that cause decrease productivity
PCB magazine indexing pitch lower than PCB Pusher will push on slot which is no PCB
stacking
cause decrease the productivity
If there is solder paste printing problem (missprint, miss-alignment etc) will cause to clean
actual PCB.
IPA Overflow
Squeeze dented
Squeeze curly
Squeeze not match with process type (Water Solder paste contamination between Water
soluble and Non Clean)
Soluble and No Clean
Component broken
Squeeze dirty
Sgueeze loose
Stencil dented
Production use opened container solder paste Creating solderability issues in reflow
that already exceed 24 hour
soldering process
10
10
Potential Cause(s) /
Mechanisms of Failure
Occurrence
Class
Key Date
Moderate
High
High
High
Moderate
Moderate
High
Moderate
High
High
High
Moderate
Moderate
High
Moderate
High
Moderate
High
High
Moderate
High
High
High
Moderate
High
Moderate
High
High
High
High
Extreme
Extreme
High
High
High
High
High
High
Moderate
Moderate
High
Moderate
Moderate
Moderate
Moderate
High
High
High
High
High
Moderate
Moderate
High
High
High
High
Moderate
High
High
High
Moderate
Moderate
High
High
High
High
High
High
High
High
High
High
High
Moderate
High
High
High
High
Low
High
High
High
Moderate
Moderate
Moderate
Moderate
Moderate
High
High
Moderate
Moderate
Moderate
High
Moderate
Moderate
High
High
Moderate
Moderate
Moderate
Moderate
Moderate
Moderate
Moderate
Moderate
Moderate
High
High
High
High
High
Moderate
Moderate
High
Moderate
Moderate
Moderate
High
Moderate
No stencil identification
Moderate
Moderate
High
High
Moderate
Moderate
Moderate
Moderate
Moderate
Moderate
Moderate
Moderate
Moderate
Refrigerator spoilt
High
High
High
High
High
High
High
High
High
High
High
High
High
High
High
High
Moderate
Moderate
High
Moderate
High
None
Moderate
High
High
High
High
Moderate
Moderate
Moderate
High
High
High
High
High
High
Bambang K,
use actual PCB for fill in PCB size in the PCB data
parameters
use actual PCB for fill in PCB size in the PCB data
parameters
use actual PCB for fill in PCB size in the PCB data
parameters
use actual PCB for fill in PCB size in the PCB data
parameters
use actual PCB for fill in PCB size in the PCB data
parameters
use actual PCB for fill in PCB size in the PCB data
parameters
Setting the PCB size using actual PCB to ensure the setting
is matching with PCB width.
Setting the PCB size using actual PCB to ensure the setting
is matching with PCB width.
Setting the PCB size using actual PCB to ensure the setting
is matching with PCB width.
Setting the out put link conveyor widht using actual PCB on
top and bottom magazine to ensure the setting is matching
with PCB width.
Setting the out put link conveyor widht using actual PCB on
top and bottom magazine to ensure the setting is matching
with PCB width.
ALYSIS
Prepared By
Bambang K,
Approved By
Detection.
RPN
Doc. No.
20
28
60
42
48
40
56
20
28
60
42
48
40
56
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28
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42
48
40
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20
28
60
42
48
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24
24
24
40
40
42
32
32
32
32
32
20
20
28
20
30
20
20
63
63
63
63
63
45
45
63
63
63
63
45
21
70
70
10
30
42
42
42
42
42
42
42
21
48
96
96
36
At SPI machine only the certify operator has own user and
pasword can log in to machine
63
96
96
96
27
96
63
42
45
30
45
63
45
54
63
63
30
30
42
45
96
24
24
30
24
24
30
Machine sensor will active if the level IPA lower than control
limit
20
30
30
45
30
96
96
42
42
48
20
20
28
30
20
20
48
30
Buy off PCB after solder paste printing proces every setup
setup complited
45
24
42
63
36
36
36
36
36
36
36
36
30
28
42
28
42
28
28
28
28
28
42
42
42
42
Production and IPQC check and buy off use form F-MP-0416 revC
28
Production and IPQC check and buy off use form F-MP-0416 revC
28
Production and IPQC check and buy off use form F-MP-0416 revC
28
Production and IPQC check and buy off use form F-MP-0416 revC
28
14
36
36
36
42
45
24
30
63
24
24
42
45
45
32
32
32
32
30
30
: Zulfadli
:
Responsibili
ty / Target
Date
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Action Implemented
Sev.
Recommend
ed action.
: FMEA/MP/008
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IT Team continuesly
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IT Team continuesly
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WW25-2016
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1 SEVERITY
2 OCCURANCE
Risk
Extereme
High
Moderate
Low
None
3 DETECTION
Occurence of Effect
Failure
Rate
in 2
in 3
in 8
in 20
in 80
in 400
in 2000
in 15K
1
1
1
Process is not in statistical control. Similar processes have
experienced problems
1
1
Process is in statistical control but with isolated failures.
Previous processes have experienced occasional failures or out- 1
of-control conditions
1
Process in statistical control
1
Process is in statistical control. Only isolated failures associated
with almost identical processes
1 in 150K
Failure is unlikely. No known failures associated with almost
identical processes.
1 in 1.5M
Failure is almost inevitable
Capability
(Cpk)
< 0.33
> 0.33
> 0.51
< 0.67
> 0.83
> 1.00
> 1.17
> 1.33
Rating
10
9
8
7
6
5
4
3
> 1.50
> 1.67