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Digital Design and System Implementation Overview of Physical Implementations
Digital Design and System Implementation Overview of Physical Implementations
Power Supplies
Tri-state buffers
Integrated Circuits
Chip in Package
3 - 10 conductive layers
Package provides:
spreading of chip-level signal paths to
board-level
heat dissipation.
fiberglass or ceramic
1-25 conductive layers
1-20in on a side
IC packages are
soldered down
Multichip Modules (MCMs)
Multiple chips directly connected to a substrate
(silicon, ceramic, plastic, fiberglass) without chip packages
Integrated Circuits
Integrated Circuits
Uses for digital IC technology today:
Standard microprocessors
CMOS Devices
NAND gate
Note:
Top View
Cross Section
nFET
The gate acts like a capacitor. A high voltage on
the gate attracts charge into the channel. If a
voltage exists between the source and drain a
current will flow. In its simplest
approximation, the device acts like a switch.
pFET
NOR gate
Note:
Transmission Gate
Pass-Transistor Multiplexer
2-to-1 multiplexer:
c = sa + sb
Does not directly connect to Vdd and GND, but can be combined with
logic gates or buffers to simplify many logic structures
a
b
20 transistors
36 Transistors
Tri-state Buffers
Tri-state Buffers
Transistor circuit for
inverting tri-state buffer:
Tri-state Buffer:
high impedance
(output disconnected)
Tri-state buffers are used when multiple circuits all connect to a common bus.
Only one circuit at a time is allowed to drive the bus. All others disconnect.
Bidirectional
connections:
Busses:
Variations
Inverting buffer
Inverted enable
transmission gate
1/2 Register
clk
R
E
G
Combinational
Logic
State
clk
CLK
clk
P2
P1
CS 150 Fall 2005 - Lec #26 Digital Design 19
R
E
G
Out
1/2 Register