Scribd Logo
Upload

Welcome to Scribd!

  • Typical Procedure For Lithography IV. Exposure System/Optics

    Uploaded by

    stansilaw
    9 views1 page
    The document discusses the typical lithography process used in microfabrication. It involves cleaning the wafer, depositing a photoresist, soft baking to remove solvents, aligning and exposing the wafer using a mask in either contact, proximity, or projection printing. Contact printing involves the mask physically touching the wafer, allowing for exposure of surfaces with topography but risking mask damage. Proximity printing keeps the mask close but not touching, while projection printing uses a reduced mask and step-and-repeat exposure to enable smaller feature sizes in a more cost-effective manner. After exposure, the photoresist is developed and the wafer is descumed in oxygen plasma to complete the lithography stage.

    Original Description:

    microfabrication technology 20

    Original Title

    Lec8m.lithography.ee143.f14.Ctn

    Copyright

    © © All Rights Reserved

    Available Formats

    PDF, TXT or read online from Scribd

    Did you find this document useful?

    Is this content inappropriate?

    Report this Document
    The document discusses the typical lithography process used in microfabrication. It involves cleaning the wafer, depositing a photoresist, soft baking to remove solvents, aligning and exposing the wafer using a mask in either contact, proximity, or projection printing. Contact printing involves the mask physically touching the wafer, allowing for exposure of surfaces with topography but risking mask damage. Proximity printing keeps the mask close but not touching, while projection printing uses a reduced mask and step-and-repeat exposure to enable smaller feature sizes in a more cost-effective manner. After exposure, the photoresist is developed and the wafer is descumed in oxygen plasma to complete the lithography stage.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as pdf or txt
    9 views1 page

    Typical Procedure For Lithography IV. Exposure System/Optics

    Uploaded by

    stansilaw
    The document discusses the typical lithography process used in microfabrication. It involves cleaning the wafer, depositing a photoresist, soft baking to remove solvents, aligning and exposing the wafer using a mask in either contact, proximity, or projection printing. Contact printing involves the mask physically touching the wafer, allowing for exposure of surfaces with topography but risking mask damage. Proximity printing keeps the mask close but not touching, while projection printing uses a reduced mask and step-and-repeat exposure to enable smaller feature sizes in a more cost-effective manner. After exposure, the photoresist is developed and the wafer is descumed in oxygen plasma to complete the lithography stage.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as pdf or txt
    of 1

    EE 143: Microfabrication Technology

    Lecture 8m: Lithography

    CTN

    Typical Procedure for Lithography

    IV. Exposure System/Optics


    Proximity Printing

    Contact Printing
    Clean Wafer

    9/23/14

    Very important step


    30 min. @ 120C
    pre-bake

    Dry Wafer
    Deposit HMDS

    (for oxide on
    wafer surface)

    Spin-on PR

    30-60 sec @
    1000-5000 rpm

    Topography very important:


    PR
    Thicker and unfocused

    underexpose
    overexpose
    2 min @ 90C
    Improve adhesion and remove solvent from PR

    Soft Bake

    Photoresist

    Oxygen plasma (low power ~ 50W)

    Align & Expose


    Develop

    Descum

    Photoresist

    Mask in contact with wafer


    Problem: mask pattern can become
    damaged with each exposure
    must make a new mask after x
    number of exposures

    Post Bake

    Mask in very close


    proximity but not touching

    1X printing very useful for MEMS can expose surfaces


    with large topography (where reduction printers cannot)

    EE 143: Microfabrication Technology

    LecM 1

    C. Nguyen

    8/20/09

    11

    EE 143: Microfabrication Technology

    IV. Exposure System/Optics


    Projection Printing

    Dominates in IC transistor fabrication


    5X or 10X reduction typical
    Mask minimum features can be larger
    than the actual printed features by
    the focused reduction factor less
    expensive mask costs
    Less susceptible to thermal variation
    (in the mask) than 1X printing
    Can use focusing tricks to improve
    yield:
    mask

    Photoresist

    Step &
    repeat

    EE 143: Microfabrication Technology

    Dust particle will


    be out of focus
    better yield!

    wafer

    LecM 1

    C. Nguyen

    8/20/09

    13

    Copyright @ 2014 Regents of the University of California at Berkeley

    LecM 1

    C. Nguyen

    8/20/09

    12

    You might also like