DARPA

From MEMS to NEMS:

Smaller Is Still Better
Clark T.-C. Nguyen
Dept. of Electrical Engineering & Computer Science
University of Michigan
Ann Arbor, Michigan 48105-2122
(Last Month: Program Manager, DARPA/MTO)
MARC06 Meeting
Jan. 25-26, 2006
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

Outline

Introduction:

MEMS technology
integration with transistors: an early driver for MEMS
Benefits of Scaling
size reduction
speed, energy conservation, complexity, economy
DARPA/MTO Program Examples
Nano Mechanical Array Signal Processors (NMASP)
Chip-Scale Atomic Clock (CSAC)
Micro Gas Analyzers (MGA)
Conclusions (Whats Next?)

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

MEMS: Micro Electro Mechanical Systems

A device constructed using micromachining (MEMS) tech.

A micro-scale or smaller device/system that operates mainly
via a mechanical or electromechanical means
At least some of the signals flowing through a MEMS device
are best described in terms of mechanical variables, e.g.,
displacement, velocity, acceleration, temperature, flow
Input:
voltage, current
acceleration, velocity
light, heat
Transducer
Transducerto
to
Convert
Control
Convert Control
to
toaaMechanical
Mechanical
Variable
Variable(e.g.,
(e.g.,
displacement,
displacement,
velocity,
velocity,stress,
stress,
heat,
heat,)
)

MEMS

Output:
voltage, current
acceleration, velocity
light, heat,
[Wu, UCLA]

Control:
voltage, current
acceleration
velocity
light, heat,

Angle set by mechanical means

to control the path of light
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

Other Common Attributes of MEMS

Feature sizes measured in microns or less

80 mm

Gimballed, Spinning
Macro-Gyroscope

[Najafi, Michigan]

Micromechanical
Vibrating Ring Gyroscope

MEMS
Technology
(for 80X size
Reduction)

1 mm
Signal Conditioning Circuits

Merges computation with sensing and actuation to change

the way we perceive and control the physical world

Planar lithographic technology often used for fabrication
can use fab equipment identical to those needed for ICs
however, some fabrication steps transcend those of
conventional IC processing
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

Bulk Micromachining and Bonding

Micromechanical
Vibrating Ring Gyroscope

Use the wafer itself as the

structural material
Adv: very large aspect ratios,
thick structures
Example: deep etching and
wafer bonding

1 mm
[Najafi, Michigan]

Movable
Silicon Substrate
Structure
Silicon Substrate

Electrode

Glass Substrate
Metal Interconnect

[Pisano, UC Berkeley]

Anchor

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Microrotor
(for a microengine)

DARPA

Surface Micromachining

Fabrication steps compatible with planar IC processing

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

Single-Chip Ckt/MEMS Integration

Completely monolithic, low phase noise, high-Q oscillator

(effectively, an integrated crystal oscillator)

Oscilloscope
Output
Waveform
[Nguyen, Howe
[Nguyen,
Howe1993]
1993]

To allow the use of >600oC processing temperatures,

tungsten (instead of aluminum) is used for metallization

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

Technology Trend and Roadmap for MEMS

Number of Transistors

increasing ability to compute

109

Pentium 4

108
107

CPUs

106

ADXL-50

105
104
103
102
101

Distributed
Structural
Control

Terabit/cm2
Data Storage

Digital Micromirror
Device (DMD)

Phased-Array Displays
Inertial
Navigation OMM 32x32 Antenna
Integrated Fluidic
On a Chip
Systems
i-STAT 1
Adaptive
Weapons, Caliper
Optics
Safing, Arming,
Future MEMS
and Fusing
Integration Levels
Optical Switches
& Aligners
ADXL-278
Enabled Applications
ADXRS
ADXL-78

100
0
10
Majority of

Early MEMS
Devices
(mostly sensors)

101

102

103

104

105

106

107

Number of Mechanical Components

increasing ability to sense and act

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

108

109

DARPA

Benefits of Size Reduction: ICs

Numerous benefits attained by scaling of transistors:

Lower
Power

Higher Current Drive

Lower Capacitance
Higher Integration Density
Lower Supply Voltage

Faster
Speed

Higher Circuit Complexity & Economy of Scale

But some drawbacks:

poorer reliability
(e.g., hot e- effects)
lower dynamic range
(analog ckts suffer)

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

Example: Micromechanical Accelerometer

The MEMS Advantage:

400 m

Tinymass
massmeans
means
>30X size reduction forTiny
small
output

need
small
output

need
accelerometer mechanical
element
integrated
integratedtransistor
transistor
allows integration with
ICstotocompensate
circuits
circuits
compensate

Basic Operation Principle

xo

x Fi = ma

Displacement
Spring

Inertial Force
Proof Mass
Acceleration
Analog Devices ADXL 78

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

Technology Trend and Roadmap for MEMS

Number of Transistors

increasing ability to compute

109

Pentium 4

108
107

Distributed
Structural
2 8x8 Optical
Control
OMM
Terabit/cm
Cross-Connect Switch
Data Storage

CPUs
ADXL-50

Adv.:
switching,
Phased-Array
Displays
Adv.:faster
faster
switching,low
low
loss,
larger
networks
Antenna
OMM loss,
32x32 larger networks

Analog 10
Devices
ADXRS
6
Integrated Gyroscope Inertial

Navigation
Adv.:
Adv.:small
smallsize
sizeOn a Chipi-STAT 1
Adaptive
Weapons, Caliper
104
Optics
Safing, Arming,
and Fusing
103
Optical Switches
& Aligners
ADXL-278
2
10
ADXRS
Caliper Microfluidic
Chip
ADXL-78

105

101

Early MEMS
Devices
(mostly sensors)

Integrated Fluidic
Systems
Future MEMS
Integration Levels
Enabled Applications

TI Digital Micromirror Device

100
0
10
Majority of

Digital Micromirror
Device (DMD)

101

102

103

104

Adv.:
Adv.:low
lowloss,
loss,fast
fast
switching,
high
fill
factor 9
7
fill
105 switching,
106
10high
108factor
10

Number of Mechanical Components

increasing ability to sense and act

Adv.:
Adv.:small
smallsize,
size,small
small
sample,
analysis
speed
C. T.-C. Nguyen,
From MEMSfast
to
NEMS:
Smaller Is Still Better,
MARC06 Meeting, 1/25-26/05
fast
analysis
speed
sample,

DARPA

Benefits of Size Reduction: MEMS

Benefits of size reduction clear for ICs in elect. domain

size reduction speed, low power, complexity, economy

MEMS: enables a similar concept, but

MEMS extends the benefits of size reduction

beyond the electrical domain
Performance enhancements for application
domains beyond those satisfied by electronics
in the same general categories
Speed

Frequency , Thermal Time Const.

Power Consumption

Actuation Energy , Heating Power

Complexity

Integration Density , Functionality

Economy

Batch Fab. Pot. (esp. for packaging)

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

Nano Mechanical Array Signal

Processors (NMASP)

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

Basic Concept: Scaling Guitar Strings

Mechanical Resonator

Vib. Amplitude

Guitar String

Low Q
High Q
110 Hz

Freq.

Vibrating
VibratingA
A
String
(110
String (110Hz)
Hz)

[Bannon 1996]

Stiffness

Guitar

Freq. Equation:
1 kr
fo =
2 m r
Freq.

Mass

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

fo=8.5MHz
Qvac =8,000
Qair ~50

Performance:
Lr=40.8m
mr ~ 10-13 kg
Wr=8m, hr=2m
d=1000, VP=5V
Press.=70mTorr

3CC 3/4 Bridged Mechanical Filter

DARPA

Performance:
Performance:
fof =9MHz,
BW=20kHz, PBW=0.2%
o=9MHz, BW=20kHz, PBW=0.2%
I.L.=2.79dB,
I.L.=2.79dB,Stop.
Stop.Rej.=51dB
Rej.=51dB
20dB
20dBS.F.=1.95,
S.F.=1.95,40dB
40dBS.F.=6.45
S.F.=6.45

VP
In

Out

Transmission [dB]

0
-10
-20

Pin=-20dBm

Sharper
Sharper
roll-off
roll-off

-30

Loss
LossPole
Pole

-40
-50
[S.-S. Li, Nguyen, FCS05]

-60
8.7

[Li, et al., UFFCS04]

8.9

9.1

Frequency [MHz]

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Design:
Lr=40m
Wr=6.5m
hr=2m
Lc=3.5m
Lb=1.6m
VP=10.47V
P=-5dBm
9.3
RQi=RQo=12k

DARPA

Nanomechanical Vibrating Resonator

Constructed in SiC material w/ 30 nm Al metallization for

magnetomotive pickup

Design/Performance:
Design/Performance:
m, Wr =120 nm, h= 75 nm
LLr =1.1
r =1.1 m, Wr =120 nm, h= 75 nm
fof =1.029
=1.029GHz,
GHz,QQ=500
=500@
@4K,
4K,vacuum
vacuum

Lr

Wr

Magnetomotive Resp. [nV]

[Roukes, Zorman 2002]

Frequency [GHz]
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

Scaling-Induced Performance
Limitations
Mass Loading Noise
Contaminant
Molecules

Temperature Fluctuation
Noise

[J. R. Vig, 1999]

Photons

1 k
f =
o 2 m

Nanoresonator
Volume ~10-21 m3

Nanoresonator
Mass ~10-17 kg

Differences in rates of

Absorption/emission of

photons
adsorption and desorption of
contaminant molecules
temperature fluctuations
mass fluctuations
frequency fluctuations
frequency fluctuations
Problem: if dimensions too small @ phase noise significant!
Solution: operate under optimum pressure and temperature

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

1.51-GHz, Q=11,555 Nanocrystalline

Diamond Disk Mechanical Resonator

Impedance-mismatched stem for

reduced anchor dissipation

Operated in the 2nd radial-contour mode
Q ~11,555 (vacuum); Q ~10,100 (air)
Design/Performance:
Below: 20 m diameter disk
R=10m, t=2.2m, d=800, VP=7V

Polysilicon
Electrode

CVD Diamond
Mechanical Disk
Resonator

Ground
Plane

Mixed Amplitude [dB]

Polysilicon Stem
(Impedance Mismatched
to Diamond Disk)

fo=1.51 GHz (2nd mode), Q=11,555

-84
-86
-88
-90
-92
-94

fo = 1.51 GHz
Q = 11,555 (vac)
Q = 10,100 (air)

Q = 10,100 (air)

-96
-98
-100
1507.4 1507.6 1507.8

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

1508

1508.2

Frequency [MHz]
[Wang, Butler, Nguyen MEMS04]

DARPA

Miniaturization of RF Front Ends

Diplexer
Diplexer

RF
RFPower
Power
Amplifier
Amplifier

925-960MHz
925-960MHz
RF
RFSAW
SAWFilter
Filter

897.517.5MHz
897.517.5MHz
RF
RFSAW
SAWFilter
Filter

1805-1880MHz
1805-1880MHz
RF
RFSAW
SAWFilter
Filter

Dual-Band
Dual-BandZero-IF
Zero-IF
Transistor
TransistorChip
Chip

26-MHz
26-MHzXstal
Xstal
Oscillator
Oscillator

Problem:
Problem:high-Q
high-Qpassives
passivespose
poseaa
bottleneck
bottleneckagainst
againstminiaturization
miniaturization

3420-3840MHz
3420-3840MHz
VCO
VCO
Antenna

Mixer I

LPF

A/D

Diplexer

Wireless
Phone
From TX

RF
BPF

I
AGC

0o
90o
LNA

RF PLL
RXRF LO

Xstal
Osc

Q
A/D

Mixer Q
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

LPF

AGC

DARPA

Miniaturization of RF Front Ends

QQ<10
<10too
too
small
small

Single-Chip
Realization

Planar
PlanarSpiral
Spiral
Inductor
Inductor

Raised
RaisedInductor
Inductor
QQ~30-70
~30-70

Vibrating
VibratingResonator
Resonator
1.5-GHz,
Q~12,000
1.5-GHz, Q~12,000

Wireless
Phone

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Vibrating
VibratingResonator
Resonator
72-MHz,
72-MHz,Q~146,000
Q~146,000

DARPA

Chip-Scale Atomic Clocks (CSAC)

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

NIST F1 Fountain Atomic Clock

Vol: ~3.7 m3
Power: ~500 W
Acc: 11015
Stab: 3.3x10-15/hr
After

After11sec
sec

-15
Error:
10-15sec
sec
Error:10
Loses
Loses11sec
secevery
every
30
30million
millionyears!
years!
Physics
PhysicsPackage
Package
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

Benefits of Accurate Portable Timing

Better
BetterTiming
Timing

Networked Sensors

Secure Communications
More
Moreefficient
efficient
spectrum
spectrumutilization
utilization
Longer
Longerautonomy
autonomyperiods
periods

Larger
Largernetworks
networkswith
with
longer
longerautonomy
autonomy

GPS

Faster
Fasterfrequency
frequencyhop
hoprates
rates
Faster
Fasteracquire
acquireof
of
pseudorandom
pseudorandomsignals
signals
Superior
Superiorresilience
resilience
against
againstjamming
jammingor
or
interception
interception
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Fewer
Fewersatellites
satellites
needed
needed
Higher
Higherjamming
jamming
margin
margin
Faster
FasterGPS
GPSacquire
acquire

DARPA

Accurate Portable Timekeepers

High-Q Oscillators

Tank Q ~ tens of thousands

Example: crystal oscillator

Stability quite good at carrier

offset freqs. around 1 kHz

L{fm=1kHz} = -140dBc/Hz

Accuracy
Accuracy(@
(@tiny
tiny
offset
offsetfreqs.)
freqs.)good,
good,
but
butnot
notgood
goodenough
enough
for
forsome
someapplications
applications
10MHz

Quartz: vibrating mechanical

resonance high Q, stable

Shear Mode
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Excellent
Excellentstability
stability
at
atoffset
offset
frequencies
frequencies~1kHz
~1kHz

DARPA

Atomic Clock Fundamentals

Frequency determined

by an atomic transition
energy

Energy Band Diagram

E = 1.46 eV

= E/h

Excite
Exciteee-to
to
the
thenext
next
orbital
orbital

= 352 THz
852.11 nm
E = 0.000038 eV

m=1

= E/
= 9 192 631 770 Hz

133Cs

m=0
f=4

Opposite
Opposite
ee-spins
spins

m=0
f=3

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Miniature Atomic Clock Design

DARPA

Carrier
(852 nm)

Atoms
Atomsbecome
become
transparent
transparentto
to
light
lightat
at852
852nm
nm

Sidebands
4.6GHz

= E/
= 9 192 631 770 Hz

9.2GHz

Modulated
Laser

Photo
Detector
133Cs

Hyperfine
Hyperfine
Splitting
SplittingFreq.
Freq.

vapor at 107 torr

Mod f

vo

VCXO
4.6 GHz

wave osc

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Close
Closefeedback
feedback
loop
loopto
tolock
lock

DARPA

Miniaturizing Atomic Clocks

NIST- F1
Datum R2000
Vol: 9,050 cm3
Power: 60 W
Acc: 51011

Vol: ~3.7 m3
Power: ~500 W
Acc: 11015
Stab: 3.3x10-15/hr
State-ofPractice

Temex RMO
Vol: 230 cm3
Power: 10 W
Acc: 11011

ps/day
ps/day
State-ofResearch

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

s/day
s/day

CSAC
Vol: 1 cm3
Power: 30 mW
Acc: 1x10-11
Stab: 11011/hr

Chip-Scale Atomic Clock

DARPA

Laser

133Cs

vapor at 107 torr

Mod f

vo

4.6 GHz

VCXO
wave osc

Atomic Clock Concept

MEMS and
Photonic
Technologies

Key Challenges:

Photo
Detector

GHz
Resonator
in Vacuum
VCSEL
Cs or Rb
Glass
Detector
Substrate

thermal isolation for low power

Vol: 1 cm3
Chip-Scale
cell design for maximum Q
Power: 30 mW
Atomic Clock Stab: 11011

low
power
wave
oscillator
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

Pros and Cons of Miniaturization

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

Micro-Scale Oven-Control Advantages

Macro-Scale
2 cm3
Atomic
Cell @
80oC

2 cm

Macro-Oven
(containing heater
and T sensor)

300x300x300 m3
Atomic Cell @ 80oC

Micro-Scale
Heater

Insulation

Laser

Laser
25oC
T = P x Rth

Thermally
Isolating Feet
P

RRth==18
K/W
th 18 K/W
CCth==40
J/K
th 40 J/K
o
PP(@
(@80
80oC)
C)==33W
W

Rth

Cth

support length
Rth ~
X-section area
Cth ~ volume

3,000x lower power

240x faster warm up

Warm
Up,
==12
min.
Warm
Up,
12
min.
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

T Sensor
(underneath)

Long, Thin
Nitride
Tethers w/
Metal Leads

RRth==61,000
K/W
K/W
th 61,000
-5
CCth==4.8x10
-5J/K
th 4.8x10 J/K
o
PP(@
(@80
80oC)
C)==11mW
mW

Warm
WarmUp,
Up,==33ss

DARPA

Challenge: Miniature Atomic Cell

Large Vapor Cell

Tiny Vapor Cell

1,000X
Volume
Scaling

Surface

Volume

More
Morewall
wallcollisions
collisions

stability
stabilitygets
getsworse
worse
lowest
lowestQQ

Intensity

Atomic
Resonance

Wall
Wallcollision
collisiondephases
dephases
atoms
atoms
lose
losecoherent
coherentstate
state

lower
lowerQQ

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

9.2 GHz

Mod f

DARPA

Challenge: Miniature Atomic Cell

Large Vapor Cell

Tiny Vapor Cell

1,000X
Volume
Scaling
Buffer
Gas
Soln:
Soln:Add
Addaa
buffer
buffergas
gas

Lower
Lowerthe
themean
meanfree
free
path
pathof
ofthe
theatomic
atomicvapor
vapor

Intensity

Atomic
Resonance

9.2 GHz
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Return
Returnto
to
higher
higherQQ

Mod f

DARPA

1st Chip-Scale Atomic Physics Package

1.5 mm

Photodiode

Cell
4.2 mm
Optics
ND
Quartz
Si
ND
Glass
Alumina

Lens
VCSEL

1.5 mm

Laser

1 mm

3
-10
Total
Stability:
TotalVolume:
Volume:9.5
9.5mm
mm3
Stability:2.4
2.4xx10
10-10@
@1s
1s
3
Cell
CellInterior
InteriorVol:
Vol:0.6
0.6mm
mm3 Power
PowerCons:
Cons:75
75mW
mW

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Tiny Physics Package Performance

DARPA

Dime
Dime

NISTs
NISTs
Chip-Scale
Chip-Scale
Atomic
Atomic
Physics
Physics
Package
Package

Experimental Conditions:

Cs D2 Excitation
External (large) Magnetic Shielding
External Electronics & LO
Cell Temperature: ~80 C
Cell Heater Power: 69 mW
Laser Current/Voltage: 2mA / 2V
RF Laser Mod Power: 70W

Open Loop Resonance:

6
QQ=1.3x10
=1.3x106

PD Signal [V]

5.67

7.1 kHz
5.66

Contrast: 0.91%
5.65
40

50

60

70

80

Sufficient
Sufficient
to
tomeet
meet
CSAC
CSAC
program
program
goals
goals
90

Allan Deviation, y

Stability Measurement:
10

-9

Cs
Cs(D
(D22) )

10-10
10-11
10-12

Frequency Detuning, [kHz]

from 9,192,631,770 Hz

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Drift
Drift Drift to Be
Drift to Be
Issue
Issue Removed
Removed
in
inPhase
Phase33

2.4e-10
Allan
2.4e-10
Rb
(D
)
1
Rb (D1) Allan
deviation
1 hour
deviation@
@11ss
100

101

102

103

CS
AC
1 day
104

Integration Time, [s]

Go

al

105

DARPA

Physics Package Power Diss. < 10 mW

Achieved via MEMS-based thermal isolation

Cesium cell

Heater/Sensor
Suspension
7 mm

VCSEL /
Photodiode

20 pin LCC

Frame
Spacer

Only
Only~5
~5mW
mW
heating
power
heating power
needed
neededto
to
o
achieve
achieve80
80oCC
cell
celltemperature
temperature

VCSEL
Suspension
12
10
Power [mW]

Symmetricom
Symmetricom/ /
Draper
DraperPhysics
Physics
Package
Assembly
Package Assembly

Measured
Model

8
6
4
2
0
0

20

40

60

80

100 120 140

Temperature [oC]
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

A 9.95 cc, 153 mW Atomic Clock w/

Chip-Scale Physics Package

CS
AC
Ph
ase
-10
5x10
5x10-10

2G

oa
l

@
@11sec
sec

Symmetricoms
Symmetricoms
measured
measuredAllan
Allan
deviation
deviationeasily
easily
satisfies
CSAC
satisfies CSAC
Phase
Phase22Goal
Goal

3.53 cm

Physics
PhysicsPackage
Package

3
9.95
9.95cm
cm3Total
Total
Package
PackageVolume
Volume

3.94 cm

0.64 cm
1.43 cm

Power Budget < 200 mW

Power Regulation

1 mW

Microprocessor

8 mW

Signal Processing

6 mW

RF

75 mW

VCSEL drive

2 mW

Heater Power (air)

51 mW

C-field

10 mW

Total:

153 mW

m
c
7
0.4

Packaged CSAC

Physics
PhysicsPackage
Package

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

MEMS-based
MEMS-basedthermal
thermal
isolation
isolationallows
allowslow
lowphysics
physics
package
packagepower
powerconsumption
consumption

DARPA

Atomic Clock Technology Progression

Stab
Stab==Allan
Allandeviation/
deviation/
integration
integrationtime
time
Physics
PhysicsPackage
Package

NIST- F1

NIST
PP Vol: 9.5 mm3
Power: 75 mW+elect.
Stab: 1011/hr

HP 5071A
Vol: 29,700 cm3
Power: 50 W
Acc: 51013

Vol: ~3.7 m3
Power: ~500 W
Acc: 3.81015
Stab: 3.3x10-15/hr

State-ofPractice

Symmetricom CSAC

Datum R2000
Vol: 9,050 cm3
Power: 60 W
Acc: 51011

Vol: 9.95 cm3

Power: 153 mW
Stab: 51011/100s

Temex RMO
Vol: 230 cm3
Power: 10 W
Acc: 11011

State-ofResearch

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

CSAC
Vol: 1 cm3
Power: 30 mW
Acc: 1x10-11
Stab: 11011/hr

DARPA

Micro Gas Analyzers (MGA)

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Micro Gas Analyzers

DARPA

Objective: enable remote detection of chemical agents via tiny,

ultra-low power, fast, chip-scale gas analyzers that greatly
reduce the incidence of false positives
Approach: use micromachining technologies to implement
separation-based analyzers (e.g., gas chromatographs, mass
spectrometers) at the micro-scale to enhance gas selectivity
Conventional Sensor
Capacitor
Plates

Gas Sensitive
Polymer

Species A

Species B
C ~gas conc.

Problem: polymer has finite

sensitivity to both A & B

Separation Analyzer

Species A

A
B

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Result:
Problem:
species
too big,
A too
& Bslow,
now
separated
power hungry
can identify
and analyze individually

Advantages of Miniaturization

DARPA

Portable Gas Chromatograph

Depth = 10

Preconcentrator

Detector Array

5 mm

19

Chip-Scale Gas Chromatograph

13

1-2 cm
Reduction
ReductionFactors
Factors
Size
Sensitivity
Analysis Time
Energy Per Analysis

40,500 cm3

20,000X
20,000X

1 ppb

1,000X
1,000X

15 min.

225X
225X

10,000 J

10,000X
10,000X

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Separation Micropump
Column

Size

2 cm3

Sensitivity

1 ppt

Analysis Time

4 sec

Energy Per Analysis

1J

DARPA

Basic Approach: Separation Analyzer

Three
Analytes

Compacted
Slice of
Analytes

Separated
Analytes

Electronic
Processor
Pump

Pre-Concentrator

Separator

Miniaturization

Input Gas
Mixture

Tiny
TinyDimensions
Dimensions
fast
fasttime
timeconstants
constants
10,000X
10,000Xgain
gainfactor
factor
via
viamulti-staging
multi-staging
enhanced
enhancedsensitivity
sensitivity
lower
power
lower
power
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Detector

Multi-Stage Pre-Concentration

DARPA

Incoming Gas
Mixture

10 ppb

Heater

Absorbent
Film

1,000 ppb

2,000 ppb

Heat
Heat~2mW
~2mW
to
toRelease
Release
Analyte
Analyte
Release
Release
Analyte
Analyte
in
inPhase
Phase
Thin
ThinConcentrated
ConcentratedPlug
Plug
To
Separator

3,000 ppb
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

5,000 ppb

[Honeywell]

DARPA

Fast PHASED Pre-Concentration

Below: 20-stage PHASED preconc./sep. analysis of a 720 ppm

Hexane-in-Air sample at 60 cm/s sample velocity

Sample
Sample
Expulsion
Expulsion
o
@
@120
120oCC

300 ms

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

PHASED
PHASEDchip
chip
with
with20-stage
20-stage
preconcentrator
preconcentrator
and
andseparator
separator

Only
Only300ms
300msneeded
needed
for
forsample
sample o
absorption
absorption@
@20
20oC!
C!

DARPA

Basic Approach: Separation Analyzer

Three
Analytes

Compacted
Slice of
Analytes

Separated
Analytes

Electronic
Processor
Pump

Pre-Concentrator

Separator

Miniaturization

Input Gas
Mixture

Tiny
TinyDimensions
Dimensions
fast
fasttime
timeconstants
constants
Tiny
10,000X
TinyDimensions
Dimensions
10,000Xgain
gainfactor
factor
faster
via
fasterseparation
separation
viamulti-staging
multi-staging
lower
enhanced
lowerpower
power
enhancedsensitivity
sensitivity
lower
power
lower
power
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Detector

DARPA

Scaling Leads to Faster Separation

Example: gas chromatograph

separation column
unique analyte interactions
with the column walls
different analyte velocities
result: separation after a
finite distance

240
m

150
m

Stationary
Phase
Thin
Channel

Wide
Channel
Miniaturize
Carrier Gas (Mobile Phase)

Conc.

Peak
Broadens

Conc.
x

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Less
Peak
Separation
Stays Thin
Needed to
Resolve

DARPA

Scaling Leads to Faster Separation

Example: gas chromatograph

separation column
unique analyte interactions
with the column walls
different analyte velocities
result: separation after a
finite distance

240
m

150
m

Stationary
Phase
Thin
Channel

Wide
Channel
Miniaturize
Carrier Gas (Mobile Phase)
Column
Width

Surface-to-
Volume Ratio

Peak

Spreading

Separation

Distance

Result of Scaling: shorter column length; faster analysis time

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Gas Chromatography in Less Than 4s!

1.2

2.4

Elution time [s]

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

3.6

Green
Green==Analyte
Analyte
Blue
=
Inteferent
Blue = Inteferent

1-decanol

16000

n-dodecane

32000

Peak
Peakcapacity
capacity
>40,
>40,in
in44sec
sec
DIMP

46000

Sandias
Sandiasmicro-GC
micro-GCColumn
Column

DEMP

64000

3-methylhexane
Toluene
DMMP

80000

Solvent

Relative Intensity

Design/Measurement
Design/MeasurementData:
Data:
0.75m
0.75mxx100
100column
column
0.1
0.1DB-5
DB-5stationary
stationaryphase
phase
Heart-cut
Heart-cut275
275msec
msecpeak
peakinjection
injection
Temperature:
Temperature:~30
~30deg
degC/sec
C/sec
35-39 psi at 1 psi/sec
HH2 carrier:
2 carrier: 35-39 psi at 1 psi/sec

1,6-dichlorohexane

DARPA

4.8

DARPA

Basic Approach: Separation Analyzer

Three
Analytes

Compacted
Slice of
Analytes

Separated
Analytes

Electronic
Processor
Pump

Pre-Concentrator

Separator

Detector

Miniaturization

Input Gas
Mixture

Tiny
TinyDimensions
Dimensions
fast
fasttime
timeconstants
constants
Tiny
10,000X
TinyDimensions
Dimensions
10,000Xgain
gainfactor
factor
faster
via
fasterseparation
separation
viamulti-staging
multi-staging
lower
enhanced
lowerpower
power
enhancedsensitivity
sensitivity
lower
power
lower
power
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Tiny
TinyDimensions
Dimensions
higher
highersensitivity
sensitivity
faster
fasterrefresh
refreshrate
rate
lower
lowerpower
power
arrays
arraysfor
forspecificity
specificity

Zeptogram Mass Sensors

DARPA

Nanomechanical
Resonator

Nanomechanical
NanomechanicalResonator
Resonator

Shutter

Au
Measurement
Measurementnoise
noiselevel
level
indicates
indicates~7
~7zg
zgof
ofresolution
resolution
0

-200

-500

~100 zg

-400
-600
-800

100
100zg
zgAu
Auatom
atom
clumps
clumpsresolved!
resolved!

-1000
0

50

100 150 200 250 300 350

100

m (zg)

Frequency Shift (Hz)

Frequency Shift (Hz)

Nozzle

10

~7 zg

-1000
0.1

-1500

2000

-2000

Time (sec)
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

>1Hz/zg

133 MHz
190 MHz

-2500
-3000

4000

Time (s)

1000

2000

Mass (zeptograms)

3000

4000

ITMS: Scaling Leads to Lower Power

DARPA

Example: ion trap mass spectrometer (ITMS)

separate analytes by molecular weight

VRF

Detector

Stability Thresholds
(dependent on mass)

Detector
Output

time

vRF
100 ms

Trapped
Ions

time

Advantages of Miniaturization:

Detector

can support smaller mean free path relaxed vacuum req.

result: substantially lower power requirement

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

Operation at 1.7 Torr!

DARPA

1mm
1mmCylindrical
CylindricalIon
IonTrap
Trap

Resistive
ResistiveGlass
Glass
Drift
DriftTube
TubeDetector
Detector

Detector Current [pA]

Channeltron
Channeltron
Detector
Detector
0.16
0.12
0.08

Mass
Massspectrum
spectrumof
ofDMMP
DMMPby
byaa
single
single1-mm
1-mmion
iontrap
trap@
@1.7
1.7Torr
Torr
Highest
Highestpressure
pressure
ever
everdemonstrated!
demonstrated!

0.04

Test
TestJig
Jig(vacuum
(vacuum
chamber
insert)
90
100
80
chamber
insert)
C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

110

120

m/z

DARPA

40m-Ion Traps Functional!

Array
Arrayof
of40m
40mSi
SiIon
IonTraps
Traps

Heavily-Doped
Polysilicon

Oxide

Aluminum

Silicon
Xenon
Xenonsignal
signalobtained
obtainedat
at
-4
low
lowHe
Hepressure
pressure(10
(10-4Torr)
Torr)
Xe
Xeion
ionpeak
peak

Should allow much higher pressure operation (~76 Torr)

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

Gas Analyzer Technology Progression

Agilent 6852A
Vol: 60,000 cm3
Power: 20 W
Energy/Analysis: 18 kJ
Analysis Time: 15 min.

Gas
GasChromatograph/Mass
Chromatograph/Mass
Spectrometer
Spectrometer(GC/MS)
(GC/MS)isis
aagold
goldstandard
standardin
in
chemical
gas
detection
chemical gas detection
with
withexcellent
excellentimmunity
immunity
to
false
alarms
to false alarms
Problems:
Problems:too
toobig,
big,too
too
slow,
power
hungry
slow, power hungry

LLNL
Vol: 40,500 cm3
Power: 11.5 W
Energy/Analysis: 10 kJ
Analysis Time: 15 min.

small
smallenough
enoughfor
for
projectile
delivery
projectile delivery
11ppt
pptdet.
det.limit
limit
very
fast
very fast
battery
batteryoperable
operable

Sandia Chem Lab

Vol: 1,050 cm3
Power: 4.5 W
Energy/Analysis: 540 J
Analysis Time: 2 min.

Solution:
Solution:use
useMEMS
MEMS
technology
technologyto
tominiaturize
miniaturize
the
GC/MS,
which
the GC/MS, whichin
inturn
turn
makes
it
faster
and
more
makes it faster and more
energy
energyefficient
efficient

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

MGA Objective
Vol: 2 cm3
Power: <200 mW
Energy/Analysis: 1 J
Analysis Time: 4 s

DARPA

Example: Micromechanical Accelerometer

The MEMS Advantage:

400 m

Tinymass
massmeans
means
>30X size reduction forTiny
small
output

need
small
output

need
accelerometer mechanical
element
integrated
integratedtransistor
transistor
allows integration with
ICstotocompensate
circuits
circuits
compensate

Basic Operation Principle

xo

x Fi = ma

Displacement
Spring

Inertial Force
Proof Mass
Acceleration
Analog Devices ADXL 78

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05

DARPA

Conclusions

MEMS are micro-scale or smaller devices/systems that operate

mainly via a mechanical or electromechanical means
MEMS NEMS offer the same scaling advantages that IC
technology offers (e.g., speed, low power, complexity, cost),
but they do so for domains beyond electronics:

Size

resonant frequency (faster speed)

actuation force (lower power)
# mechanical elements (higher complexity)
integration level (lower cost)

Micro nano its all good

Just as important: MEMS or NEMS have brought together

people from diverse disciplines this is the key to growth!

Whats next? Nano-nuclear fusion? Chip-scale atomic
sensors?

limitless possibilities

C. T.-C. Nguyen, From MEMS to NEMS: Smaller Is Still Better, MARC06 Meeting, 1/25-26/05