Questions from last years exam paper and guidelines on what we are

looking for in the answers.

Three questions from last years paper and guidelines for what is required in the answer are
attached.
Please remember as I said in the revision lecture that the compulsory section is now two long
questions rather than 8 short questions as in previous examination papers. The compulsory
section is worth 50% of the available marks and the remaining 50% of marks comes from a
free choice of two questions from the four set in the optional questions section.
Good luck in the exam

Question 5 from Summer 2008 examination paper

Solid metals and alloys are described as polycrystalline materials. They are also known to
have a variety of different crystal structures. Describe how crystal structure and the
polycrystalline nature of metals and alloys can affect the mechanical properties.
(10 marks)
The properties of metals and alloys are profoundly affected by the presence of crystalline
defects. Describe what is meant by the term crystalline defects. Explain how these defects
can be exploited in a number of ways to enhance the mechanical properties of the solids. You
should pay particular attention to strengthening mechanisms.
(15 marks)

What we are looking for in the answer

Looking for :
Description of different crystal structures accompanied by a drawing of one or two as well as
a short discussion about slip planes and how some crystal structures have more than others
and therefore are generally more ductile
Description of origin of polycrystalline nature and refernce to grain size effects such as Hall
Petch relationship or even anisotropy caused by grain shape.
(10 Marks)
Looking for
Description of line and point defects probably with an emphasis on edge dislocations.
Thermodynamically stable at T>0K,, responsible for ductility in metals and alloys (above that
theoretically predicted by perfect crystal model). Drawings will be useful here.
Looking for understanding that impedance of dislocation movement is a strengthening
mechanism
Looking for defect centred description of a number of strengthening mechanismswork
hardening, solid solution hardening, precipitation hardening as well as a short discussion
about softening with annealing and normalising heat treatments
(15 Marks)

Question 4 from Summer 2008 Exam Paper

Electronic devices can be fabricated on a variety of materials including Silicon, Germanium

and Gallium Arsenide. Explain why Silicon has become the material of choice for the
majority of the microelectronics industry.
(5 marks)
The first stage in the manufacture of microelectronic devices is to obtain a single crystal of
silicon. There are two processes used to make single crystal silicon. Explain with the aid of
diagrams how these two processes work.
(20 marks)

What we are looking for in the answer

Most microelectronic circuits are currently based on silicon. This is due to its abundance and
relative ease of processing.
Early devices were processed on germanium, however this has a lower energy gap than
silicon and so operates at a lower temperature than silicon (100C as opposed to 150C for
silicon).
Silicon also has an advantage due to its oxide, silicon dioxide.
Silicon dioxide is an excellent insulator and can be used for isolation in the microchip.
Germaniums oxide however is water soluble and not suitable for use in microelectronics.
(5 marks)

Diagram as above and an explanation of how the Czochralski process works.

Diagram of a Polycrystaline bar rod pulled through an induction heating element and an
explanation of what is happening.
(20 marks)

Question 3 from Summer 2008 Exam Paper

In bulk deformation processes like rolling and forging the metal can be hot worked or cold
worked. What is the difference between hot and cold working?
(3 marks)
Describe with the aid of diagrams the differences in the microstructure obtained between a
hot rolled and cold rolled metallic component.
(12 marks)
In sheet metalworking the stock material is usually in the form of long strips, or coils, of cold
rolled material. During bending explain why it is important to know the original direction in
which the strip or coil was cold rolled.
(10 marks)

What we are looking for in the answer

Cold working is carried out below the recrystallization temperature of the material whereas
hot working is carried out above the recrystallization temperature of the material.
(3 marks)
What is needed here is two diagrams and a short explanation of the changes in
microstructure. The diagrams should look something like these

(12 marks)

For the final part another diagram is required along with an explanation of how the original
rolling direction lines up the grains and that the bend should be across the grains and not
parallel with them.

(10 marks)