2017328 What'sHDICircuitBoard?

NewsHerosElectronics

+867552749 5167 Ext. 806 sales@heroselectronics.com

Home Capacities Products News Contact Request A Quote

Home / News

What'sHDICircuitBoard?
The authorPageviews148Release time20160514 10:47:57

20layer HDI Circuit Boad Stackup

HDI is the abbreviation for High Density Interconnect. HDI circuit board is defined as a PCB with a higher wiring density per unit area than conventional PCB. They have finer lines
and spaces, smaller vias and capture pads and higher connection pad density than employed in conventional PCB technology. HDI PCB is used to reduce size and weight, as
well as to enhance electrical performance of the device. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor
wiring for higher density of routing. HDI PCB is the best alternative to high layercountand expensive standard laminate or sequentially laminated boards.

Concerning the electrical requirements for highspeed signal, the PCB must possess some AC characteristics, such as impedance control, highfrequency transmission capability
and reduce unnecessary radiation. Multilayered design is necessary for the structure of Stripline and Microstrip. In order to lesson the quality issues of signal transmission, the
insulating material with low dielectric factor and low attenuation ratio is applied. Duo to the miniaturization and arrays of the electronic components, the PCB must be improved
in the density. Along with the outcome of the assembling methods of Ball Grid Array, Chip Scale Package and Direct Chip Attachment, the PCB is featured with unprecedented
highdensity. The hole with a diameter less than 150um is known as Microvia. It can improve the effectiveness of assembly and space utilization and so on. Its also necessary for
the miniaturization of electronic products.

There were a lot of different names for the PCB with such structures. For example, it was called SBU (Sequence Build up the Process) in European and American industry as the
program production is in the constructive mode of sequence. It was called MVP (Microvia Process) in Japanese industry because the hole of such products is much smaller than
the previous one. It was also called BUM (Build up Multilayer Board) because the traditional multilayer is known as MLB (Multilayer Board).In order to avoid confusion, IPC Printed
Circuit Association proposed to call it HDI (High Density Interconnection Technology) as the common name, but it can not reflect the characteristics of the circuit board. So the
majority in the PCB industry define such products as HDI PCB.

There are a lot of advantages with HDI Circuit Board, such as small size pcb, high speed pcb and high frequency pcb. It is the main components of personal computers, portable
computers, mobile phones and personal digital assistants. At present, except mobile phones, HDI PCB is also widely used in a variety of other consumer products, such as game
consoles and industrial controller, etc. In addition, the applying of HDI PCB in notebook computer is expected trend since 2006 is in the industry.

Pre Blind & Buried Via Technology in HDI PCB

Next Why High Layer PCB Board Used So Widely?

Contact Our Features News Click to send mail

Tel: PCB Assembly Capacities Introduction of PCB Materials Get PCB and PCBA quick quote!
+867552749 5167 Ext. 806
Rigid PCB Capacities DFM From Gerber files to PCB Production
Email: Data Send Email
sales@heroselectronics.com File Package Information
Skype: Blind & Buried Via Technology in HDI PCB
130Layer FR4 PCB
alan@heroselectronics.com
Aluminum PCB Controlled Impedance Printed Circuit
Address: Board
3F, A4 Building, Junfeng Industrial Car Devices
Park, Chongqing Road, Fuyong Computer
Street, Bao'an District, Shenzhen
518103, China.

http://heroselectronics.com/en/News/95.html 1/1