Ultrasonic exfoliation, adhesive tape exfoliation, and reactive ion etching (RIE) were evaluated for their ability to reliably thin molybdenum disulfide (MoS2). Tape exfoliation produced more and thinner MoS2 flakes than ultrasonic exfoliation. Wet etching with nitric acid proved unsuccessful due to inconsistent or complete removal of the MoS2. RIE using argon and NF3 gas was able to control etching of MoS2 and showed the most promise as a reliable thinning method. Further optimization of RIE parameters such as gas ratio and power is recommended to refine control of MoS2 etching.
Ultrasonic exfoliation, adhesive tape exfoliation, and reactive ion etching (RIE) were evaluated for their ability to reliably thin molybdenum disulfide (MoS2). Tape exfoliation produced more and thinner MoS2 flakes than ultrasonic exfoliation. Wet etching with nitric acid proved unsuccessful due to inconsistent or complete removal of the MoS2. RIE using argon and NF3 gas was able to control etching of MoS2 and showed the most promise as a reliable thinning method. Further optimization of RIE parameters such as gas ratio and power is recommended to refine control of MoS2 etching.
Ultrasonic exfoliation, adhesive tape exfoliation, and reactive ion etching (RIE) were evaluated for their ability to reliably thin molybdenum disulfide (MoS2). Tape exfoliation produced more and thinner MoS2 flakes than ultrasonic exfoliation. Wet etching with nitric acid proved unsuccessful due to inconsistent or complete removal of the MoS2. RIE using argon and NF3 gas was able to control etching of MoS2 and showed the most promise as a reliable thinning method. Further optimization of RIE parameters such as gas ratio and power is recommended to refine control of MoS2 etching.
EFRI 2-DARE: 2D Crystals Formed by Activated Atomic Layer
Deposition
2015 REM Program
Can Known Etching and Exfoliation Techniques
Reliably Thin Down MoS2? Sebastian O. 1 Manzo , Yiyang Gong2 and Thomas. N. Jackson3 1Department of Materials Science and Engineering and 2Department of Electrical Engineering, The Pennsylvania State University
Introduction f Methods Results Trial Gas Pressure (mT)
RIE Results Gas Ratio (%Ar, %NF3) Power (W) Self-Bias (V) Time (min.) Results
1 Ar+NF3 200 10%, 90% 150 -22 4 complete removal
2 Ar+NF3 150 10%, 90% 137 -11 1 complete removal
Molybdenum disulfide is a direct bandgap Ultrasonic Exfoliation semiconductor that exhibits high mobility, high Adhesive Tape Exfoliation Tape Exfoliation Water IPA 3 Ar+NF3 150 50%, 50% 100 -11 1 complete removal
4 Ar+NF3 150 95%, 5% 18 -3 1 controlled etch
on/off ratio and robust mechanical properties [2] 5 Ar+NF3 150 95%, 5% 20 -3 1 no change in its 2-D form. 2-D semiconducting materials Bulk MoS2 [2] Process, by which 6 Ar+NF3 150 95%, 5% 23 -3 3 complete removal
that represent the ultimate limit in thickness 2D MoS2
flakes were exfoliated. Etched flakes from Trial 4 using RIE are desired so that transistor sizes can be Before After Before After further minimized while maintaining good electrostatic control. Consequently, MoS2 is Ultrasonic Exfoliation regarded as one of the most promising [3] Bath Sonicator Probe Sonicator materials for future applications in display, flexible and biomedical electronics. [3] color optical images of 1L-15L MoS2 Conclusion nanosheets on 90 nm SiO2/Si, scale bar is 5m. Images used to approximate thickness of Significant progress has been made in our samples. As shown in figures above, tape identifying etches for thinning MoS2, but our [1] etching methods were not able to consistently exfoliation yielded more and thinner flakes. etch our samples. Since tape exfoliation yielded more and thinner flakes than ultrasonic, our Sonication devices used to exfoliate MoS2. Wet Etching Results samples were produced using this method. Wet Water and IPA were used as sonicating liquids. no change, non-uniform etch, complete removal etching proved to be unsuccessful in Time consistently thinning the flakes; however, RIE Acid Temperature C Result (minutes) was able to etch the MoS2 easily. From our Wet Etching Trial 1 HNO3 85 60 no change HNO3 85 75 complete removal observations, RIE shows the most promise as a HNO3 85 90 complete removal reliable etching recipe for MoS2. Therefore, it is Trial 3 HNO3 85 60 no change Wet etching set up HNO3 85 70 no change recommended that more research goes into the [1] some potential applications for MoS2 in 68% HNO3, HNO3 85 80 no change effect of using different gas ratios and self Trial 4 HNO3 70 60 no change display, flexible and biomedical electronics 33-40% HCl used HNO3 70 60 no change biases. In addition, characterization utilizing an HNO3 70 90 no change atomic force microscope would provide more HNO3 70 140 no change Trial 5 HCl 50 60 non-uniform change accurate flake thicknesses after each trial, giving Trial 6 HCl RT 60 no change more insight on which parameters to adjust. Objectives Reactive Ion Etching HCl HCl 50 30 60 60 no change no change
RIE System RIE Model Acknowledgements
Identify reproducible etching and exfoliation Trial 5 Samples after 50C HCl 1 hour wet etch. This project was made possible through the techniques for MoS2 National Science Foundations Emerging Frontiers in Research and Innovation (EFRI) for Develop a slow wet etching recipe for MoS2 Before Two-Dimensional Atomic Layer Research and that shows a high degree of control. Ar and NF3 get ionized Engineering (2-DARE) program. Different ratios Develop a dry etching recipe that can because of electric field from successfully etch MoS2 flakes layer-by- of Ar and NF3 were used. electrodes in chamber. After References layer. Particles accelerate and [1] Akinwande D. et al, Nature Communications,5 6678 (2014) bombard sample. [2]Center for Solid State Physics at Institute of Physics Belgrade [3]Li.H, et al., ACS Nano, (2013)
The Penn States EFRI 2-DARE: 2D Crystals Formed by Activated Atomic Layer Deposition REM is sponsored by the National Science Foundation (EFMA 1433378).
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