RecentTrendsinAdditiveManufacturing

&theNeedforPredictiveSimulation

BrentStucker,Ph.D.
ChiefExecutiveOfficer
WhatisAdditiveManufacturing?

AccordingtoASTMF42andISOTC261
Theprocessofjoiningmaterialstomakeobjects
from3Dmodeldata,usuallylayeruponlayer,as
opposedtosubtractivemanufacturing
methodologies
KeyDevelopmentsinVatPhotopolymerization

Expirationofinitial Anadditivemanufacturing
stereolithography processinwhichliquid
photopolymerinavatis
patentsareopeningup
selectivelycuredbylight
themarketplace activatedpolymerization.
Increasedproliferationof
projectorbased
(DLP/LCD/LED)technology
whichcureentirelayersat
once.
KeyDevelopmentsinMaterialJetting
NewStratasys/Objet Anadditivemanufacturing
Connex 500 processinwhichdropletsof
Multimaterial&Multicolor buildmaterialareselectively
Manytraditional2D deposited
printingcompaniesare
investigating3Dprinting
HPMultiJet Fusion
Metalsarestartingtobe
publicallydiscussed
Significantinterestin
printedelectronics
Attheintersectionbetween
2D&3Dgeometries
KeyDevelopmentsinBinderJetting
3DSystemsmarketing Anadditivemanufacturing
Colorjet(basedonZcorp) processinwhichaliquid
Printingsugaryfoodand bondingagentisselectively
ceramics(pottery&art)
depositedtojoinpowder
Announcedacolorpersonal3D
printer materials.
ExOne isexpandingsand
printingandbuildsmetal
partsforShapeways
Voxeljet,andothersmake
marketplacedynamic
Continuousbuildplatform
designhasinteresting
ramifications
KeyDevelopmentsinMaterialExtrusion
Anadditivemanufacturingprocess
inwhichmaterialisselectively
dispensedthroughanozzleororifice
Expirationof patentshasledtoa
proliferationof3Dprinters
Morepersonalmachinessold@$500$2k
thanindustrialmachinesfor$10k$200k
(400+manufacturers?)
Renewedinterestinmanufacturingparts
viaextrusion
Hightempmaterials,concrete,fiber
reinforcedcomposites,etc.
BigAreaAdditiveManufacturingatORNL
KeyDevelopmentsinDirectedEnergyDeposition

ElectronBeamwithwire Anadditivemanufacturing
seemstobeleadingforpart processinwhichfocused
productioncurrently thermalenergyisusedto
DARPAOpenMfg w/Sciaky fusematerialsbymeltingas
DoD isinterestedinlaser theyarebeingdeposited
powderdepositionforrepair
(AmericaMakesproject)
Manufacturersaremarketing
laserdepositionheadsasadd
onstoexistingmachinetools
PowderBedFusion
Anadditivemanufacturingprocessinwhichthermal
energyselectivelyfusesregionsofapowderbed
SLS,SLM,DMLS,EBM,BluePrinter,etc.
Polymers,metals&ceramics
KeyDevelopmentsinPowderBedFusion
Themostusedplatformforfunctionalparts
SignificantR&Dinvestments
Manymetalmachinemanufacturers
Arcam,SLMSolutions,ConceptLaser,EOS,3DSystems/Phenix,Renishaw,
Realizer
Manynewmetallasersinteringmachinescoming
AdditiveIndustries,MatterFab,Velo3D,Japanese&ChineseMfg,etc.
Startingtoseenewpolymermachinemanufacturers
Wejusttookdeliverythisyearofanewmachine
OpenversusClosedmachinearchitecturebattles
GEspurchaseofMorrisTechnologies(2012)isstillhavingmajor
ramificationsonthemetallasersinteringmarketplace
EngineeringImplications
MAINDRIVINGFORCEFOR
IMPLEMENTATION
MoreComplexGeometries
PartsConsolidation
Designedinternalstructures
BusinessTrend

Removesmuchofthelowcostlaboradvantage
Manynewbusinessmodels
Peoplecanprintpartsathome,atalocalprintshop
(Staples),oronline(shapeways.com)
NewMachines
PatentsExpiring
Softwaretools
Serviceproviders

Pharmaceutical Manufacturing in China

KeyTrendsDiscussionPoints

2MainConglomeratesforming
3DSystems
Stratasys
Manymarketentrants
Manystartups
Personal/ConsumerPrinting
MetalAM
LotsofVentureCapitalMoney
Manyuninformedinvestors
Afewveryinformedinvestors
Scamsareoccurring
KeyTrends

Governmentsarebecomingincreasingly
involved
AmericaMakes
EUactivities
IncludingindividualstatessuchasUK,Germany
Chinaisinvestinghundredsofmillions
Singapore
Japan
KeyTrends

Peoplearefocusingonthemainobstaclesto
commercial/industrialimplementation
Repeatabilityoftheprocess
Reproducibilitybetweenmachines
Qualityoftheproductforaparticularuse
Accuracy,SurfaceFinish,Porosity,MechanicalProperties,
etc.
Speed
AMcannowenableusto
control
Buttheoverallgeometry
we dont know how to: ofapart,whichcouldbe
Efficiently represent this type of multi-scale
madeupofatrussnetwork,whereeachtrusshasan
geometry in a CAD environment, or
optimizedthicknessandcouldhaveanindividually
Efficiently optimize these multi-scale features, or
controllablemicrostructureormaterial.
Efficiently simulate the link between AM
process parameters and microstructure, or
Efficiently compute the effects of changes in
microstructure on part performance

CourtesyDavidRosen,GeorgiaTech
3DSIMVISION
Movingfromempiricallydriven tosimulationdriven
AdditiveManufacturing
SupportsinMetalLaserSintering

Supportsareplaced
basedupongeometry
anduserexperience
Nocalculationofstress
Extrasupportsincreases
postprocessingcosts
Supportscanruin
features
Undersupportedregions
causebladecrashes
~$100k/year/machine
MetalsuseComplexScanStrategies
EBM

MetalLaserSintering
TypicalProcessVariationEffects
2mmwallmade
fromInconel625
XZsectionshowing
effectsofscan
patternon
microstructure
Identicalgeometries
inthesamebuild
givedifferent
distortions
MicrostructuralVariationsinTi6/4
LessresidualstressinVerticalsamples
columnargrains
HighresidualstressinHorizontalsamples
martensiticstreaks

NeartheBottomofa
Identicalprocessparameters
Vertical Sample foridenticalparts
inanidenticallayer,
inthesamebuild,
forthesamematerial,but
indifferentorientationsandlocations,
resultin
differentmicrostructuresand
NeartheBottomofa properties
HorizontalSample
ProblemComplexity
THECORRECTANSWERREQUIRESVECTORBYVECTOR
COMPUTATION

WithoutSupports 40mmx5mmx2mmpart
Layers:66
HatchesConsidered:17,490
LaserPositions:13,216,038

Withpillarsupports
Layers:233
HatchesConsidered:61,745
LaserPositions:25,766,422

ANSYSComputationalTime
~150years
WhatsWrongwithExistingSimulationApproaches?

Theyretooslow
Theycantefficientlysolveproblemswhichhavedynamically
changinggeometryandmovingenergysources
Especiallymultiphysics,multiscalemodeling
TheyarentoptimizedforGPUs.
Theyrenotuserfriendly
Theyrequireexpertusers
Manydifferentsoftwaretools/approachesarerequiredto
solvesimpleproblems
Notdesignedforadditivemanufacturing
NoprocessormaterialspecificinformationforAM
OurOverallApproach

WevedevelopedtwoSeparateSolvers:
ProcessSolvergives ProcessStructure
Thermalhistory,distortion,residualstress,crystal
structure

MaterialSolvergives StructureProperties
Baseduponthecrystalstructure,whataretheproperties
 ProcessStructureSolver
Inputs
Material&Process
Information

3DSIM
ProcessSolver
(a.k.a FFDAMRD)
MultiscaleFiniteElementAnalysis
usingNovelMeshingandEfficient
NumericalTechniques)

Outputs
ThermalHistory,CoolingRates,Phase
Information,ResidualStress/Strain
BenefitsofourDynamicMeshingStrategy

3DSIMiscurrently~3000x
fasterthancommercialFEA
codeforanidentical
dynamicmesh
TraditionalFEArequires
matrixassemblyeverytime
meshingchanges
3DSIMintelligent
assemblyofmatrices
requiresnorecalculationof
nodalconnectivity
 SimulationResults:ComplexThermalHistoryand
ComparisonofSimulationwithExperiments
x 10
-3 Thermal contours at arbitary time steps during 1st layer of Laser scanning
2 5000

1.8 Scan 4500

Strategy

1.6 4000
Top Surface D om ain in the y direction

1.4 3500

1.2 3000
Stable thermal
contours
1 2500

0.8 2000
Formetals,thelackof
symmetryandcomplex
0.6
1500
thermalhistoriesmean
0.4
1000 youcannotcreate
0.2 Unstable thermal contours at turns
representativesolutions
500

0
Thecorrectanswer
0 0.2 0.4 0.6 0.8 1 1.2 1.4
Top Surface Domain in the x direction
1.6 1.8
x 10
2
-3 requiresthecorrectscan
vectors
NewPowderInsertionCaseStudy

Threedifferentpowdersfromdifferentsuppliers
weretestedandsimulated

EOSspherical LPWspherical Raymor significantly

moreagglomerated
fineparticles
ModelGuidedProcessingParameterPredictions

Powder Bed Density & Powder Bed Thermal

Conductivity inputs were changed based upon
experiments
Hatch spacing was varied to achieve the same
predicted melt pool overlap for EOS, LPW and Raymor
powders

Supplier LaserPower ScanSpeed LayerThickness HatchSpacing

(W) (mm/s) (m) (m)
EOS 186 1200 30 77
LPW 186 1200 30 86
Raymor 186 1200 30 100
ValidationExperiments
Near full density parts and similar microstructures
We can predict parameters to match melt pool depth to
width ratios or any other phenomena to make sure a new
powder acts like your old powder

EOSTi64 LPWTi64 Raymor Ti64

Microstructure Microstructure Microstructure
HowLargeistheFullBedProblemWeWanttoModel?

FiniteElementModelingofacommercialfullscalebuild:
200mmx200mmx200mmpowderbedsize
10micronresolutionsmallscalemesh(2elements/layer)
108 elementsperlayer,1012 elementsperbuildiffinemeshedeverywhere
10microsecondstimestepstocapturemelting
50hoursofactuallaserscantime
1010 totaltimesteps
TimeandEfficiencyComparisons
(assuming16teraflopsmachine)
FineGridding(usingANSYSorsimilarmethod)=5.7 10 years
Justincludingthematrixmultiplicationflops,nothingelse
SYSWELD
ANSYS(withmultiscale) ~8.9 10 years(89billionyears) COMSOL

3DSIM(withmultiscale) ~3 10 years(30millionyears)
3DSIM(+ZdirectionEigenmodes after4layers)~200years Thermalwavepropagation

3DSIM(+IntelligentCholesky)~15years
Dontmultiplybythezerosinthematrices
3DSIM(+PHOBC)=22.1 10 years~0.2hours
Mathematicallyidentifysymmetry&periodicity(0th,1st,2nd,3rd &4th Order)
Eliminateserrorsassociatedwithbuildingarepresentativedatabaseandthen
tryingtoapplytoanewmachine,materialorprocessparametercombination

31
 StructureProperties
Inputs
Crystalstructure(Eulerangles& Solver
dislocationdensity),thermalhistory
andmechanicalloadinginformation
(e.g.tensile/fatiguetest).

3DSIM
MaterialSolver
MultiscaleDislocationDensitybased
CrystalPlasticityFiniteElementSolver

Outputs
DislocationDensityhistory,stress/strain
curves,slipdetails,ModifiedMicrostructure
(grainsize,orientation,etc)
ValidationofMechanicalPropertyPredictions

Ti64TensileBehavior(EBMprocessing)
OtherUniqueAspectsofourCode
Thermaleigenmodes appeartocorrespondto
microstructuraltexture
Phasechangesarealreadyinthecode,butnottexture&
grainsize
ResidualStressiscalculatedinparalleltothermalhistory
atanegligibleadditionalcomputationalcost
Residualstresstakessignificantlymoretimetocomputeusing
traditionalFEA
Wearecurrentlyimplementingtheabilitytopredict:
Meltpool instabilitieswhichleadtoballing
Multipleporositymechanisms,includingkeyholeporosity
SurfaceRoughness
UserInterface
MaterialInterface
ScanandSimulationOptions

OrImportallofthe
PriorInformationfrom
theMachineSoftware

AndThenPressRUN
ButArethesecodesTrustworthy?

WehavetestedeachMatlab/Fortranalgorithm
Threeprogramswilltest3DSIMscode
GE,UTRC&HoneywellasanAmericaMakesProject
DistortionPrediction&Compensation
Multiplemachinesandmultiplematerials
RutherfordAppletonLabsandAerospaceCompanies
ResidualStressPredictions&NeutronBeamValidation
DARPAOpenManufacturingProgram
Testingfullscalesimulationcapabilities
Conclusions
AnAccuratePredictionofMetalAMisBecomingaReality
Wehavedevelopedmodelingalgorithmswithneverbeforeseen
modelingefficiencies
3DSIMtoolswill:
Provideguidancetomachineusersonhowtobestoptimizetheirexisting
machines,buildlayouts,andsupports
Enablerapidmaterialsinsertion,optimization&qualification
Provideapredictionofpartperformancebeforebuildingapart
MakepossiblethedesignandmanufactureofbetterAMmachines
Makepossiblethedesignandmanufactureofbetterparts
Wecurrentlyprovidesoftwaresimulationsasaservice
Weplantooffersupportoptimizationtoolsinmid2015.
ABetaprogramisplannedfor2016foroursuiteoftools
Questions&Comments?

brent.stucker@3dsim.com
+14353635197
Acknowledgements:3DSIMSoftwarehasBeenDevelopedand/oris
BeingValidatedviatheFollowingProjects
InvolvingBoth3DSIMandtheUniversityofLouisville
DevelopmentofDistortionPredictionandCompensationMethodsforMetalPowder
BedAM AmericaMakes,GE,UTRC&Honeywell20142015
PredictingResidualStressinMetallicAdditiveManufacturing STFCEUconsortium,
(anticipated)20142015
FurtherDevelopmentof3DSIMModels DARPA20142015
ModelingofDMLSTi6/4ResidualStress&Supports AFRL/MLPC,20122015
BasicResearchattheUniversityofLouisville
ModelingofDMLSIn625 NIST,20132015
RapidQualificationofDMLS/EBMTi6/4 AmericaMakes,20132015
ModelingofDMLSTi6/4ArbitraryPowders AFRL/MLPC,2013
ModelingofFrictionStirAM NSF,20122015
AcousticResonanceTechniquesforQualificationofMetalAM ONR20142017
Modeling&ClosedLoopControlofUltrasonicConsolidation ONR,20112014
MultiMaterialUltrasonicConsolidation ONR,20072011
 FlowDiagramforComplete3DSIMSolution
Microscopy
Process
Information DynamicMesh AND/OR
Module
Module EulerAngle
Generator
Material
Information
Module

Process Material
Solver Solver

ThermalHistory&Residual
Stress/StrainDatabase MaterialProperty
Database
ProcessSolverMaterialInputs
(andtheirtemperaturedependencies)
BulkMaterialData
MaterialChemistry
Absorptivity
Density
SpecificHeat
ThermalConductivity
SolidusTemperature
CoefficientofThermalExpansion
ElasticModulus
Poissonsratio
YieldStrength
Strainratesensitivity
SolidStateTransition
Temperature(s)andphase(s)if
present
Ifthebaseplateisdifferentthan
thepowder,thenwerequirebase
platepropertiesaswell.
PowderBedMaterialData
Absorptivity
Includingenergytransmittance
throughthebedasafunctionofbed
thickness
PackingDensity(includinganisotropy
inx,y,z ifknown)
ThermalConductivity(including
anisotropy,ifknown)
CoefficientofThermalExpansion
MeltPoolMaterialData
Absorptivity
Density
SpecificHeat
ThermalConductivity
LatentHeatofFusion
LatentHeatofVaporization
Liquidus Temperature
VaporizationTemperature(ofany
lowelementalweightconstituents)
ProcessSolverMachineInformation
Baseplatetemperature
Powderbedboundarycondition(s)attopandsides
e.g.constanttemperatureoratimedependenttemperatureprofile
Partialpressureofoxygen
Temperaturedependentconvectioncoefficientatthetopofthepowderbed
Baseplatethickness
Scanvectors(includingorder,orientation,hatchspacing,strategy,etc.)
Scanspeed(includingaccelerationanddeceleration,ifknown)
Timebetweenscans
Delaybetweenhatchlinesandpatternbaseddelays
Timebetweenlayers
Layerthickness
Beampowerprofile
Laserpower
Laserwavelength
Beamdiameter
Distribution(Gaussian,tophat,etc.)
Formation of Keyhole Porosity
Keyhole melting is usually unstable, and occurs when the heat input is high. Under the mutual
effects of recoil pressure, surface tension and impacting pressure of melt flow, the keyhole
periodically collapses and breaks into two parts: a reduced keyhole and a void cavity.

Melting Melting Keyhole

phase phase
Keyhole
front
Solidification
front

Melting front void

Solid Solid
phase phase
Melt pool bottom

The periodicity was experimentally verified by a longitudinal cross section of a single bead (LLNL*).
This periodicity and the resulting % porosity is important to predict and validate.

500m
SS 316L, 334W, 171 mm/s
*W.E. King et al. / Journal of Materials Processing Technology 214 (2014) 29152925