UNIVERSIDAD POLITÉCNICA Escuela Técnica Superior

DE MADRID (UPM) de Ingenieros Industriales (ETSII)

Universidad Politécnica de Madrid

División de Ingeniería Electrónica
http://
http://www.aei.etsii.upm.es
www.aei.etsii.upm.es//

UPM
DIE 2005

UNIVERSIDAD POLITÉCNICA DE MADRID

www.upm.es www.etsii.upm.es

40000
40000 Students
Students
3300
3300 Faculty
Faculty Engineers for Industry (Ing
(Ing Industriales)
Industriales)
1900
1900 Administrative
Administrative 3000
3000 students 12
students 12 Departments
Departments
20
20 Schools
Schools 300
300 Doctoral
Doctoral students 29
students 29 R&D
R&D Labs
Labs
109
109 Departments
Departments 300
300 Faculty
Faculty
55 Research
Research Institutes
Institutes 200
200 Administrative
Administrative
UPM
2005
DIE

1
 International approach…

Almost ANY topic

Almost
related
related with
with
Power supplies
(horizontal
(horizontal service)
service)

Direct contracts:

TELECOM AEROSPACE CAD AUTOMOTIVE MEDICAL

Alcatel INDRA ANSOFT European Siemens
General Electric Crisa Analogy Manufacturer Philips
Siemens
Hearing
Bell Labs (Lucent, Agere) Sener Alcatel
Implants
Enpirion Tecnobit
Cochlear
Boeing
Plus partners in EU contracts: Philips, Anacad,
Anacad, Fraunhofer,
Fraunhofer, Ferroperm,
Ferroperm, Noliac,
Noliac, …
UPM
DIE 2005

Trends in power supplies

“There is no more room for research in circuit

Early 90´
90´s
topologies”

“Power supplies are a commodity”

Early 2000´
2000´s

“There is no future for research on power

2005
supplies”

UPM
2005
DIE

2
 There is always room for

Military specs
… but better
…but better LEAD
LEAD
Transformer with
25kV isolation,
isolation, than
than FOLLOW
FOLLOW
at high frequency
VCA ~
PRIMARY
Is SHARED
VBAT

Short Two inputs

charging time

UPM
DIE 2005

Objective

A
A look
look at
at the
the PAST….
PAST….
…may
…may help
help to
to guess
guess the FUTURE
FUTURE

Comment, from UPM perspective,

perspective, on:
9 the evolution of technologies, methodologies and applications demanded by companies in
actual projects
9 Identify areas of change, and research opportunities for future products

UPM
2005
DIE

3
 Look at the past…
High power
Power density
Factor PRE-
REGULATORS on board
Correction with
converters
PFC

Vast
Vast changes
changes in
in TECHNOLOGY
TECHNOLOGY
were
were APPLICATION
APPLICATION driven
driven

Circuit
Circuit topologies
topologies Goals
Goals ((Energy
Energy processing)
processing))
processing
Soft
Soft switching
switching techniques
techniques
Low
Low profile
profile Synchronous
Synchronous rectification
rectification
Low
Low current
current harmonics
harmonics
(EN
(EN 61000-3-2,
61000-3-2, IEEE519,…)
IEEE519,…) 2 stage, Series/parallel Low
Low voltage
voltage (1V)
(1V) Planar
Planar magnetic
magnetic
single stage energy flow, etc

UPM
DIE 2005

Look at the past…

P2 P2

P1 P1

Now it is a mature technology,

technology,
but there was a lot of research in
energy processing

HRU HRU

UPM
2005
DIE

4
 Look at the past…

Active clamp
(250kHz)
Resonant topologies
(1 MHz)
MHz)

New circuits
Mature technology
for
for stand
stand alone
alone converters
converters
A
A lot
lot to
to do
do at
at board
board level,
level,, VRMs,
level VRMs,,
VRMs
on
on chip
chip converters,
converters,, …
converters … Low Rg MOSFETs

Planar magnetics
UPM
DIE 2005

Look at the past…

Flexible
Flexible

Thick
Thick film
film Electroplating
Electroplating

INTEGRATION
is
is still
still an
an issue
issue

UPM
2005
DIE

5
 Look at the past…

D2 L1 C1
R1 D3
C8

ue
T1 C2 A Improvement
Improvement inin technology
technology
D5 L2
D1
T1
D4
produced
produced aa
M1
D6 L3 C3
great
great improvement
improvement inin
D7

D9 L4
C4 B PERFORMANCE
D8
T1
Cross
Cross regulation
regulation
D10 L5 C5
D11 C
T1

D12 L6 C7
D13

C7
D
D15
D14 L7
T1

• Standard set of layers

• Fast prototyping

UPM
DIE 2005

Look at the past…

Great
Great improvement
improvement in
in
PERFORMANCE
Repeatability
Repeatability
Efficiency
Efficiency
EMI
EMI

UPM
2005
DIE

6
 Look at the past…

Will
Will
clock
clock frequency
frequency and
and power
power
density
density continue
continue
increasing??
increasing??
Is
Is this
this the
the way
way to
to follow?
follow?
follow?

ENGINEERING PROBLEM
Thermal
Thermal management,
management,, Energy
management Energy processing
processing

UPM
DIE 2005

Guess the future

Wearable computing Ubiquotous computing

Ambient Intelligence

DO NOT forget
the ENERGY !!

UPM
2005
DIE

7
 Guess the future
Technology
Technology Applications
Applications

Devices Mobile electronics

9 CMOS Integration 9 Energy harvesting
9 Piezoelectric 9 Energy storage, Fuel cells
9 wide bandgap 9 Power management, DVS
Energy Processing 9 Source-converter-load integration
9 Synchronous buck
9 Multi-phase, homogeneous power
RF amplifiers
9 energy sharing 9 AM modulation of the supply voltage
9 Data transmitters (wide bandwidth)
Control
9 Non Linear breaks linear limitations Automotive
9 Digital and/or analog 9 Dual voltage 14V/42V
Virtual prototyping 9 Hybrid vehicles 14V/400V
9 Magnetic modeling and design Human implants
9 Behavioral models of power and control 9 Transfer energy through the skin
building blocks
Integration and packaging Aerospace
9 System integration
9 Not only stand alone, but within the system

UPM
DIE 2005

Mobile electronics

ENERGY SOURCE LOAD

LOAD
CONSUMPTION
CONSUMPTION
Harvesting INTEGRATED
INTEGRATED
DC-
DC-DC
DC-DC
¾ Electromechanical
CONVERTER
CONVERTER IC techniques
¾ Piezo
¾ Thermal Communication
Dynamic power
INTERFACE
INTERFACE
is needed
Storage management

¾ Li Ion, Li Polimer
¾ Fuel cells

UPM
2005
DIE

8
 Mobile electronics

Electric Motor

Fuel cells

Battery pack

POWER SUPPLIES
are
are used
used to
to control
control
ENERGY FLOW
UPM
DIE 2005

Mobile electronics
Power Converter

Filter

Amp
RF

Control

UPM
2005
DIE

9
 Mobile electronics

Dynamic
Dynamic losses
losses

E =k·Ceq·Vdd2
Dynamic Voltage dyn
Scaling
Changes in Vdd reduce dynamic losses
Changes in Vdd reduce dynamic
3V to 1V meanslosses
90% of energy savings !!
Vdd Static losses
Changes
Changes in
in Vt
Vt reduce
reduce static
static losses
losses
Dynamic losses
Static
Static losses
losses
CL In 90 nm technology static leakage losses
are a real problem

UPM
DIE 2005

Mobile electronics

Ideally,
Ideally, same task needs 10 times less energy at 1.1V than at 3.3V!!
(PENTIUM-TRANSMETA)
Is it really workable?
workable?

Prohibited zone

Same application (DVD)

UPM
2005
DIE

10
 Mobile electronics

Clock frequency 3.3V

Intensive tasks (maximum frequency and
supply voltage)
2V
1.1V Non-intensive tasks (fclk < fclk_max)

workload Low latency time

8 The system speed adjustes dynamically to the workload

8 The supply voltage adjustes dynamically to the system speed

Is
Is the
the power
power supply
supply
limiting
limiting this
this technology?
technology?
technology?
Fast changes
in Vout
out
are necessary

UPM
DIE 2005

Mobile electronics
Power stage
&
energy processing
2V are not trivial

Output 1
voltage µs Digital control
1V 4.5
A
Inductor current
ripple= 0.8 A 0A Non linear control

10µs
Tracking time = 1 µs
1.5 V
2V

0V 1V

UPM
2005
DIE

11
 Mobile electronics

CMOS
CMOS integration
integration
Integrate power devices in CMOS

Digital
Digital control
control

Counter
ref
> on_off

Integrated
Integrated magnetics
magnetics

UPM
DIE 2005

Mobile electronics
Power Converter

Filter

Amp
RF

Control

Voltage Scaling is also applicable to

AUDIO and DATA transmitters
Variable supply voltage
vo

Fast dynamics (Vout

out
)
Bandwitdh = 20kHz
UPM
2005
DIE

12
 Mobile electronics

V s = 9V, I s = 10A

V s = 24V, Is = 10A
UPM
DIE 2005

Mobile electronics

Digital control is
is implemented
implemented in
in the FPGA
ALREADY AVAILABLE in the system

f = 3kHz

UPM
2005
DIE

13
 Multi-
Multi-phase converters

Opposite to this:
this:

ƒ Energy is lumped
ƒ Losses are lumped

UPM
DIE 2005

Multi-
Multi-phase converters

DC/DC

DC/DC
DC/DC IIN/N
DC/DC
DC/DC
DC/DC

Paralleling
Multi-
Multi-phase converters
Phase shift

Integration
N ↑↑ Digital control
Homogeneous power

UPM
2005
DIE

14
 Multi-
Multi-phase converters

DC/DC

DC/DC
DC/DC IIN/N
DC/DC
DC/DC
DC/DC

Distributed losses
Space
Other technologies
ENERGY is distributed
Smaller ripple & filter
Better dynamics
Time
Smaller EMI

UPM
DIE 2005

Multi-
Multi-phase converters

Digital control

Counter
ref
> on_off

UPM
2005
DIE

15
 Multi-
Multi-phase converters

Very special magnetic materials are needed

UPM energy =1725uJ energy =1523uJ

DIE 2005

Multi-
Multi-phase converters
DC-DC

High Low
DC-DC

42V 12V
DC-DC

400V 12V

UPM
2005
DIE

16
 Multi-
Multi-phase converters

Digital control
control is
is mandatory
mandatory

UPM
DIE 2005

Multi-
Multi-phase converters
Phase currents
2

1.5
Phase currents (A)

0.5

0
SMD is possible
-0.5
0.0E+00 5.0E-06 1.0E-05 1.5E-05 2.0E-05 2.5E-05
t (s)

100.00

Very small size 97.50 Only power stage

SMD Power stage + control

components
Output capacitors
95.00

92.50
Efficiency (%)

90.00

87.50

85.00

82.50

80.00
0 10 20 30 40 50 60 70
Output current (A)

UPM
2005
DIE

17
 Multi-
Multi-phase converters

Multiphase
Multiphase Magnetic
Magnetic Coupling
Coupling
converters
converters integration
integration

i1
i0
v1 Load
i2

v2
i3

v3 Multiphase transformer
i4 (several implementations)

UPM
DIE 2005

Multi-
Multi-phase converters

v1 iO Load
i2

v2
i3

v3

Standard cores

UPM
2005
DIE

18
 Multi-
Multi-phase converters
Phase currents
Phase voltages
i1 Voltage averager

v1 iO Load
i2 v 1 +v 2 + K +v M
vc =
M
v2 v4
i3 vC Transformer
output voltage
v3
t

V1 V1

V2 V2
V3 V3

VC VC

UPM
DIE 2005

Transformador multifase
i1 iO
AC current equalizer
v1 Load
i2
i1 = i 2 = K = i M
v2
i3
Phase current ripple and
v3 Lequivalet are decoupled

Lequivalent decoupled inductors Output current

Phase current Phase current

( inductors) ( transformers)
Lfilter

Leq minimum allowable

(MOSFET losses)
log M
UPM
2005
DIE

19
 Multi-
Multi-phase converters

Core A Core B Core A

Core B

Winding phase 3
Winding phase 1

Winding Winding Winding phase 4

phase 2 phase 4
Volume comparison
125%
Phase 2 Core A
100%

Phase 3 Phase 1 75%

50%
Core B Phase 4
25%

0%
Decoupled Integrated Integrated
inductor transformer transformer +
UPM additional inductor
DIE 2005

Multi-
Multi-phase converters

16 small transformers

UPM
2005
DIE

20
 Multi-
Multi-phase converters

UPM
DIE 2005

Mobile electronics

• Objective: MORE AUTONOMY

Emitter

Implant

Microphone Cochlea

Auditive
nerve
Cable

Electrodes

Speech processor

Minimize
Minimize LOSSES
LOSSES 55 mW
mW
TRANSFORMER
TRANSFORMER coupling
coupling
Resonant
Resonant topology
topology

UPM
2005
DIE

21
 Piezoelectric transformers

AC
AC adapters
adapters

PT:
25W/cm3
Magnetic-
Magnetic-less DC/DC
Magnetic-less DC/DC
DC/DC (400W/in3!!)
Lighting
Lighting

UPM
DIE 2005

Virtual prototyping

UPM
2005
DIE

22
 Virtual prototyping

Saturation & Hysteresis

PExprt Model

Over-Voltage at the Switch because Converter Losses: 1.7 W

of the leakage Inductance

UPM
DIE 2005

Virtual prototyping

UPM
2005
DIE

23
 Virtual prototyping

From the COMPONENT

to the
the SYSTEM
SYSTEM

UPM
DIE 2005

Virtual prototyping

But for SYSTEM INTEGRATION,

you need top-
top-down approach
top-down

UPM
2005
DIE

24
 Virtual prototyping

755.00m Input Voltage

LAMBDA X15-
X15-48S05
600.00m Output Voltage

500.00m

400.00m

Behaviotal models facilitate

300.00m
system design
DATASHEETS 200.00m Input Current

100.00m
Imbalance
Vin+ Vout+
Remote
Share -45.00m
On/Off
DC/DC
Sync In Sync Out
0 2.00m 4.00m 6.00m 10.00m
Vin- Temp Vout-
t [s]

UPM
DIE 2005

Virtual prototyping

270V Main Bus 48V Unregulated Load 28V Secondary Bus DC-DC
Vinp Vop Vinp Vop
DC/DC
DC/DC

270V/48V
R48V 28V/12V TRAPEZ2 R12V
12V Regulated Load
TRAPEZ1
Vinm Vom
Vinm Vom

E270V MonosalidaRegUnidireccionalConLimitadorRendVariable
MonosalidaRegUnidireccionalResistSalidaVariableRendVariable1
DC-DC MultisalidaUnidireccional
Multi-output
MonosalidaRegUnidireccionalResistSalidaVariableRendVariable2
A Vinp
DC/DC
5Vout reg Vop TRAPEZ5 5V Regulated Load
(with Io limiter)
R5VM
Vinp Vop
DC/DC + AM5 Vom
V V28V 28VIn
270V/28V
12Vout no regV2op
Vinm Vom (without Io limiter)
Vinm
V2on

TRAPEZ4 R12VM
12V Unregulated Load
DC-DC
Imbalance STEP1
Battery Subsystem
AM4

A Vinp DC/DC Vop

A
Vinp Vop Vinn
DC/DC + 28V/5V AM1
Vbat (parallel option)
V
270V/28V
Vinm Share Vom
Vinm Vom Vinp

BatterySubsystem
Vinp DC/DC Vop A

28V/5V AM2
Bidirectional converter (parallel option)

Vinm Share Vom

R5VP 5V High Power Regulated Load

• Complex system Vinp DC/DC

28V/5V
Vop
A
AM3
(parallel option)

• Building-Blocks Vinm Share Vom

Parallel converters
UPM
2005
DIE

25
 Trends in Power Supplies
Energy processing Voltage scaling Digital control
Counter
ref
> on_off

Virtual prototyping
Stand alone power
Input/output models suplies
become commoditized
Integration
Look at Source -Converter
Vin+ -Load Integration
Source-Converter-Load
Vout+
Remote
Imbalance
Source-Converter-Load
Share
Piezoelectric materials DC/DC
On/Off
Sync In Sync Out
CMOS integration
Transformers and Vin- Temp Vout- Magnetics integration
energy harvesting

UPM
DIE 2005

26