09/04/2013

A guide to auditing a surface mount

production Line

Naim Kapadia
Research Engineer
Manufacturing Technology Centre

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What is The MTC?

Address
MTC Limited
Ansty Park, Coventry, CV7 9JU
Contact Details
T: +44 (0)2476 701600

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Fully equipped surface mount line

Investment of 2.1 million

spent on state of the art
surface mount equipment.

Humidity & temperature

Controlled.

Best practice ESD control.

Why audit?
Transparency for what is happening
in the area or to the product.

Allows companies to assess the

necessary steps for continued
improvements or selecting the
correct sub-contractor.

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Some useful accreditation

NADCAP AC7120.
IPC 1720A.

Courtesy of Nadcap

Courtesy of IPC

Topics to cover

SMT area.
Types of Surface Mount equipment and ancillary items.
An overview of Surface Mount process.
SMT key performance indicators (KPIs).
Inspection process control.
Rework process & controls.
Process control for tin lead & lead-free process.

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Entering the SMT area

EPA area is clearly identified according

the procedure.

Personnel working within defines area are

checking daily as per the procedure.

Visitors ESD testing before entering.

Personnel trained and given an

understanding of the importance of ESD.

Surface mount area

Clear signs of entering and leaving ESD area.

Non essential insulated material .
Equipment, workstation and flooring are checked in
accordance with the preventative maintenance plan.
Procedure to address situations in which humidity level is
below 30% humidity.

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Minimum SMT requirement

Pick and Place Reflow Oven

Screen Printer
Courtesy of Europlacer Courtesy of Ersa
Courtesy of Assembleon

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SMT printing

1.Solder Paste
2. Printed Circuit Board

3. Stencil 4.Tooling 5.Squeegee Blades

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Solder paste

Paste Storage. 100% Flux Misc.

S urfactants
Condition of use (FIFO). Rheo-Additives

Activators
Control of Solder paste. Me tal
Resin
Cross Contamination.
S olvent
Disposal.
Content of Solder paste

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Printed circuit board (PCB)

IPC-6012.
Incoming inspection.
Storage & handling.
Age sensitivity.

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Stencils

Stencil design procedure.

Controlling stencil no.
Cleaning stencil.
Screen orientation.

Stencil (Courtesy of Tecan)

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Tooling pins & surface

Cleaning procedure.
Diagram of tooling spread.
Grid Lock

PCB

Pins
Surface

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Squeegee blades

Correct sizes available.

Cleaning regularly.
Cross contamination.
Check for damages.

Squeegee Blade (Courtesy of DEK)

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SMT placement
1. SMT Components in
correct presentation

2. Pasted PCB

Courtesy of Europlacer
3. Offline Program 4. Feeders &
Trollies

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SMT components

Method of verifying the kits.

Suitable packaging.
Control moisture sensitive.
components (does it meet J-STD-033/
J-STD-020).

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Solder pasted board

Procedure for cleaning & inspecting misprinted
board.
Transportation.
2D or 3D inspection.
Place component within a given TAKT time.

Printed boards

1 2

5 point inspection 5
3 4

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Off line programming

Initial issue & revision control of

programs.

Control of overriding old programs on

automated pick and place machine.

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Feeders & trollies

Fiducials on trollies.
Signs of damage.
Correct feeders for correct Feeder stick
package.

Feeder Trolley

Fiducials on Trollies or magazine

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SMT reflow or vapour phase

1. PCB ready for

Soldering
2. SMT
Profile

Reflow
Oven

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PCB ready for soldering

MSD control.
Maximum time permitted between
solder paste and reflow.
Air or Nitrogen.

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Solder profile
Profile monitoring.
Thermocouple calibration.
IPC-7530.

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Inspection stations
Stencil Printing Procedures for control solder paste coverage,
alignment, shape, frequency).

2D or 3D Solder paste inspection.

Post place and post reflow inspection.
X-ray.

Questions to consider around inspection

Acceptance of false defects is carried out by authorised personnel per

procedure.
X-ray training.
Warm up procedure.

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Rework process
Procedure to perform rework.
Approved tools.
Subsequent stages of rework.
Method of preventing parts removed during
rework.
Method of recording component removal.
Maximum number of permitted rework.

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Other audit items to consider

Training matrix.
Timescales Use SMART.
Up to date datasheets, COSHH & Risk
assessments.
Qualification for solder material.
Qualification for compatibility with other material
such as conformal coating and cleaning
process.

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Key performance indicator KPIs

Key Performance Indicators (KPIs) helps organisations
to understand how well each shift cell or department
are performing.

Why do we measure?
To learn and improve.
To report externally and demonstrate compliance.
To control and monitor people.

Important: Use KPIs correctly.

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Cascading the KPIs

Shop floor level (per shift)
Components placed per time period vs. the defect found
per time period.
Average components placed per hour.

Operation level (Core KPI)

Aggregated across all lines & shifts to give a long term
view of performance versus goals.

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General standards & procedures

Work instructions followed.
Inspection standards.
Health & Safety.
Risk assessment.
Training records.

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Environment control

ESD control at <30%.

relative humidity to satisfy
the J-STD-001 requirement.
Corrective action.

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Maintenance schedule records

All machine undergo daily weekly monthly, six

monthly and yearly.

Up to date signed sheets.

External maintenance contract.

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Statistical process control (SPC)

3D solder paste inspection.
Post place inspection.
Post reflow Inspection.

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3D solder paste inspection passed PCB

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3D Solder paste inspection failed PCB

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3D solder paste inspection SPC

Scooping.
Misalignment.
Print height.
Incomplete print.
Bridging.
Print volume.

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AOI inspection SPC

Each board report Defect report by type

Consistency in the defect. Missing.

Accuracy of placement. Skewed.
Tolerances . Rotation.
Incorrect.
Solder defect -Opens & shorts.
Incorrect value.
False defects.

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Some pointers for controlling Lead-free Vs.

Leaded Process in SMT
To prevent cross contamination

Works instruction or batch card (red vs. green). Label

Label
Stencil design Corner tabs or label.
Solder paste and pots. RoHS
Non-RoHS
Soldering Irons.
Dedicated areas for soldering & cleaning stencil.
Squeegee blades.
Spatula.

Tin lead Solder paste

Lead-free Solder
paste

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