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QCVN 09 Tiep Dat
QCVN 09 Tiep Dat
QCVN 9:2016/BTTTT
H NI - 2016
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MC LC
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Li ni u
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QCVN 9:2016/BTTTT
1. QUY NH CHUNG
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1.4.5. Dy lin kt ng th (equipotential bonding conductor)
Dy bo v m bo cho vic lin kt ng th.
1.4.6. Tm tip t chnh (MET)
Mt in cc hoc thanh dng kt ni cc dy dn bo v, cc dy dn kt ni
ng th v cc dy dn tip t cng tc (nu c), vi t tip t.
CH THCH: Trn thc t, tm tip t thng l mt tm ng m Niken c khoan l, bt vo bn baklit v
bt cht vo tng.
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1.4.16. Mng lin kt chung (CBN)
Mt tp hp cc phn t kim loi lin kt vi nhau mt cch ngu nhin hoc c ch
nh to thnh mt mng lin kt chnh bn trong to nh vin thng.
1.4.17. Mng lin kt mt li (Mesh -BN)
Mng lin kt m tt c cc khung thit b, cc gi , cc cabin, dy dng ca
ngun mt chiu c u ni vi mng lin kt chung (CBN) ti nhiu im.
1.4.18. Mng lin kt cch ly mt li (Mesh- IBN)
Mng lin kt cch ly m trong cc thnh phn ca n (cc khung gi thit b)
c ni vi nhau to thnh mt cu trc dng mt li.
1.4.19. Ngun s cp (primary supply)
Ngun in li cng cng, hoc, trong trng hp khn cp, ngun pht in AC
trong khu vc.
1.4.20. Ngun th cp (secondary supply)
Ngun cp n thit b vin thng, gi hoc khi h thng thit b vin thng, ly t
ngun s cp.
1.4.21. Ngun cp ba (tertiary supplies)
Ngun cp n thit b vin thng, ly t ngun th cp.
1.4.22. H thng (system)
Nhm cc thit b tng tc vi nhau to thnh mt thc th thng nht.
1.4.23. Khi h thng (system block)
Nhm theo chc nng hot ng ca thit b, hot ng trn s kt ni vi cng mt
mt phng in th chun h thng, gn lin vi mt Mesh- BN.
1.4.24. Mt phng in th chun h thng (SRPP)
Mt phng dn in vi mc ch cn bng in th, c thc hin bng cc li
thng ng hoc ngang.
CH THCH 1: rng ca mt li c iu chnh theo khong tn s xt n. Cc tm mt li nm ngang
v thng ng c th kt ni vi nhau to thnh mt cu trc tng t lng Faraday.
CH THCH 2: SRPP h tr bo hiu vi chun in th chung.
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CBN Common Bonding Network Mng lin kt chung
DC Direct Current Dng mt chiu
EMC ElectroMagnetic Compatibility Tng thch in t
LPS Lighning Protection System H thng chng st
MESH- BN Meshed Bonding Network Mng lin kt mt li
MESH- IBN MESHed Isolated Bonding Network Mng lin kt cch ly mt li
MET Main Earthing Terminal Tm tip t chnh
N Neutral conductor Dy trung tnh
PE Protective conductor Dy bo v
PEN Combined Protective conductor and Dy bo v v trung tnh kt hp
Neutral conductor
RF Radio Frequency Tn s v tuyn
SRPP System Reference Potential Plane Mt phng in th chun ca h thng
2. QUY NH K THUT
2.1.3. Cp tip t
- Chiu di cp tip t khng ln hn 50 m. Trong trng hp c bit c th cho
php tng chiu di cp dn t nhng phi m bo in tr mt chiu ca cp dn
t phi nh hn hoc bng 0,01 .
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- S dng loi cp ng (mt hoc nhiu si) c tng tit din khng c nh hn
100 mm2.
2.2. Cu hnh kt ni
2.2.1. Mng CBN bn trong trm vin thng
Trm vin thng phi thc hin kt ni lin kt chung CBN.
Mng CBN phi c ni vi tm tip t chnh bi mt vng kt ni dc theo chu vi
bn trong ta nh; hoc thnh phn c bn ca CBN l dy dn vng phi bao
quanh c khi h thng thit b. Mng CBN phi c kh nng m rng thnh kt
cu li 3 chiu p ng c nhu cu b sung thm cc h thng thit b vin
thng trong trm vin thng.
Mng CBN phi m bo c dng nh mt lng Faraday c tnh dn in lin tc
bao quanh ton b trm vin thng nh s Hnh 1.
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- Khung gi cp nhp trm vin thng;
- Cc ng dn nc, cc ng dn cp bng kim loi.
2.2.2. Mng lin kt trong h thng thit b vin thng
Trong mt khi h thng thit b vin thng, mng lin kt phi c dng mt li
(MESH- BN).
Mng MESH - BN phi kt ni cc khung gi, v my, cc ng ng, khay, gi phi
tuyn, v cp v tm m kt ni to thnh mt mt phng cn bng in th
chun h thng (xem 1.4.24).
Tt c cc thnh phn kim loi ca MESH- BN phi to thnh mt tng th lin tc
v in (xem Hnh 2).
Mng lin kt mt li (MESH- BN) cn m bo nhng yu cu nh sau:
a) Tm m mt li
- Tm m mt li c kch thc ln cha ng c cc thit b v gi
cp nm trong khi h thng MESH -BN v c t di sn thit b.
- Tm m c lm bng dy (di) ng trn hoc bng dy (di) thp m km c
tit din ti thiu 14 mm2 v hn thnh li.
- Kch thc mt li nm trong phm vi:
20 cm x 20 cm;
30 cm x 30 cm;
40 cm x 40 cm;
50 cm x 50 cm.
b) Kt ni tm m mt li vi mng CBN ti nhiu im (cng nhiu im ni vi
mng CBN cng tt) bng dy ng trn hoc thp m km c tit din ti thiu l
14 mm2.
c) Kt ni phn dn ca khi h thng thit b vin thng vi tm m mt li
- Thit b vin thng vi nhng mch in t c cung cp chung mt lp bc kim
loi to ra mt bng in th chun ph khp trn b mt cc bng mch in. Tt c
cc mt bng in th chun c ni vi nhau ng thi c ni vi khung gi
thit b hoc vi v kim loi ca h thng cp ln cn (nm trong khi M-BN) bng
nhng dy ng c tit din ti thiu l 14 mm2.
- Kt ni cc v, khung gi thit b, v kim loi cp vi tm m mt li bng dy
(di) ng theo ng ngn nht. Tit din ca dy ni c quy nh trong Bng 1.
Bng 1 - Tit din ca dy ni ti tm m mt li
TT Tn dy ni Tit din
ti thiu, mm2
1 Dy ni v kim loi ca cp thu bao (chn) 14
2 Dy ni v kim loi ca cp thu bao (treo) 14
3 Dy ni thit b bo v thu bao trn gi phi tuyn MDF 14
4 Dy ni thit b bo v ngun AC 35
5 Dy ni t ngun c quy 14
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Dy dn lin kt ng th
Cp lin kt h thng (mng ni ht hoc trung k)
Dy dn ng v DC
N PE PE
N PE
Mng tip t
H thng in
bn ngoi (TN-S)
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H thng in
bn trong (TN-S) Dy dn vng
PE
N PE PE
Mng tip t
H thng in bn ngoi
(IT hoc TT)
Hnh 5 - Phng php u ni mng phn phi in AC cho trm vin thng
3. QUY NH V QUN L
Cc trm vin thng thuc phm vi iu chnh ti mc 1.1 phi tun th cc quy nh
ti Quy chun ny.
4.1. Cc c quan, t chc thit lp, qun l, khai thc cc trm vin thng quy nh
ti mc 1.1 c trch nhim m bo ph hp vi Quy chun trong qu trnh thit k,
lp t, vn hnh, bo dng v chu s kim tra ca c quan qun l nh nc
theo quy nh.
4.2. Cc c quan, t chc qun l, khai thc cc trm vin thng quy nh ti mc
1.1 c trch nhim thc hin cam kt ph hp vi quy chun ny trn c s h s
k thut ca trm vin thng v thc hin cng b hp quy cc trm vin thng ph
hp vi mc 2.1.1 ca quy chun ny. Vic cng b hp quy thc hin theo Thng
t s 28/2012/TT-BKHCN ngy 12 thng 12 nm 2012 ca B Khoa hc v Cng
ngh.
4.3. Cc Vin thng c trch nhim tip nhn ng k cng b hp quy, thc hin
qun l, hng dn v kim tra vic cng b hp quy.
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5. T CHC THC HIN
5.1. Cc Vin thng v cc S Thng tin v Truyn thng c trch nhim t chc
hng dn, trin khai v qun l cc trm vin thng ph hp vi Quy chun ny.
5.2. Quy chun ny thay th cho Quy chun k thut quc gia QCVN 9:2010/BTTTT
Quy chun k thut quc gia v tip t cho cc trm vin thng.
5.3. Trong trng hp cc quy nh nu ti Quy chun ny c s thay i, b sung
hoc c thay th th thc hin theo quy nh ti vn bn mi.
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PH LC A
(Quy nh)
Phng php o in tr tip t
E P C
d
l
E ni n t tip t cn o
P, C - Cc im ni n cc in cc o th
Hnh A.1 - S o in tr tip t
I1 E1 E2
I
E
P in cc C in cc
l in p dng in
D2 = 0,62D1
D1 2,2l
Vng nh hng ca in
cc tip t
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I1 E1 E2
My o in tr tip t
I
ng cho ca li tip t
P
D2 = 0,62D1
C in cc
in cc
Vng nh hng D1 5D
ca li tip t
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TH MC TI LIU THAM KHO
[1] ITU- T, Recommendation K27 (03/2015), Bonding configurations and earthing inside a
telecommunication building.
[2] ETSI EN 300 253 V.2.2.1 (2015-06) Environmental Engineering (EE); Earthing and
bonding of ICT equipment powered by -48 VDC in telecom and data centres.
[3] J- STD 607- A (2002), Commercial Building Grounding (Earthing) and Bonding
Requirements For Telecommunications.
[4] R56 (1/2005), Motorola, Standards and Guilines for Communication Sites.
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