Yamaha XMV4280, XMV4140 PDF

POWER AMPLIFIER
SERVICE MANUAL
l XMV4280
l XMV4140
CONTENTS
SPECIFICATIONS.................................. 4 Initializing the Internal Memory
DIMENSIONS............................................ 9 .......................... 116
PANEL LAYOUT..................... 10 LIST OF COMMAND............. 117/119
CIRCUIT BOARD LAYOUT & WIRING Alert Numbers and Content
& .............................. 12 ................................................ 121/123
DISASSEMBLY PROCEDURE............. 17 Power start up sequence
LSI PIN DESCRIPTIONLSI . ............ 29 ..................................... 125/129
CIRCUIT BOARDS. ...................... 33 Ending Sequence after Power OFF
TEST PROGRAM. ............ 50/70 ..................................... 133/134
INSPECTIONS....................................... 90/98 CAUTIONS FOR CPU CIRCUIT BOARD REPLACEMENT
UPDATING FIRMWARE CPU ................................ 135
................... 106/109 PARTS LIST
UPDATING FIRMWARE USING MTX Editor BLOCK DIAGRAM
MTX Editor ... 112/114 CIRCUIT DIAGRAM
PA 012086
HAMAMATSU, JAPAN
Copyright (c) Yamaha Corporation. All rights reserved. PDF 13.06
XMV4280/XMV4140
IMPORTANT NOTICE
This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed that basic
service procedures inherent to the industry, and more specifically Yamaha Products, are already known and understood by the users,
and have therefore not been restated.
WARNING : Failure to follow appropriate service and safety procedures when servicing this product may result in personal injury,
destruction of expensive components and failure of the product to perform as specified. For these reasons, we advise
all Yamaha product owners that all service required should be performed by an authorized Yamaha Retailer or the
appointed service representative.
IMPORTANT : This presentation or sale of this manual to any individual or firm does not constitute authorization certification,
recognition of any applicable technical capabilities, or establish a principal-agent relationship of any form.
The data provided is belived to be accurate and applicable to the unit(s) indicated on the cover. The research engineering, and service
departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefore, inevitable and changes in
specification are subject to change without notice or obligation to retrofit. Should any discrepancy appear to exist, please contact the
distributors Service Division.
WARNING : Static discharges can destroy expensive components. Discharge any static electricity your body may have accumulated
by grounding yourself to the ground bus in the unit (heavy gauge black wires connect to this bus.)
IMPORTANT : Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power to the unit.
WARNING: This product contains chemicals known to the State of California to cause cancer, or birth defects or other reproductive harm.
DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY REASON WHAT SO EVER!
Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose eyes to solder/
flux vapor!
If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handling food.
LITHIUM BATTERY HANDLING

This product uses a lithium battery for memory back-up.
WARNING : Lithium batteries are dangerous because they can be exploded by improper handling. Observe the following precautions when
handling or replacing lithium batteries.
Leave lithium battery replacement to qualified service personnel.
Always replace with batteries of the same type.
When installing on the PC board by soldering, solder using the connection terminals provided on the battery cells.
Never solder directly to the cells. Perform the soldering as quickly as possible.
Never reverse the battery polarities when installing.
Do not short the batteries.
Do not attempt to recharge these batteries.
Do not disasemble the batteries.
Never heat batteries or throw them into fire.
ADVARSEL!
Lithiumbatteri-Eksplosionsfare ved fejlagtig hndtering. Udskiftning m kun ske med batteri af samme fabrikat og type. levr det brugte batteri tilbage til
leverandren.
VARNING
Explosionsfara vid felaktigt batteribyte.
Anvnd samma batterityp eller en ekvivalent typ som rekommenderas av apparattillverkaren.
Kassera anvnt batteri enligt fabrikantens instruktion.
VAROITUS
Paristo voi rjht, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiiin.
Hvit kytetty paristo valmistajan ohjeiden mukaisesti.
The following information complies with Dutch official Gazette 1995. 45; ESSENTIALS OF ORDER ON THE COLLECTION OF BATTERIES.
Please refer to the diassembly procedure for the removal of Back-up Battery.
Leest u voor het verwijderen van de backup batterij deze beschrijving.
WARNING
Components having special characteristics are marked and must be replaced with parts having specification equal to those
originally installed.
2
XMV4280/XMV4140
IMPORTANT NOTICE FOR THE UNITED KINGDOM This product contains a battery that contains perchlorate material.
Connecting the Plug and Cord Perchlorate Materialspecial handling may apply,
See www.dtsc.ca.gov/hazardouswaste/perchlorate.
WARNING: THIS APPARATUS MUST BE EARTHED IMPOR-
TANT. The wires in this mains lead are coloured in accor- * This applies only to products distributed by (Perchlorate)
dance with the following code: YAMAHA CORPORATION OF AMERICA.
GREEN-AND-YELLOW : EARTH
BLUE : NEUTRAL
BROWN : LIVE
As the colours of the wires in the mains lead of this apparatus
may not correspond with the coloured markings identifying the
terminals in your plug proceed as follows:
The wire which is coloured GREEN-and-YELLOW must be
connected to the terminal in the plug which is marked by the
letter E or by the safety earth symbol or colored GREEN or
GREEN-and-YELLOW.
The wire which is coloured BLUE must be connected to the
terminal which is marked with the letter N or coloured BLACK.
The wire which is coloured BROWN must be connected to the
terminal which is marked with the letter L or coloured RED.
(3 wires)
BACKUP BATTERY
This device has a built-in backup battery. When you unplug the power cord from the AC outlet, the internal data is retained.
However, if the backup battery fully discharges, this data will be lost. When the backup battery is running low, the display
indicates 012. and the ALERT indicator is blinking. In this case, immediately save the data to external device such as a
computer, then have qualified Yamaha service personnel replace the backup battery.
Be sure to
perform it

[ALERT] 012.

SAVING DATA
This device has a built-in backup battery that maintains data in internal memory even when the devices power is switched off. The
backup battery will eventually become depleted, however, and when that happens the contents of the internal memory will be lost.*
To prevent loss of data be sure to replace the backup battery before it becomes fully depleted. When the remaining capacity of the
backup battery becomes so low that it needs to be replaced a 012. message will appear on the display during operation or
when the device is powered on. If either of these messages appears do not turn off the power and immediately transfer any data you
want to save to a computer or other external storage device, then have qualified Yamaha service personnel replace the backup battery.
The average life of the internal backup battery is approximately 5 years, depending on operating conditions.
* Data items maintained in the internal memory by the backup battery are as follows:
Device parameters (Attenuator values, Polarity settings, HPF settings, Analog/digital input setting, and [SIGNAL] indicator display
setting).
Event log.
Data items other than those described above are stored in memory that does not require backup power, and will be retained even if the
backup battery fails.
*
012.
5 ( )
*
( HPF / [SIGNAL] )

3
XMV4280/XMV4140
ABOUT FIRMWARE UPDATES

With this product, it is possible by specification to update
the firmware of the main unit for the purposes to improve its
operability, to add functions and to correct malfunction.
For the information regarding the firmware update, please
visit the website below.
http://proaudio.yamaha.co.jp/ http://proaudio.yamaha.co.jp/
To execute the update and setting of the main unit, use MTX
Editor available from the above website. For the update pro- MTX EditorMTX
cedure of MTX Firmware, refer to Update Firmware dia- Firmware MTX Editor >> 7
log in Chapter 7 Dialog in MTX Editor Users Manual. >>Update Firmware

SPECIFICATIONS
XMV4280 XMV4140
Output Power 100V, 120V, 230240V 50Hz/60Hz
1kHz, THD+N=1% 4 280W 140W
(20 ms Burst) 8 280W 140W
4 / DOUBLE POWER MODE 560W 280W
8 / DOUBLE POWER MODE 560W 280W
High Impedance 100V (RL=40/XMV4280)
250W 125W
(RL=80/XMV4140)
70V (RL=20/XMV4280)
250W 125W
(RL=40/XMV4140)
Amplifier Type (Output Circuitry) Class D

THD+N 1kHz, half power, 4
0.2%
All channel output
1kHz, half power, 100V, 70V
0.2%
All channel output
Frequency Response 1W, 280W/8, 20Hz20kHz (XMV4280)
1W, 140W/8, 20Hz20kHz (XMV4140) 0dB, 1.0dB
1W, 100V/70V, 20Hz20kHz
Crosstalk 1kHz, half power, 8
-60dB
Att. max, input 150 shunt
Residual Noise A-weighted
-65dBu
280W, 8
S/N Ratio A-weighted
100dB
280W or 140W mode
Input Sensitivity +4 dBu (1.23V)
Voltage Gain 100V 38.2dB 38.2dB
70V 35.2dB 35.2dB
280W (140W)/8 31.7dB 28.7dB
560W (280W)/8 34.7dB 31.7dB
Load Protection Power switch on/off Mute the output
DC-fault Power supply shutdown
Amplifier Protection Thermal Mute the output (heatsink temp. 90C) (return automatically.)
Overcurrent Mute the output (return automatically.)
Low load impedance Mute the output (return automatically.)
Power Supply Thermal Power supply shutdown (heatsink temp. 100C)
Protection Integrated power Gain reduction (return automatically.)
Limiter Circuit Clip limiting Cilp limiter
Cooling 3 speed fan x 2, front-to-back airflow
4
XMV4280/XMV4140
XMV4280 XMV4140
Maximum Input Level +24dBu
Input Impedance 20k (balanced)
10k (unbalanced)
Sampling Frequency 48kHz
A/D, D/A Converters AD: 24-bit linear, 128 times over sampling
DA: 24-bit linear, 128 times over sampling
Signal Processing 32 bit digital signal processing
Latency Analog input m [SPEAKERS] output 1.85msec
[YDIF] input m
1.08msec
[SPEAKERS] output (fs=48kHz)
[YDIF] input m
1.17msec
[SPEAKERS] output (fs=44.1kHz)
Controls Front panel Power switch (rocker), Rotary encoder x 1,
[FUNCTION] button x 1, [SELECT] button x 4, [MUTE] button x 1
Front panel (software) ATT (-99dB to 0dB, 1dB step), POLARITY,
HPF (OFF, 40Hz, 80Hz), *40Hz or 80Hz for Hi-Z output setup
INPUT SOURCE (ANALOG/DIGITAL), SIGNAL LED (INPUT/OUTPUT)
Rear panel AMP SETTING switch (OUTPUT FORMAT, IMPEDANCE, DOUBLE POWER MODE,
HI-Z LEVEL, per 2 channels), SETUP switch ((UNIT ID, LED DIMMER, PANEL LOCK,
IP SETTING, START UP MODE), Rotary switch (UNIT ID)
Connectors Analog input Euroblock (5.08mm pitch, balanced) /ch
Digital I/O RJ45 x 2 ([YDIF] IN/OUT)
Speakers Barrier strip /ch
Network RJ45 x 1
Remote Euroblock (3.50mm pitch) x 1
Fault output Euroblock (3.50mm pitch) x 1
Power AC inlet x1
Indicators [POWER] x 1 (green),
[ALERT] x 1 (red),
[PANEL LOCK] x 1 (orange),
[PROTECTION] x 4 (orange),
[LIMIT] x 4 (red),
[MUTE] x 4 (yellow),
[SIGNAL] x 4 (green),
[SELECT] x 4 (green),
[NETWORK] x 1 (green),
[YDIF] x 1 (green)
Display 3 digit, 7 segment numeric display
AC Power Requirement 100V, 120V, 230V240V 50Hz/60Hz

Power 1/8 MAX power, (4) 250W 150W
Consumption Idle (4) 37W 37W
Standby 18.5W 18.5W
Operating Temperature 0C to +40C
Storage Temperature -20C to +60C
Dimensions (W x H x D, including knob) 480 x 88 x 422 mm (18.9 x 3.5 x 16.6 inches)

Net Weight 8.1 kg (17.9 lbs)
Included Accessories AC power cord (2.5m) x 1, Euroblock plug (3-pin, 3.50mm pitch) x 2,
Euroblock plug with tabs (3-pin, 5.08mm pitch) x 4, Cable tie x 4, Owners Manual x 1
Optional Accessories
5
XMV4280/XMV4140
[SIGNAL] Indicator Lit Level

XMV4280 XMV4140
Gain after Lit level Gain after Lit level
DSP (dB) dBu Vrms W DSP (dB) dBu Vrms W
100V 45.2 8.7 2.11 100V 45.2 8.7 2.11
70V 42.1 5.6 1.48 70V 42.1 5.6 1.48
560W/8 41.7 5.2 1.41 0.249 280W/8 38.7 2.2 1.00 0.125
560W/4 38.7 2.2 1.00 0.250 280W/4 35.7 -0.8 0.71 0.125
280W/8 38.7 2.2 1.00 0.125 140W/8 35.7 -0.8 0.71 0.063
280W/4 35.7 -0.8 0.71 0.125 140W/4 32.7 -3.8 0.50 0.063
XMV4280
Power Specifications (PINK NOISE, 100V/50Hz mains)
Power Watts Heat Dissipation
MODE Line Current (A)
consumption (W) Dissipated (W) Btu/h kcal/h
280W/4
280W/8
560W/4
standby 0.3 15 15 51 13
560W/8
100V
70V
280W/4 0.5 37 37 127 32
280W/8 0.5 37 37 127 32
560W/4 0.4 31 31 106 27
idle
560W/8 0.5 36 36 124 31
100V 0.6 48 48 165 41
70V 0.6 48 48 165 41
280W/4 2.2 218 78 268 67
280W/8 2.0 203 64 218 55
1/8 output 560W/4 2.2 214 75 256 64
power 560W/8 2.2 211 71 244 61
100V 2.0 190 65 223 56
70V 2.1 196 71 244 61
280W/4 5.2 499 123 422 106
280W/8 4.9 470 97 332 84
1/3 output 560W/4 5.0 485 113 386 97
power 560W/8 5.2 505 131 449 113
100V 4.3 416 84 288 73
70V 4.6 445 106 364 92
6
XMV4280/XMV4140

280W/4
280W/8
560W/4
standby 0.3 15 15 51 13
560W/8
100V
70V
280W/4 0.4 37 37 127 32
280W/8 0.4 37 37 127 32
560W/4 0.4 31 31 106 27
idle
560W/8 0.4 36 36 124 31
100V 0.5 48 48 165 41
70V 0.5 48 48 165 41
280W/4 1.9 218 78 268 67
280W/8 1.8 203 64 218 55
1/8 output 560W/4 1.9 214 75 256 64
power 560W/8 1.9 211 71 244 61
100V 1.6 190 65 223 56
70V 1.7 196 71 244 61
280W/4 4.3 499 123 422 106
280W/8 4.1 470 97 332 84
1/3 output 560W/4 4.2 485 113 386 97
power 560W/8 4.3 505 131 449 113
100V 3.6 416 83 284 71
70V 3.8 445 112 383 96

Power Watts Dissi- Heat Dissipation
consumption (W) pated (W) Btu/h kcal/h
280W/4
280W/8
560W/4
standby 0.3 15 15 51 13
560W/8
100V
70V
280W/4 0.4 37 37 127 32
280W/8 0.4 37 37 127 32
560W/4 0.4 31 31 106 27
idle
560W/8 0.4 36 36 124 31
100V 0.4 47 47 161 41
70V 0.4 47 47 161 41
280W/4 1.05 212 72 247 62
280W/8 1.05 208 69 235 59
1/8 output 560W/4 1.04 207 68 232 58
power 560W/8 1.04 210 70 240 60
100V 0.94 188 63 216 54
70V 0.94 195 70 240 60
280W/4 2.2 476 100 343 86
280W/8 2.1 450 77 263 66
1/3 output 560W/4 2.2 463 91 311 78
power 560W/8 2.3 479 105 360 91
100V 1.9 400 67 229 58
70V 2.0 429 96 328 83
Test signal Pink Noise, bandwidth limited 22Hz to 22kHz
All channels driven
1BTU = 1,055.06J = 0.252kcal
(W) 864 = cal
7
XMV4280/XMV4140
XMV4140
140W/4
140W/8
280W/4
standby 0.3 15 15 51 13
280W/8
100V
70V
140W/4 0.5 37 37 127 32
140W/8 0.5 37 37 127 32
280W/4 0.4 31 31 106 27
idle
280W/8 0.5 36 36 124 31
100V 0.6 48 48 165 41
70V 0.6 48 48 165 41
140W/4 1.4 130 60 206 52
140W/8 1.3 125 55 189 48
1/8 output 280W/4 1.3 123 53 182 46
power 280W/8 1.4 130 60 206 52
100V 1.3 120 58 197 50
70V 1.3 120 58 197 50
140W/4 2.6 250 63 217 55
140W/8 2.5 240 53 183 46
1/3 output 280W/4 2.5 241 54 187 47
power 280W/8 2.6 250 63 217 55
100V 2.3 220 54 184 46
70V 2.3 221 55 187 47

140W/4
140W/8
280W/4
standby 0.3 15 15 51 13
280W/8
100V
70V
140W/4 0.4 37 37 127 32
140W/8 0.4 37 37 127 32
280W/4 0.3 31 31 106 27
idle
280W/8 0.4 36 36 124 31
100V 0.5 48 48 165 41
70V 0.5 48 48 165 41
140W/4 1.2 130 60 206 52
140W/8 1.1 125 55 189 48
1/8 output 280W/4 1.1 123 53 182 46
power 280W/8 1.2 130 60 206 52
100V 1.0 120 58 197 50
70V 1.1 120 58 197 50
140W/4 2.2 250 63 217 55
140W/8 2.1 240 53 183 46
1/3 output 280W/4 2.1 241 54 187 47
power 280W/8 2.2 250 63 217 55
100V 1.9 220 54 184 46
70V 1.9 221 55 187 47
8
XMV4280/XMV4140

140W/4
140W/8
280W/4
standby 0.3 15 15 51 13
280W/8
100V
70V
140W/4 0.4 37 37 127 32
140W/8 0.4 37 37 127 32
280W/4 0.4 31 31 106 27
idle
280W/8 0.4 36 36 124 31
100V 0.4 47 47 161 41
70V 0.4 47 47 161 41
140W/4 0.73 128 58 199 50
140W/8 0.73 127 57 196 49
1/8 output 280W/4 0.70 122 52 178 45
power 280W/8 0.73 128 58 199 50
100V 0.68 117 55 188 47
70V 0.68 117 55 188 47
140W/4 1.2 242 55 190 48
140W/8 1.1 233 46 159 40
1/3 output 280W/4 1.1 234 47 163 41
power 280W/8 1.2 243 56 193 49
100V 1.1 213 47 160 40
70V 1.1 215 49 167 42
Test signal Pink Noise, bandwidth limited 22Hz to 22kHz
All channels driven
1BTU = 1,055.06J = 0.252kcal
(W) 864 = cal
DIMENSIONS
430
422
409
414
382
2.5
10
11
480
463
76.2
88
Unit: mm
11x6.5
9
XMV4280/XMV4140
PANEL LAYOUT
Front Panel
q !6 r e w y !6 !1 !0 !2 !3
i t u o !4 !5
This figure shows XMV4280.

XMV4280
q Power Switch q
w [PROTECTION] indicators A/B/C/D w [PROTECTION] A/B/C/D
e [LIMIT] indicators A/B/C/D e [LIMIT] A/B/C/D
r [SIGNAL] indicators A/B/C/D r [SIGNAL] A/B/C/D
t [SELECT] buttons/indicators A/B/C/D t [SELECT] / A/B/C/D
y Display y
u Encoder u
i [MUTE] indicators A/B/C/D i [MUTE] A/B/C/D
o [MUTE] button o [MUTE]
!0 [POWER] indicator !0 [POWER]
!1 [ALERT] indicator !1 [ALERT]
!2 [NETWORK] indicator !2 [NETWORK]
!3 [YDIF] indicator !3 [YDIF]
!4 [PANEL LOCK] indicator !4 [PANEL LOCK]
!5 [FUNCTION] button !5 [FUNCTION]
!6 Cooling vent !6
10
XMV4280/XMV4140
Rear Panel
!7 !8 !9 @2 @4 @5 @6
ON
ON
1 2 3 4 5 6 7 8
@0 @1 @3
This figure shows XMV4280.

XMV4280
!7 NETWORK connector !7 NETWORK

!8 [YDIF] connectors !8 [YDIF]
!9 [UNIT ID] rotary switch !9 [UNIT ID]
@0 Device setup DIP switch @0
@1 Analog input connectors @1
@2 [SPEAKERS] DIP switch @2 [SPEAKERS]
@3 [SPEAKERS] output connectors @3 [SPEAKERS]
@4 [REMOTE] connector @4 [REMOTE]
@5 [FAULT OUTPUT] connector @5 [FAULT OUTPUT]
@6 [AC IN] socket @6 [AC IN]
11
XMV4280/XMV4140
CIRCUIT BOARD LAYOUT & WIRING &
<Top view / > SUB OUT DSW IN RSW DM
CPU
PS PN3 AMP ANA1 (XMV4280) /
ANA2 (XMV4140)
F B E
A I H
12
XMV4280/XMV4140
Detail of A sectionA Detail of B sectionB

The PWR connector assembly and the VCC connector The OUT-D connector assembly is fixed by the style pin.
assembly are fixed by the style pin. OUT-D
PWR VCC
STYLE PIN STYLE PIN
STYLE PIN
The VDR connector assembly and the OUT-D connector

assembly are fixed by the style pin.
VDR OUT-D
Detail of C sectionC Detail of D sectionD

The VDR connector assembly is fixed by the style pin. The OUT-A connector assembly is fixed by the style pin.
VDR OUT-D
STYLE PIN BINDING TIE
CN502
STYLE PIN CN105

BINDING TIE
The B connector assembly and the OUT-D connector The B connector assembly and the OUT-D connector
assembly are fixed by the binding tie near the CN502. assembly are fixed by the binding tie near the CN105.
B OUT-D CN502 B OUT-D CN105

13
XMV4280/XMV4140
Detail of E sectionE Note of F sectionF
The DSW1 connector assembly and the DSW2 connector Note that the wiring doesnt run aground in the metallic
assembly are fixed by the style pin. chassis.
DSW1 DSW2
STYLE PIN
CORD CLAMP

STYLE PIN
The IN connector assembly, RSW connector assembly,
DSW1 connector assembly and the DSW2 connector
assembly are fixed by the style pin.
IN RSW DSW1 DSW2

The RSW connector assembly, DSW1 connector assembly
and the DSW2 connector assembly are fixed by the cord
clamp.
RSW DSW1 DSW2

Note that the wiring doesnt come in contact with the heat
sink.

Detail of H sectionH Detail of I sectionI

Pass the flat cable through the slit of the FFC guard as The CN304 is connected with the CN803 by the PN1-PN3
shown in figure. connector assembly.
FFC CN803 CN304 PN1-PN3

CN304 CN803
FFC GUARDFFC
PN1-PN3 CONNECTOR ASSEMBLY

PN1-PN3
FLEX FLAT CABLE

14
XMV4280/XMV4140
<Bottom view / >

DM RSW IN OUT SUB
CPU AMP PN3 PS

ANA1 (XMV4280) / ANA2 (XMV4140)
15
XMV4280/XMV4140
Detail of G sectionG Detail of J sectionJ
The RSW connector assembly, DSW1 connector assembly Pass the flat cable through the slit of the insulation sheet
and the DSW2 connector assembly are fixed by the cord PS2 as shown in figure.
clamp. PS2
RSW DSW1 DSW2

CORD CLAMP INSULATION SHEET PS2
PS2
<Front view / >
PN1 PN2
16
XMV4280/XMV4140
DISASSEMBLY PROCEDURE
Precaution
* Install the binding tie and the cord clamp in the same
way as they were before removal.
* Notes on Flat Cable
Contacts are visible from the back. Pay attention
not to insert and install the cable to the connector
inversely. (Photo 1) 1
Front side ( ) Back side ( )
Photo 1 1
1. Rack Angle (Time required: About 1 minute) 1. 1

Remove the six (6) screws marked [1540]. The right [1540] 6
and left rack angle can then be removed. (Fig. 1) 1
2. Top Cover (Time required: About 3 minutes) 2. 3

Remove the fifteen (15) screws marked [1520] and [1520] 15 [1525] 15
the fifteen (15) plastic washers marked [1525]. The 1
top cover can then be removed. (Fig. 1)
3. Bottom Cover 3. 3
(Time required: About 3 minutes) [1000] 15
Remove the fifteen (15) screws marked [1000]. The 2
bottom cover can then be removed. (Fig. 2)
<Top view> Priority screw (1st) <Bottom view>

BOTTOM COVER
1
Priority screw (1st)
[1520] [1000] 1
[1000]
[1525]
[1000]
TOP COVER

[1540]
RACK ANGLE

RACK ANGLE

[1540]
Fig. 1 1 Fig. 2 2
17
XMV4280/XMV4140
4. AMP Circuit Board 4. AMP 8

(Time required: About 8 minutes) 4-1. 2
4-1. Remove the top cover. (See procedure 2) 4-2. 3
4-2. Remove the bottom cover. (See procedure 3) 4-3. [340] 6 AMP
4-3. Remove the six (6) screws marked [340]. The AMP PCB AMP3 AMP3
circuit board can then be removed together with 3
the three (3) frames PCB AMP and the three (3) 4-4. [330] 9 AMP
insulation sheets AMP. (Fig. 3) PCB AMP3 AMP3
4-4. Remove the nine (9) screws marked [330]. The AMP 3
circuit board, the three (3) frames PCB AMP and the
three (3) insulation sheets AMP can then be separated.
(Fig. 3)
5. PS Circuit Board 5. PS 8
5-2. Remove the bottom cover. (See procedure 3) 5-3. [250] 6 PS
5-3. Remove the six (6) screws marked [250]. The PS PCB PS3 PS21
circuit board can then be removed together with the 4
three (3) frames PCB PS and the insulation sheet PS2. 5-4. [240] 9 PS
(Fig. 4) PCB PS3 PS21
5-4. Remove the nine (9) screws marked [240]. The PS 4
circuit board, the three (3) frames PCB PS and the
insulation sheet PS2 can then be separated. (Fig. 4)
<Bottom view> <Bottom view>

[340] FRAME PCB AMP [250] FRAME PCB PS
PCB AMP [250] PCB PS
[340]
[340] [250]
INSULATION
SHEET AMP INSULATION SHEET
AMP PS2 PS2
PS
AMP
Priority screw (1st) Priority screw (2nd)

1 2
[330] [240]

Priority screw (2nd)
1
2
Fig. 3 3 Fig. 4 4
18
XMV4280/XMV4140
6. Front Panel Assembly 6. F Assy 7

6-1. Remove the rack angle. (See procedure 1) 6-2. 2
6-3. Remove the bottom cover. (See procedure 3) 6-4. ENCDR 5
6-4. Remove the knob ENCDR. (Fig. 5) 6-5. PSW
6-5. Disconnect the PSW connector assembly. 6-6. [1140] 3 [960] 3 F
6-6. Remove the three (3) screws marked [1140] and Assy 5
the three (3) screws marked [960]. The front panel PSW F Assy
assembly can then be removed. (Fig. 5) F Assy
* The PSW connector assembly and the protector F Assy
are not parts of the front panel assembly. When
replacing the front panel assembly, be sure to remove
these parts and attach them to the new front panel
assembly.
7. PSW Connector Assembly 7. PSW 7

7-3. Remove the bottom cover. (See procedure 3) 7-4. F Assy 6
7-4. Remove the front panel assembly. (See procedure 6) 7-5. 4 PSW
7-5. Release the four (4) hooks of the power switch. The
PSW connector assembly and the protector can then 6
be removed from the front panel. (Fig. 6)
Priority screw (1st) HOOK
PSW CONNECTOR 1
ASSEMBLY
PSW
PSW CONNECTOR
ASSEMBLY
PSW
[1140]
Priority screw (1st) HOOK

1
KNOB ENCDR FRONT PANEL

ENCDR Fig. 6 6
ASSEMBLY
[960] F Assy
Fig. 5 5
Align the protector stud with the groove on the front panel. FRONT PANEL
Align the protector stud with the groove on
the PSW connector assembly.
PSW

PSW CONNECTOR ASSEMBLY
PSW PROTECTOR
PROTECTOR

PSW CONNECTOR
ASSEMBLYPSW
Fig. 7 7
19
XMV4280/XMV4140
8. PN1 Circuit Board 8. PN1 7

8-4. Remove the front panel assembly. (See procedure 6) 8-5. C&CPN1-PN3
8-5. Disconnect the flex flat cable and PN1-PN3 connector 8-6. [180A] 4 PN1
assembly. 8
8-6. Remove the four (4) screws marked [180A]. The PN1 5 PN1
circuit board can then be removed. (Fig. 8) PN1
* The five (5) button-tact switches are not parts of the PN1
PN1 circuit board. When replacing the PN1 circuit
board, be sure to remove these parts and attach them
to the new PN1 circuit board.

9-4. Remove the front panel assembly. (See procedure 6) 9-5. PN2
9-5. Disconnect the PN2 connector assembly. 9-6. [180B] 2 PN2
9-6. Remove the two (2) screws marked [180B]. The PN2 9
circuit board can then be removed. (Fig. 9) PN2
* The button-tact switch is not part of the PN2 circuit PN2
board. When replacing the PN2 circuit board, be sure PN2
to remove the part and attach them to the new PN2
circuit board.
PN2 CONNECTOR ASSEMBLY

PN2
PN1-PN3 CONNECTOR FLEX FLAT CABLE
ASSEMBLY C&C
PN1-PN3
[180A]
PN2
2
PN1 [180B]
[180A]
BUTTON-TACT SWITCH Priority screw (1st)
BUTTON-TACT SWITCH Priority screw (1st) 1

1
Fig. 8 8 Fig. 9 9
20
XMV4280/XMV4140
10. Frame Side L 10. L 9

10-4. Remove the front panel assembly. (See procedure 6) 10-5. PWR VCC C&CFAN
10-5. Disconnect the PWR connector assembly, VCC
connector assembly, flex flat cable and FAN cable. 10-6. [1010] 2 10
10-6. Remove the two (2) screws marked [1010]. (Fig. 10) 10-7. [520] 4 12
10-7. Remove the four (4) screws marked [520]. (Fig. 12) 10-8. L 12
10-8. Pull the frame side L forward. (Fig. 12) L 4
* When installing the frame side L, check to ensure that L
the four (4) claws are fit into bridges of the frame side 13
L. (Fig. 13)
Tighten the screws with holding the inlet angle.

FRAME SIDE L
L
[1010]
[1010]
INLET ANGLE

REAR PANEL

Fig. 10 10 Fig. 11 11
REAR PANEL

2 CLAW
CLAW

[520]

1
FRAME SIDE L BRIDGE
L
[520] SUB CHASSIS
FRAME SIDE L
L
3
BRIDGE

Fig. 12 12 Fig. 13 13
21
XMV4280/XMV4140
11. SUB Circuit Board 11. SUB 10

11-4. Remove the front panel assembly. (See procedure 6) 11-5. L 10
11-5. Remove the frame side L. (See procedure 10) 11-6. [440] 6 [450] 1
11-6. Remove the six (6) screws marked [440] and the SUB
screw marked [450]. The SUB circuit board can then 14
be removed together with the inlet angle. (Fig. 14) 11-7. 2
11-7. Straighten the two (2) bent parts of the inlet angle SUB
with pliers of the like. The inlet angle can then be 15
removed from the SUB circuit boards. (Fig. 15) SUB
* * The inlet angle is not a part of the SUB circuit board SUB SUB
supply unit. When replacing the SUB circuit board, SUB
remove the inlet angle from the SUB circuit board and
install that removed one to the new SUB circuit board. SUB
* When installing the SUB circuit board, make sure for the 90 16
terminal lug position so that its direction is within the
range of ninety (90) degrees as sown below. (Fig. 16)
[440]
[440] [450]
TERMINAL LUG

[440]
INLET ANGLE
INLET ANGLE

SUB
SUB
FRAME SIDE L
L
Fig. 15 15
Fig. 14 14
TERMINAL LUG

Fig. 16 16
22
XMV4280/XMV4140
12. Frame Side R 12. R 8

12-4. Remove the front panel assembly. (See procedure 6) 12-5. IN PN2 RSW DSW1 DSW2
12-5. Disconnect the IN connector assembly, PN2 FAN C&CFFC
connector assembly, RSW connector assembly, DSW1
connector assembly, DSW2 connector assembly, FAN 12-6. [820] 4 17
cable, flex flat cable and FFC cable. 12-7. R 17
12-6. Remove the four (4) screws marked [820]. (Fig. 17) R 4
12-7. Pull the frame side R forward. (Fig. 17) R
* When installing the frame side R, make sure that the 18
four (4) claws are fit into bridges of the frame side R.
(Fig. 18)
13. ANA1 Circuit Board (XMV4280)/ANA2 13. ANA1 XMV4280/ ANA2 XMV4140
Circuit Board (XMV4140) 10
13-4. Remove the front panel assembly. (See procedure 6) 13-5. R 12
13-5. Remove the frame side R. (See procedure 12) 13-6. [700] 8 ANA1 XMV4280
13-6. Remove the eight (8) screws marked [700]. The / ANA2 XMV4140 19
ANA1 circuit board (XMV4280)/ANA2 circuit board 1
(XMV4140) can then be removed. (Fig. 19)
* As one cord clamp is tightened together, use care not
to lose it.
REAR PANEL


2
CLAW

[820]
CLAW
1
BRIDGE

FRAME SIDE R
R SUB CHASSIS
[820]
FRAME SIDE R
R
3 BRIDGE

Fig. 17 17 Fig. 18 18
23
XMV4280/XMV4140
Installation of ANA1 Circuit Board (XMV4280)/ ANA1 XMV4280/ ANA2 XMV4140

ANA2 Circuit Board (XMV4140)
Insert the female header of the ANA1 circuit board ANA1 XMV4280/ ANA2 XMV4140
(XMV4280)/ANA2 circuit board (XMV4140) into DM
the pin header of the DM circuit board. Press around
the inserted female header to ensure that it is securely DM
fit to the DM circuit board.
14. DM Circuit Board 14. DM 11

14-5. Remove the frame side R. (See procedure 12) 14-6. ANA1 XMV4280/ ANA2 XMV4140
14-6. Remove the ANA1 circuit board (XMV4280)/ANA2 13
circuit board (XMV4140). (See procedure 13) 14-7. [680] 8 DM
14-7. Remove the eight (8) hexagon spacers marked [680]. 20
The DM circuit board can then be removed. (Fig. 20)
Installation of DM Circuit Board DM

Insert the connector (180P) of the DM circuit board DM 180P CPU
into the connector (180P) of the CPU circuit board. 180P
Press around the connector (180P) of the DM circuit DM 180P
board to ensure that it is securely fit to the CPU CPU
circuit board.
[700] Priority screw (1st) [680] Priority screw (1st)

1 1
ANA1 (XMV4280) /
[700] ANA2 (XMV4140) [680] CONNECTOR (180P)
FEMALE HEADER

CORD CLAMP Priority screw (2nd)
[700] Priority screw (2nd) [680]
2
2
DM
DM CPU
PIN HEADER

CPU CONNECTOR (180P)

FRAME SIDE R FRAME SIDE R

R R
Fig. 19 19 Fig. 20 20
24
XMV4280/XMV4140
15. CPU Circuit Board, Lithium P-Battery 15. CPU 12

15-5. Remove the frame side R. (See procedure 12) 15-6. ANA1 XMV4280/ ANA2 XMV4140
15-6. Remove the ANA1 circuit board (XMV4280)/ANA2 13
circuit board (XMV4140). (See procedure 13) 15-7. DM 14
15-7. Remove the DM circuit board. (See procedure 14) 15-8. [640] 4 CPU
15-8. Remove the four (4) hexagon spacers marked [640]. 21
The CPU circuit board can then be removed. (Fig. 21) 15-9. CPU
15-9. The lithium P-battery on the CPU circuit board can 22
be replaced. (Fig. 22) CPU
* The lithium P-battery is not part of the CPU circuit CPU CPU
board. When replacing the CPU circuit board, remove
the lithium P-battery from the CPU circuit board, and
install it on the new circuit board. USB
* Before replacing the lithium battery, be sure to save CPU CPU
all the internal setting data in on a USB memory.
* When installing the CPU circuit board, check that the
step of the hexagon spacer is fitted in the screw hole
in the CPU circuit board before tightening securely.
Apply torque after checking that step of

spacer has not hit PCB.

[640]
STEP CPU

LITHIUM P-BATTERY (CR2450)

[640]

1 [640]
CPU
CPU

2
FRAME SIDE R
R
Fig. 21 21 Fig. 22 22
25
XMV4280/XMV4140
16. RSW Circuit Board 16. RSW 3

16-1. Remove the top cover. (See procedure 2) 16-2. RSW
16-2. Disconnect the RSW connector assembly. 16-3. [130A] 2 RSW
16-3. Remove the two (2) screws marked [130A]. The RSW 23
circuit board can then be removed. (Fig. 23)
17. DSW Circuit Board 17. DSW 4

17-1. Remove the top cover. (See procedure 2) 17-2. DSW1 DSW2
17-2. Disconnect the DSW1 connector assembly and 17-3. [130B] 4 DSW
DSW2 connector assembly. 24
17-3. Remove the four (4) screws marked [130B]. The
DSW circuit board can then be removed. (Fig. 24)
RSW
REAR PANEL 1 REAR PANEL

DSW
[130A]
[130B]

1
Fig. 23 23 Fig. 24 24
18. IN Circuit Board 18. IN 3

18-1. Remove the top cover. (See procedure 2) 18-2. IN
18-2. Disconnect the IN connector assembly. 18-3. [130C] 3 IN
18-3. Remove the three (3) screws marked [130C]. The IN 25
circuit board can then be removed. (Fig. 25)
[1130]
REAR PANEL
REAR PANEL

IN OUT

1
[1120]
[130C]
1
Fig. 25 25 Fig. 26 26
26
XMV4280/XMV4140
19. OUT Circuit Board 19. OUT 4

19-1. Remove the top cover. (See procedure 2) 19-2. OUT-D
19-2. Disconnect the OUT-D connector assembly. 19-3. [1130] 2 [1120] 2
19-3. Remove the two (2) screws marked [1130] and the OUT 26
two (2) screws marked [1120]. The OUT circuit board
can then be removed. (Fig. 26)
20. Sub Chassis 20. 11

20-4. Remove the front panel assembly. (See procedure 6) 20-5. PN1 8
20-5. Remove the PN1 circuit board. (See procedure 8) 20-6. L 10
20-6. Remove the frame side L. (See procedure 10) 20-7. R 12
20-7. Remove the frame side R. (See procedure 12) 20-8. [170] 6
20-8. Remove the six (6) screws marked [170]. The sub 27
chassis can then be removed.(Fig. 27)

Installation of Sub Chassis 3
Have the three (3) hooks of the sub chassis caught by 28
frames respectively. (Fig. 28)
FRAME R <Bottom view>

FRAME C R HOOK
C SUB CHASSIS
FRAME L
1
L
HOOK

HOOK

[170]
FRAME L
[170]
L FRAME C
Priority screw (1st) C
[170] 1
SUB CHASSIS
Priority screw (1st) FRAME R
1 R
Fig. 27 27 Fig. 28 28
27
XMV4280/XMV4140

21-4. Remove the front panel assembly. (See procedure 6) 21-5. PN1 8
21-5. Remove the PN1 circuit board. (See procedure 8) 21-6. L 10
21-6. Remove the frame side L. (See procedure 10) 21-7. R 12
21-7. Remove the frame side R. (See procedure 12) 21-8. 20
21-8. Remove the sub chassis. (See procedure 20) 21-9. [50] 2 PN3
21-9. Remove the two (2) screws marked [50]. The PN3 29
circuit board can then be removed.(Fig. 29)
22. DC Fan (Time required: About 12 minutes) 22. DC 12

22-3. Remove the bottom cover. (See procedure 3) 22-3. 3
22-4. Remove the front panel assembly. (See procedure 6) 22-4. F Assy 6
22-5. Remove the PN1 circuit board. (See procedure 8) 22-5. PN1 8
22-6. Remove the frame side L. (See procedure 10) 22-6. L 10
22-7. Remove the frame side R. (See procedure 12) 22-7. R 12
22-8. Remove the sub chassis. (See procedure 20) 22-8. 20
22-9. Remove the four (4) screws marked [30]. The DC fan 22-9. [30] 4 DC
can then be removed.(Fig. 29) 29
* When installing the DC fan, be careful not to over- DC FAN
tighten the screw. The over-tightened screw may
cause a damage to the FAN frame.
SUB CHASSIS

FFC GUAD DC FAN L

FFC DC L
PN3
[30]
[50]

1
DC FAN R
DC R
[30]
Fig. 29 29
28
XMV4280/XMV4140
LSI PIN DESCRIPTIONLSI

AK4396VF-E2 (X8324A00) DAC (Digital to Analog Converter)............................................................32
EN5337QI-T (YC234A00) DC-DC CONVERTER.................................................................................32
KSZ8051RNL (YD367B00) PHY...........................................................................................................31
LCMXO2280C-3TN144C (YE221B00) CPLD (Complex Programmable Logic Device)........................30
LM3S808-IQN50-C2T (YD930A00) MICROCONTROLLER . ..............................................................29
PCM1803DBR (X7357A00) ADC (Analog to Digital Converter)...........................................................32
PCM1803ADBR (X7357B00) ADC (Analog to Digital Converter).........................................................32
PCM1804DBR (X6872A00) ADC (Analog to Digital Converter)...........................................................31
AMP: IC602
LM3S808-IQN50-C2T (YD930A00) MICROCONTROLLER PN1: IC302
PIN PIN
NAME I/O FUNCTION NAME I/O FUNCTION
NO. NO.
1 ADC0 I Analog Analog-to-digital converter input 0. 26 PD1 I/O GPIO port D bit 1.
2 ADC1 I Analog Analog-to-digital converter input 1. 27 PD2/ I/O GPIO port D bit 2./
3 ADC2 I Analog Analog-to-digital converter input 2. U1Rx I UART module 1 receive.
4 ADC3 I Analog Analog-to-digital converter input 3. 28 PD3/ I/O GPIO port D bit 3./
5 RST I TTL System reset input. U1Tx O UART module 1 transmit.
6 LDO - Low drop-out regulator output voltage. 29 PB0/CCP0 I/O GPIO port B bit 0./Capture/Compare/PWM 0.
This pin requires an external capacitor 30 PB1/CCP2 I/O GPIO port B bit 1./Capture/Compare/PWM 2.
between the pin and GND of 1 F or greater. 31 GND - Ground reference for logic and I/O pins.
7 VDD - Power Positive supply for I/O and some logic. 32 VDD - Positive supply for I/O and some logic.
8 GND - Power Ground reference for logic and I/O pins. 33 PB2/I2CSCL I/O GPIO port B bit 2./I2C clock.
9 OSC0 I Analog Main oscillator crystal input or an 34 PB3/I2CSDA I/O GPIO port B bit 3./I2C data.
external clock reference input. 35 PE0 I/O GPIO port E bit 0.
10 OSC1 O Main oscillator crystal output. Leave unconnected 36 PE1 I/O GPIO port E bit 1.
when using a single-ended clock source. 37 PC3/ I/O GPIO port C bit 3./
11 PC7/CCP4 I/O GPIO port C bit 7./Capture/Compare/PWM 4. TDO/SWO O JTAG TDO and SWO.
12 PC6/CCP3 I/O GPIO port C bit 6./Capture/Compare/PWM 3. 38 PC2/ I/O GPIO port C bit 2.
13 PC5/CCP1 I/O GPIO port C bit 5./Capture/Compare/PWM 1. TDI I JTAG TDI.
14 PC4 I/O GPIO port C bit 4. 39 PC1/ GPIO port C bit 1./
I/O
15 VDD - Positive supply for I/O and some logic. SWDIO/TMS JTAG TMS and SWDIO.
16 GND - Ground reference for logic and I/O pins. 40 PC0/ I/O GPIO port C bit 0.
17 PA0/ I/O GPIO port A bit 0./ SWCLK/TCK I JTAG/SWD CLK.
U0Rx I UART module 0 receive. 41 PB7/ I/O GPIO port B bit 7.
18 PA1/ I/O GPIO port A bit 1./ TRST I JTAG TRST.
U0Tx O UART module 0 transmit. 42 PB6/ I/O GPIO port B bit 6.
19 PA2/SSIClk I/O GPIO port A bit 2./SSI clock. C0+ I Analog comparator 0 positive input.
20 PA3/SSIFss I/O GPIO port A bit 3./SSI frame. 43 PB5/CCP5 I/O GPIO port B bit 5./Capture/Compare/PWM 5.
21 PA4/ I/O GPIO port A bit 4./ 44 PB4/ I/O GPIO port B bit 4.
SSIRx I SSI receive. C0- I Analog comparator 0 negative input.
22 PA5/ I/O GPIO port A bit 5./ 45 ADC7 I Analog-to-digital converter input 7.
SSITx O SSI transmit. 46 ADC6 I Analog-to-digital converter input 6.
23 VDD - Positive supply for I/O and some logic. 47 ADC5 I Analog-to-digital converter input 5.
24 GND - Ground reference for logic and I/O pins. 48 ADC4 I Analog-to-digital converter input 4.
25 PD0 I/O GPIO port D bit 0.
29
XMV4280/XMV4140
LCMXO2280C-3TN144C (YE221B00) CPLD (Complex Programmable Logic Device) DM: IC402

PIN PIN
NO. NO.
1 /RD I/O 73 RESERVE I/O
2 BID[0] I/O 74 EXTWC[1] I/O
3 /WRH I/O 75 RESERVE I/O
4 BID[1] I/O 76 EXTWC[2] I/O
5 D[0] I/O User programmable pin 77 RESERVE I/O User programmable pin
6 D[1] I/O 78 EXTWC[3] I/O
7 D[2] I/O 79 RESERVE I/O
8 D[3] I/O 80 EXTWC[4] I/O
10 VCCIO7 - Power supply pin for I/O Bank 7 82 VCCIO3 - Power supply pin for I/O Bank 3
11 GNDIO7 - Ground pin for I/O Bank 7 83 GNDIO3 - Ground pin for I/O Bank 3
12 D[5] I/O 84 EXTWCSEL I/O
13 BID[2] I/O 85 RESERVE I/O
User programmable pin User programmable pin
14 /RESET I/O 86 MWC I/O
15 BID[3] I/O 87 MWC_REF I/O
16 GND - Ground 88 GND - Ground
17 D[6] I/O 89 M256FS I/O
19 D[8] I/O 91 M128FS I/O
21 VCC - Power supply pin 93 VCC - Power supply pin
22 D[10] I/O 94 M64FS I/O
24 D[12] I/O 96 MSYNC I/O
25 D[13] I/O 97 SPI_CLK I/O
28 D[14] I/O 100 SOF_8 I/O
30 A[1] I/O 102 SOF_4 I/O
31 A[2] I/O 103 /CS_SPI1 I/O
32 A[3] I/O User programmable pin 104 SOF_MY I/O
33 A[4] I/O 105 /CS_SPI2 I/O
34 A[5] I/O 106 BCK_MY I/O
35 A[22] I/O 107 /CS_SPI3 I/O
36 A[23] I/O 108 RESERVE I/O User programmable pin
37 GNDIO5 - Ground pin for I/O Bank 5 109 CWC_REF I/O
38 VCCIO5 - Power supply pin for I/O Bank 5 110 CWC I/O
39 TMS I Test Mode Select input pin 111 RESERVE I/O
40 A[24] I/O 112 C256FS I/O
User programmable pin
41 /CS5[0] I/O 113 RESERVE I/O
42 TCK I Test Clock input pin 114 C64FS I/O
43 /CS5[1] I/O 115 RESERVE I/O
44 /CS5[2] I/O 116 SOF_C I/O
45 /CS5[3] I/O 117 VCCIO1 - Power supply pin for I/O Bank 1
46 /CS5[4] I/O 118 GNDIO1 - Ground pin for I/O Bank 1
47 TDO O Test Data output pin 119 SOF_DNT I/O
48 /CS5[5] I/O 120 SPI_MDO I/O
49 /CS5[6] I/O User programmable pin 121 DNT_SCK I/O
50 /CS5[7] I/O 122 SPI_MDI I/O
51 TDI I Test Data input pin 123 GND - Ground
52 VCC - Power supply pin 124 PLLOUT I/O
53 VCCAUX - Auxiliary power supply pin 125 RESERVE I/O
54 RESERVE I/O 126 nTEST I/O
55 ICK49 I/O 127 C_PLLOUT I/O
56 RESERVE I/O User programmable pin 128 VCCAUX - Auxiliary power supply pin
57 RESERVE I/O 129 VCC - Power supply pin
58 ICK45 I/O 130 A[21] I/O
59 GND - Ground 131 /CS5[8] I/O
60 MUTE_IN I/O 132 /CS5[9] I/O User programmable pin
61 DET_CAS I/O User programmable pin 133 /CS5[10] I/O
62 PCP_OUT I/O 134 /CS5[11] I/O
65 NLOCKRTN I/O 137 C_EXTWCSEL I/O
66 C_PCPOUT I/O 138 GP[0] I/O
67 C_NLOCKRTN I/O User programmable pin 139 GP[1] I/O
68 MUTEOUT[1] I/O 140 GP[2]/IRQ I/O
69 MUTEOUT[2] I/O 141 PLL_INH I/O
70 SLEEPN I Sleep Mode pin 142 DFS I/O
71 NMUTEOUT[3] I/O 143 /CS5 I/O
72 NMUTEOUT[4] I/O 144 /CS4 I/O
30
XMV4280/XMV4140
KSZ8051RNL (YD367B00) PHY DM: IC303

PIN PIN
NO. NO.
1 GND - Ground 19 RXC/ I/O MII Mode: MII Receive Clock Output/
2 VDD_1.2 - 1.2V core VDD B-CAST_OFF Config Mode: The pull-up/pull-down value is latched
3 VDDA_3.3 - 3.3V analog VDD as B-CAST_OFF at the de-assertion of reset
4 RXM I/O Physical receive or transmit signal (- differential) 20 RXER/ I/O MII Mode: MII Receive Error Output/
5 RXP I/O Physical receive or transmit signal (+ differential) ISO Config Mode: The pull-up/pull-down value is latched
6 TXM I/O Physical transmit or receive signal (- differential) as ISOLATE at the de-assertion of reset
7 TXP I/O Physical transmit or receive signal (+ differential) 21 INTRP/ I/O Interrupt Output: Programmable Interrupt Output
8 XO O Crystal feedback for 25 MHz crystal NAND_Tree# Config Mode: The pull-up/pull-down value is latched
9 XI I Crystal / Oscillator / External Clock Input as NAND Tree# at the de-assertion of reset.
10 REXT I Set physical transmit output current 22 TXC I/O MII Mode: MII Transmit Clock Output
11 MDIO I/O Management Interface (MII) Data I/O MII Back-to-Back Mode: MII Transmit Clock Input
12 MDC I Management Interface (MII) Clock Input 23 TXEN I MII Mode: MII Transmit Enable Input
13 RXD3/ I/O MII Mode: MII Receive Data Output[3]/ 24 TXD0 I MII Mode: MII Transmit Data Input[0]
PHYAD0 Config Mode: The pull-up/pull-down value is latched 25 TXD1 I MII Mode: MII Transmit Data Input[1]
as PHYADDR[0] at the de-assertion of reset 26 TXD2 I MII Mode: MII Transmit Data Input[2]
14 RXD2/ I/O MII Mode: MII Receive Data Output[2]/ 27 TXD3 I MII Mode: MII Transmit Data Input[3]
PHYAD1 Config Mode: The pull-up/pull-down value is latched 28 COL/ I/O MII Mode: MII Collision Detect Output /
as PHYADDR[1] at the de-assertion of reset CONFIG0 Config Mode: The pull-up/pull-down value is latched
15 RXD1/ I/O MII Mode: MII Receive Data Output[1]/ as CONFIG0 at the de-assertion of reset
PHYAD2 Config Mode: The pull-up/pull-down value is latched 29 CRS/ I/O MII Mode: MII Carrier Sense Output /
as PHYADDR[2] at the de-assertion of reset CONFIG1 Config Mode: The pull-up/pull-down value is latched
16 RXD0/ I/O MII Mode: MII Receive Data Output[0]/ as CONFIG1 at the de-assertion of reset
DUPLEX Config Mode: The pull-up/pull-down value is latched 30 LED0/ I/O LED Output: Programmable LED0 Output /
as DUPLEX at the de-assertion of reset NWAYEN Config Mode: Latched as Auto-Negotiation Enable
17 VDDIO - 3.3V, 2.5V or 1.8V digital VDD (register 0h, bit 12) at the de-assertion of reset
18 RXDV/ I/O MII Mode: MII Receive Data Valid Output/ 31 LED1/ I/O LED Output: Programmable LED1 Output /
CONFIG2 Config Mode: The pull-up/pull-down value is latched SPEED Config Mode: Latched as SPEED (register 0h, bit
as CONFIG2 at the de-assertion of reset 13) at the de-assertion of reset
32 RST# I/O Chip Reset (active low)
PADDLE GND - Ground
PCM1804DBR (X6872A00) ADC (Analog to Digital Converter) ANA2/ANA1: IC107, 108

PIN PIN
NO. NO.
1 VREFL - L-channel voltage reference output, 16 BCK/DSDL I/O Bit clock input/output in PCM mode /
requires capacitors for decoupling to AGND L-channel audio data output in DSD mode
2 AGNDL - Analog ground for VREFL 17 LRCK/DSDBCK I/O Sampling clock input/output in PCM and
3 VCOML - L-channel analog common-mode voltage (2.5 V) DSD modes
4 VINL+ I L-channel analog input, positive pin 18 SCKI I System clock input
5 VINL I L-channel analog input, negative pin 19 RST I Reset, power-down input, active-low
6 FMT0 I Audio data format 0 20 OVFR O Overflow signal of R-channel in PCM mode
7 FMT1 I Audio data format 1 21 OVFL O Overflow signal of L-channel in PCM mode
8 S/M I Slave/master mode selection 22 VCC - Analog power supply +5 V
9 OSR0 I Oversampling ratio 0 23 AGND - Analog ground
10 OSR1 I Oversampling ratio 1 24 VINR I R-channel analog input, negative pin
11 OSR2 I Oversampling ratio 2 25 VINR+ I R-channel analog input, positive pin
12 BYPAS I HPF bypass control 26 VCOMR - R-channel analog common-mode voltage (2.5 V)
13 DGND - Digital ground 27 AGNDR - Analog ground for VREFR
14 VDD - Digital power supply +3.3 V 28 VREFR - R-channel voltage reference output,
15 DATA/DSDR O L-channel and R-channel audio data output in PCM requires capacitors for decoupling to AGND
mode / R-channel audio data output in DSD mode
31
XMV4280/XMV4140
PCM1803DBR (X7357A00) ADC (Analog to Digital Converter)

PCM1803ADBR (X7357B00) ADC (Analog to Digital Converter) ANA1/ANA2: IC505, 506
PIN PIN
NO. NO.
1 VINL I Analog input (L ch) 11 BCK I/O Audio data bit clock input/output
2 VINR I Analog input (R ch) 12 DOUT O Audio data digital output
3 VREF1 - Reference-voltage-1 decoupling capacitor 13 DGND - Digital ground
4 VREF2 - Reference-voltage-2 decoupling capacitor 14 VDD - Digital power supply +3.3V
5 VCC - Analog power supply +5V 15 SCKI I System clock input
6 AGND - Analog ground 16 OSR I Oversampling ratio select input
7 PDWN I Power-down control, active-low 17 FMT0 I Audio data format select input 0
8 BYPAS I HPF bypass control 18 FMT1 I Audio data format select input 1
9 TEST I Test, must be connected to DGND 19 MODE0 I Mode select input 0
10 LRCK I/O Audio data latch enable input/output 20 MODE1 I Mode select input 1
AK4396VF-E2 (X8324A00) DAC (Digital to Analog Converter) ANA1/ANA2: IC310, 311

PIN PIN
NO. NO.
1 DVSS - Digital ground 15 TTL I CMOS/TTL level select
2 DVDD - Digital power supply +3.3 V 16 VREFL I Low level voltage reference input
3 MCLK I Master clock input 17 VREFH I High level voltage reference input
4 PDN I Power-down mode 18 AVDD - Analog power supply +5 V
5 BICK I Audio serial data clock 19 AVSS - Analog ground
6 SDATA I Audio serial data input 20 AOUTR- O Rch negative analog output
7 LRCK I L/R clock 21 AOUTR+ O Rch positive analog output
8 SMUTE/CSN I Soft mute/Chip select 22 AOUTL- O Lch negative analog output
9 DFS0/CAD0 I Sampling speed mode select/Chip address 0 23 AOUTL+ O Lch positive analog output
10 DEM0/CCLK I De-emphasis enable 0/Control data clock 24 VCOM O Common voltage output
11 DEM1/CDTI I De-emphasis enable 1/Control data input 25 P/S I Parallel/serial select
12 DIF0 I 26 TST1/DZFL O Test 1/Lch zero input detect
13 DIF1 I Digital input format 27 TST2/CAD1 I Test 2/Chip address 1
14 DIF2 I 28 ACKS/DZFR I/O Master clock auto setting mode/Rch zero input detect
EN5337QI-T (YC234A00) DC-DC CONVERTER DM: IC506

PIN PIN
NO. NO.
1 NC(SW) NO CONNECT 20 PVIN I Input power supply.
2 NC(SW) NO CONNECT 21 PVIN I Input power supply.
3 NC NO CONNECT 22 NC NO CONNECT
4 NC NO CONNECT 23 NC NO CONNECT
5 VOUT O Regulated converter output. 24 NC NO CONNECT
6 VOUT O Regulated converter output. 25 NC NO CONNECT
7 VOUT O Regulated converter output. 26 SYNC I External Clock Input to synchronize internal
8 VOUT O Regulated converter output. switching clock to an external signal
9 VOUT O Regulated converter output. 27 ENABLE I Input Enable.
10 VOUT O Regulated converter output. 28 POK Power OK is an open drain transistor for
11 VOUT O Regulated converter output. power system state indication.
12 NC(SW) NO CONNECT 29 EAOUT O Optional Error Amplifier output.
13 PGND Input/Output power ground. 30 SS I Soft-Start node.
14 PGND Input/Output power ground. 31 XFB I External Feedback Input.
15 PGND Input/Output power ground. 32 AGND Analog Ground.
16 PGND Input/Output power ground. 33 AVIN I Input power supply for the controller.
17 PGND Input/Output power ground. 34 NC(SW) NO CONNECT
18 PGND Input/Output power ground. 35 NC(SW) NO CONNECT
19 PVIN I Input power supply. 36 NC(SW) NO CONNECT
37 NC(SW) NO CONNECT
38 NC(SW) NO CONNECT
32
XMV4280/XMV4140
CIRCUIT BOARDS
AMP Circuit Board (YD913G0)............................................................. 34/36

ANA1/ANA2 Circuit Board (YE011D0)................................................ 38/39
CPU Circuit Board (YD939C0).................................................................. 44
DM Circuit Board (YE010H0)............................................................... 40/41
DSW Circuit Board (YE014E0).................................................................. 47
IN Circuit Board (YE015D0)...................................................................... 33
OUT Circuit Board (YE015D0).................................................................. 48
PN1 Circuit Board (YE014E0)................................................................... 45
PS Circuit Board (YD895E0)..................................................................... 49
RSW Circuit Board (YE014E0).................................................................. 45
SUB Circuit Board (YD894D0)............................................................. 42/43
Note: See parts list for details of circuit board component parts.
:
IN Circuit Board
to ANA1/ANA2-CN101
Component side
Pattern side
2NA-WZ98640 1
33
XMV4280/XMV4140
AMP Circuit Board A

to OUT-CN801 to PS-CN205
A'
Assembly of heat radiation parts (ZA77720) and MOSFET (WZ10730)
Assemble it referring to the figure below.
1 Air blow
The screw hole and the circumference of the Heat sink are purified by the air
blow before installation of FET. (both top side and bottom side of heat sink)
2 Screw tightening
The screw is inserted with the hand drill when FET is tightened in the heat sink in
the screw, and it tightens with the electric drill afterwards.
3 Brush it after assembly

After the installation of FET on this heat sink, brush only the screw where FET is
fixed. (The brush must use the electrostatic prevention brush.)
2NA-WZ98570 4
34
XMV4280/XMV4140
A
to PS-CN205 to OUT-CN802 to PS-CN206
to ANA1/ANA2-CN606
Component side
A'
MOSFET
1
FET

2
FET

3
FET FET

2NA-WZ98570 4
35
XMV4280/XMV4140
AMP Circuit Board
B'
2NA-WZ98570 4
36
XMV4280/XMV4140
Pattern side
B'
2NA-WZ98570 4
37
XMV4280/XMV4140
ANA1/ANA2 Circuit Board
C
to DM-CN608 to AMP-CN601 not installed to DM-CN603
to IN-CN701
not installed
C'
C
not installed to DM-CN603 not installed
to FAN
to PN3-CN802
to DM-CN605
C' Component side
2NA-WZ98600 1
38
XMV4280/XMV4140
ANA1/ANA2 Circuit Board
D'
D' Pattern side
2NA-WZ98600 1
39
XMV4280/XMV4140
DM Circuit Board
E
to ANA1/ANA2-CN103 not installed not installed to ANA1/
to DSW-CN603 to DSW-CN604 to RSW-CN501

E'
Switch setting condition for model identification

BID[0] 1 O BID[0] 1 O
BID[1] 2 N BID[1] 2 N
BID[2] 3 BID[2] 3
BID[3] 4 BID[3] 4
E
lled not installed to ANA1/ANA2-CN301 not installed
to PN1-CN301
to PN2-CN701
to ANA1/ANA2-CN603
E'
Component side
2NA-WZ98580 2
40
XMV4280/XMV4140
DM Circuit Board
F
to CPU-CN301
F'
01
F'
Pattern side
2NA-WZ98580 2
41
XMV4280/XMV4140
Scale: 90/100
SUB Circuit Board
G
to FAN to PS-CN207 to PS-CN201
to PN3-CN801
G'
G
to PS-CN207 to PS-CN201 to POWER SWITCH
G' Component side
2NA-WZ98550
42
XMV4280/XMV4140
Scale: 90/100
SUB Circuit Board
H'
H' Pattern side
2NA-WZ98550
43
XMV4280/XMV4140
CPU Circuit Board
Component side
to DM-CN502
Pattern side
2NA-WZ74110
44
XMV4280/XMV4140
PN1 Circuit Board
Component side
to DM-CN601 to PN3-CN803 not installed
Pattern side
RSW Circuit Board

to DM-CN606
Component side Pattern side

PN1, RSW: 2NA-WZ98630 1
45
XMV4280/XMV4140
PN2 Circuit Board

to DM-CN602
Component side Pattern side
PN3 Circuit Board
to PN1-CN304
to ANA1/ANA2-CN601 to SUB-CN106
Component side
Pattern side
PN2, PN3: 2NA-WZ98630 1

46
XMV4280/XMV4140
DSW Circuit Board
I'
to DM-CN604 to DM-CN607
Component side
I'
J'
J
J'
Pattern side
2NA-WZ98630 1
47
XMV4280/XMV4140
OUT Circuit Board
to AMP-CN502 to AMP-CN501
Component side
Pattern side
2NA-WZ98640 1
48
XMV4280/XMV4140
Scale: 90/100
PS Circuit Board
to AMP-CN106
to AMP-CN105
to SUB-CN103 to SUB-CN101
Component side
2NA-WZ98560 3
49
XMV4280/XMV4140
TEST PROGRAM
1. Preparation
1-1. Required items

PC: 1 unit, Windows XP SP3 with Ethernet port Windows Vista or Windows 7
GPI test jig (to be used for GPI test)
Ethernet (CAT5e) Straight cable: 3 pcs.
MTX3 (to be used for PLL test): 1 unit
1-2. Network setting

[Control panel] [Network connection] [Local area connection] [Property] Select Internet Protocol (TCP/IP) [Prop-
erty]
1) Open the property of the internet protocol (TCP/IP).
2) Check Use the next IP address and make IP address settings.

IP address: 192.168.0.101
Sub-net mask: 255.255.255.0
Default gateway: No setting
3) Check Use the next DNS server address and make DNS server settings.
Priority DNS server: No setting
Substitute DNS server: No setting
4) After above settings are completed, select [OK] and the IP address is changed.
* Do not connect to house LAN or Internet.
50
XMV4280/XMV4140
1-3. Application
Download the following applications from YSISS website and install to the PC.
Applications for Service Test
DiagXMV4-SERVICE.exe
DiagXMV4- SERVICE.ini
These applications are used to display commands to execute the tests and their result.
They are stored in C: mtxtoolsdiag.
1-4. Connection
Connect the PC and the NETWORK terminal using the Ethernet (CAT5e) straight cable.
PLL Test
PC
PC
XMV4280/XMV4140
ON
XMV4280/XMV4140 ON
1 2 3 4 5 6 7 8
ON
MTX3
ON
1 2 3 4 5 6 7 8
1-5. Settings and starting of DIP switch

* Turn off the power when setting the DIP switch. If the power is turned on, no setting will be reflected.
DIAG startup mode
Make settings for the DIP switch.
1) Set the DIP switch to the DIAG mode by setting No.1 to 6 to the on position (upward) and others to the off position.
ON
1 2 3 4 5 6 7 8
2) Turn on the power switch of XMV.
Setting of jig (MTX3)

Check to make sure that DIP switches are set as follows before turning on the power.
DIP switch 1, 2, 3, 5, 6 OFF
DIP switch 4, 7, 8 ON
51
XMV4280/XMV4140
2. Details of applications
* Details of applications are described based on the representative model which uses the same test program in the production pro-
cess. Note that the file name may be different or some test items may not be applicable.

Inspection was failed.
Inspection succeeded.
Object to be inspected is displayed.

Check box with tick is regarded as object to be inspected.
Select an object to be Able to perform Unit inspection by selecting individually.
inspected. Detailed inspection item is displayed by selecting
individually and double-clicking.
Information such as version is displayed.

Details of inspection result are displayed.
[Execution and Termination of inspection]

[F1]START : Start test.
[F2]PAUSE : Pause test.
[F3]STOP : Stop test.
[F4]CLEAR : Clear the result.
[F5]EXECUTE : Execute test.
[F6]S.LOG : Store Log.
[F7]S.OUTPUT : Store Output character string.
q Title bar
The title of the application is shown.
w Title button
The buttons for controlling the window are shown. The left button minimizes, the middle button maximizes and the right
button closes the window.
e Menu bar
The menu list is shown.
The details of the menu items are described in following tables.
Menu Tool bar Description
Save OUTPUT Saves OUTPUT contents into a file
File Save log Saves log contents into a file
Exit Closes an application
52
XMV4280/XMV4140
Menu Tool bar Description

Execute Executes a single test
Start Starts a test
Pause Temporarily stops a test
Stop Stops a test
Clear result Clears test results for selected items
FAIL Stop Stops a test when an FAIL occurs
Test All on Checks a check mark to every item
All off Removes check mark of every item
Selected on Checks a check mark to a selected item
Check
Selected off Removes check mark of a selected item
FAIL on Checks a check mark to FAIL items
FAIL off Removes a check mark of FAIL items
Port setup Makes settings of connection port to the product
Folder up Moves to the folder just abo ve the current folder
Large Icons Displays items with large icons
Small Icons Displays items with small icons
View
List Displays items as a list
Details Displays items as a detailed list
Options Makes various option settings
Help About Displays version information of an application
r Tool bar
The command buttons are shown.
With this window, it is possible to switch between displayed/hidden state and between floating/docking state.
Displayed/hidden state can be switched with [View] [Options] menu.
Floating/docking is executed by dragging the window.
Tool help and display Text can be switched with [View] [Options] menu.
t Tree window
Test items are shown in steps.
If an item is selected, items contained in the step are displayed in the List window
Drag the window to execute floating/docking.
y List window
Items included in the step selected with Tree window are displayed as a list.
If test is started with [Test] [Start] menu, only tests for items with a check mark are executed.
If Details is selected for display, Result and Procedure are displayed.
Color of characters can be changed according to the test result.
Use [View] [Options] menu to change the color of characters.
u Property window
A list of text obtained through tests is shown.
i OUTPUT window
The text such as communication contents with the main unit is displayed.
Font types and color of characters can be changed with [View] [Option] menu.
53
XMV4280/XMV4140
o Function key
Commands assigned to F1 to F12 keys are displayed.
!0 Status bar
The bar describes the selected command and state of toggle-type key.
With this window, it is possible to switch between displayed/hidden state.
Communication error
Port Setting error. is indicated in the OUTPUT window if there is no communication response in each test.
The possible causal factors are as follows.
The Ethernet cable is not connected.
The network terminal periphery circuit is damaged.
2-6. List of test items

* :to be checked : Not to be checked
XMV4280/
No Test items
XMV4140
1 INFO Test
2 DDR2 Test
3 SRAM Test
4 RTC Test
5 CPLD I/O Test
6 WORD CLOCK Test
7 PLL Test
8 LED Test
9 PANEL SWITCH Test
10 DIP SWITCH Test
11 ROTARY SW Test
12 ENCODER Test
13 BATTERY Test
14 GPI Test
15 FAN Test
16 DSP SDRAM Test
17 ANALOG Test
18 AMP DIAG INI Test
19 DC-DETECT Test (SUB)
20 AMP-ERR Test (SUB)
21 T-SENSE Test (SUB)
22 I-SENSE Test
23 MPS OVP Test (SUB)
24 MPS ENABLE Test
25 MPS WAKEUP Test
OUTPUT LEVEL SetUp (calibration)
26
I-SENSE LEVEL SetUp (calibration)
54
XMV4280/XMV4140
2-7. Test procedure 3. Test item
1) Check that [XMV-Final] is selected in the tree window. 3-1. INFO Test
* If it is not selected, select [XMV-Final].
Contents: Checks the version.
2) Check that all items to be checked are marked with Checks the MAC Address.
check marks in the list window. Checks the Serial No.
* To mark all items to be checked with check marks, click
Checks the Model ID.
the [ALL ON] button in the tool bar.
* To limit the test items, mark only desired items to be (Example of screen)
checked with check marks.
3) Start the test in one of the following ways.

Click [Start] in the Tool bar.
Click [START] in the Function key.
Press [F1] on the keyboard.
Click [Test] [Start] in the Menu bar.
OUTPUT result
Displays in the property window as follows.
Field Value (Example) Supplement
Main CPU Boot
Main Boot Version V1.00 Version character
string
Main CPU Program
Main Program
V1.00 Version character
Version
string
Sub CPU
Sub Version V1.00 Version character
string
Mac address of
MAC Address 00A0DE251234
subject device
Serial number of
Serial Number ZA37640UERY01001
subject device
MODEL ID XMV4140 Applicable model ID
DANTE version
DANTE Version V1.00 character string
DANTE model only
Mac address of
DANTE MAC
00A0DE251234 DANTE
Address
DANTE model only
55
XMV4280/XMV4140
3-2. DDR2 Test 3-3. SRAM Test

Contents: Checks the address bus of DDR2. Contents: Checks the address bus of SRAM.
Checks the data bus of DDR2. Checks the data bus of SRAM.
(Example of screen) Caution
To start in the usual manner after the SRAM test, initializa-
tion is required.
(Example of screen)
OUTPUT result
Normal condition
The result is displayed in the OUTPUT window as follows.
Item Text indication OUTPUT result
Address Bus PASS: DDR2 Address Bus Test Normal condition
Data Bus PASS: DDR2 Data Bus Test The result is displayed in the OUTPUT window as follows.
Item Text indication
In case of failure
Address Bus PASS: SRAM Address Bus Test
The result is displayed in the OUTPUT window as follows. Data Bus PASS: SRAM Data Bus Test
Address Bus FAIL: Address xxxxxxxxh Data xxxxh In case of failure
Data Bus FAIL: Address xxxxxxxxh Data xxxxh The result is displayed in the OUTPUT window as follows.
* Address xxxxxxxxh in the text indication represents the
Address Bus FAIL: Address xxxxxxxxh Data xxxxh
address in the hexadecimal notation. Data Bus FAIL: Address xxxxxxxxh Data xxxxh
* Data xxxxh in the text indication represents the write
data in hexadecimal notation. * Address xxxxxxxxh in the text indication represents the
address in the hexadecimal notation.
* Data xxxxh in the text indication represents the write
data in hexadecimal notation.
56
XMV4280/XMV4140
3-4. RTC Test 3-5. CPLD I/O Test

Contents: Initializes RTC, makes its settings and checks Contents: Checks the address bus of CPLD.
for proper operation for the specified time (5
(Example of screen)
seconds).
(Example of screen)
OUTPUT result
Normal condition
OUTPUT result The result is displayed in the OUTPUT window as follows.
Normal condition
The result is displayed in the OUTPUT window as follows. Address Bus PASS: CPLD Address Bus Test
Item Text indication Data Bus PASS: CPLD Data Bus Test
RTC PASS: RTC Test
In case of failure
In case of failure The result is displayed in the OUTPUT window as follows.
The result is displayed in the OUTPUT window as follows. Item Text indication
Item Text indication FAIL: Set (PLL)
FAIL: Set (External, Internal) FAIL: Get (PLL)
FAIL: Get (External) FAIL: Compare (PLL)
RTC FAIL: Compare (External) Address Bus FAIL: Set (MUTE2)
FAIL: Get (Internal) FAIL: Get (MUTE2)
FAIL: Compare (Internal) FAIL: Compare (MUTE2)
FAIL: Compare (GP Port)
FAIL: Set
Data Bus FAIL: Get
FAIL: Compare
57
XMV4280/XMV4140
3-6. WORD CLOCK Test 3-7. PLL Test

Contents: Activates the internal word clock and checks the Contents: Activates the external word clock and checks
crystal oscillator. the path and CPLD.
Prior preparation Prior preparation
Install the jig for LoopBack. Connect the YDIF terminal with the jig MTX3, using the
Connect IN and OUT of the YDIF terminal with the Ethernet Ethernet (CAT5e) straight cable.
cable (CAT5e straight) by LoopBack.
Jig MTX3: YDIF OUTXMV4280/XMV4140: YDIF IN
(Example of screen) Jig MTX3: YDIF INXMV4280/XMV4140: YDIF OUT
Setting of jig (MTX3)

Check to make sure that DIP switches are set as follows and
activate the jig (MTX3).
(Example of screen)
OUTPUT result
Normal condition
WORD CLOCK PASS: Wck Test completed
In case of failure
WORD CLOCK FAIL: Wck Test failed so far
OUTPUT result
Normal condition
PLL PASS: PLL Test completed
In case of failure
PLL FAIL: PLL Test failed so far
58
XMV4280/XMV4140
3-8. LED Test OUTPUT result

Contents: Checks visually if LEDs on the panel light up in Normal condition
the specified order. The result is displayed in the OUTPUT window as follows.
Caution Item Text indication

It is necessary for the tester to make judgment. For the proce- LED PASS
dure, follow the dialog displayed on the screen.
Enter the judged result after the test. In case of failure
(Example of screen)
LED FAIL
111

222

333

444

...
59
XMV4280/XMV4140
3-9. PANEL SWITCH Test OUTPUT result

Contents: Checks if all keys on the panel respond properly Normal condition
while they are pressed in the specified order. The result is displayed in the OUTPUT window as follows.
(Example of screen)
PANEL SWITCH PASS: Sw-Input Test completed
In case of failure
PANEL SWITCH FAIL: Sw-Input Test failed so far
60
XMV4280/XMV4140
3-10. DIP SWITCH Test (Example of screen)

Contents: Checks if DIP switches respond properly while
they are operated in the specified order.
1 : DIP SW 1 OFF
2 : DIP SW 1 ON
3 : DIP SW 2 OFF
4 : DIP SW 2 ON
5 : DIP SW 3 OFF
6 : DIP SW 3 ON
7 : DIP SW 4 OFF
8 : DIP SW 4 ON
9 : DIP SW 5 OFF
10 : DIP SW 5 ON
11 : DIP SW 6 OFF
12 : DIP SW 6 ON
13 : DIP SW 7 OFF
14 : DIP SW 7 ON
OUTPUT result
15 : DIP SW 8 OFF Normal condition
16 : DIP SW 8 ON The result is displayed in the OUTPUT window as follows.
* Use the same procedure for both [SPEAKERS] DIP and
Device setup DIP. DIP SWITCH PASS: DIP SW Test
Prior preparation
Set all DIP switches to the ON position before testing. In case of failure
Caution The result is displayed in the OUTPUT window as follows.
Confirm that all DIP switches are set to the ON position after Item Text indication
testing. FAIL: Starting value
FAIL: Scan
DIP SWITCH
FAIL: SW Sequence or Aberrance
FAIL: TimeOut
[SPEAKERS] DIP switch

ON
ON
1 2 3 4 5 6 7 8
Device setup DIP switch
61
XMV4280/XMV4140
3-11. ROTARY SWITCH Test 3-12. ENCODER Test

Contents: Checks if the ROTARY switch responds properly Contents: Checks the encoder rotation response.
while it is operated in the specified order. When it is turned clockwise so that 7SEG indica-
0 1 2 E F 0 1 tion is over 20 and then turned counterclockwise
1 2 3 E F 0 1 back to 0, the result will be PASS.
Prior preparation
(Example of screen)
Set ROTARY switches to the 0 or 1 position before testing.
Caution
Confirm that the ROTARY switch is set to the 1 position
after testing.
Even when the switch is at any position other than 0 or 1,
if it is turned clockwise more than 1 full rotation and stopped
at 1, the result will be PASS.
(Example of screen)
OUTPUT result
Normal condition
ENCODER PASS : ENCODER Test
In case of failure
OUTPUT result Item Text indication
Normal condition ENCODER FAIL : ENCODER Test
ROTARY SWITCH PASS: Rotary SW Test
In case of failure
FAIL: Starting value
FAIL: Scan
ROTARY SWITCH
FAIL: TimeOut
62
XMV4280/XMV4140
3-13. BATTERY Test 3-14. GPI Test

Contents: Checks remaining amount of the backup battery. Contents: Checks if the data can be sent and received with
the GPI port looped back.
(Example of screen)
Prior preparation
Install the GPI test jig.
MINI TERMINAL BLOCK

3P MC420-35003 (WK530400)
1 M (MUTE ALL) 1 NO (Normally Open)

2 S (STANDBY) 2 C (Common)
3 G (GND) 3 NC (Normally Close)
REMOTE FAULT OUTPUT

CN602 CN601
(Example of screen)
OUTPUT result
Normal condition
BATTERY PASS: Battery Test
In case of failure
FAIL: Get Value
FAIL: Low Battery
BATTERY
FAIL: High Battery
FAIL: Battery Test
OUTPUT result
Normal condition
GPI PASS: GPI Test
In case of failure
FAIL: Set
FAIL: Get
GPI
FAIL: Parameter
FAIL: Compare
63
XMV4280/XMV4140
3-15. FAN Test 3-16. DSP SDRAM Test

Contents: Checks if the fan is rotating and confirms that Contents: Checks if the DSP SDRAM can be read and
the rotation can be set. written properly.
(Example of screen) Caution
For the XMV series, this test is applicable to DSP1 only.
Be sure to execute this test before the analog test, or testing
will result in failure.
(Example of screen)
OUTPUT result
Normal condition
FAN PASS OUTPUT result
Normal condition
In case of failure The result is displayed in the OUTPUT window as follows.
Item Text indication DSP0 SDRAM
FAN FAIL : Fan Test DSP1 SDRAM
PASS: DSP SDRAM Test
DSP2 SDRAM
DSP3 SDRAM
In case of failure
FAIL: Chip Select
FAIL: Invalid Parameter
FAIL: Send
FAIL: Recv
DSP0 SDRAM FAIL: CheckSum
DSP1 SDRAM FAIL: Sem
DSP2 SDRAM FAIL: MemApi
DSP3 SDRAM FAIL: SysDB
FAIL: StsDB
FAIL: MDLDB
FAIL: DSP
FAIL: Unknown
64
XMV4280/XMV4140
3-17. ANALOG test OUTPUT result

Contents: Checks that signals input to or output from the Normal condition
ANALOG circuit and CASCADE circuit are The result is displayed in the OUTPUT window as follows.
normal. For the details of test items and settings, Item Text indication
refer to Inspection in page 90. FREQ RES (280W/4) PASS: Frequency Response Test
THD (100V) PASS: T.H.D. 1 Test
Prior preparation THD (280W/4) PASS: T.H.D. 2 Test
It initializes by a command(init_audio) before an inspection. MAX OUT A,B,C,D
PASS: Max Output 1 Test
(100V)
Caution
MAX OUT A,B,C,D
The level is measured by the operator for confirmation. PASS: Max Output 2 Test
(280W/4)
MAX OUT A,C
(Example of screen) (560W/4)
MAX OUT A,C
(560W/8)
MAX OUT A,B,C,D
(70V)
NOISE LEVEL (100V) PASS: Residual Noize Level 1 Test
NOISE LEVEL
PASS: Residual Noize Level 2 Test
(280W/4)
CROSSTARK (100V) PASS: Channel Separation 1 Test
CROSSTARK
PASS: Channel Separation 2 Test
(280W/4)
YDIF PASS: Digital Audio Check
DANTE PASS: Digital Audio Dante Check
In case of failure
FREQ RES (280W/4) FAIL: Frequency Response Test
THD (100V) FAIL: T.H.D. 1 Test
THD (280W/4) FAIL: T.H.D. 2 Test
MAX OUT A,B,C,D
FAIL: Max Output 1 Test
(100V)
MAX OUT A,B,C,D
(280W/4)
MAX OUT A,C
(560W/4)
MAX OUT A,C
(560W/8)
MAX OUT A,B,C,D
(70V)
NOISE LEVEL (100V) FAIL: Residual Noize Level 1 Test
NOISE LEVEL
FAIL: Residual Noize Level 2 Test
(280W/4)
CROSSTARK (100V) FAIL: Channel Separation 1 Test
CROSSTARK
FAIL: Channel Separation 2 Test
(280W/4)
YDIF FAIL: Digital Audio Check
DANTE FAIL: Digital Audio Dante Check
65
XMV4280/XMV4140
3-18. AMP DIAG-INI Test 3-20. AMP-ERR Test

This test is intended for factory inspection and not for servicing This test is intended for factory inspection and not for servicing
inspection. inspection.
(Example of screen) (Example of screen)
3-21. T-SENSE Test

This test is intended for factory inspection and not for servicing
3-19. DC-DETECT Test inspection.
This test is intended for factory inspection and not for servicing
inspection. (Example of screen)
(Example of screen)
66
XMV4280/XMV4140
3-22. I-SENSE Test 3-24. MPS ENABLE Test

3-23. MPS OVP Test 3-25. MPS WAKEUP Test

67
XMV4280/XMV4140
3-26. OUTPUT LEVEL SetUp (calibration) 1) When preparation of OUTPUT LEVEL CALIBRAION
I-SENSE LEVEL SetUp (calibration) is completed, press [OK] to start.
Contents: Executes calibration of the OUTPUT/I-SENSE Enter the calibration data for each channel.
level.
Prior preparation
As the DIAG application is executed automatically, just fol-
low the instruction displayed on the screen. Use the no signal
method for input.
Perform steps 1) to 4) without a load applied to the output 2) Enter the calibration data obtained in measurement at
terminal. each channel into the calibration data input window.
For steps 5) to 7), make adjustment with a load applied. Input data: Value from -100 to 100 Unit: dBx100
Measurement mode: 100V mode No data input is considered as 0 input and calibra-
XMV4280: 401% (Rating 250W or more) tion is processed accordingly.
XMV4140: 801% (Rating 120W or more) When [OK] is pressed, the confirmation window appears.
* Resistor used: Dummy resistor IRV150L 80 NG (ZJ056200) Pressing [Cancel] is considered as 0 input and the
Execute the test items of OUTPUT/I-SENSE LEVEL SET- confirmation window appears.
UP.
3) Calibration data input window
(Example of screen)
With 0 considered being

inputted, processing advances.
Confirmation window
Check the input data for confirmation and press [YES].

When [YES] is pressed, the calibration data input win-
dow of the next channel appears.
When [NO] is pressed, the calibration data input win-
dow of the current channel appears again.
4) Repeat the same procedure by the number of channels

of the applicable model.
5) Next, execute the I-SENSE calibration. In the 100V

mode, connect a load corresponding to each model to
the output terminal for adjustment.
XMV4280: 401% (Rating 250W or more)
XMV4140: 801% (Rating 120W or more)
The OSC output (28.2dBu) is provided at all channels
by calbisen_cal.
68
XMV4280/XMV4140
6) When preparation of I-SENSE LEVEL CALIBRA- Caution

TION is completed, press [OK] to start. As it is not possible to re-execute the procedures [3-26
Connect a load to each channel and execute calibration, OUTPUT LEVEL SetUp (calibraion)] and [I-SENSE
and the calibration data is set automatically. LEVEL SetUp (calibraion)] for each channel individu-
ally, be sure to follow the above commands.
Calibration available range: 28.2 2.0dBu
OUTPUT result
Normal condition
7) With a load connected to the applicable channel, press Item Text indication
[OK] for execution.
When [OK] is pressed and calibration fails, the window
for retry appears. In case of failure
When [Cancel] is pressed, calibration is not executed The result is displayed in the OUTPUT window as follows.
for that channel and advances to the next channel.

With calibration failed,

the retry window appears.
Retry window
Confirm the current channel condition and press [Re-

try], and calibration of this channel is executed auto-
matically.
When [Cancel] is pressed, calibration is not executed
for that channel and advances to the next channel.
Repeat the same procedure by the number of channels
of the applicable model.
8) When the calibration of all channels is completed with

calibration data recorded properly, this test item ends
successfully. If an error occurred during the process, the
all calibration data are not recorded and the test item
ends unsuccessfully.
69
XMV4280/XMV4140

1.
1-1.
Ethernet Windows XP SP3, Vista, 7 1
GPI GPI
EthernetCAT5e3
MTX3PLL 1
1-2.
TCP/IP

1 TCP/IP
2 IP IP
IP 192.168.0.101
255.255.255.0

3
DNS DNS
DNS
DNS
OK IP
4
LAN Internet
70
XMV4280/XMV4140
1-3.
YSISS PC

DiagXMV4-SERVICE.exe
DiagXMV4-SERVICE.ini

C:mtxtoolsdiag
1-4.
XMV NETWORK EthernetCAT5e
PLL Test
PC
PC
XMV4280/XMV4140
ON
XMV4280/XMV4140 ON
1 2 3 4 5 6 7 8
ON
MTX3
ON
1 2 3 4 5 6 7 8
1-5.

XMV
1
1 6 on off
ON
1 2 3 4 5 6 7 8
2 XMV Power
(MTX3)
DIP
71
XMV4280/XMV4140
2.

FAIL
PASS

[F1]START :
[F2]PAUSE :
[F3]STOP :
[F4]CLEAR :
[F5]EXECUTE :
[F6]S.LOG :
[F7]S.OUTPUT :

Save OUTPUT
File Save log
Exit
72
XMV4280/XMV4140

Execute
Start
Pause
Stop
Clear result
FAIL Stop FAIL
Test All on
All off
Selected on
Check
Selected off
FAIL on FAIL
FAIL off FAIL
Port setup
Folder up
Large Icons
Small Icons
View
List
Details
Options
Help About
r

View-Options

View-Options
t

View-Options

y

-

View-Options
u

View-Options

i

View-Options

View-Options

73
XMV4280/XMV4140
o
F1 F12

View-Options

!0

View-Options

Port Setting error.

Ethernet
Network
2-1.

XMV4280/
No
XMV4140
1 INFO
2 DDR2
3 SRAM
4 RTC
5 CPLD I/O
6 WORD CLOCK
7 PLL
8 LED
9 PANEL SWITCH
10 DIP SWITCH
11 ROTARY SW
12 ENCODER
13 BATTERY
14 GPI
15 FAN
16 DSP SDRAM
17 ANALOG
18 AMP DIAG INI
19 DC-DETECT (SUB)
20 AMP-ERR SUB)
21 T-SENSE (SUB)
22 I-SENSE
23 MPS OVP (SUB)
24 MPS ENABLE
25 MPS WAKEUP
OUTPUT LEVEL (calibration)
26
I-SENSE LEVEL (calibration)
74
XMV4280/XMV4140
2-2. 3.
1
XMV-Final 3-1. INFO
VERSION
XMV-Final MAC Address
Serial No.
2 MODEL ID

3
Start
START

Test-Start
Field Value
Main Boot Main CPU Boot
V1.00
Version
Main Program Main CPU Program
V1.00
Version
Sub CPU
Sub Version V1.00

MAC Address 00A0DE251234
Mac Address
Serial Number ZA37640UERY01001 Serial
MODEL ID XMV4140 ID
DANTE
DANTE Version V1.00
Dante
DANTE MAC DANTE Mac Address
00A0DE251234
Address Dante
75
XMV4280/XMV4140
3-2. DDR2 3-3. SRAM

DDR2 SRAM
DDR2 SRAM

SRAM

Address Bus PASS: DDR2 Address Bus Test
Data Bus PASS: DDR2 Data Bus Test

Address Bus PASS: SRAM Address Bus Test

Data Bus PASS: SRAM Data Bus Test

Data Bus FAIL: Address xxxxxxxxh Data xxxxh
Address xxxxxxxxh16
Data xxxxh16 Data Bus FAIL: Address xxxxxxxxh Data xxxxh

Address xxxxxxxxh16

Data xxxxh16

76
XMV4280/XMV4140
3-4. RTC 3-5. CPLD I/O

RTC CPLD
5

Address Bus PASS: CPLD Address Bus Test
RTC PASS: RTC Test Data Bus PASS: CPLD Data Bus Test

FAIL: Set (External, Internal) FAIL: Set (PLL)
FAIL: Get (External) FAIL: Get (PLL)
RTC FAIL: Compare (External) FAIL: Compare (PLL)
FAIL: Get (Internal) Address Bus FAIL: Set (MUTE2)
FAIL: Compare (Internal) FAIL: Get (MUTE2)
FAIL: Compare (MUTE2)
FAIL: Compare (GP Port)
FAIL: Set
Data Bus FAIL: Get
FAIL: Compare
77
XMV4280/XMV4140
3-6. WORD CLOCK 3-7. PLL

CPLD

LoopBack YDIF Ethernet (CAT5e) straight cable
YDIF IN OUT Ethernet (CAT5e MTX3
)
MTX3YDIF OUT XMV4280/XMV4140YDIF IN
MTX3YDIF IN XMV4280/XMV4140YDIF OUT
(MTX3)
DIP
(MTX3)

WORD CLOCK PASS: Wck Test completed

WORD CLOCK FAIL: Wck Test failed so far

PLL PASS: PLL Test completed

PLL FAIL: PLL Test failed so far
78
XMV4280/XMV4140
3-8. LED
LED

LED PASS

LED FAIL
111

222

333

444

...
79
XMV4280/XMV4140
3-9. PANEL SWITCH

PANEL SWITCH PASS: Sw-Input Test completed

PANEL SWITCH FAIL: Sw-Input Test failed so far
80
XMV4280/XMV4140
3-10. DIP SWITCH

DIP SWITCH

1 DIP SW 1 OFF
2 DIP SW 1 ON
3 DIP SW 2 OFF
4 DIP SW 2 ON
5 DIP SW 3 OFF
6 DIP SW 3 ON
7 DIP SW 4 OFF
8 DIP SW 4 ON
9 DIP SW 5 OFF
10 DIP SW 5 ON
11 DIP SW 6 OFF
12 DIP SW 6 ON
13 DIP SW 7 OFF
14 DIP SW 7 ON
15 DIP SW 8 OFF
16 DIP SW 8 ON
[SPEAKERS] DIP, Device setup DIP

DIP SWITCH ON

DIP SWITCH PASS: DIP SW Test
DIP SWITCH ON

FAIL: Scan
DIP SWITCH
FAIL: TimeOut
[SPEAKERS] DIP switch

ON
ON
1 2 3 4 5 6 7 8
Device setup DIP switch
81
XMV4280/XMV4140
3-11. ROTARY SWITCH 3-12. ENCODER

ROTARY SWITCH
7SEG 20
0 1 2 E F 0 1 0 PASS
1 2 3 E F 0 1

ROTARY SWITCH 01

ROTARY SWITCH 1

SWITCH 01
1 1 PASS

ENCODER PASS : ENCODER Test

ENCODER FAIL : ENCODER Test

ROTARY SWITCH PASS: Rotary SW Test

FAIL: Scan
ROTARY SWITCH
FAIL: TimeOut
82
XMV4280/XMV4140
3-13. BATTERY 3-14. GPI

GPI Port Loop Back

GPI
3P
3P MC420-35003 (WK530400)
1 M (MUTE ALL) 1 NO (Normally Open)

2 S (STANDBY) 2 C (Common)
3 G (GND) 3 NC (Normally Close)
REMOTE FAULT OUTPUT

CN602 CN601

BATTERY PASS: Battery Test

FAIL: Get Value
FAIL: Low Battery
BATTERY
FAIL: High Battery
FAIL: Battery Test

GPI PASS: GPI Test

FAIL: Set
FAIL: Get
GPI
FAIL: Parameter
FAIL: Compare
83
XMV4280/XMV4140
3-15. FAN 3-16. DSP SDRAM

FAN DSP SDRAM

XMV DSP1

FAN PASS

DSP0 SDRAM
DSP1 SDRAM
PASS: DSP SDRAM Test
FAN FAIL : Fan Test DSP2 SDRAM
DSP3 SDRAM

FAIL: Chip Select
FAIL: Invalid Parameter
FAIL: Send
FAIL: Recv
DSP0 SDRAM FAIL: CheckSum
DSP1 SDRAM FAIL: Sem
DSP2 SDRAM FAIL: MemApi
DSP3 SDRAM FAIL: SysDB
FAIL: StsDB
FAIL: MDLDB
FAIL: DSP
FAIL: Unknown
84
XMV4280/XMV4140
3-17.
ANALOG CASCADE

98
FREQ RES (280W/4 ) PASS: Frequency Response Test
THD (100V) PASS: T.H.D. 1 Test
THD (280W/4 ) PASS: T.H.D. 2 Test

(init_audio) MAX OUT A,B,C,D (100V) PASS: Max Output 1 Test
MAX OUT A,B,C,D
(280W/4 )
MAX OUT A,C (560W/4 ) PASS: Max Output 3 Test
MAX OUT A,C (560W/8 ) PASS: Max Output 4 Test
MAX OUT A,B,C,D (70V) PASS: Max Output 5 Test

PASS: Residual Noize Level 1
NOISE LEVEL (100V)
Test
PASS: Residual Noize Level 2
NOISE LEVEL (280W/4 )
Test
PASS: Channel Separation 1
CROSSTARK (100V)
Test
PASS: Channel Separation 2
CROSSTARK (280W/4 )
Test
YDIF PASS: Digital Audio Check
PASS: Digital Audio Dante
DANTE
Check

FREQ RES (280W/4 ) FAIL: Frequency Response Test
THD (100V) FAIL: T.H.D. 1 Test
THD (280W/4 ) FAIL: T.H.D. 2 Test
MAX OUT A,B,C,D (100V) FAIL: Max Output 1 Test
MAX OUT A,B,C,D
(280W/4 )
MAX OUT A,C (560W/4 ) FAIL: Max Output 3 Test
MAX OUT A,C (560W/8 ) FAIL: Max Output 4 Test
MAX OUT A,B,C,D (70V) FAIL: Max Output 5 Test
FAIL: Residual Noize Level 1
NOISE LEVEL (100V)
Test
FAIL: Residual Noize Level 2
NOISE LEVEL (280W/4 )
Test
FAIL: Channel Separation 1
CROSSTARK (100V)
Test
FAIL: Channel Separation 2
CROSSTARK (280W/4 )
Test
YDIF FAIL: Digital Audio Check
FAIL: Digital Audio Dante
DANTE
Check
85
XMV4280/XMV4140
3-18. AMP DIAG-INI 3-20. AMP-ERR

3-21. T-SENSE
3-19. DC-DETECT

86
XMV4280/XMV4140
3-22. I -SENSE 3-24. MPS ENABLE

3-23. MPS OVP 3-25. MPS WAKEUP

87
XMV4280/XMV4140
3-26. OUTPUT LEVEL (calibration) 1 OUTPUT LEVEL CALIBRATION

I-SENSE LEVEL (calibration) [OK]
OUTPUT/I-SENSE LEVEL

1) 4) 2
5) 7)
-100 100 dBx100
100V

XMV428040 1%( 250W )

XMV414080 1%( 120W )
IRV150L 80 NGZJ056200 [OK]
[Cancel]
0
OUTPUT/I-SENSE LEVEL SETUP

[YES]
[YES]

[NO]

4
5
I-SENSE
100V

XMV428040 1%( 250W )
XMV414080 1%( 120W )
calb_isen_cal CH OSC (28.2dBu)

88
XMV4280/XMV4140
6 I-SENSE LEVEL CALIBRATION

[OK] 3-26 OUTPUT LEVEL (calibration)
I-SENSE
LEVEL (calibration) CH

28.2 2.0dBu

- -
7 [OK]

[OK]

[Cancel] - -
[Retry]

[Cancel]

89
XMV4280/XMV4140
INSPECTIONS
1. Measurement condition
1-1. Environment
Ordinary temperature: 5 to 40C
Ordinary humidity: 30 to 90%
* If the measured values are within the test standard range, 5 to 40C temperature and 30 to 90% humidity are acceptable as measurement
conditions. If they are out of it, however, measurement must be taken again at the above ordinary temperature and humidity.
1-2. Power Source

Voltage Frequency
220V10% 50Hz
* Power source change by inducing.
1-3. Measuring instruments and jigs

Make sure that the instruments used for inspections have enough accuracy and precision to measure the standard of each measurement item.
Use the instruments with more than 100k input impedance.
Use the jigs and instruments that can measure the specification values as indicated.
1-3-1. Test jig

GPI test jig: To be used to loop back the [FAULT OUTPUT] connector and [REMOTE] connector.
MTX3: To be connected with XMV and used to check YDIF AUDIO.
1-3-2. Cable
LAN straight cable: 1 pc
To be used to connect XMV and the NETWORK terminal of the PC for testing.
LAN straight cable: 2 pcs. (of CAT5e or more category, 5m or less)
To be used to connect XMV and the [YDIF] IN/OUT connectors of MTX.
1-3-3. Connection
NETWORK connector [REMOTE] connector [FAULT OUTPUT] connector
ON
ON
1 2 3 4 5 6 7 8
[YDIF] connectors Analog input connectors [SPEAKERS] output connectors
1-3-3-1. Input terminal

The mini terminal block is used as the input terminal. The input should be balance input.
1-3-3-2. Output terminal

The barrier stop terminal block is used as the output terminal.
90
XMV4280/XMV4140
1-4. Filter for measurement

For measurement of 2-2-15 to 2-2-19, use AUX-0025 filter made by Audio Precision.
Use a low pass filter of 22kHz or 80kHz depending on the measurement items.
1-5. Inspection
Adjust and check items 2-2-1 to 2-2-24 according to the described contents.
Use the DIAG mode to check items 2-2-1 to 2-2-24.
For the starting method of the DIAG mode, refer to TEST Program. (See page 51.)
Unless otherwise specified, execute testing on all channels.
2. Electric characteristics
2-1. Preparation
Use the load resistance specified below for each output terminal.
1 280W (140W)/4 mode

The description in ( ) is applicable to the 140W model.
4 1% (Rating 250W or more)
2 560W (280W)/4 mode

The description in ( ) is applicable to the 140W model.
4 1% (Rating 500W or more)
3 100V mode
XMV4280: 40 1% (Rating 250W or more)
XMV4140: 80 1% (Rating 120W or more)
Use equations of 0dBu = 0.775Vrms and 0dBV = 1Vrms.

Unless otherwise specified, use a 1kHz sine wave for the input signal.
The impedance of the signal source should be 100 to 150 .
2-2. Check items
2-2-1. Power consumed during idling

Measurement condition Judgment criteria
Measurement mode 62W or less
100V mode 50W or less
280W (140W)/4 mode
Input without signal
Ground the input terminal through a 100 to 150 resistance and
measure the primary power consumption.
2-2-2. Firmware version check

DIAG mode Confirm that the version displayed on the PC screen matches
Execute item INFO. with the latest version.
If the firmware version is not suitable, update the version by
referring to Updating Firmware. (See page 106.)
91
XMV4280/XMV4140
2-2-3. Model ID check

DIAG mode Confirm that a correct model ID is displayed corresponding to
Execute item INFO. each model name.
Model Name MODEL ID
XMV4280 XMV4280
XMV4140 XMV4140
XMV8280 XMV8280
XMV8140 XMV8140
XMV4280-D XMV4280-D
XMV4140-D XMV4140-D
XMV8280-D XMV8280-D
XMV8140-D XMV8140-D
2-2-4. Battery check

DIAG mode Judgment is made automatically by the test program.
Execute item BATTERY. Confirm that PASS: Battery Test is displayed on the PC
monitor screen.
2-2-5. Real time clock check

Execute item RTC. Confirm that PASS: RTC Test is displayed on the PC monitor
screen.
2-2-6. Gain calibration

Measurement mode All channels: +28.2 0.1dBu
100V mode Check to judge if the measured value is within the permissible
range and if it is, write the measured value as the correction
Disconnect all loads from the output terminals. value.
DIAG mode
Execute item Gain CALIBRATION.
Adjust the output level to the specified level by operating the PC for
testing.
2-2-7. I-SENSE calibration

Measurement mode Judgment is made automatically by the test program.
100V mode Confirm that PASS: I-SENSE Calibration is displayed on the
PC monitor screen.
DIAG mode
Execute item I-SENSE CALIBRATION.
2-2-8. LED check

DIAG mode Confirm that LEDs light up in such order as specified by the test
Execute item LED. program.
92
XMV4280/XMV4140
2-2-9. Panel switch check

DIAG mode Push the switch specified by the test program.
Execute item PANEL SW. Judgment is made automatically by the test program.
Confirm that PASS: SW-Input Test completed is displayed on
the PC monitor screen.
2-2-10. DIP switch check

DIAG mode Set DIP-SW as specified by the test program.
Execute item DIP SW. Judgment is made automatically by the test program.
Confirm that PASS: DIP-SW Test is displayed on the PC
monitor screen.
2-2-11. Rotary switch check

DIAG mode Set ROTARY-SW as specified by the test program.
Execute item ROTARY SW. Judgment is made automatically by the test program.
Confirm that PASS: ROTARY-SW Test is displayed on the
PC monitor screen.
2-2-12. Encoder check

DIAG mode Turn the encoder clockwise until the 7SEG-LED indication
Execute item ENCODER. exceeds 20. Then, turn it counterclockwise until 7SEG-LED
indication is 0.
Judgment is made automatically by the test program.
Confirm that PASS: ENCODER Test is displayed on the PC
monitor screen.
2-2-13. GPI check

Connect the GPI test jig to [REMOTE] and [FAULT OUTPUT] Judgment is made automatically by the test program.
terminals in the loop-back manner. Confirm that PASS: GPI Test is displayed on the PC monitor
screen. (See page 63.)
DIAG mode
Execute item GPI.
2-2-14. FAN check

DIAG mode Confirm visually and by hearing that the fan is rotating properly.
Execute item FAN.
93
XMV4280/XMV4140
2-2-15. Frequency characteristic

Measurement mode Record the measured value as (A1).
280W (140W)/ 4 mode
Apply a 1kHz -10dBu sine wave to the input terminal and measure
the output level.
Apply a 20Hz -10dBu sine wave to the input terminal and measure Confirm that the measured value is within the -11dB range with
the output level. A1 as the reference.
Apply a 20kHz -10dBu sine wave to the input terminal and measure Confirm that the measured value is within the -21dB range with
the output level. A1 as the reference.
2-2-16. Measuring total harmonic distortion

Measurement mode All channels
100V mode THD = 0.2% or less
280W (140W)/ 4 mode
With a 1kHz sine wave applied to the input terminal, measure the
total harmonic distortion when the following output is obtained.
100V mode: 18.23 dBu
280W (140W)/ 4 mode: 8.23 dBu
* Use a 22kHz low pass filter for measurement.
* Drive all channels.
2-2-17. Maximum output

Measurement mode All channels
100V mode THD = 1% or less
280W (140W)/ 4 mode
With a 1kHz sine wave applied to the input terminal, measure the
total harmonic distortion when the following output is obtained.
100V mode: 42.2 dBu
280W (140W)/ 4 mode: 32.7 (29.7) dBu
* Drive the channels one by one.
2-2-18. Residual noise level

Measurement mode 100V mode: -56 dBu or less
100V mode 280W (140W)/ 4 mode: -65 dBu or less
280W (140W)/ 4 mode
2-2-19. Crosstalk
Measurement mode 100V mode: -60 dBu or less
100V mode 280W (140W)/ 4 mode: -60 dBu or less
280W (140W)/ 4 mode
Apply a 1kHz, -10 dBu signal to the input terminal of one channel
and ground the input terminal of the adjacent channel through 100
to 150 resistance.
Measure the voltage at the output terminal of the adjacent channel
with the voltage at the output terminal of the signal applied channel
as the reference voltage (0 dB).
94
XMV4280/XMV4140
2-2-20. YDIF check

Using 2 LAN cables, connect XMV to be checked and the [YDIF] terminal of the MTX3 test jig.
Use MTX3 test jig as the YDIF master.
Jig (MTX3) settings

(1) Check to ensure that DIP switches are set as follows and activate the jig (MTX3).
DIP switch 1, 2, 3, 4, 5, 6 OFF
DIP switch 7, 8 ON
(2) Connect with the PC using the LAN cable and enter the following DIAG commands.
init_audio
test_audio 3 0
MTX
ID=01
Computer
XMV
ID=1A
ON
ON
1 2 3 4 5 6 7 8
95
XMV4280/XMV4140
1 Measuring output level

Apply a 1kHz, +10 dBu signal to the input CH1 of the MTX3 test jig. The measured value should be +4 2dBu.
Terminate other input channels with a 100 to 150 resistance in
advance.
Measure the signal level of the output CBH1 of the MTX3 test jig.
2 Measuring total harmonic distortion

Apply a 1kHz signal to the input CH1 of the MTX3 test jig and set The measured value should be 0.2% or less.
the output CH1 level to 4dBu. Terminate other input channels with
a 100 to 150 resistance in advance. Measure the total harmonic
distortion of the output CH1 of the MTX3 test jig.
* When measuring T.H.D., use a 80 kHz LPF for the filter of the measuring instrument.
3 Measuring output noise level

All inputs of the MTX3 test jig should be without signal. The measured value should be -70 dBu or less.
Ground all input terminals through a 100 to 150 resistance.
Measure the noise level occurring at the output CH1 of the MTX3
test jig.
* When measuring the noise level, use a 22 kH LPF for the filter of the measuring instrument.
2-2-21. DDR2 check

Execute item DDR2. Confirm that PASS: DDR2 Address Bus Test is displayed on
Confirm that PASS: DDR2 Data Bus Test is displayed on the
PC monitor screen.
2-2-22. SRAM check

Execute item SRAM. Confirm that PASS: SRAM Address Bus Test is displayed on
Confirm that PASS: SRAM Data Bus Test is displayed on the
PC monitor screen.
2-2-23. CPLD I/O check

Execute item CPLD. Confirm that PASS: CPLD Address Bus Test is displayed on
Confirm that PASS: CPLD Data Bus Test is displayed on the
PC monitor screen.
96
XMV4280/XMV4140
2-2-24. WORD CLOCK check

Using a LAN cable, connect the [YDIF IN] and [YDIF OUT] Judgment is made automatically by the test program.
connectors for the loop-back. Confirm that PASS: Wck Test completed is displayed on the
PC monitor screen.
DIAG mode
Execute item WORD CLOCK.
3. Settings after testing is completed
3-1. Initialization
Perform the initializing procedure when testing is completed. (See page 116.)
After initialization, turn off the power switch.
3-2. Default settings of each switch

Device setup DIP switch [SPEAKER] DIP switch [UNIT ID] rotary switch
Set all switches to the ON (upward) position. Set all switches to the OFF (upward) Set this switch to the 1 position.
position.
ON
1 2 3 4 5 6 7 8
97
XMV4280/XMV4140

1.
1-1.
5 40
30 90%
5 4020 90%

1-2.

100V 10% 50Hz
1-3.

100k

1-3-1.
GPI : [FAULT OUTPUT] [REMOTE]
MTX3 : XMV YDIF AUDIO
1-3-2.
LAN 1
XMV PC NETWORK
LAN 2 (CAT5e 5m )
XMV MTX [YDIF] IN/OUT
1-3-3.
NETWORK [REMOTE] [FAULT OUTPUT]

ON
ON
1 2 3 4 5 6 7 8
[YDIF] [SPEAKERS]
1-3-3-1.

1-3-3-2.

98
XMV4280/XMV4140
1-4.
2-2-15 2-2-19 Audio Precision AUX-0025
22kHz 80kHz
1-5.
2-2-1 2-2-24
2-2-1 2-2-24
71
2.
2-1.
1 280W(140W)/4
( ) 140W
4 1%( 250W )
2 560W(280W)/4
( ) 140W
4 1%( 500W )
3 100V
XMV4280 40 1%( 250W )
XMV414080 1%( 120W )
0dBu=0.775Vrms0dBV=1Vrms
1kHz
100 150
2-2.
2-2-1.

62W
100V 50W
280W(140W)/4
100 150
2-2-2.

DIAG PC
INFO
109

99
XMV4280/XMV4140
2-2-3.

DIAG ID
INFO
Model Name MODEL ID
XMV4280 XMV4280
XMV4140 XMV4140
XMV8280 XMV8280
XMV8140 XMV8140
XMV4280-D XMV4280-D
XMV4140-D XMV4140-D
XMV8280-D XMV8280-D
XMV8140-D XMV8140-D
2-2-4.

DIAG
BATTERY PASS:Battery Test PC

2-2-5.

DIAG
RTC PASS:RTC Test PC

2-2-6.

+28.2 0.1dBu
100V

DIAG
Gain CALIBRATION
PC

2-2-7. I-SENSE

100V PASS:I-SENSE Calibration PC

DIAG
I-SENSE CALIBRATION
2-2-8. LED

DIAG
LED
100
XMV4280/XMV4140
2-2-9.

DIAG
PANEL SW
PASS:SW-Input Test completed PC

2-2-10.

DIAG DIP-SW
DIP SW

PASS:DIP-SW Test PC

2-2-11.

DIAG ROTARY-
ROTARY SW SW

PASS:ROTARY-SW Test PC

2-2-12.

DIAG 7SEG-LED 20
ENCODER
7SEG-LED 0

PASS:ENCODER Test PC

2-2-13. GPI

GPI [REMOTE]
[FAULT OUTPUT] PASS:GPI Test PC

DIAG 83
GPI
2-2-14. FAN

DIAG FAN
FAN
101
XMV4280/XMV4140
2-2-15.

(A1)
280W(140W)/4
1kHz -10dBu

20Hz -10dBu A1 -1 1dB

20kHz -10dBu A1 -2 1dB

2-2-16.

100V THD=0.2%
280W(140W)/4
1kHz

100V 18.23dBu
280W(140W)/4 8.23dBu
22kHz

2-2-17.

100V THD=1%
280W(140W)/4
1kHz

100V 42.2dBu
280W(140W)/4 32.7(29.7)dBu
22kHz
1
2-2-18.

100V -56dBu
100V 280W(140W)/4 -65dBu
280W(140W)/4
22kHz
2-2-19.

100V -60dBu
100V 280W(140W)/4 -60dB
280W(140W)/4
1kHz, -10dBu
100 150

(0dB)

22kHz
102
XMV4280/XMV4140
2-2-20. YDIF
XMV MTX3 [YDIF] 2 LAN
MTX3 YDIF
(MTX3)
(1) DIP (MTX3)

DIP switch 1, 2, 3, 4, 5, 6 OFF
DIP switch 7, 8 ON
(2) LAN DIAG

init_audio
test_audio 3 0
MTX
ID=01
XMV
ID=1A
ON
ON
1 2 3 4 5 6 7 8
103
XMV4280/XMV4140
1

MTX3 CH1 1kHz+10dBu +4 2dBu

100 150
MTX3 CH1
2

MTX3 CH1 1kHz 0.2%
CH1 4dBu
100 150 MTX3
CH1
T.H.D. 80kHz LPF
3

MTX3 -70dBu
100 150
MTX3 CH1

22kH LPF
2-2-21. DDR2

DIAG
DDR2 PASS:DDR2 Address Bus Test PC

PASS:DDR2 Data Bus Test PC

2-2-22. SRAM

DIAG
SRAM PASS:SRAM Address Bus Test PC

PASS:SRAM Data Bus Test PC

2-2-23. CPLD I/O

DIAG
CPLD PASS:CPLD Address Bus Test PC

PASS:CPLD Data Bus Test PC

104
XMV4280/XMV4140
2-2-24. WORD CLOCK

[YDIF IN] [YDIF OUT]
LAN PASS:PASS:Wck Test completed PC

DIAG
WORD CLOCK
3.
3-1.
116
SW OFF
3-2.
[SPEAKERS] [UNIT ID]
ON OFF 1
ON
1 2 3 4 5 6 7 8
105
XMV4280/XMV4140
UPDATING FIRMWARE
1. Preparation
For the updating procedure and settings of the main unit, please refer to Firmware Update Guide found in our web-site.
1-1. Required items

XMV4280/XMV4140
Ethernet (CAT5e) straight cable: 1 pc.
PC: 1 unit, Windows XP SP3 with Ethernet port Windows Vista or Windows 7
1-2. Network setting

Use the same network setting as for Test Program. (See page 50)
1-3. Application
Download XMV Test Program Data Package from YSISS website and copy it right under the C drive.
1-4. Connection
Connect the PC and Network port of XMV with Ethernet (CAT5e) straight cable.
* Only the above connection is required. Do not connect anything to other terminals.
PC
XMV4280/XMV4140
ON
ON
1 2 3 4 5 6 7 8
1-5. Settings and starting of DIP switch

1) Turn off the power to the XMV.
2) Write down settings of DIP switches on the rear panel of the XMV main unit.
* Change settings of DIP switches according to the following procedure.
Be sure to write down settings of the DIP switches before changing them as they must be reset to the original state after the
DANTE firmware updating is completed.
3) Set all DIP switches on the rear panel of the XMV itself to the upward (ON) position.
ON
1 2 3 4 5 6 7 8
4) Set the [UNIT ID] rotary switch to the 1 position.
5) Turn on the power switch of XMV.
106
XMV4280/XMV4140
2. Updating MAIN firmware
2-1. Starting software for updating

Double-click the MTX-MainUpdate.exe icon in C:mtxtoolsupdateprogramvXXX.
(vXXX represents the version to be updated.)
2-2. Checking settings

Settings vary depending on what to be updated.
Item to be updated File name
Program section MTX_XMV_MAIN_PROG.BIN
(Example of screen)
2-3. Updating
Click connection.
Confirm that Connection was completed is displayed and click update.
(Example of screen)
When Update was completed is displayed, the updating procedure is completed.

(Example of screen)
As a dialog urging for restarting is displayed, press the OK key to restart MTX.
(Example of screen)
107
XMV4280/XMV4140
3. Updating BOOT firmware
3-1. Starting updating software

Double-click the MTX-MainUpdate.exe icon in C:mtxtoolsupdatebootvXXX.
(vXXX represents the version to be updated.)
3-2. Checking settings

Settings vary depending on what to be updated.
Item to be updated File name
Program section MTX_XMV_MAIN_BOOT.BIN
(Example of screen)
3-3. Updating
Click connection.
Confirm that Connection was completed is displayed and click update.
(Example of screen)
When Update was completed is displayed, the updating procedure is completed.

(Example of screen)
As a dialog urging for restarting is displayed, press the OK key to restart MTX.
(Example of screen)
108
XMV4280/XMV4140
1.
1-1.
XMV4280/XMV4140
EthernetCAT5e1
Ethernet Windows XP SP3, Vista, 7 1
1-2.
70
1-3.
YSISS XMV C
1-4.
LAN XMV NETWORK EthernetCAT5e

PC
XMV4280/XMV4140
ON
ON
1 2 3 4 5 6 7 8
1-5.
1 XMV
2
XMV

3 XMV (ON)
ON
1 2 3 4 5 6 7 8
4 [UNIT ID] 1
5 XMV Power
109
XMV4280/XMV4140
2. MAIN
2-1.
C:mtxtoolsupdateprogramvXXXMTX-MainUpdate.exe
(vXXX )
2-2.

MTX_XMV_MAIN_PROG.BIN
2-3.
connection
Connection was completed
update

Update was completed

OK MTX

110
XMV4280/XMV4140
3. BOOT
3-1.
C:mtxtoolsupdatebootvXXXMTX-MainUpdate.exe
(vXXX )
3-2.

MTX_XMV_MAIN_BOOT.BIN
3-3.
connection
Connection was completed
update
Update was completed
OK XMV
111
XMV4280/XMV4140
UPDATING FIRMWARE USING MTX Editor

The firmware can be updated using MTX Editor besides the updating method as used in the factory.
The information about updating the firmware using MTX Editor is found in the following website.
http://proaudio.yamaha.co.jp/
To execute updating and setting of the main unit, use MTX Editor available from the above website. For the updating procedure
of MTX Firmware, refer to Update Firmware dialog in Chapter 7 Dialog in MTX Editor Users Manual.
Update procedure
All applicable devices can be updated at the same time.
1) For all MTX and XMV units in the MTX system, turn DIP switches 7 and 8 OFF (RESUME mode).
2) Turn on the power of all MTX and XMV units in the MTX system.
3) In the Device Information dialog box, click the [Update Firmware] button.
Update Firmware dialog box

This dialog box lets you update the firmware of a unit such as an MTX or XMV.
Firmware Data Location

Shows the name of the selected folder.
Firmware version
Shows the firmware versions existing in the selected folder for each device.
List
Unit ID ............................. Shows the UNIT ID of the device.
Type................................... Shows the model name of the device.
Version ............................. Shows the firmware version of the device.
[Update] button
Executes the update.
If an update file does not exist in the selected folder, this button will be dimmed and unavailable.
[Cancel] button
Cancels the update and closes the dialog box.
4) Specify the folder that contains the firmware.

If you select a folder that does not contain update files, an error message will appear and the update will be cancelled.
5) The Update Firmware dialog box will appear.

This shows the firmware versions existing in the selected folder.
112
XMV4280/XMV4140
6) Click the [Update] button to execute the update.

During the update, the indicators of the devices will flash.
NOTE
Do not turn off the power of the devices while the update is being executed.
7) When the update is completed, the indicators of the MTX and XMV units will light.
When the update is completed, the devices will restart automatically.
NOTE
If the [ALERT] indicators of the MTX or XMV are flashing, the update has failed due to an error.
As the alert number appears on the [PRESET] display on the front panel, check the content of the error with Alert Numbers and
Content (p.121) and take a necessary measure.
8) Close the Device Information dialog box.

When the update has ended successfully, the devices will restart, and the devices in the MTX system will reappear in MTX Editors
Project window.
113
XMV4280/XMV4140
MTX Editor
MTX Editor

MTX Editor
http://proaudio.yamaha.co.jp/
MTX Editor
MTX Firmware MTX Editor >> 7 >>Update Firmware

1 MTX MTX XMV 7 8 OFF

(RESUME )
2 MTX MTX XMV
3 Device Information [Update Firmware]

Update Firmware
MTX XMV
Firmware Data Location

Firmware version

Unit ID ................ UNIT ID
Type ....................
Version ...............
[Update]

[Cancel]

114
XMV4280/XMV4140
5 Update Firmware

6 [Update]

NOTE

7 MTX XMV

NOTE
MTX XMV [ALERT]
[PRESET] 123

8 Device Information
MTX Editor Project MTX
115
XMV4280/XMV4140
Initializing the Internal Memory

Execute the following procedure when you want to return
the internal memory settings to their factoryset state, such as
when the amplifier has been moved to a different location.
1
XMV
1) To initialize the internal memory, power-off the XMV; 7
then set device setup DIP switch 7 to the downward 8 XMV
position and switch 8 to the upward position, and power- [NETWORK][YDIF][PANEL LOCK]
on the XMV.
During initialization, the [NETWORK], [YDIF], and [NETWORK] [YDIF]
[PANEL LOCK] indicators will blink. When initialization
is complete, the [NETWORK] and [YDIF] indicators will
blink.
* When the unit is shipped from the factory, the device
setup DIP switches are all in the upward position.
ON
1 2 3 4 5 6 7 8
[YDIF] indicator [NETWORK] indicator

[YDIF] [NETWORK]
[PANEL LOCK] indicator

[PANEL LOCK]
116
XMV4280/XMV4140
List of command
Command Parameter 1 Parameter 2 Parameter 3 Function
echo on/off - - Echo on/off change.
main_boot_ver - - - Check main CPU boot version number.
main_prog_ver - - - Check main CPU program version number.
sub_ver - - - Check main sub CPU program version number.
mac - - - Check mac address.
sernum - - - Check serial number.
modid - - - Check model ID.
ddr2_addr - - - Start DDR2 address bus inspection.
ddr2_data - - - Start DDR2 data bus inspection.
sram_addr - - - Start SRAM address bus inspection.
sram_data - - - Start SRAM data bus inspection.
rtc - - - Start RTC inspection.
cpld_addr - - - Start CPLD address bus inspection.
cpld_data - - - Start CPLD data bus inspection.
detect_wck - - - Start wordclock inspection.
plllck_cas - - - Start PLL inspection.
- Start LED inspection.
g Start green LED inspection.
r Start red LED inspection.
turnon_pnl - -
o Start orange LED inspection.
y Start yellow LED inspection.
x Start all off LED inspection.
presson_sw - - - Start panel sw inspection.
sys
(Device setup)
dip_sw - - Start dip sw inspection.
amp 1
([SPEAKERS])
rty_sw low - - Start rotary sw inspection.
rotary_enc - - - Start encoder inspection.
battery - - - Start battery inspection.
gpi - - - Start GPI inspection.
0
- -
(off)
1
- -
(Level 1)
2
fan - - Start fan inspection.
(Level 2)
3
- -
(Level 3)
4
- -
(Level 4)
dsp_sdram 1 - - Start DSP SDRAM inspection.
frq_res - - - Change Frequency Response Inspection.
Change Total Harmonics Distortion (1)
thd1 - - -
(100V mode) Inspection.
Change Total Harmonics Distortion (2)
thd2 - - -
(280W/4 mode) Inspection.
Change Output Noise Level (1)
noise_lev1 - - -
Change Output Noise Level (2)
noise_lev2 - - -
117
XMV4280/XMV4140
Command Parameter 1 Parameter 2 Parameter 3 Function

Change Channel Separation (1)
cansep1 - - -
Change Channel Separation (2)
cansep2 - - -
Change Max Output (1)
max_out1 - - -
max_out2 - - -
max_out3 - - -
max_out4 - - -
max_out5 - - -
init_audio - - - Analog inspection prior processing
dig_aud - - - Change Digital Audio Inspection(YDIF).
amp_ini - - - AMP inspection prior processing
0 0
-
(Amp Sheet 1) (OFF Check)
amp_dc_det Start DC-DETECT inspection.
1 1
-
(Amp Sheet 2) (ON Check)
0
(Amp Sheet 1)
amp_err - - Start AMP-ERR inspection.
1
(Amp Sheet 2)
0
(Amp Sheet 1)
amp_mps_ena - - Start MPS-ENABLE inspection.
1
(Amp Sheet 2)
0
(Amp Sheet 1)
amp_mps_wup - - Start MPS-WAKEUP inspection.
1
(Amp Sheet 2)
0 0
amp_mps_ovp - Start MPS-OVP inspection.
1 1
0
(Amp Sheet 1)
i_sense - - Start I-SENSE inspection.
1
(Amp Sheet 2)
0
(Amp Sheet 1)
t_sense - - Start T-SENSE inspection.
1
(Amp Sheet 2)
calb_ini - - - Calibration inspection prior processing
calb_gain_cal - - - Change Gain Calibration inspection.
0-7 0 (+; plus) 0 100

calb_gain_set Set Gain for Gain Calibration.
(Amp Ch) 1 (-: minus) (dB x 100)
calb_gain_fin - - - Finish Gain Calibration inspection.

calb_isen_cal - - - Change I-SENSE Calibration inspection.
calb_isen_fin - - - Finish I-SENSE Calibration inspection.
calb_fin - - - Calibration inspection post processing (Data Write)
0-7
calb_isen_calch - - Calculate Gain for I-SENSE Calibration
(Amp Ch)
calb_isen_finch - - - Finish I-SENSE Calibration inspection
118
XMV4280/XMV4140
1 2 3
echo on/off - - ON/OFF
main_boot_ver - - - Main CPU Boot
main_prog_ver - - - Main CPU Program
sub_ver - - - Sub CPU Program
mac - - - Mac Address
sernum - - - Serial
modid - - - ID
ddr2_addr - - - DDR2 Address Bus
ddr2_data - - - DDR2 Data Bus
sram_addr - - - SRAM Address Bus
sram_data - - - SRAM data Bus
rtc - - - RTC
cpld_addr - - - CPLD Address Bus
cpld_data - - - CPLD Data Bus
detect_wck - - - WORDCLOCK
plllck_cas - - - PLL
- LED
g LED
r LED
turnon_pnl - -
o LED
y LED
x LED
presson_sw - - - PANEL SW
sys
(Device setup)
dip_sw - - Dip SW
amp 1
([SPEAKERS])
rty_sw low - - Rotary SW
rotary_enc - - - Encoder
battery - - - Battery
gpi - - - GPI
0
- -
(off)
1
- -
(Level 1)
2
fan - - FAN
(Level 2)
3
- -
(Level 3)
4
- -
(Level 4)
dsp_sdram 1 - - DSP SDRAM
frq_res - - -
(1)
thd1 - - -
(100V )
(2)
thd2 - - -
(280W/4 )
(1)
noise_lev1 - - -
(100V )
(2)
noise_lev2 - - -
(280W/4 )
119
XMV4280/XMV4140
1 2 3
(1)
cansep1 - - -
(100V )
(2)
cansep2 - - -
(280W/4 )
(1)
max_out1 - - -
(100V )
(2)
max_out2 - - -
(280W/4 )
(3)
max_out3 - - -
(560W/4 )
(4)
max_out4 - - -
(560W/8 )
(4)
max_out5 - - -
(70V )
init_audio - - - Analog
dig_aud - - - (YDIF)
amp_ini - - - AMP
0 0
-
amp_dc_det DC-DETECT
1 1
-
0
(Amp Sheet 1)
amp_err - - AMP-ERR
1
(Amp Sheet 2)
0
(Amp Sheet 1)
amp_mps_ena - - MPS-ENABLE
1
(Amp Sheet 2)
0
(Amp Sheet 1)
amp_mps_wup - - MPS-WAKEUP
1
(Amp Sheet 2)
0 0
amp_mps_ovp - MPS-OVP
1 1
0
(Amp Sheet 1)
i_sense - - I-SENSE
1
(Amp Sheet 2)
0
(Amp Sheet 1)
t_sense - - T-SENSE
1
(Amp Sheet 2)
calb_ini - - - Calibration
calb_gain_cal - - - Gain Calibration
0-7 0 (+; plus) 0 100

calb_gain_set Gain Calibration
(Amp Ch) 1 (-: minus) (dB x 100)
calb_gain_fin - - - Gain Calibration

calb_isen_cal - - - I-SENSE Calibration
calb_isen_fin - - - I-SENSE Calibration
calb_fin - - - Calibration ( )
0-7
calb_isen_calch - - I-SENSE Calibration CH
(Amp Ch)
calb_isen_finch - - - I-SENSE Calibration
120
XMV4280/XMV4140
Alert Numbers and Content

If a problem occurs in the XMV, the [ALERT] indicator will flash and an alert number will appear in the display.
The alert numbers, the corresponding content, and the appropriate actions are listed below.
Alert number Meaning Response

No display Turn the power off, then turn on after waiting at least
(only [ALERT] is lit) The device has not started up correctly. 5 seconds. If this does not solve the problem, please
001.008. initialize the memory.
The internal backup battery has been completely
010.
exhausted or is not installed. When you turn off the power, the current settings will
The internal backup battery has run extremely low, be lost, and will return to the default values. Please
011. and it is possible that the internal memory has been stop use immediately.
cleared.
This does not affect the operation of the device.
The internal backup battery has only a small amount
012. However, if you continue using the device, the settings
of power remaining.
may be lost and reset to the default values.
If this occurs each time you turn on the power, it is
possible that the internal backup battery has run down
A problem has occurred with the internal clock, and it or that the device has malfunctioned. If this occurs
013.
has been initialized (January 1, 2000, 0:00) only once, an abnormality was detected with the clock
setting and it was initialized; use MTX Editor to set the
time.
Either the internal backup battery has run low, or the
015. The settings saved in internal memory have been lost.
device has malfunctioned.
016. A memory problem has occurred.
Make sure that the word clock signal is being input
021. The word clock master has become unlocked.
correctly.
The digital signal being input to the [YDIF IN] connector
022.
is not synchronized to the word clock of this device.
Make sure that YDIF cables are properly connected.
The digital signal being input to the [YDIF IN] connector
Use cables that meet the required specifications.
023. is not continuously synchronized to the word clock of
this device.
There is a problem with the connection of the [YDIF Make sure that YDIF cables are properly connected.
030.
IN] connector. Use cables that meet the required specifications.
Change the IP addresses so that there are no dupli-
040. Duplicate IP addresses.
cates.
Please check rear panel DIP switch 6 (IP Setting). If
041. IP address was not set within 60 seconds of startup. DIP switch 6 is set to PC, use MTX Editor or DHCP
server to specify the device IP address.
Reduce the number of devices connected to the
043. Too many devices are connected to the network.
network.
050. The UNIT ID is set to 00. Set the UNIT ID to something other than 00.
Devices with identical UNIT IDs were found connected
051. Change the UNIT ID so that there are no duplicates.
within the same network.
The power supply was shut down because d.c. was It is likely that the device has malfunctioned; immedi-
100.
detected on a speaker output. ately stop using the device.
Turn the power off, let the power supply cool down,
then turn the power on again. Continuous high-power
The power supply was shut down because its output will cause high temperatures, so please lower
101.
temperature exceeded the allowed limit. the output level. If the temperature is still high, check
whether dirt or a foreign object could have clogged
the cooling fan, and clean the fan if necessary.
121
XMV4280/XMV4140
Alert number Meaning Response

Protection has been activated, and the power supply Continuous high-power output may have activated
103.
was shut down. protection; lower the output level.
For details on the reason that protection was activated,
104. Protection has been activated, and muted.
refer to [PROTECTION] A/B/C/D indicators.
It may be that the speaker output connectors + and
A short circuit was detected in the speaker output
105. - are shorted, or that the connected speaker has
connector, so the output signal has been muted.
malfunctioned.
The temperature of the amp section (heat sink) has Continuous high-power output will cause high
changed, and the speaker output is now ****. temperatures, so please lower the input level or
106. **** = 0dB and OK attenuator. If the temperature is still high, check
-1dB and in protection whether dirt or a foreign object could have clogged
muted and in protection the cooling fans air intake, and clean it if necessary.
The Redundant Backup function has been activated, There is a problem in the digital signal being input to
110.
and the input signal has been switched. the digital signal port.
122
XMV4280/XMV4140
[ALERT]

5
([ALERT]

)

001. 008.

010.

011.

012.

(2000 1
013.
1 0 0 )
MTX Editor

015.

016.

021.

[YDIF IN]
022.

[YDIF IN]

023.

030. [YDIF IN]

040. IP IP
6(IP SETTING)
60 IP
041. PC MTX Editor

DHCP IP

043.

050. UNIT ID 00 UNIT ID 00
UNIT
051. UNIT ID
ID

100.

101.

103.

[PROTECTION] A/B/C/
104.
D
123
XMV4280/XMV4140

105.

( )

(****)

106. **** = 0dB and OK

-1dB and in protection

muted and in protection
Redundant Backup
110.

124
Start up sequence
MAINCPU processing sequence FRONT PANEL display Panel Sub CPU processing sequence Amp Sub CPU processing sequence Power On sequence
(XMV only) (XMV only) (XMV only)
PowerON (Reset)
CPU reset cancelled
UBL (AIS image) by AISboot started

PLL setting
DDR & CS2 address space setting
DDR2 space
UBL RAM copied
Jumping to the top of UBL
U
B UBL program operation by AISboot started
L Program section copied to DDR area
Program section in DDR area checksum judgment
(1) When program checksum result is OK,
Jumping to program start position
(2) When program checksum result is NG,
Boot section copied to DDR area
Boot section in DDR area checksum judgment
When boot section checksum result is OK,
Jumping to boot section start position
When boot section checksum result is NG,
Infinite loop
Execution of boot section in DDR2 started
Procedure common to models

Power start up sequence
CS address space setting Common setting (mmu_cfgtbl) for Hornet which is common to models
Model identified Reading from CPLD
Procedure for each model

CS address space setting Defined using define only (io_ext.h) for Hornet which is free from MAP function overlapping
PSC initialized Mounting policy: Initialization for each model (safe direction)
PINMUX initialized
GGPIO initialized
Bank0 interruption function assigned for each model Mounting policy: Interruption function table assigned for each model
Internal device initialized
External device initialized
SubCPU initialized & initial setting & initial data obtained

SubCPU Reset Power ON (reset) Power ON (reset)
Waiting for specified time (some ms?)
SubCPU resetting cancelled CPU reset cancelled (Operation in internal ROM started) CPU reset cancelled (Operation in internal ROM started)
Waiting for I2C communication preparation time (some ten ms?)
Internal device and external device initialized Inernal device and external device initialized

I2C initial communication

Sub ID setting Host Sub initial communication and Sub ID decided Host Sub initial communication and Sub ID decided
I2C information obtained
Static information (DIP SW, Rotary SW, etc.)obtained Host Sub Static information response Host Sub Static information rsponse
B
O
O
T
Ether initialized
125
XMV4280/XMV4140
126
RTC initialized
System related task started (1) POWER LED ON

B
O
O Module initialized
T
XMV4280/XMV4140
Start up mode decided
Making internal drive

Flash ROM FAT area copied by image to DDR2 FAT area
DDR2FAT area mounted
Front panel display changed Display instructed to scan task by kernel ALERT LED ON
NETWORK LED ON
SubCPU control YDIF LED ON Host Sub Front Panel display control
SCHEDULER LED ON
SD/ACT LED ON
Model operation controlled by device descriptor

Device descriptor loaded
Model's own task wake-up TBL setting
Model's own task wake-up information setting
Slave task started
Execution of program section in DDR2 started
Procedure common to models

CS address space setting Common setting (mmu_cfgtbl) with Hornet
Model identified Reading from CPLD
Procedure for each model

CS address space setting Defined using define only as there is no MAP function overlapping with Hornet (io_ext.h)
PSC initialized Mounting policy: Initialization for each model (safe direction)
P PINMUX initialized
R GPIO initialized
O Bank0 interruption function assigned for each model Mounting policy: Interruption function table assigned for each model
G
(
Internal device initialized
S
y
s External device initialized
t
e
m SubCPU initialized & initial setting & initial data obtained
Sub CPU Reset Power ON (reset) Power ON (reset)
o Waiting for specifed time (some ms?)
p
Sub CPU resetting cancelled CPU Reset cancelled (operation in internal ROM started) CPU Reset cancelled (operation in internal ROM started)
e
Waiting for I2C communication preparation time (some10 ms?)
r
Internal device and external device initialized Internal device and external device initialized
a
t
i
o I2C initial communication
n Sub ID setting Host Sub initial communication and Sub ID decided Host Sub initial communication and Sub ID decided
)
I2C information obtained
Static information (DIP SW, Rotary SW, etc.) obtained Host Sub Static information response Host Sub Static information response
Ether initialized
RTC initialized
System related task started (1) POWER LED ON
Module initialized
Start up mode decided
Making internal drive

Flash ROM FAT area copied by image to DDR2 FAT area
DDR2FAT area mounted
Updating SubCPU LED & 7 SEG display

P SubCPU version information obtained (Do not turn off)
R Version & boot start up check, abnormal information obtained and alert judged Host Sub Static information response Host Sub Static information response
O Updating possibility judged
G Updating executed Host Sub I2C BOOT executed Host Sub I2C BOOT executed
(a) Update mode (LED display, key behavior, etc.)
(
(a') BOOT check if there is no response
S If boot check resulted in a communication error and reception response error, it is removed from the subject range of updating and alert is output.
y Updating is executed with one DCP first (as described in the manual), If still unsuccessful, the unit should be brought in for servicing.
s (b) UBL change command issued
t
(c) Firmware transmission using UBL protocol
e
(d) After completion of transmission, RUN command issued
m
(e) Waiting for SUB start up
o (f) Version confirmed
p Back to and the procedure is repeated by the number of Sub units.
e (g) Completion indicated with LED LED & 7 SEG display
r (h) Main CPU stopped here (OK/NG indicated)
a
t
i Switch check
o
n DIGITAL CONTROL PANEL update processing LED & 7 SEG display
)
DIGITAL CONTROL PANEL Information obtained (Do not turn off)
Version check
Version & boot start up check, abnormal information obtained and alert judged Host Sub Static information response Host Sub Static information response
Updating possibility judged
DIGITAL CONTROL PANEL updating mode (LED display, key behavior, etc.)
Host Sub I2C BOOT executed
(f) Completion indicated with LED? LED & 7 SEG display

(Success/failure indicated)
(g) MAIN CPU stopped here.

Initialization when shipped from factory LED & 7 SEG display
(Do not turn off)
127
XMV4280/XMV4140
128
RAM drive, SRAM initialized
Completion indicated with LED
MAIN CPU stopped here
Front panel display changed Display instructed to scan task by kernel LED & 7 SEG display
P (All lit)
R SubCPU control Host Sub Front Panel display control
O
G
XMV4280/XMV4140
DSP BOOT
(
S SPI mode setting (low speed)
y
AIS image road (low speed transmission)
s
SPI mode setting (high speed)
t
AIS image road (high speed transmission)
e
DSP initial state setting
m
WAIT(min 1sec)
o
p DANTE update check
e (DANTE model only)
r AMP resource initialized
a
t ADC/DAC reset cancelled
i MPX initialized
o EVOL initialized
n
)
Model operation control by device descriptor
Device descriptor loaded
Model's own task wake-up TBL setting
Model's own task wake-up information setting
Slave task started
Basic start up sequence completed
Front panel display updated LED & 7 SEG display

(RESUME indicated)
SubCPU control Host Sub Front Panel display control
P WAIT(min 3sec)
R
O LED & 7 SEG display
G (Normal screen display)
(
T
a LED & 7 SEG display
s
MAC address check (Alert indicated)
k
o
p LED & 7 SEG display
e Battery check (Alert indicated)
r
a
t
i Scene recall LED & 7 SEG display AMP Power ON
o (Normal screen display)
n MPS relay setting
)
Interlocking device control MPS enable setting
AMP enable setting
AMP relay setting
Normal operation started AMP gain setting
DAC mute cancelled

MAIN CPU FRONT PANEL PanelSubCPU AmpSubCPU PowerOn
(XMV) (XMV) (XMV)
PowerON
CPU Reset
AISbootUBL(AISimage)Load
PLL
DDRCS
DDR2
UBLRAM COPY
UBLJUMP
U
B AISbootUBL
L ProgramDDR
ProgramDDR
(1)ProgramOK

Program StartJUMP
(2)ProgramNG
BootDDR
BootDDR
BootOK
Boot StartJUMP
BootNG
Loop
BootDDR2

CS Hornet(mmu_cfgtbl)
CPLD

CS HornetMAPdefine(io_ext.h)
PSC ()
PINMUX
GPIO
Bank0
SubCPU
SubCPU Reset PowerON PowerON
(ms)
SubCPU CPU Reset(ROM CPU Reset(ROM
I2C(ms)

I2C
Sub ID SubSub ID SubSub ID
I2C
Static(DIP SWRotary SW) Sub Static Sub Static
B
O
O
T
Ether
129
XMV4280/XMV4140
130
RTC
B
O
O (1)POWER LED ON
T

XMV4280/XMV4140

FlashROM FATDDR2 FAT
DDR2FAT
FrontPanel ALERT LED ON

NETWORK LED ON
SubCPU YDIF LED ON Sub FronpPanel
SCHEDULER LED ON
SD/ACT LED ON

LOAD
TBL

ProgramDDR2

CS Hornet(mmu_cfgtbl)
CPLD

CS HornetMAPdefine(io_ext.h)
PSC ()
PINMUX
GPIO
Bank0
P
R
O
G
(

SubCPU

SubCPU Reset PowerON PowerON

(ms)

SubCPU CPU Reset(ROM CPU Reset(ROM
)
I2C(ms)

I2C
Sub ID SubSub ID SubSub ID
I2C
Static(DIP SWRotary SW) Sub Static Sub Static
Ether
RTC
(1)POWER LED ON

FlashROM FATDDR2 FAT
DDR2FAT
SubCPU LED&7SEG
SubCPU (Do not turn off)
BOOT Sub Static Sub Static
Update
Update Sub I2C BOOT Sub I2C BOOT
(a)LEDKEY)
P (a')BOOT
R BOOTUpdate
O ()DCPUpdate
G (b)UBL
(
(C)UBL
(d)RUN
(e)SUB
(f)
Sub
(g)LED LED&7SEG
(h)MAIN CPU (/)
)
Switch
LED&7SEG
(Do not turn off)

BOOT Sub Static Sub Static
Update
LEDKEY)
Sub I2C BOOT
(f)LED LED&7SEG
(/)
(g)MAIN CPU
LED&7SEG
RAMSRAM (Do not turn off)
131
XMV4280/XMV4140
132
LED
P MAIN CPU
R
O
G FrontPanel LED&7SEG
(
()
SubCPU Sub FronpPanel

DSP BOOT

XMV4280/XMV4140
)
SPI()
AIS1()
SPI()
AIS2()
DSP
WAIT(min 1sec)
Dante Update
DANTE
AMP
ADC/DAC
MPX
EVOL

LOAD
TBL

FrontPanel LED&7SEG
(RESUME)
SubCPU Sub FronpPanel
WAIT(min 3sec)
LED&7SEG
()
P
R
O LED&7SEG
G
MAC Address (Alert)
(

LED&7SEG
Battery (Alert)

)
LED&7SEG AMP Power ON
()
MPS relay
MPS enable
AMP enable
AMP relay
AMP gain
DAC mute
XMV4280/XMV4140
Ending Sequence after Power OFF

Ending (Returning) Sequence
Power OFF sequence
Power OFF
CPU P_OFF interruption
Processing during interruption

Mute processing (DSP, YDIF IN AND circuit)
DIO task start flag
Memory Backup task start flag
Ending Sequence
Writing newly to SRAM inhibited.

Mute processing (DAC)
2ms wait
MPS _ENA turned off
Timer for Amp sequence setting
DIO task processing Memory Backup task processing DSP task processing (Amp sequence)
Measure against power shutdown started Task priority raised to 5 After 10 msec since Amp sequence
Reset after waiting for 20ms shutdown flag turned on timer setting
1.5s timer started Writing the data which was AMP_ENA turned off
started before P-OFF interruption continued. AMP_RELAY turned off
Return processing Return processing Return processing

Returning Sequence
After 1.5s timer operation is over, After more than 500ms since the shutdown flag After more than 10 msec since ending
Execute unlocking procedure. was turned on sequence
Execute locking procedure. shutdown flag turned off Amplifier start up sequence
(Reset cancelled/Mute cancelled) Inhibition to write neewly to SRAM started
cancelled
133
XMV4280/XMV4140

()
PowerOFF
OFF
CPU P_OFF

Mute (DSP,YDIF IN AND)
DIO
MemoryBackup

SRAM

Mute(DAC)

2ms wait
MPS_ENAOff

Amp

DIO MemoryBackup DSP(Amp)
5 Amp
20msWaitReset ON 10ms
1.5s P-OFF AMP_ENAOFF
AMP_RELAYOFF

1.5s ON500ms 100ms
Unlock OFF
Lock SRAM
(Reset/Mute)

134
XMV4280/XMV4140
CAUTIONS FOR CPU CIRCUIT BOARD REPLACEMENT

This product has an individual MAC address.
The MAC address data is stored in IC304 of the CPU circuit board. The MAC Address has not been written by servicing in the
market.
When replacement of CPU circuit board is necessary while servicing in the market, use the CPU circuit board (for servicing) with
the MAC address written in.
Part number: ZH991100
Description: CPU SHEET ASSEMBLY CS (with MAC address label)
Perform following steps after replacing the CPU circuit board (for servicing).
Check and adjust the operation using the Test Program.
* It is necessary to rewrite the OUTPUT LEVEL, I-SENSE LEVEL data as they are different depending on products.
Explain to your customer that the MAC address has been changed.
Clean the surface of the MAC address label attached to the top cover and attach the MAC address label included in the kit of the
CPU circuit board (for servicing) onto it.
* After replacing any electric part, be sure to check it for proper operation using the Test Program and make
adjustment as necessary.
CPU
MAC
MAC CPU IC304
MAC Address
CPU MAC CPU
ZH991100
CPU Assy CS (with MAC address label)
CPU

OUTPUT LEVELI-SENSE LEVEL
MAC
MAC CPU
MAC
135
POWER AMPLIFIER
PARTS LIST
CONTENTS
OVERALL ASSEMBLY....................................................... 2
FRONT PANEL ASSEMBLY Assy...................... 8
ELECTRICAL PARTS ............................................... 944
Notes : DESTINATION ABBREVIATIONS

A : Australian model M : South African model
B : British model O : Chinese model
C : Canadian model P : Blazillian model
D : German model Q : South-east Asia model
E : European model T : Taiwan model
F : French model U : U.S.A. model
H : North European model V : General export model (110V)
I : Indonesian model W: General export model (220V)
J : Japanese model N,X: General export model
K : Korean model Y : Export model
WARNING
Components having special characteristics are marked and must be replaced with parts having
specification equal to those originally installed.
The numbers QTY show quantities for each unit.

The parts with -- in PART NO. are not available as spare parts.
This mark } in the REMARKS column means these parts are interchangeable.
The second letter of the shaded ( ) part number is O, not zero.
The second letter of the shaded ( ) part number is I, not one.

QTY
PART NO. --
REMARKS }
PART NO. 2
PART NO. 2
XMV4280/XMV4140
OVERALL ASSEMBLY
1420
<Top view / >
1520 x12
1525 x12
1520 x3
1525 x3
1510
790
1170 1230 1180

1230
1180
1170
1230
1140 x3
C
1540 x3
1530
910
1460
1550
1540 x3
Detail C
C 1210
1530
480
460
2
XMV4280/XMV4140
<Bottom view / >
30
x4
30
x4
20
760 770 80
750
50 x2
(PN3)
820 x4
40
670
710
720
620
610
630 1220
640 x4
740
680 x8
700 160
690 x8
800
780
150
10
950
180 x2
740 170 x2
40
(PN2)
140
60 180 x4
950 x5
170 x2
1220
70 x4 170 x2
40
980 (PN1)
60
960 x3 70 x4
910
910
1160
1150
3
XMV4280/XMV4140
<Bottom view / >
310 x3 1000 x12

340 x6
1000 x3
370
x3 210 x3
300 320 250 x6
990
230
330 x9
220 170 x2
130
x2
110
240 x9
(RSW)
170
40 x2
130 x3
170
x2
750 1120
x2
130 x4
1010 x2
720 40
(DSW)
360 x2
760 770
160
120 (IN) 350
150
120
(OUT)
1130 x2
420
450
510 x2
140 430
410
480
460
440 x6
520 x4
500
4
XMV4280/XMV4140
<Top view / >
1230 1180 1170 720 770 760 750 The pressed marking (DANGER HIGH
VOLTAGE - 80V) has been disused
partway in production.
From the beginning of the production,
the voltage is not applied to the heat
1210 sink by specification.
DANGER HIGH
460 370
VOLTAGE -80V

480 790

1210
1150
CHANGE
1210
Delete pressed marking

500 1220 780 800 80 740
<Bottom view / >
710
750
760
770
780 220 500
5
XMV4280/XMV4140
REF NO. PART NO. DESCRIPTION REMARKS QTY RANK

OVERALL ASSEMBLY XMV4280/XMV4140
-- OVERALL ASSEMBLY XMV4280 (ZA41440)
-- OVERALL ASSEMBLY XMV4140 (ZA41450)
10 -- SUB CHASSIS (WZ46320)
* 20 WZ836500 DC FAN RDH8025S1 2
30 WE99920R BIND HEAD SCREW 4.0X35 MFZN2B3 SP 8 01
40 -- CIRCUIT BOARD PN (WZ98630)
* 40a ZF928800 CIRCUIT BOARD DSW (WZ98630)
* 40b ZF928500 CIRCUIT BOARD PN1 (WZ98630)
* 40c ZF928600 CIRCUIT BOARD PN2 (WZ98630)
* 40d ZF928700 CIRCUIT BOARD PN3 (WZ98630)
* 40e ZF928900 CIRCUIT BOARD RSW (WZ98630)
50 WF304800 PW HEAD TAPPING SCREW-S 3.0X6 MFZN2W3 2 01
60 -- GRILL HEXAGON BLACK (ZA15390) 2
70 WE87780R BIND HEAD TAPPING SCREW-S 3.0X6 MFZN2B3 8 01
80 -- FFC GUARD 25X86X0.3 (ZE11450)
* 110 WZ464500 REAR PANEL BLACK 4280 XMV4280
* 110 WZ627500 REAR PANEL BLACK 4140 XMV4140
* 120 WZ986400 CIRCUIT BOARD IO1
120a -- CIRCUIT BOARD IN (WZ98640)
120b -- CIRCUIT BOARD OUT (WZ98640)
140 -- FRAME L LEFT (WZ46330)
150 -- FRAME C CENTER (WZ46340)
160 -- FRAME R RIGHT (WZ46350)
210 -- FRAME PCB PS (WZ46560) 3
220 -- INSULATION SHEET PS2 137X188X0.5 (ZE62190)
* 230 WZ985600 CIRCUIT BOARD PS
300 -- INSULATION SHEET AMP 25X155X0.3 (ZA98510) 3
310 -- FRAME PCB AMP (WZ46570) 3
* 320 WZ985700 CIRCUIT BOARD AMP
350 -- FRAME PCB OUT (ZA10370)
370 ZA955000 CORD CLAMP CS-3U
* 410 WZ466000 FRAME SIDE L BLACK LEFT
420 -- INLET ANGLE 0.8 (WW45400)
* 430 WZ985500 CIRCUIT BOARD SUB
450 WF001900 BIND HEAD SCREW 4.0X8 MFZN2W3 SP 01
460 -- CONNECTOR ASSEMBLY PWR (ZA30700)
480 -- CONNECTOR ASSEMBLY VCC (ZF82630)
* 500 WR750000 FLEX FLAT CABLE C&C 25P 250mm P=1.0
510 WB408000 BINDING TIE GT-100M HUA WEI 2
* 610 WZ466100 FRAME SIDE R BLACK RIGHT
620 VS246400 LITHIUM P-BATTERY CR2450 03
630 -- CIRCUIT BOARD CPU (WZ74110)
* 630 ZH991100 CPU SHEET ASSEMBLY CS CPU CS with MAC address label (YD939C0)
640 -- HEXAGON SPACER STEP H7 (ZD55450) 4
* 670 WZ985800 CIRCUIT BOARD DM
680 -- HEXAGON SPACER H16.5 (WZ70570) 8
* 690 WZ986000 CIRCUIT BOARD ANA1 XMV4280
* 690 ZC366100 CIRCUIT BOARD ANA2 XMV4140
710 ZA955000 CORD CLAMP CS-3U
720 -- CONNECTOR ASSEMBLY IN (ZA31040)
740 -- CONNECTOR ASSEMBLY PN2 (ZA50780)
750 -- CONNECTOR ASSEMBLY RSW (ZA50860)
760 -- CONNECTOR ASSEMBLY DSW1 (ZA50870)
770 -- CONNECTOR ASSEMBLY DSW2 (ZA50880)
* 780 WR750000 FLEX FLAT CABLE C&C 25P 250mm P=1.0
* 790 ZA310200 FFC CABLE 30P 120mm P=1.0
800 -- FLEX FLAT CABLE C&C 11P 200mm P=1.0 (WR73450)
*: New Parts RANK: Japan only
6
XMV4280/XMV4140
* 910 ZA927200 FRONT PANEL ASSEMBLY 4280 XMV4280

* 910 ZA927300 FRONT PANEL ASSEMBLY 4140 XMV4140
950 -- BUTTON-TACT SWITCH BLACK SELECT A-D, (WZ76680) 6
* 950 WZ7668I0 BUTTON-TACT SWITCH BLACK MUTE,FUNCTION 6
980 -- INSULATION SHEET FC2 67X76X0.3 (ZA98520)
* 990 WZ464400 BOTTOM COVER
* 1000 WZ621800 +LAMIMATE SCREW #S 4.0X6 LAMIMATE 15
1010 WF257600 BIND HEAD TAPPING SCREW-S 3.0X12 MFZN2B3 2 01
* 1150 ZF826200 CONNECTOR ASSEMBLY PSW POWER switch
1160 -- PROTECTOR BLACK CF-LA-2KZ2-1C (ZA30200)
* 1160 ZA3020I0 PROTECTOR BLACK CF-LA-2KZ2-1C
1170 -- CONNECTOR ASSEMBLY B (ZA30720)
1180 -- CONNECTOR ASSEMBLY VDR (ZA30730)
1210 WB408000 BINDING TIE GT-100M HUA WEI 7
1220 -- CONNECTOR ASSEMBLY PN1-PN3 (ZE58580)
1230 -- CONNECTOR ASSEMBLY OUT-D WITH CORE (ZG42510)
* 1420 ZF236500 INSULATION SHEET TOP 70X70X0.3
* 1460 ZH744100 CU FOIL TAPE L:7X100
* 1510 WZ466200 TOP COVER BLACK
* 1520 WZ621800 +LAMIMATE SCREW #S 4.0X6 LAMIMATE 15
* 1525 ZG944200 PLASTIC WASHER 15
* 1530 ZA300100 RACK ANGLE BLACK 2
* 1550 ZA244000 KNOB ENCDR BLACK MUTE
ACCESSORIES
WY031400 AC CORD NR VM1093-VM1714 J 08
WC249500 AC CORD U 3P 10A U 05
WC24960R AC CORD E 3P 10A E,K 05
WC24970R AC CORD B H05VV-F 3X1.00 B 06
WD29640R AC CORD CHN RVV 3X1.0 O 06
WU795000 AC CORD BRA 3P 2.5m 10A P 09
-- LABEL NAME PLATE XMV4280 (ZC16520)
-- LABEL NAME PLATE XMV4140 (ZC16530)
WU215000 MINI TERMINAL BLOCK 3P MSTB2.5/3-STZ-5.08 4 05
* WK530400 MINI TERMINAL BLOCK 3P MC420-35003 2
-- SERVICE PARTS KIT (ZF92960)

* 10 ZF928500 CIRCUIT BOARD PN1
10a -- CIRCUIT BOARD PN (WZ98630)
* 40 ZF928800 CIRCUIT BOARD DSW
* 50 ZF928900 CIRCUIT BOARD RSW
JIG
* Z J 0 5 6 2 0 0 METALCLAD WINDING RESISTER IRV150L 80 NG
METALCLAD WINDING RESISTER
7
XMV4280/XMV4140
FRONT PANEL ASSEMBLYAssy
30 30a
40
20
30 30a
20
10
30 30a
* ZG190900 by separating this parts at hinge A
are LENS 1P: ZG19100.
ZG190900 A
1P: ZG19100
A
LED LENS 2P (ZG190900) LED LENS 1P (ZG19100)

FRONT PANEL ASSEMBLY XMV4280/XMV4140

* ZA927200 FRONT PANEL ASSEMBLY 4280 XMV4280

* ZA927300 FRONT PANEL ASSEMBLY 4140 XMV4140

10 -- FRONT PANEL GRAY SILVER 4280 XMV4280 (ZC87410)
10 -- FRONT PANEL GRAY SILVER 4140 XMV4140 (ZC87420)
20 -- ADHESIVE TAPE NITTO #500 50X5 (ZA69360) 5
* 30 ZG190900 LED LENS 2P SELECT A-D,MUTE,SIGNAL, 13
LIMIT,PROTECTION,POWER,
ALERT,NETWORK,YDIF,
PANEL LOCK
30a -- LED LENS 1P (ZG19100)
* 40 ZA597000 7SEG COVER
8
XMV4280/XMV4140
ELECTRICAL PARTS
AMP
ELECTRICAL PARTS XMV4280/XMV4140
* WZ985700 CIRCUIT BOARD AMP (YD913G0)
* WZ986000 CIRCUIT BOARD ANA1 XMV4280 (YE011D0)
* ZC366100 CIRCUIT BOARD ANA2 XMV4140 (YE011D0)
-- CIRCUIT BOARD CPU (WZ74110)(YD939C0)
* ZH991100 CPU SHEET ASSEMBLY CS CPU CS with MAC address label (YD939C0)
* WZ985800 CIRCUIT BOARD DM (YE010H0)
* WZ986400 CIRCUIT BOARD IO1 (YE015D0)
-- CIRCUIT BOARD IN (WZ98640)(YE015D0)
-- CIRCUIT BOARD OUT (WZ98640)(YE015D0)
-- CIRCUIT BOARD PN (WZ98630)(YE014E0)
* ZF928800 CIRCUIT BOARD DSW (WZ98630)(YE014E0)
* ZF928500 CIRCUIT BOARD PN1 (WZ98630)(YE014E0)
* ZF928900 CIRCUIT BOARD RSW (WZ98630)(YE014E0)
* WZ985600 CIRCUIT BOARD PS (YD895E0)
* WZ985500 CIRCUIT BOARD SUB (YD894D0)
* WZ985700 CIRCUIT BOARD AMP (YD913G0)

ZD566400 PAN HEAD SCREW 3.0X12 MFZN2W3 SP D6 16
* ZA579300 INSULATED BUSH PBT 16
* ZA381000 T.H SHEET AMP WHITE 4
* C136 WZ846100 ELECTROLYTIC CAPACITOR 390.00 100.0V TE
* -139 WZ846100 ELECTROLYTIC CAPACITOR 390.00 100.0V TE
* C140 WZ308000 CAPCITOR POLYPROPYLEN 0.6800 250V J FC
* -186 WZ846100 ELECTROLYTIC CAPACITOR 390.00 100.0V TE
CN105 LB93203R CONNECTOR VH 3P TE 01
CN106 VB39080R CONNECTOR PH 12P TE 01
CN107 V8637500 STYLE PIN V863750 L=50 #18
CN108 V8637500 STYLE PIN V863750 L=50 #18
K101 -- HEAT SINK ASSEMBLY AMP L63 (ZA77720)
* L101 WZ308500 COIL 7G23B-220M-R
* L102 WZ308500 COIL 7G23B-220M-R
* L103 WZ451900 COIL PI-OR002-0343 TATE
* L301 WZ308500 COIL 7G23B-220M-R
* L302 WZ308500 COIL 7G23B-220M-R
* L401 WZ308500 COIL 7G23B-220M-R
* L402 WZ308500 COIL 7G23B-220M-R
* L501 WZ308500 COIL 7G23B-220M-R
* L502 WZ308500 COIL 7G23B-220M-R
* Q105 WZ107300 MOSFET IRFB4020PBF SUTO
9
XMV4280/XMV4140
AMP
* -108 WZ107300 MOSFET IRFB4020PBF SUTO

RY101 WJ122400 RELAY 981-2A-24DS-SP7 24V 04
RY401 WJ122400 RELAY 981-2A-24DS-SP7 24V 04
W101 -- CONNECTOR ASSEMBLY ISEN (ZA31590)
C101 WU447000 CERAMIC CAPACITOR (CHIP) 0.1000 50V K RECT.
C103 US061330 CERAMIC CAPACITOR (CHIP) 33P 50V J RECT.
C107 WU188700 CERAMIC CAPACITOR (CHIP) 1000P 50V J KAKUTE 01
-111 WU188700 CERAMIC CAPACITOR (CHIP) 1000P 50V J KAKUTE 01
* C112 WZ333300 MONOLITHIC CERAMIC CAP(CHIP) 22.0 10V K TE
* -115 WZ333300 MONOLITHIC CERAMIC CAP(CHIP) 22.0 10V K TE
C118 WF547900 CERAMIC CAPACITOR (CHIP) 10.000 25V K KAKUT 01
C150 US642180 CERAMIC CAPACITOR (CHIP) 180P 25V J RECT. 01
* C345 ZJ544000 CERAMIC CAPACITOR (CHIP) 1800P 50V F 1608 T
10
XMV4280/XMV4140
AMP
C602 US035100 CERAMIC CAPACITOR (CHIP) 0.1000 16V K RECT.
C603 US046100 CERAMIC CAPACITOR (CHIP) 1.00 25V K RECT. 01
-636 US035100 CERAMIC CAPACITOR (CHIP) 0.1000 16V K RECT.
* CN601 ZC316200 FMN CONNECTOR FMN 30P TE
CN603 WC233100 CONNECTOR SH 08P TE
D104 WN348700 DIODE (CHIP) CRH01(TE85L,Q)
-107 WN348700 DIODE (CHIP) CRH01(TE85L,Q)
D402 WW783900 SWITCHING DIODES (CHIP) 1SS355VM 01
D601 WJ871600 SCHOTTKY BARRIER DIODE KDR357-RTK/P 01
-608 WJ871600 SCHOTTKY BARRIER DIODE KDR357-RTK/P 01
* IC102 YD734A00 IC IRS2092STRPBF PROTECTED DIGITAL AUDIO AMP
IC104 X3505A00 IC NJM2068M-D(TE2) OP AMP
* IC105 YE141A00 IC NJM319V VOLTAGE COMPARATOR
IC601 XR680A00 IC TC7SH08FU(TE85L,JF) AND 01
IC602 YD930A00 IC LM3S808-IQN50-C2T MICROCONTROLLER 06
IC604 XU797B00 IC TC74VHC245FT TRANSCEIVER
IC605 X3540A00 IC SN74AHC1G126DCKR BUFFER 01
IC605 X8379A00 IC TC7SH126FU(TE85L,F)
IC606 X3540A00 IC SN74AHC1G126DCKR BUFFER 01
IC606 X8379A00 IC TC7SH126FU(TE85L,F)
* IC607 X7582A00 IC R3112N301C-TR-F VOLTAGE DETECTOR
IC608 X4137A00 IC SN74AHC1G04DCKR INVERTER
IC608 XS775A0R IC TC7SH04FU(TE85L,JF) 01
L601 V804510R SOLID INDUCTANCE (CHIP) BLM18BB121SN1D 01
-618 V804510R SOLID INDUCTANCE (CHIP) BLM18BB121SN1D 01
Q101 VV655400 DIGITAL TRANSISTOR (CHIP) DTC114EKA TP
Q102 WJ466300 TRANSISTOR (CHIP) 2SA2094TL Q TA 01
* Q104 WZ463700 FET (CHIP) RSE002P03TL TE
Q309 VV556400 TRANSISTOR (CHIP) 2SC2412K Q,R,S TP
11
XMV4280/XMV4140
AMP
R103 RD357220 CARBON RESISTOR (CHIP) 22.0K 63M J RECT.
R106 RF35682R CARBON RESISTOR (CHIP) 8.2K D 1608 01
R108 RF355270 CARBON RESISTOR (CHIP) 270.0 D 1608
R115 RD356121 CARBON RESISTOR (CHIP) 1.2K 63M J RECT. 01
R118 ZG423000 CARBON RESISTOR (CHIP) 100K 1/4 J TP 01
R131 RD154100 CARBON RESISTOR (CHIP) 10.0 1/4 J TP
R137 RD153470 CARBON RESISTOR (CHIP) 4.7 1/4 J TP 01
R150 WU822700 CARBON RESISTOR (CHIP) 33.0 1W 5%:J 5025
-157 WU822700 CARBON RESISTOR (CHIP) 33.0 1W 5%:J 5025
* R171 WY216800 CARBON RESISTOR (CHIP) 3.3K 1W J 5025
R196 RF458470 CARBON RESISTOR (CHIP) 470.0K D RECT.
R203 RD355560 CARBON RESISTOR (CHIP) 560.0 63M J RECT.
R206 RF356270 CARBON RESISTOR (CHIP) 2.7K D 1608
R207 RF35456R CARBON RESISTOR (CHIP) 56.0 D 1608
R313 RD355221 CARBON RESISTOR (CHIP) 220.0 63M J RECT. 01
12
XMV4280/XMV4140
AMP
13
XMV4280/XMV4140
AMP
-607 RD354330 CARBON RESISTOR (CHIP) 33.0 63M J RECT.
RA601 WH211800 RESISTOR ARRAY 10K X 4 01
-605 WH211800 RESISTOR ARRAY 10K X 4 01
TH001 WY216000 THERMISTOR (CHIP) NCP18XW223J03RB 22 01
-003 WY216000 THERMISTOR (CHIP) NCP18XW223J03RB 22 01
VR101 ZF501400 VR TRIMMER B 22.0K FUSE 3P VG 01
* X601 WT791900 RESONATOR QUARTZ 7.3728MHz DSO321SR
C105 UR847220 ELECTROLYTIC CAPACITOR 22.00 25.0V RX TP
C119 WF20440R ELECTROLYTIC CAPACITOR 22 25.0V TE 01
-122 WF20440R ELECTROLYTIC CAPACITOR 22 25.0V TE 01
14
XMV4280/XMV4140
AMP
L104 GE300610 FERRITE BEAD BL02RN1R2P1A RX T
C123 WJ592700 MONOLITHIC CERAMIC CAP(CHIP) 100P 250V J KAKUTE 01
-126 WJ592700 MONOLITHIC CERAMIC CAP(CHIP) 100P 250V J KAKUTE 01
C131 VZ420800 MONOLITHIC CERAMIC CAP(CHIP) 0.100 100V K RECT. 01
-134 VZ420800 MONOLITHIC CERAMIC CAP(CHIP) 0.100 100V K RECT. 01
* C149 ZA113100 CERAMIC CAPACITOR (CHIP) 3300P 50V J KAKUTE
C158 WU839400 CERAMIC CAPACITOR (CHIP) 1800P 50V J 1608 T
C177 WB98550R MONOLITHIC CERAMIC CAP(CHIP) 0.100 250V B RECT 01
-180 WB98550R MONOLITHIC CERAMIC CAP(CHIP) 0.100 250V B RECT 01
-453 WB98550R MONOLITHIC CERAMIC CAP(CHIP) 0.100 250V B RECT 01
15
XMV4280/XMV4140
AMP
L637 VU95400R SOLID INDUCTANCE (CHIP) BLM21PG300SN1D 01
Q116 WQ863800 TRANSISTOR (CHIP) 2SA1721-O(TE85L,F) 01
-119 WQ863800 TRANSISTOR (CHIP) 2SA1721-O(TE85L,F) 01
* R120 RD158180 CARBON RESISTOR (CHIP) 180K 1/4 J TP
-144 RD154100 CARBON RESISTOR (CHIP) 10.0 1/4 J TP
16
XMV4280/XMV4140
AMP
R224 RD15310R CARBON RESISTOR (CHIP) 1.0 1/4 J TP 01
-241 RD356470 CARBON RESISTOR (CHIP) 4.7K 63M J RECT.
17
XMV4280/XMV4140
AMP

18
XMV4280/XMV4140
AMP & ANA1/ANA2

* WZ986000 CIRCUIT BOARD ANA1 XMV4280 (YE011D0)

* ZC366100 CIRCUIT BOARD ANA2 XMV4140 (YE011D0)
CN103 -- FEMALE HEADER GSHD206 12P TE (WZ79690)
CN301 -- FEMALE HEADER GSHD206 32P TE (WZ79680)
CN603 -- FEMALE HEADER CSHF106 9P TE (WF54540)
C101 UF03722R ELECTROLYTIC CAP. (CHIP) 22 16V 01
-104 UF03722R ELECTROLYTIC CAP. (CHIP) 22 16V 01
C109 UF038100 ELECTROLYTIC CAP. (CHIP) 100 16V
-111 UF038100 ELECTROLYTIC CAP. (CHIP) 100 16V
C151 V 8 0 8 5 4 0 0 CERAMIC CAPACITOR (CHIP) 0.1000 25V K RECT.
19
XMV4280/XMV4140
ANA1/ANA2
C386 V8085400 CERAMIC CAPACITOR (CHIP) 0.1000 25V K RECT.
C603 WM489900 CERAMIC CAPACITOR (CHIP) 10.0000 35V M KAKU
CN101 VR134600 CONNECTOR PH 9P SE 01
CN601 WE86450R FFC CONNECTOR 52271SERIES 25P 02
CN602 V291570R CONNECTOR S3B-PH-SM3-TB SE
CN604 WA598400 CONNECTOR SH 04P SE
CN606 WJ853500 FFC CONNECTOR 52271-3079 P=1mm 03
D601 V2330500 SCHOTTKY BARRIER DIODE DE5S4M 03
D602 VS597600 DIODE (CHIP) RB160L-40 TE25 TP
-606 VS597600 DIODE (CHIP) RB160L-40 TE25 TP
DA501 WY281800 DIODE ARRAY DB3J314F0L 0.15A X 01
-504 WY281800 DIODE ARRAY DB3J314F0L 0.15A X 01
IC314 XS790A00 IC TC74HC4052AF(EL,F) MULTIPLEXER
IC315 XS790A00 IC TC74HC4052AF(EL,F) MULTIPLEXER
* IC602 YD986A00 IC NJM79L07UA(TE1) REGULATOR -7V
* IC603 YD985A00 IC NJM78L07UA(TE1) REGULATOR +7V
IC604 X4453A00 IC SN74LVC1G17DCKR BUFFER
L607 V718510R COIL 10uH CDRH125-100MC SMD 03
20
XMV4280/XMV4140
ANA1/ANA2
-484 RF35618R CARBON RESISTOR (CHIP) 1.8K D 1608 01
R609 RD15515R CARBON RESISTOR (CHIP) 150.0 1/4 J TP
R700 RD350000 CARBON RESISTOR (CHIP) 0 63M J RECT. XMV4280
R701 RD350000 CARBON RESISTOR (CHIP) 0 63M J RECT. XMV4140
RA603 RE044330 RESISTOR ARRAY 33X4
C139 WB57420R POLYESTER FILM CAP. (CHIP) .00022 50V J RECT. 01
C143 WB57250R POLYESTER FILM CAP. (CHIP) 0.0100 16V J RECT. 01
C163 US135220 CERAMIC CAPACITOR (CHIP) 0.2200 16V Z RECT.
-223 V8085400 CERAMIC CAPACITOR (CHIP) 0.1000 25V K RECT.
C354 WB575100 POLYESTER FILM CAP. (CHIP) 0.0012 50V J RECT.
-357 WB575100 POLYESTER FILM CAP. (CHIP) 0.0012 50V J RECT.
-365 WB57420R POLYESTER FILM CAP. (CHIP) .00022 50V J RECT. 01
21
XMV4280/XMV4140
ANA1/ANA2
C509 US063150 CERAMIC CAPACITOR (CHIP) 1500P 50V K RECT.
-512 US063150 CERAMIC CAPACITOR (CHIP) 1500P 50V K RECT.
-520 US062390 CERAMIC CAPACITOR (CHIP) 390P 50V J RECT.
C525 US06333R CERAMIC CAPACITOR (CHIP) 3300P 50V K RECT. 01
-528 US06333R CERAMIC CAPACITOR (CHIP) 3300P 50V K RECT. 01
DA101 V9424900 DIODE ARRAY 1SS372 TE85L 01
-104 V9424900 DIODE ARRAY 1SS372 TE85L 01
DA109 V9424900 DIODE ARRAY 1SS372 TE85L 01
-112 V9424900 DIODE ARRAY 1SS372 TE85L 01
* IC101 YE298A00 IC NJW1195AV(TE1) ELECTRONIC VOLUME
IC107 X6872A00 IC PCM1804DBR ADC 07
IC108 X6872A00 IC PCM1804DBR ADC 07
IC115 XV891B00 IC TC74VHC08FT(EL,K) AND 01
IC310 X8324A00 IC AK4396VF-E2 DAC 06
IC311 X8324A00 IC AK4396VF-E2 DAC 06
* IC318 YD961A00 IC SN74AHCT595PWR SHIFT REGISTER
IC505 X7357A00 IC PCM1803DBR A/D CONVERTER 04
IC505 X7357B00 IC PCM1803ADBR 03
IC506 X7357A00 IC PCM1803DBR A/D CONVERTER 04
IC506 X7357B00 IC PCM1803ADBR 03
IC601 YE543A00 IC SI-8005Q-TL DC-DC CONVERTER
-606 VU95400R SOLID INDUCTANCE (CHIP) BLM21PG300SN1D 01
-616 VU95400R SOLID INDUCTANCE (CHIP) BLM21PG300SN1D 01
22
XMV4280/XMV4140
ANA1/ANA2
-118 RF357100 CARBON RESISTOR (CHIP) 10.0K D 1608
-328 RF355100 CARBON RESISTOR (CHIP) 100.0 D 1608
R394 RF356270 CARBON RESISTOR (CHIP) 2.7K D 1608 XMV4280
R394 RF35639R CARBON RESISTOR (CHIP) 3.9K D 1608 XMV4140 01
23
XMV4280/XMV4140
ANA1/ANA2
R426 RF355430 CARBON RESISTOR (CHIP) 430.0 D 1608 XMV4280
R427 RF35456R CARBON RESISTOR (CHIP) 56.0 D 1608 XMV4140 01
R525 RF356330 CARBON RESISTOR (CHIP) 3.3K D RECT
-528 RF356330 CARBON RESISTOR (CHIP) 3.3K D RECT
-536 RF356330 CARBON RESISTOR (CHIP) 3.3K D RECT
-544 RD358100 CARBON RESISTOR (CHIP) 100.0K 63M J RECT. 01
24
XMV4280/XMV4140
ANA1/ANA2 & CPU

R608 RD350000 CARBON RESISTOR (CHIP) 0 63M J RECT.
RA601 WH205800 RESISTOR ARRAY 33 X 4 01
TR601 VV655000 DIGITAL TRANSISTOR (CHIP) DTA114EKA TP
TR602 VV92540R TRANSISTOR (CHIP) 2SC2712-GR(TE85L,F) 01
-- CIRCUIT BOARD CPU (WZ74110)(YD939C0)

* ZH991100 CPU SHEET ASSEMBLY CS CPU CS with MAC address label (YD939C0)
* BT201 WZ864800 BATTERY HOLDER BH-50N
IC304 -- IC MX29LV640EBTI-70G FLASH ROM 64M (YE527E0)
-132 US625100 CERAMIC CAPACITOR (CHIP) 0.100 10V K RECT. 01
C154 WD758300 CERAMIC CAPACITOR (CHIP) 10U 10V K RECT.
D201 V2376600 SCHOTTKY BARRIER DIODE (CHIP) RB500V-40 TAPING
EM301 ZC805200 EMI FILTER (CHIP) 31PT222Z1E9L TP 01
-303 ZC805200 EMI FILTER (CHIP) 31PT222Z1E9L TP 01
IC001 -- IC AM1808BZWT3 MICROPROCESSOR (YD828A0)
IC107 -- IC NT5TU32M16DG-AC DDR2 SDRAM 512M (YC245B0)
IC206 X2548A00 IC RTC-4543SA REAL TIME CLOCK
IC305 X6170A00 IC IS62WV12816BLL-55T SRAM 2M(128KX16) 06
IC306 X5647A00 IC SN74LV32APWR OR
IC308 X3693A00 IC SN74LV245APWR TRANSCEIVER
-312 X3693A00 IC SN74LV245APWR TRANSCEIVER
-250 RD350000 CARBON RESISTOR (CHIP) 0 63M J RECT.
25
XMV4280/XMV4140
CPU
-110 WH205400 RESISTOR ARRAY 22 X 4 01
* X101 WZ621900 RESONATOR QUARTZ 25MHz DSO321SN
26
XMV4280/XMV4140
CPU & DM
* CN102 WA599000 CONNECTOR SH 10P SE
CN301 WF02510R CONNECTOR 53481 180P TE 07
* IC101 X7582A00 IC R3112N301C-TR-F VOLTAGE DETECTOR
IC203 XR532A00 IC NJM2904V(TE1) OP AMP
IC302 XS775A0R IC TC7SH04FU(TE85L,JF) INVERTER 01
L101 V2449900 INDUCTOR (CHIP) BLM21PG600SN1D 01
-104 V2449900 INDUCTOR (CHIP) BLM21PG600SN1D 01
R114 RA155100 METAL FILM RESISTOR (CHIP) 100.0 63M D RECT.
R115 RA155100 METAL FILM RESISTOR (CHIP) 100.0 63M D RECT.
R126 RA156100 METAL FILM RESISTOR (CHIP) 1.0K 63M D RECT.
R127 RA156100 METAL FILM RESISTOR (CHIP) 1.0K 63M D RECT.
R214 RA158100 METAL FILM RESISTOR (CHIP) 100.0K 63M D RECT. 01
R215 RA158100 METAL FILM RESISTOR (CHIP) 100.0K 63M D RECT. 01
TR202 WF688500 DIGITAL TRANSISTOR (CHIP) KRC119S RTK/P 01
* WZ985800 CIRCUIT BOARD DM (YE010H0)

* CN603 WZ796600 PIN HEADER GPHA202 32P TE
JK301 WB55680R MODULAR JACK AJ-008SH-8-F-4-B1 NETWORK 03
JK601 WB55680R MODULAR JACK AJ-008SH-8-F-4-B1 YDIF IN 03
JK602 WB55680R MODULAR JACK AJ-008SH-8-F-4-B1 YDIF OUT 03
27
XMV4280/XMV4140
DM
C150 UF018100 ELECTROLYTIC CAP. (CHIP) 100 6.3V
C301 V7658000 MONOLITHIC CERAMIC CAP(CHIP) 1000P 2KV K RECT.
-304 V7658000 MONOLITHIC CERAMIC CAP(CHIP) 1000P 2KV K RECT.
C312 WJ932600 CERAMIC CAPACITOR (CHIP) 2.2 6.3V M KAKUTE 01
C507 US06127R CERAMIC CAPACITOR (CHIP) 27P 50V J RECT. 01
C508 WQ757300 CERAMIC CAPACITOR (CHIP) 47 6.3V M RECT.
C510 UF018100 ELECTROLYTIC CAP. (CHIP) 100 6.3V
C516 WQ614300 CERAMIC CAPACITOR (CHIP) 22 10V M RECT.
28
XMV4280/XMV4140
DM
C602 WQ841000 MONOLITHIC CERAMIC CAP(CHIP) 100.000 6.3V M KAK
C608 WQ841000 MONOLITHIC CERAMIC CAP(CHIP) 100.000 6.3V M KAK
CN601 V5117500 FFC CONNECTOR 52271-1179 01
CN602 VT389100 CONNECTOR PH 10P TE
CN606 WD736900 CONNECTOR PH 14P TE 04
CN607 VT389400 CONNECTOR PH 13P TE 02
D101 ZA145200 SCHOTTKY BARRIER DIODE (CHIP) RB162M-40TR TE 01
-404 ZC805200 EMI FILTER (CHIP) 31PT222Z1E9L TP 01
FT501 WS625500 FET (CHIP) RZR020P01TL 01
* FT501 ZC874700 FET (CHIP) PMV48XP
IC101 X0176D00 IC W9864G2IH-7 SDRAM 64M
IC102 -- IC D81YK113DZKB400 DSP (YD428D0)
* IC103 YE044A00 IC R3112N111C-TR-FE VOLTAGE DETECTOR
* IC104 YE042A00 IC RP131H121D5-T1-FE REGULATOR +1.25V
IC303 YD367B00 IC KSZ8051RNL PHY 03
IC311 YC226A00 IC TC7SG34FU(TE85L,F) NON-INVERTER
* IC402 YE221B00 IC LCMXO2280C-3TN144C CPLD
* IC407 YE777A00 IC AM26LV31EIPWR LINE DRIVER
* IC410 YE778A00 IC AM26LV32EIPWR LINE RECEIVER
* IC505 YE041A00 IC TC7WG08FK(TE12L,F) AND
IC506 YC234A00 IC EN5337QI-T DC-DC CONVERTER 07
* IC507 YE042A00 IC RP131H121D5-T1-FE REGULATOR +1.25V
L301 WR355200 COMMON MODE FILTER (CHIP) ACM2012-900-2P-T002 01
L302 WR355200 COMMON MODE FILTER (CHIP) ACM2012-900-2P-T002 01
L401 V858970R INDUCTOR (CHIP) 330U SLF7045T-331M 02
* L603 ZD273700 CHOKE COIL (CHIP) DLW21SN181SQ2L
* -605 ZD273700 CHOKE COIL (CHIP) DLW21SN181SQ2L
R101 RD35482R CARBON RESISTOR (CHIP) 82.0 63M J RECT. 01
29
XMV4280/XMV4140
DM
-304 RD350000 CARBON RESISTOR (CHIP) 0 63M J RECT.
-332 RD35439R CARBON RESISTOR (CHIP) 39.0 63M J RECT. 01
30
XMV4280/XMV4140
DM
R632 RD35482R CARBON RESISTOR (CHIP) 82.0 63M J RECT.
R635 V270320R INDUCTOR (CHIP) BLM18BB221SN1D
RA402 WH211000 RESISTOR ARRAY 4.7K X 4 01
SW401 WM891201 SLIDE SWITCH CHS-04TA2 05
T301 X6230A00 FILTER MODULE H1102NLT 05
X301 WN322500 RESONATOR QUARTZ 50MHz SG-310SCN
X401 WM885900 RESONATOR QUARTZ 49.152MHz SG-310SCN 03
X402 WM885800 RESONATOR QUARTZ 45.1584MHz SG-310SCF 03
31
XMV4280/XMV4140
DM
C424 V6200900 POLYESTER FILM CAP. (CHIP) 1.0000 16V M RECT 01
CN502 -- CONNECTOR 52760 180P TE (WZ72290)
D402 WG139300 DIODE (CHIP) KDS4148U-RTK/P TE
-605 V2376600 SCHOTTKY BARRIER DIODE (CHIP) RB500V-40 TAPING
IC401 XT744B0R IC TC74VHCT245AFT TRANSCEIVER 02
IC404 X8690A00 IC TLC2932AIPWR PLL 05
IC409 XY806A0R IC TC7WH14FU(TE12L,F) INVERTER 02
IC412 X7285A00 IC TC7SH00FU NAND GATE
IC414 X6158A00 IC BD5228G-TR VOLTAGE DETECTOR 01
IC501 X5135A00 IC SN74LV574APWR D-FF
IC502 XW633A0R IC TC7SH32FU(TE85L,JF) OR 01
-511 XU797B00 IC TC74VHC245FT TRANSCEIVER
IC512 X2377A0R IC SN74LV21APWR AND 01
IC513 X2377A0R IC SN74LV21APWR AND 01
IC612 XY806A0R IC TC7WH14FU(TE12L,F) INVERTER 02
32
XMV4280/XMV4140
DM & IO1
-663 RD15533R CARBON RESISTOR (CHIP) 330.0 1/4 J TP 01
* X101 WZ621900 RESONATOR QUARTZ 25MHz DSO321SN
* WZ986400 CIRCUIT BOARD IO1 (YE015D0)

-- CIRCUIT BOARD IN (WZ98640)(YE015D0)
-- CIRCUIT BOARD OUT (WZ98640)(YE015D0)
CN701 VB85880R CONNECTOR PH 9P SE 01
CN703 WW736500 MINI TERMINAL BLOCKS 6P MSTBA2.5/6-G-5.08 INPUT C/D 06
CN704 WW736500 MINI TERMINAL BLOCKS 6P MSTBA2.5/6-G-5.08 INPUT A/B 06
CN705 V8637500 STYLE PIN V863750 L=50 #18
33
XMV4280/XMV4140
IO1 & PN (DSW/PN1/PN2/PN3/RSW)

CN803 -- TERMINAL OTHERS DT-55-B14W-08 SPEAKERS A/B/C/D (WZ97550)
CN804 V8637500 STYLE PIN V863750 L=50 #18
K1 -- INPUT ANGLE (WZ98700)
K3 -- OUT4 ANGLE (WZ98720)
* L801 WZ858700 COMMON MODE COIL SFC20C-12-R06T TAT
* -804 WZ858700 COMMON MODE COIL SFC20C-12-R06T TAT
C714 UF057220 ELECTROLYTIC CAP. (CHIP) 22 35V 01
-721 UF057220 ELECTROLYTIC CAP. (CHIP) 22 35V 01
-740 WU447000 CERAMIC CAPACITOR (CHIP) 0.1000 50V K RECT.
EM701 WW443900 FILTER EMI (CHIP) NFM41CC102R2A3L SM 02
EM703 WW443900 FILTER EMI (CHIP) NFM41CC102R2A3L SM 02
-709 WW443900 FILTER EMI (CHIP) NFM41CC102R2A3L SM 02
C801 WK413800 MONOLITHIC CERAMIC CAP(CHIP) 1000P 250V J RECT. 01
-808 WK413800 MONOLITHIC CERAMIC CAP(CHIP) 1000P 250V J RECT. 01
-710 WG139300 DIODE (CHIP) KDS4148U-RTK/P TE
-- CIRCUIT BOARD PN (WZ98630)(YE014E0)

* ZF928800 CIRCUIT BOARD DSW (WZ98630)(YE014E0)
* ZF928900 CIRCUIT BOARD RSW (WZ98630)(YE014E0)
* CN301 ZA148300 FPC CONNECTOR 52030 11P TE
CN303 VB390000 CONNECTOR PH 4P TE
CN501 VE35260R CONNECTOR PH 14P TE 01
CN601 WK530300 MINI TERMINAL BLOCK 3P ME030-35003 FAULT OUTPUT 02
CN602 WK530300 MINI TERMINAL BLOCK 3P ME030-35003 REMOTE 02
CN603 VB858400 CONNECTOR PH 5P SE
CN604 VK015400 CONNECTOR PH 13P SE
CN605 V8637500 STYLE PIN V863750 L=50 #18
EC301 WW660200 ROTARY ENCODER XRE0125PVB15RINB1 MUTE
K501 -- SCREW TERMINAL H8 0.8 C (WZ98680)
K502 -- SCREW TERMINAL H8 0.8 C (WZ98680)
K601 WR364700 SCREW TERMINAL M3 RX-V465SZ 01
K602 WR364700 SCREW TERMINAL M3 RX-V465SZ 01
K603 -- CNT ANGLE (WZ98690)
34
XMV4280/XMV4140
PN (DSW/PN1/PN2/PN3/RSW)
RY601 VU685601 RELAY DC NA- 5 W-K 5V 2A 04
* SW502 ZA379700 ROTARY SWITCH S-1010AW UNIT ID
SW505 VQ949900 DIP SWITCH SSGM180100 UNIT ID,LED DIMMER,
PANEL LOCK,IP SETTING,
START UP MODE
SW601 WQ450000 DIP SWITCH CFP-0812MC SETUP PER 2CH 05
C330 WS575100 NIOBIUM OXIDE CAPACITORS (CHIP) 47 6.3V NOJB476M006R
* C331 WN945600 NIOBIUM OXIDE CAPACITORS (CHIP) 100 6.3V NOJC107M006
C804 WJ343900 CERAMIC CAPACITOR (CHIP) 0.33 10V K RECT.
D601 VS20110R DIODE (CHIP) D1F60 1A 600V TP 01
-603 VS20110R DIODE (CHIP) D1F60 1A 600V TP 01
* D802 WZ497600 SCHOTTKY BARRIER DIODE (CHIP) RB055L-40 TE
* -308 ZC874700 FET (CHIP) PMV48XP
IC302 YD930A00 IC LM3S808-IQN50-C2T MICROCONTROLLER 06
IC303 XV892B00 IC TC74VHC74FT(EL,K) D-FF 01
IC304 XV890B0R IC TC74VHC14FT-ELK INVERTER 01
* IC306 YE431A00 IC SN74LV161ADGVR BINARY COUNTER
* IC307 YE429A00 IC SN74LV138ADGVR DECODER
* IC501 YE137A00 IC TC74VHC245FK TRANSCEIVER
* IC504 YE137A00 IC TC74VHC245FK TRANSCEIVER
IC701 YC111A00 IC YLD330-EZE2 LED DRIVER
* L302 ZC977800 INDUCTOR (CHIP) 47U SLF7045T-470MR
L801 V718510R COIL 10uH CDRH125-100MC SMD 03
LD301 WW948900 LED (CHIP) ORANGE SML-D12D8WT86(R/S) SELECT A PROTECTION
LD303 WW948900 LED (CHIP) ORANGE SML-D12D8WT86(R/S) SELECT B PROTECTION
LD305 WW948900 LED (CHIP) ORANGE SML-D12D8WT86(R/S) SELECT C PROTECTION
LD307 WW948900 LED (CHIP) ORANGE SML-D12D8WT86(R/S) SELECT D PROTECTION
LD309 WY781500 LED (CHIP) RED SML-D12U8WT86(Q/R) SELECT A LIMIT 01
35
XMV4280/XMV4140
LD311 WY781500 LED (CHIP) RED SML-D12U8WT86(Q/R) SELECT B LIMIT 01
LD313 WY781500 LED (CHIP) RED SML-D12U8WT86(Q/R) SELECT C LIMIT 01
LD315 WY781500 LED (CHIP) RED SML-D12U8WT86(Q/R) SELECT D LIMIT 01
LD317 WJ833500 LED (CHIP) GREEN SML-512MW T86 SELECT A SIGNAL
LD319 WJ833500 LED (CHIP) GREEN SML-512MW T86 SELECT B SIGNAL
LD321 WJ833500 LED (CHIP) GREEN SML-512MW T86 SELECT C SIGNAL
LD323 WJ833500 LED (CHIP) GREEN SML-512MW T86 SELECT DSIGNAL
LD325 WG962100 LED (CHIP) YELLOW SML-512WW SELECT A MUTE
LD327 WG962100 LED (CHIP) YELLOW SML-512WW SELECT B MUTE
LD329 WG962100 LED (CHIP) YELLOW SML-512WW SELECT C MUTE
LD331 WG962100 LED (CHIP) YELLOW SML-512WW SELECT D MUTE
LD333 WJ833500 LED (CHIP) GREEN SML-512MW T86 SELECT A
LD335 WJ833500 LED (CHIP) GREEN SML-512MW T86 SELECT B
LD337 WJ833500 LED (CHIP) GREEN SML-512MW T86 SELECT C
LD339 WJ833500 LED (CHIP) GREEN SML-512MW T86 SELECT D
* LD341 ZC128900 LED DISPLAY LF-301VA(L,M,N)
LD701 WJ833500 LED (CHIP) GREEN SML-512MW T86 POWER
LD702 WY781500 LED (CHIP) RED SML-D12U8WT86(Q/R) ALERT 01
LD704 WJ833500 LED (CHIP) GREEN SML-512MW T86 NETWORK
LD705 WJ833500 LED (CHIP) GREEN SML-512MW T86 YDIF
LD707 WW948900 LED (CHIP) ORANGE SML-D12D8WT86(R/S) PANEL LOCK
R701 V270320R INDUCTOR (CHIP) BLM18BB221SN1D
-704 V270320R INDUCTOR (CHIP) BLM18BB221SN1D
R708 RD35627R CARBON RESISTOR (CHIP) 2.7K 63M J RECT. 01
R801 RF35643R CARBON RESISTOR (CHIP) 4.3K D 1608
36
XMV4280/XMV4140
-308 VV92540R TRANSISTOR (CHIP) 2SC2712-GR(TE85L,F) 01
TR601 WC435000 DIGITAL TRANSISTOR (CHIP) KRC102S-RTK/P
* X301 WT791900 RESONATOR QUARTZ 7.3728MHz DSO321SR
SW301 WE952000 TACT SWITCH SKRGAED010 SELECT A 01
SW303 WE952000 TACT SWITCH SKRGAED010 SELECT B 01
SW305 WE952000 TACT SWITCH SKRGAED010 SELECT C 01
SW307 WE952000 TACT SWITCH SKRGAED010 SELECT D 01
SW309 WE952000 TACT SWITCH SKRGAED010 MUTE 01
SW701 WE952000 TACT SWITCH SKRGAED010 FUNCTION 01
* -305 ZC874700 FET (CHIP) PMV48XP
37
XMV4280/XMV4140
PN (DSW/PN1/PN2/PN3/RSW) & PS
* WZ985600 CIRCUIT BOARD PS (YD895E0)

WE774300 BIND HEAD TAPPING SCREW-B 3.0X8 MFZN2W3 6
* ZA380400 T.H SHEET PS WHITE
* ZA579300 INSULATED BUSH PBT 2
ZD566400 PAN HEAD SCREW 3.0X12 MFZN2W3 SP D6 7
-- SILICON GREASE FLOIL G-600Y (WD74640)
* C218 WZ353100 ELECTROLYTIC CAPACITOR 220.00 420.0V SNAP
* -222 WZ353100 ELECTROLYTIC CAPACITOR 220.00 420.0V SNAP
* C238 ZC577200 CAPCITOR POLYPROPYLEN 0.15 630V J FC
* C241 ZC577200 CAPCITOR POLYPROPYLEN 0.15 630V J FC
C246 UR859100 ELECTROLYTIC CAPACITOR 1000 35.0V RX TP 01
* C247 WZ353200 ELECTROLYTIC CAPACITOR 1800 100.0V SNAP-I
* -250 WZ353200 ELECTROLYTIC CAPACITOR 1800 100.0V SNAP-I
CN206 VB39080R CONNECTOR PH 12P TE 01
D201 WY035400 DIODE STACK RS1505M-C 15.0A 600V 03
D206 WR542900 DIODE YG982S6R SUTO 04
D217 WS078100 DIODE MURF1560G SUTO 04
-220 WS078100 DIODE MURF1560G SUTO 04
F201 V5413700 FUSE TH 10.00A 250V
38
XMV4280/XMV4140
PS
IC206 XJ602A00 IC NJM78M12FA REGULATOR +12V 0.5A
IC207 XJ602A00 IC NJM78M12FA REGULATOR +12V 0.5A
K201 -- HEAT SINK ASSEMBLY PS L40 (WZ98510)
* K204 ZC724900 STYLE PIN CONNECT WIRE
* K206 ZC724900 STYLE PIN CONNECT WIRE
* L203 WZ809800 COIL PI-0R002-0345 YOKO
* L203 ZF291300 COIL PI-0R002-0345 YOKO
PH201 WP388200 PHOTO COUPLER TLP781(D4-GR,F) 01
-205 WP388200 PHOTO COUPLER TLP781(D4-GR,F) 01
PR201 WH324000 THERMISTOR PTMS2331RP716 P7(8) 03
Q201 WR543300 POWER MOSFET IPP60R165CP ST
Q202 WR543300 POWER MOSFET IPP60R165CP ST
* Q214 WT856700 POWER FET SPA21N50C3
* Q215 WT856700 POWER FET SPA21N50C3
R275 VC74500R METAL OXIDE FILM RESISTOR 100.0 1W J 01
* T201 YD889A00 POWER TRANSFORMER UL E
C204 WQ110000 ELECTROLYTIC CAP. (CHIP) 220 25V
C209 WJ590700 CERAMIC CAPACITOR (CHIP) 0.47 16V K RECT.
C216 WQ090100 MONOLITHIC CERAMIC CAP(CHIP) 220P 100V J KAKUTE 01
C219 V585100R CERAMIC CAPACITOR (CHIP) 470P 50V J KAKUTE 01
C224 WW715200 CERAMIC CAPACITOR (CHIP) 470P 50V G KAKUTE 01
C228 WN422300 ELECTROLYTIC CAP. (CHIP) 47.00 35.0V TP 01
C232 US063100 CERAMIC CAPACITOR (CHIP) 1000P 50V K RECT. 01
C237 V7658000 MONOLITHIC CERAMIC CAP(CHIP) 1000P 2KV K RECT.
C242 V585100R CERAMIC CAPACITOR (CHIP) 470P 50V J KAKUTE 01
D202 WT856600 DIODE (CHIP) M3F60-5063 03
D203 WK911900 ZENER DIODE (CHIP) 1SMB5953BT3G 150.0V 02
D204 WR543600 ZENER DIODE (CHIP) 1SMB5956BT3G 200.0V
D205 WR543600 ZENER DIODE (CHIP) 1SMB5956BT3G 200.0V
-209 WW783900 SWITCHING DIODES (CHIP) 1SS355VM 01
D210 WJ459300 DIODE (CHIP) D1FK60-5053 TE 01
39
XMV4280/XMV4140
PS
D213 WE665600 FAST RECOVERY DIODE (CHIP) RF101L2STE25 TE
D215 VV556300 DIODE ARRAY DAN217 0.3A X2
* D216 WN770800 FAST RECOVERY DIODE (CHIP) RF301B2S TP
D223 VU172900 ZENER DIODE (CHIP) UDZS13B TE-17 13V
D224 VU172900 ZENER DIODE (CHIP) UDZS13B TE-17 13V
* F202 ZD142800 CURRENT CUTOFF FUSE NORMAL 0.50A UL
IC201 YA732A00 IC KIA78M15F-RTF/P REGULATOR +15V 02
IC202 X5814A0R IC NJM2903M(TE1) OP AMP 01
* IC203 YE110A00 IC L6563STR PFC CONTROLLER
* IC204 YD831A00 IC SG2525AP013TR PWM CONTROLLER
* IC205 YD830A00 IC L6385ED013TR HIGH VOLTAGE DRIVER
IC208 YD843A00 IC TL431ACDBVR REGULATOR
L201 V3307700 INDUCTANCE (CHIP) BLM21BD102SN1D 01
L202 V3307700 INDUCTANCE (CHIP) BLM21BD102SN1D 01
* PR202 ZD009600 THERMISTOR PRF18BD471RB5RB 47
Q203 WC435000 DIGITAL TRANSISTOR (CHIP) KRC102S-RTK/P
-209 WC435000 DIGITAL TRANSISTOR (CHIP) KRC102S-RTK/P
Q212 WC434800 DIGITAL TRANSISTOR (CHIP) KRA102S-RTK/P 01
Q218 VV556500 TRANSISTOR (CHIP) 2SA1037AK-T146 Q,R,S
Q219 VV556500 TRANSISTOR (CHIP) 2SA1037AK-T146 Q,R,S
Q220 WC434800 DIGITAL TRANSISTOR (CHIP) KRA102S-RTK/P 01
Q221 WF549900 TRANSISTOR (CHIP) 2SC3906K T146 R,S
-223 WF549900 TRANSISTOR (CHIP) 2SC3906K T146 R,S
R201 RD158680 CARBON RESISTOR (CHIP) 680K 1/4 J TP
-203 RD158680 CARBON RESISTOR (CHIP) 680K 1/4 J TP
R212 WR649100 CARBON RESISTOR (CHIP) 0.082 1W J 5025
R230 RD158470 CARBON RESISTOR (CHIP) 470K 1/4 J TP 01
R232 RD159100 CARBON RESISTOR (CHIP) 1.0M 1/4 J TP 01
40
XMV4280/XMV4140
PS
R233 RD159100 CARBON RESISTOR (CHIP) 1.0M 1/4 J TP 01
R235 RF45833R CARBON RESISTOR (CHIP) 330.0K D RECT.
-247 RD158220 CARBON RESISTOR (CHIP) 220K 1/4 J TP 01
R250 RF455330 CARBON RESISTOR (CHIP) 330.0 D RECT.
R286 RF458150 CARBON RESISTOR (CHIP) 150.0K D RECT. 01
R298 RD15722R CARBON RESISTOR (CHIP) 22.0K 1/4 J TP 01
41
XMV4280/XMV4140
PS & SUB
VR201 WY884300 VR TRIMMERB B 100K FUSE 3P VG PFC 01
FH201 WN103000 FUSE HOLDER CLIP TP00351-31 01
L205 GE300670 FERRITE BEAD BL02RN2R1P1A TATET 02
-209 GE300670 FERRITE BEAD BL02RN2R1P1A TATET 02
* WZ985500 CIRCUIT BOARD SUB (YD894D0)

WB408000 BINDING TIE GT-100M HUA WEI
-- CONNECTOR ASSEMBLY ACINLET (WW76340)
-- SILICON GREASE FLOIL G-600Y (WD74640)
WE774300 BIND HEAD TAPPING SCREW-B 3.0X8 MFZN2W3 7
C101 V9365100 CAPACITOR 1.000 275V UCS 03
* C102 WK463100 CAPACITOR 1500P 250V J.U.C.B
* C103 WK463100 CAPACITOR 1500P 250V J.U.C.B
C105 WK463600 CAPACITOR 1000P 250V J.U.C.B 01
C106 WK463600 CAPACITOR 1000P 250V J.U.C.B 01
C118 WF50310R CERAMIC CAPACITOR 470P 1KV J TATETE
C121 UR859100 ELECTROLYTIC CAPACITOR 1000 35.0V RX TP 01
C123 UR849100 ELECTROLYTIC CAPACITOR 1000 25.0V RX TP
D102 WJ441800 DIODE STACK RS605M-B-C-J81
D109 WN416800 DIODE YG911S2R SUTO 03
F101 VT94300R FUSE TH 3.15A S 250V 01
IC102 XD853A00 IC NJM7815FA REGULATOR +15V 03
IC103 XD854A00 IC NJM7915FA REGULATOR -15V 03
IC104 X5525A00 IC NJM317F REGULATOR 04
IC105 XK309A00 IC NJM7905FA REGULATOR -5V
JK101 WH032400 AC INLET TU-301-AL AC IN 03
K102 -- HEAT SINK ASSEMBLY SUB L55 (WZ46290)
K103 -- HEAT SINK ASSEMBLY SUB L85 (WZ46280)
* L101 WZ435000 COIL EM-OR002 TATE
* L102 WZ435000 COIL EM-OR002 TATE
* L110 ZA514100 COIL 470uH TSL1112RA-471KR72
PH101 WP388200 PHOTO COUPLER TLP781(D4-GR,F) 01
-103 WP388200 PHOTO COUPLER TLP781(D4-GR,F) 01
Q103 WW228900 POWER FET FMV07N70E ST 04
R101 WY418200 CARBON RESISTOR 220.0K 1/4 J YOKO2 01
-104 WY418200 CARBON RESISTOR 220.0K 1/4 J YOKO2 01
R107 VN067400 CEMENT RESISTOR 6.8 5W K TATESUTO
R124 VC76510R METAL OXIDE FILM RESISTOR 33.0K 2W J 01
R125 VC76510R METAL OXIDE FILM RESISTOR 33.0K 2W J 01
R163 VC760800 METAL OXIDE FILM RESISTOR 560.0 2W J
R168 VN067400 CEMENT RESISTOR 6.8 5W K TATESUTO
* RY101 ZA134600 RELAY DC DI12D1-O(M)
* T101 YD888B00 POWER TRANSFORMER UL CSA CE DENAN E
TH101 WK836300 THERMISTOR 20D2-11LT3C 20ohm 03
W101 -- CONNECTOR ASSEMBLY AC (ZE75750)
* C131 WM462200 CERAMIC CAPACITOR (CHIP) 10 35V M KAKUTE
* C137 WM462200 CERAMIC CAPACITOR (CHIP) 10 35V M KAKUTE
42
XMV4280/XMV4140
SUB

* D108 WZ548700 FAST RECOVERY DIODE (CHIP) DA22F2100L
D114 VU173000 ZENER DIODE UDZS15B TE-17 15V
* D125 WZ497600 SCHOTTKY BARRIER DIODE (CHIP) RB055L-40 TE
D127 VU17310R ZENER DIODE (CHIP) UDZS16B TE-17 16V 01
D129 VU172100 ZENER DIODE (CHIP) UDZS6.2BTE-17 6.2V
* F102 ZC887100 CURRENT CUTOFF FUSE (CHIP) NORMAL 1.5A UL
L109 V5431600 INDUCTOR (CHIP) 10UH SLF10145T
L112 V3232700 INDUCTOR (CHIP) 120U 01
-114 V3232700 INDUCTOR (CHIP) 120U 01
* Q107 WZ322400 FET (CHIP) RTF016N05TL TE
-110 WC435000 DIGITAL TRANSISTOR (CHIP) KRC102S-RTK/P
* Q111 WZ328800 FET (CHIP) 2SJ518 TE
* R128 WZ388000 CARBON RESISTOR (CHIP) 0.33 1W J 5025
VR101 WY884200 VR TRIMMERB B 100.0 FUSE 3P VG 01
C114 WD70780R CERAMIC CAPACITOR 2200P 1KV K RX TP
K101 VR463400 EYELET TERMINAL D3.5 TP00385 TP
C119 WJ835000 MONOLITHIC CERAMIC CAP(CHIP) 1000P 250V K KAKUT 01
C143 WS765300 CERAMIC CAPACITOR (CHIP) 1.0 35V K RECT. 01
C166 V5333500 CERAMIC CAPACITOR (CHIP) 10.0 6.3V K RECT.
D110 ZA143300 FAST RECOVERY DIODE (CHIP) M3FL20U TE 03
43
XMV4280/XMV4140
SUB
-123 ZA145200 SCHOTTKY BARRIER DIODE (CHIP) RB162M-40TR TE 01
D124 VU172800 ZENER DIODE (CHIP) UDZS12B TE-17 12V 01
-135 ZA145200 SCHOTTKY BARRIER DIODE (CHIP) RB162M-40TR TE 01
IC101 YD162A00 IC FA5571N-D1-TE1 LOW STANDBY POWER 03
QUASI-RESONANT CONTROLLER
-108 V3232700 INDUCTOR (CHIP) 120U 01
R115 RD156220 CARBON RESISTOR (CHIP) 2.2K 1/4 J TP 01
-118 RD156220 CARBON RESISTOR (CHIP) 2.2K 1/4 J TP 01
* WZ836500 DC FAN RDH8025S1
VS246400 LITHIUM P-BATTERY CR2450 03
* ZA306700 CONNECTOR ASSEMBLY PSW POWER switch
44
POWER AMPLIFIER
CIRCUIT DIAGRAM
CONTENTS
BLOCK DIAGRAM............................................. 3
CIRCUIT DIAGRAM
AMP (001005)................................................................................ 711
ANA (001004) (ANA2/ANA1)...................................................... 1215
CPU (001003)............................................................................... 1618
DM (001006)................................................................................. 1924
IO1 (001, 002) (IN, OUT)................................................................ 25, 26
PN (001005) (PN1, RSW, DSW, PN2, PN3)................................. 2731
PS ........................................................................................................ 32
SUB ..................................................................................................... 33
Notation for Circuit Diagrams

1. How to identify inter-sheet connectors
Signal name
This indicates the location of the counter inter-sheet connector.

(The alphabet indicates horizontal direction and the number
indicates vertical direction.)

The 3-digit number indicates the destination page.
3
2. Connection of connectors.
(Example) to PS-CN206
(Page 32: A-11)
Page 32 are the page of a circuit diagram.
Page 32
A-11 is indicates the location of the counter inter-circuit board connector.

(The alphabet indicates horizontal direction and the number indicates vertical direction.)
A-11

Note : See parts list for details of circuit board conponent parts.

WARNING
Components having special characteristics are marked and must be re-
placed with parts having specification equal to those originally installed.

H G F E D C B A
BLOCK DIAGRAM 001 (XMV4280/XMV4140) XMV4280/XMV4140
ANA1 (XMV4280) AMP OUT

1
ANA2 (XMV4140) IC310 (28P)
IC106A (8P) +15A
8 +VB SPEAKERS
IN +5A
18
+3.3D
2
IC301A (8P)
+15A
+5A
16
-5A
7
IC305B (8P)
+15A 2 INV 1
CH_A+
IC103 (16P)
+5A VDR
IRS2092 L801
CN803
4 /RST 3 8 8
4
CH_A- Q107, 108 P-AMP CURRENT
+5A +3.3D L+ 23 1 6 7 -15A A+
CH_A- 3 A1(-1) SENSOR
INPUT IC702A (8P)
+15A +7A -7A +15A
8 IC103 (8P)
22 14 19 M256FS,
M64FS,
DAC 22 2 LPF INV
IC106B (8P) +15A +5A
ENA-A1
/RST L-
/ERR_A1
3 8 IC107 (28P) 3,5,7 4 4 A-
IC314, 315
+ 1 2 1 5 MWC 8 IC104 (8P) -5A
Diff 1 8 INV LIN- CLKS -15A -15A CH_B+ -VB
(28P)
CH A G -
I/F
2 +15A 6 AK4396 6 INV +15A +15A
-15A
4 4
7
ADC M256FS,
SDI IC301B (8P) IC305A (8P)
7 7 8 1 Q115119
4 4
CN704 -15A
6
INV LIN+
1618 M64FS, R+ 21 6
7 2 1 -15A
I-SENSE_A EQ 6 LPF 3
DC-DET-A
IC702B (8P) CH_B- 4 DC DET.
(6P) +15A MWC DAC 5 LPF INV +VB
TC74HC4052A
+15A CLKS 20 +5A VDR
8
IC101 (32P) 8 -15A PCM1804 8 SMUTE R- IC404A (8P) +15A -15A -15A
HC4052 x2
ANA-MPX
5 8
CN606 (30P)
CN601 (30P)
1
ANA-MPX
+ 7 2 24 SDO CH_C+ IRS2092 +24D RY101
CH B G- 6
Diff
4
2 12 INV
4
+15A
RIN-
ADC
15
DM 4
+5A
18
+3.3D
2 +15A +15A 2 INV
4
1
CH_A+ 3 P-AMP
A2(-1)
-15A -15A 7 25 /RST 23 3 8 8 IC102 (16P)
INV
NJW1195A
RIN+ L+
ENA_A2
4ch E-VOL
1 6 7 -15A CH_C-
CN701 (9P)
CN101 (9P)
Q105, 106
/ERR_A2
IC111 (8P) 6 DAC 22 2 LPF INV -5A +5A
-15A
+5A +3.3D 3,5,7 L- 4 4 IC404B (8P) +15A -VB
CN501 (5P)
CN801 (5P)
IC701A (8P) +15A CLKS -15A 8
IC302A (8P) -15A
I/F
22 14 19 CH_D+ RELAY_AB
+15A 8 IC104 (8P) IC108 (28P) /RST 6 AK4396 IC306B (8P)
6 INV
3 8 SDI 7
+ 1 2 1 5 4 +VB
Diff 32 25 INV LIN- 21 6 +5A VDR
CH C G- 2 4 4
+15A
ADC M256FS, DAC
R+
20 5 LPF
7 2
INV
1 -15A CH_D-
IC301 (16P) +24D RY101
-15A 7 4 M64FS, 8 IRS2092
-15A INV LIN+ 1618 DAC-MUTE SMUTE R- Q305, 306 P-AMP L802
CN703 6 MWC SEL CH_B+
IC701B (8P) +15A CLKS
(6P) +15A 4 IC311 (28P) IC302B (8P) IC306A (8P) 3 B2(-1) B+
8 -15A PCM1804 SDO
8 +5A
ENA-B2
5
/ERR_B2
+ 7 2 1 24 15
Diff 31 21 INV RIN- IC303 (8P)
CH D G -
6
+15A
+15A -VB
-5A
B-
I/F
4 +15A
-15A
SPI 4 7 25
ADC +1.8D
8 RELAY_AB
-15A 6
INV RIN+
+1.2D2 +1.2D LDO I-SENSE_B
7
EQ 6
1
LPF 3
IC104 (5P) DC-DET-B
IC112 (8P) 4 +VB DC DET.
-15A +5A VDR
X101 -15A -15A
8 Q314318
25MHz IRS2092
CN301 (32P)
CN603 (32P)
CN103 (12P)
CN608 (12P) +3.3D IC101 (86P) 4

+5D IC318 (16P)
SHIFT-REG
IC505 (20P)
+5A +3.3D
IC501A (8P)
CH_B-
IC302 (16P)
3 P-AMP
B1(-1)
CURRENT
SENSOR
2
ENA_B1
HCT595 14
5 Q307, 308
/ERR_B1
64Mb SDRAM
DSW +15A +5A
JTAG
7 -5A
/RST
+3.3D W9864G2IH-7 8 -VB
1 1 3
I/F
IC602 (20P) LPF I-SENSE_A
AMP OUTPUT SETTINGS 20 ADC LIN
CN604 (13P)
CN607 (13P)
3 /CS 10,11,15
3state 32 4 +VB
+3.3D +1.2D2 CLKS +5A VDR
Buffers PCM1803 -15A
12 IC501B (8P)
DIP SW EMIFB SDO IC401 (16P) IRS2092 +24D RY401
SW601 +5A 5 +3.3D 14
+15A CH_C+ Q403, 404 P-AMP L803
7 2 7 5 I-SENSE_B
/RST ADC RIN LPF 3 C2(-1) C-
CN603 (32P)
CN301 (32P)
8
FAULT OUTPUT REMOTE 1 1 3 +5A
ENA-C2
/ERR_C2
+3.3D
CN601 +5D RY601 CN602 IC102 ADC LIN LPF IC403 (8P) -5A
I-SENSE_C C+
CN603 (5P)
EMUTE-REQ
+15A -VB
CN604 (5P)
MUTE ALL I/F 10,11,15 4
I/F
NO DSP(#2) +15A
STANDBY STBY-REQ CLKS RELAY_CD
C TR602,603 -15A IC502A (8P) 7 8 1 Q409414
NC
GND D81YK113CZKB400 12 PCM1803 I-SENSE_C EQ 6 LPF 3
/DSP2-RES DC-DET-C
/ALERT SDO 4 +VB DC DET.
DSP-MUTE[1]
INT (400MHz) 2 7 -15A -15A +5A VDR
DSP-MUTE[2] 5 I-SENSE_D
INT ADC RIN LPF
McASP IRS2092
M256FS CH_C- 3 P-AMP CURRENT
(Slave)
M64FS IC506 (20P) IC502B (8P) C1(-1) SENSOR
MWC McASP IC402 (16P)
SPI1
ENA_C1
Q405, 406
/ERR_C1
SOF_8 +5A
AMP SETTINGS UNIT ID SO -VB
-5A
DIP SW 16 position Rotary SW 4
I/F
CN502 (4P)
CN802 (4P)
SW505 SW502 SI SI SI SO 4
4 2 2
+3.3D 4 +VB
IC501,504 (20P) 8 +5A VDR
20
CN606 (14P)
CN501 (14P)
3state 4 /CS IC502 (16P) IRS2092 L804

CH_D- Q505, 506 P-AMP CURRENT
Buffers
D1(-1) SENSOR
D-
3
RSW +5A
ENA-D1
/ERR_D1
/DSP2-IRQ
DSP2-ACK
D+
8ch/line
8ch/line
IC503 (8P) -5A
-VB
I/F
SPI
+15A +15A
X401 X402
SW401
DIP SW +3.3D +1.8D1 +1.2D3
/ADDA-RES
I-SENSE_D
7 8
4
EQ 6
1
LPF 3
+VB DC-DET-D
DC DET.
Q509514
3
+5A VDR
PN1 49.152MHz 45.158MHz -15A -15A
JTAG
DAC-MUTE
INT
INT
+24D
SPI0 (Master)
/ALERT
/CS-DSP1(CS2)
/CS-DSP2(CS3)
+3.3D IRS2092
IC303,304 (14P) /YDIF-MUTE +3.3D EMUTE-REQ CH_D+ 3 P-AMP
ROTARY EC301 INT
I/F 4 MODEL-ID
INT STBY-REQ IC501 (16P) D2(-1)
ENCODER x1 9 /CS
ENA_D2
M256FS /ADDA-RES Q503, 504 +5A
/ERR_D2
+3.3D
M64FS /DSP1-RES -5A RY401
7 -VB RELAY_CD
I/F
CH SELECT SW x4 MWC /DSP2-RES2
SW301,303,305,307 JTAG/SWD IC402 (144P)
SOF_8 /SRC-RES
DEBUG/ SPI
SW309 MUTE SW UART0
FLASH
Clock Control C-WCI Refer to the CPU Block Diagram (page 4) EMIFA CS4 /CPLD-CS1
+3.3LD DNT-MUTE CPLD /CPLD-CS1 /CPLD-CS2
DC-DET-D
DC-DET-C
DC-DET-A
DC-DET-B
7.3728MHz EMIFA CS5 +3.3D +3.3D +5A
DSP-MUTE[1]
CPU BATTERY
CONTROLLER
LCMXO2280C-3TN144C /CPLD-CS2
8 /AMP-ERR
7SEG LED x3 X301 I/F
/SYS-RES I/F THERMAL
JTAG/SWD
CASI-DET /SYS-RES
LM3S808
LD341343 IC604 (20P) IC605, 606 (5P)

DSP-MUTE[2] Address Decoder 4 AB[21:24] CPU-CLK SENSORS
I/F
PROTECTION LED x4 BATTERY +3.3D Clock Controller CN301 (182P) 8

LD301,303,305,307 +3.3D SPI-IRQ 5 AB[1:5]
2 SPI I/F EMA-A[0:9],[19:22],EMA-BA[0:1] X601
T-SENSE
CN502 (182P)
RELAY-CD
RELAY-AB
LIMIT LED x4 UNLOCK
AMP-ENA
UNLOCK 16 7.3728MHz
3
2 MUTE Controller
CN301 (11P)
CN601 (11P)
LD309,311,313,315 DETECTOR DEBUG/FLASH

ATT DETECTIOR
DB[0:15] 4 +3.3D
SIGNAL LED x4
TR301308
FT301308
LD317,319,321,323 +5D +3.3D

SUB1-ADRS 1,14 /SUB1-IRQ SUB2-ADRS
MUTE LED x4 INT ATT
UART0
/SUB1-RES
MPS1-OVP
LD325,327,329,331 /SUB2-IRQ
/SUB1-IRQ PLL INT /SUB2-RES CONTROLLER
SELECT LED x4 IC404 (14P) /SUB3-IRQ /SUB2-IRQ
LD333,335,337,339 I2C TLC2932A INT LM3S808
DNT-IRQ I2C IC602 (48P)
(MASTER) INT
/CS-LEDDRV(CS1)
IC302 (48P) /SIO-IRQ
RMII,MDC/MDIO
+3.3LD IC306,307 (16P) INT
/CS-DNT(CS0)
SPI1 (Master)
8 /PHY-IRQ
INT
DB[0:7] 2 SPI-IRQ
DB[0:15]
I2C0 (Master) INT
/DFF-OE
CN304 (2P)
PWM
UART1 DEBUG
+3.3D
INT
VDR
/SUB2-RES
/SUB3-RES +VB -VB
2
DB[0:15]
16
MPS-RELAY
FAN-CONT
/PWR-OFF
CN105 (3P) CN106 (12P)
PN2
FUNCTION SW
CN205 (3P) 4
SW701 FUNCTION SW 4
+VB -VB
DB[0:7]
+3.3D
PS
CN206 (12P)
+3.3D
WATCHDOG
FUNCTION SW
SYNC
LEDDRV-LD
CASI-DET
/LEDDRV-OE
16 +1.8D
8
2 +24D
LD701 POWER LED +1.2D LDO 3 VDR
+1.2D3 +3.3D +3.3D DC/DC
IC507 (5P)
LED DRIVER
IC601 (9P)
CN701 (10P)
CN602 (10P)
LD702 ALERT LED 5
MPS1-WAKEUP
/MPS1-STATUS
YLD330
/MPS1-TEMP
MPS1-ENA
+15A
MPS1-OVP
CN207 (3P)
+1.8D 1 3
/LEDDRV-OE SW +7A +7V LDO +15 Power
+1.8D1 FT501,TR501 IC603 (3P) IC201
LD705 YDIF LED LEDDRV-LD
IC505 (8P)
LD704 NETWORK LED IC701 +VB +VB Power Resonance Half PFC D201
(16P) -15A IC208 (5P)
CN201 (2P)
SPI 3 -7V LDO
2
Bridge Q201,202 Diode
LD707 PANEL LOCK LED -7A
IC602 (3P)
-VB -VB Power DC/DC CONV.
Q214,215 Bridge
IC202 (8P)
IC209 (5P) IC210,211 (5P) IC203 (14P)
Q220,224,225 IC204 (16P)
VDR VDR Power D216220 IC205 (8P)
IC206,207 (3P) T201
+3.3D
+3.3D IC410 (16P)
JK601 CN101 (5P)
LVDS 2 8ch/line MUTE /YDIF-MUTE
+3.3D /PWR-OFF
YDIF IN Receiver C_WCI (Fs=44.1, 48kHz)
+3.3D
8
DS90LV048A D-FF
LV574 IC501 (20P) PN3 SUB
6 5
CN601 (25P)
CN802 (25P)
CN801 (25P)
CN106 (25P)
CN605 (9P)
CN603 (9P)
I/F CASI-DET
/PHY-RES
/DNT-RES
/SUB3-RES
/SUB2-RES
/SUB1-RES
/SIO-RES
3
IC612 (8P) +3.3D FAN (for PS)
/CS
IC407 (16P)
JK602
MPS-RELAY
FAN-CONT
2 8ch/line
/PWR-OFF
CN107 (3P)
LVDS +24D
YDIF OUT +24D +24D Power
Transmitter MWC (Fs=44.1, 48kHz) D109
FAN DRIVER
4
+3.3D
5
2,1
DS90LV047A
+15A +15A Power
IC102
Flyback Q106,107,111 +12V RY101 5
I/F /PWR-OFF DC/DC
+5D
IC608 (5P)
+1.8D DC/DC -15A -15A Power SUB CONV.
+1.8D IC103
X301 IC506 (39P) SYNC CN602 (3P) Q103
25MHz +3.3D
+24D +5A +5A Power T101
RMII,MDC/MDIO 10 2
3 +3.3D DC/DC D106
JK301 PHY +3.3D IC104
NETWORK
KSZ8051RNL
/PHY-IRQ IC801 (9P) D107 Diode
Pulse /PHY-RES W101A (3P)
Trans IC303 (33P) -5A -5A Power Bridge AC-IN
IC105 W101B (3P)
D102 JK101
T301
+5D +5D Power
IC107 (9P)
FAN (for AMP)
CN803 (2P)
POWER
SW
CN103 (5P)
+3.3D
VCC
6
28CA1-2001094116-1 BLOCK DIAGRAM 001 (XMV4280/XMV4140)
3
H G F E D C B A
BLOCK DIAGRAM 002 (XMV4280/XMV4140) XMV4280/XMV4140
1
for DEBUG
CN102 (10P)
BtoB connector +3.3V +1.8V +1.2V
53481-1879 180P
CPU
UART x2
RXD/TXD
UART1 +1.2V
RXD/TXD ARM926EJ-S PLL SPXO

UART2 RISC CORE X101
CLK Gen
375MHz
25MHz
2 CS2/CS3/CS4/CS5
SPI x2
SPI0
as master
JTAG
CS0/CS1 SPI1 +1.8V
as master
DDR2/mDDR 16bit
AM1808BZWT3 DDR2 SDRAM
I2C x1 Controller
I2C0 512Mb
IC001 BUS : 150MHz
as master IC107
+3.3V
IC304 (56P)
MDC/MDIO
3 MDIO 16bit 16bit NOR FLASH
RMII x1
GPIO EMIFA 64Mb
CN301 (180P)
EMAC IN/OUT/INT BUS : 62.5MHz

/CS2 MAC address
10/100
+3.3B
x52
GPIO signals GPIO x46 16bit SRAM
Any Pull-UP/DOWN registers 2Mb
are not mounted on this board. /CS3 IC305 (44P)
+3.3B +3.3V x4
D201
BATTERY 1 3
EMIFA signals
4 <Control> RTC
IC203A (8P)
EMA_CLK, +3.3V IC206
/EMA_CS[5:4], (14P)
/EMA_OE, 20
IC308312 (20P) BT201
/EMA_WE,
EMA_A_R/W, 16bit 16bit
EMA_WAIT[0],
/EMA_WEN_DQM[1:0]
<Address> +3.3V +3.3V
EMA_A[22:19], IC101 (5P)
BUFFER +3.3V 5
EMA_A[9:0], +3.3V 1 2
EMA_BA[1:0] +1.8V /SYS_RES
2 DETECT to CPU & DM
<Data> 4
1
EMA_D[15:0] +1.2V
IC103 (5P)
5 /FLASH_RES
to NOR FLASH
/SYS_RES
6
28CA1-2001094116-2 BLOCK DIAGRAM 002 (XMV4280/XMV4140)
4
H G F E D C B A
BLOCK DIAGRAM 003 (XMV4280) XMV4280/XMV4140
1
GAIN:+19.2dB
GAIN:-11dB GAIN:-12dB
PCM1804DB AK4396VF GAIN:+12dB P-AMP
INPUT + (-1)
- Dif E-VOL INV IN- OUT+ OUTPUT
(MAX.: +24dBu) LPF ATT
[NOM.: +4dBu]
G NJW1195A ADC DSP DAC TC74HC4052A INV
IN+ D81YK113BZKB400 OUT-
INV
P-AMP
INV (-1)
-95dB to +17dB
GAIN:0dB GAIN: 0dB
1dB Step
GAIN:-0.5dB GAIN:0dB
GAIN:-3dB
GAIN:-3.5dB
-95dB to +31.5dB
0.5dB Step
2
560W 4 SE[+35.7dBu]
560W 8 BTL[+38.7dBu]
+50 +50
Hi-Z 100V BTL[+42.2dBu]

+40 Hi-Z 70V BTL[+39.1dBu] +40
280W 8 SE[+35.7dBu]
280W 4 SE[+32.7dBu]
+30 +30
Max. INPUT Level(+24dBu)
LPF(+20dBu)
+20 +20
3
E-vol IN/OUT(+13dBu) Head Room Margin:3dB Head Room Margin:3dB
+10 ADC 0dBFS(+7dBu)Balance DAC 0dBFS(+8dBu)Balance +10
INPUT SENSITIVITY[+4dBu]
ADC INPUT [+4dBu] Balance
DAC OUT[+5dBu]Balance
0 0
-10 -10
-20 -20
-30 -30
4
-40 -40
Notice
This level diagram is based on the all internal equalizer settings are Flat position and all internal dynamics effects are OFFposition.
6
28CA1-2001094116-3 BLOCK DIAGRAM 003 (XMV4280)
5
H G F E D C B A
BLOCK DIAGRAM 004 (XMV4140) XMV4280/XMV4140
1
GAIN:+19.2dB
GAIN:-11dB GAIN:-12dB
PCM1804DB AK4396VF GAIN:+12dB P-AMP
INPUT + (-1)
Dif E-VOL INV OUTPUT
(MAX.: +24dBu)
- IN- OUT+ LPF ATT
[NOM.: +4dBu]
G NJW1195 ADC DSP DAC TC74HC4052A INV
IN+ D81YK113BZKB400 OUT-
INV
P-AMP
INV (-1)
-95dB to +17dB
GAIN:0dB GAIN:0dB
1dB Step GAIN:-3dB GAIN:0dB
GAIN:-3.5dB
GAIN:-6.5dB
280W 4 SE[+32.7dBu]
+50 +50
Hi-Z 100V BTL[+42.2dBu]

+40 Hi-Z 70V BTL[+39.1dBu] +40
280W 8 BTL[+35.7dBu]
140W 8 SE[+32.7dBu]
+30 140W 4 SE[+29.7dBu] +30
Max. INPUT Level(+24dBu)
LPF(+20dBu)
+20 +20
3 Head Room Margin:3dB
E-vol IN/OUT(+13dBu) Head Room Margin:3dB
+10 ADC 0dBFS(+7dBu)Balance DAC 0dBFS(+8dBu)Balance +10
INPUT SENSITIVITY[+4dBu]
ADC INPUT [+4dBu] Balance
DAC OUT[+5dBu]Balance
0 0
-10 -10
-20 -20
-30 -30
4
-40 -40
Notice
This level diagram is based on the all internal equalizer settings are Flat position and all internal dynamics effects are OFFposition.
6
28CA1-2001094116-4 BLOCK DIAGRAM 004 (XMV4140)
6
Q P O N M L K J I H G F E D C B A
AMP 001 CIRCUIT DIAGRAM (XMV4280/XMV4140) XMV4280/XMV4140
VOLTAGE 1
COMPARATOR
(Page 32: A-11)

to PS-CN206
PROTECTED DIGITAL AUDIO AMP
2
OP AMP
OP AMP
3
OP AMP
4
to PS-CN205
(Page 32: A-3)

6
10
11
not installed
12
28CC1-2001094118-1 7 AMP 001 CIRCUIT DIAGRAM (XMV4280/XMV4140)

7
1 OP AMP
OP AMP
3
OP AMP

6
10
11
not installed
12
8
OP AMP
OP AMP
3
OP AMP
4

6
10
11
not installed
12

9
OP AMP
3
OP AMP
4 OP AMP
to OUT-CN801
5 (Page 26: F-2)
to OUT-CN802
(Page 26: F-4)
6
10
11
not installed
12
10
L K J I H G F E D C B A
not installed
to ANA1/ANA2-CN606
(Page 15: A-1)
VOLTAGE DETECTOR
2
TRANSCEIVER
AND
INVERTER
4
BUFFER
BUFFER
5
not installed
MICROCONTROLLER
not installed
not installed
AND

11
W V U T S R Q P O N M L K J I H G F E D C B A
ANA 001 (ANA1/ANA2) CIRCUIT DIAGRAM (XMV4280/XMV4140) XMV4280/XMV4140
1
OP AMP
2
ADC
3 ELECTRONIC VOLUME
to IN-CN701 to DM-CN608
(Page 25: C-4) OP AMP (Page 24: C-5)
4
5 OP AMP
6 ADC
OP AMP
8
10 not installed
11
12
13
14
15
16
17 28CC1-2001094228-1 2 ANA 001 (ANA1/ANA2) CIRCUIT DIAGRAM (XMV4280/XMV4140)

12
to DM-CN603 SHIFT REGISTER 2

(Page 24: N-9)
AND XMV4280
XMV4140
3
DAC
OP AMP
4
OP AMP
5
OP AMP
OP AMP 6
DAC
MULTIPLEXER
OP AMP
7
OP AMP
8
OP AMP
OP AMP 9
not installed
MULTIPLEXER
10
11
12
13
14
15
16
28CC1-2001094228-2 1 ANA 002 (ANA1/ANA2) CIRCUIT DIAGRAM (XMV4280/XMV4140) 17

13
2
AND
3
OP AMP
ADC
4
OP AMP
6
OP AMP
ADC
7
not installed
not installed not installed
9 OP AMP
not installed
10
11
12
13
14
15
16
17 28CC1-2001094228-3 1
ANA 003 (ANA1/ANA2) CIRCUIT DIAGRAM (XMV4280/XMV4140)
14
REGULATOR +7V 1
to AMP-CN601
(Page 11: K-2)
REGULATOR -7V 3
not installed
not installed
to FAN
to PN3-CN802
(Page 31: B-4)
4
to DM-CN605
BUFFER
(Page 24: J-3)
not installed
DC-DC CONVERTER 6
28CC1-2001094228-4 4 ANA 004 (ANA1/ANA2) CIRCUIT DIAGRAM (XMV4280/XMV4140)

15
CPU 001 CIRCUIT DIAGRAM (XMV4280/XMV4140) XMV4280/XMV4140
MICROPROCESSOR DDR2 SDRAM 512M

1
VOLTAGE DETECTOR
not installed
MICROPROCESSOR
4
not installed
not installed
MICROPROCESSOR MICROPROCESSOR
7
not installed
10
11 not installed not installed not installed
12
28CC1-2001097135-1 CPU 001 CIRCUIT DIAGRAM (XMV4280/XMV4140)
16
not installed
1
MICROPROCESSOR
not installed
MICROPROCESSOR
not installed
7
not installed
OP AMP
not installed 9
not installed
AND
10
AND
11
REAL TIME CLOCK

12
28CC1-2001097135-2 1 CPU 002 CIRCUIT DIAGRAM (XMV4280/XMV4140)

17
to DM-CN502
1 (Page 23: K-2)
INVERTER
FLASH ROM 64M TRANSCEIVER

2 not installed
MICROPROCESSOR
3
TRANSCEIVER
4
not installed
TRANSCEIVER
5 not installed
6
TRANSCEIVER
7 not installed not installed

SRAM 2M
(128KX16)
TRANSCEIVER
8
OR
not installed
9 AND
not installed
not installed
10
11
12
28CC1-2001097135-3 CPU 003 CIRCUIT DIAGRAM (XMV4280/XMV4140)
18
DM 001 CIRCUIT DIAGRAM (XMV4280/XMV4140) XMV4280/XMV4140
not installed
1
DSP
DSP DSP
not installed
2
not installed
not installed
NON-INVERTER 4
AND
5
not installed
6
DSP
DSP 7
SDRAM 64M
10
REGULATOR
+1.25V
11
12
VOLTAGE DETECTOR
28CC1-2001095637-1 3 DM 001 CIRCUIT DIAGRAM (XMV4280/XMV4140)
19
not installed
10
11
12
20

not installed
NON-INVERTER
AND
PHY 3
not installed
not installed
8
10
11
12

21
not installed
not installed
TRANSCEIVER
1 TRANSCEIVER
PLL
2 not installed
TRANSCEIVER not installed
not installed
3
AND
not installed
4 installed
not installed
not installed
NAND GATE
CPLD
7
VOLTAGE DETECTOR
INVERTER
8
LINE RECEIVER
not installed
AND
10 LINE DRIVER
not installed
installed
not installed
11
12
22
to CPU-CN301
(Page 18: C-2)
TRANSCEIVER 2
AND
5
AND
TRANSCEIVER
8
REGULATOR
+1.25V
not installed
VOLTAGE DETECTOR
9
D-FF
10
DC-DC CONVERTER
11
OR
VOLTAGE DETECTOR AND
12

23
to DSW-CN603
(Page 29: K-2)
installed not installed not installed
2 not installed installed not installed

not installed not installed installed
OR
3
to DSW-CN604
to PN1-CN301 (Page 29: K-4)
(Page 27: P-3) to ANA1/ANA2-CN603
(Page 15: G-5)
to ANA1/ANA2-CN103
(Page 12: C-4)
5
OR
AND
6
to RSW-CN501
(Page 28: H-2)
to PN2-CN701
(Page 30: G-2) INVERTER
INVERTER
7
not installed
to ANA1/ANA2-CN301 not installed

(Page 13: S-3)
AND
10
INVERTER
11
not installed
12
24
IO1 001 (IN) CIRCUIT DIAGRAM (XMV4280/XMV4140) XMV4280/XMV4140
IN
not installed
OP AMP 3
not installed
4
OP AMP
to ANA1/ANA2-CN101
(Page 12: V-4)
5
not installed
OP AMP
6
not installed
7
OP AMP
28CC1-2001094117-1 IO1 001 (IN) CIRCUIT DIAGRAM (XMV4280/XMV4140)

25
H G F E D C B A
IO1 002 (OUT) CIRCUIT DIAGRAM (XMV4280/XMV4140) XMV4280/XMV4140
1 OUT
to AMP-CN501
(Page 10: B-5)
to AMP-CN502
4 (Page 10: B-8)
28CC1-2001094117-2 IO1 002 (OUT) CIRCUIT DIAGRAM (XMV4280/XMV4140)

26
PN 001 (PN1) CIRCUIT DIAGRAM (XMV4280/XMV4140) XMV4280/XMV4140
PN1 BINARY COUNTER DECODER 1
to PN3-CN803
(Page 31: F-2) 2
D-FF INVERTER
not installed
3
(Page 24: O-3)
to DM-CN601
AND
4
not installed
5
not installed
MICROCONTROLLER
not installed
not installed not installed
8
not installed
AND 10
11
12
28CC1-2001095638-1 2 PN 001 (PN1) CIRCUIT DIAGRAM (XMV4280/XMV4140)

27
H G F E D C B A
PN 002 (RSW) CIRCUIT DIAGRAM (XMV4280/XMV4140) XMV4280/XMV4140
1
RSW
not installed
not installed
2
(Page 24: J-6)
to DM-CN606
TRANSCEIVER
3
not installed
TRANSCEIVER
28CC1-2001095638-2 1 PN 002 (RSW) CIRCUIT DIAGRAM (XMV4280/XMV4140)

28
PN 003 (DSW) CIRCUIT DIAGRAM (XMV4280/XMV4140) XMV4280/XMV4140
DSW 1
2
(Page 24: J-2)
to DM-CN604
not installed
4
not installed
TRANSCEIVER
(Page 24: E-3)
to DM-CN607
not installed 6
not installed
installed not installed not installed not installed

not installed installed not installed not installed 7
not installed not installed installed not installed
not installed not installed not installed installed
28CC1-2001095638-3 1 PN 003 (DSW) CIRCUIT DIAGRAM (XMV4280/XMV4140)

29
H G F E D C B A
1 PN2
LED DRIVER
2
not installed
to DM-CN602
(Page 24: O-6)
not installed
not installed

30
H G F E D C B A
PN3
(Page 27: O-2)

to PN1-CN304
to SUB-CN106
2
(Page 33: A-2)
DC-DC CONVERTER
not installed
to ANA1/ANA2-CN601
(Page 15: K-3)
not installed

31
PS CIRCUIT DIAGRAM (XMV4280/XMV4140) XMV4280/XMV4140
1
to SUB-CN101
(Page 33: L-1)
REGULATOR
HIGH VOLTAGE DRIVER

3
to AMP-CN105
(Page 7: F-5)
REGULATOR
REGULATOR
(Page 33: K-10)
+12V 0.5A
to SUB-CN103
5
PFC CONTROLLER PWM CONTROLLER
6
REGULATOR
+12V 0.5A
7
OP AMP
BUFFER
9
not installed
10
BUFFER
(Reference) VR adjustment of PS circuit board:
When parts on the first side are exchanged, 2pin of CN205 is built the PS circuit board into the main body of the
product, energized by 100V mode setting, and adjusted, and 1pin of 0V and CN205 is adjusted and to become
78.250.1V as +B voltage, VR201 is adjusted.
11
It is 0V next as for 2pin of CN205, and it is confirmed that it is 78.250.1V- as B voltage ..3pin of CN205.. -.
PS VR
PS 100V CN205 2pin 0V to AMP-CN106
CN205 1pin +B 78.250.1V VR201 (Page 7: P-1)
12
CN205 2pin 0VCN205 3pin -B -78.250.1V
28CC1-2001094353 4 PS CIRCUIT DIAGRAM (XMV4280/XMV4140)
32
SUB CIRCUIT DIAGRAM (XMV4280/XMV4140) XMV4280/XMV4140

to PS-CN201
(Page 32: Q-2)
1
REGULATOR
+15V
2
to PN3-CN801
(Page 31: B-1) 3
REGULATOR
-15V
REGULATOR 4
(Reference) VR adjustment of SUB circuit board:

When IC104 and parts around IC104 are exchanged, it builds in
the main body of the SUB circuit board product and it energizes. 5
5pin of CN106 is adjusted, and 3pin of 0V and CN106 is
adjusted and to become 5.19V0.05V as an output voltage of
+5A, VR101 is adjusted.
REGULATOR
-5V 6
SUB VR
IC104 IC104 SUB

CN106 5pin 0VCN106 3pin +5A
5.19V0.05V VR101
7
DC-DC CONVERTER
8
LOW STANDBY POWER
QUASI-RESONANT CONTROLLER
to PS-CN207 9
(Page 32: Q-5)
REGULATOR
not installed
10
11
to FAN
12
28CC1-2001094352 3 SUB CIRCUIT DIAGRAM (XMV4280/XMV4140)

33

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Yamaha XMV4280, XMV4140 PDF

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POWER AMPLIFIER

LITHIUM BATTERY HANDLING

ABOUT FIRMWARE UPDATES

Amplifier Type (Output Circuitry) Class D

AC Power Requirement 100V, 120V, 230V240V 50Hz/60Hz

Dimensions (W x H x D, including knob) 480 x 88 x 422 mm (18.9 x 3.5 x 16.6 inches)

[SIGNAL] Indicator Lit Level

Power Specifications (PINK NOISE, 120V/60Hz mains)

Power Specifications (PINK NOISE, 230V/50Hz mains)

Power Specifications (PINK NOISE, 120V/60Hz mains)

Power Specifications (PINK NOISE, 230V/50Hz mains)

This figure shows XMV4280.

This figure shows XMV4280.

!7 NETWORK connector !7 NETWORK

CIRCUIT BOARD LAYOUT & WIRING &

<Top view / > SUB OUT DSW IN RSW DM

Detail of A sectionA Detail of B sectionB

STYLE PIN STYLE PIN

The VDR connector assembly and the OUT-D connector

Detail of C sectionC Detail of D sectionD

STYLE PIN CN105

Detail of E sectionE Note of F sectionF

Detail of H sectionH Detail of I sectionI

PN1-PN3 CONNECTOR ASSEMBLY

<Bottom view / >

CPU AMP PN3 PS

Detail of G sectionG Detail of J sectionJ

<Front view / >

Front side ( ) Back side ( )

1. Rack Angle (Time required: About 1 minute) 1. 1

2. Top Cover (Time required: About 3 minutes) 2. 3

<Top view> Priority screw (1st) <Bottom view>

4. AMP Circuit Board 4. AMP 8

<Bottom view> <Bottom view>

Priority screw (1st) Priority screw (2nd)

Priority screw (1st)

6. Front Panel Assembly 6. F Assy 7

7. PSW Connector Assembly 7. PSW 7

Priority screw (1st) HOOK

KNOB ENCDR FRONT PANEL

8. PN1 Circuit Board 8. PN1 7

9. PN2 Circuit Board 9. PN2 7

PN2 CONNECTOR ASSEMBLY

10. Frame Side L 10. L 9

Tighten the screws with holding the inlet angle.

Priority screw (1st)

11. SUB Circuit Board 11. SUB 10

12. Frame Side R 12. R 8

Priority screw (2nd)

Installation of ANA1 Circuit Board (XMV4280)/ ANA1 XMV4280/ ANA2 XMV4140

14. DM Circuit Board 14. DM 11

Installation of DM Circuit Board DM

[700] Priority screw (1st) [680] Priority screw (1st)

FRAME SIDE R FRAME SIDE R

15. CPU Circuit Board, Lithium P-Battery 15. CPU 12

Apply torque after checking that step of

LITHIUM P-BATTERY (CR2450)

Priority screw (1st)

Priority screw (2nd)

16. RSW Circuit Board 16. RSW 3

17. DSW Circuit Board 17. DSW 4

Priority screw (1st)

18. IN Circuit Board 18. IN 3

Priority screw (1st)

19. OUT Circuit Board 19. OUT 4

20. Sub Chassis 20. 11